Laser processing device

Abstract

To further improve processing quality of routing processing by laser.SOLUTION: A laser processing device that performs laser processing includes: an input part that inputs a track that is processed by the laser; a determination part that determines whether or not the track has an arc track of equal to or less than a threshold; a track calculation part that calculates the track based on galvano and AOD on the basis of a determination result by the determination part; and a processing part that processes the track on the basis of a determination result by the determination part.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a laser processing device. [Background technology]

[0002] For example, as disclosed in Patent Document 1, a technique is known in which, in laser routing, a laser is deflected by a galvanometer mirror to cut a resin film. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2016-068086 Summary of the Invention [Problem to be solved by the invention]

[0004] However, conventional techniques have the problem that the processing quality of laser routing is insufficient.

[0005] An object of the present invention is to further improve the processing quality of laser routing processing. [Means for solving the problem]

[0006] Laser processing equipment that processes with lasers an input unit for inputting a trajectory to be processed by the laser; a determination unit that determines whether the trajectory includes an arc trajectory having a curvature radius equal to or less than a threshold; a trajectory calculation unit that calculates the trajectory based on the galvanometer and the AOD based on the determination result by the determination unit; a processing unit that processes the track based on the determination result by the determination unit; The present invention is characterized by comprising: [Effects of the Invention]

[0007] According to the present invention, the processing quality of the routing process using a laser can be further improved. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 2 is a diagram illustrating an example of a hardware configuration of a laser processing apparatus. [Figure 2] FIG. 10 is a diagram illustrating an example of overall processing. [Figure 3] FIG. 10 is a diagram illustrating an example of an effect. [Figure 4] FIG. 10 is a diagram illustrating responsiveness. [Figure 5] FIG. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, an embodiment will be described with reference to the drawings. In the following description, elements related to the invention will be described in detail, and other elements will be omitted. Note that the same elements are given the same reference numerals.

[0010] The laser processing apparatus 100 performs processing such as drilling by irradiating a printed circuit board or the like with a laser. For example, the laser processing apparatus 100 is an apparatus having the following hardware configuration.

[0011] [Hardware configuration example of laser processing device 100] 1 is a diagram showing an example of the hardware configuration of a laser processing apparatus. For example, the laser processing apparatus 100 includes an oscillation control device 100H1, an AOD control device 100H2, and a galvanometer control device 100H3. The laser processing apparatus 100 also includes a laser oscillator 100H4, an AOD (acousto-optical element, hereinafter referred to as "AOD 100H5"), a galvanometer scanner (hereinafter referred to as "galvanometer 100H6"), and an fθ lens 100H7. The laser processing apparatus 100 also includes a central processing unit (hereinafter referred to as "CPU 100H8").

[0012] Oscillation control device 100H1 is a control device that controls laser oscillator 100H4. Laser oscillator 100H4 emits laser light 101 based on the control of oscillation control device 100H1.

[0013] The AOD control device 100H2 is a control device that controls the AOD 100H5.

[0014] The galvanometer control device 100H3 is a control device that controls the galvanometer 100H6.

[0015] The galvanometer 100H6 is, for example, a galvanometer mirror, etc. Therefore, the galvanometer 100H6 deflects the laser light 101.

[0016] The fθ lens 100H7 is an optical component for irradiating the laser at a position away from the center of the lens by a distance proportional to the deflection angle θ of the galvano 100H6, and is placed between the galvano 100H6 and the workpiece. Normally, the laser processing apparatus 100 has an optical path system composed of multiple optical components other than the fθ lens 100H7, but this is not shown here because it is not necessary for explaining the invention.

[0017] The CPU 100H8 controls the entire device, for example, and also performs processes such as calculations.

[0018] Hereinafter, it is assumed that the object to be machined is an electronic circuit board 200. A scan area 20 is set on the electronic circuit board 200. The electronic circuit board 200 is machined for each scan area 20. Therefore, when the area to be machined is large, the scan area 20 is set to move sequentially through multiple locations within the electronic circuit board 200.

[0019] The electronic circuit board 200 is placed on a table, for example. The table may be able to be moved up and down, left and right, or in the depth direction, or may be able to be controlled to rotate, etc. A control device may be provided to control such a table.

[0020] The laser beam 101 emitted from the laser oscillator 100H4 is deflected by the AOD 100H5 and the galvanometer 100H6. After being deflected, the laser beam 101 enters the fθ lens 100H7 and processes the scan area 20 in the electronic circuit board 200.

[0021] The hardware configuration is not limited to the above. For example, the CPU 100H8 may also function as another control device or an arithmetic device. In addition, the hardware configuration may further include an arithmetic device, a control device, an input device, an output device, a communication device, a storage device, or an auxiliary device. Furthermore, each device may be realized by combining multiple devices.

[0022] [Overall processing example] 2 is a diagram showing an example of the overall process. For example, the laser processing apparatus 100 executes the following control method.

[0023] In step S01, the laser processing apparatus 100 acquires routing information. Specifically, the routing information is basically processing position coordinates and information on what type of processing will be performed. Therefore, once the laser processing apparatus 100 acquires the routing information, it becomes ready for subsequent trajectory calculation, processing, etc. Note that the routing information is, for example, input by the user in advance. Furthermore, the routing information may be any information that the laser processing apparatus 100 uses for overall processing including trajectory calculation, processing, etc.

[0024] In step S02, the laser processing apparatus 100 determines whether or not there is an arc trajectory having a curvature radius equal to or less than a threshold value. For example, the laser processing apparatus 100 determines whether or not there is a location on the arc trajectory having a curvature radius equal to or less than a threshold value based on the routing information.

[0025] The threshold is set in advance, and by determining whether or not there is an arcuate orbit with a curvature radius equal to or less than the threshold, it is possible to detect whether or not there is a portion to which the galvanometer 100H6 has difficulty responding. The threshold may be set based on the response specifications of the galvanometer 100H6, etc.

[0026] Next, if it is determined that there is an arcuate trajectory having a curvature radius equal to or less than the threshold value (YES in step S02), the laser processing apparatus 100 proceeds to step S03. On the other hand, if it is determined that there is no arcuate trajectory having a curvature radius equal to or less than the threshold value (NO in step S02), the laser processing apparatus 100 proceeds to step S04.

[0027] In step S03, the laser processing apparatus 100 performs trajectory calculation based on the galvanometer and the AOD.

[0028] In step S04, the laser processing apparatus 100 performs trajectory calculation based on a galvanometer.

[0029] The difference is that in step S03, the laser processing apparatus 100 performs trajectory calculation for the galvano and AOD, whereas in step S04, it performs trajectory calculation for only the galvano. Therefore, the trajectory calculation process is switched based on the determination result of whether or not there is an arc trajectory having a curvature radius equal to or less than the threshold.

[0030] In step S05, the laser processing apparatus 100 performs processing. Specifically, step S05 is executed based on the trajectory calculation result of either step S03 or step S04 performed in the previous stage.

[0031] [effect] 3 is a diagram showing an example of the effect. Below, an example will be explained in which machining is started from a starting point 10 and machined in an "inverted U" shape to an end point 14. Specifically, this is an example in which machining is performed along a target trajectory 15.

[0032] When the target trajectory 15 includes an "arc with a minimum radius of curvature 16," which is an example of an arc trajectory with a radius of curvature equal to or less than the threshold, the scan area 20 is moved by galvano scanning. Specifically, the area center point 21 is moved. When the area center point 21 moves, the scan area 20 also moves.

[0033] When processing the target trajectory 15, the area center point 21 is repeatedly moved in the order of the start point 10, the first point 11, the second point 12, the third point 13, and the end point 14. Along with the area center point 21, the AOD100H5 scans the moving scan area 20 to route the fine pattern.

[0034] The AOD100H5 has a higher response frequency than a galvanometer, so it can process even extremely small arc trajectories, including those with an extremely small curvature radius of 16.

[0035] 4 is a diagram illustrating the responsiveness. Hereinafter, it will be referred to as a beam spot 30. The movement speed of the beam spot by the galvanometer is determined and constant by "movement speed = processing pitch (distance interval between shots) x laser oscillation frequency."

[0036] In the case of a pair of galvanometers, when the orbit is circular, each galvanometer reciprocates with a sine wave. Hereinafter, the galvanometer channels are assumed to be the X-axis and Y-axis in Figure 4.

[0037] In the example shown in FIG. 4, the X-axis direction motion 31 and the Y-axis direction motion 32 are reciprocating motions in the form of sine waves.

[0038] Therefore, if the radius of the circular orbit is small, even if a target position for reciprocating movement is specified, the tool may turn back before reaching the target position, making it impossible to machine a circle of the specified radius.

[0039] On the other hand, if the radius of the circular orbit is large, there is sufficient responsiveness, so it is possible to reach the target position and then turn back.

[0040] [Comparative Example] Fig. 5 is a diagram showing a comparative example. In the comparative example, the target trajectory 15, the starting point 10, and the ending point 14 are the same as those in Fig. 3. On the other hand, the hardware configuration of the laser processing device 100 is the same.

[0041] If there is a response delay in the galvano scan, even if a command is given to operate the target trajectory 15, the trajectory may become like the comparative example trajectory 40 in the case of an arc with a minimum radius of curvature 16 or the like.

[0042] As shown in the figure, the comparative example trajectory 40 may deviate from the target trajectory 15, resulting in poor processing quality in the laser routing process.

[0043] Although an example of a minute arc is shown here, deviation from the target trajectory may occur even in a rectangular trajectory such as the corner of a rectangle due to the limited response of the Galvano 100H6. Even in such cases, the present invention allows machining to be performed according to the target trajectory.

[0044] With the above configuration, for example, when an arc trajectory having a radius of curvature equal to or less than a threshold is included as shown in Figure 3, the area including the arc trajectory having a radius of curvature equal to or less than the threshold is machined using the AOD, and the movement of the area to be machined is performed using the galvanometer. When an area including an arc trajectory having a radius of curvature equal to or less than the threshold, which is prone to response delays in the galvanometer scan, is machined using the AOD, the effect of response delays in the galvanometer scan is reduced, allowing for accurate machining.

[0045] Therefore, with the above configuration, the processing quality of the routing process using a laser can be further improved.

[0046] [Other embodiments] The above processes and data used in the processes executed in this embodiment may be executed and stored by an information processing system. For example, the information processing system may execute or store data on multiple information processing devices to achieve redundant, distributed, parallel, or a combination of these processes. Therefore, the present invention may be realized in devices with hardware configurations other than those described above and in systems other than those described above.

[0047] The above control method may be realized by a program that causes a computer to execute the overall processing and the like.

[0048] Furthermore, the program according to the present invention is not limited to a single program, but may be a collection of multiple programs. Furthermore, the program according to the present invention is not limited to being executed by a single device, but may be executed by multiple information processing devices in a shared manner. Furthermore, the allocation of roles among the information processing devices is not limited to the above-mentioned example. In other words, some or all of the above-mentioned processes may be executed by information processing devices different from the above-mentioned information processing device.

[0049] Some or all of the means implemented by the program can be implemented in hardware such as an integrated circuit. Furthermore, the program may be provided in a form recorded on a non-transitory recording medium readable by a computer. Examples of recording media include a hard disk, an SD card (registered trademark), an optical disk such as a DVD, or a server on the Internet. Therefore, the program may be distributed via a telecommunications line such as the Internet.

[0050] The present invention is not limited to the above-described exemplary embodiments. Therefore, the present invention allows for the addition or modification of components within the scope of the technical gist. Therefore, all technical matters included in the technical concept described in the claims are subject to the present invention. The above-described exemplary embodiments are preferred specific examples. Furthermore, a person skilled in the art can realize various modifications from the disclosed content, and such modifications are included in the technical scope described in the claims.

Claims

1. A laser processing device for processing with a laser, an input unit for inputting a trajectory to be processed by the laser; a determination unit that determines whether the trajectory includes an arc trajectory having a curvature radius equal to or less than a threshold; a trajectory calculation unit that calculates the trajectory based on the galvanometer and the AOD based on the determination result by the determination unit; a processing unit that processes the track based on the determination result by the determination unit; A laser processing device comprising:

2. The laser The electronic circuit board is processed as the target object, The trajectory calculation unit If it is determined that the orbit is not an arc orbit having a radius of curvature equal to or less than the threshold, the orbit is calculated based on the galvanometer; The processing unit is If it is determined that the orbit is an arcuate orbit having a radius of curvature equal to or less than the threshold value, An area including the arcuate orbit that is equal to or smaller than the threshold value is processed by the AOD, and the area is moved based on the galvanometer. The laser processing device according to claim 1 .

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