Three-dimensional measuring device, component mounting device, and three-dimensional measuring method

Abstract

To improve the performance of component recognition by a three-dimensional measuring device.SOLUTION: A three-dimensional measuring device comprises: a projection device for irradiating, with pattern light, a component having a body part and a plurality of electrode parts; an imaging device for imaging the component irradiated with pattern light; and a processing device including a processor for processing the image data of the component imaged by the imaging device. The processing device generates, from the image data, first grayscale image data indicating the shape of the component by shades, converts the first grayscale image data into three-dimensional point cloud data of the component, removes noise from the three-dimensional point cloud data to extract the electrode parts, converts the noise-removed three-dimensional point cloud data into second grayscale image data, and calculates the reference position of the component on the basis of the respective coordinates of the plurality of electrodes in the second grayscale image data.SELECTED DRAWING: Figure 16

Description

[Technical Field]

[0001] The technology disclosed in this specification relates to a three-dimensional measuring device, a component mounting device, and a three-dimensional measuring method. [Background technology]

[0002] In the technical field related to component mounting devices, there is known a component mounting device equipped with a three-dimensional measuring device, as disclosed in Patent Document 1. In Patent Document 1, the three-dimensional measuring device measures the three-dimensional shape of a component based on a phase shift method. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2023-054992 Summary of the Invention [Problem to be solved by the invention]

[0004] A component mounting device uses a 3D measurement device to recognize the reference position (e.g., the center position) of a component, and then mounts the component at the target position on the board based on the reference position of the component. Therefore, there is a demand for improving the component recognition performance of the 3D measurement device. [Means for solving the problem]

[0005] This specification discloses a three-dimensional measuring device. The three-dimensional measuring device includes a projection device that irradiates a patterned light onto a component having a body portion and multiple electrodes, an imaging device that images the component irradiated with the patterned light, and a processing device having a processor that processes image data of the component imaged by the imaging device. The processing device generates first gradation image data that indicates the shape of the component using shades of gray from the image data, converts the first gradation image data into three-dimensional point cloud data of the component, removes noise from the three-dimensional point cloud data to extract the electrodes, converts the noise-removed three-dimensional point cloud data into second gradation image data, and calculates a reference position of the component based on the coordinates of each of the multiple electrodes in the second gradation image data. [Effects of the Invention]

[0006] The technology disclosed in this specification improves the part recognition performance of a three-dimensional measuring device. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a side view schematically showing a component mounting apparatus according to the first embodiment. [Figure 2] FIG. 2 is a plan view schematically showing the component mounting apparatus according to the first embodiment. [Figure 3] FIG. 3 is a diagram showing a component according to the first embodiment. [Figure 4] FIG. 4 is a diagram showing a component according to the first embodiment. [Figure 5] FIG. 5 is a diagram showing a component according to the first embodiment. [Figure 6] FIG. 6 is a side view schematically showing the three-dimensional measuring apparatus according to the first embodiment. [Figure 7] FIG. 7 is a top view schematically showing the three-dimensional measuring apparatus according to the first embodiment. [Figure 8] FIG. 8 is a hardware configuration diagram showing the processing device according to the first embodiment. [Figure 9] FIG. 9 is a functional block diagram showing the processing device according to the first embodiment. [Figure 10]FIG. 10 is a diagram illustrating part data according to the first embodiment. [Figure 11] FIG. 11 is a diagram illustrating noise processing according to the first embodiment. [Figure 12] FIG. 12 is a diagram illustrating noise processing according to the first embodiment. [Figure 13] FIG. 13 is a diagram illustrating imaging parameters according to the first embodiment. [Figure 14] FIG. 14 is a diagram illustrating a method for determining imaging parameters according to the first embodiment. [Figure 15] FIG. 15 is a diagram showing pattern data according to the first embodiment. [Figure 16] FIG. 16 is a diagram illustrating a part processing method according to the first embodiment. [Figure 17] FIG. 17 is a diagram illustrating noise processing for a component according to the first embodiment. [Figure 18] FIG. 18 is a diagram illustrating noise processing for a component according to the first embodiment. [Figure 19] FIG. 19 is a diagram showing the second gradation image data of the part according to the first embodiment. [Figure 20] FIG. 20 is a diagram illustrating noise processing for a component according to the first embodiment. [Figure 21] FIG. 21 is a diagram showing the second gradation image data of the part according to the first embodiment. [Figure 22] FIG. 22 is a diagram illustrating noise processing for a component according to the second embodiment. [Figure 23] FIG. 23 is a flowchart showing noise processing for a component according to the second embodiment. [Figure 24] FIG. 24 is a diagram illustrating the reference height and height range according to the second embodiment. [Figure 25] FIG. 25 is a flowchart showing a production program generating method according to the third embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0008] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings, but the present disclosure is not limited to the embodiments. The components of the embodiments described below can be combined as appropriate. In addition, some components may not be used.

[0009] In the embodiment, a local coordinate system is set in the component mounting apparatus 1, and the positional relationship of each part will be described with reference to the local coordinate system. An XYZ Cartesian coordinate system is set as the local coordinate system. The direction parallel to the X axis within a predetermined plane is defined as the X-axis direction. The direction parallel to the Y axis perpendicular to the X axis within the predetermined plane is defined as the Y-axis direction. The direction parallel to the Z axis perpendicular to both the X axis and the Y axis is defined as the Z-axis direction. The direction of rotation or tilt around the X axis is defined as the θX direction. The direction of rotation or tilt around the Y axis is defined as the θY direction. The direction of rotation or tilt around the Z axis is defined as the θZ direction. The predetermined plane is the XY plane. The Z axis is perpendicular to the predetermined plane. In the embodiment, the predetermined plane is parallel to a horizontal plane. The Z-axis direction is the vertical direction (height direction). The +Z direction (+Z side) is upward (upper side), and the -Z direction (-Z side) is downward (lower side). Note that the predetermined plane may be inclined with respect to the horizontal plane.

[0010] [First embodiment] A first embodiment will be described.

[0011] <Component mounting equipment> Fig. 1 is a side view schematically showing a component mounting apparatus 1 according to the first embodiment. Fig. 2 is a plan view schematically showing the component mounting apparatus 1 according to the first embodiment. The component mounting apparatus 1 mounts a component C on a board W on which cream solder has been printed.

[0012] The component mounting apparatus 1 includes a base 11, a support 12, a component supply device 2, a substrate support device 3, a mounting head 5 having a nozzle 4, a nozzle moving device 6, a head moving device 7, a three-dimensional measuring device 8, and a control device 10.

[0013] The base 11 is installed on the floor of an industrial facility where the component mounting apparatus 1 is used. In the XY plane, the base 11 is long in the X-axis direction. The outer shape of the top surface of the base 11 is rectangular. The support columns 12 protrude upward from the top surface of the base 11. The support columns 12 are fixed to the base 11. In this embodiment, the support columns 12 are arranged at each of the four corners of the top surface of the base 11.

[0014] The component supply device 2 supplies components C. A supply position AP is set in the component mounting device 1. The component supply device 2 supplies the components C to the supply position AP. The component supply device 2 includes multiple tape feeders. The tape feeder has a reel on which a tape that holds the components C is wound, and a drive device that unwinds the tape wound on the reel. The drive device unwinds the tape so that the components C held on the tape move to the supply position AP. The component supply device 2 may also include a tray that supports the components C.

[0015] The substrate support device 3 supports the substrate W. A processing position BP is set in the component mounting device 1. The substrate support device 3 supports the substrate W at the processing position BP. The substrate support device 3 is supported on a base 11. The substrate support device 3 includes a substrate transport device that transports the substrate W to the processing position BP, and a substrate support member that supports the substrate W transported to the processing position BP. The substrate transport device includes a conveyor that transports the substrate W in the X-axis direction, and a guide member that guides the substrate W in the X-axis direction. The substrate support member supports the substrate W so that the surface of the substrate W is parallel to the XY plane.

[0016] The nozzle 4 detachably holds the component C. The nozzle 4 is a suction nozzle that suctions the top surface of the component C. An opening is provided at the tip of the nozzle 4. The opening of the nozzle 4 is connected to a vacuum system. With the tip of the nozzle 4 in contact with the top surface of the component C, the suction operation of the opening of the nozzle 4 is performed, thereby suctioning and holding the component C at the tip of the nozzle 4. When the suction operation of the opening of the nozzle 4 is released, the component C is released from the nozzle 4. The nozzle 4 may also be a gripper nozzle that grips the component C.

[0017] The mounting head 5 has a plurality of nozzles 4. The mounting head 5 has a shaft 5S to which the nozzles 4 are attached. The nozzles 4 are attached to the lower end of the shaft 5S. The mounting head 5 mounts the components C held by the nozzles 4 onto the board W. The mounting head 5 is movable between a supply position AP and a processing position BP. The supply position AP and the processing position BP are set at different positions within the XY plane. The mounting head 5 moves to the supply position AP and holds the component C supplied from the component supply device 2 with the nozzles 4. After holding the component C with the nozzles 4 at the supply position AP, the mounting head 5 moves to the processing position BP and mounts the component C on the board W supported by the board support device 3.

[0018] The nozzle moving device 6 moves the nozzle 4 in both the Z-axis direction and the θZ direction. The nozzle moving device 6 includes an actuator provided in the mounting head 5. A nozzle moving device 6 is provided for each of the multiple nozzles 4. The nozzle moving device 6 moves the shaft 5S in the Z-axis direction and the θZ direction, thereby moving the nozzle 4 in the Z-axis direction and the θZ direction.

[0019] The head moving device 7 moves the mounting head 5 in both the X-axis direction and the Y-axis direction. The head moving device 7 has an X-axis moving device 13 that moves the mounting head 5 in the X-axis direction, and a Y-axis moving device 14 that moves the mounting head 5 in the Y-axis direction.

[0020] The X-axis movement device 13 includes a guide member 13A extending in the X-axis direction, and an actuator 13B that generates power to move the mounting head 5 in the X-axis direction. The mounting head 5 is supported by the guide member 13A. The guide member 13A guides the mounting head 5 in the X-axis direction. At least a portion of the actuator 13B is disposed between the mounting head 5 and the guide member 13A. The mounting head 5 moves in the X-axis direction by the power generated by the actuator 13B while being guided by the guide member 13A.

[0021] The Y-axis movement device 14 includes a pair of guide members 14A and an actuator 14B that generates power to move the guide member 13A in the Y-axis direction. One guide member 14A is supported by two support columns 12 arranged at the +X side end of the base 11. The other guide member 14A is supported by two support columns 12 arranged at the -X side end of the base 11. The +X side end of the guide member 13A is supported by one guide member 14A. The -X side end of the guide member 13A is supported by the other guide member 14A. The guide member 14A guides the guide member 13A in the Y-axis direction. At least a portion of the actuator 14B is arranged between the guide members 13A and 14A. The guide member 13A moves in the Y-axis direction by the power generated by the actuator 14B while being guided by the guide member 14A. As the guide member 13A moves in the Y-axis direction, the mounting head 5 moves in the Y-axis direction.

[0022] The component mounting apparatus 1 is a gantry robot type mounting apparatus. A gantry robot is a robot that moves the mounting head 5 linearly in each of the X-axis direction and the Y-axis direction. The head moving device 7 includes a gantry robot. The nozzle 4 can be moved in four directions, the X-axis direction, the Y-axis direction, the Z-axis direction, and the θZ direction, by the nozzle moving device 6 and the head moving device 7. By moving the nozzle 4, the component C held by the nozzle 4 can also be moved in four directions, the X-axis direction, the Y-axis direction, the Z-axis direction, and the θZ direction.

[0023] The three-dimensional measuring device 8 measures the three-dimensional shape of the component C held by the nozzle 4. The three-dimensional measuring device 8 recognizes the reference position (e.g., the center position) of the component C. A measurement position CP is set in the component mounting device 1. The three-dimensional measuring device 8 measures the component C placed at the measurement position CP. The measurement position CP is set between the supply position AP and the processing position BP. The three-dimensional measuring device 8 measures the three-dimensional shape of the component C based on the phase shift method. The three-dimensional measuring device 8 measures the component C held by the nozzle 4 at the supply position AP before it is mounted on the substrate W. The three-dimensional measuring device 8 can recognize not only the three-dimensional shape of the component C, but also the holding state of the component C by the nozzle 4.

[0024] The control device 10 includes a computer. The control device 10 outputs an operation command to operate the mounting head 5. The control device 10 stores a production program that indicates the procedure for mounting components C on the substrate W. The control device 10 outputs an operation command to operate the mounting head 5 based on the production program.

[0025] <Parts> FIG. 3 is a diagram showing a component Ca according to the first embodiment. FIG. 4 is a diagram showing a component Cb according to the first embodiment. FIG. 5 is a diagram showing a component Cc according to the first embodiment. The component mounting apparatus 1 can mount multiple types of components C on the board W. The component C has a body portion B and multiple protrusions P protruding from the body portion B.

[0026] The component mounting apparatus 1 can mount a component Ca as shown in Fig. 3 as the component C on the board W. The component mounting apparatus 1 can mount a component Cb as shown in Fig. 4 as the component C on the board W. The component mounting apparatus 1 can mount a component Cc as shown in Fig. 5 as the component C on the board W.

[0027] FIG. 3(A) is a side view showing the component Ca, and FIG. 3(B) is a bottom view showing the component Ca. As shown in FIG. 3, the component Ca has a body portion Ba and multiple protrusions Pa protruding from the body portion Ba. The component Ca is a mounted component that is mounted on the surface of the substrate W. The component Ca is surface-mounted on the substrate W. The protrusions Pa include electrode portions Ea and boss portions Da. The component Ca has a body portion Ba, multiple electrode portions Ea, and multiple boss portions Da. The body portion Ba is long in a predetermined direction. Each of the electrode portions Ea and boss portions Da is supported by the body portion Ba.

[0028] The body part Ba is made of resin. The body part Ba has terminal parts C11 that support multiple electrode parts Ea and fixed parts C12 that are fixed to the substrate W. Two terminal parts C11 are provided. Three fixed parts C12 are provided. The fixed parts C12 are provided at one end of the body part Ba, at the center of the body part Ba, and at the other end of the body part Ba in the longitudinal direction of the body part Ba. One terminal part C11 is disposed between the fixed part C12 at one end of the body part Ba and the fixed part C12 at the center of the body part Ba. The other terminal part C11 is disposed between the fixed part C12 at the center of the body part Ba and the fixed part C12 at the other end of the body part Ba.

[0029] The electrode portions Ea are made of metal. A plurality of electrode portions Ea are provided on each of the two terminal portions C11. The electrode portions Ea protrude obliquely downward from the lower surface of the terminal portion C11 so as to extend in the width direction of the component Ca. The tip portions (lower ends) of the electrode portions Ea are substantially flat. The tip portions of the electrode portions Ea are connected to the wiring pattern provided on the surface of the substrate W.

[0030] The boss portion Da is made of resin. The boss portion Da may be integral with the body portion Ba. One boss portion Da is arranged on each of the three fixing portions C12. The boss portion Da protrudes downward from the lower surface of the fixing portion C12. The boss portion Da is inserted into a recess provided in the substrate W. A screw hole Fa is provided in the fixing portion C12. A screw is inserted into the screw hole Fa of the fixing portion C12 and a screw hole provided in the substrate W. The fixing portion C12 and the substrate W are fixed with the screw.

[0031] As shown in FIG. 4, component Cb has a body portion Bb and multiple protrusions Pb protruding from the body portion Bb. Component Cb is an insertion component in which at least a portion of component Cb is inserted into a through-hole provided in a board W. Component Cb is inserted and mounted on the board W. The protrusions Pb include electrode portions Eb and boss portions Db. Component Cb has a body portion Bb, multiple electrode portions Eb, and multiple boss portions Db. Each of the electrode portions Eb and boss portions Db is supported by the body portion Bb.

[0032] The body Bb is made of resin and has a substantially rectangular parallelepiped outer shape.

[0033] The electrode portion Eb is made of metal. A plurality of electrode portions Eb are provided. The electrode portions Eb protrude downward from the lower surface of the body portion Bb. The electrode portions Eb are lead electrodes that are inserted into through holes provided in the substrate W. The lengths of the plurality of electrode portions Eb are equal to one another. In other words, the protrusion amounts of the plurality of electrode portions Eb from the body portion Bb are equal to one another.

[0034] The boss portion Db is made of resin. A plurality of boss portions Db are provided. The boss portion Db may be integral with the body portion Bb. The boss portion Db protrudes downward from the lower surface of the body portion Bb. The boss portion Db is inserted into a through hole provided in the substrate W. The lengths of the plurality of boss portions Db are equal to each other. In other words, the protrusion amounts of the plurality of boss portions Db from the body portion Bb are equal to each other.

[0035] The length of the electrode portion Eb is equal to the length of the boss portion Db, that is, the amount by which the electrode portion Eb protrudes from the body portion Bb is equal to the amount by which the boss portion Db protrudes from the body portion Bb.

[0036] As shown in Figure 5, the component Cc has a body portion Bc and multiple protrusions Pc protruding from the body portion Bc. The component Cc is an insertion component in which at least a portion of the component Cc is inserted into a through-hole provided in the board W. The component Cc is inserted and mounted on the board W. The protrusions Pc include electrode portions Ec. The component Cc has a body portion Bc and multiple electrode portions Ec. The electrode portions Ec are supported by the body portion Bc.

[0037] The body portion Bc is made of resin and has a substantially rectangular parallelepiped outer shape.

[0038] The electrode portion Ec is made of metal. A plurality of electrode portions Ec are provided. The electrode portion Ec protrudes downward from the lower surface of the body portion Bc. The electrode portion Ec is a lead electrode to be inserted into a through hole provided in the substrate W. The lengths of the plurality of electrode portions Ec are different from one another. That is, the protrusion amounts of the plurality of electrode portions Ec from the body portion Bc are different from one another. In the example shown in FIG. 5, the electrode portion Ec includes a first electrode portion Ec1, a second electrode portion Ec2, and a third electrode portion Ec3. The protrusion amount of the first electrode portion Ec1 from the body portion Bc, the protrusion amount of the second electrode portion Ec2 from the body portion Bc, and the protrusion amount of the third electrode portion Ec3 from the body portion Bc are different. The protrusion amount of the first electrode portion Ec1 is the largest, the protrusion amount of the second electrode portion Ec2 is next largest after the first electrode portion Ec1, and the protrusion amount of the third electrode portion Ec3 is the smallest. That is, the first electrode portion Ec1 is the longest, the second electrode portion Ec2 is the next longest, and the third electrode portion Ec3 is the shortest.

[0039] <3D measurement device> Fig. 6 is a side view schematically showing the three-dimensional measuring apparatus 8 according to the first embodiment. Fig. 7 is a top view schematically showing the three-dimensional measuring apparatus 8 according to the first embodiment.

[0040] The three-dimensional measuring device 8 measures the three-dimensional shape of the part C based on the phase shift method. The three-dimensional measuring device 8 acquires image data of the part C based on the phase shift method. The three-dimensional measuring device 8 measures the three-dimensional shape of at least a portion of the part C while the part C is held by the nozzle 4. The three-dimensional measuring device 8 is placed below the measurement position CP. The three-dimensional measuring device 8 measures the part C held by the nozzle 4 from below. Figures 6 and 7 show an example in which a part Ca is placed at the measurement position CP as the part C. Either a part Cb or a part Cc may be placed at the measurement position CP.

[0041] As shown in Figures 6 and 7, the three-dimensional measuring device 8 includes a projection device 30 that irradiates pattern light PL onto a component C placed at a measurement position CP, a reflecting member 81 that reflects the pattern light PL, an imaging device 40 that images the component C irradiated with the pattern light PL, and a processing device 50 that processes image data of the component C imaged by the imaging device 40.

[0042] The projection device 30 irradiates the component C with striped pattern light PL. The projection device 30 irradiates the component C with pattern light PL having different phases. The projection device 30 has a light source 31 that generates light, a light modulation element 32 that optically modulates the light generated from the light source 31 to generate the pattern light PL, and an emission optical system 33 that emits the pattern light PL generated by the light modulation element 32.

[0043] The light modulation element 32 includes a digital mirror device (DMD). The light modulation element 32 may include a transmissive liquid crystal panel or a reflective liquid crystal panel. The light modulation element 32 generates the patterned light PL based on the pattern data output from the processing device 50. The projection device 30 emits the patterned light PL that has been patterned based on the pattern data.

[0044] The reflecting member 81 reflects the pattern light PL emitted from the projection device 30 and irradiates it onto the component C. The reflecting surface of the reflecting member 81 is flat.

[0045] The imaging device 40 has an imaging optical system 41 that forms an image of the pattern light PL reflected by the component C, and an imaging element 42 that acquires image data of the component C via the imaging optical system 41. The imaging element 42 is a solid-state imaging element including a CMOS image sensor (Complementary Metal Oxide Semiconductor Image Sensor) or a CCD image sensor (Charge Coupled Device Image Sensor). In the embodiment, the optical axis AX and Z axis of the imaging optical system 41 are parallel to each other.

[0046] The processing device 50 includes a computer and controls the projection device 30 and the imaging device 40. The processing device 50 recognizes the part C based on image data captured by the imaging device 40. Recognizing the part C includes recognizing the three-dimensional shape of the part C and recognizing the position of the part C. Recognizing the position of the part C includes recognizing the reference position of the part C (e.g., the center position).

[0047] The three-dimensional measuring device 8 measures the three-dimensional shape of the component C placed at the measurement position CP by the nozzle 4 based on the phase shift method. The projection device 30 irradiates the component C with patterned light PL, for example, stripe pattern light with a sinusoidal brightness distribution, while shifting the phase of the light. The patterned light PL is irradiated onto the component C from multiple directions.

[0048] The imaging device 40 acquires image data of the component C illuminated with the patterned light PL. The imaging device 40 acquires image data of the component C illuminated with the first patterned light PL1 and image data of the component C illuminated with the second patterned light PL2. The incident direction of the first patterned light PL1 and the incident direction of the second patterned light PL2 incident on the component C are different.

[0049] 6, the first pattern light PL1 is pattern light PL that is emitted from the projection device 30 and directly irradiated onto the component C. The second pattern light PL2 is pattern light PL that is emitted from the projection device 30, reflected by the reflecting member 81, and irradiated onto the component C.

[0050] The processing device 50 controls the light modulation element 32 so as to change from one of a first irradiation state in which the first pattern light PL1 from the projection device 30 is irradiated onto the component C to the other of a second irradiation state in which the second pattern light PL2 from the reflecting member 81 is irradiated onto the component C.

[0051] When irradiating the component C with the first pattern light PL1, the processing device 50 controls the light modulation element 32 so that the pattern light PL is emitted from a first region 331 of the emission surface 33S of the emission optical system 33 and is not emitted from a second region 332 of the emission surface 33S. The pattern light PL emitted from the first region 331 is irradiated directly onto the component C as the first pattern light PL1 without passing through the reflecting member 81.

[0052] When irradiating the component C with the second pattern light PL2, the processing device 50 controls the light modulation element 32 so that the pattern light PL is emitted from the second region 332 of the emission surface 33S of the emission optical system 33 and is not emitted from the first region 331 of the emission surface 33S. The pattern light PL emitted from the second region 332 passes through the optical axis AX and is irradiated onto the reflecting member 81. The pattern light PL emitted from the second region 332 is irradiated onto the component C via the reflecting member 81 as the second pattern light PL2.

[0053] 6, the first region 331 is half of the area of ​​the emission surface 33S on the +X side of the optical axis of the emission optical system 33, and the second region 332 is half of the area of ​​the emission surface 33S on the −X side of the optical axis of the emission optical system 33. The pattern light PL emitted from the first region 331 is irradiated onto the component C placed at the measurement position CP by the nozzle 4. The pattern light PL emitted from the second region 332 is irradiated onto the reflecting surface of the reflecting member 81, reflected by the reflecting surface of the reflecting member 81, and then irradiated onto the component C placed at the measurement position CP.

[0054] The projection device 30, the imaging device 40, and the reflecting member 81 are each supported by a housing 82. The relative positions of the projection device 30, the imaging device 40, and the reflecting member 81 are fixed by the housing 82. The imaging device 40 is disposed below the measurement position CP. The incident surface 41S of the imaging device 40 can face the component C disposed at the measurement position CP.

[0055] The reflecting member 81 is disposed at least partially around the optical axis AX of the imaging optical system 41 between the incident surface 41S and the component C disposed at the measurement position CP. The projection device 30 is disposed at least partially around the optical axis AX of the imaging optical system 41 between the incident surface 41S and the component C disposed at the measurement position CP. The reflecting member 81 is disposed at a position closer to the measurement position CP than the projection device 30.

[0056] 7, two projection devices 30 are arranged around the optical axis AX, and two reflecting members 81 are arranged around the optical axis AX.

[0057] The first reflecting member 81 is disposed on the -X side of the optical axis AX. The first projection device 30 is disposed on the +X side of the optical axis AX. The first projection device 30 can irradiate the first reflecting member 81 with the second pattern light PL2. The second pattern light PL2 reflected by the first reflecting member 81 is irradiated onto the component C disposed at the measurement position CP. The first projection device 30 can also irradiate the first pattern light PL1 directly onto the component C disposed at the measurement position CP.

[0058] The second reflecting member 81 is disposed on the +Y side of the optical axis AX. The second projection device 30 is disposed on the -Y side of the optical axis AX. The second projection device 30 is capable of irradiating the second reflecting member 81 with the second pattern light PL2. The second pattern light PL2 reflected by the second reflecting member 81 is irradiated onto the component C disposed at the measurement position CP. In addition, the second projection device 30 is capable of irradiating the first pattern light PL1 directly onto the component C disposed at the measurement position CP.

[0059] In this way, the three-dimensional measuring device 8 can irradiate the component C placed at the measurement position CP with the pattern light PL from four directions by using the first projection device 30, the second projection device 30, and the first reflecting member 81, the second reflecting member 81. The imaging device 40 acquires image data of the component C irradiated with the first pattern light PL1 from the first projection device 30, image data of the component C irradiated with the second pattern light PL2 from the first reflecting member 81, image data of the component C irradiated with the first pattern light PL1 from the second projection device 30, and image data of the component C irradiated with the second pattern light PL2 from the second reflecting member 81.

[0060] <Processing equipment> FIG. 8 is a hardware configuration diagram showing a processing device 50 according to the first embodiment. The processing device 50 includes a computer. The processing device 50 has a processor 50A such as a CPU (Central Processing Unit), a main memory 50B including a non-volatile memory such as a ROM (Read Only Memory) and a volatile memory such as a RAM (Random Access Memory), a storage 50C, and an interface 50D including an input / output circuit. The functions of the processing device 50 are stored in the storage 50C as a computer program. The processor 50A reads the computer program from the storage 50C, loads it into the main memory 50B, and executes processing in accordance with the computer program. The computer program may be distributed to the processing device 50 via a network.

[0061] Like the processing device 50, the control device 10 includes a computer. The control device 10 has a processor, a main memory, a storage, and an input / output interface.

[0062] 9 is a functional block diagram showing a processing device 50 according to the first embodiment. The processing device 50 includes a component data acquisition unit 51, a noise processing parameter determination unit 52, an imaging parameter determination unit 53, a pattern generation unit 54, an image data acquisition unit 55, a phase value calculation unit 56, a first gradation image data generation unit 57, a three-dimensional point cloud data generation unit 58, a noise processing unit 59, a second gradation image data generation unit 60, a reference position calculation unit 61, and a storage unit 62.

[0063] The component data acquisition unit 51 acquires component data relating to the component C to be mounted on the board W. The component data includes specification data indicating the specifications of the component C.

[0064] FIG. 10 is a diagram illustrating part data according to the first embodiment. The part data indicates the outer shape and dimensions of part C. As an example, the part data includes the outer dimensions of the body B, the number of protrusions P, the cross-sectional dimensions of the protrusions P, the cross-sectional shape of the protrusions P, the length of the protrusions P, the distance between a pair of adjacent protrusions P, and the material of the protrusions P. The part data includes, for example, specification data of part C provided by a part manufacturer. The part data may be input to the processing device 50 from the input device 9, or may be input to the processing device 50 via a network.

[0065] The noise processing parameter determination unit 52 determines noise processing parameters to be used when performing noise processing to remove noise from image data of the component C captured by the imaging device 40, based on the component data.

[0066] 11 and 12 are diagrams illustrating noise processing according to the first embodiment. Noise processing is performed to remove noise from image data of the part C captured by the imaging device 40. As will be described later, three-dimensional point cloud data of the part C is generated from the image data of the part C. Noise processing is performed to remove noise from the three-dimensional point cloud data of the part C. The noise processing parameter determination unit 52 determines noise processing parameters to be used when removing noise from the three-dimensional point cloud data of the part C, based on the part data.

[0067] The noise processing is performed based on known noise processing algorithms, such as filtering, downsampling, upsampling, feature point, registration, and segmentation.

[0068] As shown in FIG. 11, an example of a noise processing algorithm is Radius Outlier Removal, which is a type of filtering. Radius outlier removal is an algorithm that removes noise based on the number of points (number of point clouds) existing inside a sphere centered on a point of interest and a threshold value. The threshold value is a threshold value for the number of point clouds existing inside the sphere. If the number of point clouds existing inside the sphere is equal to or less than the threshold value, the points existing inside the sphere are removed as noise.

[0069] Examples of noise processing parameters for radial outlier removal include the radius R of the sphere and a threshold for the number of point clouds present inside the sphere. When radial outlier removal is used as the noise processing algorithm, the noise processing parameter determination unit 52 determines the threshold for the radius R of the sphere and the number of point clouds based on the component data. The noise processing parameter determination unit 52 determines the threshold for the radius R of the sphere and the number of point clouds based on, for example, at least one of the number of protrusions P, the length of the protrusions P, and the distance between a pair of adjacent protrusions P. For example, the noise processing parameter determination unit 52 increases the radius R of the sphere and the threshold for the number of point clouds as the number of protrusions P increases. For example, the noise processing parameter determination unit 52 increases the radius R of the sphere and the threshold for the number of point clouds as the length of the protrusions P increases. For example, the noise processing parameter determination unit 52 increases the radius R of the sphere and the threshold for the number of point clouds as the distance between a pair of adjacent protrusions P increases.

[0070] As shown in Figure 12, Euclidean Cluster Segmentation, a type of segmentation, is an example of a noise processing algorithm. Euclidean segmentation is an algorithm that removes noise based on the Euclidean distance between two points in a point cloud and a threshold value. The threshold value is a threshold value for the Euclidean distance. If the Euclidean distance between two points is equal to or less than the threshold value, the two points are considered to be in the same cluster Cr. If the Euclidean distance between two points exceeds the threshold value, the two points are removed as noise.

[0071] Noise processing parameters for Euclidean segmentation include a threshold for Euclidean distance, a maximum number of point clouds in cluster Cr, a minimum number of point clouds in cluster Cr, and a cluster tolerance. When Euclidean segmentation is used as the noise processing algorithm, the noise processing parameter determination unit 52 determines the threshold for Euclidean distance, the maximum number of point clouds in cluster Cr, the minimum number of point clouds in cluster Cr, and the cluster tolerance based on the component data. The noise processing parameter determination unit 52 determines the threshold for Euclidean distance, the maximum number of point clouds in cluster Cr, the minimum number of point clouds in cluster Cr, and the cluster tolerance based on, for example, at least one of the number of protrusions P, the length of the protrusions P, and the distance between a pair of adjacent protrusions P. For example, the noise processing parameter determination unit 52 increases the threshold for Euclidean distance, the maximum number of point clouds in cluster Cr, the minimum number of point clouds in cluster Cr, and the cluster tolerance as the number of protrusions P increases. For example, the noise processing parameter determination unit 52 increases the threshold for Euclidean distance, increases the maximum number of point groups in cluster Cr, increases the minimum number of point groups in cluster Cr, and increases the cluster tolerance as the length of the protrusion P increases. For example, the noise processing parameter determination unit 52 increases the threshold for Euclidean distance, increases the maximum number of point groups in cluster Cr, increases the minimum number of point groups in cluster Cr, and increases the cluster tolerance as the distance between a pair of adjacent protrusions P increases.

[0072] The imaging parameter determination unit 53 determines, based on the component data, imaging parameters to be used when imaging the component C with the imaging device 40. The imaging parameters include imaging conditions to be used when imaging the component C with the imaging device 40. The imaging device 40 images the component C placed at the measurement position CP based on the imaging parameters determined by the imaging parameter determination unit 53.

[0073] FIG. 13 is a diagram illustrating imaging parameters according to the first embodiment. As an example, the imaging parameters include the amount of pattern light irradiated onto the component C, exposure time, camera gain, noise cut threshold, and height range. The camera gain refers to the luminance value (pixel value) in the image data when a certain amount of light is incident on the imaging element 42. The higher the camera gain, the higher the luminance value (pixel value) in the image data when a certain amount of light is incident on the imaging element 42. The height range refers to the width in the height direction of the component C acquired as image data. The larger the height range, the larger the amount of image data.

[0074] The imaging parameter determination unit 53 determines at least one of the light intensity of the pattern light, the exposure time, and the camera gain based on, for example, the material of the protrusion P. The light reflectance of the protrusion P varies depending on the material of the protrusion P. If the protrusion P is made of metal and has high light reflectance, saturation (saturation of image brightness values) may occur due to excessive light reflection. If the protrusion P is made of resin and has low light reflectance, the imaging device 40 may have difficulty recognizing the protrusion P. For example, the imaging parameter determination unit 53 may reduce the light intensity of the pattern light, shorten the exposure time, or reduce the camera gain as the light reflectance of the protrusion P increases. In addition, the optimal imaging parameters for acquiring clear image data of the component C may vary depending on the outer dimensions of the body B, the number of protrusions P, the cross-sectional dimensions of the protrusions P, the cross-sectional shape of the protrusions P, the length of the protrusions P, and the distance between pairs of adjacent protrusions P.

[0075] FIG. 14 is a diagram illustrating a method for determining imaging parameters according to the first embodiment. The imaging parameter determination unit 53 may determine the imaging parameters based on an artificial intelligence (AI) algorithm. The AI ​​algorithm determines the imaging parameters based on a learning model generated by learning feature amounts of component data. The learning model is a learning model that receives the feature amounts of the component data as input and outputs imaging parameters. The learning model is generated in advance and stored in the storage unit 62. The imaging parameter determination unit 53 inputs the component data into the learning model, thereby being able to determine optimal imaging parameters for acquiring clear image data of the component C.

[0076] The pattern generation unit 54 generates pattern data. The pattern data generated by the pattern generation unit 54 is output to the light modulation element 32. The light modulation element 32 generates pattern light PL based on the pattern data generated by the pattern generation unit 54. The pattern data generated by the pattern generation unit 54 includes first pattern data for irradiating the component C with first pattern light PL1 from the projection device 30 without using the reflecting member 81, and second pattern data for irradiating the component C with second pattern light PL2 from the projection device 30 via the reflecting member 81.

[0077] 15A and 15B are diagrams showing pattern data according to the first embodiment. As shown in Fig. 15A, when the component C is irradiated with the first pattern light PL1, the pattern generation unit 54 generates the first pattern data and controls the light modulation element 32 so that the pattern light PL is emitted from a first region 331 of the emission surface 33S of the emission optical system 33 and the pattern light PL is not emitted from a second region 332 of the emission surface 33S.

[0078] As shown in Figure 15(B), when irradiating the part C with the second pattern light PL2, the pattern generation unit 54 generates second pattern data and controls the light modulation element 32 so that the pattern light PL is emitted from the second region 332 of the emission surface 33S of the emission optical system 33 and the pattern light PL is not emitted from the first region 331 of the emission surface 33S.

[0079] The image data acquisition unit 55 acquires image data from the imaging element 42. The image data acquisition unit 55 acquires image data of the component C onto which the first pattern light PL1 is projected by the first projection device 30 and the second projection device 30, and image data of the component C onto which the second pattern light PL2 from the first reflection member 81 and the second reflection member 81 is projected.

[0080] The phase value calculation unit 56 calculates a phase value for each of the multiple pixels in the image data based on the luminance of the image data. The phase value calculation unit 56 calculates a phase value for a pixel in the image data corresponding to the same point based on the luminance of the same point in the multiple image data of the component C irradiated with each of the phase-shifted patterned lights PL. The phase value calculation unit 56 calculates a phase value for each of the multiple pixels in the image data based on the luminance of the respective points in the image data.

[0081] The first gradation image data generation unit 57 generates first gradation image data that indicates the shape of the part C with gradation from the image data of the part C captured by the imaging device 40. The first gradation image data calculates height data for each of the multiple points on the part C that correspond to each of the multiple pixels of the image data based on the phase values ​​of each of the multiple pixels in the image data of the part C. The first gradation image data generation unit 57 generates first gradation image data that indicates the three-dimensional shape of the part C with gradation based on the height data for each of the multiple points on the part C.

[0082] The three-dimensional point cloud data generating unit 58 converts the first gradation image data of the part C into three-dimensional point cloud data of the part C.

[0083] The noise processing unit 59 removes noise from the three-dimensional point cloud data of the part C and extracts the protrusion P. The noise processing unit 59 removes noise from the three-dimensional point cloud data of the part C and extracts the protrusion P based on the noise processing parameters determined by the noise processing parameter determination unit 52.

[0084] The second gradation image data generating unit 60 converts the three-dimensional point cloud data from which noise has been removed by the noise processing unit 59 into second gradation image data that indicates the shape of the part C with shading.

[0085] The reference position calculation unit 61 calculates the reference position of the part C based on the coordinates of each of the multiple protrusions P in the second gradation image data. The coordinates of the protrusions P are coordinates in the X-axis direction and coordinates in the Y-axis direction. The reference position of the part C includes the center position of the part C on the XY plane.

[0086] The control device 10 controls the mounting head 5 so that the component C is mounted at the target position on the board W based on the reference position of the component C calculated by the reference position calculation unit 61.

[0087] <How to process Ca parts> Fig. 16 is a diagram illustrating a method for processing a part Ca according to the first embodiment. Each of the first gradation image data, the three-dimensional point cloud data, and the second gradation image data of the part Ca shown in Fig. 16 corresponds to a view of a part of the part Ca viewed from below.

[0088] As shown in FIG. 16, the first gradation image data generator 57 generates first gradation image data that indicates the shape of the part Ca using shading from image data of the part Ca captured by the imaging device 40. The first gradation image data expresses the height of each of the multiple parts of the part Ca using multiple gradations. The first gradation image data may express the height of each of the multiple parts of the part Ca using 256 gradations or 1024 gradations. In the first gradation image data, parts of the part Ca that are short are expressed in light colors, and parts of the part Ca that are tall are expressed in dark colors. When the part Ca is placed at the measurement position CP, the part of the part Ca that is shortest is the tip (lower end) of the electrode portion Ea. In the first gradation image data, the electrode portion Ea is expressed in the lightest color.

[0089] The 3D point cloud data generation unit 58 converts the first gradation image data of the part Ca into 3D point cloud data of the part Ca. The 3D point cloud data generation unit 58 converts each gradation in the first gradation image data into one point. When the heights of each of the multiple portions of the part Ca are expressed in 256 gradations in the first gradation image data, the 3D point cloud data generation unit 58 generates 3D point cloud data consisting of points divided into 256 levels in the height direction. For example, the pixel with the lowest height, the first gradation, in the first gradation image data is converted into the point with the lowest height, the first level, in the 3D point cloud data. The pixel with the 100th gradation in the first gradation image data is converted into the point with the 100th level of height in the 3D point cloud data. The pixel with the highest height, the 256th gradation, in the first gradation image data is converted into the point with the highest height, the 256th level, in the 3D point cloud data.

[0090] The noise processing unit 59 removes noise from the 3D point cloud data of the part Ca. As shown in Fig. 16 , if noise Nz is present in the 3D point cloud data of the part Ca before noise processing, the noise processing unit 59 removes the noise Nz from the 3D point cloud data of the part Ca based on the well-known noise processing algorithm described above. When removing the noise Nz, the noise processing unit 59 removes the noise Nz from the 3D point cloud data of the part Ca based on the noise processing parameters determined by the noise processing parameter determination unit 52.

[0091] In the embodiment, removing noise from the 3D point cloud data of the part Ca includes removing a point cloud representing the body part Ba from the 3D point cloud data of the part Ca. That is, in the embodiment, the noise includes a point cloud representing the body part Ba. The noise processing unit 59 removes the point cloud representing the body part Ba as noise from the 3D point cloud data of the part Ca.

[0092] FIG. 17 is a diagram illustrating noise processing for the part Ca according to the first embodiment. As shown in FIG. 17, the noise processing unit 59 removes noise from the three-dimensional point cloud data of the part Ca to extract the electrode portion Ea. The noise processing unit 59 leaves the point cloud in the height range Ze that includes the electrode portion Ea and removes the point cloud outside the height range Ze that includes the body portion Ba as noise. The height range Ze includes the tip end (lower end) of the electrode portion Ea. The height range Ze does not include the base end (upper end) of the electrode portion Ea. The point cloud of the body portion Ba and the point cloud of the base end of the electrode portion Ea are removed. The point cloud in the height range Ze that includes only the tip end of the electrode portion Ea is left, and the point cloud outside the height range Ze is removed, thereby extracting the point cloud of the tip end of the electrode portion Ea.

[0093] When imaging the component Ca placed at the measurement position CP, the imaging device 40 images the component Ca with the focal point of the imaging optical system 41 of the imaging device 40 aligned with the electrode portion Ea. That is, the imaging device 40 images the component C with the focus adjusted on the electrode portion Ea. The noise processing unit 59 can determine the height range Ze based on the focal position of the imaging device 40 when imaging the component Ca. The noise processing unit 59 can extract a point cloud of the tip of the electrode portion Ea from the 3D point cloud data of the component Ca based on the focal position of the imaging device 40 when imaging the component Ca. The height range Ze may be considered as one of the noise processing parameters.

[0094] As shown in Figure 16, by performing noise processing, the point cloud representing the tall body part Ba is removed from the 3D point cloud data of the part Ca, and the point cloud representing the short electrode part Ea remains.

[0095] The second gradation image data generator 60 converts the noise-removed 3D point cloud data of the part Ca into second gradation image data. As shown in Fig. 16, the second gradation image data does not include the body part Ba but includes the electrode part Ea.

[0096] The reference position calculation unit 61 calculates the reference position of the part Ca based on the coordinates of each of the multiple electrode portions Ea in the second gradation image data of the part Ca. The coordinates of the electrode portions Ea are coordinates in the X-axis direction and coordinates in the Y-axis direction. The reference position of the part Ca includes the center position of the part Ca on the XY plane.

[0097] The control device 10 controls the mounting head 5 so that the component Ca is mounted at the target position on the board W based on the reference position of the component Ca calculated by the reference position calculation unit 61.

[0098] <Processing method for part Cb> FIG. 18 is a diagram illustrating noise processing for a part Cb according to the first embodiment. As with the part Ca, when recognizing the reference position of the part Cb, the part Cb placed at the measurement position CP is imaged by the imaging device 40. The part Cb has electrode portions Eb, which are metal protrusions Pb, and boss portions Db, which are resin protrusions Pb. When imaging the part Cb with the imaging device 40, the imaging parameter determination unit 53 determines optimal imaging parameters for imaging the part Cb based on the part data of the part Cb. The imaging device 40 can acquire clear image data of the part Cb by imaging the part Cb based on the imaging parameters.

[0099] As with part Ca, first gradation image data generation unit 57 generates first gradation image data for part Cb from image data for part Cb. 3D point cloud data generation unit 58 converts the first gradation image data for part Cb into 3D point cloud data for part Cb. Noise processing unit 59 removes noise from the 3D point cloud data for part Cb based on the noise processing parameters determined by noise processing parameter determination unit 52.

[0100] Removing noise from the 3D point cloud data of the part Cb includes removing at least the point cloud representing the body portion Bb from the 3D point cloud data of the part Cb and extracting the tip portions of the protrusions Pb (the tip portions of the electrodes Eb and the tip portions of the bosses Db). As shown in FIG. 18, the noise processing unit 59 leaves the point cloud in the height range Ze including the tip portions (lower ends) of the electrodes Eb and the tip portions (lower ends) of the bosses Db, and removes the point cloud outside the height range Ze including the body portion Bb as noise. The height range Ze does not include the base end (upper end) and middle portion of the electrodes Eb. The height range Ze does not include the base end (upper end) and middle portion of the bosses Db. The height range Ze does not include the body portion Bb. The point cloud of the body portion Bb, the point cloud of the base end and middle portion of the electrodes Eb, and the point cloud of the base end and middle portion of the bosses Db are removed. The point cloud of the height range Ze, which includes only the tip of the electrode portion Eb and the tip of the boss portion Db, is left, and the point cloud outside the height range Ze is removed, thereby extracting the point cloud of the tip of the electrode portion Eb and the tip of the boss portion Db.

[0101] When imaging a component Cb placed at measurement position CP, the imaging device 40 images the component Cb with the focal point of the imaging optical system 41 of the imaging device 40 aligned with the tips of the protrusions Pb (the tips of the electrodes Eb and the bosses Db). That is, the imaging device 40 images the component Cb with the focus adjusted on the tips of the protrusions Pb. The noise processing unit 59 can extract point clouds of the tips of the electrodes Eb and the bosses Db from the 3D point cloud data of the component Cb based on the focal position of the imaging device 40 when imaging the component Cb. The height range Ze may be considered as one of the noise processing parameters.

[0102] The second gradation image data generating unit 60 converts the noise-removed three-dimensional point cloud data of the part Cb into second gradation image data.

[0103] FIG. 19 is a diagram showing the second gradation image data of the part Cb according to the first embodiment. FIG. 19 corresponds to a view of the part Cb as seen from below. As shown in FIG. 19, the second gradation image data of the part Cb includes the tip portions of the electrode portions Eb and the tip portions of the boss portions Db. The second gradation image data of the part Cb does not include the base end portions and middle portions of the electrode portions Eb. The second gradation image data of the part Cb does not include the base end portions and middle portions of the boss portions Db. The second gradation image data of the part Cb does not include the body portion Bb.

[0104] The reference position calculation unit 61 calculates the reference position of the component Cb based on the coordinates of each of the tip ends of the multiple protrusions Pb (the tip ends of the electrode portions Eb and the tip ends of the boss portions Db) in the second gradation image data of the component Cb. The coordinates of the tip ends of the protrusions Pb are coordinates in the X-axis direction and coordinates in the Y-axis direction. The reference position of the component Cb includes the center position of the component Cb on the XY plane.

[0105] The control device 10 controls the mounting head 5 so that the component Ca is mounted at the target position on the board W based on the reference position of the component Cb calculated by the reference position calculation unit 61.

[0106] <Processing method for part Cc> FIG. 20 is a diagram illustrating noise processing for a part Cc according to the first embodiment. As with parts Ca and Cb, when recognizing the reference position of part Cc, the imaging device 40 captures an image of part Cc placed at measurement position CP. Part Cc has a first electrode portion Ec1, a second electrode portion Ec2, and a third electrode portion Ec3, each of which has a different protrusion amount. When imaging part Cc using the imaging device 40, the imaging parameter determination unit 53 determines optimal imaging parameters for imaging part Cc based on the part data of part Cc. By capturing an image of part Cc based on the imaging parameters, the imaging device 40 can acquire clear image data of part Cc.

[0107] As with parts Ca and Cb, first gradation image data generation unit 57 generates first gradation image data for part Cc from the image data of part Cc. 3D point cloud data generation unit 58 converts the first gradation image data for part Cc into 3D point cloud data for part Cc. Noise processing unit 59 removes noise from the 3D point cloud data for part Cc based on the noise processing parameters determined by noise processing parameter determination unit 52.

[0108] Removing noise from the 3D point cloud data of the part Cc includes removing at least the point cloud representing the body portion Bc from the 3D point cloud data of the part Cc and extracting the tip portions of the protrusions Pc (the tip portions of the first electrode portion Ec1, the second electrode portion Ec2, and the third electrode portion Ec3). As shown in Fig. 20, the noise processing unit 59 leaves a point cloud in a height range Ze1 that includes the tip portion (lower end) of the first electrode portion Ec1, a point cloud in a height range Ze2 that includes the tip portion (lower end) of the second electrode portion Ec2, and a point cloud in a height range Ze3 that includes the tip portion (lower end) of the third electrode portion Ec3, and removes point clouds outside the height ranges Ze1, Ze2, and Ze3 as noise. The point cloud of the body portion Bc, the point cloud of the base end (upper end) and middle portion of the first electrode portion Ec1, the point cloud of the base end (upper end) and middle portion of the second electrode portion Ec2, and the point cloud of the base end (upper end) and middle portion of the third electrode portion Ec3 are removed. The point cloud of the height range Ze1 including only the tip portion of the first electrode portion Ec1, the point cloud of the height range Ze2 including only the tip portion of the second electrode portion Ec2, and the point cloud of the height range Ze3 including only the tip portion of the third electrode portion Ec3 are left, and the point clouds outside the height ranges Ze1, Ze2, and Ze3 are removed, thereby extracting the point cloud of the tip portion of the first electrode portion Ec1, the point cloud of the tip portion of the second electrode portion Ec2, and the point cloud of the tip portion of the third electrode portion Ec3.

[0109] In the embodiment, the noise processing unit 59 removes the base end and intermediate portion of the first electrode portion Ec1, the second electrode portion Ec2, the third electrode portion Ec3, and the body portion Bc as noise from the 3D point cloud data of the part Cc to generate first 3D point cloud data in which the tip portion of the first electrode portion Ec1 is extracted. Also, the noise processing unit 59 removes the base end and intermediate portion of the second electrode portion Ec2, the third electrode portion Ec3, the first electrode portion Ec1, and the body portion Bc as noise from the 3D point cloud data of the part Cc to generate second 3D point cloud data in which the tip portion of the second electrode portion Ec2 is extracted. In addition, the noise processing unit 59 removes the base end and middle portion of the third electrode portion Ec3, the first electrode portion Ec1, the second electrode portion Ec2, and the body portion Bc as noise from the 3D point cloud data of the part Cc, and generates third 3D point cloud data in which the tip portion of the third electrode portion Ec3 is extracted.

[0110] The second gradation image data generating unit 60 converts the noise-removed three-dimensional point cloud data of the part Cc into second gradation image data.

[0111] FIG. 21 is a diagram showing second gradation image data of a part Cc according to the first embodiment. FIG. 21 corresponds to a view of the part Cc as seen from below. As shown in FIG. 21, the second gradation image data generation unit 60 converts the first three-dimensional point cloud data from which noise has been removed into first second gradation image data. The second gradation image data generation unit 60 converts the second three-dimensional point cloud data from which noise has been removed into second second gradation image data. The second gradation image data generation unit 60 converts the third three-dimensional point cloud data from which noise has been removed into third second gradation image data.

[0112] The first second-level gradation image data includes the tip of the first electrode portion Ec1 but does not include the second electrode portion Ec2 or the third electrode portion Ec3. The second second-level gradation image data includes the tip of the second electrode portion Ec2 but does not include the third electrode portion Ec3 or the first electrode portion Ec1. The third second-level gradation image data includes the tip of the third electrode portion Ec3 but does not include the first electrode portion Ec1 or the second electrode portion Ec2.

[0113] The reference position calculation unit 61 calculates the reference position OX of the component Cc based on the coordinates of the tip of the first electrode portion Ec1 in the first second-level image data, the coordinates of the tip of the second electrode portion Ec2 in the second second-level image data, and the coordinates of the tip of the third electrode portion Ec3 in the third second-level image data. The coordinates of the tip of the first electrode portion Ec1, the coordinates of the tip of the second electrode portion Ec2, and the coordinates of the tip of the third electrode portion Ec3 are coordinates in the X-axis direction and Y-axis direction. The reference position OX of the component Cc includes the center position of the component Cc in the XY plane.

[0114] The control device 10 controls the mounting head 5 so that the component Cc is mounted at the target position on the board W based on the reference position of the component Cc calculated by the reference position calculation unit 61.

[0115] <Effects> As described above, the three-dimensional measuring device 8 includes the projection device 30 that irradiates the part Ca having a body portion Ba and multiple electrode portions Ea with patterned light PL, the imaging device 40 that images the part Ca irradiated with the patterned light PL, and the processing device 50 having a processor 50A that processes image data of the part Ca imaged by the imaging device 40. The processing device 50 includes a first gradation image data generation unit 57 that generates first gradation image data that indicates the shape of the part Ca using shading from the image data, a three-dimensional point cloud data generation unit 58 that converts the first gradation image data of the part Ca into three-dimensional point cloud data of the part Ca, a noise processing unit 59 that removes noise from the three-dimensional point cloud data of the part Ca to extract the electrode portions Ea, a second gradation image data generation unit 60 that converts the noise-removed three-dimensional point cloud data of the part Ca into second gradation image data, and a reference position calculation unit 61 that calculates a reference position of the part Ca based on the coordinates of each of the multiple electrode portions Ea in the second gradation image data of the part Ca.

[0116] According to the embodiment, the recognition performance of the part Ca by the three-dimensional measuring device 8 is improved. When removing noise from measurement data of the part Ca measured by the three-dimensional measuring device 8, it is easier to remove noise from three-dimensional point cloud data than from first gradation image data. Furthermore, there are many known noise processing algorithms for removing noise from three-dimensional point cloud data, and noise processing techniques are established. Furthermore, when setting a height range Ze for extracting the electrode portion Ea, it is easier to set the height range Ze for three-dimensional point cloud data than for gradation image data. That is, after the first gradation image data of the part Ca is converted into three-dimensional point cloud data, noise processing is performed to remove noise from the three-dimensional point cloud data, thereby properly removing noise. By converting the three-dimensional point cloud data from which noise has been properly removed into second gradation image data, the coordinates of the electrode portion Ea can be properly recognized in the second gradation image data. When recognizing the coordinates of the electrode portion Ea, it is easier to recognize the coordinates of the electrode portion Ea in the second gradation image data than in the three-dimensional point cloud data. Since the coordinates of the electrode portion Ea are correctly recognized in the second gradation image data, the reference position of the component Ca is correctly recognized.

[0117] According to the embodiment, first gradation image data is generated from the image data of the part Ca, and then the first gradation image data is converted into three-dimensional point cloud data. If three-dimensional point cloud data were generated directly from the image data of the part Ca, the amount of data in the three-dimensional point cloud data could be large. After the first gradation image data is generated from the image data of the part Ca, the first gradation image data is converted into three-dimensional point cloud data, thereby reducing the amount of data in the three-dimensional point cloud data. Noise processing is performed on the three-dimensional point cloud data with a small amount of data. The three-dimensional point cloud data with a small amount of data after noise processing is converted into second gradation image data. The reference position of the part Ca is recognized based on the coordinates of the electrode portion Ea in the second gradation image data with a small amount of data. This reduces the computational load on the processing device 50 that recognizes the reference position of the part Ca.

[0118] In this embodiment, when recognizing the reference position OX of the part Cc, the noise processing unit 59 removes noise from the 3D point cloud data of the part Cc to extract the tip of the first electrode portion Ec1, the tip of the second electrode portion Ec2, and the tip of the third electrode portion Ec3. The second gradation image data generation unit 60 converts the 3D point cloud data of the part Cc from which noise has been removed into second gradation image data. The reference position calculation unit 61 calculates the reference position OX of the part Cc based on the coordinates of the tip of the first electrode portion Ec1, the coordinates of the tip of the second electrode portion Ec2, and the coordinates of the tip of the third electrode portion Ec3 in the second gradation image data of the part Cc. Even if a component Cc is provided with a first electrode portion Ec1, a second electrode portion Ec2, and a third electrode portion Ec3 that have different amounts of protrusion (tip heights) from the body portion Bc, the second grayscale image data of the component Cc will have clear images of the tips of the first electrode portion Ec1, the second electrode portion Ec2, and the third electrode portion Ec3. Since the imaging device 40 does not need to capture images of the component Cc multiple times (three times) to match the heights of the tips of the first electrode portion Ec1, the second electrode portion Ec2, and the third electrode portion Ec3, respectively, the takt time, which is the time required to recognize the reference position OX of the component Cc, is improved.

[0119] In this embodiment, the processing device 50 includes a component data acquisition unit 51 that acquires component data indicating the external shape and dimensions of a component Cb, and a noise processing parameter determination unit 52 that determines noise processing parameters for use in removing noise from the 3D point cloud data of the component Cb based on the component data. A noise processing unit 59 removes noise from the 3D point cloud data of the component Cb based on the noise processing parameters to extract protrusions Pb (electrodes Eb and bosses Db). Even if the component Cb has electrodes Eb and bosses Db with different optical reflectances, noise is removed from the 3D point cloud data of the component Cb based on the optimal noise processing parameters, resulting in the generation of second-level grayscale image data that clearly depicts the tips of the electrodes Eb and bosses Db. This allows the reference position of the component Cb to be accurately recognized.

[0120] [Second embodiment] A second embodiment will now be described. In the following description, the same or equivalent components as those in the first embodiment described above will be denoted by the same reference numerals, and the description thereof will be simplified or omitted.

[0121] 16 and 17 , in the first embodiment described above, when extracting the point cloud of the tip portion of the electrode portion Ea of the part Ca, the imaging device 40 images the part Ca while the focal point of the imaging optical system 41 of the imaging device 40 is aligned with the tip portion (lower end) of the electrode portion Ea (while focusing on the tip portion of the electrode portion Ea). The noise processing unit 59 determines the height range Ze based on the focal position of the imaging device 40 when imaging the part Ca. Based on the focal position of the imaging device 40 when imaging the part Ca, the noise processing unit 59 leaves the point cloud within the height range Ze that includes the tip portion of the electrode portion Ea and removes, as noise, the point cloud outside the height range Ze that includes the body portion Ba.

[0122] When imaging the part Ca with the imaging device 40, if the part Ca is tilted, it may be difficult for the imaging device 40 to simultaneously focus on each of the multiple electrode portions Ea. If it becomes difficult for the imaging device 40 to simultaneously focus on each of the multiple electrode portions Ea, it may be difficult for the noise processing unit 59 to appropriately determine the height range Ze based on the position of the focal point of the imaging device 40 when imaging the part Ca.

[0123] In the second embodiment, the noise processor 59 calculates the tilt of the part Ca based on 3D point cloud data of the electrode Ea located within a predetermined range FG near the focus of the imaging optical system 41. The noise processor 59 extracts the tip of the electrode Ea from the 3D point cloud data, taking the tilt of the part Ca into consideration. The noise processor 59 sets a reference height Zr for the tip of the electrode Ea (described later) based on the tilt of the part Ca, and determines a height range Ze based on the reference height Zr. The height range Ze includes the tip of the electrode Ea. The noise processor 59 retains the point cloud within the height range Ze determined based on the reference height Zr, and removes, as noise, the point cloud outside the height range Ze including the body Ba. As a result, even when the imaging device 40 captures an image of a tilted part Ca, the noise processor 59 can retain the point cloud within the height range Ze including the tip of the electrode Ea, and remove, as noise, the point cloud outside the height range Ze including the body Ba.

[0124] Fig. 22 is a diagram for explaining noise processing for the part Ca according to the second embodiment, and Fig. 23 is a flowchart showing noise processing for the part Ca according to the second embodiment.

[0125] The imaging device 40 images the part Ca. The imaging device 40 images the part Ca with the focal point of the imaging optical system 41 of the imaging device 40 aligned with the tip ends of at least some of the electrode portions Ea among the plurality of electrode portions Ea. In the embodiment, the imaging device 40 images the part Ca with the focal point of the imaging optical system 41 aligned with the tip ends of the electrode portions Ea at the center of the part Ca within the XY plane among the plurality of electrode portions Ea. In the example shown in FIG. 22 , the imaging device 40 images the part Ca with the focal point of the imaging optical system 41 aligned with the tip ends of the electrode portions Ear that are closest to the center of the part Ca within the XY plane among the plurality of electrode portions Ea.

[0126] The image data acquisition unit 55 acquires image data of the part Ca captured by the imaging device 40. As in the first embodiment described above, the phase value calculation unit 56 calculates a phase value for each of the multiple pixels in the image data of the part Ca based on the luminance of each of the multiple points in the image data of the part Ca. The first gradation image data calculates height data for each of the multiple points of the part Ca corresponding to each of the multiple pixels in the image data based on the phase value of each of the multiple pixels in the image data of the part Ca. The first gradation image data generation unit 57 generates first gradation image data that indicates the three-dimensional shape of the part Ca using shades of gray based on the height data for each of the multiple points of the part Ca. The three-dimensional point cloud data generation unit 58 converts the first gradation image data of the part Ca into three-dimensional point cloud data of the part Ca.

[0127] The noise processing unit 59 calculates the tilt of the part Ca based on the three-dimensional point cloud data of the electrode portion Ea present in a predetermined range FG near the focal point of the imaging optical system 41 of the imaging device 40 (step SA1).

[0128] The tilt of the part Ca refers to the tilt of the part Ca with respect to the optical axis AX of the imaging optical system 41. When the part Ca is not tilted, the lower surface of the body part B of the part Ca is perpendicular to the optical axis AX. When the part Ca is not tilted, the central axis of the electrode part Ea (the protruding direction of the electrode part Ea) is parallel to the optical axis AX.

[0129] As shown in Figure 22, when part Ca is tilted, the bottom surface of body B of part Ca is not perpendicular to the optical axis AX. When part Ca is tilted, the central axis of electrode Ea is not parallel to the optical axis AX. The tilt of part Ca includes the tilt angle of the bottom surface of part Ca relative to a reference plane perpendicular to the optical axis AX. When part Ca is not tilted, the tilt angle of part Ca is 0 degrees.

[0130] The predetermined range FG around the focal point is a predetermined range in the XY plane. The three-dimensional point cloud data of the electrode portion Ea present in the predetermined range FG refers to the three-dimensional point cloud data of the tip of the electrode portion Ea in a predetermined range in the XY plane centered on the tip of the electrode portion Ear. The three-dimensional point cloud data of the electrode portion Ea present in the predetermined range FG is the three-dimensional point cloud data of multiple electrode portions Ea centered on the electrode portion Ear in the XY plane. The noise processing unit 59 can calculate the tilt of the part Ca using the three-dimensional point cloud data of the multiple electrode portions Ea centered on the electrode portion Ear.

[0131] The noise processor 59 sets multiple division regions VD in the 3D point cloud data of the multiple electrode portions Ea of the part Ca based on the inclination (tilt angle) of the part Ca (step SA2). The noise processor 59 increases the number of division regions VD as the inclination angle of the part Ca increases. The multiple division regions VD have the same size. In the example shown in FIG. 22, the noise processor 59 divides the 3D point cloud data of the multiple electrode portions Ea of the part Ca into four division regions VD. The division regions VD include a first division region VD1, a second division region VD2, a third division region VD3, and a fourth division region VD4. In other words, the noise processor 59 divides the point cloud of the multiple electrode portions Ea of the part Ca into multiple groups based on the inclination (tilt angle) of the part Ca. The point group of the electrode portion Ea is divided into a point group of the electrode portion Ea belonging to the first division region VD1, a point group of the electrode portion Ea belonging to the second division region VD2, a point group of the electrode portion Ea belonging to the third division region VD3, and a point group of the electrode portion Ea belonging to the fourth division region VD4.

[0132] The noise processing unit 59 determines the reference height Zr of the tip ends of the electrode portions Ea for each of the multiple divided regions VD (step SA3). The noise processing unit 59 determines the reference height Zr of the tip ends of the multiple electrode portions Ea belonging to the first divided region VD1. The noise processing unit 59 determines the reference height Zr of the tip ends of the multiple electrode portions Ea belonging to the second divided region VD2. The noise processing unit 59 determines the reference height Zr of the tip ends of the multiple electrode portions Ea belonging to the third divided region VD3. The noise processing unit 59 determines the reference height Zr of the tip ends of the multiple electrode portions Ea belonging to the fourth divided region VD4.

[0133] The reference height Zr may be the height of the tip of the electrode portion Ea that is located at the center of the divided region VD in the XY plane among the multiple electrode portions Ea that belong to one divided region VD, or the reference height Zr may be the average value of the heights of the tip of the multiple electrode portions Ea that belong to one divided region VD.

[0134] The noise processor 59 extracts the tip of the electrode Ea from the three-dimensional point cloud data of each of the divided regions VD based on the reference height Zr. The noise processor 59 sets a height range Ze so as to include each of the reference heights Zr (step SA4).

[0135] The noise processing unit 59 leaves the point cloud in the height range Ze including the reference height Zr, and removes the point cloud outside the height range Ze as noise (step SA5).

[0136] FIG. 24 is a diagram illustrating the reference height Zr and height range Ze according to the second embodiment. FIG. 24 corresponds to an enlarged view of the first divided region VD1 in FIG. 22. As shown in FIG. 24, the noise processing unit 59 sets the height range Ze based on the reference height Zr set in the first divided region VD1. The noise processing unit 59 sets the height range Ze in the first divided region VD1 so as to include the reference height Zr. The noise processing unit 59 sets the height range Ze in the first divided region VD1 so that the reference height Zr is positioned at the center of the height range Ze in the height direction (Z-axis direction), for example.

[0137] The noise processing unit 59 leaves the point cloud in the height range Ze and removes the point cloud outside the height range Ze as noise. The height range Ze includes the tip end (lower end) of the electrode portion Ea in the first divided region VD1. The height range Ze does not include the base end (upper end) of the electrode portion Ea in the first divided region VD1. In the first divided region VD1, the point cloud of the body portion B and the point cloud of the base end of the electrode portion Ea are removed as noise. In the first divided region VD1, the point cloud in the height range Ze including only the tip end of the electrode portion Ea is left and the point cloud outside the height range Ze is removed, thereby extracting the point cloud of the tip end of the electrode portion Ea in the first divided region VD1.

[0138] The noise processing unit 59 performs the same processing on the second divided region VD2, the third divided region VD3, and the fourth divided region VD4 as on the first divided region VD1 described with reference to Fig. 24. As a result, point clouds of the tip portions of the electrode portions Ea in the second divided region VD2, the third divided region VD3, and the fourth divided region VD4 are extracted.

[0139] After the point cloud of the tip portions of the electrode portions Ea has been extracted, the second gradation image data generation unit 60 converts the noise-removed 3D point cloud data of the component Ca into second gradation image data, as in the first embodiment described above. The reference position calculation unit 61 calculates the reference position of the component Ca based on the coordinates of each of the multiple electrode portions Ea in the second gradation image data of the component Ca. The coordinates of the electrode portions Ea are coordinates in the X-axis direction and coordinates in the Y-axis direction. The reference position of the component Ca includes the center position of the component Ca in the XY plane. The control device 10 controls the mounting head 5 based on the reference position of the component Ca calculated by the reference position calculation unit 61 so that the component Ca is mounted at the target position on the board W.

[0140] As described above, in this embodiment, the tilt of the part Ca is calculated based on the 3D point cloud data of the electrode portion Ea present in the predetermined range FG near the focal point of the imaging optical system 41 of the imaging device 40. The tip of the electrode portion Ea is extracted from the 3D point cloud data taking into account the tilt of the part Ca. As a result, even if the part Ca is tilted, the height range Ze is appropriately determined for each of the multiple divided regions VD. Therefore, the tip of the electrode portion Ea is appropriately extracted from the 3D point cloud data.

[0141] [Third embodiment] A third embodiment will now be described. In the following description, the same or equivalent components as those in the first embodiment described above will be denoted by the same reference numerals, and the description thereof will be simplified or omitted.

[0142] In the third embodiment, an example will be described in which the processing device 50 generates a production program. The production program refers to a computer program used to produce a mounting board Wm in an electronic device production line that includes the component mounting apparatus 1. The mounting board Wm is a board W on which multiple components C are mounted by the component mounting apparatus 1. In other words, the production program refers to a computer program used to control the component mounting apparatus 1. The processing device 50 generates the production program used to control the mounting head 5 that includes at least the nozzles 4, based on the second gradation image data.

[0143] As described above, the component mounting apparatus 1 mounts components C on a board W on which cream solder has been printed. The production line includes a solder paste inspection device (SPI: Solder Paste Inspection) that inspects the printed state of the cream solder on the board W before the components C are mounted, the component mounting apparatus 1, and a board appearance inspection device (AOI: Automated Optical Inspection) that inspects the state of the board W after the components C have been mounted.

[0144] 25 is a flowchart showing a production program generation method according to the third embodiment. As in the first embodiment described above, the three-dimensional measurement device 8 measures the three-dimensional shape of the component C placed at the measurement position CP by the nozzle 4 based on the phase shift method. The projection device 30 irradiates the component C with patterned light PL, for example, stripe pattern light with a sinusoidal brightness distribution, while shifting the phase. The patterned light PL is irradiated onto the component C from multiple directions. The image data acquisition unit 55 acquires image data of the component C onto which the patterned light PL is projected from the image sensor 42 of the imaging device 40 (step SB1).

[0145] As in the first embodiment described above, the phase value calculation unit 56 calculates a phase value for each of the multiple pixels of the image data based on the luminance of the image data (step SB2). Based on the luminance of the same point in the multiple image data of the component C irradiated with each of the phase-shifted patterned light PL, the phase value calculation unit 56 calculates a phase value for the pixel of the image data corresponding to that point. Based on the luminance of each of the multiple points in the image data, the phase value calculation unit 56 calculates a phase value for each of the multiple pixels of the image data.

[0146] The first gradation image data generation unit 57 generates first gradation image data that indicates the shape of the component C in gradation from the image data of the component C captured by the imaging device 40 (step SB3). The first gradation image data calculates height data for each of the multiple points on the component C that correspond to each of the multiple pixels of the image data based on the phase values ​​of each of the multiple pixels in the image data of the component C. The first gradation image data generation unit 57 generates first gradation image data that indicates the three-dimensional shape of the component C in gradation based on the height data for each of the multiple points on the component C.

[0147] The three-dimensional point cloud data generator 58 converts the first gradation image data of the part C into three-dimensional point cloud data of the part C (step SB4).

[0148] The noise processing unit 59 removes noise from the three-dimensional point cloud data of the part C and extracts the protruding portion P. Based on the noise processing parameters determined by the noise processing parameter determination unit 52, the noise processing unit 59 removes noise from the three-dimensional point cloud data of the part C and extracts the protruding portion P (step SB5).

[0149] The second gradation image data generating unit 60 converts the three-dimensional point cloud data from which noise has been removed by the noise processing unit 59 into second gradation image data that indicates the shape of the part C with shading (step SB6).

[0150] The reference position calculation unit 61 performs binarization processing on the second gradation image data generated in step SB6 (step SB7). Binarization processing refers to image processing that converts the image to be analyzed into only two colors, black and white. Through binarization processing, the boundary between the image of part C and the background becomes clear.

[0151] The reference position calculation unit 61 performs an expansion process or a closing process on the second gradation image data after the binarization process (step SB8). The expansion process is a process of increasing the white pixel area of ​​a binary image. If there is at least one white pixel around the pixel of interest, the pixel of interest is replaced with a white pixel. The closing process is a process of shrinking a binary image. The closing process removes black noise. Note that in step SA3, both the expansion process and the closing process may be performed, or the expansion process and the closing process may be repeated multiple times.

[0152] The phase value calculation unit 56 calculates the phase value of each of the multiple pixels in the image data of the part C that was expanded or closed in step SB8, based on the luminance of the image data. The reference position calculation unit 61 calculates three-dimensional data of the part C based on the image data of the part C projected with the first patterned light PL1 and the image data of the part C projected with the second patterned light PL2 (step SB9). The three-dimensional data of the part C includes the position of the tip of the protrusion P in the XY plane and the length of the protrusion P. Note that the three-dimensional data of the part C may also include the overall length of the part C in the Z-axis direction.

[0153] Specifically, the reference position calculation unit 61 calculates the three-dimensional shape of the tip of the protrusion P based on the phase values ​​of each of the multiple pixels in the image data. Based on the phase values, the reference position calculation unit 61 calculates height data of each pixel of the image data corresponding to the tip of the protrusion P using the principle of triangulation. Here, the height data of each pixel of the image data and the height data of each point at the tip of the protrusion P correspond one-to-one. The height data of each point at the tip of the protrusion P indicates the coordinate value of each point at the tip of the protrusion P in three-dimensional space. The reference position calculation unit 61 calculates the three-dimensional shape of the tip of the protrusion P based on the height data of each point at the tip of the protrusion P. Based on the three-dimensional shape of the tip of the protrusion P, the reference position calculation unit 61 can calculate the position of the tip of the protrusion P on the XY plane and the length of the protrusion P. Based on the three-dimensional shape of the tip of the protrusion P, the reference position calculation unit 61 can also calculate the overall length of the part C in the Z-axis direction.

[0154] In this embodiment, after the three-dimensional data of the part C is calculated in step SB9, the reference position calculation unit 61 calculates the position of the center of the part C in the XY plane. A plurality of protrusions P are provided on the underside of the body part B. The protrusions P are provided at different positions in the XY plane. Since the positions of the tips of the plurality of protrusions P in the XY plane are calculated, the reference position calculation unit 61 can calculate the position of the center of the part C in the XY plane based on the positions of the tips of the plurality of protrusions P.

[0155] After the position of the center of component C in the XY plane is calculated, control device 10 corrects the position of component C so that the center of the field of view of imaging device 40 in the XY plane coincides with the center of component C (step SB10). Control device 10 moves nozzle 4 holding component C so that the center of the field of view of imaging device 40 in the XY plane coincides with the center of component C. Control device 10 moves component C in the X-axis direction or Y-axis direction or rotates it in the θZ direction so that the center of the field of view of imaging device 40 in the XY plane coincides with the center of component C.

[0156] After the position of component C is corrected so that the center of the field of view of imaging device 40 in the XY plane coincides with the center of component C, pattern light is irradiated onto component C and image data of component C is acquired (step SB11). The process performed in step SB11 is the same as the process performed in step SB1. After the process of step SB11 is performed, the image data is binarized (step SB12). The process performed in step SB12 is the same as the process performed in step SB7. After the process of step SB12 is performed, three-dimensional data of component C is calculated (step SB13). The process performed in step SB13 is the same as the process performed in step SB9.

[0157] As a result of the above, the three-dimensional data of the part C whose position in the local coordinate system has been corrected is calculated. That is, the three-dimensional data of the part C is calculated in a state where the center of the field of view of the imaging device 40 in the XY plane coincides with the center of the part C.

[0158] The reference position calculation unit 61 generates a production program based on the three-dimensional data of the part C calculated in step SB13 (step SB14). The three-dimensional data of the part C includes the position of the tip of the protrusion P on the XY plane and the length of the protrusion P. The three-dimensional data of the part C may also include the overall length of the part C in the Z-axis direction.

[0159] As described above, according to the embodiment, after first gradation image data is generated from the image data of part C, the first gradation image data is converted into three-dimensional point cloud data. If three-dimensional point cloud data is generated directly from the image data of part C, the amount of data in the three-dimensional point cloud data may be large. After first gradation image data is generated from the image data of part C, the first gradation image data is converted into three-dimensional point cloud data, thereby reducing the amount of data in the three-dimensional point cloud data. Noise processing is performed on the three-dimensional point cloud data with a small amount of data. The three-dimensional point cloud data with a small amount of data after noise processing is converted into second gradation image data. A production program is generated based on the second gradation image data. This reduces the computational load on the processing device 50 that generates the production program. [Explanation of symbols]

[0160] 1...component mounting device, 2...component supply device, 3...substrate support device, 4...nozzle, 5...mounting head, 5S...shaft, 6...nozzle moving device, 7...head moving device, 8...3D measuring device, 9...input device, 10...control device, 11...base, 12...support, 13...X-axis moving device, 13A...guide member, 13B...actuator, 14...Y-axis moving device, 14A...guide member, 14B...actuator, 30...projection device, 31...light source, 32...light modulation element, 33...emission optical system, 33S...emission surface, 40...imaging device Imaging device, 41...imaging optical system, 41S...incident surface, 42...imaging element, 50...processing device, 50A...processor, 50B...main memory, 50C...storage, 50D...interface, 51...component data acquisition unit, 52...noise processing parameter determination unit, 53...imaging parameter determination unit, 54...pattern generation unit, 55...image data acquisition unit, 56...phase value calculation unit, 57...first gradation image data generation unit, 58...3D point cloud data generation unit, 59...noise processing unit, 60...second gradation image data generation unit, 61...reference position calculation unit, 62...storage unit, 81...reflective member, 82...housing, 331...first area, 332...second area, AP...supply position, AX...optical axis, B...body part, Ba...body part, Bb...body part, Bc...body part, BP...processing position, C...component, Ca...component, Cb...component, Cc...component, Cr...cluster, C11...terminal part, C12...fixed part, CP...measurement position, Da...boss part, Db...boss part, Ea...electrode part, Ear...electrode part, Eb...electrode part, Ec...electrode part, Ec1...first electrode part, Ec2...second electrode portion, Ec3...third electrode portion, Fa...screw hole, FG...specified range, Nz...noise, OX...reference position, P...protrusion, Pa...protrusion, Pb...protrusion, Pc...protrusion, PL...pattern light, PL1...first pattern light, PL2...second pattern light, R...radius, VD...divided area, VD1...first divided area, VD2...second divided area, VD3...third divided area, VD4...fourth divided area, W...substrate, Ze...height range, Ze1...height range, Ze2...height range, Ze3...height range, Zr...reference height.

Claims

1. a projection device that irradiates a component having a body portion and a plurality of electrode portions with patterned light; an imaging device that captures an image of the component irradiated with the pattern light; a processing device having a processor that processes image data of the component captured by the imaging device, The processing device includes: generating first gradation image data that indicates the shape of the component in shades of gray from the image data; converting the first gradation image data into three-dimensional point cloud data of the component; removing noise from the three-dimensional point cloud data to extract the electrode portion; converting the noise-removed three-dimensional point cloud data into second gradation image data; calculating a reference position of the component based on the coordinates of each of the plurality of electrode portions in the second gradation image data; 3D measuring device.

2. the imaging device images the component in a state where a focal point of an optical system of the imaging device is aligned with the electrode portion; the processing device extracts the electrode portion from the three-dimensional point cloud data based on the position of the focal point; The three-dimensional measurement device according to claim 1 .

3. the processing device removes the body part as the noise from the three-dimensional point cloud data. The three-dimensional measuring device according to claim 2 .

4. the imaging device images the component in a state where a focal point of an optical system of the imaging device is aligned with at least some of the electrode portions, the processing device calculates the tilt of the part based on three-dimensional point cloud data of the electrode portion present in a predetermined range around the focal point; extracting the electrode portion from the three-dimensional point cloud data while taking into consideration the inclination of the component; The three-dimensional measurement device according to claim 1 .

5. the processing device sets a plurality of divided regions in the three-dimensional point cloud data of the electrode portion based on the inclination of the component; a reference height of the electrode portion is set for each of the plurality of divided regions; extracting the electrode portion from the three-dimensional point cloud data of each of the plurality of divided regions based on the reference height; The three-dimensional measuring device according to claim 4.

6. the processing device removes the body part as the noise from the three-dimensional point cloud data. The three-dimensional measuring device according to claim 5 .

7. The three-dimensional measurement device according to claim 1 ; a mounting head having a nozzle for holding the component, the three-dimensional measuring device measures the part held by the nozzle; the mounting head mounts the component at a target position on a board based on the reference position of the component calculated by the three-dimensional measurement device. Component mounting equipment.

8. the processing device generates a production program used to control the mounting head based on the second gradation image data. The component mounting device according to claim 7 .

9. acquiring image data of a component having a body portion and a plurality of electrodes based on a phase shift method; generating first gradation image data that indicates the shape of the component in shades of gray from the image data; converting the first gradation image data into three-dimensional point cloud data of the component; removing noise from the three-dimensional point cloud data to extract the electrode portion; converting the noise-removed three-dimensional point cloud data into second gradation image data; calculating a reference position of the component based on the coordinates of each of the plurality of electrode portions in the second gradation image data; Three-dimensional measurement method.

Images