Ceiling-mounted camera device

The ceiling-mounted camera device integrates the imaging element above the frame body through-hole, minimizing protrusion and enhancing spatial design while enabling ultra-wide-angle lens usage and simplifying installation.

JP2025145410APending Publication Date: 2025-10-03PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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Patent Information

Application Number
JP2024045574
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-03-21
Publication Date
2025-10-03

AI Technical Summary

Technical Problem

Conventional ceiling-mounted camera devices protrude significantly from the ceiling surface due to the camera unit being positioned outside the mounting frame, necessitating a large cover material for concealment.

Method used

A ceiling-mounted camera device with a camera block and a mounting frame where the imaging element is positioned above a through-hole in the frame body, reducing protrusion by integrating the camera unit within the ceiling structure.

Benefits of technology

The device minimizes the protrusion from the ceiling surface, enhancing spatial design aesthetics and allowing for the use of ultra-wide-angle lenses while improving installation workability and reducing wiring complexity.

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Abstract

To provide a ceiling-mounted camera device capable of reducing the amount of protrusion from the surface of a ceiling material.SOLUTION: A ceiling-mounted camera device A1 includes: a camera block 1; and a mounting frame 2 for attaching the camera block 1 to a ceiling material S1. The camera block 1 has an image sensor 100 and a lens 110 that focuses light onto the image sensor 100. The mounting frame 2 has a plate-shaped frame body 20. The frame body 20 has a through hole that penetrates through in the thickness direction. The camera block 1 is attached to the frame body 20 with the image sensor 100 above the frame body 20 facing the through hole.SELECTED DRAWING: Figure 2
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Description

[Technical Field]

[0001] The present disclosure relates to a ceiling-mounted camera device, and more particularly to a ceiling-mounted camera device that is installed so as to be embedded in a ceiling. [Background technology]

[0002] As a conventional example, the recessed camera device (hereinafter referred to as the conventional example) described in Patent Document 1 will be exemplified. The conventional example includes a camera body, a mounting frame that houses the camera body and is mounted so as to be recessed into the ceiling, and a cover material.

[0003] The mounting frame is formed into a cylindrical shape with a bottom and a circular outer flange at the bottom end. The camera body is housed inside (in a recessed portion) of the mounting frame. The camera body includes a camera unit that captures images and a movable camera mounting plate that rotatably supports the camera unit. The camera unit protrudes outside (below) the mounting frame from the opening of the recessed portion. The cylindrical portion of the mounting frame, excluding the outer flange, is inserted into a hole in the ceiling material, and the mounting frame is attached to the construction material by placing the outer casing against the surface (underside) of the ceiling material.

[0004] The cover material is attached to the mounting frame so as to cover the outer flange, the opening of the recess, and the camera body that are exposed on the surface of the ceiling material. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 11-355615 Summary of the Invention [Problem to be solved by the invention]

[0006] In the above-mentioned conventional example, the camera unit protrudes outside the mounting frame, and therefore the cover material for covering and concealing the camera unit is large.

[0007] An object of the present disclosure is to provide a ceiling-embedded camera device that can reduce the amount of protrusion from the surface of a ceiling material. [Means for solving the problem]

[0008] A ceiling-mounted camera device according to one aspect of the present disclosure includes a camera block and a mounting frame for mounting the camera block to a ceiling material. The camera block has an imaging element and a lens that focuses light onto the imaging element. The mounting frame has a plate-shaped frame body. The frame body has a through-hole that penetrates in the thickness direction. The camera block is mounted to the frame body with the imaging element positioned above the frame body opposite the through-hole. [Effects of the Invention]

[0009] The ceiling-embedded camera device of the present disclosure has the advantage of being able to reduce the amount of protrusion from the surface of the ceiling material. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 1 is a perspective view of a ceiling-mounted camera device according to an embodiment of the present disclosure. [Figure 2] FIG. 2 is a side view of the ceiling-embedded camera device installed on a ceiling material. [Figure 3] FIG. 3 is a cross-sectional view of a main part of the ceiling-embedded camera device. [Figure 4] FIG. 4 is an exploded perspective view of the ceiling-mounted camera device. [Figure 5] FIG. 5 is a side view of the ceiling-mounted camera device. [Figure 6] FIG. 6 is a top view of the ceiling-embedded camera device with the cover removed. [Figure 7] FIG. 7 is a top view of the ceiling-embedded camera device with the cover attached. [Figure 8] FIG. 8 is a bottom view of the ceiling-mounted camera device. [Figure 9]FIG. 9 is a block diagram showing the circuit configuration of the ceiling-mounted camera device. [Figure 10] FIG. 10 is a side view of a main part of the first modification of the ceiling-embedded camera device. [Figure 11] FIG. 11 is a cross-sectional view of a main part of the ceiling-embedded camera device according to the first modification of the first embodiment. [Figure 12] FIG. 12 is a side view of a second modification of the ceiling-mounted camera device. [Figure 13] FIG. 13 is a block diagram showing a circuit configuration of the ceiling-mounted camera device according to the second modification of the above embodiment. [Figure 14] FIG. 14 is a side view of a third modification of the ceiling-mounted camera device. [Figure 15] FIG. 15 is a side view of another configuration of the ceiling-embedded camera device according to the third modification of the embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0011] Below, a ceiling-mounted camera device according to an embodiment of the present disclosure will be described in detail with reference to the drawings. However, each diagram described in the following embodiment is a schematic diagram, and the ratios of the sizes and thicknesses of the components do not necessarily reflect the actual dimensional ratios. Note that the configurations described in the following embodiment are merely examples of the present disclosure. The present disclosure is not limited to the following embodiment, and various modifications are possible depending on the design, etc., as long as the effects of the present disclosure can be achieved.

[0012] (1) Overview The ceiling-embedded camera device A1 according to the embodiment includes a camera block 1 and a mounting frame 2 for mounting the camera block 1 to a ceiling material S1 (see FIGS. 1 and 2). The ceiling-embedded camera device A1 according to the embodiment is installed in, for example, an office building, a commercial facility, a hospital, a public facility, etc., and used as a surveillance camera. However, the ceiling-embedded camera device A1 according to the embodiment may also be used for purposes other than as a surveillance camera.

[0013] The camera block 1 includes an image sensor 100 and a lens 110 that focuses light onto the image sensor 100. The image sensor 100 is, for example, a monochrome or color CMOS image sensor. However, the image sensor 100 may also be a monochrome or color CCD image sensor. The lens 110 is a wide-angle lens or an ultra-wide-angle lens (fisheye lens) made of glass or acrylic resin.

[0014] The mounting frame 2 is formed by aluminum die-casting. However, the mounting frame 2 may also be formed from sheet metal or synthetic resin. The mounting frame 2 has a plate-shaped frame main body 20. The frame main body 20 is formed in a circular plate shape. The frame main body 20 also has a through-hole 200 that penetrates through in the thickness direction. The through-hole 200 is formed at the center of the circular frame main body 20 so as to be concentric with the frame main body 20.

[0015] The camera block 1 is attached to the frame body 20 with the imaging element 100 disposed above the frame body 20 facing the through-hole 200 (see FIGS. 2 and 3).

[0016] Therefore, in the ceiling-embedded camera device A1 according to the embodiment, the imaging element 100 is positioned above the frame body 20, which is exposed on the surface (underside) of the ceiling material S1, and therefore the amount of protrusion from the surface of the ceiling material S1 can be reduced compared to conventional examples in which the camera unit protrudes outside the mounting frame.

[0017] Furthermore, the ceiling-embedded camera device A1 according to the embodiment reduces its protrusion from the surface of the ceiling material S1, thereby reducing its presence in the installation location and improving the so-called spatial design.

[0018] (2) Details A ceiling-mounted camera device A1 (hereinafter simply referred to as camera device A1) according to this embodiment includes a camera block 1 and a mounting frame 2 for mounting the camera block 1 to a ceiling material S1. The camera device A1 also includes two mounting springs 3 (see FIGS. 1 and 2). In the following description, unless otherwise specified, the front-to-back, left-to-right, and up-to-down directions indicated by arrows in FIG. 1 are defined as the front-to-back, left-to-right, and up-to-down directions of the camera device A1.

[0019] (2-1) Camera block The camera block 1 includes an imaging unit 10, a lens unit 11, a main body 12, a circuit unit 13, a cover 14, a fixing plate 15, and the like (see FIGS. 3 and 4).

[0020] The imaging unit 10 includes an imaging element 100, an imaging board 101, a housing 102, and the like (see FIG. 3). The imaging element 100 is a monochrome or color CMOS image sensor. However, the imaging element 100 may also be a monochrome or color CCD image sensor. The imaging element 100 is mounted on the imaging board 101 (see FIG. 3). The housing 102 has a cylindrical main portion 1020 and a sub-portion 1021 that is substantially frustum-shaped. The sub-portion 1021 is formed integrally with the main portion 1020 so as to protrude downward from the bottom end of the main portion 1020. The bottom surface of the sub-portion 1021 is open (see FIG. 3). The sub-portion 1021 has a plurality of bosses 1022 that stand upward from the bottom surface. The housing 102 accommodates the imaging element 100 and the imaging board 101 inside by screwing the imaging board 101 onto the upper ends of a plurality of bosses 1022 (see FIG. 3).

[0021] The lens unit 11 has a lens 110 and a lens barrel 111 that supports the lens 110 (see FIG. 3). The lens 110 is a wide-angle lens or an ultra-wide-angle lens (fisheye lens) made of glass or acrylic resin. The lens barrel 111 is formed in a cylindrical shape. The lens 110 is attached to the bottom end of the lens barrel 111. The lens unit 11 is attached to the housing 102 of the imaging unit 10. That is, the lens unit 11 is fixed to the housing 102 so that the lens 110 and a portion of the lens barrel 111 pass through holes that open in the bottom surface of a secondary section 1021 of the housing 102 (see FIG. 3).

[0022] The main body 12 has a rectangular bottom plate 121 and four side plates 120 protruding downward from four sides of the bottom plate 121. That is, the main body 12 is formed in a box shape with an open bottom surface facing the bottom plate 121 in the up-down direction (see FIG. 4). The bottom plate 121 and the four side plates 120 are integrally formed by stamping and bending a single metal plate.

[0023] The main body 12 also has an opening 122 that extends from the bottom plate 121 to the top of the right side plate 120 (see FIGS. 4 to 6). The opening 122 is provided for pulling in a LAN cable L1 (described later) into the main body 12. However, the portion of the opening 122 that is provided in the bottom plate 121 is closed openably and closably by a lid 14 (see FIGS. 6 and 7). The lid 14 is made of a rectangular metal plate (see FIGS. 4 and 7). A screw insertion hole 140, which is a circular through-hole, is provided in one corner of the lid 14. The lid 14 is fixed to the bottom plate 121 by a mounting screw 141 that is inserted into the screw insertion hole 140.

[0024] The circuit unit 13 has three circuit boards PB1, PB2, and PB3 of different sizes and two support plates 135 (see FIGS. 4 and 6). The smallest circuit board PB3 is mounted with circuit components constituting a drive circuit 130 that drives the image sensor 100 and an image processing circuit 131 that processes the output of the image sensor 100 to generate image data. The second smallest circuit board PB2 is mounted with circuit components constituting a communication circuit 133. The largest circuit board PB1 is mounted with circuit components constituting a power supply circuit 132 and a connector 134. The power supply circuit 132 generates power for operating the image sensor 100, the drive circuit 130, the image processing circuit 131, and the communication circuit 133 (see FIG. 9). However, the types of circuits constituting each of the circuit boards PB1, PB2, and PB3 are merely examples, and the types of circuits constituting each of the circuit boards PB1, PB2, and PB3 may be changed from the above example.

[0025] The drive circuit 130 drives the image sensor 100 and inputs the signal output from the image sensor 100 to the image processing circuit 131. The image processing circuit 131 processes the signal output from the image sensor 100 to generate image data. The image processing circuit 131 generates image data by compressing still images or moving images captured by the image sensor 100 using a compression method such as MPEG-4, H.264, or H.265.

[0026] The communication circuit 133 is configured to perform two-way communication (data transmission) in accordance with the 100BASE-T or 1000BASE-T standard via a LAN cable L1 made of a UTP (unshielded twisted pair) cable. The communication circuit 133 transmits (transmits) image data generated by the image processing circuit 131 to an external device by packet communication via the LAN cable L1. The external device is a network device (router, switching hub, etc.) connected to a network such as a local area network (LAN) or the Internet. Note that the image data transmitted to the external device may be transmitted to a server via the Internet, for example.

[0027] The connector 134 is electrically connected to the LAN cable L1 directly or via a signal cable and another connector. The connector 134 is mounted on the upper end of the largest circuit board PB1 (see FIG. 6). The LAN cable L1 connected to the connector 134 has eight wires. Of the eight wires, two are used for upstream communication, the other two for downstream communication, and two or four of the remaining four are used for power supply. In other words, the camera device A1 is a power receiving device that complies with PoE (Power over Ethernet) standards such as IEEE802.3af, IEEE802.3at, and IEEE802.3bt. The power supply circuit 132 generates operating power using DC power supplied via the LAN cable L1.

[0028] The two support plates 135 are formed into long, flat plates, for example, from metal plates (see FIG. 4). The two support plates 135 are coupled together, facing each other with a gap in between along their thickness direction, sandwiching the three circuit boards PB1, PB2, and PB3. Specifically, a plurality of cylindrical spacers 136 made of, for example, a metal material are disposed between each support plate 135 and the largest circuit board PB1, and the two support plates 135 and the circuit board PB1 are screwed together via these spacers 136 (see FIGS. 4 and 6). The remaining two circuit boards PB2 and PB3 are electrically and mechanically connected to the circuit board PB1 by connectors or the like.

[0029] The fixed plate 15 has a flat first fixed portion 151, a second fixed portion 152 that protrudes outward from the right end of the first fixed portion 151, and a pair of third fixed portions 153 that protrude outward from the left end of the first fixed portion 151 (see FIG. 4). The housing 102 of the imaging unit 10 is fixed to the lower surface of the first fixed portion 151 by screwing. In addition, one of the support plates 135 is fixed to the upper surface of the first fixed portion 151 by screwing.

[0030] The second fixing portion 152 is screwed to a fixing piece 123 provided at the lower end of the side plate 120 on the right side of the main body 12 (see FIGS. 4 and 6). The pair of third fixing portions 153 are screwed to fixing pieces 124 provided at the lower end of the side plate 120 on the left side of the main body 12 (see FIGS. 4 and 6).

[0031] (2-2) Mounting frame The mounting frame 2 has a disk-shaped frame body 20, a pair of holding portions 21, and a pair of bosses 22 (see FIGS. 4 to 6). The mounting frame 2 is constructed by integrally forming the frame body 20, the pair of holding portions 21, and the pair of bosses 22 by aluminum die-casting. However, the mounting frame 2 may also be constructed from a synthetic resin molded body or a sheet metal part.

[0032] A circular through-hole 200 is provided in the center of the frame body 20. The diameter of the through-hole 200 is large enough to allow the lens 110 and part of the lens barrel 111 of the lens unit 11 to pass through (see FIG. 3).

[0033] The pair of bosses 22 protrude upward from both ends in the front-rear direction on the upper surface of the frame body 20, sandwiching the through-hole 200 therebetween (see FIG. 5).

[0034] Each of the pair of holding portions 21 is configured to hold one mounting spring 3. Specifically, each of the pair of holding portions 21 has a rectangular upright piece 210 with the longitudinal direction in the up-down direction, and a pair of holding pieces 211 provided integrally at both ends of the upright piece 210 in the short direction (front-rear direction) (see FIGS. 4 to 6). The pair of holding pieces 211 protrude outward from the upright piece 210. Furthermore, the front-rear direction tip portions of the pair of holding pieces 211 protrude in directions approaching each other. In other words, the pair of holding pieces 211 are formed in an L shape when viewed from the up-down direction (see FIG. 6).

[0035] (2-3) Mounting spring Each of the two mounting springs 3 is formed as a long leaf spring (see FIG. 4). One longitudinal end 30 of each mounting spring 3 is bent into a V-shape. Each mounting spring 3 is attached to the mounting frame 2 by having the end 30 held by the holding portion 21 of the mounting frame 2 (see FIGS. 5 and 6). Specifically, each mounting spring 3 is held by the holding portion 21 by inserting the end 30 into the space formed between the holding piece 211 and the upright piece 210 and hooking the claw portion 300 cut and raised from the end 30 into a recess 212 provided in the holding portion 21 (see FIG. 5). Thus, each mounting spring 3 is configured to bend vertically, with the end 30 held by the holding portion 21 as a fulcrum.

[0036] (2-4) Camera device assembly procedure Next, the procedure for assembling the camera device A1 will be briefly described. However, the procedure described below is an example, and the order of some of the steps may be changed.

[0037] The worker performing the assembly work (hereinafter referred to as the worker) screws two support plates 135 together so that they sandwich the three circuit boards PB1, PB2, and PB3 between them, and then screws one of the support plates 135 onto the top surface of the first fixing portion 151 of the fixing plate 15 to secure it.

[0038] Next, the worker places the two support plates 135 and the three circuit boards PB1, PB2, and PB3 inside the main body 12. Then, the worker screws the second fixing portion 152 of the fixing plate 15 to the fixing piece 123 of the main body 12, and screws the pair of third fixing portions 153 of the fixing plate 15 to the fixing piece 124 of the main body 12.

[0039] Next, with the lens 110 and part of the barrel 111 of the lens unit 11 inserted into the through-hole 200 of the mounting frame 2, the worker screws a pair of mounting pieces 125 provided at the lower ends of the front and rear side plates 120 of the main body 12 to a pair of bosses 22 of the mounting frame 2 (see Figures 4-6).

[0040] Finally, the worker attaches the mounting springs 3 one by one to the pair of holding portions 21 of the mounting frame 2.

[0041] The assembly of the camera device A1 is completed through the above steps.

[0042] (2-5) Camera installation procedure Next, a procedure for installing the camera device A1 on the ceiling will be briefly described. However, the procedure described below is an example, and the order of some of the steps may be changed.

[0043] The worker performing the installation (hereinafter referred to as the worker) removes the lid 14 from the bottom plate 121 of the main body 12. The worker pulls out the LAN cable L1 from the recessed hole S10 in the ceiling material S1, and electrically connects the LAN connector (RJ-45 plug) attached to the end of the LAN cable L1 through the opening 122 of the main body 12 to the connector 134 of the circuit unit 13 directly or via a conversion cable. Thereafter, the worker screws the lid 14 to the bottom plate 121 of the main body 12, and closes the portion of the opening 122 that is provided on the bottom plate 121 with the lid 14 (see FIG. 5).

[0044] Next, the worker pushes the two mounting springs 3 upward to bend them. Then, with the two mounting springs 3 in a bent state, the worker inserts the main body 12 and the two mounting springs 3 into the recessed hole S10 in the ceiling material S1. When the frame main body 20 of the mounting frame 2 reaches a position where it abuts on the surface (underside) of the ceiling material S1, the two mounting springs 3 catch on the edges of the recessed hole S10 on the upper surface of the ceiling material S1, and the camera device A1 is attached to the ceiling material S1 with the ceiling material S1 sandwiched between the two mounting springs 3 and the mounting frame 2 (see FIG. 2).

[0045] The above steps complete the installation of the camera device A1 on the ceiling.

[0046] (3) Advantages of the embodiment In the above-described conventional example, the camera unit protrudes outside the mounting frame, and therefore the cover material for covering and concealing the camera unit is large.

[0047] In contrast to this, camera device A1 has imaging element 100 disposed above frame body 20 facing through-hole 200, and camera block 1 attached to frame body 20 (see FIG. 3). Therefore, compared to conventional examples in which the camera unit protrudes outside the mounting frame, camera device A1 has the advantage of being able to reduce the amount of protrusion from the surface (underside) of ceiling material S1 (see FIG. 2).

[0048] Furthermore, the camera device A1 has the advantage of reducing the amount of protrusion from the surface of the ceiling material S1, thereby reducing its presence in the installation location and improving the so-called spatial design.

[0049] Here, in the camera device A1, a part of the lens 110 protrudes downward from the frame body 20 through the through-hole 200, and the camera block 1 is attached to the frame body 20 (see FIGS. 2 and 3). Thus, by having a part of the lens 110 protrude downward from the frame body 20 of the mounting frame 2, the camera device A1 can use an ultra-wide-angle lens such as a fisheye lens as the lens 110. And, by using an ultra-wide-angle lens as the lens 110, the camera device A1 has the advantage of being able to simultaneously capture an image of a wider range.

[0050] The camera device A1 also includes one or more mounting springs 3. The mounting springs 3 are fixed to the frame body 20, and fix the mounting frame 2 to the ceiling material S1 by sandwiching the ceiling material S1 between the mounting springs 3 and the frame body 20. Thus, since the camera device A1 is attached to the ceiling material S1 using the mounting springs 3 as described above, the workability of the installation work on the ceiling material S1 can be improved.

[0051] Furthermore, in the camera device A1, a LAN cable L1, which serves as a power supply path, is drawn into the main body 12 through an opening 122 provided in the main body 12, and a part of the opening 122 is closed by a cover 14 that is detachably attached to a bottom plate 121 of the main body 12. The opening 122 is provided in a side surface (right side plate 120) adjacent to the top surface (bottom plate 121) of the main body 12. The opening 122 is also provided across the side surface (right side plate 120) and the top surface (bottom plate 121).

[0052] Thus, in the camera device A1, when electrically connecting the LAN cable L1 to the circuit unit 13, the cover 14 is removed from the main body 12, making it easier to pull the LAN cable L1 through the opening 122. Meanwhile, after pulling the LAN cable L1, the camera device A1 closes a portion of the opening 122 with the cover 14, thereby preventing foreign matter such as dust from entering the main body 12 through the opening 122. In other words, the camera device A1 has the advantage of improving the workability of wiring work while preventing foreign matter from entering the main body 12. Furthermore, by pulling the LAN cable L1 through the opening 122 provided in the side panel 120 of the main body 12, the camera device A1 prevents the LAN cable L1 from hitting the ceiling slab and receiving excessive stress when the ceiling recess is not high enough compared to the height of the main body 12. However, the camera device A1 may have the opening 122 provided in only one of the bottom panel 121 or side panel 120 of the main body 12.

[0053] Incidentally, the camera device A1 uses a single LAN cable L1 as both a transmission path for transmitting image data generated by the image processing circuit 131 to the outside and a supply path for supplying power from the outside to the power supply circuit 132. In other words, the camera device A1 is a power-receiving device compliant with the PoE (Power over Ethernet) standard, and generates operating power using DC power supplied via the LAN cable L1. Therefore, the camera device A1 can reduce wiring compared to a case where data transmission and power supply are performed using separate cables. Furthermore, the camera device A1 can simplify its circuit configuration compared to a case where AC power supplied from a commercial power system or the like is converted to DC power.

[0054] Here, the camera device A1 is formed so that the main body 12 does not protrude from the projection range of the mounting frame 2 when viewed in the thickness direction (vertical direction) of the frame body 20 (see FIGS. 5 to 8). Therefore, the camera device A1 can improve the workability when inserting the main body 12 into the embedding hole S10 of the ceiling material S1.

[0055] (4) Variations Next, several modified examples of the camera device A1 according to the embodiment will be described. However, the basic configuration of the camera device A1 in each of the modified examples described below is the same as the basic configuration of the camera device A1 according to the embodiment. Therefore, the same reference numerals will be used to designate the configurations that are common to the basic configuration of the camera device A1 according to the embodiment, and illustrations and descriptions thereof will be omitted as appropriate. In the following description, "substantially common configuration" means a configuration that is slightly different in shape, size, etc., but has the same function.

[0056] (4-1) Variation 1 The camera device A1 of the first modification is characterized in that the camera block 1 is attached to the frame body 20 without the lens 110 protruding below the frame body 20 (see FIGS. 10 and 11).

[0057] For example, when a wide-angle lens with an angle of view of about 130 degrees is used as lens 110 instead of an ultra-wide-angle lens (fisheye lens), lens 110 can be housed inside through-hole 200 of frame body 20 (see FIG. 11).

[0058] Therefore, the camera device A1 of the first modification can capture an image of a relatively wide range, while further reducing its presence in the installation location, thereby further improving the so-called spatial design.

[0059] (4-2) Variation 2 The camera device A1 of the second modification is characterized in that the camera block 1 has a battery unit 16 (see FIGS. 12 and 13).

[0060] The battery unit 16 includes a storage battery, a charging circuit for charging the storage battery, and a case 160 for accommodating the storage battery and the charging circuit. The storage battery is configured, for example, by electrically connecting a plurality of nickel-metal hydride storage batteries or lithium-ion storage batteries in series or series-parallel. The charging circuit stabilizes DC power supplied via a connector 134 to charge the storage battery. The charging circuit also supplies DC power to the image sensor 100, drive circuit 130, image processing circuit 131, and communication circuit 133 in place of the power supply circuit 132.

[0061] The case 160 is made of synthetic resin and has a box shape. The case 160 is attached to the left side plate 120 of the main body 12 (see FIG. 12). However, the case 160 may be attached to the right side plate 120 or to either the front or rear side plate 120, or may be housed within the main body 12.

[0062] Thus, when the external power supply to camera device A1 of Modification 2 is stopped, it is possible to operate image sensor 100, drive circuit 130, and image processing circuit 131 with DC power supplied from the storage battery of battery unit 16. Note that image processing circuit 131 preferably records generated image data in a nonvolatile semiconductor memory such as a flash memory. As a result, camera device A1 of Modification 2 can continue capturing images using image sensor 100 even while the external power supply is stopped.

[0063] (4-3) Variation 3 The camera device A1 of variant example 3 is characterized in that the main body 12 is formed so that a portion of the main body 12 extends beyond the projection range of the mounting frame 2 when viewed from the thickness direction (vertical direction) of the frame main body 20 (see Figures 14 and 15).

[0064] The main body 12 in Modification 3 is formed in a substantially L-shape, as shown in Figures 14 and 15. The main body 12 in Modification 3 is formed so that its length in the front-to-rear direction is longer than its height when attached to the mounting frame 2. The circuit unit 13 in Modification 3 is housed in the main body 12 so that the thickness direction of the support plate 135 is parallel to the up-down direction (see Figure 14). However, the circuit unit 13 in Modification 3 may also be housed in the main body 12 so that the thickness direction of the support plate 135 intersects (for example, is perpendicular to) the up-down direction (see Figure 15).

[0065] Therefore, the camera device A1 of variant example 3 is formed so that a part of the main body 12 extends beyond the projection range of the mounting frame 2 when viewed from the thickness direction (vertical direction) of the frame main body 20, and therefore can be attached to the ceiling material S1 even if the ceiling recess is not high enough.

[0066] (4-4) Variation 4 The camera device A1 of the fourth modification is characterized in that it has a power conversion circuit instead of the power supply circuit 132. The power conversion circuit is configured to convert AC power supplied from an external source into DC power. The AC power is supplied, for example, from a commercial power system (effective value of 100V or 200V).

[0067] The power conversion circuit includes, for example, a boost chopper circuit for power factor correction and a step-down chopper circuit for stepping down the DC voltage output from the boost chopper circuit. The DC power output from the power conversion circuit (specifically, the output of the step-down chopper circuit) is supplied to the image sensor 100, the drive circuit 130, the image processing circuit 131, and the communication circuit 133. However, the circuit configuration of the power conversion circuit is not particularly limited.

[0068] Therefore, the camera device A1 of the fourth modification can operate on power supplied from a general commercial power system, which has the advantage that a power supply device conforming to the PoE standard is not required.

[0069] (5) Summary A ceiling-mounted camera device (A1) according to a first aspect of the present disclosure includes a camera block (1) and a mounting frame (2) for mounting the camera block (1) to a ceiling material (S1). The camera block (1) has an imaging element (100) and a lens (110) that focuses light on the imaging element (100). The mounting frame (2) has a plate-shaped frame body (20). The frame body (20) has a through-hole (200) that penetrates the frame body (20) in the thickness direction. The camera block (1) is mounted to the frame body (20) with the imaging element (100) positioned above the frame body (20) opposite the through-hole (200).

[0070] The ceiling-embedded camera device (A1) according to the first aspect can reduce the amount of protrusion from the surface of the ceiling material (S1) compared to conventional examples in which the camera unit protrudes outside the mounting frame.

[0071] A ceiling-mounted camera device (A1) according to a second aspect of the present disclosure can be realized by combining it with the first aspect. In the ceiling-mounted camera device (A1) according to the second aspect, the camera block (1) is preferably attached to the frame body (20) with a portion of the lens (110) protruding downward from the frame body (20) through the through-hole (200).

[0072] The ceiling-mounted camera device (A1) according to the second aspect can use an ultra-wide-angle lens such as a fisheye lens for the lens (110) by having a part of the lens (110) protrude below the frame body (20). As a result, the ceiling-mounted camera device (A1) according to the second aspect can simultaneously capture an image of a wider range by using an ultra-wide-angle lens for the lens (110).

[0073] A ceiling-mounted camera device (A1) according to a third aspect of the present disclosure can be realized by combining it with the first aspect. In the ceiling-mounted camera device (A1) according to the third aspect, it is preferable that the camera block (1) is attached to the frame body (20) with the lens (110) facing the through-hole (200) and without the lens (110) protruding below the frame body (20).

[0074] The ceiling-embedded camera device (A1) according to the third aspect can further reduce its presence in the installation location, and can further improve the so-called spatial design.

[0075] A ceiling-mounted camera device (A1) according to a fourth aspect of the present disclosure can be realized by combining it with any of the first to third aspects. The ceiling-mounted camera device (A1) according to the fourth aspect preferably further includes one or more mounting springs (3). The mounting springs (3) are preferably fixed to the frame body (20). The mounting springs (3) preferably fix the mounting frame (2) to the ceiling material (S1) by sandwiching the ceiling material (S1) between the mounting springs (3) and the frame body (20).

[0076] The ceiling-embedded camera device (A1) according to the fourth aspect is attached to the ceiling material (S1) using the attachment spring (3), and therefore the workability of the installation work on the ceiling material (S1) can be improved.

[0077] A ceiling-mounted camera device (A1) according to a fifth aspect of the present disclosure can be realized by combining it with any of the first to fourth aspects. In the ceiling-mounted camera device (A1) according to the fifth aspect, the camera block (1) further includes a drive circuit (130) that drives the image sensor (100) with externally supplied power, a box-shaped main body (12) that houses the drive circuit (130), and a cover (14). The main body (12) preferably has an opening (122) for inserting a cable (LAN cable L1) that serves as a power supply path. The cover (14) is preferably detachably attached to the main body (12) and is formed to cover at least a portion of the opening (122).

[0078] The ceiling-embedded camera device (A1) according to the fifth aspect can improve the workability of wiring work and can also prevent foreign matter from entering the main body part (12).

[0079] A ceiling-mounted camera device (A1) according to a sixth aspect of the present disclosure can be realized by combining it with the fifth aspect. In the ceiling-mounted camera device (A1) according to the sixth aspect, the opening (122) is preferably provided on a side surface (side plate 120) adjacent to the top surface (bottom plate 121) of the main body (12).

[0080] In the ceiling-embedded camera device (A1) according to the sixth aspect, the cable is pulled in through an opening (122) provided on the side of the main body (12), so that if the height of the ceiling recess is not sufficient compared to the height of the main body (12), the cable will not hit the ceiling slab and be subjected to excessive stress.

[0081] A ceiling-mounted camera device (A1) according to a seventh aspect of the present disclosure can be realized by combining it with the sixth aspect. In the ceiling-mounted camera device (A1) according to the seventh aspect, it is preferable that the opening (122) is provided across the side surface and the top surface.

[0082] The ceiling-embedded camera device (A1) according to the seventh aspect can improve workability by enlarging the opening (122).

[0083] A ceiling-mounted camera device (A1) according to an eighth aspect of the present disclosure can be realized by combining it with the seventh aspect. In the ceiling-mounted camera device (A1) according to the eighth aspect, it is preferable that the cover (14) is formed so as to cover a portion of the opening (122) that is provided on the upper surface of the main body (12).

[0084] The ceiling-mounted camera device (A1) according to the eighth aspect can prevent foreign matter such as dust from entering the main body (12) through the opening (122).

[0085] A ceiling-mounted camera device (A1) according to a ninth aspect of the present disclosure can be realized by combining it with any of the fifth to eighth aspects. In the ceiling-mounted camera device (A1) according to the ninth aspect, it is preferable that the camera block (1) further includes an image processing circuit (131) housed in the main body (12). It is preferable that the image processing circuit (131) processes the output of the imaging element (100) to generate image data. It is preferable that the cable includes a power supply path and a transmission path for transmitting image data generated by the image processing circuit (131) to the outside.

[0086] The ceiling-embedded camera device (A1) according to the ninth aspect can reduce wiring compared to when data transmission and power supply are carried out using separate cables.

[0087] A ceiling-mounted camera device (A1) according to a tenth aspect of the present disclosure can be realized by combining it with any of the fifth to ninth aspects. In the ceiling-mounted camera device (A1) according to the tenth aspect, it is preferable that the main body (12) is formed so as not to protrude from the projection range of the mounting frame (2) when viewed in the thickness direction of the frame main body (20).

[0088] The ceiling-embedded camera device (A1) according to the tenth aspect can improve the workability when inserting the main body part (12) into the hole (embedding hole S10) provided in the ceiling material (S1).

[0089] The ceiling-mounted camera device (A1) according to an eleventh aspect of the present disclosure can be realized by combining it with any one of the fifth to tenth aspects. In the ceiling-mounted camera device (A1) according to the eleventh aspect, it is preferable that the drive circuit (130) operates on DC power supplied from an external source.

[0090] The ceiling-embedded camera device (A1) according to the eleventh aspect can simplify the circuit configuration compared to when AC power supplied from a commercial power system or the like is converted into DC power.

[0091] A ceiling-mounted camera device (A1) according to a twelfth aspect of the present disclosure can be realized by combining it with any of the fifth to tenth aspects. In the ceiling-mounted camera device (A1) according to the twelfth aspect, the camera block (1) preferably further includes a power conversion circuit. The power conversion circuit preferably converts externally supplied power and supplies the converted power to the drive circuit (130). The power conversion circuit is preferably configured to convert AC power into DC power.

[0092] The ceiling-embedded camera device (A1) according to the twelfth aspect does not require dedicated equipment for supplying DC power, and therefore, introduction costs can be reduced.

[0093] A ceiling-mounted camera device (A1) according to a thirteenth aspect of the present disclosure can be realized by combining it with any of the fifth to tenth aspects. In the ceiling-mounted camera device (A1) according to the thirteenth aspect, it is preferable that the camera block (1) further includes a storage battery (battery unit 16) that is charged with power supplied from an external source. It is preferable that the drive circuit (130) be capable of driving the image sensor (100) with power discharged from the storage battery.

[0094] The ceiling-embedded camera device (A1) according to the thirteenth aspect can continue capturing images using the image sensor (100) even while the external power supply is stopped.

[0095] A ceiling-mounted camera device (A1) according to a fourteenth aspect of the present disclosure can be realized by combining it with any one of aspects five to ninth. In the ceiling-mounted camera device (A1) according to the fourteenth aspect, it is preferable that the main body (12) is formed so that a part of the main body (12) extends beyond the projection range of the mounting frame (2) when viewed in the thickness direction of the frame main body (20).

[0096] The ceiling-embedded camera device (A1) according to the fourteenth aspect can be attached to the ceiling material (S1) even if the ceiling space is not high enough. [Explanation of symbols]

[0097] A1 Ceiling-mounted camera device L1 LAN cable (cable) S1 Ceiling Material 1 Camera Block 2 Mounting frame 3 Mounting spring 12 Main body 14 Lid 16 Battery Unit 20 Frame body 100 image sensor 110 Lens 120 Side panel 121 Bottom plate 122 Opening 130 Drive circuit 131 Image processing circuit 200 through holes

Claims

1. A camera block, a mounting frame for mounting the camera block to a ceiling material; Equipped with The camera block includes: An imaging element; a lens that focuses light onto the imaging element; and The mounting frame has a plate-shaped frame body, The frame body has a through hole penetrating in a thickness direction, the camera block is attached to the frame body with the imaging element disposed above the frame body facing the through hole; Ceiling-mounted camera device.

2. The camera block is attached to the frame body such that a portion of the lens protrudes downward from the frame body through the through hole.

2. The ceiling-mounted camera device according to claim 1.

3. the camera block is attached to the frame body with the lens facing the through-hole and without the lens protruding below the frame body; 2. The ceiling-mounted camera device according to claim 1.

4. The ceiling material is fixed to the frame body by sandwiching the mounting frame between the frame body and one or more mounting springs. The ceiling-mounted camera device according to any one of claims 1 to 3.

5. The camera block includes: a drive circuit that drives the image sensor using power supplied from an external source; a box-shaped main body that houses the drive circuit; A lid body, and the main body has an opening for drawing in a cable that serves as a power supply path, The cover is detachably attached to the main body and is formed to close at least a portion of the opening. The ceiling-mounted camera device according to any one of claims 1 to 3.

6. The opening is provided on a side surface adjacent to the top surface of the main body.

6. The ceiling-mounted camera device according to claim 5.

7. The opening is provided across the side surface and the top surface.

7. The ceiling-mounted camera device according to claim 6.

8. The lid is formed to close a portion of the opening that is provided on the top surface of the main body.

8. The ceiling-mounted camera device according to claim 7.

9. the camera block is housed in the main body and further includes an image processing circuit that processes an output of the image sensor to generate image data; the cable has a power supply path and a transmission path for transmitting the image data generated by the image processing circuit to an external device.

6. The ceiling-mounted camera device according to claim 5.

10. The main body portion is formed so as not to protrude from a projection range of the mounting frame when viewed in the thickness direction of the frame main body.

6. The ceiling-mounted camera device according to claim 5.

11. the drive circuit is operated by the externally supplied DC power; 6. The ceiling-mounted camera device according to claim 5.

12. the camera block further includes a power conversion circuit that converts the externally supplied power and supplies the converted power to the drive circuit; the power conversion circuit is configured to convert AC power to DC power; 6. The ceiling-mounted camera device according to claim 5.

13. the camera block further includes a storage battery that is charged by the power supplied from the outside, the drive circuit is capable of driving the image sensor with power discharged from the storage battery; 6. The ceiling-mounted camera device according to claim 5.

14. The main body is formed such that a portion of the main body extends beyond a projection range of the mounting frame when viewed in a thickness direction of the frame main body.

6. The ceiling-mounted camera device according to claim 5.

Citation Information

Patent Citations

  • Built-in camera apparatus

    JP1999355615A