Transfer machine, substrate processing equipment, substrate processing method, semiconductor device manufacturing method, and program

Abstract

To provide a technology that allows detection of a substrate even when it is a transparent substrate.SOLUTION: A transfer machine includes (a) an end effector configured to be able to grip a corresponding substrate, and (b) a substrate detector that includes (b1) a light projecting portion having a first end that emits reference light from a first optical fiber, (b2) a light receiving portion that substantially opposes the first end, having a second end portion that receives the reference light reflected by the back surface or the front surface of the corresponding transparent substrate and guides it to a second optical fiber, (b3) a plate extending from the vicinity of the first end to the vicinity of the second end on the opposite side of the corresponding substrate as viewed from the light projecting portion and the light receiving portion, and (b4) a wall that blocks direct incidence of the reference light from the first end to the second end, the substrate detector configured to be able to optically detect the corresponding substrate in at least one of the state of being inserted into the holder and a state where the corresponding substrate is being held.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present disclosure relates to a transfer machine, a substrate processing apparatus, a substrate processing method, a method for manufacturing a semiconductor device, and a program. [Background technology]

[0002] The transfer of substrates to be processed within semiconductor manufacturing equipment is performed by a substrate transfer machine. The substrate transfer machine is provided with multiple stages of substrate transport plates so that multiple substrates to be processed can be transferred at once, and a substrate detection sensor is sometimes provided for each substrate transport plate to detect the presence or absence of a substrate to be processed on the substrate transport plate (for example, Japanese Patent Application Laid-Open No. 2000-138280). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2000-138280 Summary of the Invention [Problem to be solved by the invention]

[0004] When the substrate detection sensor is a transmission type fiber sensor, if the substrate is visually transparent, it cannot block the light and may result in erroneous detection.

[0005] The present disclosure provides a technique that can detect a substrate even if the substrate is transparent. [Means for solving the problem]

[0006] According to one aspect of the present disclosure, (a) an end effector configured to be inserted into a holder that accommodates multiple substrates in multiple stages without coming into contact with the substrates and then be able to grip the corresponding substrates; (b) positioned at a specific relative position with respect to the end effector; (b1) a light projecting unit formed in a rod shape and having a first end portion that emits reference light from a first optical fiber; (b2) a rod-shaped light-receiving unit having a second end portion that is substantially opposite to the first end portion and receives the reference light reflected by the back surface or the front surface of the corresponding transparent substrate and guides the reference light to a second optical fiber; (b3) a plate extending from a vicinity of the first end to a vicinity of the second end on the opposite side of the corresponding substrate as viewed from the light-emitting unit and the light-receiving unit; (b4) a wall that blocks direct incidence of the reference light from the first end to the second end, A technology is provided that includes a substrate detector configured to optically detect the corresponding substrate when the substrate is inserted into the holder or when the corresponding substrate is being held. [Effects of the Invention]

[0007] According to the present disclosure, even a transparent substrate can be detected. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a perspective view of a substrate processing apparatus that is preferably used in an embodiment of the present disclosure. [Figure 2] FIG. 2 is a schematic perspective view of a transfer machine preferably used in an embodiment of the present disclosure, illustrating transfer onto a boat by the transfer machine. [Figure 3] FIG. 3 is a diagram showing the arrangement of an end effector and a substrate detector preferably used in an embodiment of the present disclosure. [Figure 4] FIG. 4 is a diagram illustrating the range of arrangement of the light receiving portion of the substrate detector preferably used in the embodiment of the present disclosure. [Figure 5] FIG. 5 is a schematic configuration diagram of a controller of a substrate processing apparatus that is preferably used in an embodiment of the present disclosure. [Figure 6] FIG. 6 is a flow diagram illustrating a substrate processing process applied in an embodiment of the present disclosure. [Figure 7]FIG. 7 is a cross-sectional view showing a substrate detector according to another embodiment of the present disclosure. [Figure 8] FIG. 8 is a perspective view showing a substrate detector according to another embodiment of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, one embodiment of the present disclosure will be described mainly with reference to Figures 1 to 6. Note that all drawings used in the following description are schematic, and the dimensional relationships between elements, the ratios of elements, etc. shown in the drawings do not necessarily match those in reality. Furthermore, the dimensional relationships between elements, the ratios of elements, etc. do not necessarily match between multiple drawings. Unless otherwise specified in the specification, each element is not limited to one, and multiple elements may be present.

[0010] (Overview of substrate processing equipment) The substrate processing apparatus described in this embodiment is used in the manufacturing process of semiconductor devices, and heats the substrate to be processed (heat treatment) by heating the substrate with a heater while the substrate is accommodated in a processing chamber. More specifically, it is a vertical substrate processing apparatus that simultaneously processes multiple substrates stacked vertically at a predetermined interval.

[0011] Substrates to be processed by substrate processing apparatuses include, for example, semiconductor wafer substrates (hereinafter simply referred to as "wafers") on which semiconductor devices are fabricated. Heat treatments performed by substrate processing apparatuses include, for example, oxidation, diffusion, annealing, reflow, densification, film formation by thermal CVD (Chemical Vapor Deposition) reactions, and film quality improvement (treatment) processes.

[0012] (1) Configuration of the substrate processing equipment The entire apparatus will be described with reference to Figure 1. Figure 1 shows the main parts of the substrate processing apparatus.

[0013] The substrate processing apparatus 1 includes a housing 13. A pod (holding device) 21, which is a sealed substrate container, is carried into and out of the substrate processing apparatus 1 by an in-process transport device (not shown).

[0014] A sub-housing 28 is provided along the rear end of the lower portion of the housing 13 in the rearward / rearward direction. A pair of wafer loading / unloading openings 32 are provided in a front wall 29 of the sub-housing 28, arranged vertically in two tiers, one above the other, for loading and unloading wafers 31 into and out of the sub-housing 28. Pod openers 26 are provided for the upper and lower wafer loading / unloading openings 32, respectively.

[0015] The pod opener 26 includes a mounting table 33 on which the pod 21 is placed, and an opening / closing mechanism 34 that opens and closes the lid of the pod 21. The pod opener 26 is configured to open and close the wafer entrance / exit of the pod 21 by opening and closing the lid of the pod 21 placed on the mounting table 33 using the opening / closing mechanism 34.

[0016] The sub-housing 28 forms a transfer chamber (loading chamber, loading area) 35 that is airtight from the space in which the pod opener 26 is disposed. A transfer machine 36 is installed in the front region of the transfer chamber 35. The transfer machine 36 is equipped with multiple end effectors 37 that hold wafers 31. The end effectors 37 are capable of translating horizontally, rotating horizontally, and moving up and down vertically. The transfer machine 36 is configured to load and unload wafers 31 into and from a boat 38 that serves as a substrate holder. The end effectors 37 are also called substrate grippers, wafer loading plates, hands, chucks, forks, or tweezers, and five of them are arranged in a direction perpendicular to the surface of the wafers 31 they grip.

[0017] A vertical processing furnace 12 is installed above the transfer chamber 35. The processing furnace 12 has a processing chamber 14 formed therein, and the lower end of the furnace port near the bottom of the processing chamber 14 is open and can be opened and closed by a furnace port shutter (not shown). The processing chamber 14 heat-treats the wafers 31 held in a boat 38.

[0018] A boat elevator 42 for raising and lowering the boat 38 is installed on the side of the sub-housing 28. A seal cap 44 serving as a lid is attached horizontally to the lifting platform of the boat elevator 42. The seal cap 44 supports the boat 38 vertically and can airtightly close the furnace throat when the boat 38 is loaded into the processing furnace 12. The transfer chamber 35 is adjacent to the processing chamber 14 and transports wafers 31 together with the boat 38 between them. The boat 38 is configured to hold multiple wafers 31 (e.g., between 50 and 175) horizontally and at predetermined intervals in multiple stages, with their centers aligned. As shown in FIG. 2, the boat 38 has support columns 38a to 38c serving as columns for holding the wafers 31. The support columns 38a to 38c are provided with grooves (slots) for holding the wafers 31. The interval between the slots, that is, the interval between the wafers 31 held in the boat, is different from the interval between the wafers 31 held in the pod 21 and can be typically 6 mm or less.

[0019] A rotation mechanism 46 is installed on the opposite side of the seal cap 44 from the processing chamber 14, to rotate the boat 38 around a central axis corresponding to the center of the wafers 31. The rotation axis of the rotation mechanism 46 passes through the seal cap 44 and is connected to the boat 38. The rotation mechanism 46 is configured to rotate the boat 38, thereby rotating the wafers 31.

[0020] An example of the configuration of the transfer machine will be described with reference to Fig. 2. Fig. 2 shows a state in which the transfer machine 36 transfers wafers 31 to a boat 38. That is, the end effector 37 of the transfer machine 36 faces the support columns 38a and 38c of the boat 38.

[0021] The transfer machine 36 has a guide 360 ​​provided along the vertical direction (Z-axis direction), a Z-axis direction drive unit 361, a Y-axis rotation drive unit 362, an X-axis direction drive unit 363, and a V-axis direction drive unit 364. The drive units 361 to 364 can be called a drive system.

[0022] The Z-axis direction drive unit 361 is provided at the lower end or upper end of the guide 360 ​​to move the mount 360a up and down along the guide 360 ​​(Z-axis direction, vertical direction).

[0023] Y-axis rotation drive unit 362 is installed on the upper surface of mount 360a so that it can rotate in the Y-axis direction itself, in order to rotate clockwise or counterclockwise horizontally (rotate around the Y-axis) while supporting X-axis drive unit 363 so that the X-axis and Y-axis are perpendicular to each other. Since pod 21 is usually positioned between the direction of boat 38 and the opposite direction when viewed from the Y-axis, a rotation range of about 180 degrees is sufficient.

[0024] The X-axis direction drive unit 363 is provided integrally with or inside the Y-axis rotation drive unit 362 in order to move the V-axis direction drive unit 364 back and forth in the horizontal direction (X-axis direction) while supporting the V-axis direction drive unit 364. Note that the X-axis defines the direction in which the end effector 37 moves protruding from the Y-axis rotation drive unit 362 in order to enter the boat 38 or the pod 21 as "forward."

[0025] The V-axis direction drive unit 364 is provided on the X-axis direction drive unit 363, and is configured to horizontally support the five end effectors 37 while making the spacing between them adjustable (changeable) in the Z-axis direction. Each end effector 37 is attached to the V-axis direction drive unit 364 by a corresponding attachment unit 39. The V-axis direction drive unit 364 and attachment unit 39 form a pitch variable mechanism.

[0026] The end effector 37 is inserted without coming into contact with the wafer 31 and then can grip the corresponding wafer 31. This allows the transfer machine 36 to use the end effector 37 to remove the wafer 31 from the pod 21 and charge it into the boat 38. After any processing is performed on the wafer 31 in the processing furnace 12, the transfer machine 36 can use the end effector 37 to remove (discharge) the wafer 31 from the boat 38 and charge it into the pod 21.

[0027] The transfer machine 36 further includes a pair of sensor rods 50 provided on both sides of the Y-axis rotation drive unit 362, and a forward / backward drive unit 365 that moves the sensor rods 50 in the X-axis direction.

[0028] The sensor rod 50 extends upward along both side surfaces of the Y-axis rotation drive unit 362 to approximately the same height as one of the end effectors 37, and is configured to bend at approximately a right angle in the direction opposite to the mounting direction of the end effector 37 to the X-axis drive unit 363, i.e., backward along the X-axis. The sensor rod 50 holds a fiber sensor 51 as a mapping sensor.

[0029] The light transmitting unit or light receiving unit of a fiber sensor 51 is attached to the tip of the pair of sensor rods 50. The fiber sensors 51 are a pair of transmission type sensors, one of which transmits light and the other of which receives it, and can be arranged so that the light path (optical axis) formed between the light transmitting unit and the light receiving unit is parallel to the tangent line of the wafers 31. By detecting a blockage of the light path, the fiber sensor 51 counts the number of wafers 31 loaded in the pod 21 or boat 38 and performs mapping to detect normality or abnormality, such as protrusion of wafers.

[0030] The advance / retract drive units 365 are arranged on both sides of the Y-axis rotation drive unit 362, and support the sensor rod 50 so that it can move in the X-axis direction between the protruding position and the retracted position.

[0031] The transfer machine 36 is provided with five substrate detectors 60 corresponding to the five end effectors 37. Each substrate detector 60 is disposed at a specific relative position with respect to the corresponding end effector 37. Each substrate detector 60 is configured to be able to optically detect the corresponding wafer 31 in at least one of a state in which the corresponding end effector 37 is inserted between wafers 31 held in the boat 38 or pod 21 and a state in which the end effector 37 is gripping the corresponding wafer 31.

[0032] The substrate detector 60 will be described with reference to Figures 3 and 4. Figure 3 shows a state in which the end effector 37 is gripping the corresponding wafer 31.

[0033] The substrate detector 60 has a support arm 61 as a fixing member, a light projecting unit 62, a light receiving unit 63, and a partition 64. The substrate detector 60 is a pair of reflective sensors consisting of the light projecting unit 62 and the light receiving unit 63, which are configured as fiber sensors. The substrate detector 60 is provided for each end effector 37, separate from the end effector 37.

[0034] The support arm 61 is screwed to one side surface of the mounting portion 39 of the end effector 37. The support arm 61 extends parallel to the longitudinal direction of the end effector 37 and bends and extends in the tangential direction of the wafer 31 to be placed thereon to form a tip portion 611.

[0035] A rod-shaped light-projecting unit 62 and a light-receiving unit 63 are provided at the tip 611 of the support arm 61. The light-projecting unit 62 and the light-receiving unit 63 are inserted into through-holes provided in the tip 611 and fixed (screwed) with screws 612, 613 (see FIG. 8). The light-projecting unit 62 and the light-receiving unit 63 are arranged approximately parallel to each other. The axes (central axes) of the light-projecting unit 62 and the light-receiving unit 63 point toward approximately the center of the wafer 31 placed on the end effector 37 (approximately coincident with the radial direction). The tips of the light-projecting unit 62 and the light-receiving unit 63 are located laterally away from the side edges of the end effector 37. The optical axes of the light-projecting unit 62 and the light-receiving unit 63 are located inside the outline of the wafer 31 placed on the end effector 37.

[0036] The first end 621 of the light-projecting unit 62 emits reference light from a first optical fiber 623. The first end 621 has a reflector 622 that reflects the reference light from the first optical fiber 623 in a direction perpendicular to the longitudinal direction of the light-projecting unit 62. This allows the reference light from the optical fiber 623 to be irradiated onto the wafer 31. The second end 631 of the light-receiving unit 63 receives the reference light reflected by the back or front surface of the wafer 31 and guides it to the second fiber 633. The second end 631 has a reflector 632 that reflects the reference light from a direction perpendicular to the longitudinal direction of the light-receiving unit 63 and guides it to the second optical fiber 633. This allows the reference light reflected by the wafer 31 to be received by the optical fiber 623. The first end 621 and the second end 631 have small holes (e.g., approximately 0.5 mm in diameter) on their side surfaces, through which light can enter and exit.

[0037] The light-projecting unit 62 has a sheath tube 624 that houses the reflector 622 and a portion of the optical fiber 623, and a fixed unit 625 that houses another portion of the optical fiber 623. The fixed unit 625 is connected to the sheath tube 624 and has a larger diameter than the sheath tube 624. The light-receiving unit 63 has a sheath tube 634 (see FIG. 8) that houses the reflector 632 and a portion of the optical fiber 633, and a fixed unit 635 (see FIG. 8) that houses another portion of the optical fiber 633. The fixed unit 635 is connected to the sheath tube 634 and has a larger diameter than the sheath tube 634.

[0038] The sheath tubes 624, 634 and the fixing parts 625, 635 are, for example, metal tubes, and the optical fibers 623, 633 are sealed inside with an adhesive. The fixing parts 625, 635 have enough strength to withstand screw fastening. Their large diameters make fixing and positioning easy.

[0039] A partition 64 fits into a recess in the tip 611 of the support arm 61 and is fixed (screwed) with screws 614, 615 (see FIG. 8). The partition 64 extends from the tip 611 toward the center of the wafer 31 placed on the end effector 37. The partition 64 is preferably configured by, for example, black anodizing or black painting. For example, the reflectance in this case is about 0.1%. This makes it possible to reduce reflection of the reference light.

[0040] The partition 64 includes a plate 641 disposed below the light-projecting unit 62 and the light-receiving unit 63, a wall 642 disposed between the light-projecting unit 62 and the light-receiving unit 63, and a fixing unit 643 fixed to the arm 61. The plate 641 is configured to extend from the vicinity of the first end 621 to the vicinity of the second end 631 on the opposite side (here, downward) of the wafer 31 to be detected when viewed from the light-projecting unit 62 and the light-receiving unit 63. The wall 642 is provided on the surface of the plate 641 facing the wafer 31 to be detected, and prevents (blocks) the reference light from the first end 621 from directly entering the second end 631. Therefore, the wall 642 has a predetermined height that is higher than the height of the axial center of the light-projecting unit 62 and the axial center of the light-receiving unit 63. The wall 642 also has a predetermined width.

[0041] The support arm 61 fixes the positions of the first end 621 of the light projecting unit 62 and the second end 631 of the light receiving unit 63 to the plate 641 or the wall 642. This makes it possible to optimize the distance (sensor pitch) between the light projecting unit 62b and the light receiving unit 63b.

[0042] The functions of plate 641 and wall 642, and the range of arrangement of light-receiving unit 63 will be described with reference to Fig. 4. Fig. 4 shows the arrangement of plate 641a, wall 642a, light-projecting unit 62a, and light-receiving unit 63a in the top row of substrate detector 60, and plate 641b, wall 642b, light-projecting unit 62b, and light-receiving unit 63b in the row below. The range of arrangement of light-receiving unit 63 when the position of light-projecting unit 62 relative to wall 642 is fixed will be described.

[0043] At the top, there is no plate 641 above the wafer 31a. Therefore, the reference light from the light-projecting unit 62a can be reflected only by the wafer 31a and enter the light-receiving unit 63a. The reference light from the light-projecting unit 62a can be incident on the light-receiving unit 63a if it exceeds the wall 642a. The light-receiving unit 63a can be positioned up to position P3.

[0044] The upper plate 641a blocks the reference light from the lower light-projecting unit 62b. The upper wall 642a blocks the reference light from the upper light-projecting unit 62a from directly entering the light-receiving unit 63a. The reference light from the lower light-projecting unit 62b is reflected by the lower surface of the wafer 31a and the lower surface of the upper plate 641a.

[0045] On a stage below the top stage, for example, the stage one stage below the top stage, there is a plate 641a above the wafer 31b. Therefore, the reference light from the light projecting unit 62b can be reflected by the plate 641a and enter the light receiving unit 63a in addition to the wafer 31b.

[0046] Let Y be the distance (height) between the axial centers of the lower-level light-projecting unit 62b and light-receiving unit 63b and the underside of the wafer 31b located above it. Let H be the distance (height) between the axial centers of the light-projecting unit 62b and light-receiving unit 63b and the underside of the upper-level plate 641a. Let X be the distance between the axial centers of the light-projecting unit 62b and light-receiving unit 63b and the side surface of the lower-level wall 642b. Let V be half the length (width) of the wall 642 in the direction perpendicular to the axial centers of the light-projecting unit 62 and light-receiving unit 63, and let h be the height from the axial centers of the light-projecting unit 62 and light-receiving unit 63 to the top surface of the wall 642.

[0047] The angle at which the reference light from light-projecting unit 62b exceeds wall 642b is defined as α, based on the line connecting the axes of light-projecting unit 62b and light-receiving unit 63b. The angle at which the reference light from light-projecting unit 62b is reflected by the underside of wafer 31b and exceeds wall 642b is defined as β. The angle at which the reference light from light-projecting unit 62b is reflected by the underside of upper plate 641a at the center of the width of wall 642b is defined as θ. Here, the relationship between α, β, and θ is as follows: 0°<α<β<θ<90°

[0048] If the range in which the wafer 31b is detected but the upper plate 641a is not detected (effective range: distance between position P1 and position P2) is A, A is as follows. Y / tanβ <A<H / tanθ tanθ=Y / (X+V) tanβ=h / (XA) ∴YX / (Y+h) <A<H(X+V) / Y

[0049] The range between positions P2 and P3 is a range in which the wafer 31b and the upper plate 641a are detected, and the range between positions P3 and P4 is a range in which only the upper plate 641a is detected.

[0050] The light emitted from the first end 621 spreads at a certain angle (the same applies to the received light). The aperture angle (half-value angle), which represents the angle of spread, is preferably 2 to 60 degrees. A wider aperture angle is more desirable so that the angle precision required when assembling the substrate detector 60 is not too strict. Note that in this specification, the notation of a numerical range such as "2 to 60 degrees" means that the lower and upper limits are included in the range. Therefore, for example, "2 to 60 degrees" means "2 degrees or more and 60 degrees or less." The same applies to other numerical ranges.

[0051] The light projecting unit 62 and the light receiving unit 63 (proximal ends of a pair of optical fibers 623, 633) are connected to the amplifier unit 40 (see FIG. 5). The amplifier unit 40 incorporates a light source (e.g., a light emitting diode), a photodetector (e.g., a photodiode), and a detection circuit.

[0052] Light emitted from a light source built into the amplifier unit 40 enters the base end of the optical fiber 623, propagates through the optical fiber 623, enters the reflector 622 from its tip face, and exits from the first end 621. When the emitted light (reference light) is reflected by the wafer 31 to be detected, the reflected light enters the second end 631 and then enters the tip face of the optical fiber 633. Therefore, the light-projecting unit 62 and the light-receiving unit 63 are fixed to the tip 611 of the support arm 61 so that the exit face (hole) of the first end 621 and the entrance face (hole) of the second end 631 face in approximately the same direction. The incident light propagates through the optical fiber 633 and reaches the photodetector built into the amplifier unit 40.

[0053] The detection circuit built into the amplifier unit 40 determines the presence or absence of a substrate (including a transparent substrate) by thresholding the light reception level. The threshold can be the same for all substrate detectors. In other words, since there is little risk of false detection, there is no need to adjust each substrate detector.

[0054] 5, a controller 210, which is a control unit (control means), is configured as a computer including a CPU (Central Processing Unit) 212, a RAM (Random Access Memory) 214, a storage device 216, and an I / O port 218. The RAM 214, the storage device 216, and the I / O port 218 are configured to be able to exchange data with the CPU 212 via an internal bus 220. An input / output device 222 configured as, for example, a touch panel is connected to the controller 210.

[0055] The storage device 216 is configured with, for example, a flash memory, an HDD (Hard Disk Drive), etc. Control programs for controlling the operation of the substrate processing apparatus, process recipes describing procedures and conditions for substrate processing (described later), etc., are readably stored in the storage device 216. The process recipe is a combination of procedures in the substrate processing steps (described later) that are executed by the controller 210 to obtain a predetermined result, and functions as a program. Hereinafter, the process recipes, control programs, etc. are collectively referred to simply as programs. In this specification, the term "program" may refer to only a process recipe, only a control program, or both. The RAM 214 is configured as a memory area (work area) for temporarily storing programs, data, etc. read by the CPU 212.

[0056] The I / O port 218 is connected to the transfer machine 36, the rotation mechanism 46, the boat elevator 42, the amplifier unit 40, and the like.

[0057] The CPU 212 is configured to read and execute a control program from the storage device 216, and also to read a process recipe from the storage device 216 in response to input of an operation command from the input / output device 222. The CPU 212 is configured to control the wafer transfer operation by the transfer machine 36, the rotation and rotation speed adjustment operation of the boat 38 by the rotation mechanism 46, the lifting and lowering operation of the boat 38 by the boat elevator 42, and the substrate detection operation by the amplifier unit 40, in accordance with the contents of the read process recipe.

[0058] The controller 210 can be configured by installing the above-mentioned program stored in the external storage device 224 into a computer. The external storage device 224 is, for example, a magnetic tape, a magnetic disk such as a flexible disk or a hard disk, an optical disk such as a CD or a DVD, a magneto-optical disk such as an MO, or a semiconductor memory such as a USB memory or a memory card. The storage device 216 and the external storage device 224 are configured as computer-readable recording media. Hereinafter, these will be collectively referred to simply as recording media. When the term "recording medium" is used in this specification, it may include only the storage device 216, only the external storage device 224, or both. Note that the program may be provided to the computer using a communication means such as the Internet or a dedicated line, without using the external storage device 224.

[0059] (2) Substrate processing process An outline of a substrate processing process for processing a substrate using the substrate processing apparatus 1 as a semiconductor manufacturing apparatus will be described. This substrate processing process is, for example, one process for manufacturing a semiconductor device. In the following description, the operation and processing of each part constituting the substrate processing apparatus 1 are controlled by a controller 210.

[0060] (Substrate loading process: S10) When the pod 21 is supplied to the substrate processing apparatus 1, it is transferred to the mounting table 33.

[0061] The open end face of the pod 21 placed on the mounting table 33 is pressed against the edge of the opening of the wafer loading / unloading port 32 in the front wall 29 of the sub-housing 28, and the lid is removed by the opening / closing mechanism 34, opening the wafer entrance / exit.

[0062] When the pod 21 is opened by the pod opener 26, the sensor rod 50 of the transfer machine 36 is moved to a protruding position (in a direction approaching the pod 21) by the forward / backward driving unit 365. Then, the sensor rod 50 is moved up and down at a constant speed by the Z-axis direction driving unit 361, and the wafers 31 are mapped by the fiber sensor 51, thereby detecting the wafers 31 in the pod 21 in order. After the mapping operation is completed, the sensor rod 50 is returned to the retracted position.

[0063] Then, the end effector 37 advances, rises, and retreats, the Y-axis rotary drive unit 362 turns, and the pitch is changed, and the end effector 37 advances, falls, and retreats, and the Y-axis rotary drive unit 362 turns and the pitch is changed, and these cycles are repeated in sequence. As a result, the wafers 31 are picked up from inside the pod 21 through the wafer loading / unloading port 32 and loaded (charged) into the boat 38. The output (state) of the substrate detector 60 when the end effector 37 is inserted into the pod 21 is stored. The output of the substrate detector 60 is monitored during transfer, and if the output changes, it is determined to be abnormal, the transfer is stopped, and an alarm is sounded. This makes it possible to detect a substrate falling or shifting during transfer.

[0064] After the loading is completed, the lower end of the processing furnace 12, which had been closed by the furnace port shutter, is opened by the furnace port shutter. Then, the boat 38 holding the wafers 31 is loaded from the transfer chamber 35 into the processing furnace 12 by the boat elevator 42 raising the seal cap 44 (boat up).

[0065] (Film forming process: S20) After loading, the wafers 31 are subjected to heat treatment in the processing chamber 14 in the processing furnace 12 .

[0066] (Substrate unloading process: S30) Next, the boat 38 on which the heat-treated wafers 31 are placed is carried out (boat unloading) from the processing chamber 14 to the transfer chamber 35. Then, the boat 38 cools the wafers 31 after the heat treatment.

[0067] After cooling, the sensor rod 50 of the transfer machine 36 is moved to the protruding position by the forward / backward driving unit 365. Then, the sensor rod 50 is moved up and down by the Z-axis direction driving unit 361, and the fiber sensor 51 performs a mapping operation on the wafer 31. When the mapping is completed, the sensor rod 50 is returned to the stored position.

[0068] Next, the end effector 37 moves forward, upward, and backward, the Y-axis rotary drive unit 362 turns, and the pitch is changed, and the end effector 37 moves forward, downward, and backward, and the Y-axis rotary drive unit 362 turns and the pitch is changed, and these steps are repeated in sequence. As a result, the wafers 31 are picked up from the boat 38 and transferred to the pod 21 through the wafer transfer port 32. The pod 21 is then transferred to the outside of the housing 13. During this time, the output of the substrate detector 60 is monitored, as in the substrate transfer process 10.

[0069] According to this aspect, one or more of the following effects can be obtained.

[0070] (a) The height of the substrate detector can be reduced, making it possible to accommodate transfer to narrow-pitch boats.

[0071] (b) It is possible to reliably block reflected light (external light) from sources other than the target wafer, thereby improving detection accuracy.

[0072] (c) The substrate detector is a reflective sensor in which the light projecting part is positioned so that the angle of incidence is close to 90°, so that the reflectivity is high in accordance with Fresnel's formula, and higher sensitivity (higher S / N) is possible compared to a transmission sensor with an orthogonal or oblique optical axis.

[0073] (d) The wafer 31 can be detected even if it is a visually transparent wafer (which transmits almost all visible light), such as a silicon carbide (SiC) wafer.

[0074] (e) Even if the pitch of the end effector is changed, the optical arrangement such as the distance between the light projecting unit and the light receiving unit does not change, so it is possible to eliminate the effect on the operation of the sensor.

[0075] Another embodiment of the substrate detector 60 will be described with reference to Figures 7 and 8. Figure 7 shows the substrate detector 60 inserted between wafers 31 placed on the pod 21 or boat 38.

[0076] The configuration of the plate 641 of the partition 64 in this embodiment is different from the plate 641 in the embodiment shown in Fig. 4. The other configuration of the substrate detector 60 in this embodiment is the same as in the embodiment.

[0077] The width of the plate 641 is smaller than the distance between the central axis of the light-emitting unit 62 and the central axis of the light-receiving unit 63. The ends of the plate 641, which are close to the first end 621 and the second end 631, respectively, have first and second tapered surfaces 644, 645 that are pointed toward the points (lower ends) of the first end 621 and the second end 631 that are farthest from the corresponding wafer 31 (the wafer 31 to be detected). This prevents the reference light from entering from below. The tapered surfaces 644, 645 are, for example, chamfered at 30 degrees with respect to the horizontal plane. The points (lower ends) of the first end 621 and the second end 631 that are farthest from the corresponding wafer 31 are positioned approximately flush with the surface of the plate 641 opposite the corresponding wafer 31 (the lower surface of the plate 641). The lower surface of the plate 641 is positioned approximately flush with the lower surface of the corresponding end effector 37.

[0078] The maximum thickness of the portion (tip) inserted between wafers of the substrate detector 60, that is, the sum of the height of the plate 641 and the wall 642, is substantially the same as the outer diameter of the sheath tubes 624 and 634, and this is designated as H1. When the end effector 37 receives the wafer 31, the end effector 37 and the substrate detector 60 rise toward the wafer 31. The distance between the lower end of the substrate detector 60 and the lower surface of the wafer 31 at this time (wafer placement height) is designated as H2. In addition, the maximum thickness height (height) of the portion of the end effector 37 inserted between wafers is designated as H3. Here, H1 < H2 < H3. H1 is, for example, 0.5 to 2 mm, H2 is, for example, 1 mm to 3 mm or H1 + 0.2 mm to H1 + 1.5 mm, and H3 is, for example, 11.3 to 4 mm or H2 + 0.3 mm to H2 + 2 mm.

[0079] Also in this embodiment, the same effects as those of the above-described embodiment can be obtained. Further, in this embodiment, the position of the lower surface of the plate 641 is arranged closer to the light projecting portion 62 and the light receiving portion 63 than the position of the lower surface of the plate 641 in the embodiment shown in FIG. 4, and the portion (tip) inserted between wafers of the substrate detector 60 is thinned. Thereby, the upper end of the tip of the substrate detector 60 can be made lower than the lower surface of the wafer 31 to avoid contact with the wafer 31. Also, the lower end of the tip of the substrate detector 60 can be made higher than the lower end of the end effector 37 to avoid reducing the conveyance clearance.

[0080] As described above, the embodiments of the present disclosure have been specifically described, but the present disclosure is not limited to the above-described embodiments, and various modifications can be made without departing from the gist thereof. For example, a groove can be provided along the radial direction of the wafer on the lower surface of the plate 641 directly below the wall 642 to further reduce the back surface reflection of the plate 641.

[0081] In the above-described embodiment, an example of heat treatment using a batch-type substrate processing apparatus that processes multiple substrates at a time has been described. The present disclosure is not limited to the above-described embodiment and can be suitably applied, for example, to heat treatment using a single-wafer substrate processing apparatus that processes one or several substrates at a time. Furthermore, in the above-described embodiment, an example of film formation using a substrate processing apparatus having a hot-wall processing furnace has been described. The present disclosure is not limited to the above-described embodiment and can be suitably applied to heat treatment using a substrate processing apparatus having a cold-wall processing furnace.

[0082] When using these substrate processing apparatuses, each process can be performed under the same process procedures and conditions as in the above-described embodiment, and the same effects as in the above-described embodiment can be obtained. [Explanation of symbols]

[0083] 36: Transfer machine 37: End effector 60: Substrate detector 62: Light projection unit 621: First end 63: Light receiving part 631: Second end 641: Plate 642: Wall

Claims

1. (a) an end effector configured to be inserted into a holder that accommodates multiple substrates in multiple stages without coming into contact with the substrates and then be able to grip the corresponding substrates; (b) positioned at a specific relative position with respect to the end effector; (b1) a light projecting unit formed in a rod shape and having a first end portion that emits reference light from a first optical fiber; (b2) a rod-shaped light-receiving unit having a second end portion that is substantially opposite to the first end portion and receives the reference light reflected by the back surface or the front surface of the corresponding transparent substrate and guides the reference light to a second optical fiber; (b3) a plate extending from a vicinity of the first end to a vicinity of the second end on the opposite side of the corresponding substrate as viewed from the light-emitting unit and the light-receiving unit; (b4) a wall that blocks direct incidence of the reference light from the first end to the second end, A transfer machine comprising a substrate detector configured to optically detect the corresponding substrate when the substrate is inserted into the holder or when the corresponding substrate is being held.

2. 2. The transfer machine according to claim 1, wherein the light-emitting unit and the light-receiving unit are disposed substantially parallel to each other, and the width of the plate is smaller than the distance between the central axes of the light-emitting unit and the light-receiving unit.

3. 2. The transfer machine according to claim 1, wherein both ends of the plate adjacent to the first end and the second end have first and second tapered surfaces that are pointed toward the points of the first end and the second end that are farthest from the corresponding substrate.

4. 2. The transfer machine according to claim 1, wherein the plate is positioned approximately parallel to the corresponding substrate held by the end effector, and the points of the first end and the second end that are farthest from the corresponding substrate are positioned approximately flush with the surface opposite the corresponding substrate.

5. a plurality of the end effectors are provided in a direction perpendicular to the surface of the substrate to be gripped; The transfer machine according to claim 1 , wherein the substrate detector is provided for each of the end effectors separately from the end effectors.

6. The transfer machine according to claim 5, further comprising a pitch variable mechanism configured to be able to change the interval between the plurality of end effectors.

7. The transfer machine according to claim 5 , wherein the substrate detector further comprises a fixing member that fixes and holds the positions of the first end and the second end relative to the plate or the wall.

8. the first end portion has a first reflector that reflects the reference light from the first optical fiber in a direction perpendicular to a longitudinal direction of the light projecting portion, 6. The transfer machine according to claim 5, wherein the second end portion has a second reflector that reflects the reference light from a direction perpendicular to the longitudinal direction of the light receiving portion and guides the reference light to the second optical fiber.

9. the light projecting unit has a first sheath tube that houses a portion of the first optical fiber and the first end portion, and a first fixing unit that is connected to the first sheath tube and houses another portion of the first optical fiber and has a diameter larger than that of the first sheath tube; The transfer machine described in claim 8, wherein the light receiving unit has a second sheath tube that accommodates a portion of the second optical fiber and the second end, and a second fixing unit that is connected to the second sheath tube and has a larger diameter than the second sheath tube and accommodates another portion of the second optical fiber.

10. the light-projecting unit and the light-receiving unit are disposed substantially parallel to each other, and a longitudinal direction of the light-projecting unit or the light-receiving unit substantially coincides with a radial direction of the corresponding substrate; the light projecting unit has a first sheath tube that houses a portion of the first optical fiber and the first end portion, and a first fixing unit that is connected to the first sheath tube and houses another portion of the first optical fiber and has a diameter larger than that of the first sheath tube; The transfer machine described in claim 5, wherein the light receiving unit has a second sheath tube that accommodates a portion of the second optical fiber and the second end, and a second fixing unit that is connected to the second sheath tube and has a larger diameter than the second sheath tube and accommodates another portion of the second optical fiber.

11. (a) an end effector configured to be inserted into a holder that accommodates multiple substrates in multiple stages without coming into contact with the substrates and then be able to grip the corresponding substrates; (b) positioned at a specific relative position with respect to the end effector; (b1) a light projecting unit formed in a rod shape and having a first end portion that emits reference light from a first optical fiber; (b2) a rod-shaped light-receiving unit having a second end portion that is substantially opposite to the first end portion and receives the reference light reflected by the back surface or the front surface of the corresponding transparent substrate and guides the reference light to a second optical fiber; (b3) a plate extending from a vicinity of the first end to a vicinity of the second end on the opposite side of the corresponding substrate as viewed from the light-emitting unit and the light-receiving unit; (b4) a wall that blocks direct incidence of the reference light from the first end to the second end, A substrate processing apparatus comprising: a substrate detector configured to optically detect the corresponding substrate when the substrate is inserted into the holder or when the corresponding substrate is being held.

12. (a) an end effector configured to be inserted into a holder that accommodates a plurality of substrates in multiple stages without contacting the substrate and then be able to grip the corresponding substrate; (b) a light projecting unit that is arranged at a specific relative position with respect to the end effector, (b1) formed in a rod shape and having a first end that emits reference light from a first optical fiber; and (b2) a second rod shape that is substantially opposite the first end and receives the reference light reflected by the back surface or front surface of the corresponding substrate, which is transparent, and guides it to a second optical fiber. (b2) a light-receiving unit having an end, (b3) a plate extending from the vicinity of the first end to the vicinity of the second end on the opposite side of the corresponding substrate as viewed from the light-emitting unit and the light-receiving unit, and (b4) a wall that blocks direct incidence of the reference light from the first end to the second end, and a substrate detector configured to be able to optically detect the corresponding substrate at least in one of a state where the substrate is inserted into the holder and a state where the corresponding substrate is being held; processing the substrate; A substrate processing method comprising:

13. 13. The substrate processing method according to claim 12, wherein in the substrate transporting step, an output of the substrate detector is monitored to detect a drop or deviation of the substrate during transport.

14. (a) an end effector configured to be inserted into a holder that accommodates a plurality of substrates in multiple stages without contacting the substrate and then be able to grip the corresponding substrate; (b) a light projecting unit that is arranged at a specific relative position with respect to the end effector, (b1) formed in a rod shape and having a first end that emits reference light from a first optical fiber; and (b2) a second rod shape that is substantially opposite the first end and receives the reference light reflected by the back surface or front surface of the corresponding substrate, which is transparent, and guides it to a second optical fiber. (b2) a light-receiving unit having an end, (b3) a plate extending from the vicinity of the first end to the vicinity of the second end on the opposite side of the corresponding substrate as viewed from the light-emitting unit and the light-receiving unit, and (b4) a wall that blocks direct incidence of the reference light from the first end to the second end, and a substrate detector configured to be able to optically detect the corresponding substrate at least in one of a state where the substrate is inserted into the holder and a state where the corresponding substrate is being held; processing the substrate; A method for manufacturing a semiconductor device comprising:

15. (a) an end effector configured to be inserted into a holder that accommodates a plurality of substrates in multiple stages without contacting the substrate and then be able to grip the corresponding substrate; (b) a light projecting unit that is arranged at a specific relative position with respect to the end effector, (b1) formed in a rod shape and having a first end that emits reference light from a first optical fiber; and (b2) a second rod shape that is substantially opposite the first end and receives the reference light reflected by the back surface or front surface of the corresponding substrate, which is transparent, and guides it to a second optical fiber. (b2) a light-receiving unit having an end, (b3) a plate extending from a vicinity of the first end to a vicinity of the second end on an opposite side of the corresponding substrate as viewed from the light-emitting unit and the light-receiving unit, and (b4) a wall that blocks direct incidence of the reference light from the first end to the second end, and a substrate detector configured to be able to optically detect the corresponding substrate at least in one of a state where the substrate is inserted into the holder and a state where the corresponding substrate is being held; processing the substrate; A program that causes a computer to execute the above in a substrate processing apparatus.

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