Polyarylene sulfide resin composition for tabular conductive member, conductive member, and manufacturing method of the same

Abstract

To provide a polyarylene sulfide resin composition for a tabular conductive member which is excellent in high / low temperature impact resistance, a conductive member, a manufacturing method of the same.SOLUTION: A polyarylene sulfide resin composition for a tabular conductive member contains (A) a polyarylene sulfide resin, (B) a fibrous inorganic filler, and (C) an alkoxysilane compound, wherein a temperature-falling crystallization temperature (Tc) of (A) the polyarylene sulfide resin is 215°C or higher, (B) the fibrous inorganic filler contains a fibrous inorganic filler (b1) having a different diameter ratio of 3.0 or more, a content of the fibrous inorganic filler (b1) is 50 to 100 mass% in (B) the fibrous inorganic filler, and with respect to 100 pts.mass of (A) the polyarylene sulfide resin, the content of (B) the fibrous inorganic filler is 55 to 250 pts.mass, and the content of (C) the alkoxysilane compound is 0.3 to 10 pts.mass.SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present disclosure relates to a polyarylene sulfide resin composition for a plate-shaped conductive member, a conductive member, and a method for producing the same. [Background technology]

[0002] Because plate-shaped conductive members such as bus bars can efficiently supply power, they are often used in components that carry large currents, such as inverter current sensors for automotive parts. Such plate-shaped conductive members often have a structure in which a resin insulating layer is provided on the surface of a conductive substrate such as a metal. Because the temperature-dependent expansion and contraction rates (so-called linear expansion coefficients) of the conductive substrate (metal, etc.) and the resin are significantly different, the plate-shaped conductive member may crack or break when used in an environment with large temperature fluctuations, such as in automotive parts. Therefore, it is desirable to use a resin that has excellent high- and low-temperature impact resistance when combined with metal, etc., as the resin constituting the insulating layer, so that the plate-shaped conductive member can maintain reliability and withstand temperature changes even when used in an environment with large temperature fluctuations. Patent Document 1 describes an insert-molded product made of a polyarylene sulfide resin with improved high- and low-temperature impact resistance. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2005-161693 Summary of the Invention [Problem to be solved by the invention]

[0004] An object of the present disclosure is to provide a polyarylene sulfide resin composition for a plate-shaped conductive member that has excellent high- and low-temperature impact resistance, a conductive member, and a method for producing the same. [Means for solving the problem]

[0005] The present disclosure includes the following aspects. [1] A polyarylene sulfide resin composition for a plate-shaped conductive member, (A) a polyarylene sulfide resin; (B) a fibrous inorganic filler; (C) an alkoxysilane compound, the (A) polyarylene sulfide resin has a temperature-decreasing crystallization temperature (Tc) of 215°C or higher, wherein the temperature-decreasing crystallization temperature (Tc) is an exothermic peak temperature associated with crystallization observed when the (A) polyarylene sulfide resin is heated to 340°C by a differential scanning calorimeter, melted, and then cooled at a rate of 10°C / min; The (B) fibrous inorganic filler contains a fibrous inorganic filler (b1) having a diameter ratio, which is the ratio of the major axis to the minor axis of a cross section perpendicular to the longitudinal direction, of 3.0 or more, the content of the fibrous inorganic filler (b1) is 50 to 100 mass% of the total amount of the fibrous inorganic filler (B), the content of the (B) fibrous inorganic filler is 55 to 250 parts by mass relative to 100 parts by mass of the (A) polyarylene sulfide resin, A polyarylene sulfide resin composition, wherein the content of the (C) alkoxysilane compound is 0.3 to 10 parts by mass per 100 parts by mass of the (A) polyarylene sulfide resin. [2] A plate-shaped conductive member comprising at least a plate-shaped conductive substrate and an insulating layer covering at least a part of the plate-shaped conductive substrate, the insulating layer contains a polyarylene sulfide resin composition, The polyarylene sulfide resin composition is (A) a polyarylene sulfide resin; (B) a fibrous inorganic filler; (C) an alkoxysilane compound, the (A) polyarylene sulfide resin has a temperature-decreasing crystallization temperature (Tc) of 215°C or higher, wherein the temperature-decreasing crystallization temperature (Tc) is an exothermic peak temperature associated with crystallization observed when the (A) polyarylene sulfide resin is heated to 340°C by a differential scanning calorimeter, melted, and then cooled at a rate of 10°C / min; The (B) fibrous inorganic filler contains a fibrous inorganic filler (b1) having a diameter ratio, which is the ratio of the major axis to the minor axis of a cross section perpendicular to the longitudinal direction, of 3.0 or more, the content of the fibrous inorganic filler (b1) is 50 to 100 mass% of the total amount of the fibrous inorganic filler (B), the content of the (B) fibrous inorganic filler is 55 to 250 parts by mass relative to 100 parts by mass of the (A) polyarylene sulfide resin, The plate-shaped conductive member, wherein the content of the (C) alkoxysilane compound is 0.3 to 10 parts by mass relative to 100 parts by mass of the (A) polyarylene sulfide resin. [Effects of the Invention]

[0006] According to the present disclosure, it is possible to provide a polyarylene sulfide resin composition for a plate-shaped conductive member, which has excellent high- and low-temperature impact resistance, a conductive member, and a method for producing the same. DETAILED DESCRIPTION OF THE INVENTION

[0007] An embodiment of the present disclosure will be described in detail below. However, the scope of the present disclosure is not limited to the embodiment described herein, and various modifications can be made without departing from the spirit of the present disclosure. Each aspect disclosed in this specification can be combined with any other feature disclosed in this specification. Furthermore, when multiple upper and lower limit values ​​are described for a specific parameter, any of these upper and lower limit values ​​can be combined to form a suitable numerical range. Furthermore, the lower and / or upper limit values ​​of a numerical range described in this disclosure are numerical values ​​within that numerical range and may be replaced with numerical values ​​shown in the examples. The expression "X to Y" indicating a numerical range means "X or more and Y or less." If a specific description described for one embodiment also applies to other embodiments, that description may be omitted in other embodiments.

[0008] [Polyarylene sulfide resin composition] The polyarylene sulfide resin composition (hereinafter also simply referred to as "resin composition") according to the present disclosure is a polyarylene sulfide resin composition for a plate-shaped conductive member, and contains (A) a polyarylene sulfide resin, (B) a fibrous inorganic filler, and (C) an alkoxysilane compound. The term "polyarylene sulfide resin composition" refers to a resin composition containing a polyarylene sulfide resin. The term "for plate-shaped conductive members" refers to a composition used for producing plate-shaped conductive members. The term "plate-shaped conductive member" refers to a conductive member that is at least partially or entirely plate-shaped, and the specific shape is selected depending on the application. The shape of the main surface of the plate-shaped conductive member is not particularly limited, and examples thereof include polygonal (e.g., rectangular), circular, and elliptical shapes. The cross-sectional shape of the plate-shaped conductive substrate (the shape of the surface perpendicular to the main surface) is also not particularly limited, and examples thereof include polygonal (e.g., rectangular), circular, and elliptical shapes. When the thickness of the plate-shaped conductive substrate is large (for example, when the thickness is equal to or greater than half the width in a plan view), the shape of the plate-shaped conductive member can also be called columnar. When the columnar shape has a small thickness (thin) and a long length, the shape of the plate-shaped conductive member can also be called rod-shaped. In other words, the term "plate-shaped conductive member" also includes shapes such as "columnar" and "rod-shaped." The plate-shaped conductive member may have a shape that combines multiple shapes described above.

[0009] <(A) Polyarylene sulfide resin> The resin composition contains (A) a polyarylene sulfide resin as a resin component. The content of (A) the polyarylene sulfide resin in the resin component is preferably 80% by mass or more, more preferably 90% by mass or more, even more preferably 95% by mass or more, still more preferably 98% by mass or more, and particularly preferably 99.9% by mass or more. In one embodiment, the resin component constituting the resin composition may be configured to consist of (A) the polyarylene sulfide resin. The content of the polyarylene sulfide resin (A) in the resin composition is preferably 30% by mass or more, more preferably 35% by mass or more. In one embodiment, the content of the polyarylene sulfide resin (A) in the resin composition may be 30 to 70% by mass, 30 to 65% by mass, or 35 to 60% by mass.

[0010] The (A) polyarylene sulfide resin is a resin having a repeating unit represented by the following general formula (I). -(Ar-S)- (I) (wherein Ar represents an arylene group.)

[0011] The arylene group is not particularly limited, and examples thereof include p-phenylene group, m-phenylene group, o-phenylene group, substituted phenylene group, p,p'-diphenylene sulfone group, p,p'-biphenylene group, p,p'-diphenylene ether group, p,p'-diphenylene carbonyl group, naphthalene group, etc. The (A) polyarylene sulfide resin can be a homopolymer using the same repeating unit among the repeating units represented by the above general formula (I), or a copolymer containing different repeating units depending on the application.

[0012] As the homopolymer, one having a p-phenylene group as the arylene group and a p-phenylene sulfide group as a repeating unit is preferred. This is because homopolymers having a p-phenylene sulfide group as a repeating unit have extremely high heat resistance and exhibit high strength, high rigidity, and high dimensional stability over a wide temperature range. By using such homopolymers, molded products with excellent physical properties can be obtained.

[0013] As the copolymer, a combination of two or more different arylene sulfide groups among the above-mentioned arylene group-containing arylene sulfide groups can be used. Among these, a combination containing a p-phenylene sulfide group and an m-phenylene sulfide group is preferred from the viewpoint of obtaining a molded product with high physical properties such as heat resistance, moldability, and mechanical properties. A polymer containing 70 mol % or more of p-phenylene sulfide groups is more preferred, and a polymer containing 80 mol % or more is even more preferred. The (A) polyarylene sulfide resin having phenylene sulfide groups is a polyphenylene sulfide resin (PPS resin).

[0014] Generally, polyarylene sulfide resins are known to have molecular structures that are substantially linear and have no branched or crosslinked structures, and structures that have branches or crosslinks, depending on the production method, and either type may be used as the (A) polyarylene sulfide resin.

[0015] (A) Polyarylene sulfide resin at 310°C and a shear rate of 1200 sec -1 From the viewpoint of improving moldability and toughness, the melt viscosity measured by is preferably 3 to 250 Pa·s, more preferably 5 to 150 Pa·s, and even more preferably 8 to 80 Pa·s.

[0016] The cooling crystallization temperature (Tc) of the (A) polyarylene sulfide resin is 215° C. or higher, preferably greater than 215° C., more preferably 216° C. or higher, even more preferably 217° C. or higher, and particularly preferably 218° C. or higher. Surprisingly, when the (A) polyarylene sulfide resin has a cooling crystallization temperature (Tc) of 215° C. or higher, a synergistic effect can be sufficiently obtained in combination with the (C) alkoxysilane compound described below, and the high and low temperature impact resistance of a conductive member used in combination with a plate-shaped conductive substrate such as a metal can be improved. The upper limit of the cooling crystallization temperature (Tc) of the (A) polyarylene sulfide resin is preferably 260°C or lower, more preferably 250°C or lower, and particularly preferably 240°C or lower, from the viewpoint of transferability during molding. In one embodiment, the cooling-down crystallization temperature (Tc) of the (A) polyarylene sulfide resin may be 215 to 260° C., may be greater than 215° C. and not greater than 260° C., may be 216 to 250° C., or may be 216 to 240° C. In one embodiment, the cooling-down crystallization temperature (Tc) of the (A) polyarylene sulfide resin may be 219° C., or may be within the upper or lower limit of the above-mentioned numerical range.

[0017] The cooling crystallization temperature (Tc) is the exothermic peak temperature associated with crystallization observed when (A) polyarylene sulfide resin is heated to 340°C using a differential scanning calorimeter to melt it, and then cooled at a rate of 10°C / min.

[0018] Methods for adjusting the temperature-drop crystallization temperature (Tc) of the (A) polyarylene sulfide resin to 215°C or higher include adjusting the molecular weight of the (A) polyarylene sulfide resin and adjusting whether or not a post-polymerization washing treatment is performed and the conditions for such treatment. While a post-polymerization washing treatment is preferred due to its simple process, this method is not necessarily limited to this method. When the molecular weight of the (A) polyarylene sulfide resin is low, the temperature-drop crystallization temperature (Tc) tends to be high. Therefore, when the temperature-drop crystallization temperature (Tc) is too low, the temperature-drop crystallization temperature (Tc) can be increased by blending a (A) polyarylene sulfide resin with a low molecular weight. Examples of washing treatment methods include washing the polymer after polymerization with an acidic aqueous solution of appropriate acidity. In this case, examples of acids used as the acidic aqueous solution include inorganic acids such as hydrochloric acid, sulfuric acid, and ammonium chloride; saturated fatty acids such as acetic acid, formic acid, propionic acid, butyric acid, valeric acid, and caproic acid; unsaturated fatty acids such as acrylic acid, crotonic acid, and oleic acid; aromatic carboxylic acids such as benzoic acid, phthalic acid, and salicylic acid; dicarboxylic acids such as oxalic acid, maleic acid, and fumaric acid; and methanesulfonic acid and paratoluenesulfonic acid. Among these, hydrochloric acid, acetic acid, and ammonium chloride tend to increase the temperature-decreasing crystallization temperature (Tc) of the (A) polyarylene sulfide resin. Furthermore, regarding the conditions for the washing treatment, increasing the acid concentration of the acidic aqueous solution can further increase the temperature-decreasing crystallization temperature (Tc). Furthermore, before or after washing with the acidic aqueous solution, washing with an organic solvent such as acetone or water may be performed as needed.

[0019] The method for producing the (A) polyarylene sulfide resin is not particularly limited, and it can be produced by a conventionally known production method. For example, it can be produced by synthesizing a low-molecular-weight polyarylene sulfide resin and then polymerizing it at high temperature in the presence of a known polymerization aid to increase the molecular weight. It may also be produced by blending multiple types of polyarylene sulfide resins. In this case, it is also possible to produce it by combining polyarylene sulfide resins with different melt viscosities. When combining polyarylene sulfide resins with different melt viscosities, it is preferable that the melt viscosity of the resulting resin is within the above range. It is also possible to combine two or more polyarylene sulfide resins with different cooling crystallization temperatures (Tc) within a range in which the cooling crystallization temperature (Tc) of the resulting resin is 215°C or higher.

[0020] Polyarylene sulfide resins produced by a general polymerization method are usually washed several times with an organic solvent such as water or acetone to remove by-product impurities, etc. As described above, in one embodiment, the polyarylene sulfide resin (A) may then be further washed with acetic acid, ammonium chloride, etc.

[0021] <(B) Fibrous inorganic filler> The resin composition contains (B) a fibrous inorganic filler. By containing (B) the resin composition, mechanical strength can be increased, and by containing the following fibrous inorganic filler (b1), high and low temperature impact resistance of a conductive member used in combination with a plate-like conductive substrate such as a metal can be increased.

[0022] (fibrous inorganic filler (b1)) The (B) fibrous inorganic filler contains a fibrous inorganic filler (b1) (hereinafter simply referred to as "fibrous inorganic filler (b1)") having a cross-sectional area ratio, which is the ratio of the major axis to the minor axis of a cross section perpendicular to the longitudinal direction, of 3.0 or more. By including the fibrous inorganic filler (b1) in the (B) fibrous inorganic filler, the resin composition can enhance the high- and low-temperature impact resistance of a plate-shaped conductive member used in combination with a metal or the like through a synergistic effect with the (C) alkoxysilane compound described below. Furthermore, the (B) fibrous inorganic filler can contain fibrous inorganic fillers other than the fibrous inorganic filler (b1). However, when the (B) fibrous inorganic filler contains a fibrous inorganic filler with a round cross section, conductive members with edges (corners) are prone to cracking at the edges due to sudden temperature changes. However, surprisingly, it has been found that by including the fibrous inorganic filler (b1) in the (B) fibrous inorganic filler, even when the resin composition contains a fibrous inorganic filler with a round cross section, cracking at the edges due to sudden temperature changes can be prevented. In addition, when the resin composition contains a fibrous inorganic filler (B) with a round cross section, it is difficult to obtain the effect of improving high and low temperature impact resistance by adding the alkoxysilane compound (C) described below. In fact, adding the alkoxysilane compound (C) may actually reduce high and low temperature impact resistance. However, surprisingly, when the fibrous inorganic filler (b1) is added to the fibrous inorganic filler (B), the synergistic effect with the alkoxysilane compound (C) can improve the high and low temperature impact resistance of the plate-shaped conductive member used in combination with metals, etc. Furthermore, even when the resin composition contains a fibrous inorganic filler with a round cross section, it is possible to obtain a resin composition with excellent high and low temperature impact resistance.

[0023] The "major diameter of the cross section perpendicular to the longitudinal direction" is the longest linear distance in the cross section perpendicular to the longitudinal direction of the fiber, and the "minor diameter of the cross section perpendicular to the longitudinal direction" is the longest linear distance perpendicular to the major diameter in that cross section. The diameter ratio refers to the diameter ratio of the initial shape (the shape before melt-kneading). The diameter ratio can be calculated using a scanning electron microscope and image processing software, and is the arithmetic average value measured for 10 (B) fibrous inorganic fillers. The diameter ratio can also be the manufacturer's value (a value published by the manufacturer in a catalog, etc.).

[0024] The diameter ratio of the fibrous inorganic filler (b1) is 3.0 or more, preferably 3.5 or more, and more preferably 3.8 or more. The upper limit of the diameter ratio is 10.0 or less, preferably 8.0 or less, and more preferably 6.0 or less. In one embodiment, the diameter ratio of the fibrous inorganic filler (B) may be 3.0 to 10.0, 3.5 to 8.0, or 3.8 to 6.0. In one embodiment, the diameter ratio of the fibrous inorganic filler (B) may be 4.0, or may be the upper or lower limit of the above-mentioned numerical range.

[0025] Examples of the fibrous inorganic filler (b1) include fibrous inorganic fillers whose cross-sectional shape perpendicular to the longitudinal direction of the fiber is oval, semicircular, cocoon-shaped (an oval shape with a portion of the longitudinal direction recessed inward), rectangular, or similar shapes.

[0026] The major axis of the cross section of the fibrous inorganic filler (b1) perpendicular to the longitudinal direction is preferably 10 to 40 μm, more preferably 20 to 30 μm. The minor axis of the cross section perpendicular to the longitudinal direction of the fibrous inorganic filler (b1) is preferably 1 to 20 μm, more preferably 3 to 10 μm. The major and minor axes of the cross section perpendicular to the longitudinal direction can be calculated using a scanning electron microscope and image processing software, and are the arithmetic mean values ​​measured for 10 pieces of (B) fibrous inorganic filler. Furthermore, the major and minor axes of the cross section perpendicular to the longitudinal direction can also be the manufacturer's values ​​(values ​​published by the manufacturer in their catalogs, etc.).

[0027] From the viewpoint of further increasing the bending strength and impact strength of the molded article, the average fiber length (cut length) of the fibrous inorganic filler (b1) before melt-kneading into the resin composition is preferably 0.01 to 3.5 mm, more preferably 0.05 to 3.5 mm, even more preferably 0.1 to 3.5 mm, and particularly preferably 0.5 to 3 mm. The average fiber length can be calculated using a scanning electron microscope and image processing software, and is the arithmetic mean value measured for 1,000 pieces of fibrous inorganic filler (B). The average fiber length can also be determined by the manufacturer (a value published by the manufacturer in a catalog, etc.).

[0028] The average fiber length of the fibrous inorganic filler (b1) in the molded article is preferably 50 to 1000 μm, more preferably 100 to 900 μm, from the viewpoint of easily improving the high and low temperature impact resistance of the molded article. The average fiber length of the fibrous inorganic filler (b1) in the molded article can be calculated by heating the molded article at 600°C for 3 to 5 hours, incinerating the residue (3 mg), dispersing it in a 5% polyethylene glycol aqueous solution, stirring thoroughly, and then transferring 10 mL to a Petri dish using an image measuring device, and the arithmetic mean value measured for 1000 pieces of fibrous inorganic filler (b1) is used.

[0029] The cross-sectional area of ​​the fibrous inorganic filler (b1) is set to 1×10 -5 ~1×10 -3 mm 2 Preferably, it is 1×10 -4 ~5×10 -4 mm 2It is more preferable that the "cross-sectional area" is the value obtained by multiplying the value obtained by dividing the longest linear distance of the cross section of the fibrous inorganic filler (b1) measured using a scanning electron microscope and image processing software, where the longest linear distance is the major axis and the shortest linear distance is the minor axis, by the value obtained by dividing the major axis by 2 and the value obtained by dividing the minor axis by 2, and then multiplying the result by pi. The cross-sectional area is the arithmetic average value measured for 10 pieces of fibrous inorganic filler (b1).

[0030] Examples of materials for the fibrous inorganic filler (b1) include mineral fibers such as glass fiber, carbon fiber, zinc oxide fiber, titanium oxide fiber, wollastonite, silica fiber, silica-alumina fiber, zirconia fiber, boron nitride fiber, silicon nitride fiber, boron fiber, and potassium titanate fiber, as well as metal fibrous materials such as stainless steel fiber, aluminum fiber, titanium fiber, copper fiber, and brass fiber. It is preferable to use one or more materials selected from these. Among these, glass fiber is more preferable. Hollow fibers can also be used as the fibrous inorganic filler (b1) for the purpose of reducing the specific gravity of the resin composition.

[0031] The fibrous inorganic filler (b1) may be surface-treated with various commonly known surface treatment agents such as epoxy compounds, isocyanate compounds, titanate compounds, and fatty acids. The surface treatment can improve adhesion to the polyarylene sulfide resin (A). The surface treatment agent may be applied to the fibrous inorganic filler (B) in advance of the material preparation to perform a surface treatment or a sizing treatment, or may be added simultaneously during the material preparation.

[0032] The content of the fibrous inorganic filler (b1) in the total amount of the fibrous inorganic filler (B) is 50 to 100 mass% based on the total amount (100 mass%) of the fibrous inorganic filler (B) from the viewpoint of obtaining excellent high and low temperature impact resistance by a synergistic effect with the silane compound (C). In one embodiment, the content of the fibrous inorganic filler (b1) in the total amount of the fibrous inorganic filler (B) may be 80 to 100 mass%, 90 to 100 mass%, 95 to 100 mass%, 98 to 100 mass%, or 99 to 100 mass%. In one embodiment, when the (B) fibrous inorganic filler contains a fibrous inorganic filler (b2) having a diameter ratio, which is the ratio of the major axis to the minor axis of a cross section perpendicular to the longitudinal direction described below, of less than 3.0, the content of the fibrous inorganic filler (b1) in the total amount of the (B) fibrous inorganic filler may be 50 to 80 mass%, 50 to 78 mass%, or 50 to 75 mass%.

[0033] In one embodiment, when the (B) fibrous inorganic filler contains a fibrous inorganic filler (b2) having a diameter ratio, which is the ratio of the major axis to the minor axis of a cross section perpendicular to the longitudinal direction described below, of less than 3.0, the content ratio (b1 / b2) of the fibrous inorganic filler (b1) to the fibrous inorganic filler (b2) may be 1.0 to 4.0, or may be 1.0 to 3.0.

[0034] The content of the fibrous inorganic filler (b1) in the resin composition is preferably 15 to 70 mass %, more preferably 18 to 65 mass %, and even more preferably 20 to 60 mass %, based on the total amount (100 mass %) of the resin composition.

[0035] From the viewpoint of easily obtaining a synergistic effect in combination with the (C) alkoxysilane compound described below, the content of the fibrous inorganic filler (b1) is preferably 25 to 180 parts by mass, more preferably 30 to 170 parts by mass, more preferably 30 to 160 parts by mass, and even more preferably 33 to 155 parts by mass relative to 100 parts by mass of the (A) polyarylene sulfide resin. In one embodiment, when the (B) fibrous inorganic filler contains a fibrous inorganic filler (b2) having a difference diameter ratio, which is the ratio of the major axis to the minor axis of a cross section perpendicular to the longitudinal direction, of less than 3.0, the content of the fibrous inorganic filler (b1) is preferably 20 to 60 parts by mass, more preferably 25 to 55 parts by mass, more preferably 28 to 53 parts by mass, and even more preferably 33 to 51 parts by mass relative to 100 parts by mass of the (A) polyarylene sulfide resin. In one embodiment, the content of the fibrous inorganic filler (b1) may be 33 parts by mass, 34 parts by mass, 51 parts by mass, 67 parts by mass, 101 parts by mass, or 152 parts by mass relative to 100 parts by mass of the polyarylene sulfide resin (A), or may be within a range with these as upper or lower limits.

[0036] (fibrous inorganic filler (b2)) From the viewpoint of reducing costs and easily increasing mechanical strength, (B) fibrous inorganic filler may further contain a fibrous inorganic filler (b2) (hereinafter simply referred to as "fibrous inorganic filler (b2)") having a diameter ratio, which is the ratio of the major axis to the minor axis of a cross section perpendicular to the longitudinal direction, of less than 3.0. The diameter ratio of the fibrous inorganic filler (b2) may be less than 2.0, 1.5 or less, or even 1.0. The diameter ratio is as described above. Examples of the fibrous inorganic filler (b2) include fibrous inorganic fillers whose cross section perpendicular to the longitudinal direction of the fiber has a round or square shape.

[0037] As described above, when the (B) fibrous inorganic filler contains a fibrous inorganic filler having a round cross section, conductive components having edges (corners) are prone to cracking at the edges due to sudden temperature changes, and the incorporation of the (C) alkoxysilane compound may result in a decrease in high- and low-temperature impact resistance. However, in this embodiment, since the (B) fibrous inorganic filler contains the fibrous inorganic filler (b1), a resin composition having excellent high- and low-temperature impact resistance can be obtained even when the (B) fibrous inorganic filler contains a fibrous inorganic filler having a round cross section. That is, by containing the (B) fibrous inorganic filler (b1) and the fibrous inorganic filler (b2), it is possible to reduce costs while increasing mechanical strength, and even when used in combination with a plate-shaped conductive substrate having edges (corners), it is possible to increase high- and low-temperature impact resistance.

[0038] The material of the fibrous inorganic filler (b2) can be exemplified by the same compounds as those of the fibrous inorganic filler (b1). The materials of the fibrous inorganic filler (b1) and the fibrous inorganic filler (b2) may be the same or different. The average fiber length and average fiber diameter of the fibrous inorganic filler (b2) are not limited. Like the fibrous inorganic filler (b1), the fibrous inorganic filler (b2) may be surface-treated with various surface treatment agents.

[0039] The content of the fibrous inorganic filler (b2) in the (B) fibrous inorganic filler is 50% by mass or less, preferably 0 to 50% by mass or less, and more preferably 0 to 35% by mass or less, based on the total amount (100% by mass) of the (B) fibrous inorganic filler, from the viewpoint of easily obtaining high and low temperature impact resistance due to the synergistic effect of the fibrous inorganic filler (b1) and the (C) alkoxysilane compound. In one embodiment, the content of the fibrous inorganic filler (b2) in the (B) fibrous inorganic filler may be 5 to 50% by mass or may be 10 to 30% by mass, based on the total amount (100% by mass) of the (B) fibrous inorganic filler.

[0040] The content of the fibrous inorganic filler (b2) in the resin composition is preferably 0 to 35 mass %, more preferably 0 to 30 mass %, based on the total amount (100 mass %) of the resin composition.

[0041] The content of the fibrous inorganic filler (b2) is preferably 0 to 40 parts by mass, more preferably 0 to 35 parts by mass, and may be less than 20 parts by mass, relative to 100 parts by mass of the polyarylene sulfide resin (A).

[0042] In one embodiment, from the viewpoint of easily increasing mechanical strength while suppressing costs, the content of the fibrous inorganic filler (b2) may be 1 part by mass or more, 0.5 parts by mass or more, or 0.1 parts by mass or more relative to 100 parts by mass of the polyarylene sulfide resin (A).

[0043] In another embodiment, from the viewpoint of reducing the content of the fibrous inorganic filler (b2) and more easily achieving the effect of improving high and low temperature impact resistance by blending the (C) alkoxysilane compound, the content of the fibrous inorganic filler (b2) may be less than 1 part by mass, less than 0.5 parts by mass, or less than 0.1 parts by mass per 100 parts by mass of the (A) polyarylene sulfide resin.

[0044] In one embodiment, the (B) fibrous inorganic filler may be composed of the fibrous inorganic filler (b1). In another embodiment, the (B) fibrous inorganic filler may be composed of the fibrous inorganic filler (b1) and the fibrous inorganic filler (b2).

[0045] (Other inorganic fillers) The (B) fibrous inorganic filler may contain other inorganic fillers in addition to the fibrous inorganic filler (b1) and the fibrous inorganic filler (b2), as needed. Examples of other inorganic fillers include a non-fibrous inorganic filler (b3). The inclusion of the non-fibrous inorganic filler (b3) can further improve mechanical strength and flatness.

[0046] Examples of the non-fibrous inorganic filler (b3) include powdery and granular inorganic fillers, plate-like inorganic fillers, and the like. Examples of particulate inorganic fillers include carbon black, silica, quartz powder, glass beads, glass powder, talc (granular), silicates such as calcium silicate, aluminum silicate, and diatomaceous earth, metal oxides such as iron oxide, titanium oxide, zinc oxide, and alumina, metal carbonates such as calcium carbonate and magnesium carbonate, metal sulfates such as calcium sulfate and barium sulfate, silicon carbide, silicon nitride, boron nitride, and various metal powders, and may contain one or more selected from these. Examples of plate-like inorganic fillers include glass flakes, talc (platy), mica, kaolin, clay, alumina, and various metal foils, and may contain one or more selected from these. The average particle size (D50) of the non-fibrous inorganic filler is not limited and can be, for example, 0.1 to 100 μm.

[0047] The content of the non-fibrous inorganic filler (b3) is not limited, and is, for example, 50 mass% or less, preferably 0 to 50 mass% or less, and more preferably 0 to 40 mass% or less, based on the total amount (100 mass%) of the fibrous inorganic filler (B). The content of the non-fibrous inorganic filler (b3) in the resin composition is preferably 0 to 35 mass %, more preferably 0 to 30 mass %, based on the total amount (100 mass %) of the resin composition. The content of the non-fibrous inorganic filler (b3) can be set to 0 to 40 parts by mass, or can also be set to 0 to 35 parts by mass, relative to 100 parts by mass of the polyarylene sulfide resin (A).

[0048] ((B) Content of fibrous inorganic filler) The content of the (B) fibrous inorganic filler is 55 to 250 parts by mass relative to 100 parts by mass of the (A) polyarylene sulfide resin, and from the viewpoint of more easily obtaining a synergistic effect by using the fibrous inorganic filler (b1) in combination with the (C) alkoxysilane compound, the content is preferably 58 to 230 parts by mass, more preferably 60 to 220 parts by mass, even more preferably 65 to 200 parts by mass, and particularly preferably 67 to 152 parts by mass.

[0049] The content of the (B) fibrous inorganic filler in the resin composition is preferably 15 to 70 mass %, more preferably 18 to 65 mass %, and even more preferably 20 to 60 mass %, based on the total amount (100 mass %) of the resin composition.

[0050] <(C) Alkoxysilane Compound> The resin composition contains an alkoxysilane compound (C). By containing the alkoxysilane compound (C), the high- and low-temperature impact resistance of the plate-shaped conductive member used in combination with a metal or the like can be improved due to a synergistic effect with the fibrous inorganic filler (b1).

[0051] The (C) alkoxysilane compound preferably contains one or more alkoxysilane compounds having one or more groups selected from an epoxy group, an amino group, a vinyl group, a (meth)acrylic group, an isocyanate group, and a mercapto group.

[0052] In one embodiment, the alkoxysilane compound (C) is preferably represented by the following formula (II): R 1 n Si(OR 2 ) 4-n (II) In formula (II), R 1 is an alkyl group having 1 to 18 (preferably 1 to 10) carbon atoms and having an epoxy group, an amino group, a vinyl group, a (meth)acrylic group, an isocyanate group, or a mercapto group, and R 2 is an alkyl group having 1 to 4 carbon atoms, and n is an integer of 1 to 3.

[0053] Examples of the (C) alkoxysilane compound include alkoxysilanes such as epoxyalkoxysilanes, aminoalkoxysilanes, vinylalkoxysilanes, (meth)acrylicalkoxysilanes, isocyanatealkoxysilanes, and mercaptoalkoxysilanes, and it is preferable to contain one or more of these. The number of carbon atoms in the alkoxy group is preferably 1 to 10, and particularly preferably 1 to 4. The (C) alkoxysilane compound can contain one or more of these.

[0054] Examples of epoxyalkoxysilanes include γ-glycidoxypropyltrimethoxysilane, β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, and γ-glycidoxypropyltriethoxysilane.

[0055] Examples of aminoalkoxysilanes include γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-aminopropylmethyldimethoxysilane, γ-aminopropylmethyldiethoxysilane, N-(β-aminoethyl)-γ-aminopropyltrimethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane, γ-diallylaminopropyltrimethoxysilane, and γ-diallylaminopropyltriethoxysilane.

[0056] Examples of vinylalkoxysilanes include vinyltrimethoxysilane, vinyltriethoxysilane, and vinyltris(β-methoxyethoxy)silane.

[0057] Examples of (meth)acrylalkoxysilanes include γ-acryloxypropyltriethoxysilane, γ-acryloxypropyltrimethoxysilane, γ-methacryloxypropyltriethoxysilane, γ-methacryloxypropyltrimethoxysilane, γ-methacryloxypropylmethyldimethoxysilane, and γ-methacryloxypropylmethyldiethoxysilane.

[0058] Examples of the isocyanate alkoxysilane include γ-isocyanate propyl triethoxysilane and γ-isocyanate propyl trimethoxysilane.

[0059] Examples of mercaptoalkoxysilanes include γ-mercaptopropyltrimethoxysilane and γ-mercaptopropyltriethoxysilane.

[0060] Among these, it is more preferable to include one or more selected from epoxyalkoxysilanes and aminoalkoxysilanes, and it is particularly preferable to include γ-aminopropyltriethoxysilane.

[0061] The content of the (C) alkoxysilane compound is 0.3 to 10 parts by mass, preferably 0.3 to 8 parts by mass, more preferably 0.4 to 4.5 parts by mass, even more preferably 0.4 to 1.4 parts by mass, and particularly preferably 0.5 to 1.3 parts by mass, relative to 100 parts by mass of the (A) polyarylene sulfide resin. By setting the content of the (C) alkoxysilane compound to 0.3 to 10 parts by mass relative to 100 parts by mass of the (A) polyarylene sulfide resin, a synergistic effect with the fibrous inorganic filler (b1) can be fully exerted, and excellent high and low temperature impact resistance can be achieved when combined with metals, etc. In one embodiment, the content of the (C) alkoxysilane compound may be 0.3 parts by mass, 0.7 parts by mass, 0.8 parts by mass, 1.0 parts by mass, 1.2 parts by mass, or 1.5 parts by mass relative to 100 parts by mass of the (A) polyarylene sulfide resin, or may be within a range with these as upper or lower limits.

[0062] In one embodiment, the (B) fibrous inorganic filler may be surface-treated with a silane compound or the like, but the content of the (C) alkoxysilane compound does not include the content of the alkoxysilane compound derived from the surface treatment agent.

[0063] (Other additives, etc.) The resin composition may contain known additives commonly added to thermoplastic resins and thermosetting resins to impart desired properties to the intended purpose, as long as the effects of the present invention are not impaired. Examples of additives include burr inhibitors, release agents, lubricants, plasticizers, flame retardants, colorants such as dyes and pigments, crystallization accelerators, crystal nucleating agents, various antioxidants, heat stabilizers, weathering stabilizers, and corrosion inhibitors. Examples of release agents include polyethylene wax, fatty acid esters, and fatty acid amides. Examples of crystal nucleating agents include boron nitride, talc, kaolin, carbon black, and carbon nanotubes. Examples of corrosion inhibitors include zinc oxide and zinc carbonate. The content of the above additives may be 5% by mass or less of the total resin composition.

[0064] In addition to the above components, the resin composition may also contain a small amount of other auxiliary thermoplastic resin components depending on the purpose. The other thermoplastic resin used here may be any resin stable at high temperatures. Examples include aromatic polyesters such as polyethylene terephthalate and polybutylene terephthalate, which are composed of aromatic dicarboxylic acids and diols or oxycarboxylic acids, polyamides, polycarbonates, ABS, polyphenylene oxide, polyalkyl acrylates, polysulfones, polyethersulfones, polyetherimides, polyether ketones, fluororesins, liquid crystal polymers, and cyclic olefin copolymers. Two or more of these thermoplastic resins may also be used in combination. The content of the other thermoplastic resin components in the resin components may be 20% by mass or less.

[0065] (Method for producing polyarylene sulfide resin composition) The method for producing the resin composition is not particularly limited, and the resin composition can be produced by melt-kneading the above-mentioned components by a known method. For example, any of the following methods can be used: a method in which the components are mixed and then kneaded and extruded in an extruder to prepare pellets; a method in which pellets with different compositions are first prepared, and then a predetermined amount of the pellets is mixed and molded to obtain a molded product of the desired composition; and a method in which one or more of the components are directly charged into a molding machine.

[0066] (High and low temperature impact resistance) As an indicator of high and low temperature impact resistance, the resin composition is insert injection molded into an 8 mm x 23 mm x 40 mm insert metal so that the resin portion has a thickness of 1 mm. The number of cycles until cracks appear when the test piece is cooled at -40°C for 0.5 hours and then heated at 140°C for 0.5 hours is preferably 100 or more, more preferably 120 or more, even more preferably 130 or more, even more preferably 140 or more, and particularly preferably 200 or more.

[0067] The resin composition was heated at 310°C and a shear rate of 1000 sec -1 The melt viscosity at 200°C is preferably 600 Pa·s or less, more preferably 50 to 500 Pa·s, and even more preferably 100 to 400 Pa·s.

[0068] (Application) The resin composition according to this embodiment can provide molded articles with excellent high and low temperature impact resistance when used in combination with metals, and can therefore be preferably used as a resin composition for producing plate-shaped conductive members such as bus bars (preferably for forming an insulating layer of a plate-shaped conductive member). In one embodiment, the present disclosure provides use of the polyarylene sulfide resin composition as an insulating layer of a plate-shaped conductive member.

[0069] [Conductive material] The conductive member according to the present disclosure includes at least a plate-shaped conductive substrate and an insulating layer covering at least a portion of the plate-shaped conductive substrate. This conductive member may be a plate-shaped conductive member that is at least partially or entirely plate-shaped. The term "plate-shaped conductive member" is as defined above.

[0070] <Plate-shaped conductive substrate> The term "plate-shaped conductive substrate" refers to a conductive substrate that is at least partially or entirely plate-shaped, and the specific shape is selected depending on the application. The shape of the main surface of the plate-shaped conductive substrate is not particularly limited, and examples thereof include polygonal (e.g., rectangular), circular, and elliptical shapes. The cross-sectional shape of the plate-shaped conductive substrate (the shape of the surface perpendicular to the main surface) is also not particularly limited, and examples thereof include polygonal (e.g., rectangular), circular, and elliptical shapes. When the thickness of the plate-shaped conductive substrate is large (for example, when the thickness is equal to or greater than half the width in a plan view), the shape of the plate-shaped conductive substrate can also be called columnar. When the columnar shape has a small thickness (thin) and a long length, the shape of the plate-shaped conductive substrate can also be called rod-shaped. In other words, the term "plate-shaped conductive substrate" also includes shapes such as "columnar" and "rod-shaped." The plate-shaped conductive substrate may have a shape that combines multiple shapes described above.

[0071] In one embodiment, the thickness of the plate-shaped conductive substrate is preferably 0.1 to 50 mm, more preferably 30 mm or less, and even more preferably 1 to 25 mm. The thickness of the plate-shaped conductive substrate is an arithmetic mean value measured with a vernier caliper.

[0072] Examples of materials for the plate-shaped conductive substrate include metals and alloys, and for example, copper or copper alloys, aluminum or aluminum alloys, etc. are generally used.

[0073] <Insulating layer> The insulating layer is formed so as to cover at least a portion of the plate-shaped conductive substrate, and may be formed on the entire conductive substrate except for the contact portion, or may be formed only on the portion other than the contact portion.

[0074] The insulating layer contains the polyarylene sulfide resin composition described above. The polyarylene sulfide resin composition is as described above. Since the insulating layer contains the polyarylene sulfide resin composition described above, cracks and breakages are unlikely to occur even when there are large temperature changes in the environment in which the insulating layer is used, and a conductive member having excellent high- and low-temperature impact resistance can be obtained.

[0075] The thickness of the insulating layer is preferably 5 mm or less, more preferably 3 mm or less The thickness of the insulating layer is the arithmetic mean value measured with a vernier caliper.

[0076] The insulating layer can be formed by a known method. For example, the polyarylene sulfide resin composition described below can be integrally molded onto the conductive substrate by injection molding, melt extrusion molding, compression molding, transfer molding, or the like.

[0077] In one embodiment, the dimensions of the plate-shaped conductive member are not particularly limited and are appropriately selected depending on the application, location of use, and the like.

[0078] In one embodiment, the plate-shaped conductive member may have one or more bent portions, or may have two or more bent portions. The bent portions may be bent along the same plane, or may be bent so as to rise from one plane at a predetermined angle. In one embodiment, the plate-shaped conductive member has one or more contact portions for electrical connection with other conductive members. The thickness of the contact portion is preferably 3 mm or less, and more preferably 2 mm or less.

[0079] The conductive member according to the present disclosure has excellent high and low temperature impact resistance, and can therefore be preferably used in environments with large temperature changes, for example, as a conductive member for automobile parts (e.g., a bus bar for automobile parts).

[0080] [Method of manufacturing conductive members] The method for producing a conductive member according to the present disclosure includes forming an insulating layer containing a polyarylene sulfide resin composition on at least a part of the surface of a plate-shaped conductive substrate. The plate-shaped conductive substrate, the polyarylene sulfide resin composition, the insulating layer, and the method for forming the insulating layer are as described above.

[0081] A non-limiting list of exemplary embodiments and combinations of exemplary embodiments of the present disclosure are disclosed below. [1] A polyarylene sulfide resin composition for a plate-shaped conductive member, (A) a polyarylene sulfide resin; (B) a fibrous inorganic filler; (C) an alkoxysilane compound, the (A) polyarylene sulfide resin has a temperature-decreasing crystallization temperature (Tc) of 215°C or higher, wherein the temperature-decreasing crystallization temperature (Tc) is an exothermic peak temperature associated with crystallization observed when the (A) polyarylene sulfide resin is heated to 340°C by a differential scanning calorimeter, melted, and then cooled at a rate of 10°C / min; The (B) fibrous inorganic filler contains a fibrous inorganic filler (b1) having a diameter ratio, which is the ratio of the major axis to the minor axis of a cross section perpendicular to the longitudinal direction, of 3.0 or more, the content of the fibrous inorganic filler (b1) is 50 to 100 mass% of the total amount of the fibrous inorganic filler (B), the content of the (B) fibrous inorganic filler is 55 to 250 parts by mass relative to 100 parts by mass of the (A) polyarylene sulfide resin, A polyarylene sulfide resin composition, wherein the content of the (C) alkoxysilane compound is 0.3 to 10 parts by mass per 100 parts by mass of the (A) polyarylene sulfide resin. [2] The (B) fibrous inorganic filler further contains a fibrous inorganic filler (b2) having a diameter ratio, which is the ratio of the major axis to the minor axis of a cross section perpendicular to the longitudinal direction, of less than 3.0; The polyarylene sulfide resin composition according to [1], wherein the content of the fibrous inorganic filler (b2) is 50 mass % or less based on the total amount of the fibrous inorganic filler (B). [3] The polyarylene sulfide resin composition according to [1] or [2], wherein the alkoxysilane compound (C) contains one or more alkoxysilane compounds having one or more groups selected from an epoxy group, an amino group, a vinyl group, a (meth)acrylic group, an isocyanate group, and a mercapto group. [4] The polyarylene sulfide resin composition according to any one of [1] to [3], wherein the fibrous inorganic filler (b1) contains glass fibers. [5] The polyarylene sulfide resin composition according to any one of [1] to [4], for forming an insulating layer of the plate-shaped conductive member. [6] The polyarylene sulfide resin composition according to any one of [1] to [5], which is for use in a bus bar. [7] A conductive member comprising at least a plate-shaped conductive substrate and an insulating layer covering at least a part of the plate-shaped conductive substrate, the insulating layer contains a polyarylene sulfide resin composition, The polyarylene sulfide resin composition is (A) a polyarylene sulfide resin; (B) a fibrous inorganic filler; (C) an alkoxysilane compound, the (A) polyarylene sulfide resin has a temperature-decreasing crystallization temperature (Tc) of 215°C or higher, wherein the temperature-decreasing crystallization temperature (Tc) is an exothermic peak temperature associated with crystallization observed when the (A) polyarylene sulfide resin is heated to 340°C by a differential scanning calorimeter, melted, and then cooled at a rate of 10°C / min; The (B) fibrous inorganic filler contains a fibrous inorganic filler (b1) having a diameter ratio, which is the ratio of the major axis to the minor axis of a cross section perpendicular to the longitudinal direction, of 3.0 or more, the content of the fibrous inorganic filler (b1) is 50 to 100 mass% of the total amount of the fibrous inorganic filler (B), the content of the (B) fibrous inorganic filler is 55 to 250 parts by mass relative to 100 parts by mass of the (A) polyarylene sulfide resin, The conductive member has a content of the (C) alkoxysilane compound of 0.3 to 10 parts by mass relative to 100 parts by mass of the (A) polyarylene sulfide resin. [8] The conductive member according to [7], wherein the thickness of the plate-shaped conductive substrate is 3 mm or less. [9] The conductive member according to [7] or [8], which is a bus bar for an automobile part.

[10] A method for producing a plate-shaped conductive member, comprising forming an insulating layer containing a polyarylene sulfide resin composition on at least a part of the surface of a plate-shaped conductive substrate, The polyarylene sulfide resin composition is (A) a polyarylene sulfide resin; (B) a fibrous inorganic filler; (C) an alkoxysilane compound, the (A) polyarylene sulfide resin has a temperature-decreasing crystallization temperature (Tc) of 215°C or higher, wherein the temperature-decreasing crystallization temperature (Tc) is an exothermic peak temperature associated with crystallization observed when the (A) polyarylene sulfide resin is heated to 340°C by a differential scanning calorimeter, melted, and then cooled at a rate of 10°C / min; The (B) fibrous inorganic filler contains a fibrous inorganic filler (b1) having a diameter ratio, which is the ratio of the major axis to the minor axis of a cross section perpendicular to the longitudinal direction, of 3.0 or more, the content of the fibrous inorganic filler (b1) is 50 to 100 mass% of the total amount of the fibrous inorganic filler (B), the content of the (B) fibrous inorganic filler is 55 to 250 parts by mass relative to 100 parts by mass of the (A) polyarylene sulfide resin, The production method, wherein the content of the (C) alkoxysilane compound is 0.3 to 10 parts by mass relative to 100 parts by mass of the (A) polyarylene sulfide resin.

[11] Use of a polyarylene sulfide resin composition as an insulating layer of a plate-shaped conductive member, The polyarylene sulfide resin composition is (A) a polyarylene sulfide resin; (B) a fibrous inorganic filler; (C) an alkoxysilane compound, the (A) polyarylene sulfide resin has a temperature-decreasing crystallization temperature (Tc) of 215°C or higher, wherein the temperature-decreasing crystallization temperature (Tc) is an exothermic peak temperature associated with crystallization observed when the (A) polyarylene sulfide resin is heated to 340°C by a differential scanning calorimeter, melted, and then cooled at a rate of 10°C / min; The (B) fibrous inorganic filler contains a fibrous inorganic filler (b1) having a diameter ratio, which is the ratio of the major axis to the minor axis of a cross section perpendicular to the longitudinal direction, of 3.0 or more, the content of the fibrous inorganic filler (b1) is 50 to 100 mass% of the total amount of the fibrous inorganic filler (B), the content of the (B) fibrous inorganic filler is 55 to 250 parts by mass relative to 100 parts by mass of the (A) polyarylene sulfide resin, The content of the (C) alkoxysilane compound is 0.3 to 10 parts by mass relative to 100 parts by mass of the (A) polyarylene sulfide resin.

[0082] The configurations and combinations thereof in each embodiment are merely examples, and additions, omissions, substitutions, and other modifications of the configurations are possible as appropriate within the scope that does not deviate from the gist of this disclosure. [Example]

[0083] The present disclosure will be explained in more detail below by showing examples, but interpretation of the present disclosure is not limited to these examples. [Examples 1 to 10, Comparative Examples 1 to 10] Using the materials shown below, polyarylene sulfide resin, inorganic filler, and alkoxysilane compound were dry-blended in the compositions and content ratios shown in Tables 1 and 2. This was charged into a twin-screw extruder with a cylinder temperature of 320°C and melt-kneaded to obtain resin composition pellets of the examples and comparative examples.

[0084] (Polyarylene sulfide resin) PPS: Polyphenylene sulfide resin, manufactured by Kureha Corporation, Fortron (registered trademark) KPS, melt viscosity 30 Pa·s (shear rate 1200 sec -1 , 310℃), Tc: 219℃

[0085] The Tc of the PPS resin was measured as follows: Approximately 5 mg of the PPS resin was weighed out, and using a PerkinElmer DSC-8500 differential scanning calorimeter, the temperature was increased at a rate of 10°C / min, held at 340°C for 5 minutes, and then decreased at a rate of 10°C / min. The crystallization peak (exothermic peak) temperature was read from the resulting DSC chart to determine Tc.

[0086] The melt viscosity of the PPS resin was measured as follows: using a Capillograph manufactured by Toyo Seiki Seisakusho Co., Ltd., a flat die of 1 mm diameter x 20 mm length was used as a capillary, the barrel temperature was 310°C, and the shear rate was 1200 sec -1 The melt viscosity was measured at 100°C.

[0087] (inorganic filler) GF1: Nippon Electric Glass Co., Ltd., flat glass fiber ESC03T-760-FGF, oval cross section, long diameter 28 μm, short diameter 7 μm, long diameter / short diameter ratio 4.0, average fiber length 3 mm GF2: Chopped strand ECS 03 T-747H manufactured by Nippon Electric Glass Co., Ltd., approximately circular cross section, major axis / minor axis ratio 1.0, average fiber diameter 10 μm, average fiber length 3 mm, GF3: Nippon Electric Glass Co., Ltd., chopped strand ECS 03T-747, approximately circular cross section, major axis / minor axis ratio 1.0, average fiber diameter 13 μm, average fiber length 3 mm GF4: Chopped strand ECS 03T-747N manufactured by Nippon Electric Glass Co., Ltd., approximately circular cross section, major axis / minor axis ratio 1.0, average fiber diameter 17 μm, average fiber length 3 mm

[0088] (alkoxysilane compounds) γ-Aminopropyltriethoxysilane, Shin-Etsu Chemical Co., Ltd., KBE-903P

[0089] [evaluation] (High and low temperature impact resistance: HS test) The resin compositions obtained in the examples and comparative examples were used with a plate-shaped insert metal (8 mm x 23 mm x 40 mm) made of S35C as specified in JIS G4051:2005, a carbon steel for machine structures. Insert injection molding was performed under the conditions of a cylinder temperature of 320°C, a mold temperature of 150°C, an injection time of 40 seconds, and a cooling time of 60 seconds to produce an insert-molded product with a resin thickness of 1 mm. This test piece was a matchbox-shaped plate-shaped test piece with corners. This test piece was subjected to a thermal shock test using a thermal shock tester (manufactured by Espec Corporation), which consisted of cooling at -40°C for 0.5 hours and then heating at 140°C for 0.5 hours, with the molded product being observed every 20 cycles. The number of cycles at which cracks appeared in the molded product was evaluated as an index of high- and low-temperature impact resistance. The results are shown in Tables 1 and 2. A cycle count of 100 or more indicated excellent high- and low-temperature impact resistance; 120 or more indicated even better high- and low-temperature impact resistance; 130 or more indicated even better high- and low-temperature impact resistance; 140 or more indicated even better high- and low-temperature impact resistance; and 200 or more indicated particularly excellent high- and low-temperature impact resistance.

[0090] [Table 1] [Table 2]

[0091] As shown in Table 1, the resin compositions of Examples 1 to 10 all had 100 or more cycles in the HS resistance test, even when test pieces with corners that are prone to cracking due to temperature changes were used, demonstrating excellent high and low temperature impact resistance. [Industrial Applicability]

[0092] The conductive member of this embodiment has excellent high and low temperature impact resistance when combined with a conductive member such as a metal, and therefore has industrial applicability as a conductive member in various fields, for example.

Claims

1. A polyarylene sulfide resin composition for a plate-shaped conductive member, (A) a polyarylene sulfide resin; (B) a fibrous inorganic filler; (C) an alkoxysilane compound, the (A) polyarylene sulfide resin has a temperature-decreasing crystallization temperature (Tc) of 215°C or higher, wherein the temperature-decreasing crystallization temperature (Tc) is an exothermic peak temperature associated with crystallization observed when the (A) polyarylene sulfide resin is heated to 340°C by a differential scanning calorimeter, melted, and then cooled at a rate of 10°C / min; The (B) fibrous inorganic filler contains a fibrous inorganic filler (b1) having a diameter ratio, which is the ratio of the major axis to the minor axis of a cross section perpendicular to the longitudinal direction, of 3.0 or more, the content of the fibrous inorganic filler (b1) is 50 to 100 mass% of the total amount of the fibrous inorganic filler (B), the content of the fibrous inorganic filler (B) is 55 to 250 parts by mass relative to 100 parts by mass of the polyarylene sulfide resin (A), A polyarylene sulfide resin composition, wherein the content of the alkoxysilane compound (C) is 0.3 to 10 parts by mass per 100 parts by mass of the polyarylene sulfide resin (A).

2. The (B) fibrous inorganic filler further contains a fibrous inorganic filler (b2) having a diameter ratio, which is the ratio of the major axis to the minor axis of a cross section perpendicular to the longitudinal direction, of less than 3.0; 2. The polyarylene sulfide resin composition according to claim 1, wherein the content of the fibrous inorganic filler (b2) is 50 mass % or less based on the total amount of the fibrous inorganic filler (B).

3. 3. The polyarylene sulfide resin composition according to claim 1, wherein the alkoxysilane compound (C) comprises one or more alkoxysilane compounds having one or more groups selected from an epoxy group, an amino group, a vinyl group, a (meth)acrylic group, an isocyanate group, and a mercapto group.

4. The polyarylene sulfide resin composition according to claim 1 or 2, wherein the fibrous inorganic filler (b1) contains glass fibers.

5. The polyarylene sulfide resin composition according to claim 1 or 2, for forming an insulating layer of a plate-shaped conductive member.

6. The polyarylene sulfide resin composition according to claim 1 or 2, which is for use in a bus bar.

7. A conductive member comprising at least a plate-shaped conductive substrate and an insulating layer covering at least a portion of the plate-shaped conductive substrate, the insulating layer contains a polyarylene sulfide resin composition, The polyarylene sulfide resin composition is (A) a polyarylene sulfide resin; (B) a fibrous inorganic filler; (C) an alkoxysilane compound, the (A) polyarylene sulfide resin has a temperature-decreasing crystallization temperature (Tc) of 215°C or higher, wherein the temperature-decreasing crystallization temperature (Tc) is an exothermic peak temperature associated with crystallization observed when the (A) polyarylene sulfide resin is heated to 340°C by a differential scanning calorimeter, melted, and then cooled at a rate of 10°C / min; The (B) fibrous inorganic filler contains a fibrous inorganic filler (b1) having a diameter ratio, which is the ratio of the major axis to the minor axis of a cross section perpendicular to the longitudinal direction, of 3.0 or more, the content of the fibrous inorganic filler (b1) is 50 to 100 mass% of the total amount of the fibrous inorganic filler (B), the content of the fibrous inorganic filler (B) is 55 to 250 parts by mass relative to 100 parts by mass of the polyarylene sulfide resin (A), The conductive member has a content of the alkoxysilane compound (C) of 0.3 to 10 parts by mass relative to 100 parts by mass of the polyarylene sulfide resin (A).

8. The conductive member according to claim 7 , wherein the plate-shaped conductive substrate has a thickness of 3 mm or less.

9. The conductive member according to claim 7 or 8, which is a bus bar for an automobile part.

10. A method for producing a conductive member, comprising forming an insulating layer containing a polyarylene sulfide resin composition on at least a part of a surface of a plate-shaped conductive substrate, The polyarylene sulfide resin composition is (A) a polyarylene sulfide resin; (B) a fibrous inorganic filler; (C) an alkoxysilane compound, the (A) polyarylene sulfide resin has a temperature-decreasing crystallization temperature (Tc) of 215°C or higher, wherein the temperature-decreasing crystallization temperature (Tc) is an exothermic peak temperature associated with crystallization observed when the (A) polyarylene sulfide resin is heated to 340°C by a differential scanning calorimeter, melted, and then cooled at a rate of 10°C / min; The (B) fibrous inorganic filler contains a fibrous inorganic filler (b1) having a diameter ratio, which is the ratio of the major axis to the minor axis of a cross section perpendicular to the longitudinal direction, of 3.0 or more, the content of the fibrous inorganic filler (b1) is 50 to 100 mass% of the total amount of the fibrous inorganic filler (B), the content of the fibrous inorganic filler (B) is 55 to 250 parts by mass relative to 100 parts by mass of the polyarylene sulfide resin (A), The production method, wherein the content of the alkoxysilane compound (C) is 0.3 to 10 parts by mass per 100 parts by mass of the polyarylene sulfide resin (A).

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