Heat dissipation structure and electronic apparatus

Abstract

To suppress a heat dissipation to a housing of an electronic device and suppress an exposure of a heat dissipation member.SOLUTION: A heat dissipating structure 1 for dissipating a heat of an integrated circuit 105 that is at least partially exposed to an outside of a housing 102 of an electronic device 100 and generates the heat includes: a heat sink 2 that is at least partially exposed to the outside of the housing 102 and dissipates the heat generated in the integrated circuit 105; and a cover member 3 disposed to cover an outer periphery of the heat sink 2. The cover member 3 includes: a slit 33 that exposes the heat sink 2; and attachment parts 38 and 39 in which holes 38H and 39H through which fastening members 111 and 113 that fix the heat sink 2 covered by the cover member 3 to the housing 102 are inserted are formed. The attachment parts 38 and 39 are interposed between the heat sink 2 and the housing 102 in a state of being assembled to the housing 102.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a heat dissipation structure and an electronic device. [Background technology]

[0002] A heat sink for an electronic component is known that has a heat conductive member with a surface that comes into contact with the electronic component, heat dissipation fins joined to the heat conductive member, and a heat conductive resin that covers and is integrated with almost the entire heat dissipation fin, absorbing heat stored in the heat dissipation fin and dissipating it into the atmosphere (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2009-302302 Summary of the Invention [Problem to be solved by the invention]

[0004] In electronic devices, a heat dissipation component such as a heat sink is attached to an integrated circuit to dissipate heat from the integrated circuit, such as a power supply IC (Integrated Circuit) that supplies power voltage. However, when the heat from the heat dissipation component reaches a high temperature and is dissipated into the housing of the electronic device, the temperature of the housing rises. If the heat dissipation component becomes exposed due to the high temperature, care must be taken to avoid contact with the component when removing it or performing other operations. Therefore, a heat dissipation structure that suppresses heat dissipation into the housing of the electronic device and minimizes exposure of the heat dissipation component is desired.

[0005] The present invention has been made in view of the above, and has an object to suppress heat dissipation to the housing of an electronic device and suppress exposure of a heat dissipation member. [Means for solving the problem]

[0006] In order to solve the above-mentioned problems and achieve the object, the heat dissipation structure of the present invention is a heat dissipation structure that is at least partially exposed to the outside of the housing of an electronic device and dissipates heat from heat-generating electronic components, and comprises: a heat dissipation member that is at least partially exposed to the outside of the housing and dissipates heat generated by the electronic component; and a cover member that is arranged to cover the outer periphery of the heat dissipation member, wherein the cover member has a slit that exposes the heat dissipation member and an attachment portion that has a hole through which a fixing member that fixes the heat dissipation member covered by the cover member to the housing is inserted, and the attachment portion is interposed between the heat dissipation member and the housing when assembled to the housing.

[0007] In order to solve the above-mentioned problems and achieve the object, an electronic device according to the present invention includes the above-mentioned heat dissipation structure and the housing. [Effects of the Invention]

[0008] According to the present invention, it is possible to suppress heat dissipation to the housing of the electronic device and to suppress exposure of the heat dissipation member. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a perspective view showing an electronic device having a heat dissipation structure according to an embodiment. [Figure 2] FIG. 2 is a perspective view of the heat dissipation structure according to the embodiment, seen from the right rear. [Figure 3] FIG. 3 is a perspective view of the heat dissipation structure according to the embodiment, as viewed from the left front. [Figure 4] FIG. 4 is a cross-sectional view showing a heat dissipation structure according to an embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of an electronic device 100 including a heat dissipation structure 1 according to the present invention will be described in detail below with reference to the accompanying drawings. Note that the present invention is not limited to the following embodiment.

[0011] In the following description, the front-rear direction is a direction parallel to the direction of travel when the vehicle is traveling straight, and the side from the driver's seat toward the windshield is referred to as the "rear" in the front-rear direction, and the side from the windshield toward the driver's seat is referred to as the "front" in the front-rear direction. The front-rear direction is referred to as the X-axis direction. The left-right direction is a direction horizontally perpendicular to the front-rear direction. When viewed from the windshield, the left-hand side is the "left" and the right-hand side is the "right". The left-right direction is referred to as the Y-axis direction. The up-down direction is a direction perpendicular to the front-rear direction and the left-right direction. The up-down direction is referred to as the Z-axis direction. Therefore, the front-rear direction, left-right direction, and up-down direction are orthogonal in three dimensions. In the following description, the front-rear direction, left-right direction, and up-down direction refer to the front-rear direction, left-right direction, and up-down direction when the electronic device 100 equipped with the heat dissipation structure 1 is mounted on a vehicle.

[0012] [Embodiment] (heat dissipation structure) FIG. 1 is a perspective view showing an electronic device having a heat dissipation structure according to an embodiment. FIG. 2 is a perspective view of the heat dissipation structure according to an embodiment as seen from the right rear. FIG. 3 is a perspective view of the heat dissipation structure according to an embodiment as seen from the left front. FIG. 4 is a cross-sectional view of the heat dissipation structure according to an embodiment. The electronic device 100 is, for example, an AV-integrated car navigation system or car audio system that does not have an electric fan. The electronic device 100 includes a display panel 101, a housing 102, and a heat dissipation structure 1.

[0013] The display panel 101 is disposed in front of the housing 102. A surface 102c of the housing 102 is attached to a surface 101b of the display panel 101 facing the opposite side to the display surface 101a.

[0014] The housing 102 covers the outer periphery of various electronic components such as a circuit board of the electronic device 100. The outer shape of the housing 102 is defined by a right-facing surface 102a, a left-facing surface 102b, a front-facing surface 102c, a rear-facing surface 102d, an upward-facing surface 102e, and a downward-facing surface 102f. The housing 102 has a box shape. The housing 102 is formed, for example, from a steel plate.

[0015] The electronic device 100 includes an integrated circuit 105 arranged on a substrate. The integrated circuit 105 is a power supply IC that supplies a power supply voltage. The integrated circuit 105 is arranged outside the housing 102 and generates heat when the electronic device 100 is operating. The integrated circuit 105 becomes the hottest part of the electronic device 100, so by arranging it outside the housing 102, heat is less likely to build up inside the housing 102. At least a portion of the integrated circuit 105 is exposed to the outside of the housing 102. The integrated circuit 105 is housed in a thin, rectangular box-shaped case that houses a substrate on which heat-generating electronic components are mounted. The case of the integrated circuit 105 becomes hot due to the heat generated by the mounted electronic components.

[0016] In this embodiment, the heat dissipation structure 1 is attached to the surface 102 a of the housing 102 so as to face the integrated circuit 105 .

[0017] The heat dissipation structure 1 dissipates heat generated in the electronic device 100. The heat dissipation structure 1 is arranged outside the housing 102 of the electronic device 100, and dissipates heat from heat-generating electronic components. The heat dissipation structure 1 is provided on a part or the entire outer surface of the housing 102. In this embodiment, the heat dissipation structure 1 is provided on a part of the right side surface of the housing 102. The heat dissipation structure 1 has a heat sink (heat dissipation member) 2 and a cover member 3.

[0018] The heat sink 2 dissipates heat generated by the integrated circuit 105. The heat sink 2 is disposed outside the housing 102. In other words, at least a portion of the heat sink 2 is exposed to the outside of the housing 102. The heat sink 2 is assembled in face-to-face contact with the case of the integrated circuit 105. The heat sink 2 is made of a material that has higher thermal conductivity than the case of the integrated circuit 105 and the housing 102. The heat sink 2 is formed, for example, from an aluminum material. When the heat sink 2 is cooler than the case of the integrated circuit 105, the heat generated by the integrated circuit 105 is conducted to the heat sink 2. When the heat sink 2 is hotter than the air outside the housing 102, it is constantly air-cooled by the air outside the housing 102.

[0019] The heat sink 2 is a heat dissipation fin. The heat sink 2 includes a rectangular plate-shaped wall portion 21 and a plurality of fins 22. The wall portion 21 and the plurality of fins 22 are integrally formed. A surface 21a of the wall portion 21 faces to the right. A surface 21b of the wall portion 21 faces to the left. The surface 21b of the wall portion 21 comes into surface contact with the case of the integrated circuit 105. The fins 22 are erected on the surface 21a of the wall portion 21. A plurality of the fins 22 are arranged parallel to the up-down direction. The plurality of fins 22 are arranged side by side at intervals in the front-to-rear direction.

[0020] The wall 21 of the heat sink 2 is provided with holes 21H through which fastening members (fixing members) 112 are inserted to fix the integrated circuit 105 to the heat sink 2 covered by the cover member 3 with their faces in close contact with each other. The holes 21H penetrate in the thickness direction. The fastening members 112 inserted into the holes 21H assemble the surface 21b of the wall 21 of the heat sink 2 and the case of the integrated circuit 105 with their faces in close contact with each other.

[0021] The cover member 3 is a case that covers the outer periphery of the heat sink 2. The cover member 3 is box-shaped. The cover member 3 is made of a material that has lower thermal conductivity than the case of the integrated circuit 105, the housing 102, and the heat sink 2. The heat generated in the integrated circuit 105 is not easily conducted to the cover member 3. The cover member 3 is made of, for example, a hard resin material or silicone rubber.

[0022] The cover member 3 has an outer shape defined by a wall portion 31a facing to the right, a wall portion 31b facing to the left, a wall portion 31c facing backward, a wall portion 31d facing forward, a wall portion 31e facing upward, and a wall portion 31f facing downward. The outer shapes of the walls 31a, 31c, 31d, 31e, and 31f are rectangular plates. The wall portion 31b is frame-shaped with an opening in the center. The wall portion 21 of the heat sink 2 is exposed through the opening in the wall portion 31b. The integrated circuit 105 is located in the opening in the wall portion 31b. Within the opening in the wall portion 31b, the integrated circuit 105 and the wall portion 21 of the heat sink 2 are in surface contact with each other. The wall portion 31b has a surface that contacts the housing 102.

[0023] The cover member 3 has a slit 33 that exposes the heat sink 2, and an attachment portion 37, an attachment portion 38, and an attachment portion 39 through which a fixing member that fixes the heat sink 2 covered by the cover member 3 to the housing 102 is inserted.

[0024] The slits 33 are provided to dissipate heat from the heat sink 2 covered by the cover member 3. The slits 33 are provided in at least one of the wall portions 31a, 31b, 31c, 31d, 31e, and 31f of the cover member 3. The slits 33 are provided in the wall portions of the cover member 3 that face outward. In this embodiment, the slits 33 include a first slit 33a and a second slit 33e.

[0025] The first slits 33a are provided so as to penetrate the wall portion 31a in the thickness direction. The first slits 33a are elongated holes that are long in the up-down direction. A plurality of the first slits 33a are provided at intervals in the front-rear direction. The interval between adjacent first slits 33a is such that a person's fingers cannot be inserted therebetween.

[0026] The second slits 33e are provided so as to penetrate the wall portion 31e in the thickness direction. The second slits 33e are elongated holes that are long in the left-right direction. A plurality of second slits 33e are provided at intervals in the front-rear direction. The interval between adjacent second slits 33e is such that a person's fingers cannot be inserted therebetween.

[0027] The mounting portion 37 is provided integrally on the upper rear of the wall portion 31b. The mounting portion 37 protrudes into an opening in the frame-shaped wall portion 31b. The mounting portion 37 is provided with a hole 37H through which a fastening member (not shown) serving as a fixing member is inserted. The mounting portion 37 is interposed between the wall portion 21 of the heat sink 2 and the housing 102 when the heat sink 2 covered by the cover member 3 is assembled to the housing 102. The fastening member inserted through the hole 37H assembles the wall portion 31b of the cover member 3 and the outer peripheral surface of the housing 102 in a state where their surfaces are in close contact with each other.

[0028] The mounting portion 38 is provided integrally on the upper front of the wall portion 31b. The mounting portion 38 protrudes into an opening in the frame-shaped wall portion 31b. The mounting portion 38 is provided with a hole 38H through which a fastening member (fixing member) 111 is inserted. The mounting portion 38 is interposed between the wall portion 21 of the heat sink 2 and the housing 102 when the heat sink 2 covered by the cover member 3 is assembled to the housing 102. The fastening member 111 inserted through the hole 38H assembles the wall portion 31b of the cover member 3 and the outer peripheral surface of the housing 102 with their surfaces in close contact with each other.

[0029] The mounting portion 39 is provided integrally with the lower front of the wall portion 31b. The mounting portion 39 protrudes into an opening in the frame-shaped wall portion 31b. The mounting portion 39 is provided with a hole 39H through which a fastening member (fixing member) 113 is inserted. The mounting portion 39 is interposed between the wall portion 21 of the heat sink 2 and the housing 102 when the heat sink 2 covered by the cover member 3 is assembled to the housing 102. The fastening member 113 inserted through the hole 39H assembles the wall portion 31b of the cover member 3 and the outer peripheral surface of the housing 102 with their surfaces in close contact with each other.

[0030] The heat dissipation structure 1 having the heat sink 2 whose outer periphery is covered with the cover member 3 configured in this manner is attached to the outside of the housing 102 by fastening members 111, 112, and 113.

[0031] (action) Next, the operation of the heat dissipation structure 1 for the electronic device 100 configured as described above will be described.

[0032] The surface 21b of the wall portion 21 of the heat sink 2 exposed from the opening in the cover member 3 and the integrated circuit 105 are fixed by the fastening member 112 with their surfaces in close contact with each other. When the heat sink 2 is at a lower temperature than the case of the integrated circuit 105, heat generated in the integrated circuit 105 is conducted to the heat sink 2 via the wall portion 21. When the heat sink 2 is at a higher temperature than the air outside the housing 102, it is air-cooled by the air outside the housing 102 through the slits 33 in the cover member 3.

[0033] Mounting portions 37, 38, and 39 are interposed between wall portion 21 of heat sink 2 and housing 102. As a result, surface 21b of wall portion 21 of heat sink 2 is not in contact with housing 102 of electronic device 100. Cover member 3 is made of a material with lower thermal conductivity than heat sink 2 and housing 102. Even when heat sink 2 is hotter than the air outside housing 102, heat from heat sink 2 is prevented from being dissipated to housing 102 via fastening members 111, 113, etc.

[0034] In this way, the heat generated in the integrated circuit 105 is dissipated by the heat sink 2, thereby cooling the integrated circuit 105. In addition, the heat received by the heat sink 2 from the integrated circuit 105 is prevented from being dissipated to the housing 102. The heat sink 2 is covered with the cover member 3, and therefore its exposure is reduced.

[0035] (effect) As described above, in this embodiment, the cover member 3 is disposed to cover the outer periphery of the heat sink 2. According to this embodiment, it is possible to prevent the heat sink 2 from being exposed to the outside. According to this embodiment, it is possible to prevent contact with a person's fingers during operations such as removal, thereby improving safety during operations such as removal of the electronic device 100.

[0036] In this embodiment, even if the heat dissipation structure 1 is placed on the surface of the housing 102 of the electronic device 100 where the connector is provided, the heat sink 2 is not exposed, so it is possible to prevent contact with the cable and damage to the cable.

[0037] In this embodiment, the mounting portions 37, 38, and 39 of the cover member 3 are interposed between the heat sink 2 and the housing 102 when the heat dissipation structure 1 is attached to the housing 102. This embodiment can prevent the heat sink 2 and the housing 102 from coming into contact with each other on their surfaces. This embodiment can prevent the heat received by the heat sink 2 from being dissipated to the housing 102.

[0038] In this way, in this embodiment, heat dissipation to the housing 102 of the electronic device 100 can be suppressed, and exposure of the heat sink 2 can be suppressed.

[0039] In this embodiment, the cover member 3 has a slit 33 that exposes the heat sink 2. According to this embodiment, the heat sink 2 can be cooled by the air outside the housing 102 via the slit 33.

[0040] In this embodiment, the first slits 33a are provided in the wall portion 31a facing outward. This embodiment can effectively cool the heat sink 2. In this embodiment, the first slits 33a extend in the vertical direction, so that the flow of air heated by the heat sink 2 inside the cover member 3 can be discharged from above to the outside without interfering with the flow.

[0041] In this embodiment, the second slit 33e is provided in the upwardly facing wall portion 31e. According to this embodiment, the air heated by the heat sink 2 inside the cover member 3 can be discharged from above to the outside.

[0042] In contrast, in conventional cases, the heat sink is not covered with a cover member, so the integrated circuit and the housing come into direct contact with the heat sink and fixing members such as screws, and as a result, heat received by the heat sink from the integrated circuit is sometimes dissipated to the housing of the electronic device via the fixing members.

[0043] The heat dissipation structure and electronic device according to the present invention have been described above, but they may be embodied in various different forms other than the above-described embodiments. The heat dissipation structure and electronic device configurations described above are merely examples and are not intended to be limiting.

[0044] [Variations] The configuration of the heat sink 2 described in the above embodiment is an example, and the heat sink 2 may have any configuration as long as it can dissipate heat generated by the integrated circuit 105.

[0045] The cover member 3 may be embossed (matt-finished) on the surface of the wall facing outward, thereby reducing the area of ​​contact with the cover member 3 by a person.

[0046] The wall 31b of the cover member 3 has been described as being frame-shaped with an opening in the center, but it may be closed except for the exposed portion of the wall 21 of the heat sink 2 that contacts the integrated circuit 105. The wall 31b may be a plate material having an opening approximately the same size as the outer shape of the wall 21 of the heat sink 2. [Explanation of symbols]

[0047] 1 Heat dissipation structure 2 Heat sink (heat dissipation material) 21 Wall 22 Finn 3 Cover material 31a, 31b, 31c, 31d, 31e, 31f Wall section 33 Slit 33a First slit 33e Second slit 37 Mounting part 38 Mounting part 39 Mounting part 100 Electronic equipment 101 Display Panel 102 Case 102a, 102b, 102c, 102d, 102e, 102f side 105 Integrated circuits (electronic components) 111 Fastening members (fixing members) 112 Fastening members (fixing members) 113 Fastening members (fixing members)

Claims

1. A heat dissipation structure that is at least partially exposed to the outside of a housing of an electronic device and dissipates heat from a heat-generating electronic component, a heat dissipation member at least part of which is exposed to the outside of the housing and which dissipates heat generated by the electronic components; a cover member disposed to cover the outer periphery of the heat dissipation member; Equipped with the cover member has a slit that exposes the heat dissipation member, and an attachment portion having a hole through which a fixing member that fixes the heat dissipation member covered by the cover member to the housing is inserted, The mounting portion is interposed between the heat dissipation member and the housing when the heat dissipation member is attached to the housing. Heat dissipation structure.

2. The cover member has a wall portion having a surface of an outer circumferential surface that contacts the housing, the wall portion having an opening. The heat dissipation structure according to claim 1 .

3. The slit includes a first slit in a wall portion having a surface facing away from a surface in contact with the housing, in the outer peripheral surface of the cover member. The heat dissipation structure according to claim 1 .

4. The slit has a second slit in at least one wall portion of the outer peripheral surface of the cover member, the wall portion having a surface other than a surface that contacts the electronic component and a surface facing the opposite side. The heat dissipation structure according to claim 1 .

5. The heat dissipation structure according to any one of claims 1 to 4; The housing; An electronic device comprising:

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