Image sensor and image inspection system

Abstract

To provide an image sensor which inhibits increase in size and suppresses increase in a sensible temperature felt by a user.SOLUTION: An image sensor includes a cover member covering at least parts of a pair of side surfaces which are located adjacent to a front surface, which includes an imaging hole configured to guide exterior light to an imaging part, of an image sensor housing and are not located adjacent to each other. The cover member is formed of a material having heat conductivity lower than that of the image sensor housing. The image sensor housing includes a contact part formed integrally with the image sensor housing. The contact part contacts with a support when the image sensor housing is attached to the support.SELECTED DRAWING: Figure 12

Description

[Technical Field]

[0001] The present invention relates to an image sensor and an image inspection system. [Background technology]

[0002] Image sensors are becoming increasingly high-resolution in order to output images that correspond to minute visual features. To process high-resolution images at high speed, image sensors are now using components that generate a lot of heat, such as inference accelerators that perform high-speed calculations (execution of AI functions) using network structure models. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2017-76168 Summary of the Invention [Problem to be solved by the invention]

[0004] When using components that generate a large amount of heat, conventional heat dissipation measures that conduct heat generated internally to a metal casing result in a higher casing temperature (external surface temperature) than conventional methods. This increases the perceived temperature when the user grips the casing, potentially reducing user convenience. Furthermore, because the perceived temperature is higher than with conventional image sensors, there is also the risk that the user may mistakenly recognize an abnormality.

[0005] Another possible method is to increase the size of the housing to increase the heat dissipation area and the amount of heat dissipated, thereby lowering the housing temperature and lowering the temperature felt by the user when holding the housing. However, increasing the size of the housing increases the limitations on where the image sensor can be installed, which may reduce convenience.

[0006] In view of the above-mentioned problems, an object of the present invention is to provide an image sensor that can suppress an increase in size and an increase in the temperature perceived by the user. [Means for solving the problem]

[0007] An image sensor according to the present invention captures an image of an inspection object. The image sensor includes: an imaging unit including an imaging sensor; a control unit that processes images captured by the imaging unit; an image sensor housing formed of metal and accommodating the imaging unit and the control unit and that is attachable to a support; and cover members formed of a material with lower thermal conductivity than the image sensor housing, covering at least a portion of a pair of side surfaces that intersect with a front surface that has an imaging hole configured to guide light outside the image sensor housing to the imaging sensor and that face in different directions. The image sensor housing includes a contact portion that comes into contact with the support when the image sensor housing is attached to the support. [Effects of the Invention]

[0008] According to the present invention, it is possible to provide an image sensor that can suppress an increase in size and that can suppress an increase in the temperature perceived by the user. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a diagram illustrating an image inspection system according to an embodiment of the present invention during operation. [Figure 2] FIG. 1 is a hardware configuration diagram of an image inspection system. [Figure 3] FIG. 2 is a perspective view of the image sensor as seen from above and behind. [Figure 4] FIG. 2 is a perspective view of the image sensor as seen from above and in front. [Figure 5] FIG. 2 is a front view of the image sensor. [Figure 6] FIG. 2 is a rear view of the image sensor. [Figure 7] FIG. 2 is a top view of the image sensor. [Figure 8]FIG. 2 is a bottom view of the image sensor. [Figure 9] FIG. 2 is a left side view of the image sensor. [Figure 10] FIG. 2 is a right side view of the image sensor. [Figure 11] FIG. 2 is a rear view of the image sensor. [Figure 12] 12 is a cross-sectional view of the image sensor shown in FIG. 11 taken along line XII-XII. [Figure 13] 10 is a perspective view of the image sensor viewed from above and rear with a rear sensor connector cover provided on the rear surface of the image sensor open; FIG. [Figure 14] FIG. 10 is a perspective view of the image sensor from above and rear with the cover member and the rear sensor connector lid separated. [Figure 15] FIG. 2 is a perspective view of the image sensor seen from below and in front with the front sensor connector cover open. [Figure 16] FIG. 10 is a view of the rear sensor connector cover as seen from the inside. [Figure 17] FIG. 10 is a view of the front sensor connector cover as seen from the inner surface side. [Figure 18] 10 is a perspective view of the image sensor seen from above and rear with the external connection portion moved to a second position. FIG. [Figure 19] FIG. 1 is a block diagram of an image sensor with an attached communication unit. [Figure 20] FIG. 10 is a perspective view of the image sensor with the communication unit 700 attached, viewed from above and behind. [Figure 21] FIG. 2 is a cross-sectional view of the image sensor with the communication unit attached. [Figure 22] FIG. 10 is a perspective view showing a state in which the communication unit is separated from the image sensor. [Figure 23] FIG. 2 is a perspective view of the communication unit as seen from above and behind. [Figure 24] FIG. 2 is a perspective view of the communication unit from which the communication unit cover member is separated, as viewed from above and behind; [Figure 25] 10 is a perspective view of the communication unit when viewed from above and rear with the external connection portion moved to a fourth position. FIG. [Figure 26]10 is a perspective view showing a state in which an image sensor with an external connection portion moved to a second position is combined with an external connection portion with an external connection portion moved to a fourth position. FIG. [Figure 27] 10 is a flowchart of an operation for setting a communication unit. [Figure 28] FIG. 10 is a diagram showing a setting screen displayed on the display device when performing extended settings for the image sensor. [Figure 29] FIG. 10 is a diagram showing a setting screen when a communication unit is connected. [Figure 30] FIG. 10 is a diagram showing a detailed setting screen used when setting up a communication unit. [Figure 31] FIG. 1 is a schematic diagram of an image inspection system connected in a first network connection example. [Figure 32] FIG. 10 is a schematic diagram of an image inspection system connected in a second network connection example. [Figure 33] FIG. 10 is a schematic diagram of an image inspection system connected in a third network connection example. [Figure 34] FIG. 2 is a block diagram showing communication between a control unit of an image sensor and a control unit of a communication unit. [Figure 35] FIG. 10 is a schematic diagram of an image inspection system connected in a fourth network connection example. [Figure 36] FIG. 10 is a schematic diagram of an image inspection system connected in a fifth network connection example. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that the following description of the preferred embodiments is merely exemplary in nature and is not intended to limit the present invention, its applications, or its uses.

[0011] FIG. 1 is a diagram illustrating an image inspection system S according to an embodiment of the present invention during operation. The image inspection system S, for example, captures an image of a workpiece W, which is an inspection object transported by a transport means A, according to an imaging setting to acquire inference image data, detects the workpiece W in the image of the acquired inference image data, and outputs the detection result to an external device. An example of the external device is a programmable logic controller (PLC) 5, but a device other than the PLC 5 may also be the external device. The PLC 5 controls the transport means A based on the received detection result, for example, to separate the storage destination of the workpiece W. In the following description, a case where the external device is the PLC 5 will be described. Note that the workpiece W may be a workpiece that is not transported by the transport means A. In the following description, the workpiece is also referred to as the target object.

[0012] The image inspection system S includes an image sensor 100, a PC (personal computer) 3, a display device 4, and a PLC 5. The image sensor 100 includes an imaging unit 1 for capturing an image of a workpiece W, and a control unit 2 to which inference image data captured by the imaging unit 1 is input. The image sensor 100 is an integrated device that incorporates the imaging unit 1 and the control unit 2. The image sensor 100 includes an external connection unit 300.

[0013] The PC 3 performs settings for the image inspection system S, the image sensor 100, etc. The display device 4 displays a setting screen, a selection screen, workpiece images, detection results, etc. The control unit 2 is capable of executing a trained model that detects a workpiece W in an image of input inference image data. The control unit 2 executes an output to the PLC 5 according to the detection results by the trained model.

[0014] Here, the image inspection system S may be used, for example, to inspect the workpiece W from various angles at various points in a manufacturing device or a manufacturing line. For this reason, multiple image inspection systems S may be installed in one manufacturing device or one manufacturing line, and it may be difficult to secure sufficient installation space or power supply. Therefore, the image inspection system S needs to be miniaturized to fit the installation space and power-saving to fit the power supply. To satisfy these requirements, the image inspection system S according to this embodiment does not have a GPU.

[0015] The image inspection system S executes a model created using machine learning techniques to be suitable for detecting the workpiece W. The provider of the image inspection system S provides the user with most of the calculations required to obtain the model already completed. In this specification, the machine learning performed by the provider before providing the system to the user is referred to as "pre-training," and the model created through pre-training is referred to as a "pre-trained model." In other words, the control unit 2 executes a model that has been trained to the extent that it can detect the workpiece W, but it is possible to achieve the desired detection accuracy without the user having to perform advanced machine learning, such as the type for which the use of a GPU is recommended. Furthermore, because the user does not have to perform advanced machine learning, the user can execute a model capable of detecting the workpiece W without preparing a GPU for training. Alternatively, the time required to prepare a model capable of detecting the workpiece W can be reduced. The image inspection system S installed in a manufacturing device or production line may be configured to include one image sensor 100 or multiple image sensors 100. The image inspection system S shown in FIG. 1 is configured to include one image sensor 100.

[0016] (Configuration of imaging unit 1) The imaging unit 1 is installed so as to be able to capture an image of the workpiece W from a desired direction. The workpieces W are transported by the transport means A successively into the imaging field of the imaging unit 1.

[0017] As shown in FIG. 2, the imaging unit 1 includes an illumination module 10 for illuminating the workpiece W, and a camera module 11 for capturing an image of the workpiece W illuminated by the illumination module 10.

[0018] The lighting module 10 has an LED (light emitting diode) 10a that irradiates light toward the workpiece W, and an LED driver 10b that controls the light intensity and light emission timing of the LED 10a. The LED driver 10b is connected to the control unit 2 and is controlled by the image sensor control unit 21 of the control unit 2.

[0019] The camera module 11 has an AF motor 11a and an imaging unit 11b. The AF motor 11a drives an optical lens (not shown) that constitutes the lens unit 11f. The position of the optical lens is adjusted by driving the AF motor 11a. As a result, the focus is automatically adjusted on the workpiece W. The autofocus method is not particularly limited, and examples include a contrast method.

[0020] The imaging unit 11b is equipped with a CMOS sensor 11c. The CMOS sensor 11c is an image sensor that receives light that is irradiated from the LED 10a onto the workpiece W and reflected by the workpiece W. This CMOS sensor 11c is connected to the image sensor control unit 21 of the control unit 2, and is controlled by the image sensor control unit 21 of the control unit 2 so as to perform exposure processing for a predetermined time at a predetermined timing.

[0021] (Configuration of control unit 2) The control unit 2 is provided in the image sensor 100 together with the imaging unit 1, and is connected to the imaging unit 1 so as to enable mutual transmission and reception of power, signals, and data. The control unit 2 includes an image sensor control unit 21, a communication unit 22, a power supply 23, and a storage device (storage unit) 24. Control signals for the imaging unit 1 output from the image sensor control unit 21 are transmitted to the imaging unit 1. The control signals for the imaging unit 1 include signals for controlling the light emission timing and light emission amount of the LED 10a, and signals for controlling the AF motor 11a and the imaging unit 11b. In addition, image data acquired by the imaging unit 1 is transmitted from the imaging unit 1 to the image sensor control unit 21 in the control unit 2.

[0022] The image sensor control unit 21 includes a DSP 21a and an FPGA 21b that perform various signal processing, an accelerator 21c that speeds up the processing, and a memory 21d that includes a RAM, a ROM, or the like.

[0023] The DSP 21a is a signal processing device. The FPGA 21b is a processing device whose internal processing contents can be changed. The light receiving amount signal of the light receiving element provided in the CMOS sensor 11c is output to the FPGA 21b and processed, and is also output from the FPGA 21b to the DSP 21a and processed. The processing by the DSP 21a and FPGA 21b is not particularly limited, but for example, various filter processing, processing to detect the work W from the image data, processing to determine whether the work performed on the detected work W is appropriate (good / bad judgment), and other processing and inspection of the work W obtained from the image data are performed. In addition, the DSP 21a and FPGA 21b can also perform other processing on the work W. In this embodiment, the control unit 2 is equipped with the DSP 21a and FPGA 21b, but the imaging unit may also be configured to be equipped with a similar DSP or FPGA.

[0024] The communication unit 22 executes data communication sent and received by the image sensor control unit 21. The communication unit 22 is connected to an external connection plug 330 of the external connection unit 300. A communication cable Cn is connected to the external connection plug 330, which is connected to the PC 3, the display device 4, and the PLC 5. The communication unit 22 enables mutual data communication between the image sensor control unit 21 and the PC 3, the display device 4, and the PLC 5. The communication unit 22 also transmits to the PLC 5 inspection results for image data executed by the image sensor control unit 21. That is, the control unit 2 executes sensor output of processed data obtained by processing the captured image captured by the imaging unit 1 in the image sensor control unit 21. The image sensor control unit 21 may be provided as a one-chip semiconductor element, for example, an IC 500 (see FIG. 12). The IC 500 is a heating element of the image sensor 100.

[0025] The external connection unit 300 includes an external connection plug 330 to which a communication cable Cn connected to an external device is connected, and an external connection plug 340 to which a power cable Cp is connected. The external connection plug 330 is connected to the communication unit 22, and communicates with the PC 3, the display device 4, and the PLC 5 via the communication cable Cn. The external connection plug 340 is also connected to the power source 23, and power is supplied to the external connection plug 330 via the power cable Cp. The image sensor 100 is connected to the PC 3, the display device 4, and the PLC 5 via a communication router 8. That is, the image sensor 100, the PC 3, the display device 4, and the PLC 5 are all connected to the communication router 8 via the communication cable Cn.

[0026] Note that some communication cables are capable of carrying out data communication as well as supplying power. When a communication cable capable of supplying power and data communication is connected to external connection plug 330, both external connection plugs 330 and 340 can be configured to carry out communication as well as supply power.

[0027] (PC configuration) PC3 is configured as a general-purpose personal computer or the like. In this example, a personal computer can be used as PC3 by installing a predetermined program on it. PC3 includes operating devices such as a keyboard 3a and a mouse (not shown). A user of the image inspection system S can perform setting operations and selection operations on the image inspection system S by operating the operating devices on PC3. Specific setting operations and selection operations will be described later.

[0028] The PC 3 and the image sensor 100 are connected to be able to communicate with each other, and data based on setting operations by the user is sent from the PC 3 to the image sensor 100. In addition, the image data of the workpiece W, inspection results, etc. output from the image sensor 100 can be received by the PC 3. The PC 3 and the image sensor 100 are connected via a communication cable Cn. Therefore, the PC 3 can be installed in a location away from the installation location of the image sensor 100.

[0029] (Configuration of display device 4) The display device 4 is configured with, for example, a liquid crystal display or an organic EL display. In this example, the display device 4 includes a touch panel 4a. The touch panel 4a is a member capable of detecting operations performed by a user's finger. The type of the touch panel 4a is not particularly limited, and examples include a capacitance type and an infrared type.

[0030] The display device 4 and the image sensor 100 are connected so that they can communicate with each other. Data based on the user's operation of the touch panel 4a is transmitted from the display device 4 to the image sensor 100. In addition, the display device 4 is capable of receiving image data of the workpiece W output from the image sensor 100. The display device 4 and the image sensor 100 are connected via a communication cable Cn. Therefore, the display device 4 can be installed in a location away from the installation location of the image sensor 100.

[0031] The PC 3 and the display device 4 may be configured as an integrated unit. For example, the display device 4 may be configured as a display device provided in the PC 3. In this case, the main body of the PC 3 and the display device 4 may be integrated or separate. In this example, the image sensor 100 and the PLC 5 are connected via a communication cable Cn.

[0032] (Configuration of image sensor 100) Details of the image sensor 100 will be described below with reference to the drawings. FIG. 3 is a perspective view of the image sensor 100 as seen from above and rear. FIG. 4 is a perspective view of the image sensor 100 as seen from above and front. FIG. 5 is a front view of the image sensor 100. FIG. 6 is a rear view of the image sensor 100. FIG. 7 is a top view of the image sensor 100. FIG. 8 is a bottom view of the image sensor 100. FIG. 9 is a left side view of the image sensor 100. FIG. 10 is a right side view of the image sensor 100.

[0033] 11 is a rear view of the image sensor 100. FIG. 12 is a cross-sectional view of the image sensor 100 taken along line VI-VI of FIG. 11. FIG. 13 is a perspective view of the image sensor 100 seen from above and rear with the rear sensor connector lid 613 provided on the rear surface of the image sensor open. FIG. 14 is a perspective view of the image sensor 100 seen from above and rear with the cover member 400 and the rear sensor connector lid 613 separated. FIG. 15 is a perspective view of the image sensor 100 seen from below and front with the front sensor connector lid 623 open.

[0034] In the following description, the front-rear, up-down, left-right directions of the image sensor 100 are defined based on the state of the image sensor 100 viewed from the front side as shown in Fig. 3. The rear view shown in Fig. 11 shows a state in which the rear sensor connector cover 613 has been removed, and the cross-sectional view in Fig. 12 shows a state in which the rear sensor connector cover 613 has been attached. As shown in Figs. 3 to 12, the image sensor 100 includes an image sensor housing 200 and a cover member 400.

[0035] (Image sensor housing 200) The image sensor housing 200 is made of a metal such as aluminum, aluminum alloy, brass, or stainless steel. The material for the image sensor housing 200 is not limited to these metal materials. A wide range of materials can be used for the material for the image sensor housing 200, including those that have high thermal conductivity and rigidity sufficient to suppress deformation such as bending and distortion of the image sensor housing 200. An external connection unit 300 is disposed at the bottom of the image sensor housing 200. The external connection unit 300 can also be considered to be part of the image sensor housing 200.

[0036] As shown in Figures 3 to 12, the image sensor housing 200 includes a back portion 210 (see Figure 6) that forms the back surface of the image sensor housing 200, a left side portion 220 (see Figure 9) that forms the left side surface of the image sensor housing 200, a right side portion 230 (see Figure 10) that forms the right side surface of the image sensor housing 200, a front portion 240 (see Figure 5) that forms the front surface of the image sensor housing 200, an upper surface portion 250 (see Figure 7) that forms the top surface of the image sensor housing 200, a lower surface portion 260 (see Figure 8) that forms the bottom surface of the image sensor housing 200, and an inclined surface portion 270.

[0037] The image sensor housing 200 is a box-shaped body having an internal space IS surrounded by the above-mentioned components. The front surface of the image sensor housing 200 is the surface on which an imaging hole 244 (described later) is provided. The bottom surface of the image sensor housing 200 is the surface on which an external connection unit 300 (described later) is provided.

[0038] The imaging unit 1 and the control unit 2 are disposed in the internal space IS of the image sensor housing 200. In other words, the image sensor 100 is an integrated image sensor that incorporates the imaging unit 1 and the control unit 2. As shown in Fig. 12 and other figures, a main board 280 and a sub-board 290 are disposed in the internal space IS of the image sensor housing 200. In the internal space IS, the main board 280 is disposed at the rear, and the sub-board 290 is disposed in front of and alongside the main board 280.

[0039] As shown in Figures 3, 4, 12, etc., image sensor housing 200 is configured by combining rear frame 201 and front frame 202. Left side surface portion 220, right side surface portion 230, and top surface portion 250 are configured to be separable into front and rear portions. Left side surface portion 220, right side surface portion 230, and rear portions of top surface portion 250, as well as inclined surface portion 270, are provided on rear frame 201. Furthermore, left side surface portion 220, right side surface portion 230, and front portions of top surface portion 250, as well as bottom surface portion 260, are provided on front frame 202.

[0040] That is, the rear frame 201 is a cylindrical shape with a bottom, including a back surface portion 210, an inclined surface portion 270, a right side of the left side surface portion 220, a side surface portion 230, and a rear portion of each of the top surface portion 250. The front frame 202 is a cylindrical shape with a bottom, including a front surface portion 240, a bottom surface portion 260, and a rear portion of each of the left side surface portion 220, the right side surface portion 230, and the top surface portion 250. This configuration can increase the rigidity of the rear frame 201 and the front frame 202. The image sensor housing 200 is configured by combining the rear frame 201 and the front frame 202 so that the opening of the rear frame 201 and the opening of the front frame 202 overlap each other.

[0041] (Back part 210) The detailed configuration of the image sensor housing 200 will be described. In the image sensor housing 200, the rear surface section 210 has a rectangular shape with the longitudinal direction extending vertically when viewed from the rear side. An inclined surface section 270 is adjacent to the lower end of the rear surface section 210. The rear surface section 210 and the inclined surface section 270 are integrally formed.

[0042] The rear surface 210 includes a sensor contact portion 211. The sensor contact portion 211 is a convex portion that protrudes from an outer surface 217 (the surface on the rear surface side) of the rear surface 210. As shown in FIG. 11 and other figures, the rear surface 210 is provided with six sensor contact portions 211. Of the six sensor contact portions 211, three are provided on each of the left and right sides. Each sensor contact portion 211 has a screw hole 212 that extends in the front-rear direction. As shown in FIG. 12, the sensor contact portion 211 of the rear surface 210 of the image sensor 100 is brought into contact with and fixed to a support Pr, which is a frame or the like of the conveying means A. More specifically, the image sensor 100 is fixed to the support Pr by passing a screw through an attachment hole in the support Pr and screwing the portion of the screw protruding from the attachment hole into the screw hole 212 of the sensor contact portion 211 of the rear surface 210.

[0043] 11, of the six sensor contact portions 211, the sensor contact portions 211 provided at the top are each provided with two screw holes 212. For example, when the image sensor 100 is mounted on a different device or when the mounting position is different, the spacing (pitch) of the mounting holes provided in the support body Pr may differ. By using one of the screw holes 212 of the sensor contact portion 211 provided at the top, it is possible to fix the same image sensor 100 to a support body Pr provided with mounting holes at different pitches.

[0044] For example, the image sensor 100 may be screwed into one of the screw holes 212 of the upper sensor contact portion 211 and into the screw holes 212 of the central sensor contact portion 211 or the lower sensor contact portion 211. In this case, a common image sensor 100 can be attached to four types of support bodies Pr having different mounting hole pitches. Furthermore, the image sensor 100 can also be screwed into the screw hole 212 of the central sensor contact portion 211 and the screw hole 212 of the lower sensor contact portion 211. This allows attachment to support bodies Pr having mounting holes with even different pitches.

[0045] That is, the image sensor 100 shown in this embodiment can be attached to seven types of support bodies Pr having different mounting hole pitches. Note that the central and lower sensor contact portions 211 may be configured to have multiple screw holes 212. In this case, the image sensor 100 can be attached to a support body Pr having mounting holes at yet another pitch.

[0046] Heat from each part of the image sensor housing 200 is conducted to the rear surface part 210. In addition, although details will be described later, heat generated by the operation of the IC 500 attached to the main board 280 arranged in the internal space IS is also conducted to the rear surface part 210 via the first thermal conduction member 501 and the second thermal conduction member 502.

[0047] The image sensor housing 200 is attached to the support body Pr with the sensor contact portion 211 in contact with the support body Pr. As a result, heat conducted to the image sensor housing 200 is conducted to the support body Pr via the sensor contact portion 211. Because the sensor contact portion 211 is in direct contact with the support body Pr, heat can be conducted to the support body Pr efficiently.

[0048] The rear surface 210 of the image sensor housing 200 is provided with a rear sensor connector hole 213, a positioning portion 214, and a lid mounting portion 215. The rear sensor connector hole 213 is a hole that penetrates in the front-rear direction, and is formed at a position that overlaps in the front-rear direction with a rear sensor connector 611 (described below) that is attached to the main board 280. The rear sensor connector 611 is connected to the communication unit 22.

[0049] The image sensor 100 according to this embodiment can be connected to an external unit disposed on the rear surface part 210 or the front surface part 240. The external unit connected to the rear surface part 210 is, for example, a communication unit 700, which will be described later. The external unit connected to the front surface part 240 is, for example, a lighting unit. The external unit connected to the image sensor 100 is not limited to the communication unit 700 and the lighting unit. Here, a configuration in which the communication unit 700 attached to the rear surface part 210 is attached as the external unit will be described as an example.

[0050] The rear sensor connector 611 is electrically connected to a communication unit connector 721 (described later) provided in the communication unit 700. The communication unit connector 721 is connected to a communication unit control unit 720 provided in the communication unit 700, and connecting the rear sensor connector 611 and the communication unit connector 721 enables mutual communication between the image sensor control unit 21 of the image sensor 100 and the communication unit control unit 720 of the communication unit 700. Note that the rear sensor connector 611 may be configured to be capable of simultaneously transmitting multiple signals of different bands. In addition, the rear sensor connector 611 is also connected to a power source 23, and is configured to be able to supply power from the power source 23 to the communication unit 700.

[0051] The positioning portion 214 has a recessed shape that opens to the rear surface portion 210. A positioning protrusion 713 (described later) provided on the communication unit 700 is inserted into the positioning portion 214. Two positioning portions 214 are provided on the rear surface portion 210 of the image sensor housing 200. The positioning protrusion 713 is inserted into each of the two positioning portions 214. This positions the communication unit 700 relative to the rear surface portion 210. Note that the number of positioning portions 214 is not limited to two, as long as there is more than one. Furthermore, the shape of the positioning portion 214 may be an oval, a polygon, or another shape that prevents the communication unit 700 from rotating relative to the rear surface portion 210. In this case, the number of positioning portions 214 may be one.

[0052] When the communication unit 700 is attached to the rear surface portion 210, the communication unit connector 721 passes through the rear sensor connector hole 213 and is electrically connected to the rear sensor connector 611. The rear sensor connector hole 213 has a rectangular shape in rear view. Therefore, when the communication unit connector 721 passes through the rear sensor connector hole 213, interference of the communication unit connector 721 with the rear surface portion 210 is suppressed.

[0053] 12 and other figures, a rear sensor connector sealing member 612 is attached to the periphery of the rear sensor connector hole 213. The rear sensor connector sealing member 612 is made of, for example, silicone rubber, rubber, or other elastically deformable material that can prevent the intrusion of water, dirt, dust, and the like. In the image sensor 100, the rear sensor connector sealing member 612 is a rectangular ring-shaped member that overlaps the shape of the rear sensor connector hole 213, and has a groove that is recessed inward and continues circumferentially on its outer periphery. The rear sensor connector sealing member 612 is attached to the back surface portion 210 by inserting the peripheral portion of the rear sensor connector hole 213 into the groove of the rear sensor connector sealing member 612.

[0054] A rear sensor connector lid 613 is detachably attached to the rear surface portion 210. The rear sensor connector lid 613 can close the rear sensor connector hole 213. FIG. 16 is a view of the rear sensor connector lid 613 as seen from the inside surface side. The rear sensor connector lid 613 fits into a lid mounting portion 215 provided on the outer surface 217 of the rear surface portion 210. When attached to the lid mounting portion 215, the rear sensor connector lid 613 is fixed to the rear surface portion 210 with screws Bt. Note that the sensor contact portion 211 is also provided on the lid mounting portion 215 on the rear surface portion 210.

[0055] In this case, the rear sensor connector lid 613 is provided with a contact portion through-hole 616. The sensor contact portion 211 passes through the contact portion through-hole 616. As a result, when the rear sensor connector lid 613 is fixed to the rear surface portion 210, the sensor contact portion 211 provided on the lid attachment portion 215 can be exposed to the outside. Therefore, when the image sensor 100 is fixed to the support body Pr with the rear sensor connector lid 613 attached to the lid attachment portion 215, the sensor contact portion 211 can be brought into contact with the support body Pr. In addition, a screw hole 212 is formed in the sensor contact portion 211, which can be used for screwing when fixing the image sensor housing 0200 to the support body Pr.

[0056] As shown in FIGS. 12 and 16 , when the rear sensor connector cover 613 is attached to the cover attachment portion 215, a pressing portion 615 is provided on an inner surface 614 that faces the rear surface portion 210. The pressing portion 615 has a shape that overlaps with the rear sensor connector sealing member 612 in a plan view. After the rear sensor connector cover 613 is attached to the cover attachment portion 215 of the rear surface portion 210, the rear sensor connector cover 613 is pressed against the rear surface portion 210 with the screws Bt, causing the pressing portion 615 to press the rear sensor connector sealing member 612. This causes the rear sensor connector sealing member 612 to elastically deform. The rear sensor connector sealing member 612 then comes into close contact with the pressing portion 615 and the edge of the rear sensor connector hole 213 of the rear surface portion 210. As a result, intrusion of foreign matter such as water, dirt, and dust through the rear sensor connector hole 213 is suppressed.

[0057] The rear sensor connector lid 613 may be made of a material such as silicone resin, epoxy resin, or ABS resin that has a lower thermal conductivity than the metal that constitutes the image sensor housing 200. In this case, the material may be the same as or different from the material of the cover member 400 described above. The rear sensor connector lid 613 may also be made of the same metal material as the image sensor housing 200.

[0058] (Left side part 220 and right side part 230) The left side surface portion 220 and the right side surface portion 230 are both adjacent to the front surface portion 240, but are arranged so as not to be adjacent to each other. In other words, the left side surface portion 220 and the right side surface portion 230 are formed contiguous with each of the pair of long sides of the rectangular front surface portion 240. The lower ends of the left side surface portion 220 and the right side surface portion 230 slope upward toward the rear. This sloped portion is adjacent to the sloped surface portion 270. The left side surface portion 220 constitutes the left side surface of the image sensor housing 200, and the right side surface portion 230 constitutes the right side surface of the image sensor housing 200. Therefore, due to the positional relationship of the left side surface portion 220 and the right side surface portion 230 with respect to the front surface portion 240, which constitutes the front surface of the image sensor housing 200, the right side surface and the left side surface of the image sensor housing 200 are paired surfaces that intersect with the front surface of the image sensor housing 200 and face in different directions.

[0059] 2, 3, 4, 7, 9, etc., a left lamp 221 is provided at the corner where the upper end of the left side surface portion 220 intersects with the left end of the top surface portion 250. Also, as shown in Figures 2, 3, 4, 7, 10, etc., a right lamp 231 is provided at the corner where the upper end of the right side surface portion 230 intersects with the right end of the top surface portion 250.

[0060] 2, the left lamp 221 and the right lamp 231 are connected to the image sensor control unit 21. The left lamp 221 and the right lamp 231 are controlled by the image sensor control unit 21 to be turned on or off.

[0061] The left lamp 221 and the right lamp 231 may be configured to use, for example, a light emitting element such as an LED, an organic EL, etc. However, the left lamp 221 and the right lamp 231 are not limited to these elements.

[0062] The left lamp 221 and the right lamp 231 are configured to emit, for example, green light, which is a first color light, and red light, which is a second color light different from the first color. The image sensor control unit 21 controls the left lamp 221 and the right lamp 231 to emit light of the first color when the image sensor 100 is in an operable state, such as when the imaging unit 1 is capable of imaging or communication. The image sensor control unit 21 also controls the left lamp 221 and the right lamp 231 to emit light of the second color when the image sensor 100 is in operation, such as during imaging, image processing, communication, etc.

[0063] The image sensor control unit 21 controls the light emission of the left lamp 221 and the right lamp 231, so that the state of the image sensor 100, such as operable or in operation, can be notified to the outside.

[0064] In the present embodiment, the left lamp 221 and the right lamp 231 are configured to emit light of the same color, but the present invention is not limited to this and may emit light of different colors. The image sensor control unit 21 may be configured to be able to control not only the turning on and off of the left lamp 221 and the right lamp 231 but also the blinking. The image sensor control unit 21 may also control the emission of light by the left lamp 221 and the right lamp 231 when a communication unit 700 (described later) is connected to the image sensor 100 and communication is performed via the communication unit 700. The above-described light emission operation of the left lamp 221 and the right lamp 231 is an example and is not limited to this operation.

[0065] (Front section 240) When viewed from the rear, the front surface portion 240 has a shape that roughly matches the shape of the rear surface portion 210 and the inclined surface portion 270, i.e., a rectangular shape with the longitudinal direction extending in the vertical direction. The front surface portion 240 and the rear surface portion 210 are surface portions on opposite sides of the image sensor housing 200. The front surface portion 240 has a front protrusion portion 241 that protrudes forward from the top. The front protrusion portion 241 is cylindrical with a bottom surface at the front.

[0066] The front surface of the front convex portion 241 is provided with an imaging hole 244 and four light source holes 245. The imaging hole 244 is a through hole. In the internal space IS, a lens unit 11f is arranged behind the imaging hole 244. The sub-substrate 290 has a through hole. When viewed from the front, the through hole of the sub-substrate 290 overlaps with the CMOS sensor 11c from front to back. The lens unit 11f is arranged to pass through the through hole of the sub-substrate 290. Then, an image of the workpiece W (light reflected from the surface of the workpiece W) enters the lens unit 11f arranged in the internal space IS of the image sensor housing 200 through the imaging hole 244. The image of the workpiece W incident from the imaging hole 244 is optically modulated as it passes through the lens unit 11f and is incident in a focused state on the CMOS sensor 11c.

[0067] A plate-shaped transparent cover made of a light-transmitting material such as glass is attached to the imaging hole 244. Attaching the transparent cover prevents the intrusion of foreign matter such as dust, dirt, and moisture. The transparent cover and the image sensor housing 200 are preferably sealed and fixed with a sealing material such as an adhesive or a sealant. If foreign matter is unlikely to intrude, the sealing material may be omitted. Alternatively, an optical element such as an optical filter that can block light of a specific wavelength or phase may be used as the sealing material. The sealing material provided in the imaging hole 244 may be an optical element having optical functions equivalent to those of a convex or concave lens.

[0068] Furthermore, each of the four light source holes 245 is an independent through hole. In the internal space IS, the LED 10a of the lighting module 10 is arranged behind the light source holes 245. The illumination light emitted from the LED 10a passes through the light source holes 245 and is irradiated onto the workpiece W. Similar to the imaging hole 244, a translucent sealant is arranged in each light source hole 245. Note that the sealant used in the light source holes 245 may be an optical element having properties similar to those used in the imaging hole 244. Alternatively, it may be an optical element having properties that concentrate light on the workpiece W.

[0069] In the image sensor 100, by irradiating illumination light from the four light source holes 245, it is possible to prevent shadows from being formed on at least the imaged surface of the workpiece W. Note that the number of light source holes 245 is not limited to four as long as the configuration can prevent shadows from being formed on the imaged surface of the workpiece W.

[0070] In the image sensor 100, an external unit can be connected to the front part 240 in addition to the rear part 210. A front sensor connector 621 having a configuration similar to that of the rear sensor connector 611 is disposed on the sub-substrate 290. The front sensor connector 621 is electrically connected to a wiring pattern provided on the sub-substrate 290 to form an electric circuit. A front sensor connector hole 242 penetrating from front to back is formed in a position overlapping with the front sensor connector 621 (described later) in the front-to-rear direction at the bottom of the front protrusion 241 of the front part 240. The front sensor connector hole 242 has a configuration similar to that of the rear sensor connector hole 213. A front sensor connector sealing member 622 having a configuration similar to that of the rear sensor connector sealing member 612 is also attached to the front sensor connector hole 242.

[0071] 17 is a view of the front sensor connector lid 623 as seen from the inner surface side. The front sensor connector lid 623, which covers the front sensor connector hole 242, is detachably attached to the front surface part 240. The basic configuration of the front sensor connector lid 623 is the same as that of the rear sensor connector lid 613. Therefore, an inner surface 624 of the front sensor connector lid 623 is provided with a pressing part 625 that presses the front sensor connector sealing member 622. A lid mounting part 243 is provided on the front surface part 240. By fixing the front sensor connector lid 623 to the lid mounting part 243 with screws Bt, the pressing part 625 deforms the front sensor connector sealing member 622. This makes it possible to prevent foreign matter such as water, dust, and dirt from entering the internal space IS of the image sensor housing 200.

[0072] (Top part 250, bottom part 260) The upper surface portion 250 and the lower surface portion 260 constitute the upper and lower surfaces of the image sensor housing 200. The area of ​​the lower surface portion 260 is smaller than that of the upper surface portion 250. The lower surface portion 260 is adjacent to the left side surface portion 220, the right side surface portion 230, the front surface portion 240, and the inclined surface portion 270.

[0073] 7, an upper surface lamp 251 is provided in the left-right center of an upper surface 250 of the image sensor 100. The upper surface 250 has a recess 253 covered by a light-transmitting cover 252, and the upper surface lamp 251 is disposed in the recess 253 covered by the cover 252. The upper surface lamp 251 emits red light when power is supplied to the image sensor 100 and the image sensor 100 is in an off state, i.e., in a standby state, and emits green light when the image sensor 100 is in an on state. The light-emitting operation of the upper surface lamp 251 described above is an example and is not limited to this operation.

[0074] (Slope section 270) The inclined surface portion 270 is inclined so that the lower side of the inclined surface portion 270 faces forward and is in contact with the lower end of the rear surface portion 210. The inclined surface portion 270 can also be said to be configured by bending the lower end of the rear surface portion 210 at 45 degrees. The external connection portion 300 is disposed opposite the outer surface of the inclined surface portion 270.

[0075] (Main board 280 and sub board 290) As shown in FIG. 11 and other figures, in the internal space IS, the main board 280 is disposed so that one surface faces the inner surface 218 of the rear part 210. An IC 500, a rear sensor connector 611, and a CMOS sensor 11c are disposed on the main board 280. The IC 500 and the rear sensor connector 611 are disposed on the rear surface of the main board 280, i.e., the surface facing the inner surface 218 of the rear part 210. The CMOS sensor 11c is disposed on the front surface of the main board 280. The rear sensor connector 611 and the CMOS sensor 11c are each connected to the IC 500, i.e., the image sensor control unit 21, via wiring patterns provided on the main board 280. The rear sensor connector 611 is also connected to the power supply 23 via a wiring pattern.

[0076] The IC 500 is a processing unit that performs image processing, controls each unit, etc. Therefore, when the image sensor 100 operates, the IC 500 generates heat due to the supply of power. Furthermore, in recent years, the amount of calculations required in the image sensor 100 has increased due to the higher resolution of image data. Therefore, there is a growing demand for faster calculation processing in the IC 500. For this reason, an inference accelerator is used as the accelerator 21c of the image sensor control unit 21 included in the IC 500. The use of an inference accelerator results in a larger amount of heat generation compared to conventional calculation elements.

[0077] In the image sensor 100 according to this embodiment, heat from the IC 500 is conducted to the image sensor housing 200 and released to the outside of the image sensor housing 200, thereby suppressing a temperature rise in the internal space IS. A first thermal conduction member 501 and a second thermal conduction member 502 are used to efficiently conduct the heat from the IC 500 to the image sensor housing 200. The first thermal conduction member 501 is arranged so as to be in surface contact with the IC 500 arranged on the main board 280.

[0078] The first thermally conductive member 501 is made of a resin material such as silicone resin, polyamide resin, polycarbonate resin, polyester resin, acrylic resin, or rubber, mixed with a filler such as carbon fiber, magnesium oxide, magnesium hydroxide, anhydrous magnesium carbonate, aluminum oxide, aluminum nitride, silica, or boron nitride. A member for improving thermal conductivity, such as thermally conductive grease, may be interposed between the first thermally conductive member 501 and the IC 500.

[0079] While the first thermally conductive member 501 has high thermal conductivity, it may also be electrically conductive due to the influence of the filler. Therefore, in the image sensor 100 according to this embodiment, the second thermally conductive member 502, which has insulating properties, is disposed between the first thermally conductive member 501 and the image sensor housing 200. In this manner, heat generated in the IC 500 is conducted sequentially through the first thermally conductive member 501 and the second thermally conductive member 502, and then conducted to the image sensor housing 200.

[0080] At this time, the second thermal conductive member 502 also maintains insulation between the image sensor housing 200 and the IC 500. The thermal conductivity of the second thermal conductive member 502 is lower than that of the first thermal conductive member 501. Therefore, the second thermal conductive member 502 is formed to be thinner than the first thermal conductive member 501. Furthermore, the thickness of the second thermal conductive member 502 only needs to be thick enough to reliably insulate the image sensor housing 200 and the IC 500.

[0081] Both the first thermal conduction member 501 and the second thermal conduction member 502 are made of an elastically deformable resin. The first thermal conduction member 501 and the second thermal conduction member 502 are arranged between the image sensor housing 200 and the IC 500 in an elastically deformed state. As a result, the first thermal conduction member 501 and the second thermal conduction member 502 are in close contact with each other due to their restoring forces. Similarly, the first thermal conduction member 501 is in close contact with the IC 500, and the second thermal conduction member 502 is in close contact with the image sensor housing 200. This allows the heat of the IC 500 to be efficiently conducted to the image sensor housing 200. As a result, the temperature rise in the internal space IS of the image sensor housing 200 can be suppressed.

[0082] The first thermally conductive member 501 and the second thermally conductive member 502 may be arranged in a state where they are not elastically deformed. Even in this case, the first thermally conductive member 501 and the second thermally conductive member 502 expand due to the heat from the IC 500 and the heat in the internal space IS of the image sensor housing 200. This causes the first thermally conductive member 501 to be pressed against the IC 500. Furthermore, the second thermally conductive member 502 is in close contact with the image sensor housing 200. This allows the heat from the IC 500 to be efficiently conducted to the image sensor housing 200.

[0083] In the above description, the IC 500 is a heat-generating element, but this is not limiting. For example, elements such as the DSP 21a, FPGA 21b, and accelerator 21c of the image sensor control unit 21 of the control unit 2 may be configured as separate chips from the IC 500 and may also be heat-generating elements. In such cases, the heat from the heat-generating elements may be conducted to the image sensor housing 200 using the first thermal conductive member 501 and the second thermal conductive member 502. Similarly, in a configuration in which the imaging unit 1 includes elements such as a DSP and an FPGA, even if these elements are heat-generating elements, the heat from these elements may be similarly conducted to the image sensor housing 200. Note that in the image sensor 100, when the main board 280 is configured, elements that may be heat-generating elements are arranged to face the inner surface 218 of the rear surface portion 210. The heat generated from the elements that may be heat-generating elements is conducted to the rear surface portion 210 via the first thermal conductive member 501 and the second thermal conductive member 502.

[0084] (External connection unit 300) 18 is a perspective view of the image sensor 100 seen from above and behind with the external connection unit 300 moved to the second position P2. As shown in FIG. 12, the external connection unit 300 includes an external connection unit housing 310. The external connection unit housing 310 has a trapezoidal pillar shape when viewed from the side. The external connection unit housing 310 is made of the same metal material as the image sensor housing 200, but may be made of a different material.

[0085] External connection unit casing 310 includes opposing surface 311 that faces inclined surface 270. Opposing surface 311 is connected to inclined surface 270 via rotation shaft 312. External connection unit 300 is rotatable around rotation shaft 312.

[0086] External connection unit housing 310 has connection surface 313 that forms a surface that is not adjacent to opposing surface 311. External connection plugs 330, 340 are attached to connection surface 313. External connection plugs 330, 340 have a portion that is exposed to the outside and a portion that is disposed inside external connection unit housing 310. The portion that is disposed inside external connection unit housing 310 is electrically connected to at least one of main board 280 and sub-board 290 via an inner wire (not shown).

[0087] In the image sensor 100, a communication cable Cn is connected to the external connection plug 330 and is used for data communication. A power cable Cp is connected to the external connection plug 340 and is used for power supply. Note that a heat insulator is disposed between the external connection plugs 330 and 340 and the external connection unit housing 310, in other words, the image sensor housing 200. This suppresses the conduction of heat from the image sensor housing 200 to the external connection plugs 330 and 340. This allows general-purpose communication cables Cn and power cables Cp to be connected to the external connection plugs 330 and 340, even if the temperature of the image sensor housing 200 rises due to an increase in power consumption of the image sensor 100.

[0088] In the image sensor 100 of this embodiment, the external connection plug 330 is for communication and the external connection plug 340 is for power, but this is not limiting. For example, if the image sensor control unit 21, communication unit 22, and power supply 23 of the image sensor 100 are compatible with a network that supports power supply such as PoE (Power over Ethernet), a cable used for both data communication and power supply may be connected to at least one of the external connection plugs 330, 340.

[0089] The number of external connection plugs of the image sensor 100 is not limited to two, and three or more external connection plugs may be provided. When three or more external connection plugs are provided, one of the external connection plugs may be the external connection plug 340 for power supply, and the remaining external connection plugs may be the external connection plug 330 for communication. At least one external connection plug may be used for both data communication and power supply.

[0090] The rotating shaft 312 is cylindrical, and the inner wire passes through its internal space. The inner wire is not fixed at its middle portion and is flexible. Therefore, even when the external connection unit 300 rotates, the connection state between the external connection plugs 330, 340 and the main board 280 or the sub-board 290 is maintained.

[0091] In the image sensor 100, by rotating the external connection unit 300 about the rotation shaft 312, the external connection plugs 330, 340 can be rotated between a first position P1 (see FIG. 3) where they extend downward and a second position P2 (see FIG. 18) where they extend rearward. In this way, even if there is an obstacle below the image sensor 100, the external connection plugs 330, 340 can be positioned to avoid the obstacle by rotating the external connection unit 300. This increases the degree of freedom in wiring the cables connected to the external connection plugs 330, 340. Furthermore, by changing the direction of the external connection plugs 330, 340, the connection positions of the cables can be changed, and the cables can also be shortened.

[0092] The external connection unit 300 includes an external connection unit cover 350. The external connection unit cover 350 covers a portion of the external connection unit housing 310. The external connection unit cover 350 is made of a material such as silicone resin, epoxy resin, or ABS resin that has a lower thermal conductivity than the metal that makes up the external connection unit housing 310. This makes it difficult for the user's hands to directly touch the external connection unit 300, and keeps the temperature that the user feels low.

[0093] (Cover member 400) As shown in Fig. 14, the cover member 400 is detachably attached to the image sensor housing 200. The cover member 400 includes a first cover portion 410, a second cover portion 420, and a third cover portion 430. The first cover portion 410 has a rectangular shape with its longitudinal direction extending vertically when viewed from the rear side. The second cover portion 420 and the third cover portion 430 are formed continuous with the portions that form the long sides of the first cover portion 410. In other words, in the cover member 400, the first cover portion 410, the second cover portion 420, and the third cover portion 430 are formed as a single member.

[0094] When the cover member 400 is attached to the image sensor housing 200, the first cover part 410 covers a part of the back part 210. The second cover part 420 covers a part of the left side part 220, and the third cover part 430 covers a part of the right side part 230.

[0095] The cover member 400 is made of a material such as silicone resin, epoxy resin, or ABS resin, which has a lower thermal conductivity than the metal constituting the image sensor housing 200. Being made of resin, the cover member 400 is elastically deformable. When the cover member 400 is attached to the image sensor housing 200, the second cover portion 420 and the third cover portion 430 press against the left side surface portion 220 and the right side surface portion 230 due to the elastic force of the cover member 400. Note that, although the cover member 400 is fixed to the image sensor housing 200 by the elastic force in this embodiment, this is not limiting. For example, the cover member 400 may be fixed to the image sensor housing 200 by engaging with an engaging portion, using screws, or other fixing methods.

[0096] The first cover part 410 has a contact part through-hole 411 and a lid through-hole 412. The contact part through-hole 411 is provided at a position where the sensor contact part 211 of the first cover part 410 passes through when the cover member 400 is attached to the image sensor housing 200. When the cover member 400 is attached to the image sensor housing 200, the sensor contact part 211 passes through the contact part through-hole 411 and protrudes rearward beyond the first cover part 410. This makes it possible to attach the image sensor 100 to the support body Pr with the cover member 400 attached to the image sensor housing 200, and to bring the sensor contact part 211 into contact with the support body Pr. In other words, even when the image sensor 100 is attached to the support body Pr with the cover member 400 attached, heat from the image sensor housing 200 is efficiently conducted to the support body Pr.

[0097] When the cover member 400 is attached to the image sensor housing 200, the rear sensor connector lid 613 passes through the lid through-hole 412. In other words, with the cover member 400 attached to the image sensor housing 200, the rear sensor connector lid 613 can be attached to and detached from the lid attachment portion 215 of the back surface portion 210.

[0098] The rear surface 210 of the image sensor housing 200 is fixed to a support Pr such as a frame of an apparatus equipped with the transport means A. This allows heat from the rear surface 210 to be efficiently conducted to the support Pr via the sensor contact portion 211. As a result, it is possible to suppress a rise in temperature inside the image sensor 100.

[0099] Furthermore, as described above, the image sensor 100 may be PoE-compatible. When power is supplied via PoE, a higher voltage is supplied to the image sensor 100 than when only power is supplied via the power cable Cp. In other words, a high voltage is also applied to the elements provided inside the image sensor 100 via PoE, resulting in a larger amount of heat generated by the image sensor 100. In addition, the amount of heat generated by the IC 500 often increases. As described above, the sensor contact portion 211 of the image sensor housing 200 contacts the support body Pr. This allows heat accumulated in the internal space IS of the image sensor housing 200 and heat generated by heat-generating elements such as the IC 500 to be efficiently conducted to the support body Pr, thereby suppressing a rise in temperature inside the image sensor 100.

[0100] A user may hold the image sensor 100 during operation or immediately after it has stopped operating. When holding a member shaped like the image sensor housing 200, the user supports the back surface 210 with the palm of their hand, supports one of the left side surface 220 and the right side surface 230 with their thumb, and supports the other of the left side surface 220 and the right side surface 230 with all or some of their remaining fingers.

[0101] At this time, the user's palm and fingers come into contact with the cover member 400. This keeps the user's perceived temperature low. In addition, because the user's perceived temperature is kept low, the user is less likely to mistakenly recognize that there is an abnormality in the image sensor 100 due to a rise in temperature. For these reasons, use of the image sensor 100 of this embodiment can improve user convenience.

[0102] When holding the image sensor 100, the user often avoids touching the image capture hole 244 and the light source hole 245, through which the image of the workpiece W is incident. In other words, the front surface 240 of the image sensor housing 200 is rarely touched by the user. For this reason, the cover member 400 is configured not to cover the front surface 240. In this way, heat from the image sensor housing 200 is more easily released to the outside from the front surface 240, and the temperature rise of the image sensor 100 can be suppressed.

[0103] In the image sensor 100 of this embodiment, the second cover portion 420 and the third cover portion 430 of the cover member 400 cover the portions of the left side surface portion 220 and the right side surface portion 230 of the image sensor housing 200 that are formed on the rear frame 201. However, this configuration is not limited thereto, and the cover member 400 may cover at least a part of the portions of the left side surface portion 220 and the right side surface portion 230 that are formed on the front frame 202. Furthermore, in the portions of the left side surface portion 220 and the right side surface portion 230 that are not covered by the cover member 400, a member made of a material with a lower thermal conductivity than the metal material that forms the image sensor housing 200, such as a heat insulating sheet, may be disposed.

[0104] Furthermore, if the image sensor 100 is lightweight, the user can hold the image sensor 100 with just their fingers. In this case, the user's palm does not touch the image sensor 100. The weight of the image sensor 100 varies depending on the user. Therefore, the cover member 400 provided on the image sensor 100 may be configured to include at least a second cover portion 420 that covers the left side surface portion 220 of the image sensor housing 200 and a third cover portion 430 that covers the right side surface portion 230. However, in consideration of the possibility of contact with the palm, the cover member 400 preferably includes a first cover portion 410 that covers the back surface portion 210. Furthermore, the first cover portion 410 integrally forms the second cover portion 420 and the third cover portion 430, making the cover member 400 easier to handle. For this reason as well, the cover member 400 preferably includes the first cover portion 410.

[0105] (Communication unit 700) A communication unit 700 can also be connected to the image sensor 100. FIG. 19 is a block diagram of the image sensor 100 to which the communication unit 700 is attached. FIG. 20 is a perspective view of the image sensor 100 to which the communication unit 700 is attached, viewed from above and behind. FIG. 21 is a cross-sectional view of the image sensor 100 to which the communication unit 700 is attached. FIG. 22 is a perspective view of the communication unit 700 separated from the image sensor 100. FIG. 23 is a perspective view of the communication unit 700 to which the communication unit cover member 730 is separated, viewed from above and behind. FIG. 24 is a perspective view of the communication unit 700 to which the communication unit cover member 730 is separated, viewed from above and behind. FIG. 25 is a perspective view of the communication unit 700 to which the external communication connection portion 740 has been moved to the fourth position P4, viewed from above and behind. Note that the front, rear, left, and right directions of the communication unit 700 are based on the state in which the communication unit 700 is attached to the rear portion 210 of the image sensor housing 200.

[0106] 19, the communication unit 700 is provided with a communication unit control unit 720. The communication unit 700 is controlled by the communication unit control unit 720. The communication unit 700 has a communication unit connector 721, which is connected to the communication unit control unit 720. When the communication unit 700 is attached to the image sensor, the communication unit connector 721 is coupled to the rear sensor connector 611. Connecting the communication unit connector 721 to the rear sensor connector 611 enables mutual communication between the image sensor control unit 21 of the image sensor 100 and the communication unit control unit 720 of the communication unit 700.

[0107] That is, the communication unit connector 721, when connected to the rear sensor connector 611, enables data transmission between the image sensor control unit 21 and the communication unit control unit 720. Furthermore, power is supplied to the communication unit 700 from the power supply 23 of the image sensor 100 through the connection between the rear sensor connector 611 and the communication unit connector 721. By directly connecting the communication unit connector 721 of the communication unit 700 to the rear sensor connector 611 of the image sensor 100, the number of cables connecting the image sensor 100 and the communication unit 700 can be reduced.

[0108] 19, 23, and 24, the communication unit 700 includes a communication unit housing 710, a communication unit cover member 730, and an external communication connection section 740. The communication unit housing 710 is formed of the same metal material as the image sensor housing 200, but is not limited to this. The communication unit housing 710 is a rectangular parallelepiped box. A main board 750 and a sub-board 760 are provided in an internal space IS1 of the communication unit housing 710. The sub-board 760 is disposed forward of the main board 750. A communication unit connector 721 is attached to the sub-board 760. The communication unit connector 721 is electrically connectable to the rear sensor connector 611 provided in the image sensor 100. An IC (not shown) constituting a control section for controlling the communication unit 700 is attached to the main board 750 or the sub-board 760.

[0109] The communication unit housing 710 has a front surface 711. When viewed from the front side, the front surface 711 has a rectangular shape with the longitudinal direction extending vertically. The front surface 711 is provided with two contact protrusions 712 and two positioning protrusions 713. The two contact protrusions 712 protrude forward from both left and right ends of the front surface 711. The cover mounting portion 215 of the image sensor 100 is provided with a contact surface 216. When the communication unit housing 710 is attached to the rear surface 210 of the image sensor housing 200, the tip of the contact protrusion 712 comes into surface contact with the contact surface 216. In addition, a screw Bt protrudes from the tip of the contact protrusion 712. By screwing the screw Bt into a screw hole 219 provided in the contact surface 216, the communication unit 700 is firmly fixed to the image sensor 100.

[0110] The front surface 711 is also provided with a pressing protrusion 714 that protrudes forward. The communication unit connector 721 protrudes forward of the pressing protrusion 714. The pressing protrusion 714 presses the rear sensor connector sealing member 612 when the communication unit connector 721 is connected to the rear sensor connector 611.

[0111] The positioning protrusions 713 protrude forward from the front surface 711. The positioning protrusions 713 are provided at positions that overlap the positioning portions 214 in the front-to-rear direction when the communication unit 700 is disposed behind the image sensor 100. Two positioning protrusions 713 are provided on the front surface 711.

[0112] Like the cover member 400, the communication unit cover member 730 is made of a material such as silicone resin, epoxy resin, or ABS resin, which has a lower thermal conductivity than the metal that makes up the communication unit housing 710. This keeps the temperature that the user's hand feels low even when the user's hand touches the communication unit 700. This improves user convenience.

[0113] Four communication unit contact portions 717 that protrude rearward are provided on the rear surface 716 of the communication unit housing 710. When the communication unit 700 is attached to the image sensor 100, the communication unit contact portions 717 of the communication unit housing 710 are positioned so as to overlap, in the front-to-rear direction, with the sensor contact portions 211 on the rear surface 210 of the image sensor housing 200. The communication unit cover member 730 has contact portion through-holes 731. The contact portion through-holes 731 are formed at positions that allow the communication unit contact portions 717 to pass through.

[0114] With the communication unit cover member 730 attached to the communication unit housing 710, the communication unit 700 can be fixed using the attachment holes provided in the support body Pr. Therefore, there is no need to prepare a separate jig for attaching the communication unit 700 to the support body.

[0115] In other words, the communication unit contact portion 717 of the communication unit 700 and the sensor contact portion 211 of the image sensor 100 are positioned so that they overlap front to back. This ensures that the center of the field of view of the image sensor 100 when the image sensor 100 with the communication unit 700 attached is attached to the support body Pr coincides with the center of the field of view when only the image sensor 100 is attached to the support body Pr. Therefore, even when the communication unit 700 is attached, there is no need to adjust the center of the field of view. This also makes it possible to improve user convenience.

[0116] The external communication connection unit 740 includes an external communication connection unit housing 741. The external communication connection unit housing 741 has a trapezoidal pillar shape when viewed from the side. The external communication connection unit housing 741 is made of the same metal material as the communication unit housing 710, but is not limited to this.

[0117] The external communication connection unit housing 741 has a facing surface portion 742, which faces an inclined surface portion 719 provided at the lower end of the communication unit housing 710. The facing surface portion 742 is connected to the inclined surface portion 719 via a rotation shaft 743. The external communication connection unit 740 is rotatable around the rotation shaft 743.

[0118] The external communication connection unit housing 741 has a connection surface 744 that forms a surface that is not adjacent to the opposing surface 742. Two communication plugs 745 are attached to the connection surface 744. A portion of the communication plug 745 is exposed to the outside of the external connection unit housing 741. A communication cable is connected to the communication plug 745 and is used for data communication. The communication plug 745 may be connectable to a cable that can perform data communication and also supply power. The communication unit 700 of this embodiment is configured to include two communication plugs 745, but is not limited to this. For example, the communication unit 700 may be configured to include three or more communication plugs 745. By configuring the communication unit 700 to include three or more communication plugs 745, it becomes possible to use a connection method other than a daisy chain connection.

[0119] The communication plug 745 and at least one of the main board 750 and the sub-board 760 are connected by an inner wire (not shown). The rotating shaft 743 is cylindrical. The inner wire passes through the internal space of the rotating shaft 743. The inner wire is not fixed at its middle portion and is flexible. Therefore, even when the external communication connection unit 740 rotates, the connection between the communication plug 745 and the main board 750 or the sub-board 760 is maintained.

[0120] External communication connection unit 740 includes external connection unit cover 746. External connection unit cover 746 covers a portion of external communication connection unit housing 741. External connection unit cover 746 is made of a material such as silicone resin, epoxy resin, or ABS resin that has a lower thermal conductivity than the metal that makes up external communication connection unit housing 741. This makes it less likely that the user's hands will directly touch external communication connection unit 740. In addition, the temperature that the user feels is kept low.

[0121] In the communication unit 700, by rotating the external communication connection part 740 about the rotation shaft 743, the communication plug 745 can be rotated between a third position P3 (see FIG. 23, etc.) where the communication plug 745 extends downward and a fourth position P4 where the communication plug 745 extends rearward. This increases the degree of freedom in wiring the cable connected to the communication plug 745. Furthermore, even if there is an obstacle below the communication unit 700, by rotating the external communication connection part 740, the communication plug 745 can be positioned to avoid the obstacle.

[0122] Next, we will explain how to attach the communication unit 700 to the image sensor 100. The communication unit 700 is positioned relative to the image sensor 100 by inserting the two positioning protrusions 713 into the positioning portions 214. This allows the communication unit connector 721 to be inserted into the rear sensor connector hole 213.

[0123] Screw holes for fixing the rear sensor connector cover 613 are provided on the contact surface 216 of the rear part 210 of the image sensor housing 200. By positioning the communication unit 700 on the image sensor 100, the screws Bt protruding from the tips of the contact protrusions 712 overlap with the screw holes 219 provided on the contact surface 216 of the image sensor housing 200 in the front-to-rear direction.

[0124] The screw Bt protruding from the tip of the contact protrusion 712 is screwed into the screw hole 219 provided in the contact surface 216. This firmly fixes the communication unit 700 to the image sensor 100. Also, there is reliable surface contact between the tip of the contact protrusion 712 and the contact surface 216 of the rear surface 210 of the image sensor housing 200. Furthermore, the sensor contact portion 211 on the rear surface 210 of the image sensor housing 200 also comes into contact with the front surface 711 of the communication unit housing 710. This allows heat from the image sensor housing 200 to be efficiently conducted to the communication unit housing 710. After a certain period of time has passed in this state, the temperatures of the image sensor housing 200 and the communication unit housing 710 become uniform.

[0125] Furthermore, when the communication unit 700 is attached to the image sensor 100, the pressing protrusion 714 presses the rear sensor connector sealing member 612. This causes the sensor connector sealing member 612 to tightly contact the rear surface 210 of the image sensor housing 200 and the front surface 711 of the communication unit 700. As a result, foreign matter such as water, dust, and dirt is prevented from entering the internal spaces IS and IS1 through gaps between the rear surface 210 of the image sensor housing 200 and the front surface 711 of the communication unit housing 710.

[0126] 21, 22, etc., the rear sensor connector 611 of the image sensor 100 and the communication unit connector 721 of the communication unit 700 are electrically connected. This allows mutual communication between the image sensor control unit 21 of the image sensor 100 and the communication unit control unit 720 of the communication unit 700. This allows the image sensor 100 to communicate with external devices using the communication unit 700.

[0127] Furthermore, by connecting the rear sensor connector 611 and the communication unit connector 721, it is possible to supply power from the power supply 23 of the image sensor 100 to the communication unit 700. Note that power may be supplied to the communication unit 100 via a communication cable connected to a communication plug 745 using a communication cable that is capable of supplying power as well as data communication.

[0128] Furthermore, the communication unit 700 can be attached to the image sensor 100 with the external communication connection part 740 rotated from the third position P3 to the fourth position P4 (see FIG. 25). At this time, the external connection part 300 of the image sensor 100 may be rotated from the first position P1 to the second position P2 (see FIG. 18) (see FIG. 26). Figure 26 is a perspective view showing a state in which the image sensor 100 with the external connection part 300 moved to the second position P2 is combined with the communication unit 700 with the external communication connection part 740 moved to the fourth position P4.

[0129] With this configuration, when the image sensor 100 is attached to the support Pr, even if there is a structure below the image sensor 100 and the communication unit 700, cables can be connected to the external connection plugs 330, 340 and the communication plug 745. In other words, the degree of freedom in installing the image sensor 100 with the communication unit 700 provided thereon is increased, improving user convenience.

[0130] By using the communication unit 700 as described above, it is possible to reduce the number of cables connecting the communication unit 700 and the image sensor 100. Furthermore, since heat from the image sensor 100 can be conducted to the support Pr via the communication unit 700, it is possible to suppress temperature increases in the image sensor 100 and the communication unit 700.

[0131] Here, the setting of the communication unit 700 will be described. Fig. 27 is a flowchart of the operation for setting the communication unit 700. Fig. 28 is a diagram showing a setting screen Sc1 displayed on the display device 4 when performing extended settings for the image sensor 100. Fig. 29 is a diagram showing the setting screen Sc1 when the communication unit 700 is connected. Fig. 29 is a diagram showing a detailed setting screen Sc2 used when performing settings for the communication unit 700.

[0132] The image sensor 100 is configured to allow the setting of extended functions. The extended functions are set by displaying a setting screen on the display device 4 and operating the touch panel 4a, keyboard 3a, mouse, etc. An example of the setting screen displayed on the display device 4 is a setting screen Sc1 shown in FIG. 28.

[0133] 28 has a plurality of tabs for extended settings such as device settings, image / result output, utility, etc. Each tab has setting items corresponding to the extended functions of the image sensor 100.

[0134] 28 and 29, the settings of the communication unit 700 can be performed on the setting screen Sc1 with the utility tab active. The setting screen Sc1 with the utility tab active has a field network / communication unit setting item. The field network / communication unit setting item has a setting button Bt1.

[0135] When the communication unit 700 cannot be configured, the setting button Bt1 is in an inactive (inoperable) state, as shown in FIG. 28. On the other hand, when the communication unit 700 can be configured, the setting button Bt1 is in an active (operable) state, as shown in FIG. 29. In other words, the setting screen Sc1 is configured to accept operation of the setting button Bt1 only when the communication unit 700 can be configured. Note that even when configuring other extended functions, only items that can be configured can be operated. Furthermore, when there are multiple setting items, the setting screen Sc1 may be configured so that only items that can be configured are active.

[0136] An OK button Bt2 and a Cancel button Bt3 are provided at the bottom of the setting screen Sc1. After operating the Setting button Bt1, operating the OK button Bt2 enables the operation of the Setting button Bt1, i.e., the operation on the setting screen Sc1. Furthermore, after operating the Setting button Bt1, operating the Cancel button Bt3 disables the operation of the Setting button Bt1, i.e., the input on the setting screen Sc1. The operation of enabling or disabling the setting operation is similar for other setting screens.

[0137] For example, suppose that the Set button Bt1 is operated on the setting screen Sc1, and then the OK button Bt2 is operated. At this time, the image sensor control unit 21 sends a control signal to the display device 4 to display the detailed setting screen Sc2 (see FIG. 30).

[0138] As shown in FIG. 30, the detailed setting screen Sc2 has a setting item Mn. The setting item Mn on the detailed setting screen Sc2 shown in FIG. 30 is an item for selecting a communication protocol. Note that on the detailed setting screen Sc2, the setting item Mn may be a setting item other than a communication protocol, or may have multiple setting items. The setting item Mn is provided with a setting operation unit Mn1. On the detailed setting screen Sc2, the setting operation unit Mn1 is a pull-down menu that allows selection from multiple communication protocols, but is not limited to this. It may also be configured to allow the user to input characters. Like the setting screen Sc1, the detailed setting screen Sc2 has an OK button Bt4 and a cancel button Bt5.

[0139] In the image sensor 100, the image sensor control unit 21 has a function that can automatically display an extended function setting screen on the display device 4 when it becomes necessary to set an extended function. For example, when the communication unit 700 is connected to the image sensor 100, a setting screen Sc1 is displayed on the display device 4. To explain in more detail, when the communication unit 700 is connected to the image sensor 100, the communication unit control unit 720 transmits a connection notification signal to the image sensor 100. The connection notification signal includes information that identifies the connected device as the communication unit 700. Therefore, when the image sensor control unit 21 receives the connection notification signal, it transmits a control signal to the display device 4 to display the setting screen Sc1 (see FIG. 29 ). Then, the image sensor control unit 21 accepts an operation input by the user.

[0140] The above-mentioned operation will be described with reference to the drawings. As shown in Fig. 27, when the image sensor control unit 21 receives a connection notification signal (step S101), the image sensor control unit 21 sends a control signal to cause the display device 4 to display the setting screen Sc1 (step S102).

[0141] Then, the image sensor control unit 21 checks whether the setting button Bt1 has been operated (step S103). Whether the setting button Bt1 has been operated and whether the operation is valid is as described above. If the image sensor control unit 21 does not check whether the setting button Bt1 has been operated (No in step S103), the image sensor control unit 21 checks whether the cancel button Bt3 has been operated (step S104). If the image sensor control unit 21 does not check whether the cancel button Bt3 has been operated (No in step S104), the process returns to step S103, and the image sensor control unit 21 continues the process.

[0142] Furthermore, if the image sensor control unit 21 confirms that the cancel button Bt3 has been operated (Yes in step S104), the image sensor control unit 21 ends the setting process. Furthermore, if the image sensor control unit 21 confirms that the set button Bt1 has been operated (Yes in step S103), the image sensor control unit 21 sends a control signal to the display device 4 to display the detail setting screen Sc2 (step S105). As a result, the detail setting screen Sc2 is displayed on the display device 4 (see FIG. 30).

[0143] The image sensor control unit 21 checks whether or not the setting item Mn has been operated (step S106). If the image sensor control unit 21 does not check whether or not the setting item Mn has been operated (No in step S106), the image sensor control unit 21 checks whether or not the cancel button Bt5 has been operated (step S107). If the image sensor control unit 21 does not check whether or not the cancel button Bt5 has been operated (No in step S107), the process returns to step S106, and the image sensor control unit 21 continues the process.

[0144] Furthermore, if the image sensor control unit 21 confirms that the cancel button Bt5 has been operated (Yes in step S107), the image sensor control unit 21 returns to step S102 and displays the setting screen Sc1. Note that if the image sensor control unit 21 confirms that the cancel button Bt5 has been operated in step S107, the image sensor control unit 21 may end the setting process.

[0145] If the image sensor control unit 21 confirms the operation of the setting item Mn (Yes in step S106), the image sensor control unit 21 acquires the setting information set on the detailed setting screen Sc2 (step S108). Then, the image sensor control unit 21 transmits the acquired setting information to the communication unit control unit 720 of the communication unit 700 (step S109). The communication unit control unit 720 of the communication unit 700 sets the communication protocol based on the setting information acquired from the image sensor control unit 21 of the image sensor 100.

[0146] In this way, when the communication unit 700 is connected to the image sensor 100, the user can configure the communication unit 700 using the PC 3 and the display device 4 connected to the image sensor 100. This eliminates the need for the communication unit 700 to be provided with an input unit and a display unit for configuration, simplifying the configuration of the communication unit 700 and making it smaller.

[0147] In the image inspection system S, by attaching a communication unit 700 to the image sensor 100, it is possible to connect the image sensors 100 to each other using the communication unit 700. An example of connecting the image sensors 100 will be described below.

[0148] First, the communication network will be described. The communication network of a factory where the image inspection system S is used is often classified into two communication networks: an IT network 6 and an OT network 7. The IT network 6 is a network that communicates data such as processed data captured by an image sensor 100. The IT network 6 may also be connected to a communication network that connects to an external server (not shown) such as the Internet.

[0149] The OT network 7 is a network (e.g., Profinet) within the factory. The OT network 7 is used to transmit to the PLC 5, for example, a result of a pass / fail judgment of processed data obtained by performing predetermined processing on the image captured by the image sensor 100 and then by the image sensor control unit 21 (e.g., binary data indicating pass / fail). In addition to this, the OT network 7 also transmits data related to the operation of external devices such as the PLC 5. The OT network 7 communicates data necessary for the operation of manufacturing equipment and the manufacturing line.

[0150] Typically, the volume of data transmitted over the IT network 6 is larger than the volume of data transmitted over the OT network 7. Therefore, the communication speed of the IT network 6 is generally higher than the communication speed of the OT network 7.

[0151] (First network connection example) Fig. 31 is a schematic diagram of an image inspection system S1 connected in the first network connection example. As shown in Fig. 31, the image inspection system S1 has multiple image sensors 100, and each image sensor 100 is equipped with a communication unit 700. The communication units 700 are daisy-chained, with their respective communication plugs 745 connected to each other by communication cables Cn. The communication units 700 are connected to the OT network 7 via the communication cables Cn connected to the communication plugs 745. In other words, the image sensors 100 are connected to the OT network 7 via the communication units 700. A PLC 5 is connected to the OT network 7. To explain further, the communication units 700 can also be said to be devices that relay the OT network 7.

[0152] Furthermore, a power cable Cp is connected to the external connection plug 340 of each image sensor 100, and power is supplied to the image sensor 100. Power is supplied to the communication unit 700 from the power supply 23 of the image sensor 100 via the connection between the communication unit connector 721 and the rear sensor connector 611. Furthermore, the external connection plug 330 of each image sensor 100 is connected to the IT network 6 via a communication cable Cn. The PC 3 and the display device 4 are then connected to the communication cable Cn.

[0153] That is, the image sensor 100 is connected to the PC 3 and the display device 4 connected to the IT network 6 via the external connection plug 330. The image sensor 100 is also connected to the PLC 5 connected to the OT network 7 via the communication unit 700. In this way, by using the image inspection system S1, the IT network 6 and the OT network 7 can be connected separately, thereby improving the security of the OT network 7. The PLC 5 is connected to the OT network 7 via a communication router 8.

[0154] (Second network connection example) An image inspection system S2 employing the second network connection example will be described with reference to the drawings. Fig. 32 is a schematic diagram of the image inspection system S2 connected in the second network connection example. In the image inspection system S2 shown in Fig. 32, the image sensor 100 is compatible with a communication line capable of supplying power (PoE). Therefore, in the image inspection system S2, power is supplied to the image sensor 100 via a communication cable Cn1 that is connected to the IT network 6 and is capable of supplying power.

[0155] With this configuration, it is not necessary to connect a power cable to the external connection plug 340 of the image sensor 100, and it is possible to reduce the amount of wiring (hereinafter referred to as wiring reduction).

[0156] (Third network connection example) An image inspection system S3 employing the third network connection example will be described with reference to the drawings. Figure 33 is a schematic diagram of the image inspection system S3 connected in the third network connection example.

[0157] Depending on the manufacturing equipment or production line, there may be cases where separation of the OT network 7 and the IT network 6 is not necessary for security reasons. In networks under such conditions, the IT network 6 and the OT network 7 can share the communication cable Cn. Therefore, the communication unit 700 is assigned the function of an OT network port and the function of an IT network port. This allows the IT network 6 and the OT network 7 to be configured by daisy-chaining the communication units 700 together.

[0158] 33, in the image inspection system S3, a PC 3, a display device 4, and a PLC 5 are connected to one end of a daisy chain connection of a plurality of communication units 700 via a communication router 8. A high-speed IT network 6 is used for communication between the image sensor control unit 21 and the PC 3 and the display device 4 via the communication unit 700, and information such as the inspection results from the image sensor control unit 21 and control signals corresponding to the inspection results is transmitted to the PLC 5 via an OT network 7.

[0159] Fig. 34 is a block diagram showing communication between the image sensor control unit 21 of the image sensor 100 and the communication unit control unit 720 of the communication unit 700. As shown in Fig. 34, in the image inspection system S3, the connection to both the IT network 6 and the OT network 7 is performed by the communication unit 700. Therefore, data transmitted and received over the IT network 6 and data transmitted and received over the OT network 7 are transmitted and received between the image sensor control unit 21 of the image sensor 100 and the communication unit control unit 720 of the communication unit 700.

[0160] 34, in the image inspection system S3, large-volume data such as image data and processing data, and data for which less delay is preferable such as setting data (referred to as IT data) are transmitted between the image sensor control unit 21 and the communication unit control unit 720. Similarly, small-volume data (referred to as OT data) such as inspection results and pass / fail judgment results of the image data of the image sensor control unit 21 are transmitted between the image sensor control unit 21 and the communication unit control unit 720, and a slight delay in communication is tolerated compared to the above-mentioned IT data.

[0161] In this configuration, if the communication speed for all data between the image sensor control unit 21 and the communication unit control unit 720 is set based on the IT data, the speed may be excessive for transmitting OT data. Furthermore, if the communication speed for all data is set based on the OT data, it takes a long time to transmit IT data and is unable to handle data that requires rapid transmission. Therefore, in the image inspection system S3, the image sensor control unit 21 and the communication unit control unit 720 are connected via a first line C1 and a second line C2. The first line C1 is a line that transmits IT data. Furthermore, the second line C2 is a line that transmits OT data.

[0162] The first line C1 and the second line C2 may communicate using a protocol that apparently realizes multiple communications with different communication speeds. The rear sensor connector 611 and the communication unit connector 721 may also include the first line C1 and the second line C2 that are physically independent. In this case, the communication units connected to the first line C1 and the second line C2 may be separate communication units. By physically separating the first line C1, which transmits and receives IT data, and the second line C2, which transmits and receives OT data, communication conflicts are reduced.

[0163] As described above, by connecting the image sensor control unit 21 of the image sensor 100 and the communication unit control unit 720 of the communication unit 700 with multiple lines with different communication speeds, IT data and OT data can be transmitted efficiently.

[0164] (4th network connection example) An image inspection system S4 employing a fourth network connection example will be described with reference to the drawings. Fig. 35 is a schematic diagram of the image inspection system S4 connected in the fourth network connection example. As shown in the image inspection system S4, the image sensors 100 may be daisy-chain connected between the external connection plugs 340 of the image sensors 100 and the power cables Cp. In this way, the power cables Cp and the communication cables Cn can be wired apart, and noise and the like that may be transmitted to the communication cables Cn by the power cables Cp can be suppressed.

[0165] (5th network connection example) An image inspection system S5 employing the fifth network connection example will be described with reference to the drawings. Fig. 36 is a schematic diagram of the image inspection system S5 connected in the fifth network connection example. As shown in the image inspection system S5, by using a communication cable Cn1 capable of supplying power and giving the communication units 700 the ability to receive power via the communication cable Cn1, the communication units 700 can be daisy-chained, thereby enabling the IT network 6, OT network 7, and power supply to be implemented in a single network. This allows for further wiring savings.

[0166] <Other> In addition to the above-described embodiments, the various technical features disclosed in this specification can be modified in various ways without departing from the spirit of the technical creation. In other words, the above-described embodiments should be considered to be illustrative and not restrictive in all respects. Furthermore, the technical scope of the present invention is defined by the claims, and should be understood to include all modifications that fall within the meaning and scope of the claims. [Explanation of symbols]

[0167] 1 Imaging unit 2. Control Unit 3a keyboard 4 Display device 4a Touch panel 6. IT Network 7 OT Network 8. Communication Router 10 Lighting Module 10a LED 10b LED Driver 11 Camera module 11a AF motor 11b Imaging unit 11c CMOS sensor 11d FPGA 11e DSP 11f Lens section 21 Image sensor control unit 21a DSP 21b FPGA 21c Accelerator 21d Memory 22 Communications Department 23 Power supply 24 Storage device 100 Image Sensor 200 Image sensor housing 201 rear frame 202 Front Frame 210 Back section 211 Contact part 212 screw hole 213 Rear sensor connector hole 214 Positioning part 215 Lid mounting part 216 Contact surface 217 Exterior 218 Inside 220 Left side part 221 Left side lamp 230 Right side part 231 Right side lamp 240 Front part 241 Front convex part 242 Front sensor connector hole 243 Lid mounting part 244 Imaging hole 245 Light source hole 250 Top part 260 Bottom part 270 Slope section 280 Main Board 290 Sub-board 300 External connection part 310 External connection housing 311 Opposite surface part 312 Rotational Axis 313 Connection surface 330, 340 external connection plug 400 Cover material 410 First cover part 411 Contact through hole 412 Lid through hole 420 Second cover part 430 Third cover part 501 First heat conductive member 502 Second heat conducting member 611 Rear sensor connector 612 Rear sensor connector sealing member 613 Rear sensor connector cover 614 Inside 615 Pressing part 616 Contact through hole 621 Front sensor connector 622 Front sensor connector sealing member 623 Front sensor connector cover 624 Inside 625 Pressing part 700 Communication Unit 710 Communication unit housing 711 Front part 712 Contact protrusion 713 Positioning protrusion 714 Pressing convex part 716 Back section 717 Contact part 718 Contact Penetration 719 Slope section 720 Control Unit 721 Communication unit connector 730 Communication unit cover member 740 External communication connection 741 External communication connection housing 742 Opposing surface part 743 Rotational Axis 744 Connection surface 745 Communication Plug 746 External connection cover 750 main board 760 Sub-board A. Means of transport Bt1 Setting button Bt2, Bt4 OK button Bt3, Bt5 Cancel button C1 First Line C2 Second line Cn communication cable Cn1 communication cable (power supply) Cp power cable IS, IS1 interior space Mn setting items Mn1 setting operation section P1 1st position P2 2nd position P3 3rd position P4 4th position Pr support S Image Inspection System S1 Vision Inspection System S2 Image Inspection System S3 Vision Inspection System S4 Vision Inspection System S5 Vision Inspection System Sc1 setting screen Sc2 Advanced settings screen Tb Settings tab double work

Claims

1. An image sensor that captures an image of an inspection object, an imaging unit including an imaging sensor; a control unit for processing the captured image captured by the imaging unit; an image sensor housing formed of metal, in which the imaging unit and the control unit are housed, and which is attachable to a support; a cover member that covers at least a portion of each of a pair of side surfaces that are surfaces that intersect with a front surface that is a surface that has an imaging hole configured to guide light outside the image sensor housing to the imaging sensor and that faces in different directions, and that is made of a material that has a lower thermal conductivity than the image sensor housing; The image sensor, wherein the image sensor housing includes a contact portion that contacts the support when the image sensor housing is attached to the support.

2. The image sensor according to claim 1 , wherein the cover member covers at least a part of a rear surface of the image sensor housing opposite to the front surface.

3. The image sensor of claim 1 , wherein at least a portion of the contact portion is fixed to the support.

4. The image sensor according to claim 1 , wherein the cover member has a contact portion through-hole through which the contact portion passes.

5. a first heat conducting member in contact with a heat generating element disposed inside the image sensor housing; and a second heat conducting member in contact with the heat conducting member and the image sensor housing; the first thermally conductive member has a higher thermal conductivity than the second thermally conductive member; The image sensor according to claim 1 , wherein the second thermally conductive member has insulating properties.

6. The image sensor according to claim 1 , wherein the cover member is configured not to cover the front surface of the image sensor housing.

7. The image sensor of claim 5 , wherein the heating element is a semiconductor device and includes an inference accelerator.

8. an external connection plug having a portion exposed to the outside of the image sensor housing and to which an external cable can be connected; The image sensor according to claim 1 , wherein a heat insulator is disposed between the external connection plug and the image sensor housing.

9. a sensor connector hole is formed on the rear surface of the image sensor housing, the sensor connector hole overlapping with a sensor connector disposed inside the image sensor housing in the front-rear direction; a sensor connector sealing member attached adjacent to the sensor connector hole; a detachable sensor connector cover that covers the sensor connector hole, the sensor connector cover has a pressing portion that can press the sensor connector sealing member when attached to the rear surface, The image sensor according to claim 2 , wherein the cover member has a lid through-hole through which the sensor connector lid can pass when the sensor connector lid is attached or detached to or from the image sensor housing while the cover member is attached to the image sensor housing.

10. an image sensor according to any one of claims 1 to 9; a support body capable of supporting the image sensor housing; The image inspection system according to claim 1 , wherein the support is made of aluminum or an alloy containing aluminum.

11. an image sensor according to claim 9; an external unit having a communication unit connector connectable to the sensor connector; the external unit includes an external unit housing that is contactable with the contact portion, The external unit housing includes a pressing portion capable of pressing the sensor connector sealing member.

12. the external unit is attached to the rear surface of the image sensor housing; the external unit includes a contact protrusion that contacts at least a portion of the rear surface; The image inspection system according to claim 11 , wherein the rear surface of the image sensor housing is provided with a contact surface with which the tip of the contact protrusion can come into surface contact.

13. the external unit is attached to the rear surface of the image sensor housing; The image inspection system of claim 11, wherein the external unit has an external contact portion on a surface opposite to the surface facing the back surface of the image sensor housing, the external contact portion being positioned so as to overlap with the contact portion of the image sensor housing in the direction of connection between the image sensor housing and the external unit.

14. The image inspection system according to claim 11, wherein the external unit is a communication unit to which a cable for information communication can be connected.

15. The image inspection system according to claim 11 , wherein the external unit is an illumination unit capable of irradiating the object with illumination light.

Images