Linear motion device and electronic component mounting device

Abstract

To provide a linear motion device that suppresses thermal deformation of a mobile object, a guide rail, and a linear guide due to heat generated from a movable element, to improve positioning accuracy of the mobile object.SOLUTION: A linear motion device 1 includes: a base 2 extending in a reference direction; a linear guide mechanism 3 having a slider 32 movable along a guide rail 31 disposed on a side of the base; a mobile object 5 fixed to the slider; a linear motor 4 having a stator 42 and a mover 41 disposed above the base; and a heat transfer body 6 coupled to the mobile object and the mover above the linear guide mechanism. The mobile object and the heat transfer body are connected via the spacer. The heat transfer body extends in a direction away from the linear guide mechanism, and the linear motor and the heat transfer body do not face the linear guide mechanism in a horizontal direction orthogonal to the reference direction.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a linear motion device that moves a moving body by a linear motor, and an electronic component mounting apparatus that includes the linear motion device. [Background technology]

[0002] A known linear motion device for moving a moving body uses a linear motor as a drive unit. Because a linear motor does not have a mechanical power transmission part, deterioration of the positioning accuracy of the moving body due to deformation or wear of the components constituting the linear motion device is less likely, making it suitable for high-precision positioning.

[0003] The moving body moves by being connected to the mover of a linear motor, but the mover generates heat when current is applied, and when this heat is transferred to the moving body, the moving body thermally deforms and the positioning accuracy of the moving body deteriorates. Therefore, Patent Document 1 discloses a linear motion device in which a ventilation path through which cooling air flows is provided between the mover and the moving body (top plate), thereby efficiently cooling the mover, and the mover and moving body are connected via a heat insulating material, thereby suppressing the transfer of heat generated from the mover to the moving body. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2013-212024 Summary of the Invention [Problem to be solved by the invention]

[0005] In the linear motion device disclosed in Patent Document 1, a mover is disposed between a pair of guide rails, and a moving body connected to the mover is fixed to a linear guide (slider) supported by the guide rails, thereby allowing it to move along the guide rails. In a linear motion device configured in this manner, the mover is disposed close to one another in a space surrounded by the moving body, guide rails, and linear guide. Therefore, even if an air passage or heat insulating material is interposed between the mover and the moving body, heat generated from the mover is inevitably transferred to the moving body, guide rails, and linear guide by thermal radiation and convection, resulting in a problem of thermal deformation of these components, which deteriorates the positioning accuracy of the moving body.

[0006] The present invention has been made in consideration of the above points, and its main object is to provide a linear motion device that suppresses thermal deformation of the moving body, guide rail, and linear guide due to heat generated from the moving element, and improves the positioning accuracy of the moving body. [Means for solving the problem]

[0007] The linear motion device of the present invention is a linear motion device that moves a movable body in a reference direction, and includes: a base extending in the reference direction; a linear guide mechanism arranged to the side of the base and having a guide rail extending in the reference direction and a slider movable along the guide rail; a movable body fixed to the slider; a linear motor arranged above the base and having a stator extending in the reference direction and a movable body provided with a fixed gap between it and the stator; and a heat transfer body interposed between the movable body and the movable body above the linear guide mechanism and connected to the movable body and the movable body, the movable body and the heat transfer body being connected via a spacer, the heat transfer body extending in a direction away from the linear guide mechanism, and the linear motor and the heat transfer body not facing the linear guide mechanism in a horizontal direction perpendicular to the reference direction. [Effects of the Invention]

[0008] According to the present invention, it is possible to provide a linear motion device that suppresses thermal deformation of the moving body, guide rail, and linear guide due to heat generated from the moving element, and improves the positioning accuracy of the moving body. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a perspective view showing a configuration of a linear motion device according to a first embodiment of the present invention. [Figure 2] 1 is a cross-sectional view showing the configuration of a linear motion device according to a first embodiment of the present invention. [Figure 3] 1A and 1B are diagrams showing the configuration of a conventional linear motion device. [Figure 4] 10(A) and 10(B) are diagrams showing the configuration of a linear motion device in which a mover is disposed in a direction away from a linear guide mechanism. [Figure 5] 1A and 1B are diagrams showing the configuration of a linear motion device according to a first embodiment. [Figure 6] 10(A) and 10(B) are diagrams showing the configuration of another linear motion device in the first embodiment. [Figure 7] 4 is a cross-sectional view showing the configuration of a linear motion device in a modified example of the first embodiment. [Figure 8] 4 is a cross-sectional view showing the configuration of a linear motion device in a modified example of the first embodiment. [Figure 9] FIG. 4 is a cross-sectional view showing the configuration of an electronic component mounting device according to a second embodiment of the present invention. [Figure 10] FIG. 10 is a front view showing the configuration of an electronic component mounting apparatus according to a second embodiment of the present invention. [Figure 11] FIG. 10 is a cross-sectional view showing the configuration of a linear motion device according to another embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. Note that the present invention is not limited to the following embodiment. Furthermore, appropriate modifications are possible within the scope of the effects of the present invention.

[0011] (First embodiment) FIG. 1 is a perspective view that schematically shows the configuration of a linear motion device according to a first embodiment of the present invention, and FIG. 2 is a cross-sectional view that schematically shows the configuration of the linear motion device.

[0012] In the following description, the direction in which the moving body moves (reference direction) is the X direction, the horizontal direction perpendicular to the X direction is the Y direction, and the vertical direction perpendicular to the X direction is the Z direction.

[0013] As shown in FIG. 1, the linear motion device 1 includes a base 2, a linear guide mechanism 3, a linear motor 4, a moving body 5, a heat transfer body 6, a spacer 7, a position sensor 8, a power supply cable 9, and a control unit (not shown).

[0014] The base 2 is formed in a rectangular parallelepiped shape extending in the X direction. The linear guide mechanism 3 has a guide rail 31 and a slider 32. The guide rail 31 extends in the X direction and is fixed to the base 2 with bolts or the like. A plurality of guide rails 31 may be provided. In this embodiment, two guide rails 31 are provided spaced apart in the Z direction.

[0015] The guide rails 31 support sliders 32 so as to be movable in the X direction along the guide rails 31. A plurality of sliders 32 may be provided. In this embodiment, two sliders 32 are provided for each guide rail 31, for a total of four sliders 32.

[0016] It is desirable to provide a rolling element at the engagement portion between the guide rail 31 and the slider 32. This reduces the frictional force generated between the guide rail 31 and the slider 32, and reduces lost motion during positioning of the moving body 5, which will be described later.

[0017] 2, the linear motor 4 has a stator 42 and a mover 41. The stator 42 is arranged facing each other with a gap in the Z direction and is composed of a series of magnet rows 42a extending in the X direction and a frame 42b with a U-shaped cross section that holds the magnet rows 42a. The stator 42 is fixed to the upper surface of the base 2. A support part 43 that supports the power supply cable 9 is provided on the upper surface of the stator 42.

[0018] The mover 41 is formed in a rectangular parallelepiped shape and has multiple coils (not shown) inside. The mover 41 is disposed between the magnet rows 42a with a fixed gap between the upper and lower magnet rows. The mover 41 is fixed to the heat transfer body 6 (described later) with bolts or the like. The multiple coils are electrically connected to the control unit via a power supply cable 9.

[0019] When the coils are energized, magnetism is generated around the coils, generating an attractive force between the coils and the magnet array 42a, thereby applying a propulsive force to the mover 41 in the X direction.

[0020] It is desirable that the linear motor 4 be arranged so that the mover 41 is located above the linear guide mechanism. Because air heated near the mover 41 tends to flow upward, by arranging the mover 41 above the linear guide mechanism 3, it is possible to suppress heat transfer by convection from the mover 41 to the linear guide mechanism 3 and the moving body 5, which will be described later.

[0021] The moving body 5 is formed, for example, in the shape of a plate extending in the X and Z directions. The lower side of the moving body 5 is fixed to the slider 32 with bolts or the like. The upper side of the moving body 5 is fixed to the heat transfer body 6 with bolts or the like via a spacer 7, which will be described later. In FIG. 1, the moving body 5 is shown as a transparent part with dotted lines so that the internal structure can be seen.

[0022] The heat transfer body 6 connected to the mover 41 extends in a direction (Z direction) away from the linear guide mechanism 3. Furthermore, the heat transfer body 6 has a bent portion 61 at the end opposite the linear guide mechanism 3, extending in a direction (Y direction) away from the moving body 5. In this way, the heat transfer body 6 is formed so that its cross section when viewed from the X direction is L-shaped. Note that the bent portion 61 may extend at an angle with respect to the Y direction. Furthermore, the heat transfer body 6 may have a heat shielding portion 62 at the end on the linear guide mechanism 3 side that blocks radiant heat from the mover 41.

[0023] The heat transfer body 6 is desirably made of a material with high thermal conductivity, such as aluminum or copper. This allows the heat generated from the mover 41 to be efficiently transferred to the heat transfer body 6, and the heat transferred from the mover 41 to be dissipated into the atmosphere. The heat transfer body 6 may also be provided with heat dissipation fins. This increases the heat dissipation area and improves the heat dissipation efficiency of the heat transfer body 6. A support for supporting one end of the power feed cable 9 may be provided at a part of the heat transfer body 6 (for example, at the bent portion 61). The other end of the power feed cable 9 is fixed to a support 43 provided on the upper surface of the linear motor 4, for example.

[0024] The spacer 7 is formed, for example, in a cylindrical shape. The multiple spacers 7 are arranged at intervals between the moving body 5 and the heat transfer body 6 so as to provide ventilation passages 71 that communicate in the X direction. This forms an air layer between the moving body 5 and the heat transfer body 6, suppressing heat transfer between the heat transfer body 6 and the moving body 5. Furthermore, by providing the ventilation passages 71 in the direction in which the moving body 5 moves (X direction), an air flow is generated between the moving body 5 and the heat transfer body 6, thereby improving the heat dissipation effect.

[0025] It is also preferable to provide ventilation passages communicating in the Z direction between the plurality of spacers 7. This makes it easier for the heated air around the heat transfer body 6 to flow upward, thereby improving the heat dissipation effect of the heat transfer body 6.

[0026] The spacer 7 is preferably made of a material with low thermal conductivity, such as resin or stainless steel, so that heat transfer from the heat transfer body 6 to the moving body 5 can be suppressed.

[0027] The position sensor 8 has a linear scale 82 and a sensor head 81. The linear scale 82 extends in the X direction so as to be substantially parallel to the guide rail 31, and is fixed to the base 2. The sensor head 81 is fixed to the movable body 5 so that a reading unit of the sensor head 81 faces the linear scale 82. The reading unit of the sensor head 81 acquires position information recorded on the surface of the linear scale 82, thereby acquiring the relative position of the movable body 5 in the X direction with respect to the base 2.

[0028] A control unit (not shown) acquires position information from the sensor head 81 and outputs drive signals (currents) to the multiple coils based on the difference between the relative position of the moving body 5 with respect to the base 2 and the target position of the moving body 5. When the multiple coils are energized, a driving force is applied to the mover 41, and the moving body 5 moves relative to the base 2 in the X direction.

[0029] In this embodiment, the mover 41 is disposed in a direction away from the linear guide mechanism 3. In other words, the mover 41 is disposed in a position where it is not constrained by the space surrounded by the movable body 5, the guide rail 31, and the slider 32. Therefore, the heat conductor 6 connected to the mover 41 can be disposed extending in a direction away from the linear guide mechanism 3 (Z direction). This allows heat generated in the mover 41 to be quickly dissipated via the heat conductor 6, and the temperature of the mover 41 can be quickly lowered. As a result, the transfer of heat generated from the mover 41 to the movable body 5, the guide rail 31, and the slider 32 by radiant heat or convection can be significantly suppressed, preventing thermal deformation of these members and improving the positioning accuracy of the movable body.

[0030] 3A and 3B, in a conventional linear motion device, the mover 41 is disposed midway between a pair of guide rails 31. In this case, the center of gravity P1 of the movable part, which is made up of the moving body 5, the mover 41, and the slider 32, is located near the mover 41 in the Z direction. Therefore, the movable part receives the thrust F generated in the mover 41 when the linear motor 4 is operated near the center of gravity P1 of the movable part, and the couple generated in the movable part is small.

[0031] 4A and 4B, when the mover 41 is disposed in a direction away from the linear guide mechanism 3 (Z direction), the center of gravity P2 of the movable part made up of the moving body 5, the mover 41, and the slider 32 is located in a position away from the mover 41 in the Z direction. Therefore, the movable part receives the thrust F generated in the mover 41 when the linear motor 4 is operated at a position away from the center of gravity P1 of the movable part, and a couple of forces is generated in the movable part.

[0032] 4(A), this couple N acts on the slider 32, which movably supports the movable body 5, in a direction (mainly the Z direction) other than the movement direction (X direction) of the slider 32. Therefore, this couple N elastically deforms the slider 32 and the rolling elements interposed between the slider 32 and the guide rail 31, and increases the sliding resistance between the guide rail 31 and the slider 32. Furthermore, the direction of this couple N is reversed depending on the direction of the thrust force F, i.e., the movement direction of the movable body 5. As a result, lost motion increases when positioning the movable body 5.

[0033] 5(A) and 5(B), in this embodiment, the heat transfer body 6 connected to the mover 41 disposed in a direction away from the linear guide mechanism 3 is disposed so as to extend in the direction away from the linear guide mechanism 3 (mainly in the Z direction). Therefore, by adjusting the configuration of the heat transfer body 6, for example, the length of the heat transfer body 6 in the Z direction, the center of gravity position P3 of the movable part formed by the moving body 5, the heat transfer body 6, the mover 41, and the slider 32 can be moved closer to the mover 41 in the Z direction.

[0034] 5A, in this embodiment, the thrust F generated in the mover 41 can be received near the center of gravity P3 of the movable part, thereby reducing the couple N applied to the slider 32. As a result, elastic deformation of the slider 32 and the rolling elements interposed between the slider 32 and the guide rail 31 is suppressed, and sliding resistance between the guide rail 31 and the slider 32 is reduced, thereby suppressing lost motion in positioning the movable body 5.

[0035] 6(A) and 6(B), a bent portion 61 extending in the direction away from the movable body 5 (X direction) may be provided at the end of the heat transfer body 6 opposite the linear guide mechanism 3. This allows the center of gravity P4 of the movable part consisting of the movable body 5, heat transfer body 6, movable element 41, and slider 32 to be closer to the center of the movable element 41. As a result, the couple N acting on the slider 32 becomes smaller, and lost motion in positioning the movable body 5 can be further suppressed.

[0036] 2, when the power feed cable 9 is arranged at the bent portion 61 of the heat transfer body 6, it is preferable to adjust the configuration of the heat transfer body 6 including the bent portion 61 so that the position of the center of gravity of the movable part including the power feed cable 9 approaches the vicinity of the mover 41. In this case, the mass of the power feed cable 9 received by the bent portion 61 changes depending on the position of the movable body 5, so it is preferable to determine the position of the center of gravity of the movable part including the power feed cable 9 at, for example, an intermediate position in the stroke of the movable body 5.

[0037] (Modification of the first embodiment) FIG. 7 is a cross-sectional view schematically illustrating the configuration of a linear motion device 1 according to a modification of the first embodiment. In the linear motion device 1 illustrated in FIG. 2, a heat shield 62 that blocks radiant heat from the mover 41 is provided at the end of the heat transfer body 6 facing the linear guide mechanism 3. However, in this modification, a heat shield 63 that blocks radiant heat from the mover 41 is provided at the end of the heat transfer body 6 facing the linear guide mechanism 3. This suppresses heat transfer by radiation from the mover 41 to the moving body 5 and the linear guide mechanism 3. The heat shield 63 is preferably formed of a material with low thermal conductivity, such as resin or stainless steel. This reduces the amount of heat transferred from the heat transfer body 6 to the heat shield 63, thereby suppressing heating of the air near the linear guide mechanism 3 by the heat shield 63.

[0038] 8, a heat shield 10 fixed to the base 2 may be provided between the stator 42 and the linear guide mechanism 3 to block radiant heat from the mover 41. This reduces the amount of heat radiated from the heat transfer body 6 toward the moving body 5 and the linear guide mechanism 3, thereby suppressing heat transfer from the heat transfer body 6 to the moving body 5 and the linear guide mechanism 3. In addition, convection in the Z direction with the heat shield 10 as a boundary is suppressed, thereby suppressing heat transfer by convection from the mover 41 and heat transfer body 6 to the moving body 5 and the linear guide mechanism 3.

[0039] Furthermore, the surface of the heat transfer body 6 facing the mover 41 may be coated with a material that absorbs radiant heat from the mover 41. Examples of materials that promote absorption of radiant heat include black paint and alumite. This increases the amount of radiant heat absorbed by the heat transfer body 6, thereby improving the heat dissipation efficiency of the heat transfer body 6.

[0040] Furthermore, it is preferable that the surface of the heat transfer body 6 facing the moving body 5 is a mirror finish. This reduces the amount of heat radiated from the heat transfer body 6 toward the moving body 5 and the linear guide mechanism 3, thereby suppressing heat transfer from the heat transfer body 6 to the moving body 5 and the linear guide mechanism 3.

[0041] (Second embodiment) 9 and 10 are diagrams schematically showing the configuration of an electronic component mounting apparatus according to a second embodiment of the present invention.

[0042] As shown in FIG. 9, the electronic component mounting device in this embodiment is an electronic component mounting device that mounts electronic components on a substrate, and includes the linear motion device 1 in the first embodiment and a mounting head 101 that is fixed to the moving body 5 of the linear motion device 1 and mounts the electronic components on the substrate.

[0043] The mounting head 101 has a suction nozzle 111 and a head driving mechanism 121. The head driving mechanism 121 is provided on the moving body 5 and supports the suction nozzle 111 so that it can move in the Z direction relative to the moving body 5. The suction nozzle 111 has a suction hole 112 on its underside. By supplying negative pressure or positive pressure to the suction nozzle 111, the suction nozzle 111 picks up, holds, and releases components.

[0044] The head driving mechanism 121 is composed of a servo motor, a stepping motor, a linear motor, or the like, and moves the suction nozzle 111 in the Z direction relative to the component 501 placed on the component supply stage 201 described below and the substrate 502 placed on the substrate supply stage 301.

[0045] The linear motion device 1 moves the moving body 5 along the X direction to move the suction nozzle 111 directly above the component supply stage 201 (first position) and directly above the substrate supply stage 301 (described later) (second position).

[0046] 10, the component supply stage 201 has a stage 202 that supports a component 501, and a stage driving mechanism 203. The component supply stage 201 is disposed so that the upper surface of the stage 202 faces the suction nozzle 111 that is in the first position. The stage driving mechanism 203 is made up of an actuator such as a servo motor, a stepping motor, or a linear motor, and moves the component 501 relative to the mounting head 101 in a rotation direction (θ direction) with the X direction, Y direction, and Z direction as the rotation axis.

[0047] The substrate supply stage 301 includes a stage 302 that supports the substrate 502, a stage driving mechanism 303, and a mounting position measurement sensor (not shown). The substrate supply stage 301 is disposed so that the upper surface of the stage 302 faces the suction nozzle 111 that is in the second position. The stage driving mechanism 303 is made up of an actuator such as a servo motor, a stepping motor, or a linear motor, and moves the stage 302 relative to the mounting head 101 in the X direction, Y direction, and Θ direction.

[0048] The mounting position measurement sensor has at least one camera, etc. The mounting position measurement sensor measures the relative position and relative angle on a horizontal plane between the component 501 sucked and held by the suction nozzle 111 and the substrate 502 placed on the upper surface of the stage 302.

[0049] The head driving mechanism 121 and stage driving mechanism 203 described above are provided for the purpose of moving the suction nozzle 111 and the component 501 relatively in the Z direction, X direction, Y direction, and Θ direction. These relative movements may be performed by either or both of the mounting head 101 and the component supply stage 201. For example, a configuration may be adopted in which the suction nozzle 111 is moved relatively in the Z direction, X direction, Y direction, and Θ direction with respect to the fixed stage 202.

[0050] The same applies to the head driving mechanism 121 and the stage driving mechanism 303, and the relative movement of the suction nozzle 111 and the substrate 502 may be performed by either the mounting head 101 or the substrate supply stage 301, or both.

[0051] Next, the mounting operation of the electronic component mounting apparatus of this embodiment will be described.

[0052] A control unit (not shown) drives the linear motion device 1 and the stage drive mechanism 203, causing the suction nozzle 111 to move to a first position, and the component 501 to move directly below the suction nozzle 111. The control unit also drives the head drive mechanism 121, causing the suction nozzle 111 to move downward. When the upper surface of the component 501 and the lower surface of the suction nozzle 111 are at a predetermined distance, or when the upper surface of the component 501 and the lower surface of the suction nozzle 111 come into contact, the suction nozzle 111 stops moving. By supplying negative pressure to the suction hole 112, the suction nozzle 111 suctions and holds the component 501. By driving the head drive mechanism 121, the suction nozzle 111 moves a predetermined distance upward while suction-holding the component 501. By driving the linear motion device 1 and the stage drive mechanism 303, the suction nozzle 111 moves to a second position while suction-holding the component 501, and the substrate 502 moves directly below the suction nozzle 111.

[0053] Based on the relative position and relative angle between the component 501 and the board 502 on the horizontal plane acquired from the mounting position measurement sensor, the stage driving mechanism 303 is driven to move the board 502 to a predetermined mounting position and mounting angle. By driving the head driving mechanism 121, the suction nozzle 111 moves downward while suction-holding the component 501. When the upper surface of the board 502 and the lower surface of the component 501 are at a predetermined distance or when the upper surface of the board 502 and the lower surface of the component 501 come into contact, the movement of the suction nozzle 111 stops. By supplying positive pressure to the suction hole 112, the suction nozzle 111 releases the component 501. By driving the head driving mechanism 121, the suction nozzle 111 moves upward a predetermined amount.

[0054] By the above operation, the component 501 is placed on the board 502 at the correct mounting position and angle.

[0055] The direction of vertical movement of the suction nozzle 111 changes slightly with each mounting operation due to thermal deformation of the components of the linear motion device 1 and the mounting head 101, lost motion of the moving body 5, etc. The component 501 held by suction on the suction nozzle 111 is placed on the board 502 by linearly moving the suction nozzle 111 downward after the component 501 and the board 502 have been positioned at the mounting position. Therefore, if the inclination of the vertical movement direction of the suction nozzle 111 is large, the difference between the relative position acquired by the mounting position measurement sensor and the relative position between the component 501 placed on the board 502 and the board 502 becomes large. In other words, the mounting accuracy of the component 501 relative to the board 502 deteriorates.

[0056] The linear motion device of the present invention can reduce thermal deformation of the components of the linear motion device 1 and the mounting head 101, and lost motion of the moving body 5, thereby reducing changes in the tilt of the up and down movement direction of the suction nozzle 111 for each mounting operation. Therefore, it is possible to mount the component 501 on the board 502 with high precision.

[0057] While the present invention has been described above using preferred embodiments, these descriptions are not limiting and various modifications are possible. For example, in the above embodiment, in the linear motion device 1 illustrated in Figures 1 and 2, the mover 41 is arranged to extend in the Y direction (horizontal direction), and the movable body 5 and heat transfer body 6 are arranged to extend in the Z direction (vertical direction). However, this is not limiting. For example, as shown in Figure 11, the mover 41 may be arranged to extend in the Z direction (vertical direction), and the movable body 5 and heat transfer body 6 may be arranged to extend in the Y direction (horizontal direction). Of course, the mover 41, the movable body 5, and the heat transfer body 6 may be arranged in other directions.

[0058] In the above embodiment, the linear motion device 1 is applied to an electronic component mounting device, but the linear motion device 1 is not limited to this and can be applied to any component transport, assembly, and positioning applications. The linear motion device 1 may also be used as a stage driving device in which the moving body 5 is configured as a stage. [Explanation of symbols]

[0059] 1. Linear motion device 2. Bass 3 Linear guide mechanism 4 Linear motor 5. Mobile 6 Heat Transfer Material 7 spacers 8 Position Sensor 9 Power Cable 10 Heat shield 31 Guide rail 32 slider 41 Mover 42 Stator 42a Magnet array 42b frame 43 Support part 62 Heat shield 63 Heat shield material 71 Ventilation duct 81 Sensor head 82 Linear Scale 101 Mounting head 111 Suction nozzle 112 suction hole 121 Head drive mechanism 201 Parts supply stage 202 Stages 203 Stage drive mechanism 301 Substrate supply stage 302 Stage 303 Stage drive mechanism 501 parts 502 board

Claims

1. A linear motion device that moves a moving body in a reference direction, a base extending in the reference direction; a linear guide mechanism disposed on a side of the base and including a guide rail extending in the reference direction and a slider movable along the guide rail; the moving body fixed to the slider; a linear motor disposed above the base and including a stator extending in the reference direction and a mover provided with a certain gap between the stator and the linear motor; a heat transfer body that is interposed between the moving body and the movable element above the linear guide mechanism and is connected to the moving body and the movable element; Equipped with the moving body and the heat transfer body are connected via a spacer, the heat transfer body extends in a direction away from the linear guide mechanism, The linear motor and the heat transfer body do not face the linear guide mechanism in a horizontal direction perpendicular to the reference direction.

2. The linear motion device according to claim 1 , wherein the mover is disposed in a direction away from the linear guide mechanism.

3. The linear motion device according to claim 1 or 2, wherein the heat transfer body has a bent portion at an end opposite to the linear guide mechanism, the bent portion extending in a direction away from the moving body.

4. 4. The linear motion device according to claim 1, wherein a heat dissipation fin is provided on a surface of the heat transfer body.

5. 5. The linear motion device according to claim 1, wherein the heat transfer body has a heat shield portion at an end portion on the linear guide mechanism side that blocks radiant heat from the mover.

6. The linear motion device according to any one of claims 1 to 5, wherein a heat shield fixed to the base is provided between the stator and the linear guide mechanism to block radiant heat from the mover.

7. 7. The linear motion device according to claim 1, wherein a surface of said heat transfer body facing said moving element is coated with a material that absorbs radiant heat from said moving element.

8. 8. The linear motion device according to claim 1, wherein a surface of the heat transfer body facing the moving body is a mirror surface.

9. the spacer is made up of two spacers extending in the reference direction and parallel to each other, The linear motion device according to claim 1 , wherein a ventilation passage communicating in the reference direction is provided between the spacers.

10. The linear motion device according to any one of claims 1 to 9, wherein a part of the heat transfer body has a support portion that supports a power supply cable connected to the mover.

11. the spacer is made up of a plurality of spacers arranged at intervals in the reference direction, The linear motion device according to claim 1 , wherein a ventilation passage communicating in the vertical direction is provided between the spacers.

12. A linear motion device that moves a moving body in a reference direction, a base extending in the reference direction; a linear guide mechanism that is disposed on a side of the base and has a guide rail that extends in the reference direction and a slider that is supported movably along the guide rail; the moving body fixed to the slider; a linear motor disposed above the base and including a stator extending in the reference direction and a mover provided with a certain gap between the stator and the linear motor; a heat transfer body that is interposed between the moving body and the movable element above the linear guide mechanism and is connected to the moving body and the movable element; Equipped with the heat transfer body extends in a direction away from the linear guide mechanism, A linear motion device in which a plurality of spacers are arranged at intervals between the moving body and the heat transfer body, and a first ventilation passage communicating in the reference direction and a second ventilation passage communicating in a vertical direction perpendicular to the reference direction are formed between the plurality of spacers.

13. An electronic component mounting apparatus that mounts electronic components on a substrate, A linear motion device according to any one of claims 1 to 12; a mounting head fixed to the movable body and configured to mount the electronic components on the substrate; An electronic component mounting device comprising:

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