Cover tape wound article and electronic component packaging body

Abstract

To provide means for suppressing deterioration in an anti-static effect even after a certain time has passed after manufacturing in a cover tape, containing an anti-static component, for electronic component packaging.SOLUTION: In a cover tape wound article, an electronic component packaging cover tape of the following (1) or (2) is wound in a traverse manner: (1) a long electronic component packaging cover tape comprising a base material layer and a heat seal layer containing an anti-static agent provided on one surface side of the base material layer, (2) a long electronic component packaging cover tape comprising a base material layer, a heat seal layer provided on one surface side of the base material layer, and an anti-static agent-containing layer provided on a surface of the heat seal layer on the side opposite to the base material layer.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a cover tape roll and an electronic component package, and more particularly to a roll in which a cover tape for packaging electronic components is wound. [Background technology]

[0002] After manufacturing, electronic components are often stored and transported in packaging materials to prevent the adhesion of dust and other contaminants until they are subjected to the mounting process. Tape-type packaging materials are often used to package electronic components, allowing them to be mounted on circuit boards using automated mounting equipment. These packaging materials typically consist of a carrier tape, a long sheet with multiple recessed storage pockets formed at predetermined intervals, and a cover tape that is heat-sealed to the carrier tape. After the electronic components are housed in the storage pockets of the carrier tape, a cover tape is placed on top of the carrier tape as a lid, and both ends of the cover tape are heat-sealed continuously along the length with a heated seal bar to form an electronic component package.

[0003] The following Patent Documents 1 to 6 can be cited as prior art related to cover tapes. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2002-211813 [Patent Document 2] Japanese Patent Publication No. 2020-093815 [Patent Document 3] Japanese Patent Application Laid-Open No. 2010-013177 [Patent Document 4] Japanese Patent Application Publication No. 2023-092899 [Patent Document 5] Japanese Patent Application Publication No. 2023-037999 [Patent Document 6] Japanese Patent Publication No. 2023-038475 Summary of the Invention [Problem to be solved by the invention]

[0005] To prevent electronic components from sticking due to static electricity, cover tapes often contain antistatic components. For example, the heat seal layer of the cover tape may contain an antistatic component, or a separate layer containing the antistatic component may be provided. Reducing static electricity-induced sticking of electronic components allows for smooth removal of the electronic components. However, through preliminary studies, the inventors have found that for cover tapes that contain an antistatic component in the heat seal layer or that have an antistatic component-containing layer provided as a layer separate from the heat seal layer, although sufficient antistatic effect is obtained immediately after production, the antistatic effect may decrease after a certain amount of time has passed since production.

[0006] The present invention has been made in view of the above circumstances, and one of the objects of the present invention is to provide a means for preventing a decrease in the antistatic effect of a cover tape containing an antistatic component for packaging electronic components, even after a certain amount of time has passed since production. [Means for solving the problem]

[0007] The present inventors have completed the invention provided below and solved the above problems.

[0008] 1. A cover tape roll in which the cover tape for packaging electronic components described below in (1) or (2) is traverse-wound. (1) A long cover tape for packaging electronic components, comprising a base layer and an antistatic agent-containing heat seal layer provided on one side of the base layer. (2) A long cover tape for packaging electronic components, comprising: a base layer; a heat seal layer provided on one side of the base layer; and an antistatic agent-containing layer provided on the heat seal layer on the side opposite to the base layer. 2. 1. The cover tape roll according to claim 1, A cover tape roll, wherein the antistatic agent comprises a conductive polymer. 3. 1. or 2. The cover tape roll according to claim 1, A cover tape roll in which the concentration of the antistatic agent in the antistatic agent-containing heat seal layer of the cover tape of (1) is 3 to 50 mass %, or the concentration of the antistatic agent in the antistatic agent-containing layer of the cover tape of (2) is 3 to 50 mass %. 4. A cover tape roll according to any one of 1. to 3., A cover tape roll in which the antistatic agent-containing heat seal layer in the cover tape of (1) does not contain inorganic particles, or if it does contain inorganic particles, the proportion of inorganic particles is 1% by mass or less of the entire heat seal layer, or the antistatic agent-containing layer in the cover tape of (2) does not contain inorganic particles, or if it does contain inorganic particles, the proportion of inorganic particles is 1% by mass or less of the entire antistatic agent-containing layer. 5. A cover tape roll according to any one of 1. to 4., A cover tape roll in which the antistatic agent-containing heat seal layer in the cover tape of (1) or the antistatic agent-containing layer in the cover tape of (2) is formed by applying a coating liquid and drying it. 6. A cover tape roll according to any one of 1. to 5., A cover tape roll in which the thickness of the antistatic agent-containing heat seal layer in the cover tape of (1) is 0.01 to 15 μm, or the thickness of the antistatic agent-containing layer in the cover tape of (2) is 0.01 to 15 μm. 7. A cover tape roll according to any one of 1. to 6., A cover tape roll, wherein the width of the cover tape of (1) or (2) is 2 to 10 mm. 8. A cover tape roll according to any one of 1. to 7., The surface resistance value of the heat seal layer side of the cover tape (1) or the antistatic agent-containing layer side of the cover tape (2) immediately before traverse winding is defined as Ri, When the surface resistance value of the heat seal layer side of the cover tape (1) or the antistatic agent-containing layer side of the cover tape (2) that has been traverse-wound and stored under conditions of 60°C and 10% RH or less for 1 hour is Rf, Cover tape roll with an Rf / Ri value of 100 or less. 9. A cover tape roll according to any one of 1. to 8., The cover tapes in the cover tape roll are partially overlapped within the same layer. 10. a carrier tape containing electronic components; The cover tape (1) or (2) in the cover tape winding product according to any one of 1. to 9., which is adhered to the carrier tape so as to seal the electronic component; An electronic component packaging body comprising: [Effects of the Invention]

[0009] According to the present invention, in a cover tape containing an antistatic component for packaging electronic components, it is possible to suppress the deterioration of the antistatic effect even after a certain amount of time has passed since production. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 10 is a diagram for explaining a cover tape roll. [Figure 2] 10A and 10B are diagrams for explaining a conventional method of winding a cover tape (record winding). [Figure 3] FIG. 10 is a diagram showing an example of a state in which a cover tape is bonded (heat sealed) to a carrier tape. DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The drawings are for illustrative purposes only, and the shapes and dimensional ratios of the components in the drawings do not necessarily correspond to the actual products.

[0012] In this specification, unless otherwise specified, the expression "X to Y" in the description of a numerical range means at least X and at most Y. For example, "1 to 5% by mass" means "at least 1% by mass and at most 5% by mass."

[0013] In the description of groups (atomic groups) in this specification, when a notation does not specify whether the group is substituted or unsubstituted, it encompasses both groups having no substituents and groups having a substituent. For example, the term "alkyl group" encompasses not only alkyl groups having no substituents (unsubstituted alkyl groups) but also alkyl groups having a substituent (substituted alkyl groups). In this specification, the term "(meth)acrylic" represents a concept that encompasses both acrylic and methacrylic. The same applies to similar terms such as "(meth)acrylate." Unless otherwise specified, the term "organic group" as used herein means an atomic group obtained by removing one or more hydrogen atoms from an organic compound. For example, a "monovalent organic group" refers to an atomic group obtained by removing one hydrogen atom from any organic compound.

[0014] <Cover tape rolled product> In this embodiment, the cover tape for packaging electronic components of the following (1) or (2) is traverse-wound to form a cover tape roll. (1) A long cover tape for packaging electronic components, comprising a base layer and an antistatic agent-containing heat seal layer provided on one side of the base layer. (2) A long cover tape for packaging electronic components, comprising: a base layer; a heat seal layer provided on one side of the base layer; and an antistatic agent-containing layer provided on the heat seal layer on the side opposite to the base layer.

[0015] As described above, by traverse winding the antistatic agent-containing cover tape, it is possible to prevent the antistatic effect of the cover tape from decreasing even after a certain amount of time has passed since production. Through preliminary investigations, the inventors have found that one of the reasons why the antistatic effect of cover tapes containing antistatic components for packaging electronic components decreases after a certain amount of time has passed since production is that when the cover tape is rolled up for storage after production, the layer containing the antistatic component is in close contact with other layers, causing at least a portion of the layer containing the antistatic component to peel off. (Most conventional cover tapes for packaging electronic components are typically wound like a record, as shown in Figure 2, and stored until just before use.) Therefore, the inventors decided to wind the cover tape in a traverse winding method instead of a record winding method. This method is believed to make it easier for gaps to form between the layer containing the antistatic component and the other layers, and also to weaken the contact force between the layer containing the antistatic component and the other layers compared to a record winding method, thereby preventing the layer containing the antistatic component from peeling off. This is believed to prevent a decrease in the antistatic effect even after a certain amount of time has passed since the cover tape was manufactured.

[0016] Incidentally, there are various disadvantages to storing cover tape for packaging electronic components in a traverse wrap rather than a record wrap until just before use, as follows: - Winding tends to collapse easily The ears (the parts near both ends of the core of a rolled product) tend to crumble easily. Compared to winding records, there is a high tendency for cover tapes to not wind properly due to manufacturing variations and defects. Compared to record rolls, they are bulkier, take up more space, and are more expensive to store. Record rolls are widely available on the market, and using traverse rolls requires the introduction of new equipment. In this embodiment, the traverse winding is adopted in order to suppress the deterioration of the antistatic effect, while acknowledging the various disadvantages described above.

[0017] The cover tape wound product of this embodiment is typically formed by traversely winding the cover tape (1) or (2) on a winding core. Specific forms of the cover tape and the cover tape wound product will be described below with reference to Figures 1(A) and 1(B).

[0018] (Specific form of traverse winding) The term "traverse winding" is commonly used in winding various types of strings and tapes, and the meaning of the term "traverse winding" in this specification remains the same as the general meaning. Specifically, in this embodiment, as shown in Figure 1(A), Figure 1(B), or Figure 1(C), the cover tape 1 (the cover tape (1) or (2) described above) is traverse-wound around the winding core 10. Even when the cover tape 1 is wound in two or more layers as shown in Figure 1(B), it is believed that peeling or detachment of the layer containing the antistatic component is suppressed compared to when the cover tape is wound on a record (as described above).

[0019] In traverse winding, gaps 15 may or may not exist between adjacent cover tapes 1. From the viewpoint of further suppressing peeling or detachment of the layer containing the antistatic component, it is considered preferable that gaps 15 exist. On the other hand, from the viewpoint of suppressing collapse of the winding and saving space, it is preferable that gaps 15 do not exist, or if they exist, that their width is small.

[0020] In Figures 1(A) and 1(B), the cover tape 1 in a certain layer does not overlap with the adjacent cover tape 1 in that layer. In contrast, as shown in Figure 1(C), the cover tapes 1 wound around the winding core 10 may overlap partially (but not entirely) within the same layer. In other words, the cover tapes 1 may be traverse-wound around the winding core 10 while overlapping partially. The width of the overlapping portion, where W is the width of the cover tape 1, is, for example, 0.8W or less, preferably 0.1W to 0.8W, more preferably 0.2W to 0.7W, and even more preferably 0.3W to 0.6W. Even with traverse winding as shown in Figure 1(C), it is believed that peeling and detachment of the layer containing the antistatic component can be suppressed compared to record winding. Furthermore, traverse winding as shown in Figure 1(C) is preferable from the viewpoint of both suppressing peeling and detachment of the layer containing the antistatic component and making the cover tape wound product smaller and more space-saving.

[0021] The width of the cover tape 1 is preferably 1 to 13 mm, and more preferably 2 to 10 mm.

[0022] (Cover tape 1) As mentioned above, the cover tape 1 can be either (1) or (2) below. (1) A long cover tape for packaging electronic components, comprising a base layer and an antistatic agent-containing heat seal layer provided on one side of the base layer. (2) A long cover tape for packaging electronic components, comprising a base layer, a heat seal layer provided on one side of the base layer, and an antistatic agent-containing layer provided on the heat seal layer on the side opposite to the base layer.

[0023] First, the cover tape (1) above will be described in more detail below. The cover tape (1) above may comprise at least a base layer and an antistatic agent-containing heat seal layer provided on one side of the base layer, but preferably also comprises an intermediate layer between the base layer and the heat seal layer in addition to these layers. Of course, other layers may also be included. When the cover tape (1) above has an intermediate layer, the intermediate layer may be in direct contact with the base layer, or a separate layer such as an anchor coat layer may be present between the intermediate layer and the base layer. Similarly, the intermediate layer may be in direct contact with the antistatic agent-containing heat seal layer, or a separate layer may be present between the intermediate layer and the antistatic agent-containing heat seal layer.

[0024] Specific examples of materials constituting the substrate layer include polyester, polyamide, polyolefin, polyacrylate, polymethacrylate, polyimide, polycarbonate, ABS resin, etc. Among these, polyester-based resins are preferred from the viewpoint of improving the mechanical strength and flexibility of the cover tape. The substrate layer may or may not contain additives such as lubricants.

[0025] The substrate layer may be in the form of a single layer film containing the above-mentioned materials, or in the form of a multilayer film containing the above-mentioned materials in each layer. The film used to form the substrate layer may be an unstretched film, or a uniaxially or biaxially stretched film. From the viewpoint of improving the mechanical strength of the cover tape, a uniaxially or biaxially stretched film is preferred.

[0026] The thickness of the base layer is preferably 5 μm or more, more preferably 7 μm or more. The thickness of the base layer is preferably 50 μm or less, more preferably 40 μm or less. When the thickness of the base layer is equal to or less than the upper limit, the rigidity of the cover tape is not too high, and even when a torsional stress is applied to the carrier tape after sealing, the cover tape can follow the deformation of the carrier tape and prevent peeling. When the thickness of the base layer is equal to or greater than the lower limit, the mechanical strength of the cover tape can be improved, and therefore, when the cover tape is peeled off from the carrier tape at high speed, the cover tape can be prevented from breaking.

[0027] The intermediate layer is preferably provided with the intention of improving the cushioning properties of the entire cover tape and further improving the heat sealability. Materials constituting the intermediate layer include one or more selected from polyacrylic acid derivatives, polyacrylic acid ester derivatives, polyvinyl acetate derivatives, styrene-based resins, olefin-based resins, and cyclic olefin resins, as well as copolymers thereof. Among these, ethylene-(meth)acrylic acid ester copolymers, ethylene-vinyl acetate copolymers, polyethylene, and polystyrene-based resins are preferred from the viewpoint of improving the cushioning properties of the entire cover tape. Low-density polyethylene (LDPE) or linear low-density polyethylene (L-LDPE) is more preferred as the polyethylene. The intermediate layer may or may not contain various additives.

[0028] When an intermediate layer is provided, it may have a single layer structure or a multi-layer structure. When an intermediate layer is provided, its thickness is preferably 10 to 60 μm, more preferably 15 to 50 μm, from the viewpoint of improving the cushioning properties of the entire cover tape and from the viewpoint of good handleability of the cover tape.

[0029] The antistatic agent-containing heat seal layer is usually present on the outermost surface of the cover tape, and is a layer that is brought into close contact with the carrier tape during the production of electronic component packages. The antistatic agent-containing heat seal layer preferably contains a thermoplastic resin to exhibit heat sealability. Specifically, the antistatic agent-containing heat seal layer can contain one or more resins selected from styrene-based resins, (meth)acrylic resins, olefin-based resins, urethane-based resins, and ester-based resins. Among these, styrene-based resins and (meth)acrylic resins are preferred from the viewpoints of good heat sealability and good dissolution or dispersion of the antistatic agent. The antistatic agent-containing heat seal layer may contain only one resin, or may contain two or more resins.

[0030] Specific examples of styrene-based resins include polystyrene, styrene-butadiene copolymer (SB), styrene-butadiene-styrene block copolymer (SBS), styrene-ethylene-butadiene-styrene block copolymer (SEBS), styrene-isoprene-styrene block copolymer (SIS), styrene-ethylene-propylene-styrene block copolymer (SEPS), styrene-methyl (meth)acrylate copolymer, hydrogenated styrene block copolymer, high impact polystyrene (HIPS), general purpose polystyrene resin (GPPS), etc. Among these, styrene-butadiene copolymer (SB) is preferred in terms of the balance of various performances.

[0031] Specific examples of (meth)acrylic resins include resins having structural units derived from monomers such as acrylic acid, methacrylic acid, methyl acrylate, ethyl acrylate, butyl acrylate, and 2-ethylhexyl acrylate; methacrylic acid esters such as methyl methacrylate, ethyl methacrylate, and butyl methacrylate; and acrylonitrile, methacrylonitrile, and acrylamide. The (meth)acrylic resin may contain structural units derived from one or more monomers selected from these examples. Of course, the (meth)acrylic resin may also contain structural units derived from monomers other than these examples.

[0032] The ester resin usually comprises a structural unit derived from an alcohol component and a structural unit derived from a carboxylic acid component. Specific examples of the alcohol component include chain or branched aliphatic diols such as ethylene glycol, 1,2-propanediol, 1,3-propanediol, 1,2-butanediol, 1,3-butanediol, 1,4-butanediol, 2,3-butanediol, 2,2-dimethyl-1,3-propanediol, 1,6-hexanediol, 1,8-octanediol, 1,9-nonanediol, 1,10-decanediol, and 1,12-dodecanediol; alicyclic diols such as hydrogenated bisphenol A [2,2-bis(4-hydroxycyclohexyl)propane] and adducts of hydrogenated bisphenol A with alkylene oxides having 2 to 4 carbon atoms (average number of added moles: 2 to 12); and trihydric or higher polyhydric alcohols such as glycerin, pentaerythritol, trimethylolpropane, and sorbitol. These alcohol components may be used alone or in combination. Specific examples of the carboxylic acid component include chain or branched aliphatic dicarboxylic acids such as oxalic acid, malonic acid, maleic acid, fumaric acid, citraconic acid, itaconic acid, glutaconic acid, succinic acid, adipic acid, sebacic acid, dodecanedioic acid, azelaic acid, dodecylsuccinic acid, dodecenylsuccinic acid, and octenylsuccinic acid, trivalent or higher polycarboxylic acids such as trimellitic acid and its anhydride, and aromatic dicarboxylic acids such as phthalic acid, isophthalic acid, and terephthalic aromatic dicarboxylic acids. These carboxylic acid components may be used alone or in combination.

[0033] In one embodiment, the antistatic agent contained in the antistatic agent-containing heat seal layer includes a conductive polymer. Because conductive polymers are "polymers," they are more likely to increase the adhesiveness of the heat seal layer than other antistatic agents, such as metal-containing particles. For this reason, when a cover tape whose heat seal layer (outermost layer) contains a conductive polymer is wound around a record and stored, peeling of the heat seal layer (outermost layer) is likely to occur. However, by traverse-wrapping the cover tape as in this embodiment, peeling of the heat seal layer (outermost layer) can be prevented, even when the heat seal layer (outermost layer) contains a conductive polymer, and a decrease in the antistatic effect can be suppressed.

[0034] As the conductive polymer, a π-conjugated conductive polymer is preferred in terms of good conductivity and easy availability. Specific conductive polymers include polypyrroles, polythiophenes, polyacetylenes, polyphenylenes, polyphenylene vinylenes, polyanilines, polyacenes, polythiophene vinylenes, and copolymers thereof. In terms of stability in air, polypyrroles, polythiophenes, and polyanilines are preferred.

[0035] Specific examples of π-conjugated conductive polymers include polypyrrole, poly(N-methylpyrrole), poly(3-methylpyrrole), poly(3-ethylpyrrole), poly(3-n-propylpyrrole), poly(3-butylpyrrole), poly(3-octylpyrrole), poly(3-decylpyrrole), poly(3-dodecylpyrrole), poly(3,4-dimethylpyrrole), poly(3,4-dibutylpyrrole), poly(3-carboxypyrrole), and poly(3-methyl-4-carboxypyrrole). pyrrole), poly(3-methyl-4-carboxyethylpyrrole), poly(3-methyl-4-carboxybutylpyrrole), poly(3-hydroxypyrrole), poly(3-methoxypyrrole), poly(3-ethoxypyrrole), poly(3-butoxypyrrole), poly(3-methyl-4-hexyloxypyrrole), poly(thiophene), poly(3-methylthiophene), poly(3-ethylthiophene), poly(3-propylthiophene), poly(3-butylthiophene) thiophene), poly(3-hexylthiophene), poly(3-heptylthiophene), poly(3-octylthiophene), poly(3-decylthiophene), poly(3-dodecylthiophene), poly(3-octadecylthiophene), poly(3-bromothiophene), poly(3-chlorothiophene), poly(3-iodothiophene), poly(3-cyanothiophene), poly(3-phenylthiophene), poly(3,4-dimethylthiophene), poly(3,4-dibutylthiophene). thiophene), poly(3-hydroxythiophene), poly(3-methoxythiophene), poly(3-ethoxythiophene), poly(3-butoxythiophene), poly(3-hexyloxythiophene), poly(3-heptyloxythiophene), poly(3-octyloxythiophene), poly(3-decyloxythiophene), poly(3-dodecyloxythiophene), poly(3-octadecyloxythiophene), poly(3-methyl-4-methoxythiophene), poly(3,4-ethylenedioxythiophene), poly(3-methyl-4-ethoxythiophene), poly(3-carboxythiophene), poly(3-methyl-4-carboxythiophene), poly(3-methyl-4-carboxyethylthiophene), poly(3-methyl-4-carboxybutylthiophene), polyaniline, poly(2-methylaniline), poly(3-isobutylaniline), poly(2-anilinesulfonic acid), poly(3-anilinesulfonic acid), etc.

[0036] The antistatic agent-containing heat seal layer may contain, in addition to the conductive polymer, a dopant for increasing the conductivity of the conductive polymer. Preferred examples of the dopant include polymers having anionic functional groups. Specific examples of polymers having anionic functional groups include polyvinyl sulfonic acid, polystyrene sulfonic acid, polyallyl sulfonic acid, polyacrylic sulfonic acid, polymethacrylic sulfonic acid, poly(2-acrylamido-2-methylpropanesulfonic acid), polyisoprene sulfonic acid, polyvinyl carboxylic acid, polystyrene carboxylic acid, polyallyl carboxylic acid, polyacrylic carboxylic acid, polymethacrylic carboxylic acid, poly(2-acrylamido-2-methylpropanecarboxylic acid), polyisoprene carboxylic acid, polyacrylic acid, etc. Among these, polystyrene sulfonic acid, polyacrylic sulfonic acid, and polymethacrylic sulfonic acid are preferred, with polystyrene sulfonic acid being particularly preferred.

[0037] Among conductive polymers, polythiophenes, i.e., conductive polymers containing a structure derived from thiophene or a thiophene derivative, are preferred from the viewpoints of good conductivity and heat resistance during heat sealing. As polythiophenes, poly(3,4-ethylenedioxythiophene) or its derivatives are particularly preferred from the viewpoints of maintaining and improving various performances.

[0038] Other examples of the antistatic agent that can be contained in the antistatic agent-containing heat seal layer include the following. - Materials containing lithium ions, such as lithium chloride, lithium fluoride, lithium bromide, lithium iodide, lithium perchlorate, lithium acetate, lithium fluorosulfonate, lithium methanesulfonate, lithium trifluoromethanesulfonate, and lithium pentafluoroethanesulfonate Polymers containing a polyether structure (for example, polyamide copolymers such as polyetheresteramide, block polymers of polyolefin and polyether, polymers consisting of polyethylene ether and glycol, etc.), carboxylate group-containing polymers such as potassium ionomers, quaternary ammonium group-containing copolymers, etc. Particles containing metal elements such as tin oxide, zinc oxide, and titanium oxide, especially metal oxide particles Conductive polymers such as polyethylenedioxythiophene / polystyrene sulfonate (PEDOT / PSS), polyacetylene, and polyaniline Conductive carbon

[0039] In one embodiment, the antistatic agent-containing heat seal layer does not contain inorganic particles, or if it does contain inorganic particles, the proportion of inorganic particles is 1% by mass or less of the entire heat seal layer. Since inorganic particles can function as antiblocking agents, the presence of inorganic particles in the antistatic agent-containing heat seal layer can sometimes prevent peeling of the layer. However, in this embodiment, by adopting traverse winding, peeling of the antistatic agent-containing heat seal layer can be prevented without relying on the antiblocking effect of inorganic particles.

[0040] The concentration of the antistatic agent (conductive polymer or the like) in the antistatic agent-containing heat seal layer is, for example, 3 to 50% by mass, and preferably 3 to 45% by mass. In this embodiment, even if the antistatic agent-containing heat seal layer is adhesive, for example, because it contains a relatively large amount of conductive polymer, the use of traverse winding prevents the antistatic agent-containing heat seal layer from peeling off during storage of the cover tape.

[0041] The antistatic agent-containing heat seal layer may or may not contain other additives such as a leveling agent and a conductive aid.

[0042] The antistatic agent-containing heat seal layer may have a single layer structure or a multi-layer structure. The thickness of the antistatic agent-containing heat seal layer is not particularly limited, but is preferably 0.01 to 15 μm, more preferably 0.02 to 12 μm, and even more preferably 0.02 to 10 μm.

[0043] The haze value of the cover tape (1), measured in accordance with JIS K 7136 (2000), is preferably 5 to 25%, more preferably 5 to 20%. When the haze value is not too high, the visibility of the electronic components packaged with the cover tape can be improved. The total light transmittance of the cover tape (1), measured in accordance with JIS K 7361-1 (1997), is preferably 80 to 100%, more preferably 85 to 95%.

[0044] The cover tape (1) comprising a substrate layer, an antistatic agent-containing heat seal layer, and preferably an intermediate layer can be produced, for example, as follows. First, an intermediate layer is formed on the surface of the substrate layer. The substrate layer is preferably a film formed from an ester-based resin, an olefin-based resin, or the like. The intermediate layer can be formed, for example, by extrusion lamination or dry lamination. In order to prevent peeling between the substrate layer and the intermediate layer, a layer made of, for example, an anchor coating agent may be present between the substrate layer and the intermediate layer.

[0045] Thereafter, a coating liquid for forming an antistatic agent-containing heat seal layer is applied to the surface of the intermediate layer opposite to the substrate layer and dried. For example, gravure coating can be used as the coating method, but other methods can also be used. The coating liquid here can typically be obtained by thoroughly mixing a resin (preferably a thermoplastic resin such as the above-mentioned styrene-based resin or (meth)acrylic resin), an antistatic agent such as a conductive polymer, and a solvent capable of dissolving or dispersing them.

[0046] To obtain a cover tape of the desired width, the laminate obtained as described above is cut. For example, a shear slitting method can be used. Cutting may also be performed by shear slitting.

[0047] The above has described a long cover tape for packaging electronic components, which includes (1) a base material layer and an antistatic agent-containing heat seal layer provided on one surface of the base material layer. Next, we will explain (2) a long cover tape for packaging electronic components, which comprises a base layer, a heat seal layer provided on one side of the base layer, and an antistatic agent-containing layer provided on the side of the heat seal layer opposite the base layer.

[0048] The specific embodiment of the base material layer in the cover tape (2) is the same as that of the cover tape (1). The cover tape (2) preferably includes an intermediate layer, the specific embodiment of which is the same as that of the cover tape (1). Furthermore, the specific embodiment of the heat seal layer in the cover tape (2) is the same as that of the cover tape (1), except that it does not need to contain an antistatic agent.

[0049] The antistatic agent-containing layer in the cover tape (2) typically contains a resin component and an antistatic agent. A preferred example of the resin component is a (meth)acrylic resin. Specific examples of the antistatic agent are as described for the cover tape (1). The thickness of the antistatic agent-containing layer in the cover tape (2) is preferably 0.01 to 15 μm, more preferably 0.02 to 12 μm, and even more preferably 0.02 to 10 μm.

[0050] The concentration of the antistatic agent (such as a conductive polymer) in the antistatic agent-containing layer is, for example, 3 to 50 mass %, preferably 5 to 45 mass %. In this embodiment, even if the antistatic agent-containing layer is adhesive because it contains a relatively large amount of conductive polymer, the adoption of traverse winding prevents the antistatic agent-containing heat seal layer from peeling off during storage of the cover tape.

[0051] In one embodiment, the antistatic agent-containing layer does not contain inorganic particles, or if it does contain inorganic particles, the proportion of inorganic particles in the entire layer is 1% by mass or less. Since inorganic particles can function as an antiblocking agent, the presence of inorganic particles in the antistatic agent-containing layer can prevent peeling of the layer. However, in this embodiment, by adopting traverse winding, peeling of the antistatic agent-containing layer can be prevented without relying on the antiblocking effect of inorganic particles.

[0052] The manufacturing method of the cover tape (2) can be the same as that of the cover tape (1). The heat seal layer can be provided by applying a coating liquid and drying it. The antistatic agent-containing layer can also be provided by applying an appropriate coating liquid and drying it.

[0053] (Core 10) The material and shape of the winding core 10 are not particularly limited as long as the cover tape 1 can be wound around it. Typically, the core 10 is made of a material such as paper or plastic. Typically, the cross section of the winding core 10 is circular, with a diameter of 1 to 6 inches. Although not shown in FIG. 1, the winding core 10 may be provided with disk-shaped plate portions (flanges) on both ends.

[0054] (Quantitative expression of antistatic effect) As already mentioned, in this embodiment, by adopting traverse winding, it is possible to suppress the deterioration of the antistatic effect of a cover tape containing an antistatic component for packaging electronic components, even after a certain amount of time has passed since production.

[0055] The phrase "the reduction in antistatic effect can be suppressed" can be quantitatively expressed as follows. The surface resistance of the antistatic agent-containing heat seal layer side of the cover tape (1) or the antistatic agent-containing layer side of the cover tape (2) immediately before traverse winding is defined as Ri, When the surface resistance of the antistatic agent-containing heat seal layer side of the cover tape (1) or the antistatic agent-containing layer side of the cover tape (2) after traverse winding and storing under conditions of 60°C and 10% RH or less for 1 hour is Rf, The value of Rf / Ri is preferably 100 or less, more preferably 80 or less.

[0056] In other words, it is preferable to select the material constituting the cover tape or adjust the specific conditions for traverse winding so that the Rf / Ri value is 100 or less.

[0057] (Specific method of traverse winding) The produced long cover tape 1 is traverse-wound around the winding core 10 to produce the cover tape wound product of this embodiment. In fields other than cover tape, methods for traverse winding long films and specific devices for doing so are well known. Therefore, the cover tape roll of this embodiment can be manufactured by appropriately utilizing known technology. A specific example of known technology is Japanese Patent No. 4241794. Of course, other known technology can also be referenced.

[0058] (Electronic component packaging) An electronic component package can be obtained from the cover tape (1) or (2) in the cover tape roll and the carrier tape having electronic components housed in recesses. This will be described with reference to FIG. 3.

[0059] In FIG. 3, the cover tape 1 is used as a lid material for a strip-shaped carrier tape 20 on which recessed pockets 21 are continuously provided to match the shapes of electronic components. Specifically, the cover tape 1 is adhered (usually heat sealed) to the surface of the carrier tape 20 so as to cover the entire opening of the pocket 21 of the carrier tape 20. Hereinafter, the structure obtained by adhering the cover tape 1 and the carrier tape 20 together will be referred to as the electronic component packaging body 100.

[0060] The electronic component packaging body 100 can be produced, for example, by the following procedure. First, electronic components are placed in the pockets 21 of the carrier tape 20 . Next, the cover tape 1 is adhered to the surface of the carrier tape 20 by a heat sealing method so as to cover the entire opening of the pocket 21 of the carrier tape 20. At this time, care is taken to ensure that the base layer side of the cover tape 1 faces outward. The specific method and conditions for heat sealing are not particularly limited as long as the cover tape 1 is sufficiently strongly adhered to the carrier tape 20. Typically, a known heat sealing machine is used, and the heat sealing can be carried out at a temperature of 100 to 240°C, a load of 0.1 to 10 kgf, and a time of 0.0001 to 1 second.

[0061] In this way, a structure (electronic component packaging body 100) in which electronic components are hermetically housed is obtained. This structure (electronic component packaging 100) is, for example, wound on a reel and stored until the electronic component is to be used. Alternatively, the reel on which the electronic component packaging 100 is wound may be transported to a remote location by sea or air. The reel may be made of metal, paper, plastic, or the like.

[0062] When using the electronic component, the cover tape 1 is peeled off from the carrier tape 20, and the housed electronic component is taken out. There are no particular limitations on the electronic components housed in the electronic component packaging 100. Examples include general components used in the manufacture of electrical and electronic devices, such as semiconductor chips, transistors, diodes, capacitors, piezoelectric elements, optical elements, LED-related members, connectors, and electrodes.

[0063] Although the embodiments of the present invention have been described above, these are merely examples of the present invention, and various other configurations may be adopted. Furthermore, the present invention is not limited to the above-described embodiments, and modifications and improvements within the scope of achieving the object of the present invention are included in the present invention. [Example]

[0064] The embodiments of the present invention will be described in detail based on Examples and Comparative Examples. However, it should be noted that the present invention is not limited to the Examples. In the following, exponential notation may be indicated by the symbol "E." For example, 1.3.E+06 is 1.3 x 10 6 means.

[0065] <Cover tape manufacturing> An anchor coating agent was applied to a 12 μm thick antistatic polyethylene terephthalate (PET) film ("E7455" manufactured by Toyobo Co., Ltd.) by gravure coating to a wet thickness of 4 μm, and then dried at 100°C. Thereafter, low-density polyethylene (LDPE, "Sumikathen L705" manufactured by Sumitomo Chemical Co., Ltd.) was extrusion laminated and cooled with a cooling roll (surface temperature 20°C) to provide an intermediate layer with a thickness of 37 µm. In this way, a laminated film consisting of a substrate layer and an intermediate layer was produced.

[0066] A coating solution (non-volatile component concentration adjusted to 12.5% ​​by mass) prepared by thoroughly dissolving or dispersing the materials shown in the "Antistatic Agent-Containing Sealant Layer" column in Table 1 in methyl ethyl ketone was applied by gravure coating onto the intermediate layer side of the obtained laminated film, forming a dry film (antistatic agent-containing sealant layer) with a thickness of 0.5 μm.

[0067] The resulting three-layer film was cut into a width of 5.5 mm to form a cover tape.

[0068] The resulting cover tape was traverse-wound around a 6-inch paper core using a traverse winding machine, with a portion of the cover tape overlapping the other, as shown in Figure 1(C). The width of the overlapping portion was approximately 50% of the width of the cover tape.

[0069] In this manner, a cover tape roll was produced.

[0070] <Evaluation> (Changes in antistatic properties over time) The change in antistatic property over time was evaluated using a surface resistance measuring instrument (PRS-801B) manufactured by PROSTAT, according to the following procedure. (1) The surface resistance value Ri of the cover tape on the side of the heat seal layer containing the antistatic agent before being wound around the core was measured. (2) After traverse winding on a core, the cover tape was stored for 1 hour under conditions of 60°C and 10% RH or less, and the surface resistance value Rf of the heat seal layer side containing the antistatic agent was measured. (3) The value of Rf / Ri was calculated.

[0071] For reference, the cover tape was wound on a record instead of being wound traversely, and stored at 60°C and 10% RH or less for 1 hour. The surface resistance Rf' of the heat seal layer containing the antistatic agent was also measured. The value of Rf' / Ri was then calculated.

[0072] (Confirming the basic performance of the cover tape itself) To be sure, the manufactured cover tape was evaluated as follows to confirm that it had the basic performance required for a cover tape.

[0073] Peel strength The side of the cover tape containing the antistatic agent-containing sealant layer was aligned with the uneven surface side of a polystyrene film ("CEL-E980A" manufactured by Sumitomo Bakelite Co., Ltd.) measuring 8 mm in width and having an average surface roughness (Ra) of 0.25 μm on the uneven surface side, to obtain a laminate. This laminate was heat-sealed using a two-blade iron (one blade 0.4 mm wide and 28 mm long) under the following conditions: sealing temperature 180°C, load 5 kgf, sealing time 60 ms, carrier tape feed pitch 4 mm, 2 rows x 7 strikes, using a heat sealer (Tokyo Wells Co., Ltd., "TWA-6621") to obtain Sample A. Using Sample A, the peel strength (N) immediately after heat sealing of the cover tape to the polystyrene film was measured, referring to the description of JIS C0806-3. Specifically, peeling was performed using a peel tester (EPI "PTS-5000") at 25°C, a peel rate of 300 mm / min, and a peel angle of 170°, and the peel strength was continuously recorded. The average peel strength for 10 seconds immediately after the start of peeling was calculated from the relationship between the recorded time and peel strength. This average value was taken as the peel strength.

[0074] ·Total light transmittance The total light transmittance (%) of the cover tape was measured in accordance with JIS K 7361-1 (1997) using a Haze Meter NDH 2000 manufactured by Nippon Denshoku Kogyo Co., Ltd. under light source D65.

[0075] Hayes The haze (external haze, %) of the cover tape was measured in accordance with JIS K 7136 (2000) using a Haze Meter NDH 2000 manufactured by Nippon Denshoku Kogyo Co., Ltd. under a light source of D65.

[0076] Various information is summarized in Table 1. The materials listed in the "Antistatic Agent-Containing Sealant Layer" column of Table 1 are as follows: The values ​​listed in the "Antistatic Agent-Containing Sealant Layer" column represent the ratio of each component in the non-volatile components of the coating liquid used to form the sealant layer. Resin 1: Acrylic resin, adhesive resin manufactured by DIC Corporation, Part number: A450A Conductive polymer 1: A conductive polymer soluble in organic solvents, polythiophene resin CPA-24 manufactured by Kleba Corporation

[0077] [Table 1]

[0078] As shown in Table 1, by traverse-wrapping the cover tape containing the antistatic agent, the deterioration of the antistatic effect of the cover tape was suppressed even over time after production, compared to when it was wrapped around a record. [Explanation of symbols]

[0079] 1 cover tape 10 Winding core 15 Gap 20 Carrier tape 21 pockets 100 Electronic component packaging body

Claims

1. A cover tape roll in which the cover tape for packaging electronic components according to (1) or (2) below is traverse-wound. (1) A long cover tape for packaging electronic components, comprising a base layer and an antistatic agent-containing heat seal layer provided on one side of the base layer. (2) A long cover tape for packaging electronic components, comprising: a base layer; a heat seal layer provided on one side of the base layer; and an antistatic agent-containing layer provided on the heat seal layer on the side opposite to the base layer.

2. 2. The cover tape roll according to claim 1, A cover tape roll, wherein the antistatic agent comprises a conductive polymer.

3. The cover tape roll according to claim 1 or 2, A cover tape roll, in which the concentration of the antistatic agent in the antistatic agent-containing heat seal layer of the cover tape of (1) is 3 to 50 mass %, or the concentration of the antistatic agent in the antistatic agent-containing layer of the cover tape of (2) is 3 to 50 mass %.

4. The cover tape roll according to claim 1 or 2, A cover tape roll in which the antistatic agent-containing heat seal layer in the cover tape of (1) does not contain inorganic particles, or if it does contain inorganic particles, the proportion of inorganic particles is 1% by mass or less of the entire heat seal layer, or the antistatic agent-containing layer in the cover tape of (2) does not contain inorganic particles, or if it does contain inorganic particles, the proportion of inorganic particles is 1% by mass or less of the entire antistatic agent-containing layer.

5. The cover tape roll according to claim 1 or 2, A cover tape roll in which the antistatic agent-containing heat seal layer in the cover tape of (1) or the antistatic agent-containing layer in the cover tape of (2) is formed by applying a coating liquid and drying it.

6. The cover tape roll according to claim 1 or 2, A cover tape roll, in which the thickness of the antistatic agent-containing heat seal layer in the cover tape of (1) is 0.01 to 15 μm, or the thickness of the antistatic agent-containing layer in the cover tape of (2) is 0.01 to 15 μm.

7. The cover tape roll according to claim 1 or 2, A cover tape roll, wherein the width of the cover tape of (1) or (2) is 2 to 10 mm.

8. The cover tape roll according to claim 1 or 2, The surface resistance value of the heat seal layer side of the cover tape (1) or the antistatic agent-containing layer side of the cover tape (2) immediately before traverse winding is defined as Ri, When the surface resistance value of the heat seal layer side of the cover tape (1) or the antistatic agent-containing layer side of the cover tape (2) that has been traverse-wound and stored under conditions of 60°C and 10% RH or less for 1 hour is Rf, A roll of cover tape having an Rf / Ri value of 100 or less.

9. The cover tape roll according to claim 1 or 2, The cover tapes in the cover tape roll are partially overlapped within the same layer.

10. a carrier tape containing electronic components; The cover tape (1) or (2) in the cover tape winding product according to claim 1 or 2, which is adhered to the carrier tape so as to seal the electronic component; An electronic component packaging body comprising:

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