Processing device

Abstract

To provide a processing device which inhibits change of an attitude of a chuck table regardless of rigidity of the chuck table.SOLUTION: A processing device 1 includes: a chuck table 12 which rotatably supports a workpiece W having a substantially circular disc shape; a chuck table support mechanism 80 supporting the chuck table 12; and grinding parts 40, 50 which rotatably hold grind stones 41, 51 for grinding the workpiece W. A point of application of a support reaction force of the chuck table support mechanism 80 is eccentric relative to a rotation center C2 of the chuck table 12. Additionally, a physical relationship between the grinding parts 40, 50 and the chuck table 12 is set so that the point of application of the support reaction force is included in a portion, which excludes both ends, of a processing area AR including an arc-shaped portion AC where the grind stones 41, 51 contact with the workpiece W.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present disclosure relates to a processing apparatus that grinds a workpiece such as a semiconductor wafer. [Background technology]

[0002] In the field of semiconductor manufacturing, backside grinding is performed to grind the backside of semiconductor wafers (hereinafter referred to as "wafers") such as silicon wafers to make them thinner. For example, Patent Document 1 discloses an in-feed grinding device that grinds a wafer mounted on a rotatable chuck table using a grinding wheel rotatably arranged on the chuck table. The in-feed grinding device measures the thickness profile of the wafer before grinding, adjusts the tilt amount of the chuck table and the grinding wheel according to the measurement result, and performs grinding by pressing the arc-shaped edge of the grinding wheel against the wafer. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2016-201422 Summary of the Invention [Problem to be solved by the invention]

[0004] In the above-mentioned machining apparatus, it is necessary to suppress fluctuations in the position of the chuck table during machining. Conventionally, techniques have been proposed to suppress fluctuations in the position by improving the rigidity of the chuck table. However, there is a limit to how much the rigidity of the chuck table can be increased, and increasing the rigidity also leads to increased costs.

[0005] The present disclosure provides a processing device that can suppress fluctuations in the posture of the chuck table regardless of the rigidity of the chuck table, thereby achieving further increased processing precision and improved thickness variation (TTV). [Means for solving the problem]

[0006] A processing apparatus according to a first aspect of the present disclosure includes a chuck table that rotatably supports a substantially disk-shaped workpiece, a grinding unit that rotatably holds a grinding wheel that grinds the workpiece, and a chuck table support mechanism that includes a support body that supports the chuck table. The point of application of the support reaction force of the support body of the chuck table support mechanism is eccentric with respect to the center of rotation of the chuck table. In addition, the positional relationship between the grinding unit and the chuck table is set so that the point of application is included in a portion of the processing area that includes an arc-shaped portion where the grinding wheel contacts the workpiece, excluding both end portions. In addition to the positional relationship, the distribution of each member in the chuck table support mechanism may be set appropriately.

[0007] Here, the machining area can be defined as a rectangular area surrounding the arc-shaped portion. In addition to the above features, the positional relationship between the grinding unit and the chuck table can be set so that the direction of the chuck table's attitude change during grinding of the workpiece and the short-side direction of the machining area are approximately aligned. The support body can be composed of multiple support parts, and the point of action of the resultant support reaction forces of the multiple support parts is the center of gravity of a polygon connecting the multiple support parts. The positional relationship of the chuck table support mechanism with respect to the grinding unit can be set so that the center of gravity is included in a portion of the machining area excluding both end portions. In addition to the positional relationship, the allocation of each member in the chuck table support mechanism can also be set appropriately.

[0008] A processing apparatus according to a second aspect of the present disclosure includes a chuck table that rotatably supports a substantially disk-shaped workpiece, a grinding unit that rotatably holds a grinding wheel that grinds the workpiece, and a chuck table support mechanism including a support body that supports the chuck table. The point of application of the support reaction force of the support body of the chuck table support mechanism is eccentric with respect to the center of rotation of the chuck table. In addition, the positional relationship between the grinding unit and the chuck table is set so that the direction of the positional change of the chuck table during grinding of the workpiece is approximately aligned with the short-side direction of the processing area including the arc-shaped portion where the grinding wheel contacts the workpiece. In addition to the positional relationship, the allocation of each member in the chuck table support mechanism may be appropriately set. [Effects of the Invention]

[0009] According to the processing device of the first aspect of the present disclosure, the point of application of the support reaction force of the support of the chuck table support mechanism is included in the processing area including the arc-shaped portion where the grinding wheel contacts the workpiece, excluding both ends thereof, so fluctuations in the attitude of the chuck table due to external forces from the grinding wheel are suppressed, and fluctuations in the degree of contact between the grinding wheel and the workpiece can also be suppressed.Furthermore, according to the processing device of the second aspect of the present disclosure, the direction of fluctuations in the attitude of the chuck table is aligned with the short side direction of the processing area including the arc-shaped portion where the grinding wheel contacts the workpiece, so even if the attitude of the chuck table fluctuates due to external forces from the grinding wheel, fluctuations in the degree of contact between the grinding wheel and the workpiece due to such fluctuations can be suppressed. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a perspective view illustrating a schematic configuration of a wafer grinding apparatus 1 according to a first embodiment. [Figure 2] FIG. 2 is a plan view illustrating the configuration of an index table 11 and a chuck table 12. [Figure 3] 2 is a block diagram illustrating the configuration of a control unit 100 of the processing device 1 of FIG. [Figure 4]2 is a schematic perspective view illustrating the positional relationship between the chuck table 12 and the rough grinding unit 40 or the fine grinding unit 50. FIG. [Figure 5] 3 is a plan view illustrating the positional relationship between the chuck table 12 and the rough grinding unit 40 or the fine grinding unit 50. FIG. [Figure 6] 1 is a perspective view showing an example of the positional relationship between a chuck table 12 and a rough grinding unit 40 or a fine grinding unit 50 in a conventional processing device. [Figure 7] 1 is a plan view showing an example of the positional relationship between a chuck table 12 and a rough grinding unit 40 or a fine grinding unit 50 in a conventional processing device. [Figure 8] 10 is a plan view illustrating the positional relationship between the chuck table 12 and the rough grinding unit 40 or the precision grinding unit 50 in the processing apparatus of the second embodiment. FIG. [Figure 9] 10 shows variations of various embodiments. DETAILED DESCRIPTION OF THE INVENTION

[0011] The present embodiment will now be described with reference to the accompanying drawings. The accompanying drawings illustrate embodiments consistent with the principles of the present disclosure. However, these drawings are intended to aid in understanding the present disclosure and are not intended to limit the present disclosure in any way. The description in this specification is merely exemplary and does not limit the scope or application of the present disclosure. The present embodiment has been described in sufficient detail to enable those skilled in the art to implement the present disclosure, but it should be understood that other implementations and forms are possible, and that changes in configuration and structure and substitutions of various elements are possible without departing from the scope and spirit of the technical concept of the present disclosure. Therefore, the following description should not be construed as being limited thereto.

[0012] In the following description, "upper" and "lower" refer to directions perpendicular to the surface of the base B of the processing device 1, with the side farther from the surface of the base B being called "upper" and the side closer to the surface of the base B being called "lower."

[0013] In the following description, a processing apparatus will be described that processes a substantially disk-shaped semiconductor wafer as a workpiece W to be processed.

[0014] [First embodiment] The schematic configuration of a wafer grinding processing apparatus 1 (hereinafter referred to as processing apparatus 1) according to a first embodiment will be described with reference to Figures 1 and 2. Figure 1 is a perspective view illustrating the overall configuration of processing apparatus 1, and Figure 2 is a plan view illustrating the configuration of index table 11 and chuck table 12. This processing apparatus 1 is roughly configured to include a base B, a workpiece holding section 10, and a main unit 20.

[0015] The workpiece holding unit 10 is a part that holds a workpiece W, such as a wafer, which is an object to be processed, and is placed on a base B. The workpiece holding unit 10 includes an index table 11 and a plurality of (for example, three) chuck tables 12.

[0016] As shown in FIG. 2, the index table 11 is connected to a motor (not shown) and is configured to rotate around a rotation axis C1 by the driving force of the motor. The chuck tables 12 are mounted on the index table 11 at approximately equal intervals (for example, every 120°) in a circular pattern to hold the workpieces W and are rotatable around a rotation axis C2 by the driving force of the motor. The index table 11 is provided with radial partition plates 13 that separate the space. Each chuck table 12 is installed in a fan-shaped space separated by the partition plates 13, for example, at intervals of 120°. The three spaces are separated for performing three stages: an alignment stage S1, a rough grinding stage S2, and a fine grinding stage S3. The alignment stage S1 is a stage where the workpiece W is transported onto the chuck table 12 by a transport device (not shown) or the like and aligned. The rough grinding stage S2 is a stage for roughly grinding the workpiece W to a surface roughness less than the desired surface roughness, and the fine grinding stage S3 is a stage for precisely grinding the workpiece W to a surface roughness that is desired.

[0017] The partition plate 13 serves to prevent the machining fluid used in each stage from splashing onto an adjacent stage. The processing apparatus 1 is capable of successively executing stages S1 to S3 and continuously grinding workpieces W placed on multiple chuck tables 12 by rotating the index table 11 around the rotation axis C1 in accordance with the progress of the stages. Wafers serving as workpieces W are, for example, silicon wafers or silicon carbide wafers, but are not limited to these.

[0018] The chuck table 12 has a chuck portion 12c that adsorbs the workpiece W. Although not shown, the chuck portion 12c has an adsorption body made of porous ceramic, and also has a pipe line connected to a vacuum source below the adsorption body. The workpiece W is adsorbed to the chuck table 12 by negative pressure from the pipe line.

[0019] Next, the main unit 20 will be described. As shown in FIG. 1, the main unit 20 is a portion for holding a grinding unit and the like for grinding the workpiece W above the workpiece holding unit 10. Specifically, the main unit 20 includes an arch-shaped column 30 formed to straddle the workpiece holding unit 10, and further includes a rough grinding unit 40 and a fine grinding unit 50 mounted on the column 30. The rough grinding unit 40 is a grinding unit corresponding to the rough grinding stage S2 for performing rough grinding to roughly grind the surface of the workpiece W to less than a desired surface roughness, and the fine grinding unit 50 is a grinding unit corresponding to the fine grinding stage S3 for performing fine grinding to grind the surface of the workpiece W to a desired surface roughness.

[0020] The column 30 is composed of a base 31 that is roughly E-shaped in plan view, and a support 32 that extends vertically from a base B and is connected to the end of the base 31. A rough grinding unit 40 and a fine grinding unit 50 are arranged in two recesses of the E-shaped base 31 in plan view. The rough grinding unit 40 and the fine grinding unit 50 may be collectively referred to as the "grinding unit."

[0021] The rough grinding unit 40 has a rough grinding wheel 41, a grinding mechanism 42 to which the rough grinding wheel 41 is attached at its lower end, and a spindle feed mechanism 43 that raises and lowers the grinding mechanism 42 in the vertical direction V. Similarly, the fine grinding unit 50 has a fine grinding wheel 51, a grinding mechanism 52 to which the fine grinding wheel 51 is attached at its lower end, and a spindle feed mechanism 53 that raises and lowers the grinding mechanism 52 in the vertical direction V. The grinding mechanism 42 and the grinding mechanism 52 are configured to be rotatable by a motor (not shown). The rough grinding wheel 41 and the fine grinding wheel 51 may be collectively referred to simply as "grinding wheels."

[0022] The column 30 is provided with a first guide 60 and a second guide 70 for controlling the elevation of the rough grinding unit 40 and the fine grinding unit 50. The first guide 60 is provided in one of two recesses of the base 31 that is E-shaped in plan view, and has a plurality of guide portions 61 for raising and lowering the rough grinding unit 40, and a rail 62 for sliding the guide portions 61 along the vertical direction V. The second guide 70 is provided in the other of the two recesses of the base 31 that is E-shaped in plan view, and has a plurality of guide portions 71 for raising and lowering the fine grinding unit 50, and a rail 72 for sliding the guide portions 71 along the vertical direction V.

[0023] Each of the three chuck tables 12 is provided with a first tilt angle adjustment unit 80 for adjusting the tilt angle of the chuck table 12 relative to the index table 11. As shown in FIG. 2, the first tilt angle adjustment unit 80 includes, for example, two movable support members 14 and one fixed support member 15. That is, the chuck table 12 is supported on the surface of the index table 11 by a plurality of support members (for example, three points) provided by the movable support members 14 and the fixed support member 15. The first tilt angle adjustment unit 80 constitutes a chuck table support mechanism that supports the tilt angle of the chuck table 12 in an adjustable manner. The movable support member 14 and the fixed support member 15 may be collectively referred to as "support members 14, 15." The movable support member 14 and the fixed support member 15 are examples of supports.

[0024] The movable support member 14 raises and lowers a tilt table (not shown) in the chuck table 12, while the fixed support member 15 fixes the tilt table in the vertical direction V. Therefore, the chuck table 12 can be tilted relative to the index table 11 according to the respective amounts of extension and contraction of the two movable support members 14. The movable support member 14 can be, for example, a differential screw mechanism and bolts, but is not limited to this. Furthermore, the number of support members 14 and 15 supporting one chuck table 12 is three in the illustrated example, but is not limited to this and may be four (four-point support), five, or more. Furthermore, the number of movable support members 14 supporting one chuck table 12 is two in the above example, but is not limited to this.

[0025] Furthermore, the rough grinding unit 40 and the fine grinding unit 50 each include a second inclination angle adjustment unit 90 for adjusting the inclination angle relative to a reference direction (for simplicity of illustration, only the second inclination angle adjustment unit 90 of the rough grinding unit 40 is shown in FIG. 1). As an example, the second inclination angle adjustment unit 90 may be configured with two movable support units 91 and one fixed support unit 92. The movable support unit 91 may be, for example, a differential screw mechanism including a slide block, a fixed block, and an adjustment screw. The movable support unit 91 and the fixed support unit 92 may be collectively referred to as "support units 91, 92."

[0026] The index table 11 rotates in 120° increments in accordance with the stages S1 to S3, allowing the workpiece W to be moved in sequence to the alignment stage S1, the rough grinding stage S2, and the fine grinding stage S3. The chuck table 12 of the alignment stage S1 is exposed on the side opposite the two recessed portions of the base 31 as the index table 11 rotates. On the other hand, the chuck tables 12 of the rough grinding stage S2 and the fine grinding stage S3 are moved to below the two recessed portions of the base 31 as the index table 11 rotates.

[0027] After the workpiece W has been aligned with the chuck table 12 in the alignment stage S1, the index table 11 rotates 120° to move it below the rough grinding section 40 and transition to the rough grinding stage S2. After the rough grinding stage S2 is completed, the index table 11 rotates another 120°, and the workpiece W moves below the fine grinding section 50 and transitions to the fine grinding stage S3. After the fine grinding stage S3 is completed, the index table 11 rotates again, and the workpiece W transitions back to the alignment stage S1, where it is moved from the chuck table 12 to a rack or the like (not shown) by a transport device or the like (not shown). It is also possible to divide the index table 11 into four sections by 90°, and to further provide a polishing stage for polishing the workpiece W after fine grinding.

[0028] 1 will be described with reference to Fig. 3. As described above, the processing apparatus 1 processes the workpiece W by the index table 11, chuck table 12, rough grinding unit 40, and fine grinding unit 50 performing rotational operations, tilt angle adjustment operations, and parallel movement operations. The control unit 100 controls the various operations of the index table 11, chuck table 12, rough grinding unit 40, and fine grinding unit 50.

[0029] The control unit 100 includes, for example, a CPU 101, a memory 102, and a memory 103, and is connected to a first sensor 104 and a second sensor 105 located externally. The CPU 101 operates according to a control program stored in the memory 102, and stores various calculation results in the memory 103. The memory 103 may also store a data map as an analysis result of acquired data.

[0030] The first sensor 104 and the second sensor 105 are disposed near the workpiece W and output measurement signals indicating the surface shape of the workpiece W to the control unit 100. The control unit 100 outputs the measurement signals to an index table control unit 106, a chuck table control unit 107, a grindstone rotation drive control unit 108, and a tilt control unit 109.

[0031] The index table control unit 106 controls the rotational drive of the index table 11 in accordance with commands from the control program. Furthermore, the chuck table control unit 107 controls the suction operation and rotational drive of the chuck table 12 in accordance with commands from the control program. Furthermore, the grinding wheel rotational drive control unit 108 controls the rotational drive of the grinding wheels 41, 51 of the rough grinding unit 40 and the fine grinding unit 50. The tilt control unit 109 controls the movable support unit 14 and the movable support unit 91 in accordance with measurement signals from the first sensor 104 and the second sensor 105 to control the tilt angles of the chuck table 12, the rough grinding unit 40, and the fine grinding unit 50.

[0032] 4 and 5, the positional relationship between the chuck table 12 and the rough grinding unit 40 or the fine grinding unit 50 in the processing apparatus 1 of the first embodiment will be described. In the processing apparatus 1 of the first embodiment, in order to suppress fluctuations in the posture of the chuck table 12 due to external forces from the grinding wheels 41, 51, the chuck table 12, the rough grinding unit 40, and the fine grinding unit 50 are arranged to have the positional relationship described below.

[0033] The chuck portion 12c of the chuck table 12 is disposed on the index table 11 so as to rotate about a rotation axis C2 by a motor 12d. The chuck table 12 is supported at three points on the index table 11 by three support portions, namely, the movable support portion 14 and the fixed support portion 15 that constitute the first tilt angle adjustment portion 80. If the point of action of the resultant force of the support reaction forces from the three support portions is defined as SC, the rotation axis C2 (center of rotation) of the chuck table 12 (chuck portion 12c) is positioned eccentric to the point of action SC.

[0034] If the support stiffness of the three support parts 14, 15 is the same, the point of application SC coincides with the center of gravity of the triangle connecting the three points. If the support stiffness of the three support parts 14, 15 is different, the point of application SC may be located at a position different from the center of gravity. The three support parts 14, 15 may be arranged in an equilateral triangle as shown in FIG. 5, but may be arranged in a shape other than an equilateral triangle (for example, an isosceles triangle with one side shorter) depending on the difference in support stiffness of each support part 14, 15 and other factors. In the case of four-point support, the three support parts may be arranged in a square, but may also be arranged in a shape other than a square (e.g., a rectangle, parallelogram, trapezoid, etc.) depending on the difference in support stiffness and other factors. If the support stiffness of each support part is the same, the point of application SC coincides with the center of gravity of the polygon connecting each support part.

[0035] The rotation axes C3 of the grinding wheels 41, 51 of the rough grinding unit 40 and the fine grinding unit 50 are adjusted to have a slight inclination angle relative to the rotation axis C2 of the workpiece W (chuck table 12) during machining. During machining, the grinding wheels 41, 51 are controlled so that they contact the workpiece W at an arc-shaped portion AC (an arc-shaped curved region) as shown in FIG. 5. The arc-shaped portion AC is adjusted to pass through the rotation axis C2, and the positions of the rough grinding unit 40 and the fine grinding unit 50 are adjusted so that the aforementioned point of application SC is included at least near the center of the rectangular machining area AR surrounding the arc-shaped portion AC (in other words, the portion excluding both ends of the machining area AR). In FIG. 5, the point of application SC coincides with the midpoint ACC of the arc-shaped portion AC, but this is just an example; it is sufficient for the point of application SC to be included near the center of the machining area AR. While it is sufficient for the point of application SC to be included near the center of the machining area AR, it is preferable for it to be located near the midpoint ACC of the arc-shaped portion AC. Here, the "machining area AR" may be defined as a rectangular area that touches both ends and vertices of the arc-shaped portion AC, or may be a slightly larger area. Furthermore, "near the middle of the machining area AR" refers to the extent that it excludes both longitudinal ends of the machining area AR, and does not refer to only the area near the midpoint ACC. For example, the area centered on the midpoint ACC and occupying approximately 50% of the arc-shaped portion AC can be defined as near the middle of the machining area. More preferably, the area centered on the midpoint ACC and occupying approximately 20% of the arc-shaped portion AC can be defined as near the middle of the machining area.

[0036] In this way, the positional relationship of the rough grinding unit 40 and the fine grinding unit 50 with respect to the chuck table 12 is set so that the point of application SC is included in the machining area AR. This makes it possible to obtain a state in which the support reaction force and the external force from the rough grinding unit 40 or the fine grinding unit 50 are likely to cancel each other out, and even if a large external force from the rough grinding unit 40 or the fine grinding unit 50 is applied to the workpiece W, fluctuations in the tilt angle of the chuck table 12 can be suppressed.

[0037] 6 and 7 are diagrams (perspective view and schematic plan view) showing an example of the positional relationship between the chuck table 12 and the rough grinding unit 40 or the fine grinding unit 50 in a conventional machining apparatus. In this conventional machining apparatus, the rotation axis C2 of the chuck portion 12c of the chuck table 12 approximately coincides with the point of application SC of the support portions 14 and 15. As described above, if the support portions 14 and 15 have approximately the same support rigidity, the point of application SC will be the center of gravity of the triangle, and the rotation axis C2 will approximately coincide with this center of gravity. Therefore, the point of application SC will be located near the end of the machining area AR surrounding the arc-shaped portion AC, rather than near the center. Because the position of the point of application SC is different from the center of the machining area AR including the arc-shaped portion AR, a force (arrow A) that tilts the chuck table 12 during machining of the workpiece W will act, increasing the possibility of changing the tilt angle of the chuck table 12. 7, the scope of the present application also includes setting or adjusting the support rigidity, length, and other shapes of the supports 14, 15 so that the application points SC of the supports 14, 15 are included in the machining area AR. With such a configuration, the effects of this embodiment can be obtained without changing the arrangement of the supports 14, 15 or the shape of the chuck table 12.

[0038] [Second embodiment] Next, a processing apparatus 1 according to a second embodiment of the present invention will be described with reference to FIG. 8. The overall configuration of the processing apparatus 1 is similar to that of the first embodiment (FIGS. 1 and 2), so a redundant description will be omitted. In this second embodiment, the positional relationship between the chuck table 12 and the rough grinding unit 40 or the fine grinding unit 50 differs from that of the first embodiment. In the first embodiment, the positional relationship is set so that the point of application of the support reaction force of the support, i.e., the point of application SC of the resultant force of the support reaction forces of the movable support unit 14 and the fixed support unit 15, is located near the center of the processing area AR. In contrast, in the second embodiment, the positional relationship is set so that the direction of the positional change of the chuck table 12 coincides with the short-side direction of the processing area AR. Here, the "direction of the positional change of the chuck table 12" refers to the change in position or inclination of the chuck table 12 that occurs when the rotating grinding wheel 41 or 51 is pressed against the workpiece W during processing.

[0039] Referring to FIG. 8, in the machining apparatus 1 of the second embodiment, the rotation axis C2 of the chuck portion 12c is also eccentric from the point of application SC (or the center of gravity of the support portions 14, 15), which is similar to the first embodiment. However, in the second embodiment, the machining area AR does not include the point of application SC, which is different from the first embodiment. Instead, in the second embodiment, the direction D1 of the attitude change of the chuck table 12 (the direction in which the chuck table 12 tilts is indicated by symbols I1 and I2 in FIG. 8) and the short-side direction D2 of the machining area AR are substantially aligned. The direction D1 of the attitude change of the chuck table 12 varies depending on, for example, the arrangement and / or support rigidity of the support portions 14, 15, the arrangement of the chuck portion 12c, and the position of the machining area AR. Since this direction D1 coincides with the short-side direction D2 of the processing area AR, even if the posture of the chuck table 12 fluctuates due to the external force of the grinding wheels 41, 51, it is possible to suppress fluctuations in the contact state between the grinding wheels 41, 51 and the workpiece W due to such fluctuations. This makes it possible to further improve the precision of processing and the in-plane thickness variation (TTV).

[0040] The present invention is not limited to the above-described embodiments and includes various modifications. For example, the above-described embodiments have been described in detail to clearly explain the present invention, and the present invention is not necessarily limited to those including all of the described configurations. Furthermore, it is possible to replace part of the configuration of one embodiment with the configuration of another embodiment, or to add the configuration of another embodiment to the configuration of one embodiment. Furthermore, it is possible to add, delete, or replace part of the configuration of each embodiment with other configurations. Regarding the positional relationship between the chuck table 12 and the rough grinding unit 40 or the fine grinding unit 50, it is also possible to adopt the features of the first and second embodiments in a single machining apparatus 1.

[0041] Furthermore, in the above embodiment, the first tilt angle adjustment mechanism 80 has been described as having a configuration in which the movable support member 14 and the fixed support member 15 are supported at multiple points, but the present invention is not limited to this. For example, as shown in Fig. 9, the chuck table 12 can also be supported by a first tilt angle adjustment mechanism 80A (chuck table support mechanism) that has an inclined surface on its upper surface and includes a support that is rotatable relative to the chuck table 12. By appropriately rotating the first tilt angle adjustment mechanism 80A relative to the chuck table 12, the tilt angle of the chuck table 12 can be appropriately adjusted, and the point of action of the resultant force of the support reaction force can also be arbitrarily adjusted.

[0042] Furthermore, in the above example, the first tilt angle adjustment mechanisms 80, 80A are configured to be able to adjust the tilt angle of the chuck table 12, but the tilt angle adjustment function of the first tilt angle adjustment mechanisms (chuck table support mechanisms) 80, 80A may be omitted, and only the tilt angle of the grinding units 40, 50 may be adjustable by the second tilt angle adjustment unit 90. [Explanation of symbols]

[0043] 1...Wafer grinding equipment 10...Work holding part 11...Index table 12...Chuck table 12c...Zucker part 12d...Motor 13...Partition board 14...Movable support part 15...Fixed support part 20...Main unit 30...Column 31...Base 32…post 40...Rough grinding section 41...Rough grinding wheel 42, 52...Grinding mechanism 43, 53...Spindle feed mechanism 50...Precision grinding section 51...Precision grinding wheel 60...First Guide 61, 71...Guide section 62, 72...rail 70...Second Guide 80...1st tilt angle adjustment section 90...Second tilt angle adjustment section 91...Movable support part 92...Fixed support part 100...Control unit 102, 103...Memory 104, 105...Sensor 106...Index table control unit 107...Chuck table control unit 108... Grindstone rotation drive control unit 109...Tilt control unit AC: Arc-shaped section ACC…midpoint AR…Processing area B...bass C1~C3...Rotation axis SC…point of action V: vertical direction W…Work

Claims

1. a chuck table that rotatably supports a substantially disk-shaped workpiece; a grinding unit that rotatably holds a grinding wheel that grinds the workpiece; a chuck table support mechanism including a support body for supporting the chuck table, wherein the point of application of the support reaction force of the support body is eccentric with respect to the center of rotation of the chuck table, and the positional relationship with respect to the grinding unit is set so that the point of application is included in a portion excluding both end portions of a machining area including an arc-shaped portion where the grinding wheel contacts the workpiece; A processing device comprising:

2. The processing device according to claim 1 , wherein the processing area is a rectangular area surrounding the arc-shaped portion.

3. 3. The processing device according to claim 1, wherein the positional relationship between the grinding unit and the chuck table is set so that the direction of the posture change of the chuck table when grinding the workpiece is approximately aligned with the short side direction of the processing area.

4. The support body is configured to include a plurality of support parts, The point of action, which is the resultant force of the support reaction forces of the plurality of support parts, is the center of gravity position of a polygon connecting the plurality of support parts, The processing apparatus according to claim 1 , wherein the chuck table support mechanism is positioned relative to the grinding unit so that the center of gravity is included in a portion of the processing area excluding both end portions.

5. a chuck table that rotatably supports a substantially disk-shaped workpiece; a grinding unit that rotatably holds a grinding wheel that grinds the workpiece; a chuck table support mechanism including a support body for supporting the chuck table, the point of application of the support reaction force of the support body being eccentric with respect to the center of rotation of the chuck table, and a positional relationship with respect to the grinding unit being set so that the direction of the posture change of the chuck table during grinding of the workpiece and the short-side direction of a processing area including an arc-shaped portion where the grinding wheel contacts the workpiece are approximately aligned; A processing device comprising:

6. The processing device according to claim 5 , wherein the processing area is a rectangular area surrounding the arc-shaped portion.

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