Temperature sensor device

Abstract

To provide a technology that eliminates the difficulty in wiring arrangement and process management such as fixation in manufacturing, and also suppresses occurrence of warp of base substrates due to a temperature change.SOLUTION: A temperature sensor device comprises a base substrate, a plurality of sensor elements, and a circuit board. The base substrate forms a discoidal shape, and has a first plane brought into contact with the top face of an electrostatic chuck and a second plane on the side reverse from the first plane. The plurality of sensor elements are in thermal contact with the second plane of the base substrate. The circuit board has an outer edge along the outer edge of the second plane of the base substrate, a third plane facing the second plane of the base substrate, and a fourth plane on the side reverse from the third plane, and is electrically connected to the plurality of sensor elements. The second plane of the base substrate is partially joined at one or more points to the third plane of the circuit board.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] SUMMARY OF THE INVENTION An exemplary embodiment of the present disclosure relates to a temperature sensor device. [Background technology]

[0002] Patent Document 1 discloses an apparatus for detecting temperature on an integrated circuit manufacturing tool substrate. The apparatus includes a substrate having a surface containing a plurality of small cavities. A plurality of sensors are adhesively attached within the cavities of the substrate. Each sensor is connected to at least one conductor. Each conductor is coated with an insulating wall, such as polyimide, and is bonded to the base of the substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Special Publication No. 2002-544502 Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides a technology that eliminates the difficulty in managing manufacturing processes such as arranging and fixing wiring for temperature sensors, and that suppresses warping of the base substrate due to temperature changes. [Means for solving the problem]

[0005] In one exemplary embodiment, a temperature sensor device for acquiring a temperature distribution on the upper surface of an electrostatic chuck constituting a substrate processing apparatus is provided. The temperature sensor device includes a base substrate, a plurality of sensor elements, and a circuit board. The base substrate is disk-shaped and has a first surface that contacts the upper surface of the electrostatic chuck and a second surface opposite the first surface. The plurality of sensor elements are in thermal contact with the second surface of the base substrate. The circuit board has an outer edge along the outer edge of the second surface of the base substrate, a third surface facing the second surface of the base substrate, and a fourth surface opposite the third surface, and is electrically connected to the plurality of sensor elements. The second surface of the base substrate is partially joined to the third surface of the circuit board at one or more locations. [Effects of the Invention]

[0006] A temperature sensor device according to one exemplary embodiment can eliminate the difficulty in managing manufacturing processes such as wiring placement and fixing, and can also suppress warping of the base substrate due to temperature changes. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a diagram illustrating an example of a plasma processing apparatus. [Figure 2] FIG. 1 is a plan view showing an example of a temperature sensor device as viewed from the top side. [Figure 3] FIG. 1 is a partial cross-sectional view schematically illustrating an example of a temperature sensor device. [Figure 4] FIG. 10 is a partial cross-sectional view schematically showing another example of a temperature sensor device. [Figure 5] FIG. 10 is a partial cross-sectional view schematically showing a temperature sensor device according to still another example. DETAILED DESCRIPTION OF THE INVENTION

[0008] Various exemplary embodiments are described below.

[0009] In one exemplary embodiment, a temperature sensor device for acquiring a temperature distribution on the upper surface of an electrostatic chuck constituting a substrate processing apparatus is provided. The temperature sensor device includes a base substrate, a plurality of sensor elements, and a circuit board. The base substrate is disk-shaped and has a first surface that contacts the upper surface of the electrostatic chuck and a second surface opposite the first surface. The plurality of sensor elements are in thermal contact with the second surface of the base substrate. The circuit board has an outer edge along the outer edge of the second surface of the base substrate, a third surface facing the second surface of the base substrate, and a fourth surface opposite the third surface, and is electrically connected to the plurality of sensor elements. The second surface of the base substrate is partially joined to the third surface of the circuit board at one or more locations.

[0010] In the above embodiment, since the circuit board is sized to fit the outer edge of the base substrate, wiring can be easily managed even when many sensor elements are arranged. Furthermore, since the circuit board and the base substrate are not bonded over the entire surface but at one or more locations, warping of the base substrate due to temperature changes can be suppressed.

[0011] In one exemplary embodiment, the second surface of the base substrate and the third surface of the circuit board may be joined to each other by a joining member disposed between the second surface and the third surface, and a gap may be formed between the second surface and the third surface.

[0012] In one exemplary embodiment, each of the plurality of sensor elements may be electrically connected to a terminal portion formed on the fourth surface of the circuit board via a lead wire, and the lead wire may be flexible with excess length.

[0013] In one exemplary embodiment, each of the plurality of sensor elements may be a flip-chip type element, and the second surface of the base substrate and the third surface of the circuit board may be joined to each other via the plurality of sensor elements disposed between the second surface and the third surface.

[0014] In one exemplary embodiment, a joining member may be provided on the outer circumferential surface of each of the plurality of sensor elements, joining the second surface and the third surface to each other.

[0015] Various embodiments will be described in detail below with reference to the drawings, in which the same or equivalent parts are designated by the same reference numerals.

[0016] A temperature sensor device according to one exemplary embodiment acquires a temperature distribution on the upper surface of an electrostatic chuck that constitutes a plasma processing apparatus (substrate processing apparatus). First, the plasma processing apparatus will be described. FIG. 1 is a diagram showing an example of a plasma processing apparatus. The plasma processing apparatus 10 is a processing apparatus configured to perform a dedicated process, such as plasma processing, on a workpiece W. The plasma processing apparatus 10 is a capacitively coupled plasma etching apparatus. The plasma processing apparatus 10 includes a chamber body 12 having a substantially cylindrical shape. The chamber body 12 is formed of, for example, aluminum, and its inner wall surface may be anodized. The chamber body 12 is protectively grounded.

[0017] A substantially cylindrical support 14 is provided on the bottom of the chamber body 12. The support 14 is made of, for example, an insulating material. The support 14 is provided within the chamber body 12 and extends upward from the bottom of the chamber body 12. A stage ST is provided within a chamber S provided by the chamber body 12. The stage ST is supported by the support 14. The chamber body 12 has a temperature sensor and a heater, and can maintain the interior of the chamber S at a set temperature.

[0018] The stage ST has a lower electrode LE and an electrostatic chuck ESC. The lower electrode LE includes a first plate 18a and a second plate 18b. The first plate 18a and the second plate 18b are made of a metal such as aluminum and have a substantially circular plate shape. The second plate 18b is provided on the first plate 18a and is electrically connected to the first plate 18a.

[0019] An electrostatic chuck ESC is provided on the second plate 18b. The electrostatic chuck ESC has a structure in which an electrode made of a conductive film is disposed between a pair of insulating layers or insulating sheets, and has a substantially circular disk shape. A DC power supply 22 is electrically connected to the electrode of the electrostatic chuck ESC via a switch 23. The electrostatic chuck ESC attracts the workpiece W by electrostatic force such as Coulomb force generated by a DC voltage from the DC power supply 22. This allows the electrostatic chuck ESC to hold the workpiece W. The temperature of the electrostatic chuck ESC may be adjustable by a temperature adjustment unit such as a heater embedded in the second plate 18b.

[0020] An edge ring ER is provided on the peripheral edge of the second plate 18b. This edge ring ER is provided so as to surround the edge of the workpiece W and the electrostatic chuck ESC. In other words, the workpiece W is placed on the electrostatic chuck ESC so as to be located inside the edge ring ER. This edge ring ER can be made of any of a variety of materials, such as silicon, silicon carbide, or silicon oxide.

[0021] A coolant flow path 24 is provided inside the second plate 18b. The coolant flow path 24 constitutes a temperature control mechanism. A coolant is supplied to the coolant flow path 24 from a chiller unit provided outside the chamber body 12 via a pipe 26a. The coolant supplied to the coolant flow path 24 is returned to the chiller unit via a pipe 26b. In this manner, the coolant circulates between the coolant flow path 24 and the chiller unit. By controlling the temperature of this coolant, the temperature of the workpiece W supported by the electrostatic chuck ESC is controlled.

[0022] The stage ST has a plurality of (for example, three) through holes 25 formed therethrough. The plurality of through holes 25 are formed inside the electrostatic chuck ESC in a plan view. A lift pin 25a is inserted into each of these through holes 25. Note that FIG. 1 illustrates one through hole 25 into which one lift pin 25a is inserted. The lift pin 25a is provided so as to be movable up and down within the through hole 25. By raising the lift pin 25a, the workpiece W supported on the electrostatic chuck ESC can be raised.

[0023] The stage ST has a plurality of (for example, three) through-holes 27 formed therein, penetrating the stage ST (lower electrode LE), at positions outside the electrostatic chuck ESC in a plan view. A lift pin 27a is inserted into each of the through-holes 27. Note that FIG. 1 illustrates one through-hole 27 into which one lift pin 27a is inserted. The lift pin 27a is provided so as to be movable up and down within the through-hole 27. By raising the lift pin 27a, the edge ring ER supported on the second plate 18b can be raised.

[0024] The plasma processing apparatus 10 is also provided with a gas supply line 28. The gas supply line 28 supplies a heat transfer gas, for example, He gas, from a heat transfer gas supply mechanism to between the upper surface of the electrostatic chuck ESC and the back surface of the workpiece W.

[0025] The plasma processing apparatus 10 also includes an upper electrode 30. The upper electrode 30 is disposed above the stage ST and faces the stage ST. The upper electrode 30 is supported on the upper part of the chamber body 12 via an insulating shielding member 32. The upper electrode 30 may include a top plate 34 and a support 36. The top plate 34 faces the chamber S and has a plurality of gas ejection holes 34a formed therein. The top plate 34 may be made of silicon or quartz. Alternatively, the top plate 34 may be formed by forming a plasma-resistant film such as yttrium oxide on the surface of an aluminum base material.

[0026] The support 36 detachably supports the top plate 34 and may be made of a conductive material such as aluminum. The support 36 may have a water-cooled structure. A gas diffusion chamber 36a is provided inside the support 36. A plurality of gas flow holes 36b extend downward from the gas diffusion chamber 36a and communicate with the gas discharge holes 34a. The support 36 also has a gas inlet 36c formed therein for introducing a process gas into the gas diffusion chamber 36a, and a gas supply pipe 38 is connected to the gas inlet 36c.

[0027] A gas source group 40 is connected to the gas supply pipe 38 via a valve group 42 and a flow rate controller group 44. The gas source group 40 includes a plurality of gas sources for a plurality of types of gas. The valve group 42 includes a plurality of valves, and the flow rate controller group 44 includes a plurality of flow rate controllers such as mass flow controllers. The plurality of gas sources in the gas source group 40 are connected to the gas supply pipe 38 via the corresponding valves in the valve group 42 and the corresponding flow rate controllers in the flow rate controller group 44.

[0028] Furthermore, in the plasma processing apparatus 10, a deposit shield 46 is detachably provided along the inner wall of the chamber body 12. The deposit shield 46 is also provided on the outer periphery of the support portion 14. The deposit shield 46 prevents etching by-products (deposits) from adhering to the chamber body 12, and can be formed by coating an aluminum material with a ceramic such as yttrium oxide.

[0029] An exhaust plate 48 is provided on the bottom side of the chamber body 12, between the support member 14 and the sidewall of the chamber body 12. The exhaust plate 48 can be made, for example, of aluminum coated with a ceramic such as yttrium oxide. A plurality of holes are formed through the exhaust plate 48 in its thickness direction. An exhaust port 12e is provided below the exhaust plate 48 and in the chamber body 12. An exhaust device 50 is connected to the exhaust port 12e via an exhaust pipe 52. The exhaust device 50 has a pressure adjustment valve and a vacuum pump such as a turbomolecular pump, and can reduce the pressure inside the chamber body 12 to a desired vacuum level. A load / unload port 12g for the workpiece W is provided on the sidewall of the chamber body 12, and this load / unload port 12g can be opened and closed by a gate valve 54.

[0030] The plasma processing apparatus 10 further includes a first high frequency power supply 62 and a second high frequency power supply 64. The first high frequency power supply 62 is a power supply that generates a first high frequency power supply for plasma generation, and generates a high frequency power supply having a frequency of, for example, 27 to 100 MHz. The first high frequency power supply 62 is connected to the upper electrode 30 via a matching box 66. The matching box 66 has a circuit for matching the output impedance of the first high frequency power supply 62 with the input impedance on the load side (upper electrode 30 side). The first high frequency power supply 62 may also be connected to the lower electrode LE via the matching box 66.

[0031] The second high frequency power supply 64 is a power supply that generates a second high frequency for attracting ions into the workpiece W, and generates a high frequency with a frequency within a range of, for example, 400 kHz to 13.56 MHz. The second high frequency power supply 64 is connected to the lower electrode LE via a matching box 68. The matching box 68 has a circuit for matching the output impedance of the second high frequency power supply 64 with the input impedance on the load side (lower electrode LE side).

[0032] In this plasma processing apparatus 10, gas is supplied to a chamber S from one or more selected gas sources among a plurality of gas sources. The pressure in the chamber S is set to a predetermined pressure by an exhaust device 50. The gas in the chamber S is excited by a first high frequency wave from a first high frequency power supply 62. This generates plasma. The workpiece W is then processed by the generated activated species. If necessary, ions may be attracted to the workpiece W by a bias based on a second high frequency wave from a second high frequency power supply 64.

[0033] The temperature sensor device will be described below. FIG. 2 is a plan view showing an example of the temperature sensor device as seen from above. FIG. 3 is a schematic cross-sectional view of an example of the temperature sensor device, with a portion cut away. The temperature sensor device 100 is used to acquire the temperature distribution on the upper surface of the electrostatic chuck ESC while placed on the electrostatic chuck ESC, such as a workpiece W. This may allow, for example, calibration of a heater that heats the electrostatic chuck ESC to be performed.

[0034] An example of the temperature sensor device 100 includes a base substrate 110, a sensor element 120, and a circuit board 130. The base substrate 110 is formed of, for example, silicon, and has a shape similar to that of the workpiece W. That is, the base substrate 110 is disk-shaped and has a first surface 111 and a second surface 112 opposite to the first surface 111. The temperature sensor device 100 can be placed on the electrostatic chuck ESC with the first surface 111 of the base substrate 110 in contact with the upper surface of the electrostatic chuck ESC.

[0035] The diameter of the base substrate 110 is the same as the diameter of the workpiece W, for example, 300 mm. The shape and dimensions of the temperature sensor device 100 are determined by the shape and dimensions of this base substrate 110. Therefore, the temperature sensor device 100 has a shape similar to the shape of the workpiece W and dimensions similar to the dimensions of the workpiece W. A notch may be formed on the edge of the base substrate 110.

[0036] The sensor element 120 is in thermal contact with the second surface 112 of the base substrate 110 and can measure the temperature of the second surface 112. For example, the sensor element 120 may be a resistance temperature detector sensor including a resistance temperature detector therein. In the temperature sensor device 100 according to one exemplary embodiment, 100 or more sensor elements 120 are arranged on the second surface 112 of the base substrate 110, thereby making it possible to observe the surface temperature of the electrostatic chuck ESC at multiple points.

[0037] For example, the multiple sensor elements 120 may be fixed to multiple recesses 113 formed on the second surface 112 of the base substrate 110. Each recess 113 has a size that allows the abutment surface 121 side of the corresponding sensor element 120 to be at least partially accommodated therein. The recess 113 in the illustrated example has a bottom surface 113a that is parallel to the first surface 111 of the base substrate 110, and has a height that is lower than the height of the sensor element 120. Therefore, the upper part of the sensor element 120 arranged in the recess 113 protrudes above the recess 113.

[0038] The contact surface 121 of the sensor element 120 contacts the bottom surface 113a of the recess 113 via a heat-conductive grease (heat-conductive grease 125). The heat-conductive grease 125 may be, for example, a mixture of a silicone-based resin and a heat-conductive filler. The sensor element 120, which is disposed on the bottom surface 113a via the heat-conductive grease 125, is fixed to the recess 113 by a heat-resistant adhesive 126a. The heat-resistant adhesive 126a may be made of a resin having heat resistance and insulating properties, such as a silicone-based resin.

[0039] The circuit board 130 is electrically connected to the sensor element 120 and connects the sensor element 120 to an external measurement system (not shown). For example, the circuit board 130 may be a heat-resistant board such as a heat-resistant LCP (Liquid Crystal Polymer) board, a heat-resistant flexible board, or a heat-resistant printed circuit board. The circuit board 130 in the illustrated example includes a base material 131, a wiring pattern 132 (wiring layer) formed on the base material 131, and a solder resist layer 133 that covers the wiring pattern 132. The wiring pattern 132 includes pads 132a (electrodes) for connection to the sensor element 120. The wiring pattern 132 also includes pads (not shown) for electrical connection to a flat cable for drawing out that is connected to an external measurement system.

[0040] The circuit board 130 has a disk shape. In a plan view, the outer edge 130a of the circuit board 130 is aligned with the outer edge of the second surface 112 of the base substrate 110. The circuit board 130 has a third surface 135 that faces the second surface 112 of the base substrate 110, and a fourth surface 136 that is opposite the third surface 135. In one example of the circuit board 130, the substrate 131 side forms the third surface 135, and the solder resist layer 133 side forms the fourth surface 136.

[0041] The circuit board 130 has a through hole 137 penetrating from the third surface 135 to the fourth surface 136 at the position where the sensor element 120 is disposed. That is, the circuit board 130 has a plurality of through holes 137 corresponding to the plurality of recesses 113 formed in the base substrate 110. In one example, the recesses 113 and the through holes 137 may both have a circular shape in a plan view and may have the same diameter. Note that although the plurality of through holes 137 are omitted in FIG. 2, the plurality of through holes 137 may be arranged so that the intervals between adjacent through holes 137 are approximately equal. For example, the through holes 137 may be arranged on a plurality of concentric circles.

[0042] The sensor element 120 fixed in the recess 113 is electrically connected to a pad 132a of a wiring pattern 132 of a circuit board 130 via a lead wire 105 passing through a through hole 137. The pad 132a is covered with a heat-resistant adhesive 126b. That is, the connection portion between the pad 132a and the lead wire 105 is protected by the heat-resistant adhesive 126b. The heat-resistant adhesive 126b may have the same composition as the heat-resistant adhesive 126a, or may have a different composition.

[0043] 3, the lead wire 105 has an excess length and is bent between the heat-resistant adhesive 126a that fixes the sensor element 120 and the heat-resistant adhesive 126b that covers the pad 132a. That is, the length of the lead wire 105 is longer than the shortest distance from the exposed position of the lead wire 105 in the heat-resistant adhesive 126a that fixes the sensor element 120 to the exposed position of the lead wire 105 in the heat-resistant adhesive 126b that covers the pad 132a.

[0044] The base substrate 110 and the circuit board 130 are joined to each other by a joining member. In one example, a heat-resistant adhesive 126c (an example of a joining member) may be disposed between the second surface 112 of the base substrate 110 and the third surface 135 of the circuit board 130. The heat-resistant adhesive 126c may have the same composition as the heat-resistant adhesives 126a and 126b, or may have a different composition.

[0045] The heat-resistant adhesive 126c may be injected between the base substrate 110 and the circuit board 130 through adhesive holes 138 formed in the circuit board 130. The adhesive holes 138 penetrate the circuit board 130. More specifically, the adhesive holes 138 may be configured as a collection of multiple through holes. For example, the adhesive holes 138 are configured with a first hole 138a in the center and multiple second holes 138b surrounding the first hole 138a. In the illustrated example, the first hole 138a is located at the center of four second holes 138b arranged on the sides of a square.

[0046] A plurality of adhesive holes 138 may be formed in the circuit board 130. The plurality of adhesive holes 138 may be arranged in a plan view so as to be point symmetrical with respect to the center of the circuit board 130. For example, in the illustrated example, eight adhesive holes 138 are arranged at equal intervals in the circumferential direction on the peripheral edge of the circuit board 130. Furthermore, inside these eight adhesive holes 138, six adhesive holes 138 are arranged at equal intervals on a circle with the center of the circuit board 130 as the reference.

[0047] The base substrate 110 has a plurality of bonding recesses 118 corresponding to the plurality of bonding holes 138. The bonding recesses 118 may be recesses formed in the second surface 112 of the base substrate 110. For example, the plurality of bonding recesses 118 are formed in the same positions as the plurality of bonding holes 138 of the circuit board 130. The bonding recesses 118 may be formed by a collection of a plurality of recesses, similar to the bonding holes 138. For example, the bonding recesses 118 may be formed by arranging one recess 118b at the center of four recesses 118a arranged on the sides of a square in a plan view.

[0048] The heat-resistant adhesive 126c is placed at the position of the bonding holes 138 (i.e., the bonding recesses 118). That is, the multiple positions where the heat-resistant adhesive 126c is placed are spaced apart from one another. Furthermore, when the base substrate 110 and the circuit board 130 are bonded together, a gap is formed between the second surface 112 of the base substrate 110 and the third surface 135 of the circuit board 130. For example, the heat-resistant adhesive 126c may be injected through the bonding holes 138 while the base substrate 110 and the circuit board 130 are spaced apart from one another. With this manufacturing method, the second surface 112 of the base substrate 110 and the third surface 135 of the circuit board 130 are not bonded together entirely, but are instead bonded partially at multiple locations.

[0049] Such a temperature sensor device 100 can be connected to an external measurement system via a flat cable passing through a seal portion of the gate valve 54 while being mounted on the electrostatic chuck ESC of the plasma processing apparatus 10. The measurement system can measure the temperature at the position of each sensor element 120 by obtaining the resistance value of each sensor element 120. During temperature measurement, for example, the chamber S may be in a vacuum state.

[0050] As described above, in one exemplary embodiment, a temperature sensor device 100 for acquiring a temperature distribution on the upper surface of the electrostatic chuck ESC is provided. The temperature sensor device 100 includes a base substrate 110, a plurality of sensor elements 120, and a circuit board 130. The base substrate 110 is disk-shaped and has a first surface 111 that abuts against the upper surface of the electrostatic chuck ESC and a second surface 112 opposite to the first surface 111. The plurality of sensor elements 120 measure the temperature of the second surface 112 of the base substrate 110. The circuit board 130 has an outer edge 130a along the outer edge of the second surface 112 of the base substrate 110, a third surface 135 that faces the second surface 112 of the base substrate 110, and a fourth surface 136 opposite to the third surface 135. The circuit board 130 is electrically connected to the plurality of sensor elements 120. The second surface 112 of the base substrate 110 is partially bonded to the third surface 135 of the circuit board 130 .

[0051] When mounting multiple sensor elements on a disk-shaped base substrate, if the number of sensor elements increases, the wiring space for the sensor elements may become insufficient, making it difficult to manage the wiring. In the above embodiment, since the circuit board 130 is sized to fit the outer edge of the base substrate 110, even if a large number of sensor elements 120, for example, 100 or more, are arranged, the wiring can be easily managed by forming the wiring pattern 132 on the circuit board 130.

[0052] Furthermore, when the base substrate and the circuit board are mounted on the base substrate by bonding them to each other, stress may be generated between the base substrate and the circuit board during temperature changes due to the difference in the thermal expansion coefficients of the base substrate and the circuit board, which may cause warping of the base substrate. In the above exemplary embodiment, the circuit board 130 and the base substrate 110 are not bonded entirely, but are bonded partially. Therefore, the stress caused by the difference in the thermal expansion coefficients is absorbed as bending of the circuit board 130, thereby suppressing warping of the base substrate 110.

[0053] In one exemplary embodiment, the second surface 112 of the base substrate 110 and the third surface 135 of the circuit board 130 may be bonded to each other by a heat-resistant adhesive 126c disposed between the second surface 112 and the third surface 135. A gap may be formed between the second surface 112 and the third surface 135. The gap formed between the second surface 112 and the third surface 135 may provide space for the circuit board 130 to flex.

[0054] In one exemplary embodiment, each of the multiple sensor elements 120 may be electrically connected to a pad 132a (terminal portion) formed on the fourth surface 136 of the circuit board 130 via a lead wire 105, and the lead wire 105 may be flexible with an excess length. In this configuration, even if a positional deviation occurs between the pad 132a of the circuit board 130 and the sensor element 120 due to a temperature change or the like, damage to the lead wire 105 is suppressed due to the excess length of the lead wire 105.

[0055] 4 is a schematic cross-sectional view of a portion of a temperature sensor device according to another example. Here, differences from the temperature sensor device 100 shown in FIGS. 2 and 3 will be mainly described. The temperature sensor device 200 shown in FIG. 4 includes a base substrate 210, a plurality of sensor elements 220, and a circuit board 230. The base substrate 210 differs from the above-described base substrate 110 in that it does not have the recess 113 or the bonding recess 118. That is, the base substrate 210 may have a first surface 211 formed flat and a second flat surface 212 on the opposite side to the first surface 211.

[0056] Circuit board 230 includes a substrate 231, a wiring pattern 232 (wiring layer) formed on substrate 231, and a solder resist layer 233 that covers wiring pattern 232. Circuit board 230 has a third surface 235 that faces second surface 212 of base substrate 210, and a fourth surface 236 that is opposite to third surface 235. In circuit board 230 shown in FIG. 4, the solder resist layer 233 side forms third surface 235, and the substrate 231 side forms fourth surface 236. Note that circuit board 230 does not have through holes 137 or adhesive holes 138.

[0057] The sensor element 220 measures the temperature of the second surface 212 of the base substrate 210. For example, the sensor element 220 may be a flip-chip (surface-mount) resistance temperature detector sensor including a resistance temperature detector. The sensor element 220 has a terminal surface 221 having an electrode connected to the resistance temperature detector, and an abutment surface 222 opposite the terminal surface 221. The electrode on the terminal surface 221 is fixed to the circuit board 230 by bumps 225 (solder) based on surface mounting technology. That is, the electrode is electrically connected to a pad exposed on the third surface 235 of the circuit board 230. The abutment surface 222 of the sensor element 220 is bonded to the second surface 212 of the base substrate 210 via a heat-resistant and heat-conductive bonding agent 226. The bonding agent 226 may be, for example, a thermally conductive adhesive, a conductive adhesive, a conductive paste, or the like.

[0058] In this way, the base substrate 210 and the circuit board 230 are joined to each other via the multiple sensor elements 220. When the base substrate 210 and the circuit board 230 are joined together, a gap is formed between the second surface 212 of the base substrate 210 and the third surface 235 of the circuit board 230. In other words, the second surface 212 of the base substrate 210 and the third surface 235 of the circuit board 230 are not joined together entirely, but are joined only partially at positions where the multiple sensor elements 220 are arranged.

[0059] As described above, in one exemplary embodiment, each of the plurality of sensor elements 220 may be a flip-chip type element. The second surface 212 of the base substrate 210 and the third surface 235 of the circuit board 230 may be joined to each other via the plurality of sensor elements 220 arranged between the second surface 212 and the third surface 235. In this configuration, a state in which a gap is formed between the base substrate 210 and the circuit board 230 can be easily formed. Furthermore, there is no need to adjust the gap length between the base substrate 210 and the circuit board 230 during manufacturing.

[0060] FIG. 5 is a schematic cross-sectional view of a portion of a temperature sensor device according to yet another example. Here, differences from the temperature sensor device 200 shown in FIG. 4 will be mainly described. The temperature sensor device 300 shown in FIG. 5 differs from the temperature sensor device 200 shown in FIG. 4 in that an adhesive 326 is provided on the outer peripheral surface of each of the plurality of sensor elements 220, bonding the second surface 212 and the third surface 235 to each other. That is, the base substrate 210 and the circuit board 230 are not only bonded to each other via the sensor elements 220, but also bonded to each other by the adhesive 326 disposed between the second surface 212 and the third surface 235. The adhesive 326 may be a heat-resistant adhesive made of a resin having heat resistance and insulating properties, such as a silicone-based resin.

[0061] As described above, in one exemplary embodiment, the adhesive 326 may be provided on the outer peripheral surface of each of the plurality of sensor elements 220, bonding the second surface 212 and the third surface 235 to each other. In this configuration, the fixation between the base substrate 210 and the sensor element 220 and the fixation between the circuit board 230 and the sensor element 220 are reinforced.

[0062] Although various exemplary embodiments have been described above, the present invention is not limited to the above-described exemplary embodiments, and various omissions, substitutions, and modifications may be made. Furthermore, elements in different embodiments may be combined to form other embodiments.

[0063] For example, while FIG. 3 shows an example in which the base substrate 110 and the circuit board 130 are joined to each other by heat-resistant adhesive 126c arranged at multiple positions, the heat-resistant adhesive 126c may be arranged only at one location between the base substrate 110 and the circuit board 130. The temperature sensor device 100 shown in FIG. 3 does not need to have the heat-resistant adhesive 126c that bonds the base substrate 110 and the circuit board 130 to each other. In this case, the circuit board 130 is placed on the second surface 112 of the base substrate 110. The sensor element 120 and the heat-resistant adhesive 126a are inserted into the through-hole 137 of the circuit board 130, thereby preventing the circuit board 130 from shifting horizontally on the base substrate 110. Furthermore, the sensor element 120 and the pad 132a are connected by the lead wire 105, thereby further preventing the circuit board 130 from shifting horizontally.

[0064] From the foregoing, it will be understood that various embodiments of the present disclosure have been described herein for purposes of illustration, and that various modifications may be made without departing from the scope and spirit of the present disclosure. Accordingly, the various embodiments disclosed herein are not intended to be limiting, with the true scope and spirit being indicated by the appended claims. [Explanation of symbols]

[0065] 10...plasma processing apparatus (substrate processing apparatus), 100...temperature sensor device, 110...base substrate, 111...first surface, 112...second surface, 120...sensor element, 130...circuit board, 135...third surface, 136...fourth surface.

Claims

1. A temperature sensor device for acquiring a temperature distribution on an upper surface of an electrostatic chuck included in a substrate processing apparatus, a disk-shaped base substrate having a first surface that is in contact with the upper surface of the electrostatic chuck and a second surface that is opposite to the first surface; a plurality of sensor elements in thermal contact with the second surface of the base substrate; a circuit board having an outer edge along an outer edge of the second surface of the base substrate, a third surface facing the second surface of the base substrate, and a fourth surface opposite to the third surface, the circuit board being electrically connected to the plurality of sensor elements; The second surface of the base substrate is partially joined to the third surface of the circuit board at one or more locations.

2. the second surface of the base substrate and the third surface of the circuit board are joined to each other by a joining member disposed between the second surface and the third surface, The temperature sensor device according to claim 1 , wherein a gap is formed between the second surface and the third surface.

3. each of the plurality of sensor elements is electrically connected to a terminal portion formed on the fourth surface of the circuit board via a lead wire; 3. The temperature sensor device according to claim 1, wherein the lead wires are bent with excess length.

4. each of the plurality of sensor elements is a flip-chip type element; 2. The temperature sensor device according to claim 1, wherein the second surface of the base substrate and the third surface of the circuit board are joined to each other via the plurality of sensor elements arranged between the second surface and the third surface.

5. The temperature sensor device according to claim 4 , wherein a joining member is provided on an outer peripheral surface of each of the plurality of sensor elements to join the second surface and the third surface to each other.

Images