Maintenance device, vacuum processing system, and maintenance method

Abstract

To efficiently clean the inside of a processing container without opening it to the atmosphere.SOLUTION: A maintenance device includes a case that is formed with an opening having a size corresponding to a second gate of a vacuum processing device in which a first gate used for loading and unloading a substrate and a second gate different from the first gate is provided in a processing container is formed, and in which the opening can be airtightly attached to the second gate, a decompression mechanism that depressurizes the inside of the case, and a suction mechanism that is placed inside the case, enters the processing container through the opening, and suctions an object attached to the processing container.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present disclosure relates to a maintenance device, a vacuum processing system, and a maintenance method. [Background technology]

[0002] Vacuum processing apparatuses are known that place substrates such as semiconductor wafers (hereinafter referred to as "wafers") in a processing chamber under vacuum and perform various substrate processing operations. In such vacuum processing apparatuses, in order to reduce downtime, it is required to clean the processing chamber without opening it to the atmosphere.

[0003] In this regard, Patent Document 1 discloses a technology for cleaning the inside of a processing vessel by providing a second gate to which a maintenance device having an adsorption unit can be attached, separate from a first gate used for loading and unloading substrates, and having the adsorption unit adsorb unwanted materials inside the processing vessel. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 2018-133464 Summary of the Invention [Problem to be solved by the invention]

[0005] The present disclosure provides a technique that can efficiently clean the inside of a processing vessel without opening it to the atmosphere. [Means for solving the problem]

[0006] A maintenance device according to one aspect of the present disclosure includes a case having an opening of a size corresponding to a first gate used for loading and unloading substrates and a second gate different from the first gate provided in a processing vessel of a vacuum processing device, the opening being airtightly attached to the second gate, a pressure reduction mechanism for reducing the pressure inside the case, and a suction mechanism disposed inside the case, which enters the processing vessel through the opening and sucks up adhesions from an object inside the processing vessel. [Effects of the Invention]

[0007] According to the present disclosure, it is possible to achieve an effect of highly efficiently cleaning the inside of a processing vessel without exposing it to the atmosphere. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a diagram schematically illustrating a plasma etching apparatus according to an embodiment. [Figure 2] FIG. 2 is a cross-sectional view that schematically shows a maintenance device according to an embodiment. [Figure 3] FIG. 3 is a diagram showing details of the suction mechanism according to the embodiment. [Figure 4] FIG. 4 is a diagram showing an example of the arrangement of the suction port, the supply port, the irradiation unit, and the imaging unit according to the embodiment. [Figure 5] FIG. 5 is a diagram showing another example of the arrangement of the suction port, the supply port, the irradiation unit, and the imaging unit according to the embodiment. [Figure 6] FIG. 6 is a flowchart showing an example of a processing operation of the vacuum processing system according to the embodiment. [Figure 7A] FIG. 7A is a view for explaining an example of an operation when the edge ring is carried out from the processing vessel and the mounting table is cleaned. [Figure 7B] FIG. 7B is a view for explaining an example of an operation when the edge ring is carried out from the processing chamber and the mounting table is cleaned. [Figure 8] FIG. 8 is a flowchart showing an example of a process for cleaning the mounting table. [Figure 9A]FIG. 9A is a view for explaining an example of an operation when an edge ring is carried into a processing vessel. [Figure 9B] FIG. 9B is a view for explaining an example of an operation when the edge ring is carried into the processing vessel. [Figure 9C] FIG. 9C is a view for explaining an example of an operation when the edge ring is carried into the processing vessel. [Figure 10] FIG. 10 is a flowchart showing an example of a process for correcting the position of the edge ring after loading. [Figure 11] FIG. 11 is a diagram showing an example of an imaging position in the imaging unit. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments of the maintenance device, vacuum processing system, and maintenance method disclosed herein will be described in detail with reference to the drawings. Note that the same or equivalent parts in each drawing will be denoted by the same reference numerals. Furthermore, the disclosed processing device is not limited to the present embodiment.

[0010] [Configuration of equipment to be maintained] The maintenance target device, which is the object of maintenance by the maintenance device, will be described below. The maintenance target device is a vacuum processing device that places substrates such as wafers in a processing vessel under vacuum and performs predetermined substrate processing. In this embodiment, the maintenance target device will be described as a plasma etching device that performs plasma etching on substrates. However, the maintenance target device is not limited to a plasma etching device.

[0011] FIG. 1 is a schematic diagram illustrating a plasma etching apparatus according to an embodiment. The plasma etching apparatus 10 includes a processing chamber 30 that is airtight and electrically grounded. The processing chamber 30 is cylindrical and made of, for example, aluminum with an anodized oxide film formed on its surface. The processing chamber 30 defines a processing space in which plasma is generated. A mounting table 31 that horizontally supports a wafer W is accommodated within the processing chamber 30.

[0012] The mounting table 31 has a generally cylindrical shape with its bottom surface facing up and down, and its upper surface serves as a mounting surface 36d. The mounting surface 36d of the mounting table 31 is slightly smaller in size than the wafer W. The mounting table 31 includes a base 33 and an electrostatic chuck 36.

[0013] The base 33 is made of a conductive metal such as aluminum. The base 33 functions as a lower electrode. The base 33 is supported by an insulating support 34, which is installed at the bottom of the processing vessel 30.

[0014] The electrostatic chuck 36 has a convex substrate mounting portion formed in the center of its upper side, and the upper surface of this substrate mounting portion serves as a mounting surface 36d on which a wafer W is mounted. The electrostatic chuck 36 is provided in the center of the mounting table 31 in a plan view. The electrostatic chuck 36 is an example of a mounting portion capable of mounting a substrate. The electrostatic chuck 36 has an electrode 36a and an insulator 36b. The electrode 36a is provided inside the insulator 36b, and a DC power supply 42 is connected to the electrode 36a. The electrostatic chuck 36 is configured to attract the wafer W by Coulomb force when a DC voltage is applied to the electrode 36a from the DC power supply 42. The electrostatic chuck 36 also has a heater 36c provided inside the insulator 36b. Power is supplied to the heater 36c via a power supply mechanism (described later) to control the temperature of the wafer W.

[0015] The mounting table 31 also has an outer periphery formed of an insulator 36b around the mounting surface 36d, which is lower than the mounting surface 36d. The upper surface of this outer periphery serves as an ER mounting surface 36f on which the edge ring 35 is mounted. An edge ring 35 made of, for example, single crystal silicon is provided on the ER mounting surface 36f of the mounting table 31. The electrostatic chuck 36 has a pair of electrodes 36g, 36h overlapping the edge ring 35 in a top view. The pair of electrodes 36g, 36h are provided inside the insulator 36b. The electrostatic chuck 36 is configured to attract the edge ring 35 by Coulomb force when a DC voltage is applied to the pair of electrodes 36g, 36h from a DC power supply (not shown). 1 illustrates the case where the pair of electrodes 36g, 36h are provided inside the electrostatic chuck 36, but the pair of electrodes 36g, 36h may be provided inside a ring-shaped dielectric body that is separate from the electrostatic chuck 36. Also, in the example of Fig. 1, the pair of electrodes 36g, 36h form bipolar electrodes, but monopolar electrodes may be used instead of the pair of electrodes 36g, 36h. Furthermore, a cylindrical inner wall member 37 made of, for example, quartz is provided to surround the peripheries of the mounting table 31 and the support table 34.

[0016] A power feed rod 50 is connected to the base 33. A first RF power supply 40a is connected to the power feed rod 50 via a first matching box 41a, and a second RF power supply 40b is connected to the power feed rod 50 via a second matching box 41b. The first RF power supply 40a is a power supply for generating plasma, and is configured to supply high-frequency power of a predetermined frequency from the first RF power supply 40a to the base 33 of the mounting table 31. The second RF power supply 40b is a power supply for attracting ions (for bias), and is configured to supply high-frequency power of a predetermined frequency lower than that of the first RF power supply 40a to the base 33 of the mounting table 31.

[0017] A flow path 33d is formed inside the base 33. One end of the flow path 33d is connected to a heat transfer fluid inlet pipe 33b, and the other end is connected to a heat transfer fluid outlet pipe 33c. The plasma etching apparatus 10 is configured to control the temperature of the mounting table 31 by circulating a heat transfer fluid, such as a highly insulating, low-viscosity fluorine-based inert liquid or pure water, through the flow path 33d. The plasma etching apparatus 10 may be configured to have separate flow paths inside the base 33 corresponding to the areas where the wafer W and the edge ring 35 are mounted, respectively, so that the temperatures of the wafer W and the edge ring 35 can be controlled individually. The plasma etching apparatus 10 may also be configured to supply a heat transfer gas to the backside of the wafer W and the edge ring 35 so that the temperatures can be controlled individually. For example, a gas supply pipe may be provided penetrating the mounting table 31, etc., to supply a heat transfer gas (backside gas), such as helium gas, to the backside of the wafer W. The gas supply pipe is connected to a gas supply source. With this configuration, the wafer W attracted and held on the upper surface of the mounting table 31 by the electrostatic chuck 36 is controlled to a predetermined temperature.

[0018] Meanwhile, a shower head 46 functioning as an upper electrode is provided above the mounting table 31 so as to face and be parallel to the mounting table 31. The shower head 46 and the mounting table 31 function as a pair of electrodes (upper electrode and lower electrode).

[0019] The shower head 46 is provided on the ceiling wall of the processing vessel 30. The shower head 46 includes a main body 46a and an upper top plate 46b serving as an electrode plate, and is supported on the upper part of the processing vessel 30 via an insulating member 47. The main body 46a is made of a conductive material, such as aluminum with an anodized coating formed on its surface, and is configured so that the upper top plate 46b can be detachably supported below the main body 46a.

[0020] A gas diffusion chamber 46c is provided inside the main body 46a, and a number of gas flow holes 46d are formed in the bottom of the main body 46a so as to be located below the gas diffusion chamber 46c. Furthermore, gas inlet holes 46e are provided in the upper top plate 46b so as to penetrate the upper top plate 46b in the thickness direction and overlap with the gas flow holes 46d. With this configuration, the process gas supplied to the gas diffusion chamber 46c is dispersed and supplied into the process vessel 30 through the gas flow holes 46d and the gas inlet holes 46e in a shower-like manner.

[0021] The main body 46a is formed with a gas inlet 46g for introducing a process gas into the gas diffusion chamber 46c. One end of a gas supply pipe 45a is connected to the gas inlet 46g. The other end of the gas supply pipe 45a is connected to a process gas supply source 45 for supplying the process gas. A mass flow controller (MFC) 45b and an on-off valve V2 are installed on the gas supply pipe 45a, in this order from upstream to downstream. The process gas for plasma etching is supplied from the process gas supply source 45 to the gas diffusion chamber 46c via the gas supply pipe 45a, and then from the gas diffusion chamber 46c to the inside of the process vessel 30 via the gas flow holes 46d and the gas inlet holes 46e, dispersing the process gas in a shower-like manner.

[0022] A variable DC power supply 48b is electrically connected to the shower head 46 serving as the upper electrode via a low-pass filter (LPF) 48a. The variable DC power supply 48b is configured so that power supply can be turned on and off using an on-off switch 48c. The current and voltage of the variable DC power supply 48b and the on-off state of the on-off switch 48c are controlled by a controller 90, which will be described later. Note that, as will be described later, when high frequency power is applied to the mounting table 31 from the first RF power supply 40a and the second RF power supply 40b to generate plasma in the processing space, the controller 90 turns on the on-off switch 48c as necessary, and a predetermined DC voltage is applied to the shower head 46 serving as the upper electrode.

[0023] A cylindrical ground conductor 30a is provided so as to extend from the sidewall of the processing vessel 30 to a position above the height of the shower head 46. The cylindrical ground conductor 30a has a ceiling wall at its top.

[0024] An exhaust port 81 is formed at the bottom of the processing vessel 30, and an exhaust device 83 is connected to the exhaust port 81 via an exhaust pipe 82. The exhaust device 83 has a vacuum pump, and is configured so that the inside of the processing vessel 30 can be depressurized to a predetermined vacuum level by operating the vacuum pump.

[0025] Meanwhile, a first gate 84 used for loading and unloading the wafer W is provided on a sidewall inside the processing vessel 30. A gate valve G for opening and closing the first gate 84 is provided at the first gate 84. The first gate 84 is connected to the vacuum transfer chamber via the gate valve G in an airtight manner, allowing the wafer W to be loaded and unloaded from the vacuum transfer chamber while maintaining a vacuum atmosphere.

[0026] A deposit shield 86 is provided along the inner wall surface on the inside of the side of the processing vessel 30. The deposit shield 86 prevents reaction products (deposits) generated by the plasma-based etching process from adhering to the processing vessel 30. The deposit shield 86 is configured to be detachable.

[0027] The operation of plasma etching apparatus 10 having the above configuration is controlled in an integrated manner by control unit 90. Control unit 90 is, for example, a computer, and controls each unit of plasma etching apparatus 10. The operation of plasma etching apparatus 10 is controlled in an integrated manner by control unit 90.

[0028] In the plasma etching apparatus 10, reaction products, fine particles, and the like accumulate inside the processing vessel 30 as deposits, so the inside of the processing vessel 30 is periodically cleaned. In the plasma etching apparatus 10, if the processing vessel 30 is opened to the atmosphere for cleaning, a considerable amount of time (downtime) is required before the etching process for the wafers W can be resumed due to temperature and moisture control inside the processing vessel 30. As a result, the productivity of the plasma etching apparatus 10 decreases. Therefore, from the viewpoint of reducing downtime, it is preferable to clean the inside of the processing vessel 30 without opening it to the atmosphere.

[0029] Furthermore, the plasma etching apparatus 10 has consumable parts that gradually wear out as etching processes using plasma are repeatedly performed. For example, the consumable part is the edge ring 35 provided around the outer periphery of the wafer W placed on the mounting surface 36d of the mounting table 31. The edge ring 35 is abraded by exposure to plasma and therefore must be replaced periodically. Replacement of such consumable parts is generally performed with the processing vessel 30 open to the atmosphere. However, in the plasma etching apparatus 10, replacing consumable parts while the processing vessel 30 is open to the atmosphere results in downtime. Therefore, from the perspective of reducing downtime, it is preferable to replace consumable parts without opening the processing vessel 30 to the atmosphere.

[0030] Therefore, in the plasma etching apparatus 10, a gate for cleaning the interior of the processing vessel 30 and for replacing consumable parts is provided in the processing vessel 30, separate from the first gate 84 used for loading and unloading the wafer W. For example, in the plasma etching apparatus 10, as shown in FIG. 1 , a second gate 95 is provided on the opposite side of the first gate 84 from the mounting table 31 on which the wafer W is placed. The second gate 95 is airtightly closed by a lid 96. A maintenance apparatus 100, which will be described later, is detachably attached to the second gate 95. When performing maintenance such as cleaning the interior of the processing vessel 30 or replacing consumable parts, an operator attaches the maintenance apparatus 100 to the plasma etching apparatus 10 to be maintained.

[0031] [Maintenance equipment configuration] Next, the configuration of the maintenance device 100 according to the embodiment will be described. FIG. 2 is a cross-sectional view that schematically shows the maintenance device 100 according to the embodiment. FIG. 2 shows the state in which the maintenance device 100 is attached to the plasma etching device 10. Note that the plasma etching device 10 is shown in a simplified form in the following figures. In addition, the configuration of the maintenance device 100 will be appropriately described below along the flow of cleaning the mounting table 31, which is an object in the processing chamber 30, and replacing the edge ring 35, which is a consumable part.

[0032] The maintenance apparatus 100 has a case 101 with an opening 101A formed therein that corresponds to the second gate 95 of the plasma etching apparatus 10. The size corresponding to the second gate 95 means that a suction mechanism 110 and an edge ring 35 (described later) can be moved or loaded between the case 101 and the processing vessel 30 through the second gate 95. The size corresponding to the second gate 95 may be any size that allows the suction mechanism 110 and the edge ring 35 to be moved or loaded between the case 101 and the processing vessel 30. The case 101 is provided with a sealing member such as an O-ring around the opening 101A in contact with the plasma etching apparatus 10. The case 101 is mounted on a transportation vehicle 102. The maintenance apparatus 100 is transported to the location of the plasma etching apparatus 10 by the transportation vehicle 102 and positioned with the opening 101A of the case 101 aligned with the second gate 95. The opening 101A of the case is then airtightly attached to the second gate 95 by screws or the like.

[0033] The case 101 is composed of a first case 101B and a second case 101C that communicates with the first case 101B via an openable / closable shutter member 101D. The first case 101B houses a suction mechanism 110, which will be described later. An opening 101A is formed in the second case 101C.

[0034] A first pipe 103A equipped with a first valve 104A is connected to the first case 101B. A second pipe 103B equipped with a second valve 104B is connected to the second case 101C. The first pipe 103A and the second pipe 103B are connected to a vacuum pump 103 via a common pipe 103C. The vacuum pump 103 is mounted on a loading platform 102A provided on the transport vehicle 102. A leak pipe 103D branches off from the second pipe 103B on the way to the common pipe 103C. A leak valve 104D is provided on the leak pipe 103D. The vacuum pump 103, the first pipe 103A, the second pipe 103B, and the common pipe 103C constitute a decompression mechanism that decompresses the inside of the case 101. The maintenance device 100 uses a pressure reduction mechanism to reduce the pressure inside the case 101 to a predetermined vacuum level, making the pressure equivalent to that inside the processing vessel 30, and then removes the lid 96, thereby connecting the case 101 and the processing vessel 30 via the opening 101A and the second gate 95.

[0035] The maintenance device 100 also includes a suction mechanism 110 inside the case 101 (first case 101B) that sucks up deposits on the mounting table 31 inside the processing chamber 30.

[0036] 3 is a diagram showing details of the suction mechanism 110 according to the embodiment. The suction mechanism 110 has a robot arm 111, and a suction port 112, a supply port 113, an irradiation unit 114, and an imaging unit 115 provided at the tip of the robot arm 111.

[0037] The robot arm 111 includes an arm 121 having two arm elements connected by a joint, a support 122 that supports the arm 121 so that it can rotate and move up and down, and a head 123 provided at the tip of the arm 121. The robot arm 111 is extendable by linearly extending the two arm elements of the arm 121 or by overlapping them. The robot arm 111 can move the head 123 at the tip of the arm 121 up and down by raising and lowering the arm 121 using the support 122. The robot arm 111 can extend the two arm elements of the arm 121 toward the opening 101A and move the head 123 toward the mounting table 31 through the opening 101A. The operation of the robot arm 111 is controlled comprehensively by a control unit (not shown). The control unit has a user interface that accepts various operation instructions and displays the operation status. The operator issues operation instructions via the user interface. The operation instruction is, for example, an operation instruction that individually specifies the movement of the robot arm 111. Note that the operation instruction may specify a series of movements. For example, the operation instruction may specify, as a suction instruction, a series of movements of the robot arm 111 when sucking up deposits on the mounting table 31.

[0038] The head unit 123 is provided with a suction port 112, a supply port 113, an irradiation unit 114, and an image capturing unit 115. The positions of the suction port 112, the supply port 113, the irradiation unit 114, and the image capturing unit 115 will be described later.

[0039] As the head unit 123 approaches the mounting table 31, the suction port 112 sucks up the deposits on the mounting table 31. That is, the suction port 112 is connected to an exhaust device 131 on the platform 102A via an exhaust pipe 131A that is provided with a valve 131B and that passes through the robot arm 111, and sucks up the deposits on the mounting table 31 based on the exhaust operation of the exhaust device 131.

[0040] The supply port 113 supplies gas to the mounting table 31 as the head unit 123 approaches the mounting table 31. The gas supplied from the supply port 113 is an inert gas, a gas that reacts with adhesions to facilitate suction of adhesions from the mounting table 31, or a gas that reacts with adhesions to gasify the adhesions. Examples of inert gases include Ar, N2, and dry air. When an inert gas is used, the gas flow rate is appropriately set so as to blow away adhesions attached to the mounting table 31. Examples of gases that react with adhesions to facilitate suction of adhesions from the mounting table 31 or gases that react with adhesions to gasify the adhesions include nitrogen trifluoride gas (NF3) and fluorine gas (F2). The suction port 112 suctions adhesions together with the gas supplied from the supply port 113. The supply port 113 is connected to a gas supply source (not shown) via a pipe passing through the robot arm 111 , and supplies gas from the gas supply source to the mounting table 31 .

[0041] When the head unit 123 approaches the mounting table 31, the irradiation unit 114 irradiates the mounting table 31 with plasma to remove deposits from the mounting table 31. The irradiation unit 114 can reduce the adhesive strength of the deposits or gasify the deposits by causing ions or radicals in the plasma to react with the deposits. The deposits with reduced adhesive strength or the gasified deposits are detached from the mounting table 31 and sucked through the suction port 112. The irradiation unit 114 irradiates the mounting table 31 with plasma obtained by applying high-frequency power to a gas such as an oxygen-containing gas (O2, CO2, etc.), a gas containing an oxygen-containing gas and a rare gas (a gas containing O2 and Ar, etc.), or a fluorine-containing gas (CF4, etc.). The irradiation unit 114 may irradiate the mounting table 31 with a laser, or may irradiate the mounting table 31 with both plasma and laser. The laser may be any laser that heats the deposits and reduces the adhesive strength of the deposits. The laser may have a wavelength that gasifies the adhering matter. For example, a semiconductor laser having a wavelength of 808 nm, a laser spot area of ​​0.5 to 3 mm, and a laser power of 200 W may be used. The irradiating unit 114 may irradiate the mounting table 31 with a laser in an environment in which a gas (e.g., ozone gas) that has the effect of reducing the adhesive strength of the adhering matter or gasifying the adhering matter is present.

[0042] The imaging unit 115 is, for example, an image sensor, and captures an image of the mounting table 31 as the head unit 123 approaches the mounting table 31. The imaging unit 115 may capture an image of the mounting table 31 while irradiating it with light as necessary. The operation of the imaging unit 115 is controlled comprehensively by a control unit (not shown). The imaging unit 115 outputs the captured image obtained by capturing an image of the mounting table 31 to the control unit. The control unit detects the presence or absence of an attachment on the mounting table 31 from the captured image. If an attachment is detected from the captured image, the control unit controls the exhaust device 131 to start suction of the attachment from the suction port 112.

[0043] Further, exhaust pipe 131A is provided with measuring instrument 132. Measuring instrument 132 measures the diameter and number of particles flowing in exhaust pipe 131A, and outputs information on the number for each predetermined particle size range and information on the total number of particles to a control unit (not shown). When suction is performed from suction port 112, the control unit monitors whether the number for each predetermined particle size range and the total number of particles obtained from measuring instrument 132 are below a predetermined threshold. When the number for each predetermined particle size range and the total number of particles are below the predetermined threshold, the control unit controls exhaust device 131 to stop suction from suction port 112.

[0044] FIG. 4 is a diagram illustrating an example of the arrangement of the suction port 112, the supply port 113, the irradiation unit 114, and the imaging unit 115 according to the embodiment. FIG. 4 illustrates a view of the head unit 123 of the robot arm 111 as viewed from below. The head unit 123 is formed in a rectangular shape with a pair of short sides sandwiching the arm unit 121 in a plan view. The suction port 112 is provided along each of the pair of short sides at a position inside the pair of short sides of the head unit 123. The supply port 113 is provided adjacent to one of the two suction ports 112, and the irradiation unit 114 is provided adjacent to the other of the two suction ports 112. The imaging unit 115 is provided at a position corresponding to the long side of the pair of long sides of the head unit 123 opposite the arm unit 121. Note that the arrangement positions of the suction port 112, the supply port 113, the irradiation unit 114, and the imaging unit 115 illustrated in FIG. 4 are merely examples and are not limited thereto. For example, as shown in Fig. 5, the suction port 112 may be provided at a position inside a pair of short sides of the head unit 123, at a position surrounding the outer periphery of each of the supply port 113 and the irradiation unit 114. Fig. 5 is a diagram showing another example of the arrangement of the suction port 112, the supply port 113, the irradiation unit 114, and the imaging unit 115 according to the embodiment.

[0045] Returning to FIG. 2 , the maintenance apparatus 100 includes a transport mechanism 140 inside the case 101. The transport mechanism 140 transports the edge ring 35 out of and into the processing vessel 30. The transport mechanism 140 includes an articulated arm 141, a support 142 that supports the arm 141 so that it can rotate and move up and down, and a fork 143 provided at the tip of the arm 141. The transport mechanism 140 is extendable and retractable by linearly extending the arm 141 or by overlapping the arm 141. The transport mechanism 140 can move the fork 143 at the tip of the arm 141 up and down by raising and lowering the arm 141 using the support 142. The operation of the transport mechanism 140 is controlled comprehensively by a control unit (not shown). The control unit has a user interface that accepts various operation instructions and displays the operation status. An operator issues operation instructions via the user interface. The operation instruction is, for example, an operation instruction that individually specifies the movement of the transport mechanism 140. Note that the operation instruction may specify a series of movements. For example, the operation instruction may specify, as a transport instruction, a series of movements of the transport mechanism 140 when loading and unloading the edge ring 35.

[0046] As an example, three tiers of support stands 105 are provided inside the case 101 at predetermined height intervals. Replacement edge rings 35 are placed on two of the three tiers of support stands 105. The remaining support stand 105 is left empty so that a used edge ring 35 can be placed on it. The replacement edge ring 35 is, for example, a new, unused edge ring. Alternatively, the replacement edge ring 35 may be a used, second-hand edge ring that has a relatively small amount of wear.

[0047] Next, a specific processing operation by a vacuum processing system having the plasma etching apparatus 10 and the maintenance apparatus 100 will be described with reference to Fig. 6. Fig. 6 is a flowchart showing an example of the processing operation of the vacuum processing system according to the embodiment. The processing operation shown in Fig. 6 is mainly performed under control by a control unit (not shown).

[0048] First, dry cleaning is performed on the processing vessel 30 with the edge ring 35 placed on the mounting table 21 (step S101).

[0049] After the dry cleaning is completed, the maintenance device 100 is attached to the plasma etching device 10 (step S102).

[0050] After the installation of the maintenance device 100 is completed, the edge ring 35 is unloaded from the processing vessel 30 (step S103).

[0051] Subsequently, the mounting table 31 in the processing chamber 30 is cleaned by the maintenance device 100 (step S104).

[0052] After the cleaning is completed, a replacement edge ring 35 is carried into the processing vessel 30 (step S105).

[0053] Thereafter, the position of the edge ring 35 is corrected (step S106).

[0054] Next, an example of the operation of unloading the edge ring 35 from the processing vessel 30 and cleaning the mounting table 31 will be described with reference to FIGS. 7A, 7B, and 8. FIGS. 6A and 6B are diagrams for explaining an example of the operation of unloading the edge ring 35 from the processing vessel 30 and cleaning the mounting table 31. FIG. 8 is a flowchart showing an example of a process of cleaning the mounting table 31. Note that FIG. 8 corresponds to the process of step S104 in FIG. 6.

[0055] The worker moves the transport vehicle 102 to transport the maintenance apparatus 100 to the location of the plasma etching apparatus 10. At this time, the first valve 104A is controlled to be in an open state. Then, the vacuum pump 103 reduces the pressure inside the first case 101B with the shutter member 101D closed. The maintenance apparatus 100 may be configured to be automatically transported to the location of the plasma etching apparatus 10 based on an instruction from the control unit 90 or an instruction from a remote controller. Next, the opening 101A of the case 101 (second case 101C) is airtightly attached to the second gate 95. When the opening 101A of the case 101 (second case 101C) is attached to the second gate 95, the first valve 104A is switched from an open state to a closed state, and the second valve 104B is controlled to be in an open state. Then, the vacuum pump 106 reduces the pressure inside the second case 101C. This reduces the pressure inside both the first case 101B and the second case 101C, i.e., the entire inside of the case 101. Next, the shutter member 101D is opened, connecting the first case 101B and the second case 101C. Then, the second valve 104B is switched from the open state to the closed state.

[0056] The maintenance apparatus 100 includes a removal unit (not shown) inside the case 101 that removes the lid 96 of the plasma etching apparatus 10. When the edge ring 35 is to be removed from the processing vessel 30, as shown in FIG. 6A , the removal unit removes the lid 96 through the second gate 95 and retracts the removed lid 96 to a retracted position inside the case 101. This allows the case 101 and the processing vessel 30 to communicate with each other via the opening 101A and the second gate 95. When the case 101 and the processing vessel 30 communicate with each other, lift pins (not shown) protrude from the mounting table 31 and position the edge ring 35 above the mounting table 31. If the edge ring 35 is electrostatically attracted, the lift pins protrude after releasing the electrostatic attraction and position the edge ring 35 above the mounting table 31. The transfer mechanism 140 uses the support unit 142 to move the fork 143 at the tip of the arm 141 to a height corresponding to the opening 101A. The transfer mechanism 140 extends the arm 141 toward the opening 101A and moves the fork 143 below the edge ring 35 through the opening 101A. When the lift pins are lowered, the transfer mechanism 140 receives the edge ring 35 supported on the lift pins with the fork 143. The transfer mechanism 140 retracts the arm 141 while holding the edge ring 35, and transfers the edge ring 35 out of the processing vessel 30.

[0057] 7A, the transport mechanism 140 moves the fork portion 143 holding the edge ring 35 to a height corresponding to an empty support base 105. The transport mechanism 140 moves the arm portion 141 toward the empty support base 105 and moves the edge ring 35 above the empty support base 105. The transport mechanism 140 lowers the arm portion 141 and stores the edge ring 35 in the empty support base 105.

[0058] Next, as shown in FIG. 7B , the robot arm 111 uses the support 122 to move the head 123 at the tip of the arm 121 to a height corresponding to the opening 101A. The robot arm 111 extends the arm 121 toward the opening 101A and moves the head 123 toward the mounting table 31 through the opening 101A. As shown in FIG. 8 , the imaging unit 115 captures an image of the mounting table 31 from above and outputs the captured image to a control unit (not shown) (step S111). That is, the imaging unit 115 captures the mounting surface 36d, outer peripheral surface 36e, and ER mounting surface 36f of the electrostatic chuck 36 and outputs the captured image to the control unit. The control unit detects the presence or absence of adhesions on the mounting table 31 by comparing the captured image with a reference image obtained by previously capturing an image of a cleaned or new mounting table 31 (step S112). If an attachment is detected in the captured image (step S113: Yes), the control unit moves the suction port 112 to the position of the attachment and controls the exhaust device 131 to start suction by the suction port 112. As a result, the attachment on the mounting table 31 (i.e., attachment remaining on the mounting surface 36d, outer peripheral surface 36e, ER mounting surface 36f, etc. of the electrostatic chuck 36) is sucked by the suction port 112 (step S114). For example, if dry cleaning is performed with the edge ring 35 mounted on the mounting table 31, reaction products are not completely removed from the outer peripheral surface 36e of the electrostatic chuck 36 and remain as attachments. In such a case, the control unit, for example, sucks the attachment remaining on the outer peripheral surface 36e of the electrostatic chuck 36 through the suction port 112.

[0059] The suction port 112 may suck deposits on the mounting table 31 while an inert gas is being supplied from the shower head 46 of the plasma etching apparatus 10 into the processing vessel 30 and the inside of the case 101. Examples of the inert gas include Ar, N2, and dry air. The source of the inert gas is not limited to the shower head 46, and may be, for example, a purge port (not shown) that supplies gas when the processing vessel 30 is opened to the atmosphere.

[0060] When suction is performed through suction port 112, the control unit monitors whether the number of particles for each predetermined particle size range and the total number of particles obtained from measuring instrument 132 are equal to or less than a predetermined threshold. When the number of particles is equal to or less than the predetermined threshold, the control unit controls exhaust device 131 to stop suction through suction port 112.

[0061] When suction from the suction port 112 is stopped, the image capturing unit 115 captures an image of the mounting table 31 from above again and outputs the captured image to the control unit (step S115). The control unit detects the presence or absence of adhesions on the mounting table 31 by comparing the captured image with a reference image obtained by previously capturing an image of a cleaned or new mounting table 31 (step S116). If adhesions are detected again from the captured image (step S117: Yes), the control unit controls the exhaust device 131 to start suction by the suction port 112. At this time, the supply port 113 supplies gas to the mounting table 31 (step S118). The suction port 112 sucks the adhesions together with the gas supplied from the supply port 113. If the number of particles for each predetermined particle size range obtained from the measuring instrument 132 and the total number of particles are equal to or less than a threshold, the control unit controls the exhaust device 131 to stop suction from the suction port 112.

[0062] When suction through the suction port 112 is stopped, the image capturing unit 115 captures an image of the mounting table 31 from above again and outputs the captured image to the control unit (step S119). The control unit detects the presence or absence of adhering matter on the mounting table 31 by comparing the captured image with a reference image previously captured of a cleaned or new mounting table 31 (step S120). If adhering matter is detected again from the captured image (step S121: Yes), the control unit controls the exhaust device 131 to start suction through the suction port 112. At this time, the irradiation unit 114 irradiates the mounting table 31 with plasma, laser, or both plasma and laser to remove the adhering matter from the mounting table 31 (step S122). The suction port 112 sucks the adhering matter removed from the mounting table 31. Note that the control unit may cause the suction port 112 to suck the adhering matter after the irradiation unit 114 irradiates the mounting table 31 with plasma and / or laser. When the number of particles obtained from the measuring instrument 132 is equal to or less than the threshold value, the control unit controls the exhaust device 131 to stop suction from the suction port 112 .

[0063] When the suction from the suction port 112 is stopped, the image capturing unit 115 captures an image of the mounting table 31 from above again and outputs the captured image to the control unit (step S123). The control unit detects whether or not there is any attachment on the mounting table 31 by comparing the captured image with a reference image obtained by capturing an image of a cleaned or new mounting table 31 in advance (step S124). If attachment is detected again in the captured image (step S125: Yes), the control unit notifies an operator of the vacuum processing system by issuing an alert (step S126). The operator who has received the alert opens the processing vessel 30 to the atmosphere and performs maintenance, including cleaning, of the mounting table 31.

[0064] Moreover, if no adhering matter is detected from the captured image (step S113: No, step S117: No, step S121: No, step S125: No), the control unit ends the process of cleaning the mounting table 31. In this way, the mounting table 31 is cleaned.

[0065] When cleaning of the mounting table 31 is completed, the robot arm 111 retracts the arm portion 121 and returns the suction port 112 , the supply port 113 , the irradiation portion 114 and the imaging portion 115 to their original positions inside the case 101 .

[0066] Next, an example of the operation of loading a replacement edge ring 35 into the processing vessel 30 will be described with reference to FIGS. 9A to 9C. FIGS. 9A to 9C are views for explaining an example of the operation of loading the edge ring 35 into the processing vessel 30. FIG. 10 is a flowchart showing an example of a process of correcting the position of the edge ring 35 after loading. Note that FIG. 10 corresponds to the process of step S106 in FIG. 6.

[0067] 9A , when a replacement edge ring 35 is carried into the processing vessel 30, the transfer mechanism 140 moves the fork unit 143 to a height corresponding to the height of the support table 105 on which the replacement edge ring 35 is placed. The transfer mechanism 140 moves the arm unit 141 toward the replacement edge ring 35 and holds the replacement edge ring 35 with the fork unit 143. The transfer mechanism 140 moves the arm unit 141 toward the opening 101A while holding the replacement edge ring 35.

[0068] 9A, the transport mechanism 140 moves the fork portion 143 to a height corresponding to the opening 101A. The transport mechanism 140 extends the arm portion 141 toward the opening 101A and carries the replacement edge ring 35 above the mounting table 31 through the opening 101A.

[0069] When the fork portion 143 holding the replacement edge ring 35 reaches above the mounting table 31, lift pins (not shown) protrude from the mounting table 31, and the replacement edge ring 35 is transferred from the fork portion 143 to the lift pins. After the replacement edge ring 35 has been transferred from the fork portion 143 to the lift pins, the transport mechanism 140 retracts the arm portion 121 and returns the fork portion 143 to its original position inside the case 101. The lift pins supporting the replacement edge ring 35 descend, and the replacement edge ring 35 is placed on the outer periphery of the mounting table 31.

[0070] Next, as shown in FIG. 9B , the robot arm 111 moves the head unit 123 to a height corresponding to the opening 101A. The robot arm 111 extends the arm unit 121 toward the opening 101A and moves the head unit 123 toward the mounting table 31 through the opening 101A. As shown in FIG. 10 , the imaging unit 115 captures images of the gap between the replacement edge ring 35 and the electrostatic chuck 36 of the mounting table 31 at each of a plurality of positions in the circumferential direction (step S131). For example, the imaging unit 115 sequentially captures images of the gap between the replacement edge ring 35 and the electrostatic chuck 36 of the mounting table 31 at a plurality of imaging positions set at equal intervals in the circumferential direction of the mounting table 31.

[0071] FIG. 11 is a diagram showing an example of an imaging position in the imaging unit 115. FIG. 11 corresponds to a top view of the replacement edge ring 35 and the electrostatic chuck 36 of the mounting table 31. FIG. 8 shows the disk-shaped mounting surface 36d of the mounting table 31, and the replacement edge ring 35 in a ring shape around the mounting surface 36d. Four imaging positions P in the imaging unit 115 are set at equal intervals of 90 degrees around the circumferential direction of the mounting table 31. Note that the number of imaging positions set around the circumferential direction of the mounting table 31 may be three or less, or may be five or more. Furthermore, the imaging unit 115 may simultaneously capture an image of the gap between the replacement edge ring 35 and the electrostatic chuck 36 of the mounting table 31.

[0072] Returning to FIG. 9B , the imaging unit 115 captures the gap between the replacement edge ring 35 and the electrostatic chuck 36 of the mounting table 31 at each of a plurality of positions in the circumferential direction and outputs the captured images to a control unit (not shown). As shown in FIG. 10 , the control unit compares the captured image with a correction reference image obtained by previously capturing an image of the edge ring 35 in a state without misalignment (step S132), and calculates the amount of deviation between the gap width and a reference width for each of the plurality of positions in the circumferential direction (step S133). The reference width is, for example, the gap width measured in advance when the center of the replacement edge ring 35 and the center of the electrostatic chuck 36 are aligned.

[0073] Next, the control unit determines whether the calculated amount of deviation is within the tolerance (step S134). If the calculated amount of deviation is outside the tolerance (step S134: No), the control unit controls the transport mechanism 140 to correct the position of the replacement edge ring 35 by the calculated amount of deviation (step S135). That is, when the lift pins (not shown) protrude from the mounting table 31 and the replacement edge ring 35 is positioned above the mounting table 31, the transport mechanism 140 moves the fork unit 143 to a height corresponding to the opening 101A, as shown in FIG. 9C. Then, the transport mechanism 140 extends the arm unit 141 toward the opening 101A and moves the fork unit 143 below the replacement edge ring 35 through the opening 101A. When the lift pins descend, the transport mechanism 140 receives the replacement edge ring 35 supported on the lift pins with the fork unit 143. The transport mechanism 140 moves the arm unit 141 horizontally while holding the replacement edge ring 35 so that the calculated amount of misalignment becomes zero. When the replacement edge ring 35 moves and the amount of misalignment becomes zero, the lift pins protrude from the mounting table 31, and the replacement edge ring 35 is transferred from the fork unit 143 to the lift pins. When the replacement edge ring 35 is transferred from the fork unit 143 to the lift pins, the transport mechanism 140 retracts the arm unit 121 and returns the fork unit 143 to its original position inside the case 101. The lift pins supporting the replacement edge ring 35 descend, and the replacement edge ring 35 is placed on the outer periphery of the mounting table 31. After correcting the amount of misalignment, the control unit returns the process to step S131, and may cause the imaging unit 115 to capture an image of the gap between the replacement edge ring 35 and the electrostatic chuck 36 of the mounting table 31 to confirm that the amount of misalignment is within the tolerance (steps S131 to S134). Furthermore, if the amount of deviation is outside the allowable range, the control unit may again perform the correction as described above so that the amount of deviation of the replacement edge ring 35 becomes 0 (step S135).

[0074] If the calculated amount of deviation is within the tolerance (step S134: Yes), the control unit ends the process, thereby completing the loading of the replacement edge ring 35 into the processing vessel 30.

[0075] When the edge ring 35 is completely carried into the processing vessel 30, the maintenance apparatus 100 controls the removal unit to attach the lid 96 to the second gate 95. Then, with the shutter member 101D closed, the leak valve 104D is opened, thereby opening the second case 101C to the atmosphere. After the maintenance of the processing vessel 30 has been performed in this order, the operator moves the transport vehicle 102 to move the maintenance apparatus 100 away from the plasma etching apparatus 10. The maintenance apparatus 100 may be configured to automatically move away from the plasma etching apparatus 10 and automatically transport to a predetermined position based on an instruction from the control unit 90 or a remote instruction.

[0076] As described above, the maintenance apparatus 100 according to the embodiment includes a case 101 having an opening 101A formed therein that corresponds in size to the second gate 95 of the plasma etching apparatus 10, and the opening 101A can be airtightly attached to the second gate 95. The maintenance apparatus 100 is also disposed inside the case 101 and includes a suction mechanism 110 that enters the processing vessel 30 through the opening 101A and sucks up deposits on an object (for example, the mounting table 31) inside the processing vessel 30. This allows the maintenance apparatus 100 to efficiently clean the inside of the processing vessel 30 without opening it to the atmosphere.

[0077] The suction mechanism 110 also has a robot arm 111 whose tip can approach the object in the processing vessel 30 through the opening 101A. The suction mechanism 110 also has a suction port 112 that is provided at the tip (for example, the head portion 123) of the robot arm 111 and that sucks up deposits on the object in the processing vessel 30. This allows the maintenance device 100 to suck up deposits near the object in the processing vessel 30 through the suction port 112.

[0078] Furthermore, the suction port 112 sucks the deposits while the inert gas is being supplied into the processing vessel 30. This allows the maintenance apparatus 100 to suck the deposits together with the inert gas through the suction port 112.

[0079] The suction mechanism 110 is provided at the tip of the robot arm 111 and further includes a supply port 113 for supplying gas to the object in the processing vessel 30. This allows the maintenance apparatus 100 to blow off deposits from the object in the processing vessel 30 with the inert gas, while sucking the deposits together with the inert gas through the suction port 112.

[0080] The suction mechanism 110 further includes an irradiation unit 114 provided at the tip of the robot arm 111, which irradiates the object in the processing vessel 30 with plasma and / or laser to remove deposits from the object in the processing vessel 30. This allows the maintenance device 100 to suck the deposits removed from the object in the processing vessel 30 through the suction port 112.

[0081] The suction mechanism 110 further includes an imaging unit 115 that is provided at the tip of the robot arm 111 and captures an image of an object inside the processing vessel 30. This allows the maintenance device 100 to obtain a captured image that is used to detect the presence or absence of an attachment.

[0082] The maintenance device 100 also includes an exhaust device 131 connected to the suction port 112 via an exhaust pipe 131A, and a measuring instrument 132 that measures the number of particles flowing through the exhaust pipe 131A. The exhaust device 131 stops suction from the suction port 112 when the number of particles for each predetermined particle size range and the total number of particles measured by the measuring instrument 132 are equal to or less than a predetermined threshold. This allows the maintenance device 100 to stop suction from the suction port 112 at an appropriate timing.

[0083] The object inside the processing vessel 30 is an electrostatic chuck 36 on which a wafer W can be placed and a mounting table 31 having an outer periphery on which an edge ring 35 can be placed, and the maintenance apparatus 100 further includes a transfer mechanism 140. The transfer mechanism 140 is disposed inside the case 101 and transfers the edge ring 35 out of the processing vessel 30 and into the processing vessel 30 through an opening 101A. This allows the maintenance apparatus 100 to clean the inside of the processing vessel 30 and replace the edge ring 35 without exposing it to the atmosphere.

[0084] Furthermore, the suction port 112 sucks deposits on the outer circumferential surface of the mounting portion (for example, the electrostatic chuck 36) of the mounting table 31 when the edge ring 35 is carried out of the processing vessel 30 by the transport mechanism 140. This allows the maintenance device 100 to clean the outer circumferential surface of the mounting portion of the mounting table 31, which is exposed when the edge ring 35 is carried out.

[0085] The transport mechanism 140 also carries a replacement edge ring 35 into the processing vessel 30 and places it on the outer periphery of the mounting table 31. The maintenance apparatus 100 further includes a control unit. The control unit uses the imaging unit 115, which is provided at the tip of the robot arm 111, to capture images of the gap between the replacement edge ring 35 and the mounting portion of the mounting table 31 at each of multiple circumferential positions. Based on the captured images, the control unit calculates the amount of deviation between the gap width and the reference width at each of the multiple circumferential positions. The control unit controls the transport mechanism 140 to correct the position of the replacement edge ring 35 by the calculated amount of deviation. This allows the maintenance apparatus 100 to appropriately correct the position of the replacement edge ring 35 placed on the outer periphery of the mounting table 31.

[0086] (Variation) In the above embodiment, the case where the mounting table 31 is cleaned as the object in the processing vessel 30 has been described as an example, but the disclosed technology is not limited thereto. The maintenance apparatus 100 may clean components other than the mounting table 31 as long as they are located in the processing vessel 30. The control unit may compare an image obtained by imaging the component in the processing vessel 30 using the imaging unit 115 with an image obtained by imaging a new component using the imaging unit 115, and determine an abnormality of the component in the processing vessel 30 based on at least one of the surface condition, shape, and size. The control unit may output a component replacement instruction when it determines that an abnormality has occurred in a component in the processing vessel 30.

[0087] In the above embodiment, the edge ring 35 is replaced as a consumable part, but the disclosed technology is not limited to this. The consumable part to be replaced may be the edge ring 35, a cover ring (not shown) disposed on the outer periphery of the edge ring 35, or any part that can be carried into and out of the processing vessel 30 by a transport mechanism such as a robot arm.

[0088] Furthermore, in the above embodiment, the suction mechanism 110 has the suction port 112, the supply port 113, the irradiation unit 114, and the imaging unit 115 at the tip of the robot arm 111. However, the supply port 113, the irradiation unit 114, and the imaging unit 115 do not have to be provided as a set with the suction port 112. For example, any one of the combinations of the suction port 112 and the supply port 113, the suction port 112 and the irradiation unit 114, the suction port 112 and the imaging unit 115, the suction port 112, the supply port 113, and the irradiation unit 114, the suction port 112, the supply port 113, and the imaging unit 115, or the suction port 112, the irradiation unit 114, and the imaging unit 115 may be provided at the tip of the robot arm 111.

[0089] Furthermore, in the above embodiment, the case where both the suction mechanism 110 and the transport mechanism 140 are provided inside the case 101 has been described, but the disclosed technology is not limited to this. For example, only the suction mechanism 110 may be provided inside the case 101, and a part of the robot arm 111 of the suction mechanism 110 may be replaced with a pick for edge ring replacement. Also, for example, only the suction mechanism 110 may be provided inside the case 101, and a pick for edge ring replacement may be attached to the robot arm 111 of the suction mechanism 110. In such a case, the edge ring 35 may be replaced using the pick for edge ring replacement. Note that the replacement or attachment of the pick may be performed by an operator or may be achieved by automatic replacement.

[0090] It should be noted that the embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive, and the above-described embodiments may be omitted, substituted, or modified in various ways without departing from the scope and spirit of the appended claims. [Explanation of symbols]

[0091] 10 Plasma etching equipment 30 Processing container 31 Mounting table 35 Edge Ring 36 Electrostatic Chuck 84 Gate 1 95 Gate 2 100 Maintenance Equipment 101 cases 101A opening 110 Suction mechanism 111 Robot Arm 112 Suction port 113 Supply port 114 Irradiation unit 115 Imaging unit 131 Exhaust system 131A Exhaust pipe 132 Measuring Instruments 140 Transport mechanism

Claims

1. A maintenance device detachably attached to a substrate processing apparatus, the substrate processing apparatus having a substrate processing chamber, a substrate support disposed in the substrate processing chamber, a first gate for transporting a substrate, and a second gate different from the first gate, the substrate support having a substrate support portion and a ring support portion surrounding the substrate support portion, a decompressible case having an opening detachably attached to the second gate; a sensor disposed within the depressurizable case and configured to move between the depressurizable case and the substrate processing chamber; a transfer unit disposed within the depressurizable case and configured to transfer an edge ring between the depressurizable case and the substrate processing chamber through the opening, the transfer unit configured to place a replacement edge ring on the ring support of the substrate support; and configured to control the sensor to detect a plurality of circumferential gaps between the replacement edge ring on the ring support and the substrate support; a controller configured to control the transport unit to correct the position of the replacement edge ring based on an output from the sensor; A maintenance device comprising:

2. The sensor is provided on a robot arm disposed in the maintenance device. The maintenance device according to claim 1 .

3. The sensor is provided at the tip of the robot arm. The maintenance device according to claim 2 .

4. The sensor is provided on a robot arm different from the arm of the transport unit. The maintenance device according to claim 1 .

5. The sensor is an image sensor. The maintenance device according to claim 1 .

6. The image sensor is configured to acquire images of the plurality of gaps in the circumferential direction; the control unit is configured to control the transport unit to correct a position of the replacement edge ring based on the acquired image. The maintenance device according to claim 5 .

7. The control unit is configured to control the transport unit to correct the position of the replacement edge ring based on the acquired image and a previously acquired reference image of the multiple gaps in the circumferential direction between the substrate support part and the edge ring positioned without any misalignment relative to the substrate support part. The maintenance device according to claim 6.

8. A substrate processing system having a substrate processing apparatus and a maintenance apparatus, The substrate processing apparatus includes: a substrate processing chamber; a substrate support disposed within the substrate processing chamber, the substrate support having a substrate support portion and a ring support portion surrounding the substrate support portion; a first gate for transporting a substrate; a second gate different from the first gate; and The maintenance device includes: a decompressible case having an opening detachably attached to the second gate; a sensor disposed within the depressurizable case and configured to move between the depressurizable case and the substrate processing chamber; a transfer unit disposed within the depressurizable case and configured to transfer an edge ring between the depressurizable case and the substrate processing chamber through the opening, the transfer unit configured to place a replacement edge ring on the ring support of the substrate support; and configured to control the sensor to detect a plurality of circumferential gaps between the replacement edge ring on the ring support and the substrate support; a controller configured to control the transport unit to correct the position of the replacement edge ring based on an output from the sensor; A substrate processing system comprising:

9. The sensor is provided on a robot arm disposed in the maintenance device. The substrate processing system of claim 8 .

10. The sensor is provided at the tip of the robot arm. The substrate processing system of claim 9 .

11. The sensor is provided on a robot arm different from the arm of the transport unit. The substrate processing system of claim 8 .

12. The sensor is an image sensor. The substrate processing system of claim 11 .

13. The image sensor is configured to acquire images of the plurality of gaps in the circumferential direction; the control unit is configured to control the transport unit to correct a position of the replacement edge ring based on the acquired image. The substrate processing system of claim 12 .

14. The control unit is configured to control the transport unit to correct the position of the replacement edge ring based on the acquired image and a previously acquired reference image of the multiple gaps in the circumferential direction between the substrate support part and the edge ring positioned without any misalignment relative to the substrate support part. The substrate processing system of claim 13 .

15. The control unit is configured to instruct the maintenance device to automatically move to the position of the substrate processing device. The substrate processing system of claim 8 .

16. The sensor is an image sensor. The maintenance device according to claim 2 .

17. The sensor is an image sensor. The maintenance device according to claim 3 .

18. The image sensor is configured to acquire images of the plurality of gaps in the circumferential direction. The maintenance device according to claim 5 .

19. The sensor is an image sensor. The substrate processing system of claim 9 .

20. The sensor is an image sensor. The substrate processing system of claim 10 .

21. A vacuum processing apparatus having a processing vessel provided with a first gate used for loading and unloading substrates and a second gate different from the first gate, in which an opening of a size corresponding to the second gate is formed, and in which the opening can be attached detachably and airtightly to the second gate, the case being capable of being depressurized; a suction mechanism that is disposed inside the case, enters the processing vessel through the opening, and sucks up adhesions of the object inside the processing vessel; A maintenance device comprising:

22. The suction mechanism an arm having a tip end that can approach the object in the processing vessel through the opening; a suction port provided at the tip of the arm for sucking out deposits on the object in the processing vessel; 22. The maintenance device of claim 21, comprising:

23. A maintenance device as described in Claim 22, wherein the suction port sucks up the adhesions while an inert gas is supplied into the processing container.

24. The suction mechanism 24. The maintenance device according to claim 22, further comprising a supply port provided at a tip of the arm for supplying gas to the object in the processing vessel.

25. The suction mechanism The maintenance device according to any one of claims 22 to 24, further comprising an irradiation unit provided at the tip of the arm, which irradiates one or both of plasma and laser onto the object in the processing vessel, thereby removing the deposits from the object in the processing vessel.

26. The suction mechanism The maintenance device according to any one of claims 22 to 25, further comprising an imaging unit provided at a tip of the arm for imaging an object in the processing vessel.

27. ​​An exhaust device connected to the suction port via an exhaust pipe; a measuring instrument for measuring the number of particles flowing in the exhaust pipe; and The maintenance device according to any one of claims 22 to 26, wherein the exhaust device stops suction from the suction port when the number of particles measured by the measuring instrument is equal to or less than a predetermined threshold.

28. The object in the processing vessel is a mounting table having a mounting portion on which a substrate can be placed and an outer peripheral portion on which an edge ring can be placed, The maintenance device according to any one of claims 22 to 27, further comprising a transport mechanism disposed inside the case and configured to transport an edge ring out of the processing vessel and transport the edge ring into the processing vessel through the opening.

29. A maintenance device as described in Claim 28, wherein the suction port sucks up any adhesions on the outer surface of the mounting portion of the mounting table when the edge ring is transported out of the processing container by the transport mechanism.

30. The transfer mechanism transports a replacement edge ring into the processing vessel and places it on an outer periphery of the mounting table; 30. The maintenance device according to claim 28, further comprising a control unit that uses an imaging unit provided at the tip of the arm to capture images of the gap between the replacement edge ring and the mounting portion of the mounting table at each of a plurality of circumferential positions, calculates a deviation amount between the width of the gap and a reference width at each of the plurality of circumferential positions based on the captured images, and controls the transport mechanism to correct the position of the replacement edge ring by the calculated deviation amount.

31. A vacuum processing system having a vacuum processing device and a maintenance device, The vacuum processing apparatus includes: A processing vessel; a first gate provided in the processing chamber and used for loading and unloading a substrate; a second gate provided in the processing vessel, to which the maintenance device is detachably attached; and The maintenance device includes: a case in which an opening having a size corresponding to the second gate is formed, the opening being airtightly attached to the second gate, the case being capable of being depressurized; a suction mechanism that is disposed inside the case, enters the processing vessel through the opening, and sucks up adhesions of the object inside the processing vessel; A vacuum processing system comprising:

Images