Cooling apparatus

Abstract

To provide a cooling apparatus of a semiconductor module that reduces costs while ensuring cooling performance.SOLUTION: A plurality of first protrusions 30 have a first fillet 33 at the corner between them and a bottom wall portion 20, and the bottom wall portion 20 and the first protrusions 30 are formed by casting. The first fillet 33 of the first protrusion 30 is spaced apart from the first fillet 33 of the adjacent first protrusion 30 at the bottom surface 20a. Therefore, it is possible to achieve good casting results. As a result, it is possible to reduce costs while ensuring cooling performance.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a cooling device. [Background technology]

[0002] A known example of a conventional cooling device is the technology described in Patent Document 1. The cooling device described in Patent Document 1 includes an inverter case. The inverter case has a base on one side of which an inverter circuit is attached. A flow path for flowing cooling water is provided in the base, and a water channel lid is provided on the flow path. The inverter circuit is provided on the upper surface of the water channel lid. A heat dissipation member for dissipating heat is provided on the lower surface of the water channel lid. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2022-143711 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the above-mentioned Patent Document 1, a heat dissipation member must be provided on the underside of the water channel lid, which increases the cost of manufacturing the semiconductor module. On the other hand, if such a heat dissipation member is not provided on the semiconductor module, the cooling performance of the cooling device decreases. Therefore, there is a need for a cooling device that can reduce costs while ensuring cooling performance.

[0005] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a cooling device for a semiconductor module that can reduce costs and ensure cooling performance. [Means for solving the problem]

[0006] A cooling device according to one embodiment of the present invention is a cooling device for a semiconductor module that is arranged to be joined to the semiconductor module so as to be able to transfer heat thereto and that has a cooling flow path through which a cooling fluid flows, and that comprises: a base member to which the semiconductor module is connected and that exchanges heat with the cooling fluid; and a bottom wall portion that is arranged opposite and spaced apart from the base member in a first direction and that forms a cooling flow path between itself and the base member; the bottom surface of the bottom wall portion is provided with a plurality of first protrusions that protrude toward the base member in the first direction, and the plurality of first protrusions have first fillets at the corners between them and the bottom wall portion, and the first fillets of the first protrusions are spaced apart on the bottom surface from the first fillets of adjacent first protrusions.

[0007] This cooling device includes a base member to which a semiconductor module is connected and which exchanges heat with a cooling fluid, and a bottom wall portion disposed opposite the base member and spaced apart in a first direction, forming the cooling flow path between the base member and the bottom wall portion. The cooling device can thereby cool the semiconductor module via the base member by flowing the cooling fluid through the cooling flow path. The bottom surface of the bottom wall portion is provided with a plurality of first protrusions that protrude toward the base member in the first direction. Turbulence occurs in the cooling fluid within the cooling flow path due to the influence of the first protrusions. This facilitates contact of the cooling fluid with the base member, enabling efficient cooling of the semiconductor module. Furthermore, the plurality of first protrusions have first fillets at corners between the bottom wall portion and the bottom wall portion, and the bottom wall portion and the first protrusions are formed by casting. The first fillets of the first protrusions are spaced apart from the first fillets of adjacent first protrusions on the bottom surface. Therefore, good casting can be performed. As a result, costs can be reduced while ensuring cooling performance.

[0008] The cooling device may further include a sidewall extending from an edge of the bottom wall toward the base member and extending along a second direction in which the cooling fluid flows, and a second protrusion may be provided on a side surface of the sidewall that protrudes into the cooling flow path in a third direction intersecting the first and second directions. In this case, turbulence can be generated in the cooling fluid even near the side surface, and the cooling fluid can be directed toward the first protrusion, thereby improving cooling efficiency.

[0009] The height of the first protrusion in the first direction may be equal to or greater than half the height of the cooling channel in the first direction, which can generate turbulence in the cooling fluid near the base member.

[0010] The plurality of first protrusions may be arranged side by side in a third direction intersecting the first direction and the second direction in which the cooling fluid flows, with the arrays being provided in a plurality of rows in the second direction, and the plurality of first protrusions in one array being arranged in a staggered pattern relative to the plurality of first protrusions in another array adjacent to the array in the second direction. In this case, the cooling fluid flowing in the cooling flow path in the second direction can be regulated by the first protrusions arranged in a staggered pattern, allowing the cooling fluid to effectively cool the base member.

[0011] The first protrusion may have a second fillet at a corner between the side surface extending in the first direction and the tip surface, which allows a turbulent flow of the cooling fluid to flow smoothly into the gap between the tip surface and the base member.

[0012] The first protrusion may have an elliptical shape extending in a second direction in which the cooling fluid flows, as viewed from the first direction. An elliptical shape extending in the second direction does not obstruct the cooling fluid as much as a circular shape with the same minor axis, thereby contributing to reduced pressure loss. Furthermore, an elliptical shape extending in the second direction allows more cooling fluid to be applied to the base member as compared to a circular shape with the same minor axis. Furthermore, an elliptical shape extending in the second direction can generate more turbulence than a circular shape with the same minor axis by providing fillets around the base and tip. [Effects of the Invention]

[0013] According to the present invention, it is possible to provide a cooling device for a semiconductor module that can reduce costs and ensure cooling performance. [Brief explanation of the drawings]

[0014] [Figure 1] 1 is a schematic cross-sectional view showing a cooling device according to an embodiment of the present invention. [Figure 2] FIG. [Figure 3] FIG. 3 is a cross-sectional view taken along line III-III in FIG. 2. [Figure 4] FIG. 10 is a view showing the internal structure of the groove portion as viewed from the positive side to the negative side in the Z-axis direction. [Figure 5] FIG. 4 is an enlarged cross-sectional view of the cooling channel and its vicinity in FIG. 3. [Figure 6] FIG. 10 is a schematic cross-sectional view showing a cooling device according to a comparative example. [Figure 7] FIG. 10 is a schematic cross-sectional view showing a cooling device according to a comparative example. [Figure 8] FIG. 10 is a schematic cross-sectional view showing a cooling device according to a comparative example. DETAILED DESCRIPTION OF THE INVENTION

[0015] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

[0016] Fig. 1 is a schematic cross-sectional view showing a cooling device according to an embodiment of the present invention. As shown in Fig. 1, the cooling device 100 is arranged so as to be joined to a semiconductor module 1 so as to be capable of transferring heat therebetween, and is a device for cooling the semiconductor module 1. The cooling device 100 is applied to electronic devices, power electronics devices, etc. The semiconductor module 1 is, for example, a power semiconductor module that constitutes a power converter having functions such as an inverter that converts direct current to alternating current, a converter that converts alternating current to direct current, and frequency conversion.

[0017] The cooling device 100 is provided with a cooling channel 10 through which a cooling fluid CW flows, and cools a semiconductor module 1 with the cooling fluid CW. In the following description, an XYZ coordinate system may be used. The Y-axis direction (second direction) is perpendicular to the X-axis direction (third direction). The Z-axis direction (first direction) is perpendicular to the X-axis direction and the Y-axis direction. The cooling device 100 includes a main body 2 and a base member 3. The main body 2 is a housing having a cooling channel 10 formed therein. The main body 2 includes a cooling unit 4 that cools the semiconductor module 1, an inlet 6 that supplies the cooling fluid CW to the cooling unit 4, and an outlet 7 that discharges the cooling fluid CW from the cooling unit 4. The cooling channel 10 is formed inside the cooling unit 4. The cooling channel 10 extends in the Y-axis direction. The main body 2 is a member formed by casting. The material of the main body 2 is a material used in casting, and cast iron, steel, aluminum, zinc, magnesium, etc. may be used.

[0018] The cooling section 4 has an opening 13 where the cooling flow path 10 opens on the positive side in the Z-axis direction. The cooling flow path 10 is formed by blocking the opening 13 of the cooling section 4 with the base member 3. The base member 3 is a member to which the semiconductor module 1 is connected and which exchanges heat with the cooling fluid CW. The base member 3 is a flat plate-shaped member. The surface of the base member 3 facing the cooling flow path 10 is flat and does not have any protrusions such as fins. The outer surface of the base member 3 is also flat. The semiconductor module 1 is connected to the outer surface of the base member 3.

[0019] The inlet section 6 is provided on the negative side of the cooling section 4 in the Y-axis direction. The outlet section 7 is provided on the positive side of the cooling section 4 in the Y-axis direction. An inlet flow path 11 that communicates with the cooling flow path 10 is formed inside the cooling section 4. An outlet flow path 12 that communicates with the cooling flow path 10 is formed inside the outlet section 7. As a result, the cooling fluid CW that has flowed through the inlet flow path 11 is supplied to the cooling flow path 10. The cooling fluid CW flows inside the cooling flow path 10 from the negative side to the positive side in the Y-axis direction. At this time, the cooling fluid CW cools the base member 3. As a result, the semiconductor module 1 can dissipate heat to the base member 3. The cooling fluid CW that has flowed through the cooling flow path 10 is discharged from the outlet flow path 12.

[0020] The cooling section 4 of the main body 2 includes a bottom wall 20. The bottom wall 20 is disposed opposite the base member 3 at a distance in the Z-axis direction, and forms a cooling flow path 10 between the base member 3 and the bottom wall 20. The bottom wall 20 is disposed at a position spaced apart from the base member 3 on the negative side in the Z-axis direction. The bottom wall 20 has a bottom surface 20a extending along the XY plane. The bottom surface 20a of the bottom wall 20 is provided with a plurality of first protrusions 30 that protrude toward the base member 3 in the Z-axis direction (the positive side in the Z-axis direction). The first protrusions 30 are components that generate turbulent flow of the cooling fluid CW within the cooling flow path 10. A detailed description of the first protrusions 30 will be given later.

[0021] Next, an example of a specific structure of the cooling device 100 will be described with reference to FIGS. 2 to 5. Note that the semiconductor module 1 is omitted from FIGS. 2 to 5. FIG. 2 is a perspective view of the cooling device 100. As shown in FIG. 2, the main body 2 of the cooling device 100 has two cooling sections 4A and 4B. The main body 2 has a rectangular parallelepiped shape extending in the Y-axis direction. The main body 2 has an inlet section 6A and an outlet section 7A for the upstream cooling section 4A. The main body 2 has an inlet section 6B and an outlet section 7B for the downstream cooling section 4B. The upstream cooling section 4A is provided at a position spaced from the downstream cooling section 4B on the negative side in the Y-axis direction. The upstream outlet section 7A and the downstream inlet section 6B are connected via a connection section 5.

[0022] Groove portions 40 constituting the flow path 10 are formed on the upper surface 2a on the positive side of the Z axis direction of the main body 2 at positions corresponding to the cooling portions 4A and 4B. When viewed from the Z axis direction, the groove portions 40 have a rectangular shape extending in the Y axis direction. The groove portions 40 are recessed a predetermined distance from the upper surface 2a toward the negative side of the Z axis direction. The groove portions 40 of the cooling portion 4A are blocked from the positive side in the Z axis direction by the base member 3A. The groove portions 40 of the cooling portion 4B are blocked from the positive side in the Z axis direction by the base member 3B. The base members 3A and 3B are rectangular plate-like members extending along the XY plane. The base members 3A and 3B are fixed to the upper surface 2a of the main body 2 in a sealed state. In FIG. 2, the upstream side of the base member 3 is open.

[0023] The cooling units 4A and 4B include the aforementioned bottom wall 20, side wall portions 21 and 22 opposed to each other in the X-axis direction, and side wall portions 23 and 24 opposed to each other in the Y-axis direction. The side wall portions 21 and 22 extend from an edge of the bottom wall 20 in the X-axis direction toward the base members 3A and 3B (positive side in the Z-axis direction). The side wall portions 21 and 22 also extend along the Y-axis direction along which the cooling fluid CW flows. The side wall portion 21 is disposed on the negative side in the X-axis direction. The side wall portion 22 is disposed on the positive side in the X-axis direction. The side wall portions 23 and 24 extend from an edge of the bottom wall 20 in the Y-axis direction toward the base members 3A and 3B (positive side in the Z-axis direction). The side wall portions 23 and 24 also extend along the X-axis direction. The side wall portion 23 is disposed on the negative side in the Y-axis direction. The side wall portion 24 is disposed on the positive side in the Y-axis direction. The cooling flow path 10 of the cooling unit 4A is defined by a space surrounded by the base member 3A and the walls 20, 21, 22, 23, and 24. The cooling flow path 10 of the cooling unit 4B is defined by a space surrounded by the base member 3B and the walls 20, 21, 22, 23, and 24.

[0024] Fig. 3 is a cross-sectional view taken along line III-III in Fig. 2. Fig. 3 shows the cross-sectional structures of the downstream cooling section 4B, inlet section 6B, and outlet section 7B. When a reference plane parallel to the XZ plane is set at the center position of the cooling device 100 in the Y-axis direction, the upstream cooling section 4A, inlet section 6A, and outlet section 7A have a configuration that is plane-symmetrical to the downstream cooling section 4B, inlet section 6B, and outlet section 7B. Therefore, a description of the upstream cooling section 4A, inlet section 6A, and outlet section 7A will be omitted.

[0025] In the cooling unit 4B, the inlet flow path 11 of the inlet portion 6B extends from the edge on the negative side in the Y-axis direction of the cooling flow path 10 toward the negative side in the Z-axis direction. The end of the inlet flow path 11 on the negative side in the Z-axis direction is connected to the connection flow path 14 of the connection portion 5. The connection flow path 14 extends in the Y-axis direction and is connected to the outlet flow path 12 of the outlet portion 7A on the upstream side and the inlet flow path 11 of the inlet portion 6B on the downstream side.

[0026] In the cooling section 4B, the outlet flow path 12 of the outlet section 7B has a vertical portion 12a and a horizontal portion 12b. The vertical portion 12a extends from the edge on the positive side in the Y-axis direction of the cooling flow path 10 toward the negative side in the Z-axis direction. The horizontal portion 12b bends from the end of the vertical portion 12a on the negative side in the Z-axis direction and extends horizontally toward the positive side in the Y-axis direction.

[0027] As shown in FIG. 2 , the multiple first protrusions 30 are formed in the groove 40 over substantially the entire area in the Y-axis direction and substantially the entire area in the X-axis direction. The multiple first protrusions 30 are arranged in the groove 40 at a predetermined pitch from a position adjacent to the side wall 21 on the negative side in the X-axis direction to a position adjacent to the side wall 22 on the positive side in the X-axis direction. The multiple first protrusions 30 are arranged in the groove 40 at a predetermined pitch from a position adjacent to the opening of the inlet flow channel 11 on the negative side in the Y-axis direction to a position adjacent to the opening of the outlet flow channel 12 on the positive side in the Y-axis direction. The pitches in the X-axis direction and the Y-axis direction are not particularly limited and may be set to any value corresponding to various parameters.

[0028] Furthermore, a second protrusion 35 that protrudes into the cooling flow path 10 in the X-axis direction is provided on the side surface of the side wall 21 on the negative side in the X-axis direction. A second protrusion 35 that protrudes into the cooling flow path 10 in the X-axis direction is provided on the side surface of the side wall 22 on the positive side in the X-axis direction. The second protrusion 35 has a shape that protrudes from the bottom surface 20a toward the positive side in the Z-axis direction. These second protrusions 35 are arranged at a predetermined pitch along each side wall 21, 22, from a position close to the opening of the inlet flow path 11 on the negative side in the Y-axis direction to a position close to the opening of the outlet flow path 12 on the positive side in the Y-axis direction.

[0029] The first protrusion 30 and the second protrusion 35 will be described in detail with reference to Figures 4 and 5. Figure 4 is a view showing the internal structure of the groove 40 as viewed from the positive side to the negative side in the Z-axis direction. Figure 5 is an enlarged cross-sectional view of the cooling channel 10 and its vicinity in Figure 3.

[0030] As shown in FIG. 4, the multiple first protrusions 30 are arranged side by side in the X-axis direction. Furthermore, multiple rows of such multiple first protrusions 30 are provided in the Y-axis direction. Furthermore, the multiple first protrusions 30 in an array are arranged in a staggered pattern relative to the multiple first protrusions 30 in other arrays adjacent to them in the Y-axis direction. In each array, the multiple first protrusions 30 are arranged at equal pitches in the X-axis direction. The pitches in the X-axis direction in each array are equal to each other. Each array is arranged at equal pitches in the Y-axis direction.

[0031] For example, the arrays shown in FIG. 4 are arrays AL1, AL2, AL3, AL4, and AL5. Each first protrusion 30 in array AL1 is arranged at the same position in the X-axis direction as each first protrusion 30 in arrays AL3 and AL5. Each first protrusion 30 in array AL2 is arranged at the same position in the X-axis direction as each first protrusion 30 in array AL4. Each first protrusion 30 in arrays AL1, AL3, and AL5 is arranged at a position offset in the X-axis direction from each first protrusion 30 in arrays AL2 and AL4. Each first protrusion 30 in arrays AL1, AL3, and AL5 is arranged at a position offset by half a pitch in the X-axis direction from each first protrusion 30 in arrays AL2 and AL4. When focusing on the first protrusions 30A arranged on the most negative side in the X-axis direction, the first protrusions 30A in the arrays AL2 and AL4 are farther away from the side surface 21a than the first protrusions 30A in the arrays AL1, AL3, and AL5. Therefore, second protrusions 35 are provided at positions corresponding to the arrays AL2 and AL3.

[0032] Next, the shapes of the first protrusion 30 and the second protrusion 35 will be described. As shown in FIG. 4, the first protrusion 30 has an elliptical shape extending with a major axis in the Y-axis direction when viewed from the Z-axis direction. The first protrusion 30 has an elliptical cylindrical shape that protrudes from the bottom surface 20a toward the positive side in the Z-axis direction with a substantially constant cross-sectional shape (see also FIG. 5). Therefore, the first protrusion 30 has a side surface 31 and a tip surface 32. The side surface 31 has an elliptical shape when viewed from the Z-axis direction. The dimension of the ellipse of the side surface 31 in the Y-axis direction when viewed from the Z-axis direction, i.e., the dimension of the long side, is not limited and may be set to any value corresponding to various parameters. The dimension of the ellipse of the side surface 31 in the X-axis direction when viewed from the Z-axis direction, i.e., the dimension of the short side, is not limited and may be set to any value corresponding to various parameters. The second protrusion 35 has a shape that extends from the side surface 21a in the X-axis direction and has a semicircular tip when viewed from the Z-axis direction.

[0033] As shown in FIG. 5, the height H2 of the first protrusion 30 in the Z-axis direction may be equal to or greater than half the height H1 of the cooling flow path 10 in the Z-axis direction. More preferably, the height H2 of the first protrusion 30 in the Z-axis direction may be arbitrarily set in relation to the height H1 of the cooling flow path 10 in the Z-axis direction so that a minute gap is provided between the lower surface 3a and the tip surface 32. A gap is formed between the tip surface 32 of the first protrusion 30 and the lower surface 3a of the base member 3B, allowing the cooling fluid CW to pass through. The height of the second protrusion 35 in the Z-axis direction may be the same as that of the first protrusion 30. The heights of all the protrusions 30, 35 in the groove 40 do not need to be the same; the heights may vary depending on the location.

[0034] The first protrusions 30 each have a first fillet 33 at a corner between the bottom wall 20 and the first protrusion 30. The first fillet 33 is formed by rounding the corner between the side surface 31 of the first protrusion 30 and the bottom surface 20a of the bottom wall 20. The first fillet 33 has a curved shape that is recessed inward. The edge of the first fillet 33 on the bottom surface 20a is referred to as the "edge EG." The edge EG is the starting point where the curvature of the first fillet 33 begins from the bottom surface 20a, which is parallel to the XY plane. The first protrusion 30 has a second fillet 34 at a corner between the side surface 31 extending in the Z-axis direction and the tip surface 32. The second fillet 34 is formed by rounding the corner between the side surface 31 of the first protrusion 30 and the tip surface 32. The second fillet 34 has a curved shape that protrudes outward. The sizes of the fillets 33, 34 are not particularly limited and may be set to, for example, R2, but may be adjusted appropriately depending on various parameters. The second protrusion 35 also has a fillet similar to the first fillet 33 and the second fillet 34. In addition, the second protrusion 35 has a third fillet 36 between it and the side surface 21a of the side wall 21 (see FIG. 4).

[0035] The first fillet 33 of one first protrusion 30 is spaced apart from the first fillet 33 of an adjacent first protrusion 30 on the bottom surface 20a. That is, when a certain first protrusion 30 is used as a reference, there are other first protrusions 30 adjacent to the reference first protrusion 30 on both sides in the X-axis direction and on both sides in the Y-axis direction. The first fillet 33 of the reference first protrusion 30 is not in contact with any of the first fillets 33 of the other adjacent first protrusions 30, and is spaced apart in the XY plane. Note that in this embodiment, since a staggered arrangement is employed, two first protrusions 30 are adjacent to the reference first protrusion 30 on one side in the Y-axis direction. Specifically, a planar bottom surface 20a is interposed between the edge portion EG of the first fillet 33 of one first protrusion 30 and the edge portion EG of the first fillet 33 of another first protrusion 30.

[0036] Next, the operation and effect of the cooling device 100 according to this embodiment will be described.

[0037] First, comparative cooling devices 200 and 300 are described. The comparative cooling device 200 shown in FIG. 6 has a base member 3 with a heat dissipation member 130 formed on its underside. This cooling device 200 requires a heat dissipation member on the underside of the heat dissipation member water channel cover of the base member 3, resulting in increased component costs for the semiconductor module. When the semiconductor module 1 does not require a heat dissipation member 130, the comparative cooling device 300 shown in FIG. 7 can be used. The cooling device 300 employs an indirect cooling system in which a heat dissipation member 120, such as thermal grease, is provided on the upper surface of the main body 2, and the base member 3 and semiconductor module 1 are mounted on top of the heat dissipation member 120. Because the cooling device 300 indirectly dissipates heat to the cooling fluid CW, its cooling performance is inferior to that of the cooling device 200. Even when a direct cooling system-based comparative cooling device 400 shown in FIG. 8 is used, its cooling performance is inferior to that of the cooling device 200 because it does not have a fin-shaped heat dissipation member.

[0038] On the other hand, the cooling device 100 according to this embodiment includes a base member 3 to which the semiconductor module 1 is connected and which exchanges heat with the cooling fluid CW, and a bottom wall portion 20 disposed opposite the base member 3 and spaced apart in the Z-axis direction, forming a cooling flow path 10 between the base member 3 and the bottom wall portion 20. The cooling device 100 can cool the semiconductor module 1 via the base member 3 by flowing the cooling fluid CW through the cooling flow path 10. A bottom surface 20a of the bottom wall portion 20 is provided with a plurality of first protrusions 30 that protrude toward the base member 3 in the Z-axis direction. Within the cooling flow path 10, turbulence occurs in the cooling fluid CW due to the influence of the first protrusions 30. This makes it easier for the cooling fluid CW to hit the base member 3, enabling efficient cooling of the semiconductor module 1. The plurality of first protrusions 30 have first fillets 33 at corners between the base member 20 and the bottom wall portion 20, and the bottom wall portion 20 and the first protrusions 30 are formed by casting. The first fillet 33 of the first protrusion 30 is spaced apart from the first fillet 33 of the adjacent first protrusion 30 on the bottom surface 20a. This allows for good casting. As a result, costs can be reduced and cooling performance can be ensured.

[0039] The cooling fluid CW further has a side wall 21 extending from an edge of the bottom wall 20 toward the base member 3B side and extending along the Y-axis direction through which the cooling fluid CW flows, and second protrusions 35 may be provided on the side surfaces of the side walls 21, 22, protruding into the cooling flow path 10 in the X-axis direction intersecting the Z-axis and Y-axis directions. In this case, turbulence can be generated in the cooling fluid CW even near the side surface, and the cooling fluid CW can be directed from the side toward the next-stage first protrusion 30 to concentrate the flow, thereby improving cooling efficiency.

[0040] The height H2 in the Z-axis direction of the first protrusion 30 may be equal to or greater than half the height H1 in the Z-axis direction of the cooling flow path 10. In this case, turbulence can be generated in the cooling fluid CW near the base member 3.

[0041] The first protrusions 30 may be arranged side by side in the Z-axis direction and the X-axis direction intersecting the Y-axis direction along which the cooling fluid CW flows. The arrays may be arranged in multiple rows along the Y-axis direction, and the first protrusions 30 in one array may be arranged in a staggered pattern relative to the first protrusions 30 in another array adjacent to the first protrusions 30 in the Y-axis direction. In this case, the cooling fluid CW flowing in the Y-axis direction within the cooling flow channel 10 can be regulated by the staggered first protrusions 30, thereby effectively cooling the base member 3. For example, as shown in FIG. 4 , the flow of the cooling fluid CW flowing between a pair of first protrusions 30 in array AL1 collides with the first protrusions 30 in array AL2, branches into two directions, and flows toward the first protrusions 30 in array AL3.

[0042] The first protrusion 30 may have a second fillet 34 at the corner between the side surface 31 extending in the Z-axis direction and the tip surface 32. In this case, the turbulent flow of the cooling fluid CW can be smoothly passed through the gap between the tip surface 32 and the base member 3.

[0043] When viewed from the Z-axis direction, the first protrusion 30 may have an elliptical shape extending in the Y-axis direction, along which the cooling fluid CW flows. Compared to a circular shape with the same minor axis, an elliptical shape extending in the Y-axis direction does not obstruct the cooling fluid, thereby contributing to reducing pressure loss. Furthermore, compared to a circular shape with the same minor axis, an elliptical shape extending in the Y-axis direction allows a larger amount of cooling fluid CW to be applied to the underside 3a of the base member 3. Furthermore, compared to a circular shape with the same minor axis, an elliptical shape extending in the Y-axis direction can generate more turbulence by providing fillets (first fillet 33, second fillet 34) around the base and tip.

[0044] The present invention is not limited to the above-described embodiments.

[0045] In the above-described embodiment, the first protrusion has an elliptical shape when viewed in the Z-axis direction, but the shape is not particularly limited. For example, the first protrusion may have a circular or diamond shape when viewed in the Z-axis direction.

[0046] [Form 1] A cooling device for a semiconductor module, the cooling device being disposed so as to be joined to the semiconductor module in a heat transferable manner and having a cooling flow path through which a cooling fluid flows, a base member to which the semiconductor module is connected and which exchanges heat with the cooling fluid; a bottom wall portion that is disposed so as to face the base member and spaced apart in a first direction, and that forms the cooling flow path between the base member and the bottom wall portion; a plurality of first protrusions are provided on a bottom surface of the bottom wall portion, the first protrusions protruding toward the base member in the first direction; the plurality of first protrusions have first fillets at corners between the first protrusions and the bottom wall portion; The cooling device, wherein the first fillet of the first protrusion is spaced apart from the first fillet of an adjacent first protrusion on the bottom surface. [Form 2] a sidewall portion extending from an edge of the bottom wall portion toward the base member and extending along a second direction in which the cooling fluid flows; A cooling device as described in embodiment 1, wherein a second protrusion is provided on a side surface of the side wall portion, protruding into the cooling flow path in a third direction intersecting the first direction and the second direction. [Form 3] 3. The cooling device according to claim 1, wherein the height of the first protrusion in the first direction is equal to or greater than half the height of the cooling flow path in the first direction. [Form 4] the plurality of first protrusions are arranged so as to line up in the first direction and a third direction intersecting the second direction in which the cooling fluid flows, and the arrangement is provided in a plurality of rows in the second direction; The cooling structure device according to any one of the first to third aspects, wherein the plurality of first protrusions in the array are arranged in a staggered pattern relative to the plurality of first protrusions in other arrays adjacent to the array in the second direction. [Form 5] 5. The cooling device according to any one of aspects 1 to 4, wherein the first protrusion has a second fillet at a corner between a side surface extending in the first direction and a tip surface. [Form 6] 6. The cooling device according to any one of aspects 1 to 5, wherein the first protrusion has an elliptical shape extending in a second direction in which the cooling fluid flows, when viewed from the first direction. [Explanation of symbols]

[0047] 1...semiconductor module, 3...base member, 10...cooling flow path, 20...bottom wall portion, 20a...bottom surface, 21, 22...side wall portion, 30...first protrusion portion, 32...upper surface, 33...first fillet, 34...second fillet, 35...second protrusion portion, 100...cooling device.

Claims

1. A cooling device for a semiconductor module, the cooling device being disposed so as to be joined to the semiconductor module in a heat transferable manner and having a cooling flow path through which a cooling fluid flows, a base member to which the semiconductor module is connected and which exchanges heat with the cooling fluid; a bottom wall portion that is disposed so as to face the base member and spaced apart in the first direction, and that defines the cooling flow path between the base member and the bottom wall portion; a plurality of first protrusions are provided on a bottom surface of the bottom wall portion, the first protrusions protruding toward the base member in the first direction; the plurality of first protrusions have first fillets at corners between the first protrusions and the bottom wall portion; The cooling device, wherein the first fillet of the first protrusion is spaced apart from the first fillet of an adjacent first protrusion on the bottom surface.

2. a sidewall portion extending from an edge of the bottom wall portion toward the base member and extending along a second direction in which the cooling fluid flows; The cooling device according to claim 1 , wherein a second protrusion is provided on a side surface of the side wall portion, protruding into the cooling flow path in a third direction intersecting the first direction and the second direction.

3. The cooling device according to claim 1 , wherein a height of the first protrusion in the first direction is equal to or greater than half a height of the cooling channel in the first direction.

4. the plurality of first protrusions are arranged so as to line up in the first direction and a third direction intersecting the second direction in which the cooling fluid flows, and the arrangement is provided in a plurality of rows in the second direction; The cooling device according to claim 1 , wherein the plurality of first protrusions in the array are arranged in a staggered pattern relative to the plurality of first protrusions in other arrays adjacent to each other in the second direction.

5. The cooling device according to claim 1 , wherein the first protrusion has a second fillet at a corner between a side surface extending in the first direction and a tip surface.

6. The cooling device according to claim 1 , wherein the first protrusion has an elliptical shape extending in a second direction in which the cooling fluid flows when viewed from the first direction.

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