Light emitting module

Abstract

To provide a light emitting module that can store information using a simple method and retain the stored information for a long period of time.SOLUTION: A light emitting module according to the embodiment comprises: a substrate; light emitting elements provided on the substrate; and an information storage unit provided on the substrate that stores information through the arrangement of a plurality of holes.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] FIELD OF THE INVENTION An embodiment of the present invention relates to a light emitting module. [Background technology]

[0002] Light-emitting modules equipped with light-emitting elements such as light-emitting diodes are becoming increasingly popular in place of lamps with filaments from the viewpoints of energy conservation and longer life. Such light-emitting modules include, for example, a substrate and a light-emitting element provided on the substrate.

[0003] The type of light-emitting element is selected appropriately depending on the application of the light-emitting module. For example, when the light-emitting module is used in a lighting device, the light-emitting element can be a light-emitting element that emits light in the visible light range. When the light-emitting module is used for surface modification, curing of ultraviolet-curable resin, excitation of photocatalyst, sterilization, or the like, the light-emitting element can be a light-emitting element that emits light in the ultraviolet range. When the light-emitting module is used in a sensor, for example, the light-emitting element can be any of a light-emitting element that emits light in the infrared range, a light-emitting element that emits light in the visible light range, and a light-emitting element that emits light in the ultraviolet range.

[0004] In this way, light-emitting modules equipped with light-emitting elements are used for various purposes in a wide range of technical fields. Therefore, from the viewpoint of quality control, etc., it is necessary to manage information such as the type, manufacturing lot, product number, etc. of the light-emitting module. In this case, if such information is provided for each light-emitting module, it is possible to perform lot tracing and maintenance by reading the information.

[0005] For example, such information can be printed on a substrate provided in the light-emitting module using ink, etc. However, when such information is printed using ink, etc., there is a risk that the information will fade over time or become difficult to read over time.

[0006] Therefore, there has been a demand for the development of a light-emitting module that can store information in a simple manner and that can retain the stored information for a long period of time. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Japanese Patent Publication No. 2022-024123 Summary of the Invention [Problem to be solved by the invention]

[0008] An object of the present invention is to provide a light-emitting module that can store information in a simple manner and that can retain the stored information for a long period of time. [Means for solving the problem]

[0009] A light emitting module according to an embodiment includes: a substrate; a light emitting element provided on the substrate; and an information storage unit provided on the substrate and storing information by arranging a plurality of holes. [Effects of the Invention]

[0010] According to an embodiment of the present invention, it is possible to provide a light-emitting module that can store information in a simple manner and can retain the stored information for a long period of time. [Brief explanation of the drawings]

[0011] [Figure 1] 1 is a schematic perspective view illustrating a light-emitting module according to an embodiment of the present invention; [Figure 2] FIG. 2 is a schematic plan view of the light-emitting module. [Figure 3] 10 is a schematic plan view of the information storage unit when viewed from a direction along the optical axis of the light-emitting module. FIG. [Figure 4] 1 is a micrograph of a cross section of an information storage section. DETAILED DESCRIPTION OF THE INVENTION

[0012] Hereinafter, embodiments will be illustrated with reference to the drawings. In the drawings, like components are designated by like reference numerals and detailed descriptions thereof will be omitted where appropriate.

[0013] FIG. 1 is a schematic perspective view illustrating a light-emitting module 1 according to the present embodiment. FIG. 2 is a schematic plan view of the light-emitting module 1. As shown in FIG. As shown in FIGS. 1 and 2, the light emitting module 1 includes, for example, a substrate 11, a light emitting element 12, a frame 13, a sealing portion 14, a circuit element 15, and an information storage portion 16.

[0014] The substrate 11 has a plate-like shape. The planar shape of the substrate 11 (the shape when viewed from a direction along the optical axis 1a of the light-emitting module 1) is, for example, a substantially rectangular shape. However, the planar shape of the substrate 11 can be changed as appropriate depending on the use of the light-emitting module 1 and the shape and size of a housing in which the light-emitting module 1 is installed. For example, the planar shape of the substrate 11 can be a circle, an ellipse, a polygon such as a hexagon, or any shape composed of straight lines and curves.

[0015] When the light-emitting module 1 is turned on, a current flows through the light-emitting element 12, causing the light-emitting element 12 to emit light and generate heat. A current also flows through the circuit element 15, generating heat. If the temperature of the light-emitting element 12 increases due to the heat generated in the light-emitting element 12 and the heat generated in the circuit element 15 and transmitted to the light-emitting element 12, the temperature of the light-emitting element 12 may exceed the maximum junction temperature. If the temperature of the light-emitting element 12 exceeds the maximum junction temperature, the light-emitting element 12 may break down or the luminous flux of the light emitted from the light-emitting element 12 may decrease.

[0016] Therefore, it is preferable that the substrate 11 be made of a material with high thermal conductivity. For example, the substrate 11 can be made of an inorganic material such as ceramics (e.g., aluminum oxide or aluminum nitride). The substrate 11 may also be a metal core substrate in which the surface of a metal plate is covered with an insulating material. However, from the viewpoint of weight reduction and cost reduction, it is preferable that the substrate 11 be made of an inorganic material such as ceramics. If the substrate 11 is made of a material with high thermal conductivity, it becomes easy to dissipate heat generated in the light-emitting element 12 and the circuit element 15 to the outside via the substrate 11. Therefore, it becomes easy to prevent the temperature of the light-emitting element 12 from exceeding the maximum junction temperature.

[0017] A wiring pattern 11a can be provided on the surface of the substrate 11. The wiring pattern 11a is made of, for example, a material containing silver as a main component or a material containing copper as a main component.

[0018] Furthermore, a covering portion 11b can be provided on the surface of the substrate 11. The covering portion 11b can cover the wiring pattern 11a, a film resistor (described later), and the like. In this case, the portions of the wiring pattern 11a on which the light-emitting elements 12 and circuit elements 15 are mounted and the portions to which external connection terminals are connected are exposed from the covering portion 11b. The covering portion 11b contains, for example, a glass material. For example, the covering portion 11b can be formed by applying a paste-like glass material onto the wiring pattern 11a and baking it.

[0019] The light-emitting element 12 is provided on the substrate 11. The light-emitting element 12 is electrically connected to the wiring pattern 11a. At least one light-emitting element 12 can be provided. The light-emitting module 1 illustrated in FIGS. 1 and 2 is provided with a plurality of light-emitting elements 12. When a plurality of light-emitting elements 12 are provided, the plurality of light-emitting elements 12 can be connected in series.

[0020] The light emitting element 12 may be, for example, a light emitting diode, an organic light emitting diode, a laser diode, or the like.

[0021] The wavelength of the light emitted from the light emitting element 12 can be appropriately selected depending on the application of the light emitting module 1 and the like. For example, when the light-emitting module 1 is used in a lighting device, it can be configured as a light-emitting element 12 that emits light in the visible light region. In this case, light of a desired color can be emitted from the light-emitting element 12. Alternatively, light of a desired color may be emitted by mixing blue light emitted from the light-emitting element 12 with light excited by the blue light entering a phosphor included in the sealing portion 14, which will be described later.

[0022] For example, when the light-emitting module 1 is used for surface modification, curing of ultraviolet curable resin, excitation of ultraviolet responsive photocatalyst, sterilization, etc., the light-emitting module 1 can be a light-emitting element 12 that irradiates light in the ultraviolet region. When the light-emitting module 1 is used for excitation of visible light responsive photocatalyst, the light-emitting module 12 can be a light-emitting element 12 that irradiates light in the visible region.

[0023] For example, when the light-emitting module 1 is used as a sensor or the like, it can be any one of a light-emitting element 12 that emits light in the infrared region, a light-emitting element 12 that emits light in the visible light region, and a light-emitting element 12 that emits light in the ultraviolet region.

[0024] The light emitting element 12 may be any of a chip-type light emitting element, a surface-mounted light emitting element such as a PLCC (Plastic Leaded Chip Carrier) type, and a light emitting element having leads such as a bullet type. However, if the light emitting element 12 is a chip-shaped light emitting element, the light emitting module 1 can be made smaller.

[0025] In the following, as an example, a case where the light emitting element 12 is a chip-shaped light emitting element will be described. The chip-shaped light-emitting element 12 can be electrically connected to the wiring pattern 11a by COB (Chip On Board). The chip-shaped light-emitting element 12 may be any of an upper electrode type light-emitting element, a top and bottom electrode type light-emitting element, and a flip-chip type light-emitting element.

[0026] The frame 13 is bonded to the substrate 11. The frame 13 has a frame shape and surrounds the light-emitting element 12. The outline of the frame 13 (the outline of the planar shape) when viewed from a direction along the optical axis 1a of the light-emitting module 1 can be changed as appropriate depending on the required light distribution characteristics, luminance distribution, etc. For example, the outline of the planar shape of the frame 13 can be a circle, a rectangle, an ellipse, etc. The outline of the planar shape of the frame 13 illustrated in Figures 1 and 2 is a circle.

[0027] The frame 13 is formed from, for example, a resin, which may be a thermoplastic resin such as PBT (polybutylene terephthalate), PC (polycarbonate), PET, nylon, PP (polypropylene), PE (polyethylene), or PS (polystyrene).

[0028] Here, a portion of the light irradiated from the light-emitting element 12 is incident on the inner wall of the frame 13 provided around the light-emitting element 12. The light incident on the inner wall of the frame 13 is reflected by the inner wall of the frame 13 and is irradiated toward the front side of the light-emitting module 1. Therefore, if the frame 13 is provided, the utilization efficiency of the light irradiated from the light-emitting element 12 can be improved. For example, the frame 13 can contain titanium oxide particles or a white resin in order to improve the reflectance of the light irradiated from the light-emitting element 12.

[0029] Furthermore, if the frame portion 13 is provided, the area in which the sealing portion 14 is formed can be reduced, and therefore the light-emitting module 1 can be made smaller.

[0030] The sealing portion 14 is provided inside the frame portion 13. The sealing portion 14 is provided so as to cover the region of the substrate 11 surrounded by the frame portion 13. The sealing portion 14 is provided so as to cover the light-emitting element 12. The sealing portion 14 contains a light-transmitting resin. The sealing portion 14 is formed, for example, by filling the inside of the frame portion 13 with resin. The filling of the resin is performed, for example, using a dispenser or the like. The resin to be filled is, for example, silicone resin. The sealing portion 14 may also contain a phosphor.

[0031] In addition, optical elements and the like can be provided as necessary. Examples of optical elements include convex lenses, concave lenses, and light guides. The optical elements can be provided on the sealing portion 14, for example.

[0032] If the light emitting element 12 is a surface-mounted light emitting element or a bullet-type light emitting element having lead wires, the frame portion 13 and the sealing portion 14 can be omitted.

[0033] The circuit element 15 can be a passive element or an active element used to configure a light-emitting circuit having the light-emitting element 12. The circuit element 15 is provided on the substrate 11. The circuit element 15 is provided, for example, around the periphery of the frame portion 13 and is electrically connected to the wiring pattern 11a. For example, the circuit element 15 is electrically connected to the light-emitting element 12 via the wiring pattern 11a.

[0034] The circuit elements 15 illustrated in FIGS. 1 and 2 are a protection element 15a, a resistor 15b, and a control element 15c. However, the type of circuit element 15 is not limited to the exemplified ones, and can be changed as appropriate depending on the configuration of the light-emitting circuit having the light-emitting element 12. For example, in addition to the above-mentioned ones, the circuit element 15 may also be a capacitor, a positive temperature coefficient thermistor, a negative temperature coefficient thermistor, an inductor, a surge absorber, a varistor, a transistor, an integrated circuit, an arithmetic element, or the like.

[0035] The protective element 15a is provided, for example, to prevent a reverse voltage from being applied to the light-emitting element 12 and to prevent pulse noise from being applied from the reverse direction to the light-emitting element 12. The protective element 15a may be, for example, a diode. The protective element 15a illustrated in FIGS. 1 and 2 is a surface-mount diode.

[0036] Resistor 15b may be, for example, a surface-mount resistor, a resistor with leads (metal oxide film resistor), a film resistor formed by screen printing, etc. Resistor 15b illustrated in Figures 1 and 2 is a film resistor.

[0037] Here, since there is variation in the forward voltage characteristics of the light-emitting element 12, if the voltage applied between the anode terminal and the ground terminal is constant, variation occurs in the brightness (luminous flux, luminance, luminous intensity, illuminance) of the light emitted from the light-emitting element 12. Therefore, to keep the brightness of the light emitted from the light-emitting element 12 within a predetermined range, the value of the current flowing through the light-emitting element 12 is controlled to be within a predetermined range by using resistor 15b connected in series to the light-emitting element 12. In this case, the resistance value of resistor 15b is changed to keep the value of the current flowing through the light-emitting element 12 within the predetermined range.

[0038] If the resistor 15b is a surface-mount resistor or a resistor with leads, the resistor 15b should have an appropriate resistance value depending on the forward voltage characteristics of the light-emitting element 12. If the resistor 15b is a film resistor, the resistance value can be increased by removing a portion of the resistor 15b. For example, a portion of the film resistor can be easily removed by irradiating the film resistor with laser light. The number, arrangement, size, etc. of the resistors 15b are not limited to those illustrated, and can be changed as appropriate depending on the number and specifications of the light-emitting elements 12.

[0039] The control element 15c is provided, for example, to switch the voltage applied to the light-emitting element 12 or to perform temperature derating. However, the functions and uses of the control element 15c are not limited to those illustrated. The control element 15c can be, for example, a transistor or an integrated circuit. The control element 15c illustrated in FIGS. 1 and 2 is a surface-mount integrated circuit.

[0040] As described above, the light emitting module 1 including the light emitting element 12 is used for various purposes in a wide range of technical fields. Therefore, from the viewpoint of quality control, etc., it is necessary to manage information such as the type, manufacturing lot, and product number of the light-emitting module 1 (light-emitting element 12). In this case, if such information is provided for each light-emitting module 1, it is possible to perform lot tracing and maintenance by reading the information.

[0041] In this case, information can be printed using ink or the like on the substrate 11. However, when information is printed using ink or the like, there is a risk that the information may fade over time or become difficult to read over time.

[0042] Therefore, the light-emitting module 1 is provided with an information storage section 16 that stores information by arranging a plurality of holes 16a. 1 and 2, the information storage unit 16 is provided on the surface of the substrate 11 on which the light-emitting elements 12 are provided. The information storage unit 16 has, for example, a film-like body 16b provided on the surface of the substrate 11 and a plurality of holes 16a provided in the film-like body 16b.

[0043] FIG. 3 is a schematic plan view of the information storage section 16 when viewed from the direction along the optical axis 1a of the light-emitting module 1. FIG. 4 is a micrograph of a cross section of the information storage section 16. As shown in FIG. As shown in Figures 3 and 4, the information storage unit 16 has a plurality of holes 16a. Depending on the arrangement of the plurality of holes 16a, it is possible to form, for example, a one-dimensional code or a two-dimensional code. Therefore, depending on the arrangement of the plurality of holes 16a, it is possible to store information such as the type, production lot, and product number of the light-emitting module 1 (light-emitting element 12). Note that the content of the information stored in the plurality of holes 16a is not limited to the example shown.

[0044] The multiple holes 16a, for example, penetrate the film 16b in the thickness direction. The multiple holes 16a do not have to penetrate the film 16b in the thickness direction. However, as long as the multiple holes 16a penetrate the film 16b in the thickness direction, the substrate 11 can be exposed inside the multiple holes 16a. Therefore, the color, light reflectance, brightness, etc. can be changed between the surface of the film 16b opposite the substrate 11 side and the portion of the multiple holes 16a. Therefore, the information stored in the information storage unit 16 can be read out with high accuracy.

[0045] 4, the holes 16a can also reach the inside of the substrate 11. In this case, a recess 11c communicating with the holes 16a is provided on the surface of the substrate 11 on which the film-like body 16b is provided. In this way, the substrate 11 can be more reliably exposed inside the holes 16a. Therefore, the information stored in the information storage unit 16 can be read out with even greater accuracy.

[0046] The film 16b can be formed from, for example, a glass material. The thickness of the film 16b can be, for example, about 10 μm to 30 μm. The film 16b can be formed, for example, by applying a paste-like glass material to a predetermined area of ​​the substrate 11 and then baking it. For example, the material and thickness of the film 16b can be the same as the material and thickness of the covering portion 11b described above. In this way, the film 16b and the covering portion 11b can be formed in the same process. This simplifies the manufacturing process, thereby shortening the manufacturing period and reducing the manufacturing costs.

[0047] The holes 16a can be formed, for example, by irradiating the surface of the film 16b opposite the substrate 11 with laser light in a dot pattern. For example, a fiber laser or YAG laser can be used to form the holes 16a with a dot size of approximately 50 μm to 80 μm and a dot pitch of approximately 60 μm to 90 μm. The laser output, pulse width, pulse period, and the like can be appropriately changed depending on the thickness of the film 16b. For example, in the case of a film 16b containing a glass material and having a thickness of approximately 10 μm, the fiber laser output can be approximately 10 W to 20 W, the pulse width can be approximately 1 ns to 200 ns, and the pulse period can be approximately 0.5 μs to 500 μs.

[0048] If the wiring pattern 11a or the film-like resistor 15b is located at a position where the laser light is irradiated, the laser light may be incident on the covering portion 11b covering the wiring pattern 11a or the film-like resistor 15b, potentially forming a hole in the covering portion 11b. If a hole is formed in the covering portion 11b, the wiring pattern 11a or the film-like resistor 15b may be exposed inside the hole. If the wiring pattern 11a or the film-like resistor 15b is exposed, the wiring pattern 11a or the film-like resistor 15b may be oxidized or deteriorated by oxygen, gas, moisture, or the like contained in the atmosphere. This may result in changes in the color, light reflectance, brightness, or other characteristics of the exposed portion inside the hole 16a, potentially reducing the accuracy of reading the information stored in the information storage unit 16. Furthermore, the wiring pattern 11a or the film-like resistor 15b may be damaged.

[0049] Therefore, the holes 16a can be provided at positions that do not overlap with the wiring pattern 11a or the film-like resistor 15b. In this case, the holes 16a can be provided at any positions as long as they do not overlap with the wiring pattern 11a or the film-like resistor 15b.

[0050] Furthermore, a plurality of holes 16a (recesses) can be provided directly on the surface of the substrate 11 on which the light-emitting elements 12 are provided. That is, the film-like body 16b can be omitted. In this case, the information storage unit 16 has a plurality of holes 16a provided directly on the surface of the substrate 11. Even when a plurality of holes 16a are provided directly on the substrate 11, it is sufficient to irradiate the surface of the substrate 11 with laser light in a dot pattern.

[0051] In this case, the depth of the plurality of holes 16a is preferably about 50 μm. If the depth of the plurality of holes 16a is about 50 μm, the difference in brightness between the holes 16a and the surface of the substrate 11 around the holes 16a can be increased. This improves the accuracy of reading information.

[0052] However, if the depth of the holes 16a is made deeper, the thickness of the substrate 11 may become thinner in parts, or stress concentration may become more likely to occur. As mentioned above, the substrate 11 may be made of an inorganic material such as ceramics. Since inorganic materials such as ceramics are brittle materials, if the depth of the holes 16a is made too deep, damage such as cracks and chips may easily occur in the parts of the substrate 11 where the holes 16a are formed.

[0053] Therefore, when the plurality of holes 16a are directly formed in the substrate 11, it is preferable that the thickness of the substrate 11 be three times or more the depth of the holes 16a. In this way, even when the plurality of holes 16a are directly formed in the substrate 11, damage such as cracks and chips can be prevented from occurring in the substrate 11.

[0054] If a film 16b is provided on the surface of the substrate 11 and multiple holes 16a are provided in the film 16b, the periphery of the recess 11c opening on the surface of the substrate 11 can be covered by the film 16b, as shown in Fig. 4. Therefore, the portion of the substrate 11 where the multiple holes 16a are provided can be reinforced by the film 16b, so that even if the thickness of the substrate 11 is reduced, damage such as cracks and chips to the substrate 11 can be suppressed. Furthermore, if the thickness of the substrate 11 can be reduced, it becomes easier to transfer heat generated in the light-emitting elements 12 and the circuit elements 15 to the outside via the substrate 11. Therefore, the heat dissipation performance of the light-emitting module 1 can be improved.

[0055] Whether multiple holes 16a are provided in the film-like body 16b or multiple holes 16a are provided directly in the substrate 11, as long as the multiple holes 16a do not overlap with the wiring pattern 11a or the film-like resistor 15b, it is possible to prevent the wiring pattern 11a or the film-like resistor 15b from being altered or damaged by oxygen, gas, moisture, etc. contained in the atmosphere.

[0056] This has been confirmed through specified reliability tests (1000 hours of high-temperature, high-humidity testing and 3000 cycles of thermal shock testing). The high-temperature, high-humidity testing was conducted in an atmosphere with an ambient temperature of 85°C±3°C and a relative humidity of 85%±5%. In the thermal shock testing, one cycle consists of 30 minutes of alternating exposure to an atmosphere of 105°C±3°C and an atmosphere of -30°C±3°C.

[0057] As explained above, if information is stored by arranging a plurality of holes 16a, information can be stored in a simple manner and the stored information can be retained for a long period of time.

[0058] Although several embodiments of the present invention have been described above, these embodiments are presented by way of example only and are not intended to limit the scope of the invention. These novel embodiments can be embodied in various other forms, and various omissions, substitutions, modifications, etc. can be made without departing from the spirit of the invention. These embodiments and their modifications are included within the scope and spirit of the invention, as well as within the scope of the invention and its equivalents as set forth in the claims. Furthermore, the above-described embodiments can be implemented in combination with each other. [Explanation of symbols]

[0059] 1 light-emitting module, 11 substrate, 11a wiring pattern, 11b covering portion, 12 light-emitting element, 13 frame portion, 14 sealing portion, 15 circuit element, 15b resistor, 16 information storage portion, 16a hole, 16b film-like body

Claims

1. a substrate; a light-emitting element provided on the substrate; an information storage unit provided on the substrate and configured to store information by arranging a plurality of holes; A light emitting module comprising:

2. 2. The light-emitting module according to claim 1, wherein the information storage section comprises a film-like body provided on the surface of the substrate, and the plurality of holes provided in the film-like body.

3. The light-emitting module according to claim 1 , wherein the information storage section has the plurality of holes formed directly on the surface of the substrate.

4. the substrate comprises an inorganic material; 3. The light-emitting module according to claim 2, wherein the film-like body includes a glass material.

5. a wiring pattern provided on the substrate; a covering portion that covers the wiring pattern and includes the glass material; 5. The light emitting module according to claim 4, further comprising:

Images