Exhaust gas treatment device and method for treating exhaust gas

Abstract

To provide an exhaust gas treatment device that can prevent a gas treatment reactor from corroding and can improve reaction efficiency with a treatment gas.SOLUTION: An exhaust gas treatment device includes a liquid supply line for supplying liquid to a torch part and then supplying the liquid heated by the torch part to a gas treatment reactor.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an exhaust gas treatment device and an exhaust gas treatment method. [Background technology]

[0002] There are detoxification systems (an example of exhaust gas treatment systems) that detoxify gases. Known methods for detoxifying gases include a wet system in which the treated gas is brought into contact with a liquid to remove foreign matter and water-soluble components, and a combustion system in which the treated gas is combusted. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2008-161861 Summary of the Invention [Problem to be solved by the invention]

[0004] When a process gas is pyrolyzed at high temperatures, the pyrolyzed process gas needs to react with some substance to prevent recombination of the pyrolyzed process gas. Water generates hydrogen atoms and oxygen atoms through its pyrolysis, and the pyrolyzed process gas reacts with these atoms. Therefore, water is suitable as a substance to react with the pyrolyzed process gas. In particular, vaporized water (i.e., water vapor) can react with the process gas with less energy than water in liquid form.

[0005] One possible method is to use water circulated between a water tank and a gas treatment reactor as the water to react with the pyrolyzed treatment gas. However, when such circulated water is used, the products contained in the circulated water gradually become concentrated, and as a result, there is a risk that the acidic products will corrode the gas treatment reactor.

[0006] On the other hand, it is possible to use fresh water (i.e., water supplied from a water supply source) instead of circulating water, but using fresh water with a low temperature may result in a lower reaction efficiency with the treatment gas.

[0007] Therefore, an object of the present invention is to provide an exhaust gas treatment device and an exhaust gas treatment method that can prevent corrosion of a gas treatment reactor and improve the reaction efficiency with the treatment gas. [Means for solving the problem]

[0008] In one aspect, an exhaust gas treatment device is provided, comprising: a torch unit that generates a high-temperature jet; a gas treatment reactor having a gas flow path through which treatment gas pyrolyzed by the jet flows; a liquid supply line that supplies a liquid to the torch unit and then supplies the liquid heated by the torch unit to the gas treatment reactor; and a liquid supply source connected to the liquid supply line.

[0009] In one aspect, the torch section includes a cathode chamber in which a cathode is disposed and an anode chamber in which an anode is disposed, and the liquid supply line includes a cathode side supply line that supplies the liquid to the cathode chamber and an anode side supply line that supplies the liquid to the anode chamber. In one embodiment, the liquid supply line has a confluence line connected to the cathode side supply line and the anode side supply line. In one embodiment, at least one of the cathode supply line and the anode supply line is connected to the gas processing reactor.

[0010] In one aspect, the torch section includes a cathode chamber in which a cathode is disposed and an anode chamber in which an anode is disposed, and the liquid supply line supplies the liquid to one of the cathode chamber and the anode chamber, and then supplies the liquid to the other of the cathode chamber and the anode chamber. In one aspect, the liquid supply line is configured to supply the liquid to an upper portion of the gas processing reactor. In one aspect, the gas processing reactor comprises an inner cylindrical portion forming the gas flow path and an outer cylindrical portion surrounding the inner cylindrical portion, and the inner cylindrical portion has an upper end serving as an overflow weir for liquid supplied from the liquid supply line.

[0011] In one aspect, the exhaust gas treatment device includes a gas-liquid separation tank connected to the liquid supply line, and the gas-liquid separation tank is disposed downstream of the torch section in the flow direction of the liquid. In one aspect, the gas-liquid separation tank includes a gas introduction line connected to the outer cylindrical portion at a position higher than the upper end, and a liquid introduction line connected to the outer cylindrical portion at a position lower than the upper end. In one embodiment, the inner cylindrical portion has a flow path restrictor portion that narrows the gas flow path.

[0012] In one aspect, the exhaust gas treatment device includes a spray nozzle that sprays the liquid into the gas flow path. In one embodiment, the exhaust gas treatment device is an atmospheric pressure plasma type exhaust gas treatment device, and the torch portion has a non-transfer type plasma torch structure.

[0013] In one aspect, a method for treating an exhaust gas is provided, which comprises supplying a liquid from a liquid supply source to a torch section that generates a high-temperature jet, and then supplying the liquid heated by the torch section to a gas treatment reactor having a gas flow path through which a treatment gas resulting from pyrolysis by the jet flows.

[0014] In one embodiment, the liquid is supplied to a cathode chamber in which a cathode is disposed and an anode chamber in which an anode is disposed in the torch section. In one embodiment, the liquid is supplied to one of the cathode chamber and the anode chamber, and then the liquid is supplied to the other of the cathode chamber and the anode chamber. In one aspect, the gas contained in the liquid supplied to the torch section is separated, and the gas is supplied to a position higher than the upper end of the inner cylindrical section forming the gas flow path of the gas processing reactor, and the liquid is supplied to a position lower than the upper end. [Effects of the Invention]

[0015] The liquid supply line is configured to supply liquid from a liquid supply source to the torch section, and then supply the liquid heated by the torch section to the gas treatment reactor. Therefore, the exhaust gas treatment device can prevent corrosion of the gas treatment reactor and improve the reaction efficiency with the treatment gas.

[0016] The exhaust gas treatment device can prevent corrosion of the gas treatment reactor by acid, particularly after the reaction of the treatment gas, and can improve the reaction efficiency with the treatment gas due to the high reactivity of the heated liquid. [Brief explanation of the drawings]

[0017] [Figure 1] 1 is a diagram illustrating an embodiment of an exhaust gas treatment device. [Figure 2] 10A and 10B show other embodiments of the liquid supply line. [Figure 3] 10A and 10B show other embodiments of the liquid supply line. [Figure 4] 10A and 10B show other embodiments of the liquid supply line. [Figure 5] 10A and 10B show other embodiments of the liquid supply line. [Figure 6] FIG. 2 is a diagram showing an embodiment of a gas-liquid separation tank. [Figure 7] FIG. 7 is a diagram showing the gas-liquid separation tank shown in FIG. [Figure 8] FIG. 2 illustrates another embodiment of a gas processing reactor. [Figure 9] FIG. 10 is a diagram showing a spray nozzle for spraying a liquid into a gas flow path. DETAILED DESCRIPTION OF THE INVENTION

[0018] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings described below, identical or corresponding components are designated by the same reference numerals, and duplicated descriptions will be omitted. In the multiple embodiments described below, the configuration of an embodiment that is not particularly described is the same as that of other embodiments, and therefore duplicated descriptions will be omitted.

[0019] 1 is a diagram showing one embodiment of an exhaust gas treatment device. For example, the exhaust gas treatment device 1 is provided to neutralize gas (treatment gas) from a vacuum pump. In this case, a vacuum pump (not shown) is connected to the primary side (upstream side) of the exhaust gas treatment device 1.

[0020] In this embodiment, the exhaust gas treatment device 1 is an atmospheric pressure plasma type exhaust gas treatment device. As shown in Fig. 1, the exhaust gas treatment device 1 includes a torch unit 2 that generates a high-temperature jet (more specifically, a plasma jet P), and a gas treatment reactor 3 that has a gas flow path GF through which treatment gas pyrolyzed by the plasma jet P flows.

[0021] The torch section 2 includes a cathode 10 and an anode 11 facing each other, and a torch body 40 that houses the cathode 10 and the anode 11. The torch section 2 has a non-transfer type plasma torch structure.

[0022] More specifically, the torch unit 2 has a structure for spraying plasma generated between the cathode 10 and the anode 11. Although not shown, the exhaust gas treatment device 1 is equipped with a power supply that applies a voltage between the anode 10 and the cathode 11.

[0023] The torch body 40 has a cathode housing portion 40a that houses the cathode 10, and an anode housing portion 40b that houses the anode 11. The cathode housing portion 40a has a space (cathode chamber) 14 for cooling the cathode 10. The cathode 10 is disposed in the cathode chamber 14. The anode housing portion 40b has a space (anode chamber) 15 for cooling the anode 11. The anode 11 is disposed in the anode chamber 15.

[0024] The cathode housing portion 40a and the anode housing portion 40b are separated by partition walls 13A and 13B disposed between the cathode housing portion 40a and the anode housing portion 40b. The torch body 40 has a space (plasma generation chamber 12) surrounded by the partition walls 13A and 13B.

[0025] When plasma gas is supplied to plasma generation chamber 12 (see FIG. 1) and a predetermined discharge voltage is applied to cathode 10 and anode 11, a plasma arc is generated and a plasma jet P is sprayed from torch section 2 toward gas processing reactor 3.

[0026] The gas processing reactor 3 includes an inner cylindrical portion 31 that forms a gas flow path GF, an outer cylindrical portion 30 that surrounds the inner cylindrical portion 31, and a processing gas inlet portion 32 that is connected to the upper portion of the outer cylindrical portion 30. The inner cylindrical portion 31 and the outer cylindrical portion 30 are arranged concentrically.

[0027] Both the inner cylindrical portion 31 and the outer cylindrical portion 30 have a cylindrical shape. Therefore, an annular gap SP is formed between the outer wall surface of the inner cylindrical portion 31 and the inner wall surface of the outer cylindrical portion 30. The gap SP is disposed radially outward of the gas flow path GF.

[0028] The process gas is introduced into the gas process reactor 3 through the process gas introduction section 32. The process gas introduced from the process gas introduction section 32 comes into contact with the high-temperature plasma jet P sprayed from the torch section 2 and is pyrolyzed. The pyrolyzed process gas passes through the gas flow path GF, is processed in a liquid tank casing (not shown) and a process casing (not shown), and is then discharged to the outside.

[0029] As described above, vaporized water (i.e., water vapor) is a suitable substance to react with the pyrolyzed process gas to prevent recombination of the pyrolyzed process gas. However, if water stored in the liquid tank casing is used, the acid products contained in the water may corrode the gas process reactor 3. On the other hand, if low-temperature water (fresh water) is used, a relatively large amount of energy is required to react with the process gas, which may reduce the reaction efficiency with the process gas.

[0030] Therefore, in this embodiment, the exhaust gas treatment device 1 has a configuration that prevents corrosion of the gas treatment reactor 3 and improves the reaction efficiency with the treatment gas. Such a configuration will be described below. Hereinafter, in this specification, the term "liquid" is a concept that includes water.

[0031] The exhaust gas treatment device 1 is equipped with a liquid supply line 4 that supplies liquid (more specifically, fresh water) to the torch section 2 and then supplies the liquid heated by the torch section 2 to the gas treatment reactor 3, and a liquid supply source WS connected to the liquid supply line 4.

[0032] The liquid supply line 4 is connected to the torch unit 2 and the gas processing reactor 3, and is configured to supply the liquid that has passed through the torch unit 2 to the gas processing reactor 3. In the flow direction of the liquid supplied from the liquid supply source WS, the torch unit 2 is disposed upstream of the gas processing reactor 3.

[0033] 1, the liquid supply line 4 includes a cathode-side supply line 20A that supplies the liquid supplied from the liquid supply source WS to the cathode chamber 14, and an anode-side supply line 20B that supplies the liquid supplied from the liquid supply source WS to the anode chamber 15. The cathode-side supply line 20A and the anode-side supply line 20B are connected to separate liquid supply sources WS, but may also be connected to a single liquid supply source WS.

[0034] The liquid supply line 4 further includes a confluence line 20C connected to the cathode supply line 20A and the anode supply line 20B. The confluence line 20C is connected to the outer casing 30 of the gas processing reactor 3.

[0035] Liquid supplied from the liquid supply source WS is supplied to the cathode chamber 14 and the anode chamber 15 via the cathode side supply line 20A and the anode side supply line 20B. The cathode chamber 14 and the anode chamber 15 are filled with liquid. The cathode 10 and the anode 11 become hot due to the application of voltage. Therefore, the liquid supplied to the cathode chamber 14 and the anode chamber 15 cools the cathode 10 and the anode 11.

[0036] The liquid heated by heat exchange with the cathode 10 and the anode 11 is supplied to the outer tubular portion 30 through the junction line 20C. More specifically, the junction line 20C is connected to a communication port 30a formed in the upper part of the outer tubular portion 30. Therefore, the liquid flowing through the junction line 20C is supplied to the upper part of the outer tubular portion 30.

[0037] The inner cylindrical portion 31 has an upper end TP that serves as an overflow weir for the liquid supplied from the liquid supply line 4. Therefore, the liquid supplied to the gas processing reactor 3 gradually rises through the gap SP between the inner cylindrical portion 31 and the outer cylindrical portion 30 and overflows the upper end TP.

[0038] The liquid overflowing the upper end TP forms a liquid film F on the inner wall surface of the inner cylindrical portion 31. The liquid film F can prevent foreign matter, such as reaction by-products formed by the processing gas, from accumulating on the inner cylindrical portion 31. The entire inner wall surface of the inner cylindrical portion 31 is covered with the liquid film F.

[0039] 1, a gas-liquid interface GL is formed at the upper end portion of the liquid film F (i.e., radially outside the upper end TP of the inner cylindrical portion 31). The gas-liquid interface GL is a boundary portion where a part of the liquid overflowing the upper end TP is vaporized. The space above the gas-liquid interface GL is filled with vaporized liquid (i.e., water vapor).

[0040] The processing gas inlet 32 ​​is located at a position higher than the upper end TP. Therefore, the processing gas introduced from the processing gas inlet 32 ​​and thermally decomposed by the plasma jet P actively reacts with the water vapor present above the gas-liquid interface GL. This improves the reaction efficiency of the processing gas with the water vapor.

[0041] In particular, the communication port 30a of the outer cylindrical portion 30 is located adjacent to the upper end TP (i.e., the gas-liquid interface GL) of the inner cylindrical portion 31. Therefore, by supplying heated liquid to the gas processing reactor 3 through the communication port 30a, the space above the gas-liquid interface GL can be stably filled with water vapor. In this embodiment, the communication port 30a is located at a position lower than the upper end TP of the inner cylindrical portion 31.

[0042] According to this embodiment, by supplying the liquid heated by the torch unit 2 to the gas processing reactor 3, the space above the gas-liquid interface GL can be efficiently filled with water vapor, thereby improving the reaction efficiency with the processing gas. Furthermore, by reacting the liquid (new water) supplied from the liquid supply source WS with the pyrolyzed processing gas, corrosion of the gas processing reactor 3 can be prevented.

[0043] Fig. 2 shows another embodiment of the liquid supply line. In the embodiment shown in Fig. 1, the liquid supply line 4 has a structure that cools the cathode 10 and the anode 11 in parallel, but in the embodiment shown in Fig. 2, the liquid supply line 4 has a structure that cools the cathode 10 and the anode 11 in series.

[0044] More specifically, the liquid supply line 4 is configured to supply liquid to one of the cathode chamber 14 and the anode chamber 15, and then to the other of the cathode chamber 14 and the anode chamber 15.

[0045] 2, the liquid supply line 4 is configured to first supply the liquid to the cathode chamber 14, and then supply the liquid to the anode chamber 15. In one embodiment, the liquid supply line 4 may be configured to first supply the liquid to the anode chamber 15, and then supply the liquid to the cathode chamber 14.

[0046] Fig. 3 is a diagram showing another embodiment of the liquid supply line. In the embodiment shown in Fig. 1, the liquid supply line 4 has a junction line 20C connected to the cathode side supply line 20A and the anode side supply line 20B, but as shown in Fig. 3, the liquid supply line 4 does not necessarily have to have the junction line 20C.

[0047] In the embodiment shown in FIG. 3, the liquid supply line 4 does not have the joining line 20C, but has a cathode side supply line 20A and an anode side supply line 20B connected to the upper part of the outer tubular portion 30.

[0048] The cathode side supply line 20A is connected to a communication port 30a-2 formed in the upper part of the outer cylindrical portion 30, and the anode side supply line 20B is connected to a communication port 30a-1 formed in the upper part of the outer cylindrical portion 30. In this embodiment, both of the communication ports 30a-1 and 30a-2 are located at a position lower than the upper end TP of the inner cylindrical portion 31.

[0049] Fig. 4 is a diagram showing another embodiment of the liquid supply line. In the embodiment shown in Fig. 3, both the cathode side supply line 20A and the anode side supply line 20B are connected to the outer tubular portion 30, but at least one of the cathode side supply line 20A and the anode side supply line 20B may be connected to the outer tubular portion 30.

[0050] In the embodiment shown in FIG. 4 , the cathode side supply line 20A is not connected to the outer tubular portion 30. On the other hand, the anode side supply line 20B is connected to a communication port 30a formed in the upper part of the outer tubular portion 30. The liquid flowing through the cathode side supply line 20A may be discharged or recovered after cooling the cathode 10 in the cathode chamber 14. In one embodiment, the cathode side supply line 20A may be connected to the communication port 30a of the outer tubular portion 30, while the anode side supply line 20B may not be connected to the outer tubular portion 30.

[0051] Fig. 5 is a diagram showing another embodiment of the liquid supply line. In the embodiment shown in Figs. 1 to 4, the liquid supply line 4 is connected to the upper part of the outer tubular portion 30, but as shown in Fig. 5, the liquid supply line 4 may be connected to a communication port 30b formed in the lower part of the outer tubular portion 30.

[0052] In the embodiment shown in Fig. 5, the liquid supply line 4 has the same configuration (i.e., the cathode side supply line 20A, the anode side supply line 20B, and the junction line 20C) as the liquid supply line 4 described with reference to Fig. 1. In one embodiment, the liquid supply line 4 may have the same configuration as the liquid supply line 4 described with reference to Figs. 2 to 4.

[0053] Fig. 6 is a diagram showing one embodiment of a gas-liquid separation tank. In the embodiment shown in Fig. 6, the exhaust gas treatment device 1 includes a gas-liquid separation tank 50 connected to the liquid supply line 4 (more specifically, the joining line 20C).

[0054] The gas-liquid separation tank 50 is disposed downstream of the torch unit 2 in the flow direction of the liquid flowing through the liquid supply line 4. The gas-liquid separation tank 50 is configured to separate gas contained in the liquid introduced therein.

[0055] When the gas-liquid separation tank 50 is applied to the liquid supply line 4 according to the embodiment described with reference to FIG. 3, the gas-liquid separation tank 50 may be connected to at least one of the cathode side supply line 20A and the anode side supply line 20B.

[0056] Depending on conditions such as the temperature of the torch section 2 and the flow rate of the liquid supplied from the liquid supply source WS, some of the liquid cooling the torch section 2 may boil (evaporate), causing the liquid (hot water) to contain water vapor. In this case, if liquid containing water vapor is supplied to the gap SP between the inner cylinder section 31 and the outer cylinder section 30, the large amount of water vapor may prevent a liquid film F from being properly formed on the inner surface of the inner cylinder section 31. The gas-liquid separation tank 50 can separate gas from the liquid that has passed through the torch section 2, thereby solving this problem.

[0057] Fig. 7 is a diagram showing the gas-liquid separation tank shown in Fig. 6. As shown in Fig. 7, the gas-liquid separation tank 50 includes a tank portion 51 connected to the liquid supply line 4 (the junction line 20C in the embodiment shown in Figs. 6 and 7), and a gas introduction line 52A and a liquid introduction line 52B connected to the tank portion 51. In this embodiment, the gas introduction line 52A and the liquid introduction line 52B are components of the gas-liquid separation tank 50, but they may also be components of the liquid supply line 4.

[0058] The gas introduction line 52A is connected to the outer cylindrical portion 30 at a position higher than the upper end TP of the inner cylindrical portion 31 (i.e., above the gas-liquid interface GL). The liquid introduction line 52B is connected to the outer cylindrical portion 30 at a position lower than the upper end TP of the inner cylindrical portion 31 (i.e., below the gas-liquid interface GL).

[0059] The confluence line 20C is connected to the lower part of the tank part 51. Therefore, when the liquid that has passed through the torch part 2 is introduced into the tank part 51, the liquid and gas are separated in the tank part 51. The gas contained in the liquid is introduced into the gas processing reactor 3 through the gas introduction line 52A connected to the upper part of the tank part 51. The tank part 51 has a sufficient volume necessary to separate the gas from the liquid.

[0060] The processing gas thermally decomposed by the plasma jet P actively reacts with the gas introduced into the gas processing reactor 3 through the gas introduction line 52A. This makes it possible to further improve the reaction efficiency of the processing gas with water vapor.

[0061] The liquid introduced into the gas processing reactor 3 through the liquid introduction line 52B connected to the lower part of the tank part 51 gradually rises in the gap SP between the inner cylindrical part 31 and the outer cylindrical part 30 and overflows the upper end TP. The liquid overflowing the upper end TP forms a liquid film F on the inner wall surface of the inner cylindrical part 31.

[0062] The boiling point of a liquid depends on its pressure. Therefore, by supplying a liquid pressurized to a predetermined target pressure (e.g., several tenths of a MPa), any amount of water vapor can be introduced into the gas processing reactor 3.

[0063] Although not shown, the exhaust gas treatment device 1 may also include a flow rate adjustment valve disposed upstream and / or downstream of the torch unit 2, and a temperature sensor disposed downstream of the torch unit 2. With this configuration, the exhaust gas treatment device 1 can control the flow rate of the liquid flowing through the liquid supply line 4 based on the temperature of the torch unit 2. In this way, the exhaust gas treatment device 1 can control the amount of gas (water vapor) introduced into the gas treatment reactor 3.

[0064] Fig. 8 is a diagram illustrating another embodiment of a gas processing reactor. As shown in Fig. 8, inner cylindrical portion 31 may have a flow path restrictor 35 that narrows gas flow path GF. Flow path restrictor 35 is formed in the lower portion of inner cylindrical portion 31 and reduces the inner diameter of inner cylindrical portion 31 at the lower portion. A liquid film F formed on the inner wall surface of inner cylindrical portion 31 flows down flow path restrictor 35. In the embodiment shown in Fig. 8, flow path restrictor 35 has a tapered shape that gradually reduces the inner diameter of inner cylindrical portion 31, but it may also have a stepped shape that protrudes from the inner wall surface of inner cylindrical portion 31.

[0065] When nitrogen present in the gas flow path GF (for example, nitrogen contained in the processing gas or plasma jet P) combines with oxygen, nitrogen oxides (NO X 8, by forming the flow path narrowing section 35, the processing gas (or plasma jet P) flowing through the gas flow path GF is rapidly cooled by the liquid film F flowing down the flow path narrowing section 35. By rapidly cooling the processing gas, it is possible to suppress the generation of nitrogen oxides.

[0066] In the embodiment shown in Figure 8, the liquid supply line 4 has the same structure as the liquid supply line 4 in the embodiment described with reference to Figure 1, but it may also have the same structure as the liquid supply line 4 described with reference to Figures 2 to 7.

[0067] Fig. 9 is a diagram showing a spray nozzle that injects liquid into a gas flow path. As shown in Fig. 9, the exhaust gas treatment device 1 may include a spray nozzle SN that injects liquid into a gas flow path GF. In the embodiment shown in Fig. 9, the liquid supply line 4 has an anode-side supply line 20B that communicates with the gap SP between the outer cylindrical portion 30 and the inner cylindrical portion 31, and a cathode-side supply line 20A that communicates with the gas flow path GF formed inside the inner cylindrical portion 31.

[0068] More specifically, the anode-side supply line 20B is connected to a communication port 30a formed in the upper part of the outer cylindrical portion 30. The cathode-side supply line 20A extends through a communication port 30b formed in the lower part of the outer cylindrical portion 30 and is connected to a communication port 31a formed in the lower part of the inner cylindrical portion 31.

[0069] The spray nozzle SN is connected to the tip of the cathode-side supply line 20A, in other words, the communication port 31a, and is positioned facing the gas flow path GF. Therefore, the spray nozzle SN sprays the liquid flowing through the cathode-side supply line 20A in a spray-like manner toward the process gas (or plasma jet P) flowing through the gas flow path GF. The liquid sprayed in a spray-like manner rapidly cools the process gas flowing through the gas flow path GF. Rapidly cooling the process gas can suppress the generation of nitrogen oxides.

[0070] 9, the cathode side supply line 20A extends to the gas flow path GF, and the anode side supply line 20B extends to the gap SP, but the anode side supply line 20B may extend to the gas flow path GF, and the cathode side supply line 20A may extend to the gap SP. In this case, the spray nozzle SN may be connected to the tip of the anode side supply line 20B.

[0071] The components of the embodiment described with reference to Figures 1 to 9 can be combined as appropriate. For example, the components such as the gas-liquid separation tank 50, the flow path throttle section 35, and the spray nozzle SN can be applied to the embodiment described with reference to Figures 1 to 9.

[0072] The above-described embodiments have been described for the purpose of enabling a person of ordinary skill in the art to practice the present invention. Various modifications of the above-described embodiments would be obvious to a person skilled in the art, and the technical concept of the present invention may be applied to other embodiments. Therefore, the present invention is not limited to the described embodiments, but is to be interpreted in the broadest scope in accordance with the technical concept defined by the claims. [Explanation of symbols]

[0073] 1. Exhaust gas treatment equipment 2 Torch section 3 Gas Processing Reactor 4 Liquid Supply Lines 10 cathode 11 Anode 12 Plasma generation chamber 13A,13B Bulkhead 14 Cathode chamber 15 Anode chamber 20A cathode supply line 20B Anode side supply line 20C Merging Line 30 outer cylinder 30a Communication port 30a-1,30a-2 Communication port 30b Communication port 31 Inner cylinder 31a Communication port 32 Processing gas inlet 35 Flow path restriction 40 Torch body 40a Cathode housing 40b Anode housing 50 Gas-liquid separation tank 51 Tank section 52A Gas inlet line 52B Liquid introduction line F liquid film P Plasma Jet GF Gas flow path GL gas-liquid interface SP Gap WS liquid source TP top edge SN spray nozzle

Claims

1. An exhaust gas treatment device, a torch section that generates a high-temperature jet; a gas processing reactor having a gas flow path through which the processing gas pyrolyzed by the jet flows; a liquid supply line for supplying a liquid to the torch section and then supplying the liquid heated by the torch section to the gas processing reactor; a liquid supply source connected to the liquid supply line.

2. The torch unit includes: a cathode chamber in which a cathode is disposed; an anode chamber in which an anode is disposed, The liquid supply line a cathode-side supply line that supplies the liquid to the cathode chamber; 2. The exhaust gas treatment device according to claim 1, further comprising an anode-side supply line that supplies the liquid to the anode chamber.

3. The exhaust gas treatment device according to claim 2 , wherein the liquid supply line has a junction line connected to the cathode side supply line and the anode side supply line.

4. The exhaust gas treatment device according to claim 2 , wherein at least one of the cathode side supply line and the anode side supply line is connected to the gas treatment reactor.

5. The torch unit includes: a cathode chamber in which a cathode is disposed; an anode chamber in which an anode is disposed, 2. The exhaust gas treatment device according to claim 1, wherein the liquid supply line supplies the liquid to one of the cathode chamber and the anode chamber, and then supplies the liquid to the other of the cathode chamber and the anode chamber.

6. The exhaust gas treatment device of claim 1 , wherein the liquid supply line is configured to supply the liquid to an upper portion of the gas treatment reactor.

7. The gas processing reactor comprises: an inner cylindrical portion that forms the gas flow path; an outer cylindrical portion surrounding the inner cylindrical portion, The exhaust gas treatment device according to claim 1 , wherein the inner cylindrical portion has an upper end serving as an overflow weir for the liquid supplied from the liquid supply line.

8. the exhaust gas treatment device includes a gas-liquid separation tank connected to the liquid supply line, The exhaust gas treatment device according to claim 7 , wherein the gas-liquid separation tank is disposed downstream of the torch unit in the direction of flow of the liquid.

9. The gas-liquid separation tank is a gas introduction line connected to the outer cylindrical portion at a position higher than the upper end; The exhaust gas treatment device according to claim 8 , further comprising: a liquid introduction line connected to the outer cylindrical portion at a position lower than the upper end.

10. The exhaust gas treatment device according to claim 7 , wherein the inner cylindrical portion has a flow path restrictor portion that narrows the gas flow path.

11. The exhaust gas treatment device according to claim 1 , further comprising a spray nozzle for spraying the liquid into the gas flow path.

12. the exhaust gas treatment device is an atmospheric pressure plasma type exhaust gas treatment device, The exhaust gas treatment device according to claim 1 , wherein the torch portion has a non-transfer type plasma torch structure.

13. An exhaust gas treatment method, comprising: supplying a liquid from a liquid supply source to a torch portion that generates a high-temperature jet; The liquid heated by the torch is then supplied to a gas treatment reactor having a gas flow path through which a treatment gas pyrolyzed by the jet flows.

14. The exhaust gas treatment method according to claim 13 , wherein the liquid is supplied to a cathode chamber in which a cathode is disposed and an anode chamber in which an anode is disposed in the torch unit.

15. 15. The exhaust gas treatment method according to claim 14, wherein the liquid is supplied to one of the cathode chamber and the anode chamber, and then the liquid is supplied to the other of the cathode chamber and the anode chamber.

16. Separating gas contained in the liquid supplied to the torch section; supplying the gas to a position of the gas processing reactor that is higher than an upper end of an inner cylindrical portion that forms the gas flow path; The exhaust gas treatment method according to claim 13 , wherein the liquid is supplied to a position lower than the upper end.

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