Substrate transport robot, substrate processing system, and method for controlling substrate transport robot

Abstract

To provide a substrate transport robot, a substrate processing system, and a method for controlling a substrate transport robot that can prevent liquid from spilling from the top surface of a substrate during transport.SOLUTION: A substrate transport robot 71 includes a hand 73 that supports a substrate W in a horizontal position, an advancing / retreating unit 75 and a linear movement unit 79 that move the hand 73 in the horizontal direction, and a robot control unit 111. The robot control unit 111 causes the hand 73 to support the substrate W on whose upper surface a liquid film has been formed, obtains a first range of acceleration / deceleration for moving the hand 73 that corresponds to the state of the liquid film, and moves the hand 73 within the first range of acceleration / deceleration by at least one of the advancing / retreating unit 75 and the linear movement unit 79.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present invention relates to a substrate transfer robot that transfers substrates in a horizontal position, a substrate processing system including the same, and a method for controlling the substrate transfer robot. Examples of the substrate include semiconductor substrates, FPD (Flat Panel Display) substrates, photomask glass substrates, optical disk substrates, magnetic disk substrates, ceramic substrates, and solar cell substrates. Examples of the FPD include liquid crystal display devices and organic EL (electroluminescence) display devices. [Background technology]

[0002] The substrate processing system includes a transfer arm (substrate transfer robot) for transferring substrates (see, for example, Patent Documents 1 and 2). The transfer arm includes a fork (hand) that can move forward and backward. The fork includes four holding claws for holding the substrate at four points on the periphery. Each of the four holding claws is provided with four strain sensors (strain gauges). The strain sensors detect the amount of distortion of the holding claws when a load is applied from above to the holding claws.

[0003] Patent Document 3 discloses a wafer handling arm capable of measuring the load applied to a wafer support part using a total of four load detection elements. Patent Document 4 discloses a substrate coating device equipped with three lift pins for raising and lowering a substrate and a weighing means for measuring the weight of the substrate, the three lift pins, and a processing liquid while the substrate is raised by the three lift pins. Patent Document 5 also discloses a multi-axis tactile sensor.

[0004] Patent Document 6 discloses a substrate processing apparatus (substrate processing system) that employs a processing method (a so-called hybrid method) that combines the batch and single-wafer processing techniques. The batch method processes multiple substrates in a vertical position all at once. The single-wafer method processes a single substrate W in a horizontal position. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2011-161521 [Patent Document 2] Japanese Patent Application Laid-Open No. 2012-121680 [Patent Document 3] Japanese Patent Application Publication No. 04-152654 [Patent Document 4] Japanese Patent Application Laid-Open No. 2000-012430 [Patent Document 5] Japanese Patent Application Laid-Open No. 2016-217804 [Patent Document 6] Japanese Patent Application Publication No. 2024-001576 Summary of the Invention [Problem to be solved by the invention]

[0006] In the substrate processing system of Patent Document 6, if a substrate dries after processing in a batch processing unit and before processing in a single-wafer processing unit, there is a risk that the pattern formed on the substrate will collapse. Therefore, to prevent the substrate from drying out, the substrate is transported in a horizontal position with a liquid poured on the upper surface of the substrate on which the pattern will be formed. Here, if the liquid poured on the upper surface of the substrate spills during transportation, there is a risk that the substrate will dry out, which is undesirable.

[0007] The present invention has been made in consideration of the above circumstances, and aims to provide a substrate transport robot, a substrate processing system, and a method for controlling a substrate transport robot that can prevent liquid from spilling from the top surface of a substrate during transport. [Means for solving the problem]

[0008] In order to achieve the above object, the present invention has the following configuration: That is, a substrate transport robot according to the present invention for transporting a substrate includes a hand that supports the substrate in a horizontal position, a movement unit that moves the hand in a horizontal direction, and a control unit, wherein the control unit causes the hand to support the substrate having a liquid film formed on an upper surface thereof, obtains a first range of acceleration / deceleration for moving the hand that corresponds to the state of the liquid film, and causes the movement unit to move the hand within the first range of acceleration / deceleration.

[0009] According to the substrate transport robot of the present invention, a first range of acceleration / deceleration for moving the hand is acquired in accordance with the state of the liquid film. The hand is moved within the first range of acceleration / deceleration. Therefore, it is possible to prevent the liquid from spilling from the upper surface of the substrate during transport.

[0010] Furthermore, it is preferable that the above-mentioned substrate transport robot further comprises a detection unit that detects the state of the liquid film, and the control unit causes the detection unit to detect the state of the liquid film and obtains a first range of acceleration / deceleration for moving the hand corresponding to the detected state of the liquid film.

[0011] The substrate transport robot includes a detection unit that detects the state of the liquid film. Therefore, the control unit can obtain a first range of acceleration / deceleration that takes into account the actual state of the liquid film detected by the detection unit. This can improve the accuracy of the first range of acceleration / deceleration.

[0012] Furthermore, in the above-mentioned substrate transport robot, it is preferable that the detection unit is a weight sensor provided on the hand that measures weight, and the control unit measures the weight of the liquid film using the weight sensor and obtains the range of acceleration / deceleration for moving the hand that corresponds to the measured weight of the liquid film.

[0013] The substrate transport robot is equipped with a weight sensor as a detection unit that detects the state of the liquid film. The weight sensor is provided in the hand. Therefore, the control unit can obtain a first range of acceleration / deceleration that takes into account the weight of the liquid film measured by the weight sensor. Furthermore, weight sensors are relatively small and relatively inexpensive. Therefore, even if a weight sensor is provided in the hand, the hand is unlikely to become large. Therefore, problems of space or cost are unlikely to occur.

[0014] In addition, in the above-described substrate transport robot, an example of the hand includes a hand body and a plurality of contact portions provided on the upper surface of the hand body for receiving the peripheral portion of the substrate, and an example of the weight sensor is provided between any one of the plurality of contact portions and the hand body. The plurality of contact portions receive the peripheral portion of the substrate. Therefore, the weight sensor can measure the weight at the position of any one of the plurality of contact portions. Furthermore, a first range of acceleration / deceleration can be obtained based on the weight measured at that position.

[0015] Furthermore, in the above-mentioned substrate transport robot, it is preferable that the first range of acceleration / deceleration is an allowable range of acceleration / deceleration that is narrower than the limit range of acceleration / deceleration at which the movement of the liquid in the liquid film does not cause liquid spillage from the substrate, and that the control unit monitors the amount of weight change of the liquid moving on the top surface of the substrate at the measurement position of the weight sensor based on the weight value measured by the weight sensor while the hand is moving, and controls the acceleration / deceleration of the hand so that the amount of weight change falls within the change range corresponding to the allowable range of acceleration / deceleration.

[0016] The limit range of acceleration / deceleration is the range in which liquid spillage from the substrate does not occur. Furthermore, the allowable range of acceleration / deceleration is narrower than the limit range. Therefore, if the acceleration / deceleration is within the acquired allowable range, liquid spillage will not occur. However, the relationship between the acquired allowable range and the change amount range may change due to some factor. In this case, the possibility of liquid spillage increases. Even in such cases, the change amount range is used as a threshold, and if the weight change amount deviates from the threshold, the weight change amount is adjusted so that it falls within the change amount range. Therefore, liquid spillage can be prevented.

[0017] Furthermore, in the substrate transport robot described above, it is preferable that the control unit acquires a first range of acceleration / deceleration for moving the hand, which corresponds to the state of the liquid film and the type of substrate. The first range of acceleration / deceleration for moving the hand is acquired in accordance with the type of substrate and the state of the liquid film. The hand is moved within the first range of acceleration / deceleration. This makes it possible to prevent liquid from spilling from the top surface of the substrate during transport.

[0018] In the substrate transport robot described above, the type of the substrate preferably includes the wettability of the substrate. Since the first range of acceleration / deceleration is a range that takes into account the wettability of the substrate W, the precision of the allowable range of acceleration / deceleration can be improved.

[0019] In the substrate transport robot described above, the control unit preferably uses a lookup table to obtain the first range of acceleration / deceleration for moving the hand, which corresponds to the state of the liquid film and the type of the substrate. The lookup table makes it possible to easily obtain the first range of acceleration / deceleration.

[0020] Furthermore, the above-mentioned substrate transport robot preferably further comprises a detection unit that detects the state of the liquid film and a memory unit that stores multiple different relational data for each state of the liquid film, each of the multiple relational data having a relational equation between the amount of change in state of the liquid film and the acceleration / deceleration, and a first range of the acceleration / deceleration in the relational equation, and the control unit preferably causes the detection unit to detect the amount of change in state of the liquid film when the moving unit is moving the hand at a predetermined acceleration / deceleration, and compares the predetermined acceleration / deceleration and the detected amount of change in state of the liquid film with the relational equation of each of the multiple relational data, thereby extracting one piece of relational data having the optimal relational equation from the multiple relational data and obtaining the first range of the acceleration / deceleration of the one piece of relational data.

[0021] For example, even if the conditions for the type of board are not sufficiently provided, it is possible to obtain optimal (approximate) relational data from a plurality of already-held relational data, and to obtain the first range of acceleration / deceleration contained in the relational data.

[0022] Furthermore, it is preferable that the above-mentioned substrate transport robot further includes a rotation unit that rotates the hand around a vertical axis, and the control unit acquires a second range of rotational acceleration / deceleration for rotating the hand corresponding to the state of the liquid film, and rotates the hand within the second range by the rotation unit.

[0023] According to the substrate transport robot of the present invention, a second range of rotational acceleration / deceleration for rotating the hand corresponding to the state of the liquid film is acquired, and the hand is moved within the second range of rotational acceleration / deceleration, thereby preventing liquid from spilling from the upper surface of the substrate during transport (especially rotation).

[0024] Further, according to the present invention, there is provided a substrate processing system for processing a substrate, characterized by including the substrate transport robot described above.

[0025] The present invention also provides a control method for a substrate transport robot that transports a substrate, the substrate transport robot comprising a hand on which the substrate in a horizontal position is placed, and a moving unit that moves the hand horizontally, and the control method is characterized by comprising a supporting step of supporting the substrate having a liquid film formed on its upper surface with the hand, a range acquisition step of acquiring a first range of acceleration / deceleration for movement of the hand corresponding to the state of the liquid film, and a hand moving step of moving the hand within the first range of acceleration / deceleration by the moving unit. [Effects of the Invention]

[0026] According to the substrate transport robot, the substrate processing system, and the method for controlling the substrate transport robot of the present invention, it is possible to prevent liquid from spilling from the upper surface of the substrate during transport. [Brief explanation of the drawings]

[0027] [Figure 1] 1 is a plan view showing a schematic configuration of a substrate processing system according to a first embodiment. [Figure 2] 10(a) to 10(c) are side views illustrating the configurations and operations of the substrate handling mechanism and the first attitude changing mechanism. [Figure 3] FIG. 10 is a plan view of a second attitude change mechanism. [Figure 4] 4 is a vertical cross-sectional view showing the rotary chuck as seen from the arrow Q in FIG. 3. [Figure 5] FIG. 2 is a side view showing a schematic configuration of a substrate transport robot. [Figure 6] FIG. [Figure 7] FIG. 10(a) is a plan view illustrating the movement of liquid when the hand is retracted, and FIG. 10(b) is a diagram showing the waveforms detected by four weight sensors. [Figure 8] FIG. 10(a) is a plan view for explaining the movement of liquid during the rotation of the hand, and FIG. 10(b) is a diagram showing the waveforms detected by four weight sensors. [Figure 9]FIG. 10(a) is a plan view illustrating the movement of liquid when the hand moves forward, and FIG. 10(b) is a diagram showing the waveforms detected by four weight sensors. [Figure 10] 10 is a diagram for explaining the relationship between one of acceleration / deceleration and rotational acceleration / deceleration and the amount of change in weight of liquid. FIG. [Figure 11] FIG. 10 is a diagram illustrating an example of a lookup table. [Figure 12] FIG. 10 is a diagram showing an example of the relationship between acceleration / deceleration and the amount of change in weight of the liquid in the case of a hydrophilic substrate. [Figure 13] FIG. 10 is a diagram showing an example of the relationship between acceleration / deceleration and the amount of change in weight of the liquid in the case of a hydrophobic substrate. [Figure 14] 10 is a flowchart illustrating an operation of the substrate processing system. [Figure 15] 10(a) to 10(c) are side views illustrating the operation of the second attitude changing mechanism. [Figure 16] 10(a) to 10(c) are side views illustrating the operation of the second attitude changing mechanism. [Figure 17] 10 is a flowchart illustrating the operation of the substrate transport robot. [Figure 18] FIG. 10 is a plan view for explaining the operation of the substrate transport robot. [Figure 19] 10 is a waveform detected by a weight sensor for explaining the operation of the substrate transport robot according to the second embodiment. [Figure 20] (a) is a side view for explaining a camera as a detection unit in a modified example, and (b) is a diagram showing an entire image of a substrate showing the state of a liquid film and four images of interest. [Figure 21] FIG. 10 is a side view illustrating a film thickness meter as a detection unit according to a modified example. [Figure 22] 10A and 10B are diagrams for explaining a method for obtaining the allowable range of acceleration / deceleration according to a modified example. DETAILED DESCRIPTION OF THE INVENTION

[0028] The present invention will be described below with reference to various examples. [Example]

[0029] A first embodiment of the present invention will be described below with reference to the drawings. Fig. 1 is a plan view showing a schematic configuration of a substrate processing system 1 according to the first embodiment.

[0030] For convenience, in this specification, the direction in which the transfer block 19 and the processing block 21 are aligned is referred to as the "front-rear direction X." The front-rear direction X is horizontal. Within the front-rear direction X, for example, the direction from the processing block 21 toward the transfer block 19 is referred to as the "front." The direction opposite to the front is referred to as the "rear." The horizontal direction perpendicular to the front-rear direction X is referred to as the "width direction Y." One direction in the "width direction Y" is referred to as the "right" as appropriate. The direction opposite to the right is referred to as the "left." The direction perpendicular to the horizontal direction is referred to as the "vertical direction Z." For reference, in each figure, front, back, right, left, top, and bottom are indicated as appropriate.

[0031] <1. Configuration of the substrate processing system> Please refer to Figure 1. The substrate processing system 1 processes substrates W. The substrate processing system 1 performs, for example, chemical processing, cleaning processing, drying processing, etc. on the substrates W. The substrate processing system 1 performs batch processing in which a plurality of substrates W (for example, 25 or 50 substrates W) are processed at once, and single wafer processing in which a plurality of substrates W are processed one by one. For this reason, the substrate processing system 1 is called a hybrid substrate processing system. In this embodiment, a case in which 25 substrates W are processed at once will be described.

[0032] The substrate processing system 1 includes a stocker 2, a batch processing device 3, a relay device 5, and a single-wafer processing device 7. The batch processing device 3 processes a plurality of substrates W collectively. The single-wafer processing device 7 processes a plurality of substrates W one by one. The single-wafer processing device 7 is disposed to the right of the batch processing device 3 and is disposed apart from the batch processing device 3. The relay device 5 connects the batch processing device 3 and the single-wafer processing device 7.

[0033] <2. Stocker> The stocker 2 stores at least one carrier C. The stocker 2 is adjacent to the front of the batch processing device 3. The carrier C stores a plurality of substrates W (e.g., 25 substrates) aligned at a predetermined interval (e.g., 10 mm) in a horizontal position. The carrier C may be, for example, a FOUP (Front Opening Unify Pod), but is not limited to this. The substrates W are, for example, disk-shaped with a diameter of 300 mm.

[0034] The stocker 2 includes, for example, two load ports 9, at least one storage shelf 11, and a carrier transport robot 13. On the storage shelf 11, a carrier C is placed.

[0035] The carrier transport robot 13 transports the carrier C between the two load ports 9, the storage shelf 11, and the loading shelf 17 described below. The carrier transport robot 13 is equipped with a gripping unit 15 that grips a protrusion provided on the top surface of the carrier C, for example. The carrier transport robot 13 can move the gripping unit 15 in the horizontal direction (front-back direction X and width direction Y) and the vertical direction Z. The carrier transport robot 13 is driven by one or more electric motors.

[0036] <3. Batch processing equipment> The batch processing apparatus 3 includes a loading shelf 17, a transfer block 19, a processing block 21, and a batch transport area R1. The loading shelf 17 is adjacent to the front of the transfer block 19. The processing block 21 is disposed behind the transfer block 19, with a posture change area R2 (described later) interposed therebetween. The batch transport area R1 extends rearward from the transfer block 19. The batch transport area R1 is adjacent to the left of the transfer block 19, the processing block 21, and the posture change area R2.

[0037] <3-1. Transfer block> The transfer block 19 includes a substrate handling mechanism (robot) HTR and a first position conversion mechanism 23. The substrate handling mechanism HTR is provided behind the mounting shelf 17. The substrate handling mechanism HTR transports a plurality of substrates W (e.g., 25 substrates) in a horizontal position between a carrier C placed on the mounting shelf 17 and the first position conversion mechanism 23.

[0038] See Figures 2(a) to 2(c). The substrate handling mechanism HTR has a plurality of (e.g., 25) hands 25. Each hand 25 holds one substrate W. For convenience of illustration, in Figures 2(a) to 2(c), the substrate handling mechanism HTR is shown to have three hands 25. Furthermore, a pair of horizontal holding units 31B and a pair of vertical holding units 31C, which will be described later, hold three substrates W. Furthermore, a pusher member 33A, which will be described later, holds three substrates W.

[0039] The substrate handling mechanism HTR further includes a hand support unit 26, an advancing / retreating unit 27, and an elevating / rotating unit 29. The hand support unit 26 supports a plurality of hands 25. The advancing / retreating unit 27 moves the plurality of hands 25 forward and backward via the hand support unit 26. The elevating / rotating unit 29 rotates the advancing / retreating unit 27 around a vertical axis AX1 to change the orientation of the hands 25. The advancing / retreating unit 27 and the elevating / rotating unit 29 each include an electric motor.

[0040] The first position change mechanism 23 includes a position change unit 31 and a pusher mechanism 33. The substrate handling mechanism HTR, the position change unit 31, and the pusher mechanism 33 are arranged on the left in this order. The position change unit 31 changes the position of the substrates W received from the substrate handling mechanism HTR from a horizontal position to a vertical position.

[0041] As shown in FIG. 2(a), the posture conversion unit 31 includes a support base 31A, a pair of horizontal holding units 31B, a pair of vertical holding units 31C, and a rotation drive unit 31D. The pair of horizontal holding units 31B and the pair of vertical holding units 31C are provided on the support base 31A. When the substrates W are in a horizontal posture, the pair of horizontal holding units 31B support the substrates W from below while contacting the underside of each substrate W. When the substrates W are in a vertical posture, the pair of vertical holding units 31C hold the substrates W. The rotation drive unit 31D rotates the support base 31A around a horizontal axis AX2.

[0042] As shown in FIG. 2(c), the pusher mechanism 33 includes a pusher member 33A, a lifting and rotating unit 33B, a horizontal moving unit 33C, and a rail 33D. The pusher member 33A holds the bottom of each of a plurality of substrates W (e.g., 25 or 50 substrates W) that have been converted to a vertical position by the position conversion unit 31. The lifting and rotating unit 33B raises and lowers the pusher member 33A in the vertical direction Z. The lifting and rotating unit 33B also rotates the pusher member 33A around a vertical axis AX3. This allows the orientation of the device surface of the substrate W, indicated by the symbol DR1, to be in any direction.

[0043] The horizontal moving unit 33C moves the pusher member 33A and the lifting and rotating unit 33B horizontally along the rails 33D. The rails 33D extend in the width direction Y. Each of the rotation driving unit 31D, the lifting and rotating unit 33B, and the horizontal moving unit 33C includes an electric motor.

[0044] Here, the operation of the first attitude change mechanism 23 will be described. See FIG. 2(a). The attitude change unit 31 receives 25 substrates W from the substrate handling mechanism HTR. The device side of each substrate W faces upward. The device side of a substrate W is the side on which electronic circuits are formed, and includes the side on which electronic circuits are in the process of being formed. The device side is also called the "front side" or "main side." The back side of a substrate W refers to the side on which electronic circuits are not formed. The side opposite the device side is the back side.

[0045] 2(b), the rotation drive unit 31D of the attitude conversion unit 31 converts the 25 substrates W from a horizontal attitude to a vertical attitude by rotating the pair of horizontal holding units 31B, etc. by 90 degrees around the horizontal axis AX2.

[0046] 2(c), the pusher mechanism 33 then raises the pusher member 33A to receive the 25 substrates W from the attitude conversion unit 31. The pusher member 33A holds the 25 substrates W. The pusher mechanism 33 then moves the pusher member 33A, which holds the 25 substrates W, along the rails 33D to a substrate transfer position PP below a chuck 37 (described below) of the first batch transport robot WTR1 (described below).

[0047] <3-2. Processing Block> Referring to Figure 1, the processing block 21 includes a plurality of (for example, four) batch processing tanks BT1 to BT4 and a batch drying section 35. The four batch processing tanks BT1 to BT4 and the batch drying section 35 are arranged in the front-rear direction X along which the batch processing device 3 extends. Each of the four batch processing tanks BT1 to BT4 immerses and processes a plurality of substrates W (for example, 25 or 50 substrates W) at once. Each of the four batch processing tanks BT1 to BT4 stores a processing liquid (for example, a chemical liquid or pure water) in which the plurality of substrates W are immersed.

[0048] The four batch processing tanks BT1 to BT4 are composed of, for example, two chemical processing tanks BT1, BT2 and two cleaning processing tanks BT3, BT4. The number of batch processing tanks is not limited to four, and may be one or more. The arrangement and roles of the four batch processing tanks BT1 to BT4 are not limited.

[0049] Each of the two chemical treatment tanks BT1 and BT2 performs an etching process using a chemical solution. For example, a phosphoric acid solution is used as the chemical solution. A chemical solution jet pipe (not shown) is provided at the inner bottom of each of the chemical treatment tanks BT1 and BT2. Each of the chemical treatment tanks BT1 and BT2 stores the chemical solution supplied from the chemical solution jet pipe.

[0050] Each of the two cleaning processing tanks BT3 and BT4 performs a cleaning process in which chemical solutions adhering to multiple substrates W are washed away with a cleaning liquid (rinse liquid). Pure water such as deionized water (DIW) is used as the cleaning liquid. Each of the cleaning processing tanks BT3 and BT4 stores pure water supplied from a pure water jet pipe (not shown).

[0051] Four lifters LF1 to LF4 are provided for each of the four batch processing tanks BT1 to BT4. For example, the lifter LF1 holds 25 substrates W aligned in a vertical position in the width direction Y. The lifter LF1 can immerse the 25 substrates W in the chemical solution in the batch processing tank BT1 while holding the 25 substrates W in a vertical position. The lifter LF1 raises and lowers the substrates W between a processing position inside the batch processing tank BT1 and a transfer position above the batch processing tank BT1. The other three lifters LF2 to LF4 are configured in the same manner as the lifter LF1.

[0052] The batch drying unit 35 dries a plurality of substrates W all at once. The batch drying unit 35 is used, for example, when the single wafer processing apparatus 7 cannot be used. The batch drying unit 35 is provided between the transfer block 19 and the four batch processing tanks BT1 to BT4. The batch drying unit 35 includes a lifter LF7. The batch drying unit 35 dries the substrates W by supplying an organic solvent (e.g., isopropyl alcohol) to the substrates W in a reduced pressure atmosphere and by shaking off liquid components on the surfaces of the substrates W by centrifugal force.

[0053] <3-3. Batch transport area> The batch transfer region R1 includes a first batch transfer robot WTR1, which transfers a plurality of substrates W in a vertical position among a first position conversion mechanism 23 (including a pusher mechanism 33), four lifters LF1 to LF4, a relay device 5 (a second position conversion mechanism 43 described later), and a lifter LF7 of a batch drying section 35.

[0054] The first batch transfer robot WTR1 includes a chuck 37 and a guide rail 39. The chuck 37 includes two chuck members 41 and 42. Each of the two chuck members 41 and 42 extends in the width direction Y. The two chuck members 41 and 42 include, for example, 25 pairs of holding grooves for holding 25 substrates W. The first batch transfer robot WTR1 opens and closes the two chuck members 41 and 42. The guide rail 39 extends in the front-rear direction X. The first batch transfer robot WTR1 moves the chuck 37 along the guide rail 39. The first batch transfer robot WTR1 is driven by an electric motor.

[0055] <4. Relay device (interface device)> The relay device 5 converts multiple substrates W that have been processed in either of the two chemical processing tanks BT1, BT2 from a vertical position to a horizontal position, and also transfers the multiple substrates W that have been converted to a horizontal position to the single-wafer processing device 7.

[0056] 1, the relay device 5 includes a position change region R2 and a relay region R3 arranged in the width direction Y. The relay region R3 extends rightward from the position change region R2. In the front-rear direction X, the position change region R2 is arranged between the first position change mechanism 23 of the transfer block 19 and the four batch processing tanks BT1 to BT4 of the processing block 21. In addition, the left side portion of the relay region R3 is arranged between the transfer block 19 and the processing block 21.

[0057] <4-1. Second attitude conversion mechanism> The posture change region R2 includes a second posture change mechanism 43. The second posture change mechanism 43 includes a standby tank 45, a standby lifter LF9, a second batch transfer robot WTR2, a posture change tank 47, and a posture change unit 49, as shown in FIG.

[0058] 3 is a plan view of the second attitude change mechanism 43. In FIG. 3, the pair of chuck members 57, 58 of the second batch transport robot WTR2 are shown in cross section. Also, the pair of chuck members 65, 66 of the attitude change unit 49 are shown in cross section. In FIG. 3, for convenience of illustration, the standby lifter LF9 holds three substrates W. Also, the chuck 52 of the second batch transport robot WTR2 holds three substrates W.

[0059] The standby tank 45 stores an immersion liquid in which a plurality of substrates W are immersed. Pure water (for example, DIW) is used as the immersion liquid. The pure water is supplied from a pure water jet pipe (not shown).

[0060] The standby lifter LF9 receives a plurality of substrates W (e.g., 25 substrates) from the first batch transport robot WTR1 and holds the plurality of substrates W in a vertical position. The standby lifter LF9 includes, for example, three support members 51 extending in the width direction Y. Each of the three support members 51 includes a plurality of holding grooves aligned in the width direction Y in order to hold the plurality of substrates W.

[0061] The second batch transport robot WTR2 transports a plurality of substrates W (e.g., 25 substrates) between the standby lifter LF9 and the rotary chuck 61 of the posture conversion unit 49. The second batch transport robot WTR2 includes a chuck 52 and a drive mechanism 54. The chuck 52 is movable in the width direction Y and can be opened and closed in the front-rear direction X. The chuck 52 includes a pair of chuck members 57, 58. The pair of chuck members 57, 58 includes multiple pairs (e.g., 25 pairs) of holding grooves 59, 60. The holding grooves 59, 60 of each pair face each other.

[0062] The drive mechanism 54 moves the chuck 52 in the width direction Y. The drive mechanism 54 also moves the chuck 52 (chuck members 57, 58) in the front-rear direction X to open and close the chuck 52. In FIG. 3, the chuck 52 is in a closed state. The drive mechanism 54 includes, for example, at least one of an electric motor and an air cylinder.

[0063] The posture changing tank 47 stores an immersion liquid in which a plurality of substrates W are immersed. Pure water (e.g., DIW) is used as the immersion liquid. The pure water is supplied from a pure water jet pipe (not shown). The posture changing tank 47 is disposed to the right of the standby tank 45 in the width direction Y.

[0064] The attitude changing unit 49 changes the attitude of a plurality of substrates W (for example, 25 substrates W) from a vertical attitude to a horizontal attitude in the immersion liquid stored in the attitude changing tank 47. The attitude changing unit 49 includes a rotary chuck 61 and a drive unit 63.

[0065] The rotary chuck 61 holds a plurality of substrates W (e.g., 25 substrates). The rotary chuck 61 includes a pair of chuck members 65 and 66. As shown in FIG. 4, each of the pair of chuck members 65 and 66 includes a plurality of pairs of holding grooves 67 and 68 (e.g., 25 pairs). The rotary chuck 61 (chuck members 65 and 66) can be opened and closed along a horizontal axis AX4 extending in the front-rear direction X. Therefore, when the rotary chuck 61 is in a closed state, the rotary chuck 61 can hold a plurality of substrates W using the plurality of pairs of holding grooves 67 and 68. FIG. 4 is a front view showing the rotary chuck 61 as viewed from the arrow Q in FIG. 3. In FIGS. 3 and 4, the rotary chuck 61 is in an open state. For convenience of illustration, the rotary chuck 61 holds three substrates W.

[0066] The rotary chuck 61 is rotatable about a horizontal axis AX4. The drive unit 63 of the attitude conversion unit 49 rotates the rotary chuck 61 about the horizontal axis AX4. As a result, the multiple substrates W held by the rotary chuck 61 are converted from a vertical attitude to a horizontal attitude. The drive unit 63 also opens and closes the rotary chuck 61 (chuck members 65, 66). The drive unit 63 also raises and lowers the rotary chuck 61. The drive unit 63 includes, for example, at least one of an electric motor and an air cylinder.

[0067] <4-2. Substrate transport robot> 1 and 5. The relay area R3 includes a substrate transport robot 71 that transports the substrate W, and a substrate platform PS1 on which the substrate W is placed. The substrate transport robot 71 corresponds to the substrate transport robot of the present invention.

[0068] Here, an outline of the characteristics of this embodiment will be described. In the substrate processing system 1, if the substrate W dries after processing in at least one of the batch processing baths BT1 to BT4 and before processing in the single wafer processing chambers SW1, SW2 of the single wafer processing apparatus 7, there is a risk that the pattern formed on the substrate W will collapse. Therefore, to prevent the substrate W from drying, the substrate W is transported in a horizontal position with a liquid poured on the upper surface of the substrate W on which the pattern will be formed (with a liquid film formed). Here, if the liquid poured on the upper surface of the substrate W spills during transportation, for example, the substrate W may dry out, which is undesirable. Therefore, this embodiment prevents the liquid from spilling from the upper surface of the substrate W during transportation.

[0069] <4-2-1. Overall configuration of the substrate transfer robot> The substrate transfer robot 71 includes a hand 73, an advance / retract unit 75, a rotation unit 77, and a linear movement unit 79. The hand 73 supports one substrate W in a horizontal position. The hand 73 includes a hand main body 83 and a hand support unit 85. The hand support unit 85 is connected to the base end of the hand main body 83. Details of the hand 73 will be described later.

[0070] The advancing / retreating unit 75 moves the hand 73 forward and backward. That is, the advancing / retreating unit 75 moves the hand 73 in the horizontal direction. The advancing / retreating unit 75 includes, for example, an electric motor M1, a screw shaft 87, and a guide rail 89. The screw shaft 87 extends linearly in any horizontal direction. The guide rail 89 extends parallel to the screw shaft 87. The hand support unit 85 is guided by the guide rail 89 in the direction in which the guide rail 89 extends.

[0071] The screw shaft 87 is engaged with the internal thread portion 85A of the hand support portion 85. One end of the screw shaft 87 is connected to the output shaft M1A of the electric motor M1. The electric motor M1 rotates the screw shaft 87 in the forward direction around its axis, thereby moving the hand 73 forward. The electric motor M1 also rotates the screw shaft 87 in the reverse direction around its axis, thereby moving the hand 73 backward.

[0072] The rotating unit 77 rotates the hand 73 and the advancing / retreating unit 75 around the vertical axis AX5, thereby changing the orientation of the hand 73 and the advancing / retreating unit 75. The rotating unit 77 includes, for example, an electric motor M2.

[0073] The linear movement unit 79 moves the hand 73, the advancing / retreating unit 75, and the rotating unit 77 in the width direction Y (horizontal direction). The linear movement unit 79 includes, for example, an electric motor M3, a screw shaft 91, a guide rail 93, and a slider 95. The screw shaft 91 and the guide rail 93 extend in the width direction Y. The slider 95 is connected to the rotating unit 77. The slider 95 is guided by the guide rail 93 in the width direction Y in which the guide rail 93 extends.

[0074] The screw shaft 91 is engaged with the internal thread portion 95A of the slider 95. One end of the screw shaft 91 is connected to the output shaft M3A of the electric motor M3. The electric motor M3 rotates the screw shaft 91 in the forward direction around its axis. As a result, the hand 73, the advancing / retreating unit 75, and the rotating unit 77 move forward. In FIG. 1, for example, the hand 73 and the like are moved toward the attitude changing unit 49. In addition, the electric motor M1 rotates the screw shaft 87 in the reverse direction around its axis. As a result, the hand 73 and the like are moved backward. In FIG. 1, for example, the hand 73 and the like are moved toward the substrate placing unit PS1.

[0075] <4-2-2. Detailed hand configuration> Please refer to Figures 5 and 6. Figure 6 is a plan view showing the hand 73. The hand 73 further includes a plurality of (for example, four) contact portions 97A, 97B, 97C, and 97D, and a plurality of (for example, four) weight sensors SA, SB, SC, and SD.

[0076] As shown in Fig. 6, the hand body 83 is formed in a U-shape or a Y-shape. Specifically, the hand body 83 includes one palm portion 101 and two finger portions 103 and 104. The two finger portions 103 and 104 are both formed to extend from the palm portion 101 in a predetermined horizontal direction HD1. The finger portion 103 is disposed apart from the finger portion 104.

[0077] The four contact portions 97A to 97D are provided on the upper surface of the hand body 83. Each of the four contact portions 97A to 97D receives an outer edge portion of the substrate W. In other words, the substrate W is placed on the four contact portions 97A to 97D. Each of the four contact portions 97A to 97D does not contact the side surfaces of the substrate W in a horizontal position, but contacts the underside of the substrate W in a horizontal position. The two contact portions 97A and 97C are provided on the upper surface of the finger portion 103. The contact portion 97A is provided closer to the tip of the finger portion 103 than the contact portion 97C. The two contact portions 97B and 97D are provided on the upper surface of the finger portion 104. The contact portion 97B is provided closer to the tip of the finger portion 104 than the contact portion 97D.

[0078] The four weight sensors SA, SB, SC, and SD are provided on the hand main body 83 so as to correspond to the four contact portions 97A, 97B, 97C, and 97D, respectively. That is, the four weight sensors SA, SB, SC, and SD are provided between the four contact portions 97A, 97B, 97C, and 97D and the hand main body 83, respectively. As shown in FIG. 5, weight sensor SB is provided below or on the lower surface of contact portion 97B. Weight sensor SD is provided below or on the lower surface of contact portion 97D. Weight sensors SA and SC are provided in the same manner as weight sensor SB (SD). The four weight sensors SA to SD may be embedded in the hand main body 83.

[0079] Each of the four weight sensors SA to SD is a multi-axis tactile sensor (force sensor), such as a six-axis or three-axis sensor, but may also be a one-axis (Z-axis) load cell (tactile sensor). A six-axis tactile sensor is a sensor that can measure three-axis forces (Fx, Fy, Fz) and three-axis moments (Mx, My, Mz). The detection method of the tactile sensor may be, for example, an electrical resistance type, but is not limited to this.

[0080] The four weight sensors SA to SD measure the weight of the substrate W and the liquid film formed on its upper surface. For example, four weight values ​​(weight data) JA, JB, JC, and JD measured by the four weight sensors SA to SD are sent to the robot control unit 111. The robot control unit 111 calculates, for example, the total value of the four weight data JA, JB, JC, and JD. In this way, the robot control unit 111 obtains the total weight of the substrate W and the liquid film formed on its upper surface. Note that the amount of the liquid film (liquid volume) (ml; milliliters) can be determined from the weight of the liquid film minus the weight of the substrate W.

[0081] During the transport of the substrate W supported by the hand 73, the liquid in the liquid film formed on the upper surface of the substrate W moves, which causes the four weight values ​​JA to JD measured by the four weight sensors SA to SD to fluctuate.

[0082] <4-2-3. Robot control unit> The substrate transfer robot 71 includes a robot control unit 111 and a memory unit 113. The robot control unit 111 is communicatively connected to a main control unit 180, which will be described later. The robot control unit 111 controls each component of the substrate transfer robot 71. The robot control unit 111 includes one or more processors, such as a central processing unit (CPU). The memory unit 113 includes at least one of a read-only memory (ROM), a random-access memory (RAM), and a hard disk. The memory unit 113 stores computer programs required to control each component of the substrate transfer robot 71. At least one of the memory unit 113 and a memory unit 181, which will be described later, stores information on the type (e.g., wettability) of each substrate W stored in a carrier C.

[0083] <4-2-4. Obtaining the tolerance range for acceleration / deceleration and rotational acceleration / deceleration> First, the movement of the liquid and the detected waveforms of the four weight sensors SA to SD will be described with reference to Figures 7(a), 7(b), 8(a), 8(b), 9(a), and 9(b). In Figures 7(a), 8(a), and 9(a), a liquid film is formed on the upper surface of the substrate W held by the hand 73.

[0084] See Figures 7(a) and 7(b). Assume that the advancing / retreating unit 75 or the linear moving unit 79 retracts the hand 73. In this case, in the acceleration region, the liquid tends to move toward the weight sensors SA and SB. Therefore, the weight values ​​JA and JB measured by the weight sensors SA and SB, respectively, increase. In contrast, the weight values ​​JC and JD measured by the weight sensors SC and SD, respectively, decrease. Also, in the deceleration region, the liquid tends to move toward the weight sensors SC and SD. Therefore, the weight values ​​JA and JB measured by the weight sensors SA and SB decrease. In contrast, the weight values ​​JC and JD measured by the weight sensors SC and SD increase. Note that in Figures 7(a) and 7(b), the rotating unit 77 does not rotate the hand 73 around the vertical axis AX5.

[0085] See Figures 8(a) and 8(b). Assume that the rotating unit 77 rotates the hand 73 counterclockwise around the vertical axis AX5. In this case, in the acceleration region, the liquid tends to move toward the weight sensors SA and SC. Furthermore, as the centrifugal force increases, the liquid tends to move toward the weight sensor SA rather than the weight sensor SC. Therefore, the weight values ​​JA and JC measured by the weight sensors SA and SC increase. Furthermore, the weight value JA (weight change amount) is greater than the weight value JC. In contrast, the weight values ​​JB and JD measured by the weight sensors SB and SD decrease. Furthermore, the weight value JD (weight change amount) is smaller than the weight value JB.

[0086] Furthermore, in the deceleration region, the liquid tends to move toward weight sensors SB and SD. Furthermore, because centrifugal force decreases, the liquid tends to move toward weight sensor SD rather than weight sensor SB. Therefore, the weight values ​​JA and JC measured by weight sensors SA and SC decrease. Furthermore, the rate of decrease in weight value JA (weight change amount) is greater than that of weight value JC. In contrast, the weight values ​​JB and JD measured by weight sensors SB and SD increase. Furthermore, the rate of increase in weight value JD (weight change amount) is greater than that of weight value JB. Note that in Figures 8(a) and 8(b), neither the advancing / retreating unit 75 nor the linear moving unit 79 is moving the hand 73.

[0087] See Figures 9(a) and 9(b). Assume that the advancing / retreating unit 75 or the linear moving unit 79 moves the hand 73 forward. In this case, in the acceleration region, the liquid tends to move toward the weight sensors SC and SD. Therefore, the weight values ​​JC and JD measured by the weight sensors SC and SD increase. In contrast, the weight values ​​JA and JB measured by the weight sensors SA and SB decrease. Also, in the deceleration region, the liquid tends to move toward the weight sensors SA and SB. Therefore, the weight values ​​JA and JB measured by the weight sensors SA and SB increase. In contrast, the weight values ​​JC and JD measured by the weight sensors SC and SD decrease. Note that in Figures 9(a) and 9(b), the rotating unit 77 does not rotate the hand 73 around the vertical axis AX5.

[0088] In this way, at least one of the movement and rotation of the hand 73 causes the liquid in the liquid film formed on the upper surface of the substrate W to move, and the amount of change in the weight of the liquid can be monitored by the four weight sensors SA to SD.

[0089] Therefore, the robot control unit 111 causes the hand 73 to support the substrate W on whose upper surface a liquid film has been formed, and measures the weight of the liquid film using the four weight sensors SA to SD. The weight of the liquid film can be used to determine the amount of the liquid film (liquid volume). The robot control unit 111 then obtains the allowable range RA of acceleration and deceleration for moving the hand 73, corresponding to the type of substrate W and the measured weight of the liquid film. The robot control unit 111 then causes the advancing / retracting unit 75 or the linear movement unit 79 to move the hand 73 within the allowable range RA of acceleration and deceleration.

[0090] See FIG. 10. The allowable range of acceleration / deceleration RA is narrower than the limit range of acceleration / deceleration LRA. The limit range of acceleration / deceleration LRA is the limit range within which the movement of the liquid in the liquid film will not cause spillage of the liquid from the substrate W. If it is within the limit range of acceleration / deceleration LRA, no spillage will occur unless it differs from the actual range. The limit range of acceleration / deceleration LRA is set in advance by conducting experiments, etc. For example, the limit range LRA is set by using four weight sensors SA to SD to measure the weight value (weight change amount) of the liquid at which the movement of the liquid in the liquid film will cause spillage of the liquid from the substrate W.

[0091] The limit range LRA is the acceleration (positive acceleration) (m / s 2 ;meters per second per second) limit and deceleration (negative acceleration) (m / s 2 ) limit value. Similarly, the allowable range of acceleration / deceleration RA is the range between the allowable value of acceleration and the allowable value of deceleration. The allowable range RA is also set in advance.

[0092] As shown in FIG. 10, the limit range LRA of acceleration / deceleration corresponds to the limit range LRB of the weight change amount (N; Newton) of the liquid. If one of the four weight sensors SA to SD measures a weight change amount that falls outside the limit range LRB, the liquid will spill from the substrate W. The allowable range RA of acceleration / deceleration corresponds to the allowable range RB of the weight change amount of the liquid. In FIG. 10, the weight change amount is the amount of weight change relative to the weight when the liquid film is stationary. Therefore, if the weight change amount is 0 (zero), it means that the measured weight is the same as the weight when stationary.

[0093] Furthermore, the robot control unit 111 acquires the allowable range RC of rotational acceleration / deceleration for rotating the hand 73, which corresponds to the type of substrate W and the weight of the measured liquid film. Thereafter, the robot control unit 111 causes the rotation unit 77 to rotate the hand 73 within the allowable range RC.

[0094] The allowable range RC of rotational acceleration / deceleration is narrower than the limit range LRC of rotational acceleration / deceleration. The limit range LRC of rotational acceleration / deceleration is the limit range within which the movement of the liquid in the liquid film does not cause spillage of the liquid from the substrate W. The limit range LRC of rotational acceleration / deceleration is set in advance by conducting experiments, etc. The limit range LRC is the rotational acceleration (positive rotational acceleration or positive angular acceleration) (rad / s 2 ; radians per second per second) and rotational deceleration (negative rotational acceleration or negative angular acceleration) (rad / s 2 ) range. Similarly, the rotational acceleration / deceleration allowable range RC is the range of the allowable values ​​of the rotational acceleration and the allowable values ​​of the rotational deceleration. The allowable range RC is also set in advance.

[0095] Furthermore, the limit range LRC of rotational acceleration / deceleration corresponds to the limit range LRD of the amount of change in weight of the liquid. Furthermore, the allowable range RC of acceleration / deceleration corresponds to the allowable range RD of the amount of change in weight of the liquid. Note that data showing the relationship between rotational acceleration / deceleration and amount of change in weight, as shown in Figure 10, is prepared separately from data showing the relationship between acceleration / deceleration and amount of change in weight.

[0096] 11 is a diagram showing an example of the lookup table LUT. The lookup table LUT is stored in at least one of the storage unit 113 and a storage unit 181, which will be described later. The robot control unit 111 uses the lookup table LUT to obtain, for example, an allowable range RA of acceleration / deceleration, an allowable range RC of rotational acceleration / deceleration, and allowable ranges RB and RD of weight change, which correspond to the type of substrate W and the measured weight of the liquid film.

[0097] In FIG. 11, the type of substrate W includes any one of the wettability of the substrate W, the warp of the substrate W (e.g., umbrella-shaped or bowl-shaped), and the diameter of the substrate W (e.g., 300 mm (millimeters)). The wettability of the substrate W refers to, for example, whether the substrate W is hydrophilic or hydrophobic. For example, the substrate WA shown in FIG. 11 is a hydrophilic substrate, and the substrate WB is a hydrophobic substrate. The wettability is expressed by the contact angle. The weight of the liquid film is, for example, the total value of weight values ​​JA to JD measured by four weight sensors SA to SD. For example, weights JU1, JU2, and JU3 are assigned to the substrates WA, WB, and WC, respectively.

[0098] FIG. 12 is a diagram showing an example of the relationship between acceleration / deceleration and the amount of change in weight of the liquid in the case of a hydrophilic substrate WA. In the case of a hydrophilic substrate WA, a relatively small amount of liquid (e.g., DIW) can cover the entire upper surface of the substrate W. Therefore, liquid spillage does not occur until the weight change amount is large. FIG. 13 is a diagram showing an example of the relationship between acceleration / deceleration and the amount of change in weight of the liquid in the case of a hydrophobic substrate WB. In the case of a hydrophobic substrate WB, a relatively large amount of liquid (e.g., DIW) is required to cover the entire upper surface of the substrate W. Therefore, liquid spillage occurs even with a small weight change amount.

[0099] The allowable range RA of acceleration / deceleration corresponds to the first range of the present invention. The allowable range RB of weight change corresponds to the change amount range of the present invention. The allowable range RC of rotational acceleration / deceleration corresponds to the second range of the present invention.

[0100] <5. Single wafer processing equipment> Please refer to Fig. 1. The single-substrate processing device 7 performs predetermined processing on the plurality of substrates W received from the relay device 5 one by one.

[0101] The single wafer processing apparatus 7 includes an indexer block 121 and a processing block 123. The indexer block 121 includes, for example, four placement shelves 125 and an indexer robot IR. The four placement shelves 125 are arranged in the width direction Y. The four placement shelves 125 are arranged in front of the indexer robot IR. A carrier C is placed on each placement shelf 125.

[0102] The indexer robot IR transports substrates W between the four carriers C placed on the four placement shelves 125 and the substrate placement part PS2, which will be described later. The indexer robot IR includes a hand 127, an articulated arm 129, and a lifting platform 131. The hand 127 holds one substrate W in a horizontal position.

[0103] The articulated arm 129 moves the hand 127 in the horizontal direction and also changes the orientation of the hand 127. The tip end of the articulated arm 129 is connected to the hand 127, and the base end is connected to a lifting platform 131. The lifting platform 131 raises and lowers the hand 127 via the articulated arm 129. The articulated arm 129 and the lifting platform 131 are equipped with, for example, electric motors.

[0104] The processing block 123 is adjacent to and rearward of the indexer block 121. The processing block 123 includes a substrate transport region R4 and, for example, four towers TW1 to TW4. The substrate transport region R4 extends rearward (in the front-to-rear direction X) from the indexer block 121. The two towers TW1 and TW2 are provided along the substrate transport region R4. The two towers TW3 and TW4 are also provided along the substrate transport region R4. The two towers TW1 and TW2 are disposed opposite the two towers TW3 and TW4 across the substrate transport region R4.

[0105] Tower TW1 includes, for example, three single wafer processing chambers SW1 arranged in the vertical direction Z. Tower TW3 includes, for example, two single wafer processing chambers SW1 arranged in the vertical direction Z. In tower TW3, a substrate mounting part PS1 of relay device 5 is disposed between the two single wafer processing chambers SW1 arranged in the vertical direction Z. Each of the two towers TW2 and TW4 includes, for example, three single wafer processing chambers SW2 arranged in the vertical direction Z. Each of the eleven single wafer processing chambers SW1 and SW2 processes one horizontally oriented substrate W at a time.

[0106] The number of single wafer processing chambers SW1 and SW2 is not limited to 11. The number of single wafer processing chambers SW1 is not limited to 5, but may be 1 or more. The number of single wafer processing chambers SW2 is not limited to 6, but may be 1 or more.

[0107] Each single wafer processing chamber SW1 includes, for example, a holding / rotating unit 141 and a nozzle 143. The holding / rotating unit 141 includes a spin chuck that holds one substrate W in a horizontal position, and an electric motor that rotates the spin chuck around a vertical axis that passes through the center of the substrate W. The nozzle 143 supplies a processing liquid to the upper surface of the substrate W held by the holding / rotating unit 141. For example, pure water (e.g., DIW) and IPA (isopropyl alcohol) are used as the processing liquid. Each single wafer processing chamber SW1 performs a cleaning process on the substrate W with pure water, and then forms a liquid film of IPA on the upper surface of the substrate W.

[0108] Each single wafer processing chamber SW2 performs a drying process using, for example, a supercritical fluid. For example, carbon dioxide is used as the fluid. When the fluid is carbon dioxide, the supercritical state is achieved when the critical temperature is 31°C and the critical pressure is 7.38 MPa. By performing a drying process using a supercritical fluid, pattern collapse on the substrate W is prevented.

[0109] Each single wafer processing chamber SW2 includes a chamber body (container) 145, a support tray 147, and a lid. The chamber body 145 includes a processing space provided therein, an opening for placing a substrate W into the processing space, a supply port, and an exhaust port. The substrate W is accommodated in the processing space while being supported by the support tray 147. The lid closes the opening of the chamber body 145. For example, each single wafer processing chamber SW2 brings a fluid to a supercritical state and supplies the supercritical fluid to the processing space in the chamber body 145 from the supply port. A drying process is performed on one substrate W using the supercritical fluid supplied to the processing space.

[0110] The substrate transfer region R4 includes a center robot CR1 and a substrate platform PS2. The substrate platform PS2 is disposed between the indexer robot IR and the center robot CR1. One or more substrates W are placed on the substrate platform PS2.

[0111] The center robot CR1 transports one substrate W in a horizontal position, for example, between the substrate placement parts PS1, PS2 and the eleven single-wafer processing chambers SW1, SW2. The center robot CR1 includes, for example, two hands 151, 152, an advancing / retreating part 153, an elevating / rotating part 155, and a linear movement part 157. Each of the two hands 151, 152 holds one substrate W in a horizontal position. The hand 151 supports a substrate W having a liquid film formed on its upper surface. The hand 152 supports a substrate W that has been dried. The hand 152 is positioned higher than the hand 151. This prevents the spilled liquid from adhering to the upper surface of the substrate W supported by the hand 152, even if liquid spills from the substrate W held by the hand 151.

[0112] The advancing / retreating unit 153 moves the two hands 151, 152 forward and backward individually. The lifting / rotating unit 155 lifts and lowers the two hands 151, 152 and the advancing / retreating unit 153. Furthermore, the lifting / rotating unit 155 rotates the two hands 151, 152 and the advancing / retreating unit 153 around a vertical axis AX7 to change the orientation of the two hands 151, 152. The advancing / retreating unit 153 and the lifting / rotating unit 155 include, for example, an electric motor. The linear moving unit 157 moves the two hands 151, 152, the advancing / retreating unit 153, and the lifting / rotating unit 155 in the forward / backward direction X. The linear moving unit 157 includes, for example, a guide rail, a slider, and an electric motor.

[0113] The processing block 123 further includes two substrate transport robots CR2 and CR3. The first substrate transport robot CR2 is provided between the two towers TW1 and TW2. The second substrate transport robot CR3 is provided between the two towers TW3 and TW4. Each of the substrate transport robots CR2 and CR3 transports a substrate W having a liquid film (e.g., an IPA film) formed on its upper surface from the single-wafer processing chamber SW1 to the single-wafer processing chamber SW2. Like the center robot CR1, each of the substrate transport robots CR2 and CR3 includes a hand 151, a forward / backward moving unit 153, and an elevation / rotation unit 155. The elevation / rotation unit 155 of each of the substrate transport robots CR2 and CR3 rotates the hand 151 and other components around a vertical axis AX8.

[0114] <6. Control Unit> The substrate processing system 1 includes a main control unit 180 and a storage unit 181. The main control unit 180 controls each component of the substrate processing system 1. The main control unit 180 includes one or more processors, such as a central processing unit (CPU). The storage unit 181 includes at least one of a read-only memory (ROM), a random-access memory (RAM), and a hard disk. The storage unit 181 stores computer programs required to control each component of the substrate processing system 1. The robot control unit 111 or the main control unit 180 corresponds to the control unit of the present invention. The storage unit 113 or the storage unit 181 corresponds to the storage unit of the present invention.

[0115] 7. Operation of the Substrate Processing System Next, the operation of the substrate processing system 1 will be described with reference to the flowchart of FIG.

[0116] [Step S01] Transferring substrates from carriers Referring to Figure 1, an external transfer robot (not shown) transfers a carrier C to a load port 9. A carrier transfer robot 13 of the stocker 2 transfers the carrier C from the load port 9 to a loading shelf 17. The carrier C stores, for example, 25 substrates W before processing.

[0117] Thereafter, the substrate handling mechanism HTR of the batch processing apparatus 3 removes 25 substrates W from the carrier C placed on the loading shelf 17, and transports the 25 substrates W to the attitude conversion unit 31. Thereafter, the carrier transport robot 13 transports the carrier C, which has been emptied after the 25 substrates W have been removed, from the loading shelf 17 to the load port 9. The external transport robot transports the empty carrier C from the load port 9 to one of the four loading shelves 125.

[0118] [Step S02] Vertical posture transformation Thereafter, the attitude conversion unit 31 converts the 25 substrates W from a horizontal attitude to a vertical attitude (see FIGS. 2(a) and 2(b)). The pusher mechanism 33 receives the 25 substrates W in the vertical attitude from the attitude conversion unit 31 and transports the 25 substrates W to the substrate transfer position PP (see FIG. 2(c)).

[0119] [Step S03] Batch processing Referring to FIG. 1, the first batch transport robot WTR1 receives 25 substrates W in a vertical position from the pusher mechanism 33 and transports the 25 substrates W to one of the two chemical liquid treatment baths BT1, BT2. For example, the lifter LF1 receives the 25 substrates W in a vertical position from the first batch transport robot WTR1 above the chemical liquid treatment bath BT1 and immerses the 25 substrates W in the phosphoric acid solution (chemical liquid) stored in the chemical liquid treatment bath BT1. In this way, the chemical liquid treatment is performed on the 25 substrates W all at once. Note that the same chemical liquid treatment is performed when the lifter LF2 receives 25 substrates W from the first batch transport robot WTR1.

[0120] The lifter LF1 then lifts the 25 substrates W out of the phosphoric acid solution. The first batch transport robot WTR1 receives the 25 substrates W from the lifter LF1 and transports them to one of the two cleaning processing tanks BT3, BT4. For example, the lifter LF3 receives the 25 substrates W from the first batch transport robot WTR1 above the cleaning processing tank BT3 and immerses the 25 substrates W in pure water (e.g., DIW) stored in the cleaning processing tank BT3. This removes the phosphoric acid solution from each substrate W. The cleaning processing is also performed on the 25 substrates W collectively. Note that the same cleaning processing is performed when the lifter LF4 receives the 25 substrates W from the first batch transport robot WTR1.

[0121] Thereafter, the lifter LF3 lifts up the 25 substrates W from the pure water. The first batch transport robot WTR1 receives the 25 substrates W from the lifter LF3 and transports the 25 substrates W to the attitude change area R2 of the relay device 5. Each substrate W is in a wet state.

[0122] [Step S04] Horizontal posture change Thereafter, the standby lifter LF9 receives the 25 substrates W in a vertical position from the first batch transport robot WTR1 above the standby tank 45. Thereafter, as shown in Fig. 15(a), the standby lifter LF9 immerses the 25 substrates W in pure water (e.g., DIW) stored in the standby tank 45. At this time, the chucks 52 of the second batch transport robot WTR2 are in an open state.

[0123] 15(b). Thereafter, the standby lifter LF9 raises the 25 substrates W to a position higher than the chucks 52. As a result, the 25 substrates W are lifted up from the pure water in the standby tank 45. Thereafter, the second batch transport robot WTR2 closes the chucks 52. As a result, the chucks 52 are able to hold the 25 substrates W.

[0124] 15(c). Thereafter, the standby lifter LF9 lowers the 25 substrates W. This allows the chucks 52 to receive the 25 substrates W from the standby lifter LF9. Thereafter, the second batch transport robot WTR2 moves the chucks 52 holding the 25 substrates W from above the standby tank 45 to above the posture changing tank 47 (i.e., below the rotating chuck 61 of the posture changing unit 49). At this time, the rotating chuck 61 is in an open state.

[0125] 16(a), the attitude changing unit 49 then lowers the rotary chuck 61 to position the 25 substrates W in a vertical attitude between the pair of chuck members 65, 66. The attitude changing unit 49 then closes the rotary chuck 61. As a result, the rotary chuck 61 holds the 25 substrates W held by the chuck 52.

[0126] 16(b), the second batch transfer robot WTR2 then opens the chucks 52, thereby releasing the holding of the 25 substrates W. The second batch transfer robot WTR2 then moves the open chucks 52 from above the posture changing tank 47 to above the standby tank 45.

[0127] Thereafter, the attitude changing unit 49 lowers the rotary chuck 61 holding the 25 substrates W in the vertical attitude. As a result, the 25 substrates W are immersed in the pure water (e.g., DIW) stored in the attitude changing tank 47. Thereafter, in the pure water, the attitude changing unit 49 rotates the rotary chuck 61 by 90 degrees about the horizontal axis AX4 to change the 25 substrates W from the vertical attitude to a horizontal attitude. The device surface of each of the horizontally oriented substrates W faces upward.

[0128] 16(c). Thereafter, the attitude changing unit 49 raises the rotary chuck 61, thereby, for example, lifting the substrate W at the highest position out of the pure water. At this time, the substrate W at the highest position is lifted out of the pure water while scooping up the pure water with its upper surface. As a result, a liquid film (a film of pure water) is formed on the upper surface of the substrate W.

[0129] [Step S05] Transporting the substrate on which the liquid film has been formed The substrate transport robot 71 transports the substrate W having the liquid film formed on the upper surface in the relay area R3 of the relay device 5. Fig. 17 is a flowchart showing the details of the transport of the substrate W in step S05.

[0130] [Step S51] Supporting the substrate on which the liquid film is formed 1 and 18. First, the linear movement unit 79 of the substrate transport robot 71 moves the hand 73 and other parts not supporting the substrate W to position PT1 on the attitude change unit 49 side. The tip of the hand 73 (hand 73) faces the attitude change unit 49. Then, the advance / retract unit 75 advances the hand 73 (arrow AR1 in FIG. 18). As a result, the hand 73 accesses the attitude change unit 49 and is moved below the substrate W at its highest position, as shown by the two-dot chain line in FIG. 16(c). The attitude change unit 49 slightly lowers the rotary chuck 61. As a result, the substrate W at its highest position is placed on the upper surfaces of the four contact units 97A to 97D of the hand 73. In the following description, the substrate W at its highest position will be referred to as "substrate W."

[0131] In this manner, the substrate transport robot 71 supports the substrate W having the liquid film (pure water film) formed on the upper surface of the substrate W with the hand 73. At this time, the substrate W is not supported by the rotary chuck 61, but is supported only by the hand 73.

[0132] [Step S52] Measuring the liquid film weight The hand 73 is provided with four weight sensors SA to SD corresponding to the four contact portions 97A to 97D. The weight of the liquid film is measured by the four weight sensors SA to SD. The four weight values ​​JA to JD output from the four weight sensors SA to SD are sent to the robot control unit 111. The robot control unit 111 calculates the weight of the liquid film, for example, by adding up the four weight values ​​JA to JD.

[0133] More specifically, the four weight values ​​JA to JD measured by the four weight sensors SA to SD include the weight of the liquid film and the weight of the substrate W. Therefore, for example, first, the weight of a dummy substrate equivalent to (having substantially the same shape and material as) the substrate W transported by the hand 73 is measured in advance, and the weight of the substrate W is stored in at least one of the memory unit 113 and the memory unit 181. Then, the weight of the dummy substrate is subtracted from the weight of the substrate W on which the liquid film has been formed. This gives the weight of the liquid film.

[0134] [Step S53] Obtain the allowable range of acceleration / deceleration 11, the robot control unit 111 acquires the allowable range RA of acceleration / deceleration and the allowable range RC of rotational acceleration for the movement of the hand 73 in accordance with the measured weight of the liquid film and the type of substrate W. In the lookup table LUT of FIG. 11, for example, the allowable range RA6 of acceleration / deceleration and the allowable range RC6 of rotational acceleration are acquired from the weight JU3 of the substrate WB and the liquid film.

[0135] [Step S54] Hand movement The robot control unit 111 moves the hand 73 within an allowable range RA of acceleration and deceleration using the advancing / retreating unit 75 or the linear movement unit 79. The robot control unit 111 also rotates the hand 73 within an allowable range RC of rotational acceleration and deceleration using the rotating unit 77. Next, a specific example of the operation will be described.

[0136] See FIG. 18. In the current state, the hand 73 is accessing the attitude change unit 49 and supporting the substrate W on which a liquid film has formed. Therefore, next, the advancing / retracting unit 75 retracts the hand 73 supporting the substrate W (arrow AR2 in FIG. 18). Here, the advancing / retracting unit 75 retracts the hand 73 within the allowable range RA of acceleration / deceleration. This prevents liquid from spilling from the substrate W during the retraction movement of the hand 73. Note that the allowable range RA of acceleration / deceleration corresponds to the allowable range RB of the amount of weight change. Therefore, in FIG. 7(b), the detection waveforms of the four weight sensors SA to SD fall within the allowable range RB.

[0137] After the hand 73 is retracted, the rotation unit 77 rotates the hand 73 supporting the substrate W 180 degrees counterclockwise around the vertical axis AX5 (arrow AR3 in FIG. 18). This changes the orientation of the hand 73 from the attitude changing unit 49 to the substrate placement unit PS1. Here, the rotation unit 77 rotates the hand 73 180 degrees within the permissible range RC of rotational acceleration / deceleration. This prevents liquid from spilling from the substrate W during the rotational operation (direction changing operation) of the hand 73. Note that the permissible range RC of rotational acceleration / deceleration corresponds to the permissible range RD of weight change. Therefore, in FIG. 8(b), the detection waveforms of the four weight sensors SA to SD fall within the permissible range RD.

[0138] After changing the orientation of the hand 73 to the substrate platform PS1, the linear movement unit 79 moves the hand 73 supporting the substrate W, the advancing / retreating unit 75, and the rotating unit 77 from position PT1 on the attitude changing unit 49 side to position PT2 on the substrate platform PS1 side (arrow AR4 in FIG. 18). Here, similarly, the linear movement unit 79 moves the hand 73 etc. within the allowable range RA of acceleration / deceleration. Note that in FIG. 9(b), the detection waveforms of the four weight sensors SA to SD fall within the allowable range RB of weight change amount.

[0139] After moving the hand 73 and other components to position PT2, the advancing / retracting unit 75 advances the hand 73 supporting the substrate W to move the hand 73 above the substrate mounting part PS1 (arrow AR5 in FIG. 18). Here, the advancing / retracting unit 75 advances the hand 73 within the allowable range RA of acceleration / deceleration. In FIG. 9(b), the detection waveforms of the four weight sensors SA to SD fall within the allowable range RB of weight change.

[0140] After the hand 73 is advanced above the substrate platform PS1, the three lift pins PN (see FIG. 18) of the substrate platform PS1 are raised by the electric motor. As a result, the three lift pins PN receive the substrate W from the hand 73 while supporting the underside of the substrate W on which a liquid film has been formed. The substrate transport robot 71 then retreats the hand 73 that is not supporting the substrate W. The substrate transport robot 71 then transports the remaining 24 substrates W one by one to the substrate platform PS1. Note that a liquid film has been formed on the upper surface of the transported substrate W.

[0141] [Step S06] First single wafer processing See Figure 1. The center robot CR1 of the single wafer processing apparatus 7 uses the hand 151 to receive the substrate W on which the liquid film has been formed from the substrate mounting part PS1, and transports the substrate W to one of the five single wafer processing chambers SW1 of the two towers TW1 and TW3. The holding and rotating part 141 of each single wafer processing chamber SW1 holds and rotates the substrate W with its device side facing upward in a horizontal position. Furthermore, each single wafer processing chamber SW1 supplies pure water from a nozzle 143 to the device side (top surface) of the rotating substrate W, and then supplies IPA from the nozzle 143 to the device side. As a result, the pure water on the top surface of the substrate W is replaced with IPA.

[0142] [Step S07] Second Single-Wafer Processing The first substrate transport robot CR2 receives the substrate W on which the liquid film (IPA film) has been formed from one of the three single-wafer processing chambers SW1 in the tower TW1 using the hand 151. Thereafter, the first substrate transport robot CR2 transports the substrate W to one of the three single-wafer processing chambers SW2 in the tower TW2.

[0143] Furthermore, the second substrate transport robot CR3 receives the substrate W on which the liquid film (IPA film) has been formed from one of the two single-wafer processing chambers SW1 of the tower TW3 using the hand 151. Thereafter, the second substrate transport robot CR3 transports the substrate W to one of the three single-wafer processing chambers SW2 of the tower TW4.

[0144] Each second single-wafer processing chamber SW2 uses carbon dioxide in a supercritical state (supercritical fluid) to perform a drying process on one substrate W. The drying process using the supercritical fluid prevents the pattern on the device surface of the substrate W from collapsing.

[0145] [Step S08] Transferring substrates to carriers The center robot CR1 uses the hand 152 to receive one substrate W that has been dried from one of the six single-wafer processing chambers SW2, and transports the single substrate W to the substrate platform PS2. Twenty-five substrates W that have been dried are transported in turn to the substrate platform PS2.

[0146] The indexer robot IR uses the hand 127 to transport the substrates W placed on the substrate platform PS2 to the carrier C placed on the mounting shelf 125. Once the 25 dried substrates W have been transported to the carrier C, an external transport robot (not shown) transports the carrier C from the mounting shelf 125 to its next destination.

[0147] According to this embodiment, the allowable range RA of acceleration / deceleration for moving the hand 73 is acquired in accordance with the type of substrate W and the weight of the liquid film (state of the liquid film). The hand 73 is moved within this allowable range RA of acceleration / deceleration. This makes it possible to prevent liquid from spilling from the upper surface of the substrate W during transport. Furthermore, since the allowable range RA of acceleration / deceleration is a range that takes into account the wettability of the substrate W, the accuracy of the allowable range RA of acceleration / deceleration can be improved. Furthermore, the allowable range RA of acceleration / deceleration can be easily acquired using the look-up table LUT.

[0148] The substrate transport robot is equipped with four weight sensors SA to SD as detectors for detecting the state of the liquid film. The four weight sensors SA to SD are provided on the hand 73. Therefore, the robot control unit 111 can obtain the allowable range RA of acceleration and deceleration by taking into account the weight of the liquid film actually measured by the four weight sensors SA to SD. Furthermore, the four weight sensors SA to SD are relatively small and relatively inexpensive. Therefore, even if the hand 73 is provided with the four weight sensors SA to SD, the size of the hand 73 is unlikely to increase. Therefore, problems with space or cost are unlikely to occur.

[0149] Furthermore, according to this embodiment, the allowable range RC of rotational acceleration / deceleration for rotating the hand 73 is acquired, which corresponds to the type of substrate W and the weight of the liquid film (state of the liquid film). The hand 73 is rotated within the allowable range RC of rotational acceleration / deceleration. This makes it possible to prevent liquid from spilling from the upper surface of the substrate W during transportation (particularly rotation). [Example]

[0150] Next, a second embodiment of the present invention will be described with reference to the drawings. Note that the description overlapping with the first embodiment will be omitted.

[0151] In the first embodiment, the substrate transport robot 71 did not take any particular action even if the weight change rate of the liquid measured by the weight sensor SA exceeded the allowable range RB during the horizontal movement of the hand 73. In contrast, in the second embodiment, when the weight change rate of the liquid exceeds the allowable range RB, the acceleration / deceleration of the hand 73 during transport (movement) is controlled (adjusted) so that the weight change rate of the liquid falls within the allowable range RB.

[0152] The robot control unit 111 monitors the four weight changes of the liquid moving on the upper surface of the substrate W at the measurement positions of the weight sensors SA to SD based on the four weight values ​​JA to JD measured by the four weight sensors SA to SD while the hand 73 is moving. If any of the four weight changes falls outside the allowable range RB of the weight change corresponding to the allowable range RA of the acceleration / deceleration, the robot control unit 111 reduces the absolute value of the acceleration / deceleration of the hand 73 so that the weight change falls within the allowable range RB.

[0153] For example, in the acceleration region of Figure 19, suppose that the liquid is concentrated on the weight sensor SA side, causing the weight change in the weight value JA measured by the weight sensor SA to exceed the allowable range RB. In this case, the acceleration (absolute value) is reduced so that the weight change in the weight value JA falls within the allowable range RB (symbol DL in Figure 19). This brings the weight change in the weight value JA within the allowable range RB, reducing the possibility of liquid spillage.

[0154] Similarly, the robot control unit 111 monitors the four weight changes of the liquid moving on the upper surface of the substrate W at the measurement positions of the weight sensors SA to SD based on the four weight values ​​JA to JD measured by the four weight sensors SA to SD during rotation of the hand 73 about the vertical axis AX5. If any of the four weight changes falls outside the allowable range RD of the weight change corresponding to the allowable range RC of the rotational acceleration / deceleration, the robot control unit 111 reduces the absolute value of the rotational acceleration / deceleration so that the weight change falls within the allowable range RD.

[0155] The effect of this embodiment will be explained. If the acquired acceleration / deceleration is within the allowable range RA, liquid spillage will not occur. However, the relationship between the acquired allowable range RA and the allowable range RB of weight change may change due to some factor. In this case, the possibility of liquid spillage increases. Even in such cases, the allowable range RB of weight change is used as a threshold, and if the weight change amount deviates from this range, the weight change amount is controlled (adjusted) to fall within the allowable range RB. Therefore, liquid spillage can be prevented.

[0156] The present invention is not limited to the above-described embodiment, but can be modified as follows.

[0157] (1) In each of the above-described embodiments, the center robot CR1 and at least one of the two substrate transport robots CR2 and CR3 may be configured similarly to the substrate transport robot 71 that prevents liquid from spilling from the substrate W. In this case, the center robot CR1 and at least one of the two substrate transport robots CR2 and CR3 configured similarly to the substrate transport robot 71 correspond to the substrate transport robot of the present invention.

[0158] 6, the hand 151 includes four weight sensors SA to SD. The main control unit 180 acquires the allowable range RA of acceleration and deceleration for moving the hand 151 in accordance with the type of substrate W and the weight of the measured liquid film. Thereafter, the main control unit 180 moves the hand 151 within the allowable range RA of acceleration and deceleration using, for example, the advancing and retreating unit 153 or the linear movement unit 157.

[0159] (2) In the above-described embodiments and modified example (1), the substrate transport robot 71 is provided with four weight sensors SA to SD that measure the weight of the liquid film as a detector for detecting the state of the liquid film. In this regard, the substrate transport robot 71 may be provided with a camera 185 as a detector instead of the four weight sensors SA to SD. As shown in FIG. 20(a), for example, the camera 185 photographs the entire liquid film formed on the upper surface of the substrate W supported by the hand 73 from above the substrate W. This obtains an entire image ZG of the liquid film as shown in FIG. 20(b). The entire image ZG of the liquid film is sent to the robot control unit 111.

[0160] The robot control unit 111 may acquire a corresponding value corresponding to the weight or amount (liquid volume) of the liquid film based on pixel values ​​indicating the density of the liquid film captured in the entire image ZG. Then, the robot control unit 111 may acquire, for example, the type of substrate W and an allowable range RA of acceleration / deceleration for moving the hand 73, etc., corresponding to the acquired corresponding value.

[0161] The camera 185 may also be moved together with the hand 73. In this way, the robot control unit 111 may monitor the amount of change in the four corresponding values ​​in the four regions of interest INT1, INT2, INT3, and INT4 (see FIG. 20(b)) of the entire image ZG based on the entire image ZG captured by the camera 185 while the hand 73 is moving. Furthermore, when any of the amounts of change in the four corresponding values ​​falls outside the range of change corresponding to the allowable range RA of acceleration / deceleration, the robot control unit 111 reduces the absolute value of the acceleration / deceleration of the hand 73 so that the amount of change falls within the range of change.

[0162] (3) In each of the above-described embodiments and modifications, the substrate transport robot 71 includes weight sensors SA to SD that measure the weight of the liquid film as a detection unit that detects the state of the liquid film. In this regard, the substrate transport robot 71 may include a film thickness meter 187 as a detection unit instead of the four weight sensors SA to SD.

[0163] 21 , for example, a non-contact type film thickness meter using a laser beam is used as the film thickness meter 187. For example, as shown in Fig. 21 , the film thickness meter 187 measures the film thickness at a predetermined position of the liquid film formed on the upper surface of the substrate W supported by the hand 73 from above the substrate W. The film thickness is sent to the robot control unit 111. The robot control unit 111 acquires the measured film thickness of the liquid film and the range of acceleration / deceleration for moving the hand 73 corresponding to the type of substrate W.

[0164] (4) In each of the above-described embodiments and modifications, the robot control unit 111 acquires the allowable range RA of acceleration / deceleration for moving the hand 73, which corresponds to the type of substrate W and the measured weight of the liquid film, using the lookup table LUT shown in Fig. 11. In this regard, the robot control unit 111 may acquire the allowable range RA of acceleration / deceleration and the allowable range RC of rotational acceleration / deceleration without using the lookup table LUT.

[0165] For example, the robot control unit 111 acquires the allowable range RA of acceleration / deceleration etc. as follows: First, as shown in Fig. 22, the memory unit 113 or the memory unit 181 stores a plurality of different relational data DT for each combination of the type of substrate W and the weight of the liquid film. Each relational data DT has a relational expression EX between the amount of change in weight of the liquid film (amount of change in state of the liquid film) and the acceleration / deceleration, an allowable range RA of acceleration / deceleration in this relational expression EX, and an allowable range RB of the amount of change in weight.

[0166] The robot control unit 111 supports the substrate W on which the liquid film has been formed by the hand 73. Thereafter, the robot control unit 111 measures four weight values ​​JA to JD using the four weight sensors SA to SD. The robot control unit 111 may obtain the weight of the liquid film based on the four measured weight values ​​JA to JD. Furthermore, the robot control unit 111 measures a weight change amount CM1 of the four liquid films using the four weight sensors SA to SD while the advancing / retreating unit 75 or the linear movement unit 79 is moving the hand 73 at a preset acceleration / deceleration AC1.

[0167] The robot control unit 111 then compares the preset acceleration / deceleration AC1 and the measured weight change CM1 of the liquid film with the relational equation EX of each of the multiple pieces of relational data DT. As a result, the robot control unit 111 extracts one piece of relational data DT1 having the optimal relational equation EX from the multiple pieces of relational data DT. The robot control unit 111 also obtains the allowable range RA of acceleration / deceleration and the allowable range RB of weight change contained in the one piece of relational data DT1. The allowable range RC of rotational acceleration / deceleration and the allowable range RD of weight change are also obtained in the same way.

[0168] According to this modification, even if the conditions for the type of substrate W are insufficient, for example, it is possible to acquire optimal (approximate) relationship data DT from the multiple pieces of relationship data DT already in possession, and to acquire the allowable range RA of acceleration / deceleration and the allowable range RB of weight change contained in that relationship data DT. Note that if multiple weight change amounts CM1, CM2 are acquired using multiple acceleration / deceleration rates AC1, AC2, the accuracy of matching can be improved.

[0169] (4) In the above-described embodiments and modifications, the substrate transport robot 71 cannot raise and lower the hand 73. In this regard, the substrate transport robot 71 may be configured to raise and lower the hand 73.

[0170] (5) In the above-described embodiments and modifications, the hand 73 is advanced and retreated by the screw shaft 87 and guide rail 89 of the advancing and retreating unit 75. However, the hand 73 may be advanced and retreated by an articulated arm instead of the advancing and retreating unit 75. It may be possible to do so.

[0171] (6) In the above-described embodiments and modifications, the advancing / retreating unit 75 moved the hand 73 when the linear movement unit 79 was not moving the hand 73. However, the advancing / retreating unit 75 may move the hand 73 when the linear movement unit 79 was moving the hand 73.

[0172] (7) In the above-described embodiments and modifications, the rotation unit 77 rotates the hand 73 about the vertical axis AX5 when the advancing / retreating unit 75 and the linear movement unit 79 are not moving the hand 73. However, the rotation unit 77 may rotate the hand 73 about the vertical axis AX5 when at least one of the advancing / retreating unit 75 and the linear movement unit 79 is moving the hand 73.

[0173] (8) In the above-described embodiments and modifications, the allowable ranges RA and RC of acceleration and deceleration correspond to the type of substrate W and the weight of the liquid film (state of the liquid film). The allowable ranges RA and RC may correspond to the type of liquid, the temperature of the liquid, the type of substrate W, and the weight of the liquid film. The liquid is the liquid in the liquid film formed on the upper surface of the substrate W.

[0174] (9) In the above-described embodiments and modifications, the substrate in a horizontal position is lifted up from the pure water in the position changing unit 49 of Fig. 16(c), thereby forming a liquid film on the upper surface of the substrate W. In this regard, the liquid film may be formed on the upper surface of the substrate W by supplying pure water in a columnar or mist form from a nozzle onto the upper surface of the substrate W.

[0175] For example, the relay area R3 may be provided with a nozzle NZ shown by the dashed line in Fig. 18. For example, suppose that processing in the single wafer processing apparatus 7 stops and the substrate W supported by the hand 73 moved to position PT2 cannot be transported. In this case, the liquid film on the upper surface of the substrate W may volatilize and become smaller. Therefore, by supplying pure water to the upper surface of the substrate W from the nozzle NZ, the substrate W can be prevented from drying out.

[0176] (10) In each of the above-described embodiments and modifications, the hand 73 is provided with four weight sensors SA to SD. As a result, the weight is measured at four locations on the hand 73. In this regard, the number of weight sensors is not limited to four. That is, the hand 73 may be provided with at least one weight sensor provided on the hand body 83. Also, for example, one weight sensor may be disposed on any one of the four contact portions 97A to 97D. Also, for example, two weight sensors may be provided corresponding to any two of the four contact portions 97A to 97D.

[0177] (11) In each of the above-described embodiments and modifications, the robot control unit 111 acquires the allowable range RA of acceleration / deceleration and the allowable range RC of rotational acceleration / deceleration corresponding to the type of substrate W and the weight of the liquid film measured by the four weight sensors SA to SD. In this regard, for example, if the weight of the liquid film can be known to some extent from the amount (in milliliters) of liquid supplied from the nozzle to the upper surface of the substrate W, the allowable range RA etc. may not take into account the weight of the liquid film measured by the four weight sensors SA to SD. In such a case, for example, the robot control unit 111 acquires the amount of liquid film supplied or the corresponding weight of the liquid film from the memory unit 113 as the state of the liquid film.

[0178] (12) In the above-described embodiments and modifications, the robot control unit 111 uses the lookup table LUT to acquire the allowable range RA of acceleration / deceleration for moving the hand 73, etc., corresponding to the type of substrate W and the state of the liquid film. In this regard, the robot control unit 111 may use the lookup table LUT to acquire the allowable range RA of acceleration / deceleration for moving the hand 73, etc., corresponding to the state of the liquid film.

[0179] (13) In the above-described embodiments and modifications, the single wafer processing chamber SW2 uses a supercritical fluid to dry the substrate W. In this regard, the single wafer processing chamber SW2 may include a holding / rotating unit 141 and a nozzle 143, similar to the single wafer processing chamber SW1. In this case, each of the eleven single wafer processing chambers SW1 and SW2 supplies, for example, pure water and IPA to the substrate W in this order, and then performs a drying process (spin drying) on ​​the substrate W. [Explanation of symbols]

[0180] 1... Substrate processing system 71 ... Substrate transport robot 73...Hand 75 … Advancement and retreat club 77... Rotating part 79 ... Linear movement section SA, SB, SC, SD ... Weight sensor JA, JB, JC, JD ... weight value 111 ... Robot control unit 113 … Storage section Acceleration / deceleration tolerance range … RA Weight change tolerance: RB Rotation acceleration / deceleration tolerance range … RC Weight change tolerance … RD LUT...Look-up table CR1: Center robot CR2, CR3 ... Substrate transport robot 151 … Hand 153 … Advancement and retreat club 155 ... Elevating and rotating part 157 ... Linear movement section 180 ... Main control unit 181 … Storage section 185... Camera 187... Film Thickness Gauge AX5, AX7, AX8 ... vertical axis DT... relational data EX... relational expression AC1: Acceleration / deceleration CH1: Weight change W: Substrate

Claims

1. A substrate transport robot that transports a substrate, a hand that supports the substrate in a horizontal position; a moving unit that moves the hand in a horizontal direction; a control unit, The control unit The substrate on which the liquid film is formed is supported by the hand; acquiring a first range of acceleration / deceleration for moving the hand, the first range corresponding to the state of the liquid film; A substrate transport robot, characterized in that the hand is moved within the first range of acceleration and deceleration by the moving unit.

2. 2. The substrate transport robot according to claim 1, Further, a detection unit that detects the state of the liquid film is provided, The control unit The state of the liquid film is detected by the detection unit; A substrate transport robot, characterized in that a first range of the acceleration / deceleration for moving the hand is acquired in accordance with the detected state of the liquid film.

3. 3. The substrate transport robot according to claim 2, the detection unit is a weight sensor provided in the hand that measures weight, The control unit The weight sensor measures the weight of the liquid film; A substrate transport robot, characterized in that the range of acceleration / deceleration for moving the hand is acquired in accordance with the measured weight of the liquid film.

4. 4. The substrate transport robot according to claim 3, The hand includes a hand body and a plurality of contact portions provided on an upper surface of the hand body for receiving a peripheral portion of the substrate; The substrate transport robot is characterized in that the weight sensor is provided between any one of the plurality of contact portions and the hand body.

5. 4. The substrate transport robot according to claim 3, the first range of acceleration / deceleration is an allowable range of acceleration / deceleration that is narrower than the limit range of acceleration / deceleration in which movement of the liquid in the liquid film does not cause spillage of the liquid from the substrate, the control unit monitors a change in weight of the liquid moving on the upper surface of the substrate at a measurement position of the weight sensor based on a weight value measured by the weight sensor while the hand is moving; a substrate transport robot, characterized in that the acceleration / deceleration of the hand is controlled so that the amount of change in weight falls within the range of change amount corresponding to the allowable range of the acceleration / deceleration;

6. 2. The substrate transport robot according to claim 1, The control unit acquires a first range of the acceleration / deceleration for moving the hand, the first range corresponding to the state of the liquid film and the type of the substrate.

7. 7. The substrate transport robot according to claim 6, The substrate transport robot is characterized in that the type of the substrate includes the wettability of the substrate.

8. 7. The substrate transport robot according to claim 6, The control unit uses a lookup table to obtain a first range of acceleration / deceleration for moving the hand, corresponding to the state of the liquid film and the type of the substrate.

9. 2. The substrate transport robot according to claim 1, a detection unit that detects the state of the liquid film; a storage unit that stores a plurality of different relational data depending on the state of the liquid film; each of the plurality of relational data has a relational expression between the state change amount of the liquid film and the acceleration / deceleration, and a first range of the acceleration / deceleration in the relational expression; the control unit causes the detection unit to detect a state change amount of the liquid film when the movement unit moves the hand at a preset acceleration / deceleration speed, extracting one piece of relational data having an optimum relational expression from the plurality of pieces of relational data by comparing the preset acceleration / deceleration and the detected amount of change in state of the liquid film with the relational expressions of each of the plurality of pieces of relational data; The substrate transport robot is characterized in that a first range of the acceleration / deceleration speed contained in the one piece of relationship data is acquired.

10. 2. The substrate transport robot according to claim 1, Further provided is a rotating unit that rotates the hand around a vertical axis, The control unit acquires a second range of rotational acceleration / deceleration for rotating the hand corresponding to the state of the liquid film, and rotates the hand within the second range using the rotation unit.

11. A substrate processing system for processing a substrate, A substrate processing system comprising the substrate transport robot according to any one of claims 1 to 10.

12. A method for controlling a substrate transport robot that transports a substrate, comprising: The substrate transport robot a hand on which the substrate is placed in a horizontal position; a moving unit that moves the hand in a horizontal direction, The control method includes: a supporting step of supporting the substrate with the hand, the substrate having the liquid film formed on the upper surface of the substrate; a range acquisition step of acquiring a first range of acceleration / deceleration for movement of the hand, the first range corresponding to the state of the liquid film; a hand moving step of moving the hand within the first range of acceleration and deceleration by the moving unit; A method for controlling a substrate transport robot, comprising:

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