Thermal analysis device

Abstract

To provide a thermal analysis device that can be used effectively for a material generating by volatilization multiple constituents having different boiling points by heating.SOLUTION: A thermal analysis device 51 is used for confirming physical properties following a temperature change of a material targeted for the material that generates by volatilization a low-boiling-point constituent having a relatively low boiling point by heating and a high-boiling-point constituent having a relatively higher boiling point than the low-boiling-point constituent, and comprises a deposit generation section 52 for heating a sample of the material, depositing a high-boiling-point constituent in the evolved gas, and generating an analysis deposit, and a gas generation section 53 for generating an analysis gas containing a low-boiling-point constituent by heating the sample of the material.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a thermal analysis device. [Background technology]

[0002] For example, in the case of resin materials, metal materials, ceramic materials, and various other materials, the components may volatilize when the raw materials, materials, products, parts, components, etc. made of these materials are heated during use.

[0003] In such cases, in order to understand in advance the various effects of volatilization of components, the material may be analyzed using a thermal analyzer to confirm the physical properties of the material as they change in temperature.

[0004] As a related technology, for example, Patent Document 1 describes the following: "A thermal analysis apparatus with a gas analysis function, which has a protective tube surrounding a sample, a sample temperature control means for changing the temperature of the sample, and a gas analysis means connected to the protective tube via a gas conduit, the thermal analysis apparatus having a gas conduit temperature control means for changing the temperature of the gas conduit, a sample temperature detection means for detecting the temperature of the sample, and a control means for controlling the gas conduit temperature control means based on the temperature detection result by the sample temperature detection means, the control means controlling the gas conduit temperature control means so that the temperature of the gas conduit is equal to the temperature of the sample." [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 5-60709 Summary of the Invention [Problem to be solved by the invention]

[0006] Incidentally, some of the above-mentioned materials volatilize and generate different components in different temperature ranges when heated.

[0007] When such materials are heated at a relatively low temperature, certain components volatilize while other components remain solid, which can have some effect on the use of raw materials made from such materials. Therefore, there is a demand for a thermal analysis device that can effectively confirm the physical properties of such materials.

[0008] The present invention aims to solve these problems, and its object is to provide a thermal analysis device that can be effectively used for materials that are generated by the evaporation of multiple components with different boiling points when heated. [Means for solving the problem]

[0009] One thermal analysis device that can solve the above problem targets a material that, when heated, generates low-boiling-point components with relatively low boiling points and high-boiling-point components with relatively high boiling points compared to the low-boiling-point components by volatilization, and is used to confirm the physical properties of the material as the temperature changes.The thermal analysis device includes: a precipitate generation unit that heats a sample of the material, precipitates the high-boiling-point components in the generated gas, and generates a precipitate for analysis; and a gas generation unit that heats the sample of the material and generates a gas for analysis that contains the low-boiling-point components. [Effects of the Invention]

[0010] The above-described thermal analysis device can be effectively used for materials in which a plurality of components with different boiling points are volatilized by heating. [Brief explanation of the drawings]

[0011] [Figure 1] 1 is a cross-sectional view showing an example of an injection molding machine in which a material that can be targeted by a thermal analysis apparatus according to an embodiment of the present invention can be used as a molding material. [Figure 2] 1 is a piping and instrumentation diagram that schematically illustrates a thermal analysis apparatus according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0012] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The thermal analyzer of one embodiment of the present invention analyzes materials that are generated by heating and vaporizing low-boiling-point components with relatively low boiling points and high-boiling-point components with relatively high boiling points compared to the low-boiling-point components. This thermal analyzer is used to confirm the physical properties of such materials that change with temperature.

[0013] The above-mentioned materials include various types such as resin materials, metal materials such as steel materials, and ceramic materials, but as an example, the case of a resin material used as a molding material in injection molding using an injection molding machine 1 as shown in Fig. 1 will be described in detail here. However, the materials that can be analyzed by the thermal analysis apparatus of this invention are not limited to molding materials.

[0014] (Outline of injection molding machine) The injection molding machine 1 shown in Figure 1 generally comprises an injection device 11 that melts molding material such as thermoplastic resin and injects it into a mold device 101 by rotating and advancing a screw 13 arranged inside and heating it with a heater 14 arranged around it, a movement device 21 that moves the injection device 11 forward and backward relative to the mold device 101, a mold clamping device 31 that opens and closes the mold device 101 between a mold clamping state and a mold open state, and an ejector device 41 that removes a molded product from the mold device 101 in the mold open state.

[0015] In the illustrated example, the mold assembly 101 attached to the injection molding machine 1 includes a fixed mold 102 and a movable mold 103, which define a cavity therein when the molds are clamped, and a movable member 104, such as an ejector pin, which is displaced by the ejector device 41 to push out and remove the molded product. This mold assembly 101 can be referred to as a two-plate mold, primarily divided into two parts, the fixed mold 102 and the movable mold 103, but it can also be a three-plate mold, further divided into three parts by adding a slide mold, slide core, or stripper plate. The mold assembly 101 can be attached to the injection molding machine 1 or replaced as appropriate depending on the shape of the molded product to be manufactured, and here, the mold assembly 101 is not considered part of the injection molding machine 1. A facility or device including the injection molding machine 1 and the mold assembly 101 attached to the injection molding machine 1 is sometimes referred to as an injection molding system.

[0016] In injection molding using the injection molding machine 1, as will be described later, a predetermined amount of molding material has already been measured and placed inside the injection device 11 in the previous measuring process, and then a clamping process is performed in which the mold device 101 is closed using the clamping device 31 to set the mold in a clamped state. Next, the screw 13 is advanced to inject the molding material into the mold device 101, thereby filling the cavity in the mold device 101 with the molding material, and then a pressure holding process is carried out in which the screw 13 is advanced further to maintain the molding material inside the tip of the injection device 11 at a predetermined pressure.

[0017] Thereafter, a cooling process is carried out in which the molding material filled in the cavity of the mold device 101 is cooled and solidified to obtain a molded product. At this time, a measuring process is carried out in which the molding material separately charged into the injection device 11 is melted while being fed toward the tip of the injection device 11 by the rotation of the screw 13 under heating by the heater 14, and a predetermined amount of molding material is filled into the tip. Thereafter, the mold clamping device 31 is operated to open the mold device 101 to bring it into a mold open state, and the ejector device 41 is used to move the movable member 104, thereby carrying out an ejection step of removing the molded product from the mold device 101.

[0018] (thermal analysis device) In the injection molding described above, molding material heated in the injection device 11 is injected into the mold device 101. At this time, the molding material, which is a resin material, is decomposed by heating. Low-boiling-point components generated from the molding material have lower boiling points than high-boiling-point components, so they do not precipitate even when cooled within the mold device 101, but are discharged to the outside through a gas vent or the like that may be provided in the mold device 101.

[0019] On the other hand, the high-boiling components generated from the molding material together with the low-boiling components are cooled and precipitated within the mold device 101, adhering to the surfaces of gaps and spaces within the mold device 101 and forming deposits (so-called mold deposits). These deposits hinder the smooth filling of the molding material into the mold device 101, causing defects in the shape of the molded product, and also lead to molding defects such as blocking gas vents and causing gas burns.

[0020] Under these circumstances, when using a molding material as a resin material of a predetermined composition or type, it is desirable to be able to grasp and consider molding conditions that can suppress molding defects before mass production. In such cases, the thermal analysis apparatus of this embodiment can be suitably used.

[0021] FIG. 2 shows an example of a thermal analyzer 51. The illustrated thermal analyzer 51 is intended for materials such as the molding materials described above, which are generated by the volatilization of low-boiling-point and high-boiling-point components upon heating. The terms "low boiling point" and "high boiling point" in the terms "low boiling point component" and "high boiling point component" refer to the relative difference in boiling point, i.e., whether the boiling point of one component is higher or lower than the boiling point of the other component, when comparing the boiling points of those components, and do not refer to high or low relative to a specific temperature. The material to be analyzed is not particularly limited as long as it generates multiple components that volatilize at different temperatures when heated.

[0022] When the material is a resin material used as a molding material for injection molding, an example of such a resin material is PBT, a type of ester-based polymer material. When PBT is heated, its main chain is broken by thermal decomposition, and high-boiling-point components such as terephthalic acid and oligomers and low-boiling-point components including linear or branched saturated or unsaturated hydrocarbons are generated. The low-boiling-point components include, for example, C n H 2n+2 Alkanes represented by (n≧1), C n H 2n Alkenes represented by (n≧2), C n H 2n-2 It may be an alkyne or diene represented by (n≧2).

[0023] Other examples of the resin materials include polyester polymer materials, polyamide polymer materials, polyolefin polymer materials, acrylonitrile-butadiene-styrene copolymers, polycarbonate resins, polyphenylene sulfide resins, and acrylic resins. Polyester polymer materials include, for example, polyethylene terephthalate, polypropylene terephthalate, and polybutylene terephthalate (PBT). The resin materials may be used alone or in the form of a mixture of multiple materials. They may also contain different types of monomer units, such as copolymers.

[0024] A thermal analyzer 51 used to confirm the physical or thermal properties of such materials as they change temperature includes a precipitate generating section 52 that precipitates high-boiling-point components to generate a precipitate for analysis, and a gas generating section 53 that generates a gas for analysis containing low-boiling-point components. The precipitate generating section 52 and the gas generating section 53 heat a sample of the material to generate a precipitate for analysis and a gas for analysis, respectively.

[0025] The components of the precipitate for analysis obtained in the precipitate generating section 52 and the gas for analysis obtained in the gas generating section 53 are analyzed, identified, and further quantified, thereby making it possible to confirm the physical properties of the material when heated at a predetermined temperature. Therefore, it can be said that the thermal analysis apparatus 51 of this embodiment can be effectively used for materials that are generated by the evaporation of multiple components with different boiling points when heated.

[0026] In the illustrated thermal analysis apparatus 51, more specifically, the precipitate generation section 52 includes a thermal reaction section 54 and a cooling section 55. Of these, the thermal reaction section 54 that heats the sample can be any section that can heat the sample. As an example, the thermal reaction section 54 is configured by placing at least a portion of a U-shaped or other shaped reaction tube 54b, the inside of which is filled with the sample, inside a heating furnace 54a. The reaction tube 54b is preferably made of heat-resistant glass (such as borosilicate glass, aluminosilicate glass, or quartz). In this case, the interior can be visually inspected during cleaning after use, and unintended catalytic action of the metal on the sample can be suppressed if the reaction tube 54b is made of a metal such as stainless steel.

[0027] The cooling section 55 of the precipitate generating section 52 is provided downstream in the flow direction of the gas generated by heating the sample in the thermal reaction section 54. The cooling section 55 cools the gas generated from the thermal reaction section 54 and precipitates the high-boiling-point components in the generated gas. This allows a precipitate for analysis containing the high-boiling-point components to be obtained.

[0028] In the illustrated example, the cooling section 55 includes a plate-shaped deposit attachment section 55a disposed adjacent to the outlet or opening of the reaction tube 54b of the thermal reaction section 54 so that the generated gas flowing therefrom contacts the deposit attachment section 55a, and a cooling device 55b disposed behind the deposit attachment section 55a. The cooling device 55b may be located anywhere as long as it can cool the attachment surface 55c of the deposit attachment section 55a with which the generated gas contacts. When the generated gas is blown from the outlet of the reaction tube 54b of the thermal reaction section 54 onto the attachment surface 55c of the deposit attachment section 55a, the generated gas is cooled by the cooling device 55b, and a precipitate for analysis is generated from the generated gas and adheres to the attachment surface 55c. The precipitate for analysis is collected from the attachment surface 55c and can be analyzed using known equipment for identification and quantification of its components.

[0029] In the case where a deposit for analysis is obtained in the deposit generation section 52 and a next deposit for analysis is continuously generated in the deposit generation section 52 for the same or a different sample while the deposit for analysis is being analyzed, the cooling section 55 can be provided with multiple attachment surfaces 55c, 55d for depositing the deposit for analysis. In this way, while the deposit for analysis obtained on one attachment surface 55c is being collected and analyzed, the next deposit for analysis can be generated on another attachment surface 55d. The multiple attachment surfaces 55c, 55d can be provided at different locations on the same deposit attachment section 55a, as shown in the figure. Alternatively, although not shown, multiple deposit attachment sections can be installed and the attachment surfaces 55c, 55d can be provided separately on each of the multiple deposit attachment sections. It is also possible to provide three or more attachment surfaces.

[0030] In this case, the cooling section 55 may be provided with a drive mechanism that drives the deposit adhesion section 55a to change the adhesion surface that comes into contact with the generated gas among the plurality of adhesion surfaces 55c, 55d. Fig. 2 shows a rotation shaft 55e as part of an example of this drive mechanism. The rotation shaft 55e is attached to the deposit adhesion section 55a and drives the deposit adhesion section 55a to rotate, thereby moving either the adhesion surface 55c, 55d of the deposit adhesion section 55a alternately or sequentially to a position facing the outlet of the reaction tube 54b.

[0031] The gas generation section 53 provided in the thermal analysis device 51 may include, for example, a thermal reaction section 56 that heats the sample, and a gas analysis section 57 that is located downstream of the thermal reaction section 56 in the flow direction of the analysis gas generated in the thermal reaction section 56 and analyzes the analysis gas.

[0032] The thermal reaction section 56 of the gas generation section 53 can be substantially similar to the thermal reaction section 54 of the precipitate generation section 52, and can be a heating furnace 56a and a U-shaped or similar heat-resistant glass reaction tube 56b. However, in order to separate high-boiling-point components from the gas for analysis generated in the thermal reaction section 56, the gas generation section 53 preferably has a capture section 56c downstream in the flow direction of the thermal reaction section 56 of the gas generation section 53, which captures and precipitates the high-boiling-point components. On the other hand, the capture section 56c can be set to a temperature at which the low-boiling-point components do not precipitate, so that the low-boiling-point components in the gas for analysis pass through the capture section 56c without being captured by it. This allows the gas for analysis from which the high-boiling-point components have been removed to be sent to the gas analysis section 57 downstream in the flow direction, thereby improving the accuracy of the analysis of the low-boiling-point components in the gas analysis section 57.

[0033] The trapping section 56c may be provided with a cooler to cool it so that the high-boiling-point components precipitate. However, as in the illustrated embodiment, even if such a cooler is not provided and the location of the trapping section 56c in the thermal reaction section 56 is simply positioned outside the heating furnace 56a, it may be possible to appropriately cool the analysis gas in the trapping section 56c to a temperature at which the high-boiling-point components precipitate.

[0034] The gas analyzer 57 is preferably capable of identifying and quantifying the components in the gas to be analyzed. For example, the gas analyzer 57 may be a known gas chromatograph capable of identifying and quantifying the components in a gas. If necessary, the gas analyzer 57 may be provided with a flow meter to measure the flow rate of the gas to be analyzed.

[0035] In the gas generation section 53, a plurality of gas storage chambers 58a to 58c capable of storing the gas for analysis may be provided downstream of the thermal reaction section 56 and upstream of the gas analysis section 57 in the flow direction of the gas for analysis. In this case, the gas for analysis generated next in the thermal reaction section 56 can be stored in the gas storage chamber 58a, 58b, or 58c until the analysis of the predetermined gas for analysis is completed in the gas analysis section 57. In the illustrated example, three gas storage chambers 58a, 58b, and 58c are provided, but two or four or more gas storage chambers may be provided. It is desirable to evacuate the gas storage chamber 58a, 58b, or 58c using a vacuum pump 68 before storing the gas for analysis. This allows components other than the gas for analysis to be removed, which is expected to improve the accuracy of analysis.

[0036] Furthermore, after the gas for analysis stored in the gas storage chamber 58a, 58b or 58c is analyzed by the gas analysis unit 57, the gas in the gas storage chamber 58a, 58b or 58c can be removed by the vacuum pump 68 by opening the valve 67a, 67b or 67c provided in the vacuum exhaust pipe 66a, 66b or 66c.

[0037] Gas pipe 59, located downstream of thermal reaction section 56 of gas generation section 53 in the gas flow direction, is connected to gas pipe 59a only when the gas for analysis is stored in gas storage chamber 58a, 58b, or 58c through six-way valve 65, and is otherwise connected to vent pipe 69. In other words, gas pipe 59 is connected to port 65a of six-way valve 65, and gas components such as atmospheric gas flowing from thermal reaction section 56 pass through the solid line portion of six-way valve 65 and are discharged from port 65f through vent pipe 69, except when the gas for analysis generated in thermal reaction section 56 is stored in gas storage chamber 58a, 58b, or 58c.

[0038] On the other hand, port 65c is connected to gas pipe 63 leading to atmospheric gas, and the atmospheric gas flows to gas pipe 59a through port 65b except when the analytical gas generated in thermal reaction section 56 is stored in gas storage chambers 58a, 58b, or 58c. At this time, valves 60a to 60f are closed and only valve 60g is open, so that the atmospheric gas passes through gas pipes 59i and 59h and ports 65e and 65d and is introduced into gas analysis section 57.

[0039] When the gas for analysis generated in the thermal reaction section 56 is to be stored in the gas storage chamber 58a, 58b, or 58c, valve 60g is closed, and the valves installed on the heating side and analysis side of the gas storage chamber where the gas is stored are opened, and the gas passes through the dotted line portion of the six-way valve 65. As a result, the gas for analysis generated in the thermal reaction section 56 passes through the gas storage chamber 58a, 58b, or 58c from port 65b, passes through gas pipe 59h and port 65e, and is discharged through vent pipe 69 from port 65f.

[0040] Then, the valves installed on the heating side and analysis side of the gas storage chamber storing the gas for analysis are closed, and valve 60g is opened. This causes the gas for analysis to be stored in gas storage chamber 58a, 58b, or 58c. At this time, the ambient gas introduced from port 65c flows into gas analysis section 57 via port 65d without passing through gas piping 59, 59a, 59h-59j.

[0041] When the gas for analysis stored in gas storage chamber 58a, 58b, or 58c is to be analyzed in gas analysis unit 57, the six-way valve 65 is switched so that the gas passes through the solid line portion, valve 60g is closed, and the valves installed on the heating side and analysis side of the gas storage chamber in which the gas for analysis is stored are opened. As a result, the gas for analysis stored in gas storage chamber 58a, 58b, or 58c, together with the atmospheric gas supplied from port 65c, is sent to gas analysis unit 57 through ports 65e and 65d, where it is subjected to component identification and quantitative analysis.

[0042] In the illustrated example, a gas pipe 59a connected to a reaction tube 56b of a thermal reaction section 56 branches into a first branch path 59b, a second branch path 59c, and a third branch path 59d on the heating side, which are connected to a first gas storage chamber 58a, a second gas storage chamber 58b, and a third gas storage chamber 58c, respectively. The first gas storage chamber 58a, the second gas storage chamber 58b, and the third gas storage chamber 58c are connected to a first branch path 59e, a second branch path 59f, and a third branch path 59g on the analysis side, respectively. These branches join together to form a gas pipe 59h, which is connected to a gas analysis section 57.

[0043] Valves 60a to 60f such as on-off valves are provided on the first branch path 59b, the second branch path 59c, and the third branch path 59d on the heating side, and the first branch path 59e, the second branch path 59f, and the third branch path 59g on the analysis side, respectively. By operating the valves 60a to 60f, the inflow of the gas for analysis from the thermal reaction unit 56 to each of the gas storage chambers 58a to 58c and the outflow of the gas for analysis from each of the gas storage chambers 58a to 58c to the gas analysis unit 57 can be controlled.

[0044] Incidentally, the thermal analysis apparatus 51 preferably includes gas supply pipes 61a and 61b capable of supplying atmospheric gas to the deposit generation section 52 and / or the gas generation section 53. Here, one end of each of the gas supply pipes 61a and 61b is connected to the upstream openings in the flow direction of the reaction tubes 54b and 56b of the deposit generation section 52 and the gas generation section 53. The gas supply pipes 61a and 61b and the aforementioned gas piping 59 may be made of stainless steel.

[0045] The other ends of the gas supply pipes 61a and 61b are connected to one or more gas supply sources 62a to 62c, such as a gas storage unit, such as a gas tank, that stores atmospheric gas. The thermal analysis device 51 may further include the gas supply sources 62a to 62c, but the gas supply sources 62a to 62c do not necessarily constitute a part of the thermal analysis device 51.

[0046] By providing gas supply pipes 61a and 61b, it is possible to adjust the atmosphere during heating of the sample in heat reaction sections 54 and / or 56 of precipitate generation section 52 and / or gas generation section 53. In the illustrated example, valves 61c and 61d are provided in gas supply pipes 61a and 61b, respectively, and by opening and closing valves 61c and 61d, it is possible to supply or stop the supply of atmospheric gas to either or both of precipitate generation section 52 and gas generation section 53.

[0047] The atmospheric gas supplied from gas supply pipes 61a and 61b to deposit generation unit 52 and / or gas generation unit 53 is preferably at least one selected from the group consisting of oxygen, nitrogen, carbon dioxide, argon, helium, xenon, neon, and krypton, and may be a mixture of two or more. For example, mixed gases such as nitrogen and oxygen, helium and oxygen, or nitrogen and carbon dioxide may also be preferably used. Air may also be used as the atmospheric gas.

[0048] When the sample is heated in the thermal reaction units 54 and / or 56 in an oxygen-containing atmosphere, oxygen alone can be used. Alternatively, oxygen can be mixed with nitrogen or carbon dioxide, or oxygen can be mixed with a rare gas such as argon, helium, xenon, neon, or krypton. When the sample is heated in the thermal reaction units 54 and / or 56 in an oxygen-deficient atmosphere, at least one gas selected from the group consisting of nitrogen, carbon dioxide, argon, helium, xenon, neon, and krypton can be preferably used. Two or more gases can also be mixed. For example, mixed gases such as nitrogen and oxygen, helium and oxygen, or nitrogen and carbon dioxide can also be preferably used.

[0049] In this embodiment, three gas supply sources 62a-62c each supply atmospheric gas containing one or more of oxygen, nitrogen, carbon dioxide, argon, helium, xenon, neon, and krypton, and gas supply pipes 61a, 61b merge at the gas supply sources 62a-62c sides and then branch into three, including three gas flow paths 63a-63c, one for each of the different atmospheric gases. Valves 64a-64c provided in each gas flow path 63a-63c can be appropriately operated depending on which one or more of the multiple atmospheric gases are to be supplied.

[0050] During injection molding, combustion decomposition of the molding material, mainly due to oxygen, and thermal decomposition of the resin can occur. In the thermal analysis device 51, by supplying oxygen while supplying one or more of nitrogen, carbon dioxide, argon, helium, xenon, neon, and krypton, combustion decomposition of the resin can occur in an oxygen-deficient atmosphere in the thermal reaction sections 54 and / or 56. Alternatively, by supplying one or more of nitrogen, carbon dioxide, argon, helium, xenon, neon, and krypton without supplying oxygen gas, thermal decomposition of the resin can occur in an oxygen-deficient atmosphere in the thermal reaction sections 54 and / or 56.

[0051] The thermal analysis device 51 described above heats a sample of a predetermined material at a predetermined temperature under a predetermined atmosphere in the heat reaction sections 54 and 56 of the deposit generation section 52 and the gas generation section 53. The resulting precipitate and gas can be analyzed to determine the components and amounts of the precipitate and gas. From the results, when the material is used as a molding material for injection molding in the injection molding machine 1, for example, it is possible to estimate the components and amounts of deposits within the mold device 101 and gases emitted from the mold device 101 under molding conditions such as a predetermined heating temperature. Therefore, by repeatedly performing analyses using the thermal analysis device 51 while changing the conditions, it is possible to determine molding conditions that are less likely to cause molding defects in advance.

[0052] Furthermore, since the thermal analysis apparatus 51 of this embodiment does not require the use of precision equipment requiring a high vacuum, such as a mass spectrometer, it may be possible to make it relatively small so that it can be easily transported by hand, for example.

[0053] (injection device) The injection unit 11 mainly comprises a cylindrical or other shaped cylinder 12 extending toward the mold device 101, a screw 13 disposed inside the cylinder 12 with its central axis parallel to the cylinder 12 and with flights spiraling around its periphery, a band-like or other shaped heater 14 disposed around the outer periphery of the cylinder 12, and a motor box 15 disposed behind the cylinder 12 and the screw 13. Although not shown, the motor box 15 contains a metering motor that rotates the screw 13 about its central axis to accumulate a predetermined amount of molding material at the tip of the cylinder 12, an injection motor that moves the screw 13 forward and backward in both directions, toward and away from the mold device 101, and a pressure detection sensor that detects the pressure that the screw 13 receives from the molding material.

[0054] In this case, the direction approaching the fixed platen 32a of the mold clamping unit 31 to which the fixed mold 102 of the mold device 101 is attached is defined as the front side, and the direction moving away from the fixed platen 32a is defined as the rear side. Therefore, in FIG. 1, when looking at the injection unit 11 located to the right of the fixed platen 32a, the left direction approaching the fixed platen 32a is the front side, and the right direction moving away from the fixed platen 32a is the rear side.

[0055] The cylinder 12 is provided with a supply port 12a on the rear side, in front of the motor box 15, to which a hopper can be attached for feeding molding material into the cylinder 12. A nozzle 12b, whose cross-sectional area decreases on the front side, is provided at the tip of the cylinder 12 close to the mold device 101. A water-cooled cylinder 12c, such as a water-cooled cylinder, can be provided near the supply port 12a.

[0056] The heater 14, which is disposed around the cylinder 12 including the nozzle 12b, can be divided into a plurality of sections in the axial direction of the cylinder as shown in the figure, so that the inside of the cylinder 12 inside each heater section can be heated to a different temperature. Each heater section can be provided with a temperature detector.

[0057] Although not shown, a backflow prevention ring may be placed around the tip of the screw 13, which is a constricted portion formed by partially reducing the outer diameter of the screw, to prevent the molding material that has been sent forward as it moves forward and backward with the screw 13 from flowing backward toward the rear. This backflow prevention ring moves back and forth relative to the screw 13 in response to the pressure it receives from molding material located forward or rearward, thereby allowing only the flow of molding material from the rear to the front.

[0058] In the injection device 11 having such a configuration, the molding material introduced into the cylinder 12 from the supply port 12a is heated by the heater 14 on the outer periphery of the cylinder 12 and melted by the rotation of the screw 13 driven by the metering motor during the metering process, while being sent forward inside the cylinder 12 and accumulated at the tip of the cylinder 12. At this time, the screw 13 is displaced backward by the injection motor to form a space at the tip of the cylinder 12 where the molding material can be accumulated. As mentioned above, this metering process can be carried out during the cooling process or the like of the previous molding.

[0059] Then, in the filling step, the screw 13 is displaced forward, so that the molding material at the tip of the cylinder 12 is injected through the nozzle 12b toward the mold device 101. Furthermore, in the subsequent pressure holding step, pressure is applied to the molding material filled in the cavity of the mold device 101 through the molding material remaining at the tip of the cylinder 12. At this time, it is possible to replenish the molding material that has become deficient in the cavity of the mold device 101 due to the cooling contraction of the molding material.

[0060] Although this injection molding machine 1 is an inline screw type, it can also be a pre-plasticization type injection molding machine in which the plasticizing cylinder and plasticizing screw are structurally and functionally separated from the injection cylinder and injection plunger.

[0061] (Mobile device) The moving device 21 is provided, for example, below the motor box 15 of the injection device 11, and is an advance / retract drive mechanism for displacing the injection device 11 forward and backward relative to the fixed platen 32a. Various mechanisms can be used as the forward / backward drive mechanism that constitutes the moving device 21, but the moving device 21 shown in the figure is configured to include a hydraulic or other hydraulic pump 22, a pump operation motor 23 that is electric or other such that operates the hydraulic pump 22, and a double-acting hydraulic cylinder 24 that receives hydraulic fluid from the hydraulic pump 22 and causes a piston rod, the tip of which is fixed to a fixed platen 32a, to perform an extension / retraction motion.

[0062] The moving device 21 further includes a slide base 25 to which the above-mentioned hydraulic pump 22, pump actuation motor 23, and hydraulic cylinder 24 are attached, and a guide 26 that is laid on the base frame 2 to guide the linear movement of the slide base 25. Thereby, the injection unit 11 placed on the slide base 25 can be moved forward and backward.

[0063] The moving device 21 makes it possible to move the injection device 11 away from the mold device 101, or to move the injection device 11 closer to the mold device 101 and press the nozzle 12b of the cylinder 12 of the injection device 11 against the mold device 101 with a predetermined pressure, thereby performing a so-called nozzle touch.

[0064] (mold clamping device) The mold clamping device 31 displaces the movable mold 103 relative to the fixed mold 102 of the mold device 101 to open or close the mold device 101, thereby placing the mold device 101 in a mold clamping state, mold closed state, or mold open state. The mold clamping device 31 includes a platen 32 including a fixed platen 32a, a movable platen 32b, and tie bars 32c, and a platen operating mechanism 33 that operates the platen 32.

[0065] As described above, of the platens 32, the fixed platen 32a is fixedly attached to the platen attachment plate of the base frame 2. On the other hand, the movable platen 32b is disposed on a guide member 32d that is laid on a guide plate of the base frame 2, and can slide in directions toward and away from the fixed platen 32a.

[0066] The platen operating mechanism 33 includes a rear platen 34 arranged on the base frame 2, a mold clamping motor 35 provided on the rear platen 34, a motion conversion mechanism 36 that converts the rotational motion of the mold clamping motor 35 into linear motion in the displacement direction of the movable platen 32b, and a toggle mechanism 37 that amplifies the force transmitted to the motion conversion mechanism 36 and transmits it to the movable platen 32b.

[0067] Of these, the motion conversion mechanism 36 can be various mechanisms that can convert rotational motion into linear motion, but in this example, it is configured to include a screw shaft 36a that is rotationally driven by the mold clamping motor 35 and a nut 36b that is screwed onto the screw shaft 36a. The motion conversion mechanism 36 can also be a ball screw.

[0068] The toggle mechanism 37, which increases the force transmitted from the motion conversion mechanism 36, is formed by connecting a plurality of links 37a to 37c, which connect the rear platen 34 and the nut 36b to the movable platen 32b, with joints so that they can swing. The number and shape of the links and joints can be changed as appropriate, but as shown in Figure 1, a pair of link groups consisting of links 37a to 37c located above and below crosshead 37d, separated by crosshead 37d, are swingably connected to crosshead 37d, which is connected to nut 36b and extends in the vertical direction.

[0069] In addition to the above-described mold clamping motor 35, a mold thickness adjustment motor 38 can also be provided on the rear platen 34. This mold thickness adjustment motor 38 applies a rotational driving force to the screw shaft 36a and the nut 36b connected to the extensions of the tie bars 32c of the platen 32, thereby adjusting the distance between the fixed platen 32a and the rear platen 34, which is movably mounted on the base frame 2. This makes it possible to adjust the mold thickness so that a desired mold clamping force can be applied to the mold device 101, even when replacing the mold device 101 or when the thickness of the mold device 101 is changed due to temperature changes. Although not shown in the drawings, mold thickness adjustment can also be achieved even if the fixed platen side is made movable on the base frame 2 and the rear platen side is fixed.

[0070] The illustrated mold clamping unit 31 is a horizontal type in which the moving direction of the movable platen 32b is parallel to the horizontal direction, but it may also be a vertical type in which the moving direction is vertical.

[0071] (Ejector device) The ejector device 41 provided on the movable platen 32b has an ejector rod 42 that extends through the movable platen 32b and is driven back and forth to press a movable member 104 such as an ejector pin of the mold device 101 from the rear side, and a rod drive source 43 that includes a motion conversion mechanism such as a motor and a ball screw to operate the ejector rod 42.

[0072] In the process of removing the molded product, the ejector device 41 advances the ejector rod 42 driven by the rod drive source 43 to eject the movable member 104 within the mold device 101, thereby making it possible to push the molded product out of the mold device 101. After the movable member 104 has been ejected, the ejector rod 42 can be retracted by the rod drive source 43 to return to its original position. [Explanation of symbols]

[0073] 1 injection molding machine 2 base frame 11 Injection device 12 cylinders 12a Supply port 12b nozzle 12c water-cooled cylinder 13 Screw 14 Heater 15 Motor box 21 Mobile Devices 22 Hydraulic pump 23 Pump operating motor 24 Hydraulic Cylinder 25 Slide Base 26 Guide 31 Mold clamping device 32 Platen 32a Fixed Platen 32b Movable platen 32c tie bar 32d Guide member 33 Platen operating mechanism 34 Rear platen 35 Mold clamping motor 36 Motion conversion mechanism 36a Screw shaft 36b Nut 37 Toggle mechanism 37a~37c Link 37d Crosshead 38 Mold thickness adjustment motor 41 Ejector device 42 Ejector rod 43 Rod drive source 51 Thermal analyzer 52 Precipitate generation part 53 Gas generation unit 54 Heating reaction section 54a Furnace 54b Reaction tube 55 Cooling section 55a Deposit adhesion area 55b Cooling device 55c, 55d Adhesion surface 55e Rotating shaft 56 Heating reaction section 56a Furnace 56b Reaction tube 56c Capture part 57 Gas Analysis Section 58a First Gas Storage Room (Gas Storage Room) 58b Second Gas Storage Room (Gas Storage Room) 58c Third Gas Storage Room (Gas Storage Room) 59, 59a, 59h~59j Gas piping 59b, 59e First Branch 59c, 59f Second Branch 59d, 59g Third Branch 60a~60g, 61c, 61d, 64a~64d, 67a~67c valves 61a, 61b gas supply pipes 62a~62c Gas supply source 63a~63c Gas flow path 65 Six-way valve 65a~65f ports 66a~66c Vacuum exhaust pipe 68 Vacuum Pump 69 Vent piping 101 Mold equipment 102 Fixed mold 103 Movable mold 104 Movable parts

Claims

1. A thermal analyzer for a material that is generated by the evaporation of low-boiling-point components having a relatively low boiling point and high-boiling-point components having a boiling point relatively higher than the low-boiling-point components when heated, and used to confirm physical properties of the material that accompany temperature changes, comprising: a precipitate generating unit that heats the sample of the material, precipitates high-boiling point components in the generated gas, and generates a precipitate for analysis; a gas generating unit that heats the sample of the material and generates an analytical gas containing a low boiling point component; A thermal analysis apparatus comprising:

2. The precipitate generation portion is a thermal reaction unit for heating the sample; a cooling section that is provided downstream of the thermal reaction section in the flow direction of the generated gas and cools the generated gas to precipitate the high-boiling point component; The thermal analysis device according to claim 1 ,

3. The gas generating unit a thermal reaction unit for heating the sample; a gas analysis section that is provided downstream of the thermal reaction section in the flow direction of the gas for analysis and analyzes the gas for analysis; The thermal analysis device according to claim 1 ,

4. 4. The thermal analysis apparatus according to claim 3, wherein the gas analysis section is capable of identifying and quantifying components in the gas to be analyzed.

5. A thermal analysis apparatus as described in claim 3, wherein a capture section is provided at a location downstream in the flow direction of the heating reaction section of the gas generation section, which allows low boiling point components in the analysis gas to pass through and precipitates and captures high boiling point components in the analysis gas.

6. 4. The thermal analysis apparatus according to claim 3, wherein the gas generating section has a plurality of gas storage chambers downstream of the thermal reaction section and upstream of the gas analyzing section in the flow direction.

7. 4. The thermal analysis device according to claim 1, further comprising a gas supply pipe capable of supplying an atmospheric gas to the deposit generating section and / or the gas generating section.

8. 8. The thermal analysis apparatus according to claim 7, wherein the gas supply pipe includes a plurality of gas flow paths for different types of atmospheric gas.

9. 8. The thermal analysis apparatus according to claim 7, wherein the atmospheric gas contains at least one selected from the group consisting of oxygen, nitrogen, carbon dioxide, argon, helium, xenon, neon, and krypton.

10. The thermal analysis device according to any one of claims 1 to 3, wherein the material is a resin material.

11. The thermal analyzer according to claim 10, wherein the resin material is a molding material used in injection molding.

Images