Heat conduction member, heat radiation unit, electronic apparatus, and assembly method for heat conduction member

Abstract

To provide a heat conduction member capable of suppressing excessive pressure applied to a membrane-like member, heat radiation unit, electronic apparatus, and assembly method for a heat conduction member.SOLUTION: The heat conduction member includes a first heat transfer member, a second heat transfer member disposed apart from the first heat transfer member, a membrane-like member formed of a flexible and elastic material and forming a sealed space between the first heat transfer member and the second heat transfer member, and a filler filled into the sealed space within the membrane-like member. The membrane-like member includes a first end joined to the first heat transfer member, a second end joined to the second heat transfer member, an elastic deformation section formed between the first and second ends and elastically deformable, and a low-strength connection section provided between the first end and the elastic deformation section, joined to the first heat transfer member with a lower bonding strength than that of the first end and the first heat transfer member.SELECTED DRAWING: Figure 18

Description

[Technical Field]

[0001] The present disclosure relates to a heat conduction member, a heat dissipation unit, an electronic device, and a method for assembling a heat conduction member. [Background technology]

[0002] It is known to dissipate heat generated by electronic components to the outside via heat dissipation components such as heat sinks, heat dissipation fins, heat pipes, etc. In such cases, a thermally conductive material called a TIM (Thermal Interface Material) is sometimes placed between the electronic component and the heat dissipation component to improve thermal conductivity between them.

[0003] For example, Patent Document 1 discloses a configuration in which a thermally conductive gel pack is disposed between an electronic component and a heat dissipation member. In this configuration, the thermally conductive gel pack is encapsulated in a package having a first layer including a polymer film or thermal tape and a second layer including a polymer film. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Utility Model Registration No. 3191158 Summary of the Invention [Problem to be solved by the invention]

[0005] In the configuration described in Patent Document 1, the thermally conductive gel pack is made of a material that bends with a small force. Therefore, if the heat dissipation member attached to the thermally conductive member is excessively heavy, excessive pressure may be applied to the film member.

[0006] An object of the present disclosure is to provide a heat conduction member, a heat dissipation unit, an electronic device, and a method for assembling a heat conduction member that solves the above-mentioned problems. [Means for solving the problem]

[0007] A heat conduction member according to one embodiment of the present disclosure comprises a first heat transfer member, a second heat transfer member spaced apart from the first heat transfer member, a film-like member formed from a flexible and elastic film-like material and forming an enclosed space between the first heat transfer member and the second heat transfer member, and a filler material filled in the enclosed space within the film-like member, wherein the film-like member has a first end joined to the first heat transfer member, a second end joined to the second heat transfer member, an elastic deformation portion formed between the first end and the second end and capable of elastic deformation, and a low-strength connection portion provided between the first end and the elastic deformation portion and connected to the first heat transfer member with a bonding strength lower than the bonding strength between the first end and the first heat transfer member.

[0008] A method for assembling a heat conduction member according to one aspect of the present disclosure includes the steps of: joining a second end of a film-like member formed from a flexible and elastic film-like material and having a cylindrical shape from a first end to a second end to a first heat transfer member; supplying a filler material to the portion surrounded by the first heat transfer member and the film-like member; joining the first end to another heat transfer member; and connecting the portion between the first end and an elastically deformable elastic deformation portion formed between the first end and the second end to the other heat transfer member with a bonding strength lower than the bonding strength between the first end and the other heat transfer member.

[0009] A method for assembling a heat conduction member according to one aspect of the present disclosure includes the steps of joining one first end of a film-like member formed from a flexible film-like material to a first heat transfer member and joining the other second end to a second heat transfer member spaced apart from the first heat transfer member, thereby forming the sealed space within the film-like member between the first heat transfer member and the second heat transfer member, and filling the sealed space with a filler material. In the step of forming the sealed space, the portion between the first end and the second end and an elastically deformable elastic deformation portion formed between the first end and the second end and capable of elastic deformation is connected to the first heat transfer member with a bonding strength lower than the bonding strength between the first end and the first heat transfer member. [Effects of the Invention]

[0010] According to the above aspect, excessive pressure acting on the membrane member is suppressed. [Brief explanation of the drawings]

[0011] [Figure 1] 1 is a cross-sectional view illustrating an example of an electronic device including a thermally conductive member according to the present disclosure. [Figure 2] FIG. 2 is a cross-sectional view illustrating an example of a heat conduction member according to the present disclosure. [Figure 3] FIG. 2 is a perspective view of the heat conduction member of the present disclosure, as viewed from the second heat transfer member side. [Figure 4] 1 is a cross-sectional view showing a state in which a heat dissipation member is close to a heat-generating component in a heat conduction member according to the present disclosure. [Figure 5] 1 is a cross-sectional view showing a state in which a first heat transfer member and a second heat transfer member are in contact with each other in a heat conduction member according to the present disclosure. [Figure 6] 1A to 1C are diagrams showing the flow of an assembly method for a heat conduction member according to the present disclosure. [Figure 7] 10 is a cross-sectional view showing a state in which a second heat transfer member is placed on a lower mold frame in order to form a film member in the method of assembling a heat conduction member according to the present disclosure. FIG. [Figure 8] 10 is a cross-sectional view showing a state in which an upper mold frame is placed on a lower mold frame to form a film member in the method for assembling a thermal conduction member according to the present disclosure. FIG. [Figure 9] 10 is a cross-sectional view showing a state in which the material of the film-shaped member is filled between the lower mold form and the upper mold form in the method of assembling the thermal conduction member of the present disclosure. FIG. [Figure 10] 10 is a cross-sectional view showing a state in which a film member integrally molded with a second heat transfer member is set in a jig in the method of assembling a heat conduction member according to the present disclosure. FIG. [Figure 11] 10 is a cross-sectional view showing a state in which a filler material is supplied into a film member in the method of assembling a thermal conduction member according to the present disclosure. FIG. [Figure 12] 10 is a cross-sectional view showing a state in which a first heat transfer member and a second heat transfer member are connected via a film-like member in the method of assembling a heat conduction member according to the present disclosure. FIG. [Figure 13] 1A to 1C are diagrams showing the flow of a method for assembling a heat conduction member according to the present disclosure. [Figure 14] 10 is a cross-sectional view showing a state in which a sealed space is formed in the method of assembling a heat conduction member according to the present disclosure. FIG. [Figure 15] 10 is a cross-sectional view showing a state in which a vacuum is drawn in the sealed space in the method for assembling a heat conduction member according to the present disclosure. FIG. [Figure 16] FIG. 2 is a cross-sectional view showing a heat conduction member of the present disclosure. [Figure 17] FIG. 2 is a cross-sectional view showing a heat conduction member of the present disclosure. [Figure 18] FIG. 2 is a cross-sectional view showing a heat conduction member of the present disclosure. [Figure 19] FIG. 2 is a cross-sectional view showing a heat dissipation unit of the present disclosure. [Figure 20] FIG. 1 is a cross-sectional view showing an electronic device according to the present disclosure. [Figure 21] 1A to 1C are diagrams showing the flow of an assembly method for a heat conduction member according to the present disclosure. [Figure 22] 1A to 1C are diagrams showing the flow of an assembly method for a heat conduction member according to the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0012] Each embodiment will be described below with reference to the drawings. In all drawings, the same or corresponding components are designated by the same reference numerals, and common descriptions will be omitted. It should be noted that in this disclosure, the drawings may relate to one or more embodiments.

[0013] First Embodiment Hereinafter, an embodiment according to the present disclosure will be described with reference to the drawings. FIG. 1 is a cross-sectional view showing an example of an electronic device 200 including a heat conducting member 100A according to the present disclosure. As shown in FIG. 1, an electronic device 200 according to the present disclosure includes a substrate 220 on which a heat-generating component 210 is mounted, and a heat dissipation unit 300. The heat-generating component 210 generates heat during operation. Examples of the heat-generating component 210 include an IC (Integrated Circuit) and an inverter. The heat-generating component 210 is mounted on a substrate 220 having a circuit section with a predetermined pattern. One surface of the heat-generating component 210 faces the substrate 220.

[0014] The heat dissipation unit 300 dissipates heat generated by the heat-generating component 210 to the outside. The heat dissipation unit 300 includes a heat dissipation member 310 and a heat conduction member 100A. The heat dissipation member 310 dissipates heat transmitted from the heat-generating component 210 via the thermal conduction member 100A to the outside. The heat dissipation member 310 dissipates the heat from the heat-generating component 210 into the surrounding atmosphere. The heat dissipation member 310 is made of metal. The heat dissipation member 310 is, for example, a heat sink, a heat dissipation fin, a heat pipe, or the like. The heat dissipation member 310 of the present disclosure is a heat sink having a plurality of heat dissipation fins 311.

[0015] 2 is a cross-sectional view showing an example of a heat transfer member 100A according to the present disclosure. As shown in FIGS. 1 and 2, the heat transfer member 100A includes a first heat transfer member (another heat transfer member) 10, a second heat transfer member (one heat transfer member) 20, a film member 30A, and a filler 40.

[0016] The first heat transfer member 10 and the second heat transfer member 20 are spaced apart from each other. Each of the first heat transfer member 10 and the second heat transfer member 20 has a flat plate shape extending along a plane intersecting the direction in which the first heat transfer member 10 and the second heat transfer member 20 are spaced apart from each other. As shown in FIG. 1 , one of the first heat transfer member 10 and the second heat transfer member 20 is provided so as to be in contact with the heat dissipation member 310. One surface 10f of the first heat transfer member 10 of the present disclosure is in contact with the bottom surface of the heat dissipation member 310. A thin material for reducing contact thermal resistance may be interposed between the one surface 10f of the first heat transfer member 10 and the bottom surface of the heat dissipation member 310. The bottom surface of the heat dissipation member 310 is, for example, flat. The one surface 10f of the first heat transfer member 10 and the bottom surface of the heat dissipation member 310 are in surface contact. Note that, for example, if the bottom surface of the heat dissipation member 310 is not flat but has a step, the first heat transfer member 10 may have a shape that engages with the bottom surface of the heat dissipation member 310 rather than being flat.

[0017] The other of the first heat transfer member 10 and the second heat transfer member 20 is provided so as to contact the heat-generating component 210. One surface 20g of the second heat transfer member 20 of the present disclosure is in contact with the upper surface of the heat-generating component 210. A thin material for reducing contact thermal resistance may be interposed between the one surface 20g of the second heat transfer member 20 and the upper surface of the heat-generating component 210. The upper surface of the heat-generating component 210 is, for example, flat. The one surface 20g of the second heat transfer member 20 and the upper surface of the heat-generating component 210 are in surface contact. Note that, for example, if the upper surface of the heat-generating component 210 is not flat but has a step, the second heat transfer member 20 may have a shape that engages with the upper surface of the heat-generating component 210 rather than being flat.

[0018] 2, the outer dimension D1 of the first heat transfer member 10 of the present disclosure is larger than, for example, the outer dimension D2 of the second heat transfer member 20. In other words, the area of ​​the first heat transfer member 10 is larger than the area of ​​the second heat transfer member 20 when viewed from a direction in which the first heat transfer member 10 and the second heat transfer member 20 of the present disclosure are separated from each other. The outer dimension D1 of the first heat transfer member 10 may be smaller than the outer dimension D2 of the second heat transfer member 20. Alternatively, the outer dimension D1 of the first heat transfer member 10 and the outer dimension D2 of the second heat transfer member 20 may be the same.

[0019] Examples of materials for forming the first heat transfer member 10 and the second heat transfer member 20 include metals with high thermal conductivity such as gold, silver, copper, magnesium, zinc, and iron, alloys containing gold, silver, copper, magnesium, zinc, and the like (for example, stainless steel, brass, phosphor bronze, and zinc die-cast), and ceramics such as aluminum nitride and silicon carbide. When a metal or an alloy is used, the surfaces of the first heat transfer member 10 and the second heat transfer member 20 may be plated with nickel, nickel phosphorus, or the like to prevent corrosion and alloying.

[0020] FIG. 3 is a perspective view of a heat conduction member 100A of the present disclosure as viewed from the second heat transfer member 20 side. As shown in FIGS. 2 and 3 , the film member 30A is formed from a flexible and elastic film-like material. When viewed from the direction in which the first heat-transfer member 10 and the second heat-transfer member 20 are spaced apart, the film member 30A is rectangular and has an opening 30h in its center. At least a portion of the film member 30A is cylindrically formed from a first end 30p located on the outer periphery of the film member 30A toward a second end 30q on the other side, which forms the inner periphery of the opening 30h of the film member 30A. The film member 30A of the present disclosure is pre-formed, at least in part, into a truncated pyramid shape so that the outer dimensions along a plane intersecting the direction in which the first heat-transfer member 10 and the second heat-transfer member 20 are spaced apart gradually decrease from the first end 30p toward the second end 30q.

[0021] The film-like member 30A is formed from a film-like or sheet-like elastic material that is flexible and elastic (stretchable). The film-like member 30A of the present disclosure is formed from a material containing, for example, a film-like rubber such as silicone rubber or a stretchable resin such as PET (polyethylene terephthalate).

[0022] As shown in FIGS. 1 to 3, the film member 30A has a first end portion 30p, a second end portion 30q, an elastically deforming portion 30f, and a low-strength connecting portion 30d. The first end 30p is bonded to the first heat-transfer member 10. As shown in FIGS. 1 and 2, one first end 30p of the film-shaped member 30A of the present disclosure is bonded to the outer periphery of the other surface 10g of the first heat-transfer member 10 with an adhesive 37, such as a thermosetting silicone adhesive. The second end 30q is bonded to the second heat-transfer member 20. The other second end 30q of the film-shaped member 30A of the present disclosure is, for example, integrally molded with the outer periphery of the one surface 20g of the second heat-transfer member 20. The other second end 30q of the film-shaped member 30A may be bonded to the outer periphery of the one surface 20g of the second heat-transfer member 20 with, for example, an adhesive. Such a film-shaped member 30A forms an enclosed space S between the first heat-transfer member 10 and the second heat-transfer member 20. The enclosed space S is filled with a filler 40, which will be described later.

[0023] The elastically deforming portion 30f is formed between the first end portion 30p and the second end portion 30q. As will be described in detail later, the elastically deforming portion 30f is expandable and contractable when the first heat-transfer member 10 and the second heat-transfer member 20 are displaced relative to each other in a direction in which they move toward or away from each other.

[0024] The low-strength connection portion 30d is formed between the first end portion 30p and the elastically deformable portion 30f. The low-strength connection portion 30d is formed on the inner circumferential side of the first heat-transfer member 10 relative to the first end portion 30p. The low-strength connection portion 30d connects the film-shaped member 30A and the first heat-transfer member 10 with a bonding strength lower than the bonding strength between the first end portion 30p and the first heat-transfer member 10. In the low-strength connection portion 30d of the present disclosure, the film-shaped member 30A and the first heat-transfer member 10 are connected with an adhesive or pressure-sensitive adhesive 38. The adhesive or pressure-sensitive adhesive 38 is appropriately selected so as to obtain a bonding strength as described in detail below. The adhesive or pressure-sensitive adhesive 38 may be, for example, an adhesive tape (double-sided tape). The adhesive or pressure-sensitive adhesive 38 may be applied to the entire bonding surface between the film-shaped member 30A and the first heat-transfer member 10, or may be applied in a dotted pattern, for example.

[0025] In this way, the first heat transfer member 10 and the second heat transfer member 20, which are arranged via a membrane member 30A, at least a portion of which has been formed into a cylindrical shape in advance, are maintained apart from each other due to the rigidity (shape retention) of the membrane member 30A itself.

[0026] In such a heat conduction member 100A, when viewed from the direction in which the first heat transfer member 10 and the second heat transfer member 20 are separated from each other, the first end 30p of the film-like member 30A is located closer to the outer periphery than the second heat transfer member 20. On the other hand, the second end 30q is joined to one surface 20g of the second heat transfer member 20. As a result, when the heat conduction member 100A is compressed in the direction in which the first heat transfer member 10 and the second heat transfer member 20 approach each other, the film-like member 30A does not exist between the first heat transfer member 10 and the second heat transfer member 20, and the first heat transfer member 10 and the second heat transfer member 20 can be displaced to a position where they come into contact with each other.

[0027] The filler 40 fills the sealed space S in the film member 30A. A liquid metal can be used as the filler 40. Examples of the liquid metal used for the filler 40 include one containing at least one of gallium (Ga) and indium (In). Furthermore, the liquid metal used for the filler 40 may contain tin (Sn), bismuth (Bi), or zinc (Zn). A metal filler having a higher thermal conductivity than the liquid metal may be mixed into the liquid metal. Alternatively, a metal powder or a conductive paste may be used as the filler 40.

[0028] 1, in such electronic device 200, heat generated in heat-generating component 210 is efficiently transferred to heat-dissipating member 310 via second heat-transfer member 20, filler 40, and first heat-transfer member 10. Therefore, heat-generating component 210 is efficiently cooled.

[0029] FIG. 4 is a cross-sectional view showing a state in which heat dissipation member 310 approaches heat-generating component 210 in heat conduction member 100A of the present disclosure. 4, when the first heat transfer member 10 and the second heat transfer member 20 approach each other due to the load of the heat dissipation member 310 or the like, the filler 40 interposed between the first heat transfer member 10 and the second heat transfer member 20 is pushed outward in the sealed space S. Then, the filler 40 moving to the outer periphery of the first heat transfer member 10 and the second heat transfer member 20 causes the elastic deformation portion 30f of the film member 30A to deform or stretch so as to bulge.

[0030] FIG. 5 is a cross-sectional view showing a state in which the first heat transfer member 10 and the second heat transfer member 20 are in contact with each other in a heat conduction member 100A of the present disclosure. The connection strength of the low-strength connection portion 30d, which is made by the adhesive or pressure-sensitive adhesive 38, is set so that the low-strength connection portion 30d begins to peel from the first heat-transfer member 10 when the first heat-transfer member 10 and the second heat-transfer member 20 approach each other to a predetermined distance. When the first heat-transfer member 10 and the second heat-transfer member 20 approach each other by a distance equal to or greater than the predetermined distance, the low-strength connection portion 30d peels from the first heat-transfer member 10, as shown in FIG. 5. Note that FIG. 5 illustrates a state in which the low-strength connection portion 30d peels from the first heat-transfer member 10 and the first heat-transfer member 10 and the second heat-transfer member 20 come into contact when the first heat-transfer member 10 and the second heat-transfer member 20 approach each other by a distance equal to or greater than the predetermined distance. In other words, when the low-strength connection portion 30d begins to peel from the first heat-transfer member 10, the gap between the first heat-transfer member 10 and the second heat-transfer member 20 is not necessarily the same as when the first heat-transfer member 10 and the second heat-transfer member 20 are in contact (gap = 0). In the heat conduction member 100A of the present disclosure, the low-strength connection portion 30d is formed on the inner circumferential side of the first end portion 30p. Therefore, when the low-strength connection portion 30d is separated from the first heat transfer member 10, the volume of the sealed space S on the outer circumferential side of the first heat transfer member 10 and the second heat transfer member 20 increases. As a result, the pressure acting on the elastically deforming portion 30f of the film member 30A from the filler 40 in the sealed space S is reduced.

[0031] In electronic device 200, the gap between heat-generating component 210 and heat dissipation member 310 must be designed to accommodate the dimensional tolerances of the components. For example, if the flatness of heat dissipation member 310 is ±0.05 mm, the positioning accuracy of heat dissipation member 310 is ±0.1 mm, the thickness accuracy of heat-generating component 210 is ±0.2 mm, and the flatness accuracy of the board is ±0.2 mm, then the root mean square variation in the gap between heat-generating component 210 and heat dissipation member 310 is ±0.3 mm. Even with such a simple configuration, taking these variations into account, the thermal conductive member 100A, which is inserted in the gap between heat-generating component 210 and heat dissipation member 310, must have a thickness and deformability of at least 0.6 mm. Furthermore, when considering actually incorporating the thermal conductive member 100A into the electronic device 200, taking into account the complexity of the structure and the safety factor, the thermal conductive member 100A needs to have thickness deformability to accommodate gaps and variations of, for example, about 1.0±0.5 mm.

[0032] As shown in FIG. 2, when the heat transfer member 100A maintains the thickness of its initial uncompressed state, the internal pressure P0 of the sealed space S is expressed as follows, where Wp is the load of the first heat transfer member 10, Wm is the load of the filler 40, and Ap is the total area to which the load is applied: P0=W0 / Ap (where W0=Wp+Wm) This becomes: At this time, the force F0 due to the internal pressure P0 that attempts to peel off the low-strength connection portion 30d can be expressed as follows, where A0 is the area on which the elastically deforming portion 30f is subjected to pressure, b is the depth direction length of the membrane-like member 30A, and L0 is the length of the elastically deforming portion 30f. F0=P0×A0 (A0=L0×b)

[0033] As shown in Fig. 4, the internal pressure Pc (see Fig. 4) is calculated when the first heat transfer member 10 and the second heat transfer member 20 approach each other and the elastic deformation portion 30f is stretched. The internal pressure Pc is expressed as the internal pressure P0 and the differential pressure Pe generated by the tension caused by the stretch of the elastic deformation portion 30f. The differential pressure Pe can be expressed as the tension γ caused by the stretch of the elastic deformation portion 30f and the radius of curvature R of the expanded shape of the elastic deformation portion 30f. Pc=P0+Pe (where Pe=γ / R) At this time, the tension γ and the radius of curvature R change depending on the volume of the filler 40 extruded from between the first heat transfer member 10 and the second heat transfer member 20. Simply considering the cross-sectional area of ​​the extruded filler 40, the cross-sectional area D of the extruded filler 40 is calculated from the widthwise length a of the first heat transfer member 10 and the second heat transfer member 20 and the compression amount δ of the heat conduction member 100A from the initial state, as follows: D=a×δ / 2 This becomes:

[0034] If the elastically deforming portion 30f is approximated as a circular bulge in order to accommodate the extruded filler 40, the radius R can be substituted as follows: R=(D / π) 0.5 If the original length of the elastically deforming portion 30f is L0, the circumferential length of the elastically deforming portion 30f when it expands into a circular shape is Lc, the thickness and depth direction length of the membrane-like member 30A are t and b, respectively, and the stress caused by the expansion of the elastically deforming portion 30f is σ, the force F generated by the elastically deforming portion 30f can be substituted as follows: ε=(Lc-L0) / Lc (where Lc=2π×R) σ=ε×E (where E is the Young's modulus of the membrane member 30A), F=σ×A (A=t×b) If we substitute the generated force per unit length for tension γ, we get γ=F / b This becomes:

[0035] The force Fc that tries to separate the low-strength connection portion 30d can be calculated from the internal pressure Pc obtained when the first heat-transfer member 10 and the second heat-transfer member 20 approach each other to a predetermined distance. The area of ​​the elastically deformable portion 30f that receives the pressure is Ac, and the force Fc is calculated as follows: Fc=Pc×Ac (Ac=Lc×b) This becomes: In this case, the peel strength fa of the low-strength connecting portion 30d may be within the following range. F0 / b(=P0×L0) <fa≦Fc / b(=Pc×Lc)

[0036] That is, if the low-strength connection 30d does not peel off at the peel force F0 / b acting when the filler 40 is initially filled, it is possible to save the amount of filler 40 to fill the heat transfer gap between the heat-generating component 210 and the heat dissipation member 310. On the other hand, if the low-strength connection 30d peels off at the peel force Fc / b acting at the amount of compression where the compressive load acting on the heat conducting member 100A reaches its limit, the excessive pressure acting on the film-like member 30A is suppressed, and the effect of the excessive load on the heat-generating component 210 is suppressed.

[0037] 5, even when the first heat-transfer member 10 and the second heat-transfer member 20 are displaced to a position where they contact each other, the separation of the low-strength connection 30d progresses in response to an increase in the internal pressure Pc due to compression, thereby ensuring the capacity to accommodate the filler 40. Therefore, the internal pressure Pc after the low-strength connection 30d begins to separate becomes almost stable (Pz≈Pc). Therefore, the load on the heat-generating component 210 also becomes stable. However, if the first heat transfer member 10 and the second heat transfer member 20 are compressed beyond the position where they are in contact with each other, the load is directly applied to the heat-generating component 210. For this reason, it is preferable that the amount of compression acting on the heat conduction member 100A does not exceed the deformability of the heat conduction member 100A.

[0038] An example using specific numerical values ​​is shown below. First, consider the peel force (F0 / b) applied to the low-strength connection 30d in an uncompressed state. For example, the first heat transfer member 10 is a copper plate (specific gravity 8.9) with dimensions of 36 mm length x 36 mm width x 0.2 mm thickness, and the second heat transfer member 20 is a copper plate (specific gravity 8.9) with dimensions of 23 mm length x 23 mm width x 0.2 mm thickness. The separation distance between the first heat transfer member 10 and the second heat transfer member 20 is 0.8 mm. The filler 40 is a liquid metal (Ga / In, specific gravity 6.2). Then, the load Wp of the first heat transfer member 10 is 2.3 gf, the load Wm of the filler 40 is 5.2 gf, and the total area A to which the loads are applied is 1300 mm 2 , the area A0 subjected to pressure at the elastic deformation portion 30f = 216 mm 2As a result, W0=7.6 gf, and the internal pressure of the sealed space S in the initial state in which the heat conductive member 100A is not compressed is P0=5.7×10 (-5) MPa. Also, the force in the initial state is F0 = 0.0124 N. Then, the peel force per unit length (F0 / b) is 0.0002 N / mm 2 This becomes:

[0039] Next, the peel force (Fc / b) when the low-strength connecting portion 30d is designed to begin peeling when the compression amount δ=0.4 mm is considered. The area D (actually the volume, but for the sake of simplicity) of the filler 40 extruded by compression is 4.6 mm, since the width direction a = 23 mm and δ = 0.4 mm. 2 This is approximated as expanding into a circle, so that the radius of curvature of the elastically deforming portion 30f is R=1.2 mm, and the length of the elastically deforming portion 30f after compression is Lc=7.6 mm. The film member 30A is made of silicone rubber with a thickness t of 0.2 mm and a Young's modulus E of 0.7 MPa (hardness of about 20 degrees), and the length L0 of the elastically deforming portion 30f before compression is 3 mm. Then, the tension γ of 0.21 N / mm generated in the elastically deforming portion 30f, calculated from the strain ε generated in the elastically deforming portion 30f and the Young's modulus E, can be used as a substitute. Therefore, the values ​​of Pc and Fc at which the low-strength connection 30d begins to peel are Pc = 0.177 MPa and Fc = 48.6 N, and the peel force per unit length (Fc / b) is 1.35 N / mm 2 This becomes: That is, adhesive tape with a peel strength of 1.35 N / mm or less can be used for the low-strength connection 30d. Also, the peel strength before compression is sufficiently small at 0.0002 N / mm, so there is little need to consider it.

[0040] Next, a method for assembling the above-described heat conducting member 100A will be described. FIG. 6 is a diagram showing the flow of a method for assembling the heat conduction member 100A of the present disclosure. As shown in FIG. 6, the method for assembling the heat conduction member 100A of the present disclosure includes a step S11 of supplying the filler 40 and a step S12 of connecting the first end portion 30p to the first heat transfer member .

[0041] Fig. 7 is a cross-sectional view showing a state in which the second heat transfer member 20 is placed on a lower frame 401 to form the film member 30A in the method of assembling the heat conduction member 100A of the present disclosure. Fig. 8 is a cross-sectional view showing a state in which the upper frame 402 is placed on the lower frame 401 to form the film member 30A in the method of assembling the heat conduction member 100A of the present disclosure. In step S11 of supplying the filler 40 of the present disclosure, first, the second end 30q of the membrane member 30A is joined to the second heat transfer member 20. To do this, as shown in Fig. 7, the second heat transfer member 20 is placed on a lower mold frame 401 having a predetermined shape. Next, as shown in Fig. 8, an upper mold frame 402 having a predetermined shape is placed on the lower mold frame 401. A cavity 403 for forming the membrane member 30A is formed between the lower mold frame 401 and the upper mold frame 402.

[0042] FIG. 9 is a cross-sectional view showing a state in which the material of the film member 30A is filled between the lower mold frame 401 and the upper mold frame 402. 9, a predetermined material for forming the membrane member 30A is injected into the cavity 403 through an injection port 402h formed in the upper mold frame 402. As the injected material hardens, the second end 30q of the membrane member 30A is integrally joined to the second heat transfer member 20. After the injected material hardens, the membrane member 30A integrally molded with the second heat transfer member 20 is removed from the lower mold frame 401 and the upper mold frame 402.

[0043] Fig. 10 is a cross-sectional view showing a state in which a film member 30A integrally molded with a second heat transfer member 20 is set in a jig 501 in the method for assembling a heat conduction member 100A according to the present disclosure. Fig. 11 is a cross-sectional view showing a state in which a filler 40 is supplied into the film member 30A in the method for assembling a heat conduction member 100A according to the present disclosure. Next, as shown in Fig. 10, the film member 30A integrally molded with the second heat transfer member 20 is set in a jig 501. Subsequently, as shown in Fig. 11, an adhesive 37 is applied to the first end portion 30p of the film member 30A. Furthermore, an adhesive or pressure-sensitive adhesive 38 is applied to the inner periphery of the first end portion 30p. Thereafter, the filler 40 is supplied to the area surrounded by the second heat transfer member 20 and the film member 30A.

[0044] FIG. 12 is a cross-sectional view showing a state in which the first heat transfer member 10 and the second heat transfer member 20 are connected via a film member 30A in the method for assembling the heat conduction member 100A of the present disclosure. In step S12 of connecting the first end portion 30p to the first heat-transfer member 10, as shown in FIG. 12 , the first heat-transfer member 10 is placed over the first end portion 30p of the film-shaped member 30A and pressed from above. As a result, the first heat-transfer member 10 is bonded to the first end portion 30p of the film-shaped member 30A via the adhesive 37. In this manner, the first heat-transfer member 10 and the second heat-transfer member 20 are connected via the film-shaped member 30A, and an enclosed space S is formed within the film-shaped member 30A between the first heat-transfer member 10 and the second heat-transfer member 20. In addition, a portion between the first end portion 30p, the elastically deforming portion 30f, and the first end portion 30p is connected to the first heat-transfer member 10 with adhesive or pressure-sensitive adhesive 38 at a bonding strength lower than the bonding strength between the first end portion 30p and the first heat-transfer member 10. As a result, a low-strength connection portion 30d is formed between the first end portion 30p and the elastically deforming portion 30f. In this manner, the assembly of the heat conducting member 100A as shown in FIG. 2 is completed.

[0045] Heat conduction member 100A of this embodiment includes low-strength connection portion 30d between first end portion 30p and elastic deformation portion 30f. Therefore, when the first heat transfer member 10 and the second heat transfer member 20 come too close to each other, the low-strength connection portion 30d separates from the first heat transfer member 10 before the first end portion 30p joined to the first heat transfer member 10. This increases the volume of the sealed space S in the membrane member 30A, reducing the pressure acting on the elastically deforming portion 30f of the membrane member 30A from the filler 40 in the sealed space S. As a result, excessive pressure acting on the membrane member 30A is suppressed.

[0046] The low-strength connecting portion 30d of the heat conduction member 100A of this embodiment peels off from the first heat transfer member 10 when the first heat transfer member 10 and the second heat transfer member 20 approach each other to a predetermined distance. Therefore, when the first heat transfer member 10 and the second heat transfer member 20 are not approaching each other to the predetermined distance, the low-strength connecting portion 30d will not inadvertently peel off from the first heat transfer member 10. When the first heat transfer member 10 and the second heat transfer member 20 approach each other to the predetermined distance, the low-strength connecting portion 30d peels off from the first heat transfer member 10, thereby suppressing excessive pressure acting on the film member 30A.

[0047] The low-strength connection 30d of the heat conduction member 100A of this embodiment is formed by connecting the first heat transfer member 10 and the film member 30A with an adhesive or pressure-sensitive adhesive 38. This makes it possible to easily form the low-strength connection 30d. Furthermore, the adhesive or pressure-sensitive adhesive 38 makes it easy to control the connection strength of the low-strength connection 30d. By changing the type of adhesive or pressure-sensitive adhesive 38, the connection strength of the low-strength connection 30d can be easily changed.

[0048] In the heat conduction member 100A of the present embodiment, the first heat transfer member 10 and the second heat transfer member 20 are flat plate-shaped, which allows the first heat transfer member 10 and the second heat transfer member 20 to more stably support the heat dissipation member 310 and the heat-generating component 210 that are in contact with each other.

[0049] In the heat conduction member 100A of this embodiment, the first end portion 30p is joined to the outer periphery of the first heat transfer member 10, and the second end portion 30q is joined to the outer periphery of the second heat transfer member 20. Therefore, even if the gap between the first heat transfer member 10 and the second heat transfer member 20 is narrow, the volume of the sealed space S formed in the film member 30A can be made large, and the amount of filler 40 can be increased. Therefore, while the heat conduction member 100A can be made thinner, heat can be efficiently transferred between the first heat transfer member 10 and the second heat transfer member 20 via the filler 40.

[0050] In the heat conduction member 100A of this embodiment, the outer dimensions of the first heat transfer member 10 are larger than the outer dimensions of the second heat transfer member 20. Therefore, the film member 30A can be shaped so that the outer dimensions gradually decrease from the first end 30p to the second end 30q, and the rigidity of the film member 30A itself makes it easy to ensure shape retention.

[0051] In the heat conduction member 100A of this embodiment, the filler 40 contains at least one of gallium (Ga) and indium (In). This liquid metal has high thermal conductivity and is in a liquid state at room temperature. Therefore, when the distance between the first heat transfer member 10 and the second heat transfer member 20 changes due to a load or the like acting on the heat conduction member 100A, the filler 40 easily moves within the sealed space S accordingly.

[0052] The heat dissipation unit 300 of this embodiment includes a heat conduction member 100A. Therefore, it is possible to provide a heat dissipation unit 300 including a heat conduction member 100A that can suppress excessive pressure acting on the film member 30A.

[0053] The electronic device 200 of this embodiment includes a heat conducting member 100A. Therefore, it is possible to provide an electronic device 200 including a heat conducting member 100A that can suppress excessive pressure acting on the film member 30A.

[0054] The method for assembling the heat conduction member 100A of this embodiment can assemble and provide the heat conduction member 100A in which excessive pressure acting on the film member 30A is suppressed.

[0055] (Modification of the first embodiment) FIG. 13 is a diagram showing the flow of a method for assembling a heat conduction member 100A according to the present disclosure. As shown in FIG. 13, the method for assembling heat conduction member 100A of the present disclosure includes step S21 of forming sealed space S and step S22 of filling filler 40 into sealed space S.

[0056] FIG. 14 is a cross-sectional view showing a state in which a sealed space S is formed in the method of assembling a heat conduction member 100A of the present disclosure. 14, in step S21 of forming the sealed space S, the first heat-transfer member 10 and the second heat-transfer member 20 are connected via a film-shaped member 30A. As a result, a sealed space S is formed in the film-shaped member 30A between the first heat-transfer member 10 and the second heat-transfer member 20. At this time, the portion between the elastically deforming portion 30f and the first end portion 30p is connected to the first heat-transfer member 10 with an adhesive or pressure-sensitive adhesive 38 having a bonding strength lower than the bonding strength between the first end portion 30p and the first heat-transfer member 10. As a result, a low-strength connection portion 30d is formed between the elastically deforming portion 30f and the first end portion 30p.

[0057] FIG. 15 is a cross-sectional view showing a state in which the sealed space S is evacuated to a vacuum in the method of assembling the heat conduction member 100A of the present disclosure. As shown in FIG. 15 , in step S22 of filling the sealed space S with the filler 40 according to the present disclosure, first, the sealed space S is evacuated. To do this, the sealed space S is suctioned through nozzles formed in advance on the first heat transfer member 10 or the film-like member 30A. This brings the first heat transfer member 10 and the second heat transfer member 20 into close contact. Furthermore, the film-like member 30A comes into close contact with the first heat transfer member 10 and the second heat transfer member 20. Thereafter, the filler 40 is filled into the sealed space S through injection ports (not shown) formed in advance on the first heat transfer member 10 or the film-like member 30A. After filling with the filler 40, the injection ports are sealed. In this manner, the assembly of the heat conduction member 100A as shown in FIG. 2 is completed.

[0058] The method for assembling the heat conduction member 100A of the present disclosure can assemble and provide the heat conduction member 100A in which excessive pressure acting on the film member 30A is suppressed.

[0059] (Another modification of one embodiment) In the above embodiment, the center of the first heat transfer member 10 and the center of the second heat transfer member 20 are arranged coaxially, but the present invention is not limited to this. FIG. 16 is a cross-sectional view showing a heat conduction member of the present disclosure. 16 , in a heat conduction member 100B according to a modified example of the present disclosure, an outer dimension D3 of a first heat transfer member 10B is larger than an outer dimension D2 of a second heat transfer member 20. The first heat transfer member 10B may be provided offset with respect to the second heat transfer member 20 in a direction intersecting with the direction in which the first heat transfer member 10B and the second heat transfer member 20 are separated from each other. In other words, a central portion 10c of the first heat transfer member 10B may be offset with respect to a central portion 20c of the second heat transfer member 20 in a direction intersecting with the direction in which the first heat transfer member 10B and the second heat transfer member 20 are separated from each other.

[0060] The film member 30C extends obliquely from a first end portion 30p to a second end portion 30q with respect to the second heat transfer member 20 on one side of a direction intersecting with the direction in which the first heat transfer member 10 and the second heat transfer member 20 are separated from each other. The film member 30C has a cylindrical wall portion 30w with respect to the second heat transfer member 20 on the other side of a direction intersecting with the direction in which the first heat transfer member 10 and the second heat transfer member 20 are separated from each other.

[0061] A first end 30p of the film-shaped member 30B is joined to the outer periphery of the first heat-transfer member 10. A second end 30q of the film-shaped member 30B is joined to the outer periphery of the second heat-transfer member 20. The heat-conducting member 100B of the present disclosure has a low-strength connection portion 30d between the first end 30p and the elastic deformation portion 30f.

[0062] FIG. 17 is a cross-sectional view showing a heat conduction member 100C of the present disclosure. As shown in FIG. 17, a heat conduction member 100C of the present disclosure includes a first heat transfer member 10, a second heat transfer member 20, a film member 30C, and a filler 40.

[0063] The film member 30C is formed from a film-like material having flexibility and elasticity. The film member 30C of the present disclosure includes a first film material 31 and a second film material 32. One end of the first film material 31 is bonded to the outer periphery of the first heat transfer member 10 with an adhesive 37 as a first end portion 30p of the film member 30C. One end of the second film material 32 is bonded to the outer periphery of the second heat transfer member 20 as a second end portion 30q of the film member 30C. One end of the inner periphery of the second film material 32 of the present disclosure is bonded to the other surface 20f of the second heat transfer member 20. The other end of the outer periphery of the first film material 31 and the other end of the outer periphery of the second film material 32 are bonded to each other with, for example, an adhesive 37 at a position protruding outward from the first heat transfer member 10 and the second heat transfer member 20. In this way, the film member 30C is configured to be elastically deformable in the direction in which the first heat transfer member 10 and the second heat transfer member 20 move toward and away from each other.

[0064] The sealed space S within the membrane member 30C is filled with a filler 40. In addition, in such a configuration, a low-strength connection portion 30d made of adhesive or pressure-sensitive adhesive 38 may be provided between the portion where the other end of the outer periphery of the first membrane material 31 and the other end of the outer periphery of the second membrane material 32 are joined by adhesive 37, and the elastic deformation portion 30f of the first membrane material 31 and the elastic deformation portion 30f of the second membrane material 32.

[0065] Second Embodiment Hereinafter, an embodiment according to the present disclosure will be described with reference to the drawings. As shown in FIG. 18, a heat conduction member 100D of the present disclosure includes a first heat transfer member 10, a second heat transfer member 20, a film member 30D, and a filler 40. The second heat transfer member 20 is provided spaced apart from the first heat transfer member 10 .

[0066] The film-like member 30D is formed from a film-like material having flexibility and elasticity. The film-like member 30D forms an enclosed space S between the first heat-transfer member 10 and the second heat-transfer member 20. The film-like member 30D has a first end portion 30p, a second end portion 30q, an elastically deforming portion 30f, and a low-strength connecting portion 30d. The first end portion 30p is joined to the first heat-transfer member 10. The second end portion 30q is joined to the second heat-transfer member 20. The elastically deforming portion 30f is formed between the first end portion 30p and the second end portion 30q and is elastically deformable. The low-strength connecting portion 30d is provided between the first end portion 30p and the elastically deforming portion 30f. The low-strength connecting portion 30d is connected to the first heat-transfer member 10 with a bonding strength lower than the bonding strength between the first end portion 30p and the first heat-transfer member 10. The filler 40 is filled into the sealed space S within the membrane member 30D.

[0067] A heat conduction member 100D of this embodiment includes a low-strength connection portion 30d between the first end portion 30p and the elastic deformation portion 30f. Therefore, excessive pressure acting on the membrane member 30D is suppressed.

[0068] Third Embodiment Hereinafter, an embodiment according to the present disclosure will be described with reference to the drawings. As shown in FIG. 19, a heat dissipation unit 300E of the present disclosure includes a heat conduction member 100E and a heat dissipation member 310. The heat conduction member 100E includes a first heat transfer member 10, a second heat transfer member 20, a film-shaped member 30E, and a filler . The second heat transfer member 20 is provided spaced apart from the first heat transfer member 10 .

[0069] The film-shaped member 30E is formed from a film-shaped material that is flexible and elastic. The film-shaped member 30E forms an enclosed space S between the first heat-transfer member 10 and the second heat-transfer member 20. The film-shaped member 30E has a first end portion 30p, a second end portion 30q, an elastically deforming portion 30f, and a low-strength connecting portion 30d. The first end portion 30p is joined to the first heat-transfer member 10. The second end portion 30q is joined to the second heat-transfer member 20. The elastically deforming portion 30f is formed between the first end portion 30p and the second end portion 30q and is elastically deformable. The low-strength connecting portion 30d is provided between the first end portion 30p and the elastically deforming portion 30f. The low-strength connecting portion 30d is connected to the first heat-transfer member 10 with a bonding strength lower than the bonding strength between the first end portion 30p and the first heat-transfer member 10. The filler 40 fills the sealed space S within the membrane member 30E.

[0070] The heat dissipation member 310 is provided so as to be in contact with one of the first heat transfer member 10 and the second heat transfer member 20. The heat dissipation member 310 of the present disclosure is provided so as to be in contact with the first heat transfer member 10. The heat dissipation member 310 dissipates heat transferred from the heat-generating component 210 via the heat conduction member 100E to the outside. The heat-generating component 210 is provided so as to be in contact with the other of the first heat transfer member 10 and the second heat transfer member 20. The heat-generating component 210 of the present disclosure is provided so as to be in contact with the second heat transfer member 20. The heat-generating component 210 has heat-generating properties.

[0071] A heat conduction member 100E of a heat dissipation unit 300E of this embodiment includes a low-strength connection portion 30d between a first end portion 30p and an elastic deformation portion 30f. Therefore, excessive pressure acting on the membrane member 30E is suppressed.

[0072] <Fourth embodiment> Hereinafter, an embodiment according to the present disclosure will be described with reference to the drawings. As shown in FIG. 20, an electronic device 200F of the present disclosure includes a heat dissipation unit 300F and a substrate 220. The heat dissipation unit 300F includes a heat conduction member 100F and a heat dissipation member 310. The heat conduction member 100F includes a first heat transfer member 10, a second heat transfer member 20, a film-like member 30F, and a filler . The second heat transfer member 20 is provided spaced apart from the first heat transfer member 10 .

[0073] The film-shaped member 30F is formed from a film-shaped material that is flexible and elastic. The film-shaped member 30F forms an enclosed space S between the first heat-transfer member 10 and the second heat-transfer member 20. The film-shaped member 30F has a first end portion 30p, a second end portion 30q, an elastically deforming portion 30f, and a low-strength connecting portion 30d. The first end portion 30p is joined to the first heat-transfer member 10. The second end portion 30q is joined to the second heat-transfer member 20. The elastically deforming portion 30f is formed between the first end portion 30p and the second end portion 30q and is elastically deformable. The low-strength connecting portion 30d is provided between the first end portion 30p and the elastically deforming portion 30f. The low-strength connecting portion 30d is connected to the first heat-transfer member 10 with a bonding strength lower than the bonding strength between the first end portion 30p and the first heat-transfer member 10. The filler 40 fills the sealed space S within the membrane member 30F.

[0074] The heat dissipation member 310 is provided so as to be in contact with one of the first heat transfer member 10 and the second heat transfer member 20. The heat dissipation member 310 of the present disclosure is provided so as to be in contact with the first heat transfer member 10. The heat dissipation member 310 dissipates heat transferred from the heat-generating component 210 via the heat conduction member 100F to the outside. The heat-generating component 210 is provided so as to be in contact with the other of the first heat transfer member 10 and the second heat transfer member 20. The heat-generating component 210 of the present disclosure is provided so as to be in contact with the second heat transfer member 20. The heat-generating component 210 has heat-generating properties. The substrate 220 is provided with a heat generating component 210 .

[0075] A heat conduction member 100F of an electronic device 200F of this embodiment includes a low-strength connection portion 30d between a first end portion 30p and an elastic deformation portion 30f. Therefore, excessive pressure acting on the membrane member 30F is suppressed.

[0076] Fifth Embodiment Hereinafter, an embodiment according to the present disclosure will be described with reference to the drawings. As shown in FIG. 21, the method for assembling a heat transfer member of the present disclosure includes a step S31 of supplying a filler material and a step S32 of connecting the first end to another heat transfer member.

[0077] In the step S31 of supplying the filler, the second end of the film-like member, which is made of a flexible and elastic film-like material and has a cylindrical shape extending from a first end to a second end, is joined to one heat transfer member, and the filler is supplied to the area surrounded by the one heat transfer member and the film-like member.

[0078] In step S32 of connecting the first end to another heat transfer member, the first end is joined to the other heat transfer member, and a portion between the first end and an elastically deformable portion formed between the first end and the second end and capable of elastic deformation is connected to the other heat transfer member with a bonding strength lower than the bonding strength between the first end and the other heat transfer member.

[0079] The method for assembling a heat conduction member according to this embodiment can assemble and provide a heat conduction member that suppresses excessive pressure acting on the film member.

[0080] Sixth Embodiment Hereinafter, an embodiment according to the present disclosure will be described with reference to the drawings. As shown in FIG. 22, the method for assembling a heat conduction member according to the present disclosure includes a step S41 of forming an enclosed space and a step S42 of filling the enclosed space with a filler material.

[0081] In step S41 of forming the sealed space, a first end of a film-like member made of a flexible film-like material is joined to a first heat transfer member. A second end of the film-like member is joined to a second heat transfer member spaced apart from the first heat transfer member. This forms a sealed space within the film-like member between the first and second heat transfer members.

[0082] In step S42 of filling the sealed space with filler, the portion between the first end and the second end and the elastically deformable elastic portion that is formed between the first end and the second end and is elastically deformable is connected to the first heat transfer member with a bonding strength that is lower than the bonding strength between the first end and the first heat transfer member.

[0083] The method for assembling a heat conduction member according to this embodiment can assemble and provide a heat conduction member that suppresses excessive pressure acting on the film member.

[0084] Although the present disclosure has been described above with reference to the embodiments, the present disclosure is not limited to the above-described embodiments. Various modifications that can be understood by those skilled in the art can be made to the configuration and details of the present disclosure within the scope of the present disclosure. Furthermore, each embodiment can be combined with other embodiments as appropriate. For example, in the above embodiment, a heat dissipation member is connected to the first heat transfer member and a heat-generating component is connected to the second heat transfer member, but it is also possible to connect a heat-generating component to the first heat transfer member and a heat dissipation member to the second heat transfer member.

[0085] Some or all of the above-described embodiments can be described as, but are not limited to, the following supplementary notes.

[0086] (Appendix 1) a first heat transfer member; a second heat transfer member provided at a distance from the first heat transfer member; a film-like member formed from a flexible and elastic film-like material, and forming an enclosed space between the first heat transfer member and the second heat transfer member; a filler material filled in the sealed space within the membrane member, The film-like member is a first end portion joined to the first heat transfer member; a second end portion joined to the second heat transfer member; an elastically deformable portion formed between the first end portion and the second end portion and capable of elastic deformation; a low-strength connection portion provided between the first end portion and the elastic deformation portion and connected to the first heat transfer member with a bonding strength lower than a bonding strength between the first end portion and the first heat transfer member; Heat conducting material.

[0087] (Appendix 2) The low-strength connection portion is configured to separate from the first heat transfer member when the first heat transfer member and the second heat transfer member approach each other to a predetermined distance. 2. The thermally conductive member of claim 1.

[0088] (Appendix 3) The low-strength connection portion is formed by connecting the first heat transfer member and the film-like member with an adhesive or a pressure-sensitive adhesive. 3. The thermal conductive member according to claim 1 or 2.

[0089] (Appendix 4) At least one of the first heat transfer member and the second heat transfer member has a flat plate shape extending along a plane intersecting a direction in which the first heat transfer member and the second heat transfer member are spaced apart from each other. 4. A thermally conductive member according to any one of claims 1 to 3.

[0090] (Appendix 5) the first end is joined to an outer periphery of the first heat transfer member; The second end is joined to the outer periphery of the second heat transfer member. 5. A thermally conductive member according to any one of claims 1 to 4.

[0091] (Appendix 6) The outer dimensions of the first heat transfer member are larger than the outer dimensions of the second heat transfer member. 6. A thermally conductive member according to any one of claims 1 to 5.

[0092] (Appendix 7) The filler contains at least one of gallium (Ga) and indium (In). 7. A thermally conductive member according to any one of claims 1 to 6.

[0093] (Appendix 8) A thermally conductive member according to any one of appendices 1 to 7; a heat dissipation member that is provided in contact with one of the first heat transfer member and the second heat transfer member, and that dissipates heat transferred via the heat conduction member from a heat-generating component that has heat generating properties and is provided in contact with the other of the first heat transfer member and the second heat transfer member, to the outside. Heat dissipation unit.

[0094] (Appendix 9) a heat dissipation unit according to appendix 8; and a substrate on which the heat-generating component is provided; electronic equipment.

[0095] (Appendix 10) a step of joining a second end of a film-like member formed of a flexible and elastic film-like material and having a cylindrical shape from a first end to a second end to a first heat transfer member, and supplying a filler material to a portion surrounded by the first heat transfer member and the film-like member; and joining the first end portion and another heat transfer member, and connecting a portion between the first end portion and an elastically deformable portion formed between the first end portion and the second end portion and capable of elastically deforming to the other heat transfer member with a bonding strength lower than a bonding strength between the first end portion and the other heat transfer member. A method for assembling a thermally conductive member.

[0096] (Appendix 11) a step of joining a first end of a film-like member formed from a flexible film-like material to a first heat transfer member and joining a second end of the film-like member to a second heat transfer member provided apart from the first heat transfer member, thereby forming an enclosed space within the film-like member between the first heat transfer member and the second heat transfer member; and filling the sealed space with a filler, In the step of forming the sealed space, a portion between the first end and the second end and an elastically deformable portion that is formed between the first end and the second end and is elastically deformable is connected to the first heat transfer member with a bonding strength that is lower than the bonding strength between the first end and the first heat transfer member. A method for assembling a thermally conductive member.

[0097] (Appendix 12) In the step of filling the sealed space with the filler, the sealed space is evacuated and then the filler is filled into the sealed space. 12. A method for assembling the thermal conduction member according to claim 11.

[0098] Furthermore, some or all of the configurations described in Supplementary Notes 2 to 7, which are dependent on Supplementary Note 1, may also be dependent on Supplementary Notes 10 and 11 in the same dependent relationship as Supplementary Notes 2 to 7. Furthermore, not limited to Supplementary Notes 1, 10, and 11, some or all of the configurations described as Supplements may also be dependent on various heat conduction members or methods of assembling heat conduction members, as long as they do not deviate from the respective embodiments described above. [Explanation of symbols]

[0099] 10, 10B First heat transfer member (one heat transfer member) 20 Second heat transfer member (other heat transfer member) 30A~30F Membrane material 30d Low Strength Joint 30f Elastic deformation part 30p first end 30q second end 38 Adhesives or adhesives 40 Filler 100A~100F Thermal Conductive Material 200, 200F electronic equipment 210 Heat-generating parts 220 board 300, 300E, 300F heat dissipation unit 310 Heat dissipation material S closed space

Claims

1. a first heat transfer member; a second heat transfer member provided at a distance from the first heat transfer member; a film-like member formed from a flexible and elastic film-like material, and forming an enclosed space between the first heat transfer member and the second heat transfer member; a filler material filled in the sealed space within the membrane member, The film-like member is a first end portion joined to the first heat transfer member; a second end portion joined to the second heat transfer member; an elastically deformable portion formed between the first end portion and the second end portion and capable of elastic deformation; a low-strength connection portion provided between the first end portion and the elastic deformation portion and connected to the first heat transfer member with a bonding strength lower than a bonding strength between the first end portion and the first heat transfer member; Heat conducting material.

2. The low-strength connection portion is configured to separate from the first heat transfer member when the first heat transfer member and the second heat transfer member approach each other to a predetermined distance. The heat transfer member according to claim 1 .

3. The low-strength connection portion is formed by connecting the first heat transfer member and the film-like member with an adhesive or a pressure-sensitive adhesive. The heat conducting member according to claim 1 or 2.

4. At least one of the first heat transfer member and the second heat transfer member has a flat plate shape extending along a plane intersecting a direction in which the first heat transfer member and the second heat transfer member are spaced apart from each other. The heat conducting member according to claim 1 or 2.

5. the first end is joined to an outer periphery of the first heat transfer member; The second end is joined to the outer periphery of the second heat transfer member. The heat conducting member according to claim 1 or 2.

6. The outer dimensions of the first heat transfer member are larger than the outer dimensions of the second heat transfer member. The heat conducting member according to claim 1 or 2.

7. The heat conduction member according to claim 1 or 2; a heat dissipation member that is provided in contact with one of the first heat transfer member and the second heat transfer member, and that dissipates heat transferred via the heat conduction member from a heat-generating component that has heat generating properties and is provided in contact with the other of the first heat transfer member and the second heat transfer member, to the outside. Heat dissipation unit.

8. The heat dissipation unit according to claim 7; a substrate on which the heat-generating component is provided; electronic equipment.

9. a step of joining a second end of a film-like member formed of a flexible and elastic film-like material and having a cylindrical shape from a first end to a second end to a first heat transfer member, and supplying a filler material to a portion surrounded by the first heat transfer member and the film-like member; and joining the first end portion and another heat transfer member, and connecting a portion between the first end portion and an elastically deformable portion formed between the first end portion and the second end portion and capable of elastically deforming to the other heat transfer member with a bonding strength lower than a bonding strength between the first end portion and the other heat transfer member. A method for assembling a thermally conductive member.

10. a step of joining a first end of a film-like member formed from a flexible film-like material to a first heat transfer member and joining a second end of the film-like member to a second heat transfer member provided apart from the first heat transfer member, thereby forming an enclosed space within the film-like member between the first heat transfer member and the second heat transfer member; and filling the sealed space with a filler, In the step of forming the sealed space, a portion between the first end and the second end and an elastically deformable portion that is formed between the first end and the second end and is elastically deformable is connected to the first heat transfer member with a bonding strength that is lower than the bonding strength between the first end and the first heat transfer member. A method for assembling a thermally conductive member.

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