Fixing structure for electronic component

Abstract

To provide a fixing structure for an electronic component capable of improving vibration resistance by reducing warpage of a substrate even in a case where a mounting area of the electronic component is large.SOLUTION: A fixing structure for an electronic component 80 includes: a base; a substrate 20 which is fixed to the base by a plurality of fixing parts 21; and the electronic component 80 including a first face and a second face, which are parallel with each other, and held between the base and the substrate 20 by fixing the first face to the base and fixing a terminal 84, which is disposed on the second face, to the substrate 20. In a view in a direction vertical to a surface of the substrate 20, when a first virtual line V1 is set which connects the two fixing parts 21 between which the distance is longest with the electronic component 80 interposed therebetween, in the plurality of fixing parts 21 disposed around the electronic component 80 and within a predetermined distance from the electronic component 80, the terminal 84 includes a portion which takes a posture in parallel with the first virtual line V1.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present disclosure relates to a fixing structure for an electronic component. [Background technology]

[0002] In recent years, automobiles equipped with motors as a driving source (such as hybrid electric vehicles (HEVs), plug-in hybrid electric vehicles (PHEVs), battery electric vehicles (BEVs), and fuel cell electric vehicles (FCEVs)) have become widespread. These automobiles use vehicle drive systems that incorporate a driving motor, a power supply module, an inverter, and the like. In the vehicle drive system, various electronic components, including a coil module, are fixed to a base.

[0003] Patent Document 1 discloses a circuit assembly including a substrate (printed circuit board in Patent Document 1) on which electronic components (coils in Patent Document 1) are mounted, a heat sink, and a heat spreader. In the circuit assembly of Patent Document 1, the circuit board is fixed to the heat spreader with an insulating adhesive layer, and the heat spreader is fixed to the heat sink with fixing holes and bolts provided in the heat sink. This suppresses warping of the circuit board. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 2017-055616 Summary of the Invention [Problem to be solved by the invention]

[0005] When a substrate on which electronic components are mounted is fixed to a base with the electronic components facing the base, the substrate may be placed on the top surfaces of support posts extending from the base surface and secured to the base by fastening bolts or the like that penetrate the substrate to the support posts. The more support posts there are, the more firmly the substrate is secured to the base, reducing warpage and improving vibration resistance. However, when the mounting area of ​​electronic components is large, the number of support posts cannot be increased, resulting in a problem of increased warpage of the substrate and reduced vibration resistance. This problem is particularly exacerbated by the fact that support posts can only be placed around the electronic components where the electronic components are mounted, leaving room for improvement. Furthermore, providing a heat spreader plate, as in the circuit assembly disclosed in Patent Document 1, not only increases the number of components, but also leaves room for improvement because the mounting space for the heat spreader cannot be secured when the mounting area of ​​electronic components is large.

[0006] Therefore, there is a demand for a fixing structure for electronic components that can reduce warpage of the board and improve vibration resistance even when the mounting area of ​​the electronic components is large. [Means for solving the problem]

[0007] One embodiment of the fixing structure for an electronic component according to the present disclosure comprises a base, a substrate fixed to the base by a plurality of fixing portions, and an electronic component having a first surface and a second surface parallel to each other, the first surface being fixed to the base and terminals arranged on the second surface being fixed to the substrate, such that the electronic component is sandwiched between the base and the substrate; when viewed along a direction perpendicular to the surface of the substrate, when a first virtual line is set connecting two of the fixing portions arranged around the electronic component within a predetermined distance from the electronic component and the fixing portions are arranged at the greatest distance from each other, the terminals have portions that are parallel to the first virtual line.

[0008] The warpage of the board is relatively greatest between the two fixing portions that sandwich the electronic component at the greatest distance. However, according to the embodiment, the terminals of the electronic component have portions that are parallel to a first imaginary line that connects the two fixing portions that sandwich the electronic component at the greatest distance. This allows the parallel portions of the terminals to serve as fixing points that eliminate warpage, and even if there are only a small number of fixing portions arranged around the electronic component within a predetermined distance from the electronic component, the board can be firmly fixed to the base and warpage of the board can be suppressed. Furthermore, the terminals that have portions parallel to the first imaginary line can absorb vibrations applied in a direction perpendicular to the first imaginary line in a plan view. This improves the vibration resistance of the board. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a circuit diagram of a cooling circuit including a vehicle drive device equipped with a coil module according to a first embodiment. [Figure 2] FIG. 2 is an exploded perspective view of the vehicle drive device and the housing. [Figure 3] FIG. 2 is a perspective view of a power circuit assembly. [Figure 4] FIG. 2 is an exploded perspective view of the power circuit assembly. [Figure 5] FIG. 2 is a circuit diagram of a power circuit assembly. [Figure 6] FIG. 2 is a plan view illustrating a fixing structure of the coil module according to the first embodiment. [Figure 7] FIG. 10 is a plan view illustrating a fixing structure of a coil module according to a second embodiment. [Figure 8] FIG. 10 is a cross-sectional view illustrating the configuration of a bus bar of a smoothing capacitor according to a third embodiment. [Figure 9] FIG. 10 is a plan view illustrating a fixing structure of a coil module according to a fourth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, embodiments of the electronic component fixing structure according to the present disclosure will be described in detail with reference to the drawings. Note that the embodiments described below are merely examples for explaining the electronic component fixing structure, and the electronic component fixing structure is not limited to these embodiments. Therefore, the electronic component fixing structure can be embodied in various forms without departing from the spirit of the present disclosure.

[0011] [First embodiment] [Configuration of cooling circuit] As shown in FIG. 1, a vehicle drive device A equipped with a coil module 80 (an example of an electronic component, see also FIG. 4) according to the first embodiment is mounted on a cooling circuit consisting of a coolant flow path L1 for circulating a coolant as a cooling fluid, a refrigerant flow path L2 for circulating a refrigerant, and a lubricant flow path L3 for circulating a lubricant.

[0012] The coolant flow path L1 is driven by a coolant pump 33 to circulate the coolant through the radiator 34, the first cooling plate 11 of the power circuit assembly PE, the second cooling plate 12 (an example of a base), the oil cooler 32, and the water-cooled condenser 31 in that order. The coolant is cooling water such as long-life coolant (LLC), or insulating oil such as paraffin-based oil.

[0013] The refrigerant flow path L2 is configured to supply an externally cooled refrigerant to the water-cooled condenser 31. In this refrigerant flow path L2, a hydrofluorocarbon (HFC), a hydrofluoroolefin (HFO), or the like is used as the refrigerant.

[0014] The lubricating oil passage L3 supplies low-temperature lubricating oil to the inside of the traveling motor M and the gear mechanism Ge when the hydraulic pump 35 is driven.

[0015] In this cooling circuit, the coolant cooled by the radiator 34 flows through flow paths formed inside the first cooling plate 11 and the second cooling plate 12 of the power circuit assembly PE. As a result, the coolant absorbs heat generated in the power circuit assembly PE and cools the power circuit assembly PE. As a result, the temperature of the coolant rises.

[0016] The oil cooler 32 is disposed downstream of the power circuit assembly PE in the coolant flow path L1, and exchanges heat between the coolant circulating through the coolant flow path L1 and the lubricant circulating through the lubricant flow path L3. This further increases the temperature of the coolant and decreases the temperature of the lubricant. The cooled lubricant flows through the lubricant flow path L3 and is supplied to the drive motor M and the gear mechanism Ge. This prevents the drive motor M and the gear mechanism Ge from increasing in temperature and lubricates the drive motor M and the gear mechanism Ge. The coolant, whose temperature has increased in the oil cooler 32, removes heat from the refrigerant in the water-cooled condenser 31, then dissipates heat in the radiator 34, where it is cooled and supplied to the power module B again.

[0017] [Configuration of vehicle drive device] 2 shows the configuration of a vehicle drive device A that transmits the driving force of a traction motor M to wheels (not shown). This vehicle drive device A accommodates the traction motor M, a drive shaft DS connected to transmit the driving force of the traction motor M to the wheels, a gear mechanism Ge that reduces the driving force of the traction motor M and transmits it to the drive wheels, and a power circuit assembly PE including a power module B and an inverter C, all housed in a housing AH. Hereinafter, a vehicle equipped with a traction motor M as a driving source will also be referred to as an electric vehicle. Examples of electric vehicles include hybrid electric vehicles (HEVs), plug-in hybrid electric vehicles (PHEVs), battery electric vehicles (BEVs), and fuel cell electric vehicles (FCEVs).

[0018] The housing AH includes a first housing chamber E1 that houses the travel motor M, and a second housing chamber E2 that houses a power supply module B and an inverter C that control the power supplied to the travel motor M. The direction perpendicular to the vertical direction Z and along the rotation axis A1 of the rotor (not shown) of the travel motor M is defined as the axial direction L, the direction orthogonal to the vertical direction Z and the axial direction L is defined as the axial-orthogonal direction Y, and one side of the axial-orthogonal direction Y is defined as the axial-orthogonal first side Y1.

[0019] The housing AH has a first cover 101 that closes the outside of the drive motor M in the first accommodation chamber E1, and a second cover 102 that closes the outside of the gear mechanism Ge in the first accommodation chamber E1. In addition, an opening at the top of the housing AH is closed by an upper cover 103. This gives the housing AH a sealed structure.

[0020] The gear mechanism Ge includes a differential gear mechanism 110 arranged on the same axis as the rotation axis A1 of the drive shaft DS of the driving motor M, and a counter gear mechanism 111 arranged on an offset axis B1 offset from the rotation axis A1.

[0021] When mounted on an electric vehicle, the second storage chamber E2 has an upper region E3 which is above the driving motor M in the vertical direction Z and overlaps with the driving motor M when viewed in a direction along the Z direction (hereinafter also referred to as a planar view), and a lateral region E4 which is adjacent to the upper region E3 and is on the first side Y1 in the direction perpendicular to the axis of the driving motor M and does not overlap with the driving motor M when viewed in a planar view.

[0022] In the vehicle drive device A of this embodiment, at least a portion of the inverter C is disposed in the upper area E3, and the power supply module B is disposed in an area extending below the inverter C in the side area E4.

[0023] That is, in this embodiment, when viewed in the direction along the axial direction L (hereinafter also referred to as a side view), if the inverter C is in a horizontal position, the power supply module B extends in the vertical direction Z, thereby forming an L-shape between the inverter C and the power supply module B. In other words, the inverter C is arranged in a horizontal position above the traction motor M in an area extending in the axially orthogonal direction Y in the upper area E3 of the second housing chamber E2, and the power supply module B is arranged in a vertical position in a side area E4 adjacent to the upper area E3 and extending in the vertical direction. Note that instead of the arrangement of this embodiment, the power supply module B may be arranged in the upper area E3 and the inverter C in the side area E4.

[0024] In this embodiment, the side opposite to the axially orthogonal direction first side Y1 in the direction along the axially orthogonal direction Y is referred to as the axially orthogonal direction second side Y2, and either the axially orthogonal direction first side Y1 or the axially orthogonal direction second side Y2 may be the front side of the body of the electric vehicle.

[0025] [Power supply module structure] As shown in Figures 3 and 4, the power supply module B has a first module Ba, a second module Bb, and a third module Bc arranged in this order from top to bottom. The power supply module B has a first cooling plate 11 arranged on the upper level, and a second cooling plate 12 arranged below the first cooling plate 11 in the vertical direction Z, and these are connected via a spacer or the like. This results in a configuration in which the first cooling plate 11 and the second cooling plate 12 are stacked in this order from top to bottom along the vertical direction Z at a predetermined interval. Both the first cooling plate 11 and the second cooling plate 12 have a plate shape.

[0026] The first cooling plate 11 and the second cooling plate 12 each have a flow path therein through which a coolant flows. This flow path constitutes a part of the coolant flow path L1. This flow path enables cooling of various electronic components constituting the first module Ba, the second module Bb, and the third module Bc, which are arranged opposite the upper and lower plate surfaces of the first cooling plate 11 and the second cooling plate 12, respectively.

[0027] Specifically, in the power supply module B, a first module Ba and a second module Bb are arranged between the lower surface of the first cooling plate 11 and the upper surface of the second cooling plate 12. A third module Bc is arranged on the side of the lower surface 12c of the second cooling plate 12. An inverter C is arranged on the side of the upper surface of the first cooling plate 11.

[0028] The first module Ba is composed of a plurality of switching elements mounted on the upper surface of a plate-shaped upper substrate 14. The plurality of switching elements constitute a part of an OBC (On Board Charger) unit 50, which will be described later. The plurality of switching elements are cooled by a first cooling plate 11.

[0029] The second module Bb is composed of a transformer T mounted on the lower surface of the upper substrate 14, multiple bulk capacitors 16, and a frame member 18. The frame member 18 functions as a spacer by protruding downward from the lower surface of the upper substrate 14 while surrounding at least a portion of the outer periphery of the transformer T. The multiple bulk capacitors 16 and the transformer T are cooled by a second cooling plate 12.

[0030] The third module Bc is configured by a coil module 80 and a plurality of AC filters 22 mounted on the upper surface of a lower substrate 20 (an example of a substrate) disposed below and spaced apart from the lower surface 12c of the second cooling plate 12. The plurality of coil modules 80 and the plurality of AC filters 22 are cooled by the second cooling plate 12.

[0031] [Configuration of power circuit assembly] 5 shows a circuit diagram of the power circuit assembly PE. The power circuit assembly PE includes a filter unit 40 and an OBC unit 50 that constitute a power module B, an auxiliary inverter unit 60 and a main inverter unit 65 that constitute an inverter C, and a control unit D.

[0032] [Filter unit] The filter unit 40 includes an input connector 40a, an output connector 40b, an AC filter 22, a relay module 42, a coil module 80, a current detection module 44, and an input / output control unit 45. The input / output control unit 45 outputs a control signal to the relay module 42 and acquires a detection signal from the current detection module 44. The coil module 80 of this embodiment has four built-in coils. Hereinafter, the coils will be referred to as a first coil 81a, a second coil 81b, a third coil 81c, and a fourth coil 81d, respectively (see FIG. 6). Furthermore, the first coil 81a, the second coil 81b, the third coil 81c, and the fourth coil 81d will be collectively referred to as coils 81.

[0033] [OBC Unit] The OBC unit 50 includes a transformer T, a low-voltage connector 50a, a conversion circuit 51, a primary coil control circuit 52, a bulk capacitor 16, a secondary coil control circuit 54, a tertiary coil control circuit 55, a conversion circuit control unit 56, a transformer control unit 57, and a low-voltage control unit 58. The primary coil control circuit 52 controls the primary coil T1 of the transformer T. The bulk capacitor 16 is disposed in a power system that transmits power from the conversion circuit 51 to the primary coil control circuit 52. The secondary coil control circuit 54 controls the secondary coil T2 of the transformer T. The tertiary coil control circuit 55 obtains power from the tertiary coil T3 of the transformer T. The low-voltage connector 50a supplies power from the tertiary coil control circuit 55 to a low-voltage system battery BAT2.

[0034] The conversion circuit control unit 56 controls the multiple switching elements of the conversion circuit 51. Furthermore, the transformer control unit 57 controls the multiple switching elements of the primary coil control circuit 52 and the multiple switching elements of the secondary coil control circuit 54. The low voltage control unit 58 controls the multiple switching elements of the tertiary coil control circuit 55.

[0035] [Auxiliary inverter unit] The auxiliary inverter unit 60 of the inverter C functions as a DC-DC converter, and includes a first high-voltage connector 60 a, an auxiliary drive circuit 61 , a DC filter 62 , and an auxiliary control unit 63 .

[0036] The auxiliary drive circuit 61 includes a plurality of switching elements. The auxiliary control unit 63 controls the auxiliary drive circuit 61 to supply high-voltage power to auxiliary equipment such as the air conditioner 5 via the first high-voltage connector 60a. That is, the auxiliary inverter unit 60 includes a plurality of switching elements.

[0037] As shown in FIGS. 2 and 3, the auxiliary inverter unit 60 of the inverter C is disposed above the first cooling plate 11 in the vertical direction Z.

[0038] [Main inverter unit] 5, the main inverter unit 65 of the inverter C has a second high-voltage connector 65a, a motor drive circuit 66, and a smoothing capacitor 67. The motor drive circuit 66 has a plurality of switching elements and supplies power to the traction motor M.

[0039] When high-voltage power flowing between the OBC unit 50 and the auxiliary inverter unit 60 is supplied to the main inverter unit 65, the main inverter unit 65 functions to supply this high-voltage power from the second high-voltage connector 65a to the main battery BAT1 to charge it. Therefore, in a broad sense, the OBC unit 50 and the main inverter unit 65 can be collectively referred to as an on-board charger.

[0040] In addition, the main inverter unit 65 converts the power from the main battery BAT1 into three-phase AC power using the motor drive circuit 66, controls the frequency, and supplies it to the traction motor M, thereby obtaining driving force from the traction motor M that enables the electric vehicle to run.

[0041] 2 and 3, the main inverter unit 65 including the motor drive circuit 66 and the smoothing capacitor 67 is disposed in contact with the upper surface of the first cooling plate 11. In this way, the main inverter unit 65 is cooled by the first cooling plate 11. The motor drive circuit 66 is disposed adjacent to the smoothing capacitor 67.

[0042] [Control unit] The control unit D outputs control signals to the input / output control unit 45, the conversion circuit control unit 56, the transformer control unit 57, the low voltage control unit 58, and the auxiliary control unit 63. As shown in FIGS. 2 and 3, the control unit D is disposed above the first cooling plate 11 and adjacent to the smoothing capacitor 67. As a result, the control unit D is cooled by the first cooling plate 11.

[0043] Current Flow in Power Circuit Assembly As shown in FIG. 5, the power circuit assembly PE, under the control of the relay module 42, converts AC power from an AC power source (basically a commercial power source) supplied from outside the electric vehicle to an input connector 40a into DC power using a conversion circuit 51, and supplies AC of a set frequency generated by a primary coil control circuit 52 to the primary coil T1 side of the transformer T.

[0044] Furthermore, the high voltage power output to the secondary coil T2 side of the transformer T is extracted as high voltage DC power by the secondary coil control circuit 54 and is charged into the main battery BAT1 from the second high voltage connector 65a.

[0045] The high-voltage DC power charged in the main battery BAT1 is converted to three-phase AC power by the motor drive circuit 66, and the frequency is controlled before being supplied to the traction motor M. This allows the traction motor M to operate at a target rotation speed, enabling the electric vehicle to travel. In addition, the high-voltage DC power from the main battery BAT1 is DC-DC converted by the accessory drive circuit 61 and supplied to the air conditioner 5 and the like from the first high-voltage connector 60a.

[0046] In response to this, the low-voltage power output to the tertiary coil T3 side of the transformer T is converted into DC power by the tertiary coil control circuit 55 and charged into the system battery BAT2 from the low-voltage connector 50a. The power charged into the system battery BAT2 in this manner is supplied to the control device of the vehicle body and control devices of the electric vehicle.

[0047] Furthermore, under the control of the relay module 42, the power circuit assembly PE sequentially supplies power from the main battery BAT1 to the secondary coil control circuit 54, the transformer T, the primary coil control circuit 52, etc., thereby creating AC power similar to commercial power and outputting it from the output connector 40b.

[0048] [Coil module fixing structure] Next, the fixing structure of the coil module 80 according to this embodiment will be described with reference to Figures 4 and 6. The fixing structure of the coil module 80 according to this embodiment is the fixing structure of the electronic component in this disclosure.

[0049] As shown in Fig. 4, the coil module 80 includes a coil case 82 that houses a coil 81 therein, and a plurality of terminals 84 (eight in this embodiment) that extend parallel to the vertical direction Z from a second surface 82b of the coil case 82. As described above, the coil case 82 houses a first coil 81a, a second coil 81b, a third coil 81c, and a fourth coil 81d (see Fig. 6). A pair of terminals 84 is connected to each of the coils 81. Hereinafter, the pair of terminals 84 of the first coil 81a will be referred to as a pair of first terminals 84a, the pair of terminals 84 of the second coil 81b will be referred to as a pair of second terminals 84b, the pair of terminals 84 of the third coil 81c will be referred to as a pair of third terminals 84c, and the pair of terminals 84 of the fourth coil 81d will be referred to as a pair of fourth terminals 84d. Furthermore, the pair of first terminals 84a, the pair of second terminals 84b, the pair of third terminals 84c, and the pair of fourth terminals 84d are collectively referred to as the plurality of terminals 84. In this embodiment, each of the plurality of terminals 84 has a flat plate shape that is rectangular in plan view.

[0050] The coil module 80 is fixed to the lower substrate 20 with a plurality of terminals 84 inserted into through holes 20a formed in the lower substrate 20 and electrically connected by a method such as soldering. Furthermore, the coil module 80 has a first surface 82a of the coil case 82 fixed to the lower surface 12c of the second cooling plate 12 by a method such as adhesive bonding. In other words, the coil module 80 is sandwiched and fixed between both the lower substrate 20 and the second cooling plate 12.

[0051] A plurality of support columns 12a (an example of a fixing portion) are formed on the lower surface 12c of the second cooling plate 12, standing toward the lower substrate 20. A female screw 12b is formed on the top surface of each support column 12a, facing toward the second cooling plate 12, and a bolt 21 (an example of a fixing portion) is screwed into the female screw 12b. In this embodiment, the height of the plurality of support columns 12a is equal to the height of the coil case 82.

[0052] Through holes 20a are formed in the lower substrate 20 at locations corresponding to the plurality of support columns 12a (see FIG. 4). With the lower substrate 20 placed on the top surfaces of the support columns 12a, bolts 21 are inserted into the through holes 20a and fastened to the female threads 12b of the support columns 12a, thereby fixing the lower substrate 20 to the second cooling plate 12.

[0053] In this embodiment, as shown in FIG. 6, four support posts 12a (bolts 21) are arranged around the coil module 80. In FIGS. 6 to 9, the lines of the bolts 21 screwed into the four support posts 12a arranged around the coil module 80 are made thicker than the lines of the other bolts 21 to distinguish them from the other bolts 21. The four support posts 12a arranged around the coil module 80 are arranged within a predetermined distance (e.g., 3 cm) from the coil case 82 of the coil module 80 in a plan view. The coil module 80 has a larger mounting area on the lower substrate 20 than other electronic components, such as the AC filter 22, arranged on the lower surface 12c of the second cooling plate 12. Therefore, the distance between the support posts 12a (bolts 21) facing each other across the coil module 80 among the four support posts 12a (bolts 21) around the coil module 80 becomes larger, which may increase warping of the lower substrate 20 at the location where the coil module 80 is mounted and reduce the vibration resistance of the lower substrate 20.

[0054] Therefore, in the coil module 80 of this embodiment, when a first imaginary line V1 is set by connecting the centers of the female screws 12b of the two pillars 12a (bolts 21) that are facing each other across the coil module 80 and that are the farthest apart, the fourth plate surfaces 84d1 of the pair of fourth terminals 84d of the fourth coil 81d are arranged in a parallel position to the first imaginary line V1. Furthermore, when a second imaginary line V2 is set by connecting the centers of the female screws 12b of two opposing supports 12a (bolts 21) that are different from the two supports 12a (bolts 21) that make up the first imaginary line V1 and whose distance from each other is the second longest after the distance between the two supports 12a (bolts 21) that make up the first imaginary line V1, a first plate surface 84a1 of a pair of first terminals 84a of the first coil 81a, a second plate surface 84b1 of a pair of second terminals 84b of the second coil 81b, and a third plate surface 84c1 of a pair of third terminals 84c of the third coil 81c are each arranged in parallel with the second imaginary line V2. The first imaginary line V1 and the second imaginary line V2 intersect with each other and are not parallel to each other. Here, "the fourth plate surface 84d1 is parallel to the first virtual line V1" does not mean that the first virtual line V1 and the fourth plate surface 84d1 are completely parallel, but includes a case where the angle θ1 between the first virtual line V1 and the fourth plate surface 84d1 is within ±10 degrees, preferably within ±5 degrees. Also, "the first plate surface 84a1, the second plate surface 84b1, and the third plate surface 84c1 are parallel to the second virtual line V2" does not mean that the second virtual line V2 is completely parallel to each of the first plate surface 84a1, the second plate surface 84b1, and the third plate surface 84c1, but includes a case where the angle θ2 between the second virtual line V2 and each of the first plate surface 84a1, the second plate surface 84b1, and the third plate surface 84c1 is within ±10 degrees, preferably within ±5 degrees. In this embodiment, the pair of first terminals 84a, the pair of second terminals 84b, and the pair of third terminals 84c are arranged so that the first plate surface 84a1, the second plate surface 84b1, and the third plate surface 84c1 are parallel to the axial direction orthogonal to the axis Y. The pair of fourth terminals 84d are arranged so that the fourth plate surface 84d1 is parallel to the axial direction L.

[0055] The warping of the lower substrate 20 is relatively greatest between two support pillars 12a (bolts 21) that are spaced the furthest apart across the coil module 80. However, in the coil module 80 of this embodiment, the fourth plate surface 84d1 of the pair of fourth terminals 84d of the fourth coil 81d is arranged parallel to the first imaginary line V1, and the first plate surface 84a1 of the pair of first terminals 84a of the first coil 81a, the second plate surface 84b1 of the pair of second terminals 84b of the second coil 81b, and the third plate surface 84c1 of the pair of third terminals 84c of the third coil 81c are each arranged parallel to the second imaginary line V2. As a result, even if the number of support pillars 12a (bolts 21) arranged around the coil module 80 within a predetermined distance from the coil module 80 is small, the lower substrate 20 can be firmly fixed to the second cooling plate 12, and warping of the lower substrate 20 can be suppressed. Furthermore, the fourth plate surface 84d1 of the pair of fourth terminals 84d absorbs vibrations applied in a direction perpendicular to the first imaginary line V1 in a plan view, and the first plate surface 84a1 of the pair of first terminals 84a, the second plate surface 84b1 of the pair of second terminals 84b, and the third plate surface 84c1 of the pair of third terminals 84c absorb vibrations applied in a direction perpendicular to the second imaginary line V2. In this embodiment, the first plate surface 84a1 of the pair of first terminals 84a, the second plate surface 84b1 of the pair of second terminals 84b, and the third plate surface 84c1 of the pair of third terminals 84c are perpendicular to the fourth plate surface 84d1 of the fourth terminal 84d. This allows vibrations from all directions to be absorbed. This improves the vibration resistance of the lower substrate 20.

[0056] Second Embodiment Next, the fixing structure of a coil module 80 according to a second embodiment will be described with reference to Fig. 7. This embodiment differs from the first embodiment in the orientation of the pair of second terminals 84b of the second coil 81b, the pair of third terminals 84c of the third coil 81c, and the pair of fourth terminals 84d of the fourth coil 81d. Since the other configurations are the same as those of the first embodiment, detailed description thereof will be omitted.

[0057] In the coil module 80 of this embodiment, of the pair of second terminals 84b of the second coil 81b, a second plate surface 84b1 of one second terminal 84b is arranged parallel to the axial-orthogonal direction Y, and the second plate surface 84b1 of the other second terminal 84b is arranged parallel to the axial direction L. Furthermore, of the pair of third terminals 84c of the third coil 81c, a third plate surface 84c1 of one third terminal 84c is arranged parallel to the axial-orthogonal direction Y, and the third plate surface 84c1 of the other third terminal 84c is arranged parallel to the axial direction L. Furthermore, both fourth plate surfaces 84d1 of the pair of fourth terminals 84d of the fourth coil 81d are arranged parallel to the axial-orthogonal direction Y.

[0058] In the coil module 80 of this embodiment, the second plate surface 84b1 of the other second terminal 84b of the second coil 81b and the third plate surface 84c1 of the other third terminal 84c of the third coil 81c are parallel to the second imaginary line V2 (axial direction L), and the plate surfaces of all the terminals 84 of the remaining coils 81 are parallel to the first imaginary line V1 (axial direction Y). Therefore, in the coil module 80 of this embodiment as well, warping of the lower substrate 20 can be suppressed, and vibration resistance can be improved, similar to the first embodiment.

[0059] Third Embodiment Next, a fixing structure of a coil module 80 according to a third embodiment will be described with reference to Fig. 8. In this embodiment, the shapes of all the terminals 84 (a pair of first terminals 84a, a pair of second terminals 84b, a pair of third terminals 84c, and a pair of fourth terminals 84d) of the coil 81 of the coil module 80 in a plan view are different from those of the first and second embodiments. Since the other configurations are the same as those of the first and second embodiments, detailed description thereof will be omitted.

[0060] In the first and second embodiments, all of the terminals 84 of the coils 81 of the coil module 80 have a rectangular flat plate shape in a plan view. In the coil module 80 of this embodiment, all of the terminals 84 of the coils 81 have a bent plate shape bent into an L shape in a plan view (viewed in a direction perpendicular to the plate surface of the lower substrate 20). Specifically, all of the terminals 84 of the first coil 81a, the second coil 81b, the third coil 81c, and the fourth coil 81d have a portion parallel to the second imaginary line V2 (axial orthogonal direction Y) and a portion parallel to the first imaginary line V1 (axial direction L). Therefore, in the coil module 80 of this embodiment, as in the first and second embodiments, warping of the lower substrate 20 can be suppressed and vibration resistance can be improved.

[0061] [Fourth embodiment] Next, a fixing structure of a coil module 80 according to a fourth embodiment will be described with reference to Fig. 9. This embodiment differs from the second embodiment in the locations and orientations of the pair of second terminals 84b of the second coil 81b and the pair of third terminals 84c of the third coil 81c. The other configurations are the same as those of the second embodiment, so detailed description will be omitted.

[0062] In this embodiment, the pair of second terminals 84b of the second coil 81b and the pair of third terminals 84c of the third coil 81c are disposed on the second imaginary line V2, and the second plate surfaces 84b1 of each of the pair of second terminals 84b and the third plate surfaces 84c1 of each of the pair of third terminals 84c are disposed so as to be completely parallel to the second imaginary line V2. Furthermore, for the pair of second terminals 84b and the pair of third terminals 84c disposed between the two support posts 12a (bolts 21), the spacing S between the support posts 12a (bolts 21) and the adjacent terminals 84, as well as the spacing S between the adjacent terminals 84, are all uniform. With this configuration, vibrations applied in a direction perpendicular to the second imaginary line V2 can be uniformly absorbed. Therefore, in the coil module 80 of this embodiment, as in the first, second, and third embodiments, warping of the lower substrate 20 can be suppressed and vibration resistance can be improved.

[0063] [Another embodiment] The present disclosure may be configured as follows in addition to the above-described embodiments (common numbers and symbols as in the embodiments are used to designate components having the same functions as in the embodiments).

[0064] (1) In the first embodiment, the first plate surface 84a1 of the pair of first terminals 84a of the first coil 81a, the second plate surface 84b1 of the pair of second terminals 84b of the second coil 81b, and the third plate surface 84c1 of the pair of third terminals 84c of the third coil 81c are arranged parallel to the axial-orthogonal direction Y, and the fourth plate surface 84d1 of the pair of fourth terminals 84d of the fourth coil 81d is arranged parallel to the axial direction L. However, this is not limited to this. Depending on the direction and frequency of vibration application, it is possible to appropriately select whether the orientation of the first plate surface 84a1, the second plate surface 84b1, the third plate surface 84c1, and the fourth plate surface 84d1 should be parallel to the axial-orthogonal direction Y or parallel to the axial direction L.

[0065] (2) In the second embodiment described above, the second plate surfaces 84b1 of the pair of second terminals 84b of the second coil 81b and the third plate surfaces 84c1 of the pair of third terminals 84c of the third coil 81c are arranged so as to be parallel to the axial-orthogonal direction Y and the axial direction L, but this is not limited thereto. Depending on the direction and frequency of vibration application, a coil 81 can be selected as appropriate in which the plate surfaces of the pair of terminals 84 are arranged so as to be parallel to the axial-orthogonal direction Y and the axial direction L.

[0066] (3) In the third embodiment, all of the terminals 84 of the coil 81 have a bent plate shape that is bent into an L shape in a plan view, but this is not limited to this. Depending on the direction and frequency of vibration application, a coil 81 can be appropriately selected in which the plate surfaces of a pair of terminals 84 have a flat plate shape.

[0067] (4) In the above-described first, second, third, and other embodiments, the plate surface of the terminal 84 is arranged so as to be parallel to the axial direction Y and / or parallel to the axial direction L, but the plate surface of the terminal 84 may also be arranged so as to be completely parallel to either the first virtual line V1 or the second virtual line V2.

[0068] (5) In the above embodiments, the two supports 12a (bolts 21) that make up the first imaginary line V1 and the two supports 12a (bolts 21) that make up the second imaginary line V2 are different supports 12a (bolts 21), but this is not limited to this. One of the two supports 12a (bolts 21) that make up the first imaginary line V1 and one of the two supports 12a (bolts 21) that make up the second imaginary line V2 may be a common support 12a (bolt 21). In this case, the first imaginary line V1 and the second imaginary line V2 intersect at the center of the female thread 12b of the common support 12a (bolt 21).

[0069] (6) In the fourth embodiment, the pair of second terminals 84b of the second coil 81b and the pair of third terminals 84c of the third coil 81c are arranged on the second imaginary line V2, and the second plate surfaces 84b1 of each of the pair of second terminals 84b and the third plate surfaces 84c1 of each of the pair of third terminals 84c are arranged so as to be completely parallel to the second imaginary line V2. Furthermore, for the pair of second terminals 84b and the pair of third terminals 84c arranged between the two support posts 12a (bolts 21), the distance S between the support posts 12a (bolts 21) and the adjacent terminals 84, and the distance S between the adjacent terminals 84, are all uniform. However, such a configuration may also be achieved by arranging the coils 81 so as to be aligned along the first imaginary line V1 instead of or in addition to the second imaginary line V2.

[0070] (7) In the above embodiments, four support posts 12a (bolts 21) are arranged around the coil module 80 within a predetermined distance from the coil case 82 of the coil module 80, but this is not limited to this. Three or less, or five or more support posts 12a (bolts 21) may be arranged around the coil module 80 within a predetermined distance from the coil case 82 of the coil module 80.

[0071] In the above-described embodiment, the following configurations are envisioned.

[0072] <1> The fixing structure for the electronic component (80) includes a base (12), a substrate (20) fixed to the base (12) by a plurality of fixing portions (12a, 21), and an electronic component (80) having a first surface (82a) and a second surface (82b) parallel to each other, the first surface (82a) being fixed to the base (12) and terminals (84) arranged on the second surface (82b) being fixed to the substrate (20), thereby sandwiching the electronic component (80) between the base (12) and the substrate (20). When viewed along a direction perpendicular to the plate surface of the substrate (20), when a first imaginary line (V1) is set connecting two fixing parts (12a, 21) that are farthest from each other across the electronic component (80) among a plurality of fixing parts (12a, 21) that are arranged around the electronic component (80) within a predetermined distance from the electronic component (80), the terminal (84) has a portion that is parallel to the first imaginary line (V1).

[0073] The warping of the substrate (20) is relatively greatest between the two fixing portions (12a, 21) that are the furthest apart across the electronic component (80). However, with this configuration, the terminals (84) of the electronic component (80) have portions that are parallel to the first imaginary line (V1) that connects the two fixing portions (12a, 21) that are the furthest apart across the electronic component (80). This allows the parallel portions of the terminals (84) to serve as fixing points that eliminate warping. Even if the number of fixing portions (12a, 21) located around the electronic component (80) within a predetermined distance from the electronic component (80) is small, the substrate (20) can be firmly fixed to the base (12) and warping of the substrate (20) can be suppressed. Furthermore, the terminals (84) that have portions parallel to the first imaginary line (V1) can absorb vibrations applied in a direction perpendicular to the first imaginary line (V1) in a plan view. This improves the vibration resistance of the substrate (20).

[0074] <2> the above <1> In the fixing structure for an electronic component (80) described above, it is preferable that the terminal (84) is bent when viewed along a direction perpendicular to the surface of the board (20).

[0075] This configuration can suppress warping of the substrate 20. Furthermore, it can absorb vibrations applied in a direction perpendicular to the first virtual line V1 in plan view, as well as vibrations applied in a direction perpendicular to the plate surface of the bent terminal 84. This further improves the vibration resistance of the substrate 20.

[0076] <3> the above <1> In the fixing structure for an electronic component (80) described in the above, when viewed along a direction perpendicular to the surface of the substrate (20), among the plurality of fixing portions (12a, 21) arranged around the electronic component (80) within a predetermined distance from the electronic component (80), two fixing portions (12a, 21) different from the two fixing portions (12a, 21) constituting the first imaginary line (V1) are arranged such that the distance between them across the electronic component (80) is equal to or smaller than the distance constituting the first imaginary line (V1). A second imaginary line (V2) is set connecting the two fixed portions (12a, 21) that are next longest to the distance between the two adjacent fixed portions (12a, 21) and intersecting with the first imaginary line (V1), and it is preferable that the electronic component (80) has at least a pair of terminals (84), one of the pair of terminals (84) having a portion that is parallel to the first imaginary line (V1) and the other of the pair of terminals (84) having a portion that is parallel to the second imaginary line (V2).

[0077] This configuration can suppress warping of the substrate 20. It can also absorb vibrations applied in a direction perpendicular to the first imaginary line V1 and vibrations applied in a direction perpendicular to the second imaginary line V2 in a plan view, further improving the vibration resistance of the substrate 20.

[0078] <4> the above <1> from <3> In the fixing structure for an electronic component (80) according to any one of the above, when viewed along a direction perpendicular to the surface of the substrate (20), among the plurality of fixing portions (12a, 21) arranged around the electronic component (80) within a predetermined distance from the electronic component (80), two fixing portions (12a, 21) different from the two fixing portions (12a, 21) constituting the first imaginary line (V1) are arranged such that the distance between them across the electronic component (80) is equal to or smaller than the first imaginary line (V1). It is preferable that a second virtual line (V2) is set connecting the two fixing portions (12a, 21) that are next longest in distance to the distance between the two fixing portions (12a, 21) that constitute the electronic component (80) and intersecting the first virtual line (V1), and that the electronic component (80) has a plurality of terminals (84), and that the plurality of terminals (84) are arranged at equal intervals on the first virtual line (V1) or the second virtual line (V2) and between the two fixing portions (12a, 21) that constitute the first virtual line (V1) or the second virtual line (V2).

[0079] This configuration can suppress warping of the substrate 20. Furthermore, vibrations applied in a direction perpendicular to the first imaginary line V1 or the second imaginary line V2 along which the terminals 84 are arranged at equal intervals can be evenly absorbed, thereby further improving the vibration resistance of the substrate 20. [Industrial Applicability]

[0080] The present disclosure can be used in a fixing structure for electronic components. [Explanation of symbols]

[0081] 12: second cooling plate (base), 12a: support (fixing part), 20: lower board (board), 21: bolt (fixing part), 80: coil module (electronic component), 82a: first surface, 82b: second surface, 84: terminal, V1: first virtual line, V2: second virtual line

Claims

1. The base and a substrate fixed to the base by a plurality of fixing portions; an electronic component having a first surface and a second surface parallel to each other, the first surface being fixed to the base and terminals arranged on the second surface being fixed to the board, thereby being sandwiched between the base and the board; A fixing structure for an electronic component, wherein when a first virtual line is set connecting two fixing parts that are farthest from each other across the electronic component among a plurality of fixing parts that are arranged around the electronic component within a predetermined distance from the electronic component when viewed along a direction perpendicular to the plate surface of the board, the terminal has a portion that is in a parallel position to the first virtual line.

2. 2. The electronic component fixing structure according to claim 1, wherein the terminals are bent when viewed in a direction perpendicular to the surface of the substrate.

3. a second virtual line is set that connects two of the fixing portions that are different from the two fixing portions that form the first virtual line among the plurality of fixing portions that are arranged around the electronic component within a predetermined distance from the electronic component when viewed along a direction perpendicular to the surface of the board, the two fixing portions having the second longest distance between them across the electronic component after the distance between the two fixing portions that form the first virtual line, and that intersects with the first virtual line; The electronic component has at least one pair of the terminals, One of the pair of terminals has a portion that is oriented parallel to the first imaginary line, 2. The electronic component fixing structure according to claim 1, wherein the other of the pair of terminals has a portion that is oriented parallel to the second imaginary line.

4. a second virtual line is set that connects two of the fixing portions that are different from the two fixing portions that form the first virtual line among the plurality of fixing portions that are arranged around the electronic component within a predetermined distance from the electronic component when viewed along a direction perpendicular to the surface of the board, the two fixing portions having the second longest distance between them across the electronic component after the distance between the two fixing portions that form the first virtual line, and that intersects with the first virtual line; the electronic component has a plurality of the terminals, 4. The fixing structure for an electronic component according to claim 1, wherein the plurality of terminals are arranged at equal intervals on the first virtual line or the second virtual line and between the two fixing portions that constitute the first virtual line or the second virtual line.

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