Coating device

Abstract

To enhance the versatility of a coating device that coats a processing liquid through relative movement of a slit nozzle that discharges the processing liquid along an upper surface of a substrate held by a holding unit and applies maintenance processing to the slit nozzle.SOLUTION: A pair of guide rails for moving a first bridging structure to which a first maintenance unit and a first slit nozzle are attached, in a first horizontal direction is mounted on a base. In contrast, a holding unit is independent of the pair of guide rails, the first bridging structure, and the first maintenance unit, and is detachably mounted on the base. Therefore, even if the holding unit differs according to the substrate size, it is possible to apply a processing liquid onto a substrate after a change by replacing only the holding unit in accordance with the change in the substrate size. In other words, the processing liquid can be applied to the substrates of different sizes only by replacing the holding unit.SELECTED DRAWING: Figure 2A

Description

[Technical Field]

[0001] The present invention relates to a coating device that supplies a treatment liquid from a slit nozzle to and coats a substrate for precision electronic devices, such as a glass substrate for FPDs (liquid crystal display devices, organic EL display devices, etc.), a semiconductor wafer, a glass substrate for photomasks, a substrate for color filters, a substrate for recording disks, a substrate for solar cells, a substrate for electronic paper, etc., and a substrate for semiconductor packages (hereinafter simply referred to as "substrate"). [Background technology]

[0002] As an example of a substrate processing apparatus, there is known a coating apparatus that coats a substrate with a processing liquid by discharging a processing liquid from a slit nozzle having a slit-shaped discharge port while moving the slit nozzle relative to the substrate. For example, in the apparatus described in Patent Document 1, the slit nozzle is moved above the stage surface while the substrate is held on the stage surface, and the processing liquid is coated on the substrate.

[0003] This substrate processing apparatus (coating apparatus) is provided with a stage that functions as a holding unit for placing and holding a substrate. The stage is, for example, rectangular and made of a single piece of stone. The top surface of the stage is machined into a flat surface and functions as a holding surface for the substrate. A pair of guide rails extending parallel to each other in a substantially horizontal direction are fixed to both ends of the holding surface, sandwiching the substrate holding area. A gantry unit with a bridge structure is movable along the guide rails. A slit nozzle is attached to the gantry unit. As the gantry unit moves, the slit nozzle scans the surface of the substrate and supplies the processing liquid supplied by the supply mechanism to the upper surface of the substrate. In addition, the stage is provided with maintenance units (cleaning liquid discharge mechanism + waiting pot + pre-coating mechanism) for maintaining the slit nozzle on both sides of the holding area in the direction of movement of the slit nozzle. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2005-230807 Summary of the Invention [Problem to be solved by the invention]

[0005] As described above, in conventional devices, a pair of guide rails and a maintenance unit are provided for a holder for placing and holding a substrate. Therefore, when there is a change in the substrate size or a change in the maintenance processing specifications, it is necessary to replace the entire holder, including the pair of guide rails and the maintenance unit. As a result, there is room for improvement in versatility.

[0006] The present invention has been made in consideration of the above-mentioned problems, and aims to improve the versatility of an application device that applies a processing liquid by moving a slit nozzle that ejects a processing liquid relatively along the upper surface of a substrate held in a holding part, and that performs maintenance processing on the slit nozzle. [Means for solving the problem]

[0007] a pair of guide rails attached to the upper surface of the base so as to sandwich the holder installation area and the first adjacent area in a second horizontal direction perpendicular to the first horizontal direction; a first bridge structure provided between the pair of guide rails and movable in the first horizontal direction between above the holder installation area and above the first adjacent area; a first slit nozzle attached to the first bridge structure so as to be able to eject a first coating liquid from a first slit-shaped ejection outlet toward a substrate held on the upper surface of the holder; a drive unit that drives the first bridge structure along the pair of guide rails; and a first maintenance unit attached to the base in the first adjacent area and configured to perform a first maintenance process on the first slit nozzle.

[0008] In the invention configured as described above, a pair of guide rails for moving the first bridge structure, to which the first maintenance unit and the first slit nozzle are attached, in the first horizontal direction are attached to a base. In contrast, the holding unit is independent of the pair of guide rails, the first bridge structure, and the first maintenance unit, and is detachable from the base. Therefore, even if the holding unit differs depending on the substrate size, simply replacing the holding unit as the substrate size changes makes it possible to apply the treatment liquid to the changed substrate. In other words, simply replacing the holding unit makes it possible to apply the treatment liquid to substrates of different sizes. [Effects of the Invention]

[0009] As described above, according to the present invention, a coating apparatus that can coat a processing liquid onto each substrate while dealing with substrates of different sizes with a small amount of work, that is, a coating apparatus that has high versatility, can be obtained. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a perspective view schematically illustrating an embodiment of a coating device according to the present invention. [Figure 2A] 2 is a diagram schematically showing the positional relationship between a base, a coating mechanism, a substrate holding mechanism, and a maintenance mechanism in the coating apparatus shown in FIG. 1. FIG. [Figure 2B] 2B is a partial plan view of the coating device of FIG. 2A as viewed from above. FIG. [Figure 3A] FIG. 2 is a plan view of a substrate holding mechanism for a large substrate, as viewed from above. [Figure 3B] FIG. 2 is a plan view of a substrate holding mechanism for small substrates, as viewed from above. [Figure 4] FIG. 2 is a diagram schematically illustrating the configuration of a substrate holding mechanism. [Figure 5] 2 is a flowchart showing an example of a substrate holding process in the coating apparatus of FIG. [Figure 6] 10 is a flowchart showing a procedure for provisionally straightening a substrate by a substrate holding mechanism. [Figure 7] 10 is a flowchart showing a replacement process executed in the coating apparatus shown in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0011] FIG. 1 is a perspective view showing a schematic diagram of one embodiment of a coating apparatus according to the present invention. To clarify the directional relationships between FIG. 1 and the following figures, an XYZ Cartesian coordinate system is appropriately used, with the Z direction defined as the vertical direction and the XY plane defined as the horizontal plane. In the direction Y of movement of the slit nozzle 2, which will be described later, the upstream side corresponds to the (-Y) side, and the downstream side corresponds to the (+Y) side. Furthermore, in each figure, the dimensions and number of each part are exaggerated or simplified as necessary.

[0012] The coating apparatus 1 includes a base 100 made of cast metal, a coating mechanism that performs a coating process using a slit nozzle 2, a substrate holding mechanism equipped with a stage 3 corresponding to an example of the "holding unit" of the present invention, a maintenance mechanism having various maintenance units 6 for performing maintenance processes on the slit nozzle 2, and a control unit 200 that controls each of these components. The control unit 200 controls each component of the coating apparatus 1. As a result, while the substrate S is held by the stage 3 of the substrate holding mechanism, the slit nozzle 2 moves relative to the substrate S in the Y direction, thereby coating the surface Sa of the substrate S with a processing liquid. In other words, the coating apparatus 1 is a device called a slit coater. The processing liquid can be, for example, a photoresist liquid, a color filter pigment, a polyimide precursor, a silicone agent, nanometal ink, or various paste-like or slurry-like processing liquids containing conductive materials. The substrate S is a glass substrate that is rectangular in plan view. Furthermore, the substrate S to be coated can be a variety of substrates, such as rectangular glass substrates, semiconductor substrates, flexible substrates for film liquid crystal displays, substrates for photomasks, substrates for color filters, substrates for solar cells, substrates for organic EL (ElectroLuminescence), and substrates for semiconductor packages. In this specification, the "surface Sa of the substrate S" refers to the main surface of the substrate S that is coated with the treatment liquid, out of the two main surfaces of the substrate S. In this embodiment, the coating process is performed with the surface Sa of the substrate S facing upward, and the "surface Sa of the substrate S" corresponds to the "upper surface of the substrate" of the present invention.

[0013] Fig. 2A is a diagram schematically illustrating the relative positions of the base, coating processing mechanism, substrate holding mechanism, and maintenance mechanism in the coating apparatus shown in Fig. 1. Fig. 2B is a partial plan view of the coating apparatus of Fig. 2A viewed from above. In this embodiment, a holder installation area 101, an upstream adjacent area 102, a downstream adjacent area 103, and a rail area 104 are provided on the upper surface of the base 100.

[0014] The holder installation area 101 is located in the center of the top surface of the base 100, and the stage 3 of the substrate holding mechanism is detachably attached to the holder installation area 101. In the following, the configuration and operation of the substrate holding mechanism will be explained first, and then the coating process mechanism and maintenance mechanism will be described in detail.

[0015] As shown in FIG. 2B , the holder installation area 101 has an opening for raising and lowering four lift pins, which will be described later. The adjustment unit 33 and the transport fixation unit 34 are alternately arranged around the opening. The adjustment unit 33 has a support member 331 that supports the stage 3 from below and a screw member 332 that is rotated by an operator about a rotation axis extending in the vertical direction Z to raise and lower the support member 331. Similarly to the adjustment unit 33, the transport fixation unit 34 not only has a support member 341 that supports the stage 3 from below and a screw member 342 that is rotated by an operator about a rotation axis extending in the vertical direction Z to raise and lower the support member 341, but also has an additional fixing bolt 343. As will be described next, the transport fixation unit 34 is switchable between a transport fixation mode and a release mode.

[0016] The bolt 343 has a shaft portion that can be freely inserted into a fixing through-hole 35 ( FIG. 2A ) provided on the periphery of the stage 3. When transporting the coating apparatus 1, as shown by the dashed line in FIG. 2A , the shaft portion of the bolt 343 is inserted into the fixing through-hole 35 from above with respect to the stage 3 supported by the support member 341, and the male screw portion (not shown) is screwed into the female screw portion formed in the support member 341. As a result, the stage 3 is sandwiched between the head of the bolt 343 and the support member 341 and fixed (transportation fixed mode). As a result, it is possible to reliably prevent problems such as damage to the stage 3 during transportation of the apparatus.

[0017] After the coating apparatus 1 is transported to a factory, the bolts 343 are removed by an operator, and the stage 3 is released from the base 100 (release mode). The operator operates the screw members 332, 342, thereby adjusting the height position and horizontality of the stage 3 with high precision. In this embodiment, the stage adjustment is performed using the adjustment unit 33 and the transportation fixing unit 34 after the bolts are removed, but the stage adjustment may be performed using only the adjustment unit 33.

[0018] Furthermore, in this embodiment, the transportation fixing portion 34 fixes the stage 3 by fastening bolts, but other mechanical methods, such as clamping the periphery of the stage 3, may also be used.

[0019] 3A and 3B are plan views of the substrate holding mechanism as seen from above. FIG. 4 is a diagram showing a schematic configuration of the substrate holding mechanism. The substrate holding mechanism shown in FIG. 3A is compatible with a large-sized substrate S, and the substrate holding mechanism shown in FIG. 3B is compatible with a small-sized substrate S. While the planar size of the stage 3 is the same in these mechanisms, the other components differ in terms of arrangement and size depending on the substrate size, but the shapes and functions are basically the same.

[0020] The stage 3 is a stone surface plate or the like, the flatness of which is on the order of several micrometers for the upper surface, i.e., the mounting surface 31 on which the substrate S is placed. The central portion of the mounting surface 31 functions as a substrate mounting area on which the substrate S can be placed. In the substrate mounting area, lattice-shaped suction grooves 312 are provided corresponding to the effective area of ​​the substrate S. Here, the effective area of ​​the substrate S refers to the area in the central portion of the upper surface of the substrate S where multiple elements are provided. For example, in the case of a semiconductor package, the substrate S corresponds to a rectangular glass substrate, and the multiple elements correspond to multiple semiconductor chips stacked and arranged in the central portion of the upper surface of the glass substrate, as well as the wiring between the chips. When the substrate S is placed on the substrate mounting area, the effective area is located above the center of the substrate mounting area. In the central portion of the substrate mounting area, suction grooves 312 are engraved in a lattice pattern as shown in FIG. 2 so that the effective area of ​​the substrate S can be firmly suction-held by the mounting surface 31. That is, grooves are provided at a certain depth from the mounting surface 31 in the X and Y directions, and at some of the points where the grooves intersect, through holes 313 are drilled in the Z direction, connecting the intersections to the underside 32 of the stage 3.

[0021] As shown in FIG. 4 , each through-hole 313 is connected to a negative pressure generator 7. The negative pressure generator 7 has a suction pipe 71, a suction source 72, and an on-off valve 73. More specifically, the suction source 72 is connected to the through-hole 313 via the suction pipe 71. The suction source 72 may be, for example, a vacuum pump, or a utility power source in a factory where the coating apparatus 1 is installed. The on-off valve 73 is inserted in the suction pipe 71. The on-off valve 73 closes in response to a close command from the control unit 200, thereby stopping the supply of negative pressure to the through-hole 313. On the other hand, the on-off valve 73 opens in response to an open command from the control unit 200, thereby supplying negative pressure to the through-hole 313. That is, as will be described later, after the substrate S is placed in the substrate placement area, when the on-off valve 73 opens in response to an open command from the control unit 200, negative pressure is supplied to the through-hole 313. As a result, air is discharged from the space between the lower surface of the effective area of ​​the substrate S and the mounting surface 31 through the suction grooves 312 and the through-holes 313, and the substrate S is suction-held on the mounting surface 31. Note that the manner in which the substrate S is held is not limited to this, and the substrate S may be held mechanically, for example.

[0022] To enable the transfer of the substrate S to the stage 3 configured as described above, an elevator unit is provided corresponding to the holder installation area 101 of the base 100. The elevator unit includes a plurality of lift pins 75 arranged to be raised and lowered through an opening provided in the center of the holder installation area 101, and a lift pin driver 76. The stage 3 is provided with a plurality of pin storage holes 315 extending parallel to the Z direction and opening into the mounting surface 31, and a lift pin 75 is stored in each pin storage hole 315. Each lift pin 75 has a pin shape extending parallel to the Z direction, and the control unit 200, which controls the entire apparatus, issues an elevation command to the lift pin driver 76 to raise and lower the lift pin 75. This causes the lift pin 75 to advance and retreat relative to the pin storage hole 315. The lift pins 75 rise until their tips reach a predetermined height position as shown in FIG. 4, enabling the transfer of the substrate S to and from a robot (not shown). In other words, this height position corresponds to an example of a transfer position for the substrate S. For example, when the robot transports the substrate S above the stage 3, the multiple lift pins 75, which have been raised by the drive of the lift pin drive unit 76, protrude from the pin storage holes 315 above the mounting surface 31 and receive the substrate S at their respective upper ends. Subsequently, the multiple lift pins 75 are driven by the lift pin drive unit 76 to descend and fit into the pin storage holes 315, whereby the substrate S is placed on the mounting surface 31 from the upper ends of the multiple lift pins 75. When lifting the substrate S from the mounting surface 31, the multiple lift pins 75 are driven by the lift pin drive unit 76 to rise and protrude from the pin storage holes 315 above the mounting surface 31.

[0023] In this embodiment, a positioning unit 8 is provided to horizontally position the substrate S before coating processing, which has been transferred from the robot onto the plurality of lift pins 75. Furthermore, a pressing unit 9 is provided to perform warpage correction processing to correct warpage of the substrate S simultaneously with, before, or after the positioning processing.

[0024] In this embodiment, the positioning unit 8 and the pressing unit 9 have the same configurations as the position adjustment mechanism and pressing mechanism described in JP 2017-112197 A. In the following, detailed descriptions of the positioning unit 8 and the pressing unit 9 will be omitted, and their general configurations will be described with reference to Figures 3A, 3B, and 4.

[0025] The positioning unit 8 has a total of eight position adjustment means 81, two of which are arranged on each side of the mounting surface 31. Each position adjustment means 81 has pin-shaped alignment pins 82 extending parallel to the Z direction. In other words, two alignment pins 82 are arranged on each side of the stage 3. The alignment pins 82 are arranged above the mounting surface 31 and are horizontally movable between the space above the stage 3 and a space separated from the upper space and outside the stage. Moreover, when the substrate S is positioned at the positioning position, the alignment pins 82 face the edge face of the substrate S in the horizontal direction.

[0026] An alignment pin drive unit 83 is connected to the alignment pin 82 configured in this manner. When the alignment pin drive unit 83 operates in response to a positioning command from the control unit 200, the alignment pin 82, which has been positioned at the retracted position, moves horizontally toward the substrate S at the positioning position and abuts against the edge surface of the substrate S. This positions the substrate S at a predetermined position in the horizontal direction (alignment process). After this alignment process, when a retraction command is given to the alignment pin drive unit 83 from the control unit 200, the alignment pin 82 moves away from the substrate S and returns to the retracted position.

[0027] The pressing unit 9 has a total of four pressing means 91, one on each side of the mounting surface 31, and each pressing means 91 has a pressing member 92 extending along the corresponding side of the mounting surface 31. Each pressing member 92 is movable between a standby position, a temporary correction position, and a final correction position. The standby position refers to the position of the pressing member 92 when the substrate S is being loaded or unloaded, when the substrate S is waiting to be loaded, and during the coating process. As shown in FIGS. 3A and 3B, while the pressing member 92 is in the standby position, it does not interfere with the substrate S being loaded or unloaded, allowing the substrate S to be loaded or unloaded smoothly. Furthermore, during the coating process, it is separated from the substrate S and does not interfere with the slit nozzle 2, allowing the coating process to be performed smoothly.

[0028] The temporary correction position refers to a position where the peripheral edge of the substrate S located at the positioning position is pressed from above. That is, at this temporary correction position, the lower surface of the pressing member 92 covers the peripheral edge of the substrate S from above, and the substrate S is located at the positioning position in the vertical direction Z. As a result, if the peripheral edge of the substrate S located at the positioning position has a shape that curves upward, that is, if the substrate S has a concave shape, the pressing member 92 presses the peripheral edge of the substrate S from above at the temporary correction position to correct the warpage of the substrate S (temporary correction process). As a result, even if the peripheral edge of the substrate S is curved upward when the substrate is carried in, the substrate S that has undergone temporary correction is supported at the positioning position by the multiple lift pins 75 with its end face facing the side of the alignment pin 82. Therefore, the positioning process can be performed stably. Furthermore, the alignment pin 82 and the pressing member 92 abut against the substrate S during the positioning process. 3A and 3B, in this embodiment, the contact position where the alignment pin 82 contacts the edge surface of the substrate S and the pressing position where the pressing member 92 presses the peripheral edge portion of the substrate S are configured to be different from each other in the circumferential direction of the substrate S. As a result, it is possible to smoothly perform the temporary correction process and the positioning process at the positioning position.

[0029] The main correction position means a position where the peripheral edge of the substrate S placed on the placement surface 31 is pressed from above. That is, at the main correction position, the lower surface of the pressing member 92 and the placement surface 31 sandwich the peripheral edge of the substrate S, and the warpage of the substrate S is corrected (main correction process).

[0030] Each pressing member 92 is connected to a pressing drive unit 93. When the pressing drive unit 93 operates in response to a command from the control unit 200, the pressing member 92 moves from the standby position to the temporary correction position and the main correction position, and then returns to the standby position. A substrate holding operation including this series of pressing movement operations is performed for each substrate S, as will be described next.

[0031] FIG. 5 is a flowchart showing an example of a substrate holding process in the coating apparatus of FIG. 1. FIG. 6 is a flowchart showing a procedure for temporary correction of a substrate by the substrate holding mechanism. In step S101, the pressing members 92 provided corresponding to each of the four sides of the mounting surface 31 move to a standby position and wait there. That is, the pressing members 92 move to a non-interference position that is higher than the delivery position and outside the substrate S transported by a robot (not shown), and wait there. Then, in the next step S102, each alignment pin 82 is positioned in the separation space. Also, the upper ends of the lift pins 75 are accommodated in the pin storage holes 315. When the robot transports the substrate S above the mounting surface 31, each lift pin 75 rises from the pin storage holes 315, and the upper ends of each lift pin 75 make point contact with the substrate S at the delivery position (step S103), and each lift pin 75 receives the substrate S from the robot (step S104).

[0032] The lift pins 75 are then lowered until their upper ends are positioned at the positioning positions. As a result, the substrate S is moved to the positioning position with its lower surface supported by the lift pins 75 from below (step S105). In other words, the center of the substrate S in the vertical direction Z is approximately aligned with the positioning position. On the other hand, the peripheral edge of the substrate S does not necessarily coincide with the positioning position. For example, if the peripheral edge of the loaded substrate S is warped upward, the edge of the substrate S in the vertical direction Z may be higher than the positioning position. Furthermore, the distance from the positioning position is proportional to the degree of warping of the substrate S. Here, for example, if the amount of warping of the substrate S increases, the edge of the substrate S may be higher than the upper ends of the alignment pins 82. In this case, when the alignment pins 82 are moved horizontally toward the substrate, the alignment pins 82 come into direct contact with the lower surface of the substrate S, not the edge of the substrate S. This significantly reduces the positioning accuracy of the substrate S in the horizontal direction.

[0033] Therefore, in this embodiment, a temporary correction process for the substrate S shown in FIG. 6 is performed (step S106). That is, the four pressing members 92 move horizontally toward the substrate and are positioned directly above the corresponding sides of the substrate S (step S201). Subsequently, each pressing member 92 descends to a positioning position (step S202). At this time, if the peripheral edge of the substrate S is warped upward, the pressing members 92 descending to the positioning position press the warped peripheral edge of the substrate S downward, thereby correcting the warpage of the substrate S to some extent. As a result, the height of the peripheral edge of the substrate S is approximately at the positioning position and is lower than the upper ends of the alignment pins 82. As a result, the side surfaces of the alignment pins 82 face the edge surfaces of the substrate S in the horizontal direction.

[0034] When the temporary correction of the substrate S is completed, the alignment pins 82 move horizontally toward the substrate S at the positioning position, and position the substrate S at a predetermined position in the horizontal direction (step S107: positioning process). Then, after the positioning process, the alignment pins 82 move away from the substrate S and return to their original retracted positions.

[0035] Subsequently, the descent of the lift pins 75 is resumed (step S108). As a result, the substrate S is lowered toward the stage 3 while being supported by the lift pins 75. In synchronization with this, the pressing member 92 also descends toward the stage 3 (step S109). In other words, if the substrate S being lowered has been subjected to the temporary correction process in step S106, the substrate S descends while still in the temporarily corrected state.

[0036] As the lift pins 75 are further lowered, the upper ends of the lift pins 75 fit into the pin storage holes 315. As a result, the substrate S is placed on the placement surface 31 from the upper ends of the lift pins 75 (step S110). The pressing member 92 also presses the peripheral portion of the substrate S against the placement surface 31, thereby correcting the shape of the substrate S to match the shape of the placement surface 31. In this manner, in this embodiment, the substrate S is placed on the placement surface 31 while this correction process is being performed. Then, the air suction unit sucks air through the air holes, thereby adsorbing the substrate S to the placement surface 31 (step S111). As a result, the substrate S is fixed to the placement surface 31. Subsequently, the pressing member 92 returns to its original standby position. As a result, the substrate holding process is completed. Thereafter, the coating process is performed by the slit nozzle 2 of the coating process mechanism.

[0037] Next, the configurations of the coating processing mechanism and the maintenance mechanism will be described. In the coating processing mechanism, two coating processing units 5 having the same structure are provided for one substrate holding mechanism. When it is necessary to particularly distinguish between the two coating processing units 5, the coating processing unit 5 on the (-Y) side will be given the symbol 5a, and the coating processing unit 5 on the (+Y) side will be given the symbol 5b. Correspondingly, the nozzle 2 provided in the coating processing unit 5a will be given the symbol 2a, and the nozzle 2 provided in the coating processing unit 5b will be given the symbol 2b.

[0038] Furthermore, one set of maintenance units 6 is provided for each of the two nozzles 2a, 2b, and when it is necessary to distinguish between them, the one provided on the (-Y) side that performs maintenance on nozzle 2a is denoted by reference symbol 6a, and the one provided on the (+Y) side that performs maintenance on nozzle 2b is denoted by reference symbol 6b. These maintenance units 6a, 6b are arranged in the upstream adjacent region 102 and the downstream adjacent region 103, respectively. The configuration of the maintenance units 6a, 6b will be described in detail after the configuration of the coating processing unit 5 is described.

[0039] 1 and 2B, the stage 3 has rail areas 104, 104 extending in the Y direction. The rail areas 104, 104 are provided so as to sandwich the holder installation area 101, the upstream adjacent area 102, and the downstream adjacent area 103 in the horizontal direction X. A guide rail 52 is provided on each rail area 104.

[0040] Returning to Figure 1, the lower end (nozzle lip) of the slit nozzle 2 (2a, 2b) has a shape that tapers downward. A slit-shaped discharge port 21 is provided on the underside of the lower end, extending in the X direction, and the processing liquid pressure-fed from a processing liquid supply unit (not shown) is discharged from the discharge port 21 onto the surface Sa of the substrate S. In this way, the processing liquid is applied to the surface Sa of the substrate S. The processing liquid discharged from the discharge port 21 of the slit nozzle 2a corresponds to the "first processing liquid" of the present invention, and the processing liquid discharged from the discharge port 21 of the slit nozzle 2b corresponds to the "second processing liquid" of the present invention.

[0041] The coating processing unit 5 (5a, 5b) has a nozzle support 51 that supports the slit nozzle 2 (2a, 2b). This nozzle support 51 has a support member 511 extending parallel to the X direction above the stage 3, and two elevating mechanisms 512, 512 that support the support member 511 from both sides in the X direction and raise and lower the support member 511. The support member 511 is a rod member made of, for example, carbon fiber reinforced resin and has a rectangular cross section. The support member 511 detachably supports the slit nozzle 2 on its underside. Note that various fastening mechanisms such as latches or screws can be used as appropriate as a mechanism for attaching and detaching the slit nozzle 2 to the support member 511.

[0042] The two lifting mechanisms 512, 512 are connected to both longitudinal ends of the support member 511, and each has an AC servo motor and a ball screw, etc. These lifting mechanisms 512, 512 raise and lower the support member 511 and the slit nozzle 2 fixed thereto in the vertical direction (Z direction), adjusting the distance between the discharge outlet 21 opening at the bottom end of the slit nozzle 2 and the substrate S, i.e., the relative height of the discharge outlet 21 with respect to the substrate S. The vertical position of the support member 511 can be detected, for example, by a linear encoder (not shown) composed of a scale unit provided on the side of the lifting mechanism 512 and a detection sensor provided on the side of the slit nozzle 2 facing the scale unit.

[0043] As shown in FIG. 1, the nozzle support 51 configured in this manner has a bridge structure spanning the stage 3, spanning both ends of the stage 3 in the X direction. The coating processing unit 5 has a slit nozzle moving unit 53 that moves the nozzle support 51 in the Y direction. The slit nozzle moving unit 53 functions as a relative moving means that moves the nozzle support 51 as a bridge structure and the slit nozzle 2 supported thereby along the Y direction relative to the substrate S held on the stage 3. Specifically, the slit nozzle moving unit 53 has, on each of the ±X sides, guide rails 52 that guide the movement of the slit nozzle 2 in the Y direction, a linear motor 54 that serves as a drive source, and a linear encoder 55 that detects the position of the discharge port of the slit nozzle 2.

[0044] 1 and 2B, the pair of guide rails 52, 52 are provided on the ±X sides of the stage 3 and the maintenance units 6a, 6b, respectively. More specifically, they extend parallel to each other in the Y direction so as to include the section where the stage 3 and the maintenance units 6a, 6b are provided (= holder installation area 101 + upstream adjacent area 102 + downstream adjacent area 103).

[0045] The two guide rails 52 each guide the movement of the two lifting mechanisms 512 in the Y direction. The two linear motors 54 are each provided on either side of the stage 3 in the X direction, and are AC coreless linear motors each having a stator 541 and a slider 542. The stator 541 is provided on the side surface of the stage 3 in the X direction along the Y direction. On the other hand, the slider 542 is fixed to the outside of the lifting mechanism 512. The two linear motors 54 each drive the two lifting mechanisms 512 in the Y direction by the magnetic force generated between the stator 541 and slider 542.

[0046] Each linear encoder 55 also has a scale unit 551 and a detection unit 552. The scale unit 551 is provided along the Y direction below a stator 541 of a linear motor 54 fixed to the stage 3. On the other hand, the detection unit 552 is fixed further outward from a slider 542 of the linear motor 54 fixed to the lifting mechanism 512, and is disposed opposite the scale unit 551. The linear encoder 55 detects the position of the slit nozzle 2 in the Y direction, more specifically the position of the discharge port, based on the relative positional relationship between the scale unit 551 and the detection unit 552.

[0047] The slit nozzle moving part 53 configured in this manner can move the slit nozzle 2 between above the maintenance unit 6 and above the substrate S held on the stage 3 by driving the nozzle support 51 in the Y direction. More specifically, the slit nozzle moving part 53 moves the slit nozzle 2a between above the upstream maintenance unit 6a and above the substrate S. It also moves the slit nozzle 2a between above the downstream slit nozzle 2b and above the substrate S.

[0048] The coating device 1 then moves the slit nozzle 2a in the (+Y) direction while discharging the treatment liquid from the discharge port of the slit nozzle 2a, thereby forming a treatment liquid layer on the surface Sa of the substrate S. Furthermore, the coating device 1 moves the slit nozzle 2b in the (-Y) direction while discharging the treatment liquid from the discharge port 21 of the slit nozzle 2b, thereby forming a treatment liquid layer on the surface Sa of the substrate S.

[0049] After the application of the processing liquid is completed, as shown in FIG. 2A, slit nozzle 2a returns to stand by above upstream adjacent region 102, and slit nozzle 2b returns to stand by above downstream adjacent region 103. While slit nozzles 2a and 2b are standing by above upstream adjacent region 102 and downstream adjacent region 103, respectively, the area above holder installation region 101 is open, facilitating attachment and detachment of the substrate holding mechanism (stage 3 + positioning unit 8 + pressing unit 9) to and from holder installation region 101. Furthermore, as shown in FIG. 1, when slit nozzle 2a is positioned above holder installation region 101 and slit nozzle 2b is standing by above downstream adjacent region 103, the area above upstream adjacent region 102 is open, facilitating attachment and detachment of maintenance unit 6a to and from upstream adjacent region 102 and reconfiguration of maintenance unit 6a. Furthermore, although not shown in the figure, when the slit nozzle 2b is positioned above the holding section installation area 101 while the slit nozzle 2a waits above the upstream adjacent area 102, the area above the downstream adjacent area 103 is opened, making it easy to attach and detach the maintenance unit 6b to the downstream adjacent area 103 or to change the configuration of the maintenance unit 6b.

[0050] In this embodiment, considering that a relatively low-viscosity treatment liquid is dispensed from slit nozzle 2a and a relatively high-viscosity treatment liquid is dispensed from slit nozzle 2b, the cleaning configurations of the maintenance units 6a and 6b are different, as shown in FIG. 2A. More specifically, maintenance unit 6a includes a pre-dispensing mechanism 61, a cleaning block 62, and a standby pod 63. Maintenance unit 6a, which includes these components, functions to remove excess treatment liquid adhering to slit nozzle 2a and prepare the tip of slit nozzle 2a for application. These processes correspond to an example of the "first maintenance process" of the present invention. Known configurations can be applied, and therefore a detailed description will be omitted. For example, the configuration described in JP 2008-290031 A, previously disclosed by the applicant, can be applied.

[0051] Meanwhile, the maintenance unit 6b includes a cleaning block 62, a standby pod 63, a scraper block 64, and a scraper cleaning section 65. The maintenance unit 6b includes these components and functions to perform a cleaning process using the cleaning block 62 and a scraping process of remaining processing liquid using the scraper block 64, and these processes correspond to an example of a "second maintenance process" of the present invention. Known configurations can also be applied to these components, so a description thereof will be omitted. For example, the configuration described in JP 2018-158298 A, previously disclosed by the applicant of the present application, can be applied. A scraper cleaning section 65 is also provided to clean the scraper block 64.

[0052] However, the processing conditions for the coating process on the substrate S are not always constant. It may be necessary to perform coating processes on substrates S of different sizes or to change the specifications of the maintenance process due to changes in the processing liquid used. For example, when changing the substrate size from a relatively large to a small one, it is necessary to use a coating apparatus 1 equipped with a substrate holding mechanism as shown in FIG. 3B. In this regard, in the coating apparatus 1 configured as described above, the substrate holding mechanism for large substrates (FIG. 3A) can be removed from the base 100 and then a substrate holding mechanism for small substrates (FIG. 3B) can be attached. In other words, the substrate holding mechanism can be replaced. Furthermore, the currently installed maintenance units 6 (6a, 6b) can be removed from the base 100 as a whole and replaced with ones suitable for the maintenance process after the specification change. Furthermore, the components constituting the maintenance unit 6 (e.g., the pre-dispensing mechanism 61, the cleaning block 62, the standby pod 63, the scraper block 64, the scraper cleaning unit 65, etc.) can also be individually replaced. Therefore, in this embodiment, the control unit 200 controls each unit of the apparatus according to a replacement program stored in advance in a storage unit (not shown), thereby enabling the above replacement process to be carried out smoothly. Hereinafter, the replacement process executed in the coating apparatus 1 will be described with reference to FIG.

[0053] FIG. 7 is a flowchart showing the replacement process executed by the coating apparatus shown in FIG. 1. Each time the application of a processing liquid to a substrate S, i.e., a coating process, is completed, the control unit 200 acquires processing conditions, such as a change in substrate size or a change in maintenance process specifications, for the next coating process (step S301). The control unit 200 then determines whether the processing conditions have been changed (step S302). For example, if the substrate S to be coated is changed from a large size to a small size, the substrate holding mechanism must be replaced from that shown in FIG. 3A to that shown in FIG. 3B. Furthermore, if the maintenance process specifications are changed, the maintenance unit 6 and the configuration of the unit must also be replaced. Therefore, while the control unit 200 determines "NO" in step S301, it continues the coating process under the current processing conditions. On the other hand, if the control unit 200 determines "YES" in step S302, it executes the following steps (steps S303 to S314).

[0054] In step S303, the control unit 200 determines whether the substrate size has been changed. If it is determined in step S303 that a change in substrate size has occurred, the control unit 200 assists the worker in replacing the substrate holding mechanisms (steps S304 to S306). On the other hand, if it is determined in step S303 that a change in substrate size has not occurred, the control unit 200 skips the substrate holding mechanism replacement process and proceeds to step S307.

[0055] In step S304, the control unit 200 controls the slit nozzle moving unit 53 to move the upstream coating unit 5a and the downstream coating unit 5b above the maintenance units 6a and 6b, respectively. As a result, as shown in FIG. 2A, the upper part of the holder installation area 101 is opened, allowing the substrate holding mechanism (=stage 3 + positioning unit 8 + pressing unit 9) to be attached to and detached from the holder installation area 101. Subsequently, the control unit 200 displays a message on the display unit (not shown) requesting the operator to replace and adjust the substrate holding mechanism to one that is compatible with the changed substrate size (step S305). Of course, the notification to the operator is not limited to a message; audio notification may be given instead of or in addition to the message. This also applies to the replacement and adjustment of all or part of the upstream maintenance unit 6a or the downstream maintenance unit 6b, which will be described later.

[0056] In response to the request to replace the substrate holding mechanism, the worker removes the substrate holding mechanism installed in the holder installation area 101 and installs in the holder installation area 101 a substrate holding mechanism that is compatible with the size of the next substrate S. The worker also adjusts the height position, horizontal position, etc. of the newly installed substrate holding mechanism, and then inputs into the operation panel (not shown) of the control unit 200 that the replacement process has been completed. In response to this, the control unit 200 determines in step S306 that the replacement of the substrate holding mechanism has been completed, and proceeds to the next step S307.

[0057] In step S307, the control unit 200 determines whether the content of the maintenance process to be performed by the upstream maintenance unit 6a has changed. If it is determined in step S307 that a change in the content of the maintenance process has occurred, the control unit 200 assists the worker in replacing the entire upstream maintenance unit 6a or some of the components of the upstream maintenance unit 6a (steps S308 to S310). On the other hand, if it is determined in step S307 that a change in the content of the maintenance process has not occurred, the control unit 200 skips the replacement process for the upstream maintenance unit 6a and proceeds to step S311.

[0058] In step S308, the control unit 200 controls the slit nozzle moving unit 53 to move the upstream coating unit 5a above the stage 3. This opens up the area above the upstream adjacent region 102, as shown in FIG. 1. This allows the upstream maintenance unit 6a to be attached to and detached from the upstream adjacent region 102. This also allows the components of the upstream maintenance unit 6a (which in FIG. 2A correspond to the pre-dispensing mechanism 61, cleaning block 62, and standby pod 63) to be replaced or replaced. Subsequently, the control unit 200 displays a message on the display unit (not shown) requesting the operator to replace and adjust all or part of the upstream maintenance unit 6a so that it conforms to the changed maintenance specifications (step S309).

[0059] In response to this replacement request, the worker removes the upstream maintenance unit 6a installed in the upstream adjacent area 102 and installs in the upstream adjacent area 102 an upstream maintenance unit 6a that is suitable for the changed maintenance process. Furthermore, instead of replacing the entire upstream maintenance unit 6a, the worker replaces or substitutes some of the components of the upstream maintenance unit 6a. After performing these operations, the worker adjusts the height position, horizontal position, etc. of each part of the upstream maintenance unit 6a. Then, the worker inputs into the operation panel of the control unit 200 that the replacement process has been completed. In response to this, the control unit 200 determines in step S310 that the replacement of the upstream maintenance unit 6a has been completed, and proceeds to the next step S311.

[0060] In step S311, the control unit 200 determines whether the content of the maintenance process to be performed by the downstream maintenance unit 6b has changed. If it is determined in step S311 that a change in the content of the maintenance process has occurred, the control unit 200 assists the worker in replacing the entire downstream maintenance unit 6b or some of the components of the downstream maintenance unit 6b (steps S312 to S314). On the other hand, if it is determined in step S311 that a change in the content of the maintenance process has not occurred, the control unit 200 skips the replacement process for the downstream maintenance unit 6b and ends the series of assisting processes.

[0061] In step S312, the control unit 200 controls the slit nozzle moving unit 53 to move the downstream coating processing unit 5b above the stage 3. This opens up the area above the downstream adjacent area 103. This then makes it possible to attach and detach the downstream maintenance unit 6b to and from the downstream adjacent area 103. This also makes it possible to exchange or replace components of the downstream maintenance unit 6b (in FIG. 2A, this corresponds to the cleaning block 62, standby pod 63, scraper block 64, and scraper cleaning unit 65). Subsequently, the control unit 200 displays a message on the display unit (not shown) requesting the operator to replace and adjust all or part of the downstream maintenance unit 6b so that it conforms to the changed maintenance specifications (step S313).

[0062] In response to this replacement request, the worker removes the downstream maintenance unit 6b installed in the downstream adjacent area 103, and installs in the downstream adjacent area 103 a downstream maintenance unit 6b that is suitable for the changed maintenance process. Furthermore, instead of replacing the entire downstream maintenance unit 6b, the worker replaces or substitutes some of the components of the downstream maintenance unit 6b. After performing these operations, the worker adjusts the height position, horizontal position, etc. of each part of the downstream maintenance unit 6b. Then, the worker inputs into the operation panel of the control unit 200 that the replacement process has been completed. In response to this, the control unit 200 determines in step S314 that the replacement of the downstream maintenance unit 6b has been completed, and ends the series of assist processes.

[0063] In this embodiment, when the replacement process is performed, the control unit 200 takes the initiative in moving the coating processing units 5a and 5b. Of course, it goes without saying that the operator may also give a command to the control unit 200 to move the coating processing units 5a and 5b, and take the initiative in performing the replacement process.

[0064] As described above, according to this embodiment, the maintenance units 6 and guide rails 52 are attached to the base 100. The coating units 5a and 5b move along the guide rails 52, and the coating process is performed by discharging the treatment liquid from the slit nozzle 2. Meanwhile, the substrate holding mechanism including the stage 3 is independent of the maintenance units 6, guide rails 52, and coating units 5a and 5b, and is detachable from the base 100. Therefore, when changing the substrate holding mechanism from, for example, the one shown in FIG. 3A to the one shown in FIG. 3B in response to a change in substrate size, the treatment liquid can be applied to substrates S of different sizes by simply replacing and adjusting the substrate holding mechanism. As a result, compared to the conventional technology in which the maintenance units and guide rails are attached to the stage, the coating apparatus 1 according to this embodiment can apply the treatment liquid to each substrate S while accommodating substrates S of different sizes with minimal work, and is highly versatile.

[0065] The same is true for the maintenance unit 6. That is, the maintenance unit 6 is detachably attached to the base 100. Therefore, as described above, it is possible to respond to changes in maintenance processing by replacing or substituting the entire maintenance unit 6 or its components, and the coating apparatus 1 has even greater versatility.

[0066] Furthermore, the coating apparatus 1 can accommodate a variety of substrate sizes and a variety of maintenance processes, and the coating apparatus 1 can perform a wide range of processing conditions, expanding the range of coating processing options.

[0067] In the above embodiment, the Y direction and the X direction correspond to the "first horizontal direction" and the "second horizontal direction," respectively. The upstream adjacent region 102 and the downstream adjacent region 103 correspond to examples of the "first adjacent region" and the "second adjacent region," respectively. The coating processing units 5a and 5b correspond to examples of the "first bridge structure" and the "second bridge structure," respectively. The slit nozzle 2a and the outlet 21 of the slit nozzle 2a correspond to examples of the "first slit nozzle" and the "first outlet," respectively. The slit nozzle 2b and the outlet 21 of the slit nozzle 2b correspond to examples of the "second slit nozzle" and the "second outlet," respectively. The slit nozzle moving unit 53 corresponds to an example of the "moving unit" in the present invention. The upstream maintenance unit 6a and its components (pre-dispensing mechanism 61, cleaning block 62 and waiting pod 63) correspond to an example of the "first maintenance section" of the present invention, and the downstream maintenance unit 6b and its components (cleaning block 62, waiting pod 63, scraper block 64 and scraper cleaning section 65) correspond to an example of the "second maintenance section" of the present invention.

[0068] The present invention is not limited to the above-described embodiment, and various modifications other than those described above are possible without departing from the spirit of the present invention. For example, in the above-described embodiment, the present invention is applied to a coating apparatus 1 in which two coating processing units 5 having the same structure are provided for one substrate holding mechanism, but the present invention can also be applied to a coating apparatus in which a single coating processing unit 5 is provided, as described in JP 2017-112197 A, for example.

[0069] Furthermore, in the above embodiment, the present invention is applied to a coating apparatus 1 in which two different maintenance units 6 are provided for one substrate holding mechanism, but the present invention can also be applied to a coating apparatus in which two maintenance units 6 having the same structure are provided, as described in Patent Document 1, for example, or to a coating apparatus in which a single maintenance unit 6 is provided, as described in Patent Publication No. 2017-112197, for example.

[0070] Furthermore, in the above embodiment, a substrate holding mechanism is used in which a positioning unit 8 and a pressing unit 9 are attached to a stage 3, but the present invention can also be applied to a coating device in which either a positioning unit 8 or a pressing unit 9 is attached, or to a coating device in which neither a positioning unit 8 nor a pressing unit 9 is attached. [Industrial Applicability]

[0071] The present invention can be applied to any coating apparatus that supplies a processing liquid from a slit nozzle to a substrate held by a holder such as a stage to coat the substrate. [Explanation of symbols]

[0072] 1... Coating device 2...Slit nozzle 2a...(1st) slit nozzle 2b...(Second) slit nozzle 3,11,401…Stage 5a...coating treatment section (first cross-linked structure) 5b...coating treatment section (second cross-linked structure) 6...Maintenance unit (maintenance section) 6a...Upstream maintenance unit (first maintenance section) 6b...Downstream maintenance unit (second maintenance section) 21...Discharge port 33...Adjustment section 34…Fixed part during transportation 61...Pre-dispensing mechanism (maintenance section) 62...Cleaning block (maintenance section) 63...Standby Pod (Maintenance Department) 64...Scraper block (maintenance section) 65...Scraper cleaning section (maintenance section) 100...Foundation 101...Holding part installation area 102...Upstream adjacent region (first adjacent region) 103... downstream adjacent region (second adjacent region) 200...Control unit S...Substrate Sa...(substrate) surface X…(2nd) Horizontal direction Y…Movement direction (first horizontal direction)

Claims

1. a base having, on its upper surface, a holder installation area and a first adjacent area adjacent to the holder installation area in a first horizontal direction; a holding part detachably attached to the holding part installation area; a pair of guide rails attached to the upper surface of the base so as to sandwich the holder installation area and the first adjacent area in a second horizontal direction orthogonal to the first horizontal direction; a first bridge structure that is bridged between the pair of guide rails and is movable in the first horizontal direction between above the holder installation area and above the first adjacent area; a first slit nozzle attached to the first bridge structure so as to be able to discharge a first processing liquid from a slit-shaped first discharge port toward the substrate held on the upper surface of the holding part; a drive unit that drives the first bridge structure along the pair of guide rails; a first maintenance unit attached to the base in the first adjacent region and configured to perform a first maintenance process on the first slit nozzle; A coating device comprising:

2. The coating device according to claim 1 , The coating device, wherein the first maintenance part is detachable from the base in the first adjacent region.

3. The coating device according to claim 1 , A second bridge structure; A second slit nozzle; a second maintenance unit, the base has, on its upper surface, a second adjacent region opposite the first adjacent region with respect to the holder installation region and adjacent to the holder installation region in the first horizontal direction; the pair of guide rails extend to the second adjacent region, the second bridge structure is provided so as to be movable in the first horizontal direction between the holding portion installation area and the second adjacent area while spanning the pair of guide rails, the second slit nozzle is attached to the second bridge structure so as to be able to discharge a second processing liquid from a slit-shaped second discharge port toward the substrate held on the upper surface of the holding part, The second maintenance unit is attached to the base in the second adjacent region and performs a second maintenance process on the second slit nozzle.

4. The coating device according to claim 3, The coating device, wherein the first maintenance part and the second maintenance part are detachable from the base in the first adjacent region and the second adjacent region, respectively.

5. The coating device according to any one of claims 1 to 4, The coating device includes a plurality of adjustment units that are erected upward from the holding unit installation area and are configured to be able to adjust the height position of the holding unit while supporting the holding unit from below.

6. The coating device according to claim 5, A coating device comprising a plurality of transport fixing units configured to be switchable between a transport fixing mode in which the holding unit is fixed to the base when the device is transported with the holding unit attached to the holding unit installation area, and a release mode in which the fixing of the holding unit to the base is released after the device has been transported.

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