Ultrasonic endoscope

Abstract

To provide an ultrasonic endoscope whose durability can be improved.SOLUTION: An ultrasonic endoscope 12 includes a metal ring 41c configured including metal, an ultrasonic vibrator 48 provided at a tip part 40 of an insertion part 22, and a packing material layer 54 provided between the ultrasonic vibrator 48 and the metal ring 41c. The packing material layer 54 is configured including at least one kind of polyurea resin, epoxy resin having a polyurethane structure, and epoxy resin having a polyether amine structure.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to an ultrasonic endoscope. [Background technology]

[0002] Patent Documents 1, 2, and 3 describe ultrasonic endoscopes including an ultrasonic transducer array in which a plurality of ultrasonic transducers are arranged in a cylindrical shape. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2022-124502 [Patent Document 2] International Publication No. 2018 / 003737 [Patent Document 3] Japanese Patent Publication No. 2022-175241 Summary of the Invention [Problem to be solved by the invention]

[0004] An object of the present disclosure is to provide an ultrasonic endoscope with improved durability. [Means for solving the problem]

[0005] An ultrasonic endoscope according to one embodiment of the disclosed technology comprises a tubular member containing metal, an ultrasonic vibrator arranged along the outer peripheral surface of the tubular member, and a backing material layer arranged between the ultrasonic vibrator and the tubular member, wherein the backing material layer is composed of at least one of a polyurea resin, an epoxy resin having a polyurethane structure, and an epoxy resin having a polyetheramine structure. [Effects of the Invention]

[0006] According to the technology of the present disclosure, durability can be improved. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a schematic diagram showing the configuration of an endoscopic device that uses an ultrasonic endoscope according to one embodiment of the technology of the present disclosure. [Figure 2] FIG. 2 is a partially enlarged perspective view showing the appearance of an example of the tip portion of the ultrasonic endoscope shown in FIG. [Figure 3] 3 is a longitudinal cross-sectional view taken along the axis of the tip portion of the ultrasonic endoscope shown in FIG. [Figure 4] FIG. 4 is a partially enlarged view of FIG. DETAILED DESCRIPTION OF THE INVENTION

[0008] Fig. 1 is a schematic diagram showing an endoscopic device 10 that uses an ultrasonic endoscope 12 according to one embodiment of the disclosed technique. Fig. 2 is a partially enlarged perspective view showing an example of the appearance of the tip of the ultrasonic endoscope 12 shown in Fig. 1. Fig. 3 is a longitudinal cross-sectional view taken along the axis of the tip of the ultrasonic endoscope 12 shown in Fig. 2.

[0009] As shown in FIG. 1, the endoscopic device 10 includes an ultrasonic endoscope 12, an ultrasonic processor device 14 that generates ultrasonic images, an endoscopic processor device 16 that generates endoscopic images, a light source device 18 that supplies illumination light to the ultrasonic endoscope 12 to illuminate the inside of the body cavity, a monitor 20 that displays ultrasonic images, endoscopic images, etc., a water tank 21a that stores cleaning water, etc., and a suction pump 21b that sucks up aspirated material from the body cavity.

[0010] The ultrasonic endoscope 12 has an insertion section 22 that is inserted into the body cavity of the subject, an operation section 24 that is connected to the base end of the insertion section 22 and allows the surgeon to operate it, and a universal cord 26 that has one end connected to the operation section 24.

[0011] An air / water supply button 28a for opening and closing an air / water supply line (not shown) from the water supply tank 21a, and a suction button 28b for opening and closing a suction line (not shown) from the suction pump 21b are arranged side by side on the operation unit 24. The operation unit 24 also has a pair of angle knobs 29 and a treatment tool insertion port 30.

[0012] The other end of the universal cord 26 is provided with an ultrasound connector 32a connected to the ultrasound processor device 14, an endoscope connector 32b connected to the endoscope processor device 16, and a light source connector 32c connected to the light source device 18. The ultrasound endoscope 12 is detachably connected to the ultrasound processor device 14, the endoscope processor device 16, and the light source device 18 via these connectors 32a, 32b, and 32c, respectively. The connector 32c is also provided with an air / water supply tube 34a connected to the water tank 21a and a suction tube 34b connected to the suction pump 21b.

[0013] The insertion section 22 has, in order from the distal end, a distal end section 40 formed of a hard member and having an ultrasound observation section 36 and an endoscopic observation section 38, a bending section 42 connected to the proximal end side of the distal end section 40, and a flexible section 44 connecting the proximal end side of the bending section 42 and the distal end side of the operation section 24. The bending section 42 is made up of multiple bending pieces (angle rings) connected together and is configured to be freely bendable. The flexible section 44 is elongated, slender, and flexible.

[0014] The ultrasonic processor device 14 generates and supplies ultrasonic signals for generating ultrasonic waves to a plurality of ultrasonic transducers 48 of an ultrasonic transmission / reception unit 46 (see FIG. 2) of the ultrasonic observation unit 36, which will be described later. The ultrasonic transducers 48 used in the ultrasonic endoscope 12 preferably have a vibration frequency center frequency of 5 MHz or more and 12 MHz or less. The ultrasonic processor device 14 receives and acquires echo signals reflected from the observation target area to which ultrasonic waves are radiated using the ultrasonic transducers 48, and performs various signal processing on the acquired echo signals to generate an ultrasonic image. The generated ultrasonic image is displayed on the monitor 20.

[0015] The endoscope processor device 16 receives and acquires image signals acquired from the observation target area illuminated by illumination light from the light source device 18 in the endoscopic observation section 38, and performs various signal processing and image processing on the acquired image signals to generate an endoscopic image. The generated endoscopic image is displayed on the monitor 20.

[0016] In order to capture an image of the observation target area in the body cavity using the endoscopic observation section 38 and obtain an image signal, the light source device 18 generates illumination light such as white light or light of a specific wavelength consisting of three primary colors of light, such as red light, green light, and blue light, and propagates this illumination light through a light guide (not shown) within the ultrasonic endoscope 12 and emits it from the endoscopic observation section 38 to illuminate the observation target area in the body cavity.

[0017] Next, the configuration of the distal end portion 40 will be described with reference to Figures 2 and 3. Figure 3 shows a distal direction F, which extends from the base end to the distal end, and a proximal direction B, which extends from the distal end to the base end, as directions in the insertion portion 22 of the ultrasonic endoscope 12. The distal direction F and the proximal direction B are also referred to as the axial directions of the insertion portion 22. Figure 3 also shows an upward direction U and a downward direction D, which is the opposite direction to the upward direction U, as radial directions of the insertion portion 22 (directions perpendicular to the axial direction).

[0018] As shown in FIG. 2, the tip 40 of the ultrasonic endoscope 12 is provided with an ultrasonic observation section 36 on the base end side for acquiring ultrasonic images, and an endoscopic observation section 38 on the tip end side for acquiring endoscopic images.

[0019] The distal end portion 40 of the ultrasonic endoscope 12 includes a cap-shaped distal end part 41a that covers the distal end of the endoscopic observation section 38, a cylindrical proximal end ring 41b that is disposed on the proximal end of the proximal ultrasonic observation section 36, and a metal ring 41c (see FIG. 3). The distal end part 41a and the proximal end ring 41b are made of a hard material such as hard resin and serve as exterior members. The metal ring 41c is disposed inside the exterior member. The metal ring 41c is a cylindrical member made of a metal such as SUS (stainless steel) or aluminum, and is preferably cylindrical. The metal ring 41c does not need to be completely cylindrical and may have a partial notch.

[0020] The endoscope observation section 38 includes a treatment tool outlet 76, an observation window 78, an illumination window 80, a cleaning nozzle 82, and the like, which are provided on the distal end surface.

[0021] The ultrasonic observation section 36 is composed of an ultrasonic transmission / reception unit 46 supported on the outer peripheral surface of the metal ring 41c. The ultrasonic transmission / reception unit 46 includes a plurality of ultrasonic transducers 48 arranged along the outer peripheral surface of the metal ring 41c, a backing material layer 54 provided between the plurality of ultrasonic transducers 48 and the metal ring 41c, an intermediate layer 53 provided between the backing material layer 54 and the metal ring 41c, an electrode unit 52 including individual electrodes 52a corresponding to the plurality of ultrasonic transducers 48 and a common electrode 52b common to the plurality of ultrasonic transducers 48, a flexible printed circuit board 56 to which each individual electrode 52a is connected, a substantially cylindrical acoustic matching layer 64 laminated on the plurality of ultrasonic transducers 48, and a substantially cylindrical acoustic lens 66 laminated on the acoustic matching layer 64.

[0022] As shown in FIG. 2, the ultrasonic transducer 48 is a multi-channel, for example, 48 to 192 channel (CH) array consisting of a plurality of, for example, 48 to 192 rectangular parallelepiped ultrasonic transducers 48 arranged in a cylindrical shape.

[0023] In the ultrasonic transmitting / receiving unit 46, a plurality of ultrasonic transducers 48 are arranged at a predetermined pitch in the circumferential direction as shown in the illustrated example, for example. In this way, the ultrasonic transducers 48 constituting the ultrasonic transmitting / receiving unit 46 are arranged at equal intervals in a cylindrical shape centered on the axis of the tip portion 40. Furthermore, the ultrasonic transducers 48 are sequentially driven based on drive signals input from the ultrasonic processor device 14. As a result, radial electronic scanning is performed over the range in which the ultrasonic transducers 48 are arranged as the scanning range.

[0024] The backing material layer 54 is made of a layer of a member made of a backing material. The backing material layer 54 mechanically and flexibly supports the ultrasonic transducers 48, and also serves to attenuate ultrasonic waves that are transmitted to the backing material layer 54 side among ultrasonic signals that are emitted from the ultrasonic transducers 48 or that are reflected from the object of observation and propagate.

[0025] 3, the flexible printed circuit board 56 attached to the side surface on the base end side of the backing material layer 54 is electrically connected to each individual electrode 52a of the electrode unit 52 on one hand, and is wired and connected to the multiple coaxial cables 58 of the signal line bundle 72 on the other hand. In this way, the individual electrodes 52a of the ultrasonic transducers 48 are electrically connected to the coaxial cables 58, and each ultrasonic transducer 48 is electrically connected to the signal line bundle 72.

[0026] The ultrasonic endoscope 12 includes a bracket 120 that supports the signal wire bundle 72 at the tip portion 40 and extends along the signal wire bundle 72 , and a bracket support member 110 that supports the bracket 120 .

[0027] At least one of the bracket 120 and the bracket support member 110 is preferably made of metal. By using a metal, the thickness can be reduced. Examples of metal materials include stainless steel and aluminum. It is preferable that both the bracket 120 and the bracket support member 110 are made of metal.

[0028] The acoustic lens 66, together with the distal end part 41a and the proximal ring 41b, constitutes the exterior of the distal end portion 40. A portion of the metal ring 41c distal to the ultrasonic transmitter / receiver unit 46 is fixed to the inside of the distal end part 41a by fitting or the like. A portion of the metal ring 41c proximal to the ultrasonic transmitter / receiver unit 46 is disposed inside the proximal ring 41b with a gap formed between it and the inner circumferential surface of the proximal ring 41b.

[0029] In this way, the distal end part 41a and the proximal ring 41b constitute a housing portion that houses the metal ring 41c. As shown in the enlarged view of FIG. 4, a filler 55 is filled around the proximal portion of the metal ring 41c, for example, between the outer peripheral surface of the proximal portion of the metal ring 41c and the inner peripheral surface of the proximal ring 41b. The filler 55 is provided to limit the movement of the contents inside the proximal ring 41b and to prevent damage to the contents. The filler 55 can be made of a material such as epoxy resin, silicone resin, urethane resin, or urea resin.

[0030] The filler 55 preferably has a viscosity of less than 100 Pa·sec in an uncured state at a shear rate of 0.01 / sec. This prevents the filler 55 from penetrating into areas of the distal end portion 40 that are not intended for filling when the filler 55 is being filled into the proximal ring 41b. To achieve the above-described shear rate, for example, the filler 55 may be made of a resin-based material containing a thixotropic agent such as fumed silica as an additive. The inclusion of a thixotropic agent improves the thixotropic properties, thereby increasing the viscosity of the filler before curing. The thixotropic properties are preferably less than 100 Pa·sec, and more preferably less than 20 Pa·sec, at a shear rate of 10 / sec.

[0031] The backing material layer 54 reduces stress when a thermal load is applied to the ultrasonic endoscope 12, thereby preventing cracks and improving durability. Specifically, the backing material layer 54 contains at least one of a polyurea resin, an epoxy resin having a polyurethane structure, and an epoxy resin having a polyetheramine structure, thereby sufficiently reducing stress when a thermal load is applied. The resin contained in the backing material layer 54 preferably contains a polyurea resin from the viewpoint of further improving processability.

[0032] The resin contained in the backing material layer 54 preferably has a loss tangent of 0.06 or more in the temperature range of 0 to 50°C and a loss tangent of less than 1.50 in the temperature range of -20 to 110°C. When the content of the resin in the backing material layer 54 is 25 to 50% by volume, the storage modulus of the backing material layer 54 in the temperature range of 0 to 50°C is preferably 1000 MPa or more. The thickness of the backing material layer 54 used in the ultrasonic endoscope 12 is preferably 0.5 mm or more and 1.5 mm or less.

[0033] Preferred resins contained in the backing material layer 54 are described in detail below.

[0034] [Polyurea resin] The polyurea resin can be obtained by reacting a polyisocyanate compound with a polyamine compound. The polyisocyanate compound can be used without any particular limitation as long as it is a polyisocyanate compound having two or more isocyanate groups. The polyisocyanate compound may be either an aliphatic isocyanate compound (a compound in which an isocyanato group is bonded to an aliphatic chain or an aliphatic ring) or an aromatic isocyanate compound (a compound in which an isocyanato group is bonded to an aromatic ring), or a mixture thereof. The polyisocyanate compound may have a ring structure. The polyisocyanate compound is preferably an aliphatic polyisocyanate compound in terms of low reactivity and long pot life when producing a cured product, and preferably contains an aliphatic polyisocyanate compound having an aromatic ring and an aromatic polyisocyanate compound in terms of further improving ultrasonic attenuation. The polyamine compound can be any polyamine compound having two or more amino groups, and is preferably a polyamine compound commonly used as a curing agent for epoxy resins. The polyamine compound may be either an aliphatic polyamine compound (a chain aliphatic polyamine compound in which an amino group is bonded to an aliphatic chain, or a cyclic aliphatic polyamine compound in which an amino group is bonded to an aliphatic ring) or an aromatic polyamine compound (a compound in which an amino group is bonded to an aromatic ring), or a mixture thereof. Aliphatic polyamine compounds are preferred because of their excellent reactivity. The polyamine compound may have a cyclic structure. In addition to nitrogen atoms, it may also contain heteroatoms such as oxygen atoms. From the viewpoint of further improving ultrasonic attenuation and processability, the polyamine compound preferably contains an aliphatic polyamine compound having an aromatic ring and a chain aliphatic polyamine compound not having an aromatic ring.

[0035] [Epoxy resin with polyurethane structure] The epoxy resin having a polyurethane structure can be used without any particular limitation, so long as it is an epoxy resin having a polyurethane structure and an epoxy group. Commercially available epoxy resins having a polyurethane structure typically have a number-average molecular weight of 200 to 20,000. The viscosity of the epoxy resin having a polyurethane structure at 25°C is not particularly limited, but is preferably 200 to 200,000 mPa·s, and more preferably 600 to 30,000 mPa·s. The viscosity is measured at 25°C and a shear rate of 0.01 mPa·s. Although polyamines or acid anhydrides can be used as curing agents for reacting with epoxy resins having a polyurethane structure, it is preferable to use polyamines as curing agents. The polyamine compound to be reacted with epoxy resins having a polyurethane structure can be any polyamine compound having two or more amino groups without any particular limitation, and polyamine compounds generally used as curing agents for epoxy resins are preferably used.

[0036] [Epoxy resin with polyetheramine structure] The epoxy resin having a polyetheramine structure is a reaction cured product of an epoxy resin and a polyamine compound having two or more amino groups, and can be used without any particular limitation as long as it has a polyether structure. An epoxy resin having a polyetheramine structure can be obtained by either a reaction between an epoxy resin having a polyether structure and a polyamine compound not having a polyether structure, a reaction between an epoxy resin not having a polyether structure and a polyamine compound having a polyether structure, or a reaction between an epoxy resin having a polyether structure and a polyamine compound having a polyether structure. The polyether structure possessed by the reaction cured product obtained in this manner is generally a polyether structure having a number average molecular weight of 200 to 6,000. Among these, a reaction cured product of an epoxy resin having a polyether structure and a polyamine compound having no polyether structure, or a reaction cured product of an epoxy resin having no polyether structure and a polyamine compound having a polyether structure is preferred, and from the viewpoint of exhibiting a more preferable viscosity as a curable resin composition, a reaction cured product of an epoxy resin having no polyether structure and a polyamine compound having a polyether structure is more preferred. Commercially available epoxy resins having a polyether structure are generally, for example, epoxy resins having a polyether structure with a number average molecular weight of 200 to 6000, and specific examples thereof include the following, with those having a bisphenol structure being preferred in terms of excellent mechanical strength. Examples of epoxy resins having a polyether structure include bisphenol A epoxy resins, bisphenol F epoxy resins, bisphenol E epoxy resins, and novolac epoxy resins. Bisphenol A epoxy resins are preferred in terms of excellent mechanical strength of the cured product. The polyamine compound having a polyether structure can be used without any particular limitation as long as it is a polyamine compound having two or more amino groups, and polyamine compounds generally used as curing agents for epoxy resins are preferably used. Commercially available polyamine compounds having a polyether structure are generally, for example, polyamine compounds having a polyether structure with a number average molecular weight of 200 to 6000.

[0037] [Resin content in backing material layer] The resin content in the backing material layer 54 is 25 to 50% by volume, and preferably 30 to 50% by volume. The content of at least one reaction cured product of the polyurea resin, epoxy resin having a polyurethane structure, and epoxy resin having a polyetheramine structure in the resin contained in the backing material layer 54 is not particularly limited as long as the effects of the technology of the present disclosure are achieved, and can be, for example, 15% by volume or more, preferably 20% by volume or more, more preferably 30% by volume or more, even more preferably 50% by volume or more, and particularly preferably 70% by volume or more. It is also preferable that all of the resins contained in the backing material layer 54 are composed of at least one of the polyurea resin, epoxy resin having a polyurethane structure, and epoxy resin having a polyetheramine structure.

[0038] The backing material layer 54 preferably contains at least one of a polyurea resin, an epoxy resin having a polyurethane structure, and an epoxy resin having a polyetheramine structure as a base material, and also contains a heat-dissipating filler. The backing material layer 54 can increase its thermal conductivity by including thermally conductive particles as a heat-dissipating filler. Increasing the thermal conductivity of the backing material layer 54 allows heat generated in the ultrasonic transmitter / receiver 46 to be transferred to a heat-dissipating structure (not shown), preventing heat accumulation in the tip 40. This reduces the thermal load on the backing material layer 54 and further reduces stress caused by the thermal load. Furthermore, even if the difference between the thermal expansion coefficient of the base material of the backing material layer 54 and the thermal expansion coefficient of the metal ring 41c is somewhat large, the heat dissipation of the heat-dissipating filler can reduce stress on the base material.

[0039] The thermally conductive particles may be either inorganic or organic, as long as they are thermally conductive. To enhance the thermal conductivity of the backing material layer 54, the thermal conductivity per unit weight is preferably 30 W / m·K or higher, and more preferably 60 W / m·K or higher. Because the ultrasonic endoscope 12 is inserted into the body, the thermally conductive particles are preferably made of a safe material that is non-toxic and stable in the operating environment, such as hygroscopicity. Furthermore, to enhance attenuation, a high density is preferable, and because the particles are placed near the circuit, a material with low or no electrical conductivity is preferred to avoid short-circuit failures. There are no particular limitations on the shape of the thermally conductive particles, and various shapes such as amorphous, spherical, fibrous, branched fibrous, and flat are used. A spherical shape is preferred because it can increase the filling rate. An anisotropic shape such as a fibrous or flat shape is preferred because it can increase particle contact and improve heat dissipation. Irregular particles are preferred because they can randomly reflect ultrasonic waves, thereby improving the ultrasonic attenuation of the backing material layer 54.

[0040] Examples of thermally conductive particles include aluminum oxide, tungsten oxide, silicon carbide, tungsten carbide, aluminum nitride, silicon nitride, boron nitride, and aluminum nitride. Nitrides are particularly preferred from the viewpoint of high thermal conductivity and high insulating properties. The thermally conductive particles may contain one or more of these thermally conductive materials. The surfaces of the thermally conductive particles may be surface-treated to facilitate dispersion in the resin.

[0041] The particle size of the thermally conductive particles is not particularly limited. From the viewpoint of maintaining a high mechanical strength of the backing material layer 54 while keeping the viscosity of the curable resin composition contained in the backing material layer 54 low, the particle size of the thermally conductive particles is, for example, preferably 1 to 300 μm, more preferably 5 to 100 μm, and even more preferably 8 to 30 μm. The "particle size" of the thermally conductive particles is the number average particle size.

[0042] The proportion of thermally conductive particles in the total amount of components other than the resin in the backing material layer 54 is preferably 50% by volume or more, more preferably 60% by volume or more, and even more preferably 65% ​​by volume or more. It is also preferable that all components other than the resin in the backing material layer 54 are thermally conductive particles. The content of thermally conductive particles in the backing material layer 54 is, for example, preferably 30 to 60% by volume, more preferably 30 to 55% by volume, and even more preferably 30 to 50% by volume.

[0043] The backing material layer 54 may contain other components in addition to the above-mentioned resin and thermally conductive particles. The other components may include hollow particles. The inclusion of hollow particles can further improve ultrasonic attenuation. As the hollow particles, any hollow particles commonly used to exhibit the effect of improving acoustic wave attenuation or ultrasonic wave attenuation can be used without any particular limitation. Either hollow glass particles or hollow resin particles may be used, with hollow resin particles being preferred.

[0044] Preferred examples of hollow particles include glass balloons, hollow silica, senolite, phenolic resin microballoons, urea resin microballoons, polymethyl methacrylate balloons, and thermally expandable microcapsules. The hollow particles may be used singly or in combination of two or more types. In this specification, the content of hollow particles refers to the total amount when two or more types of hollow particles are used.

[0045] The particle size of the hollow particles is not particularly limited. From the viewpoint of maintaining high mechanical strength of the backing material layer 54 while keeping the viscosity of the curable resin composition low, the particle size of the hollow particles is, for example, preferably 1 to 300 μm, more preferably 5 to 100 μm, and even more preferably 20 to 80 μm. The "particle size" of the hollow particles is synonymous with the "particle size" of the thermally conductive particles described above. In other words, the "particle size" of the hollow particles is the number average particle size.

[0046] The other components may include a dispersant, a diluent, a colorant, a viscosity modifier, a plasticizer, a hardening accelerator, etc. The content of the other components in the backing material layer 54 may be, for example, 10 to 20% by volume.

[0047] A preferred embodiment of the backing material layer 54 includes, for example, a resin containing at least one of a polyurea resin, an epoxy resin having a polyurethane structure, and an epoxy resin having a polyetheramine structure, and thermally conductive particles, the resin having the specific loss tangent and storage modulus described above, and the hollow particles. In this embodiment, the content of each component in the backing material layer 54 is 25 to 50 volume %, preferably 30 to 50 volume % for the resin. The content of the thermally conductive particles is preferably 30 to 60 volume %, more preferably 30 to 55 volume %, and even more preferably 30 to 50 volume %. The content of the hollow particles is preferably 10 to 20 volume %.

[0048] The backing material layer 54 is preferably formed using a curable resin composition. The curable resin composition contains the thermally conductive particles described above and, as a resin component, any one of a combination of a polyisocyanate compound and a polyamine compound, a combination of an epoxy resin having a polyurethane structure and a polyamine compound, and a combination of an epoxy resin and a polyamine compound, wherein at least one of the epoxy resin and the polyamine compound has a polyether structure.

[0049] <Method for manufacturing backing material layer> The curable resin composition constituting the backing material layer 54 can be prepared by a conventional method. For example, the curable resin composition can be obtained by kneading the above-mentioned thermally conductive particles and a resin component containing at least one of a polyurea resin, an epoxy resin having a polyurethane structure, and an epoxy resin having a polyetheramine structure, as well as other components as appropriate, using a kneading device such as a planetary rotation / revolution device, a kneader, a pressure kneader, a Banbury mixer (continuous kneader), or a two-roll mill. The order in which the components are mixed is not particularly limited. The kneading conditions are not particularly limited as long as the thermally conductive particles are dispersed in the resin component.

[0050] The curable resin composition thus obtained can be cured to obtain the backing material layer 54. The curing conditions can be adjusted depending on the chemical reaction of the resin components contained in the curable resin composition, and for example, the backing material layer 54 can be obtained by heat curing at a specific temperature for a certain period of time.

[0051] The shape of backing material layer 54 is not particularly limited, and for example, a shape suitable for the backing material layer may be formed using a mold during the curing process, or a sheet-like backing material may be obtained and then cut by dicing or the like to form the desired backing material layer. Note that, because backing material layer 54 of the present disclosure has excellent processability, the desired backing material layer can be produced while suppressing deformation, breakage, and the like, even when dicing into the desired shape at a pitch on the order of μm.

[0052] Intermediate layer 53 is provided to prevent ions generated from the metal contained in metal ring 41c from coming into contact with backing material layer 54. Metal ring 41c generates ions due to hydrogen peroxide gas used for sterilization purposes that can cause deterioration of backing material layer 54, which is made of the materials described above. The presence of intermediate layer 53 prevents these ions from reaching backing material layer 54, thereby preventing deterioration of backing material layer 54.

[0053] The intermediate layer 53 is preferably thin to allow the diameter of the tip portion 40 to be reduced. For example, the intermediate layer 53 is preferably formed by coating the outer surface of the metal ring 41c with a material by application or pasting, or by surface treating the outer surface of the metal ring 41c. Examples of the intermediate layer 53 that can be used include a tape made of a polyimide film base coated with a heat-resistant silicone adhesive, a DLC (Diamond-Like Carbon) coating, a silicon coating, a parylene coating, and Abel Black (registered trademark). The intermediate layer 53 is more preferably made of a material with high voltage resistance. Furthermore, providing the intermediate layer 53 on the end surface of the backing material layer 54 in the axial direction can further suppress the arrival of ions at the backing material layer 54.

[0054] The metal ring 41c and the backing material layer 54 are fixed to each other via an intermediate layer 53. Specifically, an adhesive is applied to the surface of the intermediate layer 53, which is formed on the outer surface of the metal ring 41c by coating or the like, and this adhesive bonds the intermediate layer 53 to the backing material layer 54. By fixing the metal ring 41c to the backing material layer 54 to each other via the intermediate layer 53 in this way, it is possible to reduce the stress applied to the backing material layer 54 even if there is a large difference in the thermal expansion coefficient between the metal ring 41c and the backing material layer 54.

[0055] A balloon (not shown) that covers the ultrasonic observation unit 36 ​​and is filled with an ultrasonic wave transmission medium (for example, water, oil, etc.) may be detachably attached to the tip portion 40.

[0056] 3, an observation system unit 85 is disposed at the distal end portion 40 behind (on the proximal end side of) the observation window 78. The observation system unit 85 includes, for example, an objective lens 86, a prism 88, an imaging element 90, a substrate 92, and a signal cable 94. The distal end portion of the observation system unit 85 is inserted into the metal ring 41c. The observation system unit 85 constitutes an imaging module.

[0057] Light reflected from the observation target area and incident through the observation window 78 is captured by the objective lens 86. The optical path of the captured reflected light is bent at a right angle by the prism 88, and an image is formed on the imaging surface of the imaging element 90. The imaging element 90 photoelectrically converts the reflected light from the observation target area that has been transmitted through the observation window 78, the objective lens 86, and the prism 88 and formed on the imaging surface, and outputs an image signal.

[0058] The imaging element 90 is mounted on a substrate 92. A circuit pattern (not shown) electrically connected to the imaging element 90 is formed on the substrate 92. The circuit pattern has a plurality of electrodes at its end, and a plurality of signal cables 94 are connected to the plurality of electrodes, respectively. The plurality of signal cables 94 are connected to a connector 32b for the endoscope (see FIG. 1). The connector 32b for the endoscope is connected to the endoscope processor device 16.

[0059] The exit end of a light guide 98 is connected to the illumination window 80 (see FIG. 2). The entrance end of the light guide 98 is connected to the light source device 18 via the universal cord 26. Illumination light emitted from the light source device 18 travels through the light guide 98 and is irradiated onto the area to be observed from the illumination window 80.

[0060] In order to clean the surfaces of the observation window 78 and the illumination window 80, the cleaning nozzle 82 sprays air or cleaning water from the water supply tank 21a toward the observation window 78 and the illumination window 80 via the air / water supply channel 100 inside the ultrasonic endoscope 12. A treatment instrument channel 84 is connected to the treatment instrument outlet 76. [Example]

[0061] Examples of the backing material layer 54 of the technology of the present disclosure will be described below, but the backing material layer 54 should not be construed as being limited by these results.

[0062] <1> Preparation of the backing layer composition A composition for a backing material layer (curable resin composition) having the following formulation was prepared.

[0063] (Polyurea resin) A composition for the backing material layer was prepared by mixing 45 parts of a resin composition prepared by mixing 2.5 parts of metaxylene diisocyanate (Tokyo Chemical Industry Co., Ltd.) as the polyisocyanate, 2 parts of Elasmer 250P (Kumiai Chemical Co., Ltd.) and 8 parts of Elasmer 250P (Kumiai Chemical Co., Ltd.) as the polyamine, 25 parts of tungsten carbide particles (WC-100S (manufactured by Allied Materials Corporation)) and 15 parts of silicon carbide particles (SSC-A15 (manufactured by Shinano Electric Refining Co., Ltd.)) as the thermally conductive particles.

[0064] (Epoxy resin with polyurethane structure) A composition for the backing material layer was prepared by mixing 10 parts of ADEKA Resin EPU-11F (ADEKA Corporation) as an epoxy resin having a polyurethane structure, 45 parts of a resin composition obtained by mixing 0.6 parts of 2,2,4-trimethylhexamethylenediamine (Tokyo Chemical Industry Co., Ltd.) and 1.0 parts of Gasgamine-328 (Mitsubishi Gas Chemical Company, Inc.) as polyamines, 25 parts of tungsten carbide particles (WC-100S (manufactured by A.L.M.T. Corporation)) as thermally conductive particles, and 15 parts of silicon carbide particles (SSC-A15 (manufactured by Shinano Electric Refining Co., Ltd.)).

[0065] (Epoxy resin with polyetheramine structure) A composition for the backing material layer was prepared by mixing 10 parts of jER828 (Mitsubishi Chemical Corporation) as a bisphenol A type epoxy resin, 45 parts of a resin composition prepared by mixing 4.5 parts of JEFFAMINE D400 (Huntsman Corporation) and 6.0 parts of JEFFAMINE D400 (Huntsman Corporation) as a bifunctional polyether polyamine, 25 parts of tungsten carbide particles (WC-100S (manufactured by Allied Materials Corporation)) as thermally conductive particles, and 15 parts of silicon carbide particles (SSC-A15 (manufactured by Shinano Electric Refining Co., Ltd.)).

[0066] <2> Fabrication, measurement, and evaluation of backing material sheets The backing material layer composition prepared above was poured into a square mold with a side length of 30 mm and the desired depth, and cured by heating at 80°C for 18 hours and then at 150°C for 1 hour to produce a square backing material sheet with a side length of 30 mm and the desired thickness. The depth of the mold used and the thickness of the resulting sheet were 2 mm or 0.5 mm, respectively. The following measurements and evaluations were performed on this backing material sheet.

[0067] (1) Measurement of thermal conductivity Test pieces were prepared by cutting a 0.5 mm thick square backing material sheet into 5 mm wide strips. These test pieces were measured using the laser flash method in accordance with JIS (Japanese Industrial Standards) R 1611. Test pieces made from any of the backing material layer compositions showed a good value of 1.0 W / m K.

[0068] (2) Measurement of attenuation rate Based on the method described in JIS (Japanese Industrial Standards) Z 2354 (2012), Methods for Measuring Ultrasonic Attenuation Coefficients of Solids, the intensity of the reflected echo was measured using a sing-around sound velocity measuring device (manufactured by Ultrasonic Industries, product name "UVM-2 Model"). The measurement was performed in water at 25°C using a 2 MHz measurement probe, and the attenuation rate was calculated from the difference in the intensity of the reflected echo with and without the test specimen used in the sound velocity measurement, and the thickness of the test specimen. All test specimens made from the backing material layer composition showed good attenuation rates exceeding 4.0 dB / mm MHz.

[0069] The above results indicate that polyurea resin, epoxy resin with a polyurethane structure, or epoxy resin with a polyetheramine structure exhibits good thermal conductivity and attenuation rate, making them suitable materials for the backing layer of ultrasonic endoscopes.

[0070] In the ultrasonic endoscope 12, the imaging module passes through the inside of the metal ring 41c, and the endoscopic observation unit 38 is located closer to the distal end than the ultrasonic observation unit 36, but this is not limiting. For example, the endoscopic observation unit 38 may be located closer to the proximal end than the ultrasonic observation unit 36, and an image of the area in front of the distal end unit 40 may be captured from the side of the distal end unit 40.

[0071] As explained above, this specification describes at least the following:

[0072] (1) a cylindrical member containing a metal; an ultrasonic vibrator provided along the outer circumferential surface of the cylindrical member; a backing material layer provided between the ultrasonic transducer and the cylindrical member, The backing material layer is an ultrasonic endoscope containing at least one of a polyurea resin, an epoxy resin having a polyurethane structure, and an epoxy resin having a polyetheramine structure.

[0073] (2) The ultrasonic endoscope according to (1), The backing material layer is configured to contain a heat dissipating filler.

[0074] (3) The ultrasonic endoscope according to (2), The thermal conductivity of the heat dissipation filler is 30 W / m·K or more.

[0075] (4) The ultrasonic endoscope according to (3), The heat dissipation filler includes at least one of aluminum oxide, tungsten oxide, silicon carbide, tungsten carbide, aluminum nitride, silicon nitride, boron nitride, and aluminum nitride.

[0076] (5) An ultrasonic endoscope according to any one of (1) to (4), The ultrasonic endoscope, wherein the cylindrical member and the backing material layer are fixed to each other via an intermediate layer.

[0077] (6) (5) An ultrasonic endoscope according to the present invention, The intermediate layer prevents ions generated from the metal contained in the cylindrical member from coming into contact with the backing material layer.

[0078] (7) (6) The ultrasonic endoscope according to (6), The backing material layer is fixed to the intermediate layer formed on the outer peripheral surface of the cylindrical member.

[0079] (8) An ultrasonic endoscope according to any one of (1) to (7), a housing portion that houses the cylindrical member; a filler filled around the cylindrical member in the storage portion, The filler has a viscosity of less than 100 Pa·sec at a shear rate of 0.01 / s in an uncured state.

[0080] (9) (8) An ultrasonic endoscope according to the present invention, The filler is an ultrasonic endoscope having a resin base and containing a thixotropic agent.

[0081] (10) (9) The ultrasonic endoscope according to (9), The ultrasonic endoscope, wherein the thixotropic agent contains fumed silica.

[0082] (11) An ultrasonic endoscope according to any one of (1) to (10), The thickness of the backing material layer is 0.5 mm or more and 1.5 mm or less.

[0083] (12) An ultrasonic endoscope according to any one of (1) to (11), The ultrasonic endoscope has a vibration frequency of the ultrasonic vibrator with a center frequency of 5 MHz or more and 12 MHz or less.

[0084] (13) An ultrasonic endoscope according to any one of (1) to (12), an imaging module including an imaging element; The imaging module is inserted into the cylindrical member of the ultrasonic endoscope. [Explanation of symbols]

[0085] 10 Endoscopic device 12 Endoscopic Ultrasound 14 Ultrasonic processor 16. Endoscope processor unit 18 Light source device 20 monitors 21a Water tank 21b Suction pump 22 Insertion section 24 Control section 26 Universal Code 28a Air and water supply button 28b Suction button 29 Angle knob 30 Treatment tool insertion port 32a, 32b, 32c connectors 34a Air and water supply tube 34b Suction tube 36 Ultrasound Observation Department 38 Endoscopic observation section 40 Tip 41a Tip parts 41b Base end ring 41c Metal Ring 42 Curved section 44 Soft part 46 Ultrasonic transmitter / receiver 48 Ultrasonic transducer 52a Individual electrode 52b Common electrode 52 Electrode section 53 Middle Class 54 Backing material layer 55 Filler 56 Flexible Printed Circuit Board 58 Coaxial Cable 64 Acoustic matching layer 66 Acoustic Lens 72 Signal line bundle 76 Treatment tool outlet 78 Observation window 80 Lighting window 82 Cleaning nozzle 85 Observation Unit 86 Objective Lens 88 Prism 90 Image sensor 92 PCB 94 Signal Cable 98 Light Guide 100 air and water supply channels 110 Bracket support member 120 bracket

Claims

1. a cylindrical member containing a metal; an ultrasonic vibrator provided along the outer circumferential surface of the cylindrical member; a backing material layer provided between the ultrasonic transducer and the cylindrical member, The backing material layer is made of at least one of a polyurea resin, an epoxy resin having a polyurethane structure, and an epoxy resin having a polyetheramine structure.

2. The ultrasonic endoscope according to claim 1, The backing material layer is configured to contain a heat dissipation filler.

3. The ultrasonic endoscope according to claim 2, The thermal conductivity of the heat dissipation filler is 30 W / m·K or more.

4. The ultrasonic endoscope according to claim 3, The heat dissipation filler includes at least one of aluminum oxide, tungsten oxide, silicon carbide, tungsten carbide, aluminum nitride, silicon nitride, boron nitride, and aluminum nitride.

5. The ultrasonic endoscope according to any one of claims 1 to 4, The ultrasonic endoscope, wherein the tubular member and the backing material layer are fixed to each other via an intermediate layer.

6. The ultrasonic endoscope according to claim 5, The intermediate layer prevents ions generated from the metal contained in the tubular member from coming into contact with the backing material layer.

7. The ultrasonic endoscope according to claim 6, The backing material layer is fixed to the intermediate layer formed on the outer peripheral surface of the tubular member.

8. The ultrasonic endoscope according to any one of claims 1 to 4, a housing portion that houses the cylindrical member; a filler filled around the cylindrical member in the storage portion, The filler has a viscosity of less than 100 Pa·sec at a shear rate of 0.01 / s in an unhardened state.

9. The ultrasonic endoscope according to claim 8, The filler is an ultrasonic endoscope having a resin base and containing a thixotropic agent.

10. The ultrasonic endoscope according to claim 9, The ultrasonic endoscope, wherein the thixotropic agent contains fumed silica.

11. The ultrasonic endoscope according to any one of claims 1 to 4, The thickness of the backing material layer is 0.5 mm or more and 1.5 mm or less.

12. The ultrasonic endoscope according to claim 11, The ultrasonic endoscope has a vibration frequency of the ultrasonic vibrator with a center frequency of 5 MHz or more and 12 MHz or less.

13. The ultrasonic endoscope according to any one of claims 1 to 4, an imaging module including an imaging element; The imaging module is inserted into the cylindrical member of the ultrasonic endoscope.

Images