Substrate processing device and manufacturing method for display device

Abstract

To provide a technique advantageous for accurately adjusting the distance between a processing head for processing a substrate and the substrate.SOLUTION: A substrate processing device for processing a substrate includes a first height sensor, a second height sensor, an assembly including a processing head for processing the substrate, a first structure supporting the first height sensor and the assembly, a second structure supporting the second height sensor and the substrate, and a control unit that causes the first height sensor to measure the height of the substrate and the height of a reference surface, causes the second height sensor to measure the height of a predetermined part of the assembly and the height of the reference surface, and performs control for adjusting the distance between the substrate and the processing head on the basis of the output of the first height sensor and the output of a second height sensor.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a substrate processing apparatus and a method for manufacturing a display device. [Background technology]

[0002] Substrate processing equipment, such as a coating device for manufacturing display devices, is required to accurately place functional ink in target areas on a substrate. The substrate processing equipment may include a stage for holding a substrate and a discharge head for discharging ink onto the substrate. By precisely controlling the driving of the stage holding the substrate and the timing of ink discharge from the discharge head, ink is sequentially deposited onto multiple target areas on the substrate. Each target area is separated from other target areas by a partition wall called a bank. Displacing ink at a position that is misaligned from the target area can degrade display performance. Therefore, the landing position of ink droplets on the substrate must be precisely controlled. Because the accuracy of the landing position of ink droplets on the substrate is affected by the distance between the substrate and the discharge head, it is necessary to accurately measure the distance between the substrate and the discharge head and control the discharge timing from the discharge head based on that distance.

[0003] Patent Document 1 relates to a droplet ejection device that causes droplets ejected from an ejection unit to land on a target object, and describes an inspection unit that inspects fluctuations in the distance between the ejection unit and the target object at multiple points on the target. Patent Document 2 relates to a droplet ejection device that has a function to adjust a work gap, which is the gap between the nozzle surface of a functional droplet ejection head and the top surface of a workpiece, and describes a work gap measurement device that measures the work gap. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 5855407 [Patent Document 2] Patent No. 4691975 Summary of the Invention [Problem to be solved by the invention]

[0005] In a system that uses a single sensor to measure the distance between the substrate and the processing head, it is difficult to accurately cancel measurement errors, which can be caused by factors such as sensor placement errors in the system and fluctuations in the sensor's fixed position over time.

[0006] An object of the present invention is to provide an advantageous technique for accurately adjusting the distance between a processing head that processes a substrate and the substrate. [Means for solving the problem]

[0007] One aspect of the present invention relates to a substrate processing apparatus for processing a substrate, the substrate processing apparatus comprising: an assembly including a first distance sensor, a second distance sensor, and a processing head for processing the substrate; a first structure supporting the first distance sensor and the assembly; a second structure supporting the second distance sensor and the substrate; and a control unit that controls the first distance sensor to measure the height of the substrate and the height of a reference surface, causes the second distance sensor to measure the height of a predetermined portion of the assembly and the height of the reference surface, and performs control to adjust the distance between the substrate and the processing head based on the output of the first distance sensor and the output of the second distance sensor. [Effects of the Invention]

[0008] The present invention provides an advantageous technique for accurately adjusting the distance between a substrate and a processing head that processes the substrate. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a diagram schematically showing the configuration of a substrate processing apparatus according to a first embodiment. [Figure 2] 5A and 5B are diagrams for explaining an operation of measuring the distance between a processing head and a substrate. [Figure 3] 5A and 5B are diagrams for explaining an operation of measuring the distance between a processing head and a substrate. [Figure 4] 5A and 5B are diagrams for explaining an operation of measuring the distance between a processing head and a substrate. [Figure 5] FIG. 10 is a diagram schematically showing the configuration of a substrate processing apparatus according to a second embodiment. [Figure 6] FIG. 10 is a diagram schematically showing the configuration of a substrate processing apparatus according to a third embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the scope of the invention claimed. Although multiple features are described in the embodiments, not all of these multiple features are necessarily essential to the invention, and multiple features may be combined arbitrarily. Furthermore, in the accompanying drawings, the same reference numerals are used to designate the same or similar components, and redundant explanations will be omitted.

[0011] In this specification and the accompanying drawings, directions are indicated using an XYZ coordinate system, with the XY plane being a plane parallel to the surface on which the substrate, the object to be processed, is placed. The XY plane is typically a horizontal plane. The substrate processing apparatus according to this embodiment is configured to process substrates. Substrate processing may include, for example, adding a substance such as a liquid or solid to the substrate, modifying a portion or the entire substrate, or inspecting the substrate. The substrate processing apparatus may be configured as, for example, a liquid application apparatus that applies or deposits a liquid on a substrate, an imprint apparatus that forms a pattern on a substrate, or a planarization apparatus that forms a planarization film on a substrate. Alternatively, the substrate processing apparatus may be configured as a bonding apparatus that bonds a second member to one or more locations on a first member. Below, a substrate processing apparatus configured as a liquid application apparatus that applies or deposits droplets containing an organic material on a substrate is described as an example.

[0012] 1 schematically illustrates the configuration of a substrate processing apparatus 1 according to a first embodiment. The substrate processing apparatus 1 may include a first height sensor (first distance sensor) 6, a second height sensor (second distance sensor) 7, an assembly 14 including a processing head 5 for processing a substrate 2, a first structure 10 supporting the first height sensor 6 and the assembly 14, a second structure 3 supporting the second height sensor 7 and the substrate 2, and a controller 15. The controller 15 may cause the first height sensor 6 to measure the height of the substrate 2 and the height of a reference surface RS, and may cause the second height sensor 7 to measure the height of a predetermined portion of the assembly 14 and the height of the reference surface RS. The controller 15 may also perform control to adjust the distance between the substrate 2 and the processing head 5 (e.g., the lower surface of the processing head 5) based on the output of the first height sensor 6 and the output of the second height sensor 7.

[0013] The assembly 14 may include a carriage 9 that holds the processing head 5 and is movable in the Z direction (normal to the surface of the substrate 2). The carriage 9 may be driven, for example, in the Z direction (and / or the X and Y directions) by a first drive mechanism (not shown). However, the assembly 14 may be fixed relative to the first structure 10. The first structure 10 may be supported, for example, by a vibration isolation mechanism (not shown). The first structure 10 may support the first height sensor 6 and may also support the assembly 14 via a first drive mechanism (not shown). The second structure 3 may be configured, for example, as a stage that is movable parallel to the X and Y plane. The substrate processing apparatus 1 may include a second drive mechanism 13 that drives the second structure 3 in the X and Y directions.

[0014] The substrate 2 is, for example, a base member or support member for manufacturing a display panel. The substrate 2 is, for example, a glass substrate or a plastic substrate. The substrate 2 is typically a plate-shaped member, but may be any member that can function as a base member or support member for manufacturing a display panel, and may be, for example, a deformable film or a circular substrate. The substrate 2 may have a pixel array region 8 including a plurality of target areas to which ink 4 is applied. The ink is a liquid material to be disposed on the substrate 2, and may be, for example, a functional material such as an organic electroluminescent (OLED) material or a quantum dot material when manufacturing an organic light-emitting diode (OLED) display panel.

[0015] The processing head 5 may be configured as an ejection head that ejects droplets of ink 4 toward a target region on the substrate 2. A plurality of ejection ports that eject droplets of ink 4 may be arranged one-dimensionally or two-dimensionally on the bottom surface of the processing head 5. The control unit 15 may be configured to control the ejection of droplets of ink 4 from the plurality of ejection ports of the processing head 5 in synchronization with the driving of the second structure 3 by the second drive mechanism 13. This allows the droplets of ink 4 to be applied or arranged in a plurality of target regions in the pixel array region 8 of the substrate 2.

[0016] The substrate 2 may have thickness variations due to manufacturing variations. From one perspective, thickness variations of the substrate 2 may mean that the upper surface of each substrate 2 has a non-uniform height distribution. Having a non-uniform height distribution of the upper surface of each substrate 2 means that the distance between the processing head 5 and the upper surface of the substrate 2 (hereinafter, the gap) changes due to driving (scanning) of the substrate along the XY plane. Therefore, if the timing of ejection of the ink 4 from the processing head 5 is controlled assuming that the gap is constant, the position of the ink 4 droplets applied to the substrate 2 will deviate from the target position (target area). Therefore, the control unit 15 controls the ejection timing of the ink 4 from each ejection port of the processing head 5 in accordance with the distribution of gaps in the pixel array region 8 (hereinafter, the gap distribution), in other words, the distribution of the Z-direction distances between the processing head 5 and multiple positions in the pixel array region 8 of the substrate 2. If the upper surface of each substrate 2 can be considered to have a constant height, the ejection timing of the ink 4 from each ejection port of the processing head 5 can be controlled according to a representative gap determined for each substrate 2. Furthermore, if the substrates 2 in a lot consisting of multiple substrates 2 can be considered to have the same thickness, the ejection timing of ink 4 from each ejection port of the processing head 5 can be controlled according to a representative gap determined for the lot.

[0017] The gap distribution for each substrate 2 can be obtained based on the results of measuring the height of multiple positions on the upper surface of the substrate 2 using the first height sensor 6 while driving the substrate 2 using the second drive mechanism 13, and the results of measuring a predetermined portion of the assembly 14 using the second height sensor 7. The predetermined portion of the assembly 14 can be, for example, a predetermined location on the underside of the processing head 5, but it can also be another location whose distance from the underside of the processing head 5 is known. Here, the position of the first height sensor 6 supported by the first structure 10 has an error from its designed position and can change over time due to changes with time, thermal deformation, etc. Similarly, the position of the second height sensor 7 supported by the second structure 3 has an error from its designed position and can change over time due to changes with time, thermal deformation, etc. Therefore, the gaps measured using the first height sensor 6 and the second height sensor 7 can have errors.

[0018] In order to reduce the influence of gap measurement errors, the substrate processing apparatus 1 or the control unit 15 measures the height of a common reference plane RS using the first height sensor 6 and the second height sensor 7, and determines a corrected gap using the results obtained thereby. The height measurement by the first height sensor 6 may be a measurement of the distance between a reference held by the first height sensor 6 and a measurement target (e.g., the upper surface of the substrate 2, the reference plane RS), and the first height sensor 6 may be a distance sensor. Similarly, the height measurement by the second height sensor 7 may be a measurement of the distance between a reference held by the second height sensor 7 and a measurement target (e.g., a predetermined portion of the assembly 14, the reference plane RS), and the second height sensor 7 may be a distance sensor.

[0019] The reference surface RS may be a surface of the reference member 11 (e.g., the upper or lower surface of the reference member 11). The reference member 11 may be supported by the second structure 3 as illustrated in FIG. 1 or may be supported by the first structure 10 (not shown). When the reference member 11 is supported by the first structure 10, the first height sensor 6 measures the height of the upper surface of the substrate 2 via the reference surface RS of the reference member 11. The reference surface RS may be a surface (e.g., the upper or lower surface) of the reference member 11 that may be arranged in the optical path of the first height sensor 6 and the optical path of the second height sensor 7 as necessary. The reference surface RS may be arranged parallel to the XY plane. The reference surface RS has a reference point 12, and the substrate processing apparatus 1 may be configured to measure the height of the reference point 12 using each of the first height sensor 6 and the second height sensor 7. This is advantageous for reducing measurement errors of the height of the reference surface RS by the first height sensor 6 and the second height sensor 7, for example, reducing the influence of tilt of the reference surface RS.

[0020] A method for measuring gaps or gap distribution will be described below with reference to FIGS. 2, 3, and 4. Note that FIGS. 2, 3, and 4 are simplified versions of FIG. 1, and do not include the control unit 15 and second drive mechanism 13. First, a method for measuring the heights of multiple measurement target locations on the top surface of the substrate 2 using the first height sensor 6 will be described with reference to FIG. 2. As shown in FIG. 2, the second drive mechanism 13 drives the substrate 2 along the XY plane so that each of the multiple measurement target locations on the top surface of the substrate 2 sequentially coincides with the optical path of the first height sensor 6, and the first height sensor 6 can sequentially measure the height of each of the multiple measurement target locations. The measurement value obtained in this manner is referred to as the first measurement value.

[0021] Next, with reference to FIG. 3 , a method for measuring the height of a predetermined portion of the assembly 14 (e.g., a predetermined location on the underside of the processing head 5) using the second height sensor 7 will be described. As shown in FIG. 3 , the second drive mechanism 13 drives the second structure 3 so that the optical path of the second height sensor 7 coincides with the predetermined portion of the assembly 14 (e.g., a predetermined location on the underside of the processing head 5), and the second height sensor 7 can measure the height of the predetermined portion of the assembly 14. The measurement value obtained in this manner is referred to as the second measurement value. The measurement light emitted from the second height sensor 7 passes through the reference member 11, is reflected by the predetermined portion of the assembly 14, and returns to the second height sensor 7. The second height sensor 7 measures the height of the predetermined portion of the assembly 14 based on the measurement light reflected by the predetermined portion of the assembly 14 and returned. In other words, the second height sensor 7 measures the height of the predetermined portion of the assembly 14 via the reference plane RS.

[0022] Next, a method for calibrating the positional relationship between the first height sensor 6 and the second height sensor 7 will be described with reference to FIG. 4 . As shown in FIG. 4 , the second structure 3 is driven by the second drive mechanism 13 so that the optical path of the second height sensor 7 coincides with the optical path of the first height sensor 6. At this time, a reference point 12 can be positioned in the optical paths of the first height sensor 6 and the second height sensor 7. In this state, the first height sensor 6 measures the height of the reference surface RS (reference point 12), and the second height sensor 7 measures the height of the reference surface RS (reference point 12). The measurement result of the reference surface RS by the first height sensor 6 is referred to as a third measurement value, and the measurement result of the reference surface RS by the second height sensor 7 is referred to as a fourth measurement value. It is preferable that the measurements of the height of the reference surface RS (reference point 12) by the first height sensor 6 and the second height sensor 7 are performed simultaneously, which can reduce the effects of vibrations of the first structure 10, the second structure 3, etc.

[0023] The control unit 15 obtains the gap distribution D(x, y) by calculation according to the following equation (1). The gap distribution D(x, y) is the distribution of the distances (gaps) between the processing head 5 and the substrate 2 at the coordinates (x, y) of multiple measurement target locations on the upper surface of the substrate 2. Here, M1(x, y) is a first measurement value obtained by measuring the height of the upper surface of the substrate 2 using the first height sensor 6 for the coordinates (x, y) of multiple measurement target locations on the upper surface of the substrate 2. M2 is a second measurement value obtained by measuring the height of a predetermined portion of the assembly 14 using the second height sensor 7. M3 is a third measurement value obtained by measuring the height of the reference surface RS using the first height sensor 6. M4 is a fourth measurement value obtained by measuring the height of the reference surface RS using the second height sensor 7.

[0024] D(x, y)=(M1(x, y)-M3)-(M2-M4)...Equation (1) By performing calculations according to equation (1), it is possible to obtain the distance between the processing head 5 and the substrate 2 at the coordinates (x, y) of multiple measurement target locations on the upper surface of the substrate 2 while calibrating the positional relationship between the first height sensor 6 and the second height sensor 7. When measuring the height of a location other than the lower surface of the processing head 5 as the predetermined portion of the assembly 14, the distance (offset value) between the predetermined portion and the lower surface of the processing head 5 can be subtracted from D(x, y).

[0025] As described above, the height of reference surface RS is measured by the first height sensor 6 and the second height sensor 7, and the measurement results can be used to obtain the distribution of distances (gaps) between the processing head 5 and the substrate 2 at the coordinates (x, y) of multiple measurement locations on the top surface of the substrate 2. This makes it possible to reduce or cancel errors contained in the measurement values ​​(first measurement value, second measurement value) of the top surface of the substrate 2 and predetermined parts of the assembly 14 measured by the first height sensor 6 and the second height sensor 7. Furthermore, errors can be further reduced by measuring the height of reference point 12 on reference surface RS by the first height sensor 6 and the second height sensor 7.

[0026] The correction time Δt(x, y) for the ejection timing at the coordinates (x, y) on the top surface of the substrate 2 is given by equation (2). Here, if the speed of the droplets of ink 4 ejected from the ejection ports of the processing head 5 is Vi, the speed of the substrate 2 when the droplets of ink 4 are applied to the substrate 2 is Vs, and the designed distance between the bottom surface of the processing head 5 and the substrate 2 is Dd, then Δt(x, y)=(Dd-D(x, y)) / Vi...Equation (2) The control unit 15 can correct the ejection timing td(x, y) of ink 4 from the processing head 5 at coordinates (x, y) determined based on the design distance Dd according to equation (3), and control the processing head 5 according to the corrected ejection timing tc(x, y).

[0027] tc(x, y)=td(x, y)-Δt(x, y)...Equation (3) If the number of measurement target locations on the top surface of the substrate 2 is not sufficiently large, the control unit 15 may obtain an approximated curved surface from the calculated D(x, y) and use the approximated curved surface to obtain D(x, y) as a function. If the top surface of the substrate 2 can be regarded as a horizontal plane, a representative value of the gap distribution D(x, y) may be used regardless of the coordinates (x, y) of the substrate 2, or the height of only a representative location on the top surface of the substrate 2 may be measured to obtain a first measurement value M1, which may be used to determine the gap D.

[0028] The above configuration and method make it possible to highly accurately correct measurement errors in gaps or gap distribution due to deformation over time and thermal deformation of the first structure 10, the second structure 3, the first height sensor 6, the second height sensor 7, etc. This makes it possible to highly accurately correct the ejection timing of the ink 4 from the processing head 5, and to apply or place droplets of the ink 4 to the target area (target position) on the substrate 2.

[0029] The first height sensor 6 and the second height sensor 7 may be, for example, sensors using the white light confocal principle or laser interferometers. Multiple first height sensors 6 and / or multiple second height sensors 7 may be provided. The reference member 11 is made of a material that transmits the measurement light of the second height sensor 7. If the wavelength of the measurement light is in the visible light range, the reference member 11 may be glass that is transparent in the visible light range. The reference member 11 may be made of a material that blocks a predetermined frequency range. For example, the reference member 11 may have optical properties that block wavelengths of 400 nm or less. In this case, even if UV-curable ink is used, the ink curing reaction caused by the measurement light can be suppressed. Furthermore, if the wavelength of the measurement light of the second height sensor 7 is in the infrared range, the reference member 11 may be made of a material that transmits infrared light, such as silicon.

[0030] A substrate processing apparatus 1 according to a second embodiment will be described below. Matters not mentioned in the second embodiment may conform to the first embodiment. FIG. 5 schematically illustrates the configuration of a substrate processing apparatus 1 according to the second embodiment. In the second embodiment, the surface of the substrate 2 supported by the second structure 3 is used as the reference surface RS. Accordingly, in one example, the substrate 2 is a light-transmitting substrate. In another example, the reference surface RS is the surface of a light-transmitting portion of the substrate 2 supported by the second structure 3. The reference surface RS may have a reference point 12, as in the first embodiment. The reference surface RS may be a portion of the upper surface of the substrate 2. Alternatively, the reference surface RS may be a portion of the lower surface of the substrate 2. If the substrate 2 has a light-shielding film 17 such as a chromium film, the substrate surface RS may be provided in a region of the substrate 2 where the light-shielding film 17 is not present. The reference surface RS may be provided in a portion of the pixel array region 8. The second height sensor 7 may be disposed in a recess recessed from the upper surface of the second structure 3. In one aspect, the reference surface RS is a surface of a member (e.g., substrate 2) that is temporarily supported by the second structure 3. The second embodiment is advantageous, for example, in reducing the size of the second structure 3, and in shortening the measurement time by reducing the amount of movement of the second structure 3 to obtain the third measurement value M3 and the fourth measurement value M4.

[0031] In the measurement step for obtaining the third measurement value M3 and the fourth measurement value M4 described above, a light-transmitting substrate for measurement may be used instead of the substrate 2.

[0032] A substrate processing apparatus 1 according to a third embodiment will be described below. Details not mentioned in the third embodiment may conform to the first or second embodiment. FIG. 6 schematically illustrates the configuration of a substrate processing apparatus 1 according to the third embodiment. In the third embodiment, the second structure 3 includes a substrate stage 19 driven by a second drive mechanism 13 and a substrate chuck 18 mounted on the substrate stage 19 and holding a substrate 2. The substrate chuck 18 supports a member 16 having a reference surface RS. In one example, the reference surface RS may constitute a portion of the surface of the substrate chuck 18. The second height sensor 7 may be embedded in the substrate chuck 18. The third embodiment is advantageous, for example, in shortening the measurement time by reducing the amount of movement of the second structure 3 required to obtain the third measurement value M3 and the fourth measurement value M4. In the third embodiment, measurements to obtain the third measurement value M3 and the fourth measurement value M4 can be performed even when the substrate 2 is not mounted on the substrate chuck 18. The measurements to obtain the third measurement value M3 and the fourth measurement value M4 may be performed, for example, during maintenance, for example, when the processing head 5 is mounted on the carriage 9. This can reduce the downtime of the substrate processing apparatus 1.

[0033] The following describes an example of a manufacturing method for manufacturing a display device such as an organic light-emitting device using the substrate processing apparatus 1. The manufacturing method may include a coating step in which an organic light-emitting material is applied to multiple locations on a substrate using the substrate processing apparatus 1, and a processing step in which the substrate is processed to obtain an organic light-emitting device. The manufacturing method may further include a drying step in which the organic light-emitting material applied to the multiple locations on the substrate in the coating step is dried, and a baking step in which the organic light-emitting material that has been dried is baked. In this case, the processing step treats the processing object that has been baked. The organic light-emitting material may be, for example, a solution containing a solute and a solvent for forming an organic film. The organic film may be, for example, any of the hole injection layer, hole transport layer, light-emitting layer, electron transport layer, and electron injection layer of an organic light-emitting (OLED) element. A manufacturing method for an organic EL element may include a step of forming each organic film, such as a hole injection layer, hole transport layer, light-emitting layer, electron transport layer, or electron injection layer, on a substrate.

[0034] This specification and the accompanying drawings include the following disclosure: (Document name) Claims (Item 1) A substrate processing apparatus for processing a substrate, a first distance sensor; A second distance sensor; an assembly including a processing head for processing the substrate; a first structure supporting the first distance sensor and the assembly; a second structure supporting the second distance sensor and the substrate; a control unit that controls the first distance sensor to measure the height of the substrate and the height of a reference surface, the second distance sensor to measure the height of a predetermined portion of the assembly and the height of the reference surface, and performs control to adjust the distance between the substrate and the processing head based on the output of the first distance sensor and the output of the second distance sensor; A substrate processing apparatus comprising: (Item 2) the second structure supports a member having the reference surface; 2. The substrate processing apparatus according to item 1, (Item 3) the substrate is a light-transmitting substrate, the reference surface is a surface of the substrate supported by the second structure; 2. The substrate processing apparatus according to item 1, (Item 4) the reference surface is a surface of a light-transmitting portion of the substrate supported by the second structure; 4. The substrate processing apparatus according to item 3, (Item 5) the reference surface is a surface of a member temporarily supported by the second structure; 2. The substrate processing apparatus according to item 1, (Item 6) the second structure includes a substrate stage and a substrate chuck that is mounted on the substrate stage and holds the substrate; the substrate chuck supports a member having the reference surface; 2. The substrate processing apparatus according to item 1, (Item 7) the reference surface constitutes a part of the surface of the substrate chuck; 7. The substrate processing apparatus according to item 6, (Item 8) the second distance sensor is embedded in the substrate chuck; 8. The substrate processing apparatus according to item 6 or 7, (Item 9) the second distance sensor measures the height of the predetermined portion of the assembly via the reference surface; 9. The substrate processing apparatus according to any one of items 1 to 8, characterized in that: (Item 10) the first distance sensor measures the height of the substrate via the reference surface; 9. The substrate processing apparatus according to any one of items 1 to 8, characterized in that: (Item 11) the first distance sensor measures the height of a reference point on the reference surface; The second distance sensor measures the height of the reference point on the reference surface. 11. The substrate processing apparatus according to any one of items 1 to 10, (Item 12) the first distance sensor and the second distance sensor are distance sensors; 12. The substrate processing apparatus according to any one of items 1 to 11, characterized in that: (Item 13) the processing head is a discharge head that discharges droplets toward the substrate; 13. The substrate processing apparatus according to any one of items 1 to 12, characterized in that: (Item 14) the control unit controls the timing at which the ejection head ejects droplets based on the distance between the substrate and the processing head. Item 14. The substrate processing apparatus according to item 13. (Item 15) A coating process in which droplets of an organic light-emitting material are applied to a plurality of locations on a substrate by the substrate processing apparatus according to item 13 or 14; a processing step of processing the substrate that has been subjected to the coating step to obtain an organic light-emitting device; A method for manufacturing a display device, comprising:

[0035] The invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention. [Explanation of symbols]

[0036] 1: substrate processing apparatus, 2: substrate, 3: second structure, 4: ink, 5: processing head, 6: first height sensor (first distance sensor), 7: second height sensor (second distance sensor), 8: pixel array area, 9: carriage, 10: first structure, 11: reference member, 12: reference point, 14: first structure, 15: control unit, RS: reference surface

Claims

1. A substrate processing apparatus for processing a substrate, a first distance sensor; A second distance sensor; an assembly including a processing head for processing the substrate; a first structure supporting the first distance sensor and the assembly; a second structure supporting the second distance sensor and the substrate; a control unit that controls the first distance sensor to measure the height of the substrate and the height of a reference plane, controls the second distance sensor to measure the height of a predetermined portion of the assembly and the height of the reference plane, and performs control to adjust the distance between the substrate and the processing head based on the output of the first distance sensor and the output of the second distance sensor; A substrate processing apparatus comprising:

2. the second structure supports a member having the reference surface; The substrate processing apparatus according to claim 1 .

3. the substrate is a light-transmitting substrate, the reference surface is a surface of the substrate supported by the second structure; The substrate processing apparatus according to claim 1 .

4. the reference surface is a surface of a light-transmitting portion of the substrate supported by the second structure; The substrate processing apparatus according to claim 3 .

5. the reference surface is a surface of a member temporarily supported by the second structure; The substrate processing apparatus according to claim 1 .

6. the second structure includes a substrate stage and a substrate chuck that is mounted on the substrate stage and holds the substrate; the substrate chuck supports a member having the reference surface; The substrate processing apparatus according to claim 1 .

7. the reference surface constitutes a part of the surface of the substrate chuck; The substrate processing apparatus according to claim 6 .

8. the second distance sensor is embedded in the substrate chuck; The substrate processing apparatus according to claim 6 .

9. the second distance sensor measures the height of the predetermined portion of the assembly via the reference surface; The substrate processing apparatus according to claim 1 .

10. the first distance sensor measures the height of the substrate via the reference surface; The substrate processing apparatus according to claim 1 .

11. the first distance sensor measures the height of a reference point on the reference surface; the second distance sensor measures the height of the reference point on the reference surface; The substrate processing apparatus according to claim 1 .

12. the first distance sensor and the second distance sensor are distance sensors; The substrate processing apparatus according to claim 1 .

13. the processing head is a discharge head that discharges droplets toward the substrate; The substrate processing apparatus according to claim 1 .

14. the control unit controls the timing at which the ejection head ejects droplets based on the distance between the substrate and the processing head. The substrate processing apparatus according to claim 13 .

15. a coating step of coating droplets of an organic light-emitting material onto a plurality of locations on a substrate by the substrate processing apparatus according to claim 13 or 14; a processing step of processing the substrate that has been subjected to the coating step to obtain an organic light-emitting device; A method for manufacturing a display device, comprising:

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