Exposure device, exposure method, and method for manufacturing article

Abstract

To suppress peeling electrification caused by a contact member in contact with an original plate or a substrate.SOLUTION: An exposure device exposes a substrate to light from a light source through an original plate, the device being provided with a contact mechanism including a contact member to be in contact with the original plate or the substrate, the contact member being composed of a fluororubber having nitrogen atoms added at least on the surface to be in contact with the original plate or the substrate.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an exposure apparatus, an exposure method, and a method for manufacturing an article. [Background technology]

[0002] Conventionally, exposure apparatuses are used in the lithography process for manufacturing electronic devices such as liquid crystal display elements, organic EL display devices, deflection elements used in VR and AR devices, and semiconductor elements. In these exposure apparatuses, the pattern of a mask (original) is transferred onto a photosensitive substrate (glass plate) via a projection optical system.

[0003] Patent Document 1 discloses an exposure apparatus in which the upper side of a mask is covered with a space-defining member such as flat glass to form an enclosed space, and the deflection of the mask is corrected by adjusting the pressure in the enclosed space.

[0004] Patent Document 2 discloses an exposure apparatus in which a substrate placed on a stage is raised and lowered by a lifting member, and the substrate is transferred to and from the outside of the exposure apparatus. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2006-135085 [Patent Document 2] JP 2018-010247 A Summary of the Invention [Problem to be solved by the invention]

[0006] However, in the exposure apparatus described in Patent Document 1, the mask and the deflection control unit are separated when the mask is replaced, but separation charges can occur at the contact points between the mask and the deflection control unit, damaging the mask pattern. Also, in the exposure apparatus described in Patent Document 2, the substrate is raised and lowered in the vertical direction to transfer the substrate, but separation charges can occur at the contact points between the substrate and the lifting member, damaging the pattern transferred to the substrate.

[0007] SUMMARY OF THE INVENTION In order to solve the above problems, an object of the present invention is to provide an exposure apparatus that can suppress peel charging caused by a contact member that comes into contact with an original or a substrate. [Means for solving the problem]

[0008] In order to achieve the above object, an exposure apparatus as one aspect of the present invention is an exposure apparatus that exposes a substrate to light from a light source through an original, and is equipped with a contact mechanism including a contact member that contacts the original or the substrate, and the contact member is made of fluororubber having nitrogen atoms added to at least the surface that contacts the original or the substrate. [Effects of the Invention]

[0009] According to the present invention, peeling electrification caused by a contact member that comes into contact with the original or substrate can be suppressed. [Brief explanation of the drawings]

[0010] [Figure 1] 3A and 3B are diagrams illustrating the structure of a deflection control unit according to the first embodiment. [Figure 2] FIG. 10 is a diagram illustrating a state in which the transfer arm of the first embodiment grips the deflection control unit. [Figure 3] 10 is a diagram showing a state in which the transfer arm of the first embodiment lifts up the deflection control unit. FIG. [Figure 4] 10 is a diagram showing a state in which the transfer arm of the first embodiment has moved the deflection control unit to the outside of the mask. FIG. [Figure 5] FIG. 2 is a perspective view of a deflection control unit according to the first embodiment. [Figure 6] FIG. 10 is a diagram showing the structure of a lifting unit according to a second embodiment. [Figure 7] FIG. 10 is a diagram showing a state in which the robot hand of the second embodiment has moved to below the glass member. [Figure 8] 10 is a diagram showing a state in which the lifting member of the second embodiment has descended and the glass member has been placed on the robot hand. FIG. [Figure 9] FIG. 10 is a diagram showing a state in which the robot hand of the second embodiment has moved to the outside of the lifting unit. [Figure 10] FIG. 10 is a diagram showing a state in which the robot hand of the second embodiment has scooped up a glass member. [Figure 11] FIG. 10 is a perspective view of a lifting unit according to a second embodiment. [Figure 12] 1 is a plot of the relationship between the difference in nitrogen content between the interior and surface of glass-contact members and the charging potential, as determined by XPS analysis in Embodiments 1 and 2. FIG. [Figure 13] FIG. 1 is a diagram showing a schematic configuration of an exposure apparatus according to an embodiment. [Figure 14] 3A and 3B are diagrams showing the structure of a glass deformation unit according to an embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the invention according to the claims. Although multiple features are described in the embodiments, not all of these multiple features are necessarily essential to the invention, and multiple features may be combined arbitrarily. Furthermore, in the accompanying drawings, the same reference numerals are used to designate the same or similar components, and redundant explanations will be omitted.

[0012] <Embodiment 1> Below, we will explain the outline of the exposure apparatus EX of embodiment 1 and the structure of the glass deformation unit with reference to Figures 13 and 14, and then explain the deflection control unit 102 that the exposure apparatus EX has according to embodiment 1. Figure 13 is a diagram showing the schematic configuration of the exposure apparatus EX of embodiment 1. Figure 1 is an enlarged view of a portion of Figure 13.

[0013] 13, the exposure apparatus EX is equipped with a mask stage MST that holds and moves a mask (original) 101 on which a pattern is formed, and a substrate stage PST that supports a photosensitive substrate P. The exposure apparatus EX also is equipped with an illumination optical system IL that illuminates the mask 101 with exposure light EL, a projection optical system PL that projects and transfers the pattern of the mask 101 illuminated by the exposure light EL onto the photosensitive substrate P held on the substrate stage PST, and a transport arm 105. The exposure apparatus EX preferably further includes a deflection measurement device 106 (measurement unit) that measures the amount of deflection of the mask 101.

[0014] Above the mask 101, a deflection control unit (a defining member that defines the control space 104) 102 is disposed, which forms a control space 104 with the surface of the mask 101 as part of its boundary. The mask 101 held by the mask stage MST and the photosensitive substrate P held by the substrate stage PST are disposed in a conjugate positional relationship via the projection optical system PL. The exposure apparatus EX in this embodiment is configured as a so-called mirror scan exposure apparatus that has a large concave mirror. The photosensitive substrate P is typically a glass plate (glass substrate) coated with a photosensitive agent (photoresist).

[0015] In this embodiment, the exposure apparatus EX is configured as a scanning exposure apparatus, and moves the mask 101 and photosensitive substrate P in synchronization with each other relative to an illumination optical system IL that emits exposure light EL, thereby transferring the pattern of the mask 101 onto the photosensitive substrate P by scanning exposure. In the following, the optical axis direction of the projection optical system PL is referred to as the Z-axis direction, the direction in which the mask 101 and photosensitive substrate P move in synchronization with each other perpendicular to the Z-axis direction is referred to as the Y-axis direction (scanning direction), and the direction perpendicular to the Z-axis direction and the Y-axis direction is referred to as the X-axis direction. Furthermore, the directions around the X-axis, Y-axis, and Z-axis are referred to as the θX direction, θY direction, and θZ direction, respectively.

[0016] The illumination optical system IL includes a light source such as a high-pressure mercury lamp, an elliptical mirror for condensing the light beam emitted from the light source, and a condenser lens for expanding and collimating the light beam condensed by the elliptical mirror. The illumination optical system IL further includes a limiting slit plate for defining an illumination region of a predetermined area, and a mirror for reflecting the light beam from the limiting slit plate to irradiate the mask 101 with a slit-shaped illumination light beam.

[0017] The exposure light EL generated by the illumination optical system IL may be, for example, ultraviolet emission lines (g-line, h-line, i-line) emitted from a mercury lamp or an LED, KrF excimer laser light (wavelength 248 nm), ArF excimer laser light (wavelength 193 nm), etc. The illumination optical system IL is configured as a so-called Koehler illumination system.

[0018] The mask stage MST is configured to drive the mask 101 to scan relative to the illumination optical system IL, and has a long stroke in the Y-axis direction (scanning direction) and an appropriate stroke in the X-axis direction perpendicular to the scanning direction. The mask stage MST has a suction portion for holding the mask 101. The suction portion is connected to a vacuum device (not shown), and the mask 101 is held by vacuum suction by the suction portion.

[0019] As shown in FIG. 13, movable mirrors 32a and 32b are provided on the edges of the mask stage MST in the X-axis and Y-axis directions, respectively, in directions perpendicular to each other. A laser interferometer Mx1 is disposed facing movable mirror 32a, and multiple (two in this embodiment) laser interferometers My1 and My2 are disposed facing movable mirror 32b. The laser interferometers My1 and My2 irradiate movable mirror 32b with laser light to detect the distance between the laser interferometers My1 and My2 and movable mirror 32b. The detection results of the laser interferometers My1 and My2 are output to a main control system C, which calculates the position of the mask stage MST in the Y-axis direction and the amount of rotation about the Z-axis based on the detection results of the laser interferometers My1 and My2. The laser interferometer Mx1 irradiates movable mirror 32a with laser light to detect the distance between the laser interferometer Mx1 and movable mirror 32a. The detection results of the laser interferometer Mx1 are output to the main control system C, which determines the position of the mask stage MST in the X direction based on the detection results of the laser interferometer Mx1. The main control system C sets the mask stage MST to the desired position (posture) while monitoring the position (posture) of the mask stage MST from the outputs of the laser interferometers Mx1, Mx2, and My1.

[0020] The exposure light EL transmitted through the mask 101 enters the projection optical system PL, which includes a plurality of mirrors 52, 54 with reflective surfaces and a glass deformation unit 300 that corrects distortion, and forms an image of the pattern present in the illumination area of ​​the mask 101 on the photosensitive substrate P.

[0021] 14, the glass deformation unit 300 has a configuration in which a plurality of (e.g., 30) actuators 302 are arranged around a parallel plate glass 301. The actuator 302 is composed of a clamp unit 304, a ball screw 307, a shaft 305, and a motor 306, and the clamp unit 304 holds the parallel plate glass 301 from above and below. Each motor 306 is driven based on a command from the main control system C, and each clamp unit 304 is driven in the Z-axis direction, thereby deforming the parallel plate glass 301 and correcting distortion.

[0022] The substrate stage PST, which drives the photosensitive substrate P, has a scanning stroke in the Y-axis direction (scanning direction) and a stepping stroke in the X-axis direction, which is perpendicular to the scanning direction, just like the mask stage MST. Furthermore, the substrate stage PST is configured to be movable in the Z-axis direction and the θX, θY, and θZ directions.

[0023] 13, movable mirrors 33a and 33b are installed in orthogonal directions on the edges of the substrate stage PST in the Y-axis and X-axis directions. Multiple (e.g., three) laser interferometers Px1, Px2, and Px3 are arranged to face movable mirror 33a extending in the X-axis direction. Furthermore, multiple (e.g., two) laser interferometers Py1 and Py2 are arranged to face movable mirror 33b extending in the Y-axis direction.

[0024] The multiple laser interferometers Py1 and Py2 irradiate the movable mirror 33b with laser light and detect the distance between the laser interferometers Py1 and Py2 and the movable mirror 33b. The detection results of the laser interferometers Py1 and Py2 are output to the main control system C, which determines the position of the substrate stage PST in the Y-axis direction and the amount of rotation about the Z-axis based on the detection results of the laser interferometers Py1 and Py2. In addition, the laser interferometers Px1 to Px3 irradiate the movable mirror 33a with laser light and detect the distance between the laser interferometers Px1 to Px3 and the movable mirror 33a. Here, since the substrate stage PST has a long stroke for scanning in the Y-axis direction, the laser interferometers Px1 to Px3 are switched depending on the position of the substrate stage PST.

[0025] The detection results of the laser interferometers Px1 to Px3 are output to a main control system C, which determines the position of the substrate stage PST in the X-axis direction based on the detection results of each of the laser interferometers Px1 to Px3. The main control system C monitors the position (posture) of the substrate stage PST from the outputs of the laser interferometers Py1, Py2, and Px1 to Px3, and sets the substrate stage PST to a desired position (posture).

[0026] The main control system C drives the mask 101 and the photosensitive substrate P synchronously in the X-axis direction in an arbitrary scanning direction (synchronous movement speed) relative to the projection optical system PL while monitoring the positions of the mask stage MST and the substrate stage PST.

[0027] Next, the deflection control unit 102 of the exposure apparatus EX according to embodiment 1 will be described with reference to Figures 1 to 5. The deflection control unit 102 in embodiment 1 is a unit that can correct deflection of the mask 101 due to its own weight and flatten it by changing the pressure in the control space 104. In this embodiment, the control space 104 can be formed by the mask 101 and the deflection control unit 102.

[0028] FIG. 1 is a diagram showing the structure of the deflection control unit 102 of the first embodiment. FIG. 2 is a diagram showing a state in which the transfer arm 105 of the first embodiment grips the deflection control unit 102. FIG. 3 is a diagram showing a state in which the transfer arm 105 of the first embodiment has lifted the deflection control unit 102. FIG. 4 is a diagram showing a state in which the transfer arm 105 of the first embodiment has moved the deflection control unit 102 to the outside of the mask 101. FIG. 5 is a perspective view of the deflection control unit 102 of the first embodiment.

[0029] The deflection control unit 102 includes a light-transmitting plate 111 facing the mask 101, a frame 112, and a contact member 103. In this embodiment, the frame 112 is disposed between the light-transmitting plate 111 and the mask 101 so as to follow the outer peripheral edge of the light-transmitting plate 111. The contact member 103 is attached to the lower part of the frame 112, for example, by adhesive, and is a member that comes into contact with the upper part of the mask 101. Note that the contact member 103 may be attached to the frame 112 by a method other than adhesive. Furthermore, the contact member 103 may be circular, rectangular, or another shape.

[0030] 5, the mask 101 is configured to be rectangular. Accordingly, the light-transmitting plate 111 and the frame 112 are also configured to be rectangular. Note that the mask 101 is not limited to a rectangular shape and may have other shapes. In that case, the light-transmitting plate 111 and the frame 112 are also configured to have shapes corresponding to the mask 101.

[0031] The exposure apparatus EX is provided with a deflection measuring device 106 that measures the deflection of the mask 101 above the light transmitting plate 111. The exposure apparatus EX also includes a servo valve 108 and clamp 110 that perform air pressure control to correct the deflection of the mask 101, and an air flow path 107 that connects the servo valve 108 and clamp 110.

[0032] The amount of deflection of the mask 101 depends on the pressure in the control space (pressure control space) 104. Therefore, the amount of deflection of the mask 101 can be controlled by the pressure in the control space 104. In order to correct the deflection of the mask 101 due to its own weight, it is necessary to control the pressure in the deflection control space 104 to be negative relative to atmospheric pressure (or the pressure of the surrounding environment).

[0033] The exposure apparatus EX further includes a control unit 109, which is communicatively connected to the deflection measurement device 106. The amount of deflection of the mask 101 measured by the deflection measurement device 106 is sent to the control unit 109, which then calculates a pressure for correcting the amount of deflection of the mask 101 and sends a command value to the servo valve 108. The servo valve 108 adjusts the pressure in the control space 104 in accordance with the command value from the control unit 109. In this embodiment, the deflection control unit 102, the clamp 110, the servo valve 108, and the flow path 107 also function as a pressure control mechanism that changes the pressure in the control space 104 so as to control the deflection of the mask 101 due to its own weight.

[0034] The control unit 109 includes a CPU, memory (storage unit), and the like, and is configured as at least one computer, and is connected to each component of the exposure apparatus EX via a line. The control unit 109 also performs overall control of the operation and adjustment of each component of the entire exposure apparatus EX in accordance with a program stored in the memory. The control unit 109 may be configured integrally with the other parts of the exposure apparatus EX (in a common housing), or may be configured separately from the other parts of the exposure apparatus EX (in a different housing), or may be installed in a location separate from the exposure apparatus EX and controlled remotely.

[0035] A method for replacing the mask 101 will be described below with reference to FIGS. 1 to 4. To replace the mask 101, first, from the state shown in FIG. 1, the frame 112 is grasped (held) by the transport arm 105 shown in FIG. 2. Then, by lifting (moving) the frame 112 upward (in the +Z direction) while it is grasped (held) by the transport arm, the deflection control unit 102 is also lifted upward (in the +Z direction). At this time, the deflection measurement device 106 does not move because it is fixed to the exposure apparatus EX. Then, when the deflection control unit 102 is lifted by the transport arm 105, the mask 101 and the contact member 103 are separated, as shown in FIG. 3. Next, as shown in FIG. 4, with the deflection control unit 102 sufficiently lifted, the deflection control unit 102, including the frame 112 held by the transport arm 105, is moved to the outside of the mask 101. In this state, the mask 101 is replaced.

[0036] Once the replacement of the mask 101 is complete, the deflection control unit 102 is placed on the mask 101 in the reverse order of the above. That is, the frame 112 is gripped by the transfer arm 105 and moved downward (in the -Z direction) to bring the contact member 103 into contact with the replaced mask 101. The deflection control unit 102 also functions as a contact mechanism including the contact member 103 that comes into contact with the mask 101. The deflection control unit 102 is positioned outside the mask 101 while being lifted by the transfer arm 105 as shown in FIG. 4, but when it is moved above the mask 101 as shown in FIG. 3 and the transfer arm 105 is lowered as shown in FIG. 2, the mask 101 and the contact member 103 come into contact.

[0037] In the above-described method for exchanging the mask 101, when the deflection control unit 102 is lifted by the transfer arm 105, the contact member 103 of the deflection control unit 102 and the mask 101 are separated from each other, causing separation electrification.

[0038] Here, fluororubber is often used for the contact member 103, which is the member that comes into contact with the mask 101. In this embodiment, too, a configuration in which fluororubber is used for the contact member 103 will be described. Fluororubber generally has a C-F bond in its copolymer structure, and because of this strong bond, it has higher chemical resistance than other synthetic rubbers and is effective in suppressing the generation of outgassing. In exposure equipment, siloxane and the like, which cause clouding of glass members, are undesirable, so fluororubber, which has low outgassing, is useful for the contact member 103 and is therefore often used for the contact member.

[0039] The fluororubber of the contact member 103 in this embodiment is foamed fluororubber, which has elasticity and is therefore suitable for keeping the mask 101 flat. Furthermore, the fluororubber of the contact member 103 is closed-cell fluororubber, and since the air bubbles are each independent, it has a structure that makes it difficult for air to escape to the outside. Fluororubber with a closed-cell structure improves the airtightness inside the control space 104 and is suitable for correcting deflection of the mask 101 due to its own weight.

[0040] Here, when the volume of the closed cells of the contact member 103 is Vc and the volume of the open cells is Vo, the open cell ratio F is expressed by the following formula (1). F=Vo / (Vc+Vo)×100 (1)

[0041] Here, the lower the open cell ratio F, the higher the airtightness, so the open cell ratio is preferably 50% or less. An open cell ratio of 25% or less is more preferable, and an open cell ratio of 10% or less is even more preferable. Therefore, the open cell ratio of the foamed fluororubber that is the contact member 103 of this embodiment is set to 50% or less. Furthermore, from the viewpoint of airtightness as described above, it is more preferable that the open cell ratio of the foamed fluororubber that is the contact member 103 of this embodiment is set to 25% or more or 10% or less.

[0042] Furthermore, the fluororubber of the contact member 103 contains carbon black as an additive. In general, adding carbon black to rubber materials is effective in improving durability, and therefore suppresses deterioration of the contact member 103 over time and deterioration caused by repeated contact and separation between the contact member 103 and the mask 101 when replacing the mask.

[0043] The mask 101 of this embodiment is made of a glass material such as quartz glass. Masks used in exposure apparatuses are generally made of quartz glass. Quartz glass is a material that easily becomes positively charged, while the fluororubber of the contact member 103 is a material that easily becomes negatively charged. The fluororubber of the contact member 103 and the quartz glass of the mask 101 are in different triboelectric series, so peeling charging is likely to occur. It is also possible that the mask 101 is made of silicon. When silicon comes into contact with air, an oxide film SiO2 is formed on the surface, which puts it in the same triboelectric series as glass, making it a material that is prone to peeling charging with the fluororubber.

[0044] In this embodiment, the method of suppressing peeling electrification is to coat the surface of the contact member 103 with a material of the same triboelectric series as quartz glass in order to suppress peeling electrification while maintaining the advantages of closed-cell fluororubber, such as high sealing performance and low outgassing. Here, the difference in electrification potential between the glass member and the contact member 103 is defined as being equivalent within a range in which electrostatic breakdown due to peeling electrification does not occur.

[0045] In the first embodiment, the contact member 103 is configured so that nitrogen atoms are added to the surface. That is, the surface of the contact member 103 is coated with a positively charged material. Specifically, the surface of the contact member 103 is subjected to an aminosilane coupling treatment (a coating treatment with a positively charged material) using an aminosilane coupling agent. After the aminosilane coupling treatment, a crosslinked structure is formed between the amino groups and the fluororubber carbon black on the surface of the contact member 103, and amino groups are added. This results in a state in which the nitrogen content on the surface of the contact member 103 is higher than that inside the contact member 103.

[0046] It is sufficient that nitrogen atoms are added to at least the surface of the contact member 103 that comes into contact with the mask 101. In this case, a positively charged material is coated on at least the surface of the contact member 103 that comes into contact with the mask 101. Specifically, as in the above, at least the surface of the contact member 103 that comes into contact with the mask 101 is subjected to an aminosilane coupling treatment (surface treatment) with an aminosilane coupling agent.

[0047] The contact member 103, which has a highly electron-donating amino group on its surface, has the same triboelectric series as the quartz glass of the mask 101, and therefore suppresses separation electrification when the contact member 103 and the mask 101 are separated.

[0048] When the contact member 103 before the aminosilane coupling treatment is peeled off from the mask 101 as shown in FIG. 4, the charge potential at the contact point is measured to be about 3000V.

[0049] 12 is a diagram showing the relationship between the difference in nitrogen content and the peel charging potential when the composition of the inside (fluororubber inside) and surface (fluororubber surface) of the contact member 103 after aminosilane coupling treatment is analyzed by XPS (X-ray photoelectron spectroscopy). As shown in Fig. 12, if the difference in nitrogen content when the composition of the inside and surface of the contact member 103 is analyzed by XPS is 0.5% or more and 7.5% or less, the charging potential is 1000 V or less, and peel charging can be suitably suppressed.

[0050] Furthermore, as can be seen from Figure 12, if the difference in nitrogen content between the composition inside the contact member 103 and the composition on the surface of the contact member 103 is 1.5% or more and 4.5% or less when analyzed by XPS, the charging potential is 300 V or less, thereby more effectively suppressing peel charging.

[0051] As described above, according to the exposure apparatus EX in the first embodiment, peel charging caused by the contact member 103, which is a member that comes into contact with the mask (original) 101, can be suppressed.

[0052] <Embodiment 2> In the second embodiment, an exposure apparatus EX having a lifting unit 200 for raising and lowering a substrate up and down will be described with reference to Figures 6 to 11. The lifting unit 200 in the second embodiment is a unit that can raise and lower a glass member 201 up and down. Note that in the second embodiment, the configuration of the exposure apparatus EX that is different from that in the first embodiment will be described, and a description of the similar configuration will be omitted.

[0053] In this embodiment, the glass member 201 is assumed to be a substrate (glass substrate, glass plate) for manufacturing, for example, a semiconductor device or a flat panel display (FPD). However, the glass member 201 is not limited to this, and may be another glass member such as a mask, or a silicon substrate. Furthermore, while the glass member 201 in this embodiment is rectangular as shown in FIG. 11, the glass member 201 is not limited to this, and may be another shape such as circular.

[0054] The lifting unit 200 includes a stage 204, a lifting member 202, and a contact member 203. A plurality of lifting members 202 are provided on the stage 204, and the lifting members 202 move up and down (in the Z direction).

[0055] A contact member 203 is adhered to the upper part of the lifting member 202, and the contact member 203 comes into contact with the lower part of the glass member 201. Here, the lifting member 202 moves up and down (in the Z direction), thereby lifting and lowering the glass member 201 up and down. The lifting unit 200 also functions as a contact mechanism including the contact member 203 that comes into contact with the glass member 201. The contact mechanism holds the glass member 201 via the contact member 203. The contact member 203 may be attached to the frame 112 by a method other than adhesion. The contact member 203 may be attached to the lifting member 202 by a method other than adhesion. The contact member 203 may be circular, rectangular, or another shape.

[0056] A method for replacing the glass member 201 will be described below with reference to Figs. 6 to 9. Fig. 6 is a diagram showing the structure of the lifting unit 200 of the second embodiment. Fig. 7 is a diagram showing a state in which the robot hand 205 of the second embodiment has moved to below the glass member 201. Fig. 8 is a diagram showing a state in which the lifting member 202 of the second embodiment has descended and the glass member has been placed on the robot hand 205. Fig. 9 is a diagram showing a state in which the robot hand 205 of the second embodiment has moved to the outside of the lifting unit 200.

[0057] First, as shown in Fig. 6, glass member 201 is lifted by lifting member 202, and then robot hand 205 is inserted below glass member 201 as shown in Fig. 7. That is, it is inserted between glass member 201 and the stage (in the Z direction).

[0058] The robot hand 205 has multiple claws as shown in FIG. 11, and is inserted between the lifting members 202. When the robot hand 205 is inserted, the lifting members 202 descend, and at the same time, the glass member 201 also descends. As shown in FIG. 8, the glass member 201 is placed on the robot hand 205, and the glass member 201 that was in contact with the contact member 203 is peeled off from the contact member 203. When the lifting members 202 have descended sufficiently, the robot hand 205 moves to the outside of the lifting unit 200 as shown in FIG. 9.

[0059] When placing the glass member 201 on the lifting unit 200, the procedure is reversed from the above. That is, the glass member 201 placed on the robot hand 205 is moved onto the lifting unit 200 as shown in FIG. 8. Next, when the lifting member 202 is raised in this state, the contact member 203 comes into contact with the glass member 201 as shown in FIG. 7. Then, after the lifting member 202 holds the glass member 201, the robot hand 205 moves to the outside of the lifting unit 200 as shown in FIG. 6.

[0060] In the above-described replacement sequence of the glass member 201, when the lifting member 202 is lowered and the glass member 201 is placed on the robot hand 205, if the lifting member 202 is further lowered, the contact member 203 and the glass member 201 are separated, and separation electrification occurs.

[0061] Although the method in which the lifting member 202 descends and places the glass member 201 on the robot hand 205 has been described above, the method of placing the glass member 201 on the robot hand 205 is not limited to this. Below, a method in which the robot hand 205 scoops up the glass member 201 and places the glass member 201 on the robot hand 205 will be described with reference to Figures 6 to 11.

[0062] First, as shown in Fig. 6, the glass member 201 is lifted by the lifting member 202, and then the robot hand 205 is inserted below the glass member 201 as shown in Fig. 7. Next, the robot hand 205 rises as shown in Fig. 10 and scoops up the glass member 201 from below. At this time, the robot hand 205 may scoop up the glass member 201 in a direction perpendicular to the glass member 201 or in a diagonal direction. Thereafter, the robot hand 205 moves to the outside of the lifting unit 200 with the glass member 201 still placed thereon.

[0063] In the above sequence, when the robot hand 205 picks up the glass member 201, the contact member 203 and the glass member 201 are separated, and separation electrification occurs.

[0064] Here, in the second embodiment, as in the first embodiment, the contact member 203 is configured so that nitrogen atoms are added to the surface. That is, the surface of the contact member 203 is coated with a positively charged material. Specifically, the surface of the contact member 203 is subjected to an aminosilane coupling treatment (a coating treatment with a positively charged material) using an aminosilane coupling agent. After the aminosilane coupling treatment, a crosslinked structure is formed between the amino groups and the fluororubber carbon black on the surface of the contact member 203, and amino groups are added. This results in a state in which the nitrogen content on the surface of the contact member 203 is higher than that inside.

[0065] It is sufficient that nitrogen atoms are added to at least the surface of the contact member 203 that comes into contact with the glass member 201. In this case, a positively charged material is coated on at least the surface of the contact member 203 that comes into contact with the glass member 201. Specifically, as in the above, at least the surface of the contact member 203 that comes into contact with the glass member 201 is subjected to an aminosilane coupling treatment (surface treatment) with an aminosilane coupling agent.

[0066] In this way, similarly to the first embodiment, the surface of the contact member 203 is subjected to aminosilane coupling treatment with an aminosilane coupling agent, thereby providing amino groups with high electron donating properties to the surface of the contact member 203. The contact member 203 has the same triboelectric series as the glass member 201, and therefore peel electrification is suppressed.

[0067] As described above, according to the exposure apparatus EX in the second embodiment, it is possible to suppress peel charging caused by the contact member 203, which is a member that comes into contact with the substrate (glass member 201). This also makes it possible to suppress damage to the pattern transferred to the glass member 201.

[0068] <Embodiments of manufacturing methods of articles> The method for manufacturing an article according to an embodiment of the present invention is suitable for manufacturing articles such as flat panel displays (FPDs), semiconductor devices, sensors, and optical elements. The method for manufacturing an article according to this embodiment includes a step of forming a latent image pattern on a photosensitive material coated on a substrate by exposure using the exposure apparatus EX to obtain an exposed substrate (exposure step), and a step of developing the exposed substrate on which the latent image pattern has been formed to obtain a developed substrate (development step). Furthermore, this manufacturing method includes other well-known steps (oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.). The method for manufacturing an article according to this embodiment is advantageous over conventional methods in at least one of the performance, quality, productivity, and production cost of the article.

[0069] While the preferred embodiments of the present invention have been described above, the present invention is not limited to these embodiments and various modifications and changes are possible within the scope of the present invention. In addition, the above-described embodiments may be combined and practiced.

[0070] Furthermore, a computer program that realizes the functions of the above-described embodiments, including part or all of the control in each of the above-described embodiments, may be supplied to the exposure apparatus EX or the like via a network or various storage media. The computer (or CPU, MPU, etc.) in each apparatus may then read and execute the program. In this case, the program and the storage medium on which the program is stored constitute the present invention.

[0071] The disclosure of this embodiment includes the following configurations and methods.

[0072] (Configuration 1) An exposure apparatus that exposes a substrate to light from a light source through an original, a contact mechanism including a contact member that comes into contact with the original or the substrate, The exposure apparatus is characterized in that the contact member is made of fluororubber having nitrogen atoms added to at least the surface that comes into contact with the original or the substrate.

[0073] (Configuration 2) 2. The exposure apparatus according to configuration 1, wherein the contact member is made of fluororubber having the nitrogen atoms added to the surface thereof.

[0074] (Configuration 3) The exposure apparatus according to configuration 1 or 2, characterized in that the difference between the nitrogen content of the fluororubber measured by X-ray photoelectron spectroscopy on the surface of the fluororubber and the nitrogen content of the fluororubber measured by X-ray photoelectron spectroscopy inside the fluororubber is 0.5% or more and 7.5% or less.

[0075] (Configuration 4) The exposure apparatus according to configuration 1 or 2, wherein the difference between the nitrogen content of the fluororubber measured by X-ray photoelectron spectroscopy on the surface of the fluororubber and the nitrogen content of the fluororubber measured by X-ray photoelectron spectroscopy inside the fluororubber is 1.5% or more and 4.5% or less.

[0076] (Configuration 5) 5. The exposure apparatus according to any one of configurations 1 to 4, wherein the fluororubber is foamed fluororubber.

[0077] (Configuration 6) 6. The exposure apparatus according to configuration 5, wherein the foamed fluororubber has an open cell ratio of 50% or less.

[0078] (Configuration 7) 6. The exposure apparatus according to configuration 5, wherein the foamed fluororubber has an open cell ratio of 25% or less.

[0079] (Configuration 8) 6. The exposure apparatus according to configuration 5, wherein the foamed fluororubber has an open cell ratio of 10% or less.

[0080] (Configuration 9) 9. The exposure apparatus according to any one of configurations 1 to 8, wherein the fluororubber contains carbon black.

[0081] (Configuration 10) a pressure control space is formed by the contact mechanism and the master plate; 10. The exposure apparatus according to any one of configurations 1 to 9, further comprising a pressure control mechanism that changes the pressure in the pressure control space so as to control bending of the original due to its own weight.

[0082] (Configuration 11) 11. The exposure apparatus according to any one of configurations 1 to 10, wherein the contact mechanism holds the substrate via the contact member.

[0083] (Configuration 12) 12. The exposure apparatus according to any one of configurations 1 to 11, wherein the original is made of quartz glass.

[0084] (Configuration 13) 13. The exposure apparatus according to any one of configurations 1 to 12, wherein at least the surface of the contact member that comes into contact with the original or the substrate is coated with a positively chargeable material.

[0085] (Configuration 14) 14. The exposure apparatus according to any one of configurations 1 to 13, wherein at least the surface of the contact member that comes into contact with the original or the substrate is surface-treated with an aminosilane coupling agent.

[0086] (Configuration 15) An exposure method for exposing a substrate to light from a light source through an original, comprising: a contact step of bringing a contact member into contact with the original or the substrate, An exposure method, wherein the contact member is made of fluororubber having nitrogen atoms added to at least the surface that comes into contact with the original or the substrate.

[0087] (Configuration 16) an exposure step of exposing a substrate using the exposure apparatus according to any one of configurations 1 to 14 to obtain an exposed substrate; a developing step of developing the exposed substrate to obtain a developed substrate, A method for manufacturing an article, comprising manufacturing an article from the developed substrate. [Explanation of symbols]

[0088] 101 Mask 102 Deflection Control Unit 103 Contact member 104 Control Space 105 Transfer arm 106 Deflection measurement unit 107 Channel 108 Servo valve 109 Control Unit 110 Clamp 111 Light transmission plate 112 slots EX exposure equipment

Claims

1. An exposure apparatus that exposes a substrate to light from a light source through an original, a contact mechanism including a contact member that comes into contact with the original or the substrate, The exposure apparatus is characterized in that the contact member is made of fluororubber having nitrogen atoms added to at least the surface that comes into contact with the original or the substrate.

2. 2. An exposure apparatus according to claim 1, wherein the contact member is made of fluororubber having nitrogen atoms added to a surface thereof.

3. 2. The exposure apparatus according to claim 1, wherein the difference between the nitrogen content of the surface of the fluororubber measured by X-ray photoelectron spectroscopy and the nitrogen content of the interior of the fluororubber measured by X-ray photoelectron spectroscopy is 0.5% or more and 7.5% or less.

4. 2. The exposure apparatus according to claim 1, wherein the difference between the nitrogen content of the surface of the fluororubber as determined by X-ray photoelectron spectroscopy and the nitrogen content of the interior of the fluororubber as determined by X-ray photoelectron spectroscopy is 1.5% or more and 4.5% or less.

5. 2. An exposure apparatus according to claim 1, wherein the fluororubber is a foamed fluororubber.

6. 6. An exposure apparatus according to claim 5, wherein the foamed fluororubber has an open cell ratio of 50% or less.

7. 6. An exposure apparatus according to claim 5, wherein the foamed fluororubber has an open cell ratio of 25% or less.

8. 6. An exposure apparatus according to claim 5, wherein the foamed fluororubber has an open cell rate of 10% or less.

9. 2. An exposure apparatus according to claim 1, wherein the fluororubber contains carbon black.

10. a pressure control space is formed by the contact mechanism and the master plate; 2. An exposure apparatus according to claim 1, further comprising a pressure control mechanism that changes the pressure in the pressure control space so as to control bending of the original due to its own weight.

11. 2. An exposure apparatus according to claim 1, wherein the contact mechanism holds the substrate via the contact member.

12. 2. An exposure apparatus according to claim 1, wherein the original is made of quartz glass.

13. 2. An exposure apparatus according to claim 1, wherein at least a surface of the contact member that comes into contact with the original or the substrate is coated with a positively chargeable material.

14. 2. The exposure apparatus according to claim 1, wherein at least the surface of the contact member that comes into contact with the original or the substrate is surface-treated with an aminosilane coupling agent.

15. An exposure method for exposing a substrate to light from a light source through an original, comprising: a contact step of bringing a contact member into contact with the original or the substrate, An exposure method, wherein the contact member is made of fluororubber having nitrogen atoms added to at least the surface that comes into contact with the original or the substrate.

16. an exposure step of exposing a substrate using the exposure apparatus according to any one of claims 1 to 14 to obtain an exposed substrate; a developing step of developing the exposed substrate to obtain a developed substrate, A method for manufacturing an article, comprising manufacturing an article from the developed substrate.

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