Vapor chamber, electronic apparatus and method of manufacturing vapor chamber

Abstract

To provide a vapor chamber that can be improved in performance even when bent, an electronic apparatus and a method of manufacturing the vapor chamber.SOLUTION: A main body sheet of a vapor chamber includes a plurality of first land parts. A first sheet outer surface 10a of a first sheet 10 includes a first joint region 13 overlapping with the first land part and a first space region 14 overlapping a space part. The vapor chamber includes a bent region 7 which is bent along a bent line extending in a direction crossing the vapor chamber in a first direction in plan view. A maximum dimension of the first sheet in a thickness direction as a maximum dimension demarcated between the first joint region and the first space region is defined as a first maximum dimension. When viewed along a direction parallel with the bent line, a first maximum dimension d2 in the bent region is larger than a first maximum dimension in a region other than the bent region.SELECTED DRAWING: Figure 13

Description

[Technical Field]

[0001] The present disclosure relates to a vapor chamber, an electronic device, and a method for manufacturing a vapor chamber. [Background technology]

[0002] Electronic devices such as mobile terminals use heat-generating electronic devices. Examples of such electronic devices include central processing units (CPUs), light-emitting diodes (LEDs), and power semiconductors. Examples of mobile terminals include handheld terminals and tablet terminals.

[0003] Such electronic devices are cooled by heat dissipation devices such as heat pipes (see, for example, Patent Documents 1 and 2). In recent years, thinner heat dissipation devices have been required in order to make electronic devices thinner. Vapor chambers, which can be made thinner than heat pipes, have been developed as heat dissipation devices. Vapor chambers efficiently cool electronic devices by absorbing the heat of the electronic device through the enclosed working fluid and diffusing it inside.

[0004] More specifically, the working fluid in the vapor chamber receives heat from the electronic device at a portion (evaporator) close to the electronic device. The heated working fluid evaporates and becomes working vapor. The working vapor diffuses away from the evaporator within a vapor flow path formed in the vapor chamber. The diffused working vapor cools and condenses to become working fluid. A liquid flow path with a capillary structure (wick) is provided within the vapor chamber. The working fluid flows through the liquid flow path and is transported toward the evaporator. The working fluid transported to the evaporator then receives heat again in the evaporator and evaporates. In this way, the working fluid circulates within the vapor chamber while repeatedly changing phases, i.e., evaporating and condensing, and dissipates heat from the electronic device. As a result, the heat dissipation efficiency of the vapor chamber is improved.

[0005] However, depending on the internal structure of the electronic device in which the vapor chamber is installed, it may be bent. In this case, the vapor flow path is bent, and the working fluid may accumulate in the bent part of the vapor flow path portion. This may impede the flow of working vapor within the vapor flow path portion. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] International Publication No. 2018 / 221369 [Patent Document 2] Japanese Patent Application Publication No. 2018-204841 Summary of the Invention [Problem to be solved by the invention]

[0007] The present disclosure aims to provide a vapor chamber, an electronic device, and a method for manufacturing a vapor chamber that can improve performance even when bent. [Means for solving the problem]

[0008] A first aspect of the present disclosure is A vapor chamber containing a working fluid, a main body sheet including a first main body surface and a second main body surface located on the opposite side to the first main body surface; a first sheet located on the first main body surface of the main body sheet; a space provided in the main body sheet, the space being covered by the first sheet; the main body sheet includes a plurality of first land portions located in the space portion, extending in a first direction, and spaced apart in a second direction perpendicular to the first direction; the first sheet includes a first sheet outer surface located on the opposite side to the main body sheet, the first sheet outer surface includes a first bonding region overlapping the first land portion and a first spatial region overlapping the spatial portion, the vapor chamber includes a bending region bent along a bending line extending in a direction intersecting the first direction in a plan view of the vapor chamber, When the maximum dimension defined between the first bonding region and the first spatial region, which is the maximum dimension in the thickness direction of the first sheet, is defined as a first maximum dimension, When viewed along a direction parallel to the bend line, the first maximum dimension in the bend region is greater than the first maximum dimension in other regions other than the bend region, forming a vapor chamber.

[0009] A second aspect of the present disclosure is a vapor chamber according to the first aspect, The first spatial region may be formed in a concave shape.

[0010] A third aspect of the present disclosure is a vapor chamber according to the first aspect, The first spatial region in the bending region is formed in a concave shape, The first spatial region in the region other than the bent region may be formed flat in a direction along the bent line.

[0011] A fourth aspect of the present disclosure is a vapor chamber according to the first aspect, A part of the first spatial region in the bending region may be formed in a concave shape, and another part may be formed in a flat shape in a direction along the bending line.

[0012] A fifth aspect of the present disclosure is a vapor chamber according to the first aspect, The first sheet may include a plurality of first sheet recesses that overlap the first spatial region in a plan view and that enter the spatial region.

[0013] A sixth aspect of the present disclosure is a vapor chamber according to any one of the first to fifth aspects described above, In the bent region, the vapor chamber may be bent along a bend line extending in the second direction.

[0014] A seventh aspect of the present disclosure is a vapor chamber according to each of the first to fifth aspects described above, In the bending region, the vapor chamber may be bent along a bending line inclined toward the first direction.

[0015] An eighth aspect of the present disclosure is a vapor chamber according to each of the first to seventh aspects described above, In the bending region, the first sheet may be located more outward than the main body sheet.

[0016] A ninth aspect of the present disclosure is a vapor chamber according to each of the first to seventh aspects described above, In the bending region, the first sheet may be located more inward than the main body sheet.

[0017] A tenth aspect of the present disclosure is a vapor chamber according to each of the first to ninth aspects described above, a second sheet positioned on the second main body surface of the main body sheet; the space portion extends from the first main body surface to the second main body surface and is covered by the second sheet at the second main body surface; the second sheet includes a second sheet outer surface located on the opposite side to the main body sheet, the second sheet includes a second bonding region overlapping the first land portion and a second spatial region overlapping the spatial portion, When the maximum dimension defined between the second bonding region and the second spatial region, which is the maximum dimension in the thickness direction of the second sheet, is defined as a second maximum dimension, When viewed along a direction parallel to the bend line, the second maximum dimension in the bend region may be greater than the second maximum dimension in other regions other than the bend region.

[0018] An eleventh aspect of the present disclosure is a vapor chamber according to each of the first to tenth aspects described above, the main body sheet includes a plurality of second land portions extending in the second direction, the second land portion is located in a region other than the bending region, the first land portion is located in the bending region, The first land portion may be connected to the second land portion.

[0019] A twelfth aspect of the present disclosure is Housing and an electronic device contained within the housing; and a vapor chamber according to any one of the first to eleventh aspects, which is in thermal contact with the electronic device.

[0020] A thirteenth aspect of the present disclosure is A method for manufacturing a vapor chamber in which a working fluid is sealed, comprising: a preparation step of preparing a main body sheet including a first main body surface and a second main body surface located on the opposite side to the first main body surface, and a first sheet; a joining step of placing the first sheet on the first main body surface of the main body sheet and joining the first sheet and the main body sheet together, whereby a space portion covered by the first sheet is formed in the main body sheet; a bending step of bending the main body sheet and the first sheet to form a bent region in which the main body sheet and the first sheet are bent, the main body sheet includes a plurality of first land portions located in the space portion, extending in a first direction, and spaced apart in a second direction perpendicular to the first direction; the first sheet includes a first sheet outer surface located on the opposite side to the main body sheet, the first sheet outer surface includes a first bonding region overlapping the first land portion and a first spatial region overlapping the spatial portion, In the bending region, the vapor chamber is bent along a bending line extending in a direction intersecting the first direction in a plan view, When the maximum dimension defined between the first bonding region and the first spatial region, which is the maximum dimension in the thickness direction of the first sheet, is defined as a first maximum dimension, A method for manufacturing a vapor chamber, wherein when viewed along a direction parallel to the bending line, the first maximum dimension in the bending region is larger than the first maximum dimension in other regions other than the bending region.

[0021] A fourteenth aspect of the present disclosure is A vapor chamber containing a working fluid, a plurality of vapor passages extending along a first direction through which the working fluid gas passes; a liquid flow path portion that communicates with the vapor path and through which the liquid of the working fluid passes, A vapor chamber is bent along a direction parallel to the first direction.

[0022] A fifteenth aspect of the present disclosure is a vapor chamber according to the fourteenth aspect, The steam passage may be bent at the location.

[0023] A sixteenth aspect of the present disclosure is a vapor chamber according to the fourteenth aspect, the liquid flow path portion is disposed between the vapor paths and extends along the first direction; The liquid flow path may be bent at a position where the liquid flow path portion is disposed.

[0024] A seventeenth aspect of the present disclosure is a vapor chamber according to the fourteenth aspect, a reinforcing portion where the steam passage and the liquid flow path portion are not arranged, The reinforcing portion may be bent at the position where the reinforcing portion is disposed.

[0025] An eighteenth aspect of the present disclosure is a vapor chamber according to the fourteenth aspect, a space portion in which the vapor passage and the liquid flow passage portion are not disposed, The space may be bent at the position where the space is disposed.

[0026] A nineteenth aspect of the present disclosure is A vapor chamber containing a working fluid, a main body sheet including a first main body surface and a second main body surface located on the opposite side to the first main body surface; a first sheet located on the first main body surface of the main body sheet; a second sheet located on the second main body surface of the main body sheet; a plurality of vapor passages extending along a first direction through which the working fluid gas passes; a liquid flow path portion that communicates with the vapor path and through which the liquid of the working fluid passes, the vapor chamber includes a curved region curved along a curved line parallel to the first direction, and a first region and a second region separated by the curved region; A vapor chamber is formed in the bending region, in the first body surface or the second body surface, with a body surface recess.

[0027] A twentieth aspect of the present disclosure is a vapor chamber according to the nineteenth aspect, The body surface recesses are vapor chambers, a plurality of which are arranged along the bending line.

[0028] A twenty-first aspect of the present disclosure is a vapor chamber according to each of the nineteenth aspect and the twentieth aspect, the main body sheet includes a reinforcing portion where the steam passage and the liquid flow passage portion are not arranged, The main body surface recess may be formed in the first main body surface or the second main body surface of the reinforcing portion.

[0029] A twenty-second aspect of the present disclosure is a vapor chamber according to each of the nineteenth aspect and the twentieth aspect, the main body sheet includes a land portion located between two adjacent steam passages and extending along the first direction, the land portion including the liquid flow path portion; The main body surface recess may be formed at a position on the land portion where the liquid flow path portion is not provided.

[0030] A twenty-third aspect of the present disclosure is Housing and a device contained within the housing; and and a vapor chamber according to any one of the fourteenth to twenty-second aspects, in thermal contact with the device.

[0031] A twenty-fourth aspect of the present disclosure is an electronic device according to the twenty-third aspect, a plurality of said devices; the plurality of devices includes a first device and a second device; The vapor chamber is divided into a first region and a second region via a bent portion, the first device is in thermal contact with the first region of the vapor chamber; The second device may be in thermal contact with the second region of the vapor chamber.

[0032] A twenty-fifth aspect of the present disclosure is an electronic device according to the twenty-third aspect, The vapor chamber is divided into a first region and a second region via a bent portion, The device may be in thermal contact with the first region of the vapor chamber.

[0033] A twenty-sixth aspect of the present disclosure is a first sheet preparation step of preparing a first sheet; a main body sheet preparation step of preparing a main body sheet including a plurality of vapor passages extending along a first direction and through which a gas of the working fluid passes, and a liquid flow path portion communicating with the vapor passages and through which a liquid of the working fluid passes; a joining step of stacking and joining the first sheet and the main body sheet; The method for manufacturing a vapor chamber includes, after the joining step, a bending step of bending the first sheet and the main body sheet along a direction parallel to the first direction. [Effects of the Invention]

[0034] The present disclosure provides improved performance even when bent. [Brief explanation of the drawings]

[0035] [Figure 1] FIG. 1 is a schematic perspective view illustrating an electronic device according to a first embodiment. [Figure 2] FIG. 2 is a schematic diagram showing an example of a vapor chamber according to the first embodiment, which is mounted on the electronic device shown in FIG. [Figure 3] FIG. 3 is a schematic diagram showing another example of the vapor chamber according to the first embodiment, which is mounted on the electronic device shown in FIG. [Figure 4] FIG. 4 is an external perspective view showing the vapor chamber according to the first embodiment. [Figure 5] FIG. 5 is a plan view of the vapor chamber shown in FIG. 2 before bending. [Figure 6] FIG. 6 is a cross-sectional view taken along line AA in FIG. [Figure 7] FIG. 7 is a plan view showing the inner surface of the first sheet shown in FIG. [Figure 8] FIG. 8 is a plan view showing the inner surface of the second sheet shown in FIG. [Figure 9] 9 is a plan view showing the first main body surface of the wick sheet shown in FIG. 6. FIG. [Figure 10] 10 is a plan view showing the second main body surface of the wick sheet shown in FIG. 6. FIG. [Figure 11] FIG. 11 is a partially enlarged cross-sectional view of FIG. 6, taken along line BB in FIG. 13, which will be described later. [Figure 12] FIG. 12 is a partial enlarged view of the liquid flow path portion shown in FIG. [Figure 13] FIG. 13 is a schematic diagram showing the outer surface of the sheet in the bending region of the vapor chamber shown in FIG. [Figure 14] FIG. 14 is a cross-sectional view taken along line CC in FIG. [Figure 15] FIG. 15 is a cross-sectional view showing a modified example of the vapor chamber according to the first embodiment, taken at an end in the width direction of the vapor chamber. [Figure 16] FIG. 16 is a cross-sectional view showing a modified example of the vapor chamber shown in FIG. [Figure 17] FIG. 17 is a cross-sectional view showing a modified example of the vapor chamber shown in FIG. [Figure 18] FIG. 18 is a cross-sectional view showing a modified example of the vapor chamber shown in FIG. [Figure 19] FIG. 19 is a cross-sectional view showing a modified example of the vapor chamber shown in FIG. [Figure 20] FIG. 20 is a cross-sectional view showing a modified example of the vapor chamber shown in FIG. [Figure 21] FIG. 21 is a cross-sectional view showing a modified example of the vapor chamber shown in FIG. [Figure 22] FIG. 22 is a cross-sectional view showing a modified example of the vapor chamber shown in FIG. [Figure 23] FIG. 23 is a cross-sectional view showing a modified example of the vapor chamber shown in FIG. [Figure 24] FIG. 24 is a plan view showing a modified example of the vapor chamber according to the first embodiment, and is an enlarged plan view showing the liquid flow path portion. [Figure 25] 25 is a cross-sectional view of the first and second regions of the vapor chamber shown in FIG. [Figure 26] FIG. 25 is a cross-sectional view of the vapor chamber shown in FIG. 24 at a bending region. [Figure 27] FIG. 27 is a plan view showing a modified example of the vapor chamber according to the first embodiment, and is an enlarged plan view showing the second main body surface of the land portion. [Figure 28] FIG. 28 is a plan view showing another example of FIG. [Figure 29] FIG. 29 is a cross-sectional view showing a modified example of the vapor chamber shown in FIG. [Figure 30] FIG. 30 is an external perspective view showing a vapor chamber according to the second embodiment. [Figure 31] FIG. 31 is a plan view showing the vapor passage in which the curved region in the vapor chamber shown in FIG. 30 is developed into a plane. [Figure 32] FIG. 32 is a schematic cross-sectional view showing the steam paths along lines DD, EE, and FF in FIG. [Figure 33] FIG. 33 is a plan view showing a modified example of the vapor chamber shown in FIG. 30 before bending. [Figure 34] FIG. 34 is a plan view showing the outer shape of the vapor chamber according to the third embodiment before bending. [Figure 35] FIG. 35 is a plan view showing a modified example of the vapor chamber shown in FIG. [Figure 36] FIG. 36 is a plan view showing another modified example of the vapor chamber shown in FIG. [Figure 37] FIG. 37 is a plan view showing another modified example of the vapor chamber shown in FIG. [Figure 38] FIG. 38 is a perspective view showing a curved vapor chamber according to the fourth embodiment. [Figure 39] FIG. 39 is a cross-sectional view taken along line AA-AA in FIG. [Figure 40] FIG. 40 is a diagram for explaining the vapor chamber of FIG. 38, and is a plan view showing the vapor chamber in an unbent state. [Figure 41] FIG. 41 is a cross-sectional view taken along line BB-BB in FIG. [Figure 42] 42 is a plan view showing the inner surface of the first sheet of FIG. [Figure 43] 43 is a plan view showing the inner surface of the second sheet of FIG. 41. FIG. [Figure 44]44 is a plan view showing the second main body surface of the main body sheet of FIG. [Figure 45] FIG. 45 is a partially enlarged cross-sectional view of FIG. [Figure 46] FIG. 46 is a partial enlarged view of the liquid flow path portion shown in FIG. [Figure 47] FIG. 47 is a diagram for explaining a material sheet preparing step in the manufacturing method of the vapor chamber according to the fourth embodiment. [Figure 48] FIG. 48 is a view for explaining an etching step in the method for manufacturing a vapor chamber according to the fourth embodiment. [Figure 49] FIG. 49 is a view for explaining a bonding step in the manufacturing method of the vapor chamber according to the fourth embodiment. [Figure 50] FIG. 50 is a view for explaining a bending step in the manufacturing method of the vapor chamber according to the fourth embodiment. [Figure 51] FIG. 51 is a cross-sectional view showing a modified example of the vapor chamber shown in FIG. 45, and is an enlarged cross-sectional view showing the liquid flow path portion. [Figure 52] FIG. 52 is a cross-sectional view showing a modified example of the vapor chamber shown in FIG. 45, and is an enlarged cross-sectional view showing the liquid flow path portion. [Figure 53] FIG. 53 is a cross-sectional view showing a modified example of the vapor chamber shown in FIG. [Figure 54] FIG. 54 is a cross-sectional view showing a modified example of the vapor chamber shown in FIG. [Figure 55] FIG. 55 is a cross-sectional view showing a modified example of the vapor chamber shown in FIG. [Figure 56] FIG. 56 is a cross-sectional view showing a modified example of the vapor chamber shown in FIG. [Figure 57] FIG. 57 is a plan view showing a modified example of the vapor chamber shown in FIG. [Figure 58] FIG. 58 is a cross-sectional view showing a modified example of the vapor chamber shown in FIG. 57, and is an enlarged cross-sectional view showing the liquid flow path portion. [Figure 59] FIG. 59 is a cross-sectional view showing a modified example of the vapor chamber shown in FIG. 57, and is an enlarged cross-sectional view showing the liquid flow path portion. [Figure 60] FIG. 60 is a cross-sectional view showing a modified example of the vapor chamber shown in FIG. 57, and is an enlarged cross-sectional view showing the liquid flow path portion. [Figure 61] FIG. 61 is a plan view showing a modified example of the vapor chamber shown in FIG. 57, and is an enlarged plan view showing the liquid flow path portion. [Figure 62] FIG. 62 is a cross-sectional view showing a modified example of the vapor chamber shown in FIG. 57, and is an enlarged cross-sectional view showing the liquid flow path portion. [Figure 63] FIG. 63 is a plan view showing a modified example of the vapor chamber shown in FIG. [Figure 64] FIG. 64 is a plan view showing a modified example of the vapor chamber shown in FIG. [Figure 65] FIG. 65 is a plan view showing a modified example of the vapor chamber shown in FIG. [Figure 66] FIG. 66 is a plan view showing a modified example of the vapor chamber shown in FIG. [Figure 67] FIG. 67 is a plan view showing a modified example of the vapor chamber shown in FIG. 65, and is an enlarged plan view showing the reinforcing portion. [Figure 68] FIG. 68 is a plan view showing another example of FIG. [Figure 69] FIG. 69 is a plan view showing a modified example of the vapor chamber shown in FIG. [Figure 70] FIG. 70 is an enlarged plan view showing a modification of the vapor chamber shown in FIG. 65, and is an enlarged plan view showing the first main body surface of the land portion. [Figure 71] FIG. 71 is a plan view showing a modified example of the vapor chamber shown in FIG. [Figure 72] FIG. 72 is a plan view showing a modified example of the vapor chamber shown in FIG. [Figure 73] FIG. 73 is a plan view showing a modified example of the vapor chamber shown in FIG. [Figure 74] FIG. 74 is a plan view showing a modified example of the vapor chamber shown in FIG. [Figure 75] FIG. 75 is a plan view showing a modified example of the vapor chamber shown in FIG. [Figure 76] FIG. 76 is a cross-sectional view showing a modified example of the vapor chamber shown in FIG. [Figure 77] FIG. 77 is a cross-sectional view of the vapor chamber shown in FIG. 76 at a bent portion. [Figure 78] FIG. 78 is a cross-sectional view showing a modified example of the vapor chamber shown in FIG. [Figure 79] FIG. 79 is a cross-sectional view showing a modified example of the vapor chamber shown in FIG. [Figure 80] FIG. 80 is a cross-sectional view showing another example of FIG. DETAILED DESCRIPTION OF THE INVENTION

[0036] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. Note that in the drawings attached to this specification, the scale and aspect ratios have been appropriately changed and exaggerated from those of the actual objects for the sake of convenience in illustration and understanding. Furthermore, configurations shown in some drawings may be omitted in other drawings.

[0037] As used herein, geometric conditions, physical characteristics, terms specifying the extent of geometric conditions or physical characteristics, and numerical values ​​indicating geometric conditions or physical characteristics may be interpreted without being bound by strict meaning. These geometric conditions, physical characteristics, terms, and numerical values ​​may also be interpreted to include the range within which similar functionality can be expected. Examples of terms specifying geometric conditions include "length," "angle," "shape," and "arrangement." Examples of terms specifying geometric conditions include "parallel," "orthogonal," and "identical." Furthermore, for clarity of the drawings, the shapes of multiple parts that can be expected to have similar functionality are depicted in a regular pattern. However, without being bound by strict meaning, the shapes of the parts may differ from each other as long as the functionality can be expected. In the drawings, for convenience, boundary lines indicating the joining surfaces of components are shown as simple straight lines. However, they are not required to be strictly straight lines, and the shape of the boundary line is arbitrary as long as the desired joining performance can be expected.

[0038] (First embodiment) 1 to 29, a vapor chamber, an electronic device, and a method for manufacturing a vapor chamber according to a first embodiment of the present disclosure will be described. The vapor chamber 1 according to this embodiment is accommodated in a housing H of the electronic device E together with an electronic device D that generates heat, and is a device for cooling the electronic device D. Examples of the electronic device E include mobile devices such as portable terminals and tablet terminals. Examples of the electronic device D include a central processing unit (CPU), a light-emitting diode (LED), and a power semiconductor. The electronic device D may also be referred to as a cooled device.

[0039] Here, an electronic device E equipped with a vapor chamber 1 according to this embodiment will be described first using a tablet terminal as an example. As shown in FIG. 1, the electronic device E may include a housing H, an electronic device D housed in the housing H, and a vapor chamber 1. In the electronic device E shown in FIG. 1, a touch panel display TD is provided on the front surface of the housing H. The vapor chamber 1 is housed in the housing H and is arranged so as to be in thermal contact with the electronic device D. The vapor chamber 1 receives heat generated by the electronic device D when the electronic device E is in use. The heat received by the vapor chamber 1 is released to the outside of the vapor chamber 1 via working fluids 2a and 2b, which will be described later, thereby effectively cooling the electronic device D. When the electronic device E is a tablet terminal, the electronic device D corresponds to a central processing unit or the like.

[0040] Next, the vapor chamber 1 according to this embodiment will be described. The vapor chamber 1 according to this embodiment is bent as shown in FIGS. 2 and 3. The vapor chamber 1 is bent according to the internal structure of the electronic device E. The vapor chamber 1 may be bent depending on the positional relationship between the electronic device E that generates heat and the housing member Ha that dissipates the heat. The housing member Ha is a member that constitutes the housing H.

[0041] As an example, an electronic device D and a housing member Ha are arranged as shown in FIG. 2. In this case, the vapor chamber 1 is bent at a right angle so as to contact the electronic device D and the housing member Ha. The electronic device D is mounted on a substrate S. As another example, an electronic device D and a housing member Ha are arranged as shown in FIG. 3. In this case, the vapor chamber 1 is bent 180° so as to contact the electronic device D and the housing member Ha. Although FIGS. 2 and 3 show an example of a vapor chamber 1 bent at one bend line 8 (see FIGS. 4 and 5), this is not limiting. The vapor chamber 1 may be bent at different positions at two or more bend lines 8.

[0042] In this embodiment, as shown in FIG. 4, a vapor chamber 1 bent at a right angle at a single bending line 8 will be described as an example. The vapor chamber 1 shown in FIG. 4 is divided into a first region 5, a second region 6, and a bending region 7 located between the first region 5 and the second region 6. The vapor chamber 1 is bent at a right angle in the bending region 7. The first region 5 and the second region 6 are formed substantially flat. An electronic device D may be in contact with the first region 5, and a housing member Ha (see FIG. 2) may be in contact with the second region 6.

[0043] 5 to 11, which show the vapor chamber 1 before bending, the configuration of the vapor chamber 1 will be described. The vapor chamber 1 shown in FIG. 4 is obtained by bending the flat vapor chamber 1 shown in FIG.

[0044] 5 and 6, the vapor chamber 1 has a sealed space 3 in which working fluids 2a and 2b are sealed. The working fluids 2a and 2b in the sealed space 3 repeatedly undergo phase changes, thereby cooling the electronic device D. Examples of the working fluids 2a and 2b include pure water, ethanol, methanol, acetone, and mixtures thereof.

[0045] As shown in FIGS. 5 and 6, the vapor chamber 1 includes a first sheet 10, a second sheet 20, a wick sheet 30, a vapor flow path section 50, and a first liquid flow path section 60. The second sheet 20 is provided on the opposite side of the wick sheet 30 from the first sheet 10. The wick sheet 30 is an example of a main body sheet and is interposed between the first sheet 10 and the second sheet 20. In the vapor chamber 1 according to this embodiment, the first sheet 10, the wick sheet 30, and the second sheet 20 are stacked in this order. Note that, although an example in which one wick sheet 30 is stacked will be described here, two or more wick sheets 30 may be stacked.

[0046] The vapor chamber 1 shown in FIG. 5 is generally formed in the shape of a thin flat plate. The planar shape of the vapor chamber 1 before bending is arbitrary, and may be a rectangular shape as shown in FIG. 5. The planar shape of the vapor chamber 1 may be, for example, a rectangle with one side 1 cm and the other 3 cm, or a square with one side 15 cm. The planar dimensions of the vapor chamber 1 before bending are arbitrary. In this embodiment, an example will be described in which the planar shape of the vapor chamber 1 before bending is a rectangle with the X direction (described later) as the longitudinal direction. In this case, as shown in FIGS. 7 to 10, the first sheet 10, the second sheet 20, and the wick sheet 30 may have the same planar shape as the vapor chamber 1. The planar shape of the vapor chamber 1 before bending is not limited to a rectangular shape and may be any shape, such as a circular shape, an elliptical shape, an L-shape, or a T-shape.

[0047] 4 and 5, the vapor chamber 1 has an evaporation region SR where the working fluid 2b evaporates and a condensation region CR where the working vapor 2a condenses. The working vapor 2a is a working fluid in a gaseous state, and the working fluid 2b is a working fluid in a liquid state.

[0048] The evaporation region SR is a region that overlaps with the electronic device D in a planar view and is a region that comes into contact with the electronic device D. The evaporation region SR is located within the first region 5, but the position of the evaporation region SR is arbitrary. In this embodiment, the evaporation region SR is formed on one side in the X direction of the vapor chamber 1 (the left side in FIG. 5). Heat from the electronic device D is transferred to the evaporation region SR, and this heat evaporates the working fluid 2b, generating working vapor 2a. The heat from the electronic device D can be transferred not only to the region that overlaps with the electronic device D in a planar view, but also to the periphery of the region where the electronic device D overlaps. Therefore, the evaporation region SR may include the region that overlaps with the electronic device D and the periphery thereof in a planar view.

[0049] The condensation region CR is a region that does not overlap with the electronic device D in a plan view, and is a region where the working vapor 2a mainly releases heat and condenses. The condensation region CR may be located within the second region 6. The condensation region CR may also be a region surrounding the evaporation region SR including the second region 6. Heat is released from the working vapor 2a in the condensation region CR. The working vapor 2a is cooled and condensed, and a working liquid 2b is produced.

[0050] Here, the plan view refers to the state of the vapor chamber 1 as viewed from a direction perpendicular to the surface that receives heat from the electronic device D and the surface that releases the received heat. The heat-receiving surface corresponds to the second sheet outer surface 20b of the second sheet 20, which will be described later. The heat-releasing surface corresponds to the first sheet outer surface 10a of the first sheet 10, which will be described later. For example, as shown in FIG. 4, in the first region 5 of the bent vapor chamber 1, the state viewed from the direction indicated by arrow V1 corresponds to the plan view. In the second region 6, the state viewed from the direction indicated by arrow V2 corresponds to the plan view. As shown in FIG. 5, in the vapor chamber 1 before bending, the state viewed from above or below corresponds to the plan view.

[0051] As shown in FIG. 6, the first sheet 10 includes a first sheet outer surface 10a located on the opposite side to the wick sheet 30, and a first sheet inner surface 10b facing the wick sheet 30. In the second region 6 described above, the first sheet outer surface 10a contacts the housing member Ha. The first sheet inner surface 10b contacts a first main body surface 30a of the wick sheet 30, which will be described later. As shown in FIGS. 6 and 7, the first sheet 10 may be formed in a substantially flat shape. The first sheet 10 may have a substantially constant thickness.

[0052] As shown in Fig. 7, alignment holes 12 may be formed in the four corners of the first sheet 10. Fig. 7 shows an example in which the planar shape of the alignment holes 12 is circular, but this is not limiting. The alignment holes 12 may also penetrate the first sheet 10.

[0053] As shown in FIG. 6, the second sheet 20 includes a second sheet inner surface 20a facing the wick sheet 30 and a second sheet outer surface 20b located on the opposite side from the wick sheet 30. In the first region 5 described above, the electronic device D contacts the second sheet outer surface 20b. A second main body surface 30b of the wick sheet 30, which will be described later, contacts the second sheet inner surface 20a. As shown in FIGS. 6 and 8, the second sheet 20 may be formed in a substantially flat shape. The second sheet 20 may have a substantially constant thickness.

[0054] As shown in Fig. 8, alignment holes 22 may be formed in the four corners of the second sheet 20. Fig. 8 shows an example in which the planar shape of the alignment holes 22 is circular, but this is not limiting. The alignment holes 22 may also penetrate the second sheet 20.

[0055] 5, the wick sheet 30 has a first main body surface 30a and a second main body surface 30b located on the opposite side to the first main body surface 30a. The first sheet inner surface 10b of the first sheet 10 contacts the first main body surface 30a. The second sheet inner surface 20a of the second sheet 20 contacts the second main body surface 30b.

[0056] The first sheet inner surface 10b of the first sheet 10 and the first main body surface 30a of the wick sheet 30 may be diffusion bonded. The first sheet inner surface 10b and the first main body surface 30a may be permanently bonded to each other.

[0057] Similarly, the second sheet inner surface 20a of the second sheet 20 and the second main body surface 30b of the wick sheet 30 may be diffusion bonded. The second sheet inner surface 20a and the second main body surface 30b may be permanently bonded to each other.

[0058] The term "permanently joined" is not limited to a strict meaning, but is used to mean that the joining is sufficient to maintain the sealing of the sealed space 3 when the vapor chamber 1 is in operation.

[0059] As shown in FIGS. 5, 9, and 10, the wick sheet 30 according to this embodiment includes a frame body 32 and a plurality of first lands 33. The frame body 32 defines a steam flow path 50 and is formed in a rectangular frame shape along the X and Y directions in a plan view. The first lands 33 are located within the steam flow path 50 and are located inside the frame body 32 in a plan view. The frame body 32 and the first lands 33 are portions of the wick sheet 30 that are not etched in the etching process described below, and the material of the wick sheet 30 remains. A first steam passage 51, described below, through which the working steam 2a flows, is formed between the frame body 32 and adjacent first lands 33. A second steam passage 52, described below, through which the working steam 2a flows, is formed between adjacent first lands 33.

[0060] In plan view, the first land portion 33 may extend in an elongated shape with the X direction as the longitudinal direction. The planar shape of the first land portion 33 may be an elongated rectangle. The X direction is an example of a first direction and corresponds to the left-right direction in FIGS. 9 and 10. The first land portions 33 may be arranged at equal intervals in the Y direction. The Y direction is an example of a second direction and is a direction perpendicular to the X direction in plan view. The Y direction corresponds to the up-down direction in FIGS. 9 and 10. The first land portions 33 may be positioned parallel to each other. The direction perpendicular to the X direction and the Y direction is defined as the Z direction. The Z direction corresponds to the up-down direction in FIGS. 6 and 11 and corresponds to the thickness direction.

[0061] 11, the width w1 of the first land portion 33 may be, for example, 100 μm to 1500 μm. Here, the width w1 of the first land portion 33 is the dimension of the first land portion 33 in the Y direction. The width w1 means the dimension of the wick sheet 30 in the Z direction at a position where a through portion 34, which will be described later, is present.

[0062] Here, the X direction in the first region 5 and the second region 6 of the vapor chamber 1 shown in FIG. 4 corresponds to the direction along the longitudinal direction of the first land portion 33. The X direction in the first region 5 corresponds to the up-and-down direction in FIG. 4. The Y direction in the first region 5 and the second region 6 of the vapor chamber 1 shown in FIG. 4 corresponds to the direction in which the first land portions 33 are arranged. The Z direction in the first region 5 and the second region 6 of the vapor chamber 1 shown in FIG. 4 corresponds to the direction perpendicular to the vapor chamber 1. The Z direction in the second region 6 corresponds to the up-and-down direction in FIG. 4.

[0063] The frame body 32 and each first land portion 33 are diffusion bonded to the first sheet 10 and also to the second sheet 20. This improves the mechanical strength of the vapor chamber 1. A wall surface 53a of the first vapor flow path recess 53 and a wall surface 54a of the second vapor flow path recess 54 (described later) form the side walls of the first land portion 33. The first main body surface 30a and the second main body surface 30b of the wick sheet 30 may be formed flat across the frame body 32 and each first land portion 33.

[0064] As shown in Figures 9 and 10, alignment holes 35 may be formed at the four corners of the wick sheet 30. Figures 9 and 10 show an example in which the planar shape of the alignment holes 35 is circular, but this is not limiting. The alignment holes 35 may also penetrate the wick sheet 30.

[0065] As shown in FIG. 6 , the vapor flow path portion 50 may be provided on the first main body surface 30a of the wick sheet 30. The vapor flow path portion 50 is an example of a space portion. The vapor flow path portion 50 may be a flow path through which the working vapor 2a mainly passes. The working liquid 2b may also pass through the vapor flow path portion 50. In this embodiment, the vapor flow path portion 50 may extend from the first main body surface 30a to the second main body surface 30b, or may penetrate the wick sheet 30. The vapor flow path portion 50 may be covered by the first sheet 10 on the first main body surface 30a, and may be covered by the second sheet 20 on the second main body surface 30b.

[0066] As shown in FIGS. 9 and 10 , the steam flow path section 50 according to this embodiment may include a first steam path 51 and a plurality of second steam paths 52. The first steam path 51 is formed between the frame body section 32 and the first land section 33. The first steam path 51 is an example of a peripheral space section. The first steam path 51 is formed inside the frame body section 32 and continuously outside the first land section 33. The planar shape of the first steam path 51 may be a rectangular frame shape along the X and Y directions. The second steam path 52 is formed between adjacent first lands 33. The planar shape of the second steam path 52 may be an elongated rectangular shape. The steam flow path section 50 is partitioned into the first steam path 51 and a plurality of second steam paths 52 by the plurality of first lands 33.

[0067] 6, the first vapor passage 51 and the second vapor passage 52 may extend from the first main body surface 30a to the second main body surface 30b of the wick sheet 30. The first vapor passage 51 and the second vapor passage 52 include a first vapor flow path recess 53 provided in the first main body surface 30a and a second vapor flow path recess 54 provided in the second main body surface 30b. The first vapor flow path recess 53 and the second vapor flow path recess 54 are in communication with each other.

[0068] The first vapor flow path recess 53 may be formed by etching from the first main body surface 30a of the wick sheet 30 in an etching step described below. The first vapor flow path recess 53 is formed in a concave shape on the first main body surface 30a. As shown in FIG. 11, the first vapor flow path recess 53 may have a curved wall surface 53a. FIG. 11 shows a cross section perpendicular to the X direction. The wall surface 53a defines the first vapor flow path recess 53 and may be curved so as to approach the opposing wall surface 53a as it approaches the second main body surface 30b. The first vapor flow path recess 53 constitutes a portion of the first vapor path 51 relatively close to the first sheet 10 and a portion of the second vapor path 52 relatively close to the first sheet 10.

[0069] The width w2 of the first steam flow path recess 53 may be, for example, 100 μm to 5000 μm. The width w2 of the first steam flow path recess 53 is the dimension in the Y direction, and is the dimension of the first steam flow path recess 53 on the first main body surface 30a. The width w2 corresponds to the dimension in the Y direction of the portion of the first steam path 51 extending in the X direction and the dimension in the Y direction of the second steam path 52. The width w2 also corresponds to the dimension in the X direction of the portion of the first steam path 51 extending in the Y direction.

[0070] The second vapor flow path recess 54 may be formed by etching from the second main body surface 30b of the wick sheet 30 in an etching step described below. The second vapor flow path recess 54 is formed in a concave shape on the second main body surface 30b. As shown in FIG. 11 , the second vapor flow path recess 54 may have a curved wall surface 54a. This wall surface 54a defines the second vapor flow path recess 54 and may be curved so as to approach the opposing wall surface 54a as it approaches the first main body surface 30a. The second vapor flow path recess 54 constitutes a portion of the first steam passage 51 relatively close to the second sheet 20 and a portion of the second steam passage 52 relatively close to the second sheet 20.

[0071] The width w3 of the second steam flow path recess 54 may be, for example, 100 μm to 5000 μm, similar to the width w2 of the first steam flow path recess 53 described above. The width w3 of the second steam flow path recess 54 is the dimension in the Y direction, and is the dimension of the second steam flow path recess 54 on the second main body surface 30b. The width w3 corresponds to the dimension in the Y direction of the portion of the first steam path 51 extending in the X direction and the dimension in the Y direction of the second steam path 52. The width w3 also corresponds to the dimension in the X direction of the portion of the first steam path 51 extending in the Y direction. The width w3 of the second steam flow path recess 54 may be equal to the width w2 of the first steam flow path recess 53, or may be different.

[0072] As shown in FIG. 11 , the wall surface 53a of the first steam flow path recess 53 and the wall surface 54a of the second steam flow path recess 54 may be connected to form the through-portion 34. In this embodiment, the planar shape of the through-portion 34 of the first steam path 51 may be a rectangular frame shape. The planar shape of the through-portion 34 of the second steam path 52 may be an elongated rectangular shape. The through-portion 34 may be defined by a ridge line formed by the joining of the wall surface 53a of the first steam flow path recess 53 and the wall surface 54a of the second steam flow path recess 54. As shown in FIG. 11 , the ridge line may be formed to protrude inward of the steam paths 51, 52. The planar area of ​​the first steam path 51 at the through-portion 34 may be minimized, and the planar area of ​​the second steam path 52 at the through-portion 34 may be minimized. The width w4 of the through-portion 34 of each steam path 51, 52 may be, for example, 400 μm to 5000 μm. Here, the width w4 of the through portion 34 corresponds to the gap between the first land portions 33 adjacent to each other in the Y direction.

[0073] The position of the through-hole 34 in the Z direction may be an intermediate position between the first main body surface 30a and the second main body surface 30b. Alternatively, the position of the through-hole 34 may be a position closer to the first sheet 10 than the intermediate position, or a position closer to the second sheet 20 than the intermediate position. The position of the through-hole 34 in the Z direction is arbitrary.

[0074] In the present embodiment, as described above, the cross-sectional shapes of the first steam passage 51 and the second steam passage 52 are formed to include the through-holes 34 defined by ridgelines formed to protrude inward, but this is not limited to this. For example, the cross-sectional shapes of the first steam passage 51 and the second steam passage 52 may be trapezoidal, parallelogram-shaped, or barrel-shaped.

[0075] The steam flow path section 50 including the first steam path 51 and the second steam path 52 configured in this manner constitutes a part of the above-mentioned sealed space 3. Each of the steam paths 51, 52 has a relatively large flow path cross-sectional area so that the working steam 2a can pass through.

[0076] 11, for clarity of the drawing, the first steam passage 51 and the second steam passage 52 are enlarged and shown. The number and positions of the steam passages 51, 52 are different from those in FIGS. 5, 9, and 10.

[0077] Although not shown, a plurality of support portions for supporting the first land portion 33 on the frame portion 32 may be provided within each of the vapor passages 51 and 52. Support portions for supporting adjacent first land portions 33 may also be provided. These support portions may be provided on both sides of the first land portion 33 in the X direction or on both sides of the first land portion 33 in the Y direction. The support portions are preferably formed so as not to impede the flow of the working vapor 2a diffusing through the vapor passage portion 50. For example, the support portions may be located near one of the first main body surface 30a and the second main body surface 30b of the wick sheet 30, and a space forming the vapor passage portion 50 may be formed near the other. This allows the thickness of the support portions to be thinner than the thickness of the wick sheet 30, preventing the first vapor passage 51 and the second vapor passage 52 from being separated in the X direction and the Y direction.

[0078] As shown in FIG. 5, the vapor chamber 1 may include an injection section 4 that injects the working fluid 2b into the sealed space 3. The injection section 4 includes an injection passage 36 that communicates with the first vapor passage 51. The injection section 4 may be located at any position. As shown in FIGS. 9 and 10, the injection passage 36 may be formed in a concave shape in the second main body surface 30b. Alternatively, the injection passage 36 may be formed in a concave shape in the first main body surface 30a. Depending on the configuration of the first liquid flow passage section 60, the injection passage 36 may be connected to the first liquid flow passage section 60.

[0079] As shown in FIGS. 6, 10, and 11, the first liquid flow path portion 60 may be formed between the first sheet 10 and the wick sheet 30. In this embodiment, the first liquid flow path portion 60 is formed on the first main body surface 30a of the first land portion 33. The first liquid flow path portion 60 may be a flow path through which the working fluid 2b mainly passes. The working vapor 2a may also pass through the first liquid flow path portion 60. The first liquid flow path portion 60 constitutes a part of the sealed space 3 and is connected to the vapor flow path portion 50. The first liquid flow path portion 60 is configured as a capillary structure for transporting the working fluid 2b to the evaporation region SR. The first liquid flow path portion 60 may also be referred to as a wick. The first liquid flow path portion 60 may be formed over the entire first main body surface 30a of each first land portion 33. Although not shown in FIG. 9, the first liquid flow path portion 60 may be formed in an inner portion of the first main body surface 30a of the frame portion 32. In this embodiment, the first liquid flow path section 60 is not formed on the second main body surface 30b of the first land section 33 and the second main body surface 30b of the frame section 32.

[0080] 12, the first liquid flow path section 60 is an example of a first groove assembly including a plurality of grooves. More specifically, the first liquid flow path section 60 includes a plurality of mainstream grooves 61 and a plurality of communication grooves 65. The mainstream grooves 61 and the communication grooves 65 are grooves through which the working fluid 2b flows. The communication grooves 65 communicate with the mainstream grooves 61.

[0081] As shown in FIG. 12, each of the main grooves 61 extends in the X direction. The main grooves 61 have a small flow path cross-sectional area so that the working fluid 2b flows mainly by capillary action. The flow path cross-sectional area of ​​the main grooves 61 is smaller than the flow path cross-sectional area of ​​the vapor passages 51, 52. The main grooves 61 are configured to transport the working fluid 2b condensed from the working vapor 2a to the evaporation region SR. The main grooves 61 may be spaced apart at equal intervals along the Y direction perpendicular to the X direction. The main grooves 61 may be positioned parallel to each other.

[0082] The main grooves 61 are formed by etching from the first main body surface 30a of the wick sheet 30 in an etching process described below. As a result, the main grooves 61 may have curved wall surfaces 62, as shown in Fig. 11. The wall surfaces 62 define the main grooves 61 and may be curved in a shape that bulges toward the second main body surface 30b.

[0083] As shown in FIGS. 11 and 12, the width w5 of the mainstream groove 61 may be smaller than the width w2 of the first steam flow path recess 53. The width w5 of the mainstream groove 61 may be smaller than the width w1 of the first land portion 33. The width w5 of the mainstream groove 61 may be, for example, 5 μm to 400 μm. The width w5 refers to the dimension of the mainstream groove 61 in the first main body surface 30a. In FIGS. 11 and 12, the width w5 corresponds to the dimension of the mainstream groove 61 in the Y direction. The depth h1 of the mainstream groove 61 may be, for example, 3 μm to 300 μm. The depth h1 corresponds to the dimension of the mainstream groove 61 in the Z direction.

[0084] As shown in FIG. 12 , each communication groove 65 extends in a direction different from the X direction. In this embodiment, each communication groove 65 extends in the Y direction and is formed perpendicular to the mainstream grooves 61. Some communication grooves 65 connect adjacent mainstream grooves 61 to each other. Other communication grooves 65 connect the first steam passage 51 or the second steam passage 52 to the mainstream groove 61. That is, the communication groove 65 extends from the side edge 33 a of the first land portion 33 in the Y direction to the mainstream groove 61 adjacent to the side edge 33 a. In this way, the first steam passage 51 communicates with the mainstream groove 61, and the second steam passage 52 communicates with the mainstream groove 61.

[0085] The communication groove 65 has a small flow path cross-sectional area so that the working fluid 2b flows mainly by capillary action. The flow path cross-sectional area of ​​the communication groove 65 is smaller than the flow path cross-sectional area of ​​the vapor passages 51, 52. The communication grooves 65 are spaced apart at equal intervals along the X direction. The communication grooves 65 may be positioned parallel to each other.

[0086] Like the mainstream grooves 61, the communication grooves 65 are also formed by etching, which will be described later. Therefore, the communication grooves 65 may have wall surfaces (not shown) formed in a curved shape similar to the mainstream grooves 61. The width w6 of the communication grooves 65 may be smaller than the width w2 of the first steam flow path recess 53. The width w6 of the communication grooves 65 may be smaller than the width w1 of the first land portion 33. As shown in FIG. 12 , the width w6 of the communication grooves 65 may be equal to the width w5 of the mainstream grooves 61. However, the width w6 may be larger or smaller than the width w5. The width w6 refers to the dimension of the communication grooves 65 at the first body surface 30a. In FIG. 12 , the width w6 corresponds to the dimension of the communication grooves 65 in the X direction. The depth of the communication grooves 65 may be equal to the depth h1 of the mainstream grooves 61. However, the depth of the communication grooves 65 may be deeper or shallower than the depth h1.

[0087] As shown in FIG. 12, the first liquid flow path section 60 has a convex portion row 63. The convex portion row 63 is provided on the first main body surface 30a of the wick sheet 30. The convex portion row 63 is provided between adjacent main flow grooves 61. Each convex portion row 63 includes a plurality of convex portions 64 arranged in the X direction. The convex portions 64 abut against the first sheet 10. As shown in FIG. 12, each convex portion 64 is formed in a rectangular shape in plan view with the X direction as its longitudinal direction. A main flow groove 61 is interposed between adjacent convex portions 64 in the Y direction. A communication groove 65 is interposed between adjacent convex portions 64 in the X direction.

[0088] The protrusions 64 are portions that are not etched in the etching process described below, and the material of the wick sheet 30 remains. In this embodiment, the planar shape of the protrusions 64 is rectangular, as shown in Fig. 12. More specifically, the planar shape of the protrusions 64 corresponds to the planar shape at the position of the first main body surface 30a.

[0089] In this embodiment, the protrusions 64 are positioned in a staggered manner. More specifically, the protrusions 64 of the protrusion rows 63 adjacent to each other in the Y direction are positioned at positions offset from each other in the X direction. This offset may be half the arrangement pitch of the protrusions 64 in the X direction. The width w7 of the protrusions 64 may be, for example, 5 μm to 500 μm. The width w7 refers to the dimension of the protrusions 64 on the first main body surface 30a. In FIG. 12, the width w7 corresponds to the dimension of the protrusions 64 in the Y direction. Note that the positions of the protrusions 64 are not limited to a staggered arrangement, and they may be arranged in parallel. In this case, the protrusions 64 of the protrusion rows 63 adjacent to each other in the Y direction are positioned at the same position in the X direction.

[0090] The materials constituting the first sheet 10, the second sheet 20, and the wick sheet 30 are not particularly limited as long as they have sufficient thermal conductivity to ensure the heat dissipation efficiency of the vapor chamber 1. For example, each of the sheets 10, 20, and 30 may be made of a metal material. For example, each of the sheets 10, 20, and 30 may contain copper or a copper alloy. Copper and copper alloys have good thermal conductivity and corrosion resistance when pure water is used as the working fluid. Examples of copper include pure copper and oxygen-free copper (C1020). Examples of copper alloys include copper alloys containing tin, copper alloys containing titanium (C1990, etc.), and Corson copper alloys (C7025, etc.), which are copper alloys containing nickel, silicon, and magnesium. An example of a copper alloy containing tin is phosphor bronze (C5210, etc.).

[0091] The materials constituting the first sheet 10, the second sheet 20, and the wick sheet 30 are not particularly limited as long as they have good thermal conductivity. Each of the sheets 10, 20, and 30 may contain, for example, copper or a copper alloy. In this case, the thermal conductivity of each of the sheets 10, 20, and 30 can be increased, thereby improving the heat dissipation efficiency of the vapor chamber 1. Furthermore, when pure water is used as the working fluids 2a and 2b, corrosion can be prevented. However, other metal materials such as aluminum or titanium, or other metal alloy materials such as stainless steel, may also be used for these sheets 10, 20, and 30 as long as the desired heat dissipation efficiency and corrosion prevention can be achieved.

[0092] The thickness t1 of the vapor chamber 1 shown in FIG. 5 may be, for example, 100 μm to 500 μm. By making the thickness t1 of the vapor chamber 1 100 μm or more, the vapor channel portion 50 can be properly secured. This allows the vapor chamber 1 to function properly. On the other hand, by making the thickness t1 500 μm or less, the thickness t1 of the vapor chamber 1 can be prevented from becoming too thick. This allows the vapor chamber 1 to be made thin.

[0093] The thickness of the wick sheet 30 may be thicker than the thickness of the first sheet 10. Similarly, the thickness of the wick sheet 30 may be thicker than the thickness of the second sheet 20. In this embodiment, an example is shown in which the thickness of the first sheet 10 and the thickness of the second sheet 20 are equal. However, this is not limited to this, and the thickness of the first sheet 10 and the thickness of the second sheet 20 may be different.

[0094] The thickness t2 of the first sheet 10 may be, for example, 6 μm to 100 μm. By setting the thickness t2 of the first sheet 10 to 6 μm or more, the mechanical strength and long-term reliability of the first sheet 10 can be ensured. On the other hand, by setting the thickness t2 of the first sheet 10 to 100 μm or less, an increase in the thickness t1 of the vapor chamber 1 can be prevented. The thickness t3 of the second sheet 20 may be set to the same as the thickness t2 of the first sheet 10.

[0095] The thickness t4 of the wick sheet 30 may be, for example, 50 μm to 400 μm. By making the thickness t4 of the wick sheet 30 50 μm or more, the vapor flow path portion 50 can be properly secured. This allows the vapor chamber 1 to function properly. On the other hand, by making the thickness t4 400 μm or less, the thickness t1 of the vapor chamber 1 can be prevented from becoming too thick. This allows the vapor chamber 1 to be made thinner. The thickness t4 of the wick sheet 30 may also be the distance between the first main body surface 30a and the second main body surface 30b.

[0096] As described above, the vapor chamber 1 according to this embodiment is divided into the first region 5, the second region 6, and the curved region 7. In the curved region 7, the vapor chamber 1 is curved along a curved line 8 extending in a direction intersecting the X direction in a plan view. As shown in FIGS. 4 and 5 , the curved line 8 according to this embodiment extends in the Y direction in a plan view. The Y direction is perpendicular to the X direction in a plan view. The curved line 8 crosses the frame portion 32, the first land portion 33, the first steam passage 51, and the second steam passage 52. This prevents the first sheet 10 from deforming into the steam passages 51 and 52, and also prevents the second sheet 20 from deforming into the steam passages 51 and 52. The cross-sectional areas of the first steam passage 51 and the second steam passage 52 can be secured.

[0097] The first region 5, the second region 6, and the curved region 7 may be separated by a boundary line along the curved line 8. As shown in FIGS. 4 and 5, each of the regions 5, 6, and 7 may be separated by a boundary line extending in the Y direction in a plan view. The curved region 7 is a region with a certain width that includes the curved line 8. The curved region 7 is formed by a portion of the vapor chamber 1 where deformation occurs due to bending. The first region 5 and the second region 6 correspond to regions other than the curved region 7. In other words, the first region 5 and the second region 6 are non-bent regions. As shown in FIGS. 4 and 5, the first region 5 and the second region 6 may be regions that extend on the XY plane without being bent. The first region 5 and the second region 6 may be formed by a portion of the curved vapor chamber 1 where deformation does not occur.

[0098] The first region 5 and the second region 6 may be two regions separated by a bending region 7. The first region 5 may be a region located on one side (the left side in FIG. 5 ) of the bending region 7 in a direction perpendicular to the bending line 8 (the X direction in the illustrated example). The first region 5 may be a region adjacent to the bending region 7 on one side of the bending region 7. The second region 6 may be a region located on the other side (the right side in FIG. 5 ) of the bending region 7 in a direction perpendicular to the bending line 8. The second region 6 may be a region adjacent to the bending region 7 on the other side of the bending region 7.

[0099] In the illustrated example, the first region 5 extends from the boundary line with the curved region 7 to the end of one side in the X direction of the vapor chamber 1 (the left side in FIG. 5), and the second region 6 extends from the boundary line with the curved region 7 to the end of the other side in the X direction of the vapor chamber 1 (the right side in FIG. 5), but this is not limiting. For example, the first region 5 does not have to extend to the end of one side in the X direction of the vapor chamber 1, and the second region 6 does not have to extend to the end of the other side in the X direction of the vapor chamber 1.

[0100] The vapor chamber 1 is curved as shown in Fig. 13. In the curved region 7, the first sheet 10 is located outside the wick sheet 30 with respect to the center O of the curve. The second sheet 20 is located inside the wick sheet 30 with respect to the center O of the curve.

[0101] Each of the steam passages 51, 52 may include a passage bend portion 57 located in the bend region 7, as shown in Fig. 13. Fig. 13 shows an example of the passage bend portion 57. In Fig. 13, the shape of the passage bend portion 57 when viewed along the Y direction forms a quarter arc, but this is not limited to this. The passage bend portion 57 may include the first steam passage recess 53 and the second steam passage recess 54 described above.

[0102] As shown in FIGS. 11 , 13 , and 14 , the first sheet outer surface 10 a of the first sheet 10 described above may include a plurality of first bonding regions 13 and a first vapor flow path region 14. Each of the first bonding regions 13 is a region that overlaps a corresponding first land portion 33 in a plan view. The first bonding region 13 is a portion that is bonded to the first land portion 33 of the wick sheet 30. The first vapor flow path region 14 is an example of a first spatial region. The first vapor flow path region 14 is a region that overlaps the vapor flow path portion 50 in a plan view. The first vapor flow path region 14 is a portion that is not bonded to the wick sheet 30. The flow path cross section of the first vapor flow path region 14 may be formed in a concave shape that is recessed inward toward the vapor flow path portion 50. The first vapor flow path region 14 may be formed in a curved shape.

[0103] The first steam flow path region 14 of the first sheet outer surface 10a may be formed in a concave shape in each of the first region 5, the second region 6, and the curved region 7. More specifically, the first steam flow path region 14 may be formed in a concave shape in each of the first region 5 and the second region 6, as shown in FIG. 11. FIG. 11 is a cross-sectional view taken along line BB in FIG. 13. In the curved region 7, the first steam flow path region 14 may be formed in a concave shape as shown in FIG. 14. FIG. 14 is a cross-sectional view taken along line CC in FIG. 13. The first steam flow path region 14 may be formed in a concave shape over the entire area of ​​the first sheet outer surface 10a.

[0104] 11 and 14, the first sheet 10 may include a first sheet recess 15 that overlaps the first vapor flow path region 14 in a plan view. The first sheet recess 15 extends into the first vapor flow path recess 53.

[0105] When bent, the first sheet 10 in the first bonding region 13 is bonded to the first land 33, and therefore deforms along the first land 33. On the other hand, the first sheet 10 in the first vapor flow path region 14 covers the steam passages 51, 52 of the vapor flow path section 50, and therefore is less likely to stretch than the first bonding region 13. For this reason, the first vapor flow path region 14 stretches less. As shown in FIG. 14 , the first sheet recess 15 is displaced inward and enters the first vapor flow path recess 53.

[0106] The recess dimension of the first vapor flow path region 14 in the bending region 7 is larger than the recess dimension of the first vapor flow path region 14 in the first region 5 and the second region 6. As shown in FIG. 13 , when viewed along a direction parallel to the bending line 8, the maximum dimension d2 in the bending region 7 is larger than the maximum dimension d1 in the first region 5 and the second region 6. The maximum dimension d1 is the dimension defined between the first bonding region 13 and the first vapor flow path region 14 in the first region 5 and the second region 6, and is the dimension in the thickness direction of the first sheet 10. The thickness direction of the first sheet 10 corresponds to the Z direction. The maximum dimension d2 is the dimension defined between the first bonding region 13 and the first vapor flow path region 14 in the bending region 7, and is the dimension in the thickness direction of the first sheet 10. FIG. 13 is a view viewed in a direction parallel to the bending line 8, in other words, along the Y direction. The maximum dimensions d1 and d2 defined between the first bonding region 13 and the first vapor flow path region 14, which are the maximum dimensions d1 and d2 in the thickness direction of the first sheet 10, are also referred to as first maximum dimensions d3 and d4. Note that the phrase "the maximum dimension d2 in the bending region 7 is larger than the maximum dimension d1 in the first region 5 and the second region 6" means that the maximum dimension d2 at a certain position in the bending region 7 is larger than the maximum dimension d1 at a certain position in the first region 5 and the second region 6, and does not necessarily mean that the maximum dimension d2 at all positions in the bending region 7 is larger than the maximum dimension d1 at all positions in the first region 5 and the second region 6.

[0107] FIG. 11 shows cross sections of the vapor chamber 1 perpendicular to the X direction in the first region 5 and the second region 6. In this embodiment, the first vapor flow path region 14 is recessed in each of the first region 5 and the second region 6. The first joining region 13 is formed flat in both the X direction and the Y direction. The dimension d1 described above may be the depth of the recess. The dimension d1 may be the distance between the most recessed position of the first vapor flow path region 14 and a line on the first joining region 13 that extends in the Y direction and overlaps with the most recessed position when viewed in the normal direction of the first vapor flow path region 14. In other words, the dimension d1 may be the distance in the Z direction between the most recessed position of the first vapor flow path region 14 and the flat portion of the first joining region 13. The dimension d1 may be obtained from each of the first region 5 and the second region 6. The dimension d1 in the first region 5 and the dimension d1 in the second region 6 may be equal to or different from each other.

[0108] FIG. 14 shows a cross section of the vapor chamber 1 perpendicular to the X direction in the bending region 7. In this embodiment, the first vapor flow path region 14 in the bending region 7 is recessed. The first joining region 13 in the bending region 7 is formed flat in the Y direction. The dimension d2 described above may be the depth of the recess. The dimension d2 may be the distance between the most recessed position of the first vapor flow path region 14 and a straight line on the first joining region 13 that extends in the Y direction and overlaps with the most recessed position when viewed in the normal direction to that position. In other words, the dimension d2 may be the distance in the Z direction between the most recessed position of the first vapor flow path region 14 and the position of the flat portion of the first joining region 13. FIG. 14 is a cross section taken along line CC in FIG. 13, at the position where the first vapor flow path region 14 is most recessed. FIG. 14 shows a cross section at a position rotated 45° from the boundary between the first region 5 and the bending region 7 with respect to the center O of the bend. However, the position where the first vapor flow path region 14 is most recessed is not limited to this.

[0109] The first vapor flow path region 14 shown in Fig. 14 is recessed more than the first vapor flow path region 14 shown in Fig. 11. Therefore, the dimension d2 is larger than the dimension d1. The first seat recess 15 in the bending region 7 extends deeper into the first vapor flow path recess 53 than the first seat recess 15 in the first region 5 and the second region 6.

[0110] 11 and 14, a flow path corner 55 that constitutes a part of the steam flow path cross section is defined by the first seat inner surface 10b of the first seat recess 15 and a wall surface 53a of the first steam flow path recess 53. The flow path corner 55 may be formed in a wedge shape.

[0111] 11, in each of the first region 5 and the second region 6, the angle formed between the first sheet inner surface 10b and the wall surface 53a may be defined as α1. α1 may be an acute angle. The angle α1 may be defined by a tangent to the first sheet inner surface 10b and a tangent to the wall surface 53a at the intersection of the first sheet inner surface 10b and the wall surface 53a.

[0112] 14, the angle formed between the first sheet inner surface 10b and the wall surface 53a in the curved region 7 may be defined as α2. α2 may be defined in the same manner as α1.

[0113] Angle α2 shown in Fig. 14 may be smaller than angle α1 shown in Fig. 11. This is because the first vapor flow path region 14 shown in Fig. 14 is recessed more than the first vapor flow path region 14 shown in Fig. 11. In this case, the capillary action of the flow path corner 55 shown in Fig. 14 may be stronger than the capillary action of the flow path corner 55 shown in Fig. 11.

[0114] The first vapor flow path region 14 may extend in the X direction in each of the first region 5, the second region 6, and the bent region 7, similarly to the first land portion 33. The first seat recess 15 and the flow path corner portion 55 may also extend in the X direction in a similar manner.

[0115] As shown in FIGS. 11 , 13 , and 14 , the second sheet outer surface 20b of the second sheet 20 described above may include a plurality of second bonding regions 23 and a second vapor flow path region 24. Each of the second bonding regions 23 is a region that overlaps a corresponding first land portion 33 in a plan view. The second bonding region 23 is a portion that is bonded to the first land portion 33 of the wick sheet 30. The second vapor flow path region 24 is an example of a second spatial region. The second vapor flow path region 24 is a region that overlaps the vapor flow path portion 50 in a plan view. The second vapor flow path region 24 is a portion that is not bonded to the wick sheet 30. The flow path cross section of the second vapor flow path region 24 may be formed in a concave shape that is recessed inward toward the vapor flow path portion 50. The second vapor flow path region 24 may be formed in a curved shape.

[0116] The second steam flow path region 24 of the second sheet outer surface 20b may be formed in a concave shape in each of the first region 5, the second region 6, and the curved region 7. More specifically, the second steam flow path region 24 may be formed in a concave shape in each of the first region 5 and the second region 6, as shown in Fig. 11. In the curved region 7, the second steam flow path region 24 may be formed in a concave shape as shown in Fig. 14. The second steam flow path region 24 may be formed in a concave shape over the entire area of ​​the second sheet outer surface 20b.

[0117] 11 and 14, the second sheet 20 may include a second sheet recess 25 that overlaps the second vapor flow path region 24 in a plan view. The second sheet recess 25 extends into the second vapor flow path recess 54.

[0118] During bending, the second joining region 23 of the second sheet 20 is joined to the first land 33, and thus deforms along the first land 33. On the other hand, the second steam flow path region 24 is prone to shrinkage because it covers the steam passages 51 and 52 of the steam flow path section 50. Because the second sheet 20 is located on the inside, a jig (not shown) abuts against the second sheet outer surface 20b of the second sheet 20. This restricts the second steam flow path region 24 from displacing inward. As shown in FIG. 13 , the second sheet recess 25 displaces outward and enters the second steam flow path recess 54.

[0119] The recess dimension of the second vapor flow path region 24 in the bending region 7 is larger than the recess dimension of the second vapor flow path region 24 in the first region 5 and the second region 6. As shown in FIG. 13 , when viewed along a direction parallel to the bending line 8, the maximum dimension d4 in the bending region 7 is larger than the maximum dimension d3 in the first region 5 and the second region 6. The maximum dimension d3 is the dimension defined between the second bonding region 23 and the second vapor flow path region 24 in the first region 5 and the second region 6, and is the dimension in the thickness direction of the second sheet 20. The thickness direction of the second sheet 20 corresponds to the Z direction. The maximum dimension d4 is the dimension defined between the second bonding region 23 and the second vapor flow path region 24 in the bending region 7, and is the dimension in the thickness direction of the second sheet 20. The maximum dimensions d3, d4 defined between the second bonding region 23 and the second vapor flow path region 24, which are the maximum dimensions d3, d4 in the thickness direction of the second sheet 20, are also referred to as second maximum dimensions d3, d4. Note that the phrase "the maximum dimension d4 in the bending region 7 is larger than the maximum dimension d3 in the first region 5 and the second region 6" means that the maximum dimension d4 at a certain position in the bending region 7 is larger than the maximum dimension d3 at a certain position in the first region 5 and the second region 6, and does not necessarily mean that the maximum dimension d4 at all positions in the bending region 7 is larger than the maximum dimension d3 at all positions in the first region 5 and the second region 6.

[0120] In this embodiment, the second vapor flow path region 24 is recessed in each of the first region 5 and the second region 6. The second bonding region 23 is formed flat in both the X and Y directions. The dimension d3 described above may be the depth of the recess. The dimension d3 may be the distance between the most recessed position of the second vapor flow path region 24 and a line on the second bonding region 23 that extends in the Y direction and overlaps with the most recessed position when viewed in the normal direction of the most recessed position. In other words, the dimension d3 may be the distance in the Z direction between the most recessed position of the second vapor flow path region 24 and the flat portion of the second bonding region 23. The dimension d3 may be obtained from each of the first region 5 and the second region 6. The dimension d3 in the first region 5 and the dimension d3 in the second region 6 may be equal to or different from each other.

[0121] In this embodiment, the second vapor flow path region 24 in the bending region 7 is recessed. The second joining region 23 in the bending region 7 is formed flat in the Y direction. The dimension d4 described above may be the depth dimension of the recess. The dimension d4 may be the distance between the most recessed position of the second vapor flow path region 24 and a straight line on the second joining region 23 that extends in the Y direction and overlaps with the most recessed position when viewed in the normal direction to that position. In other words, the dimension d4 may be the distance in the Z direction between the most recessed position of the second vapor flow path region 24 and the position of the flat portion of the second joining region 23. FIG. 14 is a cross-sectional view of the second vapor flow path region 24 at its most recessed position, but the most recessed position of the second vapor flow path region 24 is not limited to this, as is the case with the first vapor flow path region 14.

[0122] The second vapor flow path region 24 shown in Fig. 14 is recessed more than the second vapor flow path region 24 shown in Fig. 11. Therefore, the dimension d4 is larger than the dimension d3. The second seat recess 25 in the bending region 7 extends deeper into the second vapor flow path recess 54 than the second seat recess 25 in the first region 5 and the second region 6.

[0123] 11 and 14, a flow path corner 56 that constitutes a part of the steam flow path cross section is defined by the second seat inner surface 20a of the second seat recess 25 and a wall surface 54a of the second steam flow path recess 54. The flow path corner 56 may be formed in a wedge shape.

[0124] 11, in each of the first region 5 and the second region 6, the angle between the second sheet inner surface 20a and the wall surface 54a may be defined as β1. β1 may be an acute angle. The angle β1 may be defined by a tangent to the second sheet inner surface 20a and a tangent to the wall surface 54a at the intersection of the second sheet inner surface 20a and the wall surface 54a.

[0125] 14, the angle formed between the second sheet inner surface 20a and the wall surface 53a in the bending region 7 may be defined as β2. β2 may be defined in the same way as β1.

[0126] Angle β2 shown in Fig. 14 may be smaller than angle β1 shown in Fig. 11. This is because the second vapor flow path region 24 shown in Fig. 14 is recessed more than the second vapor flow path region 24 shown in Fig. 11. In this case, the capillary action of the flow path corner 56 shown in Fig. 14 may be stronger than the capillary action of the flow path corner 56 shown in Fig. 11.

[0127] The second vapor flow path region 24 may extend in the X direction in each of the first region 5, the second region 6, and the bent region 7, similarly to the first land portion 33. The second seat recess 25 and the flow path corner portion 56 may also extend in the X direction.

[0128] As described above, the first sheet 10 and the second sheet 20 may be thinner than the wick sheet 30. In this case, stress can be applied to the portion of the first sheet 10 that overlaps the vapor flow path section 50 to leave a distortion, and stress can be applied to the portion of the second sheet 20 that overlaps the vapor flow path section 50 to leave a distortion. This distortion can form the first vapor flow path region 14 and the second vapor flow path region 24 in the first region 5, the second region 6, and the bending region 7 even before bending. For example, applying stress to the first sheet 10 and the second sheet 20 while they are being heated and softened makes it easier to leave a distortion, or applying stress after they are heated and softened makes it easier to leave a distortion. This allows the first vapor flow path region 14 and the second vapor flow path region 24 to be formed in a concave shape. However, as described below, the first vapor flow path region 14 before bending may be formed flat in the first region 5, the second region 6, and the bending region 7. Similarly, the second vapor flow path region 24 before bending may be formed flat in the first region 5, the second region 6 and the bending region 7.

[0129] Next, a method for manufacturing the vapor chamber 1 of this embodiment having such a configuration will be described.

[0130] First, in a preparation step, the first sheet 10, the second sheet 20, and the wick sheet 30 are prepared. The preparation step may include an etching step in which the wick sheet 30 is formed by etching. In the etching step, the wick sheet 30 may be formed by etching using a patterned resist film (not shown) formed by photolithography technology.

[0131] In the temporary joining step, the first sheet 10, the wick sheet 30, and the second sheet 20 are temporarily joined together. For example, the sheets 10, 20, and 30 may be temporarily joined together by spot welding or laser welding. At this time, the sheets 10, 20, and 30 may be aligned using the alignment holes 12, 22, and 35 described above.

[0132] Next, in a bonding step, the first sheet 10, the wick sheet 30, and the second sheet 20 are permanently bonded together. The sheets 10, 20, and 30 may be bonded together by diffusion bonding.

[0133] After the joining step, the sealed space 3 is evacuated and the hydraulic fluid 2b is injected into the sealed space 3 from the injection part 4 (see FIG. 5) as an injection step.

[0134] After the injection step, the above-mentioned injection flow path 36 is sealed in the sealing step. This blocks communication between the sealed space 3 and the outside, sealing the sealed space 3. The sealed space 3 is filled with the working fluid 2b, and the working fluid 2b in the sealed space 3 is prevented from leaking to the outside.

[0135] After the sealing process, the first sheet 10, the second sheet 20, and the wick sheet 30 may be bent in a bending process. For example, as shown in FIG. 5, the sheets 10, 20, and 30 are bent along a bending line 8 extending in the Y direction. At this time, a jig (not shown) is abutted against the second sheet outer surface 20b of the second sheet 20, which is the inner side of the bend. Both ends of each sheet 10, 20, and 30 in the X direction are gripped, and each sheet 10, 20, and 30 is bent at a desired angle. This results in the bent vapor chamber 1 shown in FIG. 4, which is divided into a first region 5, a second region 6, and a bent region 7. The bending process may be performed between the joining process and the injection process.

[0136] In this manner, the vapor chamber 1 according to this embodiment is obtained.

[0137] Next, a method for operating the vapor chamber 1, that is, a method for cooling the electronic device D, will be described.

[0138] The vapor chamber 1 obtained as described above is installed in a housing H of a mobile terminal or the like. In the first region 5, the first sheet outer surface 10a of the first sheet 10 contacts the housing member Ha. In the second region 6, the second sheet outer surface 20b of the second sheet 20 contacts the electronic device D. The working liquid 2b in the sealed space 3 adheres to the wall surfaces of the sealed space 3 due to its surface tension. More specifically, the working liquid 2b adheres to the wall surfaces 53a of the first vapor flow path recess 53, the wall surfaces 54a of the second vapor flow path recess 54, the wall surfaces 62 of the main groove 61 of the first liquid flow path section 60, and the wall surfaces of the connecting grooves 65. The working liquid 2b may also adhere to the portion of the first sheet inner surface 10b of the first sheet 10 exposed to the first vapor flow path recess 53. Furthermore, the working fluid 2 b may also adhere to the portions of the second sheet inner surface 20 a of the second sheet 20 that are exposed to the second vapor flow path recess 54 , the main groove 61 , and the communication groove 65 .

[0139] In this state, when the electronic device D generates heat, the working fluid 2b present in the evaporation region SR receives heat from the electronic device D. The received heat is absorbed as latent heat, and the working fluid 2b evaporates, generating working vapor 2a. The generated working vapor 2a diffuses within the first vapor passage 51 and the second vapor passage 52 that constitute the sealed space 3 (see the solid arrows in FIG. 9). More specifically, in the portion of the first vapor passage 51 of the vapor flow path section 50 that extends in the X direction and in the second vapor passage 52, the working vapor 2a diffuses mainly in the X direction. In this case, a portion of the working vapor 2a diffuses through the passage bend portion 57. On the other hand, in the portion of the first vapor passage 51 that extends in the Y direction, the working vapor 2a diffuses mainly in the Y direction.

[0140] Then, the working steam 2a in each steam passage 51, 52 leaves the evaporation region SR and is transported to the condensation region CR, which has a relatively low temperature. In the condensation region CR, the working steam 2a is cooled by dissipating heat mainly to the first sheet 10. The heat received by the first sheet 10 from the working steam 2a is transferred to the outside air via the housing member Ha (see FIG. 6).

[0141] The working vapor 2a dissipates heat to the first sheet 10 in the condensation region CR, thereby losing the latent heat absorbed in the evaporation region SR. This causes the working vapor 2a to condense, generating working fluid 2b. The generated working fluid 2b adheres to the wall surfaces 53a, 54a of the vapor flow path recesses 53, 54, the first sheet inner surface 10b of the first sheet 10, and the second sheet inner surface 20a of the second sheet 20. Here, the working fluid 2b continues to evaporate in the evaporation region SR. Therefore, the working fluid 2b in the condensation region CR of the first liquid flow path section 60 is transported toward the evaporation region SR by the capillary action of the main grooves 61 (see the dashed arrows in FIG. 9 ). As a result, the working fluid 2b adhering to the wall surfaces 53a, 54a, the first sheet inner surface 10b, and the second sheet inner surface 20a moves to the first liquid flow path section 60 and enters the main grooves 61 through the communication grooves 65. In this way, the working fluid 2b is filled into each of the main grooves 61 and each of the connecting grooves 65. The filled working fluid 2b obtains a driving force toward the evaporation region SR due to the capillary action of each of the main grooves 61, and is smoothly transported toward the evaporation region SR. As shown in FIG. 4, even when the evaporation region SR is located above the vapor chamber 1, the working fluid 2b is transported by capillary action.

[0142] In the first liquid flow path section 60, each mainstream groove 61 communicates with the adjacent other mainstream grooves 61 via the corresponding communication grooves 65. This allows the working fluid 2b to flow between the adjacent mainstream grooves 61, preventing the occurrence of dryout in the mainstream grooves 61. As a result, capillary action is imparted to the working fluid 2b in each mainstream groove 61, and the working fluid 2b is smoothly transported toward the evaporation region SR.

[0143] The working fluid 2b that has reached the evaporation region SR is again heated by the electronic device D and evaporates. The working vapor 2a that has evaporated from the working fluid 2b passes through the communication groove 65 in the evaporation region SR and moves to the first vapor flow path recess 53 and the second vapor flow path recess 54, which have large flow path cross-sectional areas. The working vapor 2a then diffuses within each of the vapor flow path recesses 53 and 54, and some of the working vapor 2a can diffuse through the bent path portion 57. In this way, the working fluids 2a and 2b circulate within the sealed space 3 while repeatedly undergoing phase changes, i.e., evaporation and condensation. This diffuses and releases the heat from the electronic device D. As a result, the electronic device D is cooled.

[0144] 11 and 14, the first steam flow path region 14 of the first sheet outer surface 10a is formed in a concave shape in the first region 5, the second region 6, and the bent region 7. The above-mentioned flow path corner portion 55 having capillary action is defined within the first steam flow path recess 53. Therefore, the presence of the flow path corner portion 55 transports the working fluid 2b condensed in the steam flow path portion 50 toward the evaporation region SR.

[0145] 13, when viewed in a direction parallel to the bending line 8, the maximum dimension d2 (first maximum dimension d2) in the bending region 7 is larger than the maximum dimension d1 (first maximum dimension d1) in the first region 5 and the second region 6. As a result, the capillary action of the flow path corner 55 in the bending region 7 is stronger than the capillary action of the flow path corner 55 in the first region 5 and the second region 6.

[0146] Similarly, the second vapor flow path region 24 of the second sheet outer surface 20b is formed in a concave shape in the first region 5, the second region 6, and the bent region 7. The above-mentioned flow path corner portion 56 having capillary action is defined within the second vapor flow path recess 54. Therefore, the presence of the flow path corner portion 56 transports the working fluid 2b condensed in the vapor flow path portion 50 toward the evaporation region SR.

[0147] More specifically, when viewed in a direction parallel to the bending line 8, the maximum dimension d4 (second maximum dimension d4) in the bending region 7 is larger than the maximum dimension d3 (second maximum dimension d3) in the first region 5 and the second region 6. As a result, the capillary action of the flow path corner 56 in the bending region 7 is stronger than the capillary action of the flow path corner 55 in the first region 5 and the second region 6.

[0148] Outside the passage bend portion 57, the working vapor 2a is more likely to collide with the first sheet inner surface 10b. The colliding working vapor 2a is condensed into working fluid 2b, which adheres to the first sheet inner surface 10b. A portion of the adhered working fluid 2b is transported through the passage corner portion 55 toward the evaporation region SR by the capillary action of the passage corner portion 55. Another portion of the working fluid 2b adhering to the first sheet inner surface 10b passes through the communication grooves 65 of the first liquid passage portion 60 and enters the mainstream grooves 61. The working fluid 2b is then transported toward the evaporation region SR by the capillary action of each mainstream groove 61. In this way, the working fluid 2b adhering to the first sheet inner surface 10b in the bend region 7 is prevented from accumulating.

[0149] Inside the passage bend 57, the flow of working vapor 2a can separate from the second sheet inner surface 20a. More specifically, a vortex is formed near the exit of the passage bend 57, and the working vapor 2a condenses and adheres to the second sheet inner surface 20a. The area near the exit of the passage bend 57 corresponds to a portion of the passage bend 57 that is relatively close to the second region 6. A portion of the adhered working fluid 2b is transported through the passage corner 55 toward the evaporation region SR by the capillary action of the passage corner 56 described above. In this way, the working fluid 2b adhered to the second sheet inner surface 20a in the bend region 7 is prevented from stagnation.

[0150] As described above, according to this embodiment, the first lands 33 of the wick sheet 30 are spaced apart in the Y direction, which is perpendicular to the X direction. In the bending region 7, the vapor chamber 1 is bent along a bending line 8 that extends in a direction intersecting the X direction in a plan view. When viewed in a direction parallel to the bending line 8, the maximum dimension d2 (first maximum dimension d2) in the bending region 7 is larger than the maximum dimension d1 (first maximum dimension d1) in the other regions (the first region 5 and the second region 6) other than the bending region 7. This allows the first sheet 10 to enter the first vapor passage 51 and the second vapor passage 52 in the bending region 7, forming flow path corners 55 with enhanced capillary action in each of the vapor passages 51 and 52. Therefore, the working liquid 2b condensed from the working vapor 2a in the bending region 7 can be transported to the evaporation region SR by the capillary action of the flow path corners 55. Furthermore, the condensed working fluid 2b can be efficiently moved to the first liquid flow path portion 60 that communicates with each of the vapor passages 51, 52. This prevents the working fluid 2b from accumulating in each of the vapor passages 51, 52 in the curved region 7, and prevents the flow of the working vapor 2a from being obstructed by the working fluid 2b. As a result, even when the vapor chamber 1 is bent, the heat dissipation efficiency of the vapor chamber 1 can be improved.

[0151] Furthermore, the large maximum dimension d2 allows the surface area of ​​the first sheet 10 to be increased in the curved region 7. This improves the efficiency of heat dissipation to the outside through the housing member Ha, thereby increasing the cooling capacity of the vapor chamber 1. This also suppresses an increase in the vapor pressure of the working vapor 2a in the curved region 7, thereby reducing the difference in vapor pressure of the working vapor 2a between the curved region 7 and the first region 5 and second region 6. This allows for smooth transport of the working vapor 2a. Furthermore, the increased surface area of ​​the first sheet 10 also increases the adhesive strength with the housing member Ha via adhesive tape or the like in the curved region 7. This improves the reliability of the vapor chamber 1.

[0152] Furthermore, according to this embodiment, the first vapor flow path region 14 of the first sheet outer surface 10a is formed in a concave shape. This allows flow path corners 55 with enhanced capillary action to be formed in the first vapor path 51 and the second vapor path 52 in each of the first region 5, the second region 6, and the bent region 7. Therefore, the working fluid 2b condensed from the working vapor 2a can be transported to the evaporation region SR by the capillary action of the flow path corners 55.

[0153] Furthermore, by forming the first vapor flow path region 14 in a concave shape, the surface area of ​​the first sheet 10 can be increased. This improves the efficiency of heat dissipation to the outside through the housing member Ha, thereby increasing the cooling capacity of the vapor chamber 1. Furthermore, this suppresses an increase in the vapor pressure of the working vapor 2a in the curved region 7, thereby reducing the difference in vapor pressure of the working vapor 2a between the curved region 7 and the first region 5 and second region 6. This allows for smooth transport of the working vapor 2a. Furthermore, the increased surface area of ​​the first sheet 10 increases the adhesive strength with the housing member Ha via adhesive tape or the like. This improves the reliability of the vapor chamber 1.

[0154] Furthermore, according to this embodiment, in the bending region 7, the vapor chamber 1 is bent along a bending line 8 extending in the Y direction. This allows the vapor chamber 1 to be bent in a direction perpendicular to the X direction in which the first land portion 33 extends. Therefore, in the first region 5, the second region 6, and the bending region 7, it is possible to prevent the maximum dimension between the first joining region 13 and the first vapor flow path region 14 from becoming excessively large. As a result, it is possible to ensure the flow path cross-sectional areas of the first vapor path 51 and the second vapor path 52 in the bending region 7, and it is possible to prevent the flow of the working vapor 2a in the bending region 7 from being obstructed.

[0155] Furthermore, according to this embodiment, a first liquid flow path section 60 is formed on the first main body surface 30a of the first land portion 33. In the bending region 7, the first sheet 10 is located outward of the wick sheet 30. This allows the working liquid 2b condensed by the working steam 2a flowing through the bending path section 57 colliding with the first sheet inner surface 10b to be easily guided to the first liquid flow path section 60. This allows the working liquid 2b to be smoothly transported toward the evaporation region SR. As a result, it is possible to prevent the working liquid 2b from accumulating in the steam paths 51, 52 in the bending region 7, and to prevent the flow of the working steam 2a from being obstructed.

[0156] Furthermore, according to this embodiment, when viewed along a direction parallel to the bending line 8, the maximum dimension d4 (second maximum dimension d4) in the bending region 7 is larger than the maximum dimension d3 (second maximum dimension d3) in the regions other than the bending region (the first region 5 and the second region 6). This allows the second sheet 20 to enter the first vapor passage 51 and the second vapor passage 52 in the bending region 7, thereby forming flow path corners 56 with enhanced capillary action in each of the vapor passages 51 and 52. Therefore, the working fluid 2b condensed from the working vapor 2a in the bending region 7 can be transported to the evaporation region SR by the capillary action of the flow path corners 56. Furthermore, the condensed working fluid 2b can be efficiently transported to the first liquid flow path section 60 that communicates with each of the vapor passages 51 and 52. As a result, the working fluid 2b is prevented from accumulating in the vapor passages 51 and 52 in the bending region 7, and the flow of the working vapor 2a is prevented from being obstructed.

[0157] Furthermore, in the curved region 7, the working fluid 2b tends to accumulate inside the bend where the vapor pressure of the working vapor 2a is low. Therefore, by efficiently moving the working fluid 2b to the first liquid flow path section 60 inside the bend, an increase in flow path resistance of the working vapor 2a in the curved region 7 can be effectively suppressed. Furthermore, because the maximum dimension d4 is large, the direction of the working vapor 2a flowing along the inner wall of the second sheet 20 can be easily bent along the curved shape. Therefore, the working vapor 2a can be transported smoothly.

[0158] In the above-described embodiment, an example has been described in which the first steam flow path region 14 of the first sheet outer surface 10a in the first region 5, the second region 6, and the curved region 7 is formed in a concave shape. However, this is not limiting as long as the first steam flow path region 14 in the curved region 7 is formed in a concave shape and the above-described maximum dimension d2 is greater than the above-described maximum dimension d1.

[0159] For example, the first vapor flow path region 14 of the first sheet outer surface 10a in one of the first region 5 and the second region 6 may be formed flat in the Y direction. The first vapor flow path region 14 of the first sheet outer surface 10a in both the first region 5 and the second region 6 may be formed flat in the Y direction. In this case, the maximum dimension d1 described above may be zero. For example, if the first vapor flow path region 14 shown in FIG. 11 is formed flat, the difference between the capillary force of the flow path corner 55 shown in FIG. 11 and the capillary force of the flow path corner 55 shown in FIG. 14 can be increased. The capillary action of the flow path corner 55 in the bent region 7 can be relatively strengthened. Furthermore, the surface area of ​​the first sheet 10 in the bent region 7 can be relatively increased. This improves the efficiency of heat dissipation to the outside via the housing member Ha, thereby increasing the cooling capacity of the vapor chamber 1. Furthermore, an increase in the vapor pressure of the working steam 2a in the curved region 7 can be suppressed, and the difference in vapor pressure of the working steam 2a between the curved region 7 and the first region 5 and the second region 6 can be reduced. This allows for smooth transport of the working steam 2a. Furthermore, because the first steam flow path region 14 is formed flat, it is possible to suppress the formation of a gap between the first steam flow path region 14 and the housing member Ha, and it is possible to achieve sufficient adhesion with the housing member Ha. This improves the efficiency of heat dissipation to the outside via the housing member Ha.

[0160] Similarly, the second vapor flow path region 24 of the second sheet outer surface 20b in either the first region 5 or the second region 6 may be formed flat in the Y direction. The second vapor flow path region 24 of the second sheet outer surface 20b in both the first region 5 and the second region 6 may be formed flat in the Y direction. In this case, the maximum dimension d3 described above may be zero. For example, if the second vapor flow path region 24 shown in FIG. 11 is formed flat, the difference between the capillary force of the flow path corner 56 shown in FIG. 11 and the capillary force of the flow path corner 56 shown in FIG. 14 can be increased. This can relatively strengthen the capillary action of the flow path corner 56 in the bent region 7. Furthermore, the surface area of ​​the second sheet 20 in the bent region 7 can be relatively increased. This can improve the efficiency of heat dissipation to the outside via the housing member Ha, thereby enhancing the cooling capacity of the vapor chamber 1. Furthermore, an increase in the vapor pressure of the working vapor 2a in the curved region 7 can be suppressed, and the difference in vapor pressure of the working vapor 2a between the curved region 7 and the first region 5 and the second region 6 can be reduced. This allows the working vapor 2a to be transported smoothly. Furthermore, because the second vapor flow path region 24 is formed flat, it is possible to suppress the formation of gaps between the electronic device D and the second vapor flow path region 24, and sufficient adhesion to the electronic device D can be achieved. This allows the electronic device D to be cooled efficiently.

[0161] Furthermore, in the present embodiment described above, in the bent region 7, the recession amount of the second steam flow path region 24 of the second sheet 20 located on the inside of the bend may be smaller than the recession amount of the first steam flow path region 14 of the first sheet 10 located on the outside of the bend. In other words, the above-mentioned maximum dimension d4 may be smaller than the above-mentioned maximum dimension d2. In this case, it is possible to suppress a decrease in the flow path cross-sectional area of ​​the second steam flow path recess 54, and to suppress an increase in the flow path resistance of the working steam 2a. This allows for smooth transport of the working steam 2a.

[0162] Furthermore, in the present embodiment described above, in the bent region 7, the recession amount of the first steam flow path region 14 of the first sheet 10 located on the outer side of the bend may be smaller than the recession amount of the second steam flow path region 24 of the second sheet 20 located on the inner side of the bend. That is, the maximum dimension d2 described above may be smaller than the maximum dimension d4 described above. The maximum dimension d2 described above may even be zero. In this case, a decrease in the flow path cross-sectional area of ​​the first steam flow path recess 53 can be suppressed, and an increase in the flow path resistance of the working steam 2a can be suppressed. This allows the working steam 2a to be transported smoothly.

[0163] Furthermore, in the present embodiment described above, in the curved region 7, the amount of recession of the first vapor flow path region 14 of the first sheet 10 on the side where the first liquid flow path section 60 is located may be larger than the amount of recession of the second vapor flow path region 24 of the second sheet 20 on the side where the first liquid flow path section 60 is not located. In this case, a flow path corner 55 with enhanced capillary action can be formed between each of the vapor paths 51, 52 and the first liquid flow path section 60. Therefore, the working liquid 2b condensed from the working vapor 2a in the curved region 7 can be efficiently moved to the first liquid flow path section 60.

[0164] In the present embodiment described above, the amount of depression in the vapor flow path regions 14, 24 of each sheet 10, 20 at the widthwise end portions of the vapor flow path section 50 in the curved region 7 may be smaller than the amount of depression in the vapor flow path regions 14, 24 of each sheet 10, 20 at the widthwise center portion of the vapor flow path section 50. For example, in the second vapor passage 52 at the Y-direction center portion of the vapor chamber 1 shown in FIG. 5, the first sheet 10 may have a maximum dimension d2 in the curved region 7, and the second sheet 20 may have a maximum dimension d4 in the curved region 7, as shown in FIG. 14. In the first vapor passage 51 at the Y-direction end portion of the vapor chamber 1 shown in FIG. 5, the first sheet 10 may have a maximum dimension d2' in the curved region 7, and the second sheet 20 may have a maximum dimension d4' in the curved region 7, as shown in FIG. 15. Here, the maximum dimension d2' may be smaller than the maximum dimension d2. Furthermore, the maximum dimension d4' may be smaller than the maximum dimension d4. In this case, an increase in flow resistance of the working steam 2a can be suppressed at the widthwise ends of the steam flow path section 50, allowing the working steam 2a to be transported smoothly. Also, since heat is easily transferred at the widthwise ends of the steam flow path section 50, the temperature difference between the widthwise ends and the widthwise center of the steam flow path section 50 can be reduced, allowing the vapor chamber 1 to be heated uniformly.

[0165] Furthermore, in the present embodiment described above, in the curved region 7, the depression amount of the steam flow path regions 14, 24 of each sheet 10, 20 at the widthwise ends of the steam flow path section 50 may be larger than the depression amount of the steam flow path regions 14, 24 of each sheet 10, 20 at the widthwise center of the steam flow path section 50. For example, the maximum dimension d2' described above may be larger than the maximum dimension d2. Furthermore, the maximum dimension d4' described above may be larger than the maximum dimension d4. In this case, the condensed working fluid 2b can be efficiently transferred to the first liquid flow path section 60 at the widthwise ends of the steam flow path section 50. This prevents the condensed working fluid 2b from clogging the steam passages 51, 52, and allows the working vapor 2a to be transported smoothly. Furthermore, because heat is easily transferred at the widthwise ends of the steam flow path section 50, the temperature difference between the widthwise ends and the widthwise center of the steam flow path section 50 can be reduced, resulting in a uniform temperature distribution in the vapor chamber 1.

[0166] In the above-described embodiment, the first liquid flow path portion 60 is formed on the first main body surface 30a of the first land portion 33, and no liquid flow path portion is formed on the second main body surface 30b of the first land portion 33. However, this is not limited to this. For example, as shown in Fig. 16, no liquid flow path portion may be formed on the first main body surface 30a of the first land portion 33, and the first liquid flow path portion 60 may be formed on the second main body surface 30b of the first land portion 33.

[0167] In the above-described embodiment, the first liquid flow path portion 60 is formed on the first main body surface 30a of the first land portion 33, and no liquid flow path portion is formed on the second main body surface 30b of the first land portion 33. However, this is not limited to this. For example, as shown in FIG. 17 , a second liquid flow path portion 70 may be formed on the second main body surface 30b of the first land portion 33. The second liquid flow path portion 70 formed on the second main body surface 30b is an example of a second groove assembly. The second liquid flow path portion 70 may include a plurality of main grooves 61 and a plurality of communication grooves 65, similar to the first liquid flow path portion 60 described above.

[0168] In the curved region 7, the second sheet 20 is located more inward than the wick sheet 30. Inside the passage bend 57, the flow of working vapor 2a can separate from the second sheet inner surface 20a. More specifically, a vortex is formed near the exit of the passage bend 57, causing the working vapor 2a to condense. The condensed working liquid 2b can be guided to the second liquid flow path section 70. This allows the working liquid 2b to be transported toward the evaporation region SR. This prevents the working liquid 2b from accumulating in the vapor passages 51, 52 in the curved region 7, and prevents the flow of working vapor 2a from being obstructed.

[0169] In the example shown in FIG. 17, the second liquid flow path section 70 has been described as having the same configuration as the first liquid flow path section 60. However, this is not limited to this. For example, as shown in FIG. 18, the flow path cross-sectional area of ​​the mainstream groove 61 of the second liquid flow path section 70 may be larger than the flow path cross-sectional area of ​​the mainstream groove 61 of the first liquid flow path section 60. The flow path cross-sectional area of ​​the communication groove 65 of the second liquid flow path section 70 may be larger than the flow path cross-sectional area of ​​the communication groove 65 of the first liquid flow path section 60. The second liquid flow path section 70 shown in FIG. 18 is also referred to as a liquid storage section.

[0170] According to the modification shown in FIG. 18 , while the electronic device D is not generating heat, the working fluid 2b can be stored not only in the first liquid flow path section 60 but also dispersedly in the second liquid flow path section 70. Therefore, even if the working fluid 2b in the first liquid flow path section 60 freezes and expands in a temperature environment lower than the freezing point of the working fluid 2b, the expansion force acting on the first sheet 10 can be reduced. This reduces deformation of the first sheet 10. Furthermore, even if the working fluid 2b in the second liquid flow path section 70 freezes and expands, the expansion force acting on the second sheet 20 can be reduced. This reduces deformation of the second sheet 20. As a result, deformation of the vapor chamber 1 can be reduced, and performance degradation of the vapor chamber 1 can be suppressed. Furthermore, while the electronic device D is generating heat, the working fluid 2b in the second liquid flow path section 70 can evaporate due to heat from the electronic device D.

[0171] 18, the capillary force acting on the working fluid 2b in the mainstream grooves 61 of the second liquid flow path portion 70 can be made smaller than the capillary force acting on the working fluid 2b in the mainstream grooves 61 of the first liquid flow path portion 60. This reduces the amount of working fluid 2b moving to the second liquid flow path portion 70 while the electronic device D is generating heat. This prevents a decrease in the transport function of the working fluid 2b to the evaporation region SR, thereby preventing a decrease in heat transport efficiency. Furthermore, as described above, by making the flow path cross-sectional area of ​​the mainstream grooves 61 of the second liquid flow path portion 70 larger than the flow path cross-sectional area of ​​the mainstream grooves 61 of the first liquid flow path portion 60, the total volume of the space defined by the mainstream grooves 61 of the second liquid flow path portion 70 can be increased. This increases the amount of working fluid 2b stored in the second liquid flow path portion 70 while the electronic device D is not generating heat.

[0172] In the above-described embodiment, the second vapor flow path region 24 in the first region 5, the second region 6, and the curved region 7 is formed in a concave shape. However, this is not limited to this. For example, as shown in FIG. 19 , the second vapor flow path region 24 in the first region 5, the second region 6, and the curved region 7 may be formed flat in the Y direction. Even in this case, the capillary action of the flow path corner 55 can be enhanced, allowing the working fluid 2b attached to the first sheet inner surface 10b to be transported. Furthermore, the surface area of ​​the first sheet 10 can be increased in the curved region 7. This improves the efficiency of heat dissipation to the outside through the housing member Ha, thereby enhancing the cooling capacity of the vapor chamber 1. Furthermore, this suppresses an increase in the vapor pressure of the working vapor 2a in the curved region 7, thereby reducing the difference in vapor pressure of the working vapor 2a between the curved region 7 and the first region 5 and the second region 6. This allows the working vapor 2a to be transported smoothly. Furthermore, since the second vapor flow path region 24 is formed flat, it is possible to prevent a gap from being formed between the second vapor flow path region 24 and the electronic device D, and to achieve sufficient adhesion to the electronic device D. As a result, the electronic device D can be cooled efficiently.

[0173] In the above-described embodiment, an example has been described in which the first sheet 10 is located outside the wick sheet 30 in the bending region 7. However, this is not limited to this. For example, the first sheet 10 may be located inside the wick sheet 30. Even in this case, capillary action can be enhanced in the flow path corner 55, and the working fluid 2b adhering to the first sheet inner surface 10b can be transported. In this case, the second vapor flow path region 24 of the second sheet 20 located outside the wick sheet 30 may be formed flat in the Y direction in the first region 5, the second region 6, and the bending region 7.

[0174] In the above-described embodiment, a single first sheet recess 15 is formed across the entire width of the first vapor flow path region 14. However, this is not limited to this. For example, as shown in FIG. 20 , a portion of the first vapor flow path region 14 in the curved region 7 may be recessed, and another portion may be flat in the Y direction. This allows the capillary action in the recessed portion to be stronger than that in the flat portion. This makes it possible to control the flow of the working fluid 2b and arbitrarily set the location where the capillary action is intentionally strengthened. For example, a single first sheet recess 15 may be formed in a portion of the width of the first vapor flow path region 14. In this case, the other regions of the first vapor flow path region 14 may be flat in the Y direction. For example, a portion of the first vapor flow path region 14 in the curved region 7 in the steam flow direction may be recessed, and the other regions may be flat in the Y direction. Similarly, the second vapor flow path region 24 may also have a portion formed in a concave shape and another portion formed in a flat shape in the Y direction.

[0175] In the above-described embodiment, the first sheet 10 includes one first sheet recess 15 overlapping the first vapor flow path region 14 in a plan view. However, this is not limiting. For example, as shown in FIG. 21 , the first sheet 10 may include multiple first sheet recesses 15 overlapping the first vapor flow path region 14 in a plan view. For example, multiple first sheet recesses 15 may be formed in the first vapor flow path region 14. The multiple first sheet recesses 15 may be formed at different positions in the Y direction. The multiple first sheet recesses 15 may be formed at different positions in the X direction. FIG. 21 shows an example in which two first sheet recesses 15 aligned in the Y direction are formed in the first vapor flow path region 14. Similarly, the second sheet 20 may also include multiple second sheet recesses 25.

[0176] Furthermore, in the above-described embodiment, when the first liquid flow path portion 60 is formed on the second main body surface 30b of the first land portion 33 as shown in FIG. 22 , the width w5′ of the mainstream groove 61 of the first liquid flow path portion 60 in the bent region 7 shown in FIG. 22 may be smaller than the width w5 of the mainstream groove 61 of the first liquid flow path portion 60 in the first region 5 and the second region 6. The same applies to the width w6 of the communication groove 65. In the example shown in FIG. 22 , the second sheet 20 may be located on the inner side of the bend. In this case, the capillary action of the first liquid flow path portion 60 can be enhanced in the bent region 7. This allows the condensed working fluid 2b to move efficiently from the vapor passages 51, 52 to the first liquid flow path portion 60. Furthermore, when the second sheet 20 is pressed from the outside, the collapse of the mainstream groove 61 and the communication groove 65 of the first liquid flow path portion 60 can be suppressed.

[0177] 22, the second sheet 20 may be recessed toward the first liquid flow path section 60 in the curved region 7. The recession of the second sheet 20 in the curved region 7 may be greater than the recession of the second sheet 20 in the first region 5 and the second region 6. The recession of the second sheet 20 in the first region 5 and the second region 6 may be zero. That is, the second sheet 20 does not need to be recessed toward the first liquid flow path section 60 in the first region 5 and the second region 6. In this case, the angle between the second sheet inner surface 20a and the wall surface 62 of the main groove 61 in the curved region 7 can be reduced. Furthermore, the angle between the second sheet inner surface 20a and the wall surface of the communication groove 65 can be reduced. This enhances the capillary action of the first liquid flow path section 60. This allows the condensed working fluid 2b to be transported smoothly toward the evaporation region SR.

[0178] In the above-described embodiment, when the first liquid flow path portion 60 is formed on the first main body surface 30a of the first land portion 33 as shown in FIG. 23 , the width w5″ of the mainstream groove 61 of the first liquid flow path portion 60 in the curved region 7 shown in FIG. 23 may be larger than the width w5 of the mainstream groove 61 of the first liquid flow path portion 60 in the first region 5 and the second region 6. The same applies to the width w6 of the communication groove 65. The depth h1′ of the mainstream groove 61 of the first liquid flow path portion 60 in the curved region 7 shown in FIG. 23 may be smaller than the depth h1 of the mainstream groove 61 of the first liquid flow path portion 60 in the first region 5 and the second region 6. The same applies to the depth of the communication groove 65. In the example shown in FIG. 23 , the second sheet 20 may be located on the inner side of the bend. In this case, the angle formed between the first sheet inner surface 10b and the wall surface 62 of the mainstream groove 61 in the curved region 7 can be made smaller. Furthermore, the angle formed between the first sheet inner surface 10b and the wall surface of the communication groove 65 can be reduced, thereby enhancing the capillary action of the first liquid flow path section 60. As a result, the condensed working fluid 2b can be transported smoothly toward the evaporation region SR.

[0179] 23, the first sheet 10 may be recessed toward the first liquid flow path section 60 in the curved region 7. The recession of the first sheet 10 in the curved region 7 may be greater than the recession of the first sheet 10 in the first region 5 and the second region 6. The recession of the first sheet 10 in the first region 5 and the second region 6 may be zero. That is, the first sheet 10 does not need to be recessed toward the first liquid flow path section 60 in the first region 5 and the second region 6. In this case, the angle between the first sheet inner surface 10b and the wall surface 62 of the main groove 61 in the curved region 7 can be further reduced. Furthermore, the angle between the first sheet inner surface 10b and the wall surface of the communication groove 65 can be further reduced. This enhances the capillary action of the first liquid flow path section 60. This allows the condensed working fluid 2b to be transported more smoothly toward the evaporation region SR.

[0180] 22 and 23, the cross-sectional flow area of ​​the main flow channel grooves 61 in the bending region 7 may be smaller than the cross-sectional flow area of ​​the main flow channel grooves 61 in the first region 5 and the second region 6. The cross-sectional flow area of ​​the communication grooves 65 in the bending region 7 may be smaller than the cross-sectional flow area of ​​the communication grooves 65 in the first region 5 and the second region 6. In this case, the capillary action of the first liquid flow channel section 60 can be enhanced in the bending region 7. As a result, the condensed working fluid 2b can be smoothly transported toward the evaporation region SR.

[0181] In the above-described embodiment, as shown in FIGS. 24 to 26 , when the first liquid flow path portion 60 is formed on the first main body surface 30a of the first land portion 33 and the second liquid flow path portion 70 is formed on the second main body surface 30b of the first land portion 33, a communication path 80 may be provided to connect the first liquid flow path portion 60 and the second liquid flow path portion 70. As shown in FIGS. 25 and 26 , the communication path 80 may extend straight in the Z direction and penetrate the first land portion 33. The communication path 80 may be provided at any position on the first land portion 33. The communication path 80 may be provided at a position overlapping the mainstream groove 61 of the first liquid flow path portion 60 and the mainstream groove 61 of the second liquid flow path portion 70 in a plan view. In this case, the communication path 80 may connect the mainstream groove 61 of the first liquid flow path portion 60 and the mainstream groove 61 of the second liquid flow path portion 70. 24 , the communication passage 80 may be provided at a position overlapping the communication groove 65 of the first liquid flow path section 60 and the communication groove 65 of the second liquid flow path section 70 in a plan view. In this case, the communication passage 80 may connect the communication groove 65 of the first liquid flow path section 60 and the communication groove 65 of the second liquid flow path section 70. By providing the communication passage 80 that communicates the first liquid flow path section 60 and the second liquid flow path section 70 in this manner, even if the flow of the working fluid 2b in one of the first liquid flow path section 60 and the second liquid flow path section 70 becomes difficult due to, for example, a bend, the working fluid 2b can flow through the communication passage 80 to the other liquid flow path section. This allows the working fluid 2b to be smoothly transported toward the evaporation region SR, thereby improving the cooling capacity of the vapor chamber 1.

[0182] 26 may be shorter than the length L1 of the communicating path 80 in the first region 5 and the second region 6 shown in FIG. 25. Here, the lengths L1 and L2 of the communicating path 80 refer to the distance along the communicating path 80, and are the lengths in the Z direction when the communicating path 80 extends straight in the Z direction as shown in FIGS. 25 and 26. In this case, the liquid flow path resistance of the communicating path 80 in the bending region 7 can be reduced. As a result, the condensed working fluid 2b can be efficiently moved via the communicating path 80 from the liquid flow path portion with high capillary action at the flow path corner to the liquid flow path portion with low capillary action at the flow path corner, thereby improving the cooling capacity of the vapor chamber 1.

[0183] Furthermore, in the above-described embodiment, the main body surface recess 82 may be formed at a position on the first land portion 33 where the first liquid flow path portion 60 is not provided. For example, when the first liquid flow path portion 60 is formed on the first main body surface 30a of the first land portion 33, the main body surface recess 82 may be formed on the second main body surface 30b of the first land portion 33. For example, when the first liquid flow path portion 60 is formed on the second main body surface 30b of the first land portion 33, the main body surface recess 82 may be formed on the first main body surface 30a of the first land portion 33. For example, when the first liquid flow path portion 60 is formed on the first main body surface 30a of the first land portion 33 and the second liquid flow path portion 70 is formed on the second main body surface 30b of the first land portion 33, the main body surface recess 82 may be formed at any position on the first main body surface 30a or the second main body surface 30b of the first land portion 33 where the liquid flow path portions 60, 70 are not formed. In the example shown in FIGS. 27 and 28, the main body surface recess 82 is formed in the second main body surface 30b of the first land portion 33.

[0184] The body surface recesses 82 may be formed in a concave shape on the second body surface 30b of the first land portion 33. The body surface recesses 82 may have any planar shape. For example, as shown in FIG. 27, the body surface recesses 82 may be formed in the shape of a small hole having a circular (perfect circle, ellipse, etc.) planar shape. For example, as shown in FIG. 28, the body surface recesses 82 may be formed in the shape of a groove extending in the Y direction. Furthermore, as shown in FIGS. 27 and 28, multiple body surface recesses 82 may be lined up along the Y direction. As shown in FIGS. 27 and 28, the multiple body surface recesses 82 overlap the bending line 8 in a planar view. That is, the multiple body surface recesses 82 are arranged along the bending line BL. In other words, each body surface recess 82 is formed at a position that overlaps the bending line 8 in a planar view.

[0185] The main body surface recess 82 may be formed by etching the wick sheet 30 in the etching step of the method for manufacturing the vapor chamber 1 described above. The main body surface recess 82 is visible from the outside through the first sheet 10 or the second sheet 20 when the vapor chamber 1 is viewed in plan view. Therefore, the main body surface recess 82 functions as a marker for the bending position of the vapor chamber 1 in the bending step of the method for manufacturing the vapor chamber 1 described above. That is, in the bending step, by bending the vapor chamber 1 along the main body surface recess 82, a vapor chamber 1 bent along the bending line 8 can be obtained. Forming the main body surface recess 82 in this manner improves the ease of bending. Furthermore, since the main body surface recess 82 is formed in a pore or groove shape, the vapor chamber 1 can be easily bent. This facilitates the manufacture of a bent vapor chamber 1.

[0186] Furthermore, in the above-described embodiment, an example has been described in which the vapor chamber 1 is bent at a right angle so that the first region 5 and the second region 6 are perpendicular to each other. However, this is not limited to this. For example, as shown in FIG. 29, the vapor chamber 1 may be bent in a U-shape so that the first region 5 and the second region 6 face each other. In the example shown in FIG. 29, the bent region 7 of the vapor chamber 1 is formed in a semicircular arc shape. In this case, the degree of freedom in arranging the vapor chamber 1 within the housing H can be improved. Therefore, for example, even if the heat-generating electronic device E is located away from the housing member Ha that dissipates the heat, the heat from the electronic device E can be transferred to the housing member Ha via the vapor chamber 1.

[0187] In this case, as shown in FIG. 29 , when viewed along a direction parallel to the bending line 8, the thickness direction dimension of the first sheet 10 defined between the first bonding region 13 and the first steam flow path region 14 in the bending region 7 may vary within the bending region 7. Here, the end of the bending region 7 on the side of the first region 5 is referred to as the first bent end 7a, the end of the bending region 7 on the side of the second region 6 is referred to as the second bent end 7c, and the intermediate portion of the bending region 7 between the first bent end 7a and the second bent end 7c is referred to as the intermediate bent portion 7b. In this case, for example, this dimension may increase from the first bent end 7a toward the intermediate bent portion 7b. This dimension may reach a maximum dimension d2 at the intermediate bent portion 7b. Alternatively, this dimension may decrease from the intermediate bent portion 7b toward the second bent end 7c. Similarly, when viewed along a direction parallel to the bend line 8, the dimension in the thickness direction of the second sheet 20 defined between the second bonding region 23 and the second vapor flow path region 24 in the bent region 7 may vary within the bent region 7. For example, this dimension may increase from the first bent end portion 7a toward the bent intermediate portion 7b. This dimension may reach a maximum dimension d4 at the bent intermediate portion 7b. Alternatively, this dimension may decrease from the bent intermediate portion 7b toward the second bent end portion 7c.

[0188] According to the modification shown in FIG. 29, the capillary action of the flow path corner 55 can be enhanced, particularly in the curved intermediate portion 7b of the curved region 7, where the curve is particularly large, and the condensed working fluid 2b can be transported smoothly toward the evaporation region SR. Furthermore, the surface area of ​​the first sheet 10 and the second sheet 20 can be increased in the curved region 7, improving the heat dissipation efficiency of the vapor chamber 1. Furthermore, an increase in the vapor pressure of the working vapor 2a can be suppressed in the curved region 7, and the difference in vapor pressure of the working vapor 2a between the curved region 7 and the first region 5 and the second region 6 can be reduced. Therefore, the working vapor 2a can be transported smoothly, even in the curved intermediate portion 7b, where the curve is particularly large.

[0189] 13 , even when the vapor chamber 1 is bent at a right angle so that the first region 5 and the second region 6 are orthogonal to each other, the thickness dimension of the first sheet 10 defined between the first bonding region 13 and the first vapor flow path region 14 in the bending region 7 may vary within the bending region 7 when viewed along a direction parallel to the bending line 8, as in the example shown in FIG. 29 . For example, this dimension may increase from the first bending end 7a toward the bending intermediate portion 7b. This dimension may reach a maximum dimension d2 at the bending intermediate portion. Furthermore, this dimension may decrease from the bending intermediate portion 7b toward the second bending end 7c. Similarly, the thickness dimension of the second sheet 20 defined between the second bonding region 23 and the second vapor flow path region 24 in the bending region 7 may vary within the bending region 7 when viewed along a direction parallel to the bending line 8. For example, this dimension may increase from the first bending end 7a toward the bending intermediate portion 7b. This dimension may be a maximum dimension d4 at the bent intermediate portion 7b. Alternatively, this dimension may become smaller from the bent intermediate portion 7b toward the second bent end portion 7c. In this case, the same effect as that of the modification shown in Figure 29 can be obtained.

[0190] (Second embodiment) Next, a vapor chamber, an electronic device, and a method for manufacturing a vapor chamber according to a second embodiment of the present disclosure will be described with reference to FIGS.

[0191] The second embodiment shown in Figures 30 to 33 differs mainly in that the vapor chamber is bent along a bending line inclined in the first direction. The other configurations are substantially the same as those of the first embodiment shown in Figures 1 to 29. In Figures 30 to 33, the same parts as those of the first embodiment shown in Figures 1 to 29 are designated by the same reference numerals, and detailed description thereof will be omitted.

[0192] As shown in Fig. 30, the vapor chamber 1 according to this embodiment is bent along a bending line 8 that is inclined in the X direction in a plan view. The bending line 8 shown in Fig. 30 is inclined in both the X direction and the Y direction. The bending line 8 shown in Fig. 30 also extends in a direction that intersects with the X direction in a plan view. In this embodiment, the first region 5, the second region 6, and the bending region 7 may be divided by a boundary line that is inclined in the X direction in a plan view and that is along the bending line 8.

[0193] The flow of steam in one steam passage 51, 52 in the curved region 7 will be described using Figures 31 and 32. Figure 31 is a plan view showing the steam passages 51, 52 in the curved region 7, developed in a plane. Figure 32 is a schematic cross-sectional view showing the steam passages 51, 52 along the lines DD, EE, and FF in Figure 31. The lines DD, EE, and FF are defined at different positions in the Y direction.

[0194] As shown in Figure 32, at position P1 on line DD, the first vapor flow path region 14 and the second vapor flow path region 24 are most recessed. At position P2 on line EE, the first vapor flow path region 14 and the second vapor flow path region 24 are most recessed. At position P3 on line FF, the first vapor flow path region 14 and the second vapor flow path region 24 are most recessed.

[0195] 31 , positions P1, P2, and P3 overlap the bending line 8 in a plan view and are different from one another in the X direction along which the steam passages 51 and 52 extend. This allows the positions P1, P2, and P3 at which the flow path cross-sectional area of ​​the steam passages 51 and 52 is smallest to be shifted in the X direction in each cross section. Therefore, positions at which the flow path resistance of the working steam 2a is high can be dispersed in the flow direction of the working steam 2a, and obstruction of the flow of the working steam 2a at the passage bending portion 57 can be suppressed.

[0196] As described above, according to this embodiment, the vapor chamber 1 is bent along the bending line 8 inclined in the X direction. This makes it possible to prevent the flow of the working vapor 2a from being obstructed in the bending region 7. Therefore, even when the vapor chamber 1 is bent, the heat dissipation efficiency of the vapor chamber 1 can be improved.

[0197] In the above-described embodiment, the frame portion 32 is formed in a rectangular frame shape along the X and Y directions. However, this is not limited to this. For example, as shown in FIG. 33, the frame portion 32 may be inclined with respect to the first land portion 33 extending in the X direction. The frame portion 32 is formed in a rectangular frame shape inclined in both the X and Y directions. The bending line 8 runs along the frame portion 32. The bending line 8 extends in the vertical direction in FIG. 33. Even in this case, the bending line 8 extends in a direction intersecting the X direction in a plan view. In the example shown in FIG. 33, as in the examples shown in FIGS. 30 to 32, the positions where the flow resistance of the working steam 2a is high in each steam passage 51, 52 can be dispersed in the flow direction of the working steam 2a. This prevents the flow of the working steam 2a from being obstructed in the bending region 7.

[0198] (Third embodiment) Next, a vapor chamber, an electronic device, and a method for manufacturing a vapor chamber according to a third embodiment of the present disclosure will be described with reference to FIGS.

[0199] In the third embodiment shown in Figures 34 to 37, the main body sheet includes a plurality of second land portions extending in the second direction, and the main body sheet differs mainly in that the second land portions are located in regions other than the bending region. The other configurations are substantially the same as those of the first embodiment shown in Figures 1 to 29. In Figures 34 to 37, the same parts as those of the first embodiment shown in Figures 1 to 29 are designated by the same reference numerals, and detailed description thereof will be omitted.

[0200] In this embodiment, as shown in Fig. 34, the wick sheet 30 includes a plurality of second lands 37 extending in the Y direction. The second lands 37 are located in each of the first region 5 and the second region 6. A plurality of second lands 37 may be located in each of the first region 5 and the second region 6. The second lands 37 can be configured similarly to the first lands 33.

[0201] The first lands 33 are located in the bending region 7. The first lands 33 may be formed from the first region 5 through the bending region 7 to the second region 6. Each of the first lands 33 is connected to a second land 37 located in the first region 5. In the example shown in FIG. 34 , a plurality of first lands 33 are connected to one second land 37 located in the first region 5. Each of the first lands 33 is connected to a second land 37 located in the second region 6. In the example shown in FIG. 34 , each of the first lands 33 is connected to a corresponding second land 37. In other words, one second land 37 located in the second region 6 is connected to one first land 33.

[0202] In the present embodiment, as shown in FIG. 34 , the steam flow path section 50 may include a third steam passage 58. The third steam passage 58 is formed between the second lands 37 located in the first region 5. The third steam passage 58 extends in the Y direction. A third steam passage 58 extending in the Y direction is also formed between the second lands 37 located in the second region 6. The third steam passage 58 located in the second region 6 communicates with the second steam passage 52 located between the first lands 33. In the example shown in FIG. 34 , a third steam passage 58 extending in the Y direction is also formed in the bending region 7. The third steam passage 58 can be configured in the same manner as the second steam passage 52.

[0203] The first steam passage 51 is formed inside the frame body portion 32 and continuously outside the first land portion 33 and the second land portion 37 .

[0204] In this embodiment, the first liquid flow path portion 60 includes a first land liquid flow path portion 71 formed in the first main body surface 30a of the first land portion 33 and a second land liquid flow path portion 72 formed in the first main body surface 30a of the second land portion 37. The first land liquid flow path portion 71 and the second land liquid flow path portion 72 each include a plurality of mainstream grooves 61 and a plurality of communication grooves 65. The mainstream groove 61 of the first land liquid flow path portion 71 extends in the X direction. The communication groove 65 of the first land liquid flow path portion 71 may extend in the Y direction. The mainstream groove 61 of the second land liquid flow path portion 72 extends in the Y direction. The communication groove 65 of the second land liquid flow path portion 72 may extend in the X direction. The first land liquid flow path portion 71 and the second land liquid flow path portion 72 are in communication with each other so that the working fluid 2b can flow between them. In this way, the working fluid 2b can flow between the first region 5 and the second region 6.

[0205] In this embodiment, the evaporation region SR overlapping the electronic device D is located in each of the first region 5 and the second region 6. The condensation region CR is located in the first region 5. A bending region 7 is formed between the first region 5 and the second region 6. A bending line 8 extends in a direction intersecting the X direction in a plan view. In FIG. 34, the bending line 8 extends in the Y direction. In the bending region 7, the working vapor 2a can pass through the first vapor passage 51, the second vapor passage 52, and the third vapor passage 58, allowing the working vapor 2a to travel between the first region 5 and the second region 6. In the example shown in FIG. 34, the bending line 8 is located in the bending region 7 in a plan view and also overlaps with the third vapor passage 58 extending in the Y direction.

[0206] The working vapor 2a is transported from the evaporation region SR located in the first region 5 to the condensation region CR, and also from the evaporation region SR located in the second region 6 through the bent region 7 to the condensation region CR. A portion of the working fluid 2b condensed in the condensation region CR is transported toward the evaporation region SR by capillary action of the second land liquid flow path portion 72 located in the first region 5. Another portion of the working fluid 2b is transported from the second land liquid flow path portion 72 located in the first region 5 to the evaporation region SR located in the second region 6 via the first land liquid flow path portion 71 and the second land liquid flow path portion 72 located in the second region 6.

[0207] 34, an electronic device D is arranged in the first region 5, and an electronic device D is arranged in the second region 6. This makes it possible to prevent heat from being transferred between the electronic device D in the first region 5 and the electronic device D in the second region 6. This makes it possible to prevent one electronic device D from being thermally damaged by heat generated by the other electronic device D.

[0208] As described above, according to this embodiment, each of the first lands 33 is connected to a second land 37. More specifically, each of the first lands 33 is connected to a second land 37 in the first region 5, and is also connected to a second land 37 in the second region 6. This allows the working fluid 2b to move between the first region 5 and the second region 6. Furthermore, evaporation regions SR, where electronic devices D overlap, can be positioned in each of the first region 5 and the second region 6. This allows heat generated by multiple electronic devices D to be dissipated in a single vapor chamber 1.

[0209] In the above-described embodiment, the bending line 8 is located in the bending region 7 in a plan view and overlaps with the third steam passage 58 extending in the Y direction. However, this is not limited to this. For example, as shown in FIG. 35 , the bending line 8 may overlap with the second land portion 37 located in the bending region 7 in a plan view. Alternatively, as shown in FIG. 36 , the bending line 8 may overlap with the frame body portion 32. In the example shown in FIG. 36 , the frame body portion 32 includes an inward protrusion 32a extending in the Y direction. The bending line 8 may overlap with this inward protrusion 32a. Alternatively, as shown in FIG. 37 , the bending line 8 may overlap with a slit 73 formed between the first region 5 and the second region 6. The slit 73 may be located between the first region 5 and the second region 6, and may be a space where the first sheet 10, the second sheet 20, and the wick sheet 30 are not present.

[0210] (Fourth embodiment) Next, a vapor chamber and an electronic device according to a fourth embodiment of the present disclosure will be described with reference to FIGS.

[0211] In this embodiment, the electronic device E may include multiple devices D. For example, the multiple devices D may include a first device D1 and a second device D2. The first device D1 may be in thermal contact with a first region RR1 of a vapor chamber 101 described later, and the second device D2 may be in thermal contact with a second region RR2 of the vapor chamber 101 described later (see FIGS. 38 to 40).

[0212] The vapor chamber 101 according to this embodiment will be described. The vapor chamber 101 has a sealed space 103 in which working fluids 102a and 102b are sealed, and is configured to effectively cool the device D of the electronic device E described above by repeatedly changing the phase of the working fluids 102a and 102b in the sealed space 103. Examples of the working fluids 102a and 102b include pure water, ethanol, methanol, acetone, etc., and mixtures thereof.

[0213] As shown in FIGS. 38 and 39, the vapor chamber 101 according to this embodiment is a curved vapor chamber 101. Such a vapor chamber 101 can be fabricated, for example, by bending a thin, flat vapor chamber 101 as shown in FIG. 40 along a bending line BL. This curved vapor chamber 101 includes a bending portion BP, a first region RR1, and a second region RR2. In this specification, "bending" is synonymous with "folding," and for example, "bending the vapor chamber 101" means folding the vapor chamber 101.

[0214] The bent portion BP is a bent portion of the first sheet 110, the second sheet 120, and the main body sheet 130 (described later) that constitute the vapor chamber 101. The bent portion BP is formed by bending the vapor chamber 101 along the bend line BL. The bent portion BP is a region having a certain width that includes the bend line BL. The bend angle at the bent portion BP is arbitrary. In the illustrated example, the bend angle is 90° (a right angle). Therefore, as shown in FIG. 39, the cross-sectional shape of the vapor chamber 101 is approximately L-shaped. However, this is not limited thereto. For example, the vapor chamber 101 may be bent in a curved manner so that the cross-sectional shape of the vapor chamber 101 is U-shaped. For example, the vapor chamber 101 may be bent multiple times so that the cross-sectional shape of the vapor chamber 101 is U-shaped.

[0215] The first region RR1 and the second region RR2 are regions separated by a bent portion BP. In the example shown in Fig. 38, the first region RR1 is a region on the vapor chamber 101 located on the positive side of the bent portion BP in the Y direction (the front side in Fig. 38), and the second region RR2 is a region on the vapor chamber 101 located on the positive side of the bent portion BP in the Z direction (the upper side in Fig. 38). In the example shown, the first region RR1 extends on the XY plane, and the second region RR2 extends on the XZ plane. The plane formed by the first region RR1 and the plane formed by the second region RR2 are perpendicular to each other.

[0216] 40, the X direction indicates the direction along the longitudinal direction of the vapor chamber 101 in an unbent state, the Y direction indicates the direction along the lateral direction of the vapor chamber 101, and the Z direction indicates the direction along the thickness direction of the vapor chamber 101. The X direction, the Y direction, and the Z direction are perpendicular to each other.

[0217] 40 to 46, which are diagrams of the vapor chamber 101 in an unbent state, will be used in the following description of the vapor chamber 101 according to this embodiment. Note that in FIGS. 40 to 46, the region on the vapor chamber 101 that becomes the above-mentioned first region RR1 when bent will also be referred to as the first region RR1, and the region on the vapor chamber 101 that becomes the above-mentioned second region RR2 when bent will also be referred to as the second region RR2.

[0218] 39 to 41, vapor chamber 101 includes first sheet 110, second sheet 120, and main body sheet 130 (wick sheet) interposed between first sheet 110 and second sheet 120. In vapor chamber 101 according to the present embodiment, first sheet 110, main body sheet 130, and second sheet 120 are laminated in this order.

[0219] The vapor chamber 101 shown in FIG. 40 is formed in the shape of a thin, flat plate. The planar shape of the vapor chamber 101 is arbitrary, but may be a rectangular shape as shown in FIG. 40. The planar shape of the vapor chamber 101 may be, for example, a rectangle with one side of 10 mm to 200 mm and the other side of 50 mm to 600 mm, or a square with one side of 40 mm to 300 mm, and the planar dimensions are arbitrary. In this embodiment, as an example, an example in which the planar shape of the vapor chamber 101 is a rectangle having a longitudinal direction and a lateral direction will be described. In this case, as shown in FIGS. 42 to 44, the first sheet 110, the second sheet 120, and the main body sheet 130 in an unbent state may also have the same planar shape as the vapor chamber 101 shown in FIG. 40. The planar shape of the vapor chamber 101 is not limited to a rectangular shape and may be any shape, such as a circle, an ellipse, an L-shape, a T-shape, or a U-shape.

[0220] 39 and 40, the vapor chamber 101 has evaporation regions SR1 and SR2 where the working fluids 102a and 102b evaporate, and condensation regions CR1 and CR2 where the working fluids 102a and 102b condense. In this embodiment, the first evaporation region SR1 and the first condensation region CR1 are provided in the first region RR1 of the vapor chamber 101, and the second evaporation region SR2 and the second condensation region CR2 are provided in the second region RR2 of the vapor chamber 101.

[0221] The first evaporation region SR1 is a region overlapping with the first device D1 (in a plan view) when viewed in the thickness direction of the vapor chamber 101 (Z direction in FIG. 39), and is a region where the first device D1 is attached. The first evaporation region SR1 can be provided at any position in the first region RR1 of the vapor chamber 101. In the illustrated example, the first evaporation region SR1 is formed on the positive side of the first region RR1 of the vapor chamber 101 in the X direction (right side in FIG. 40). Heat from the first device D1 is transferred to the first evaporation region SR1, and this heat causes the liquid of the working fluid (appropriately referred to as working liquid 102b) to evaporate in the first evaporation region SR1. The heat from the first device D1 can be transferred not only to the region overlapping with the first device D1 but also to the surrounding area of ​​that region. Therefore, the first evaporation region SR1 can include the region overlapping with the first device D1 and the surrounding area.

[0222] The first condensation region CR1 is a region that does not overlap with the first device D1 when viewed in the thickness direction of the vapor chamber 101 (Z direction in FIG. 39) (in a plan view), and is a region where the gas of the working fluid (appropriately referred to as the working vapor 102a) releases heat and condenses. The first condensation region CR1 can also be said to be a region surrounding the first evaporation region SR1 in the first region RR1. In the illustrated example, the first condensation region CR1 is formed on the negative side of the first region RR1 in the X direction (left side in FIG. 40) of the first region RR1 of the vapor chamber 101. In the first condensation region CR1, heat of the working vapor 102a from the first evaporation region SR1 is released to the first sheet 110, and the working vapor 102a is cooled and condensed in the first condensation region CR1.

[0223] The second evaporation region SR2 is a region overlapping with the second device D2 (in a plan view) when viewed in the thickness direction of the vapor chamber 101 (the Y direction in FIG. 39), and is a region where the second device D2 is attached. The second evaporation region SR2 can be provided at any position in the second region RR2 of the vapor chamber 101. In the illustrated example, the second evaporation region SR2 is formed on the positive side of the second region RR2 of the vapor chamber 101 in the X direction (the right side in FIG. 40). Heat from the second device D2 is transferred to the second evaporation region SR2, and this heat causes the working fluid 102b to evaporate in the second evaporation region SR2. The heat from the second device D2 can be transferred not only to the region overlapping with the second device D2 but also to the surrounding area of ​​that region. Therefore, the second evaporation region SR2 can include the region overlapping with the second device D2 and the surrounding area.

[0224] The second condensation region CR2 is a region that does not overlap with the second device D2 when viewed in the thickness direction of the vapor chamber 101 (Y direction in FIG. 39) (in a plan view), and is a region where the working vapor 102a mainly releases heat and condenses. The second condensation region CR2 can also be said to be a region surrounding the second evaporation region SR2 in the second region RR2. In the illustrated example, the second condensation region CR2 is formed on the negative side of the second region RR2 of the vapor chamber 101 in the X direction (left side in FIG. 40). In the second condensation region CR2, heat of the working vapor 102a from the second evaporation region SR2 is released to the first sheet 110, and the working vapor 2a is cooled and condensed in the second condensation region CR1.

[0225] Here, the plan view refers to the state when the vapor chamber 101 is viewed from a direction perpendicular to the surface that receives heat from the electronic device D and the surface that releases the received heat. That is, it refers to the state when the vapor chamber 101 is viewed from a direction perpendicular to a first sheet outer surface 110a (described later) of the first sheet 110 and a second sheet outer surface 120b (described later) of the second sheet 120. For example, as shown in FIGS. 38 and 39, in the first region RR1 of the bent vapor chamber 101, the state when viewed from the Z direction corresponds to the plan view. In addition, in the second region RR2, the state when viewed from the Y direction corresponds to the plan view.

[0226] As shown in FIG. 41, the first sheet 110 has a first sheet outer surface 110a provided on the side opposite the main body sheet 130, and a first sheet inner surface 110b provided on the side opposite the first sheet outer surface 110a (i.e., the side of the main body sheet 130). The first sheet 110 may be formed to be flat overall, or may have a uniform thickness overall. A housing member Ha that forms part of a housing H of a mobile terminal or the like is attached to the first sheet outer surface 110a (see FIGS. 38 and 39). The entire first sheet outer surface 110a may be covered with the housing member Ha. As shown in FIG. 42, alignment holes 112 may be provided in the four corners of the first sheet 110.

[0227] As shown in FIG. 41, the second sheet 120 has a second sheet inner surface 120a provided on the side of the main body sheet 130 and a second sheet outer surface 120b provided on the opposite side of the second sheet inner surface 120a. The second sheet 120 may be formed to be generally flat, or may have a uniform thickness overall. The above-mentioned devices D1 and D2 are attached to the second sheet outer surface 120b. As shown in FIG. 43, alignment holes 122 may be provided in the four corners of the second sheet 120.

[0228] In the above example, the housing member Ha is attached to the first sheet outer surface 110a of the first sheet 110, and the devices D1 and D2 are attached to the second sheet outer surface 120b of the second sheet 120, but this is not limited to this, and the devices D1 and D2 may be attached to the first sheet outer surface 110a of the first sheet 110, and the housing member Ha may be attached to the second sheet outer surface 120b of the second sheet 120. Furthermore, the housing member Ha and the devices D1 and D2 may be attached to the first sheet outer surface 110a of the first sheet 110, and the housing member Ha and the devices D1 and D2 may be attached to the second sheet outer surface 120b of the second sheet 120.

[0229] 41, the main body sheet 130 includes a sheet body 131 and a steam flow path portion 150 provided in the sheet body 131. The sheet body 131 has a first main body surface 131a and a second main body surface 131b provided on the opposite side to the first main body surface 131a. The first main body surface 131a is provided on the first sheet 110 side, and the second main body surface 131b is provided on the second sheet 120 side.

[0230] The first sheet inner surface 110b of the first sheet 110 and the first main body surface 131a of the sheet main body 131 may be permanently bonded to each other by thermocompression bonding. Similarly, the second sheet inner surface 120a of the second sheet 120 and the second main body surface 131b of the sheet main body 131 may be permanently bonded to each other by thermocompression bonding. An example of bonding by thermocompression bonding is diffusion bonding. However, the first sheet 110, the second sheet 120, and the main body sheet 130 may be bonded by other methods, such as brazing, as long as they are permanently bonded, rather than diffusion bonding. Note that the term "permanently bonded" is not limited to a strict meaning and is used to mean that the first sheet 110 and the main body sheet 130 are bonded to a degree that allows the sealing of the sealed space 103 to be maintained during operation of the vapor chamber 101, and that the second sheet 120 and the main body sheet 130 are bonded to a degree that allows the sealing of the sealed space 103 to be maintained.

[0231] 40 and 44, the sheet main body 131 has a frame portion 132 and a plurality of land portions 133 provided in the frame portion 132. The frame portion 132 and the land portions 133 are not etched in the etching step described below, and the material of the main body sheet 130 remains.

[0232] In the illustrated example, the frame portion 132 is formed in the shape of a rectangular frame when viewed in the thickness direction of the main body sheet 130 (Z direction in FIG. 44). A steam flow path portion 150 is provided inside the frame portion 132. The steam flow path portion 150 accommodates the working fluids 102a and 102b. Each land portion 133 is provided in the steam flow path portion 150, and the working steam 102a flows around each land portion 133. That is, the steam flow path portion 150 includes the above-mentioned multiple lands 133 and steam paths 151 and 152, which are provided around each land portion 133 and are described below as paths through which the working steam 102a flows.

[0233] In the illustrated example, the land portions 133 extend in the X direction (the left-right direction in FIG. 44), and the planar shape of the land portions 133 is an elongated rectangle. The land portions 133 are spaced apart in the Y direction (the up-down direction in FIG. 44) and arranged parallel to one another. The width ww1 of the land portions 133 (see FIG. 45) may be, for example, 100 μm to 3000 μm. Here, the width ww1 of the land portion 133 is the dimension of the land portion 133 in the Y direction, and refers to the dimension in the Z direction at a position where a through portion 134, which will be described later, exists.

[0234] The frame body 132 and each land portion 133 are joined to the first sheet 110 and also to the second sheet 120. A wall surface 153a of the first steam flow path recess 153 and a wall surface 154a of the second steam flow path recess 154, which will be described later, form the side walls of the land portion 133. The first main body surface 131a and the second main body surface 131b of the sheet main body 131 may be formed flat across the frame body 132 and each land portion 133.

[0235] The vapor flow path section 150 is a flow path through which the working vapor 102a mainly passes. The working fluid 102b may also pass through the vapor flow path section 150. As shown in FIGS. 41 and 45, the vapor flow path section 150 may penetrate from the first main body surface 131a to the second main body surface 131b. That is, it may penetrate the sheet main body 131 of the main body sheet 130. The vapor flow path section 150 may be covered by the first sheet 110 on the first main body surface 131a, or may be covered by the second sheet 120 on the second main body surface 131b.

[0236] As shown in FIG. 44 , the steam flow path section 150 has a first steam path 151 and a plurality of second steam paths 152. The steam flow path section 150 is partitioned into the first steam path 151 and a plurality of second steam paths 152 by a plurality of land portions 133. The first steam path 151 is formed between the frame body portion 132 and the land portion 133. The first steam path 151 is formed continuously inside the frame body portion 132 and outside the land portion 133. The first steam path 151 has a rectangular frame shape in plan view. The second steam path 152 is provided between adjacent land portions 133. The second steam path 152 includes a plurality of steam paths 152 a extending in a first direction. In the illustrated example, the first direction is the X direction. That is, each steam path 152 a extends in the X direction. The planar shape of each steam path 152 a is an elongated rectangle. The steam passages 152a are arranged in parallel.

[0237] In the present embodiment, the steam flow path section 150 has the first steam passage 151, but the steam flow path section 150 does not have to have the first steam passage 151. In other words, the frame body section 132 and the land section 133 may be disposed adjacent to each other, and no steam passage may be provided between the frame body section 132 and the land section 133.

[0238] 41 , the first steam passage 151 and the second steam passage 152 may penetrate from the first main body surface 131a to the second main body surface 131b of the sheet main body 131. That is, they may penetrate the sheet main body 131 of the main body sheet 130. The first steam passage 151 and the second steam passage 152 are each formed by a first steam flow path recess 153 provided in the first main body surface 131a and a second steam flow path recess 154 provided in the second main body surface 131b. The first steam flow path recess 153 and the second steam flow path recess 154 are in communication with each other, and the first steam passage 151 and the second steam passage 152 of the steam flow path section 150 are formed to extend from the first main body surface 131a to the second main body surface 131b.

[0239] The first vapor flow path recess 153 is formed in a concave shape on the first main body surface 131a by etching the first main body surface 131a of the main body sheet 130 in an etching step described below. As a result, the first vapor flow path recess 153 has a curved wall surface 153a, as shown in FIG. 45. This wall surface 153a defines the first vapor flow path recess 153, and in the cross section shown in FIG. 45, it curves so as to approach the opposing wall surface 153a as it extends toward the second main body surface 131b. Such a first vapor flow path recess 153 constitutes a part (lower half) of the first steam passage 151 and a part (lower half) of the second steam passage 152.

[0240] The second vapor flow path recess 154 is formed in a concave shape on the second main body surface 131b by etching the second main body surface 131b of the main body sheet 130 in an etching step described below. As a result, the second vapor flow path recess 154 has a curved wall surface 154a, as shown in FIG. 45. This wall surface 154a defines the second vapor flow path recess 154, and in the cross section shown in FIG. 45, it curves so as to approach the opposing wall surface 154a as it extends toward the first main body surface 131a. Such a second vapor flow path recess 154 constitutes a part (upper half) of the first steam passage 151 and a part (upper half) of the second steam passage 152.

[0241] As shown in FIG. 45 , a wall surface 153a of the first steam flow path recess 153 and a wall surface 154a of the second steam flow path recess 154 are connected to form a through-hole 134. The wall surfaces 153a and 154a are each curved toward the through-hole 134. This allows the first steam flow path recess 153 and the second steam flow path recess 154 to communicate with each other. The planar shape of the through-hole 134 in the first steam path 151 may be a rectangular frame like the first steam path 151, and the planar shape of the through-hole 134 in the second steam path 152 may be an elongated rectangular shape like the second steam path 152. The through-hole 134 may be defined by a ridge line formed by the joining of the wall surface 153a of the first steam flow path recess 153 and the wall surface 154a of the second steam flow path recess 154, which juts out inward. The planar area of ​​the steam flow path section 150 is minimized at this through-hole 134. The widths ww2, ww2' of the through portion 134 (see FIG. 45) may be, for example, 100 μm to 3000 μm. Here, the width ww2 of the through portion 134 corresponds to the gap between adjacent land portions 133 in the Y direction. Furthermore, the width ww2' of the through portion 134 corresponds to the gap between the frame portion 132 and the land portion 133 in the Y direction (or X direction).

[0242] The position of the through-hole 134 in the Z direction may be an intermediate position between the first main body surface 131a and the second main body surface 131b, or may be a position shifted downward or upward from the intermediate position. The position of the through-hole 134 is arbitrary as long as the first vapor flow path recess 153 and the second vapor flow path recess 154 are in communication with each other.

[0243] In the illustrated example, the cross-sectional shapes of first steam passage 151 and second steam passage 152 are formed to include through-hole 134 defined by a ridge line formed to protrude inward, but this is not limited to this. For example, the cross-sectional shapes of first steam passage 151 and second steam passage 152 may be trapezoidal, rectangular, or barrel-shaped.

[0244] The steam flow path portion 150 including the first steam path 151 and the second steam path 152 configured in this manner constitutes a part of the above-mentioned sealed space 103. As shown in Fig. 41, the first steam path 151 and the second steam path 152 are defined mainly by the first sheet 110, the second sheet 120, and the frame portion 132 and land portion 133 of the above-mentioned sheet main body 131. Each of the steam paths 151, 152 has a relatively large flow path cross-sectional area so that the working steam 102a can pass through.

[0245] Here, in order to clarify the drawing, Figure 41 shows the first steam passage 151 and the second steam passage 152 etc. enlarged, and the number and arrangement of these steam passages 151, 152 etc. differ from those in Figures 38 to 40 and Figure 44.

[0246] Although not shown, multiple support portions that support the land portion 133 on the frame portion 132 may be provided within the steam channel portion 150. Support portions that support adjacent land portions 133 may also be provided. These support portions may be provided on both sides of the land portion 133 in the X direction or on both sides of the land portion 133 in the Y direction. The support portions may be formed so as not to interfere with the flow of the working steam 102a diffusing through the steam channel portion 150. For example, the support portions may be disposed on one side of the first main body surface 131a or the second main body surface 131b of the sheet main body 131 of the main body sheet 130, with a space forming a steam channel recess formed on the other side. This allows the thickness of the support portions to be thinner than the thickness of the sheet main body 131, preventing the first steam channel 151 and the second steam channel 152 from being separated in the X direction and the Y direction.

[0247] As shown in FIGS. 41, 44, and 45, a liquid flow path portion 160, through which mainly the working liquid 102b passes, is provided on the second main body surface 131b of the sheet main body 131 of the main body sheet 130. More specifically, the liquid flow path portion 160 is provided on the second main body surface 131b of each land portion 133 of the main body sheet 130. The working vapor 102a may also pass through the liquid flow path portion 160. This liquid flow path portion 160 constitutes a part of the sealed space 103 and communicates with the vapor flow path portion 150. The liquid flow path portion 160 is configured as a capillary structure (wick) for transporting the working liquid 102b to the evaporation regions SR1 and SR2. The liquid flow path portion 160 may be formed over the entire second main body surface 131b of each land portion 133. The liquid flow path portion 160 is arranged to extend in the first direction, i.e., the X direction. In the illustrated example, no liquid flow path portion 160 is provided on the first main body surface 131a of each land portion 133 of the sheet main body 131, but a liquid flow path portion 160 may be provided on the second main body surface 131b of the land portion 133 of the sheet main body 131.

[0248] 46, the liquid flow path section 160 is composed of a plurality of grooves provided in the second main body surface 131b. More specifically, the liquid flow path section 160 has a plurality of liquid flow path main grooves 161 through which the working fluid 102b passes, and a plurality of liquid flow path communication grooves 165 that communicate with the liquid flow path main grooves 161.

[0249] As shown in Fig. 46, each liquid flow path mainstream groove 161 is formed to extend in the X direction. The liquid flow path mainstream groove 161 has a flow path cross-sectional area smaller than the first vapor passage 151 or the second vapor passage 152 of the vapor flow path section 150 so that the working liquid 102b flows mainly by capillary action. As a result, the liquid flow path mainstream groove 161 is configured to transport the working liquid 102b condensed from the working vapor 102a to the evaporation regions SR1, SR2. The liquid flow path mainstream grooves 161 may be arranged spaced apart in the Y direction.

[0250] The liquid flow path main groove 161 is formed by etching from the second main body surface 131b of the sheet main body 131 of the main body sheet 130 in an etching step described below. As a result, the liquid flow path main groove 161 has a wall surface 162 formed in a curved shape, as shown in Fig. 45. This wall surface 162 defines the liquid flow path main groove 161, and is curved concavely toward the first main body surface 131a.

[0251] The width ww3 (dimension in the Y direction) of the liquid flow path mainstream groove 161 shown in Figures 45 and 46 may be, for example, 5 µm to 150 µm. Note that the width ww3 of the liquid flow path mainstream groove 161 refers to the dimension at the second main body surface 131b. The depth hh1 (dimension in the Z direction) of the liquid flow path mainstream groove 161 shown in Figure 45 may be, for example, 3 µm to 150 µm.

[0252] As shown in FIG. 46 , each liquid flow path communication groove 165 extends in a direction different from the X direction. In the illustrated example, each liquid flow path communication groove 165 is formed to extend in the Y direction, perpendicular to the liquid flow path mainstream grooves 161. Some liquid flow path communication grooves 165 are arranged to connect adjacent liquid flow path mainstream grooves 161 to each other. Other liquid flow path communication grooves 165 are arranged to connect the vapor flow path section 150 (first vapor passage 151 or second vapor passage 152) to the liquid flow path mainstream groove 161. In other words, the liquid flow path communication groove 165 extends from the edge of the land portion 133 in the Y direction to the liquid flow path mainstream groove 161 adjacent to that edge. In this way, the first vapor passage 151 or second vapor passage 152 of the vapor flow path section 150 and the liquid flow path mainstream groove 161 are connected to each other.

[0253] The liquid flow path communication groove 165 has a flow path cross-sectional area smaller than the first vapor path 151 or the second vapor path 152 of the vapor flow path section 150 so that the working liquid 102b flows mainly by capillary action. The liquid flow path communication grooves 165 may be arranged spaced apart in the X direction.

[0254] Like the liquid flow path mainstream groove 161, the liquid flow path connecting groove 165 is also formed by etching, and has wall surfaces (not shown) that are formed in a curved shape similar to that of the liquid flow path mainstream groove 161. The width ww4 (dimension in the X direction) of the liquid flow path connecting groove 165 shown in Fig. 46 may be equal to the width ww3 of the liquid flow path mainstream groove 161, or may be greater or smaller than the width ww3. The depth of the liquid flow path connecting groove 165 may be equal to the depth hh1 of the liquid flow path mainstream groove 161, or may be greater or shallower than the depth hh1.

[0255] As shown in FIG. 46 , the liquid flow path section 160 has a liquid flow path convex section row 163 provided on the second main body surface 131b of the sheet main body 131. The liquid flow path convex section row 163 is provided between adjacent liquid flow path main grooves 161. Each liquid flow path convex section row 163 includes a plurality of liquid flow path convex sections 164 arranged in the X direction. The liquid flow path convex sections 164 are provided within the liquid flow path section 160 and abut against the second sheet 120. Each liquid flow path convex section 164 is formed in a rectangular shape with the X direction as its longitudinal direction in plan view. A liquid flow path main groove 161 is interposed between adjacent liquid flow path convex sections 164 in the Y direction, and a liquid flow path communication groove 165 is interposed between adjacent liquid flow path convex sections 164 in the X direction. The liquid flow path communication groove 165 is formed to extend in the Y direction and connects adjacent liquid flow path main grooves 161 in the Y direction. This allows the hydraulic fluid 102b to move between these liquid flow path main grooves 161.

[0256] The liquid flow path convex portion 164 is a portion that is not etched in the etching step described below, and remains as the material of the main body sheet 130. In the example shown in Fig. 46, the planar shape of the liquid flow path convex portion 164 (the shape at the position of the second main body surface 131b of the sheet main body 131 of the main body sheet 130) is rectangular.

[0257] In the example shown in FIG. 46, the liquid flow path convex portions 164 are arranged in a staggered pattern. More specifically, the liquid flow path convex portions 164 of liquid flow path convex portion rows 163 adjacent to each other in the Y direction are arranged with a mutual offset in the X direction. This offset may be half the arrangement pitch of the liquid flow path convex portions 164 in the X direction. The width ww5 (dimension in the Y direction) of the liquid flow path convex portions 164 may be, for example, 5 μm to 500 μm. Note that the width ww5 of the liquid flow path convex portion 164 refers to the dimension on the second main body surface 131b. Note that the arrangement of the liquid flow path convex portions 164 is not limited to a staggered pattern and may be arranged in parallel. In this case, the liquid flow path convex portions 164 of the liquid flow path convex portion rows 163 adjacent to each other in the Y direction are also aligned in the X direction.

[0258] The liquid flow path main groove 161 includes a liquid flow path intersection 166 that communicates with the liquid flow path communication groove 165. At the liquid flow path intersection 166, the liquid flow path main groove 161 and the liquid flow path communication groove 165 communicate in a T-shape. This makes it possible to prevent the liquid flow path communication groove 165 on the other side (for example, the lower side in FIG. 46) from communicating with the liquid flow path main groove 161 at the liquid flow path intersection 166, where one liquid flow path main groove 161 communicates with the liquid flow path communication groove 165 on one side (for example, the upper side in FIG. 46). This prevents the wall surface 162 of the liquid flow path main groove 161 from being cut out on both sides (the upper and lower sides in FIG. 46) at the liquid flow path intersection 166, leaving one side of the wall surface 162 intact. Therefore, even at the liquid flow path intersection 166, capillary action can be imparted to the working fluid in the liquid flow path main groove 161, and the propulsion force of the working fluid 102b toward the evaporation region SR can be prevented from decreasing at the liquid flow path intersection 166.

[0259] As shown in Fig. 44, alignment holes 135 may be provided at the four corners of a sheet main body 131 of a main body sheet 130. In the example shown in Fig. 44, the planar shape of the alignment holes 135 is circular, but this is not limited to this. The alignment holes 135 may penetrate the sheet main body 131 of the main body sheet 130.

[0260] 40, the vapor chamber 101 may include an injection part 104 provided at the edge on the negative side in the X direction (the left side in FIG. 40) for injecting the working liquid 102b into the sealed space 103. In the example shown in FIG. 40, the injection part 104 is disposed on the side of the condensation regions CR1 and CR2. The injection part 104 may have an injection flow path 137 formed in the main body sheet 130. After the working liquid 102b is injected, the injection flow path 137 may be sealed.

[0261] As described above, vapor chamber 101 according to this embodiment is bent along bending line BL (see FIGS. 38 and 39). This bending line BL extends in a direction parallel to the first direction, which is the direction in which vapor passage 152a described above extends. Therefore, vapor chamber 101 is bent in a direction parallel to the first direction. As described above, in this embodiment, the first direction is the X direction. As shown in FIG. 39, vapor chamber 101 may be bent so that first sheet 110 is located on the outside of the bend and second sheet 120 is located on the inside of the bend.

[0262] Furthermore, vapor chamber 101 may be bent at the position where vapor passage 152a is disposed. That is, vapor chamber 101 may be bent so as to fit along vapor passage 152a.

[0263] At the bend portion BP, the flow path cross-sectional area of ​​the steam passage 152a may be narrowed. For example, as shown in Fig. 39, at the bend portion BP, the first sheet inner surface 110b of the first sheet 110 and the second sheet inner surface 120a of the second sheet 120 come into contact with each other, thereby narrowing the flow path cross-sectional area of ​​the steam passage 152a. This suppresses the movement of the working steam 102a between the first region RR1 and the second region RR2.

[0264] When the vapor chamber 101 is bent, the first sheet 110 receives tensile stress at the bent portion BP and deforms so as to be recessed inward (toward the second sheet 120). Also, the second sheet 120 receives compressive stress at the bent portion BP and deforms so as to be recessed inward (toward the first sheet 110). As a result, when the vapor chamber 101 is bent, as shown in FIG. 39, the first sheet inner surface 110b of the first sheet 110 and the second sheet inner surface 120a of the second sheet 120 come into contact with each other, which may narrow the flow path cross-sectional area of ​​the vapor passage 152a.

[0265] In the illustrated example, the first sheet inner surface 110b of the first sheet 110 and the second sheet inner surface 120a of the second sheet 120 are in contact with each other, but this is not limited thereto, and the first sheet inner surface 110b of the first sheet 110 and the second sheet inner surface 120a of the second sheet 120 may not be in contact with each other at the bent portion BP, and a gap may be provided between the first sheet inner surface 110b and the second sheet inner surface 120a. Even in such a case, the flow path cross-sectional area of ​​the steam passage 152a is narrowed at the bent portion BP, thereby suppressing the movement of the working steam 102a between the first region RR1 and the second region RR2.

[0266] The materials constituting the first sheet 110, the second sheet 120, and the main body sheet 130 are not particularly limited as long as they have good thermal conductivity. However, the first sheet 110, the second sheet 120, and the main body sheet 130 may contain, for example, copper or a copper alloy. In this case, the thermal conductivity of each sheet 110, 120, and 130 can be increased, thereby improving the heat dissipation efficiency of the vapor chamber 101. Furthermore, when pure water is used as the working fluid 102a, 102b, corrosion can be prevented. However, other metal materials such as aluminum or titanium, or other metal alloy materials such as stainless steel can also be used for these sheets 110, 120, and 130 as long as the desired heat dissipation efficiency and corrosion prevention can be achieved.

[0267] 41 may be, for example, 100 μm to 1000 μm. By making the thickness tt1 of the vapor chamber 101 100 μm or more, the vapor channel portion 150 can be properly secured, and the vapor chamber 101 can function properly. On the other hand, by making the thickness tt1 of the vapor chamber 101 1000 μm or less, the vapor chamber 101 can be prevented from becoming too thick.

[0268] The thickness tt2 of the first sheet 110 shown in FIG. 41 may be, for example, 6 μm to 100 μm. By setting the thickness tt2 of the first sheet 110 to 6 μm or more, the mechanical strength of the first sheet 110 can be ensured. On the other hand, by setting the thickness tt2 of the first sheet 110 to 100 μm or less, an increase in the thickness tt1 of the vapor chamber 101 can be prevented. Similarly, the thickness tt3 of the second sheet 120 shown in FIG. 41 may be set to the same as the thickness tt2 of the first sheet 110. The thickness tt3 of the second sheet 120 and the thickness tt2 of the first sheet 110 may be different.

[0269] 41 may be, for example, 50 μm to 400 μm. By making the thickness tt4 of the main body sheet 130 50 μm or more, the vapor channel portion 150 can be properly secured, and the vapor chamber 101 can be properly operated. On the other hand, by making the thickness tt4 of the main body sheet 130 400 μm or less, the thickness tt1 of the vapor chamber 101 can be prevented from becoming too thick.

[0270] Next, a method for manufacturing the vapor chamber 101 having such a configuration will be described with reference to FIGS.

[0271] Here, we will first explain the sheet preparation process for preparing each of the sheets 110, 120, and 130. This sheet preparation process includes a first sheet preparation process for preparing the first sheet 110, a second sheet preparation process for preparing the second sheet 120, and a main sheet preparation process for preparing the main sheet 130.

[0272] In the first sheet preparation step, first, a first sheet base material having a desired thickness is prepared. The first sheet base material may be a rolled material. Next, the first sheet base material is etched to form a first sheet 110 having a desired planar shape. Alternatively, the first sheet base material may be press-processed to form the first sheet 110 having the desired planar shape. In this manner, a first sheet 110 having an outer contour shape such as that shown in FIG. 42 can be prepared.

[0273] In the second sheet preparation step, similar to the first sheet preparation step, a second sheet base material having a desired thickness is first prepared. The second sheet base material may be a rolled material. Subsequently, the second sheet base material is etched to form the second sheet 120 having the desired planar shape. Alternatively, the second sheet base material may be press-formed to form the second sheet 120 having the desired planar shape. In this manner, a second sheet 120 having an outer contour shape as shown in FIG. 43 can be prepared.

[0274] The main body sheet preparation step includes a material sheet preparation step of preparing a metal material sheet M, and an etching step of etching the metal material sheet M.

[0275] First, in the material sheet preparation step, a flat metal material sheet M including a first material surface Ma and a second material surface Mb is prepared as shown in Fig. 47. The metal material sheet M may be a rolled material having a desired thickness.

[0276] Next, in the etching step, as shown in FIG. 48, the metal material sheet M is etched from the first material surface Ma and the second material surface Mb to form the vapor channel portion 150 and the liquid channel portion 160.

[0277] More specifically, a patterned resist film (not shown) is formed on the first material surface Ma and the second material surface Mb of the metal material sheet M by photolithography. The pattern of this resist film includes the patterns of the vapor flow path portion 150 and the liquid flow path portion 160 described above. Next, the first material surface Ma and the second material surface Mb of the metal material sheet M are etched through the openings in the patterned resist film. As a result, the first material surface Ma and the second material surface Mb of the metal material sheet M are etched in the pattern, forming the vapor flow path portion 150 and the liquid flow path portion 160 as shown in FIG. 48. Note that the etching solution may be, for example, an iron chloride-based etching solution such as a ferric chloride aqueous solution, or a copper chloride-based etching solution such as a copper chloride aqueous solution.

[0278] In the etching process, the first material surface Ma and the second material surface Mb of the metal material sheet M may be etched simultaneously. However, this is not limited to this, and the etching of the first material surface Ma and the second material surface Mb may be performed in separate processes. Furthermore, the vapor flow path portion 150 and the liquid flow path portion 160 may be formed by etching simultaneously, or may be formed in separate processes.

[0279] In the etching step, the first material surface Ma and the second material surface Mb of the metal material sheet M are etched to obtain a predetermined outer contour shape as shown in Fig. 44. That is, a main body sheet 130 having an outer peripheral edge as shown in Fig. 44 can be obtained.

[0280] In this manner, a main body sheet 130 as shown in FIG. 44 can be prepared.

[0281] After the preparation step, the first sheet 110, the second sheet 120, and the main body sheet 130 are joined together as shown in FIG.

[0282] More specifically, first, the first sheet 110, the second sheet 120, and the main body sheet 130 are laminated in this order. In this case, the first main body surface 131a of the main body sheet 130 is superimposed on the first sheet inner surface 110b of the first sheet 110, and the second sheet inner surface 120a of the second sheet 120 is superimposed on the second main body surface 131b of the main body sheet 130. At this time, the alignment holes 112 of the first sheet 110, the alignment holes 135 of the main body sheet 130, and the alignment holes 122 of the second sheet 120 may be used to align the sheets 110, 120, and 130.

[0283] Next, the first sheet 110, the second sheet 120, and the main body sheet 130 are temporarily joined together. For example, these sheets 110, 120, and 130 may be temporarily joined together by spot resistance welding, or by laser welding.

[0284] Next, the first sheet 110, the second sheet 120, and the main body sheet 130 are permanently bonded together by thermocompression bonding. For example, these sheets 110, 120, and 130 may be permanently bonded together by diffusion bonding. As a result, a sealed space 103 having a vapor flow path portion 150 and a liquid flow path portion 160 is formed between the first sheet 110 and the second sheet 120. At this stage, the injection flow path 137 described above is not sealed in the sealed space 103, and the sealed space 103 is in communication with the outside via the injection flow path 137.

[0285] After the joining step, the hydraulic fluid 102b is injected into the sealed space 103 from the injection flow path 137 of the injection section 104 as an injection step.

[0286] After the injection step, the injection flow path 137 is sealed in the sealing step. This blocks communication between the sealed space 103 and the outside, sealing the sealed space 103. This makes it possible to obtain the sealed space 103 filled with the working fluid 102b, and to prevent the working fluid 102b in the sealed space 103 from leaking to the outside.

[0287] In this way, a thin, flat vapor chamber 101 filled with working liquid 102b can be obtained as shown in FIG.

[0288] After the sealing process, as shown in FIG. 50 , in the bending process, the first sheet 110, the second sheet 120, and the main body sheet 130 are bent along the bending line BL, i.e., along a direction parallel to the first direction in which the vapor passage 152a extends. This forms a first region RR1 and a second region RR2 in the vapor chamber 101, separated by a bending portion BP. The vapor chamber 101 is bent at the position where the vapor passage 152a is disposed. As a result, when the vapor chamber 101 is bent, the first sheet 110 receives tensile stress at the bending portion BP and deforms so as to be recessed inward, while the second sheet 120 receives compressive stress at the bending portion BP and deforms so as to be recessed inward. Therefore, the first sheet inner surface 110b of the first sheet 110 and the second sheet inner surface 120a of the second sheet 120 come into contact at the bending portion BP, narrowing the flow path cross-sectional area of ​​the second vapor passage 152. As a result, the flow of the working steam 102a between the first region RR1 and the second region RR2 is suppressed.

[0289] In this manner, a curved vapor chamber 101 as shown in FIGS. 38 and 39 can be obtained.

[0290] Next, the operation method of the vapor chamber 101, that is, the cooling method of the device D, will be described.

[0291] The vapor chamber 101 obtained as described above is installed in a housing H of a mobile terminal or the like. Here, the first sheet outer surface 110a of the first sheet 110 is covered with a housing member Ha, and devices D1 and D2, such as a CPU, which are devices to be cooled, are attached to the second sheet outer surface 120b of the second sheet 120. The first device D1 is attached to a first region RR1 of the vapor chamber 101, and the second device D2 is attached to a second region RR2 of the vapor chamber 101. Due to its surface tension, the working fluid 102b in the sealed space 103 adheres to the wall surfaces of the sealed space 103, i.e., the wall surface 153a of the first vapor flow path recess 153, the wall surface 154a of the second vapor flow path recess 154, the wall surface 162 of the liquid flow path main groove 161 of the liquid flow path section 160, and the wall surface of the liquid flow path connecting groove 165. The working fluid 102b may also adhere to a portion of the first sheet inner surface 110b of the first sheet 110 that is exposed to the first vapor flow path recess 153. Furthermore, the working fluid 102b may also adhere to a portion of the second sheet inner surface 120a of the second sheet 120 that is exposed to the second vapor flow path recess 154, the liquid flow path main groove 161, and the liquid flow path connecting groove 165.

[0292] In this state, when the first device D1 generates heat, the working fluid 102b present in the first evaporation region SR1 (see FIG. 44) receives heat from the first device D1. The received heat is absorbed as latent heat, and the working fluid 102b evaporates (vaporizes), generating working vapor 102a. Most of the generated working vapor 102a diffuses within the first vapor flow path recess 153 and the second vapor flow path recess 154 that form the sealed space 103 (see the solid arrows in FIG. 44). The working vapor 102a in each vapor flow path recess 153, 154 leaves the first evaporation region SR1, and most of the working vapor 102a is transported to the first condensation region CR1 (the left portion in FIG. 44), which has a relatively low temperature. In the first condensation region CR1, the working vapor 102a is cooled mainly by dissipating heat to the first sheet 110. The heat received by the first sheet 110 from the working steam 102a is transferred to the outside air via the housing member Ha (see FIG. 39).

[0293] In the first condensation region CR1, the working vapor 102a radiates heat to the first sheet 110, thereby losing the latent heat absorbed in the first evaporation region SR1 and condensing to produce working liquid 102b. The produced working liquid 102b adheres to the wall surfaces 153a, 154a of the vapor flow path recesses 153, 154, the first sheet inner surface 110b of the first sheet 110, and the second sheet inner surface 120a of the second sheet 120. Since the working liquid 102b continues to evaporate in the first evaporation region SR1, the working liquid 102b in the first condensation region CR1 is transported toward the first evaporation region SR1 by capillary action of the liquid flow path mainstream grooves 161 (see the dashed arrows in FIG. 44). As a result, the working fluid 102b adhering to each of the wall surfaces 153a, 154a, the first sheet inner surface 110b, and the second sheet inner surface 120a moves to the liquid flow path section 160, passes through the liquid flow path connecting groove 165, and enters the liquid flow path main groove 161. In this way, the working fluid 102b is filled into each of the liquid flow path main grooves 161 and each of the liquid flow path connecting grooves 165. Therefore, the filled working fluid 102b obtains a driving force toward the first evaporation region SR1 due to the capillary action of each of the liquid flow path main grooves 161, and is smoothly transported toward the first evaporation region SR1.

[0294] In the liquid flow path section 160, each liquid flow path mainstream groove 161 communicates with another adjacent liquid flow path mainstream groove 161 via a corresponding liquid flow path connection groove 165. This allows the working fluid 102b to flow between adjacent liquid flow path mainstream grooves 161, preventing dryout in the liquid flow path mainstream grooves 161. As a result, capillary action is imparted to the working fluid 102b in each liquid flow path mainstream groove 161, and the working fluid 102b is smoothly transported toward the first evaporation region SR1.

[0295] The working fluid 102b that reaches the first evaporation region SR1 receives heat from the first device D1 and evaporates again. The working vapor 102a that evaporates from the working fluid 102b passes through the liquid flow path connecting groove 165 in the first evaporation region SR1, moves to the first vapor flow path recess 153 and the second vapor flow path recess 154, which have large flow path cross-sectional areas, and diffuses within each of the vapor flow path recesses 153, 154. In this way, the working fluids 102a, 102b circulate within the sealed space 103 while repeatedly undergoing phase changes, i.e., evaporation and condensation, transporting and releasing heat from the first device D1. As a result, the first device D1 is cooled.

[0296] Similarly, when the second device D2 generates heat, the working fluid 102b present in the second evaporation region SR2 (see FIG. 44) receives heat from the second device D2. The received heat is absorbed as latent heat, and the working fluid 102b evaporates (vaporizes), generating working vapor 102a. Most of the generated working vapor 102a diffuses within the first vapor flow path recess 153 and the second vapor flow path recess 154 that form the sealed space 103 (see the solid arrows in FIG. 44). The working vapor 102a in each vapor flow path recess 153, 154 leaves the second evaporation region SR2, and most of the working vapor 102a is transported to the second condensation region CR2 (the left portion in FIG. 44), which has a relatively low temperature. In the first condensation region CR2, the working vapor 102a is cooled mainly by dissipating heat to the first sheet 110. The heat received by the first sheet 110 from the working steam 102a is transferred to the outside air via the housing member Ha (see FIG. 39).

[0297] In the second condensation region CR2, the working vapor 102a radiates heat to the first sheet 110, thereby losing the latent heat it absorbed in the second evaporation region SR2 and condensing to produce working liquid 102b. The produced working liquid 102b adheres to the wall surfaces 153a, 154a of the vapor flow path recesses 153, 154, the first sheet inner surface 110b of the first sheet 110, and the second sheet inner surface 120a of the second sheet 120. Since the working liquid 102b continues to evaporate in the second evaporation region SR2, the working liquid 102b in the second condensation region CR2 is transported toward the second evaporation region SR2 by the capillary action of the liquid flow path mainstream grooves 161 (see the dashed arrows in FIG. 44). As a result, the working fluid 102b adhering to each of the wall surfaces 153a, 154a, the first sheet inner surface 110b, and the second sheet inner surface 120a moves to the liquid flow path section 160, passes through the liquid flow path connecting groove 165, and enters the liquid flow path main groove 161. In this way, the working fluid 102b is filled into each of the liquid flow path main grooves 161 and each of the liquid flow path connecting grooves 165. Therefore, the filled working fluid 102b obtains a driving force toward the second evaporation region SR2 due to the capillary action of each of the liquid flow path main grooves 161, and is smoothly transported toward the second evaporation region SR2.

[0298] In the liquid flow path section 160, each liquid flow path mainstream groove 161 communicates with another adjacent liquid flow path mainstream groove 161 via a corresponding liquid flow path connection groove 165. This allows the working fluid 102b to flow back and forth between adjacent liquid flow path mainstream grooves 161, preventing dryout in the liquid flow path mainstream grooves 161. This imparts capillary action to the working fluid 102b in each liquid flow path mainstream groove 161, allowing the working fluid 102b to be smoothly transported toward the second evaporation region SR2.

[0299] The working fluid 102b that reaches the second evaporation region SR2 receives heat from the second device D2 and evaporates again. The working vapor 102a that evaporates from the working fluid 102b passes through the liquid flow path connecting groove 165 in the second evaporation region SR2, moves to the first vapor flow path recess 153 and the second vapor flow path recess 154, which have large flow path cross-sectional areas, and diffuses within each of the vapor flow path recesses 153, 154. In this way, the working fluids 102a, 102b circulate within the sealed space 103 while repeatedly undergoing phase changes, i.e., evaporation and condensation, transporting and releasing heat from the second device D2. As a result, the second device D2 is cooled.

[0300] In this embodiment, the vapor chamber 101 is bent in a direction parallel to the first direction, which is the direction in which the vapor passage 152a extends. As described above, the bent portion BP suppresses the movement of the working vapor 102a between the first region RR1 and the second region RR2. Therefore, in the bent vapor chamber 101, heat transfer via the bent portion BP can be suppressed. As a result, one vapor chamber 101 can have the functions of multiple vapor chambers (two vapor chambers in this embodiment).

[0301] For example, when the first device D1 is operating and generating heat, and the second device D2 is not operating and generating heat, the working steam 102a that has received heat from the first device D1 can be prevented from moving from the first region RR1 to the second region RR2 and transferring heat to the second device D2. Furthermore, when the first device D1 generates a large amount of heat and the second device D2 generates a small amount of heat, the working steam 102a that has received heat from the first device D1 can be prevented from moving from the first region RR1 to the second region RR2 and transferring heat to the second device D2. The heat resistance temperature of each device D varies depending on its type. Therefore, for example, when the heat resistance temperature of the second device D2 is lower than that of the first device D1, the heat from the first device D1 can be prevented from being transferred to the second device D2, which could result in thermal damage to the second device D2.

[0302] As described above, according to this embodiment, the vapor chamber 101 is bent in a direction parallel to the first direction. This makes it possible to suppress the flow of the working vapor 102a between the first region RR1 and the second region RR2 at the bent portion BP. Therefore, in the bent vapor chamber 101, it is possible to suppress heat transfer through the bent portion BP.

[0303] Furthermore, according to this embodiment, one vapor chamber 101 can have the functions of multiple vapor chambers 101. Therefore, the manufacturing cost of the vapor chamber 101 can be reduced compared to when multiple vapor chambers 101 are manufactured.

[0304] Furthermore, according to this embodiment, since the vapor chamber 101 is bent in a direction parallel to the first direction, it is possible to prevent the bent portion BP from intersecting with the vapor passage 152a. This makes it possible to suppress an increase in pressure loss of the working vapor 102a in the vapor passage 152a in each of the regions RR1 and RR2. As a result, it is possible to suppress a decrease in the heat transport capacity of the vapor chamber 101.

[0305] Furthermore, according to this embodiment, the vapor chamber 101 is bent at the position where the vapor passage 152a is disposed. This increases the pressure loss of the working vapor 102a in the vapor passage 152a at the bent portion BP. This further reduces the movement of the working vapor 102a between the first region RR1 and the second region RR2 at the bent portion BP. As a result, heat transfer through the bent portion BP can be further reduced.

[0306] Furthermore, according to the present embodiment, vapor chamber 101 is bent at the position where vapor passage 152a is disposed, and thus vapor chamber 101 can be easily bent in the bending process of vapor chamber 101. Therefore, it is possible to easily manufacture bent vapor chamber 101.

[0307] In the fourth embodiment described above, an example has been described in which the liquid flow path portion 160 is provided on the second main body surface 131b of the land portion 133, and the liquid flow path portion 160 is not provided on the first main body surface 131a of the land portion 133. However, this is not limiting, and as shown in Fig. 51, the liquid flow path portion 160 may not be provided on the second main body surface 131b of the land portion 133, and the liquid flow path portion 160 may be provided on the first main body surface 131a of the land portion 133.

[0308] 52, a liquid flow path portion 160 may be provided on the second main body surface 131b of the land portion 133, and a liquid flow path portion 160 may also be provided on the first main body surface 131a of the land portion 133. In this case, the liquid flow path portion 160 provided on the first main body surface 131a and the liquid flow path portion 160 provided on the second main body surface 131b may have the same configuration or may have different configurations. For example, as shown in FIG. 52, the flow path cross-sectional area of ​​the liquid flow path portion 160 provided on the first main body surface 131a may be larger than the flow path cross-sectional area of ​​the liquid flow path portion 160 provided on the second main body surface 131b. The liquid flow path portion 160 provided on the first main body surface 131a may function as a liquid storage portion while the electronic device D stops generating heat.

[0309] In the fourth embodiment, as shown in FIG. 53 , the height hh2 of the steam passage 152a may be smaller than the width ww1 of the land portion 133 at the bend portion BP. Here, the height hh2 of the steam passage 152a refers to the minimum dimension of the steam passage 152a in the Z direction and corresponds to the minimum distance between the first seat inner surface 110b and the second seat inner surface 120a in the Z direction. The width ww1 of the land portion 133 refers to the dimension of the land portion 133 in the Y direction and refers to the dimension at the position where the through-hole 134 is located in the Z direction. In this case, when the vapor chamber 101 is bent along the bend line BL, the gap between the first seat inner surface 110b and the second seat inner surface 120a at the bend portion BP can be further reduced, thereby further narrowing the flow path cross-sectional area of ​​the steam passage 152a. This further increases the pressure loss of the working steam 102a in the steam passage 152a at the bend portion BP. Therefore, at the bent portion BP, the movement of the working steam 102a between the first region RR1 and the second region RR2 can be further suppressed, and heat transfer via the bent portion BP can be further suppressed.

[0310] Furthermore, in the fourth embodiment described above, as shown in FIG. 54, the width ww2a of the steam passage 152a where the bending line BL is located may be larger than the width ww2b of the steam passage 152a where the bending line BL is not located. Here, the widths ww2a and ww2b of the steam passage 152a refer to the dimensions of the steam passage 152a in the Y direction, i.e., the dimensions at the positions where the through-holes 134 are located in the Z direction. The widths ww2a and ww2b of the steam passage 152a correspond to the gaps between adjacent land portions 133 in the Y direction. In this case, when the vapor chamber 101 is bent along the bending line BL, the gap between the first sheet inner surface 110b and the second sheet inner surface 120a at the bending portion BP can be further reduced, thereby further narrowing the flow path cross-sectional area of ​​the steam passage 152a. This further increases the pressure loss of the working steam 102a in the steam passage 152a at the bending portion BP. Therefore, at the bent portion BP, the movement of the working steam 102a between the first region RR1 and the second region RR2 can be further suppressed, and heat transfer via the bent portion BP can be further suppressed.

[0311] In the fourth embodiment, as shown in FIG. 55, a communication groove 136 may be provided in a land portion 133 adjacent to the vapor passage 152a where the bent line BL is located, connecting the vapor passage 152a where the bent line BL is located to the vapor passage 152a where the bent line BL is not located. In this case, the working fluid 102a can be diffused from the unbent vapor passage 152a to the bent vapor passage 152a, and the bent vapor passage 152a can be effectively used as a vapor passage. Furthermore, while the electronic device D is not generating heat, the communication groove 136 can store the working fluid 102b by capillary force. Furthermore, the communication groove 136 may be provided continuously in the X direction, or may be provided partially and discretely in the X direction. In this case, the above-mentioned effects can be obtained while suppressing a decrease in the mechanical strength of the vapor chamber 101.

[0312] Furthermore, in the fourth embodiment described above, as shown in FIG. 56 , the width ww6a of the opening of the steam passage 152a where the bend line BL is located may be larger than the width ww6b of the steam passage 152a where the bend line BL is not located. Here, the widths ww6a and ww6b of the opening of the steam passage 152a refer to the dimensions of the opening of the steam passage 152a in the Y direction, and refer to the dimensions on the first body surface 131a or the second body surface 131b. As shown in FIG. 56 , the width ww6a of the opening of the first steam flow path recess 153 of the steam passage 152a where the bend line BL is located may be larger than the width ww6b of the opening of the first steam flow path recess 153 of the steam passage 152a where the bend line BL is not located. Although not shown, the width of the opening of the second steam flow path recess 154 of the steam passage 152a where the bend line BL is located may be larger than the width of the opening of the second steam flow path recess 154 of the steam passage 152a where the bend line BL is not located. In this case, the cross-sectional area of ​​the vapor passage 152a at the bent portion BP can be secured while suppressing heat transfer through the bent portion BP, and an increase in pressure loss of the working vapor 102a in the vapor passage 152a can be suppressed, thereby suppressing a decrease in the heat transport capacity of the vapor chamber 101.

[0313] In the fourth embodiment described above, an example has been described in which the vapor chamber 101 is bent at the position where the vapor passage 152a is disposed (see FIG. 44). However, this is not limiting, and the vapor chamber 101 may be bent at the position where the liquid passage portion 160 is disposed, as shown in FIG.

[0314] 57, the bending line BL overlaps one of the plurality of land portions 133. Therefore, the vapor chamber 101 is bent at the position where the liquid flow path portion 160 is arranged.

[0315] In this case, the liquid flow path portion 160 provided in the land portion 133 may be crushed at the bent portion BP, narrowing the flow path cross-sectional area of ​​the liquid flow path portion 160. This inhibits the flow of the hydraulic fluid 102b between the first region RR1 and the second region RR2.

[0316] The other configurations of the vapor chamber 101 are the same as those in the fourth embodiment described above.

[0317] According to the modification shown in FIG. 57, the vapor chamber 101 is bent at the position where the liquid flow path section 160 is disposed. This increases the capillary force of the liquid flow path section 160 at the bent section BP. In particular, in the bent liquid flow path section 160, due to the deformation of the cross section, there are areas that are thinner or have a smaller cross-sectional area than other non-bent areas, and this increases the capillary force in these areas. This allows the working fluid 102b condensed at the bent section BP to be quickly collected.

[0318] Furthermore, the working fluid 102b is more likely to collect in the curved liquid flow path portion 160 than in other non-bent portions. Therefore, the working fluid 102b can be distributed via the curved liquid flow path portion 160 to areas where the working fluid 102b is likely to be insufficient. This makes it possible to prevent uneven distribution of the working fluid 102b in each of the regions RR1 and RR2. Therefore, the vapor chamber 101 can be uniformly heated in each of the regions RR1 and RR2.

[0319] Furthermore, according to the modified example shown in FIG. 57, the vapor chamber 101 is bent at the position where the liquid flow path section 160 is disposed, thereby suppressing an increase in pressure loss of the working vapor 102a in the vapor path 152a. Therefore, while suppressing heat transfer through the bent portion BP, a decrease in the heat transport capacity of the vapor chamber 101 as a whole can be suppressed. It is important for the vapor chamber 101 to have as many flow paths as possible within a limited space. In particular, since the vapor path 152a is a path through which the working vapor 102a flows, i.e., a path for transporting heat, it is desirable to have as many of them as possible. According to the modified example shown in FIG. 57, it is possible to secure as many vapor paths 152a as possible within a limited space. Furthermore, the area of ​​the vapor chamber 101 can be effectively utilized, thereby achieving space-saving for the vapor chamber 101.

[0320] Furthermore, in the modified example shown in FIG. 57 , when the liquid flow path section 160 is provided on the side of the second sheet 120 located on the inside of the bend, i.e., when the liquid flow path section 160 is provided on the second main body surface 131b of the land section 133, as shown in FIG. 58 , the width ww3a of the liquid flow path mainstream groove 161 provided in the land section 133 where the bend line BL is located may be smaller than the width ww3b of the liquid flow path mainstream groove 161 provided in the land section 133 where the bend line BL is not located. In other words, the width ww3a of the liquid flow path mainstream groove 161 at the bend section BP may be smaller than the width ww3b of the liquid flow path mainstream groove 161 in the first region RR1 and the second region RR2. The same applies to the width of the liquid flow path connecting groove 165. In this case, the capillary force of the liquid flow path section 160 can be increased at the bend section BP. This allows the condensed working fluid 102b to move efficiently from the vapor passage 152a to the liquid flow path section 160. Furthermore, when the second sheet 120 is pressed from the outside, the liquid flow path main groove 161 and the liquid flow path communication groove 165 can be prevented from being crushed.

[0321] 58, the second sheet 120 may be recessed toward the liquid flow path section 160 at the bend section BP. The recessed amount of the second sheet 120 at the bend section BP may be larger than the recessed amount of the second sheet 120 in the first region RR1 and the second region RR2. The recessed amount of the second sheet 120 in the first region RR1 and the second region RR2 may be zero. That is, the second sheet 120 does not need to be recessed toward the liquid flow path section 160 in the first region RR1 and the second region RR2. In this case, the angle between the second sheet inner surface 120a and the wall surface 162 of the liquid flow path main groove 161 can be reduced at the bend section BP. Furthermore, the angle between the second sheet inner surface 120a and the wall surface of the liquid flow path connecting groove 165 can be reduced. This increases the capillary force of the liquid flow path section 160. This allows the condensed working fluid 102b to be transported smoothly toward the evaporation region SR.

[0322] 57, the liquid flow path section 160 may be provided on the side of the first sheet 110 located on the outer side of the bend, as shown in FIG. 59. That is, the liquid flow path section 160 may be provided on the first main body surface 131a of the land section 133. In this case, as shown in FIG. 59, the width ww3c of the liquid flow path mainstream groove 161 provided in the land section 133 where the bend line BL is located may be larger than the width ww3d of the liquid flow path mainstream groove 161 provided in the land section 133 where the bend line BL is not located. That is, the width ww3c of the liquid flow path mainstream groove 161 at the bend section BP may be larger than the width ww3d of the liquid flow path mainstream groove 161 in the first region RR1 and the second region RR2. The same applies to the width of the liquid flow path connecting groove 165. Furthermore, the depth hh3c of the liquid flow path mainstream groove 161 provided in the land portion 133 where the bending line BL is located may be shallower than the depth hh3d of the liquid flow path mainstream groove 161 provided in the land portion 133 where the bending line BL is not located. That is, the depth hh3c of the liquid flow path mainstream groove 161 at the bending portion BP may be greater than the depth hh3d of the liquid flow path mainstream groove 161 in the first region RR1 and the second region RR2. The same applies to the depth of the liquid flow path connecting groove 165. In this case, the angle formed between the first sheet inner surface 110b and the wall surface 162 of the liquid flow path mainstream groove 161 at the bending portion BP can be reduced. Furthermore, the angle formed between the first sheet inner surface 110b and the wall surface of the liquid flow path connecting groove 165 can be reduced. This increases the capillary force of the liquid flow path portion 160. This allows the condensed working fluid 102b to be transported smoothly toward the evaporation region SR.

[0323] 59, the first sheet 110 may be recessed toward the liquid flow path section 160 at the bend section BP. The recessed amount of the first sheet 110 at the bend section BP may be larger than the recessed amount of the first sheet 110 in the first region RR1 and the second region RR2. The recessed amount of the first sheet 110 in the first region RR1 and the second region RR2 may be zero. That is, the first sheet 110 does not need to be recessed toward the liquid flow path section 160 in the first region RR1 and the second region RR2. In this case, the angle between the first sheet inner surface 110b and the wall surface 162 of the liquid flow path main groove 161 can be reduced at the bend section BP. Furthermore, the angle between the first sheet inner surface 110b and the wall surface of the liquid flow path connecting groove 165 can be reduced. This increases the capillary force in the liquid flow path section 160. This allows the condensed working fluid 102b to be transported smoothly toward the evaporation region SR.

[0324] 57, as shown in FIG. 60, the liquid flow path portion 160 may be provided on the second main body surface 131b of the land portion 133, and the liquid flow path portion 160 may be provided on the first main body surface 131a of the land portion 133. In this case, as shown in FIG. 60, the width ww3a of the liquid flow path mainstream groove 161 may be smaller than the width ww3b of the liquid flow path mainstream groove 161, as in the example shown in FIG. 58. The same applies to the width of the liquid flow path connecting groove 165. At the bend portion BP, the second sheet 120 may be recessed toward the liquid flow path portion 160. As in the example shown in FIG. 59, the width ww3c of the liquid flow path mainstream groove 161 may be larger than the width ww3d of the liquid flow path mainstream groove 161. The same applies to the width of the liquid flow path connecting groove 165. The depth hh3c of the liquid flow path mainstream groove 161 may be smaller than the depth hh3d of the liquid flow path mainstream groove 161. The same applies to the depth of the liquid flow path connection groove 165. Furthermore, at the bent portion BP, the first sheet 110 may be recessed toward the liquid flow path portion 160. In this case, it is possible to obtain both the effects of the example shown in FIG. 58 and the example shown in FIG. 59. In the example shown in FIG. 60, the flow path cross-sectional area of ​​the liquid flow path portion 160 provided on the first main body surface 131a may be larger than the flow path cross-sectional area of ​​the liquid flow path portion 160 provided on the second main body surface 131b. The liquid flow path portion 160 provided on the first main body surface 131a may function as a liquid reservoir while the electronic device D is not generating heat. In this case, the capillary force of the liquid flow path portion 160 is increased, so that the working fluid 102b can be easily drawn into the liquid flow path portion 160 provided on the first main body surface 131a, which serves as the liquid reservoir.

[0325] 61 and 62, when the liquid flow path portion 160 is provided on the second main body surface 131b of the land portion 133 and the liquid flow path portion 160 is provided on the first main body surface 131a of the land portion 133, a communication path 180 may be provided that connects the liquid flow path portion 160 provided on the second main body surface 131b with the liquid flow path portion 160 provided on the second main body surface 131b. As shown in FIG. 62, the communication path 180 may extend straight in the Z direction and penetrate the land portion 133. The communication path 180 may be provided at any position on the land portion 133. As shown in FIG. 61, the communication path 180 may be provided at a position that overlaps with the liquid flow path mainstream groove 161 in a plan view. The communication path 180 may connect the liquid flow path mainstream groove 161 on the second main body surface 131b with the liquid flow path mainstream groove 161 on the second main body surface 131b. Although not shown, the communication passage 180 may be located at a position overlapping the liquid flow path communication groove 165 in a plan view. The communication passage 180 may connect the liquid flow path communication groove 165 of the second main body surface 131b to the liquid flow path communication groove 165 of the second main body surface 131b. By providing the communication passage 180, even if the flow of the working fluid 102b becomes difficult at a position other than the bending line BL of one liquid flow path section 160, the working fluid 102b can flow through the communication passage 180 to the other liquid flow path section 160. This allows the working fluid 102b to be smoothly transported toward the evaporation region SR. This also prevents the working fluid 102b from accumulating at the bending portion BP, thereby suppressing a temperature rise at the bending portion BP. This prevents a decrease in the heat transfer suppression effect via the bending portion BP.

[0326] In the fourth embodiment described above, an example has been described in which the planar shape of vapor chamber 101 is rectangular (see FIGS. 40 and 44). However, this is not limiting, and the planar shape of vapor chamber 101 may be any shape. For example, as shown in FIG. 63, the planar shape of vapor chamber 101 may be a shape that combines two rectangular shapes.

[0327] In the example shown in FIG. 63, the vapor chamber 101 has a rectangular first portion 101a and a second portion 101b. The planar area of ​​the second portion 101b is smaller than the planar area of ​​the first portion 101a. The second portion 101b is provided so as to protrude from a part (right half) of the first portion 101a on the positive side in the X direction (the right side in FIG. 63) toward the positive side in the Y direction (the upper side in FIG. 63). The frame portion 132 is provided on the periphery of the area consisting of the first portion 101a and the second portion 101b. A plurality of land portions 133 are provided within the frame portion 132.

[0328] The plurality of lands 133 include a plurality of first lands 133a, a plurality of second lands 133b, and a plurality of third lands 133c.

[0329] Each of the first lands 133a is located in the first portion 101a. The first lands 133a extend in the X direction and are spaced apart in the Y direction and arranged parallel to one another. In the example shown in Fig. 63, five first lands 133a are provided.

[0330] Each second land portion 133b is located in the second portion 101b. The second land portions 133b extend in the X direction and are arranged parallel to one another with a space therebetween in the Y direction. In the example shown in FIG. 63, three second lands 133b are provided. The dimension of the second land portion 133b in the X direction is smaller than the dimension of the first land portion 133a in the X direction. Furthermore, as shown in FIG. 63, the dimension of each second land portion 133b in the X direction may be different from one another.

[0331] Each third land portion 133c connects the first land portion 133a and the second land portion 133b. The third land portions 133c extend in the Y direction, are spaced apart in the X direction, and are arranged parallel to one another. In the example shown in FIG. 63, three third land portions 133c are provided. As shown in FIG. 63, each third land portion 133c may be connected to the edge of the corresponding second land portion 133b on the negative side in the X direction (the left side in FIG. 63). Furthermore, each third land portion 133c may be connected to the first land portion 133a among the multiple first lands 133a that is located furthest in the positive side in the Y direction (the upper side in FIG. 63).

[0332] The first land portion 133a, the second land portion 133b, and the third land portion 133c are each provided with a liquid flow path portion 160. The liquid flow path portion 160 of the first land portion 133a communicates with the liquid flow path portion 160 of the third land portion 133c, and the liquid flow path portion 160 of the third land portion 133c communicates with the liquid flow path portion 160 of the second land portion 133b.

[0333] The second steam passage 152 includes a steam passage 152a extending in a first direction and a steam passage 152b extending in a second direction perpendicular to the first direction. In the illustrated example, the first direction is the X direction. That is, the steam passage 152a extends in the X direction, and the steam passage 152b extends in the Y direction. The steam passages 152a are provided between the first lands 133a, between the second lands 133b, and between the first lands 133a and the second lands 133b. The steam passages 152b are provided between the third lands 133c.

[0334] 63, the bending line BL is provided at the boundary between the first portion 101a and the second portion 101b of the vapor chamber 101. Therefore, the first region RR1 is located in the first portion 101a of the vapor chamber 101, and the second region RR2 is located in the second portion 101b of the vapor chamber 101.

[0335] In the example shown in FIG. 63, a first evaporation region SR1 is provided in the first region RR1 of the vapor chamber 101, and a second evaporation region SR2 is provided in the second region RR2 of the vapor chamber 101. More specifically, the first evaporation region SR1 is formed on the positive side in the X direction of the first region RR1 of the vapor chamber 101 (the right side in FIG. 63). That is, a first device D1 is attached to the positive side in the X direction of the first region RR1. A second evaporation region SR2 is formed on the positive side in the X direction of the second region RR2 of the vapor chamber 101. That is, a second device D2 is attached to the positive side in the X direction of the second region RR2. A first condensation region CR1 is formed on the negative side in the X direction of the first region RR1 of the vapor chamber 101 (the left side in FIG. 63). A second condensation region CR2 is formed on the negative side in the X direction of the second region RR2 of the vapor chamber 101.

[0336] 63, the bending line BL extends in a direction parallel to the first direction, which is the direction in which the vapor passage 152a extends. Therefore, the vapor chamber 101 is bent in a direction parallel to the first direction.

[0337] 63, vapor chamber 101 is bent at the position where vapor passage 152a is disposed. That is, vapor chamber 101 is bent so as to fit along vapor passage 152a.

[0338] The other configurations of the vapor chamber 101 are the same as those in the fourth embodiment described above.

[0339] According to the modification shown in FIG. 63, the vapor chamber 101 is bent at the position where the vapor passage 152a is disposed. This increases the pressure loss of the working vapor 102a in the vapor passage 152a at the bend BP. This reduces the movement of the working vapor 102a between the first region RR1 and the second region RR2 at the bend BP. This further reduces heat transfer through the bend BP.

[0340] 63, the flow of the working vapor 102a between the first region RR1 and the second region RR2 can be suppressed while still allowing the working vapor 102a to flow between the first region RR1 and the second region RR2. This allows, for example, heat from the second device D2 to be transferred to the first region RR1, and the first condensation region CR1 can be used as a condensation region for the working vapor 102a from the second evaporation region SR2. This allows for an efficient heat dissipation design and reduces the space required for the vapor chamber 101.

[0341] 63, an example has been described in which vapor chamber 101 is bent at the position where vapor passage 152a is disposed. However, this is not limited thereto, and vapor chamber 101 may be bent at the position where liquid passage portion 160 is disposed, as shown in FIG.

[0342] 64, one of the land portions 133 is provided at the boundary between the first portion 101a and the second portion 101b. This land portion 133 is located on the bending line BL. Therefore, the vapor chamber 101 is bent at the position where the liquid flow path portion 160 is located.

[0343] In this case, the liquid flow path portion 160 provided in the land portion 133 may be crushed at the bent portion BP, narrowing the flow path cross-sectional area of ​​the liquid flow path portion 160. This inhibits the flow of the hydraulic fluid 102b between the first region RR1 and the second region RR2.

[0344] Other configurations of the vapor chamber 101 are the same as those of the modified example shown in FIG.

[0345] According to the modification shown in FIG. 64, the vapor chamber 101 is bent at the position where the liquid flow path section 160 is disposed. This increases the capillary force of the liquid flow path section 160 at the bent section BP. In particular, in the bent liquid flow path section 160, the deformation of the cross section creates thinner sections or sections with smaller cross-sectional areas than other non-bent sections, and the capillary force can be increased in these sections. This allows the working fluid 102b condensed at the bent section BP to be quickly collected.

[0346] Furthermore, the working fluid 102b is more likely to collect in the curved liquid flow path portion 160 than in other non-bent portions. Therefore, the working fluid 102b can be distributed via the curved liquid flow path portion 160 to areas where the working fluid 102b is likely to be insufficient. This makes it possible to prevent uneven distribution of the working fluid 102b in each of the regions RR1 and RR2. Therefore, the vapor chamber 101 can be uniformly heated in each of the regions RR1 and RR2.

[0347] Furthermore, according to the modified example shown in FIG. 64, the vapor chamber 101 is bent at the position where the liquid flow path section 160 is disposed, thereby suppressing an increase in pressure loss of the working vapor 102a in the vapor path 152a. Therefore, while suppressing heat transfer through the bent portion BP, a decrease in the heat transport capacity of the vapor chamber 101 as a whole can be suppressed. It is important for the vapor chamber 101 to have as many flow paths as possible within a limited space. In particular, since the vapor path 152a is a path through which the working vapor 102a flows, i.e., a path for transporting heat, it is desirable to have as many of them as possible. According to the modified example shown in FIG. 64, it is possible to secure as many vapor paths 152a as possible within a limited space. Furthermore, the area of ​​the vapor chamber 101 can be effectively utilized, thereby achieving space-saving for the vapor chamber 101.

[0348] 64, the flow of the working vapor 102a between the first region RR1 and the second region RR2 can be suppressed while still allowing the working vapor 102a to flow between the first region RR1 and the second region RR2. This allows, for example, heat from the second device D2 to be transferred to the first region RR1, and the first condensation region CR1 can be used as a condensation region for the working vapor 102a from the second evaporation region SR2. This allows for an efficient heat dissipation design and reduces the space required for the vapor chamber 101.

[0349] 63, an example has been described in which vapor chamber 101 is bent at the position where vapor passage 152a is disposed. However, this is not limited to this, and vapor chamber 101 may be bent at the position where reinforcing portion 138 is disposed, as shown in FIG.

[0350] In the example shown in FIG. 65 , the main body sheet 130 has a reinforcing portion 138 extending inward from the frame portion 132. Neither the vapor flow path portion 150 nor the liquid flow path portion 160 is arranged in the reinforcing portion 138. The reinforcing portion 138 is not etched in the etching process, and the material of the main body sheet 130 remains. The frame portion 132 and the reinforcing portion 138 may be formed continuously. The first main body surface 131 a of the frame portion 132 of the main body sheet 130 and the first main body surface 131 a of the reinforcing portion 138 of the main body sheet 130 may be located on the same plane. Furthermore, the second main body surface 131 b of the frame portion 132 of the main body sheet 130 and the second main body surface 131 b of the reinforcing portion 138 of the main body sheet 130 may be located on the same plane. As shown in FIG. 65 , the planar shape of the reinforcing portion 138 may be an elongated rectangle extending in the X direction. The reinforcing portion 138 may be provided so as to protrude from a portion located on the positive side in the X direction (the right side in FIG. 65) of the frame portion 132 toward the negative side in the X direction (the left side in FIG. 65). The reinforcing portion 138 may also be provided between the first land portion 133a and the second land portion 133b.

[0351] 65, the bending line BL overlaps the reinforcing portion 138. Therefore, the vapor chamber 101 is bent at the position where the reinforcing portion 138 is arranged.

[0352] Other configurations of the vapor chamber 101 are the same as those of the modified example shown in FIG.

[0353] According to the modified example shown in FIG. 65, the vapor chamber 101 is bent at the position where the reinforcing portion 138 is disposed. Thus, the presence of the reinforcing portion 138 at the bent portion BP can further suppress the movement of the working vapor 102a and the working fluid 102b between the first region RR1 and the second region RR2. Heat transfer at the reinforcing portion 138 is achieved by heat transfer through the material of the main body sheet 130. For example, if the material of the main body sheet 130 is copper, its thermal conductivity is approximately 400 W / (m·K). Therefore, the vapor chamber 101 can be expected to have an equivalent thermal conductivity 10 times higher than that. Therefore, the thermal conductivity of the reinforcing portion 138 is relatively small. Therefore, in the bent vapor chamber 101, heat transfer through the bent portion BP can be further suppressed.

[0354] 65, the mechanical strength of the vapor chamber 101 at the bent portion BP can be improved by the presence of the reinforcing portion 138. Although the interior of the vapor chamber 101 is hollow, the presence of such reinforcing portion 138 allows a large bulk portion to remain inside the vapor chamber 101, thereby improving the mechanical strength of the vapor chamber 101.

[0355] 65, the vapor chamber 101 is bent at the position where the reinforcing portion 138 is disposed, thereby suppressing deformation of the vapor passage 152a and the liquid flow path portion 160. Therefore, it is possible to suppress a decrease in the heat transport capacity of the vapor chamber 101 while suppressing heat transfer via the bent portion BP.

[0356] 65, the flow of the working vapor 102a between the first region RR1 and the second region RR2 can be suppressed while allowing the working vapor 102a to flow between the first region RR1 and the second region RR2. This allows, for example, heat from the second device D2 to be transferred to the first region RR1, and the first condensation region CR1 can be used as a condensation region for the working vapor 102a from the second evaporation region SR2. This allows for an efficient heat dissipation design and reduces the space required for the vapor chamber 101.

[0357] In addition, in the modified example shown in FIG. 65, an example was described in which the planar shape of vapor chamber 101 is a shape obtained by combining two rectangular shapes. However, this is not limited to this, and the planar shape of vapor chamber 101 is arbitrary. For example, as shown in FIG. 66, the planar shape of vapor chamber 101 may be rectangular. In this case, as shown in FIG. 66, main body sheet 130 may have reinforcing portion 138, and bending line BL may overlap reinforcing portion 138. In other words, vapor chamber 101 may be bent at the position where reinforcing portion 138 is arranged.

[0358] In the example shown in FIG. 66, the reinforcing portion 138 is located between the first region RR1 and the second region RR2. As shown in FIG. 66, the planar shape of the reinforcing portion 138 may be an elongated rectangle extending in the X direction. The reinforcing portion 138 may extend from a portion located on the positive side of the X direction (the right side in FIG. 65) of the frame portion 132 to a portion located on the negative side of the X direction (the left side in FIG. 65). In the example shown in FIG. 66, the first region RR1 and the second region RR2 are separated by the reinforcing portion 138. That is, the presence of the reinforcing portion 138 prevents the working vapor 102a and the working liquid 102b from passing between the first region RR1 and the second region RR2. Each of the regions RR1 and RR2 can function as an independent vapor chamber.

[0359] 66, the first region RR1 and the second region RR2 are separated by the reinforcing portion 138, which further suppresses heat transfer through the bent portion BP. Furthermore, the presence of such a bent portion BP further improves the mechanical strength of the vapor chamber 101. Furthermore, since one vapor chamber 101 can have the functions of multiple vapor chambers 101, the manufacturing cost of the vapor chamber 101 can be reduced compared to when multiple vapor chambers 101 are manufactured.

[0360] 65 and 66, at the bending portion BP, a main body surface recess 182 may be formed in the first main body surface 131a or the second main body surface 131b of the reinforcing portion 138. In the example shown in Figures 67 and 68, the main body surface recess 182 is formed in the second main body surface 131b of the reinforcing portion 138.

[0361] The main body surface recess 182 may be formed in a concave shape on the second main body surface 131b of the reinforcing portion 138. The main body surface recess 182 may have any planar shape. For example, as shown in FIG. 67, the main body surface recess 182 may be formed in the shape of a small hole having a circular (perfect circle, ellipse, etc.) planar shape. For example, as shown in FIG. 68, the main body surface recess 182 may be formed in the shape of a groove extending in the X direction. As shown in FIGS. 67 and 68, multiple main body surface recesses 182 may be lined up along the X direction. As shown in FIGS. 67 and 68, the multiple main body surface recesses 182 overlap the bending line BL in a planar view. That is, the multiple main body surface recesses 182 are arranged along the bending line BL. In other words, each main body surface recess 182 is formed at a position that overlaps the bending line BL in a planar view.

[0362] The main body surface recess 182 may be formed by etching the main body sheet 130 in the etching step of the manufacturing method of the vapor chamber 101 described above. The main body surface recess 182 is visible from the outside through the first sheet 110 or the second sheet 120 when the vapor chamber 101 is viewed in a plan view. Therefore, the main body surface recess 182 functions as a marker for the bending position of the vapor chamber 101 in the bending step of the manufacturing method of the vapor chamber 101 described above. That is, in the bending step, by bending the vapor chamber 101 along the main body surface recess 182, the vapor chamber 101 bent along the bending line BL can be obtained.

[0363] According to the modified example shown in FIGS. 67 and 68, by bending the vapor chamber 101 along the main body surface recess 182, it is possible to obtain a vapor chamber 101 bent along the bending line BL. This improves the ease of bending. Furthermore, since the main body surface recess 182 is formed in a pore or groove shape, the vapor chamber 101 can be easily bent. This makes it easier to manufacture the bent vapor chamber 101. In particular, when the main body surface recess 182 is formed in the second main body surface 131b of the reinforcing portion 138, it becomes easier to bend the vapor chamber 101 so that the second sheet 120 is positioned on the inside of the bend.

[0364] The main body surface recess 182 may be formed on the first main body surface 131a of the reinforcing portion 138. In this case, it is easier to bend the vapor chamber 101 so that the first sheet 110 is located on the inner side of the bend. The main body surface recess 182 may also be formed on both the first main body surface 131a and the second main body surface 131b of the reinforcing portion 138. In this case, it is easier to bend the vapor chamber 101 to either side.

[0365] 65, a main body surface recess 182 may be formed at a position on the bent portion BP where the liquid flow path portion 160 of the land portion 133 is not provided. For example, when the liquid flow path portion 160 is provided on the second main body surface 131b of the land portion 133, the main body surface recess 182 may be formed on the first main body surface 131a of the land portion 133. For example, when the liquid flow path portion 160 is provided on the first main body surface 131a of the land portion 133, the main body surface recess 182 may be formed on the second main body surface 131b of the land portion 133. For example, when the liquid flow path portion 160 is provided on both the first main body surface 131a and the second main body surface 131b of the land portion 133, the main body surface recess 182 may be formed at any position on the first main body surface 131a or the second main body surface 131b of the land portion 133 where the liquid flow path portion 160 is not provided. Furthermore, the main body surface recess 182 may be formed on both the first main body surface 131a and the second main body surface 131b of the land portion 133. As shown in Fig. 69, the main body surface recess 182 may be formed on the reinforcing portion 138, and the main body surface recess 182 may also be formed on the land portion 133. The multiple main body surface recesses 182 may be aligned along the X direction, and each main body surface recess 182 may overlap the bending line BL in plan view.

[0366] 69, the main body surface recess 182 is also formed in the land portion 133, which further improves the ease of bending. Also, the vapor chamber 101 can be bent even more easily. Therefore, the manufacturing of the bent vapor chamber 101 can be made even easier.

[0367] Note that even when the vapor chamber 101 does not have the reinforcing portion 138, a main body surface recess 182 may be formed in the land portion 133. In the case where the vapor chamber 101 is bent at the position where the liquid flow path portion 160 is arranged, as in the modified example shown in Fig. 57, and the liquid flow path portion 160 is provided on the second main body surface 131b of the land portion 133, a main body surface recess 182 may be formed on the first main body surface 131a of the land portion 133, as shown in Fig. 70. As shown in Fig. 70, a plurality of main body surface recesses 182 may be lined up along the X direction, and each main body surface recess 182 may overlap a bending line BL in a plan view.

[0368] 70, the bending workability can be improved by forming the main body surface recess 182 in the land portion 133. Furthermore, the vapor chamber 101 can be easily bent. Therefore, the manufacturing of the bent vapor chamber 101 can be facilitated.

[0369] 63, an example has been described in which vapor chamber 101 is bent at the position where vapor passage 152a is disposed. However, this is not limited to this, and vapor chamber 101 may be bent at the position where space 139 is disposed, as shown in FIG.

[0370] In the example shown in FIG. 71 , the main body sheet 130 has a space 139 provided between the first region RR1 and the second region RR2. The vapor channel portion 150 and the liquid channel portion 160 are not provided in the space 139. The space 139 is continuous with the space outside the vapor chamber 101 and forms part of the space outside the vapor chamber 101. As shown in FIG. 71 , the planar shape of the space 139 may be an elongated rectangle extending in the X direction. The space 139 may be provided between the first land portion 133 a and the second land portion 133 b. In other words, the space 139 may be formed by recessing a portion of the frame portion 132 located on the positive side in the X direction (the right side in FIG. 71 ) toward the negative side in the X direction (the left side in FIG. 71 ) between the first land portion 133 a and the second land portion 133 b.

[0371] 71, the bending line BL (or its extension) overlaps the space 139. Therefore, the vapor chamber 101 is bent at the position where the space 139 is located.

[0372] Other configurations of the vapor chamber 101 are the same as those of the modified example shown in FIG.

[0373] 71, the vapor chamber 101 is bent at the position where the space 139 is disposed. As a result, the presence of the space 139 at the bent portion BP can further suppress the movement of the working vapor 102a and the working liquid 102b between the first region RR1 and the second region RR2. Therefore, in the bent vapor chamber 101, heat transfer via the bent portion BP can be further suppressed.

[0374] 71, the vapor chamber 101 is bent at the position where the space 139 is disposed, and therefore the vapor chamber 101 can be easily bent in the bending process of the vapor chamber 101. Therefore, the manufacturing of the bent vapor chamber 101 can be facilitated.

[0375] 71, vapor chamber 101 is bent at the position where space 139 is disposed, thereby suppressing deformation of vapor passage 152a and liquid flow path 160. Therefore, it is possible to suppress a decrease in the heat transport capacity of vapor chamber 101 while suppressing heat transfer via bent portion BP.

[0376] Furthermore, according to the modification shown in FIG. 71, another component can be placed in the space 139, allowing for effective use of the area within the housing H. For example, a protrusion for positioning the vapor chamber 101 can be placed in the space 139. In this case, positioning of the vapor chamber 101 within the housing H can be easily performed. Also, for example, wiring for a device or the like can be passed through the space 139. In this case, the length of the wiring can be shortened, reducing signal loss.

[0377] 71, the flow of the working vapor 102a between the first region RR1 and the second region RR2 can be suppressed while still allowing the working vapor 102a to flow between the first region RR1 and the second region RR2. This allows, for example, heat from the second device D2 to be transferred to the first region RR1, and the first condensation region CR1 can be used as a condensation region for the working vapor 102a from the second evaporation region SR2. This allows for an efficient heat dissipation design and reduces the space required for the vapor chamber 101.

[0378] In the fourth embodiment described above, an example has been described in which the first evaporation region SR1 is provided in the first region RR1 of the vapor chamber 101, and the second evaporation region SR2 is provided in the second region RR2 of the vapor chamber 101 (see FIGS. 40 and 44). However, this is not limiting, and the evaporation region SR may be provided in either the first region RR1 or the second region RR2.

[0379] In the example shown in FIG. 72, an evaporation region SR is provided in the first region RR1, and no evaporation region SR is provided in the second region RR2. More specifically, the evaporation region SR is formed on the positive side in the X direction of the first region RR1 of the vapor chamber 101 (the right side in FIG. 72). That is, the device D is attached to the positive side in the X direction of the first region RR1. In addition, a condensation region CR is formed around the evaporation region SR. More specifically, the condensation region CR is formed on the negative side in the X direction of the first region RR1 of the vapor chamber 101 (the left side in FIG. 72). In addition, the condensation region CR is formed in the second region RR2 of the vapor chamber 101.

[0380] The other configurations of the vapor chamber 101 are the same as those in the fourth embodiment described above.

[0381] 72, the evaporation region SR is provided in the first region RR1, and the evaporation region SR is not provided in the second region RR2. Even in this case, the bent portion BP can suppress the flow of the working vapor 2a between the first region RR1 and the second region RR2. Therefore, in the bent vapor chamber 101, heat transfer through the bent portion BP can be suppressed.

[0382] 72, it is possible to suppress the transfer of heat from the first region RR1 to the second region RR2, thereby suppressing the second region RR2 from becoming too hot. Therefore, for example, when the housing member Ha attached to the second region RR2 is located close to the grip portion of a mobile terminal or the like, it is possible to suppress the transfer of heat from the device D to the housing member Ha, which would cause the grip portion to become too hot.

[0383] 63, an example has been described in which the first evaporation region SR1 is provided in the first region RR1 of the vapor chamber 101, and the second evaporation region SR2 is provided in the second region RR2 of the vapor chamber 101. However, this is not limiting, and the evaporation region SR may be provided in either the first region RR1 or the second region RR2, as in the modification shown in FIG.

[0384] In the example shown in FIG. 73, an evaporation region SR is provided in the first region RR1, and no evaporation region SR is provided in the second region RR2. More specifically, the evaporation region SR is formed on the negative X-direction side (left side in FIG. 73) of the first region RR1 of the vapor chamber 101. That is, the device D is attached to the negative X-direction side of the first region RR1. In addition, a condensation region CR is formed around the evaporation region SR. More specifically, the condensation region CR is formed on the positive X-direction side (right side in FIG. 73) of the first region RR1 of the vapor chamber 101. In addition, a condensation region CR is formed in the second region RR2 of the vapor chamber 101.

[0385] Other configurations of the vapor chamber 101 are the same as those of the modified example shown in FIG.

[0386] 73, the evaporation region SR is provided in the first region RR1, and the evaporation region SR is not provided in the second region RR2. Even in this case, the bent portion BP can suppress the flow of the working vapor 102a between the first region RR1 and the second region RR2. Therefore, in the bent vapor chamber 101, heat transfer through the bent portion BP can be suppressed.

[0387] 73, it is possible to suppress the transfer of heat from the first region RR1 to the second region RR2, thereby suppressing the second region RR2 from becoming too hot. Therefore, for example, when the housing member Ha attached to the second region RR2 is located close to the grip portion of a mobile terminal or the like, it is possible to suppress the transfer of heat from the device D to the housing member Ha, which would cause the grip portion to become too hot.

[0388] 73, an example has been described in which the multiple lands 133 include multiple first lands 133a and multiple second lands 133b extending in the X direction, and multiple third lands 133c extending in the Y direction. However, this is not limiting, and the multiple lands 133 may have any shape and arrangement. For example, as shown in FIG. 74, the multiple lands 133 may include multiple first lands 133a extending in the X direction and multiple second lands 133b extending in the Y direction.

[0389] In the example shown in FIG. 74, the plurality of lands 133 include a plurality of first lands 133a and a plurality of second lands 133b.

[0390] Each of the first lands 133a is located in the first portion 101a. Each of the first lands 133a extends in the X direction. Each of the first lands 133a extends from a position on the negative side of the X direction (the left side in FIG. 74) of the first portion 101a toward the positive side of the X direction (the right side in FIG. 74). The first lands 133a are spaced apart in the Y direction and arranged parallel to one another. In the example shown in FIG. 74, five first lands 133a are provided. As shown in FIG. 74, the dimensions of the first lands 133a in the X direction may differ from one another.

[0391] Each second land portion 133b is located mainly in the second portion 101b, but also extends across the first portion 101a. Each second land portion 133b extends in the Y direction. Each second land portion 133b extends from a position on the positive side of the Y direction of the second portion 101b (upper side in FIG. 74) toward the negative side of the Y direction (lower side in FIG. 74). The second land portions 133b are spaced apart in the X direction and arranged parallel to one another. In the example shown in FIG. 74, five second lands 133b are provided. As shown in FIG. 74, the dimensions of the second lands 133b in the Y direction may differ from one another.

[0392] In the example shown in Fig. 74, each second land portion 133b is connected to a corresponding first land portion 133a. More specifically, the edge of each second land portion 133b on the negative side in the Y direction (the lower side in Fig. 74) is connected to the edge of the corresponding first land portion 133a on the positive side in the X direction (the right side in Fig. 74). As a result, the first land portion 133a and the second land portion 133b form a land portion 133 having an L-shaped planar shape.

[0393] The first land portion 133a and the second land portion 133b are each provided with a liquid flow path portion 160. The liquid flow path portion 160 of the first land portion 133a communicates with the liquid flow path portion 160 of the second land portion 133b.

[0394] The second steam passage 152 includes a steam passage 152a extending in a first direction and a steam passage 152b extending in a second direction perpendicular to the first direction. In the illustrated example, the first direction is the Y direction. That is, the steam passage 152a extends in the Y direction, and the steam passage 152b extends in the X direction. The steam passage 152a is provided between each of the second land portions 133b. The steam passage 152b is provided between each of the first land portions 133a.

[0395] 74, the bending line BL is provided across the first portion 101a and the second portion 101b. The bending line BL extends in a direction parallel to the first direction, which is the direction in which the vapor passage 152a extends. Therefore, the vapor chamber 101 is bent in a direction parallel to the first direction.

[0396] 74, the bending line BL overlaps the vapor passage 152a provided between adjacent second lands 133b. Therefore, the vapor chamber 101 is bent at the position where the vapor passage 152a is located. That is, the vapor chamber 101 is bent so as to follow the vapor passage 152a.

[0397] Other configurations of the vapor chamber 101 are the same as those of the modified example shown in FIG.

[0398] 74, the vapor chamber 101 is bent at the position where the vapor passage 152a is disposed, thereby increasing the pressure loss of the working vapor 102a in the vapor passage 152a at the bend BP. This further reduces the movement of the working vapor 102a between the first region RR1 and the second region RR2 at the bend BP. This further reduces heat transfer through the bend BP.

[0399] In the fourth embodiment described above, an example has been described in which the plurality of land portions 133 extend in the X direction (see FIG. 44). However, this is not limiting, and the shape and arrangement of the plurality of land portions 133 are arbitrary. For example, as shown in FIG. 75, the plurality of land portions 133 may include a plurality of first land portions 133a extending in the X direction, a plurality of second land portions 133b extending in the Y direction, and a plurality of third land portions 133c extending radially.

[0400] In the example shown in FIG. 75, the vapor chamber 101 has a rectangular planar shape. A first region RR1 is provided on the negative X-direction side (left side in FIG. 75) of the vapor chamber 101, and a second region RR2 is provided on the positive X-direction side (right side in FIG. 75) of the vapor chamber 101. An evaporation region SR is provided in this first region RR1. More specifically, the evaporation region SR is formed on the positive Y-direction side (upper side in FIG. 75) of the first region RR1. A condensation region CR is formed around the evaporation region SR. More specifically, the condensation region CR is formed on the negative X-direction side (lower side in FIG. 75) of the first region RR1 of the vapor chamber 101. A condensation region CR is also formed in the second region RR2 of the vapor chamber 101.

[0401] In the example shown in FIG. 75, the plurality of lands 133 include a plurality of first lands 133a, a plurality of second lands 133b, and a plurality of third lands 133c.

[0402] Each first land portion 133a is located on the positive side of the vapor chamber 101 in the Y direction (upper side in FIG. 75). Each first land portion 133a extends in the X direction. Each first land portion 133a extends from a position on the negative side of the vapor chamber 101 in the X direction (left side in FIG. 75) toward the positive side of the X direction (right side in FIG. 75). The first land portions 133a are spaced apart in the Y direction and arranged parallel to one another. In the example shown in FIG. 75, four first land portions 133a are provided. As shown in FIG. 75, the dimensions of each first land portion 133a in the X direction may differ from one another.

[0403] Each second land portion 133b is located on the negative side of the Y direction of the vapor chamber 101 (the lower side in FIG. 75). Each second land portion 133b extends in the Y direction. Each second land portion 133b extends to the negative side of the Y direction so as to branch off from the first land portion 133a located furthest on the negative side of the Y direction. The second land portions 133b are spaced apart in the Y direction and arranged parallel to one another. In the example shown in FIG. 75, four second land portions 133b are provided.

[0404] Each third land portion 133c is located on the positive side of the vapor chamber 101 in the X direction (the right side in FIG. 75). Each third land portion 133c extends radially. Each third land portion 133c extends so as to widen from the edge of the corresponding first land portion 133a on the positive side of the X direction or from any position. Each third land portion 133c is arranged so that the spacing between each third land portion 133c widens as it moves away from the evaporation region SR. In the example shown in FIG. 75, five third lands 133c are provided.

[0405] The first land portion 133a, the second land portion 133b, and the third land portion 133c are each provided with a liquid flow path portion 160. The liquid flow path portion 160 of the first land portion 133a is connected to the liquid flow path portion 160 of the second land portion 133b and the liquid flow path portion 160 of the third land portion 133c, respectively.

[0406] The second vapor passage 152 includes a vapor passage 152a extending in a first direction, a vapor passage 152b extending in a second direction perpendicular to the first direction, and a vapor passage 152c extending radially. In the illustrated example, the first direction is the Y direction. That is, the vapor passage 152a extends in the Y direction, and the vapor passage 152b extends in the X direction. The vapor passage 152c extends such that its width increases with increasing distance from the evaporation region SR. The vapor passage 152a is provided between each of the second land portions 133b. The vapor passage 152b is provided between each of the first land portions 133a. The vapor passage 152c is provided between each of the third land portions 133c.

[0407] 75, the bending line BL extends in a direction parallel to the first direction, which is the direction in which the vapor passage 152a extends. Therefore, the vapor chamber 101 is bent in a direction parallel to the first direction.

[0408] 75, the bending line BL overlaps the vapor passage 152a provided between adjacent second lands 133b. Therefore, the vapor chamber 101 is bent at the position where the vapor passage 152a is located. That is, the vapor chamber 101 is bent so as to follow the vapor passage 152a.

[0409] The other configurations of the vapor chamber 101 are the same as those in the fourth embodiment described above.

[0410] 75, the vapor chamber 101 is bent at the position where the vapor passage 152a is disposed, thereby increasing the pressure loss of the working vapor 102a in the vapor passage 152a at the bend BP. This further reduces the movement of the working vapor 102a between the first region RR1 and the second region RR2 at the bend BP. This further reduces heat transfer through the bend BP.

[0411] 75, the second vapor passage 152 includes radially extending vapor passages 152c. This allows the working vapor 102a to be transported uniformly within the XY plane of the vapor chamber 101, and heat to be spread uniformly. This improves the heat dissipation efficiency of the vapor chamber 101.

[0412] In the fourth embodiment described above, an example was described in which the vapor chamber 101 is bent in an L-shape so that the first region RR1 and the second region RR2 are perpendicular to each other (see FIG. 39). However, this is not limited to this. For example, as shown in FIG. 76, the vapor chamber 101 may be bent in a U-shape so that the first region RR1 and the second region RR2 face each other. In the example shown in FIG. 76, the bent portion BP of the vapor chamber 101 is formed in a semicircular arc shape. In this case, the degree of freedom in arranging the vapor chamber 101 within the housing H can be improved. Therefore, for example, even if the first device D1 and the second device D2 are located apart, the first device D1 can be thermally contacted with the first region RR1 of the vapor chamber 101, and the second device D2 can be thermally contacted with the second region RR2 of the vapor chamber 101. This eliminates the need to prepare multiple vapor chambers 101. Therefore, the manufacturing cost of the vapor chamber 101 can be reduced compared to when a plurality of vapor chambers 101 are manufactured.

[0413] In this case, as shown in FIG. 76, the first sheet 110 may be recessed toward the vapor passage 152a at the bend BP. The recessed amount of the first sheet 110 at the bend BP may be greater than the recessed amount of the first sheet 110 in the first region RR1 and the second region RR2. The recessed amount of the first sheet 110 in the first region RR1 and the second region RR2 may be zero. That is, the first sheet 110 does not need to be recessed toward the vapor passage 152a in the first region RR1 and the second region RR2. In this case, a flow path corner with enhanced capillary action can be formed between the first sheet inner surface 110b and the wall surface 153a of the first vapor passage recess 153 at the bend BP. This allows the working fluid 102b condensed at the bend BP to be quickly collected. This suppresses heat transfer through the bend BP while suppressing a decrease in the heat transport capacity of the vapor chamber 101.

[0414] As shown in FIG. 76 , the second sheet 120 may be recessed toward the vapor passage 152a at the bend BP. The recession of the second sheet 120 at the bend BP may be greater than the recession of the second sheet 120 in the first region RR1 and the second region RR2. The recession of the second sheet 120 in the first region RR1 and the second region RR2 may be zero. That is, the second sheet 120 does not need to be recessed toward the vapor passage 152a in the first region RR1 and the second region RR2. In this case, a flow path corner with enhanced capillary action can be formed between the second sheet inner surface 120a and the wall surface 154a of the second vapor passage recess 154 at the bend BP. This allows the working fluid 102b condensed at the bend BP to be quickly collected. This suppresses heat transfer through the bend BP while also suppressing a decrease in the heat transport capacity of the vapor chamber 101.

[0415] 76 and 77, the height hh2a of the steam passage 152a at the bend BP may be smaller than the height hh2b of the liquid flow path mainstream groove 161 in the first region RR1 and the second region RR2. The heights hh2a and hh2b of the steam passage 152a represent the minimum dimension of the steam passage 152a in the Z direction and correspond to the minimum distance between the first sheet inner surface 110b and the second sheet inner surface 120a in the Z direction. In this case, the cross-sectional area of ​​the steam passage 152a can be narrowed at the bend BP. This increases the flow path resistance of the working steam 2a at the bend BP, further suppressing heat transfer through the bend BP.

[0416] The height hh2a of the vapor passage 152a at the bend BP may be zero, but it does not have to be zero. That is, a gap may be provided between the first sheet inner surface 110b and the second sheet inner surface 120a. In this case, the capillary force between the first sheet inner surface 110b and the second sheet inner surface 120a can be increased. This allows the condensed working fluid 102b to be retained in the vapor passage 152a by the capillary force. In this case, as shown in FIG. 77, a wall LW of the condensed working fluid 102b may be formed in the vapor passage 152a. This narrows the flow path cross-sectional area of ​​the vapor passage 152a at the bend BP, which may increase the flow path resistance of the working vapor 2a. This reduces heat transfer through the bend BP.

[0417] 76 , when multiple steam passages 152a are located within the bend portion BP, the heights hh2a of the steam passages 152a at the bend portion BP may be different from one another. Here, the end of the bend portion BP on the side of the first region RR1 is referred to as the first bend portion BE1, the end of the bend portion BP on the side of the second region RR2 is referred to as the second bend portion BE2, and the intermediate portion of the bend portion BP between the first bend portion BE1 and the second bend portion BE2 is referred to as the bend intermediate portion BM. In this case, for example, within the bend portion BP, the height hh2a of the steam passage 152a located near the bend intermediate portion BM may be smaller than the heights hh2a of the steam passages 152a located near the first bend end BE1 and the heights hh2a of the steam passages 152a located near the second bend end BE2. That is, within the bend portion BP, the heights hh2a of the steam passages 152a may decrease from the first bend end BE1 toward the bend intermediate portion BM and increase from the bend intermediate portion BM toward the second bend end BE2. In this case, the flow resistance of the working steam 2a at the bent intermediate portion BM can be increased, and heat transfer through the bent portion BP can be suppressed even if the bent portion BP extends over a wide area. Furthermore, the capillary force between the first sheet inner surface 110b and the second sheet inner surface 120a can be increased at the bent intermediate portion BM. This allows the condensed working fluid 102b to be retained in the vapor passage 152a by the capillary force. In this case, as shown in FIG. 77, a wall LW of the condensed working fluid 102b can be formed in the vapor passage 152a. This narrows the flow cross-sectional area of ​​the vapor passage 152a at the bent portion BP, and the flow resistance of the working steam 2a can be increased. This further suppresses heat transfer through the bent portion BP.

[0418] As shown in FIG. 78, even when the vapor chamber 101 is bent in an L-shape so that the first region RR1 and the second region RR2 are perpendicular to each other, the vapor chamber 101 may have a configuration similar to that of the modified example shown in FIG. 76. That is, at the bent portion BP, the first sheet 110 may be recessed toward the vapor passage 152a, and the second sheet 120 may be recessed toward the vapor passage 152a. Furthermore, the height hh2a of the vapor passage 152a at the bent portion BP may be smaller than the height hh2a of the liquid flow path mainstream groove 161 in the first region RR1 and the second region RR2. Furthermore, within the bent portion BP, the height hh2a of each vapor passage 152a may decrease from the first bent end portion BE1 toward the bent middle portion BM and increase from the bent middle portion BM toward the second bent end portion BE2. Even in this case, the same effect as that of the modified example shown in FIG. 76 can be obtained.

[0419] In the fourth embodiment described above, an example has been described in which vapor chamber 101 is composed of first sheet 110, second sheet 120, and main body sheet 130 (see FIG. 41). However, this is not limited to this, and vapor chamber 101 may be composed of first sheet 110 and main body sheet 130, as shown in FIG.

[0420] In the example shown in FIG. 79, the vapor chamber 101 includes a first sheet 110 and a main body sheet 130, but does not include a second sheet 120. In the example shown in FIG. 79, the main body sheet 130 and the first sheet 110 are laminated in this order. The device D may be attached to the first sheet outer surface 110a of the first sheet 110. The housing member Ha may be attached to the second main body surface 131b of the main body sheet 130. Heat from the working vapor 102a is transferred from the main body sheet 130 to the housing member Ha.

[0421] In the example shown in FIG. 79, the vapor flow path portion 150 is provided on the first main body surface 131a, but does not reach the second main body surface 131b and does not penetrate the sheet main body 131 of the main body sheet 130. That is, the first vapor passage 151 and the second vapor passage 152 of the vapor flow path portion 150 are constituted by the first vapor flow path recess 153, and the second vapor flow path recess 154 is not provided in the main body sheet 130.

[0422] The thickness tt5 of the vapor chamber 101 shown in FIG. 79 may be, for example, 100 μm to 1000 μm. The thickness tt6 of the first sheet 110 shown in FIG. 79 may be, for example, 6 μm to 200 μm. The thickness tt7 of the main body sheet 130 shown in FIG. 79 may be, for example, 50 μm to 800 μm.

[0423] Note that the present invention is not limited to the example shown in FIG. 79. As shown in FIG. 80, a vapor flow path portion 150' may be provided on the first sheet inner surface 110b of the first sheet 110. As shown in FIG. 80, the vapor flow path portion 150' of the first sheet 110 may be provided at a position facing the vapor flow path portion 150 of the main body sheet 130. That is, the vapor flow path portion 150' of the first sheet 110 may have a first vapor passage 151' facing the first vapor passage 151 of the main body sheet 130 and a second vapor passage 152' facing the second vapor passage 152 of the main body sheet 130. Each dimension of the vapor flow path portion 150' of the first sheet 110 may be approximately the same as each dimension of the vapor flow path portion 150 of the main body sheet 130. The thickness tt7' of the first sheet 110 shown in FIG. 80 may be approximately the same as the thickness tt7 of the main body sheet 130. Note that in the example shown in FIG. 80, the liquid flow path portion 160 is not provided in the first sheet 110, but the present invention is not limited to this, and the liquid flow path portion 160 may be provided in the first sheet 110.

[0424] 79 and 80, the vapor chamber 101 is composed of a first sheet 110 and a main body sheet 130. Even in such a case, the vapor chamber 101 is bent in a direction parallel to the first direction, so that the movement of the working vapor 102a between the first region RR1 and the second region RR2 can be suppressed at the bent portion BP. Therefore, in the bent vapor chamber 101, heat transfer via the bent portion BP can be suppressed.

[0425] Furthermore, according to the modified example shown in FIGS. 79 and 80, vapor chamber 101 is made up of first sheet 110 and main body sheet 130, so that vapor chamber 101 can be made even thinner.

[0426] According to the embodiment described above, performance can be improved even when the cable is bent.

[0427] The present invention is not limited to the above-described embodiments and modifications, and can be embodied by modifying the components within the scope of the gist of the present invention. Furthermore, various inventions can be created by appropriately combining the multiple components disclosed in the above-described embodiments and modifications. Some components may be omitted from all the components shown in the above-described embodiments and modifications.

Claims

[Claim 1] A vapor chamber containing a working fluid, a main body sheet including a first main body surface and a second main body surface located opposite to the first main body surface; a first sheet positioned on the first main body surface of the main body sheet; a plurality of vapor passages extending along a first direction through which the working fluid gas passes; a liquid flow path portion that communicates with the vapor path and through which the liquid of the working fluid passes, the main body sheet includes a reinforcing portion where the steam passage and the liquid flow passage portion are not arranged, A vapor chamber, wherein a main body surface recess is formed in the first main body surface of the reinforcing portion.

Images