Pseudo-adhesive label

Abstract

To provide a pseudo-adhesive label capable of suppressing unintended peeling of a base material and achieving appropriate pseudo-adhesive bonding between the base material and a pseudo-adhesive layer with a suitable pseudo-adhesive force, regardless of storage conditions and peeling speed of the pseudo-adhesive label.SOLUTION: A pseudo-adhesive label 1 has a base material 10, an adhesive layer 30, and a pseudo-adhesive layer 20 disposed between the base material 10 and the adhesive layer 30. The pseudo-adhesive layer 20 contains at least 70 vol.% of a propylene-based resin relative to the whole pseudo-adhesive layer 20, the pseudo-adhesive layer having a tensile modulus of 250 MPa or more and 1,100 MPa or less at 23°C, as measured in accordance with JIS K 7161:2014 and JIS K 7127:1999.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to pseudo-adhesive labels. [Background technology]

[0002] A pseudo-adhesive label is a label that can be easily peeled from the substrate at the pseudo-adhesive interface after being attached to an adherend. Pseudo-adhesive labels have been put to practical use as, for example, delivery slips or information concealing labels.

[0003] Patent Document 1 discloses a pseudo-adhesive label having a laminated structure in which a surface substrate, a pseudo-adhesive layer pseudo-adhered to the surface substrate, and an adhesive layer are laminated in this order, and the surface substrate can be peeled from the pseudo-adhesive layer with the adhesive layer attached to an adherend. In the pseudo-adhesive label disclosed in Patent Document 1, the surface substrate has a cutting line for separating at least two or more label parts so that they can be peeled from the pseudo-adhesive layer, and the cutting line alternates between cut parts that are cut so as to penetrate through to the back surface of the surface substrate and groove parts that are recessed or cut to a depth halfway through the surface substrate without penetrating through to the back surface of the surface substrate.

[0004] Patent Document 2 discloses a pseudo-adhesive label having a laminated structure in which a surface substrate, a pseudo-adhesive layer pseudo-adhered to the surface substrate, and an adhesive layer are laminated in this order, and the surface substrate can be peeled from the pseudo-adhesive layer with the adhesive layer attached to an adherend. In the pseudo-adhesive label disclosed in Patent Document 2, the surface substrate has perforated cutting lines for separating at least two or more label parts so that they can be peeled from the pseudo-adhesive layer, and the cutting lines are formed by linear cuts at intervals, and at least some of the cuts are formed in a diagonal direction relative to the direction of the cutting lines.

[0005] Patent Document 3 discloses a pseudo-adhesive label having a pseudo-adhesive layer formed from a hot melt adhesive composition that contains a thermoplastic resin containing an ethylene-propylene copolymer and solid paraffin, the solid paraffin being contained in an amount of 1 to 20 parts by mass per 100 parts by mass of the thermoplastic resin, and the hot melt adhesive composition having a melt viscosity of 2000 to 10000 mPa·s at 160°C.

[0006] Patent Document 4 discloses a pseudo-adhesive label having a substrate, an adhesive layer, and a pseudo-adhesive layer contained between the substrate and the adhesive layer. In the pseudo-adhesive label disclosed in Patent Document 4, the adhesive layer contains a tackifier resin, and the pseudo-adhesive layer contains a thermoplastic resin with a crystallinity of 22.5% or less, the crystallinity being a value calculated based on scattering intensity measured by wide-angle X-ray diffraction, the pseudo-adhesive layer pseudo-adheres to the substrate, and the pseudo-adhesive strength of the pseudo-adhesive layer to the substrate is 250 mN / 50 mm or more and 1500 mN / 50 mm or less.

[0007] Patent Document 5 discloses a pseudo-adhesive label having a substrate, an adhesive layer, and a pseudo-adhesive layer between the substrate and the adhesive layer. In the pseudo-adhesive label disclosed in Patent Document 5, the pseudo-adhesive layer contains a polyolefin resin and a filler. [Prior art documents] [Patent documents]

[0008] [Patent Document 1] Japanese Patent Application Laid-Open No. 2012-189738 [Patent Document 2] Japanese Patent Application Laid-Open No. 2012-194532 [Patent Document 3] Japanese Patent Application Laid-Open No. 2015-145475 [Patent Document 4] Japanese Patent Application Publication No. 2020-160308 [Patent Document 5] Japanese Patent Publication No. 2022-123731 Summary of the Invention [Problem to be solved by the invention]

[0009] However, depending on the storage conditions (e.g., storage in a high-temperature, high-humidity environment) before the pseudo-adhesive label is attached to the adherend, the releasability of the substrate from the pseudo-adhesive layer may decrease when peeling the substrate from the pseudo-adhesive layer. If the releasability of the substrate from the pseudo-adhesive layer decreases, the substrate becomes difficult to peel from the pseudo-adhesive layer, and in some cases, the substrate may be damaged when peeled from the pseudo-adhesive layer. Furthermore, when peeling the substrate from the pseudo-adhesive layer, the peeling speed of the substrate from the pseudo-adhesive layer may change depending on, for example, whether peeling is done mechanically or by hand. Depending on the peeling speed of the substrate from the pseudo-adhesive layer, it may be difficult to peel the substrate from the pseudo-adhesive layer.

[0010] The object of the present invention is to provide a pseudo-adhesive label that can suppress unintentional peeling of the substrate and ensure that the substrate and pseudo-adhesive layer are adhered with an appropriate pseudo-adhesive force regardless of the storage conditions and peeling speed of the pseudo-adhesive label. [Means for solving the problem]

[0011] [1] A substrate; an adhesive layer; a pseudo-adhesive layer between the substrate and the pressure-sensitive adhesive layer; The pseudo-adhesive layer contains 70% by volume or more of a propylene-based resin based on the entire pseudo-adhesive layer, The tensile modulus of the pseudo-adhesive layer at 23°C in accordance with JIS K 7161:2014 and JIS K 7127:1999 is 250 MPa or more and 1100 MPa or less. Pseudo adhesive labels.

[0012] [2] In the pseudo-adhesive label according to [1], The melting point of the pseudo-adhesive layer is 120°C or higher. Pseudo adhesive labels.

[0013] [3] In the pseudo-adhesive label according to [1] or [2], The propylene-based resin is a propylene-based random copolymer. Pseudo adhesive labels.

[0014] [4] [1] to [3], the pseudo-adhesive label according to any one of [1] to [3], The pseudo-adhesive layer further contains a polyolefin resin other than a propylene-based resin. Pseudo adhesive labels.

[0015] [5] [1] to [4], the pseudo-adhesive label according to any one of [1] to [4], The melt flow rate of the pseudo-adhesive layer is 3.0 g / 10 min or more and 50.0 g / 10 min or less. Pseudo adhesive labels.

[0016] [6] [1] to [5], the pseudo-adhesive label according to any one of [1] to [5], The ratio of the thickness of the pseudo-adhesive layer to the thickness of the pressure-sensitive adhesive layer (thickness of the pseudo-adhesive layer / thickness of the pressure-sensitive adhesive layer) is 0.3 or more and 1.5 or less. Pseudo adhesive labels.

[0017] [7] [1] to [6], the pseudo-adhesive label according to any one of [1] to [6], The pseudo-adhesive strength of the pseudo-adhesive layer to the substrate is 250 mN / 50 mm or more and 2000 mN / 50 mm or less, as measured in accordance with JIS Z 0237:2022, at a peel rate of 0.3 m / min and a peel angle of 180° under an environment of 23°C and 50% RH. Pseudo adhesive labels. [Effects of the Invention]

[0018] According to one aspect of the present invention, a pseudo-adhesive label can be provided that suppresses unintentional peeling of the substrate and ensures that the substrate and pseudo-adhesive layer are adhered with an appropriate pseudo-adhesive force regardless of the storage conditions and peeling speed of the pseudo-adhesive label. [Brief explanation of the drawings]

[0019] [Figure 1] 1 is a cross-sectional schematic view of a pseudo-adhesive label according to one embodiment of the present invention. [Figure 2] 1 is a schematic cross-sectional view showing a pseudo-adhesive label according to one embodiment of the present invention attached to an adherend. [Figure 3] 1 is a schematic cross-sectional view illustrating a state in which a substrate is peeled off from a pseudo-adhesive label according to one embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0020] [Embodiment according to one aspect of the present invention] The present invention will be described below by taking an embodiment according to one aspect of the present invention as an example, but the present invention is not limited to this embodiment.

[0021] (pseudo adhesive label) The pseudo-adhesive label according to this embodiment includes a substrate, an adhesive layer, and a pseudo-adhesive layer disposed between the substrate and the adhesive layer. The pseudo-adhesive layer contains 70% by volume or more of a propylene-based resin based on the entire pseudo-adhesive layer. The tensile modulus of the pseudo-adhesive layer at 23°C, as measured according to JIS K 7161:2014 and JIS K 7127:1999, is 250 MPa or more and 1100 MPa or less.

[0022] As used herein, "pseudo-adhesion" refers to an adhesion in which one layer can be easily peeled from the interface of another layer that has been bonded under specific conditions (e.g., a combination of materials and a temperature range), and which does not exhibit re-adhesion or re-stickiness after peeling.

[0023] When the substrate of the pseudo-adhesive label is, for example, a paper substrate, the thermoplastic resin contained in the pseudo-adhesive layer conforms to and contacts the unevenness of the paper substrate, thereby creating an anchoring effect. Furthermore, by using a thermoplastic resin with low or no polarity, such as an ethylene-based resin, as the thermoplastic resin contained in the pseudo-adhesive layer, the affinity between the paper substrate and the pseudo-adhesive layer is reduced. In this way, the pseudo-adhesive properties of the pseudo-adhesive label are exhibited.

[0024] In conventional pseudo-adhesive labels, depending on the storage conditions when the pseudo-adhesive label is stored and the peeling speed conditions when the substrate is peeled from the pseudo-adhesive layer, it may become difficult to peel the paper substrate from the pseudo-adhesive layer, and the peelability of the paper substrate from the pseudo-adhesive layer may tend to decrease. This tendency tends to become more pronounced, for example, when the pseudo-adhesive layer is formed thin from the perspective of environmental friendliness.

[0025] The inventors believe that the tendency for the paper substrate to have poor releasability from the pseudo-adhesive layer is as follows: The pressure-sensitive adhesive layer is softer than the pseudo-adhesive layer. Therefore, when the paper substrate is peeled from the pseudo-adhesive layer, the pseudo-adhesive layer is pulled along with the paper substrate in the peeling direction of the paper substrate at the interface between the pseudo-adhesive layer and the paper substrate. This causes the pseudo-adhesive layer to deform slightly in the peeling direction of the paper substrate. As the peeling speed increases, the deformation of the pseudo-adhesive layer tends to become greater. Therefore, when the paper substrate is peeled from the pseudo-adhesive layer, the peeling speed is likely to affect the ease of peeling the paper substrate. Furthermore, for example, if the crystallinity of the pseudo-adhesive layer is low, it is thought that moisture and the like are likely to penetrate into the parts where the molecules constituting the resin are sparse when stored in a high-temperature, high-humidity environment. The increased moisture permeability into the pseudo-adhesive layer is likely to affect the ease of peeling the paper substrate when peeling it from the pseudo-adhesive layer due to storage conditions.

[0026] Therefore, by improving the crystallinity of the pseudo-adhesive layer and increasing the tensile modulus of the pseudo-adhesive layer, it is believed that the deterioration of the peelability of the paper substrate from the pseudo-adhesive layer can be suppressed regardless of the storage conditions and peel speed of the pseudo-adhesive label. From this perspective, the inventors have considered using an ethylene-based resin with a high tensile modulus as the main component of the pseudo-adhesive layer. However, when a pseudo-adhesive layer is formed using an ethylene-based resin with a high tensile modulus as the main component, the adhesion between the paper substrate and the pseudo-adhesive layer is reduced, making it difficult to achieve pseudo-adhesion. The inventors speculate on this as follows. For example, when the ethylene-based resin is polyethylene, polyethylene with a high tensile modulus has a high crystallinity. As the crystallinity increases, the melt viscosity at high temperatures during extrusion molding to form the pseudo-adhesive layer is less likely to decrease. Therefore, when a pseudo-adhesive layer is formed using polyethylene as the main component, it is difficult to achieve an anchoring effect on the substrate when it is a paper substrate. As a result, it is thought that the initial adhesive strength cannot be obtained, making it difficult to achieve pseudo-adhesion.

[0027] The present inventors have discovered that by using a propylene-based resin as the thermoplastic resin contained in the pseudo-adhesive layer and by incorporating 70% or more by volume of the propylene-based resin in the entire pseudo-adhesive layer, unintended peeling of the substrate can be suppressed and the substrate and the pseudo-adhesive layer can be bonded with an appropriate pseudo-adhesive strength regardless of the storage conditions and peel speed of the pseudo-adhesive label. The present inventors believe this to be the following: By incorporating 70% or more by volume of the propylene-based resin in the entire pseudo-adhesive layer, the crystallinity of the pseudo-adhesive layer is increased, resulting in a pseudo-adhesive layer with a high tensile modulus and resistance to the effects of heat and humidity. Furthermore, compared to ethylene-based resins with a similarly high degree of crystallinity, propylene-based resins tend to have a lower melt viscosity during extrusion molding to form the pseudo-adhesive layer. Therefore, incorporating 70% or more by volume of the propylene-based resin in the entire pseudo-adhesive layer makes it easier for the pseudo-adhesive layer to exhibit an anchoring effect on the substrate, when the substrate is a paper substrate, and thus pseudo-adhesive properties can be easily exhibited. On the other hand, by setting the tensile modulus of the pseudo-adhesive layer within an appropriate range, the peel resistance is within an appropriate range when the substrate is peeled off from the pseudo-adhesive layer that is in contact with the paper substrate while following the unevenness of the paper substrate. As described above, the pseudo-adhesive label according to this embodiment can suppress unintended peeling of the substrate and can realize that the substrate and the pseudo-adhesive layer are bonded with an appropriate pseudo-adhesive force regardless of the storage conditions and peeling speed of the pseudo-adhesive label. Furthermore, by having the above configuration, for example, even when the thickness of the pseudo-adhesive layer is formed thin from the viewpoint of environmental friendliness, the pseudo-adhesive label according to this embodiment can suppress unintended peeling of the substrate and can realize that the substrate and the pseudo-adhesive layer are bonded with an appropriate pseudo-adhesive force regardless of the storage conditions and peeling speed of the pseudo-adhesive label. Note that although the above description has been given of the case where the substrate is a paper substrate, the substrate is not limited to a paper substrate.

[0028] The pseudo-adhesive label according to the present embodiment suppresses unintended peeling of the substrate, and can realize that the substrate and the pseudo-adhesive layer are adhered with an appropriate pseudo-adhesive force regardless of the storage conditions and peeling speed of the pseudo-adhesive label, so that damage to the substrate is suppressed when the substrate is peeled from the pseudo-adhesive layer. For example, when a paper substrate is used as the substrate, even if the thickness of the paper substrate is thin, damage to the substrate is likely to be suppressed when the substrate is peeled from the pseudo-adhesive layer. Furthermore, even when a paper substrate such as thermal paper is used as the substrate, damage to the substrate is likely to be suppressed.

[0029] Hereinafter, the pseudo adhesive label according to this embodiment will be described with reference to the drawings.

[0030] 1 shows a schematic cross-sectional view of a pseudo adhesive label 1 according to this embodiment. In the pseudo adhesive label 1 according to this embodiment, a substrate 10, a pseudo adhesive layer 20, and a pressure-sensitive adhesive layer 30 are laminated in this order. The substrate 10 and the pseudo adhesive layer 20 are pseudo-adhered to each other at an interface A. Moreover, the pseudo adhesive label 1 according to this embodiment further has a release liner RL, as shown in Fig. 1. However, the pseudo adhesive label according to the present invention is not limited to an embodiment having a release liner RL.

[0031] In the pseudo adhesive label 1 according to this embodiment, the pseudo adhesive layer 20 is pseudo-adhered to the substrate 10. That is, the pseudo adhesive label 1 according to this embodiment can be peeled at the interface A between the substrate 10 as one layer and the pseudo adhesive layer 20 as the other layer, and after peeling, the surface of the substrate 10 on the interface A side and the surface of the pseudo adhesive layer 20 on the interface A side do not exhibit re-adhesion or re-stickiness.

[0032] There is no particular limitation on the shape of the pseudo adhesive label 1. Examples of the shape of the pseudo adhesive label 1 in plan view include polygons (for example, rectangles and triangles), circles, ellipses, and irregular shapes.

[0033] (base material) The substrate 10 of the pseudo adhesive label 1 according to this embodiment is not particularly limited. The substrate 10 is appropriately selected from substrates used in conventional pseudo adhesive labels depending on the intended use of the pseudo adhesive label 1.

[0034] In the pseudo-adhesive label 1, the substrate 10 is an information display substrate that displays information about the adherend. For example, if the adherend is a delivery item, the information about the adherend may include the name or title of the sender, destination, and delivery company, address, telephone number, and contents of the delivery item. Furthermore, information about the adherend may include, for example, when the adherend is a delivery item used in food packaging containers such as prepared meals and bento boxes, information about the contents contained in the food packaging container, such as the name, names of ingredients, content volume, expiration date (or best before date), and information such as the name or title, address, and contact information of the manufacturer, etc.

[0035] The thickness of the substrate 10 is selected appropriately depending on the application of the pseudo adhesive label 1. From the viewpoint of handleability, the thickness of the substrate 10 is preferably 10 μm or more and 200 μm or less, more preferably 20 μm or more and 150 μm or less, and even more preferably 30 μm or more and 100 μm or less. Examples of the substrate 10 include paper, resin film, synthetic paper, and laminated sheets in which two or more layers of these are laminated together. Examples of papers that can be used as the substrate 10 include thermal paper (heat-sensitive paper), kraft paper, fine paper, glassine paper, parchment paper, rayon paper, coated paper, and synthetic fiber paper. Examples of resin films that can be used as the substrate 10 include films of polyester-based resins, polyvinyl chloride-based resins, polyvinylidene chloride-based resins, and polyolefin-based resins.

[0036] The substrate 10 is preferably a paper substrate made of paper or synthetic paper, more preferably thermal paper, kraft paper, fine paper, or glassine paper, and even more preferably thermal paper. Here, in this specification, the term "paper substrate" is a concept that includes both substrates made of paper and substrates having properties similar to those of paper, such as synthetic paper.

[0037] The paper base weight is 10 g / m 2 It is preferable that the content is 15 g / m or more. 2 The basis weight of the paper substrate is more preferably 200 g / m or more. 2 Preferably, it is 150 g / m or less. 2 More preferably, it is 100 g / m or less. 2 More preferably, it is 80 g / m or less. 2 It is even more preferable that the following holds true: According to the pseudo adhesive label 1 of this embodiment, even if the substrate 10 is a paper substrate having a basis weight within this range, damage to the substrate when the substrate is peeled off can be suppressed.

[0038] (pseudo adhesive layer) The pseudo-adhesive layer 20 contains 70% by volume or more of a propylene-based resin relative to the entire pseudo-adhesive layer 20 (100% by volume). From the viewpoint of suppressing unintended peeling of the substrate and more easily realizing adhesion between the substrate and the pseudo-adhesive layer with an appropriate pseudo-adhesive strength regardless of the storage conditions and peeling speed of the pseudo-adhesive label, the content of the propylene-based resin relative to the entire pseudo-adhesive layer 20 is preferably 75% by volume or more, more preferably 80% by volume or more, even more preferably 85% by volume or more, even more preferably 90% by volume or more, and even more preferably 95% by volume or more. From the same viewpoint, the content of the propylene-based resin relative to the entire pseudo-adhesive layer 20 may be 100% by volume or less, 99% by volume or less, or 98% by volume or less. The pseudo-adhesive layer 20 may be composed essentially of a propylene-based resin. Here, the pseudo-adhesive layer 20 being composed essentially of only a propylene-based resin means that impurities that may be contained in the raw materials used to manufacture the pseudo-adhesive layer 20, or that may be mixed in during the manufacturing process of the pseudo-adhesive layer, may be unintentionally contained in the pseudo-adhesive layer 20.

[0039] The propylene-based resin is a polymer that contains the most propylene structural units. The propylene-based resin may be a propylene homopolymer or a propylene copolymer. From the viewpoint of suppressing unintended peeling of the substrate and more easily realizing adhesion between the substrate and the pseudo-adhesive layer with an appropriate pseudo-adhesive strength regardless of the storage conditions and peeling speed of the pseudo-adhesive label, the propylene-based resin is preferably a propylene-based random copolymer. If the propylene-based resin is a propylene-based random copolymer, the pseudo-adhesive strength can be easily adjusted to an appropriate range. The propylene-based random copolymer is not particularly limited, and examples thereof include copolymers of propylene and an α-olefin having 2 to 8 carbon atoms, excluding propylene. Specific examples of the propylene-based random copolymer include propylene-α-olefin copolymers obtained by copolymerizing propylene with at least one α-olefin selected from the group consisting of 1-butene, 1-pentene, 1-hexene, 1-heptene, 1-octene, and 4-methyl-1-pentene. The propylene-based random copolymer may also be, for example, a propylene-α-olefin copolymer obtained by copolymerizing propylene with at least one α-olefin selected from the group consisting of ethylene and 1-butene.

[0040] Considering the stable processability of the pseudo-adhesive layer 20, it is preferable that the pseudo-adhesive layer 20 consists essentially of a propylene-based resin. Furthermore, when the pseudo-adhesive layer 20 consists essentially of a propylene-based resin, it is easy to stably suppress unintended peeling of the substrate, and it is easy to stably achieve adhesion between the substrate and the pseudo-adhesive layer with an appropriate pseudo-adhesive force regardless of the storage conditions and peeling speed of the pseudo-adhesive label.

[0041] The pseudo-adhesive layer 20 can further contain a resin other than a propylene-based resin to adjust the tensile modulus of the pseudo-adhesive layer 20 to an appropriate range. When the tensile modulus of the pseudo-adhesive layer 20 is adjusted to an appropriate range by containing a resin other than a propylene-based resin, the resin other than a propylene-based resin is preferably a polyolefin resin. That is, the pseudo-adhesive layer 20 may further contain a polyolefin resin other than a propylene-based resin. The polyolefin resin other than a propylene-based resin is a polymer having at least a structural unit derived from an olefin monomer other than propylene. Furthermore, even when the pseudo-adhesive layer 20 further contains a polyolefin resin other than a propylene-based resin, cohesive failure of the pseudo-adhesive layer 20 is more likely to be suppressed, and stable pseudo-adhesive strength is more likely to be obtained. Furthermore, even when the pseudo-adhesive layer 20 further contains a polyolefin resin other than a propylene-based resin, stability during extrusion processing is also more likely to be improved.

[0042] The olefin monomer is preferably an olefin other than propylene having 2 or more and 8 or less carbon atoms. Examples of the olefin other than propylene having 2 or more and 8 or less carbon atoms include ethylene, butylene, isobutylene, and 1-hexene. In one aspect of this embodiment, the olefin monomer other than propylene is more preferably at least one monomer selected from the group consisting of an ethylene monomer, which is an olefin having two carbon atoms, and a butylene monomer, which is an olefin having four carbon atoms, and even more preferably an ethylene monomer, which is an olefin having two carbon atoms. The polyolefin resin other than the propylene resin may be a polymer using one kind of olefin monomer alone, or may be a copolymer using two or more kinds of olefin monomers in combination.

[0043] When the pseudo-adhesive layer 20 contains a polyolefin-based resin other than a propylene-based resin, examples of the polyolefin-based resin include polyethylene resin, ethylene-α-olefin copolymers such as ethylene-propylene copolymers, ethylene-vinyl acetate copolymers (EVA), ethylene-methyl methacrylate copolymers (EMMA), polybutene resins (PB), olefin-based elastomers (TPO), and olefin-based terpolymers. Examples of olefin-based terpolymers include ethylene-propylene-(5-ethylidene-2-norbornene). Here, ethylene-propylene copolymers are included in ethylene-based resins and are polymers that contain the largest amount of ethylene structural units.

[0044] The polyolefin resin other than the propylene resin is preferably at least one resin selected from the group consisting of polyethylene resin, ethylene-α-olefin copolymer, and polybutene resin (PB). Examples of the polyethylene resin include very low density polyethylene (VLDPE, density: 880 kg / m 3 More than 910kg / m 3 less than 910 kg / m 3 More than 915kg / m 3 less than 915 kg / m 3 More than 942kg / m 3 less than 942 kg / m 3 or more), and linear polyethylene, etc.

[0045] As described above, the pseudo-adhesive layer 20 preferably does not contain any polyolefin-based resin other than the propylene-based resin, but may contain a polyolefin-based resin other than the propylene-based resin. The pseudo-adhesive layer 20 may contain 70% by volume or more and 100% by volume or less of the propylene-based resin and 0% by volume or more and 30% by volume or less of the polyolefin-based resin other than the propylene-based resin, relative to the entire pseudo-adhesive layer (100%). Furthermore, when a polyolefin-based resin other than the propylene-based resin is contained in the pseudo-adhesive layer 20, the content of the polyolefin-based resin other than the propylene-based resin is preferably 1% by volume or more and 30% by volume or less, from the viewpoint of suppressing unintended peeling of the substrate and easily realizing adhesion between the substrate and the pseudo-adhesive layer with an appropriate pseudo-adhesive strength regardless of the storage conditions and peeling speed of the pseudo-adhesive label. That is, in this case, the pseudo-adhesive layer 20 may contain 70% by volume or more and 99% by volume or less of a propylene-based resin and 1% by volume or more and 30% by volume or less of a polyolefin-based resin other than a propylene-based resin, relative to the entire pseudo-adhesive layer (100%). The content of the polyolefin-based resin other than a propylene-based resin may be 5% by volume or more, or may be 10% by volume or more. The content of the polyolefin-based resin other than a propylene-based resin may be 25% by volume or less, or may be 20% by volume or less.

[0046] The pseudo-adhesive layer 20 has a tensile modulus at 23°C of 250 MPa or more and 1100 MPa or less, as measured in accordance with JIS K 7161:2014 and JIS K 7127:1999. From the viewpoint of suppressing unintended peeling of the substrate and making it easier to achieve adhesion between the substrate and the pseudo-adhesive layer with an appropriate pseudo-adhesive force regardless of the storage conditions and peeling speed of the pseudo-adhesive label, the tensile modulus of the pseudo-adhesive layer 20 is preferably 260 MPa or more, more preferably 270 MPa or more. From the same viewpoint, the tensile modulus of the pseudo-adhesive layer 20 is preferably 1080 MPa or less, more preferably 1060 MPa or less.

[0047] The melt flow rate of the pseudo-adhesive layer 20 is preferably 3.0 g / 10 min or more and 50.0 g / 10 min or less. The melt flow rate of the pseudo-adhesive layer 20 is more preferably 4.0 g / 10 min or more, even more preferably 5.0 g / 10 min or more, and even more preferably 6.0 g / 10 min or more. The melt flow rate of the pseudo-adhesive layer 20 is more preferably 48.0 g / 10 min or less, even more preferably 46.0 g / 10 min or less, and even more preferably 44.0 g / 10 min or less. If the melt flow rate of the pseudo-adhesive layer 20 is in the range of 3.0 g / 10 min or more and 50.0 g / 10 min or less, stable processability can be obtained, and the pseudo-adhesive layer 20 is more likely to have a thickness with near-uniform accuracy. As a result, unintended peeling of the substrate is suppressed, and it becomes easier to achieve adhesion between the substrate and the pseudo-adhesive layer with an appropriate pseudo-adhesive force regardless of the storage conditions and peeling speed of the pseudo-adhesive label.

[0048] The melt flow rate (MFR) of the pseudo-adhesive layer 20 can be measured using a flow tester in accordance with JIS K 7210-1:2014 and JIS K 7210-2:2014. The MFR indicates the MFR at a temperature of 230°C. When the pseudo-adhesive layer is made of polyethylene, the MFR is at a temperature of 190°C, and when made of ethylene-vinyl acetate copolymer, the MFR is at a temperature of 190°C. The MFR can be measured by the method described in the examples below.

[0049] The melting point of the pseudo-adhesive layer 20 is preferably 120°C or higher. If the melting point of the pseudo-adhesive layer 20 is 120°C or higher, the heat resistance of the pseudo-adhesive label is improved. Therefore, even when the pseudo-adhesive label according to this embodiment is attached to a container to be heated in a microwave oven or the like, the substrate can be prevented from lifting from the pseudo-adhesive layer and from unintentionally peeling off the substrate. From the viewpoint of improving heat resistance, the melting point of the pseudo-adhesive layer 20 is more preferably 125°C or higher, even more preferably 130°C or higher, even more preferably 135°C or higher, and even more preferably 140°C or higher. The upper limit of the melting point of the pseudo-adhesive layer 20 is not particularly limited and may be, for example, 200°C or lower.

[0050] The melting point of the pseudo-adhesive layer 20 can be measured using a differential scanning calorimeter in accordance with JIS K 7121:2012.

[0051] In the pseudo-adhesive label according to the present embodiment, the pseudo-adhesive strength of the pseudo-adhesive layer to the substrate, as measured in accordance with JIS Z 0237:2022 at 23°C and 50% RH, at a peel rate of 0.3 m / min, and at a peel angle of 180°, is preferably 250 mN / 50 mm or more and 2000 mN / 50 mm or less. The pseudo-adhesive strength is more preferably 280 mN / 50 mm or more, and even more preferably 300 mN / 50 mm or more. The pseudo-adhesive strength is more preferably 1900 mN / 50 mm or less, and even more preferably 1800 mN / 50 mm or less. When the pseudo-adhesive strength of the pseudo-adhesive layer to the substrate is in the range of 250 mN / 50 mm or more and 2000 mN / 50 mm or less, unintended peeling of the substrate is suppressed, and the substrate and the pseudo-adhesive layer are easily bonded with an appropriate pseudo-adhesive strength. Furthermore, if the pseudo-adhesion strength of the pseudo-adhesive layer to the substrate is in the range of 250 mN / 50 mm or more and 2000 mN / 50 mm or less, damage to the thermal paper when peeled off from the pseudo-adhesive layer is more likely to be suppressed, especially when thin thermal paper is used as the substrate.

[0052] Furthermore, the ratio of change Ra between the pseudo-adhesion strength measured at a peel rate of 0.3 m / min and a peel angle of 180° under an environment of 23°C and 50% RH and the pseudo-adhesion strength measured at a peel rate of 0.3 m / min and a peel angle of 180° after storage for 3 days under an environment of, for example, 60°C and 95% RH is preferably 0 or more and 3.0 or less. Furthermore, the ratio of change Rv between the pseudo-adhesion strength measured at a peel rate of 0.3 m / min and a peel angle of 180° under an environment of, for example, 23°C and 50% RH and the pseudo-adhesion strength measured at a peel rate of 30 m / min and a peel angle of 180° is preferably 0 or more and 5.0 or less. The smaller the change ratios Rv and Ra, the easier it is to achieve adhesion between the substrate and the pseudo-adhesive layer with an appropriate pseudo-adhesive force, regardless of the storage conditions and peel speed of the pseudo-adhesive label. Each change ratio can be measured by the method described in the Examples below.

[0053] The thickness of the pseudo-adhesive layer 20 is not particularly limited. The thickness of the pseudo-adhesive layer 20 is preferably 1 μm or more, more preferably 3 μm or more, even more preferably 5 μm or more, and even more preferably 7 μm or more. The thickness of the pseudo-adhesive layer 20 is preferably 20 μm or less, more preferably 18 μm or less, even more preferably 15 μm or less, and even more preferably 13 μm or less. Even if the pseudo-adhesive layer 20 is thin, the pseudo-adhesive label according to this embodiment can suppress unintended peeling of the substrate, and can easily achieve adhesion between the substrate and the pseudo-adhesive layer with an appropriate pseudo-adhesive force, regardless of the storage conditions and peeling speed of the pseudo-adhesive label.

[0054] In the pseudo-adhesive label according to this embodiment, the ratio of the thickness of the pseudo-adhesive layer to the thickness of the adhesive layer described below (thickness of the pseudo-adhesive layer / thickness of the adhesive layer) is preferably 0.3 or more and 1.5 or less. The ratio of the thickness of the pseudo-adhesive layer to the thickness of the adhesive layer may be 0.4 or more, or may be 0.5 or more. The ratio of the thickness of the pseudo-adhesive layer to the thickness of the adhesive layer may be 1.4 or less. Even when the ratio of the thickness of the pseudo-adhesive layer to the thickness of the adhesive layer is in the range of 0.3 or more and 1.5 or less, unintended peeling of the substrate is suppressed, and the substrate and the pseudo-adhesive layer are likely to be bonded with an appropriate pseudo-adhesive force regardless of the storage conditions and peeling speed of the pseudo-adhesive label.

[0055] The pseudo-adhesive layer 20 may contain additives to prevent unintended peeling of the substrate and to the extent that the adhesive strength between the substrate and the pseudo-adhesive layer is not impaired regardless of the storage conditions and peeling speed of the pseudo-adhesive label. Examples of additives include antioxidants, lubricants, UV absorbers, colorants, and antiblocking agents. When the pseudo-adhesive layer 20 contains an additive, the additive may be one type or two or more types. It is also preferable that the pseudo-adhesive label according to this embodiment does not contain a filler in the pseudo-adhesive layer 20. If the pseudo-adhesive layer 20 contains a filler, the tensile modulus of the pseudo-adhesive layer may become too high.

[0056] When the pseudo-adhesive layer 20 contains an additive, the content of the additive is preferably 0.0001 to 20 parts by weight, more preferably 0.0005 to 15 parts by weight, and even more preferably 0.001 to 10 parts by weight, per 100 parts by weight of the thermoplastic resin contained in the pseudo-adhesive layer 20. Here, 100 parts by weight of thermoplastic resin refers to 100 parts by weight of propylene-based resin when the pseudo-adhesive layer 20 is composed essentially of propylene-based resin alone. When the pseudo-adhesive layer 20 contains propylene-based resin and a polyolefin resin other than propylene-based resin, the total of the propylene-based resin and the polyolefin resin other than propylene-based resin is 100 parts by weight. In this embodiment, the pseudo-adhesive layer 20 may contain an additive, but is preferably composed essentially of thermoplastic resin alone. Here, "substantially" is as described above.

[0057] (Adhesive layer) The adhesive layer 30 preferably contains a known adhesive. The adhesive layer 30 may contain an adhesive and a tackifying resin. Examples of adhesives contained in the adhesive layer 30 include acrylic adhesives, natural rubber adhesives, synthetic rubber adhesives, and silicone adhesives. In terms of weather resistance and the like, the adhesive contained in the adhesive layer 30 is preferably an acrylic adhesive. Examples of acrylic adhesives include solvent-based acrylic adhesives and aqueous emulsion-based acrylic resins.

[0058] When the adhesive layer 30 contains a tackifying resin, examples of the tackifying resin include rosin-based resins, terpene phenolic resins, terpene resins, aromatic hydrocarbon-modified terpene resins, aliphatic petroleum resins, aromatic petroleum resins, hydrogenated petroleum resins, coumarone-indene resins, styrene-based resins, phenolic resins, and xylene resins.

[0059] The pressure-sensitive adhesive layer 30 may further contain additives as necessary. Examples of additives that may be contained in the pressure-sensitive adhesive layer 30 include fillers, softeners, heat and light stabilizers, antioxidants, and crosslinking agents. Examples of fillers include zinc oxide, titanium oxide, silica, calcium carbonate, and barium sulfate. Examples of softeners include process oil, liquid rubber, and plasticizers. Examples of heat and light stabilizers include benzophenone-based stabilizers, benzotriazole-based stabilizers, and hindered amine-based stabilizers. Examples of antioxidants include anilide-based antioxidants, phenol-based antioxidants, phosphite-based antioxidants, and thioester-based antioxidants.

[0060] The thickness of the adhesive layer 30 is selected appropriately depending on the application of the pseudo adhesive label 1. The thickness of the adhesive layer 30 is preferably 1 μm or more and 50 μm or less, more preferably 5 μm or more and 50 μm or less, even more preferably 10 μm or more and 40 μm or less, even more preferably 10 μm or more and 30 μm or less, and even more preferably 10 μm or more and 20 μm or less.

[0061] (Release liner) The release liner RL protects the adhesive layer 30 until the pseudo-adhesive label 1 is attached to an adherend. The release liner RL is not particularly limited as long as it can be used by being attached to the adhesive layer of the adhesive sheet. The release treatment layer can be formed by applying a release agent to the surface of the release liner substrate.

[0062] Examples of the substrate for the release liner include paper and plastic films. Examples of papers include fine paper, glassine paper, and kraft paper. Examples of plastic films include polyester resin films and polyolefin resin films. Examples of polyester resin films include films of polyethylene terephthalate resin, polybutylene terephthalate resin, and polyethylene naphthalate resin. Examples of polyolefin resin films include films of polypropylene resin and polyethylene resin. The papers and plastic films used as the substrate for the release liner may be the same as or different from the papers and plastic films exemplified in the description of the substrate 10 of the pseudo adhesive label 1, for example.

[0063] Examples of the release agent include rubber elastomers such as silicone resins, olefin resins, isoprene resins, and butadiene resins, long-chain alkyl resins, alkyd resins, and fluorine-based resins.

[0064] The thickness of the release liner RL is not particularly limited, and is preferably 10 μm or more and 200 μm or less, more preferably 25 μm or more and 170 μm or less, even more preferably 30 μm or more and 150 μm or less, even more preferably 35 μm or more and 100 μm or less, and even more preferably 35 μm or more and 80 μm or less.

[0065] <Manufacturing method of pseudo adhesive label> The pseudo adhesive label 1 according to this embodiment can be manufactured by, for example, a manufacturing method including the following steps P1 and P2.

[0066] ·Process P1 Step P1 is a step of laminating the substrate 10 and the pseudo-adhesive layer 20. The laminate produced in step P1, in which the interface A between the substrate 10 and the pseudo-adhesive layer 20 is pseudo-adhered, may be referred to as a "pseudo-adhesive laminate" hereinafter.

[0067] ·Process P2 Step P2 is a step of laminating a pressure-sensitive adhesive layer 30 onto the pseudo-adhesive layer 20 of the pseudo-adhesive laminate obtained in step P1.

[0068] First, step P1 will be described. The method for laminating the pseudo-adhesive layer 20 on the substrate 10 is not particularly limited. The manufacturing method of the pseudo adhesive label 1 according to this embodiment includes a step of melt-extruding a pseudo adhesive layer material containing a material constituting the pseudo adhesive layer 20 onto the substrate 10 (melt-extrusion step). In the manufacturing method of the pseudo adhesive label 1 according to this embodiment, the pseudo adhesive layer material contains 70% by volume or more of a propylene-based resin. In this embodiment, when the material constituting the pseudo adhesive layer 20 consists solely of a propylene-based resin, the "pseudo adhesive layer material" corresponds to a propylene-based resin. In addition, when the material constituting the pseudo adhesive layer 20 contains not only the propylene-based resin but also other materials, the "pseudo adhesive layer material" corresponds to a resin composition containing the propylene-based resin.

[0069] As a method for melt-extruding the pseudo-adhesive layer material, for example, a method using a T-die can be mentioned. The temperature at which the pseudo-adhesion layer material is melted and extruded (melt extrusion temperature) is preferably set appropriately depending on the type of resin that constitutes the pseudo-adhesion layer 20. In addition, the melt extrusion temperature is preferably a temperature at which the pseudo-adhesion layer material does not melt and adhere to the substrate 10. In this embodiment, since propylene-based resin is used as the main resin constituting the pseudo-adhesive layer 20, the melt extrusion temperature is typically 200°C or higher and 400°C or lower, preferably 230°C or higher and 350°C or lower, and more preferably 250°C or higher and 300°C or lower.

[0070] Step P1 also includes a step of cooling the melt-extruded pseudo-adhesive layer material (cooling step). In the cooling process, the heated and melted pseudo-adhesion layer material is brought into contact with a cooling means such as a cooling roll to form the pseudo-adhesion layer 20. The cooling roll has a cylindrical body with a metal outer surface. The cooling roll has a cooling function by passing cooling water or the like through the inside of the cylindrical body. When a cooling roll is used as the cooling means, the pseudo-adhesion layer material melt-extruded onto the substrate may be cooled by directly contacting the outer surface of the cooling roll, or the substrate may be directly contacted with the outer surface of the cooling roll to indirectly cool the pseudo-adhesion layer material. In addition, in the cooling process, the melt-extruded pseudo-adhesion layer material may be cooled by air cooling. The cooling temperature of the pseudo-adhesive layer 20 is preferably 15°C or higher and 40°C or lower, and more preferably 20°C or higher and 35°C or lower. When a cooling roll is used as the cooling means, the cooling temperature is the temperature of the cooling water passed through the cooling roll. When the pseudo-adhesive layer material is cooled by air cooling, the cooling temperature is the ambient temperature in which the melt-extruded pseudo-adhesive layer material is placed, and when temperature-controlled air is forcibly blown onto the pseudo-adhesive layer material, the cooling temperature is the temperature of that air.

[0071] When a cooling roll is used as a cooling means, the time (cooling time) during which the molten pseudo-adhesive layer material is in direct or indirect contact with the outer surface of the cooling roll can be controlled by the speed at which the laminate comprising the substrate and the pseudo-adhesive layer material is conveyed.

[0072] As described above, the pseudo-adhesive laminate can be obtained by the step P1 including the melt-extrusion step and the cooling step.

[0073] Next, step P2 will be described. In step P2, a pressure-sensitive adhesive layer 30 is formed on the surface of the pseudo-adhesive laminate on the side of the pseudo-adhesive layer 20.

[0074] Specifically, an adhesive composition containing materials for forming the adhesive layer 30 is applied to the release-treated surface of the release liner RL to form the adhesive layer 30 on the release liner RL. The adhesive composition in step P2 contains a tackifier resin and a main polymer. The adhesive layer 30 formed on the release liner RL is attached to the surface of the pseudo-adhesive laminate that faces the pseudo-adhesive layer 20, thereby producing the pseudo-adhesive label 1.

[0075] Alternatively, the pseudo-adhesive label 1 can be produced by applying an adhesive composition to the surface of the pseudo-adhesive laminate on which the pseudo-adhesive layer 20 is located to form an adhesive layer 30, and then attaching a release liner RL to the adhesive layer 30.

[0076] Examples of methods for applying the pressure-sensitive adhesive composition include roll coating, bar coating, knife coating, roll knife coating, blade coating, die coating, and gravure coating.

[0077] In order to improve the adhesion between the surface of the pseudo-adhesive laminate facing the pseudo-adhesive layer 20 and the pressure-sensitive adhesive layer 30, it is preferable to form the pressure-sensitive adhesive layer 30 after subjecting the surface of the pseudo-adhesive laminate facing the pseudo-adhesive layer 20 to corona treatment or the like.

[0078] The pseudo adhesive label 1 may be subjected to punching processing as appropriate. The punching process may be carried out, for example, by punching out the entire release liner RL using a punching blade that follows the outline of the predetermined label. Alternatively, cuts may be made from the substrate 10 to the adhesive layer 30 so as not to punch through the release liner RL, and multiple pseudo adhesive labels 1 may be arranged on the release liner RL. In this case, the cuts made by punching may penetrate into the release liner RL to an extent that the release liner RL is not punched out and falls off. If necessary, unnecessary portions around the outer periphery of each pseudo-adhesive label 1 may be removed from the release liner RL.

[0079] <Applications of pseudo adhesive labels> FIG. 2 is a schematic cross-sectional view showing a state in which the pseudo adhesive label 1 is stuck to an adherend 100. As shown in FIG. The pseudo adhesive label 1 according to this embodiment can be peeled at the interface between the adhesive layer 30 and the release liner RL. After being separated from the release liner RL, the adhesive layer 30 of the pseudo adhesive label 1 is attached to the adherend 100, as shown in FIG.

[0080] When the pseudo-adhesive label 1 is used as a delivery slip, the adherend 100 can be, for example, a delivery item. A delivery item is usually composed of an item to be delivered and packaging material for packaging the item. Examples of packaging material include wrapping paper, wrapping film, packaging boxes, and packaging containers. Examples of packaging material include cardboard, paper, plastic, and metal. Since the pseudo-adhesive label 1 is attached to the packaging material of the delivery item, the adhesive layer 30 has an appropriate adhesive strength to the packaging material. The pseudo-adhesive label 1 according to this embodiment can also be used as a label to be attached to a container to be heated in a microwave oven, etc. In this case, the adherend 100 can be, for example, a food packaging container made of one or both of paper and plastic materials.

[0081] FIG. 3 is a schematic cross-sectional view showing a state in which the substrate 10 is peeled off from the pseudo adhesive label 1 stuck to the adherend 100. As shown in FIG.

[0082] The pseudo adhesive label 1 according to this embodiment is used, for example, as a delivery slip. When the pseudo adhesive label 1 is used as a delivery slip, the entire base material 10 may be peeled off as a receipt. Furthermore, when the pseudo-adhesive label 1 is used as a delivery slip, it is also preferable that the substrate 10 of the pseudo-adhesive label 1 is divided into multiple label pieces, for example, by a slit. For example, if the substrate 10 is divided into two by a slit, one label piece can be used as a delivery slip and the other label piece can be used as a receipt. The label piece used as a receipt is usually peeled off at the interface A with the pseudo-adhesive layer 20 after being stamped or signed. The other label piece remains on the delivery item or the box or container in which the delivery item is packed. The receipt peeled off from the pseudo adhesive label 1 is used by a delivery company or the like to organize delivery slips.

[0083] (Effects of this embodiment) The pseudo adhesive label 1 according to this embodiment contains 70% by volume or more of a propylene-based resin in the pseudo adhesive layer 20, and the tensile modulus of the pseudo adhesive layer 20 is 250 MPa or more and 1100 MPa or less, thereby preventing unintended peeling of the substrate. Furthermore, because the pseudo adhesive layer 20 of the pseudo adhesive label 1 according to this embodiment has the above-mentioned configuration, the substrate and the pseudo adhesive layer can be bonded with an appropriate pseudo adhesive force regardless of the storage conditions and peeling speed of the pseudo adhesive label.

[0084] The present invention is not limited to the above-described embodiments, and may include modifications and improvements within the scope of achieving the object of the present invention. [Example]

[0085] The present invention will be described in more detail below with reference to examples, but the present invention is not limited to these examples in any way.

[0086] [Creating pseudo-adhesive labels] The pseudo-adhesive labels of each example were prepared according to the following procedure.

[0087] Example 1 The propylene-based resin used as the pseudo-adhesive layer material was heated to 260°C, and a 12 μm-thick propylene-based resin layer was extruded onto the substrate using a T-die. The thickness of the propylene-based resin layer was controlled by adjusting the back pressure of the extruder's screw. Cooling water adjusted to 23°C was passed through a water-cooled roll, and the propylene-based resin on the substrate was brought into contact with the surface of the water-cooled roll, thereby cooling and solidifying the molten propylene-based resin layer. In this way, a pseudo-adhesive layer laminated to the substrate was prepared. Next, an acrylic pressure-sensitive adhesive composition was applied onto the release liner. A roll coater was used to apply the pressure-sensitive adhesive composition. The applied pressure-sensitive adhesive composition was dried to form a 20 μm-thick pressure-sensitive adhesive layer. A pseudo-adhesive label was prepared by bonding the pressure-sensitive adhesive layer on the release liner and the pseudo-adhesive laminate (pseudo-adhesive layer on the substrate). The pseudo-adhesive label according to Example 1 was provided with a substrate, a pseudo-adhesive layer, a pressure-sensitive adhesive layer, and a release liner in this order.

[0088] In Example 1, the substrate was a sheet of paper with a basis weight of 65 g / m 2 The thermal paper was used, and the propylene-based resin used as the pseudo-adhesive layer material was SanAllomer PH943B (manufactured by SanAllomer Co., Ltd.), a propylene-based random copolymer. In Tables 1 and 2, this propylene-based random copolymer is referred to as "r-PP1."

[0089] Example 2 A pseudo-adhesive label was produced in the same manner as in Example 1, except that the propylene-based resin of the pseudo-adhesive layer material was changed to Prime Polypro F-744NP (a propylene-based random copolymer manufactured by Prime Polymer Co., Ltd.). In Tables 1 and 2, this propylene-based random copolymer is referred to as "r-PP2."

[0090] Example 3 A pseudo-adhesive label was produced in the same manner as in Example 1, except that the propylene-based resin of the pseudo-adhesive layer material was changed to Prime Polypro J226T (a propylene-based random copolymer manufactured by Prime Polymer Co., Ltd.). In Tables 1 and 2, this propylene-based random copolymer is referred to as "r-PP3."

[0091] Example 4 A pseudo-adhesive label was produced in the same manner as in Example 1, except that the propylene-based resin of the pseudo-adhesive layer material was changed to a resin composition containing a propylene-based resin obtained by mixing 70% by volume of SunAllomer PHA03A (a propylene homopolymer manufactured by SunAllomer Co., Ltd.) and 30% by volume of Tafmer A-4085S (an ethylene-α-olefin random copolymer manufactured by Mitsui Chemicals, Inc.). In Tables 1 and 2, propylene homopolymer is abbreviated as "PP," and ethylene-α-olefin random copolymer is abbreviated as "EAO."

[0092] Example 5 A pseudo-adhesive label was produced in the same manner as in Example 1, except that the propylene-based resin of the pseudo-adhesive layer material was changed to a resin composition containing a propylene-based resin mixed with 70 volume % Sunallomer PH943B and 30 volume % Tafmer A-4085S.

[0093] Example 6 A pseudo-adhesive label was produced in the same manner as in Example 1, except that the thickness of the pseudo-adhesive layer was changed to 10 μm.

[0094] Example 7 A pseudo-adhesive label was produced in the same manner as in Example 1, except that the thickness of the adhesive layer was changed to 10 μm.

[0095] (Comparative Example 1) A pseudo-adhesive label was produced in the same manner as in Example 1, except that the propylene-based resin of the pseudo-adhesive layer material was changed to polyethylene, Petrothene W14A (medium-density polyethylene, manufactured by Tosoh Corporation). In Tables 1 and 2, medium-density polyethylene is represented as "MDPE."

[0096] (Comparative Example 2) A pseudo-adhesive label was produced in the same manner as in Example 1, except that the propylene-based resin of the pseudo-adhesive layer material was changed to a resin composition containing a propylene-based resin mixed with 85% by volume of Prime Polypro F-744NP and 15% by volume of calcium carbonate. In Tables 1 and 2, calcium carbonate is represented as "CC."

[0097] (Comparative Example 3) A pseudo-adhesive label was produced in the same manner as in Example 1, except that the propylene-based resin of the pseudo-adhesive layer material was changed to polyethylene, Sumikathene L405 (low-density polyethylene, manufactured by Sumitomo Chemical Co., Ltd.). In Tables 1 and 2, low-density polyethylene is referred to as "LDPE."

[0098] Comparative Example 4 A pseudo-adhesive label was produced in the same manner as in Example 1, except that the propylene-based resin used as the pseudo-adhesive layer material was changed to an ethylene-vinyl acetate copolymer, Ultrathene 537 (manufactured by Tosoh Corporation). In Tables 1 and 2, ethylene-vinyl acetate copolymer is referred to as "EVA."

[0099] [Evaluation of pseudo-adhesive labels] The pseudo-adhesive labels of the respective examples thus produced were evaluated by the following evaluation methods. The evaluation results are shown in Tables 1 and 2.

[0100] ((Normal) Pseudo-adhesion strength) The pseudo-adhesive strength was measured in accordance with the 180° peel adhesive strength measurement method of JIS Z 0237:2022. Specifically, first, the prepared pseudo-adhesive label was fixed to a stainless steel plate using the pseudo-adhesive label's own adhesive layer. Then, the substrate of the pseudo-adhesive label was peeled from the pseudo-adhesive layer at a peeling speed of 0.3 m / min in an environment of 23°C and 50% RH by a test method in which the label is peeled at an angle of 180° to the stainless steel plate. The force required for this peeling (peel force) was measured, and the measured peel force was taken as the pseudo-adhesive strength. The unit of pseudo-adhesive strength is mN / 50 mm. This pseudo-adhesive strength was taken as the "(normal) pseudo-adhesive strength."

[0101] (Pseudo adhesive strength peel speed dependency: change ratio Rv evaluation) The pseudo-adhesion force was measured using the same test method as the above "(normal) pseudo-adhesion force" except that the peeling speed was set to 30 m / min. This pseudo-adhesion force was designated as "(normal) high-speed pseudo-adhesion force." In Comparative Example 1, partial peeling occurred during the measurement of the (normal) pseudo-adhesion force, causing damage to the substrate, so measurement of the (normal) high-speed pseudo-adhesion force was not performed. The partial peeling that occurred in Comparative Example 1 was not due to substrate damage, but rather to low adhesion to the paper, resulting in partial peeling between the pseudo-adhesion layer and the paper layer. Then, when the (normal) pseudo-adhesion force is Fs and the (normal) high-speed pseudo-adhesion force is Fhs, the change ratio Rv of the (normal) high-speed pseudo-adhesion force Fhs to the (normal) pseudo-adhesion force Fs was calculated using the following formula (Equation 1), and the pseudo-adhesion force peel speed dependency was evaluated according to the following evaluation criteria. In Tables 1 and 2, this evaluation is referred to as the change ratio Rv evaluation. Rv = |(Fhs - Fs)| / Fs (Equation 1) (In the formula (Equation 1), Rv represents the change ratio, Fhs represents the (normal) high-speed pseudo-adhesion force, and Fs represents the (normal) pseudo-adhesion force.)

[0102] <Evaluation criteria> "A": The change ratio Rv is 0.0 or more and 5.0 or less. "F1": The change ratio Rv is greater than 5.0 and equal to or less than 10.0. "F2": The change ratio Rv exceeds 10.0.

[0103] (Pseudo adhesive strength storage dependency: change ratio Ra evaluation) The prepared pseudo-adhesive label was stored for 3 days under an environment of 60°C and 95% RH. Thereafter, the pseudo-adhesive strength was measured using the same test method as the above-mentioned "(normal) pseudo-adhesive strength." The pseudo-adhesive strength of the pseudo-adhesive label that had been stored under such a heated and humidified environment was designated as the "(temporal) pseudo-adhesive strength" in comparison with the above-mentioned "(normal) pseudo-adhesive strength." In Comparative Example 1, partial peeling occurred during the measurement of the (normal) pseudo-adhesive strength, causing damage to the substrate, so the (temporal) pseudo-adhesive strength was not measured. Then, when the (normal) pseudo-adhesion force is Fs and the (over-time) pseudo-adhesion force is Fa, the change ratio Ra of the (over-time) pseudo-adhesion force Fa to the (normal) pseudo-adhesion force Fs was calculated using the following formula (Equation 2), and the storage dependency of the pseudo-adhesion force was evaluated according to the following evaluation criteria. In Tables 1 and 2, this evaluation is referred to as the change ratio Ra evaluation. Ra = |(Fa - Fs)| / Fs (Equation 2) (In the formula (Equation 2), Ra represents the change ratio, Fa represents the pseudo adhesive force (over time), and Fs represents the pseudo adhesive force (normal state).)

[0104] <Evaluation criteria> "A": The change ratio Ra is 0.0 or more and 1.0 or less. "F1": The change ratio Ra is greater than 1.0 and equal to or less than 3.0. "F2": The change ratio Ra is greater than 3.0.

[0105] (tensile modulus) Using an extruder, a 100 μm thick monolayer film was produced using the composition of the pseudo-adhesive layer in each pseudo-adhesive label, and the tensile modulus at 23°C was measured in accordance with JIS K 7161:2014 and JIS K 7127:1999. Specifically, the produced monolayer film was first cut into 15 mm × 140 mm test pieces. The obtained test pieces were subjected to a tensile test at a speed of 200 mm / min using a tensile tester (Shimadzu Corporation, product name "Autograph AG-IS 500N") with a chuck distance of 100 mm, to measure the tensile modulus (unit: MPa). The tensile modulus was measured in the CD direction. That is, the dimensions of the test piece were 15 mm in the MD direction × 140 mm in the CD direction. The CD direction means the direction perpendicular to the machine direction (MD direction) when a single-layer film is produced using the composition of the pseudo-adhesive layer in each pseudo-adhesive label example.

[0106] (Melting Point) Measurement was performed using a differential scanning calorimeter (DSC, manufactured by TA Instruments, "Q2000") in accordance with JIS K 7121:2012. Specifically, the sample was first heated from room temperature to 250°C at a heating rate of 20°C / min, held at 250°C for 10 minutes, cooled to -60°C at a heating rate of 20°C / min, and held at -60°C for 10 minutes. The sample was then heated again to 250°C at a heating rate of 20°C / min to obtain a DSC curve, and the melting point was measured.

[0107] (ratio of thickness of pseudo-adhesive layer and adhesive layer) The thickness of the pseudo-adhesive layer alone obtained by peeling off the pseudo-adhesive layer laminated to the substrate was measured. The thickness of the adhesive layer was calculated by subtracting the thickness of the substrate, pseudo-adhesive layer, and release liner from the total thickness of the pseudo-adhesive label. A constant pressure thickness meter (manufactured by Teclock Corporation, "PG-02") was used to measure the thickness. The ratio of the thickness of the pseudo-adhesive layer to the thickness of the adhesive layer was calculated from the obtained numerical values ​​for the thickness of the pseudo-adhesive layer and the adhesive layer. In Tables 1 and 2, the thickness of the pseudo-adhesive layer is represented as Pt, the thickness of the adhesive layer is represented as At, and the ratio of the thickness of the pseudo-adhesive layer to the thickness of the adhesive layer is represented as Pt / At.

[0108] (Melt flow rate: MFR) The MFR was measured using a flow tester (Shimadzu Corporation, model number "CFT-100D") in accordance with JIS K 7210-1:2014 and JIS K 7210-2:2014. The measurement conditions were a temperature of 230°C, a load of 2.16 kg, a die with a hole shape of φ2.095 mm and a length of 8.0 mm, and a cylinder with an inner diameter of 11.329 mm. Since the pseudo-adhesion layers of Comparative Examples 1 and 3 were made of polyethylene, the temperature was changed to 190°C to measure the MFR. Since the pseudo-adhesion layer of Comparative Example 4 was made of ethylene-vinyl acetate copolymer, the temperature was changed to 190°C to measure the MFR.

[0109] [Table 1]

[0110] [Table 2]

[0111] From the above results, it can be seen that the pseudo-adhesive labels of Examples 1 to 7 do not cause damage to the substrate and have a pseudo-adhesive strength that is not too low, and therefore have an appropriate pseudo-adhesive strength. Furthermore, the pseudo-adhesive labels of Examples 1 to 7 have small ratios of change Ra between the pseudo-adhesive force in the normal state and the pseudo-adhesive force after storage in a high-temperature, high-humidity environment, and small ratios Rv between the pseudo-adhesive force in the normal state and the pseudo-adhesive force when peeled off at high speed. This shows that the pseudo-adhesive labels of Examples 1 to 7 have an appropriate pseudo-adhesive force between the substrate and the pseudo-adhesive layer, regardless of the storage conditions and peeling speed of the pseudo-adhesive label. Therefore, it was confirmed that the pseudo-adhesive label of this embodiment can suppress unintentional peeling of the substrate and ensure that the substrate and pseudo-adhesive layer are adhered with an appropriate pseudo-adhesive force regardless of the storage conditions and peeling speed of the pseudo-adhesive label. [Explanation of symbols]

[0112] 1...pseudo adhesive label, 10...substrate, 100...adherend, 20...pseudo adhesive layer, 30...adhesive layer, A...interface, RL...release liner.

Claims

1. A substrate; an adhesive layer; a pseudo-adhesive layer between the substrate and the pressure-sensitive adhesive layer; The pseudo-adhesive layer contains 70% by volume or more of a propylene-based resin based on the entire pseudo-adhesive layer, The tensile modulus of the pseudo-adhesive layer at 23°C in accordance with JIS K 7161:2014 and JIS K 7127:1999 is 250 MPa or more and 1100 MPa or less. Pseudo adhesive labels.

2. The pseudo-adhesive label according to claim 1, The melting point of the pseudo-adhesive layer is 120°C or higher. Pseudo adhesive labels.

3. The pseudo-adhesive label according to claim 1 or 2, The propylene-based resin is a propylene-based random copolymer. Pseudo adhesive labels.

4. The pseudo-adhesive label according to claim 1 or 2, The pseudo-adhesive layer further contains a polyolefin resin other than a propylene-based resin. Pseudo adhesive labels.

5. The pseudo-adhesive label according to claim 1 or 2, The melt flow rate of the pseudo-adhesive layer is 3.0 g / 10 min or more and 50.0 g / 10 min or less. Pseudo adhesive labels.

6. The pseudo-adhesive label according to claim 1 or 2, The ratio of the thickness of the pseudo-adhesive layer to the thickness of the pressure-sensitive adhesive layer (thickness of the pseudo-adhesive layer / thickness of the pressure-sensitive adhesive layer) is 0.3 or more and 1.5 or less; Pseudo adhesive labels.

7. The pseudo-adhesive label according to claim 1 or 2, The pseudo-adhesion strength of the pseudo-adhesive layer to the substrate, as measured in accordance with JIS Z 0237:2022 at a peel speed of 0.3 m / min and a peel angle of 180° under an environment of 23°C and 50% RH, is 250 mN / 50 mm or more and 2000 mN / 50 mm or less. Pseudo adhesive labels.

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