Substrate processing apparatus, substrate processing system, and maintenance method

Abstract

To provide a system effective for executing, with high reliability, maintenance of a substrate processing apparatus in a fabrication facility.SOLUTION: A substrate processing apparatus 1 comprises: a processing apparatus 50 that performs processing on a substrate; a reader 111 that optically reads a code including coded maintenance information; a decoding unit 112 that decodes the code read by the reader 111 into the maintenance information; and a maintenance execution unit 114 that executes maintenance processing on the processing apparatus 50 on the basis of the decoded maintenance information.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present disclosure relates to a substrate processing apparatus, a substrate processing system, and a maintenance method. [Background technology]

[0002] Patent Document 1 discloses a substrate processing system including a plurality of substrate processing apparatuses and a group management apparatus. The group management apparatus includes a recipe storage means for storing a plurality of recipes, a correspondence storage means for storing correspondence between lot information and recipes, a lot information receiving means for receiving lot information, a recipe selection means for selecting a recipe from the plurality of recipes stored in the recipe storage means based on the lot information received by the lot information receiving means and the correspondence stored in the correspondence storage means, and a transmission means for transmitting the recipe selected by the recipe selection means to the substrate processing apparatuses. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2008-78351 Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides an effective system for reliably performing maintenance on substrate processing equipment in a fabrication facility. [Means for solving the problem]

[0005] A substrate processing apparatus according to one aspect of the present disclosure includes a processing apparatus that performs processing on a substrate, a reader that optically reads a code containing encoded maintenance information, a decoding unit that decodes the code read by the reader into maintenance information, and a maintenance execution unit that performs maintenance processing on the processing apparatus based on the decoded maintenance information.

[0006] A maintenance method according to another aspect of the present disclosure is a method for performing maintenance on a processing device that processes substrates within a fabrication facility, the method including generating maintenance information outside the fabrication facility based on input to a terminal device, encoding the maintenance information to generate a code, decrypting the code into maintenance information using a reader within the fabrication facility, and performing maintenance processing on the processing device based on the decrypted maintenance information. [Effects of the Invention]

[0007] According to the present disclosure, it is possible to provide a system that is effective in performing maintenance of substrate processing equipment in a fabrication facility with high reliability. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a plan view illustrating a schematic configuration of a wafer processing system. [Figure 2] FIG. 2 is a front view of the wafer processing system of FIG. [Figure 3] FIG. 1 is a schematic diagram illustrating a configuration of a maintenance system. [Figure 4] FIG. 2 is a block diagram illustrating a functional configuration of a control device. [Figure 5] FIG. 10 is a schematic diagram illustrating an example of guidance. [Figure 6] FIG. 10 is a schematic diagram illustrating an example of guidance. [Figure 7] FIG. 10 is a schematic diagram illustrating an example of guidance. [Figure 8] FIG. 10 is a schematic diagram showing a modified example of the maintenance system. [Figure 9] FIG. 2 is a block diagram illustrating a hardware configuration of a control device. [Figure 10] 10 is a flowchart illustrating a code generation procedure. [Figure 11] 10 is a flowchart illustrating a maintenance processing procedure. [Figure 12] 10 is a flowchart illustrating a preparation process procedure. [Figure 13] 10 is a flowchart illustrating a procedure of a sub-process of the preparation process. [Figure 14] 10 is a flowchart illustrating an example of a procedure for updating a control parameter. [Figure 15] 1 is a flowchart illustrating an example of a procedure for optimizing a control parameter. [Figure 16] 10 is a flowchart illustrating a procedure for generating a result code. [Figure 17] 10 is a flowchart illustrating a procedure for obtaining a measurement result based on a result code. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, a wafer processing system as a substrate processing apparatus according to this embodiment will be described with reference to the drawings. In this specification, elements having substantially the same functional configurations are designated by the same reference numerals, and redundant description will be omitted.

[0010] [Wafer Processing System] First, the configuration of a wafer processing system according to this embodiment will be described. Figures 1 and 2 are a plan view and a front view, respectively, that schematically show the configuration of wafer processing system 1. In this embodiment, the wafer processing system 1 will be described as an example of a photolithography processing system that performs a resist film forming process and a development process on wafers W.

[0011] 1, the wafer processing system 1 includes a cassette station 2 into which a cassette C containing a plurality of wafers W is loaded and unloaded, and a processing station 3 equipped with a plurality of various processing devices that perform predetermined processing on the wafers W. The wafer processing system 1 has a configuration in which the cassette station 2, the processing station 3, and an interface station 4 that transfers the wafers W between them and an exposure device (not shown) adjacent to the opposite side of the processing station 3 are integrally connected. Note that, as shown in FIG. 1, two processing stations 3 are installed between the cassette station 2 and the interface station 4, but one, or three or more processing stations may be installed.

[0012] Cassette station 2 is provided with a plurality of cassette mounting tables 21 and wafer transfer devices 22 and 23. Cassette station 2 uses wafer transfer device 22 or 23 to transfer wafers W between cassettes C placed on mounting tables 12 and processing station 3. To this end, wafer transfer devices 22 and 23 are each provided with drive mechanisms for directions such as the X direction, Y direction, up and down direction, and around the vertical axis (θ direction) as needed, and may also be provided with drive mechanisms for all directions. At least one of wafer transfer devices 22 and 23 is capable of transferring wafers W between cassettes C and processing station 3, and is also capable of transferring wafers W to and from processing station 3. The transfer of wafers W to and from processing station 3 refers to, for example, transferring wafers W to and from third block G3, which includes a transfer device accessible by wafer transfer device 33 in processing station 3, which will be described later. Third block G3 may include multiple transfer devices (not shown) arranged vertically.

[0013] The cassette station 2 may include an inspection device (not shown) for inspecting the wafer W at a position accessible to either the wafer transfer devices 22 or 23.

[0014] The processing station 3 is provided with multiple blocks, for example, three blocks G1, G2, and G4 (first, second, and fourth blocks). Also, as shown in FIG. 2, multiple layers 31 each including the first and second blocks G1 and G2 are stacked vertically. For example, the first block G1 is provided on the front side of the processing station 3 (the negative X-direction side in FIG. 1), and the second block G2 is provided on the back side of the processing station 3 (the positive X-direction side in FIG. 1). The fourth block G4 is provided on the interface station 4 side of the processing station 3 (the positive Y-direction side in FIG. 1) or at a connection portion with another adjacent processing station 3. The fourth block G4 may be provided with multiple transfer devices arranged vertically. The aforementioned third block G3 may also be provided within the processing station 3.

[0015] The first block G1 is provided with a plurality of processing devices, such as a patterning film forming device and a development processing device, both of which are not shown. The patterning film forming device may include, for example, a resist film forming device and an anti-reflection film forming device. For example, a plurality of processing devices are arranged horizontally. The number, arrangement, and type of these processing devices can be selected arbitrarily.

[0016] In these patterning film forming apparatuses and developing treatment apparatuses, for example, a predetermined processing liquid or a predetermined gas is supplied onto the wafer W. In this manner, the patterning film forming apparatus forms a resist film used as a mask when forming a pattern on an underlying film, or forms an anti-reflection film for efficiently performing a light irradiation process, such as an exposure process. Meanwhile, in the developing treatment apparatus, a portion of the exposed resist film is removed to form the uneven shape that serves as the mask.

[0017] For example, in the second block G2, heat treatment devices (not shown) that perform heat treatment such as heating and cooling of the wafer W are arranged in a vertical and horizontal direction. Also, in the second block G2, although neither is shown, a hydrophobization treatment device that performs a hydrophobization treatment to improve the adhesion of the resist liquid to the wafer W, and a peripheral exposure device that exposes the peripheral portion of the wafer W are arranged in a vertical and horizontal direction (Z direction in FIG. 2). The number and arrangement of these heat treatment devices, hydrophobization treatment devices, and peripheral exposure devices can also be selected as desired.

[0018] 1, a wafer transfer area 32 is formed in an area sandwiched between a first block G1 and a second block G2 in a plan view. In the wafer transfer area 32, for example, a wafer transfer device 33 is disposed.

[0019] The wafer transfer device 33 has a transfer arm that is movable in, for example, the X direction, Y direction, θ direction, and up and down direction. The wafer transfer device 33 moves within the wafer transfer area 32 and can transfer the wafer W to predetermined devices in the surrounding first block G1, second block G2, third block G3, and fourth block G4. When there are multiple processing stations 3 as shown in FIG. 1, the wafer transfer device 33 provided in the processing station 3 located on the interface station 4 side can transfer the wafer W to predetermined devices in the fifth block G5 (described below) in addition to the first, second, and fourth blocks G1, G2, and G4.

[0020] A plurality of wafer transfer devices 33 are arranged, for example, one above the other. One wafer transfer device 33 can transfer wafers W to a predetermined device located at the height of the upper layers 31 among the multiple layers 31 stacked one above the other (see FIG. 2). Another wafer transfer device 33 can transfer wafers W to a predetermined device located at the height of the multiple layers 31 located below the layers 31. A plurality of wafer transfer areas 32 are provided to enable such transfer of wafers W. Note that the number of wafer transfer devices 33 and the number of layers 31 corresponding to one wafer transfer device 33 can be selected arbitrarily, such as by providing a wafer transfer device 33 for each layer 31.

[0021] The wafer transfer area 32, the first block G1, or the second block G2 may also include a shuttle transfer device (not shown). The shuttle transfer device linearly transfers the wafer W between a space adjacent to one side of the processing station 3 and another space adjacent to the opposite side.

[0022] The interface station 4 is provided with a fifth block G5 equipped with a plurality of transfer devices, and wafer transfer devices 41 and 42. The interface station 4 uses the wafer transfer device 41 or 42 to transfer the wafer W between the fifth block G5, where the wafer W is transferred by the wafer transfer device 33, and the exposure device. To this end, the wafer transfer devices 41 and 42 are each provided with drive mechanisms for directions such as the X direction, Y direction, up / down direction, and around the vertical axis (θ direction) as needed, and may also be provided with drive mechanisms for all directions. At least one of the wafer transfer devices 41 and 42 can support the wafer W and transfer the wafer W between the transfer device in the fifth block G5 and the exposure device.

[0023] A cleaning device for cleaning the surface of the wafer W and the aforementioned peripheral exposure device may be provided in the interface station 4 at a position accessible to either of the wafer transfer devices 41 and 42 .

[0024] The inspection device may be provided in cassette station 2 as described above, but it may also be provided in processing station 3 and interface station 4 at a position accessible to any of the transport arms (33, 41, 42 in Figure 1 or Figure 2) provided inside each station.

[0025] The wafer processing system 1 described above is provided with a control device 100. The control device 100 is, for example, a computer, and has a program storage unit (not shown). The program storage unit stores a program for controlling the processing of wafers W in the wafer processing system 1. The program storage unit also stores a program for controlling the operation of drive systems such as the various processing devices and transport devices described above to realize wafer processing in the wafer processing system 1. The program may be recorded on a computer-readable storage medium H and installed into the control device 100 from the storage medium H.

[0026] The substrate processing apparatus may be any apparatus that processes substrates, and is not limited to the above-described wafer processing system 1. For example, the substrate processing apparatus may be a CVD (Chemical Vapor Deposition) apparatus, an etching apparatus, or a cleaning apparatus.

[0027] [Maintenance System] A wafer processing system 1, which is an example of a substrate processing apparatus, is installed in a fabrication facility 92 and processes substrates (e.g., wafers W) at the fabrication facility 92. Bringing mobile terminals into the fabrication facility 92 is strictly restricted. To perform maintenance on the wafer processing system 1 at the fabrication facility 92, an operator must memorize maintenance information such as work procedures or print the maintenance information on paper or the like, and manually perform the maintenance based on the maintenance information. It is difficult to adequately suppress human error in manual maintenance. In contrast, the wafer processing system 1 constitutes a maintenance system 90.

[0028] 3, the maintenance system 90 includes a code generator 93 installed in a maintenance office 91 outside a fabrication facility 92, and a wafer processing system 1 installed in the fabrication facility 92. The maintenance office 91 and the fabrication facility 92 may be located on the premises of the same vendor. Alternatively, the maintenance office 91 may be located on the premises of a vendor different from the vendor that owns the fabrication facility 92.

[0029] The code generation device 93 generates a code including the encoded maintenance information by encoding the maintenance information using an encoder (e.g., an encoding program). The code may be a two-dimensional code. For example, the code generation device 93 may encode the maintenance information into a two-dimensional code by encoding. A two-dimensional code allows for a margin in the amount of information that the code can hold. An example of a two-dimensional code is QR Code (registered trademark).

[0030] The wafer processing system 1 includes a processing device 50 and a control device 100. The processing device 50 performs processing on the wafer W. For example, the processing device 50 includes the above-mentioned wafer transfer devices 22, 23, 33, 41, and 42 and a plurality of processing devices. To distinguish the processing devices from the processing device 50, the plurality of processing devices will be referred to as "a plurality of processing modules 51" below. Each of the plurality of processing modules 51 performs processing on the wafer W. The plurality of processing modules 51 includes, for example, the above-mentioned patterning film forming device, development processing device, heat treatment device, hydrophobization processing device, peripheral exposure device, cleaning device, inspection device, etc.

[0031] The control device 100 controls the processing device 50 to perform processing on the wafer W. The control device 100 is configured to optically read the code, decode the read code into maintenance information, and perform maintenance processing on the processing device 50 based on the decoded maintenance information.

[0032] According to the maintenance system 90, by encoding the maintenance information into an optically readable code, the maintenance information can be recognized by the wafer processing system 1 without relying on manual operation, and maintenance processing can be performed based on the maintenance information. This is therefore effective in performing maintenance of the wafer processing system 1 with high reliability in the fabrication facility 92.

[0033] For example, the maintenance process includes a process for preparing the wafer W in the wafer processing system 1 so that a process for manufacturing a product (hereinafter referred to as "actual process") can be performed on the wafer W. The maintenance process may be a process executed at a timing different from the actual process. Examples of the maintenance process include a preparatory process executed by the processing device 50 to prepare a processing medium such as a chemical solution, and updating of control parameters.

[0034] An example of the preparation process is a start-up process in which a processing medium supply source (e.g., a chemical bottle) is set in the processing device 50, the processing medium is filled into a supply line in the processing device 50, and the processing medium is made ready to be supplied immediately. Updating the control parameters may include executing processing on a sample substrate and measuring the processing results on the sample substrate in order to ascertain the amount of change in the control parameters, etc.

[0035] For example, as shown in FIG. 4 , the control device 100 has, as functional components (hereinafter referred to as “functional blocks”), a recipe storage unit 117, a control execution unit 118, a reader 111, a decryption unit 112, a maintenance information storage unit 113, and a maintenance execution unit 114. The recipe storage unit 117 stores recipe information for causing each of the plurality of processing modules 51 to perform an actual process. The recipe information includes one or more control parameters for specifying the content of the actual process. For example, recipe information for an actual process in which a processing liquid is supplied to the wafer W while rotating the wafer W includes, as multiple control parameters, a rotation speed of the wafer W, a discharge pressure of the processing liquid, a discharge flow rate of the processing liquid, a discharge start timing of the processing liquid, and a discharge completion timing of the processing liquid. Recipe information for an actual process in which the wafer W is cooled and heated includes, as multiple control parameters, a cooling start timing, a cooling completion timing, a cooling temperature, a heating start timing, a heating completion timing, and a heating temperature.

[0036] The control execution unit 118 controls the processing device 50 to perform actual processing on the wafer W based on the recipe information stored in the recipe storage unit 117. For example, the control execution unit 118 controls the wafer transfer devices 22, 23, 33, 41, and 42 to sequentially transfer the wafer W to two or more processing modules 51 based on a flow determined by a host controller or the like. The control execution unit 118 controls each of the two or more processing modules 51 based on the corresponding recipe information to perform actual processing on the transferred wafer W.

[0037] The reader 111 optically reads the code containing the encoded maintenance information and includes, for example, a camera that captures an image containing the code and image processing circuitry that recognizes the code in the captured image.

[0038] The decoding unit 112 decodes the code read by the reader 111 into maintenance information. For example, the decoding unit 112 decodes the code into maintenance information using a decoder (a decoding program) corresponding to the encoder. The decoding unit 112 stores the decoded maintenance information in the maintenance information storage unit 113.

[0039] The maintenance execution unit 114 executes maintenance processing based on the decrypted maintenance information stored in the maintenance information storage unit 113. For example, the maintenance execution unit 114 may specify processing content to be executed by the processing device 50 based on the maintenance information, and cause the processing device 50 to execute the specified processing content. The maintenance execution unit 114 causing the processing device 50 to execute processing includes the control execution unit 118 causing the processing device 50 to execute processing in response to a request from the maintenance execution unit 114. The maintenance execution unit 114 may specify control parameters to be updated and their values ​​after the update based on the maintenance information, and update the specified control parameters to the specified values.

[0040] The maintenance process may include a process performed by a worker. Examples of the process performed by a worker include the following: Example 1) Setting the processing medium source in the processing device 50. Example 2) Editing the contents of maintenance processing. Example 3) Setting the value of a control parameter in order to update the control parameter.

[0041] The control device 100 may further include a display unit 115 to guide the worker through the process. The display unit 115 displays guidance based on maintenance information including configuration information for guidance requesting the worker to perform maintenance work. The configuration information included in the maintenance information allows the guidance for the worker to be individually set for each maintenance task. The individually set guidance can further reduce human error.

[0042] The guidance is a user interface that shows the content that the worker should perform. The guidance may be a CUI (Character User Interface) or a GUI (Graphical User Interface). The configuration information is information that defines the configuration of the guidance. For example, the configuration information includes the display mode and layout of each of the components of the guidance. Examples of the components of the guidance include a display that shows the work content required of the worker and an input object that can be operated by the worker. The display of the work content includes at least one of a text message and an icon that shows the work content. Examples of input objects include a button that can be operated by clicking or tapping.

[0043] The control device 100 may further include a timing specifying unit 116. The timing specifying unit 116 specifies the timing for displaying the guidance based on the progress of the maintenance process performed by the maintenance executing unit 114 and the maintenance information. The display unit 115 may display the guidance at the display timing specified by the timing specifying unit 116. By displaying the guidance in accordance with the progress of the maintenance process, human error can be further reduced.

[0044] For example, the maintenance process includes multiple sub-processes, including a process to be performed by a worker and a process to be performed by the maintenance execution unit 114. The maintenance process information includes the execution order of the multiple sub-processes and the content of each of the multiple sub-processes. The timing identification unit 116 may identify, as the display timing, the timing when the progress of the maintenance process performed by the maintenance execution unit 114 reaches just before the process to be performed by the worker in the execution order of the maintenance information. In response to the identification of the display timing, the display unit 115 displays guidance corresponding to the process to be performed by the worker.

[0045] The maintenance execution unit 114 may suspend the maintenance process at the display timing identified by the timing identification unit 116. The display unit 115 may display guidance including a maintenance work request to the worker and an input object for inputting a notification of completion of the maintenance work. The maintenance execution unit 114 may resume the maintenance process in response to input of the completion notification by the input object. This allows the wafer processing system 1 and the worker to cooperate in a timely manner.

[0046] Restarting the maintenance process includes, for example, restarting the maintenance process from the point where it was interrupted. The display unit 115 may sequentially display multiple types of guidance according to the progress of the maintenance process.

[0047] There may be cases where the process to be performed by the worker is located at the top of the execution order. In this case, the timing identification unit 116 identifies the timing immediately before the maintenance process by the maintenance execution unit 114 starts as the display timing. The maintenance execution unit 114 waits for the start of the maintenance process, and the display unit 115 displays guidance before the start of the maintenance process. In this way, waiting for the maintenance execution unit 114 to start the maintenance process is also included in interrupting the maintenance process.

[0048] The display unit 115 may display guidance including a request to confirm whether the processing device 50 is a target for maintenance processing and an input object for inputting a completion notification including the confirmation result of whether the processing device 50 is a target for maintenance processing. The maintenance execution unit 114 may resume the maintenance processing when the confirmation result included in the completion notification by the input object indicates that the processing device 50 is a target for maintenance processing. This makes it possible to prevent maintenance from being executed on the wrong target.

[0049] For example, the maintenance information includes configuration information of the guidance and ID information of the processing device 50 that is the target of the maintenance process. The ID information of the processing device 50 may be any information that can identify the processing device 50, and may be ID information of the wafer processing system 1. If the wafer processing system 1 is identified by the ID information, the processing device 50 can also be identified.

[0050] For example, the display unit 115 displays guidance 310 as illustrated in FIG. 5A based on the configuration information. The guidance 310 includes a request 311 and an input object 312. The request 311 includes a message requesting the worker to confirm whether the processing device 50 is a target for maintenance processing. This message includes a display of ID information included in the maintenance information. By comparing the display of the ID information with the ID of the processing device 50 for which maintenance is actually about to begin, it is possible to easily confirm whether the processing device 50 is a target for maintenance processing.

[0051] The input object 312 acquires a completion notification including the confirmation result of whether the processing device 50 is a target for maintenance processing. For example, the input object 312 includes buttons 313 and 314. The button 313 acquires the completion notification indicating that the processing device 50 is a target for maintenance processing. Based on an operation on the button 313, the maintenance execution unit 114 recognizes that the processing device 50 is a target for maintenance processing and resumes the maintenance processing. The button 314 acquires the completion notification indicating that the processing device 50 is not a target for maintenance processing. Based on an operation on the button 314, the maintenance execution unit 114 recognizes that the processing device 50 is not a target for maintenance processing and cancels the maintenance processing. In response to an input on the buttons 313 and 314, the display unit 115 may close the guidance 310.

[0052] The display unit 115 may display guidance including a request to confirm whether the contents of the maintenance process are as intended and an input object for inputting a completion notification including the confirmation result of whether the contents of the maintenance process are as intended. The maintenance execution unit 114 may resume the maintenance process when the confirmation result included in the completion notification by the input object indicates that the contents of the maintenance process are as intended. By comparing the contents of the maintenance process with the worker's recognition, maintenance errors can be further reduced.

[0053] For example, the display unit 115 displays guidance 320 illustrated in FIG. 5B based on the configuration information. The guidance 320 includes a request 321 and an input object 322. The request 321 includes a message requesting confirmation that the content of the maintenance process is as intended. This message includes a display of information specifying the content of the maintenance process to be executed after input into the guidance 320 (for example, the name of the process).

[0054] The input object 322 acquires a completion notification including a confirmation result as to whether the content of the maintenance processing is as intended. For example, the input object 322 includes buttons 323, 324, and 325. The button 323 acquires a completion notification indicating that the content of the maintenance processing is as intended. Based on an operation on the button 323, the maintenance execution unit 114 recognizes that the content of the maintenance processing is as intended by the worker and resumes the maintenance processing. The button 324 acquires a completion notification indicating that the content of the maintenance processing is not as intended. Based on an operation on the button 324, the maintenance execution unit 114 recognizes that the content of the maintenance processing is not as intended by the worker and cancels the maintenance processing. In response to an input on the buttons 323 and 324, the display unit 115 may close the guidance 320.

[0055] Button 325 acquires a request for the worker to display the work manual. Display unit 115 may display the work manual in response to an operation on button 325. For example, if it is not possible to determine from request 321 alone whether the contents of the maintenance process are as intended, the work manual can be displayed to easily check whether there are any problems with the contents of the maintenance process.

[0056] The display unit 115 may display guidance including a mode selection object for selecting either a first mode in which the maintenance process is performed in its entirety or a second mode in which the maintenance process is performed in stages. The maintenance execution unit 114 may cause the processing device 50 to perform the maintenance process in its entirety in the first mode, and may interrupt the execution of the maintenance process at each stage in the second mode. The display unit 115 may display guidance including a start object that instructs the maintenance execution unit to start the execution of the next stage each time the execution of the maintenance process is interrupted, and may cause the maintenance execution unit to execute the next stage in response to the instruction to start execution from the start object. This makes it possible to adjust the balance between reliability and efficiency of maintenance in a fabrication facility.

[0057] For example, the display unit 115 displays guidance 330 illustrated in Fig. 5(c) based on the configuration information. The guidance 330 includes a request 331 and an input object 332. The request 331 includes a message requesting selection of either the first mode or the second mode.

[0058] The input object 332 receives a completion notification including the selection result. For example, the input object 332 includes buttons 333 and 334. The buttons 333 and 334 are examples of mode selection objects. The button 333 receives a completion notification indicating that the first mode has been selected. Based on an operation on the button 333, the maintenance execution unit 114 recognizes that the first mode has been selected and resumes the maintenance process in its entirety. For example, the maintenance execution unit 114 sequentially executes the above-described multiple sub-processes in its entirety. The button 334 receives a completion notification indicating that the second mode has been selected. Based on an operation on the button 334, the maintenance execution unit 114 recognizes that the second mode has been selected and resumes the maintenance process, suspending the execution of the maintenance process for each sub-process. In response to an input on the buttons 333 and 334, the display unit 115 may close the guidance 330.

[0059] For example, in the second mode, the display unit 115 displays guidance 340 as illustrated in FIG. 5D each time the maintenance execution unit 114 interrupts the execution of the maintenance process. The guidance 340 includes a start object 341. The start object 341 acquires an instruction to start execution of the next stage in the maintenance process. Based on an operation on the start object 341, the maintenance execution unit 114 recognizes that an instruction to start execution of the next stage has been issued, and resumes the maintenance process.

[0060] The guidance 340 may further include an interruption object 342. The interruption object 342 receives an instruction to interrupt execution of a sub-process that is currently being executed. Based on an operation on the interruption object 342, the maintenance execution unit 114 recognizes that an instruction to interrupt execution has been issued, and interrupts the sub-process. After the sub-process is interrupted by an operation on the interruption object 342, the maintenance execution unit 114 recognizes that an instruction to resume maintenance has been issued, and resumes the sub-process. The display unit 115 may continue to display the guidance 340 until the stage that was started based on the operation on the start object 341 is completed, and close the guidance 340 when the stage is completed.

[0061] The display unit 115 displays guidance 350, as exemplified in FIG. 6A, based on the configuration information. The guidance 350 includes a request 351 and an input object 352. The request 351 includes a message requesting the operator to select whether or not to execute a manual tour. The manual tour is a program that allows the operator to understand a series of maintenance procedures, for example, through a tutorial.

[0062] The input object 352 receives a completion notification including a selection of whether or not to execute a manual tour. For example, the input object 352 includes buttons 353 and 354. The button 353 receives a completion notification indicating that the manual tour will be executed. Based on an operation on the button 353, the display unit 115 recognizes that execution of the manual tour has been selected, and executes the manual tour. The button 354 receives a completion notification indicating that the manual tour will not be executed. Based on an operation on the button 354, the maintenance execution unit 114 recognizes that execution of the manual tour has not been selected, and resumes the maintenance process. In response to an input on the buttons 353 and 354, the display unit 115 may close the guidance 350.

[0063] The display unit 115 may display guidance including a request to edit the content of the maintenance process and an input object for inputting a completion notification including the edited content of the maintenance process. In response to input of the completion notification using the input object, the maintenance execution unit 114 may resume the maintenance process based on the edited content included in the completion notification. Even in a fabrication facility, by making it possible to edit the content of the maintenance process, it is possible to achieve both the reduction of human error and flexibility.

[0064] For example, the display unit 115 displays guidance 360 ​​illustrated in Fig. 6(b) based on the configuration information. The guidance 360 ​​includes a request 361 and an input object 362. The request 361 includes a message requesting that the content of the maintenance process be edited.

[0065] The input object 362 acquires a completion notification including the editing results of the maintenance processing content. For example, the input object 362 includes an editing window 363 and buttons 364 and 365. The editing window 363 is a window for editing the maintenance processing content by entering text or adding or moving icons. The button 364 acquires a completion notification including a request to adopt the editing results in the editing window 363. Based on an operation on the button 364, the maintenance execution unit 114 recognizes that the editing results in the editing window 363 have been adopted. The maintenance execution unit 114 updates the maintenance information based on the editing results in the editing window 363 and resumes the maintenance processing based on the updated maintenance information. The button 365 acquires a completion notification including a request to discard the editing results in the editing window 363. Based on an operation on the button 365, the maintenance execution unit 114 recognizes that the editing results in the editing window 363 have not been adopted. The maintenance execution unit 114 resumes the maintenance processing based on the maintenance information to which the editing results in the editing window 363 are not reflected.

[0066] The display unit 115 may display guidance including a request to set materials for maintenance processing and an input object for inputting a notification of completion of setting the materials. In response to input of the completion notification via the input object, the maintenance execution unit may resume the maintenance processing, including causing the processing device 50 to execute processing using the materials. This can reduce human errors, including forgetting to set materials or delays in setting materials.

[0067] For example, the display unit 115 displays guidance 370 as illustrated in FIG. 6(c) based on the configuration information. The guidance 370 includes a request 371 and an input object 372. The request 371 includes a message requesting the setting of materials for the maintenance process. Examples of materials include a supply source (e.g., a bottle or a tank) of the above-mentioned processing medium (e.g., processing liquid, processing gas, or inert gas).

[0068] The input object 372 acquires a notification that the material has been set up. For example, the input object 372 includes buttons 373 and 374. The button 373 acquires a notification that the material has been set up. Based on an operation on the button 373, the maintenance execution unit 114 recognizes that the material has been set up correctly, and may resume the maintenance process, which includes causing the processing device 50 to execute a process using the material. The button 374 acquires an instruction to suspend the execution of the maintenance process. Based on an operation on the button 374, the maintenance execution unit 114 recognizes that the material has not been set up correctly, and suspends the maintenance process.

[0069] The display unit 115 may display guidance including a request to edit the control parameters and an input object for inputting a completion notification including the editing results of the control parameters. The display unit 115 may display guidance for each processing module 51, for each type of processing module 51, or for each group of one or more processing modules 51. In response to input of the completion notification using the input object, the maintenance execution unit 114 may resume the maintenance process including updating the control parameters based on the editing results included in the completion notification. This makes it possible to reduce human error in manually editing the control parameters.

[0070] For example, the display unit 115 displays guidance 380 illustrated in FIG. 7(a) based on the configuration information. The guidance 380 includes a request 381 and an input object 382. The request 381 includes a message requesting editing of a control parameter (e.g., input of a value). This message includes display of ID information of the processing module 51 for which the control parameter is to be edited. The ID information may be a name, or a combination of a name and a unique number.

[0071] The input object 382 receives a completion notification including the editing results of the control parameters. For example, the input object 382 includes one or more input boxes 383 and a button 384. The input object 382 may include multiple input boxes 383. The multiple input boxes 383 correspond to multiple control parameters, respectively. Each of the multiple input boxes 383 receives an input of a value of the corresponding control parameter. The button 384 receives a completion notification including a request to update each of the multiple control parameters based on the input to the multiple input boxes 383. Based on an operation on the button 384, the maintenance execution unit 114 recognizes that the input to the multiple input boxes 383 has been adopted. The maintenance execution unit 114 updates each of the multiple control parameters in the recipe information stored in the recipe storage unit 117 based on the input to the multiple input boxes 383.

[0072] The display unit 115 may display guidance 390, as exemplified in Fig. 7(b), based on the configuration information. The guidance 390 includes a request 391 and an input object 392. The request 391 includes a message requesting selection of a response to be taken if an alarm is issued during maintenance processing.

[0073] The input object 392 acquires a completion notification including the selection result of the countermeasure. For example, the input object 392 includes buttons 393 and 394. The button 393 acquires the selection of a predetermined automatic recovery process. Based on the operation of the button 393, the maintenance execution unit 114 stores the automatic recovery process as a countermeasure when an alarm is issued. The button 394 includes an input box 395. The button 394 acquires a registration request for the upper limit number of times entered in the input box 395. Based on the operation of the button 394, the maintenance execution unit 114 stores the upper limit number of times entered in the input box 395 together with the automatic recovery process. If an alarm is issued during maintenance processing, the maintenance execution unit 114 repeatedly executes the automatic recovery process until the alarm disappears, and aborts the maintenance processing if the upper limit number of times the automatic recovery process is repeated without the alarm disappearing.

[0074] The display unit 115 may display guidance 410, as exemplified in FIG. 7C, based on the configuration information. The guidance 410 includes a request 411 and an input object 412. The request 411 includes a message indicating that a process that is periodically executed in the wafer processing system 1 is currently being executed and requesting that the user wait for the execution to complete. The input object 412 includes a button 413. The button 413 obtains consent to the content of the message included in the request 411.

[0075] The control device 100 may be configured to determine by itself whether the processing device 50 is a target for maintenance processing. For example, the control device 100 may further include an ID storage unit 121 and a target determination unit 122. The ID storage unit 121 stores ID information representing the ID of the processing device 50. The target determination unit 122 determines whether the processing device 50 is a target for maintenance processing based on the maintenance information and the ID information stored in the ID storage unit 121. For example, the target determination unit 122 determines whether the processing device 50 is a target for maintenance processing based on a comparison between the ID information included in the maintenance information and the ID information stored in the ID storage unit 121. For example, the target determination unit 122 determines whether the processing device 50 is a target for maintenance processing when the ID information included in the maintenance information matches the ID information stored in the ID storage unit 121. The maintenance execution unit 114 may execute the maintenance processing when the target determination unit 122 determines that the processing device 50 is a target for maintenance processing. The maintenance execution unit 114 may stop the maintenance process when the processing device 50 is not the target of the maintenance process, thereby preventing the execution of maintenance on the wrong target.

[0076] The maintenance information may include values ​​of one or more control parameters. The maintenance execution unit 114 may execute a maintenance process including updating one or more control parameters based on the maintenance information. For example, the maintenance execution unit 114 may update one or more control parameters based on the values ​​of the one or more control parameters included in the maintenance information. By including the updated control parameters in the maintenance information, the control parameters can be updated with higher reliability.

[0077] The maintenance information may include information for identifying one or more processing modules 51 that are to be subjected to maintenance processing among the multiple processing modules 51. The information for identifying one or more processing modules 51 includes, for example, ID information of the one or more processing modules 51. The ID information may be a name, or a combination of a name and a unique number. The maintenance execution unit 114 may identify one or more processing modules 51 that are to be subjected to maintenance processing among the multiple processing modules 51 based on the maintenance information, and perform maintenance processing on the identified one or more processing modules 51. By specifying one or more processing modules that are to be subjected to maintenance processing using the maintenance information, errors in identifying one or more processing modules can also be reduced.

[0078] The maintenance execution unit 114 may execute a maintenance process that includes processing a sample substrate (sample wafer W) using the processing device 50 based on the maintenance information, and updating control parameters based on measurement results of the sample substrate after processing. The updated control parameters can be derived by the wafer processing system 1. This makes it possible to suppress human error in adjusting the control parameters.

[0079] For example, the maintenance information includes information for identifying the processing module 51, the processing content to be executed by the processing module 51, and the target processing result. The maintenance execution unit 114 stores a model (hereinafter referred to as a "first model") that is generated in advance to represent the relationship between the amount of change in each of a plurality of control parameters and the amount of change in the processing result for the sample substrate. When the processing for the sample substrate is a liquid processing, examples of the plurality of control parameters include, as described above, the rotation speed of the wafer W, the discharge pressure of the processing liquid, the discharge flow rate of the processing liquid, the timing at which the discharge of the processing liquid starts, and the timing at which the discharge of the processing liquid ends. When the liquid processing is a film formation process by applying and drying a processing liquid, examples of the processing result include an average film thickness, a film thickness distribution, and the like. The film thickness distribution is quantitatively expressed, for example, by Zernike polynomials or the like.

[0080] The maintenance execution unit 114 updates one or more control parameters to reduce the deviation between the target processing result and the measurement result based on the first model. The maintenance execution unit 114 may repeatedly process the sample substrate and update the one or more control parameters until the deviation between the target processing result and the measurement result falls within an allowable range.

[0081] The maintenance execution unit 114 may execute a maintenance process that further includes having the processing device 50 measure the processed sample substrate, and may update the control parameters based on the measurement results of the sample substrate by the processing device 50. For example, the multiple processing modules 51 may include one or more inspection devices, and the maintenance execution unit 114 may cause the one or more inspection devices to measure the sample substrate. In addition to processing the sample substrate, the processing device 50 also measures the processed sample substrate, so that the control parameters can be updated efficiently.

[0082] As shown in FIG. 8 , a maintenance system 90 may include a substrate processing system 94 in a fabrication facility 92, the substrate processing system 94 including a wafer processing system 1, a measuring device 200, and a code generating device 210. The measuring device 200 is provided separately from the wafer processing system 1 and measures a processed sample substrate. The code generating device 210 is capable of communicating with the measuring device 200 via wire or wirelessly, and includes a result code generating unit 211. The code generating device 210 receives the measurement results from the measuring device 200. The result code generating unit 211 encodes the measurement results from the measuring device 200 to generate a result code.

[0083] The work of carrying the processed sample substrate into the measuring device 200 and the operations of the measuring device 200 and the code generating device 210 from the measurement to the generation of the result code are performed by, for example, an operator. Therefore, the display unit 115 may display guidance requesting the operator to perform the following work when the processing of the sample substrate is completed. Operation 1) The sample substrate is loaded into the measuring device 200. Operation 2) The measurement result from the measurement device 200 is decoded by the code generation device 210 to generate a result code. Operation 3) Have the reader 111 read the result code.

[0084] The decoding unit 112 may be further configured to decode the result code read by the reader 111 into a measurement result. The maintenance execution unit 114 may update the control parameters based on the measurement result decoded by the decoding unit 112. This makes it possible to suppress human error when transmitting the measurement result outside the processing device 50 to the maintenance execution unit 114.

[0085] The processing device 50 may perform a first process on the wafer W based on predetermined first control parameters and a second process on the wafer W based on second control parameters. The first process and the second process are performed on the same wafer W. The second process may be performed before or after the first process. The maintenance execution unit 114 may perform a maintenance process including updating the first control parameter based on the maintenance information and updating the second control parameter based on the updated first control parameter and a model (hereinafter referred to as a "second model") previously generated to represent the relationship between the first control parameter and the second control parameter. This can reduce the amount of information in the maintenance information. For example, the control device 100 may further include a model storage unit 123 that stores the second model, and the maintenance execution unit 114 may update the second control parameter based on the second model stored in the model storage unit 123.

[0086] An example of the first process is a film formation process by applying and drying a processing liquid. As described above, examples of the first control parameters include the rotation speed of the wafer W, the discharge pressure of the processing liquid, the discharge flow rate of the processing liquid, the timing at which the discharge of the processing liquid starts, and the timing at which the discharge of the processing liquid ends. As described above, examples of the second process include a heating process for the wafer W after the film formation process. As described above, examples of the second control parameters include the timing at which the cooling starts, the timing at which the cooling ends, the cooling temperature, the timing at which the heating starts, the timing at which the heating ends, and the heating temperature.

[0087] Another example of the first process is a development process using a developer. As described above, examples of the first control parameters include the rotation speed of the wafer W, the discharge pressure of the process liquid, the discharge flow rate of the process liquid, the discharge start timing of the process liquid, and the discharge completion timing of the process liquid. As an example of the second process, a heating process for the wafer W after the exposure process and before the development process is included. As described above, examples of the second control parameters include the cooling start timing, the cooling completion timing, the cooling temperature, the heating start timing, the heating completion timing, and the heating temperature.

[0088] The processing device 50 may execute a plurality of first processes and a plurality of second processes corresponding to the plurality of first processes, respectively. The maintenance execution unit 114 may update a first control parameter for each of the plurality of first processes based on the maintenance information, and may update a second control parameter for each of the plurality of second processes based on the first control parameter for the corresponding first process and the second model.

[0089] The processing device 50 may execute a plurality of first processes and one second process. The maintenance execution unit 114 may update a first control parameter for each of the plurality of first processes based on the maintenance information, and may update a second control parameter for the one second process based on the first control parameters of the plurality of first processes and the second model.

[0090] The processing device 50 may execute one first process and multiple second processes. The maintenance execution unit 114 may update a control parameter for the one first process based on the maintenance information, and update a second control parameter for each of the multiple second processes based on the first control parameter for the one first process and the second model.

[0091] 9 is a block diagram illustrating an example of the hardware configuration of the control device 100. As shown in FIG. 9, the control device 100 has a circuit 190 and a camera 60. The circuit 190 has a processor 191, a memory 192, a storage 193, an image processing circuit 194, a control circuit 195, and a user interface 196.

[0092] The storage 193 includes, for example, one or more nonvolatile storage media. The nonvolatile storage medium includes one or more storage devices. Examples of the one or more storage devices include a hard disk drive, a solid state drive, and a flash memory. The nonvolatile storage medium may include a portable storage medium such as an optical disk. The storage 193 stores a program that causes the control device 100 to optically read the code, decode the read code into maintenance information, and perform maintenance processing on the processing device 50 based on the decoded maintenance information. For example, the storage 193 stores a program that causes the control device 100 to configure each of the above-mentioned functional blocks.

[0093] The memory 192 includes one or more volatile storage media. The volatile storage media includes one or more memory devices. An example of the one or more memory devices is a random access memory. The memory 192 temporarily stores a program loaded from the storage 193. The processor 191 includes one or more arithmetic devices. An example of the arithmetic device is a CPU (Central Processing Unit) or a GPU (Graphics Processing Unit). The processor 191 executes the program loaded in the memory 192, thereby configuring each of the above-mentioned functional blocks in the control device 100. The processor 191 may temporarily store the calculation results in the memory 192.

[0094] The camera 60 photographs the code. For example, the camera 60 has an imaging element such as a CCD (Charge-Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor) image sensor, and an objective optical system that forms an image of the object to be imaged on the imaging element, and photographs the image of the code. The camera 60 is directed toward the outside of the wafer processing system 1 so that the code can be held up from outside the wafer processing system 1.

[0095] The image processing circuit 194 causes the camera 60 to take a photograph in response to a request from the processor 191, acquires the captured image from the camera 60, and recognizes the code through image processing. The control circuit 195 controls the processing device 50 in response to a request from the processor 191. The user interface 196 interacts with the worker in response to a request from the processor 191. The user interface 196 includes one or more input devices and one or more display devices. Examples of the input device include a keyboard or a mouse. Examples of the display device include an LCD monitor. The input device may be incorporated into the display device to form a touch panel.

[0096] The configuration of the control device 100 shown above is an example and can be changed. All of the above-described functional blocks do not have to be configured by executing a program in the storage 193. For example, at least some of the functional blocks may be configured by a circuit specialized for that function, such as an ASIC (Application Specific Integrated Circuit).

[0097] [Maintenance Procedure] As an example of the maintenance method, a maintenance procedure executed by the maintenance system 90 is illustrated. The maintenance procedure includes generating maintenance information outside the fabrication facility based on input to a terminal device, encoding the maintenance information to generate a code, using a reader inside the fabrication facility to decode the code into the maintenance information, and executing a maintenance process on a processing device based on the decoded maintenance information.

[0098] FIG. 10 is a flowchart illustrating a code generation procedure executed by the code generation device 93. As shown in FIG. 10, the code generation device 93 executes steps S01 and S02. In step S01, the code generation device 93 generates an input interface for the worker to input maintenance information. For example, the code generation device 93 displays the input interface on an input device such as an LCD monitor. The input interface includes a display of maintenance information that has already been input. In step S02, the code generation device 93 checks whether any editing input has been made to the maintenance information displayed by the input interface.

[0099] If it is determined in step S02 that an editing input has been made, the code generating device 93 executes step S03. In step S03, the code generating device 93 updates the maintenance information displayed by the input interface based on the editing input.

[0100] Next, the code generation device 93 executes step S04. If it is determined in step S02 that no editing input has been made, the code generation device 93 executes step S04 without executing step S03. In step S04, the code generation device 93 determines whether code generation has been requested by an operation on the input interface. If it is determined in step S04 that code generation has not been requested, the code generation device 93 returns the process to step S02.

[0101] If it is determined in step S04 that code generation has been requested, the code generation device 93 executes step S05. In step S05, the code generation device 93 encodes and decodes the maintenance information displayed by the input interface to generate a code. This completes the code generation procedure.

[0102] 11 is a flowchart illustrating a maintenance processing procedure executed by the control device 100 in the wafer processing system 1. As shown in FIG. 11, the control device 100 first executes steps S11, S12, and S13. In step S11, the reader 111 waits for an operator to request the start of maintenance by input to the user interface 196. In step S12, the reader 111 starts searching for a code in an image captured by the camera 60. In step S13, the decoding unit 112 waits for the reader 111 to recognize the code.

[0103] Next, the control device 100 executes steps S14 and S15. In step S14, the decoding unit 112 decodes the code into maintenance information and stores it in the maintenance information storage unit 113. In step S15, the maintenance information storage unit 113 executes maintenance processing based on the maintenance information in the maintenance information storage unit 113. This completes the maintenance processing procedure.

[0104] Below, the maintenance processing procedures are exemplified as follows: a preparation processing procedure for causing the processing device 50 to execute processing based on the maintenance information, and an update procedure for updating the control parameters based on the maintenance information.Furthermore, an optimization procedure for optimizing the control parameters based on the maintenance information is also exemplified.

[0105] (Preparation Procedure) FIG. 12 is a flowchart illustrating a preparation processing procedure. As shown in FIG. 12, the control device 100 first executes step S21. In step S21, the timing identifying unit 116 checks whether it is time to display guidance based on the progress of the maintenance processing by the maintenance executing unit 114 and the configuration information. For example, the timing identifying unit 116 checks whether the progress of the maintenance processing by the maintenance executing unit 114 has reached a point just before the processing that should be performed by the worker in the arrangement of the multiple procedures. If step S21 is being executed for the first time, the timing identifying unit 116 checks whether the processing that should be performed by the worker is the first in the arrangement of the multiple procedures.

[0106] If it is determined in step S21 that it is time to display the guidance, the control device 100 executes steps S22, S23, S24, and S25. In step S22, the display unit 115 displays the guidance based on the configuration information included in the maintenance information. In step S23, the display unit 115 waits for a completion notification to be input by the input object of the guidance. In step S24, the display unit 115 closes the guidance.

[0107] In step S25, the maintenance execution unit 114 checks whether the completion notification includes an edit result of the maintenance processing content. If it is determined in step S25 that the completion notification includes an edit result, the control device 100 executes step S26. In step S26, the maintenance execution unit 114 updates the maintenance information based on the edit result.

[0108] Next, the control device 100 executes step S27. If it is determined in step S25 that the completion notice does not include the editing result, the control device 100 executes step S27 without executing step S26. In step S27, the display unit 115 checks whether there is any guidance to be displayed next based on the maintenance information.

[0109] If it is determined in step S27 that there is guidance to be displayed next, the control device 100 executes step S28. In step S28, the display unit 115 displays the next guidance on the user interface 196 based on the maintenance information. Thereafter, the control device 100 returns the process to step S23.

[0110] If it is determined in step S27 that there is no guidance to be displayed next, the control device 100 executes step S29. If it is determined in step S21 that it is not time to display guidance, the control device 100 executes step S29 without executing steps S22 to S28. In step S29, the maintenance execution unit 114 causes the processing device 50 to execute one sub-process. The contents of step S29 will be described later.

[0111] Next, the control device 100 executes step S31. In step S31, the maintenance execution unit 114 checks whether execution of all sub-processes included in the maintenance information has been completed. If it is determined in step S31 that unexecuted sub-processes remain, the control device 100 returns the process to step S21. If it is determined in step S31 that execution of all sub-processes has been completed, the control device 100 completes the preparation process.

[0112] 13 is a flowchart illustrating the sub-processing in step S29. As shown in FIG. 13, the control device 100 first executes steps S41 and S42. In step S41, the display unit 115 displays guidance for start / interruption (e.g., guidance 340). In step S42, the maintenance execution unit 114 waits for the start object to be operated in the guidance.

[0113] Next, the control device 100 executes steps S43 and S44. In step S43, the maintenance execution unit 114 identifies the processing module 51 that is to be the target of the sub-processing based on the maintenance information. Hereinafter, the identified processing module 51 will be referred to as the "target module." In step S44, the maintenance execution unit 114 starts control of the target module so as to execute the sub-processing. For example, the maintenance execution unit 114 requests the control execution unit 118 to start control of the target module.

[0114] Next, the control device 100 executes step S45. In step S45, the maintenance execution unit 114 checks whether or not the control of the target module by the control execution unit 118 has been completed. If it is determined in step S45 that the control has not been completed, the control device 100 executes step S46. In step S46, the maintenance execution unit 114 checks whether or not the interrupted object has been operated. If it is determined in step S46 that the interrupted object has not been operated, the control device 100 returns the process to step S45.

[0115] If it is determined in step S46 that the interruption object has been operated in the guidance, the control device 100 executes steps S47, S48, and S49. In step S47, the maintenance execution unit 114 interrupts control of the target module by the control execution unit 118. In step S48, the control device 100 waits for the start object to be operated in the guidance. In step S49, the maintenance execution unit 114 resumes control of the target module by the control execution unit 118. Thereafter, the control device 100 returns the process to step S45.

[0116] If it is determined in step S45 that control of the target module by the control execution unit 118 has been completed, the control device 100 executes steps S51 and S52. In step S51, the maintenance execution unit 114 causes the control execution unit 118 to stop the target module. In step S52, the display unit 115 closes the start / interrupt guidance. This completes the preparation process in step S29.

[0117] (Update procedure) Fig. 14 is a flowchart illustrating an example of the update procedure. As shown in Fig. 14, the control device 100 executes steps S61, S62, and S63. In step S61, the maintenance execution unit 114 identifies a processing module 51 that is to be the target of updating the control parameters. Hereinafter, the identified processing module 51 will be referred to as the "target module." The processing executed by the target module may include one or more of the first processes and one or more of the second processes.

[0118] In step S62, the maintenance execution unit 114 updates one or more first control parameters of one or more first processes based on the maintenance information. In step S63, the maintenance execution unit 114 updates one or more second control parameters of one or more second processes based on the one or more first control parameters and the second model.

[0119] (Optimization procedure) FIG. 15 is a flowchart illustrating an optimization procedure. As shown in FIG. 15, the control device 100 executes steps S71, S72, S73, and S74. In step S71, similar to step S61, the maintenance execution unit 114 identifies a target module. In step S72, the maintenance execution unit 114 causes the target module to perform processing on a sample substrate. For example, the maintenance execution unit 114 requests the control execution unit 118 to cause the target module to perform processing on a sample substrate.

[0120] In step S73, the maintenance execution unit 114 acquires the measurement results of the processed sample substrate. For example, the maintenance execution unit 114 requests the control execution unit 118 to cause the processing device 50 to measure the processed sample substrate, and acquires the measurement results from the control execution unit 118.

[0121] In step S74, the maintenance execution unit 114 checks whether the measurement result is within an allowable range. For example, the maintenance execution unit 114 checks whether the deviation between the target processing result and the measurement result is within an allowable range.

[0122] If it is determined in step S74 that the deviation is not within the allowable range, the control device 100 executes step S75. The maintenance execution unit 114 updates one or more control parameters to reduce the deviation based on the deviation between the target processing result and the measurement result and the first model described above. The control device 100 then returns the process to step S72. Thereafter, the process on the sample substrate and the update of the one or more control parameters are repeatedly executed until the deviation falls within the allowable range.

[0123] If it is determined in step S74 that the deviation is within the acceptable range, the controller 100 completes the optimization procedure.

[0124] As described above, the measurement of the processed sample substrate may be performed by a measuring device 200 provided separately from the wafer processing system 1. In this case, the display unit 115 displays guidance in step S73 requesting the operator to perform the above-mentioned tasks 1 to 3.

[0125] 16 is a flowchart illustrating a procedure for generating a result code executed by the code generation device 210 in response to an operation by an operator. As shown in FIG. 16, in step S81, the code generation device 210 requests the measurement device 200 to transmit the measurement results of the sample substrate. In step S82, the code generation device 210 waits to receive the measurement results from the measurement device 200. In step S83, the code generation device 210 encodes the measurement results using an encoder to generate a result code. This completes the generation of the result code.

[0126] FIG. 17 is a flowchart illustrating the procedure in step S74 in which the control device 100 acquires the measurement results based on the result code. As shown in FIG. 17, the control device 100 executes steps S91, S92, S93, and S94. In step S91, the reader 111 waits for an operator to request reading of the result code by input to the user interface 196. In step S92, the reader 111 starts searching for the result code in the image captured by the camera 60. In step S93, the decoding unit 112 waits for the reader 111 to recognize the code. In step S94, the decoding unit 112 decodes the code into a measurement result, and the maintenance execution unit 114 acquires the measurement result. This completes the acquisition of the measurement results.

[0127] 〔summary〕 The above-described exemplary embodiment includes the following configurations. (1) A substrate processing apparatus 1 comprising a processing apparatus 50 for processing a substrate, a reader 111 for optically reading a code including encoded maintenance information, a decoding unit 112 for decoded the code read by the reader 111 into maintenance information, and a maintenance execution unit 114 for executing maintenance processing on the processing apparatus 50 based on the decoded maintenance information. Bringing mobile terminals into the fabrication facility 92 is strictly restricted. For this reason, workers have had to memorize maintenance information or print it on paper or other media, and then perform maintenance by manually operating the workers based on the maintenance information. It is difficult to sufficiently prevent human error in maintenance that relies on workers' memory or manual operation. In contrast, the present substrate processing apparatus 1 encodes the maintenance information into an optically readable code, allowing the substrate processing apparatus 1 to recognize the maintenance information and perform maintenance based on the maintenance information without relying on manual operation that may involve human error. This is therefore effective in performing maintenance of the substrate processing apparatus 1 with high reliability.

[0128] (2) The substrate processing apparatus 1 according to (1), further comprising a display unit 115 that displays guidance based on maintenance information including configuration information of guidance requesting an operator to perform maintenance work. The maintenance may include not only the maintenance process to be performed by the substrate processing apparatus 1 itself, but also the work to be performed by the operator. The configuration information included in the maintenance information allows guidance to be individually set for the operator for each maintenance task. The individually set guidance can further reduce human error.

[0129] (3) The substrate processing apparatus 1 described in (2) further includes a timing specification unit 116 that specifies the timing for displaying the guidance based on the progress of the maintenance processing and the maintenance information, and the display unit 115 displays the guidance at the specified display timing. By displaying guidance in accordance with the progress of maintenance processing, human error can be further reduced.

[0130] (4) The substrate processing apparatus 1 described in (3) above, wherein the maintenance execution unit 114 suspends the maintenance process at the specified display timing, the display unit 115 displays guidance including a request for maintenance work and an input object for inputting a completion notification of the maintenance work, and the maintenance execution unit 114 resumes the maintenance process in response to input of the completion notification via the input object. This allows the substrate processing apparatus 1 and the worker to work together in a timely manner.

[0131] (5) The display unit 115 displays guidance including a request to set materials for the maintenance process and an input object for inputting a notification of completion of the setting of the materials, and the maintenance execution unit 114 resumes the maintenance process including having the processing device 50 perform processing using the materials in response to input of the completion notification via the input object. (4) The substrate processing device 1 described in (4) It is possible to reduce human errors, such as forgetting to set up materials or delays in setting up materials.

[0132] (6) The display unit 115 displays guidance including a request to confirm whether the contents of the maintenance processing are as intended and an input object for inputting a completion notification including the confirmation result of whether the contents of the maintenance processing are as intended, and the maintenance execution unit 114 resumes the maintenance processing when the confirmation result included in the completion notification by the input object indicates that the contents of the maintenance processing are as intended, in the substrate processing apparatus 1 described in (4) or (5). By checking the details of the maintenance process against the worker's recognition, human error can be further reduced.

[0133] (7) The display unit 115 displays guidance including a request to confirm whether the processing device 50 is a target for maintenance processing and an input object for inputting a completion notification including the confirmation result of whether the processing device 50 is a target for maintenance processing, and the maintenance execution unit 114 resumes the maintenance processing when the confirmation result included in the completion notification by the input object indicates that the processing device 50 is a target for maintenance processing, in a substrate processing apparatus 1 described in any one of (4) to (6). This can prevent maintenance from being performed on the wrong target.

[0134] (8) The display unit 115 displays guidance including a request to edit the contents of the maintenance processing and an input object for inputting a completion notification including the editing results of the contents of the maintenance processing, and the maintenance execution unit 114 resumes the maintenance processing based on the editing results included in the completion notification in response to input of the completion notification using the input object, in a substrate processing apparatus 1 described in any one of (4) to (7). In the fabrication facility 92 as well, by making it possible to edit the contents of the maintenance process, it is possible to achieve both the suppression of human error and flexibility.

[0135] (9) A substrate processing apparatus 1 according to any one of (4) to (8), wherein the processing apparatus 50 processes the substrate based on predetermined control parameters, the display unit 115 displays guidance including a request to edit the control parameters and an input object for inputting a completion notification including the editing results of the control parameters, and the maintenance execution unit 114 resumes the maintenance process including updating the control parameters based on the editing results included in the completion notification in response to input of the completion notification via the input object. This reduces human error that occurs when manually editing control parameters.

[0136] (10) The display unit 115 displays guidance including a start object that instructs the start of maintenance processing and an interrupt object that instructs the interruption of the maintenance processing, and the maintenance execution unit 114 executes the maintenance processing in response to the instruction to start execution from the start object and interrupts the maintenance processing in response to the instruction to interrupt from the interrupt object, in the substrate processing apparatus 1 described in (3). By enabling the start and interruption of maintenance processing by manual operation, it becomes possible to respond quickly to unexpected situations.

[0137] (11) The display unit 115 displays guidance including mode selection objects 333, 334 for selecting either a first mode in which the maintenance process is performed continuously or a second mode in which the maintenance process is performed in stages, the maintenance execution unit 114 causes the processing device 50 to perform the maintenance process continuously in the first mode, and interrupts the execution of the maintenance process at each stage in the second mode, the display unit 115 displays guidance including a start object that instructs the start of execution of the next stage each time the execution of the maintenance process is interrupted, and causes the maintenance execution unit 114 to execute the next stage in response to the instruction to start execution from the start object. In fabrication facility 92, the balance between maintenance reliability and efficiency can be adjusted.

[0138] (12) A substrate processing apparatus 1 according to any one of (1) to (11), further comprising an ID storage unit 121 that stores the ID of the processing apparatus 50, and a target determination unit 122 that determines whether the processing apparatus 50 is a target for maintenance processing based on maintenance information and the stored ID of the processing apparatus 50, and the maintenance execution unit 114 executes the maintenance processing when it is determined that the processing apparatus 50 is a target for maintenance processing. This can prevent maintenance from being performed on the wrong target.

[0139] (13) A substrate processing apparatus 1 according to any one of (1) to (12), wherein the processing apparatus 50 processes the substrate based on predetermined control parameters, and the maintenance execution unit 114 executes maintenance processing including updating the control parameters based on maintenance information. By including the updated control parameters in the maintenance information, the control parameters can be updated with higher reliability.

[0140] (14) A substrate processing apparatus 1 described in any one of (1) to (13), wherein the processing apparatus 50 includes a plurality of processing modules 51 each performing processing on a substrate, and the maintenance execution unit 114 identifies one or more processing modules 51 among the plurality of processing modules 51 that are to be subjected to maintenance processing based on maintenance information, and performs maintenance processing on the identified one or more processing modules 51. By specifying one or more processing modules 51 to be subjected to maintenance processing using maintenance information, it is possible to prevent errors in identifying one or more processing modules 51.

[0141] (15) A substrate processing apparatus 1 according to any one of (1) to (14), wherein the processing apparatus 50 processes the substrate based on predetermined control parameters, and the maintenance execution unit 114 performs maintenance processing including causing the processing apparatus 50 to process a sample substrate based on maintenance information, and updating the control parameters based on measurement results of the sample substrate after processing. The updated control parameters can be output to the substrate processing apparatus 1. Therefore, human error involved in adjusting the control parameters can be suppressed.

[0142] (16) The substrate processing apparatus 1 described in (15) wherein the maintenance execution unit 114 executes a maintenance process further including having the processing apparatus 50 measure the sample substrate after processing, and updates the control parameters based on the measurement results of the sample substrate by the processing apparatus 50. In addition to processing the sample substrate, the processing device 50 also measures the sample substrate after processing, so that the control parameters can be updated efficiently.

[0143] (17) The substrate processing apparatus 1 according to any one of (1) to (16), wherein the code is a two-dimensional code. This allows for more flexibility in the amount of information the code can hold.

[0144] (18) A substrate processing apparatus 1 according to any one of (1) to (17), wherein the processing apparatus 50 performs a first process on a substrate based on a predetermined first control parameter and a second process on the substrate based on a predetermined second control parameter, and the maintenance execution unit 114 performs a maintenance process including updating the first control parameter based on maintenance information and updating the second control parameter based on the updated first control parameter and a model previously generated to represent the relationship between the first control parameter and the second control parameter. The amount of maintenance information can be reduced.

[0145] (19) A substrate processing system 94 comprising: a substrate processing apparatus 1 according to (15) or (16); a measuring apparatus 200 for measuring a sample substrate after processing; and a result code generating unit 211 for encoding the measurement results obtained by the measuring apparatus 200 to generate a result code, wherein a decoding unit 112 decodes the result code read by the reader 111 into the measurement result; and a maintenance execution unit 114 updates the control parameters based on the decoded measurement result. This makes it possible to suppress human error when transmitting the measurement results outside the processing device 50 to the maintenance execution unit 114.

[0146] (20) A method for performing maintenance on a processing device 50 that processes substrates within a fabrication facility 92, the maintenance method including: generating maintenance information based on input to a terminal device outside the fabrication facility 92; encoding the maintenance information to generate a code; decrypting the code into maintenance information by a reader 111 within the fabrication facility 92; and performing maintenance processing on the processing device 50 based on the decrypted maintenance information.

[0147] Although the embodiments have been described above, the present invention is not necessarily limited to the above-described embodiments, and various modifications are possible without departing from the spirit of the present invention. [Explanation of symbols]

[0148] 92...fabrication facility, 94...substrate processing system, 1...substrate processing apparatus, 50...processing apparatus, 51...processing module, 111...reader, 112...decryption unit, 114...maintenance execution unit, 115...display unit, 116...timing identification unit, 333, 334...mode selection object, 121...ID storage unit, 122...target determination unit, 200...measuring device, 211...result code generation unit.

Claims

1. a processing device for processing a substrate; a reader for optically reading the code containing the encoded maintenance information; a decoding unit that decodes the code read by the reader into the maintenance information; a maintenance execution unit that executes a maintenance process on the processing device based on the decrypted maintenance information; A substrate processing apparatus comprising:

2. a display unit that displays the guidance based on the maintenance information including configuration information of the guidance requesting the worker to perform maintenance work, The substrate processing apparatus according to claim 1 .

3. a timing specification unit that specifies a timing for displaying the guidance based on the progress of the maintenance process and the maintenance information; the display unit displays the guidance at the specified display timing. The substrate processing apparatus according to claim 2 .

4. the maintenance execution unit interrupts the maintenance process at the specified display timing, the display unit displays the guidance including a request for the maintenance work and an input object for inputting a completion notification of the maintenance work; the maintenance execution unit resumes the maintenance process in response to the input of the completion notification by the input object. The substrate processing apparatus according to claim 3 .

5. the display unit displays the guidance including a request to set materials for the maintenance process and the input object for inputting a notification of completion of setting the materials; the maintenance execution unit resumes the maintenance process, which includes causing the processing device to execute a process using the material, in response to the input of the completion notification by the input object. The substrate processing apparatus according to claim 4.

6. the display unit displays the guidance including a request to confirm whether the content of the maintenance process is as intended, and the input object for inputting the completion notification including a confirmation result of whether the content of the maintenance process is as intended; the maintenance execution unit resumes the maintenance process when the confirmation result included in the completion notification from the input object indicates that the content of the maintenance process is as intended. The substrate processing apparatus according to claim 4.

7. the display unit displays the guidance including a request to confirm whether or not the processing device is a target for the maintenance process, and the input object for inputting the completion notification including a confirmation result of whether or not the processing device is a target for the maintenance process; the maintenance execution unit resumes the maintenance process when the confirmation result included in the completion notification from the input object indicates that the processing device is a target for the maintenance process. The substrate processing apparatus according to claim 4.

8. the display unit displays the guidance including a request to edit the content of the maintenance process and the input object for inputting the completion notification including the editing result of the content of the maintenance process; the maintenance execution unit, in response to the input of the completion notification by the input object, resumes the maintenance process based on the editing result included in the completion notification. The substrate processing apparatus according to claim 4.

9. the processing device processes the substrate based on predetermined control parameters; the display unit displays the guidance including a request to edit the control parameters and the input object for inputting the completion notification including a result of editing the control parameters; the maintenance execution unit resumes the maintenance process, in response to the input of the completion notification by the input object, which includes updating the control parameters based on the editing result included in the completion notification. The substrate processing apparatus according to claim 4.

10. the display unit displays the guidance including a start object that instructs the user to start the maintenance process and an interruption object that instructs the user to interrupt the maintenance process; the maintenance execution unit executes the maintenance process in response to an instruction to start execution from the initiation object, and suspends the maintenance process in response to an instruction to suspend from the suspend object. The substrate processing apparatus according to claim 3 .

11. the display unit displays the guidance including a mode selection object for selecting either a first mode in which the maintenance process is performed in its entirety or a second mode in which the maintenance process is performed in stages; the maintenance execution unit causes the processing device to execute the maintenance process continuously in the first mode, and interrupts the execution of the maintenance process at each stage in the second mode; the display unit displays the guidance including a start object instructing the start of execution of a next stage every time execution of the maintenance process is interrupted, and causes the maintenance execution unit to execute the next stage in response to the instruction to start execution by the start object. The substrate processing apparatus according to claim 3 .

12. an ID storage unit that stores the ID of the processing device; a target determination unit that determines whether the processing device is a target for the maintenance process based on the maintenance information and the stored ID of the processing device; Further provided with the maintenance execution unit executes the maintenance process when it is determined that the processing device is a target for the maintenance process. The substrate processing apparatus according to claim 1 .

13. the processing device processes the substrate based on predetermined control parameters; the maintenance execution unit executes the maintenance process including updating the control parameters based on the maintenance information. The substrate processing apparatus according to claim 1 .

14. the processing apparatus includes a plurality of processing modules each performing a processing on the substrate; the maintenance execution unit identifies one or more processing modules to be subjected to the maintenance processing among the plurality of processing modules based on the maintenance information, and executes the maintenance processing on the identified one or more processing modules. The substrate processing apparatus according to claim 1 .

15. the processing device processes the substrate based on predetermined control parameters; The maintenance execution unit causing the processing device to process the sample substrate based on the maintenance information; updating the control parameters based on measurement results of the sample substrate after processing; performing the maintenance process, The substrate processing apparatus according to claim 1 .

16. the maintenance execution unit executes the maintenance process, which further includes having the processing device measure the sample substrate after processing, and updates the control parameters based on the measurement results of the sample substrate by the processing device. The substrate processing apparatus according to claim 15.

17. The code is a two-dimensional code. The substrate processing apparatus according to claim 1 .

18. the processing device performs a first process on the substrate based on predetermined first control parameters, and performs a second process on the substrate based on predetermined second control parameters; The maintenance execution unit updating the first control parameter based on the maintenance information; updating the second control parameter based on the updated first control parameter and a model generated in advance to represent a relationship between the first control parameter and the second control parameter; performing the maintenance process, The substrate processing apparatus according to claim 1 .

19. a substrate processing apparatus according to claim 15; a measuring device for measuring the sample substrate after processing; a result code generation unit that encodes the measurement result obtained by the measurement device to generate a result code; Equipped with the decoding unit decodes the result code read by the reader into a measurement result; The maintenance execution unit updates the control parameters based on the decoded measurement results.

20. 1. A method for performing maintenance on a processing device that processes substrates in a fabrication facility, comprising: generating maintenance information based on input to a terminal device outside the fabrication facility; encoding the maintenance information to generate a code; decoding the code into the maintenance information by a reader within the fabrication facility; performing a maintenance process on the processing device based on the decrypted maintenance information; Maintenance methods including.

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