Liquid discharge head, liquid discharge apparatus and manufacturing method of liquid discharge head

By incorporating a distorted portion and inward-facing recess or through-hole in the nozzle cover and joining member, the liquid ejection head's structural integrity is maintained, preventing peeling and ensuring reliable operation.

JP2025146646APending Publication Date: 2025-10-03RICOH CO LTD
View PDF 1 Cites 0 Cited by

Patent Information

Application Number
JP2024217576
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-03-22
Filing Date
2024-12-12
Publication Date
2025-10-03

AI Technical Summary

Technical Problem

The joined members in liquid ejection heads may come apart when subjected to external forces during assembly or operation, leading to peeling issues.

Method used

The nozzle cover and nozzle-side joining member are designed with a distorted portion and a through-hole or recess positioned to face inward, enhancing bonding quality and preventing peeling.

Benefits of technology

This design effectively prevents the bonded members from peeling, ensuring the integrity of the liquid ejection head under external forces.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 2025146646000001_ABST
    Figure 2025146646000001_ABST
Patent Text Reader

Abstract

To suppress peeling between joined members.SOLUTION: A liquid discharge head 20 includes a nozzle plate 31 having nozzles, a nozzle cover 23 that covers the nozzle plate 31, and a base member 22 joined to the nozzle cover 23. The nozzle cover 23 includes a strain portion 23b, which is a portion including an outer peripheral surface of the nozzle cover 23 and having a partially changed shape relative to a peripheral portion. The base member 22 has a recess 22a at a position facing the strain portion 23b. In an overlapping direction of the nozzle cover 23 and the base member 22, the recess 22a is provided inside the base member 22 and does not face the outside of the base member 22.SELECTED DRAWING: Figure 13
Need to check novelty before this filing date? Find Prior Art

Description

[Technical Field]

[0001] The present invention relates to a liquid ejection head, a liquid ejection apparatus, and a method for manufacturing a liquid ejection head. [Background technology]

[0002] The liquid ejection head is provided by bonding a plurality of plate-like members together with an adhesive.

[0003] For example, in the liquid ejection head of Patent Document 1 (Japanese Patent Laid-Open No. 2023-65011), the nozzle cover is bonded with an adhesive to the base member and the common liquid chamber member, which is the frame member of the head main body. Summary of the Invention [Problem to be solved by the invention]

[0004] However, there is a problem in that the joined members may come apart when an external force is applied to the joined members during assembly or when the liquid ejection head is operated after assembly.

[0005] An object of the present invention is to prevent peeling between joined members. [Means for solving the problem]

[0006] In order to solve the above problems, the present invention provides a liquid ejection head comprising a nozzle member having a nozzle, a nozzle cover that covers the nozzle member, and a nozzle-side joining member that is joined to the nozzle cover, wherein the nozzle cover is a portion that includes the outer peripheral surface of the nozzle cover and has a distorted portion that is partially deformed in shape compared to the surrounding portion, and the nozzle-side joining member has a through-hole or a recess at a position facing the distorted portion, and when viewed in the overlapping direction of the nozzle cover and the nozzle-side joining member, the through-hole or the recess is provided on the inside of the nozzle-side joining member that does not face the outside of the nozzle-side joining member. [Effects of the Invention]

[0007] The present invention can prevent the bonded members from peeling from each other. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a diagram showing the overall configuration of an inkjet image forming apparatus according to an embodiment of the present invention; [Figure 2] FIG. 1 is a diagram illustrating a control system of an inkjet image forming apparatus according to an embodiment of the present invention. [Figure 3] FIG. 2 is an exploded perspective view showing an example of the configuration of a liquid ejection head. [Figure 4] FIG. 4 is a cross-sectional view of the liquid ejection head shown in FIG. 3 in the short side direction. [Figure 5] FIG. 2 is a plan view showing an example of the configuration of a line-type head unit. [Figure 6] FIG. 10 is a plan view showing an example of the configuration of a serial type head unit. [Figure 7] FIG. 10 is a plan view of a liquid ejection head different from an embodiment of the present invention, as viewed from the nozzle surface side. [Figure 8] FIG. 8 is a diagram showing a state in which the nozzle cover is removed from the liquid ejection head of FIG. [Figure 9] FIG. 8 is a cross-sectional view taken along the line A1-A1 in FIG. 7. [Figure 10] 10A and 10B are diagrams showing how the fixing portion is cut off from the nozzle cover. [Figure 11] 1 is a plan view of a liquid ejection head according to an embodiment of the present invention, viewed from the nozzle surface side. [Figure 12] FIG. 12 is a diagram showing a state in which the nozzle cover is removed from the liquid ejection head of FIG. [Figure 13] 12 is a cross-sectional view taken along the line A2-A2 in FIG. 11. [Figure 14] 10A and 10B are diagrams showing another form of a fixing portion provided on the nozzle cover. [Figure 15] 10A and 10B are cross-sectional views showing another form of a hole provided in a base member. [Figure 16] FIG. 10 is a cross-sectional view showing another embodiment of the liquid ejection head. [Figure 17]10A and 10B are schematic configuration diagrams showing different embodiments of the liquid ejection device. [Figure 18] FIG. 1 is a perspective view of a liquid ejection head and a cover according to an embodiment of the present invention. [Figure 19] 19 is a cross-sectional view of FIG. 18A. [Figure 20] 10A and 10B are perspective views showing the stacked state of substrates in the manufacturing process of a liquid ejection head different from that of the present embodiment. [Figure 21] FIG. 10 is a diagram showing a state in which the connection portions connecting the substrate and the gripping portion are arranged in a shifted manner. [Figure 22] 19 is a perspective cross-sectional view showing the laminated structure of a common flow path member, a first damper frame, and a second damper frame in the liquid ejection head of FIG. 18. FIG. [Figure 23] FIG. 19 is a plan view of the liquid ejection head of FIG. 18, viewed from the second damper frame side. [Figure 24] 19 is a front view showing the laminated structure of the common flow path member, the first damper frame, and the second damper frame in the liquid ejection head of FIG. 18. FIG. [Figure 25] FIG. 10 is a front view showing how the convex portion is bent and inserted into the groove portion. [Figure 26] FIG. 4 is a plan view showing each substrate after the first cutting step. [Figure 27] FIG. 10 is a front view showing a second cutting step. [Figure 28] FIG. 10 is a front view showing another example of the outer periphery of the common flow path member. [Figure 29] FIG. 10 is a front view showing a state in which the convex portion is curved toward the common flow path member. [Figure 30] FIG. 10 is a front view showing the width of the common flow path member and the first damper frame. [Figure 31] 10 is a plan view showing another example of the first groove portion and the second groove portion. FIG. [Figure 32] FIG. 19 is a cross-sectional view showing a liquid ejection head according to an embodiment different from that shown in FIG. [Figure 33] 33 is a perspective cross-sectional view showing a laminated structure of a common flow path member, a first damper frame, a second damper frame, etc. in the liquid ejection head of FIG. 32. FIG. [Figure 34]FIG. 33 is a plan view of the liquid ejection head of FIG. 32, viewed from the second damper manifold side. [Figure 35] 33 is a front view showing the layered structure of the common flow path member, the first damper frame, the second damper frame, etc. in the liquid ejection head of FIG. 32. FIG. [Figure 36] FIG. 4 is a front view showing the arrangement of each protrusion. [Figure 37] FIG. 10 is a perspective cross-sectional view showing the layered structure of a common flow path member, a first damper frame, a second damper frame, etc. in a liquid ejection head according to another embodiment. [Figure 38] FIG. 10 is a perspective cross-sectional view showing the layered structure of a common flow path member, a first damper frame, a second damper frame, etc. in a liquid ejection head according to yet another embodiment. [Figure 39] FIG. 39 is a plan view of the liquid ejection head of FIG. 38, viewed from the second damper manifold side. [Figure 40] 39 is a front view showing the layered structure of the common flow path member, the first damper frame, the second damper frame, etc. in the liquid ejection head of FIG. 38. FIG. [Figure 41] FIG. 10 is a perspective cross-sectional view showing a laminated structure of a common flow path member, a first damper frame, a second damper frame, etc. in a liquid ejection head of a comparative example. [Figure 42] FIG. 42 is a plan view of the liquid ejection head of FIG. 41, viewed from the second damper manifold side. [Figure 43] 42 is a front view showing the layered structure of the common flow path member, the first damper frame, the second damper frame, etc. in the liquid ejection head of FIG. 41. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In each drawing, the same or corresponding parts are denoted by the same reference numerals, and redundant explanations will be appropriately simplified or omitted. In the following explanation, a liquid ejection head that ejects ink as a liquid will be described.

[0010] First, the configuration of an inkjet image forming apparatus, which is one embodiment of a liquid ejection apparatus according to the present invention, will be described with reference to Figures 1 and 2. Figure 1 is a diagram showing the overall configuration of the inkjet image forming apparatus, and Figure 2 is a diagram showing the control system of the inkjet image forming apparatus.

[0011] 1, the image forming apparatus 100 according to this embodiment includes a sheet supply unit 1 that supplies sheets S for image formation, an image forming unit 2 that forms an image on the sheets S, a conveying unit 3 that conveys the sheets S to the image forming unit 2, a drying unit 4 that dries the sheets S, and a sheet collecting unit 5 that collects the sheets S on which the images have been formed. The image forming apparatus 100 according to this embodiment also includes a control unit 6 (see FIG. 2) that controls the sheet supply unit 1, the image forming unit 2, the conveying unit 3, the drying unit 4, and the sheet collecting unit 5.

[0012] The sheet supply unit 1 has a supply roller 11 around which a long sheet S is wound in a roll, and a tension adjustment mechanism 12 that adjusts the tension applied to the sheet S. The supply roller 11 is configured to be rotatable in the direction of the arrow shown in FIG. 1, and the sheet S is unwound by the rotation of the supply roller 11. The tension adjustment mechanism 12 has multiple rollers across which the sheet S is stretched and which apply tension. The tension of the sheet S is adjusted by moving some of these rollers, and the sheet S is unwound from the supply roller 11 with a constant tension.

[0013] The image forming unit 2 has a head unit 13, which is a liquid ejection unit that ejects liquid ink onto the sheet S, and a platen 14, which serves as a sheet support member that supports the sheet S as it is transported. The head unit 13 has multiple liquid ejection heads. An image is formed on the sheet S by ejecting ink from each liquid ejection head onto the sheet S based on image data generated by the control unit 6. Here, the ink is a liquid containing a colorant, a solvent, and crystalline resin particles dispersed in the solvent. The crystalline resin is a resin that undergoes a phase change when heated above a predetermined melting point, melting from a crystalline state into a liquid. The platen 14 is disposed opposite the head unit 13 and supports the underside of the sheet S supplied from the sheet supply unit 1. The platen 14 is also configured to be movable toward and away from the head unit 13 so that the distance between the head unit 13 and the sheet S can be maintained constant.

[0014] The conveying unit 3 has a plurality of conveying rollers 15. With the sheet S stretched between the conveying rollers 15, the conveying rollers 15 rotate, thereby conveying the sheet S to the image forming unit 2. Note that the conveying unit 3 may have other conveying means such as a conveying belt.

[0015] The drying unit 4 has a heating drum 16 that heats the sheet S to accelerate drying of the ink on the sheet S. The heating drum 16 is a cylindrical member that rotates with the sheet S wrapped around its outer surface, and has a heat source such as a halogen heater disposed inside. In addition to contact-type heating means such as the heating drum 16, non-contact-type heating means such as a hot air generator that blows hot air onto the sheet S can also be used as heating means for heating the sheet S.

[0016] The sheet collection unit 5 has a collection roller 17 that winds up and collects the sheet S, and a tension adjustment mechanism 18 that adjusts the tension applied to the sheet S. The collection roller 17 is configured to be rotatable in the direction of the arrow shown in FIG. 1, and as the collection roller 17 rotates, the sheet S is wound up into a roll and collected. The tension adjustment mechanism 18 has multiple rollers, similar to the tension adjustment mechanism 12 of the sheet supply unit 1. As some of these rollers move, the tension of the sheet S is adjusted, and the sheet S is wound up by the collection roller 17 at a constant tension.

[0017] The control unit 6 is configured by an information processing device such as a PC (Personal Computer). The control unit 6 generates image data to be formed on the sheet S, and also controls various operations of the sheet supply unit 1, image forming unit 2, conveyance unit 3, drying unit 4, and sheet collection unit 5. For example, the control unit 6 controls the rotation speeds of the supply roller 11, collection roller 17, and each conveyance roller 15, as well as the temperature of the heat source that heats the heating drum 16.

[0018] Next, an example of the configuration of a liquid ejection head will be described with reference to FIGS.

[0019] 3 is an exploded perspective view of the liquid ejection head, and FIG. 4 is a cross-sectional view of the liquid ejection head shown in FIG. 3 in the short side direction (the direction of the arrow Y in FIG. 3).

[0020] As shown in Figure 3, the liquid ejection head 20 includes multiple head bodies 21, a base member 22 as a nozzle-side joining member, a nozzle cover 23, a heat dissipation member 24, a manifold 25, a printed circuit board (PCB) 26, and a head case 27.

[0021] In this embodiment, the liquid ejection head 20 includes a plurality of head bodies 21, but the liquid ejection head of the present invention is not limited to this. The liquid ejection head of the present invention may include at least one head body, a nozzle cover that covers and protects the head body, and a nozzle-side joining member that is joined to the nozzle cover. However, the nozzle-side joining member may also constitute a part of the head body (see FIG. 16 described below).

[0022] The plurality of head bodies 21 are held by a base member 22. The base member 22 is a member having the outer peripheral surface of the liquid ejection head 20. To attach the head body 21 to the base member 22, first, the head body 21 is inserted into an opening 22e (see FIG. 4) provided in the base member 22. Next, the head body 21 is joined to a nozzle cover 23 joined to the base member 22. The nozzle cover 23 has holes 23c (see FIG. 3) formed therein corresponding to each head body 21, and the peripheral edge of the head body 21 is joined to the edge of the hole 23c. The head body 21 is then fastened and fixed to the base member 22 with screws. More specifically, flange portions of a common flow path member 35 (see FIG. 4) are provided on the front and back sides of the head body 21 in the longitudinal direction (the direction perpendicular to the plane of the paper in FIG. 4), and these flange portions are fastened to the base member 22 with screws. As a result, the common flow path member 35 is held by the base member 22, and the head body 21 is fixed. The attachment structure of the head body 21 and the base member 22 is not limited to this, and the head body 21 may be attached by adhesive, caulking, or the like.

[0023] As shown in Figure 4, the head main body 21 includes a nozzle plate 31 as a nozzle member in which nozzles 30 are provided, a flow path substrate 32 in which individual liquid chambers 41 communicating with the nozzles 30 are formed, a vibration plate 33 including a piezoelectric element 40, a holding substrate 34 laminated on the vibration plate 33, and a common flow path member 35 as a frame member laminated on the holding substrate 34.

[0024] In addition to the individual liquid chambers 41, the flow path substrate 32 is formed with supply-side individual flow paths 42 that communicate with the individual liquid chambers 41, and recovery-side individual flow paths 43 that communicate with the individual liquid chambers 41. The holding substrate 34 is formed with supply-side intermediate individual flow paths 44 that communicate with the supply-side individual flow paths 42 via the openings 33a of the vibration plate 33, and recovery-side intermediate individual flow paths 45 that communicate with the recovery-side individual flow paths 43 via the openings 33b of the vibration plate 33.

[0025] A supply-side common flow path 46 communicating with the supply-side intermediate individual flow path 44 and a recovery-side common flow path 47 communicating with the recovery-side intermediate individual flow path 45 are formed in the common flow path member (frame member) 35. The supply-side common flow path 46 communicates with a supply port 48 via a flow path 51 of the manifold 25. On the other hand, the recovery-side common flow path 47 communicates with a recovery port 49 via another flow path 52 of the manifold 25.

[0026] The printed circuit board 26 and the piezoelectric element 40 of the head main body 21 are connected via a flexible wiring member 50. In addition, a driver IC (drive circuit) 53 is mounted on the flexible wiring member 50.

[0027] The base member 22 is preferably made of a material with a low linear expansion coefficient. Examples of materials with a low linear expansion coefficient include 42 alloy (an alloy made of iron with nickel added) and invar. When the base member 22 is made of such a material, even if the temperature of the base member 22 rises due to heat generation from the liquid ejection head 20, the amount of expansion of the base member 22 is small, making it less likely for the nozzles to shift position, and thus suppressing deviation of the ink ejection position. Furthermore, by making the nozzle plate 31 and the diaphragm 33 out of a silicon single crystal substrate and making the linear expansion coefficient approximately the same as that of the base member 22, it is possible to further reduce nozzle position deviation due to thermal expansion.

[0028] FIG. 5 is a plan view showing an example of the configuration of the head unit.

[0029] In the example shown in FIG. 5, the head unit 13 includes two liquid ejection heads 20. Each liquid ejection head 20 is disposed such that its short-side direction (arrow Y direction) is aligned with the sheet conveyance direction A and its long-side direction (arrow X direction) is aligned perpendicular to the sheet conveyance direction A. Here, the "long-side direction" of the liquid ejection head 20 refers to the long-side direction (arrow X direction) of the liquid ejection head 20 extending in one direction when the liquid ejection head 20 is viewed from a direction perpendicular to the nozzle surface 31a on which the nozzles 30 (see FIG. 4) are exposed, as shown in FIG. 5. Furthermore, the "short-side direction" of the liquid ejection head 20 refers to the direction (arrow Y direction) perpendicular to the long-side direction of the liquid ejection head 20 when the liquid ejection head 20 is viewed from a direction perpendicular to the nozzle surface 31a. Furthermore, the "long-side direction" and "short-side direction" of the liquid ejection head 20 described below have the same meaning.

[0030] The head unit 13 shown in Figure 5 is a so-called line-type head unit, and when the sheet S is transported to a position opposite the head unit 13, an image is formed on the sheet S by ejecting ink from the nozzles of each head body 21 without the head unit 13 moving relative to the transported sheet S.

[0031] In addition to such a line-type head unit, there is also a so-called serial-type head unit in which ink is ejected while the liquid ejection head is moved in the main scanning direction (sheet width direction).

[0032] Figure 6 is a diagram showing an example of the configuration of a serial type head unit 60. As shown in Figure 6, the serial type head unit 60 includes a carriage 62 that carries a liquid ejection head 61, a guide member (guide rod) 63 for guiding the carriage 62 in the main scanning direction, which is the sheet width direction B, and a drive device 64 for moving the carriage 62.

[0033] The drive device 64 includes, for example, a motor 65 as a drive source, and a timing belt 68 wound around a drive pulley 66 and a driven pulley 67. When the motor 65 is driven and the drive pulley 66 rotates, the timing belt 68 moves in an orbit, causing the carriage 62 to move in the main scanning direction along the guide member 63. In addition, by switching the rotation direction of the motor 65 between one direction and the opposite direction, the carriage 62 can move back and forth in the main scanning direction.

[0034] In such a serial type head unit 60, ink is ejected from the liquid ejection head 61 in accordance with an image signal while the carriage 62 moves in the main scanning direction, thereby forming an image of one line on the stationary sheet S. Then, while the sheet S moves a predetermined amount at a time in the direction of arrow A in FIG. 6, the carriage 62 moves back and forth and the ink is ejected repeatedly, thereby forming images sequentially on the sheet S.

[0035] <Nozzle cover joint configuration> Next, the joining structure of the nozzle cover to the base member, etc. will be described using a liquid ejection head 200 in FIGS. 7 to 9, which has a base member 220 and a nozzle cover 230 different from those in the embodiment of the present invention. Note that while FIG. 3 shows an example in which eight head bodies are provided in a liquid ejection head, the following description will focus on a liquid ejection head having two head bodies. FIG. 7 is a plan view of the liquid ejection head as seen from the nozzle surface side, FIG. 8 is a view of the liquid ejection head in FIG. 7 with the nozzle cover removed, and FIG. 9 is a cross-sectional view taken along line A1-A1 in FIG. 7. The direction Z in FIG. 9, which is perpendicular to the plane of the paper in FIGS. 7 and 8, is the direction in which the base member and nozzle cover are joined together, or the thickness direction of the nozzle cover, etc., and is also the direction in which liquid is ejected from the nozzles and the opposite direction.

[0036] The nozzle cover 230 covers at least a portion of the nozzle surface 31a other than the nozzles. In this embodiment, the nozzle cover 230 covers the edge of the nozzle surface 31a and the surrounding area. The nozzle cover 230 also has a protruding portion 230a on its outer circumferential surface that protrudes further outward than the remaining portions.

[0037] 8, the base member 220 has a recess 220a at a position facing the protrusion 230a of the nozzle cover 230. The recess 220a opens toward the outer peripheral surface of the base member 220 in direction X. The recess 220a is recessed further away from the nozzle cover 230 in direction Z (toward the depth of the paper in FIG. 8) than its surrounding area.

[0038] Here, if the central side of the nozzle surface 31a (the right side in Fig. 9) is defined as the "inside" and the opposite side (the left side in Fig. 9) is defined as the "outside," then, as shown in Fig. 9, the outer portion of the nozzle cover 230 is adhered to the base member 220 via adhesive 54. The base member 220 is disposed around the nozzle plate 31, the flow path substrate 32, and the common flow path member 35, and the outer portion of the nozzle cover 230 is adhered to a surface 220b of this base member 220 facing the liquid ejection direction Z.

[0039] On the other hand, the inner portion of the nozzle cover 230 is adhered to the nozzle plate 31 and the flow path substrate 32 via adhesive 55. The flow path substrate 32 is arranged on the side opposite the nozzle surface 31a of the nozzle plate 31 (the lower surface side of the nozzle plate 31 in FIG. 9), and a part of it protrudes outward from the edge of the nozzle plate 31. The nozzle cover 230 is adhered to this part of the flow path substrate 32 protruding outward and to the periphery of the edge of the nozzle plate 31.

[0040] In this way, both the inner and outer portions of the nozzle cover 230 are adhered to the respective components via adhesives 54 and 55, and the gaps between the respective components and the nozzle cover 230 are sealed with adhesives 54 and 55, thereby preventing ink and other foreign matter from entering the interior through these gaps.

[0041] Furthermore, recesses 32a are provided in the joining portion (portion protruding outward beyond the nozzle plate 31) of the flow path substrate 32 that is joined to the nozzle cover 230. A plurality of recesses 32a are provided on both sides of the flow path substrate 32 in the longitudinal direction (see FIG. 8). By providing the recesses 32a and pouring the adhesive 55 into them in this way, the joining strength between the nozzle cover 230 and the flow path substrate 32 can be increased.

[0042] The nozzle cover 230 is formed from a metal plate. The protruding portion 230a formed on the nozzle cover 230 is a portion including a cut surface 230a1 and its surrounding area formed during the cutting process to form the nozzle cover 230. Specifically, as shown in FIG. 10, the nozzle cover 230 in the middle of processing has fixing portions 231 provided on both ends thereof. These fixing portions are provided to fix the nozzle cover 230 to equipment during a film formation process or the like during assembly, and are ultimately cut off. The protruding portion 230a remains in the final nozzle cover 230 as a portion including the end surface 230a1, which is the cut surface (the process of forming the protruding portion described above is similar to that of the nozzle cover 23 shown in FIG. 11 and the like below). Note that by partially connecting the main body of the nozzle cover 230 and the fixing portion 231 by the protruding portion 230a as shown in FIG. 10, the cut portion that ultimately remains on the nozzle cover 230 can be limited to a small area.

[0043] As described above, the end surface 230a1 of the protruding portion 230a of the nozzle cover 230 is a cut surface, and the surrounding area including the end surface 230a1 has burrs and distortions in shape due to cutting. The nozzle cover 230 and the base member 220 are joined at their flat surfaces, but the protruding portion 230a is not properly joined to the base member 220 due to the distortion in shape. Therefore, joining this portion to the base member 220 adversely affects the overall joining quality between the nozzle cover 230 and the base member 220.

[0044] 9, by providing a recess 220a at a position overlapping the protrusion 230a, the protrusion 230a is not joined to the base member 220. This makes it possible to improve the joining quality between the base member 220 and the nozzle cover 230.

[0045] However, providing the recess 220a and not joining the protrusion 230a to the base member 220 weakens the strength of the protrusion 230a. Furthermore, in the liquid ejection head 200 shown in FIG. 9, the recess 220a is provided with an opening on the outside in the longitudinal direction X, which makes it easy for a foreign object, such as a sheet, to come into contact with the end surface 230a1 of the protrusion 230a from the left side of FIG. 9. For these reasons, the impact of the foreign object can cause the nozzle cover 230 to peel off, starting from the joint C facing the recess 220a at the joint between the base member 220 and the nozzle cover 230. This can lead to the problem of ink and other contaminants entering the interior of the liquid ejection head.

[0046] Next, the liquid ejection head 20 of this embodiment will be described with reference to Figures 11 to 13. Figure 11 is a plan view of the liquid ejection head as seen from the nozzle surface side, Figure 12 is a view of the liquid ejection head in Figure 11 with the nozzle cover removed, and Figure 13 is a cross-sectional view taken along line A2-A2 in Figure 11. The following explanation will focus on the differences from the liquid ejection head 200 of Figures 7 to 9, and will omit explanations of the commonalities as appropriate. The liquid ejection head 20 of this embodiment differs from the liquid ejection head 200 mainly in the configurations of the base member 22 and the nozzle cover 23, but the other configurations are the same.

[0047] 11 to 13, the base member 22 provided in the liquid ejection head 20 has a recess 22a. The recess 22a is recessed in the direction Z, away from the nozzle cover 23. The recess 22a of this embodiment differs from the recess 220a of the base member 220 described above in that it does not face the outside of the base member 22 in the direction X (nor does it face the outside in the direction Y), but is provided inside the base member 22. In other words, when viewed from the direction Z, which is the view direction in FIG. 11, the recess 22a does not form part of the outer circumferential surface on either side in the direction X or the direction Y, and is provided inside the base member 22.

[0048] In this embodiment, the nozzle cover 23 is also provided with a protruding portion 23a corresponding to the protruding portion 230a in FIG. 9. The recessed portion 22a is provided at a position facing the protruding portion 23a of the nozzle cover 23. This facing position means that the protruding portion and the recessed portion overlap when viewed in direction Z, which is the direction perpendicular to the paper surface of FIG. 11. It is sufficient that at least a portion of the recessed portion 22a is provided at a position facing at least a portion of the protruding portion 23a. This makes it possible to improve the bonding quality of the nozzle cover 23 to the base member 22, as described above.

[0049] In this embodiment, as shown in Fig. 13, the recess 22a is provided on the inside of the base member 22. In other words, a portion of the base member 22 including the outer peripheral surface 22c is provided outside the protruding portion 23a of the nozzle cover 23. This makes it possible to prevent a foreign object such as a sheet from coming into contact with the end surface 23a1 of the protruding portion 23a, even if the foreign object collides with the liquid ejection head from the left direction in Fig. 13. This makes it possible to prevent the nozzle cover 23 from peeling off from the base member 22 at the joint C between the nozzle cover 23 and the base member 22, which faces the recess 22a.

[0050] In the above description, the nozzle cover 23 has a protruding portion 23a that partially protrudes beyond its surrounding area. However, the present invention is not limited to this. For example, as shown in FIG. 14, the fixing portion 23A may be cut using the entire end surface of the nozzle cover 23 in the left-right direction in FIG. 14 as the cutting surface. In this case, the entire end surface 23b1 serves as the cutting surface when the fixing portion 23A is cut. The recess 22a of the base member 22 is provided opposite the distorted portion 23b including this end surface 23b1. The distorted portion formed in the nozzle cover is a portion whose shape is partially deformed compared to its surrounding area. For example, this may be a portion with burrs formed during cutting, a portion that partially protrudes toward the base member (nozzle-side joining member) due to warping of the end, a portion that warps toward the opposite side of the base member (nozzle-side joining member), or a portion that is more uneven than the surrounding area. For example, in the nozzle cover 23 of this embodiment, the distorted portion 23b has a warp or burrs formed on the end surface 23b1 side due to the cutting process, and its shape is partially changed compared to the surrounding flat portion formed by the plate material. The distorted portion 23b is a portion that includes at least the end surface 23b1. The distorted portion 23a of this embodiment is a portion that includes the cut surface and its vicinity, and is also a part (or the entirety) of the nozzle cover 23 that is closer to the end surface 23b1 than the flow path substrate 32 or the nozzle plate 31, including the end surface 23b1. The recess 22a (or through hole) may be located at least partially or entirely facing the distorted portion 23b, and the recess 22a of this embodiment is located at least facing the cut surface of the nozzle cover. This improves the bonding quality between the nozzle cover and the base member. Similarly, as shown in FIG. 13, the recess 22a (or through hole) facing the distorted portion may be located inside the base member 22, thereby preventing the nozzle cover 23 from peeling off from the base member 22. Note that protrusions or distortions may be formed on the vertical end surfaces of the nozzle cover 23 in Fig. 14. The distortions do not have to be formed by cutting.

[0051] In the above embodiment, as shown in Fig. 11, one recess 22a (two in total) is provided corresponding to each head body, but the number and size of the recesses 22a are not limited to this. For example, the recess 22a may be provided so as to face the entire end face 23b1 of Fig. 14 above, or multiple recesses 22a may be provided so as to face the end face 23b1.

[0052] In the above description, recesses are provided at positions corresponding to protruding or distorted portions of the base member, but through holes may also be provided. Furthermore, as shown in FIG. 15, a through hole 22d may be provided in the base member 22, and this through hole 22d may be a screw hole for fastening to another member. The through hole 22d has a small diameter portion where a screw 28 is inserted, the diameter of which is smaller than that of the other portions. In FIG. 15, a screw 28 is fastened to the through hole 22d and the fastening hole 25a of the manifold 25, thereby fixing the base member 22 and the manifold 25 together.

[0053] Alternatively, the recess 22a or through-hole provided in the base member 22 may be filled with adhesive. This allows the base member 22 and the protrusion 23a of the nozzle cover 23 to be bonded together. In this case, the protrusion 23a is bonded to the adhesive filled in the recess 22a of the base member 22, so that distortion of the shape of the protrusion 23a can be absorbed within the recess 22, without adversely affecting the overall bonding quality between the nozzle cover 23 and the base member 22. This further improves the bonding strength of the nozzle cover to the base member. By providing the recess 22a or through-hole on the inside of the base member 22 as in this embodiment, the adhesive 54 filled in the recess 22a or through-hole can be prevented from leaking out, thereby realizing this configuration. Methods for filling the recess 22a or through-hole with adhesive include increasing the amount of adhesive 54 or increasing the force used to press the nozzle cover 23 against the base member 22 when bonding them together.

[0054] 16, the base member 22 (see FIG. 13) is not provided. Instead, a common flow path member (frame member) 35 serving as a nozzle-side joining member constitutes the frame portion of the head main body and the frame portion of the liquid ejection head. The nozzle cover 23 is joined to the common flow path member 35. Specifically, the common flow path member 35 has an outer periphery 35A arranged around (outside of) the nozzle plate 31 and the flow path substrate 32. The outer periphery 35A is a portion corresponding to the base member in the above-described embodiment. A recess 35a is provided in the outer periphery 35A in a portion on the inside of the common flow path member 35 that does not face the outside. The recess 35a faces the protrusion 23a of the nozzle cover 23.

[0055] In this embodiment as well, by providing the recess 35a in a portion of the inner side of the common flow path member 35 that does not face the outside, peeling of the nozzle cover 23 from the common flow path member 35 can be suppressed.

[0056] <Laminated substrate bonding structure> Next, the joining configuration of the common flow path member on the opposite side of the nozzle cover side of the liquid ejection head will be described with reference to Figures 18 and 19, which show a liquid ejection head according to another embodiment of the present invention. Figure 18 is a perspective view of the liquid ejection head and cover according to one embodiment of the present invention, and Figure 19 is a cross-sectional view taken along line A of Figure 18.

[0057] As shown in FIG. 18, a cover 74 covers the liquid ejection head 20 on the side opposite to the nozzle plate 31 side.

[0058] 19, the liquid ejection head 20, like the embodiment described above, has a nozzle plate 31, a flow path substrate 32, a vibration plate 33, a piezoelectric element 40, a common flow path member 35 as a first bonding member, etc. The liquid ejection head 20 also has a first damper frame 71 as a first substrate, a second damper frame 72 as a second substrate, a damper member 73, etc., and these members are stacked and bonded in the vertical direction in Fig. 19 to form a laminated substrate section 79. A common flow path 70 is formed in the common flow path member 35.

[0059] The damper member 73 is a flexible member. The damper member 73 is sandwiched between a first damper frame 71 and a second damper frame 72. The first damper frame 71 holds the damper member 73 from the side of the nozzle plate 31 having the nozzles 30. The second damper frame 72 holds the damper member 73 from the side opposite the nozzle plate 31 having the nozzles 30.

[0060] The flow path shapes of the flow path substrate 32, the first damper frame 71 and the second damper frame 72 can be formed by etching a substrate made of SUS with an acid etching solution, or by machining such as punching.

[0061] FIG. 20 is a perspective view showing the stacked state of each substrate in the manufacturing process of a liquid ejection head different from this embodiment.

[0062] 20, the substrates 501, 502, and 503 made of stainless steel are stacked one on top of the other. These substrates 501, 502, and 503 are members that correspond to the aforementioned damper frame, for example. Each of the substrates 501, 502, and 503 has a gripping portion 504 on each longitudinal side via connecting portions 501a, 502a, and 503a.

[0063] The gripping portion 504 is a gripping portion for holding these substrates when performing various operations such as bonding these substrates during the manufacturing process of the liquid ejection head. Therefore, since the gripping portion is unnecessary for the final product, the gripping portion 504 is separated from the substrates 501, 502, and 503 by cutting the connecting portion during the manufacturing process.

[0064] However, if the connection portions 501a, 502a, and 503a are arranged in a stacked manner as shown in Figure 20, the thickness increases, making cutting difficult. Therefore, it is preferable to arrange the connection portions 501a, 502a, and 503a in a staggered manner, as shown in Figure 21. For this reason, in this embodiment as well, the connection portions are arranged in a staggered manner.

[0065] Fig. 22 is a perspective cross-sectional view showing the stacked structure of the common flow path member, first damper frame, and second damper frame of this embodiment. Fig. 22 shows one end in the longitudinal direction where the connection part is provided. Fig. 23 is a plan view, and Fig. 24 is a front view.

[0066] As shown in FIG. 22, the first damper frame 71 has a lower layer convex portion 71a as a first convex portion, and the second damper frame 72 has an upper layer convex portion 72a as a second convex portion.

[0067] 22 is the protruding direction of the lower layer convex portions 71a and the upper layer convex portions 72a. However, in the present invention, the lower layer convex portions 71a and the upper layer convex portions 72a are not necessarily limited to extending in a direction parallel to the direction X. The direction X is also the longitudinal direction of the first damper frame 71 and the common flow path member 35. The direction Y is the lateral direction of the first damper frame 71 and the common flow path member 35. The direction Z is the stacking direction of the substrates in the stacked substrate portion 79 and the common flow path member 35. The directions X, Y, and Z are perpendicular to each other.

[0068] The lower layer convex portion 71a and the upper layer convex portion 72a are arranged offset in direction Y and do not overlap when viewed in the stacking direction. Furthermore, the upper layer convex portion 72a is provided further outward in direction Y of the common flow path member 35 than the lower layer convex portion 71a. During the manufacturing process of the liquid ejection head, the lower layer convex portion 71a and the upper layer convex portion 72a are connection portions that connect the grip portion and the damper frame side as described above, and in the liquid ejection head, they are convex portions having cut surfaces on their end faces.

[0069] The convex portions provided on the laminated substrate portion 79 in this embodiment are a lower layer convex portion 71a and an upper layer convex portion 72. In this embodiment, of the substrates provided on the laminated substrate portion 79, the second damper frame 72, which is the second substrate, is the substrate having the convex portion arranged outermost in the direction Y of the common flow path member 35.

[0070] The common flow path member 35 has first grooves 35b at positions facing the lower layer convex portions 71a in the stacking direction, and second grooves 35c at positions facing the upper layer convex portions 72a. The second grooves 35c are provided deeper in the Z direction than the first grooves 35b.

[0071] The lower-layer convex portion 71a and the upper-layer convex portion 72a are portions whose shape is distorted when cut during the manufacturing process, and correspond to the protrusions 23a (distorted portions) in FIG. 10 and other figures of the aforementioned embodiment. Therefore, similar to the aforementioned embodiment, by providing the first grooves 35b or the second grooves 35c opposite the lower-layer convex portion 71a or the upper-layer convex portion 72a, the joining quality between the first damper frame 71 or the second damper frame 72 and the common flow path member 35 can be improved. For example, as shown in FIG. 25, even if the tip of the lower-layer convex portion 71a is bent, this portion can be deflected toward the first grooves 35b, preventing the bent portion of the lower-layer convex portion 71a from interfering with the flat portion of the common flow path member 35, thereby preventing a deterioration in the joining quality between them.

[0072] An adhesive 90 is applied between the common flow path member 35 and the first damper frame 71 to bond them together. At this time, the adhesive 90 is also applied between the lower-layer convex portion 71a and the first groove portion 35b, as shown in Figure 22, and this adhesive 90 comes into contact with at least the bottom surface of the lower-layer convex portion 71a. The bottom surface of the lower-layer convex portion 71a is the lower surface in Figure 22, and is the surface of the lower-layer convex portion 71a that faces the common flow path member 35.

[0073] Next, a procedure for joining the common flow path member 35 to the first damper frame 71 and the second damper frame 72, which is part of the method for manufacturing the liquid ejection head, will be described.

[0074] First, with the gripping portions connected to the first damper frame 71 and the second damper frame 72, the first damper frame 71, the damper member 73, and the second damper frame 72 are joined together with an adhesive (first joining step). Next, of the connection portions (protruding portions after cutting) connecting these members to the gripping portions, all but the connection portion located on the outermost side in the direction Y are cut, and the gripping portions are separated from the damper frame (first cutting step). As shown in FIG. 26 , the outermost connection portion in this embodiment is the second connection portion 91a (upper-layer protruding portion 72a after cutting) provided on the second damper frame 72, and in the first cutting step, the connection portion corresponding to the lower-layer protruding portion 71a is separated. Furthermore, when gripping portions are connected to both sides of the damper frame, the outermost connection portion refers to the connection portion (protruding portion) located on the outermost side of each surface.

[0075] In the first cutting step, the connecting portions other than the outermost connecting portion 91a are cut off, so that only the second damper frame 72 is connected to the grip portion 91 via the connecting portion 91a.

[0076] Then, adhesive 90 is applied to the common flow path member 35, and the bonded substrate portion 79 is bonded to the common flow path member 35 (second bonding process). At this time, the bonded substrate portion 79 is held by gripping the gripping portion connected to the second damper frame 72, and the bonding operation of the bonded substrate portion 79 and the common flow path member 35 is performed. In this second bonding process, the adhesive 90 is also applied between the convex portions and the groove portions, including the first convex portion 71a and the first groove portion 35b. Then, as shown in FIG. 27, a cutting member 92 is used to cut at the upper convex portion 72a, and the unnecessary gripping portion 91 is separated from the second damper frame 72 (second cutting process). Through the above processes, the bonding operation of the common flow path member 35 and the laminated substrate portion is completed.

[0077] Incidentally, in the second cutting step, when the upper layer convex portion 72a is cut by the cutting member 92, a force is applied to the first damper frame 71 in a direction D that causes the first damper frame 71 to peel off from the common flow path member 35. For this reason, if the bonding strength between the laminated substrate portion 79 and the common flow path member 35 is weak, the first damper frame 71 will peel off from the common flow path member 35.

[0078] In contrast, in this embodiment, as described above, adhesive is applied between the lower-layer convex portion 71a and the first groove portion 35b, and this adhesive is brought into contact with at least the bottom surface of the lower-layer convex portion 71a. This increases the bonding strength between the first damper frame 71 and the common flow path member 35, and makes it possible to prevent the first damper frame 71 from peeling off from the common flow path member 35 when the connecting portion 91a (upper-layer convex portion 72a) is cut. Note that the adhesive applied between the lower-layer convex portion 71a and the first groove portion 35b also comes into contact with at least some portion of the common flow path member 35.

[0079] 24, a portion of the joint surface 35e of the common flow path member 35, which has a joint portion that is joined to the first damper frame 71, protrudes to the right in FIG. 24 beyond the first damper frame 71 (the end surface excluding the lower-layer convex portion). In other words, a portion 35e1 in range E in FIG. 24 protrudes. This portion 35e1 faces the upper-layer convex portion 72a in the stacking direction. This configuration can reduce the distance in the stacking direction from the upper-layer convex portion 72a to the common flow path member 35, making it easier to hold adhesive 90 between the portion 35e1 and the upper-layer convex portion 72a and join them together. The right side of FIG. 24 is the side from which the upper-layer convex portion 72a protrudes.

[0080] Also in this embodiment, as in the embodiment on the nozzle cover side shown in Fig. 13, the outer peripheral portion 35B of the common flow path member 35 is provided outside the convex portion, which is the distorted portion. This makes it possible to prevent foreign matter from coming into contact with the end face of the convex portion, and to prevent each laminated member having a convex portion from peeling off from the common flow path member 35.

[0081] 28, the height in the stacking direction of the outer circumferential portion 35B of the common flow path member 35 is set to be higher than the stacked substrate portion 79. This makes it possible to prevent other members from coming into contact with the upper layer convex portion 72a and applying a load thereto.

[0082] 22, the adhesive 90 that bonds the bottom surface of the lower-layer convex portion 71a to the first groove portion 35b may be in contact with the side surfaces of the lower-layer convex portion 71a (the surfaces on both sides in the Y direction) or the end surface 71b of the first damper frame 71. Either or both of these can increase the bonding area between the common flow path member 35 and the first damper frame 71, thereby improving the bonding strength. This can prevent the first damper frame 71, the second damper frame 72, and the like from peeling off from the common flow path member 35. The end surface 71b is the surface on which the lower-layer convex portion 71a of the first damper frame 71 is formed, or in other words, the surface to which the base portion of the lower-layer convex portion 71a is connected.

[0083] Furthermore, in this embodiment, adhesive 90 is also applied between the upper-layer convex portion 72a of the second damper frame 72 and the second groove portion 35c, and this adhesive 90 is in contact with at least the bottom surface of the upper-layer convex portion 72a. This increases the adhesive strength between the second damper frame 72 and the common flow path member 35 and prevents the first damper frame 71, the second damper frame 72, and other components from peeling off from the common flow path member 35. Furthermore, the adhesive 90 applied between the upper-layer convex portion 72a and the second groove portion 35c can also be brought into contact with the side surface of the upper-layer convex portion 72a or the end surface 72b (the surface on which the upper-layer convex portion 72a is formed) of the second damper frame 72. By using either or both of these methods, the adhesive area between the common flow path member 35 and the second damper frame 72 can be increased, thereby improving the bonding strength. This further prevents the first damper frame 71, the second damper frame 72, and other components from peeling off from the common flow path member 35.

[0084] 22 and 23, the second damper frame 72 has a plurality of through holes 72c, and the first damper frame 71 has a plurality of through holes 71c. The through holes 71c and 72c are provided between the lower-layer convex portion 71a and the common flow path 70 of the common flow path member 35 in the direction X. These through holes have a substantially circular cross section. The through holes 71c and 72c are connected to each other, but this is not necessarily limited to this. Furthermore, when the stacked substrate portion 79 is composed of three or more substrates, it is preferable that through holes be formed in all of the substrates.

[0085] By providing the through holes 71c and 72c, it is possible to reduce the strength of these portions of the stacked first damper frame 71 and second damper frame 72. Therefore, even if the first damper frame 71 is peeled off from the common flow path member 35 in the second cutting step of FIG. 27, the peeling range can be limited to the portion where the weaker through hole 71c or through hole 72c is provided. This prevents the first damper frame 71 from peeling off the portion of the common flow path member 35 where the common flow path 70 is provided, and prevents ink from leaking from the common flow path 70. The positions where the through holes 71c and 72c are provided may be different.

[0086] 29, it is preferable that the lower layer convex portion 71a or the upper layer convex portion 72a, which is the convex portion to which the adhesive 90 is applied, be curved toward the common flow path member 35. This increases the adhesive application area of ​​these convex portions to which the adhesive 90 is applied, and improves the bonding strength to the common flow path member 35.

[0087] 30, the width of the first damper frame 71 in the direction Y is preferably set smaller than that of the common flow path member 35. This makes it possible to prevent the adhesive 90 applied between the common flow path member 35 and the first damper frame 71 from leaking out to the outer periphery of the common flow path member 35. Note that since the outer periphery of the common flow path member 35 is used for positioning with other members, it is desirable that the adhesive 90 not leak out to this portion.

[0088] Furthermore, if the convex portions to be contacted with the adhesive applied between the grooves and convex portions of the common flow path member 35 are only the lower-layer convex portions among the multiple convex portions, or only some of the convex portions including the lower-layer convex portions, it is preferable that the convex portions are not the outermost convex portions. For example, in this embodiment, if the adhesive is to be applied to only one of the convex portions, as shown in FIG. 22 , it is preferable that the adhesive applied between the first grooves 35b and the lower-layer convex portions 71a be applied to the lower-layer convex portions 71a, rather than the upper-layer convex portions 72a, which are the outermost in the direction Y of the common flow path member 35. As described above, in order to hold each damper frame in the second joining step, the gripping portions must be connected to at least one of the members. In this case, connecting the outermost convex portions to the gripping portions while leaving them as connecting portions facilitates the cutting operation in the second cutting step. Conversely, by bonding the inner convex portions with adhesive, the bonding strength between the first damper frame 71 and the common flow path member 35 can be improved without impeding the workability in the second cutting step. The outermost side of the common flow path member 35 in the direction Y refers to the side of the common flow path member 35 that is closest to either end of the central position in the direction Y, when the central position of the common flow path member 35 is defined as the inner side.

[0089] 22, the second groove 35c facing the outermost upper layer protrusion 72a is preferably deeper than the other grooves (first groove 35b in this embodiment), which makes it easier to insert a cutting member in the second cutting step and improves workability.

[0090] Furthermore, the second groove portion 35c facing the outermost upper layer convex portion 72a is preferably provided extending to the end portion in the direction Y of the common flow path member 35. This makes it easier to insert a cutting member in the second cutting step, improving the workability.

[0091] As shown in Figure 31, the widths of the first groove 35b and the second groove 35c can also be increased outward in the direction Y. This makes it easier to insert a cutting tool into the first groove 35b or the second groove 35c, improving the workability of the cutting operation using the cutting tool. However, the width of either the first groove 35b or the second groove 35c may also be increased outward. Furthermore, the width is not limited to the tapered shape shown in Figure 31, and may be increased in stages, for example.

[0092] Furthermore, it is preferable that the outermost convex portion of each substrate provided in the laminated substrate portion be the thinnest convex portion of all the convex portions, which can reduce stress generated during cutting in the second cutting step and prevent the first damper frame 71 and the like from peeling off from the common flow path member 35.

[0093] In the above description, the laminated substrate is made up of two substrates having protrusions (connecting members), namely, first damper frame 71 and second damper frame 72. However, the present invention is not limited to this.

[0094] 32 has a first damper frame 71 as a first substrate, a second damper frame 72 as a second substrate, a damper member 73, and a first damper manifold 75 as a first substrate, and a second damper manifold 76. Starting from the common flow path member 35 side, the first damper manifold 75, the first damper frame 71, the damper member 73, the second damper frame 72, and the second damper manifold 76 are stacked and joined in this order. In this embodiment, the first substrate joined to the common flow path member 35, which is the first joining member, is the first damper manifold 75.

[0095] As shown in FIG. 33 , the convex portions provided on the laminated substrate portion 79 include lower-layer convex portions 71a as first convex portions of the first damper frame 71 and upper-layer convex portions 72a as second convex portions of the second damper frame 72, as well as lowermost-layer convex portions 75a as first convex portions of the first damper manifold 75 and uppermost-layer convex portions 76a of the second damper manifold 76. The convex portions are provided in the order of upper-layer convex portions 72a, lowermost-layer convex portions 75a, uppermost-layer convex portions 76a, and lower-layer convex portions 71a from the outside of the common flow path member 35. In this embodiment, the second substrate having the upper-layer convex portions 72a, which are convex portions arranged furthest outward in the direction Y, is the second damper frame 72. Furthermore, convex portions other than the upper-layer convex portions 72a are cut in the first cutting process, and the upper-layer convex portions 72a are cut in the second cutting process.

[0096] The lowermost layer convex portion 75a, the uppermost layer convex portion 76a, and the lower layer convex portion 71a face the first groove portion 35b. The upper layer convex portion 72a faces the second groove portion 35c. The convex portions are provided in positions where they do not overlap. Hereinafter, the configuration of the liquid ejection head in Figure 33 will be referred to as Example A.

[0097] In this embodiment, the adhesive 90 applied between the lowermost convex portion 75a and the first groove portion 35b is brought into contact with the bottom surface of the lowermost convex portion 75a, and the adhesive 90 applied between the lowermost convex portion 71a and the first groove portion 35b is brought into contact with the bottom surface of the lowermost convex portion 71a. However, the adhesive 90 may be brought into contact with only either the lowermost convex portion 75a or the lowermost convex portion 71a. By using at least one of these methods, the bonding strength between these stacked components and the common flow path member 35 can be improved and peeling of these components, particularly the first damper manifold 75, from the common flow path member 35 can be suppressed. However, the adhesive 90 applied between other convex portions and groove portions can be brought into contact with at least the bottom surface of the convex portion, or the adhesive may be brought into contact with the side surface of the convex portion or the end surface of the component having the convex portion. This improves the bonding strength between these stacked components and the common flow path member 35 and suppresses peeling of these components from the common flow path member 35.

[0098] This embodiment can also employ the configurations of the previous embodiments. For example, the second groove 35c is deeper than the first groove 35b. A through hole is formed in each damper frame and each damper manifold between the convex portion and the common flow path 70. While FIG. 33 illustrates the through hole 76c in the second damper manifold 76, similar through holes are formed in the other substrates. The second groove 35c extends to the left-right ends of the common flow path member 35 in FIG. 33. The outermost upper-layer convex portion 72a has the smallest thickness of all the convex portions. Furthermore, as shown in FIG. 34, the first groove 35b and the second groove 35c increase in width outward. As shown in FIG. 35, a portion of the joint surface of the common flow path member 35, which is joined to the first damper manifold 75, protrudes to the right in FIG. 35 beyond the first damper manifold 75 (the end surface excluding the bottom-layer convex portion 75a). The height of the outer peripheral portion 35B of the common flow path member 35 is higher than that of the second damper manifold 76. Also, like the first damper frame 71 in FIG. 30, the end faces of the first damper manifold 75 in the left-right direction in FIG. 30 are located more inward than the end faces of the common flow path member 35.

[0099] The arrangement order of the convex portions in the direction Y is not limited to the above example. For example, in FIG. 36 , the top layer convex portions 76a, the bottom layer convex portions 75a, the upper layer convex portions 72a, and the lower layer convex portions 71a are arranged in this order from the outside in the direction Y. In this case, it is particularly preferable that the bottom layer convex portion 75a, which is the second from the outside, contacts the adhesive between the convex portion and the groove portion of the common flow path member 35. This increases the strength of the portion closest to the top layer convex portion 76a when cutting the outermost top layer convex portion 76a in the second cutting step. This prevents the first damper manifold 75 and other components from peeling off in the second cutting step. Of course, convex portions other than the bottom layer convex portions 75a may contact the adhesive between the convex portions and the groove portion of the common flow path member 35.

[0100] Figure 37 shows a liquid ejection head of Example B, which is another example. As shown in Figure 37, this example differs from the example shown in Figure 33 in that, from the outside, lower layer convex portions 71a, upper layer convex portions 72a, uppermost layer convex portions 76a, and lowermost layer convex portions 75a are provided on the common flow path member 35. The lower layer convex portions 71a and the upper layer convex portions 72a face the second groove portions 35c. The uppermost layer convex portions 76a and the lowermost layer convex portions 75a face the first groove portions 35b.

[0101] The adhesive 90 applied between the lowermost convex portion 75a and the first groove portion 35b contacts at least the bottom surface of the lowermost convex portion 75a. The adhesive 90 applied between the lowermost convex portion 71a and the second groove portion 35c contacts at least the bottom surface of the lowermost convex portion 71a. The first damper manifold 75 having the lowermost convex portion 75a, which is the first convex portion, is the first substrate of this embodiment. Also, for example, the first damper frame 71 having the lowermost convex portion 71a, which is the outermost convex portion, can be the second substrate.

[0102] Unlike the previous embodiment, the thickness of the outermost lower layer convex portion 71a is not smaller than that of the other convex portions. As in the previous embodiment, the bottom layer convex portion 75a is in contact with the adhesive 90 applied between the bottom layer convex portion 75a and the first groove portion 35b.

[0103] FIG. 38 shows a liquid ejection head of Example C, which is yet another example. As shown in FIG. 38, this embodiment differs from the embodiments of FIGS. 33 and 35 in that, from the outside, an upper layer convex portion 72a, an uppermost layer convex portion 76a, a lower layer convex portion 71a, and a lowermost layer convex portion 75a are provided on the common flow path member 35. The upper layer convex portion 72a faces the second groove portion 35c. The lower layer convex portion 71a and the lowermost layer convex portion 75a face the first groove portion 35b. In addition, a protrusion 35d is provided between the first groove portion 35b and the second groove portion 35c, protruding beyond these portions. The protrusion 35d has the same height as the peripheral portion of the common flow path member 35 other than the groove portions. The uppermost layer convex portion 76a faces the protrusion 35d.

[0104] The adhesive 90 applied between the lowermost layer convex portion 75a and the first groove portion 35b contacts at least the bottom surface of the lowermost layer convex portion 75a. The adhesive 90 applied between the lower layer convex portion 71a and the first groove portion 35b contacts at least the bottom surface of the lower layer convex portion 71a. The lowermost layer convex portion 75a or the lower layer convex portion 71a can be the first convex portion, and the first damper manifold 75 or the first damper frame 71 can be the first substrate having the first convex portion. Alternatively, the second damper frame 72 having, for example, the upper layer convex portion 72a, which is the outermost convex portion, can be the second substrate.

[0105] Unlike the previous embodiment, the thickness of the outermost upper-layer convex portion 72a is not smaller than that of the other convex portions. In this embodiment, as shown in Figures 38 and 39, the through holes, such as the through hole 76c formed in the second damper manifold 76, have a rectangular cross section. The through holes 76c are regularly arranged. As shown in Figure 40, the outer peripheral portion 35B is at the same height as the joint with the second damper manifold 76 and is lower than the laminated substrate portion.

[0106] In the above Examples A to C, too, by bringing the adhesive applied between the first convex portion and the first groove portion into contact with the first convex portion, it is possible to increase the adhesive strength between the laminated substrate portion and the common flow path member 35. Therefore, peeling of the laminated substrate portion, particularly the first damper manifold 75, from the common flow path member 35 can be suppressed.

[0107] The test conditions and results of the peel strength tests for the above Examples A to C and Comparative Example will be described.

[0108] 41 to 43, a liquid ejection head of a comparative example different from the embodiment of the present invention will be described.

[0109] As shown in Figure 41, a common flow path member 350 is formed by stacking a first damper manifold 750 having a lowermost layer convex portion 750a, a first damper frame 710 having a lower layer convex portion 710a, a damper member 730, a second damper frame 720 having an upper layer convex portion 720a, and a second damper manifold 760 having an uppermost layer convex portion 760a.

[0110] Starting from the outside, the common flow path member 350 is provided with a lower layer convex portion 710a, an upper layer convex portion 720a, an uppermost layer convex portion 760a, and a lowermost layer convex portion 750a. Grooves 350b are provided in the common flow path member 350 facing these convex portions. That is, in the comparative example, the depth of the grooves facing the convex portions is uniform. Furthermore, the adhesive 90 does not overflow onto the convex portion side, and no adhesive is applied between each convex portion and the grooves 350b.

[0111] Furthermore, no through holes are formed in the second damper manifold 760 etc. As shown in Fig. 42, the width of the groove portion 350b is uniform in the vertical direction in Fig. 42. As shown in Fig. 43, the height of the outer peripheral portion 350B of the common flow path member 350 is the same as the portion joined to the second damper manifold 760, and is set lower than the second damper manifold 760 and other stacked members.

[0112] The test evaluated the following three items. Evaluation 1: Peel strength and extension of peel when load is applied to the convex part Evaluation 2: Flow path leak occurrence rate in the second cutting process Evaluation 3: Applicability rate of cutting materials

[0113] In Evaluation 1, a peel test was conducted in which a load was applied to the outermost convex portion in a direction that would cause the first damper manifold to peel off from the common flow path member, and the load at the time of peeling and the extent to which the peeling extended were evaluated. In Evaluation 2, after the first bonding process, first cutting process, second bonding process, and second cutting process described above were performed, the sealing ability of the flow path provided in the liquid ejection head was evaluated by a leak test. In Evaluation 3, a commercially available cutting tool such as nippers was used to determine whether the second cutting process could be performed. The following three criteria were used to determine whether the second cutting process could be performed: 1) whether the blade of the cutting tool could reach the convex portion, 2) whether the convex portion could be cut, and 3) whether peeling did not occur due to cutting. For each example and comparative example, 30 liquid ejection heads were used for Evaluations 1 and 2, and 15 different cutting tools were used for Evaluation 3.

[0114] The results of the above evaluation tests are shown in Table 1. [Table 1]

[0115] In Evaluation 1, the peel strength of the Comparative Example was 1.1 [N], while Examples A to C had 2.6, 2.2, and 2.3, all of which were more than twice the strength of the Comparative Example. This is because in each Example, the adhesive was allowed to overflow onto the groove side, and the adhesive was applied between the convex portion and the groove portion (particularly the first convex portion and the first groove portion) and brought into contact with the convex portion, thereby increasing the bonding strength. In particular, Example A, which implemented the most measures, had the best peel strength.

[0116] Furthermore, in the comparative example, the peeling reached the flow path, whereas in examples A to C, the peeling was limited to the through-hole. Thus, by providing through-holes between the convex portions and the flow path, the effect of limiting the spread of the peeling to the through-hole portion can be achieved. Therefore, in evaluation 2, ink leakage occurred in 36.7% of cases in the comparative example, while it was 0% in examples A to C.

[0117] Furthermore, in Evaluation 3, the application rate for the Comparative Example was 6.7%, while the application rates for Examples A to C were 86.7%, 86.7%, and 80%, respectively. Examples A to C are superior to the Comparative Example because the depth of the outer second groove portion 35c is deeper than the first groove portion 35b, making it easier to insert the cutting tool. Also, Examples A and B are superior to Example C because the width of the groove portion is increased toward the outside.

[0118] As described above, Examples A to C are superior to the comparative example in terms of the bonding strength with the common flow path member and the workability in the second cutting step.

[0119] Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and it goes without saying that various modifications can be made without departing from the spirit of the present invention.

[0120] The foreign matter that collides with the liquid ejection head may be a sheet onto which the liquid is ejected or a foreign matter on the sheet, but the present invention is not limited to this. The present invention can also be applied to a liquid ejection head provided in a liquid ejection device that does not transport a sheet.

[0121] Next, an electrode and electrochemical element manufacturing apparatus will be described as a liquid ejection apparatus equipped with the above-described liquid ejection head, with reference to Fig. 17. Fig. 17 is a schematic diagram showing an example of an electrode manufacturing apparatus according to an embodiment of the present invention. The electrode manufacturing apparatus is an apparatus that manufactures an electrode including a layer having an electrode material by ejecting a liquid composition using a liquid ejection head.

[0122] The discharge means provided in the electrode manufacturing apparatus shown in FIG. 17 is a liquid discharge head according to the embodiment of the present invention. A liquid composition is applied to a target object by being discharged from the liquid discharge head, thereby forming a liquid composition layer. The target object (hereinafter, sometimes referred to as a "discharge target") is not particularly limited as long as it is an object on which a layer containing an electrode material is to be formed, and can be appropriately selected depending on the purpose. For example, the target object may be an electrode substrate (current collector), an active material layer, a layer containing a solid electrode material, or the like. The target object may also be an electrode mixture layer containing an active material on an electrode substrate (current collector). The discharge means and discharge step may also be a means and step for forming a layer containing an electrode material by directly discharging the liquid composition, as long as it is possible to form a layer containing an electrode material on the discharge target object. The discharge means and discharge step may also be a means and step for forming a layer containing an electrode material by indirectly discharging the liquid composition.

[0123] Other components included in the manufacturing apparatus for an electrode mixture layer are not particularly limited as long as they do not impair the effects of the present invention, and can be selected appropriately depending on the purpose. Furthermore, other steps included in the manufacturing method for an electrode mixture layer are also not particularly limited as long as they do not impair the effects of the present invention, and can be selected appropriately depending on the purpose. For example, components and steps included in the manufacturing apparatus and manufacturing method for an electrode mixture layer include a heating means and a heating step.

[0124] The heating means included in the manufacturing device for the electrode mixture layer is a means for heating the liquid composition ejected by the ejection means. Also, the heating step included in the manufacturing method for the electrode mixture layer is a step of heating the liquid composition ejected in the ejection step. By heating the liquid composition, the liquid composition layer can be dried.

[0125] Here, as an example of an electrode manufacturing apparatus, an electrode manufacturing apparatus that forms an electrode mixture layer containing an active material on an electrode substrate (current collector) will be described. As shown in Fig. 17, the electrode manufacturing apparatus includes a discharge process unit 610 that includes a process of applying a liquid composition to a printing substrate 604 having an object to be discharged to form a liquid composition layer, and a heating process unit 620 that includes a heating process of heating the liquid composition layer to obtain an electrode mixture layer.

[0126] The electrode manufacturing apparatus includes a conveying unit 605 that conveys a printing substrate 604. The conveying unit 605 conveys the printing substrate 604 at a preset speed through a discharge process unit 610 and a heating process unit 620 in that order. The method for manufacturing the printing substrate 604 having a discharge target such as an active material layer is not particularly limited, and any known method can be appropriately selected. The discharge process unit 610 includes a liquid discharge head 20 that performs an application step of applying a liquid composition onto the printing substrate 604, a storage container 601 that stores a liquid composition 607, and a supply tube 602 that supplies the liquid composition 607 stored in the storage container 601 to the liquid discharge head 20.

[0127] In the ejection process unit 610, a liquid composition 607 is ejected from the liquid ejection head 20 and applied to the printing substrate 604, thereby forming a thin film of the liquid composition layer. The storage container 601 may be integrated with the manufacturing apparatus for the electrode mixture layer, or may be detachable from the manufacturing apparatus for the electrode mixture layer. The storage container 601 may be a container used for adding the liquid to a storage container integrated with the manufacturing apparatus for the electrode mixture layer, or a storage container detachable from the manufacturing apparatus for the electrode mixture layer.

[0128] The storage container 601 and the supply tube 602 can be arbitrarily selected as long as they can stably store and supply the liquid composition 607 .

[0129] In the heating process section 620, a solvent removal step is carried out in which the solvent remaining in the liquid composition layer is heated and removed. Specifically, the solvent remaining in the liquid composition layer is heated and dried by the heating device 603 in the heating process section 620, thereby removing the solvent from the liquid composition layer. This results in the formation of an electrode mixture layer. The solvent removal step in the heating process section 620 may also be carried out under reduced pressure.

[0130] The heating device 603 is not particularly limited and can be appropriately selected depending on the purpose. For example, the heating device 603 can be a substrate heater, an IR heater, a hot air heater, or the like. The heating device 603 may also be a combination of at least two of the substrate heater, the IR heater, and the hot air heater. The heating temperature and heating time can be appropriately selected depending on the boiling point of the solvent contained in the liquid composition 607 or the thickness of the formed film.

[0131] By using the electrode manufacturing apparatus according to an embodiment of the present invention, a liquid composition can be ejected onto a target object. The electrode mixture layer can be suitably used, for example, as part of the configuration of an electrochemical element. The components other than the electrode mixture layer in the electrochemical element are not particularly limited, and known components can be appropriately selected. For example, components other than the electrode mixture layer include a positive electrode, a negative electrode, a separator, and the like.

[0132] In the present invention, a "liquid ejection head" refers to a functional component that ejects or sprays a liquid from a nozzle. The ejected liquid may have any viscosity or surface tension that allows it to be ejected from the head. While not particularly limited, it is preferable that the viscosity of the ejected liquid be 30 mPa·s or less at room temperature and pressure, or upon heating or cooling. More specifically, the liquid may be a solution, suspension, emulsion, or the like containing a solvent such as water or an organic solvent, a colorant such as a dye or pigment, a functionalizing agent such as a polymerizable compound, a resin, or a surfactant, a biocompatible material such as DNA, amino acids, proteins, or calcium, or an edible material such as a natural dye. These liquids can be used, for example, as inkjet inks, surface treatment solutions, components of electronic or light-emitting elements, liquids for forming resist patterns for electronic circuits, and liquid materials for three-dimensional modeling. The liquid ejection head may have multiple head bodies, as in the above-described embodiment, or it may have a single head body.

[0133] Energy sources for ejecting liquid include piezoelectric actuators (laminated piezoelectric elements and thin-film piezoelectric elements), thermal actuators that use electrothermal conversion elements such as heating resistors, and electrostatic actuators consisting of a vibration plate and an opposing electrode.

[0134] In the present invention, the term "liquid ejection unit" refers to a liquid ejection head integrated with functional parts and mechanisms, and includes a collection of parts related to ejecting liquid. For example, the term "liquid ejection unit" includes a combination of a liquid ejection head and at least one of the following components: a head tank, a carriage, a supply mechanism, a maintenance and recovery mechanism, a main scanning movement mechanism, and a liquid circulation device.

[0135] Here, "integrated" includes, for example, a liquid ejection head and a functional part or mechanism fixed to each other by fastening, bonding, engaging, etc., or one held movably relative to the other. The liquid ejection head, functional part, or mechanism may also be configured to be detachable from each other.

[0136] For example, some liquid ejection units have a liquid ejection head and a head tank integrated together, while others have a liquid ejection head and a head tank integrated together by being connected to each other by a tube, etc. Here, a unit including a filter can be added between the head tank and the liquid ejection head of these liquid ejection units.

[0137] Furthermore, there is a liquid ejection unit in which the liquid ejection head and the carriage are integrated.

[0138] In some liquid ejection units, the liquid ejection head is movably held by a guide member that constitutes part of the scanning movement mechanism, and the liquid ejection head and the scanning movement mechanism are integrated together. In other liquid ejection units, the liquid ejection head, the carriage, and the main scanning movement mechanism are integrated together.

[0139] Furthermore, there is a liquid ejection unit in which a cap member, which is part of the maintenance and recovery mechanism, is fixed to a carriage on which a liquid ejection head is attached, thereby integrating the liquid ejection head, carriage, and maintenance and recovery mechanism.

[0140] In some liquid ejection units, a tube is connected to a head tank or a liquid ejection head equipped with a flow path component, integrating the liquid ejection head with a supply mechanism. Liquid is supplied from a liquid storage source to the liquid ejection head via this tube.

[0141] The main scanning movement mechanism includes the guide member alone, and the supply mechanism includes the tube alone and the loading unit alone.

[0142] The term "liquid ejection device" includes devices that have a liquid ejection head or a liquid ejection unit and eject liquid by driving the liquid ejection head. Liquid ejection devices include not only devices that can eject liquid onto objects to which the liquid can adhere, but also devices that eject liquid into air or liquid.

[0143] This "liquid ejection device" can also include means for feeding, transporting, and discharging items onto which liquid can be attached, as well as pre-processing devices and post-processing devices.

[0144] For example, examples of "liquid ejection devices" include image forming devices, which are devices that eject ink to form images on paper, and three-dimensional modeling devices (three-dimensional modeling devices), which eject modeling liquid onto a powder layer formed from layers of powder in order to create a three-dimensional object (a three-dimensional model).

[0145] Furthermore, the term "liquid ejection device" is not limited to devices that visualize meaningful images such as letters and figures using ejected liquid. For example, it also includes devices that form patterns that have no meaning in themselves, and devices that create three-dimensional images.

[0146] The above-mentioned "object onto which a liquid can adhere" refers to an object to be transported onto which a liquid can adhere at least temporarily, such as an object onto which the liquid adheres and sticks, or an object onto which the liquid adheres and penetrates, etc. Specific examples include media such as paper, recording paper, film, cloth, electronic circuit boards, electronic components such as piezoelectric elements, powder layers, organ models, and test cells, and unless otherwise specified, includes all objects onto which a liquid can adhere.

[0147] The material of the "substance to which a liquid can adhere" may be any material to which a liquid can adhere, even temporarily, such as paper, thread, fiber, fabric, leather, metal, plastic, glass, wood, or ceramics.

[0148] Furthermore, the "sheet" may be a continuous sheet formed into a long length (such as roll paper), or a sheet cut to a predetermined size (such as cut paper). Furthermore, the present invention is also applicable to devices that transport objects other than sheets.

[0149] Furthermore, the term "liquid ejection device" includes, but is not limited to, a device in which a liquid ejection head and an object onto which liquid can be attached move relatively. Specific examples include a serial type device in which the liquid ejection head moves (see FIG. 6) and a line type device in which the liquid ejection head does not move (see FIG. 5).

[0150] Other examples of "liquid ejection devices" include a treatment liquid application device that ejects a treatment liquid onto paper to apply the treatment liquid to the surface of the paper for purposes such as modifying the surface of the paper, and an injection granulation device that sprays a composition liquid in which raw materials are dispersed through a nozzle to granulate fine particles of the raw materials.

[0151] The aspects of the present invention are as follows, for example. <1> a nozzle member having a nozzle; a nozzle cover that covers the nozzle member; a nozzle-side joining member joined to the nozzle cover, the nozzle cover has a distorted portion that is a portion including an outer peripheral surface of the nozzle cover and has a shape that is partially changed compared to a peripheral portion, the nozzle-side joining member has a through-hole or a recess at a position facing the strained portion, This liquid ejection head is characterized in that, when viewed in the overlapping direction of the nozzle cover and the nozzle side joining member, the through hole or the recess is provided on the inside of the nozzle side joining member and does not face the outside of the nozzle side joining member. <2> a nozzle member having a nozzle; a nozzle cover that covers the nozzle member; a nozzle-side joining member joined to the nozzle cover, the nozzle cover has a protruding portion that protrudes outward from other portions of the nozzle cover, the nozzle-side joining member has a through-hole or a recess at a position facing the protrusion, This liquid ejection head is characterized in that, when viewed in the overlapping direction of the nozzle cover and the nozzle side joining member, the through hole or the recess is provided on the inside of the nozzle side joining member and does not face the outside of the nozzle side joining member. <3> the nozzle-side joining member has a through-hole at a position facing the distortion portion or the protrusion portion, The through hole is a screw hole. <1> or <2> The liquid ejection head is as described above. <4> An adhesive is filled into the through-hole or recess to bond it to the distorted portion or the protruding portion. <1> from <3> The liquid ejection head according to any one of the preceding claims. <5> The outer peripheral surface of the nozzle cover provided at the distortion portion is a cut surface. <1> from <4> The liquid ejection head according to any one of the preceding claims. <6> The recess or the through hole faces the cut surface. <5> The liquid ejection head is as described above. <7> A first joining member; a laminated substrate portion having at least a first substrate and a second substrate laminated together and joined to the first joining member, the first substrate has a first protrusion, the second substrate has a second protrusion protruding in the same direction as the first protrusion, the first joint member has a first groove portion facing the first protrusion, The liquid ejection head is characterized in that the adhesive applied between the first convex portion and the first groove portion comes into contact with the surface of the first convex portion that faces the first groove portion. <8> When viewed in the stacking direction of the first substrate and the second substrate, the second protrusion is disposed at a position where it does not overlap the first protrusion. <7> The liquid ejection head is as described above. <9> In a direction perpendicular to the stacking direction of the first substrate and the second substrate and different from the protruding direction of the first protrusion, the center side of the first bonding member is defined as the inner side and the end side is defined as the outer side, and the second protrusion is disposed outside the first protrusion. <8> The liquid ejection head described above. <10> the laminated substrate portion has a plurality of convex portions including the first convex portion and the second convex portion, the second protrusion is disposed outermost among the protrusions, the first joint member has a second groove portion facing the second protrusion, The second groove portion is deeper than the first groove portion. <9> The liquid ejection head is as described above. <11> The surface of the second protrusion on the second groove side and the second groove are joined with an adhesive. <10> The liquid ejection head is as described above. <12> The adhesive provided between the second protrusion and the second groove contacts the side surface of the second protrusion. <11> The liquid ejection head is as described above. <13> The adhesive provided between the second convex portion and the second groove portion comes into contact with the end surface of the second substrate on which the second convex portion is formed. <11> or <12> The liquid ejection head is as described above. <14> In a direction perpendicular to the stacking direction of the first substrate and the second substrate and different from the protruding direction of the first protrusion, The second groove portion is provided to extend to the end portion of the first joint member. <10> from <13> The liquid ejection head is as described above. <15> At least one of the first groove portion and the second groove portion has a larger width on the outer side than on the inner side. <10> from <14> The liquid ejection head according to any one of the preceding claims. <16> The first joint member has an outer periphery that is located on the outer periphery side of the first joint member relative to the first groove and that is higher than the laminated substrate portion. <8> from <15> The liquid ejection head according to any one of the preceding claims. <17> the laminated substrate portion has a plurality of convex portions including the first convex portion and the second convex portion, In a direction perpendicular to the stacking direction of the first substrate and the second substrate and different from the protruding direction of the first protrusions, if the center side of the first bonding member is defined as the inner side and the end side is defined as the outer side, the protrusion having the thinnest thickness among the plurality of protrusions is disposed on the outermost side among the plurality of protrusions. <8> from <16> The liquid ejection head according to any one of the preceding claims. <18> the laminated substrate portion has a plurality of convex portions including the first convex portion and the second convex portion, The first protrusion is disposed second most outward among the plurality of protrusions. <8> from <17> The liquid ejection head according to any one of the preceding claims. <19> the laminated substrate portion has a plurality of convex portions including the first convex portion and the second convex portion, At least one of the protrusions is curved toward the first joint member. <8> from <18> The liquid ejection head according to any one of the preceding claims. <20> the first joining member has a common flow path, which is a flow path for liquid, inside thereof; a through hole penetrating the laminated substrate portion is provided, When viewed in the stacking direction of the first bonding member and the laminated substrate unit, the through hole is provided between the first convex portion and the common flow path. <8> from <19> The liquid ejection head according to any one of the preceding claims. <21> the first substrate is provided closer to the first bonding member than the second substrate, the first bonding member has a bonding portion with the first substrate at a part thereof, and has a bonding surface that extends beyond the first substrate toward the protruding side of the second protrusion, When viewed in the stacking direction of the first joint member and the laminated substrate unit, the joint surface has a portion that protrudes further toward the protruding side of the second protrusion than the first substrate and faces the second protrusion. <8> from <20> The liquid ejection head according to any one of the preceding claims. <22> The adhesive provided between the first protrusion and the first groove contacts the side surface of the first protrusion. <8> from <21> The liquid ejection head according to any one of the preceding claims. <23> The adhesive provided between the first convex portion and the first groove portion comes into contact with an end face of a portion of the first substrate different from the first convex portion. <8> from <22> The liquid ejection head according to any one of the preceding claims. <24> the first substrate is provided closer to the first bonding member than the second substrate, The width of the first substrate is set smaller than that of the first joint member in a direction perpendicular to the stacking direction of the first joint member and the laminated substrate unit and different from the protruding direction of the first protrusion. <8> from <23> The liquid ejection head according to any one of the preceding claims. <25> <1> from <24> A liquid ejection apparatus including any one of the liquid ejection heads. <26> A first joining member; a laminated substrate portion having at least a first substrate and a second substrate laminated on each other and joined to the first joining member, the first substrate is connected to the gripping portion via a first protrusion, the second substrate is connected to the gripping portion via a second protrusion, When viewed in the stacking direction of the first substrate and the second substrate, the second protrusion is disposed at a position where it does not overlap the first protrusion, the first joint member has a first groove portion facing the first protrusion, a first bonding step of bonding the first substrate and the second substrate; a first cutting step of cutting the first protrusion to separate the first substrate from the gripping portion; a second bonding step of bonding the first substrate and the first bonding member by holding the holding portion and applying an adhesive between the first substrate and the first bonding member, including between the first convex portion and the first groove portion; The method for manufacturing a liquid ejection head is characterized by comprising a second cutting step of cutting the second protrusion portion to separate the laminated substrate portion from the gripping portion. [Explanation of symbols]

[0152] 20 Liquid ejection head 21 Head body 22 Base member (nozzle side joining member) 22a Recess 23 Nozzle cover 23a Protrusion 23b Distortion 35 common flow path member (first joining member) 35B outer periphery 35b 1st groove 35c 2nd groove 35e joint surface 35e1: The portion that protrudes from the first damper frame toward the protruding side of the second protrusion 70 Common flow path 71 First damper frame (first board) 71a Lower convex portion (first convex portion) 71c through hole 72 Second damper frame (second board) 72a Upper layer convex part (second convex part) 72c through hole 79 Laminated substrate section 100 Image forming device (liquid ejection device) Z: The overlapping direction of the nozzle cover and base material [Prior art documents] [Patent documents]

[0153] [Patent Document 1] JP 2023-65011 A

Claims

1. a nozzle member having a nozzle; a nozzle cover that covers the nozzle member; a nozzle-side joining member joined to the nozzle cover, the nozzle cover has a distorted portion that is a portion including an outer peripheral surface of the nozzle cover and has a shape that is partially changed compared to a peripheral portion, the nozzle-side joining member has a through-hole or a recess at a position facing the strained portion, A liquid ejection head characterized in that, when viewed in the overlapping direction of the nozzle cover and the nozzle side joining member, the through hole or the recess is provided on the inside of the nozzle side joining member and does not face the outside of the nozzle side joining member.

2. a nozzle member having a nozzle; a nozzle cover that covers the nozzle member; a nozzle-side joining member joined to the nozzle cover, the nozzle cover has a protruding portion that protrudes outward from other portions of the nozzle cover, the nozzle-side joining member has a through-hole or a recess at a position facing the protrusion, A liquid ejection head characterized in that, when viewed in the overlapping direction of the nozzle cover and the nozzle side joining member, the through hole or the recess is provided on the inside of the nozzle side joining member and does not face the outside of the nozzle side joining member.

3. the nozzle-side joining member has a through-hole at a position facing the strained portion, 2. A liquid ejection head according to claim 1, wherein the through-hole is a screw hole.

4. 2. A liquid ejection head according to claim 1, wherein the through-hole or the recess is filled with an adhesive to bond the distorted portion.

5. 2. A liquid ejection head according to claim 1, wherein the outer peripheral surface of the nozzle cover provided at the distortion portion is a cut surface.

6. 6. A liquid ejection head according to claim 5, wherein the recess or the through hole faces the cut surface.

7. A first joining member; a laminated substrate portion having at least a first substrate and a second substrate laminated together and joined to the first joining member, the first substrate has a first protrusion; the second substrate has a second protrusion protruding in the same direction as the first protrusion, the first joint member has a first groove portion facing the first protrusion, A liquid ejection head, characterized in that an adhesive applied between the first convex portion and the first groove portion contacts a surface of the first convex portion facing the first groove portion.

8. The liquid ejection head according to claim 7 , wherein the second convex portions are arranged at positions that do not overlap the first convex portions when viewed in the stacking direction of the first substrate and the second substrate.

9. A liquid ejection head as described in claim 8, wherein in a direction perpendicular to the stacking direction of the first substrate and the second substrate and different from the protruding direction of the first convex portion, if the center side of the first joining member is the inside and the end side is the outside, the second convex portion is positioned outside the first convex portion.

10. the laminated substrate portion has a plurality of convex portions including the first convex portion and the second convex portion, the second protrusion is disposed outermost among the protrusions, the first joint member has a second groove portion facing the second protrusion, 10. The liquid ejection head according to claim 9, wherein the second groove portion is deeper than the first groove portion.

11. The liquid ejection head according to claim 10 , wherein the surface of the second convex portion on the side of the second groove portion and the second groove portion are bonded with an adhesive.

12. The liquid ejection head according to claim 11 , wherein the adhesive provided between the second convex portion and the second groove portion contacts the side surface of the second convex portion.

13. 12. The liquid ejection head according to claim 11, wherein the adhesive provided between the second convex portion and the second groove portion contacts the end surface of the second substrate on which the second convex portion is formed.

14. In a direction perpendicular to the stacking direction of the first substrate and the second substrate and different from the protruding direction of the first protrusion, The liquid ejection head according to claim 10 , wherein the second groove portion is provided so as to extend to an end portion of the first joining member.

15. 11. The liquid ejection head according to claim 10, wherein at least one of the first groove portion and the second groove portion has a width greater on the outer side than on the inner side.

16. The liquid ejection head according to claim 8 , wherein the first joint member has an outer periphery that is higher than the laminated substrate portion on the outer periphery side of the first joint member than the first groove portion.

17. the laminated substrate portion has a plurality of convex portions including the first convex portion and the second convex portion, A liquid ejection head as described in claim 8, wherein in a direction perpendicular to the stacking direction of the first substrate and the second substrate and different from the protruding direction of the first convex portion, the central side of the first bonding member is the inside and the end side is the outside, and the convex portion with the thinnest thickness among the multiple convex portions is positioned at the outermost position among the multiple convex portions.

18. the laminated substrate portion has a plurality of convex portions including the first convex portion and the second convex portion, The liquid ejection head according to claim 8 , wherein the first convex portion is disposed second most outward among the plurality of convex portions.

19. the laminated substrate portion has a plurality of convex portions including the first convex portion and the second convex portion, The liquid ejection head according to claim 8 , wherein at least one of the protrusions is curved toward the first joining member.

20. the first joining member has a common flow path, which is a flow path for a liquid, inside thereof; a through hole penetrating the laminated substrate portion is provided, The liquid ejection head according to claim 8 , wherein the through-hole is provided between the first convex portion and the common flow path when viewed in the stacking direction of the first joint member and the laminated substrate portion.

21. the first substrate is provided closer to the first bonding member than the second substrate, the first bonding member has a bonding portion for bonding to the first substrate at a part thereof, and has a bonding surface extending toward a protruding side of the second protrusion beyond the first substrate; A liquid ejection head as described in claim 8, wherein when viewed in the stacking direction of the first joining member and the laminated substrate portion, the joining surface has a portion that protrudes toward the protruding side of the second convex portion beyond the first substrate and faces the second convex portion.

22. 9. The liquid ejection head according to claim 8, wherein the adhesive provided between the first convex portion and the first groove portion contacts the side surface of the first convex portion.

23. 9. The liquid ejection head according to claim 8, wherein the adhesive provided between the first convex portion and the first groove portion comes into contact with an end face of a portion of the first substrate different from the first convex portion.

24. the first substrate is provided closer to the first bonding member than the second substrate, 9. A liquid ejection head according to claim 8, wherein the width of the first substrate is smaller than that of the first joining member in a direction perpendicular to the stacking direction of the first joining member and the laminated substrate portion and different from the protruding direction of the first convex portion.

25. A liquid ejection apparatus comprising the liquid ejection head according to any one of claims 1 to 24.

26. A first joining member; a laminated substrate portion having at least a first substrate and a second substrate laminated on each other and joined to the first joining member, the first substrate is connected to the gripping portion via a first protrusion, the second substrate is connected to the gripping portion via a second protrusion, When viewed in a stacking direction of the first substrate and the second substrate, the second convex portion is disposed at a position where it does not overlap the first convex portion, the first joint member has a first groove portion facing the first protrusion, a first bonding step of bonding the first substrate and the second substrate; a first cutting step of cutting the first protrusion to separate the first substrate from the gripping portion; a second bonding step of bonding the first substrate and the first bonding member by gripping the gripping portion and applying an adhesive between the first substrate and the first bonding member, including between the first convex portion and the first groove portion; a second cutting step of cutting the second convex portion to separate the laminated substrate portion from the gripping portion.

Citation Information

Patent Citations

  • JP65011A