Electronic device

Abstract

To provide an electronic device which can suppress deformation of a lead frame.SOLUTION: An electronic device A1 includes a first electronic component 51, a sealing resin 7, and a first lead 1 including a first inner part 12 and a first outer part 11. The first inner part 12 includes a first die pad part 14 mounted with the first electronic component 51, and a first connection part 13 for connecting the first outer part 11 and the first die pad part 14. The first outer part 11 is positioned on an x1 side in a first direction x to the first die pad part 14. In a second direction y, the center of the first outer part 11 is positioned to a side closer to a y1 side in the second direction y than the center of the first die pad part 14. When being viewed in a thickness direction z, a first distance D1 between a first end 114a on a x2 side in the first direction x in a first cut mark 114 of the first outer part 11 and a first angle part 149a of the first die pad part 14 is equal to or less 10.8 times a first length L1 in the second direction y of the first outer part 11.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present disclosure relates to electronic devices. [Background technology]

[0002] Conventionally, semiconductor devices manufactured using lead frames are known as one type of electronic device. An example of such a semiconductor device is described in Patent Document 1. The semiconductor device described in this document is surface-mounted on a wiring board of an inverter device and includes a first semiconductor element, a conductive support member, and a sealing resin. The conductive support member is formed from a single lead frame. The conductive support member includes a first die pad and multiple input terminals. The first semiconductor element is mounted on the first die pad. Some of the multiple input terminals are connected to the first die pad.

[0003] Some conventional electronic devices, such as the semiconductor device described in Patent Document 1, have electronic components mounted on a lead frame. To improve reliability, such electronic devices require, for example, suppression of lead frame deformation. If the lead frame were to deform and the position of the die pad (the portion on which the electronic component is mounted) were to change, this would impede the bonding between the electronic component and the die pad. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 2022-55599

[0005] [overview] The present disclosure has been made in light of the above circumstances, and a main object of the present disclosure is to provide an electronic device that can suppress deformation of a lead frame.

[0006] An electronic device provided by the present disclosure includes a first electronic component, a sealing resin covering the first electronic component, and a first lead including a first inner part covered by the sealing resin and a first outer part exposed from the sealing resin, wherein the first inner part includes a first die pad part on which the first electronic component is mounted and a first connecting part connecting the first outer part and the first die pad part, and the first outer part is located on one side of the first die pad part in a first direction perpendicular to a thickness direction of the first electronic component, and is The center of the first outer part is located at the same position as the center of the first die pad part or on one side of the center of the first die pad part in the second direction, the first die pad part is rectangular when viewed in the thickness direction and has a first corner portion located on the other side in the first direction and the other side in the second direction, the first outer part has a first cut mark facing the other side in the second direction, and a first distance from a first end of the first cut mark on the other side in the first direction to the first corner portion when viewed in the thickness direction is 10.8 times or less the first length of the first outer part in the second direction.

[0007] Other features and advantages of the present disclosure will become more apparent from the following detailed description taken in conjunction with the accompanying drawings. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a plan view showing an electronic device according to a first embodiment of the present disclosure. [Figure 2] FIG. 2 is a diagram showing the sealing resin in the plan view of FIG. 1 by using imaginary lines. [Figure 3] FIG. 3 is a partially enlarged plan view of a part of FIG. [Figure 4] FIG. 4 is a partially enlarged plan view of a part of FIG. [Figure 5] FIG. 5 is a front view showing the electronic device according to the first embodiment of the present disclosure. [Figure 6] FIG. 6 is a rear view showing the electronic device according to the first embodiment of the present disclosure. [Figure 7] FIG. 7 is a left side view showing the electronic device according to the first embodiment of the present disclosure. [Figure 8] FIG. 8 is a right side view showing the electronic device according to the first embodiment of the present disclosure. [Figure 9] FIG. 9 is a cross-sectional view taken along line IX-IX in FIG. [Figure 10] FIG. 10 is a cross-sectional view taken along line XX in FIG. [Figure 11] FIG. 11 is a circuit configuration diagram of the electronic device according to the first embodiment of the present disclosure. [Figure 12] FIG. 12 is a plan view showing a step in the manufacture of the electronic device according to the first embodiment of the present disclosure. [Figure 13] FIG. 13 is a plan view showing an electronic device according to the second embodiment of the present disclosure, in which the sealing resin is indicated by imaginary lines. [Figure 14] FIG. 14 is a partially enlarged plan view of a part of FIG. [Figure 15] FIG. 15 is a partially enlarged plan view of a part of FIG. [Figure 16] FIG. 16 is a front view showing an electronic device according to the second embodiment of the present disclosure. [Figure 17] FIG. 17 is a rear view showing the electronic device according to the second embodiment of the present disclosure. [Figure 18] FIG. 18 is a plan view showing an electronic device according to a modified example of the second embodiment, in which the sealing resin is shown by imaginary lines. [Figure 19] FIG. 19 is a partially enlarged plan view of a part of FIG. [Figure 20] FIG. 20 is a partially enlarged plan view of a part of FIG. [Figure 21] FIG. 21 is a front view showing an electronic device according to a modified example of the second embodiment. [Figure 22] FIG. 22 is a rear view showing an electronic device according to a modified example of the second embodiment. [Figure 23]FIG. 23 is a plan view showing an electronic device according to a third embodiment of the present disclosure, in which the sealing resin is indicated by imaginary lines. [Figure 24] FIG. 24 is a partially enlarged plan view of a part of FIG. [Figure 25] FIG. 25 is a partially enlarged plan view of a part of FIG. [Figure 26] FIG. 26 is a front view showing an electronic device according to a third embodiment of the present disclosure. [Figure 27] FIG. 27 is a rear view showing the electronic device according to the third embodiment of the present disclosure.

[0009] [Detailed explanation] Preferred embodiments of the present disclosure will now be described in detail with reference to the drawings.

[0010] Terms such as "first," "second," and "third" in this disclosure are used merely as labels and are not necessarily intended to dictate any ordering of their objects.

[0011] In this disclosure, unless otherwise specified, "a certain object A is formed on a certain object B" and "a certain object A is formed on (an object) B" include "a certain object A is formed directly on a certain object B" and "a certain object A is formed on a certain object B with another object interposed between the certain object A and the certain object B." Similarly, "a certain object A is disposed on a certain object B" and "a certain object A is disposed on (an object) B" include "a certain object A is disposed directly on a certain object B" and "a certain object A is disposed on a certain object B with another object interposed between the certain object A and the certain object B" unless otherwise specified. Similarly, "a certain object A is located on (an object) B" includes "a certain object A is in contact with a certain object B and is located on (an object) B" and "a certain object A is located on (an object) B with another object interposed between the certain object A and the certain object B." Furthermore, unless otherwise specified, the phrase "object A overlaps object B when viewed in a certain direction" includes "object A overlaps the entire object B" and "object A overlaps a part of object B." Furthermore, the phrase "object A (its material) contains material C" includes "object A (its material) is made of material C" and "object A (its material) is mainly composed of material C." Furthermore, in this disclosure, the phrase "a surface A faces direction B (on one side or the other side of direction B)" is not limited to the case where surface A is at an angle of 90° to direction B, but also includes the case where surface A is tilted with respect to direction B.

[0012] First Embodiment 1 to 13 illustrate an electronic device according to a first embodiment of the present disclosure. The electronic device A1 of this embodiment includes a first lead 1, a second lead 2, a third lead 3, multiple fourth leads 4, a first electronic component 51, a second electronic component 52, multiple connecting members 61 to 66, and a sealing resin 7. In the illustrated example, the electronic device A1 includes 12 fourth leads 4, but the number of fourth leads 4 is not limited thereto. The specific use of the electronic device A1 is not limited thereto, but may be used to detect the battery voltage of an electric vehicle, for example. The electronic device A1 does not necessarily detect the battery voltage of an electric vehicle, but may instead detect a voltage other than that of the electric vehicle, or may detect a voltage used in industrial equipment, home appliances, power supplies, or the like. The electronic device A1 is a surface-mount semiconductor package, and in this embodiment, it is a small outline package (SOP) type, as shown in FIGS. 1 and 5 to 8.

[0013] For ease of explanation, the following will refer to the thickness direction z, the first direction x, and the second direction y, which are perpendicular to each other. The thickness direction z corresponds to the thickness direction of the electronic device A1 (first electronic component 51). Furthermore, "plan view" refers to the view in the thickness direction z. The first direction x is perpendicular to the thickness direction z. The second direction y is perpendicular to the thickness direction z and the first direction x. One side of the first direction x is referred to as the x1 side of the first direction x, and the other side of the first direction x is referred to as the x2 side of the first direction x. Furthermore, one side of the second direction y is referred to as the y1 side of the second direction y, and the other side of the second direction y is referred to as the y2 side of the second direction y. Furthermore, one side of the thickness direction z is referred to as the z1 side of the thickness direction z, and the other side of the thickness direction z is referred to as the z2 side of the thickness direction z. Furthermore, the z2 side of the thickness direction z is sometimes referred to as the upper side, and the z1 side of the thickness direction z is sometimes referred to as the lower side. Note that terms such as "top," "bottom," "upper," "lower," "top surface," and "bottom surface" indicate the relative positional relationship of each part in the thickness direction z, and do not necessarily define the relationship with the direction of gravity.

[0014] The first lead 1, the second lead 2, the third lead 3, and the multiple fourth leads 4 include metals such as Cu (copper), Ni (nickel), and Fe (iron). The first lead 1, the second lead 2, the third lead 3, and the multiple fourth leads 4 are formed from the same lead frame (lead frame 9, described below). The metal material constituting the lead frame 9 can be, for example, a Cu-Sn (tin) alloy or an Fe-Ni alloy such as 42 alloy. The first lead 1, the second lead 2, the third lead 3, and the multiple fourth leads 4 are formed, for example, by processing a metal plate material selected from punching, bending, etching, and the like. Furthermore, a plating layer made of Ag (silver), Ni, Au (gold), or the like may be provided at appropriate locations on each of the first lead 1, the second lead 2, the third lead 3, and the multiple fourth leads 4, as needed.

[0015] The first lead 1, the second lead 2, the third lead 3, and the multiple fourth leads 4 are electrically connected to the first electronic component 51 or the second electronic component 52, and form a conductive path in the electronic device A1. The first lead 1, the second lead 2, the third lead 3, and the multiple fourth leads 4 are spaced apart from one another. The first lead 1, the second lead 2, the third lead 3, and the multiple fourth leads 4 each have a portion covered with the sealing resin 7 and a portion exposed from the sealing resin 7.

[0016] The first lead 1 includes a first outer portion 11 and a first inner portion 12. The first outer portion 11 and the first inner portion 12 are connected to each other and formed integrally. The boundary between the first outer portion 11 and the first inner portion 12 overlaps the periphery of the sealing resin 7 in a plan view.

[0017] The first outer portion 11 is a portion of the first lead 1 that is exposed from the sealing resin 7. The first outer portion 11 protrudes from the sealing resin 7 toward the x1 side in the first direction x. The first outer portion 11 has a rectangular shape with the first direction x as the longitudinal direction in a plan view. The first outer portion 11 is bent in a gull-wing shape when viewed in the second direction y. A first length L1 (see FIG. 3) of the first outer portion 11 in the second direction y is not limited in any way, but is, for example, 0.1 mm or more and 1.5 mm or less. The first outer portion 11 includes a first mounting portion 111, a first root portion 112, and a first relay portion 113.

[0018] The first mounting portion 111 is a tip portion of the first outer portion 11. The first mounting portion 111 is a portion that is joined to the circuit board when the electronic device A1 is mounted on the circuit board. As shown in FIGS. 1 and 2, the first mounting portion 111 is located at the end opposite the sealing resin 7 in the first direction x. Therefore, the first mounting portion 111 is located farther from the sealing resin 7 in the first direction x than the first root portion 112 and the first relay portion 113. The first mounting portion 111 is located lower in the thickness direction z than the first root portion 112.

[0019] The first root portion 112 is a root portion of the first outer portion 11. As shown in FIGS. 1 and 2, the first root portion 112 is located at the end of the first outer portion 11 that is closer to the sealing resin 7 in the first direction x. Therefore, the first root portion 112 is located closer to the sealing resin 7 in the first direction x than the first mounting portion 111 and the first relay portion 113. The first root portion 112 is located higher in the thickness direction z than the first mounting portion 111 and protrudes from the center of the sealing resin 7 in the thickness direction z.

[0020] The first relay portion 113 connects the first mounting portion 111 and the first root portion 112. When viewed in the second direction y, the first relay portion 113 is inclined with respect to the first mounting portion 111 and the first root portion 112. In this embodiment, the first relay portion 113 is inclined with respect to the thickness direction z.

[0021] In this embodiment, the first outer portion 11 has a first cut mark 114. The first cut mark 114 is a mark left by cutting a portion of the lead frame 9 when the first outer portion 11 is formed from the lead frame 9 (described later). The first cut mark 114 faces the y2 side in the second direction y and is formed across the first root portion 112 and the first relay portion 113 (see FIG. 10 ). The first cut mark 114 has a surface rougher than other portions of the first outer portion 11. The first cut mark 114 also protrudes slightly toward the y2 side in the second direction y beyond the other surface of the first outer portion 11 facing the y2 side in the second direction y. In the drawings, the protrusion of the portion of the first cut mark 114 toward the y2 side in the second direction y is exaggerated.

[0022] The first inner portion 12 is a portion of the first lead 1 that is covered with the sealing resin 7. The first inner portion 12 extends from the first outer portion 11 inward of the sealing resin 7. The first inner portion 12 includes a first connecting portion 13 and a first die pad portion 14.

[0023] The first connecting portion 13 extends from the first outer portion 11 inward of the sealing resin 7. The first connecting portion 13 is connected to the first die pad portion 14. Therefore, the first connecting portion 13 connects the first inner portion 12 and the first die pad portion 14 together.

[0024] The first die pad portion 14 has a first electronic component 51 mounted thereon and supports the first electronic component 51. A first connecting portion 13 is connected to the first die pad portion 14 and is supported by the first connecting portion 13. The first die pad portion 14 is located on the x2 side of the first outer portion 11 in the first direction x. Therefore, the first outer portion 11 is located on the x1 side of the first die pad portion 14 in the first direction x. Furthermore, the center of the first die pad portion 14 in the second direction y is located closer to the y2 side in the second direction y than the center of the first outer portion 11 in the second direction y. Therefore, in the second direction y, the center of the first outer portion 11 is located closer to the y1 side in the second direction y than the center of the first die pad portion 14. In this embodiment, as shown in FIG. 2 , the first root portion 112 does not entirely overlap the first die pad portion 14 when viewed in the first direction x. Therefore, the first outer portion 11 is disposed outward (toward the y1 side in the second direction y) from the first die pad portion 14 in the second direction y. Alternatively, a portion of the first root portion 112 may overlap the first die pad portion 14 as viewed in the first direction x. Alternatively, the entire first root portion 112 may overlap the first die pad portion 14 as viewed in the first direction x. The first die pad portion 14 has a main surface 141, a back surface 142, a first side surface 143, and a second side surface 144.

[0025] The main surface 141 and the back surface 142 are spaced apart in the thickness direction z. The main surface 141 faces upward in the thickness direction z, and the back surface 142 faces downward in the thickness direction z. The first side surface 143 is connected to the main surface 141 and the back surface 142. The first side surface 143 faces in the first direction x toward the side where the first outer part 11 is located (the x1 side in the first direction x). The first side surface 143 extends in the second direction y in a plan view.

[0026] The second side surface 144 is connected to the main surface 141 and the back surface 142. The second side surface 144 faces the side where the first outer part 11 is located in the second direction y (the y1 side in the second direction y). The second side surface 144 extends in the first direction x in a plan view. The first connecting part 13 is connected to the second side surface 144. The first connecting part 13 is connected to the center of the second side surface 144 in the first direction x. In this embodiment, the first connecting part 13 is inclined with respect to the first direction x in a plan view. The inclination angle of the first connecting part 13 with respect to the first direction x is not particularly limited. Furthermore, the first connecting part 13 does not have to be inclined with respect to the first direction x in a plan view.

[0027] In the illustrated example, the first die pad portion 14 has a rectangular shape in plan view. Note that, in the illustrated example, the first die pad portion 14 has four corners, one of which protrudes outward in the first direction x or the second direction y. In this manner, a shape that is not strictly rectangular but has a substantially rectangular shape as a whole is also referred to as a rectangular shape in the present disclosure.

[0028] The first die pad portion 14 has a first corner portion 149a. Of the four corners of the first die pad portion 14 in a plan view, the first corner portion 149a is located on the x2 side in the first direction x and the y2 side in the second direction y. Of the four corners of the first die pad portion 14, the first corner portion 149a is the farthest from the first outer portion 11. In the illustrated example, of the four corners of the first die pad portion 14, the corner located on the x1 side in the first direction x and the y2 side in the second direction y protrudes toward the x1 side in the first direction x.

[0029] The thickness (first thickness t1) of the first lead 1 configured as described above in the thickness direction z is, for example, not less than 0.2 mm and not more than 0.3 mm (see FIG. 10).

[0030] The second lead 2 includes a second outer portion 21 and a second inner portion 22. The second outer portion 21 and the second inner portion 22 are connected to each other and formed integrally. The boundary between the second outer portion 21 and the second inner portion 22 overlaps the periphery of the sealing resin 7 in a plan view.

[0031] The second outer portion 21 is a portion of the second lead 2 that is exposed from the sealing resin 7. The second outer portion 21 protrudes from the sealing resin 7 toward the x2 side in the first direction x (the opposite side from the first outer portion 11 in the first direction x). In a plan view, the second outer portion 21 has a rectangular shape with the first direction x as its longitudinal direction. The second outer portion 21 is bent in a gull-wing shape when viewed in the second direction y. A second length L2 (see FIG. 4 ) of the second outer portion 21 in the second direction y is not particularly limited, but is, for example, 0.1 mm or more and 1.5 mm or less. The second outer portion 21 overlaps the first outer portion 11 when viewed in the first direction x. In the embodiment, the second length L2 of the second outer portion 21 is the same as the first length L1 of the first outer portion 11; however, different from this configuration, the second length L2 and the first length L1 may be different. The second outer portion 21 includes a second mounting portion 211 , a second root portion 212 and a second relay portion 213 .

[0032] The second mounting portion 211 is a tip portion of the second outer portion 21. The second mounting portion 211 is a portion that is joined to the circuit board when the electronic device A1 is mounted on the circuit board. As shown in FIGS. 1 and 2, the second mounting portion 211 is located at the end opposite the sealing resin 7 in the first direction x. Therefore, the second mounting portion 211 is located farther from the sealing resin 7 in the first direction x than the second root portion 212 and the second relay portion 213. The second mounting portion 211 is located lower in the thickness direction z than the second root portion 212. The second mounting portion 211 is located at the same position as the first mounting portion 111 in the thickness direction z.

[0033] The second root portion 212 is a root portion of the second outer portion 21. As shown in FIGS. 1 and 2, the second root portion 212 is located at the end of the second outer portion 21 that is on the sealing resin 7 side in the first direction x. Therefore, the second root portion 212 is located closer to the sealing resin 7 in the first direction x than the second mounting portion 211 and the second relay portion 213. The second root portion 212 is located higher in the thickness direction z than the second mounting portion 211 and protrudes from the center of the sealing resin 7 in the thickness direction z. The second root portion 212 is located at the same position as the first root portion 112 in the thickness direction z.

[0034] The second relay portion 213 connects the second mounting portion 211 and the second root portion 212. When viewed in the second direction y, the second relay portion 213 is inclined with respect to the second mounting portion 211 and the second root portion 212. In this embodiment, the second relay portion 213 is inclined with respect to the thickness direction z.

[0035] In this embodiment, the second outer portion 21 has a second cut mark 214. The second cut mark 214 is a mark left by cutting a portion of the lead frame 9 when the second outer portion 21 is formed from the lead frame 9 (described later). The second cut mark 214 faces the y2 side in the second direction y and is formed across the second root portion 212 and the second relay portion 213. The second cut mark 214 has a surface rougher than other portions of the second inner portion 22. The second cut mark 214 also protrudes slightly toward the y2 side in the second direction y beyond the other surface of the second outer portion 21 facing the y2 side in the second direction y. In the drawings, the protrusion of the portion of the second cut mark 214 toward the y2 side in the second direction y is exaggerated.

[0036] The second inner portion 22 is a portion of the second lead 2 that is covered with the sealing resin 7. The second inner portion 22 is connected to the second outer portion 21 and extends from the second outer portion 21 inward into the sealing resin 7. The second inner portion 22 includes a second connecting portion 23 and a second die pad portion 24.

[0037] The second connecting portion 23 extends from the second outer portion 21 inward of the sealing resin 7. The second connecting portion 23 is connected to the second die pad portion 24. Therefore, the second connecting portion 23 connects the second inner portion 22 and the second die pad portion 24 together.

[0038] The second die pad portion 24 has a second electronic component 52 mounted thereon and supports the second electronic component 52. The second connecting portion 23 is connected to the second die pad portion 24 and is supported by the second connecting portion 23. The second die pad portion 24 is spaced apart from the first die pad portion 14. The first die pad portion 14 and the second die pad portion 24 are aligned in the first direction x, and the second die pad portion 24 is located on the x2 side in the first direction x relative to the first die pad portion 14. The second die pad portion 24 is located on the x1 side in the first direction x of the second outer portion 21. Therefore, the second outer portion 21 is located on the x2 side in the first direction x relative to the second die pad portion 24. Furthermore, the center of the second die pad portion 24 in the second direction y is located on the y2 side in the second direction y relative to the center of the second outer portion 21 in the second direction y. Therefore, in the second direction y, the center of the second outer part 21 is located closer to the y1 side in the second direction y than the center of the second die pad part 24. In this embodiment, as shown in FIG. 2 , the entire second root portion 212 does not overlap the second die pad part 24 when viewed in the first direction x. Therefore, the second outer part 21 is disposed outward (toward the y1 side in the second direction y) from the second die pad part 24 when viewed in the first direction y. Alternatively, a portion of the second root portion 212 may overlap the second die pad part 24 when viewed in the first direction x. Alternatively, the entire second root portion 212 may overlap the second die pad part 24 when viewed in the first direction x. The second die pad part 24 has a main surface 241, a back surface 242, a third side surface 243, and a fourth side surface 244.

[0039] The main surface 241 and the back surface 242 are spaced apart in the thickness direction z. The main surface 241 faces upward in the thickness direction z, and the back surface 242 faces downward in the thickness direction z. The third side surface 243 is connected to the main surface 141 and the back surface 142. The third side surface 243 faces in the first direction x toward the side where the second outer part 21 is located (the x2 side in the first direction x). The third side surface 243 extends in the second direction y in a plan view.

[0040] The fourth side surface 244 is connected to the main surface 241 and the back surface 242. The fourth side surface 244 faces the side where the second outer part 21 is located in the second direction y (the y1 side in the second direction y). The fourth side surface 244 extends in the first direction x in a plan view. The second connecting part 23 is connected to the second side surface 144. The second connecting part 23 is connected to the x2 side in the first direction x of the fourth side surface 244 in the first direction x. In this embodiment, the second connecting part 23 is inclined with respect to the first direction x in a plan view. The inclination angle of the second connecting part 23 with respect to the first direction x is not particularly limited. Furthermore, the second connecting part 23 does not have to be inclined with respect to the first direction x in a plan view.

[0041] In the illustrated example, the second die pad portion 24 has a rectangular shape in a plan view. The second die pad portion 24 has a second corner portion 249a. Of the four corners of the second die pad portion 24 in a plan view, the second corner portion 249a is located on the x1 side in the first direction x and the y2 side in the second direction y. Of the four corners of the second die pad portion 24, the second corner portion 249a is the farthest from the second outer portion 21.

[0042] The thickness (second thickness t2) of the second lead 2 in the thickness direction z of the above-described configuration is, for example, not less than 0.2 mm and not more than 0.3 mm (see FIG. 10).

[0043] The third lead 3 includes a third outer portion 31 and a third inner portion 32. The third outer portion 31 and the third inner portion 32 are connected to each other and formed integrally. The boundary between the third outer portion 31 and the third inner portion 32 overlaps the periphery of the sealing resin 7 in a plan view.

[0044] The third outer portion 31 is a portion of the third lead 3 that is exposed from the sealing resin 7. The third outer portion 31 protrudes from the sealing resin 7 toward the x1 side in the first direction x (the same side as the first outer portion 11). In a plan view, the third outer portion 31 has a rectangular shape with the first direction x as its longitudinal direction. In this embodiment, the planar shape of the third outer portion 31 is congruent with the planar shape of the first outer portion 11. However, unlike this configuration, these planar shapes do not have to be congruent with each other. The third outer portion 31 is bent in a gull-wing shape when viewed in the second direction y. The third outer portion 31 overlaps the first outer portion 11 when viewed in the second direction y. A length L3 of the third outer portion 31 in the second direction y is not limited in any way and is, for example, 0.1 mm or more and 1.5 mm or less. In this embodiment, the length L3 of the third outer portion 31 in the second direction y is the same as the first length L1 of the first outer portion 11 (see FIG. 3 ). However, unlike this configuration, the length L3 of the third outer portion 31 in the second direction y and the first length L1 may be different. The third outer portion 31 includes a third mounting portion 311, a third root portion 312, and a third relay portion 313.

[0045] The third mounting portion 311 is a tip portion of the third outer portion 31. The third mounting portion 311 is a portion that is joined to the circuit board when the electronic device A1 is mounted on the circuit board. As shown in FIGS. 1 and 2, the third mounting portion 311 is located at the end opposite the sealing resin 7 in the first direction x. Therefore, the third mounting portion 311 is located farther from the sealing resin 7 in the first direction x than the third root portion 312 and the third relay portion 313. The third mounting portion 311 is located lower in the thickness direction z than the third root portion 312. The third mounting portion 311 is located at the same position as the first mounting portion 111 in the thickness direction z.

[0046] The third root portion 312 is a root portion of the third outer portion 31. As shown in FIGS. 1 and 2, the third root portion 312 is located at the end of the third outer portion 31 that is closer to the sealing resin 7 in the first direction x. Therefore, the third root portion 312 is located closer to the sealing resin 7 in the first direction x than the third mounting portion 311 and the third relay portion 313. The third root portion 312 is located higher in the thickness direction z than the third mounting portion 311 and protrudes from the center of the sealing resin 7 in the thickness direction z. The third root portion 312 is located at the same position as the first root portion 112 in the thickness direction z.

[0047] The third relay portion 313 connects the third mounting portion 311 and the third root portion 312. When viewed in the second direction y, the third relay portion 313 is inclined with respect to the third mounting portion 311 and the third root portion 312. In this embodiment, the third relay portion 313 is inclined with respect to the thickness direction z.

[0048] The third inner portion 32 is a portion of the third lead 3 that is covered with the sealing resin 7. The third inner portion 32 is connected to the third outer portion 31 and extends from the third outer portion 31 inward into the sealing resin 7. The third inner portion 32 extends from the third outer portion 31 inward into the sealing resin 7 so as to approach the first die pad portion 14.

[0049] Each of the multiple fourth leads 4 includes a fourth outer portion 41 and a fourth inner portion 42. Thus, the electronic device A1 includes multiple fourth outer portions 41 and multiple fourth inner portions 42. In the following description, the multiple fourth leads 4 may be referred to as a "fourth lead 4A" and multiple fourth leads 4B. The other of the pair of fourth leads 4 may be referred to as a "fourth lead 4B." The fourth lead 4A is disposed on the y2 side of the multiple fourth leads 4B in the second direction y. In each fourth lead 4, the fourth outer portion 41 and the fourth inner portion 42 are connected to each other and integrally formed. In each fourth lead 4, the boundary between the fourth outer portion 41 and the fourth inner portion 42 overlaps the periphery of the sealing resin 7 in a plan view. The fourth outer portion 41 and the fourth inner portion 42 described below are common to all third leads 3 unless otherwise specified.

[0050] The fourth outer portion 41 is a portion of each fourth lead 4 that is exposed from the sealing resin 7. Each fourth outer portion 41 protrudes from the sealing resin 7 to the x2 side in the first direction x (the side opposite to the first outer portion 11 and the third outer portion 31, and the same side as the second outer portion 21). In a plan view, each fourth outer portion 41 of the multiple fourth leads 4B is strip-shaped with the first direction x as its longitudinal direction. The fourth outer portions 41 of the multiple fourth leads 4B are arranged at equal intervals along the second direction y. The fourth outer portion 41 of the fourth lead 4A is located on the y2 side in the second direction y relative to the fourth outer portions 41 of the multiple fourth leads 4A. In a plan view, the fourth outer portion 41 of the fourth lead 4A is rectangular with the first direction x as its longitudinal direction. Each fourth outer portion 41 of the multiple fourth leads 4 is bent in a gull-wing shape when viewed in the second direction y. The multiple fourth outer portions 41 (the fourth outer portions 41 of the fourth lead 4A and the multiple fourth leads 4B) overlap each other when viewed in the second direction y.

[0051] The length L41 in the second direction y of each of the fourth outer portions 41 of the multiple fourth leads 4B is not limited in any way and is, for example, 0.15 mm or more and 0.5 mm or less. The length L41 in the second direction y of each of the fourth outer portions 41 of the multiple fourth leads 4B is smaller than the first length L1 in the second direction y of the first outer portion 11 and the second length L2 in the second direction y of the second outer portion 21. The fourth outer portion 41 of the fourth lead 4A overlaps the third outer portion 31 when viewed in the first direction x. The length L42 in the second direction y of the fourth outer portion 41 of the fourth lead 4A is not limited in any way and is, for example, 0.1 mm or more and 1.5 mm or less. In the present embodiment, the length L42 in the second direction y of the fourth outer portion 41 of the fourth lead 4A is the same as the first length L1 in the second direction y of the first outer portion 11, the second length L2 in the second direction y of the second outer portion 21, and the length L3 in the second direction y of the third outer portion 31. Unlike this configuration, the length L42 in the second direction y of the fourth outer portion 41 of the fourth lead 4A may be different from the first length L1 in the second direction y of the first outer portion 11, the second length L2 in the second direction y of the second outer portion 21, and the length L3 in the second direction y of the third outer portion 31. The fourth outer portion 41 includes a fourth mounting portion 411, a fourth root portion 412, and a fourth relay portion 413. The fourth mounting portion 411, the fourth root portion 412, and the fourth relay portion 413 described below are common to the fourth outer portions 41 of each fourth lead 4 unless otherwise specified.

[0052] The fourth mounting portion 411 is a tip portion of the fourth outer portion 41. The fourth mounting portion 411 is a portion that is bonded to the circuit board when the electronic device A1 is mounted on the circuit board. As shown in FIGS. 1 and 2 , the fourth mounting portion 411 is located at the end opposite the sealing resin 7 in the first direction x. Therefore, the fourth mounting portion 411 is located farther from the sealing resin 7 in the first direction x than the fourth root portion 412 and the fourth relay portion 413. The fourth mounting portion 411 is located lower in the thickness direction z than the fourth root portion 412. The multiple fourth mounting portions 411 are arranged at the same position in the thickness direction z. The multiple fourth mounting portions 411 in the multiple fourth leads 4B are arranged at equal intervals along the second direction y. The fourth mounting portion 411 of the fourth lead 4A is adjacent to the multiple fourth mounting portions 411 in the second direction y on the y2 side in the second direction y of the multiple fourth mounting portions 411 in the multiple fourth leads 4B.

[0053] The fourth root portion 412 is a root portion of the fourth outer portion 41. As shown in FIGS. 1 and 2, the fourth root portion 412 is located at the end of the fourth outer portion 41 that is closer to the sealing resin 7 in the first direction x. Therefore, the fourth root portion 412 is located closer to the sealing resin 7 in the first direction x than the fourth mounting portion 411 and the fourth relay portion 413. The fourth root portion 412 is located higher in the thickness direction z than the fourth mounting portion 411 and protrudes from the center of the sealing resin 7 in the thickness direction z. The multiple fourth root portions 412 are arranged at the same positions as each other in the thickness direction z.

[0054] The fourth relay portion 413 connects the fourth mounting portion 411 and the fourth root portion 412. When viewed in the second direction y, the fourth relay portion 413 is inclined with respect to the fourth mounting portion 411 and the fourth root portion 412. In this embodiment, the fourth relay portion 413 is inclined with respect to the thickness direction z.

[0055] The fourth inner portion 42 is a portion of the corresponding fourth lead 4 that is covered with the sealing resin 7. The fourth inner portion 42 is connected to the fourth outer portion 41 and extends from the fourth outer portion 41 inward into the sealing resin 7. In each fourth lead 4, the fourth inner portion 42 extends from the fourth outer portion 41 inward into the sealing resin 7 so as to approach the second die pad portion 24.

[0056] In the electronic device A1, the first outer portion 11 and the third outer portion 31 are adjacent to each other with a distance d13 (see FIG. 6) in the second direction y. The multiple fourth outer portions 41 in the multiple fourth leads 4A are arranged with a distance d44 (see FIG. 5) in the second direction y. The distance d13 (see FIG. 6) in the second direction y between the first outer portion 11 and the third outer portion 31 is larger than the distance d44 (see FIG. 5) in the second direction y between the adjacent fourth outer portions 41 in the second direction y. For example, the distance d13 is 10 to 20 times the distance d44. In this embodiment, the distance d13 is, for example, 5 to 10 mm, and the distance d44 is, for example, 0.25 to 5 mm. When the potential difference between the first outer part 11 and the third outer part 31 is about 800 V, the distance d13 is preferably 4 mm or more to prevent a short circuit between the first outer part 11 and the third outer part 31. The distance d24 in the second direction y between the second outer part 21 and the fourth outer part 41 of the fourth lead 4B adjacent to the second outer part 21 (see FIG. 5), and the distance d4A in the second direction y between the fourth outer part 41 of the fourth lead 4A and the fourth outer part 41 of the fourth lead 4B adjacent to the fourth outer part 41 (see FIG. 5) are both the same as the distance d44.

[0057] In the electronic device A1, the shape and positional relationship between each of the first die pad portion 14 and the second die pad portion 24 and each of the first inner portion 12, the second inner portion 22, the third inner portion 32 and each fourth inner portion 42 are not limited to the example shown in the figure, and can be changed as appropriate depending on the specifications of the electronic device A1.

[0058] The first electronic component 51 and the second electronic component 52 are elements that perform electrical functions in the electronic device A1. While the specific functions of the first electronic component 51 and the second electronic component 52 are not limited in any way, in this embodiment, the first electronic component 51 and the second electronic component 52 have a function of detecting voltage.

[0059] The first electronic component 51 is bonded to the first die pad portion 14 by a bonding material (e.g., solder or sintered silver) not shown, and is mounted on the first die pad portion 14. In this embodiment, the first electronic component 51 outputs a first signal corresponding to the potential of the first lead 1 and a second signal corresponding to the potential of the third lead 3 to the second electronic component 52. The first electronic component 51 has a plurality of electrodes 511, 512, and 513 arranged on its upper surface in the thickness direction z.

[0060] The second electronic component 52 is bonded to the second die pad portion 24 by a bonding material (e.g., solder or sintered silver) not shown, and is mounted on the second die pad portion 24. In this embodiment, the second electronic component 52 receives the first and second signals from the first electronic component 51 and outputs a third signal corresponding to the potential difference between the first lead 1 and the third lead 3. In other words, the second electronic component 52 outputs a detection signal (third signal) of the voltage applied between the first lead 1 and the third lead 3. The second electronic component 52 has a plurality of electrodes 521, 522 arranged on its upper surface in the thickness direction z.

[0061] In the electronic device A1, the first electronic component 51 and the second electronic component 52 have, for example, a circuit configuration as shown in Fig. 11. As shown in Fig. 11, the first electronic component 51 includes a plurality of resistor elements R1 to R4, and the second electronic component 52 includes an operational amplifier OP and a resistor element R5. Note that the circuit configurations of the first electronic component 51 and the second electronic component 52 are not limited to the example shown in Fig. 11.

[0062] The two resistor elements R1 and R2 are connected in series. The two resistor elements R1 and R2 divide the voltage of the terminal TE1 (the potential difference between the potential of the terminal TE1 and the reference potential of ground GND). In this embodiment, the terminal TE1 corresponds to a plurality of electrodes 512. The connection point of the two resistor elements R1 and R2 is connected to the non-inverting input terminal of the operational amplifier OP. The two resistor elements R3 and R4 are connected in series. The two resistor elements R3 and R4 divide the voltage of the terminal TE2 (the potential difference between the potential of the terminal TE2 and the reference potential of ground GND). In this embodiment, the terminal TE2 corresponds to a plurality of electrodes 511. The connection point of the two resistor elements R3 and R4 is connected to the inverting input terminal of the operational amplifier OP. When the electronic device A1 detects the voltage of a battery installed in an electric vehicle, one of the terminals TE1 and TE2 is electrically connected to a high-potential terminal of the battery, and the other is electrically connected to a low-potential terminal.

[0063] The operational amplifier OP receives as input a first signal (in this embodiment, a signal obtained by dividing the voltage of the terminal TE1) corresponding to the potential of the terminal TE1 and a second signal (in this embodiment, a signal obtained by dividing the voltage of the terminal TE2) corresponding to the potential of the terminal TE2, and outputs a third signal corresponding to the potential difference between the terminals TE1 and TE2. The resistive element R5 is an element (feedback resistor) for determining the amplification gain of the operational amplifier OP, and one end of the resistive element R5 is connected to the inverting input terminal of the operational amplifier OP, and the other end is connected to the output terminal of the operational amplifier OP. Note that the second electronic component 52 does not necessarily have to include the resistive element R5.

[0064] Each of the plurality of connection members 61 to 66 electrically connects parts spaced apart from one another. In the illustrated example, each of the plurality of connection members 61 to 66 is a bonding wire. Each of the plurality of connection members 61 to 66 may be a plate-shaped metal member instead of a bonding wire. Each of the plurality of connection members 61 to 66 includes any of Au, Al (aluminum), and Cu.

[0065] 2, the connection member 61 is joined to the electrode 511 of the first electronic component 51 and the second inner portion 22, and electrically connects the first electronic component 51 and the third lead 3. Therefore, the third outer portion 31 of the third lead 3 is electrically connected to the first electronic component 51 via the third inner portion 32 and the connection member 61.

[0066] 2, the connection member 62 is joined to the electrode 512 of the first electronic component 51 and the first coupling portion 13 (first inner portion 12), electrically connecting the first electronic component 51 and the first lead 1. Therefore, the first outer portion 11 of the first lead 1 is electrically connected to the first electronic component 51 via the first coupling portion 13 and the connection member 62.

[0067] 2, each of the plurality of connection members 63 is joined to an electrode 521 of the second electronic component 52 and one of the plurality of fourth inner portions 42 of the plurality of fourth leads 4B, electrically connecting the second electronic component 52 to one of the plurality of fourth leads 4B. Thus, each fourth outer portion 41 of the plurality of fourth leads 4B is electrically connected to the second electronic component 52 via the corresponding fourth inner portion 42 and the corresponding connection member 63.

[0068] 2, the connection member 64 is joined to the electrode 521 of the second electronic component 52 and the fourth inner portion 42 of the fourth lead 4A, electrically connecting the second electronic component 52 and the fourth lead 4A. Therefore, the fourth outer portion 41 of the fourth lead 4A is electrically connected to the second electronic component 52 via the fourth inner portion 42 of the fourth lead 4A and the connection member 64.

[0069] 2, the connection member 65 is joined to the electrode 521 of the second electronic component 52 and the second coupling portion 23 (second inner portion 22), and electrically connects the second electronic component 52 and the second lead 2. In other words, the second outer portion 21 of the second lead 2 is electrically connected to the second electronic component 52 via the second coupling portion 23 of the second lead 2 and the connection member 65.

[0070] 2, the plurality of connection members 66 are joined to the electrodes 513 of the first electronic component 51 and the electrodes 522 of the second electronic component 52, electrically connecting the first electronic component 51 and the second electronic component 52. Thus, the plurality of connection members 66 are transmission paths for the first signal and the second signal.

[0071] The sealing resin 7 covers portions of the first lead 1, the second lead 2, the third lead 3, and the plurality of fourth leads 4, the first electronic component 51, the second electronic component 52, and the plurality of connecting members 61-66. The sealing resin 7 includes an insulating material such as epoxy resin. Preferably, the sealing resin 7 is made of a resin material having a comparative tracking index (CTI) of 600 V or more. The method for forming the sealing resin 7 is not particularly limited, but may be molding, for example. The sealing resin 7 has, for example, a rectangular parallelepiped shape. The dimension of the sealing resin 7 along the second direction y is, for example, 5 mm to 10 mm, and the dimension along the first direction x is, for example, 3 mm to 13 mm. The sealing resin 7 has a resin main surface 71, a resin back surface 72, a first resin side surface 731, a second resin side surface 732, a third resin side surface 733, and a fourth resin side surface 734.

[0072] The resin main surface 71 and the resin back surface 72 are spaced apart from each other in the thickness direction z. The resin main surface 71 faces the z2 side in the thickness direction z, and the resin back surface 72 faces the z1 side in the thickness direction z. The resin main surface 71 is the upper surface of the sealing resin 7, and the resin back surface 72 is the lower surface of the sealing resin 7.

[0073] The first resin side surface 731 and the second resin side surface 732 are spaced apart from each other in the first direction x. The first resin side surface 731 faces the x1 side in the first direction x, and the second resin side surface 732 faces the x2 side in the first direction x. The third resin side surface 733 and the fourth resin side surface 734 are spaced apart from each other in the second direction y. The third resin side surface 733 faces the y1 side in the second direction y, and the fourth resin side surface 734 faces the y2 side in the second direction y.

[0074] 1 to 3 and 6 to 10, the first outer portion 11 and the third outer portion 31 each protrude from the first resin side surface 731. As shown in FIGS. 1, 2, 4, 5 and 7 to 10, the second outer portion 21 of the second lead 2 and the fourth outer portions 41 of the multiple fourth leads 4 each protrude from the second resin side surface 732.

[0075] In the electronic device A1 configured as described above, in a plan view, a first distance D1 (see FIG. 3 ) from a first end 114a on the x2 side of the first cut mark 114 in the first outer part 11 to a first corner 149a of the first die pad part 14 and a first length L1 (see FIG. 3 ) of the first outer part 11 in the second direction y satisfy the following relationship: Specifically, the first distance D1 is 10.8 times or less the first length L1 (L1 / D1≦10.8). For example, the first distance D1 from the first end 114a to the first corner 149a is 5.5 times or more and 10.8 times or less the first length L1 of the first outer part 11 in the second direction y. For example, the first distance D1 is 1.1 mm or more and 2.2 mm or less.

[0076] Furthermore, in the electronic device A1, in a plan view, a second distance D2 (see FIG. 4) from a second end 214a on the x1 side of the second cut mark 214 in the second outer part 21 to a second corner 249a of the second die pad part 24 and a second length L2 (see FIG. 4) of the second outer part 21 in the second direction y satisfy the following relationship: Specifically, the second distance D2 is 10.8 times or less the second length L2 (L2 / D2≦10.8). For example, the second distance D2 from the second end 214a to the second corner 249a is 5.5 times or more and 10.8 times or less the second length L2 of the second outer part 21 in the second direction y. As an example of the dimension, the second distance D2 is 1.1 mm or more and 2.2 mm or less.

[0077] FIG. 12 shows a process in the manufacture of the electronic device A1. FIG. 12 shows the state before the sealing resin 7 is formed. During the manufacturing process of the electronic device A1, as shown in FIG. 12, the first lead 1, the second lead 2, the third lead 3, and the multiple fourth leads 4 are connected to one another by tie bars 91 and are included in a single lead frame 9. The tie bars 91 are connected to, for example, the first outer portion 11 of the first lead 1, the second outer portion 21 of the second lead 2, the third outer portion 31 of the third lead 3, and each of the fourth outer portions 41 of the multiple fourth leads 4. In this state of the lead frame 9, the first inner portion 12 is supported by the tie bars 91 at a connection point C1 shown in FIG. 12. The second inner portion 22 is supported by the tie bars 91 at a connection point C2 shown in FIG. 12.

[0078] 12, a first electronic component 51 and a second electronic component 52 are mounted (joined) and each of the connection members 61 to 66 is formed (wire bonding), and then a sealing resin 7 is formed by, for example, molding. Thereafter, the first lead 1, the second lead 2, the third lead 3, and the plurality of fourth leads 4 are each cut off from the tie bar 91, and the first outer part 11, the second outer part 21, the third outer part 31, and each of the fourth outer parts 41 are bent, thereby manufacturing the electronic device A10.

[0079] Next, the operation of the electronic device A1 will be described.

[0080] In the electronic device A1, the center of the first outer part 11 is located on the y1 side in the second direction y with respect to the center of the first die pad part 14. In a plan view, a first distance D1 from a first end 114a on the x2 side in the first direction x of the first cut mark 114 in the first outer part 11 to a first corner 149a of the first die pad part 14 is 10.8 times or less the first length L1 of the first outer part 11 in the second direction y (L1 / D1≦10.8).

[0081] 12, during manufacturing of the electronic device A1, the first inner part 12 is cantilevered by the tie bar 91 at the connection point C1. The first inner part 12 includes a first connecting part 13 and a first die pad part 14 connected thereto. The first die pad part 14 is supported by the tie bar 91 via the first connecting part 13. In this configuration, a bending moment is generated at the connection point C1 due to the weight of the first inner part 12 (the first connecting part 13 and the first die pad part 14). The larger this bending moment is, the higher the possibility of deformation (bending) at the connection point C1. However, the bending moment tends to increase as the first die pad part 14 is farther away from the connection point C1. On the other hand, increasing the length in the second direction y of the connection point C1 where the first inner part 12 is connected to the tie bar 91 increases the cross-sectional area of ​​the connection point C1 and the strength of the connection point C1, thereby suppressing deformation at the connection point C1.

[0082] According to the research of the present inventors, as described above, it has been found that deformation at the connection point C1 of the first inner part 12 to the lead frame 9 can be suppressed by setting the first distance D1 from the first end 114a on the x2 side in the first direction x of the first cut mark 114 in the first outer part 11 to the first corner 149a of the first die pad part 14 in plan view to be 10.8 times or less the first length L1 of the first outer part 11 in the second direction y. The first corner 149a is located on the x2 side in the first direction x and the y2 side in the second direction y among the four corners of the first die pad part 14 in plan view. The first corner 149a is located on the x2 side in the first direction x and the y2 side in the second direction y among the four corners of the first die pad part 14. From the relationship between a first distance D1 from a first end 114a of the first cut mark 114, which corresponds to the portion of the connection portion C1 closest to the first corner 149a in a plan view, to the first corner 149a, and a first length L1 of the first outer portion 11, which corresponds to the length of the connection portion C1 in the second direction y, it is possible to predict the occurrence of deformation of the lead frame 9 during the manufacturing process of the electronic device A1, and it is possible to simplify the strength design of the lead frame 9 of the electronic device A1. In the electronic device A1, the first distance D1 from the first end 114a of the first cut mark 114 on the x2 side in the first direction x in the first direction x in the first outer portion 11 to the first corner 149a of the first die pad portion 14 is configured to be 10.8 times or less the first length L1 of the first outer portion 11 in the second direction y. This makes it possible to suppress deformation of the lead frame 9 (first lead 1) during the manufacturing of the electronic device A1.

[0083] In the electronic device A1, in the second direction y, the center of the second outer part 21 is located on the y1 side in the second direction y with respect to the center of the second die pad part 24. In a plan view, a second distance D2 from a second end 214a on the x1 side in the first direction x of the second cut mark 214 in the second outer part 21 to a second corner 249a of the second die pad part 24 is 10.8 times or less the second length L2 of the second outer part 21 in the second direction y (L2 / D2≦10.8).

[0084] 12, during manufacturing of the electronic device A1, the second inner part 22 is cantilevered by the tie bar 91 at the connection point C2. The second inner part 22 includes a second connecting part 23 and a second die pad part 24 connected thereto. The second die pad part 24 is supported by the tie bar 91 via the second connecting part 23. In this configuration, a bending moment is generated at the connection point C1 due to the weight of the second inner part 22 (the second connecting part 23 and the second die pad part 24). The larger this bending moment is, the higher the possibility of deformation (bending) at the connection point C2. However, the bending moment tends to increase as the second die pad part 24 is farther away from the connection point C2. On the other hand, increasing the length in the second direction y of the connection point C2 where the second inner part 22 is connected to the tie bar 91 increases the cross-sectional area of ​​the connection point C2 and the strength of the connection point C2, thereby suppressing deformation at the connection point C2.

[0085] The configuration in which the second distance D2 is 10.8 times or less the second length L2 (L2 / D2≦10.8) for the second lead 2 is similar to the configuration in which the first distance D1 is 10.8 times or less the first length L1 (L1 / D1≦10.8) for the first lead 1. This makes it possible to suppress deformation of the lead frame 9 (second lead 2) during the manufacture of the electronic device A1, similar to the effect of suppressing deformation of the first lead 1 as described above.

[0086] 13 to 27 show other embodiments and modifications of the present disclosure. In these figures, elements that are the same as or similar to those in the above-described embodiment are given the same reference numerals as in the above-described embodiment, and redundant explanations will be omitted. Furthermore, the configurations of the various parts in each embodiment and modification can be combined with each other as appropriate within the scope of not causing technical contradictions.

[0087] Second Embodiment 13 to 17 show an electronic device A2 according to a second embodiment of the present disclosure. The electronic device A2 of this embodiment is different from the above-described electronic device A1 in the configurations of the first lead 1, the second lead 2, the third lead 3, and the fourth lead 4 (fourth lead 4A).

[0088] 13, 14, and 17, the first outer part 11 of the electronic device A2 includes two parts, a first part 11A and a second part 11B, which are spaced apart from each other in the second direction y. Each of the first part 11A and the second part 11B includes a first mounting part 111, a first root part 112, and a first relay part 113.

[0089] 14 and 15, the lengths L11 and L12 of the first portion 11A and the second portion 11B in the second direction y are greater than the length L41 of each fourth outer portion 41 of the multiple fourth leads 4B in the second direction y. The multiple fourth leads 4B in the electronic device A2 correspond to an example of a "terminal lead" in the present disclosure. Furthermore, each fourth outer portion 41 of the multiple fourth leads 4B corresponds to an example of a "terminal lead outer portion" in the present disclosure, and each fourth inner portion 42 of the multiple fourth leads 4B corresponds to an example of a "terminal lead inner portion" in the present disclosure.

[0090] As shown in FIG. 17, the first portion 11A and the second portion 11B are adjacent to each other with a distance d11 in the second direction y. The distance d11 is, for example, smaller than the distance d44, but they may be the same. With this configuration, the first inner portion 12 of the first lead 1 is bifurcated at the end connected to the first outer portion 11 (the first portion 11A and the second portion 11B). Therefore, the first portion 11A and the second portion 11B are electrically connected to each other by the first inner portion 12 and are at the same potential. In the first outer portion 11 configured as described above, the first length L1 in the second direction y is the sum of the length L11 of the first portion 11A in the second direction y and the length L12 of the second portion 11B in the second direction y.

[0091] 13, 15, and 16, the second lead 2 of the electronic device A2 includes two portions, a fourth portion 21A and a fifth portion 21B, that are spaced apart from each other in the second direction y. Each of the two portions, the fourth portion 21A and the fifth portion 21B, includes a second mounting portion 211, a second root portion 212, and a second relay portion 213.

[0092] As shown in FIG. 15, the lengths L21 and L22 of the fourth portion 21A and the fifth portion 21B in the second direction y are greater than the length L41 of each fourth outer portion 41 of the multiple fourth leads 4B in the second direction y. As shown in FIG. 16, the fourth portion 21A and the fifth portion 21B are adjacent to each other with a distance d22 in the second direction y. The distance d22 is, for example, smaller than the distance d44, but they may be the same. With this configuration, the second inner portion 22 of the second lead 2 is bifurcated at the end connected to the second outer portion 21 (the fourth portion 21A and the fifth portion 21B). Therefore, the fourth portion 21A and the fifth portion 21B are electrically connected to each other by the second inner portion 22 and are at the same potential. In the second outer portion 21 configured as described above, the second length L2 in the second direction y is the sum of the length L21 in the second direction y of the fourth portion 21A and the length L22 in the second direction y of the fifth portion 21B.

[0093] As shown in FIGS. 13, 14, and 17, the third lead 3 of the electronic device A2 includes two seventh and eighth portions 31A and 31B spaced apart from each other in the second direction y. The two seventh and eighth portions 31A and 31B each include a third mounting portion 311, a third root portion 312, and a third link portion 313. As shown in FIG. 17, the seventh and eighth portions 31A and 31B are adjacent to each other in the second direction y, separated by a distance d33. The distance d33 is, for example, the same as the distance d44, but may be different. Due to this configuration, the third inner portion 32 of the third lead 3 is bifurcated at the end connected to the third outer portion 31 (the seventh and eighth portions 31A and 31B). Therefore, the seventh and eighth portions 31A and 31B are electrically connected to each other by the third inner portion 32 and are at the same potential.

[0094] As shown in FIGS. 13, 15, and 16, the fourth lead 4A of the electronic device A2 includes two 9th and 10th portions 41A and 41B spaced apart from each other in the second direction y. Each of the 9th and 10th portions 41A and 41B includes a fourth mounting portion 411, a fourth root portion 412, and a fourth link portion 413. As shown in FIG. 16, the 9th and 10th portions 41A and 41B are adjacent to each other in the second direction y, separated by a distance d4B. The distance d4B is, for example, the same as the distance d44, but may be different. Due to this configuration, the fourth inner portion 42 of the fourth lead 4A has a bifurcated end connected to the fourth outer portion 41 (the 9th and 10th portions 41A and 41B). Therefore, the 9th and 10th portions 41A and 41B are electrically connected to each other by the fourth inner portion 42 and are at the same potential.

[0095] In the electronic device A2, in a plan view, a first distance D1 (see FIG. 14 ) from a first end 114a on the x2 side in the first direction x of the first cut mark 114 in the first outer part 11 to a first corner 149a of the first die pad part 14 and a first length L1 (see FIG. 14 ) of the first outer part 11 in the second direction y satisfy the following relationship: Specifically, the first distance D1 is 10.8 times or less the first length L1 (the sum of the lengths L11 and L12) (L1 / D1≦10.8). For example, the first distance D1 from the first end 114a to the first corner 149a is 5.5 times or more and 10.8 times or less the first length L1 of the first outer part 11 in the second direction y. As an example of dimensions, the first length L1 is not less than 0.2 mm and not more than 0.5 mm, and the first distance D1 is not less than 1.1 mm and not more than 2.2 mm.

[0096] Furthermore, in the electronic device A2, in a plan view, a second distance D2 (see FIG. 15) from a second end 214a on the x1 side in the first direction x of the second cut mark 214 in the second outer part 21 to a second corner 249a of the second die pad part 24 and a second length L2 (see FIG. 15) of the second outer part 21 in the second direction y have the following relationship: Specifically, the second distance D2 is 10.8 times or less the second length L2 (the sum of the lengths L21 and L22) (L2 / D2≦10.8). For example, the second distance D2 from the second end 214a to the second corner 249a is 5.5 times or more and 10.8 times or less the second length L2 of the second outer part 21 in the second direction y. As an example of dimensions, the second length L2 is not less than 0.2 mm and not more than 0.5 mm, and the second distance D2 is not less than 1.1 mm and not more than 2.2 mm.

[0097] In the electronic device A2, as in the electronic device A1, deformation of the first lead 1 and the second lead 2, i.e., deformation of the lead frame, can be suppressed. In the electronic device A2, the lengths L11 and L12 in the second direction y of the two first portions 11A and second portions 11B constituting the first outer portion 11 are each longer than the length in the second direction y of the fourth lead 4B. This allows the first length L1 in the second direction y of the entire first outer portion 11 to be set to a desired dimension that satisfies the above-mentioned relational expression (L1 / D1≦10.8). In addition, the electronic device A2 achieves the same effects as the electronic device A1 due to the configuration that is common to the electronic device A1.

[0098] <Modification of the second embodiment> 18 to 22 show an electronic device A21 according to a modification of Embodiment 2. The electronic device A21 of this modification differs from the electronic device A2 described above in the configurations of the first lead 1 and the second lead 2.

[0099] 18, 19, and 22, the first outer part 11 of the electronic device A21 includes three parts, a first part 11A, a second part 11B, and a third part 11C, that are spaced apart from one another in the second direction y. Unlike the illustrated example, the number of spaced apart parts that make up the first outer part 11 may be four or more. The three parts, the first part 11A, the second part 11B, and the third part 11C, each include a first mounting part 111, a first root part 112, and a first relay part 113.

[0100] As shown in FIG. 22, the first portion 11A, the second portion 11B, and the third portion 11C are arranged at a distance d11 in the second direction y. The distance d11 is, for example, the same as the distance d44, but may be different. With this configuration, the first inner portion 12 of the first lead 1 has a trifurcated end connected to the first outer portion 11 (the first portion 11A, the second portion 11B, and the third portion 11C). Therefore, the first portion 11A, the second portion 11B, and the third portion 11C are electrically connected to each other by the first inner portion 12 and are at the same potential. In the first outer portion 11 configured as described above, the first length L1 in the second direction y is the sum of the length L11 in the second direction y of the first portion 11A, the length L12 in the second direction y of the second portion 11B, and the length L13 in the second direction y of the third portion 11C.

[0101] 18, 20, and 21, the second lead 2 of the electronic device A21 includes three portions, a fourth portion 21A, a fifth portion 21B, and a sixth portion 21C, that are spaced apart from one another in the second direction y. Unlike the illustrated example, the number of spaced apart portions that make up the second outer portion 21 may be four or more. The three portions, the fourth portion 21A, the fifth portion 21B, and the sixth portion 21C, each include a second mounting portion 211, a second root portion 212, and a second relay portion 213.

[0102] As shown in FIG. 21 , the fourth portion 21A, the fifth portion 21B, and the sixth portion 21C are arranged at a distance d22 in the second direction y. The distance d22 is, for example, the same as the distance d44, but may be different. With this configuration, the second inner portion 22 of the second lead 2 has a trifurcated end connected to the second outer portion 21 (the fourth portion 21A, the fifth portion 21B, and the sixth portion 21C). Therefore, the fourth portion 21A, the fifth portion 21B, and the sixth portion 21C are electrically connected to each other by the second inner portion 22 and are at the same potential. In the second outer portion 21 configured as described above, the second length L2 in the second direction y is the sum of the length L21 in the second direction y of the fourth portion 21A, the length L22 in the second direction y of the fifth portion 21B, and the length L23 in the second direction y of the sixth portion 21C.

[0103] In the electronic device A21, in a plan view, a first distance D1 (see FIG. 19 ) from a first end 114a on the x2 side in the first direction x of the first cut mark 114 in the first outer part 11 to a first corner 149a of the first die pad part 14 and a first length L1 (see FIG. 19 ) of the first outer part 11 in the second direction y satisfy the following relationship: Specifically, the first distance D1 is 10.8 times or less the first length L1 (the sum of the lengths L11, L12, and L13) (L1 / D1≦10.8). For example, the first distance D1 from the first end 114a to the first corner 149a is 5.5 times or more and 10.8 times or less the first length L1 of the first outer part 11 in the second direction y. As an example of dimensions, the first length L1 is not less than 0.2 mm and not more than 0.5 mm, and the first distance D1 is not less than 1.1 mm and not more than 2.2 mm.

[0104] Furthermore, in the electronic device A21, in a plan view, a second distance D2 (see FIG. 20) from a second end 214a on the x1 side in the first direction x of the second cut mark 214 in the second outer part 21 to a first corner 149a of the second die pad part 24 and a second length L2 (see FIG. 20) of the second outer part 21 in the second direction y satisfy the following relationship: Specifically, the second distance D2 is 10.8 times or less the second length L2 (the sum of the lengths L21 and L22) (L2 / D2≦10.8). For example, the second distance D2 from the second end 214a to the second corner 249a is 5.5 times or more and 10.8 times or less the second length L2 of the second outer part 21 in the second direction y. As an example of dimensions, the second length L2 is not less than 0.2 mm and not more than 0.5 mm, and the second distance D2 is not less than 1.1 mm and not more than 2.2 mm.

[0105] Like the electronic device A1, the electronic device A21 can also suppress deformation of the first lead 1 and the second lead 2, i.e., deformation of the lead frame. In addition, the electronic device A21 has the same configuration as the electronic device A1, and thereby achieves the same effects.

[0106] Third Embodiment 23 to 27 show an electronic device A3 according to a third embodiment of the present disclosure. The electronic device A3 of this embodiment differs from the above-described electronic device A1 in the configurations of the first lead 1 and the second lead 2.

[0107] As shown in Figures 23 and 24, the first connecting portion 13 of the electronic device A3 is connected to the first side surface 143 of the first die pad portion 14. The first connecting portion 13 is connected to the middle of the first side surface 143 in the second direction y. In the example shown, the first connecting portion 13 is connected to a portion of the first side surface 143 in the second direction y that is closer to the y1 side of the second direction y. The first connecting portion 13 is inclined with respect to the first direction x in a plan view. The inclination angle of the first connecting portion 13 with respect to the first direction x is not particularly limited. Furthermore, the first connecting portion 13 does not have to be inclined with respect to the first direction x in a plan view.

[0108] The center of the first die pad portion 14 in the second direction y is located closer to the y2 side in the second direction y than the center of the first outer portion 11 in the second direction y. Therefore, in the second direction y, the center of the first outer portion 11 is located closer to the y1 side in the second direction y than the center of the first die pad portion 14. In this embodiment, as shown in FIGS. 23 and 24 , a part of the first root portion 112 overlaps the first die pad portion 14 when viewed in the first direction x. Alternatively, the entire first root portion 112 may overlap the first die pad portion 14 when viewed in the first direction x. Alternatively, the entire first root portion 112 may not overlap the first die pad portion 14 when viewed in the first direction x. Therefore, the first outer portion 11 may be disposed outward in the second direction y than the first die pad portion 14 (on the y1 side in the second direction y).

[0109] As shown in FIGS. 23 and 25, the second connecting portion 23 of the electronic device A3 is connected to the third side surface 243 of the second die pad portion 24. The second connecting portion 23 is connected to the middle of the third side surface 243 in the second direction y. In the example shown, the second connecting portion 23 is connected to a portion of the third side surface 243 closer to the y1 side in the second direction y in the second direction y. The second connecting portion 23 is inclined with respect to the first direction x in a plan view. The inclination angle of the second connecting portion 23 with respect to the first direction x is not particularly limited. Furthermore, the second connecting portion 23 does not have to be inclined with respect to the first direction x in a plan view.

[0110] The center of the second die pad portion 24 in the second direction y is located closer to the y2 side in the second direction y than the center of the second outer portion 21 in the second direction y. Therefore, in the second direction y, the center of the second outer portion 21 is located closer to the y1 side in the second direction y than the center of the second die pad portion 24. In this embodiment, as shown in FIGS. 23 and 25 , a part of the second root portion 212 overlaps the second die pad portion 24 when viewed in the first direction x. Alternatively, the entire second root portion 212 may overlap the second die pad portion 24 when viewed in the first direction x. Alternatively, the entire second root portion 212 may not overlap the second die pad portion 24 when viewed in the first direction x. Therefore, the second outer portion 21 may be disposed outward in the second direction y than the second die pad portion 24 (on the y1 side in the second direction y).

[0111] In the electronic device A3, in a plan view, a first distance D1 (see FIG. 24 ) from a first end 114a on the x2 side of the first cut mark 114 in the first outer part 11 to a first corner 149a of the first die pad part 14 and a first length L1 (see FIG. 24 ) of the first outer part 11 in the second direction y satisfy the following relationship: Specifically, the first distance D1 is 10.8 times or less the first length L1 (L1 / D1≦10.8). For example, the first distance D1 from the first end 114a to the first corner 149a is 5.5 times or more and 10.8 times or less the first length L1 of the first outer part 11 in the second direction y. As an example of the dimension, the first distance D1 is 1.1 mm or more and 2.2 mm or less.

[0112] Furthermore, in the electronic device A3, in a plan view, a second distance D2 (see FIG. 25) from a second end 214a of the second cut mark 214 in the second outer part 21 on the x1 side in the first direction x to a second corner 249a of the second die pad part 24 and a second length L2 (see FIG. 25) of the second outer part 21 in the second direction y have the following relationship: Specifically, the second distance D2 is 10.8 times or less the second length L2 (L2 / D2≦10.8). For example, the second distance D2 from the second end 214a to the second corner 249a is 5.5 times or more and 10.8 times or less the second length L2 of the second outer part 21 in the second direction y. As an example of the dimension, the second distance D2 is 1.1 mm or more and 2.2 mm or less.

[0113] Like the electronic device A1, the electronic device A3 can also suppress deformation of the first lead 1 and the second lead 2, i.e., deformation of the lead frame. In addition, the electronic device A3 has the same configuration as the electronic device A1, and thereby achieves the same effects.

[0114] The electronic device according to the present disclosure is not limited to the above-described embodiment, and the specific configuration of each part of the electronic device according to the present disclosure can be freely modified in various ways.

[0115] In the above embodiment and each modified example, the center of the first outer part 11 is located closer to the y1 side in the second direction y than the center of the first die pad part 14 in the second direction y, but the present disclosure is not limited to this. The center of the first outer part 11 may be located at the same position as the center of the first die pad part 14 in the second direction y. Furthermore, the present disclosure is not limited to the above configuration in which the center of the second outer part 21 is located closer to the y1 side in the second direction y than the center of the second die pad part 24 in the second direction y, but the center of the second outer part 21 may be located at the same position as the center of the second die pad part 24 in the second direction y.

[0116] The present disclosure includes configurations relating to the following notes. [Appendix 1] a first electronic component; a sealing resin that covers the first electronic component; a first lead including a first inner portion covered with the sealing resin and a first outer portion exposed from the sealing resin; the first inner part includes a first die pad part on which the first electronic component is mounted, and a first connecting part connecting the first outer part and the first die pad part, the first outer portion is located on one side of the first die pad portion in a first direction perpendicular to a thickness direction of the first electronic component, a center of the first outer portion is located at the same position as a center of the first die pad portion in a second direction perpendicular to the thickness direction and the first direction, or is located on one side of the center of the first die pad portion in the second direction; the first die pad portion has a rectangular shape when viewed in the thickness direction, and has a first corner portion located on the other side in the first direction and on the other side in the second direction; the first outer portion has a first cut mark facing the other side in the second direction, An electronic device, wherein, when viewed in the thickness direction, a first distance from a first end of the first cut mark on the other side of the first direction to the first corner portion is 10.8 times or less the first length of the first outer portion in the second direction. [Appendix 2] the first die pad portion has a first side surface facing one side in the first direction, 2. The electronic device of claim 1, wherein the first connecting portion is connected to the first side surface. [Appendix 3] the first die pad portion has a second side surface facing one side in the second direction; The electronic device of claim 1, wherein the first connecting portion is connected to the second side surface. [Appendix 4] 4. The electronic device according to claim 1, wherein the first outer portion includes a first portion and a second portion spaced apart from each other in the second direction. [Appendix 5] Further comprising a plurality of terminal leads; each of the plurality of terminal leads includes a terminal lead inner portion covered with the sealing resin and a terminal lead outer portion exposed from the sealing resin; the terminal lead outer portion is located apart from the first die pad portion in the first direction, An electronic device as described in Appendix 4, wherein, when viewed in the thickness direction, the length of each of the first and second parts in the second direction is greater than the length of the terminal lead outer part in the second direction. [Appendix 6] 5. The electronic device of claim 4, wherein the first outer portion includes a third portion spaced apart from the first portion and the second portion in the second direction. [Appendix 7] 7. The electronic device according to any one of claims 1 to 6, wherein the first thickness of the first lead in the thickness direction is not less than 0.2 mm and not more than 0.3 mm. [Appendix 8] 8. The electronic device according to claim 1, wherein the first distance is greater than or equal to 5.5 times and less than or equal to 10.8 times the first length. [Appendix 9] 9. The electronic device according to claim 1, wherein the first connecting portion is inclined with respect to the first direction when viewed in the thickness direction. [Appendix 10] a second electronic component; a second lead spaced apart from the first lead; the second lead includes a second inner portion covered with the sealing resin and a second outer portion exposed from the sealing resin, the second inner part includes a second die pad part on which the second electronic component is mounted, and a second connecting part connecting the second outer part and the second die pad part, the second die pad portion is located on the other side in the first direction with respect to the first die pad portion, the second outer portion is located on the other side of the second die pad portion in the first direction, In the second direction, a center of the second outer portion is located at the same position as a center of the second die pad portion or on one side of the center of the second die pad portion in the second direction, the second die pad portion has a rectangular shape when viewed in the thickness direction, and has a second corner portion located on one side in the first direction and on the other side in the second direction; the second outer portion has a second cut mark facing the other side in the second direction, An electronic device described in any one of Appendixes 1 to 9, wherein, when viewed in the thickness direction, a second distance from a second end on one side of the second cut mark in the first direction to the second corner portion is 10.8 times or less the second length in the second direction of the second outer portion. [Appendix 11] the second die pad portion has a third side surface facing the other side in the first direction, The electronic device of claim 10, wherein the second connecting portion is connected to the third side surface. [Appendix 12] the second die pad portion has a fourth side surface facing one side in the second direction, The electronic device of claim 10, wherein the second connecting portion is connected to the fourth side surface. [Appendix 13] 13. The electronic device according to any one of claims 10 to 12, wherein the second outer portion includes a fourth portion and a fifth portion spaced apart from each other in the second direction. [Appendix 14] The electronic device of claim 13, wherein the second outer portion includes a sixth portion spaced apart from the fourth portion and the fifth portion in the second direction. [Appendix 15] 15. The electronic device according to any one of claims 10 to 14, wherein the second thickness of the second lead in the thickness direction is not less than 0.2 mm and not more than 0.3 mm. [Appendix 16] 16. The electronic device according to any one of claims 10 to 15, wherein the second distance is greater than or equal to 5.5 times and less than or equal to 10.8 times the second length. [Appendix 17] 17. The electronic device according to claim 10, wherein the second connecting portion is inclined with respect to the first direction when viewed in the thickness direction. [Explanation of symbols]

[0117] A1,A2,A21,A3:Electronic equipment 1: First lead 11: First outer part 11A: Part 1 11B: Part 2 11C: Part 3 111: First mounting section 112: First root part 113: First relay section 114: 1st cutting mark 114a: 1st end 12: First inner part 13: 1st connection part 14: First die pad part 141: Main surface 142: Back side 143 :1st side 144:Second side 149a: 1st corner 2: Second lead 21: Second outer part 21A: Part 4 21B: Part 5 21C: Part 6 211: Second mounting section 212: Second root part 213: Second relay station 214:Second cutting mark 214a: 2nd end 22: Second inner part 23:Second connection part 24: Second die pad area 241: Main surface 242: Back side 243:Third side 244: 4th side 249a:Second corner 3: Third lead 31: Third outer section 31A: Part 7 31B: Part 8 311: Third mounting section 312: Third root part 313: Third relay station 32: Third inner section 4, 4A, 4B: 4th lead 41: 4th outer part 41A: Part 9 41B: Part 10 411: 4th mounting section 412: 4th root part 413: 4th relay station 42: 4th inner part 51: First electronic component 511,512,513: Electrode 52: Secondary electronic components 521,522,523: Electrode 61 to 66: Connection parts 7: Sealing resin 71: Resin main surface 72: Resin back 731: First resin side 732: Second resin side 733: First resin side 734: 4th resin side 9: Lead frame 91: Tie bar C1, C2: Connection points L1: First length L2: Second length D1: First distance D2: 2nd distance t1: First thickness t2: Second thickness GND: Ground OP: operational amplifier R1 to R5: Resistive elements TE1, TE2: Terminals

Claims

1. a first electronic component; a sealing resin that covers the first electronic component; a first lead including a first inner portion covered with the sealing resin and a first outer portion exposed from the sealing resin; the first inner part includes a first die pad part on which the first electronic component is mounted, and a first connecting part connecting the first outer part and the first die pad part, the first outer portion is located on one side of the first die pad portion in a first direction perpendicular to a thickness direction of the first electronic component, a center of the first outer portion is located at the same position as a center of the first die pad portion in a second direction perpendicular to the thickness direction and the first direction, or is located on one side of the center of the first die pad portion in the second direction; the first die pad portion has a rectangular shape when viewed in the thickness direction, and has a first corner portion located on the other side in the first direction and on the other side in the second direction; the first outer portion has a first cut mark facing the other side in the second direction, An electronic device, wherein, when viewed in the thickness direction, a first distance from a first end on the other side of the first cut mark in the first direction to the first corner portion is 10.8 times or less the first length in the second direction of the first outer portion.

2. the first die pad portion has a first side surface facing one side in the first direction, The electronic device according to claim 1 , wherein the first connecting portion is connected to the first side surface.

3. the first die pad portion has a second side surface facing one side in the second direction; The electronic device according to claim 1 , wherein the first connecting portion is connected to the second side surface.

4. The electronic device according to claim 1 , wherein the first outer portion includes a first portion and a second portion spaced apart from each other in the second direction.

5. Further comprising a plurality of terminal leads; each of the plurality of terminal leads includes a terminal lead inner portion covered with the sealing resin and a terminal lead outer portion exposed from the sealing resin; the terminal lead outer portion is located apart from the first die pad portion in the first direction, 5. The electronic device according to claim 4, wherein, when viewed in the thickness direction, the length of each of the first portion and the second portion in the second direction is greater than the length of the terminal lead outer portion in the second direction.

6. The electronic device according to claim 4 , wherein the first outer portion includes a third portion spaced apart from the first portion and the second portion in the second direction.

7. The electronic device according to claim 1 , wherein the first lead has a first thickness in the thickness direction of 0.2 mm or more and 0.3 mm or less.

8. The electronic device of claim 1 , wherein the first distance is greater than or equal to 5.5 times and less than or equal to 10.8 times the first length.

9. The electronic device according to claim 1 , wherein the first connecting portion is inclined with respect to the first direction when viewed in the thickness direction.

10. a second electronic component; a second lead spaced apart from the first lead; the second lead includes a second inner portion covered with the sealing resin and a second outer portion exposed from the sealing resin; the second inner part includes a second die pad part on which the second electronic component is mounted, and a second connecting part connecting the second outer part and the second die pad part, the second die pad portion is located on the other side in the first direction with respect to the first die pad portion, the second outer portion is located on the other side of the second die pad portion in the first direction, a center of the second outer portion is located at the same position as a center of the second die pad portion in the second direction or on one side of the center of the second die pad portion in the second direction; the second die pad portion has a rectangular shape when viewed in the thickness direction, and has a second corner portion located on one side in the first direction and on the other side in the second direction; the second outer portion has a second cut mark facing the other side in the second direction, An electronic device as described in any one of claims 1 to 9, wherein, when viewed in the thickness direction, a second distance from a second end on one side of the second cut mark in the first direction to the second corner portion is 10.8 times or less the second length in the second direction of the second outer portion.

11. the second die pad portion has a third side surface facing the other side in the first direction, The electronic device according to claim 10 , wherein the second connecting portion is connected to the third side surface.

12. the second die pad portion has a fourth side surface facing one side in the second direction, The electronic device according to claim 10 , wherein the second connecting portion is connected to the fourth side surface.

13. The electronic device according to claim 10 , wherein the second outer portion includes a fourth portion and a fifth portion spaced apart from each other in the second direction.

14. The electronic device according to claim 13 , wherein the second outer portion includes a sixth portion spaced apart from the fourth portion and the fifth portion in the second direction.

15. The electronic device according to claim 10 , wherein the second thickness of the second lead in the thickness direction is not less than 0.2 mm and not more than 0.3 mm.

16. The electronic device of claim 10 , wherein the second distance is greater than or equal to 5.5 times and less than or equal to 10.8 times the second length.

17. The electronic device according to claim 10 , wherein the second connecting portion is inclined with respect to the first direction when viewed in the thickness direction.

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