Laminated adhesive film used in modified benzocyclobutene-containing FC-BGA-mounted carrier board, method for manufacturing the same and application

Abstract

To provide a laminated adhesive film used in a modified benzocyclobutene-containing FC-BGA-mounted carrier board, a method for manufacturing the same and application.SOLUTION: A laminated adhesive film contains 45 to 100 pts.wt. of an epoxy resin, 40 to 100 pts.wt. of an inorganic filler, 25 to 45 pts.wt. of cyanate ester, 40 to 60 pts.wt. of modified benzocyclobutene, 5 to 10 pts.wt. of an acrylic resin, 5 to 10 pts.wt. of a phenoxide resin, 0.1 to 1 pts.wt. of a solidification accelerator, and 200 to 300 pts.wt. of an organic solvent. The modified benzocyclobutene is one or two of phosphorus-containing benzocyclobutene and nitrogen-containing benzocyclobutene. The performance of the laminated adhesive film is adjusted by further adding modified benzocyclobutene in addition to the epoxy resin, the phenoxide resin, the cyanate ester, and the solidification accelerator. The laminated adhesive film has excellent dielectric characteristics and can reduce dielectric loss, by adding various modified benzocyclobutene and other raw material components. The laminated adhesive film has excellent flame retardant performance, thereby the laminated adhesive film is used in an FC-BGA-mounted carrier board, and can satisfy needs of high-speed and high integration of the electronic component.SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present invention relates to the technical field of resin composite materials, and in particular to a laminated adhesive film containing modified benzocyclobutene for use in FC-BGA mounting carrier boards, as well as its manufacturing method and applications. [Background technology]

[0002] Flip-chip ball grid array (FC-BGA) substrates are high-density packaging carrier boards that can realize faster and more multi-functional chips. As the wiring density of very large-scale integrated circuits (VLCs) increases, RC delays (resistance-capacitance delays) can easily occur due to the resistance of metal interconnection lines and the capacitance of interlayer dielectrics within electronic components. This can lead to problems such as signal transmission delays and power loss.

[0003] Laminating adhesive film is the most important material in the SAP (semi-additive process) manufacturing process of FC-BGA carrier boards. If laminating adhesive film has poor dielectric properties, it will have a significant impact on the application of laminating adhesive film to integrated circuits. In addition, laminating adhesive film is mainly composed of polymeric materials, which are flammable materials that emit large amounts of thick smoke and toxic gases when burned. Therefore, improving the flame retardancy of polymeric materials has become an important issue for laminating adhesive film.

[0004] Therefore, there is a need to improve or modify the conventional technology. Summary of the Invention [Problem to be solved by the invention]

[0005] In order to solve the shortcomings of the prior art, the present invention provides a laminating adhesive film containing modified benzocyclobutene for use in FC-BGA mounting carrier boards, as well as its manufacturing method and application, thereby solving the problem that conventional laminating adhesive films cannot meet the requirements for dielectric properties and flame retardancy. [Means for solving the problem]

[0006] The present invention adopts the following technical features to solve the technical problems of the prior art. In a first embodiment of the present invention, there is provided a laminated adhesive film for use in a modified benzocyclobutene-containing FC-BGA mounting carrier board. The laminated adhesive film contains the following components by weight: 45 to 100 weight parts of an epoxy resin, 40 to 100 weight parts of an inorganic filler, 25 to 45 weight parts of a cyanate ester, 40 to 60 weight parts of a modified benzocyclobutene, 5 to 10 weight parts of an acrylic resin, 5 to 10 weight parts of a phenoxide resin, 0.1 to 1 weight parts of a hardening accelerator, and 200 to 300 weight parts of an organic solvent. The modified benzocyclobutene is one or both of a phosphorus-containing benzocyclobutene and a nitrogen-containing benzocyclobutene.

[0007] Preferably, the phosphorus-containing benzocyclobutene is selected from any one or a combination of at least two of phosphorus-containing benzocyclobutene I, phosphorus-containing benzocyclobutene II, and phosphorus-containing benzocyclobutene III; The chemical structure of the phosphorus-containing benzocyclobutene I is: JPEG2025133002000001.jpg67170, The chemical structure of the phosphorus-containing benzocyclobutene II is: JPEG2025133002000002.jpg56170, The chemical structure of the phosphorus-containing benzocyclobutene III is: JPEG2025133002000003.jpg66170.

[0008] Preferably, the nitrogen-containing benzocyclobutene is selected from any one or a combination of at least two of nitrogen-containing benzocyclobutene I, nitrogen-containing benzocyclobutene II, and nitrogen-containing benzocyclobutene III; The chemical structure of the nitrogen-containing benzocyclobutene I is: JPEG2025133002000004.jpg62170, The chemical structure of the nitrogen-containing benzocyclobutene II is: JPEG2025133002000005.jpg48170, The chemical structure of the nitrogen-containing benzocyclobutene III is: JPEG2025133002000006.jpg45170.

[0009] Preferably, the epoxy resin is selected from one or a combination of at least two of bisphenol-type epoxy resins, biphenyl-type epoxy resins, naphthalene-type epoxy resins, linear phenol-type epoxy resins, dicyclopentadiene-type epoxy resins, aryl alkyl-type phenol-type epoxy resins, aryl alkyl biphenyl-type phenol-type epoxy resins, and naphthol-type phenol-type epoxy resins.

[0010] Preferably, the inorganic filler is any one or a combination of at least two of silicon dioxide, aluminum oxide, glass, cordierite, barium sulfate, barium carbonate, talc, clay, mica powder, zinc oxide, hydrotalcite, boehmite, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, zirconium oxide, barium titanate, barium zirconate, calcium zirconate, and zirconium phosphate.

[0011] Preferably, the solidification accelerator is selected from any one or a combination of at least two of 1-cyanoethyl-2-ethyl-4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2-ethyl-4-methylimidazole, 4-dimethylaminopyridine, and 2-phenylimidazole.

[0012] Preferably, the organic solvent is selected from the group consisting of toluene, xylene, butanone, methyl ethyl ketone, cyclohexanone, ethyl acetate, and N,N-dimethylformamide, or a combination of at least two of these.

[0013] Preferably, the laminated adhesive film further contains 3 to 9 weight percent of other auxiliary agents, and the other auxiliary agents are selected from any one or a combination of at least two of a thickener, a defoamer, a homogenizing agent, a leveling agent, an adhesion promoter, and a colorant.

[0014] In a second embodiment of the present invention, there is provided a method for producing a laminated adhesive film for use in the modified benzocyclobutene-containing FC-BGA mounting carrier board. The method includes the steps of uniformly mixing the components of the laminated adhesive film, applying the mixture to a substrate, and drying to obtain a laminated adhesive film. The drying temperature is 80 to 130°C, and the drying time is 3 to 10 minutes.

[0015] In a third embodiment of the present invention, the laminating adhesive film containing the modified benzocyclobutene for use in an FC-BGA mounting carrier board is used in an FC-BGA mounting carrier board. [Effects of the Invention]

[0016] The present invention provides a laminated adhesive film containing modified benzocyclobutene for use in FC-BGA mounting carrier boards, as well as its manufacturing method and applications. The present invention adjusts the performance of the laminated adhesive film by adding modified benzocyclobutene to epoxy resins, phenoxide resins, cyanate esters, hardening accelerators, etc. The addition of various modified benzocyclobutenes and other raw materials allows the laminated adhesive film of the present invention to have excellent dielectric properties and reduce dielectric loss. Furthermore, the laminated adhesive film's excellent flame retardancy allows it to be used in FC-BGA mounting carrier boards to meet the needs for high-speed, high-integration electronic components.

[0017] In the embodiments of the present invention, a laminated adhesive film containing modified benzocyclobutene for use in an FC-BGA mounting carrier board, its manufacturing method, and applications are provided. In order to provide a more detailed and clear understanding of the objectives, technical aspects, and effects of the present invention, the present invention will be described in more detail below. The following specific examples are provided to illustrate the present invention but are not intended to limit the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0018] In one embodiment of the present invention, there is provided a layered adhesive film containing modified benzocyclobutene for use in an FC-BGA packaging carrier board. The layered adhesive film contains the following weight components: 45 to 100 weight parts of epoxy resin, 40 to 100 weight parts of inorganic filler, 25 to 45 weight parts of cyanate ester, 40 to 60 weight parts of modified benzocyclobutene, 5 to 10 weight parts of acrylic resin, 5 to 10 weight parts of phenoxide resin, 0.1 to 1 weight part of curing accelerator, and 200 to 300 weight parts of organic solvent. The modified benzocyclobutene may be any one or two of phosphorus-containing benzocyclobutene and nitrogen-containing benzocyclobutene.

[0019] In embodiments of the present invention, the use of modified benzocyclobutene can improve dielectric properties. Specifically, phosphorus-containing benzocyclobutene does not release any small molecules upon ring cleavage, and the intramolecular polarity is low. Therefore, the resin formed by solidifying the phosphorus-containing benzocyclobutene has low dielectric properties. The chemical bonds of functional groups such as the benzene ring and heterocyclic ring of nitrogen-containing benzocyclobutene have low polarizability, and the functional groups contain large-volume structures, which can increase the free volume of the polymer. The use of nitrogen-containing benzocyclobutene introduces low-polarity, large-volume, rigid functional groups into the lamination adhesive film, thereby reducing the dielectric constant and dielectric loss.

[0020] In an embodiment of the present invention, the dielectric constant and dielectric loss tangent of the laminated adhesive film can be reduced by using modified benzocyclobutenes (phosphorus-containing benzocyclobutene and nitrogen-containing benzocyclobutene) together. During high-temperature curing, the four-membered rings of the phosphorus-containing benzocyclobutene and nitrogen-containing benzocyclobutene undergo a ring-opening cross-linking reaction to form a cyclic compound, thereby forming a network interconnection structure between the two (phosphorus-containing benzocyclobutene and nitrogen-containing benzocyclobutene). This reduces molecular polarization and improves dielectric properties.

[0021] Furthermore, during the high-temperature solidification process, phosphorus-containing benzocyclobutene and nitrogen-containing benzocyclobutene undergo a ring-opening crosslinking reaction to form a phosphorus-nitrogen flame retardant system. The phosphorus element forms a stable phosphorus-containing carbon layer in condensed phase flame retardants, while the nitrogen element forms a non-toxic flame retardant gas at high temperatures, diluting the concentration of flammable gases. The phosphorus and nitrogen elements also form a porous expanded carbon layer. This porous expanded carbon layer prevents flammable gases from penetrating the gas phase, providing heat insulation and oxygen isolation, improving the flame retardant performance of the laminated adhesive film.

[0022] In an embodiment of the present invention, the thickness of the laminated adhesive film is 10 to 100 μm.

[0023] In an embodiment of the present invention, the weight content of the epoxy resin is 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95 or 100, the weight content of the inorganic filler is 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95 or 100, the weight content of the cyanate ester is 25, 30, 35, 40 or 45, and the weight content of the modified benzocyclobutene is 40, 45, 50, 55 or 60, the weight fraction of the acrylic resin is 5, 6, 7, 8, 9, or 10, the weight fraction of the phenoxide resin is 5, 6, 7, 8, 9, or 10, the weight fraction of the hardening accelerator is 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8, 0.9, or 1, and the weight fraction of the organic solvent can be 200, 210, 220, 230, 240, 250, 260, 270, 280, 290, or 300.

[0024] In an embodiment of the present invention, the phosphorus-containing benzocyclobutene may be selected from any one or a combination of at least two of phosphorus-containing benzocyclobutene I, phosphorus-containing benzocyclobutene II, and phosphorus-containing benzocyclobutene III. The chemical structure of the phosphorus-containing benzocyclobutene I is: JPEG2025133002000007.jpg66170, The chemical structure of the phosphorus-containing benzocyclobutene II is: JPEG2025133002000008.jpg54170, The chemical structure of the phosphorus-containing benzocyclobutene III is: JPEG2025133002000009.jpg65170.

[0025] When phosphorus-containing benzocyclobutene undergoes ring cleavage, it does not release any small molecules and has low intramolecular polarity, so the resin formed by solidifying the phosphorus-containing benzocyclobutene has low dielectric properties.

[0026] In an embodiment of the present invention, the nitrogen-containing benzocyclobutene may be selected from any one or a combination of at least two of nitrogen-containing benzocyclobutene I, nitrogen-containing benzocyclobutene II, and nitrogen-containing benzocyclobutene III. The chemical structure of the nitrogen-containing benzocyclobutene I is: JPEG2025133002000010.jpg62170, The chemical structure of the nitrogen-containing benzocyclobutene II is: JPEG2025133002000011.jpg47170, The chemical structure of the nitrogen-containing benzocyclobutene III is: JPEG2025133002000012.jpg45170.

[0027] The low polarity of the chemical bonds of the functional groups of nitrogen-containing benzocyclobutene, such as the benzene ring and heterocyclic ring, and the large-volume structure of the functional groups increase the free volume of the polymer. By using nitrogen-containing benzocyclobutene, low-polarity, large-volume, rigid functional groups can be introduced into the laminated adhesive film, reducing the dielectric constant and dielectric loss.

[0028] In an embodiment of the present invention, the epoxy resin may be any one or a combination of at least two of bisphenol type epoxy resin, biphenyl type epoxy resin, naphthalene type epoxy resin, naphthol type epoxy resin, linear phenolic type epoxy resin, dicyclopentadiene type epoxy resin, arylalkyl type phenolic type epoxy resin, arylalkyl biphenyl type phenolic type epoxy resin, and naphthol type phenolic type epoxy resin.

[0029] In an embodiment of the present invention, the inorganic filler may be any one or a combination of at least two of silicon dioxide, aluminum oxide, glass, cordierite, barium sulfate, barium carbonate, talc, clay, mica powder, zinc oxide, hydrotalcite, boehmite, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, zirconium oxide, barium titanate, barium zirconate, calcium zirconate, and zirconium phosphate.

[0030] In an embodiment of the present invention, "XX-5598Z" manufactured by Sekisui Plastics Co., Ltd. can be used as the acrylic resin.

[0031] In an embodiment of the present invention, the phenoxide resin may be any one or a combination of at least two of FX280 (a product of Nippon Steel Corporation), FX293 (a product of Nippon Steel Corporation), YX8100 (a product of Mitsubishi Chemical Corporation), YX7553BH30 (a product of Mitsubishi Chemical Corporation), YX7200B35 (a product of Mitsubishi Chemical Corporation), and TER240C30 (a product of Tongyu Advanced Materials (Guangdong) Co., Ltd., China).

[0032] In an embodiment of the present invention, the solidification accelerator may be any one or a combination of at least two of 1-cyanoethyl-2-ethyl-4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2-ethyl-4-methylimidazole, 4-dimethylaminopyridine, and 2-phenylimidazole.

[0033] In an embodiment of the present invention, the organic solvent may be selected from any one or a combination of at least two of toluene, xylene, butanone, methyl ethyl ketone, cyclohexanone, ethyl acetate, and N,N-dimethylformamide.

[0034] In an embodiment of the present invention, the laminating adhesive film may further contain 3 to 9 weight percent of other additives, which may be selected from any one or a combination of at least two of a thickener, a defoamer, a homogenizer, a leveling agent, an adhesion enhancer, and a coloring agent.

[0035] In an embodiment of the present invention, there is further provided a method for manufacturing the laminated adhesive film used in the modified benzocyclobutene-containing FC-BGA mounting carrier board. The method includes the steps of uniformly mixing the components of the laminated adhesive film, coating the mixture on a substrate, and drying to obtain the laminated adhesive film. The drying temperature is 80 to 130°C, and the drying time is 3 to 10 minutes.

[0036] In an embodiment of the present invention, the thickness of the substrate may be 10 to 150 μm, specifically, 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, 110 μm, 120 μm, 130 μm, 140 μm, or 150 μm.

[0037] It should be noted that this embodiment does not specifically limit the substrate, and any substrate commonly used in this technical field can be directly used. Exemplary substrates of the present invention include, but are not limited to, PET release film, polyethylene film, polypropylene film, or polyvinyl chloride film. To facilitate subsequent removal of the substrate, the polyethylene film, polypropylene film, or polyvinyl chloride film can be subjected to corona treatment in advance.

[0038] In an embodiment of the present invention, the drying temperature may be 80°C, 90°C, 100°C, 110°C, 120°C or 130°C, and the drying time may be 3 min, 4 min, 5 min, 6 min, 7 min, 8 min, 9 min or 10 min.

[0039] In an embodiment of the present invention, the manufacturing method of the laminated adhesive film used in the modified benzocyclobutene-containing FC-BGA mounting carrier board can further include another step, which is removing the substrate.

[0040] In an embodiment of the present invention, the application of the modified benzocyclobutene-containing laminating adhesive film for use in an FC-BGA mounting carrier board is further provided.

[0041] Although the technical details of the embodiments of the present invention have been described in detail and completely, the above embodiments are only a part of the present invention and do not represent all the embodiments of the present invention. In other words, the above embodiments are for explaining the details of the present invention but do not limit the present invention. Those skilled in the art can conceive of other embodiments of the present invention by referring to the above embodiments without the need for creative invention, and it is natural that such other embodiments are also included in the present invention.

[0042] The following materials can be selected as some of the components in the examples and comparative examples of the present invention. Specifically, epoxy resin, inorganic filler, cyanate ester, acrylic resin, and phenoxide resin can be selected. The epoxy resin can be biphenyl-type epoxy resin ("NC-3000-L" manufactured by Nippon Kayaku Co., Ltd.), phenol-type epoxy resin ("WHR-991S" manufactured by Nippon Kayaku Co., Ltd.), bisphenol A-type epoxy resin ("jER828EL" manufactured by Mitsubishi Chemical Corporation), or naphthalene-type epoxy resin ("HP-6000" manufactured by DIC Corporation). The inorganic filler can be spherical silica ("SOC2" manufactured by ADMA Corporation). The cyanate ester can be "BA230S75" manufactured by Lonza Japan. The acrylic resin can be "XX-5598Z" manufactured by Sekisui Chemical Co., Ltd., and the phenoxide resin can be "YX7553BH30" manufactured by Mitsubishi Chemical Corporation.

[0043] Example 1 In this embodiment, a laminated adhesive film containing modified benzocyclobutene for use in an FC-BGA mounting carrier board is provided. The laminated adhesive film contains the following ingredients by weight: It may contain 30 weight parts of biphenyl epoxy resin (NC-3000-L), 5 weight parts of phenolic epoxy resin (WHR-991S), 10 weight parts of bisphenol A epoxy resin (jER828EL), 100 weight parts of spherical silica (SOC2), 45 weight parts of cyanate ester (BA230S75), 60 weight parts of phosphorus-containing benzocyclobutene, 10 weight parts of acrylic resin (XX-5598Z), 5 weight parts of phenoxide resin (YX7553BH30), 0.1 weight parts of 4-dimethylaminopyridine (DMAP), and 300 weight parts of cyclohexanone.

[0044] The method for producing the laminated adhesive film includes the steps of uniformly mixing the raw materials for the laminated adhesive film in the above proportions, coating the mixture on a PET release film, drying it at a temperature of 80°C for 10 minutes, and then removing the PET release film to obtain a laminated adhesive film having a thickness of 100 μm.

[0045] <Example 2> In this embodiment, a laminated adhesive film containing modified benzocyclobutene for use in an FC-BGA mounting carrier board is provided. The laminated adhesive film contains the following ingredients by weight: It may contain 30 weight parts of biphenyl type epoxy resin (NC-3000-L), 5 weight parts of phenol type epoxy resin (WHR-991S), 10 weight parts of bisphenol A type epoxy resin (jER828EL), 100 weight parts of spherical silica (SOC2), 45 weight parts of cyanate ester (BA230S75), 60 weight parts of nitrogen-containing benzocyclobutene, 10 weight parts of acrylic resin (XX-5598Z), 5 weight parts of phenoxide resin (YX7553BH30), 0.1 weight parts of 4-dimethylaminopyridine (DMAP), and 300 weight parts of cyclohexanone.

[0046] The method for producing the laminated adhesive film includes the steps of uniformly mixing the raw materials for the laminated adhesive film in the above proportions, coating the mixture on a PET release film, drying it at a temperature of 130°C for 3 minutes, and then removing the PET release film to obtain a laminated adhesive film having a thickness of 100 μm.

[0047] Example 3 In this embodiment, a laminated adhesive film containing modified benzocyclobutene for use in an FC-BGA mounting carrier board is provided. The laminated adhesive film contains the following ingredients by weight: It may contain 30 parts by weight of biphenyl type epoxy resin (NC-3000-L), 5 parts by weight of phenol type epoxy resin (WHR-991S), 10 parts by weight of bisphenol A type epoxy resin (jER828EL), 100 parts by weight of spherical silica (SOC2), 25 parts by weight of cyanate ester (BA230S75), 30 parts by weight of phosphorus-containing benzocyclobutene, 30 parts by weight of nitrogen-containing benzocyclobutene, 10 parts by weight of acrylic resin (XX-5598Z), 5 parts by weight of phenoxide resin (YX7553BH30), 0.1 parts by weight of 4-dimethylaminopyridine (DMAP), and 300 parts by weight of cyclohexanone.

[0048] The method for producing the laminated adhesive film includes the steps of uniformly mixing the raw materials for the laminated adhesive film in the above proportions, coating the mixture on a PET release film, drying it at a temperature of 110°C for 5 minutes, and then removing the PET release film to obtain a laminated adhesive film with a thickness of 40 μm.

[0049] Example 4 In this embodiment, a laminated adhesive film containing modified benzocyclobutene for use in an FC-BGA mounting carrier board is provided. The laminated adhesive film contains the following ingredients by weight: It can contain 100 weight parts of naphthalene-type epoxy resin (HP-6000), 40 weight parts of spherical silica (SOC2), 45 weight parts of cyanate ester (BA230S75), 40 weight parts of phosphorus-containing benzocyclobutene, 5 weight parts of acrylic resin (XX-5598Z), 5 weight parts of phenoxide resin (YX7553BH30), 1 weight part of 2-ethyl-4-methylimidazole (2E4MI), and 200 weight parts of butanone.

[0050] The method for producing the laminated adhesive film includes the steps of uniformly mixing the raw materials for the laminated adhesive film in the above proportions, coating the mixture on a PET release film, drying it at a temperature of 80°C for 10 minutes, and then removing the PET release film to obtain a laminated adhesive film having a thickness of 100 μm.

[0051] <Example 5> In this embodiment, a laminated adhesive film containing modified benzocyclobutene for use in an FC-BGA mounting carrier board is provided. The laminated adhesive film contains the following ingredients by weight: It may contain 80 weight parts of naphthalene-type epoxy resin (HP-6000), 60 weight parts of spherical silica (SOC2), 30 weight parts of cyanate ester (BA230S75), 50 weight parts of nitrogen-containing benzocyclobutene, 5 weight parts of acrylic resin (XX-5598Z), 5 weight parts of phenoxide resin (YX7553BH30), 0.5 weight parts of 2-ethyl-4-methylimidazole (2E4MI), and 250 weight parts of butanone.

[0052] The method for producing the laminated adhesive film includes the steps of uniformly mixing the raw materials for the laminated adhesive film in the above proportions, coating the mixture on a PET release film, drying it at a temperature of 80°C for 10 minutes, and then removing the PET release film to obtain a laminated adhesive film having a thickness of 100 μm.

[0053] Example 6 In this embodiment, a laminated adhesive film containing modified benzocyclobutene for use in an FC-BGA mounting carrier board is provided. The laminated adhesive film contains the following ingredients by weight: It may contain 100 weight parts of naphthalene-type epoxy resin (HP-6000), 40 weight parts of spherical silica (SOC2), 45 weight parts of cyanate ester (BA230S75), 25 weight parts of phosphorus-containing benzocyclobutene, 25 weight parts of nitrogen-containing benzocyclobutene, 5 weight parts of acrylic resin (XX-5598Z), 5 weight parts of phenoxide resin (YX7553BH30), 1 weight part of 2-ethyl-4-methylimidazole (2E4MI), and 200 weight parts of butanone.

[0054] The method for producing the laminated adhesive film includes the steps of uniformly mixing the raw materials for the laminated adhesive film in the above proportions, coating the mixture on a PET release film, drying it at a temperature of 80°C for 10 minutes, and then removing the PET release film to obtain a laminated adhesive film having a thickness of 100 μm.

[0055] <Comparative Example 1> In this comparative example, a laminated adhesive film is provided, which comprises the following ingredients by weight: It may contain 30 weight parts of biphenyl type epoxy resin (NC-3000-L), 5 weight parts of phenol type epoxy resin (WHR-991S), 10 weight parts of bisphenol A type epoxy resin (jER828EL), 100 weight parts of spherical silica (SOC2), 25 weight parts of cyanate ester (BA230S75), 10 weight parts of acrylic resin (XX-5598Z), 5 weight parts of phenoxide resin (YX7553BH30), 0.1 weight parts of 4-dimethylaminopyridine (DMAP), and 300 weight parts of cyclohexanone.

[0056] The method for producing the laminated adhesive film includes the steps of uniformly mixing the raw materials for the laminated adhesive film in the above proportions, coating the mixture on a PET release film, drying it at a temperature of 80°C for 10 minutes, and then removing the PET release film to obtain a laminated adhesive film having a thickness of 100 μm.

[0057] The performance of the laminated adhesive films provided in the examples and comparative examples was measured by the following methods.

[0058] Dielectric constant and dielectric loss tangent: First, the laminated adhesive film with a PET release film provided in the above examples and comparative examples was cured at 180°C for 30 minutes, and then the release film was removed to obtain a pre-cured laminated adhesive film. Next, the pre-cured laminated adhesive film was cut into three test strips measuring 2mm x 80mm. Next, the dielectric constant and dielectric loss tangent of each test strip were measured using an Agilent Technologies Inc. HP8362B and cavity resonance perturbation method at a measurement frequency of 5.8GHz and a measurement temperature of 23°C. Finally, the dielectric constant and dielectric loss tangent were obtained by calculating the average values ​​of the dielectric constant and dielectric loss tangent of the three test strips.

[0059] Flame retardancy: Using a laminator, a laminated adhesive film with a PET release film, as compared to the above examples, was pressed onto a substrate (Hitachi Chemical's MCL-E-705G), and the laminated adhesive film (the side of the laminated adhesive film without the PET release film) was pressed onto both sides of the substrate to obtain a laminate. After the pressing process was completed, the PET release film on the laminate was removed, and the laminated adhesive film was solidified (at 190°C for 90 minutes) to form a solid on both sides of the substrate. Finally, the laminate (approximately 380 μm thick) was cut into a sample measuring 12.7 mm x 127 mm with a 1.27 mm edge. The sample was measured according to the UL-94V standard, and the measurement results were recorded.

[0060] The performance of the laminated adhesive films of the Examples and Comparative Examples was measured, and the results are shown in Table 1. JPEG2025133002000013.jpg74170

[0061] Although the embodiments of the present invention have been described in detail above, the above embodiments are merely illustrative of the present invention, and the present invention is not limited to the configurations of the above embodiments. Those skilled in the art may make improvements or modifications to the design without departing from the spirit of the present invention, and such improvements or modifications will naturally be included in the scope of the claims of the present invention.

Claims

1. A laminating adhesive film for use in a FC-BGA mounting carrier board containing modified benzocyclobutene, comprising: The laminated adhesive film contains the following components by weight: 45 to 100 weight percent epoxy resin, 40 to 100 weight percent inorganic filler, 25 to 45 weight percent cyanate ester, 40 to 60 weight percent modified benzocyclobutene, 5 to 10 weight percent acrylic resin, 5 to 10 weight percent phenoxide resin, 0.1 to 1 weight percent solidification accelerator, and 200 to 300 weight percent organic solvent; The modified benzocyclobutene-containing laminated adhesive film used for an FC-BGA mounting carrier board is characterized in that the modified benzocyclobutene is either one or two of a phosphorus-containing benzocyclobutene and a nitrogen-containing benzocyclobutene.

2. As the phosphorus-containing benzocyclobutene, any one or a combination of at least two of phosphorus-containing benzocyclobutene I, phosphorus-containing benzocyclobutene II, and phosphorus-containing benzocyclobutene III is selected; The chemical structure of the phosphorus-containing benzocyclobutene I is: and The chemical structure of the phosphorus-containing benzocyclobutene II is: and The chemical structure of the phosphorus-containing benzocyclobutene III is:

2. The laminated adhesive film for use in a carrier board for mounting an FC-BGA containing modified benzocyclobutene according to claim 1, wherein:

3. As the nitrogen-containing benzocyclobutene, any one or a combination of at least two of nitrogen-containing benzocyclobutene I, nitrogen-containing benzocyclobutene II, and nitrogen-containing benzocyclobutene III is selected; The chemical structure of the nitrogen-containing benzocyclobutene I is: and The chemical structure of the nitrogen-containing benzocyclobutene II is: and The chemical structure of the nitrogen-containing benzocyclobutene III is:

2. The laminated adhesive film for use in a carrier board for mounting an FC-BGA containing modified benzocyclobutene according to claim 1, wherein:

4. 2. The laminated adhesive film used in the modified benzocyclobutene-containing FC-BGA mounting carrier board according to claim 1, wherein the epoxy resin is selected from one or a combination of at least two of bisphenol-type epoxy resins, biphenyl-type epoxy resins, naphthalene-type epoxy resins, linear phenol-type epoxy resins, dicyclopentadiene-type epoxy resins, aryl alkyl-type phenol-type epoxy resins, aryl alkyl biphenyl-type phenol-type epoxy resins, and naphthol-type phenol-type epoxy resins.

5. 2. The laminated adhesive film for use in a modified benzocyclobutene-containing FC-BGA mounting carrier board according to claim 1, wherein the inorganic filler is selected from one or a combination of at least two of silicon dioxide, aluminum oxide, glass, cordierite, barium sulfate, barium carbonate, talc, clay, mica powder, zinc oxide, hydrotalcite, boehmite, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, zirconium oxide, barium titanate, barium zirconate, calcium zirconate, and zirconium phosphate.

6. The laminated adhesive film used for a modified benzocyclobutene-containing FC-BGA mounting carrier board according to claim 1, characterized in that the solidification accelerator is selected from one or a combination of at least two of 1-cyanoethyl-2-ethyl-4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2-ethyl-4-methylimidazole, 4-dimethylaminopyridine, and 2-phenylimidazole.

7. The laminated adhesive film used for a carrier board for mounting an FC-BGA containing modified benzocyclobutene according to claim 1, characterized in that the organic solvent is selected from one or a combination of at least two of toluene, xylene, butanone, methyl ethyl ketone, cyclohexanone, ethyl acetate, and N,N-dimethylformamide.

8. The laminated adhesive film used for a modified benzocyclobutene-containing FC-BGA mounting carrier board according to claim 1, characterized in that the laminated adhesive film further contains 3 to 9 weight percent of other auxiliary agents, and the other auxiliary agents are selected from any one or a combination of at least two of a thickener, a defoamer, a homogenizing agent, a leveling agent, an adhesion promoter, and a colorant.

9. A method for producing a laminated adhesive film used in the modified benzocyclobutene-containing FC-BGA mounting carrier board according to any one of claims 1 to 8, comprising: The manufacturing method of the laminated adhesive film used for the FC-BGA mounting carrier board containing modified benzocyclobutene, characterized in that it includes the steps of uniformly mixing each component of the laminated adhesive film, applying the mixture onto a substrate, and drying to obtain the laminated adhesive film.

10. 10. An application of the laminated adhesive film for use in an FC-BGA mounting carrier board containing modified benzocyclobutene according to any one of claims 1 to 8, in an FC-BGA mounting carrier board.

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