Electronic component and manufacturing method for the same

Abstract

To provide an electronic component in which a semiconductor element is housed in a package in which a substrate and a resin frame are integrated, capable of suppressing a contamination of a foreign matter generated from the package.SOLUTION: An electronic component includes: a substrate provided with a semiconductor element; a frame body provided on the substrate so as to surround a periphery of the semiconductor element; and a lid body fixed to the frame body. The frame body has: a first surface in contact with the substrate; and a second surface facing the lid body. A second surface of the frame body includes: a frame-shaped first region to which the lid body is bonded; a frame-shaped second region located inside the first region and provided with a concave part concaved toward the substrate; and a frame-shaped third region located inside the second region and provided with a convex part protruding toward the lid body. The height of a tip part of the convex part with respect to the substrate is lower than the height of a bonding surface between the frame body and the lid body with respect to the substrate, and is higher than the height of the bottom of the concave part with respect to the substrate.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to an electronic component and a method for manufacturing the same. [Background technology]

[0002] Electronic devices such as imaging devices are sometimes configured as electronic components housed in a package that integrates a circuit board on which the electronic device is mounted and a resin frame. Patent Document 1 describes an imaging device configured to improve the adhesive strength between the resin frame and a lid by providing a protrusion on the surface of the resin frame. Patent Document 2 describes a semiconductor pressure sensor device configured to prevent a protective member for a sensor chip from creeping up the frame by providing a recess on the surface of the frame component of the package. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2015-038920 [Patent Document 2] Japanese Patent Application Laid-Open No. 2014-228295 Summary of the Invention [Problem to be solved by the invention]

[0004] In electronic components in which an electronic device such as an imaging device is housed in a package, there is a demand for further reduction in the amount of foreign matter entering the package due to pixel reduction, etc. However, Patent Documents 1 and 2 do not give particular consideration to foreign matter generated from the package, which may result in deterioration of the characteristics and reliability of the electronic device.

[0005] An object of the present invention is to provide a technique for suppressing the intrusion of foreign matter generated from a package in an electronic component in which a semiconductor element is housed in a package in which a substrate and a resin frame are integrated. [Means for solving the problem]

[0006] According to one disclosure of the present specification, there is provided an electronic component having a substrate on which a semiconductor element is provided, a frame body provided on the substrate so as to surround the periphery of the semiconductor element, and a lid body fixed to the frame body, wherein the frame body has a first surface in contact with the substrate and a second surface facing the lid body, the second surface of the frame body having a frame-shaped first region to which the lid body is joined, a frame-shaped second region located inward from the first region and having a recess that is recessed toward the substrate, and a frame-shaped third region located inward from the second region and having a protrusion that protrudes toward the lid body, and wherein the height of the tip of the protrusion relative to the substrate is lower than the height of the joining surface between the frame body and the lid body relative to the substrate and is higher than the height of the bottom of the recess relative to the substrate.

[0007] According to another disclosure of the present specification, there is provided a method for manufacturing an electronic component, the method comprising the steps of: forming a frame body on a substrate on which a semiconductor element is provided so as to surround the periphery of the semiconductor element; and fixing a lid body to the frame body so as to close the space in which the semiconductor element is provided; wherein in the step of forming the frame body, the frame body is formed by injection molding using a first mold for mounting the substrate, a second mold for molding the inner surface of the frame body, and a third mold for molding the surface of the frame body that faces the lid body; the second mold and the third mold are separate and configured so that the distance between them and the first mold can be changed independently of each other; and the third mold has a frame-shaped first region for molding the surface to which the lid body is bonded, and a frame-shaped second region that is located more inward than the first region and has a protrusion that protrudes more toward the first mold than the first region. [Effects of the Invention]

[0008] According to the present invention, in an electronic component in which a semiconductor element is housed in a package in which a circuit board and a resin frame are integrated, it is possible to prevent the intrusion of foreign matter generated from the package, and to suppress deterioration of the characteristics and reliability of the semiconductor element. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a schematic plan view showing a configuration example of an electronic component according to a first embodiment. FIG. [Figure 2] 1 is a schematic cross-sectional view showing a configuration example of an electronic component according to a first embodiment. [Figure 3] 2 is a schematic plan view showing an example of the configuration of a substrate in the electronic component according to the first embodiment. FIG. [Figure 4] 1 is a schematic cross-sectional view (part 1) showing a mold used in the method for manufacturing an electronic component according to the first embodiment. [Figure 5] 4 is a second schematic cross-sectional view showing a mold used in the method for manufacturing an electronic component according to the first embodiment. FIG. [Figure 6] 2A to 2C are cross-sectional views showing steps in a method for manufacturing an electronic component according to the first embodiment. [Figure 7] 2 is an enlarged cross-sectional view showing the structure of a mold used in the method for manufacturing an electronic component according to the first embodiment and a frame body manufactured using the mold. FIG. [Figure 8] 10A and 10B are diagrams illustrating the problem that occurs when a third mold does not have a protrusion. [Figure 9] 10 is an enlarged cross-sectional view (part 1) showing another example of a mold used in the method for manufacturing an electronic component according to the first embodiment and the structure of a frame body manufactured using the mold. FIG. [Figure 10] 10 is an enlarged cross-sectional view (part 2) showing another example of a mold used in the method for manufacturing an electronic component according to the first embodiment and the structure of a frame body manufactured using the mold. FIG. [Figure 11] 10 is an enlarged cross-sectional view (part 3) showing another example of a mold used in the method for manufacturing an electronic component according to the first embodiment and the structure of a frame body manufactured using the mold. FIG. [Figure 12] FIG. 10 is a block diagram showing a schematic configuration of a device according to a second embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0010] The embodiments described below are intended to embody the technical concept of the present invention and are not intended to limit the scope of the present invention. The sizes and positional relationships of the components shown in the drawings may be exaggerated for clarity.

[0011] [First embodiment] The structure of an electronic component according to a first embodiment of the present invention will be described with reference to Figs. 1 to 3. Fig. 1 is a schematic plan view showing an example of the configuration of an electronic component according to this embodiment. Fig. 2 is a schematic cross-sectional view showing an example of the configuration of an electronic component according to this embodiment. Fig. 2 is a cross-sectional view taken along line II' in Fig. 1. Fig. 3 is a schematic plan view showing an example of the configuration of a substrate in an electronic component according to this embodiment.

[0012] As shown in FIGS. 1 and 2 , the electronic component 100 according to this embodiment may include a semiconductor element 10, a substrate 20, a frame 30, and a lid 40. The semiconductor element 10 is a semiconductor substrate (semiconductor chip) provided with, for example, a photoelectric conversion element such as an imaging element, though not limited thereto. The substrate 20, together with the frame 30 and the lid 40, is part of a package that defines a cavity (internal space 50) for accommodating the semiconductor element 10. The substrate 20 also serves as a mounting member for mechanically fixing the electronic component 100 and electrically connecting it to an external device. The substrate 20 is an insulating substrate made of a resin such as glass epoxy or ceramic, and is preferably a rigid substrate, though not limited thereto. The substrate 20 may be a circuit board such as a printed circuit board, and may further include other elements mounted thereon in addition to the semiconductor element 10. The frame 30 serves to hold the lid 40 at a distance from the substrate 20 to define the cavity for accommodating the semiconductor element 10. The cover 40 is not particularly limited, but can be made of a light-transmitting material when the semiconductor element 10 constitutes an optical device such as a photoelectric conversion element.

[0013] The semiconductor element 10 is a plate-like body having a first surface 12 and a second surface 14 opposite the first surface 12. The substrate 20 is a plate-like body having a first surface 22, a second surface 24 opposite the first surface 22, and a side surface 26 between the first surface 22 and the second surface 24. Using the coordinate systems shown in FIGS. 1 and 2 , the first surface 12 and the second surface 14 of the semiconductor element 10 and the first surface 22 and the second surface 24 of the substrate 20 may be parallel to the XY plane. The side surface 26 of the substrate 20 may be parallel to the XZ plane or the YZ plane. The normal direction to the first surface 12 of the semiconductor element 10 and the first surface 22 of the substrate 20 may be the Z direction. The normal direction to the second surface 14 of the semiconductor element 10 and the second surface 24 of the substrate 20 may be the direction opposite to the Z direction (-Z direction).

[0014] The semiconductor element 10 is fixed to the center of the first surface 22 of the substrate 20 with an adhesive (not shown) so that the second surface 14 of the semiconductor element 10 faces the first surface 22 of the substrate 20. The semiconductor element 10 and the substrate 20 are electrically connected via a plurality of bonding wires 16. The bonding wires 16 may be connected to the periphery of the first surface 12 of the semiconductor element 10, as shown in FIGS. 1 and 2, for example. Note that the electrical connection between the semiconductor element 10 and the substrate 20 does not necessarily have to be by bonding wires 16, and solder bumps or the like may also be used.

[0015] The frame 30 has a first surface (lower surface) 32 that contacts the first surface 22 of the substrate 20, and a second surface (upper surface) 34 that faces the lid 40. The first surface 32 of the frame 30 is bonded to the peripheral edge of the first surface 22 of the substrate 20. The frame 30 may be provided so as to contact not only the first surface 22 but also the side surface 26 of the substrate 20, as shown in FIG. 2, for example. By providing the frame 30 so as to contact the first surface 22 and the side surface 26 of the substrate 20, the adhesive strength between the substrate 20 and the frame 30 can be improved. In this case, a portion (first surface 32′) of the first surface 32 of the frame 30 can form a single plane together with the second surface 24 of the substrate 20.

[0016] The second surface 34 of the frame 30 has a frame-shaped first region 34a to which the lid 40 is bonded, and a frame-shaped second region 34b located more inward (toward the inner surface 33) than the first region 34a and provided with a recess 36 recessed toward the substrate 20. The second surface 34 of the frame 30 also has a frame-shaped third region 34c located more inward (toward the inner surface 33) than the second region 34b and provided with a protrusion 38 protruding toward the lid 40. The recess 36 is provided to surround the third region 34c in a plan view. The third region 34c is in contact with the inner surface 33 of the frame 30. The Z-direction height of the tip of the protrusion 38 provided in the third region 34c is lower than the Z-direction height of the bonding surface between the frame 30 and the lid 40 and higher than the Z-direction height of the bottom of the recess 36 provided in the second region.

[0017] The lid 40 is a flat member having a first surface 42 and a second surface 44 opposite the first surface 42. The first surface 42 and the second surface 44 may be surfaces parallel to the XY plane. The lid 40 is fixed to a first region 34a of the second surface 34 of the frame 30 with an adhesive (not shown) so as to cover the space surrounded by the frame 30 and the substrate 20. In this manner, an internal space 50 for accommodating the semiconductor element 10 is defined by the substrate 20, the frame 30, and the lid 40. The lid 40 is disposed so as to face the semiconductor element 10 at a distance. The thickness (height in the Z direction) of the frame 30 is greater than the thickness (height in the Z direction) of the semiconductor element 10 so that the semiconductor element 10 can be accommodated in the internal space 50 when the frame 30 and the lid 40 are disposed on the substrate 20.

[0018] The external shapes of the semiconductor element 10 and the electronic component 100 in a plan view are typically rectangular. The dimensions of the electronic component 100 in the Z direction are smaller than the dimensions of the electronic component 100 in the X and Y directions. That is, the electronic component 100 has a generally flat plate shape. In this specification, a plan view refers to a view from the Z direction, and corresponds to the plan view of FIG. 1, for example.

[0019] Next, a configuration example of the substrate 20 will be described in more detail with reference to Fig. 3. Fig. 3(a) is a schematic plan view of the first surface 22 side of the substrate 20, and Fig. 3(b) is a schematic plan view of the second surface 24 side of the substrate 20.

[0020] The first surface 22 of the substrate 20 includes a first region 22a to which the semiconductor element 10 is fixed and electrically connected, and a second region 22b to which the frame body 30 is bonded. In Fig. 3(a), the rectangular region inside the dashed line corresponds to the first region 22a, and the frame-shaped region outside the dashed line corresponds to the second region 22b. The second region 22b surrounds the first region 22a.

[0021] As shown in FIG. 3(b), for example, electronic elements such as connectors 242, passive components 244 such as resistors, capacitors, and diodes, active components 246 such as transistors, and integrated circuit chips 248 may be mounted on the second surface 24 of the substrate 20. In FIG. 3(b), the rectangular area inside the dashed line is the first area 24a opposite the first area 22a of the first surface 22, and the frame-shaped area outside the dashed line is the second area 24b opposite the second area 22b of the first surface 22. In the configuration example of FIG. 3(b), electronic elements are mounted only in the first area 24a, but at least some of the electronic elements may be disposed in the second area 24b.

[0022] In the method for manufacturing electronic component 100 according to this embodiment, injection molding is used to form frame body 30. Therefore, before describing the specific method for manufacturing electronic component 100, the mold used for injection molding frame body 30 will be described with reference to FIGS. 4 and 5. FIGS. 4 and 5 are schematic cross-sectional views of the mold corresponding to the cross section taken along line II' in FIG. 1. FIGS. 4(a) and 5(a) show the mold in an open state, and FIGS. 4(b) and 5(b) show the mold in a closed state.

[0023] As shown in FIGS. 4 and 5 , the mold used for injection molding the frame body 30 may be composed of a first mold 60, a second mold 70, and a third mold 80. The first mold 60 serves as a base for placing the substrate 20 on which the semiconductor element 10 is mounted, and, together with the substrate 20, determines the shape of the bottom side (first surface 32 side) of the frame body 30. The second mold 70 presses and fixes the substrate 20 between itself and the first mold 60, and also determines the shape of the inner surface 33 of the frame body 30. The third mold 80 is a mold opposite the first mold 60, and determines the shape of the top side (second surface 34 side) of the frame body 30. An opening 86 is provided in the center of the third mold 80, into which the second mold 70 is inserted. The molds are closed, i.e., the third mold 80 is abutted on the first mold 60 and the second mold 70 is fitted into the opening 86, thereby forming a cavity 90 inside the molds (see FIGS. 4(b) and 5(b)). The shape of the outer surface of the frame 30 can be determined by either or both of the first mold 60 and the third mold 80.

[0024] The first mold 60 has a first surface 62 that faces the third mold 80 and a second surface 64 that faces the second mold 70. If electronic elements are mounted on the second surface 24 of the substrate 20, the second surface 64 may be located lower in the Z direction than the first surface 62 to prevent interference with the electronic elements, as in the mold shown in FIG. 4. If electronic elements are not mounted on the second surface 24 of the substrate 20, the first surface 62 and the second surface 64 may be at the same height, as in the mold shown in FIG. 5. Furthermore, if the frame 30 is configured to also contact the side surface 26 of the substrate 20 as shown in FIG. 2, the first mold 60 may be configured so that the outer edge of the first surface 62 is located outside the outer edge of the substrate 20.

[0025] The second mold 70 has a first surface 72 that faces the second surface 64 of the first mold 60. A protrusion 74 that protrudes toward the first mold 60 is provided on the outer periphery of the first surface 72. The protrusion 74 is provided in a position that presses the outer periphery of the first region 22a of the substrate 20 when the substrate 20 is placed on the first mold 60. The protrusion 74 also serves to prevent contact between the semiconductor element 10 and the first surface 72 of the second mold 70 when the substrate 20 on which the semiconductor element 10 is mounted is pressed.

[0026] The third mold 80 has a first surface 82 that faces the first surface 62 of the first mold 60. The first surface 82 has a frame-shaped first region for molding the surface to which the lid 40 is bonded, and a frame-shaped second region that is located more inward than the first region and has a protrusion 84 that protrudes more toward the first mold 60 than the first region. The protrusion 84 corresponds to the recess 36 provided in the second surface 34 of the frame 30, and is provided at the end of the third mold 80 on the side of the second mold 70 (the side of the opening 86).

[0027] By closing the mold, a cavity 90 is formed inside the mold. At this time, because the second mold 70 has the protrusion 74, when the substrate 20 is pressed by the second mold 70, the cavity 90 is divided into a cavity (central cavity 92) for accommodating the semiconductor element 10 and a cavity (frame-shaped cavity 94) for molding the frame body 30. The central cavity 92 and the frame-shaped cavity 94 will be described later.

[0028] The first mold 60 is also provided with a gate 66 for injecting resin into the cavity inside the mold, and an air vent 68 for removing air expelled by the injected resin. The gate 66 and the air vent 68 only need to be connected to the frame-shaped cavity 94 inside the mold into which the resin is injected, and do not necessarily have to be located in the illustrated position on the first mold 60. The gate 66 and the air vent 68 do not necessarily have to be provided on the first mold 60, and may be provided on the second mold 70 or the third mold 80.

[0029] Next, a method for manufacturing an electronic component according to this embodiment will be described with reference to Figs. 6 to 11. Fig. 6 is a process cross-sectional view showing the method for manufacturing an electronic component according to this embodiment. Fig. 7 is an enlarged cross-sectional view showing the structure of a mold used in the method for manufacturing an electronic component according to this embodiment and a frame body manufactured using the mold. Fig. 8 is a diagram explaining the problem when a third mold is not provided with a protrusion. Figs. 9 to 11 are enlarged cross-sectional views showing another example of a mold used in the method for manufacturing an electronic component according to this embodiment and the structure of a frame body manufactured using the mold.

[0030] First, the substrate 20 on which the semiconductor element 10 is mounted is set in a mold consisting of a first mold 60, a second mold 70, and a third mold 80. At this time, the second mold 70 is pressed in the -Z direction until the convex portion 74 contacts the substrate 20, and the substrate 20 is sandwiched and fixed between the first mold 60 and the convex portion 74. As a result, the cavity 90 inside the mold is divided into a central cavity 92 and a frame-shaped cavity 94 by the convex portion 74 ( FIG. 6( a) ). This makes it possible to prevent resin from leaking from the frame-shaped cavity 94 into the central cavity 92 during injection molding, which will be described later.

[0031] In this embodiment, the mold opposing the first mold 60 is divided into the second mold 70 and the third mold 80 in consideration of the possibility of variations in the thickness of the substrate 20. Specifically, if the second mold 70 and the third mold 80 are integrated when the substrate 20 is thinner than the design value, the separation between the frame-shaped cavity 94 and the central cavity 92 by the convex portion 74 will be insufficient, and resin may leak from the frame-shaped cavity 94 into the central cavity 92. Conversely, if the second mold 70 and the third mold 80 are integrated when the substrate 20 is thicker than the design value, the convex portion 74 may press the substrate 20 more than necessary, potentially damaging the substrate 20. Dividing the mold opposing the first mold 60 into the second mold 70 and the third mold 80 makes it possible to adjust the height of the second mold 70 according to the thickness of the substrate 20, effectively preventing resin from leaking into the central cavity 92 and damaging the substrate 20.

[0032] FIG. 7(a) is an enlarged view of the area surrounded by dotted lines in FIGS. 4(b) and 5(b). As shown in FIG. 7(a), a gap 88 is provided between the second mold 70 and the third mold 80. Providing the gap 88 between the second mold 70 and the third mold 80 allows the second mold 70 to slide within the opening 86 of the third mold 80, enabling the height of the second mold 70 to be adjusted independently of the third mold 80. That is, the second mold 70 and the third mold 80 are separate, and the distance between them and the first mold 60 can be adjusted independently. However, if the gap 88 is too wide, air may escape through the gap 88, potentially degrading the shape accuracy of the resin. Therefore, it is desirable to set the gap 88 to the minimum width necessary to allow the second mold 70 to slide. A suitable width for the gap 88 is, for example, approximately 10 μm or more and 50 μm or less.

[0033] Next, resin 96 is injected into the frame-shaped cavity 94 through a gate 66 provided in the mold. The resin 96 injected through the gate 66 advances so as to fill the frame-shaped cavity 94. Air in the frame-shaped cavity 94 is pushed by the injected resin 96 and discharged through an air vent 68 (FIGS. 6(b) and 6(c)). After the frame-shaped cavity 94 is filled with the resin 96, the resin 96 hardens and becomes a frame body 30 having a shape corresponding to the shape of the frame-shaped cavity 94.

[0034] Next, the substrate 20 to which the frame body 30 is bonded is removed from the mold, and a lid body 40 is bonded onto the second surface 34 of the frame body 30 so as to form an internal space 50 between the substrate 20 and the frame body 30, thereby completing the electronic component (Figure 6(d)).

[0035] When the resin 96 is injected, a gap 88 exists between the second mold 70 and the third mold 80. Therefore, the resin 96 may enter the gap 88 and remain as a protrusion 38 (burr 98) after the molding of the frame body 30 (see FIG. 7(b)). Here, assuming that the third mold 80 does not have a protrusion 84, as shown in FIG. 8(a), the burr 98 protrudes in the Z direction beyond the height of the joining surface between the frame body 30 and the lid body 40. Therefore, during the process of joining the lid body 40 to the second surface 34 of the frame body 30, the burr 98 may break off and fall into the internal space 50, as shown in FIG. 8(b). If the broken burr 98 adheres to the semiconductor element 10 as a foreign object, it may cause deterioration in the characteristics and reliability of the electronic component 100. For example, if the semiconductor element 10 is a photoelectric conversion element such as an imaging element, it may cause deterioration in image quality.

[0036] In this regard, in this embodiment, a convex portion 84 that protrudes in the -Z direction is provided on the end (the side of the opening 86) of the third mold 80 that faces the second mold 70. Therefore, even if resin 96 enters the gap 88 between the second mold 70 and the third mold 80, the upper end of the burr 98 will not be higher in the Z direction than the second surface 34 of the frame 30 as long as the burr 98 does not exceed the height of the convex portion 84. This reduces the possibility that the burr 98 will be chipped in the process of joining the lid 40 onto the second surface 34 of the frame 30, and can suppress deterioration in the characteristics and reliability of the electronic component 100.

[0037] The width of the protrusions 84 of the third mold 80 is not particularly limited, but is preferably 0.1 mm or more and 1.0 mm or less. If the width of the protrusions 84 is less than 0.1 mm, it may affect the processing accuracy and durability of the mold. On the other hand, if the width of the protrusions 84 exceeds 1 mm, the contact area between the frame 30 and the lid 40 decreases, which may affect the adhesive strength of the lid 40. Furthermore, it is preferable that the height of the protrusions 84 of the third mold 80 in the Z direction be 50 μm or more. If the height of the protrusions 84 is less than 50 μm, the upper end of the burr 98 will be higher in the Z direction than the second surface 34 of the frame 30, which may cause chipping of the burr 98.

[0038] Focusing on the molded frame 30, the width of the recess 36 provided on the second surface 34 of the frame 30 is not particularly limited, but is preferably 0.1 mm or more and 1.0 mm or less. A width of the recess 36 less than 0.1 mm may affect the processing accuracy and durability of the mold. On the other hand, a width of the recess 36 greater than 1 mm may reduce the contact area between the frame 30 and the lid 40, potentially affecting the adhesive strength. Furthermore, the difference in height between the joint surface between the frame 30 and the lid 40 and the bottom of the recess 36 is preferably 50 μm or more. If the difference in height between the joint surface between the frame 30 and the lid 40 and the bottom of the recess 36 is less than 50 μm, the upper end surface of the burr 98 will be higher in the Z direction than the second surface 34 of the frame 30, potentially causing chipping of the burr 98.

[0039] The second mold 70 preferably has a tapered shape in which the width in the XY plane gradually decreases toward the first surface 72 that faces the first mold 60. In this case, the tapered surface 76 of the second mold 70 may be provided over the entire outer surface as shown in Fig. 9(a), or may be provided on a part of the outer surface as shown in Figs. 7(a), 10(a), and 11(a). In this specification, the tapered surface refers to a portion of the outer surface of the second mold 70 that is inclined with respect to the normal direction of the first surface 72.

[0040] However, when the tapered surface 76 is positioned within the opening 86 of the third mold 80 as shown in Figures 9(a) and 10(a), the width of the gap 88 on the frame-shaped cavity 94 side becomes wider as shown in Figures 9(b) and 10(b), and therefore an increase in the amount of resin 96 entering the gap 88 occurs. As a result, depending on the inclination angle of the tapered surface 76, it may become difficult to stably control the height of the upper end of the burr 98 to be lower than the height of the first surface 82 of the third mold 80. From this perspective, it is preferable to position the tapered surface 76 of the second mold 70 closer to the first surface 72 than the portion facing the inner surface of the third mold 80.

[0041] The width of the first surface 32 side of the inner side surface 33 of the frame body 30 molded using the tapered second mold 70 is narrower than the width of the second surface 34 side of the inner side surface 33. When the tapered surface 76 of the second mold 70 is positioned closer to the first surface 72 than the portion facing the inner side surface of the third mold 80, the width of the inner side surface 33 of the frame body 30 gradually narrows in the portion closer to the second surface 34 than the bottom of the recess 36.

[0042] Thus, according to this embodiment, in an electronic component in which an electronic device is housed in a package in which a substrate and a resin frame are integrated, it is possible to prevent the intrusion of foreign matter generated from the package, and to suppress deterioration of the characteristics and reliability of the electronic device.

[0043] [Second embodiment] A device according to a second embodiment of the present invention will be described with reference to Fig. 12. Fig. 12 is a block diagram showing a schematic configuration of the device according to this embodiment.

[0044] FIG. 12 is a schematic diagram showing an apparatus EQP including a photoelectric conversion device APR. The photoelectric conversion device APR has the functions of the electronic component 100 according to the first embodiment. All or part of the photoelectric conversion device APR is a semiconductor device IC (semiconductor element 10). The photoelectric conversion device APR of this example can be used, for example, as an image sensor, an AF (Auto Focus) sensor, a photometry sensor, or a distance measurement sensor. The semiconductor device IC has a pixel area PX in which pixel circuits PXC, each including a photoelectric conversion unit, are arranged in a matrix. The semiconductor device IC can have a peripheral area PR around the pixel area PX. Circuits other than pixel circuits can be arranged in the peripheral area PR.

[0045] The photoelectric conversion device APR may have a structure (chip stacking structure) in which a first semiconductor chip provided with a plurality of photoelectric conversion units and a second semiconductor chip provided with peripheral circuits are stacked. The peripheral circuits in the second semiconductor chip may be column circuits corresponding to the pixel columns of the first semiconductor chip. The peripheral circuits in the second semiconductor chip may also be matrix circuits corresponding to the pixels or pixel blocks of the first semiconductor chip. The first and second semiconductor chips may be connected by through-silicon vias (TSVs), inter-chip wiring formed by direct bonding of a conductor such as copper, connection by microbumps between chips, connection by wire bonding, or the like.

[0046] The photoelectric conversion device APR may include, in addition to the semiconductor device IC, a package PKG that houses the semiconductor device IC. The package PKG may include a base to which the semiconductor device IC is fixed, a cover such as glass that faces the semiconductor device IC, and connecting members such as bonding wires or bumps that connect terminals provided on the base to terminals provided on the semiconductor device IC.

[0047] The equipment EQP may further include at least one of an optical device OPT, a control device CTRL, a processing device PRCS, a display device DSPL, a memory device MMRY, and a mechanical device MCHN. The optical device OPT corresponds to the photoelectric conversion device APR as a photoelectric conversion device, and is, for example, a lens, a shutter, or a mirror. The control device CTRL controls the photoelectric conversion device APR and is, for example, a semiconductor device such as an ASIC. The processing device PRCS processes signals output from the photoelectric conversion device APR and constitutes an AFE (analog front end) or a DFE (digital front end). The processing device PRCS is a semiconductor device such as a CPU (central processing unit) or an ASIC (application-specific integrated circuit). The display device DSPL is an EL display device or a liquid crystal display device that displays information (images) obtained by the photoelectric conversion device APR. The memory device MMRY is a magnetic device or a semiconductor device that stores information (images) obtained by the photoelectric conversion device APR. The memory device MMRY is a volatile memory such as an SRAM or a DRAM, or a non-volatile memory such as a flash memory or a hard disk drive. The mechanical device MCHN has a moving part or a propulsion part such as a motor or an engine. The device EQP displays the signal output from the photoelectric conversion device APR on a display device DSPL and transmits the signal to the outside using a communication device (not shown) provided in the device EQP. For this purpose, the device EQP preferably further includes a memory device MMRY and a processing device PRCS in addition to the memory circuit unit and arithmetic circuit unit provided in the photoelectric conversion device APR.

[0048] The device EQP shown in FIG. 12 can be an electronic device such as an information terminal with a photographing function (e.g., a smartphone or a wearable device) or a camera (e.g., an interchangeable lens camera, a compact camera, a video camera, or a surveillance camera). The mechanical device MCHN in the camera can drive components of the optical device OPT for zooming, focusing, and shutter operation. The device EQP can also be transportation equipment (mobile object) such as a vehicle, a ship, or an aircraft. The device EQP can also be medical equipment such as an endoscope or a CT scanner.

[0049] The mechanical device MCHN in the transportation equipment can be used as a moving device. The device EQP as a transportation equipment is suitable for transporting the photoelectric conversion device APR and for assisting and / or automating driving (piloting) using a photographing function. The processing device PRCS for assisting and / or automating driving (piloting) can perform processing to operate the mechanical device MCHN as a moving device based on information obtained by the photoelectric conversion device APR.

[0050] The photoelectric conversion device APR according to this embodiment can provide high value to its designer, manufacturer, seller, purchaser, and / or user. Therefore, if the photoelectric conversion device APR is installed in a device EQP, the value of the device EQP can also be increased. Therefore, when manufacturing and selling the device EQP, deciding to install the photoelectric conversion device APR according to this embodiment in the device EQP is advantageous in increasing the value of the device EQP.

[0051] [Modified embodiment] The present invention is not limited to the above-described embodiment, and various modifications are possible.

[0052] For example, an example in which part of the configuration of any one of the embodiments is added to another embodiment, or an example in which part of the configuration of another embodiment is substituted therefor, is also an embodiment of the present invention.

[0053] Furthermore, in the first embodiment described above, it was assumed that the top of the frame body 30 was the first region 34a, which was the joint surface between the frame body 30 and the lid body 40. However, a region that is higher in the Z direction than the first region 34a may be provided in a portion on the outer side of the first region 34a that does not interfere with the lid body 40.

[0054] Furthermore, in the first embodiment, the semiconductor element 10 is assumed to be a photoelectric conversion element, but the semiconductor element 10 does not necessarily have to be a photoelectric conversion element, and may be another semiconductor element such as a semiconductor memory element.

[0055] It should be noted that the above-described embodiments are merely examples of specific embodiments for carrying out the present invention, and the technical scope of the present invention should not be construed as being limited by these embodiments. In other words, the present invention can be carried out in various forms without departing from its technical concept or main features.

[0056] Furthermore, the disclosure of this specification includes not only what is described in this specification but also all matters that can be understood from this specification and the drawings attached hereto. Furthermore, the disclosure of this specification includes the complement of the concepts described in this specification. In other words, if this specification states, for example, that "A is greater than B," it can be said to disclose that "A is not greater than B."

[0057] The disclosure of the above embodiment includes the following configurations and methods. (Configuration 1) a substrate on which a semiconductor element is provided; a frame provided on the substrate so as to surround the periphery of the semiconductor element; a lid body fixed to the frame body, the frame has a first surface in contact with the substrate and a second surface facing the lid, the second surface of the frame body has a frame-shaped first region to which the lid body is joined, a frame-shaped second region located more inward than the first region and provided with a recessed portion recessed toward the substrate, and a frame-shaped third region located more inward than the second region and provided with a protruding portion protruding toward the lid body, The height of the tip of the convex portion relative to the substrate is lower than the height of the joining surface between the frame body and the lid body relative to the substrate, and higher than the height of the bottom of the concave portion relative to the substrate. An electronic component characterized by: (Configuration 2) The recess is provided so as to surround the third region in a plan view. 2. The electronic component according to claim 1. (Configuration 3) The third region is in contact with the inner surface of the frame body. 3. The electronic component according to configuration 1 or 2. (Configuration 4) The width of the recess is 0.1 mm or more and 1.0 mm or less. 4. The electronic component according to any one of configurations 1 to 3. (Configuration 5) The difference between the height of the bonding surface and the height of the bottom of the recess is 50 μm or more. 5. The electronic component according to any one of configurations 1 to 4. (Configuration 6) The width of the inner surface of the frame body on the side of the first surface is narrower than the width of the inner surface on the side of the second surface. 6. The electronic component according to any one of configurations 1 to 5. (Configuration 7) The width of the inner surface gradually narrows from the bottom of the recess toward the first surface. 7. The electronic component according to configuration 6. (Configuration 8) the semiconductor element is a photoelectric conversion element, The lid is made of a light-transmitting material. 8. The electronic component according to any one of configurations 1 to 7. (Configuration 9) The substrate further includes an electronic element provided on a surface opposite to the surface on which the semiconductor element is provided. 9. The electronic component according to any one of configurations 1 to 8. (Method 1) A method for manufacturing an electronic component, comprising: a step of forming a frame body on a substrate on which a semiconductor element is provided so as to surround the periphery of the semiconductor element; and a step of fixing a lid body to the frame body so as to close a space in which the semiconductor element is provided, In the step of forming the frame body, the frame body is formed by injection molding using a first mold for placing the substrate, a second mold for molding an inner surface of the frame body, and a third mold for molding a surface of the frame body facing the lid body; The second mold and the third mold are separated and configured so that the distance between them and the first mold can be changed independently of each other; The third mold has a frame-shaped first region for molding a surface to which the lid body is bonded, and a frame-shaped second region that is located more inward than the first region and has a protrusion that protrudes more toward the first mold than the first region. A method for manufacturing an electronic component, comprising: (Method 2) The protrusion is provided on the end of the third mold on the side of the second mold. The method for producing an electronic component according to method 1, (Method 3) The width of the protrusion of the third mold is 0.1 mm or more and 1.0 mm or less. 3. The method for producing an electronic component according to method 1 or 2, (Method 4) The height of the protrusion of the third mold is 50 μm or more. 4. A method for producing an electronic component according to any one of Methods 1 to 3. (Method 5) The second mold has a tapered shape in which the width on the first mold side is narrower than the width on the third mold side. 5. A method for producing an electronic component according to any one of methods 1 to 4. (Method 6) The tapered shape is provided on the first mold side of the portion where the second mold and the third mold face each other. 6. The method for producing an electronic component according to method 5. (Method 7) A gap of 10 μm or more and 50 μm or less is provided between the second mold and the third mold. 7. A method for producing an electronic component according to any one of methods 1 to 6. (Method 8) The second mold has a frame-shaped protrusion that protrudes toward the substrate on the outer periphery of the surface facing the substrate, and is configured so that the second mold is separated from the semiconductor element when the protrusion is brought into contact with the substrate. 8. The method for producing an electronic component according to any one of Methods 1 to 7. (Configuration 10) The electronic component according to any one of configurations 1 to 9, an optical device corresponding to the electronic component; a control device for controlling the electronic components; a processing device that processes signals output from the electronic components; a mechanical device controlled based on the information obtained by the electronic component; a display device for displaying information obtained by the electronic component; and a storage device for storing information obtained by the electronic component; An apparatus characterized by comprising: [Explanation of symbols]

[0058] 10...Semiconductor element 20...Substrate 30…frame body 34...Side 1 36...recess 38...Convex part 40...lid body 50...Interior space 60...First mold 62…Side 1 64…Second side 70...Second mold 72...Side 1 74...Convex part 80...Third mold 82...Side 1 84...Convex part 100...Electronic components

Claims

1. a substrate on which a semiconductor element is provided; a frame provided on the substrate so as to surround the periphery of the semiconductor element; a lid body fixed to the frame body, the frame has a first surface in contact with the substrate and a second surface facing the lid, the second surface of the frame body has a frame-shaped first region to which the lid body is joined, a frame-shaped second region located more inward than the first region and provided with a recessed portion recessed toward the substrate, and a frame-shaped third region located more inward than the second region and provided with a protruding portion protruding toward the lid body, The height of the tip of the convex portion relative to the substrate is lower than the height of the joining surface between the frame body and the lid body relative to the substrate, and higher than the height of the bottom of the concave portion relative to the substrate. An electronic component characterized by:

2. The recess is provided so as to surround the third region in a plan view.

2. The electronic component according to claim 1.

3. The third region is in contact with the inner surface of the frame body.

2. The electronic component according to claim 1.

4. The width of the recess is 0.1 mm or more and 1.0 mm or less.

4. The electronic component according to claim 1, wherein the first insulating layer is a conductive layer.

5. The difference between the height of the joining surface and the height of the bottom of the recess is 50 μm or more.

4. The electronic component according to claim 1, wherein the first insulating layer is a conductive layer.

6. The width of the inner surface of the frame body on the side of the first surface is narrower than the width of the inner surface on the side of the second surface.

4. The electronic component according to claim 1, wherein the first insulating layer is a conductive layer.

7. The width of the inner side surface gradually narrows from the bottom of the recess toward the first surface.

7. The electronic component according to claim 6.

8. the semiconductor element is a photoelectric conversion element, The lid is made of a light-transmitting material.

4. The electronic component according to claim 1, wherein the first insulating layer is a conductive layer.

9. The substrate further includes an electronic element provided on a surface opposite to the surface on which the semiconductor element is provided.

4. The electronic component according to claim 1, wherein the first insulating layer is a conductive layer.

10. A method for manufacturing an electronic component, comprising: a step of forming a frame body on a substrate on which a semiconductor element is provided so as to surround the periphery of the semiconductor element; and a step of fixing a lid body to the frame body so as to close a space in which the semiconductor element is provided, In the step of forming the frame body, the frame body is formed by injection molding using a first mold for placing the substrate, a second mold for molding an inner surface of the frame body, and a third mold for molding a surface of the frame body facing the lid body; The second mold and the third mold are separated from each other, and the distance between the second mold and the third mold and the first mold can be changed independently of each other; The third mold has a frame-shaped first region for molding a surface to which the lid body is bonded, and a frame-shaped second region that is located more inward than the first region and has a protrusion that protrudes more toward the first mold than the first region. A method for manufacturing an electronic component, comprising:

11. The protrusion is provided on an end of the third mold on the side of the second mold.

11. The method for manufacturing an electronic component according to claim 10.

12. The width of the protrusion of the third mold is 0.1 mm or more and 1.0 mm or less.

12. The method for manufacturing an electronic component according to claim 10 or 11.

13. The height of the protrusion of the third mold is 50 μm or more.

12. The method for manufacturing an electronic component according to claim 10 or 11.

14. The second mold has a tapered shape in which the width on the first mold side is narrower than the width on the third mold side.

12. The method for manufacturing an electronic component according to claim 10 or 11.

15. The tapered shape is provided on the first mold side relative to a portion where the second mold and the third mold face each other.

15. The method for manufacturing an electronic component according to claim 14.

16. A gap of 10 μm or more and 50 μm or less is provided between the second mold and the third mold.

12. The method for manufacturing an electronic component according to claim 10 or 11.

17. The second mold has a frame-shaped protrusion that protrudes toward the substrate on the outer periphery of the surface facing the substrate, and is configured so that the second mold is separated from the semiconductor element when the protrusion is brought into contact with the substrate.

12. The method for manufacturing an electronic component according to claim 10 or 11.

18. The electronic component according to any one of claims 1 to 3; an optical device corresponding to the electronic component; a control device for controlling the electronic components; a processing device that processes signals output from the electronic components; a mechanical device controlled based on the information obtained by the electronic component; a display device for displaying information obtained by the electronic component; and a storage device for storing information obtained by the electronic component; An apparatus characterized by comprising:

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