Chemical sensor module and method for manufacturing the same

Abstract

To provide a chemical sensor module capable of reducing characteristic variation and a method for manufacturing the same.SOLUTION: A chemical sensor module comprises: a wiring member; a first chip including a first substrate, a sensor element, a first wiring electrically connected to the sensor element, and a second wiring electrically connected to the first substrate; and a second chip having a second substrate, a nonpolarizable electrode, and a third wiring electrically connected to the nonpolarizable electrode. The wiring member includes fourth wiring electrically connected to the first wiring, fifth wiring electrically connected to the second wiring, sixth wiring electrically connected to the third wiring, a first external terminal electrically connected to the fourth wiring, a second external terminal electrically connected to the fifth wiring, and a third external terminal electrically connected to the sixth wiring.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] FIELD Embodiments of the present invention relate to a chemical sensor module and a method for manufacturing the same. [Background technology]

[0002] There is a chemical sensor that uses a graphene field effect transistor (FET) to detect an analyte in a solution. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2019-41626 Summary of the Invention [Problem to be solved by the invention]

[0004] An object of an embodiment of the present invention is to provide a chemical sensor module capable of reducing variations in characteristics and a method for manufacturing the same. [Means for solving the problem]

[0005] According to an embodiment of the present invention, a chemical sensor module includes a wiring member having a wiring board, a first substrate having a first surface and a second surface opposite the first surface, a sensor element provided on the first surface, a first wiring provided on the first surface and electrically connected to the sensor element, and a second wiring electrically connected to the first substrate, a first chip provided on the wiring member with the second surface facing the wiring member, a second substrate having a third surface and a fourth surface opposite the third surface, and a second chip provided on the wiring member with the fourth surface facing the wiring member, the second chip having a non-polarizable electrode provided on the third surface and a third wiring provided on the third surface and electrically connected to the non-polarizable electrode. The wiring member has a fourth wiring electrically connected to the first wiring, a fifth wiring electrically connected to the second wiring, a sixth wiring electrically connected to the third wiring, a first external terminal electrically connected to the fourth wiring, a second external terminal electrically connected to the fifth wiring, and a third external terminal electrically connected to the sixth wiring. [Brief explanation of the drawings]

[0006] [Figure 1] FIG. 1 is a schematic plan view showing a configuration of a chemical sensor module according to an embodiment. [Figure 2] 2 is a schematic cross-sectional view of a portion where a second wiring of a first chip and a fifth wiring of a wiring member are connected in the chemical sensor module shown in FIG. 1. FIG. [Figure 3] FIG. 10 is a schematic plan view showing the configuration of a chemical sensor module according to a modified example of the embodiment. [Figure 4] 4 is a schematic cross-sectional view of a portion where a second wiring of a first chip and a fifth wiring of a wiring member are connected in the chemical sensor module shown in FIG. 3. FIG. [Figure 5] FIG. 1 is a schematic diagram showing an example of a sensor element and a probe molecule. [Figure 6] 1 is a schematic diagram showing a state in which a chemical sensor module according to an embodiment is attached to a pipe through which a sample solution flows. [Figure 7]FIG. 2 is a circuit diagram illustrating an example of a potential difference setting circuit according to an embodiment. [Figure 8] 10 is a graph showing experimental results. DETAILED DESCRIPTION OF THE INVENTION

[0007] Each embodiment will be described below with reference to the drawings. The drawings are schematic or conceptual, and the relationship between the thickness and width of each part, the size ratio between parts, etc. are not necessarily the same as those in reality. Even when the same part is shown, the dimensions and ratios may be different depending on the drawing. Furthermore, identical or similar elements are given the same reference numerals.

[0008] As shown in FIG. 1, the chemical sensor module of the embodiment includes a first chip 100, a second chip 200, and a wiring member 300.

[0009] [Wiring materials] 2 is a schematic cross-sectional view of a portion where second wiring 112 of first chip 100 and fifth wiring 315 of wiring member 300 are connected in the chemical sensor module shown in FIG. 2. As shown in FIG. 2, wiring member 300 has wiring substrate 301. Wiring substrate 301 is, for example, a silicon substrate. An insulating film 302 is provided on the upper surface of wiring substrate 301, and an insulating film 303 is provided on the lower surface of wiring substrate 301. Insulating film 302 and insulating film 303 are, for example, silicon oxide films. Wiring substrate 301 may be, for example, a ceramic substrate such as aluminum nitride.

[0010] [First chip] The first chip 100 includes a first substrate 101 , a sensor element 110 , a first wiring 111 , and a second wiring 112 .

[0011] The first substrate 101 has a first surface 101A and a second surface 101B located on the opposite side of the first surface 101A. The first substrate 101 is, for example, a silicon substrate. An insulating film 102 (first insulating film) is provided on the first surface 101A, and an insulating film 103 is provided on the second surface 101B. The insulating film 102 and the insulating film 103 are, for example, silicon oxide films.

[0012] First chip 100 is provided, i.e., mounted, on wiring member 300 with second surface 101B facing wiring member 300. First chip 100 is bonded to wiring member 300 by die bond member 120, for example.

[0013] As shown in FIG. 1, the sensor element 110 is provided on the first surface 101A of the first substrate 101. The sensor element 110 includes, for example, graphene. The first chip 100 also has a drain electrode 11D and a source electrode 11S. The drain electrode 11D and the source electrode 11S are provided on the first surface 101A via, for example, an insulating film 102. The drain electrode 11D and the source electrode 11S are electrically connected to the sensor element 110 (graphene). The sensor element 110 (graphene) is located between the drain electrode 11D and the source electrode 11S, and a current (drain current) flows between the drain electrode 11D and the source electrode 11S through the sensor element 110 (graphene).

[0014] As will be described later, a sample solution containing a sample atmosphere is supplied to the surface of the sensor element 110. When target molecules that may be contained in the sample solution approach the surface of the sensor element 110, the electronic state of the sensor element 110 (graphene) changes. This change can be detected as a change in drain current, making it possible to know the presence and concentration of the target molecules in the sample atmosphere.

[0015] As shown in FIG. 5, the first chip 100 may have a probe molecule 150 located on the surface of the sensor element 110 (graphene). The probe molecule 150 located on the surface of the sensor element 110 means that the probe molecule 150 is bound, adsorbed, or in close proximity to the surface of the sensor element 110 by chemical or charge attraction, π-π interaction, cation-π interaction, hydrophobic interaction, or the like. The probe molecule 150 includes, for example, at least one of a protein, a peptide, an antibody, a DNA aptamer, or a biomolecule derived from these. The probe molecule 150 can be located on the surface of the sensor element 110 via, for example, a linker molecule. For example, pyrene or the like can be used as the linker molecule.

[0016] The probe molecule 150 can specifically bind to or interact with a target molecule. When the probe molecule 150 binds to or interacts with the target molecule, the target molecule approaches the surface of the sensor element 110, and the electronic state of the sensor element 110 changes due to the charge of the target molecule or the structural change of the probe molecule 150 caused by binding to or interacting with the target molecule. This can be detected as a change in drain current.

[0017] The first wiring 111 is provided on the first surface 101A of the first substrate 101, for example, via an insulating film 102. The first wiring 111 has a first drain wiring 111D connected to the drain electrode 11D and a first source wiring 111S connected to the source electrode 11S. The first drain wiring 111D is electrically connected to the sensor element 110 via the drain electrode 11D. The first source wiring 111S is electrically connected to the sensor element 110 via the source electrode 11S.

[0018] The second wiring 112 is provided on the first surface 101A of the first substrate 101, for example, via an insulating film 102. In the example shown in Fig. 2, the first chip 100 has a first contact portion 113 that penetrates the insulating film 102 and contacts the first surface 101A. The second wiring 112 is connected to the first contact portion 113 on the insulating film 102, and is electrically connected to the first substrate 101 via the first contact portion 113.

[0019] The second wiring 112 has, for example, a first layer 112A and a second layer 112B provided on the first layer 112A and covering the first layer 112A. The second layer 112B is exposed on the outermost surface (top and side surfaces) of the second wiring 112 and contains, for example, gold (Au). The second layer 112B functions as an adhesion layer and a barrier metal and contains, for example, titanium (Ti).

[0020] [Second chip] The second chip 200 includes a second substrate 201 , a non-polarizable electrode 210 , and a third wiring 213 .

[0021] The second substrate 201 has a third surface 201A and a fourth surface located on the opposite side of the third surface 201A. The second substrate 201 is, for example, a silicon substrate. As with the first chip 100, an insulating film 202 (second insulating film) is provided on the third surface 201A, and an insulating film is provided on the fourth surface. The insulating film 202 provided on the third surface 201A and the insulating film provided on the fourth surface are, for example, silicon oxide films.

[0022] Second chip 200 is provided, i.e., mounted, on wiring member 300 with its fourth surface facing wiring member 300. Similar to first chip 100, second chip 200 is bonded to wiring member 300 by, for example, a die bond member.

[0023] The non-polarizable electrode 210 has the property that when the voltage is changed, an oxidation-reduction reaction occurs on the electrode surface, causing a current to flow. This property allows the potential difference between the non-polarizable electrode 210 and the solution to be kept constant, and the solution potential can be controlled or stabilized by an external power source. The non-polarizable electrode 210 can be, for example, a silver-silver chloride electrode, a hydrogen electrode, a calomel electrode, or the like. A silver-silver chloride electrode is preferable because it has a simple structure, can be miniaturized, and has a small environmental impact.

[0024] The non-polarizable electrode 210 is provided on the third surface 201A of the second substrate 201. The non-polarizable electrode 210 is exposed to the inside of a pipe through which the sample solution flows, and is in contact with the sample solution. The sample solution contains chloride ions, and the non-polarizable electrode 210 is a silver-silver chloride electrode having silver chloride on its surface. The silver-silver chloride electrode (non-polarizable electrode 210) is in contact with the sample solution containing chloride ions, and an oxidation-reduction reaction occurs, thereby applying a potential to the sample solution. This reduces noise in the drain current of the sensor element 110. The potential of the sample solution is controlled to a constant potential difference with respect to the potential of the silver-silver chloride electrode according to the Nernst equation. The oxidation-reduction reaction with silver chloride (AgCl) (AgCl + e - → Ag + Cl - ) to detect chloride ions (Cl - ) moves between the sample solution and the surface of the silver-silver chloride electrode until the potential of the sample solution stabilizes.

[0025] The third wiring 213 is provided on the third surface 201A of the second substrate 201, for example, via an insulating film 202. The third wiring 213 is electrically connected to the non-polarizable electrode 210.

[0026] Second chip 200 further has seventh wiring 217. Seventh wiring 217 is provided on third surface 201A of second substrate 201, for example, via insulating film 202. Second chip 200 has second contact portion 218 that penetrates insulating film 202 and contacts third surface 201A. Seventh wiring 217 is connected to second contact portion 218 on insulating film 202, and is electrically connected to second substrate 201 via second contact portion 218.

[0027] The wiring member 300 further includes a fourth wiring 314 , a fifth wiring 315 , and a sixth wiring 316 .

[0028] The fourth wiring 314 is provided on the wiring substrate 301, for example, via an insulating film 302. The fourth wiring 314 has a fourth drain wiring 314D electrically connected to the first drain wiring 111D and a fourth source wiring 314S electrically connected to the first source wiring 111S. The first drain wiring 111D and the fourth drain wiring 314D are electrically connected via, for example, a gold wire w1. The first source wiring 111S and the fourth source wiring 314S are electrically connected via, for example, a gold wire w2.

[0029] The fifth wiring 315 is provided on the wiring substrate 301 via, for example, an insulating film 302. The fifth wiring 315 is electrically connected to the second wiring 112 via, for example, a gold wire w3.

[0030] 2, the fifth wiring 315 has, for example, a first layer 315A and a second layer 315B provided on the first layer 315A and covering the first layer 315A. The second layer 315B is exposed on the outermost surface (top and side surfaces) of the fifth wiring 315 and contains, for example, gold (Au). The second layer 315B functions as an adhesion layer and a barrier metal and contains, for example, titanium (Ti).

[0031] It is preferable that the wirings other than the second wiring 112 and the fifth wiring 315 also have a laminated structure of a first layer and a second layer similar to those wirings.

[0032] The fifth wiring 315 is electrically connected to the seventh wiring 217 of the second chip 200 via, for example, a gold wire w5.

[0033] The sixth wiring 316 is electrically connected to the third wiring 213 of the second chip 200 via, for example, a gold wire w4.

[0034] 1 , the wiring member 300 further includes a first external terminal 321, a second external terminal 322, and a third external terminal 323. The outermost surfaces of the first external terminal 321, the second external terminal 322, and the third external terminal 323 are made of, for example, gold. The first external terminal 321, the second external terminal 322, and the third external terminal 323 are provided on the insulating film 302 at the outer periphery of the wiring member 300, or on the back surface of the wiring member 300.

[0035] 1 is exposed to the inside of a pipe through which a sample solution flows, as will be described later. The first external terminal 321, the second external terminal 322, and the third external terminal 323 are located outside the area surrounded by the seal area 400. The first external terminal 321, the second external terminal 322, and the third external terminal 323 are electrically connected to an external circuit via, for example, a conductive elastic pin.

[0036] The first external terminal 321 has a first drain terminal 321D electrically connected to the fourth drain wiring 314D and a first source terminal 321S electrically connected to the fourth source wiring 314S. The sensor element 110 is electrically connected to the first drain terminal 321D via the drain electrode 11D, the first drain wiring 111D, a gold wire w1, and the fourth drain wiring 314D. The sensor element 110 is electrically connected to the first source terminal 321S via the source electrode 11S, the first source wiring 111S, a gold wire w2, and the fourth source wiring 314S.

[0037] The second external terminal 322 is electrically connected to the fifth wiring 315. The first substrate 101 of the first chip 100 is electrically connected to the second external terminal 322 via the second wiring 112, the gold wire w3, and the fifth wiring 315. The second substrate 201 of the second chip 200 is electrically connected to the second external terminal 322 via the seventh wiring 217, the gold wire w5, and the fifth wiring 315.

[0038] The third external terminal 323 is electrically connected to the sixth wiring 316. The non-polarizable electrode 210 of the second chip 200 is electrically connected to the third external terminal 323 via the third wiring 213, the gold wire w4, and the sixth wiring 316.

[0039] The chemical sensor module of the embodiment can be attached to an opening 601 formed in a pipe 600, as shown in Fig. 6. An annular sealing member 401 is disposed between sealing region 400 shown in Fig. 1, which is formed on the mounting surface of wiring member 300 on which first chip 100 and second chip 200 are mounted, and the outer peripheral surface of pipe 600 near opening 601. Sealing member 401 airtightly seals the inner peripheral region and the outer peripheral region of sealing member 401.

[0040] The surface of sensor element 110 of first chip 100 and non-polarizable electrode 210 of second chip 200 are exposed to the inside of piping 600 through opening 601 on the inner circumferential side of sealing member 401. A sample solution flows through piping 600, and the surface of sensor element 110 and non-polarizable electrode 210 come into contact with the sample solution. This allows sensor element 110 to react with the target substance in the sample solution, and the potential of the sample solution is fixed by non-polarizable electrode 210. The potential difference between non-polarizable electrode 210 and the sample solution is controlled to be constant.

[0041] The sealing member 401 may be attached to the piping 600 side, or may be configured to include the sealing member 401 surrounding the first chip 100 and the second chip 200 in the sealing area 400 on the chemical sensor module side.

[0042] The chemical sensor module is detachable from the opening 601 of the pipe 600 and can be replaced. By making the chemical sensor module replaceable, contamination from the sample solution does not accumulate on the sensor element 110 and the non-polarizable electrode 210, noise is reduced, and highly reliable detection of the target substance becomes possible.

[0043] In this embodiment, the potential difference between the second wiring 112 electrically connected to the first substrate 101 and the third wiring 213 electrically connected to the non-polarizable electrode 210 is controlled to be constant. That is, the potential difference between the first substrate 101 and the non-polarizable electrode 210 (sample solution) is controlled to be constant. For example, in a device external to the chemical sensor module, a second external terminal 322 electrically connected to the second wiring 112 and a third external terminal 323 electrically connected to the third wiring 213 are electrically connected.

[0044] Moreover, the chemical sensor module of the embodiment can further include a potential difference setting circuit that controls the potential difference between the second wiring 112 and the third wiring 213. As an example of the potential difference setting circuit 500, a switching regulator is shown in FIG.

[0045] The potential difference setting circuit 500 has a switch element 502 connected to an input terminal 503 to which an input voltage is input, and a control unit 501 that controls the on / off of the switch element 502. By turning the switch element 502 on and off, an output voltage is output to an output terminal 504 connected to the second wiring 112. The third wiring 213 is connected to ground. A capacitor C is connected between the line between the switch element 502 and the output terminal 504 and the line connecting the third wiring 213 to ground. A resistor R is connected between the line between the output terminal 504 and the second wiring 112 and the line connecting the third wiring 213 to ground.

[0046] The control unit 501 monitors the output voltage of the output terminal 504 and controls the on / off of the switch element 502 so that the potential difference between the second wiring 112 and the third wiring 213 is constant.

[0047] If the potential of the first substrate 101 on which the sensor element 110 is mounted is floating, variations in the back gate potential from the first substrate 101 to the sensor element 110 may cause noise in the drain current. In addition, in this embodiment, for example, the side surface of the first substrate 101 is exposed and comes into contact with the sample solution. When the first substrate 101 comes into contact with the sample solution, depending on the potential difference between the first substrate 101 and the sample solution, noise may occur in the drain current due to an electrochemical reaction between the first substrate 101 and the sample solution.

[0048] According to this embodiment, by maintaining a constant potential difference between the potential of first substrate 101 and the potential of non-polarizable electrode 210, i.e., the potential of the sample solution, the backgate potential from first substrate 101 to sensor element 110 can be maintained constant, and the potential of first substrate 101 can be kept within a range where an electrochemical reaction does not occur or is unlikely to occur. Furthermore, even if there is a slight electrochemical reaction between first substrate 101 and the sample solution, potential fluctuations of first substrate 101 can be reduced. This reduces noise in the drain current.

[0049] A plurality of first chips 100 having different types of probe molecules 150 on the surface of the sensor element 110 may be mounted on the wiring member 300. Even in this case, the potential difference between the potential of the first substrate 101 of each of the plurality of first chips 100 and the potential of the non-polarizable electrode 210, i.e., the potential of the sample solution, is controlled to be constant. This makes it possible to reduce variations in drain current between the plurality of first chips 100 due to variations in the potential of the first substrate 101.

[0050] For example, when first substrate 101 is sealed with resin, sensor element 110 needs to be sufficiently separated from the resin to suppress the effect of resin bleeding onto sensor element 110 on first surface 101A. This hinders reduction in the chip size of first chip 100. According to this embodiment, as described above, the electrochemical reaction between first substrate 101 and the sample solution can be reduced, making it unnecessary to seal the side surfaces of first substrate 101 with resin. This allows the chip size of first chip 100 to be reduced.

[0051] Furthermore, if the resin is formed so as to rise from the side surface of first substrate 101 onto the outer periphery of first surface 101A, a mound of resin is formed on the outer periphery of first surface 101A. This mound of resin on first surface 101A can make it difficult for the sample solution to flow onto the surface of sensor element 110. According to this embodiment, it is not necessary to seal the side surface of first substrate 101 with resin, which makes it easier for the sample solution to flow onto the surface of sensor element 110, thereby improving the detection sensitivity of the target substance.

[0052] 3 and 4, first chip 100 may be provided, i.e., mounted, on wiring member 300 via first conductive member 130. First conductive member 130 may be, for example, a cured conductive paste containing metal particles in resin.

[0053] 4 is a schematic cross-sectional view of a portion where the second wiring 112 of the first chip 100 and the fifth wiring 315 of the wiring member 300 in the chemical sensor module shown in FIG. 3 are connected. As shown in FIG. 4, the second wiring 112 is provided on the second surface 101B of the first substrate 101 and is in contact with the second surface 101B. The second wiring 112 has, for example, a first layer 112A and a second layer 112B. The first layer 112A is provided between the second surface 101B and the second layer 112B and is in contact with the second surface 101B, and contains, for example, titanium (Ti). The second layer 112B contains, for example, gold (Au).

[0054] The first conductive member 130 is provided between the second wiring 112 and the insulating film 302 of the wiring member 300. The first conductive member 130 is also provided between the first layer 112A of the second wiring 112 and the first layer 315A of the fifth wiring 315, and electrically connects the second wiring 112 and the fifth wiring 315.

[0055] 4 can be configured by replacing the first chip 100 with the second chip 200, the first conductive member 130 with the second conductive member 230, and the second wiring 112 with the seventh wiring 217. The second chip 200 may be provided, i.e., mounted, on the wiring member 300 via the second conductive member 230. The second conductive member 230 is, for example, formed by hardening a conductive paste containing metal particles in a resin.

[0056] The seventh wiring 217 is provided on the fourth surface of the second substrate 201 and is in contact with the fourth surface. The second conductive member 230 is provided between the seventh wiring 217 and the insulating film 302 of the wiring member 300. The second conductive member 230 is also provided between the seventh wiring 217 and the fifth wiring 315 and electrically connects the seventh wiring 217 and the fifth wiring 315.

[0057] Figure 8 shows the experimental results of measuring the change in drain current over time while changing the distance between the silver-silver chloride electrode and the graphene in the analyte solution (HEPES 1 mM + KCL 1 mM) to 0.5 mm, 1.0 mm, and 2.0 mm.

[0058] When the distance between the silver-silver chloride electrode and the graphene is 0.5 mm and 1.0 mm, the drain current is unstable and drifts upward, whereas when the distance is 2.0 mm, the drain current is stable and no drift is observed. Note that the spike-like peaks in the figure are noise caused by experimental operations such as switching the solution potential and vibrations caused by solution renewal, and can be ignored here.

[0059] From the above results, it is preferable to increase the distance between the silver-silver chloride electrode and the graphene, specifically to set the distance to 2.0 mm or more. However, increasing the distance between the silver-silver chloride electrode and the graphene within the same chip increases the chip size. According to this embodiment, by forming the first chip 100 on which the graphene (sensor element 110) is formed and the second chip 200 on which the silver-silver chloride electrode (non-polarizable electrode 210) is formed into separate chips, the chip size of each chip can be reduced, reducing chip costs, while increasing the distance between the silver-silver chloride electrode and the graphene can reduce noise generated in the drain current.

[0060] Next, a method for manufacturing the chemical sensor module of the embodiment will be described.

[0061] The manufacturing method of the chemical sensor module of the embodiment includes a step of preparing the first chip 100. As described above, the first chip 100 has the first substrate 101, the sensor element 110, the first wiring 111, and the second wiring 112. In addition, in the step of preparing the first chip 100, the first chip 100 further has a first protective film that covers the sensor element 110.

[0062] In the process of preparing the first chip 100, a sensor element 110 (e.g., graphene), a first wiring 111, a second wiring 112, a first protective film covering the sensor element 110, and the like are formed on a first substrate 101 in a wafer state. The wafer is then diced into a plurality of first chips 100. Because the sensor element 110 is covered and protected by the first protective film, the sensor element 110 (graphene) is not contaminated during dicing. For example, polyvinyl alcohol (PVA) can be used as the first protective film.

[0063] The manufacturing method of the chemical sensor module of the embodiment includes a step of preparing the second chip 200. As described above, the second chip 200 has the second substrate 201, the non-polarizable electrode 210, the third wiring 213, and the seventh wiring 217.

[0064] In the process of preparing second chips 200, non-polarizable electrodes 210 (for example, silver-silver chloride electrodes), third wiring 213, seventh wiring 217, etc. are formed on a wafer-state second substrate 201. Thereafter, the wafer is diced into a plurality of second chips 200.

[0065] The manufacturing method of the chemical sensor module of the embodiment includes a step of mounting the first chip 100 and the second chip 200 on the wiring member 300. The wiring member 300 has the above-mentioned wiring substrate 301, the fourth wiring 314, the fifth wiring 315, the sixth wiring 316, the first external terminal 321, the second external terminal 322, the third external terminal 323, and the like.

[0066] After first chip 100 and second chip 200 are mounted on wiring member 300, each of chips 100, 200 and wiring member 300 are connected with gold wires w1 to w5.

[0067] The manufacturing method of the chemical sensor module of the embodiment includes the steps of removing the first protective film of the first chip 100 mounted on the wiring member 300 to expose the surface of the sensor element 110, and forming the probe molecules 150 on the surface of the sensor element 110. For example, the first protective film made of PVA is removed by washing with warm water.

[0068] The step of forming the probe molecules 150 includes a step of supplying an organic solvent in which the probe molecules 150 are dissolved onto the surface of the sensor element 110 by, for example, an inkjet method. By using an organic solvent, the solution is less likely to dry than when an aqueous solution is used. Examples of organic solvents that can be used include dimethyl sulfoxide (DMSO) and dimethylformamide (DMF).

[0069] An organic solvent has a lower surface tension than an aqueous solution and spreads easily on the surface to which it is supplied. According to this embodiment, by providing the first chip 100 on which the sensor element 110 is formed and the second chip 200 on which the non-polarizable electrode 210 is formed as separate chips, the organic solvent supplied to the surface of the sensor element 110 does not spread to the non-polarizable electrode 210, and contamination of the non-polarizable electrode 210 can be prevented. Furthermore, when attempting to mount sensor elements with multiple different probe molecules on the same chip, if the sensor elements for forming these different probe molecules are mounted on the same chip, the sensor elements must be spaced apart by the distance the inkjet droplets spread, which increases the chip size. Therefore, if sensor elements that form different probe molecules are formed on separate chips and then mixedly mounted on the wiring member, there is no need to consider the spreading of droplets. In the case of ordinary electronic devices that do not form probe molecules, the total chip area is generally smaller when the device is integrated into a single chip rather than when it is divided into multiple chips. However, this is an exception when sensor elements that form multiple different probe molecules are mixed together, as in this example, and the total chip area can actually be smaller when it is divided into multiple chips.

[0070] The step of forming the probe molecules 150 includes a step of supplying an organic solvent in which the probe molecules 150 are dissolved onto the surface of the sensor element 110, and then removing the organic solvent. For example, DMSO or DMF can be easily removed using pure water or an aqueous electrolyte solution. At this time, it is preferable that the non-polarizable electrode 210 be covered with a third protective film. This prevents contamination of the non-polarizable electrode 210 with a cleaning solution that removes the organic solvent. For example, in the step of preparing the second chip 200, the non-polarizable electrode 210 can be covered with a third protective film.

[0071] The manufacturing method of the chemical sensor module of the embodiment includes a step of forming a second protective film that covers the surfaces of the probe molecule 150 and the sensor element 110. After this, the chemical sensor module is packed in, for example, a moisture-proof or moisture-retaining package and shipped. For example, an ionic liquid can be used as the second protective film so that the user of the chemical sensor module can easily wash and remove the second protective film with water when using the module.

[0072] In the step of mounting first chip 100 on wiring member 300, multiple first chips 100 may be mounted on wiring member 300. Then, in the step of forming probe molecules 150, an organic solvent in which different types of probe molecules 150 are dissolved can be supplied to the surface of each sensor element 110 of the multiple first chips 100.

[0073] Although several embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be embodied in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their modifications are included within the scope and spirit of the invention, and are also included in the scope of the invention and its equivalents as defined in the claims. [Explanation of symbols]

[0074] 11D...drain electrode, 11S...source electrode, 100...first chip, 101...first substrate, 101A...first surface, 101B...second surface, 110...sensor element, 111...first wiring, 112...second wiring, 113...first contact portion, 130...first conductive member, 150...probe molecule, 200...second chip, 201...second substrate, 201A...third surface, 210...non-polarizable electrode, 213...third wiring, 217 ...seventh wiring, 218...second contact portion, 230...second conductive member, 300...wiring member, 301...wiring board, 314...fourth wiring, 315...fifth wiring, 316...sixth wiring, 321...first external terminal, 322...second external terminal, 323...third external terminal, 400...sealing area, 401...sealing member, 500...potential difference setting circuit, 501...control portion, 502...switching element, 600...piping, 601...opening

Claims

1. a wiring member having a wiring substrate; a first substrate having a first surface and a second surface opposite to the first surface; a sensor element provided on the first surface; a first wiring provided on the first surface and electrically connected to the sensor element; and a second wiring electrically connected to the first substrate, the first chip being provided on the wiring member with the second surface facing the wiring member; a second chip having a second substrate having a third surface and a fourth surface located opposite to the third surface, a non-polarizable electrode provided on the third surface, and a third wiring provided on the third surface and electrically connected to the non-polarizable electrode, the second chip being provided on the wiring member with the fourth surface facing the wiring member; Equipped with The wiring member is a fourth wiring electrically connected to the first wiring; a fifth wiring electrically connected to the second wiring; a sixth wiring electrically connected to the third wiring; a first external terminal electrically connected to the fourth wiring; a second external terminal electrically connected to the fifth wiring; a third external terminal electrically connected to the sixth wiring; A chemical sensor module comprising:

2. The chemical sensor module according to claim 1 , wherein the non-polarizable electrode is a silver-silver chloride electrode.

3. the first chip further includes a first insulating film provided on the first surface of the first substrate, and a first contact portion that penetrates the first insulating film and contacts the first surface; 3. The chemical sensor module according to claim 1, wherein the second wiring is provided on the first insulating film and is electrically connected to the first substrate via the first contact portion.

4. a first conductive member electrically connecting the second wiring and the fifth wiring; the second wiring is provided on the second surface of the first substrate and is in contact with the second surface; 3. The chemical sensor module according to claim 1, wherein the first chip is provided on the wiring member via the first conductive member.

5. 3. The chemical sensor module according to claim 1, wherein the second chip further includes a seventh wiring that electrically connects the second substrate and the fifth wiring.

6. the second chip further includes a second insulating film provided on the third surface of the second substrate, and a second contact portion that penetrates the second insulating film and contacts the third surface; The chemical sensor module according to claim 5 , wherein the seventh wiring is provided on the second insulating film and is electrically connected to the second substrate via the second contact portion.

7. a second conductive member electrically connecting the seventh wiring and the fifth wiring; the seventh wiring is provided on the fourth surface of the second substrate and is in contact with the fourth surface; The chemical sensor module according to claim 5 , wherein the second chip is provided on the wiring member via the second conductive member.

8. 3. The chemical sensor module according to claim 1, further comprising a sealing member provided on a surface of the wiring member on which the first chip and the second chip are provided, the sealing member surrounding the first chip and the second chip.

9. 3. The chemical sensor module according to claim 1, wherein the first substrate and the second substrate are silicon substrates.

10. The chemical sensor module according to claim 1 , wherein the sensor element comprises graphene.

11. 3. The chemical sensor module according to claim 1, further comprising a potential difference setting circuit that controls a potential difference between the second wiring and the third wiring.

12. preparing a first chip having a sensor element and a first protective film covering the sensor element; providing a second tip having a non-polarizable electrode; providing the first chip on a wiring member; providing the second chip on the wiring member; removing the first protective film from the first chip provided on the wiring member and forming a probe molecule on the surface of the sensor element; forming a second protective film covering the probe molecules and the surface of the sensor element; A method for manufacturing a chemical sensor module, comprising:

13. 13. The method for manufacturing a chemical sensor module according to claim 12, wherein in the step of forming the probe molecules, the non-polarizable electrodes are covered with a third protective film.

14. The step of forming the probe molecule comprises: supplying an organic solvent in which the probe molecules are dissolved onto the surface of the sensor element; removing the organic solvent; The method for manufacturing a chemical sensor module according to claim 12 or 13, comprising:

15. a plurality of the first chips are provided on the wiring member; 15. The method for manufacturing a chemical sensor module according to claim 14, wherein the organic solvent in which different types of probe molecules are dissolved is supplied to the surface of each of the sensor elements of the plurality of first chips.

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