Polyalkylene oxide structure-containing organosiloxane, adhesion inhibitor, cured product, and article

Abstract

To provide a polyalkylene oxide structure-containing organosiloxane, an adhesion inhibitor, a cured product, and an article.SOLUTION: An adhesion inhibitor comprises a polyalkylene oxide structure-containing organosiloxane, the polyalkylene oxide structure-containing organosiloxane including one structure A and 10-100 diorganosiloxy units. [Structure A] (Rα1 represents a C1-3 alkyl group or a hydrogen atom. Rα2 represents a C2-3 alkylene group. Rα3 represents a C2-6 alkylene group. Rα4 and Rα5 each independently represent an alkyl group or an aryl group. a is 3-25. When the number of structure B is defined as b, the ratio b / a is less than 4.1).SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present disclosure relates to polyalkylene oxide structure-containing organosiloxanes, adhesion suppressants, cured products, and articles. [Background technology]

[0002] Silicone is used in a variety of fields due to its flexibility and transparency (Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2006-181407 Summary of the Invention [Problem to be solved by the invention]

[0004] One of the problems to be solved by the present invention is to provide an anti-tack agent having a good anti-tack effect.

[0005] One of the problems to be solved by the present invention is to provide an organosiloxane containing a polyalkylene oxide structure that can be used to produce an anti-tack agent having a good anti-tack effect. [Means for solving the problem]

[0006] The present disclosure provides the following: (Item 1) An adhesion inhibitor, The adhesion suppressant contains a polyalkylene oxide structure-containing organosiloxane, The polyalkylene oxide structure-containing organosiloxane contains one structure A and 10 to 100 structures B, which is an adhesion inhibitor. <Structure A> [ka] <Structure B> [ka] (R α1 represents a C1-3 alkyl group or a hydrogen atom. α2 represents a C2-3 alkylene group. α3 represents a C2-6 alkylene group. α4 , R α5 , R α6 , R α7 each independently represents an alkyl group or an aryl group. a is 3 to 25. When the number of structures B is b, b / a is less than 4.1. (Item 2) A cured product of the adhesion suppressant described in the above item. (Item 3) The cured product according to the above item has a hardness of 50 or less on a durometer A hardness scale and a transparency of 80% or more in total light transmittance. (Item 4) An article comprising the cured product according to any one of the preceding items. (Item 5) A polyalkylene oxide structure-containing organosiloxane containing one structure A and 10 to 100 structures B. <Structure A> [ka] <Structure B> [ka] (R α1 represents a C1-3 alkyl group or a hydrogen atom. α2 represents a C2-3 alkylene group. α3 represents a C2-6 alkylene group. α4 , R α5 , R α6 , R α7 each independently represents an alkyl group or an aryl group. a is 3 to 25. When the number of structures B is b, b / a is less than 4.1.

[0007] In the present disclosure, one or more of the above-described features may be provided in further combinations in addition to the combinations explicitly stated. [Effects of the Invention]

[0008] The tack suppressant of the present invention exhibits a good tack suppressing effect. The polyalkylene oxide structure-containing organosiloxane of the present invention exhibits good tack suppressing properties. DETAILED DESCRIPTION OF THE INVENTION

[0009] Throughout this disclosure, the range of the values ​​of the physical properties, contents, etc. may be set as appropriate (for example, by selecting from the values ​​described in each item below). Specifically, when the value α includes A3, A2, A1 (where A3>A2>A1), the range of the value α may include A3 or less, A2 or less, less than A3, less than A2, A1 or more, A2 or more, greater than A1, greater than A2, A1 to A2 (A1 or more and less than A2), A1 to A3, A2 to A3, A1 or more and less than A3, A1 or more and less than A2, A2 or more and less than A3, greater than A1 and less than A3, greater than A1 and less than A2, greater than A2 and less than A3, greater than A1 ... and the like.

[0010] As long as the problem to be solved by the present invention is solved, there are no particular limitations on the components, conditions, values, etc.

[0011] "αβ amount (A / B)" means the β amount (α) of A relative to 100% by mass of B. α can be expressed, for example, in mass %, mol %, or parts by mass. β amount can be expressed, for example, in content or amount used. "% by mass content (A / B)" means the content (% by mass) of A relative to 100% by mass of B.

[0012] The term "γ ratio (A / B)" refers to the γ ratio calculated by the formula "A÷B." Examples of the γ ratio include a mass ratio and a molar ratio.

[0013] "Non-volatile content" refers to the total mass of components other than organic solvents and water. In one embodiment, "non-volatile content of A" refers to the total mass of components remaining when 1 g of A is heated at 105°C and reaches a constant weight.

[0014] "C···" means "having carbon number···." For example, a "C1-6 alkyl group" means an alkyl group having 1 to 6 carbon atoms. A "C6 alkyl group" means an alkyl group having 6 carbon atoms.

[0015] Examples of the number of carbon atoms (organic group) include 30, 29, 28, 27, 26, 25, 24, 23, 22, 21, 20, 19, 18, 17, 16, 15, 14, 13, 12, 11, 10, 9, 8, 7, 6, 5, 4, 3, 2, and 1.

[0016] "Organic group" means a group consisting solely of carbon atoms and one or more atoms selected from the group consisting of hydrogen atoms, oxygen atoms, nitrogen atoms and halogen atoms.

[0017] Examples of the alkyl group include a linear alkyl group, a branched alkyl group, and a cycloalkyl group.

[0018] Examples of the straight-chain alkyl group include a methyl group, an ethyl group, an n-propyl group, an n-butyl group, an n-pentyl group, an n-hexyl group, an n-heptyl group, an n-octyl group, an n-nonyl group, and an n-decyl group.

[0019] Examples of branched alkyl groups include an iso-propyl group, a sec-butyl group, an iso-butyl group, a tert-butyl group, a 2-ethylhexyl group, a diethylpentyl group, a trimethylbutyl group, a trimethylpentyl group, and a trimethylhexyl group.

[0020] Examples of the cycloalkyl group include a monocyclic cycloalkyl group, a bridged ring cycloalkyl group, a fused ring cycloalkyl group, etc. A cycloalkyl group in which at least one hydrogen atom of the cycloalkyl group is substituted with an alkyl group is also considered to be a cycloalkyl group.

[0021] "Monocyclic ring" means a ring structure formed by covalent carbon bonds and having no internal bridges. "Fused ring" means a ring structure in which two or more monocyclic rings share two atoms (i.e., each ring shares only one edge (fused) with another). "Bridged ring" means a ring structure in which two or more monocyclic rings share three or more atoms.

[0022] Examples of the monocyclic cycloalkyl group include a cyclopentyl group, a cyclohexyl group, a cycloheptyl group, a cyclodecyl group, and a 3,5,5-trimethylcyclohexyl group.

[0023] Examples of the bridged ring cycloalkyl group include a tricyclodecyl group, an adamantyl group, and a norbornyl group.

[0024] The alkyl group also includes a group formed by combining a linear alkyl group, a branched alkyl group, and a cycloalkyl group, and examples of such a combined group include a cycloalkylalkyl group.

[0025] Examples of the alkenyl group include a straight-chain alkenyl group, a branched alkenyl group, and a cycloalkenyl group.

[0026] Examples of the straight-chain alkenyl group include a vinyl group, an allyl group, an n-butenyl group, an n-pentenyl group, an n-hexenyl group, an n-heptenyl group, an n-octenyl group, an n-nonenyl group, and an n-decamethenyl group.

[0027] Examples of the branched alkenyl group include a 1-methylvinyl group and a 1-methylallyl group.

[0028] Examples of the cycloalkenyl group include a monocyclic cycloalkenyl group, a bridged ring cycloalkenyl group, a fused ring cycloalkenyl group, etc. In addition, one or more hydrogen atoms of the cycloalkenyl group may be substituted with an alkyl group.

[0029] Examples of the monocyclic cycloalkenyl group include a cyclopentenyl group, a cyclohexenyl group, and a cycloheptenyl group.

[0030] Examples of the bridged ring cycloalkenyl group include a norbornenyl group.

[0031] Examples of the fused ring cycloalkenyl group include a bicyclodecenyl group.

[0032] Examples of the aryl group include a monocyclic aryl group, a fused ring aryl group, etc. In the aryl group, one or more hydrogen atoms may be substituted with an alkyl group.

[0033] Examples of the monocyclic aryl group include a phenyl group, a tolyl group, and a mesityl group.

[0034] The fused ring aryl group may, for example, be a naphthyl group.

[0035] Examples of the arylalkyl group include a benzyl group.

[0036] "Siloxane" means a compound having a Si-O-Si bond.

[0037] "Organopolysiloxane" means a siloxane having R-Si-O- (R: organic group).

[0038] "All ends with A" means that all ends are modified with A (trialkylsilyl group, etc.).

[0039] "A partial terminal" means that a part of the terminal is modified with A (such as a trialkylsilyl group).

[0040] [Polyalkylene oxide structure-containing organosiloxane] The present disclosure relates to a polyalkylene oxide structure-containing organosiloxane containing one structure A and 10 to 100 structures B. <Structure A> [ka] <Structure B> [ka] (R α1 represents a C1-3 alkyl group or a hydrogen atom. α2 represents a C2-3 alkylene group. α3 represents a C2-6 alkylene group. α4 , R α5 , R α6 , R α7 each independently represents an alkyl group or an aryl group. a is 3 to 25. When the number of structures B is b, b / a is less than 4.1.

[0041] In one embodiment, R α1 is preferably a methyl group or a hydrogen atom.

[0042] In one embodiment, R α2 is preferably an ethylene group or an n-propylene group.

[0043] In one embodiment, R α3 is preferably a C3 alkylene group, more preferably an n-propylene group.

[0044] In one embodiment, R α4 , R α5 , R α6 , R α7 are preferably each independently a methyl group or a phenyl group.

[0045] Examples of a include 25, 24.5, 24, 23.5, 23, 22.5, 22, 21.5, 21, 20.5, 20, 19.5, 19, 17.5, 17, 16.5, 15, 14.5, 14, 13.5, 12, 11.5, 11, 10.5, 10, 9.5, 9, 8.5, 7, 6.6, 6.5, 6, 5.5, 5, 4.5, 4, 3.5, and 3. In one embodiment, a is preferably 3 to 25. Examples of preferable reasons include improved hydrophilicity.

[0046] Examples of b include 100, 97.5, 95, 92.5, 90, 87.5, 85, 82.5, 80, 77.5, 75, 72.5, 70, 67.5, 65, 62.5, 60, 57.5, 55, 52.5, 50, 47.5, 45, 42.5, 40, 37.5, 35, 32.5, 30, 27.5, 25, 22.5, 21, 20.5, 20.3, 20, 17.5, 16, 15.9, 15.5, 15, 14.5, 14, 12.5, 10, and 9. In one embodiment, b is preferably 9 to 100.

[0047] Examples of b / a include less than 4.1, 4, 3.9, 3.7, 3.5, 3.3, 3.1, and 3. In one embodiment, b / a is preferably less than 4.1, and more preferably 3 or more and less than 4.1. The reason for this preference is, for example, achieving both water resistance and hydrophilicity.

[0048] a and b are average numbers. Specifically, a and b can be calculated based on the molecular weight of the silicone and the atomic weight of each repeating unit.

[0049] In one embodiment, the polyalkylene oxide structure-containing organosiloxane is represented by the following formula: [ka] (R α1 represents a C1-3 alkyl group or a hydrogen atom. R α2 represents a C2-3 alkylene group. Rα3 represents a C2-6 alkylene group. R α4 , R α5 , R α6 , R α7 each independently represents an alkyl group or an aryl group. R α8 , R α9 , R α10 each independently represents an alkyl group or an arylalkyl group. a represents 3 to 25. b represents 9 to 100. b / a is less than 4.1.

[0050] In one embodiment, R α8 , R α9 , R α10 are preferably each independently a C1-10 alkyl group or a phenylalkyl group, more preferably an octyl group or a phenylethyl group.

[0051] <Physical Properties (Polyalkylene Oxide Structure-Containing Organosiloxane)> Examples of the weight average molecular weight (of the polyalkylene oxide structure-containing organosiloxane) include 30,000, 29,000, 27,000, 25,000, 23,000, 21,000, 20,000, 19,000, 17,000, 15,000, 13,000, 11,000, 10,000, 9,000, 7,000, 5,000, 3,000, 2,000, and 1,200. In one embodiment, the weight average molecular weight is preferably 1,200 to 30,000.

[0052] Examples of the number average molecular weight (of the polyalkylene oxide structure-containing organosiloxane) include 20,200, 20,000, 19,000, 17,000, 15,000, 13,000, 11,000, 10,000, 9,000, 7,000, 5,000, 3,000, 2,000, 1,000, and 990. In one embodiment, the number average molecular weight is preferably 990 to 20,200.

[0053] The weight average molecular weight and number average molecular weight can be measured under the following conditions. GPC device: HLC-8420GPC (Tosoh Corporation) Column: Two TSKgel GMHhr-H columns connected together Eluent: chloroform Flow rate: 1.0mL / min Calibration curve: Polystyrene Measured concentration: 2mg / mL Column temperature: 40℃

[0054] Examples of the average degree of polymerization (of the polyalkylene oxide structure-containing organosiloxane) include 101, 100, 95, 90, 85, 80, 75, 70, 65, 60, 55, 50, 45, 40, 35, 30, 25, 20, 15, and 11. In one embodiment, the average degree of polymerization is preferably 11 to 101.

[0055] Examples of viscosity (of polyalkylene oxide structure-containing organosiloxane) include 5000 mPa·s, 4750 mPa·s, 4500 mPa·s, 4250 mPa·s, 4000 mPa·s, 3750 mPa·s, 3500 mPa·s, 3250 mPa·s, 3000 mPa·s, 2750 mPa·s, 2500 mPa·s, 2250 mPa·s, 2000 mPa·s, 1750 mPa·s, 1500 mPa·s, 1250 mPa·s, 1000 mPa·s, 750 mPa·s, 500 mPa·s, 250 mPa·s, 100 mPa·s, 50 mPa·s, and 10 mPa·s. In one embodiment, the viscosity is preferably 10 mPa·s to 5000 mPa·s.

[0056] The viscosity can be measured under the following conditions. Measuring equipment: Product name: “E-type viscometer TVE-22H” Measurement temperature: 25℃ No.1 rotor, range R, rotation speed 12 rpm

[0057] <Production Method (Polyalkylene Oxide Structure-Containing Organosiloxane)> In one embodiment, the production method (polyalkylene oxide structure-containing organosiloxane) includes the following steps. Polyalkylene oxide structure introduction process Sealing process Purification process

[0058] (Polyalkylene oxide structure introduction process) The "polyalkylene oxide structure introduction step" refers to a step of reacting a compound containing an alkenyl group and a polyalkylene oxide structure, and a compound group including a linear organosiloxane containing SiH groups at all terminals, in the presence of an addition curing catalyst to obtain an organosiloxane containing SiH groups and a polyalkylene oxide structure.

[0059] Alkenyl group and polyalkylene oxide structure-containing compounds The alkenyl group- and polyalkylene oxide structure-containing compounds may be used alone or in combination of two or more.

[0060] Examples of the compound containing an alkenyl group and a polyalkylene oxide structure include polyalkylene glycol monoallyl ether and alkoxypolyalkylene glycol monoallyl ether.

[0061] Examples of polyalkylene glycol monoallyl ethers include polyethylene glycol monoallyl ether and polypropylene glycol monoallyl ether.

[0062] Examples of the alkoxypolyalkylene glycol monoallyl ether include methoxypolyethylene glycol monoallyl ether, methoxypolypropylene glycol monoallyl ether, ethoxypolyethylene glycol monoallyl ether, and ethoxypolypropylene glycol monoallyl ether.

[0063] In one embodiment, the compound containing an alkenyl group and a polyalkylene oxide structure is represented by the following formula: [ka] (R α1’ represents a C1-3 alkyl group or a hydrogen atom. R α2’ represents a C2-3 alkylene group. R α3’ represents a C2-6 alkenyl group. a' represents 3 to 25.)

[0064] In one embodiment, R α3’ is preferably an allyl group.

[0065] Examples of the mass % content (alkenyl group and polyalkylene oxide structure-containing compound / compound group) include 60 mass %, 55 mass %, 50 mass %, 45 mass %, 40 mass %, 35 mass %, 30 mass %, 25 mass %, 20 mass %, 15 mass %, 10 mass %, 5 mass %, 1 mass %, etc. In one embodiment, the content is preferably 1 mass % to 60 mass %.

[0066] · Linear organosiloxane containing SiH groups at all terminals The organosiloxanes containing SiH groups at all terminals may be used alone or in combination of two or more.

[0067] Examples of organosiloxanes containing SiH groups at all terminals include dimethylpolysiloxanes all terminally blocked with dimethylhydrogensiloxy groups, dimethylsiloxane-methylphenylsiloxane copolymers all terminally blocked with dimethylhydrogensiloxy groups, dimethylsiloxane-methylhydrogensiloxane copolymers all terminally blocked with dimethylhydrogensiloxy groups, methylhydrogenpolysiloxanes all terminally blocked with trimethylsiloxy groups, and dimethylsiloxane-methylhydrogensiloxane copolymers all terminally blocked with trimethylsiloxy groups.

[0068] In one embodiment, the organosiloxane containing all terminal SiH groups is represented by the following formula: [ka] (R α4’ , R α5’ , R α6’ , R α7’ each independently represents an alkyl group or an aryl group. R α8’ , R α9’ each independently represents an alkyl group or an arylalkyl group. b' represents 9 to 100.)

[0069] Examples of the mass % content (total terminal SiH group-containing linear organosiloxane / compound group) include 98 mass %, 95 mass %, 90 mass %, 85 mass %, 80 mass %, 75 mass %, 70 mass %, 65 mass %, 60 mass %, 55 mass %, 50 mass %, 45 mass %, 40 mass %, 39.5 mass %, etc. In one embodiment, the content is preferably 39.5 mass % to 98 mass %.

[0070] Addition curing catalyst The addition curing catalysts may be used alone or in combination of two or more.

[0071] Examples of the addition curing catalyst include the catalysts described below.

[0072] Examples of the content in parts by mass (addition curing catalyst / compound group) are 0.03 parts by mass, 0.025 parts by mass, 0.02 parts by mass, 0.015 parts by mass, 0.01 parts by mass, 0.005 parts by mass, 0.004 parts by mass, 0.002 parts by mass, 0.001 parts by mass, 0.0009 parts by mass, 0.0007 parts by mass, 0.0005 parts by mass, 0.0003 parts by mass, 0.0001 parts by mass, etc. In one embodiment, the content is preferably 0.0001 parts by mass to 0.03 parts by mass.

[0073] In one embodiment, the reaction temperature (polyalkylene oxide structure introduction step) is preferably 0°C to 100°C.

[0074] In one embodiment, the reaction time (polyalkylene oxide structure introduction step) is preferably 1 hour to 24 hours.

[0075] In one embodiment, the reaction solvent (polyalkylene oxide structure introduction step) is preferably toluene.

[0076] (Sealing process) The "capping step" refers to a step of reacting a group of compounds including an organosiloxane containing a SiH group and a polyalkylene oxide structure, and an alkenyl group-containing compound in the presence of an addition curing catalyst to obtain an organosiloxane containing a polyalkylene oxide structure.

[0077] Examples of the mass % content (SiH group- and polyalkylene oxide structure-containing organosiloxane / compound group) include 99 mass %, 97 mass %, 95 mass %, 93 mass %, 91 mass %, 90 mass %, 89 mass %, 87 mass %, 85 mass %, 83 mass %, 81 mass %, 80 mass %, 79 mass %, 77 mass %, 75 mass %, 73 mass %, 71 mass %, 70 mass %, etc. In one embodiment, the content is preferably 70 mass % to 99 mass %.

[0078] ·Alkenyl group-containing compounds The alkenyl group-containing compounds may be used alone or in combination of two or more.

[0079] Examples of the alkenyl group-containing compound include alkenes and alkenylaryls.

[0080] Examples of alkenes include pentene, hexene, heptene, octene, nonene, and decene.

[0081] Examples of alkenylaryl include styrene and α-methylstyrene.

[0082] Examples of the mass % content (alkenyl group-containing compound / compound group) include 20 mass %, 19 mass %, 17 mass %, 15 mass %, 13 mass %, 11 mass %, 10 mass %, 9 mass %, 7 mass %, 5 mass %, 3 mass %, 1 mass %, 0.5 mass %, etc. In one embodiment, the content is preferably 0.5 mass % to 20 mass %.

[0083] Addition curing catalyst The addition curing catalysts may be used alone or in combination of two or more.

[0084] Examples of the addition curing catalyst include the catalysts described below.

[0085] Examples of the content in parts by mass (addition curing catalyst / compound group) are 0.03 parts by mass, 0.025 parts by mass, 0.02 parts by mass, 0.015 parts by mass, 0.01 parts by mass, 0.005 parts by mass, 0.004 parts by mass, 0.002 parts by mass, 0.001 parts by mass, 0.0009 parts by mass, 0.0007 parts by mass, 0.0005 parts by mass, 0.0003 parts by mass, 0.0001 parts by mass, etc. In one embodiment, the content is preferably 0.0001 parts by mass to 0.03 parts by mass.

[0086] In one embodiment, the reaction temperature (polyalkylene oxide structure introduction step) is preferably 0°C to 100°C.

[0087] In one embodiment, the reaction time (polyalkylene oxide structure introduction step) is preferably 1 hour to 24 hours.

[0088] In one embodiment, the reaction solvent (polyalkylene oxide structure introduction step) is preferably toluene.

[0089] (purification process) The polyalkylene oxide structure-containing organosiloxane can be purified. In one embodiment, the purification step can be carried out by the following procedure. (1) Distillation (2)Liquid-liquid extraction (3) Removal of organic solvents

[0090] ·distillation Unreacted alkenyl-containing compounds can be removed by distillation.

[0091] The distillation conditions are, for example, as follows: Temperature: 40℃~80℃ Pressure: 0.1kPa~30kPa

[0092] ·Liquid-liquid extraction Liquid-liquid extraction can be carried out using an organic solvent and water. By liquid-liquid extraction, organosiloxanes having two or more polyalkylene oxide structures can be removed. In liquid-liquid extraction, the aqueous layer is removed.

[0093] In liquid-liquid extraction, the organic solvent is preferably an organic solvent having a boiling point of 160°C or less, more preferably a ketone solvent or an aliphatic solvent having a boiling point of 160°C or less, and even more preferably methylcyclohexane or hexamethyldisiloxane.

[0094] ·Removal of organic solvents The method for removing the organic solvent is preferably distillation.

[0095] The organic solvent removal conditions include, for example, the following conditions. Temperature: 40℃~80℃ Pressure: 0.1kPa~30kPa

[0096] The mass % content [organosiloxane having one polyalkylene oxide structure / (organosiloxane having one polyalkylene oxide structure + organosiloxane having one or more polyalkylene oxide structures + organosiloxane having zero polyalkylene oxide structures)] can be 100 mass %, 95 mass %, 90 mass %, 85 mass %, 80 mass %, 75 mass %, 70 mass %, 65 mass %, 60 mass %, 55 mass %, 50 mass %, etc. In one embodiment, the content is preferably 50 mass % or more. A preferred reason is, for example, reduction of turbidity.

[0097] [Adhesion inhibitor] The present disclosure relates to an adhesion suppressant containing the above-mentioned polyalkylene oxide structure-containing organosiloxane.

[0098] <Organosiloxane containing polyalkylene oxide structure> The polyalkylene oxide structure-containing organosiloxanes may be used alone or in combination of two or more.

[0099] Examples of the mass % content (polyalkylene oxide structure-containing organosiloxane / tack suppressant non-volatile content) include 10 mass %, 9 mass %, 7 mass %, 5 mass %, 3 mass %, 1 mass %, 0.9 mass %, 0.5 mass %, and 0.1 mass %. In one embodiment, the content is preferably 0.1 mass % to 10 mass %, and more preferably 1 mass % to 5 mass %. A preferred reason is, for example, an improvement in the tack suppression effect. A more preferred reason is, for example, an improvement in the transparency of the cured product.

[0100] <Antioxidants> In one embodiment, the adhesion inhibitor may optionally contain an antioxidant. The antioxidant may be used alone or in combination of two or more kinds.

[0101] Antioxidants include, for example, 2,6-di-tert-butyl-4-methylphenol, 2-tert-butyl 4-methoxyphenol, n-octadecyl 3-(4'-hydroxy-3',5'-di-t-butylphenyl)propionate, 2,2'-methylenebis(4-methyl-6-t-butylphenol), 2,2'-methylenebis(4-ethyl-6-t-butylphenol), 2,4-bis(octylthiomethyl)-o-cresol, 2-t-butyl-6-(3-t-butyl-2-hydroxy-5-methylbenzyl)-4-methylphenyl acrylate, 2,4-di-t-amyl-6-[1-(3,5-di-t-amyl-2-hydroxyphenyl)ethyl]phenyl acrylate, 2-[1-(2-hydroxy-3,5-di-tert-pentylphenyl)]acrylate, tetrakis[methylene-3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate]methane, 1,3,5-tris(4-tert-butyl-3-hydroxy-2,6-dimethylbenzyl)isocyanuric acid, bis[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propionic acid][ethylenebis(oxyethylene)], 3,9-bis[2-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propynyloxy]-1,1-dimethylenyl]-2,4,8,10-tetraoxaspiro[5,5]undecane, 4,4'-butylidenebis(3-methyl-6-t-butylphenol), tocopherol (vitamin E), ascorbic acid (vitamin C), and the like.

[0102] The mass ppm content (antioxidant / adhesive inhibitor non-volatile matter) includes, for example, 2000 ppm, 1900 ppm, 1700 ppm, 1500 ppm, 1300 ppm, 1100 ppm, 1000 ppm, 900 ppm, 700 ppm, 500 ppm, 400 ppm, 300 ppm, 200 ppm, 100 ppm, 50 ppm, 10 ppm, 5 ppm, and the like. In one embodiment, the above content is preferably 0 ppm to 2000 ppm.

[0103] <Organosiloxane containing SiH group> In one embodiment, the adhesion suppressant may optionally contain an SiH group-containing organosiloxane. The SiH group-containing organosiloxane may be used alone or in combination of two or more.

[0104] Examples of the SiH group-containing chain organosiloxane include SiH group-containing linear organosiloxane and SiH group-containing branched organosiloxane.

[0105] Examples of the SiH group-containing linear organosiloxane include linear organosiloxanes having some terminal SiH groups, linear organosiloxanes having all terminal SiH groups, linear organosiloxanes having side chain SiH groups, linear organosiloxanes having some terminal and side chain SiH groups, and linear organosiloxanes having all terminal and side chain SiH groups.

[0106] Examples of the SiH group-containing branched-chain organosiloxane include branched-chain organosiloxanes containing some terminal SiH groups, branched-chain organosiloxanes containing all terminal SiH groups, branched-chain organosiloxanes containing side chain SiH groups, branched-chain organosiloxanes containing some terminal and side chain SiH groups, and branched-chain organosiloxanes containing all terminal and side chain SiH groups.

[0107] Examples of the average composition formula (SiH group-containing organosiloxane) include the following composition formula. H β1 R 2 β2 SiO (4-β1-β2) / 2 (R 2 each independently represents an organic group. β1 represents 0.005 to 1.0. β2 represents 0.9 to 1.5.

[0108] Examples of β1 include 1.0, 0.9, 0.8, 0.7, 0.6, 0.5, 0.4, 0.3, 0.2, 0.1, 0.09, 0.07, 0.05, 0.03, 0.01, 0.009, 0.007, and 0.005.

[0109] Examples of β2 include 1.5, 1.4, 1.3, 1.2, 1.1, 1.0, and 0.9.

[0110] Examples of the organic group include an alkyl group and an aryl group.

[0111] Examples of the SiH group-containing organosiloxane include organosiloxanes containing SiH groups at all terminals and organosiloxanes containing SiH groups at some terminals.

[0112] Examples of organosiloxanes containing SiH groups at all terminals include the above compounds.

[0113] Examples of organosiloxanes containing partial SiH groups at the terminals include partially dimethylhydrogensiloxy-blocked dimethylpolysiloxane, partially dimethylhydrogensiloxy-blocked dimethylsiloxane-methylphenylsiloxane copolymer, partially dimethylhydrogensiloxy-blocked dimethylsiloxane-methylhydrogensiloxane copolymer, partially trimethylsiloxy-blocked methylhydrogenpolysiloxane, partially trimethylsiloxy-blocked dimethylsiloxane-methylhydrogensiloxane copolymer, and H(CH3)2SiO 1 / 2 Units and SiO 4 / 2 Organopolysiloxane consisting of units, H(CH3)2SiO 1 / 2 Units: (CH3)3SiO 1 / 2 Units and SiO 4 / 2 Examples of suitable organosiloxanes include organopolysiloxanes consisting of units.

[0114] Examples of the product (SiH group-containing organosiloxane) include KF-99, KF-9901 (manufactured by Shin-Etsu Chemical Co., Ltd.), XL-112, and XL3-7500 (manufactured by Nusil Technology).

[0115] The number of SiH groups (SiH group-containing organosiloxane) is, for example, 300, 275, 250, 225, 200, 175, 150, 125, 100, 75, 50, 25, 20, 10, 5, 2, or 1. In one embodiment, the number of SiH groups is preferably 1 to 300.

[0116] Examples of the weight average molecular weight (SiH group-containing organosiloxane) include 30,000, 27,500, 25,000, 22,500, 20,000, 17,500, 15,000, 12,500, 10,000, 7,500, 5,000, 2,500, and 1,500. In one embodiment, the weight average molecular weight is preferably 1,500 to 30,000.

[0117] Examples of the number average molecular weight (of the SiH group-containing organosiloxane) include 20,000, 17,500, 15,000, 12,500, 10,000, 7,500, 5,000, 2,500, 1,500, and 1,000. In one embodiment, the number average molecular weight is preferably 1,000 to 20,000.

[0118] Examples of the average degree of polymerization (of the SiH group-containing organosiloxane) include 400, 375, 350, 325, 300, 275, 250, 225, 200, 175, 150, 125, 100, 75, 50, 25, 20, and 15. In one embodiment, the average degree of polymerization is preferably 15 to 400.

[0119] Examples of the viscosity (of the SiH group-containing organosiloxane) include 2000 mPa·s, 1750 mPa·s, 1500 mPa·s, 1250 mPa·s, 1000 mPa·s, 750 mPa·s, 500 mPa·s, 250 mPa·s, 100 mPa·s, 50 mPa·s, and 10 mPa·s. In one embodiment, the viscosity is preferably 10 mPa·s to 2000 mPa·s.

[0120] The mass % content (SiH group-containing organosiloxane / tack suppressant nonvolatile content) can be, for example, 30 mass %, 25 mass %, 20 mass %, 15 mass %, 10 mass %, 5 mass %, 1 mass %, 0 mass %, etc. In one embodiment, the content is preferably 0 mass % to 30 mass %.

[0121] Examples of the molar ratio (SiH groups / alkenyl groups) include 20, 19, 17, 15, 13, 11, 10, 9, 7, 5, 3, 1, 0.9, 0.5, 0.2, etc. In one embodiment, the molar ratio is preferably 0.2 to 20.

[0122] <Alkenyl group-containing organosiloxane> In one embodiment, the adhesion suppressant may optionally contain an alkenyl group-containing organosiloxane. The alkenyl group-containing organosiloxane may be used alone or in combination of two or more kinds.

[0123] Examples of the alkenyl group-containing organosiloxane include alkenyl group-containing linear organosiloxanes and alkenyl group-containing non-linear organosiloxanes.

[0124] (Alkenyl group-containing linear organosiloxane) Examples of the alkenyl group-containing linear organosiloxane include linear organosiloxanes containing partial terminal alkenyl groups, linear organosiloxanes containing all terminal alkenyl groups, linear organosiloxanes containing side chain alkenyl groups, linear organosiloxanes containing partial terminal and side chain alkenyl groups, and linear organosiloxanes containing all terminal and side chain alkenyl groups.

[0125] Examples of the average composition formula (alkenyl group-containing linear organosiloxane) include the following composition formula. R 3a γ1 R 3b γ2 SiO (4-γ1-γ2) / 2 (R 3a R each independently represents an alkenyl group.3b each independently represents a non-alkenyl-containing group; γ1 represents 0.00001 to 0.1; and γ2 represents 1.9 to 2.3.

[0126] Examples of γ1 include 0.1, 0.09, 0.07, 0.05, 0.03, 0.01, 0.009, 0.007, 0.005, 0.003, 0.001, 0.0009, 0.0007, 0.0005, 0.0003, 0.0001, 0.00009, 0.00007, 0.00005, 0.00003, and 0.00001.

[0127] Examples of γ2 include 2.3, 2.2, 2.1, 2.0, and 1.9.

[0128] Examples of the non-alkenyl group-containing group include an alkyl group and an aryl group.

[0129] The linear organosiloxane containing alkenyl groups at all terminals includes, for example, dimethylpolysiloxanes all end-blocked with dimethylvinylsiloxy groups, dimethylpolysiloxanes all end-blocked with diphenylvinylsiloxy groups, dimethylsiloxane-methylphenylsiloxane copolymers all end-blocked with dimethylvinylsiloxy groups, dimethylsiloxane-diphenylsiloxane copolymers all end-blocked with dimethylvinylsiloxy groups, dimethylsiloxane-methylphenylsiloxane copolymers all end-blocked with diphenylvinylsiloxy groups, dimethylsiloxane-methylphenylsiloxane copolymers all end-blocked with dimethylvinylsiloxy groups, dimethylsiloxane-methylvinylsiloxane copolymers all end-blocked with dimethylvinylsiloxy groups, and dimethylsiloxane-methylvinylsiloxane copolymers all end-blocked with dimethylvinylsiloxy groups. Examples include dimethylvinylsiloxy-terminated dimethylsiloxane-methylphenylsiloxane-methylvinylsiloxane copolymer, dimethylvinylsiloxy-terminated dimethylsiloxane-diphenylsiloxane-methylvinylsiloxane copolymer, trimethylsiloxy-terminated methylvinylpolysiloxane, trimethylsiloxy-terminated methylvinylsiloxane-methylphenylsiloxane copolymer, trimethylsiloxy-terminated methylvinylsiloxane-diphenylsiloxane copolymer, and trimethylsiloxy-terminated dimethylsiloxane-methylvinylsiloxane copolymer.

[0130] Examples of the partially alkenyl-terminated linear organosiloxane include partially end-blocked dimethylvinylsiloxy groups dimethylpolysiloxane, partially end-blocked dimethylpolysiloxane with diphenylvinylsiloxy groups, partially end-blocked dimethylsiloxane-methylphenylsiloxane copolymer, partially end-blocked dimethylvinylsiloxy groups dimethylsiloxane-diphenylsiloxane copolymer, partially end-blocked dimethylsiloxane-methylphenylsiloxane copolymer with diphenylvinylsiloxy groups dimethylsiloxane-methylphenylsiloxane copolymer, partially end-blocked dimethylvinylsiloxy groups dimethylsiloxane-methylvinylsiloxane copolymer, partially end-blocked dimethylvinylsiloxy groups dimethylsiloxane-methylvinylsiloxane copolymer, Examples include methylvinylsiloxy group-blocked dimethylsiloxane-methylphenylsiloxane-methylvinylsiloxane copolymer, partially dimethylvinylsiloxy group-blocked dimethylsiloxane-diphenylsiloxane-methylvinylsiloxane copolymer, partially trimethylsiloxy group-blocked methylvinylpolysiloxane, partially trimethylsiloxy group-blocked methylvinylsiloxane-methylphenylsiloxane copolymer, partially trimethylsiloxy group-blocked methylvinylsiloxane-diphenylsiloxane copolymer, and partially trimethylsiloxy group-blocked dimethylsiloxane-methylvinylsiloxane copolymer.

[0131] Examples of the product (alkenyl group-containing linear organosiloxane) include PLY1-7500 and PLY-7661 (manufactured by Nusil Technology).

[0132] (Alkenyl-containing non-linear organosiloxane) Examples of the average composition formula (alkenyl group-containing non-linear organosiloxane) include the following composition formula. (R 4a SiO 3 / 2 ) δ1 (R 4a 2SiO 2 / 2 ) δ2 (R 4a 3SiO 1 / 2 ) δ3 (SiO 4 / 2 ) δ4 (R 4b O1 / 2 ) δ5 (In the formula, R 4a each independently represents an alkyl group, an alkenyl group, or an aryl group, provided that at least two R 4a represents an alkenyl group. 4b represents a hydrogen atom or an alkyl group. δ1 represents 0 to 1. δ2 represents 0 to 0.8. δ3 represents 0 to 0.8. δ4 represents 0 to 0.8. δ5 represents 0 to 0.5. δ1 + δ2 + δ3 + δ4 + δ5 = 1. (δ1 + δ4) > 0.)

[0133] Examples of δ1 include 1, 0.9, 0.8, 0.7, 0.6, 0.5, 0.4, 0.3, 0.2, 0.1, and 0. In one embodiment, δ1 is preferably 0 to 1, more preferably greater than 0.3, and even more preferably 0.4 to 1.

[0134] Examples of δ2 include 0.8, 0.7, 0.6, 0.5, 0.4, 0.3, 0.2, 0.1, and 0.

[0135] Examples of δ3 include 0.8, 0.7, 0.6, 0.5, 0.4, 0.3, 0.2, 0.1, and 0.

[0136] Examples of δ4 include 0.8, 0.7, 0.6, 0.5, 0.4, 0.3, 0.2, 0.1, and 0.

[0137] Examples of δ5 include 0.5, 0.4, 0.3, 0.2, 0.1, and 0.

[0138] In one embodiment, R 4a R is preferably a methyl group, a vinyl group, a phenyl group, or the like. 4b is preferably a hydrogen atom, a methyl group, or the like.

[0139] An example of the product (alkenyl group-containing non-linear organosiloxane) is Silmer VQ20 (manufactured by Siltech).

[0140] Examples of the number of alkenyl groups (alkenyl group-containing organosiloxane) include 200, 175, 150, 125, 100, 75, 50, 25, 20, 10, 5, 2, and 1. In one embodiment, the number of alkenyl groups is preferably 1 to 200.

[0141] Examples of the weight average molecular weight (alkenyl group-containing organosiloxane) include 1,000,000, 750,000, 500,000, 250,000, 100,000, 90,000, 70,000, 50,000, 30,000, 10,000, 9,000, 7,000, 5,000, 3,000, and 2,000. In one embodiment, the weight average molecular weight is preferably 2,000 to 1,000,000.

[0142] Examples of the number average molecular weight (alkenyl group-containing organosiloxane) include 500,000, 250,000, 100,000, 90,000, 70,000, 50,000, 30,000, 10,000, 9,000, 7,000, 5,000, 3,000, 2,000, and 1,000. In one embodiment, the number average molecular weight is preferably 1,000 to 500,000.

[0143] Examples of the average degree of polymerization (alkenyl group-containing organosiloxane) include 15,000, 13,000, 11,000, 10,000, 9,000, 7,000, 5,000, 3,000, 1,000, 900, 700, 500, 300, 100, 75, 50, 25, and 15. In one embodiment, the average degree of polymerization is preferably 15 to 15,000.

[0144] Examples of the viscosity (of the alkenyl group-containing organosiloxane) include 1,000,000 mPa·s, 750,000 mPa·s, 500,000 mPa·s, 250,000 mPa·s, 100,000 mPa·s, 50,000 mPa·s, 20,000 mPa·s, 10,000 mPa·s, 9,000 mPa·s, 7,000 mPa·s, 5,000 mPa·s, 2,000 mPa·s, 1,000 mPa·s, 500 mPa·s, 100 mPa·s, 75 mPa·s, 50 mPa·s, 25 mPa·s, and 10 mPa·s. The viscosity is preferably 10 mPa·s to 1,000,000 mPa·s.

[0145] Examples of the mass % content (alkenyl group-containing organosiloxane / tack suppressant non-volatile content) include 99.9 mass %, 99 mass %, 95 mass %, 90 mass %, 85 mass %, 80 mass %, 75 mass %, 70 mass %, 65 mass %, 60 mass %, 55 mass %, 50 mass %, 45 mass %, 40 mass %, 35 mass %, 30 mass %, 25 mass %, 20 mass %, 15 mass %, 10 mass %, 5 mass %, 0 mass %, etc. In one embodiment, the content is preferably 0 mass % to 99.9 mass %.

[0146] Examples of crosslinking mechanisms (adhesion inhibitors) include addition curing and peroxide curing.

[0147] <Addition curing catalyst> In one embodiment, the adhesion reducer may optionally contain an addition cure catalyst. The addition cure catalyst may be used alone or in combination of two or more.

[0148] Examples of the addition curing catalyst include platinum catalysts, rhodium catalysts, and iridium catalysts.

[0149] Examples of platinum catalysts include platinum fine powder, platinum black, chloroplatinic acid, platinum tetrachloride, alcohol-modified chloroplatinic acid, platinum-olefin complexes, platinum-alkenylsiloxane complexes, and platinum-carbonyl complexes.

[0150] Examples of platinum-alkenylsiloxane complexes include platinum-1,3-divinyl-1,1,3,3-tetramethyldisiloxane, platinum-1,3-diallyl-1,1,3,3-tetramethyldisiloxane, platinum-1,3-divinyl-1,3-dimethyl-1,3-diphenyldisiloxane, platinum-1,3-divinyl-1,1,3,3-tetraphenyldisiloxane, and platinum-1,3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetrasiloxane.

[0151] Examples of platinum-carbonyl complexes include platinum bis(acetoacetate) and platinum bis(acetylacetonate).

[0152] Rhodium catalysts include, for example, [Rh(O2CCH3)2]2, Rh(O2CCH3)3, and Rh2(C8H 15 O2)4, Rh(C5H7O2)3, Rh(C5H7O2)(CO)2, Rh(CO)[Ph3P](C5H7O2), Rh2R r1 2nd Round r2 4. Rh[O(CO)R r3 ] 3-r1 (OH) r1 , RhR r1 3[(R r3 )2S]3, (R r4 3P)2Rh(CO)R r1 , (R r4 3P)2Rh(CO)H, H r2 Rh r3 (En) r4 Cl r5 etc. (In the formula, R r1 represents a hydrogen atom, a chlorine atom, a bromine atom, or an iodine atom. r2 is an alkyl group, CO, CH 14 or 0.5C8H 12 Represents R r3 represents an alkyl group or an aryl group. r4 represents an alkyl group, an aryl group, an alkyloxy group, or an aryloxy group. En represents an olefin. r1 represents 0 or 1. r2 represents 0 or 1. r3 represents 1 or 2. r4 represents 1, 2, 3, or 4. r5 represents 2, 3, or 4.

[0153] Iridium catalysts include, for example, Ir(OOCCH3)3, Ir(C5H7O2)3, [Ir(R i1 )(En)2]2, [Ir(R i1 )(Dien)]2, etc. (In the formula, R i1 represents a chlorine atom, a bromine atom, an iodine atom or an alkoxy group. En represents an olefin. Dien represents cyclooctadiene.

[0154] The mass % content (addition curing catalyst / tack suppressant non-volatile content) is, for example, 0.02 mass %, 0.015 mass %, 0.01 mass %, 0 mass %, etc. In one embodiment, the content is preferably 0 mass % to 0.02 mass %.

[0155] <Hydrosilylation Reaction Inhibitor> In one embodiment, the adhesion inhibitor may optionally include a hydrosilylation reaction inhibitor. The hydrosilylation reaction inhibitor may be used alone or in combination of two or more.

[0156] Examples of the hydrosilylation reaction inhibitor include alkyne alcohols, enynes, methylalkenylsiloxane oligomers, alkyneoxysilanes, and triallyl isocyanurate.

[0157] Examples of alkyne alcohols include 1-ethynylcyclohexan-1-ol, 2-methyl-3-butyn-2-ol, 3,5-dimethyl-1-hexyn-3-ol, and 2-phenyl-3-butyn-2-ol.

[0158] Examples of enynes include 3-methyl-3-penten-1-yne and 3,5-dimethyl-3-hexen-1-yne.

[0159] Examples of the methylalkenylsiloxane oligomer include 1,3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetrasiloxane and 1,3,5,7-tetramethyl-1,3,5,7-tetrahexenylcyclotetrasiloxane.

[0160] Examples of alkyneoxysilanes include dimethylbis(3-methyl-1-butyn-3-oxy)silane and methylvinylbis(3-methyl-1-butyn-3-oxy)silane.

[0161] Examples of the mass % content (hydrosilylation reaction inhibitor / tack suppressant nonvolatile content) include 1 mass %, 0.9 mass %, 0.7 mass %, 0.5 mass %, 0.3 mass %, 0.1 mass %, 0 mass %, etc. In one embodiment, the content is preferably 0 mass % to 1 mass %.

[0162] <Peroxide> In one embodiment, the adhesion inhibitor may optionally contain a peroxide. The peroxide may be used alone or in combination of two or more kinds.

[0163] Examples of peroxides include benzoyl peroxide, 2,4-dichlorobenzoyl peroxide, p-methylbenzoyl peroxide, o-methylbenzoyl peroxide, 2,4-dicumyl peroxide, 2,5-dimethyl-bis(2,5-t-butylperoxy)hexane, di-t-butyl peroxide, t-butyl perbenzoate, and 1,6-hexanediol-bis-t-butylperoxycarbonate.

[0164] The mass % content (peroxide / non-volatile content of adhesion inhibitor) can be, for example, 5 mass %, 4 mass %, 3 mass %, 2 mass %, 1 mass %, 0 mass %, etc. In one embodiment, the content is preferably 0 mass % to 5 mass %.

[0165] <Silicone oil> In one embodiment, the adhesion inhibitor may optionally contain silicone oil. The silicone oil may be used alone or in combination of two or more kinds.

[0166] "Silicone oil" means a silicone that does not have reactive groups.

[0167] Examples of the reactive group include an alkenyl group, an alkynyl group, a SiH group, and a hydroxyl group.

[0168] The silicone oil may be, for example, polydialkylsiloxane.

[0169] Examples of polydialkylsiloxanes include polydimethylsiloxane, polydiethylsiloxane, and polymethylethylsiloxane.

[0170] Examples of the mass % content (polydialkylsiloxane / tack suppressant nonvolatile content) include 30 mass %, 25 mass %, 20 mass %, 15 mass %, 10 mass %, 5 mass %, 4 mass %, 2 mass %, 1 mass %, 0 mass %, etc. In one embodiment, the content is preferably 0 mass % to 30 mass %.

[0171] <Organic solvents> In one embodiment, the adhesion inhibitor may optionally contain an organic solvent. The organic solvent may be used alone or in combination of two or more kinds.

[0172] Examples of the organic solvent include ketone solvents, aromatic solvents, aliphatic solvents, alcohol solvents, glycol solvents, glycol ether solvents, ester solvents, petroleum-based solvents, haloalkane solvents, amide solvents, and silicon-containing solvents.

[0173] Examples of the ketone solvent include methyl ethyl ketone, acetylacetone, methyl isobutyl ketone, cyclopentanone, and cyclohexanone.

[0174] Examples of aromatic solvents include toluene and xylene.

[0175] Examples of the aliphatic solvent include pentane, hexane, cyclohexane, and methylcyclohexane.

[0176] Examples of the alcohol solvent include methanol, ethanol, n-propanol, isopropanol, and butanol.

[0177] Examples of glycol solvents include ethylene glycol, propylene glycol, diethylene glycol, dipropylene glycol, triethylene glycol, tripropylene glycol, polyethylene glycol, and polypropylene glycol.

[0178] Examples of glycol ether solvents include ethylene glycol dimethyl ether, ethylene glycol diethyl ether, propylene glycol dimethyl ether, propylene glycol diethyl ether, diethylene glycol dimethyl ether, triethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, diethylene glycol diethyl ether, propylene glycol monomethyl ether, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol mono-n-propyl ether, ethylene glycol monoisopropyl ether, ethylene glycol mono-n-butyl ether, ethylene glycol monoisobutyl ether, and ethylene glycol mono-t-butyl ether.

[0179] Examples of the ester solvent include ethyl acetate, butyl acetate, methyl cellosolve acetate, ethyl cellosolve acetate, and propylene glycol monomethyl ether acetate.

[0180] Examples of petroleum-based solvents include Solvesso #100 (manufactured by Exxon Chemical), Solvesso #150 (manufactured by Exxon Chemical), and the like.

[0181] Examples of haloalkane solvents include chloroform.

[0182] The amide solvent may, for example, be dimethylformamide.

[0183] Examples of silicon-containing solvents include hexamethyldisiloxane.

[0184] Examples of the mass % content (organic solvent / tack suppressant) include 95 mass %, 90 mass %, 85 mass %, 80 mass %, 75 mass %, 70 mass %, 65 mass %, 60 mass %, 55 mass %, 50 mass %, 45 mass %, 40 mass %, 35 mass %, 30 mass %, 25 mass %, 20 mass %, 15 mass %, 10 mass %, 5 mass %, 0 mass %, etc. In one embodiment, the content is preferably 0 mass % to 95 mass %.

[0185] <Additives> The above-mentioned adhesion inhibitor may optionally contain an agent (additive) that does not fall into any of the above categories.

[0186] Examples of additives include curing retarders, inorganic fluorescent materials, antioxidants, radical inhibitors, ultraviolet absorbers, adhesion improvers, flame retardants, surfactants, storage stability improvers, antiozonants, light stabilizers, thickeners, plasticizers, coupling agents, antioxidants, heat stabilizers, conductivity imparting agents, antistatic agents, radiation shielding agents, nucleating agents, phosphorus-based peroxide decomposers, lubricants, pigments, metal deactivators, physical property adjusters, and inorganic fillers.

[0187] In one embodiment, the content in parts by mass (additive / adhesion inhibitor) is preferably less than 1 part by mass, less than 0.1 part by mass, less than 0.01 part by mass, 0 part by mass, or the like.

[0188] In one embodiment, the content in parts by mass of the additive (any one of "polyalkylene oxide structure-containing organosiloxane, SiH group-containing organosiloxane, alkenyl group-containing organosiloxane, addition curing catalyst, hydrosilylation reaction inhibitor, polydialkylsiloxane, and organic solvent") is preferably less than 1 part by mass, less than 0.1 part by mass, less than 0.01 part by mass, or 0 part by mass, for example.

[0189] The mass % content (organosiloxane having two or more polyalkylene oxide structures / tack suppressant non-volatile content) is, for example, 0.5 mass % or less, 0.4 mass % or less, 0.2 mass % or less, 0.1 mass % or less, 0 mass %, etc. In one embodiment, the content is preferably 0.5 mass % or less.

[0190] The adhesion inhibitor can be produced by dispersing and mixing the above agents.

[0191] Examples of the dispersing and mixing means include an emulsifying disperser and an ultrasonic dispersing device.

[0192] [Cured product] The present disclosure relates to a cured product of the above-mentioned adhesion suppressant.

[0193] In one embodiment, the curing temperature is preferably 0°C to 200°C.

[0194] In one embodiment, the curing time is preferably 10 minutes to 24 hours.

[0195] The hardness (cured product: measured with a durometer A hardness meter) is, for example, 50, 45, 40, 35, 30, 25, 20, 15, 10, 5, or 0. In one embodiment, the hardness is preferably 50 or less.

[0196] The measurement conditions (hardness) are, for example, as follows: Measuring equipment: Durometer A hardness tester (product name "GS-719N", manufactured by Teclock Corporation) Measurement standard: JIS K 6253

[0197] The total light transmittance (cured product) is, for example, 80%, 85%, 90%, 95%, 100%, etc. In one embodiment, the total light transmittance is preferably 80% or more.

[0198] The measurement conditions (total light transmittance) are, for example, as follows. Measuring equipment: Haze meter (product name "HZ-V3", manufactured by Suga Test Instruments Co., Ltd.) Measurement standard: JIS K 7361-1(1997)

[0199] [Goods] The present disclosure relates to an article comprising the cured product.

[0200] Examples of the article include cell culture vessels, medical devices, heat-dissipating silicones, and LED sealants. [Example]

[0201] The present invention will be described in detail below through examples and comparative examples. However, the above description and the following examples are not intended to limit the present invention. The present invention is limited only by the claims. Unless otherwise specified below, numerical values ​​such as parts and % are based on mass.

[0202] Example 1 To a reaction vessel equipped with a stirrer and a cooling tube, 0.036 parts of hexachloroplatinic acid (IV) hexahydrate and 120 parts of toluene were added. Next, the temperature was raised to 90°C over 1 hour, and then a mixture of 35.0 parts of allyl group-containing polyethylene glycol (product name "PKA-5006" manufactured by NOF Corporation), 83.28 parts of SiH group-containing organosiloxane having SiH groups at all terminals (product name "Modifier 1439" manufactured by BRB), and 67.60 parts of toluene was added dropwise to the reaction system over 60 minutes. After maintaining the temperature at 90°C for 1 hour, 16.26 parts of 1-octene was added dropwise over 10 minutes. Subsequently, the temperature was raised to 100°C over 10 minutes and maintained at that temperature for 3 hours. Thereafter, the solvent was removed at 50°C to 55°C and 5 kPa to 10 kPa over 1 hour. 100 parts of the obtained liquid and 50 parts of ion-exchanged water were added to a separatory funnel, stirred for 10 minutes, and then allowed to stand for 1 hour. The lower layer of the two separated layers was removed and discarded. 50 parts of ion-exchanged water was added to the separatory funnel with the upper layer remaining, stirred for 10 minutes, and then allowed to stand for 1 hour. The lower layer of the two separated layers was removed and discarded. The upper layer was recovered, and the solvent was removed at 60°C to 65°C and 5 kPa to 10 kPa for 1 hour. GPC measurement revealed that the proportion of the compound with two polyethylene glycol units added was 1.0% and that with one unit added was 68.5%.

[0203] Unless otherwise stated, the following examples were carried out in the same manner as above, except for the changes shown in the table.

[0204] Comparative Example 1 To a reaction vessel equipped with a stirrer and a condenser, 0.067 parts of hexachloroplatinic (IV) acid hexahydrate and 130 parts of toluene were added. Next, the temperature was raised to 90°C over 1 hour, and then a mixture of 82.0 parts of PKA-5006, 173.86 parts of XL3-7500, and 126.40 parts of toluene was added dropwise to the reaction system over 60 minutes. Subsequently, the temperature was raised to 100°C over 10 minutes and maintained at that temperature for 3 hours. Thereafter, the solvent was removed at 50°C to 55°C and 5 kPa to 10 kPa over 1 hour. GPC measurement showed that the compound with two polyethylene glycol units added was 100.0% and the compound with one polyethylene glycol unit was 0%. [Table 1] <description> Addition curing catalyst Platinum catalyst: Hexachloroplatinic acid (IV) hexahydrate (Fujifilm Wako Pure Chemical Industries, Ltd.) Allyl group-containing polyethylene glycol PKA-5006: Product name "Uniox PKA-5006", manufactured by NOF Corporation, average molecular weight 350 PKA-5001: Product name "Uniox PKA-5001", manufactured by NOF Corporation, average molecular weight 200 PKA-5009: Product name "Uniox PKA-5009", manufactured by NOF Corporation, average molecular weight 550 ·SiH group-containing organosiloxane Modifier 1439: BRB, organosiloxane containing SiH groups at all terminals, average molecular weight 860 XL3-7500: Nusil Technology, organosiloxane containing SiH groups at all terminals, average molecular weight 1,600 XL-7505: Nusil Technology, organosiloxane containing SiH groups at all terminals, average molecular weight 13,300

[0205] <Manufacture (cured product)> An adhesion inhibitor was produced by mixing 3.0 parts of each of the silicones of the examples with addition-curing silicone "Silpot 184" (manufactured by Dow Toray). The adhesion inhibitor was placed on a 1.0 mm thick soda glass, coated with a film applicator having a gap of 500 μm, and heated at 150° C. for 2 hours to obtain a cured product with a film thickness of 400 μm.

[0206] <Hardness> The measurements were carried out under the following conditions. Measuring equipment: Durometer A hardness tester (product name "GS-719N", manufactured by Teclock Corporation) Measurement standard: JIS K 6253

[0207] <Total light transmittance> The measurements were carried out under the following conditions. Measuring equipment: Haze meter (product name "HZ-V3", manufactured by Suga Test Instruments Co., Ltd.) Measurement standard: JIS K 7361-1(1997)

[0208] <Adhesion suppression effect> A probe tack test was carried out under the following conditions. Probe: 5mm diameter Nichiban NS probe tack tester Approach speed: 10mm / min Pressure: 20g Pressurization time: 1 second Peeling speed: 10mm / min Measurement temperature: 23℃ Humidity: 45% Test piece: 3cm x 3cm x 1mm

Claims

1. An adhesion inhibitor, The adhesion suppressant contains a polyalkylene oxide structure-containing organosiloxane, The polyalkylene oxide structure-containing organosiloxane contains one structure A and 10 to 100 structures B. <Structure A> 【Chemical A】 <Structure B> 【Chemistry B】 (R α１ represents a C1-3 alkyl group or a hydrogen atom. α２ represents a C2-3 alkylene group. α３ represents a C2-6 alkylene group. α４ , R α５ , R α６ , R α７ each independently represents an alkyl group or an aryl group; a is 3 to 25; when the number of structures B is b, b / a is less than 4.

1.

2. A cured product of the adhesion suppressant according to claim 1.

3. 3. The cured product according to claim 2, which has a hardness of 50 or less on a durometer A hardness scale and a total light transmittance of 80% or more.

4. An article comprising the cured product according to claim 2 or 3.

5. A polyalkylene oxide structure-containing organosiloxane containing one structure A and 10 to 100 structures B. <Structure A> 【Chemical A】 <Structure B> 【Chemistry B】 (R α１ represents a C1-3 alkyl group or a hydrogen atom. α２ represents a C2-3 alkylene group. α３ represents a C2-6 alkylene group. α４ , R α５ , R α６ , R α７ each independently represents an alkyl group or an aryl group; a is 3 to 25; when the number of structures B is b, b / a is less than 4.1.

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