Crimping device

Abstract

To provide a crimping device capable of suppressing transfer of heat from a substrate to another mounting member when an electronic component such as an IC chip or the like is subjected to thermocompression crimping using an anisotropic conductive film (ACF).SOLUTION: A crimping device for thermocompression crimping an electronic component 2 to a substrate 1 having a high thermal conductivity includes: a crimping member 51 for thermocompression crimping the electronic component from one surface at a crimping portion of the substrate 1; a backup part 61 for thermocompression crimping the electronic component from the other surface; and a stage 71 having a mounting surface for supporting a part of the substrate 1 not including the crimping portion of the electronic component. The stage 71 includes: a facing surface 73b having a height different from that of the mounting surface and facing the substrate 1 mounted on the mounting surface without being in contact therewith; and a blowout hole 76a which is provided in the facing surface 73b and discharges gas to a portion of the substrate 1 mounted on the mounting surface facing the facing surface 73b.SELECTED DRAWING: Figure 8

Description

[Technical Field]

[0001] SUMMARY OF THE INVENTION An embodiment of the present invention relates to a crimping device. [Background technology]

[0002] One known method for bonding electronic components such as IC chips to a substrate is to use an anisotropic conductive film (hereinafter referred to as ACF). When bonding an IC chip to a substrate, the ACF is sandwiched between the substrate and the IC chip, and pressure and heat are applied to melt and harden the ACF to bond it.

[0003] The heat applied to the ACF from the bonding head is also transferred to the substrate. In addition to IC chips, other mounting components may be present on the substrate. These mounting components include functional components. Examples of functional components include functional films formed on the substrate as display components for display panels, and various components applied to the substrate. In such cases, depending on the thermal conductivity of the substrate, heat from the bonding head may be transferred to the functional components through the substrate. Depending on the functional components, the heat may cause deterioration or damage.

[0004] Therefore, when an IC chip is heat-pressed using an ACF, methods for suppressing the temperature rise of other mounting components include, for example, a method of removing heat from the functional component by contacting a heat transfer part cooled by a refrigerant, and a method of removing heat from the functional component by spraying a gas acting as a refrigerant onto the substrate (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2001-230577 Summary of the Invention [Problem to be solved by the invention]

[0006] However, in recent years, there has been a growing demand for higher bonding head temperatures to improve ACF bonding efficiency, as well as for the use of substrates with high thermal conductivity, such as silicon substrates, and substrates with heat-sensitive functional components, such as organic materials. Increasing the bonding head temperature increases the heat transferred to the substrate through the ACF, resulting in a relatively higher heat temperature transferred to the substrate. As a result, the substrate becomes hotter, and the heat transferred to the functional components on the substrate increases. On the other hand, when a substrate with high thermal conductivity is used, even if the bonding head temperature remains the same, the heat transferred to the substrate is more easily transferred, resulting in a greater impact on the functional components on the substrate. For example, if a heat-sensitive organic electroluminescent (EL) panel is mounted on a silicon substrate with high thermal conductivity, heating the ACF to a temperature that melts and hardens the IC chip bonding material will transfer heat from the bonding head to the silicon substrate, raising the temperature of the EL display film to a temperature that could damage the EL display film. To prevent heat-related deterioration and damage to the EL display film, it is necessary to keep the temperature below a temperature that will not damage the EL display film.

[0007] In a method of removing heat from a functional member by contacting a heat transfer removal part cooled by a refrigerant, the heat transfer part can remove heat from the contacting portion of the functional member, but the removed heat is heat that has already been transferred to the substrate, so it is quite possible that the functional member will be damaged. Furthermore, there is a high possibility that the contact will cause scratches, dust, etc. on the substrate surface. Therefore, it is not preferable to contact the heat transfer removal part, especially when the functional member is a display member. Furthermore, in a method of spraying a refrigerant onto the functional member, the refrigerant is sprayed onto the functional member, which is already at a high temperature due to the heat already transferred, just like the heat transfer removal part cooled by a refrigerant, so it is quite possible that the functional member will be damaged. Furthermore, since the refrigerant is sprayed onto the functional member, it is quite possible that the refrigerant will lower the temperature of the bonding head, which may cause the temperature of the bonding head to become unstable and result in unstable bonding.

[0008] The present invention has been proposed to solve the above-mentioned problems, and aims to provide a bonding device that suppresses the transfer of heat through a substrate to other mounting members (functional members) when electronic components such as IC chips are thermocompressed using an ACF. More specifically, the present invention aims to provide a bonding device that suppresses damage to functional members formed on a substrate due to the heat of thermocompression when electronic components such as IC chips are thermocompressed to a substrate. [Means for solving the problem]

[0009] A crimping device according to an embodiment of the present invention is a crimping device that heats and presses an electronic component onto a substrate, and is characterized by having: a crimping unit that heats and presses the electronic component from one side at a crimping location on the substrate; a backup unit that heats and presses the electronic component from the other side of the crimping location on the substrate; a stage having a mounting surface on which a portion of the substrate not including the crimping location is placed; an opposing surface on the stage that is different in height from the mounting surface and faces the substrate placed on the mounting surface without coming into contact with the substrate; and an outlet hole provided in the opposing surface that ejects gas toward a portion of the substrate placed on the mounting surface that faces the opposing surface. [Effects of the Invention]

[0010] According to an embodiment of the present invention, a pressure-bonding device can be provided that suppresses damage to functional components formed on a substrate due to heat from thermocompression bonding when thermocompression bonding an electronic component such as an IC chip to a substrate. [Brief explanation of the drawings]

[0011] [Figure 1] FIG. 2 is a perspective view showing a workpiece to be crimped in accordance with the embodiment. [Figure 2] FIG. 2 is a plan view showing the leads of a workpiece to be crimped in accordance with an embodiment. [Figure 3] 3 is a cross-sectional view showing a crimped portion of a workpiece and an ACF to be crimped in accordance with an embodiment. FIG. [Figure 4]1 is an overall configuration diagram showing the configuration of a crimping device according to an embodiment; [Figure 5] FIG. 3 is a schematic side view showing a thermocompression bonded portion in the embodiment. [Figure 6] 1A and 1B are a perspective view and a cross-sectional view showing a stage in an embodiment. [Figure 7] FIG. 2 is a plan view of a stage according to the embodiment. [Figure 8] FIG. 2 is a perspective view showing a stage, a backup unit, and a pressure bonding unit in the embodiment. [Figure 9] 10A and 10B are cross-sectional views showing the movement of a stage in a pressure bonding step in the embodiment. [Figure 10] 10A and 10B are a plan view and a side view of a stage in a modified embodiment. [Figure 11] 10A and 10B are a plan view and a side view of a stage in a modified embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0012] [1. First embodiment] [1-1.Configuration]

[0013] An embodiment of the present invention (hereinafter referred to as the present embodiment) will be specifically described with reference to the drawings. Note that the drawings are schematic diagrams, and the size, proportions, etc. of each part are exaggerated for ease of understanding.

[0014] (Crimping target) Referring to FIGS. 1 and 2 , a substrate 1, an electronic component 2, and an ACF 3 to be bonded in this embodiment will be described. The substrate 1 is a silicon substrate with high thermal conductivity. A substrate with high thermal conductivity is a substrate that easily transmits heat, and thermal conductivity is a physical property expressed in units of [W / (m·K)]. Silicon substrates are an example of substrates with high thermal conductivity, while glass substrates are an example of substrates with low thermal conductivity. Mounted on the surface of the substrate 1 are display panels with display areas, such as liquid crystal displays and organic electroluminescence (EL) displays, for which thermal degradation is particularly important. The mounting components include functional components. For example, the functional components include a functional film formed in the display area of ​​a liquid crystal display or organic electroluminescence (EL) display, and are configured to be protected by covering the functional film with a glass plate. The functional film is configured as a multilayer laminate structure, including, for example, an organic electroluminescence (EL) layer, a color filter layer, an electrode layer, and the like, and includes a layer that is particularly important for preventing thermal degradation and damage. Depending on the size of such a substrate 1, a single electronic component 2 may be pressure-bonded as shown in Fig. 1(A) or a plurality of electronic components 2 may be pressure-bonded as shown in Fig. 1(B). In this embodiment, an example in which a single electronic component 2 is pressure-bonded will be described.

[0015] 1(A), the electronic component 2 is a member that is bonded to a bonding portion A, which is an edge of the substrate 1, via an ACF 3, and is temporarily bonded to the substrate 1. In this embodiment, a COF (Chip On Film) is used as the electronic component 2. The COF is a member in which, for example, a driver IC is mounted on a flexible sheet made of a flexible resin and printed wiring is formed on the flexible sheet.

[0016] As shown in FIG. 2, one side of the electronic component 2 is provided with a conductive lead 21. The lead 21 is for electrically connecting to the lead 11 of the substrate 1. Each lead 21 is connected to a driver IC via a signal line. A plurality of leads 21 are arranged side by side at a predetermined interval. The leads 11 of the substrate 1 and the leads 21 of the electronic component 2 have a predetermined correspondence relationship for how they should be connected to each other, and they need to be crimped so that the corresponding leads 11 and 21 are aligned. For this reason, the spacing between the leads 11 and 21 also matches. This alignment need only ensure conductivity between the corresponding leads 11 and 21 and insulation between adjacent leads 11 and 21.

[0017] ACF3 is an anisotropic conductive member, and is a film formed by dispersing conductive particles 32 in a substrate 31 (see FIG. 3(A)). A thermosetting resin that hardens when heated is used as the substrate 31. ACF3 has adhesiveness on the film surface.

[0018] When the ACF 3 is sandwiched between the electronic component 2 and the substrate 1 and pressurized while being heated, the thermosetting resin of the substrate 31 melts and softens, and conductive particles 32 located between the leads 21 and 11 on the opposing electronic component 2 and substrate 1 are crushed by being sandwiched between the leads 11, 21, thereby realizing electrical conductivity in the thickness direction of each of the leads 21 and 11 and insulation between adjacent leads 21 and 11 (see FIG. 3(B)). Further heating hardens the thermosetting resin of the substrate 31, bonding the electronic component 2 and substrate 1 together. In other words, thermocompression bonding establishes an electrical connection between the leads 11 and 21 and a mechanical connection between the substrate 1 and the electronic component 2. Completing the electrical and mechanical connection between the electronic component 2 and substrate 1 in this manner is called final compression bonding.

[0019] [1-2. Overall configuration of the device] The configuration of the crimping device 40 of this embodiment will be described with reference to FIG. 4. A pre-bonding process is performed as a pre-process prior to the crimping process performed by the crimping device 40. In the pre-bonding process, a pre-bonding device (not shown) pre-bonds the electronic component 2 to the crimping point A of the substrate 1 via the ACF 3. During this pre-bonding, the electronic component 2 is attached to the substrate 1 due to the adhesiveness of the ACF 3, and the necessary electrical connection and adhesion are not achieved. The crimping device 40 then performs final crimping, electrically connecting and adhering the electronic component 2 to the substrate 1 that has undergone the pre-bonding process, as described above. In FIG. 4, the crimping direction by the crimping device 40 is the Z direction, and the directions perpendicular to each other in a plane perpendicular to the Z direction are the X direction and the Y direction. The Y direction is the left-right direction in the figure. When the crimping device 40 is installed so that the Z direction is vertical, the XY plane is horizontal. In this case, the Z direction is the height direction, and the installation surface side is called the bottom and the opposite side is called the top. The rotation direction parallel to the XY plane is defined as the θ direction.

[0020] The crimping device 40 has a crimping unit 50, a pressure receiving unit 60, and a support unit 70. The crimping unit 50 corresponds to a crimping head. The crimping unit 50 is a component that heats and crimps the leads 11 of the substrate 1 and the leads 21 of the electronic component 2 via the ACF 3. The crimping unit 50 has a pressure member 51, a heating unit 52, a pressure source 53, and a drive mechanism 54. Note that in the following description, the electronic component 2 is assumed to be supplied to the crimping device 40 in a state where it has been temporarily pressure-bonded to the substrate 1 via the ACF 3 by a temporary pressure-bonding device arranged in a process preceding the crimping device 40.

[0021] The pressure member 51 is a member that applies pressure to the electronic component 2. The pressure member 51 has a generally rectangular parallelepiped shape that is elongated in the Y direction, and has a pressure surface whose length corresponds to the electronic component 2. The surface of the pressure member 51 that faces the electronic component 2 has a pressure portion 51a that protrudes in a strip shape. This pressure portion 51a has a flat pressure surface that faces the electronic component 2 in parallel. Note that the pressure portion 51a may have a pressure surface whose length corresponds to a conventional wide COF.

[0022] The heating unit 52 is a member that heats the pressure member 51. The heating unit 52 is built into the pressure member 51. The heating unit 52 is, for example, a heater that generates heat when a voltage is applied, and heats the ACF 3 through the temporarily pressure-bonded electronic components 2.

[0023] The pressure source 53 is a device that applies pressure to the pressure member 51. The pressure set in the pressure source 53 causes the pressure member 51 to pressurize the electronic component 2. The pressure source 53 is a fluid pressure cylinder that applies pressure to the pressure member 51 by applying fluid pressure to a piston that is slidably provided within the cylinder. For example, an air cylinder is used in which the piston slides inside due to the pressure of compressed air. The pressure source 53 has an actuating rod connected to the piston. The actuating rod is urged downward in the Z direction by the pressure source 53, and applies pressure to the pressure member 51. The pressure source 53 is also provided with a load sensor such as a load cell that detects the load applied to the electronic component 2. The pressure source 53 may be configured as a linear motion mechanism using a servo motor.

[0024] The driving mechanism 54 is a mechanism that drives the pressure member 51 in a direction to move toward or away from the electronic component 2, together with the pressure source 53. In FIG.

[0025] As shown in FIGS. 4, 5A, and 5B, the pressure receiving portion 60 is a member that sandwiches the electronic component 2 and the substrate 1 between itself and the pressure applying portion 51a of the pressure applying member 51. The pressure receiving portion 60 is a substantially rectangular parallelepiped member that can be raised and lowered by a lifting mechanism (not shown), and has the same length as the pressure applying member 51. The pressure receiving portion 60 has a backup portion 61 and a heating portion 62. The backup portion 61 is provided on the surface facing the pressure applying portion 51a, and extends in the Y direction, protruding in a strip shape. In this way, the backup portion 61 is a member that is elongated in the Y direction.

[0026] The backup unit 61 is made of a heat insulating material such as quartz. The backup unit 61 has a flat support surface that faces the pressure applying surface of the pressure applying unit 51a. The support surface of the backup unit 61 is long in the Y direction. Furthermore, the support surface of the backup unit 61 is set so that, when the pressure receiving unit 60 is raised, it becomes flush with the lower surface of the substrate 1 supported by a stage 71, which will be described later. Note that the pressure receiving unit 60 may be provided immovably, so that the support surface of the backup unit 61 becomes flush with the lower surface of the substrate 1.

[0027] The heating section 62 is a member built into the pressure receiving section 60 and heats the backup section 61. The heating section 62 is, for example, a heater that generates heat when a voltage is applied, and heats the ACF 3 through the substrate 1.

[0028] Although not shown in Fig. 4, as shown in Figs. 5(A) and 5(B), a protective sheet C is interposed between the support surface of pressure member 51a and electronic component 2. Protective sheet C is made of a heat-resistant, durable, hard material such as polyimide or glass cloth, and prevents ACF 3 from adhering to the pressure member 51a's pressure member surface. When thermocompression bonding substrate 1 and electronic component 2 together, protective sheet C is supplied by protective sheet supply unit 35 (not shown) between pressure member 51 and electronic component 2 temporarily bonded to substrate 1.

[0029] The support unit 70 is a device that supports the substrate 1 during pressure bonding. The support unit 70 has a stage 71 and a moving device 72. The stage 71 is a flat, roughly rectangular parallelepiped member that supports the substrate 1 in the horizontal direction. The stage 71 has suction holes 73c (described later) that are connected to a vacuum source. This allows the stage 71 to suction-hold the substrate 1. The moving device 72 is a device that supports the stage 71, which suction-holds the substrate 1, so that it can move freely in the X, Y, Z, and θ directions.

[0030] The support unit 70 receives the substrate 1 to which the electronic components 2 have been temporarily pressure-bonded via the ACF 3 from a previous process such as a temporary pressure-bonding device, and moves the substrate 1 to a pressure-bonding position where the electronic components 2 are pressure-bonded to the substrate 1 by the pressure unit 51a. The support unit 70 also delivers the substrate 1, for which the pressure-bonding operation has been completed, to a subsequent process such as a substrate storage device.

[0031] The control device 80 is a device that controls the crimping device 40. The control device 80 is configured, for example, by a dedicated electronic circuit or a computer that operates according to a predetermined program. In other words, the control device 80 controls the operation of the crimping device 40 by operating the heating unit 52 of the crimping unit 50, the driving mechanism 54, the heating unit 62 of the pressure-receiving unit 60, the moving device 72 of the support unit 70, etc.

[0032] The control device 80 stores programs and data that control the heating temperatures of the heating units 52 and 62, the timing of pressurization by the pressure source 53, the operation of the moving device 72, etc. The control device 80 controls each unit by reading and executing the programs and data using a processing device such as a PLC or CPU. By changing the programs and data, it is possible to accommodate a wide variety of specifications for the substrate 1, electronic component 2, and ACF 3 to be bonded.

[0033] Furthermore, an input device 91 and an output device 92 are connected to the control device 80. The input device 91 is an input means such as a switch, a touch panel, a keyboard, or a mouse that allows an operator to operate the crimping device 40 via the control device 80. The operator can input various types of information using the input device 91.

[0034] The output device 92 is an output means such as a display, lamp, meter, etc. that makes information for checking the status of the device visible to the operator. For example, the output device 92 can display an input screen for information from the input device 91.

[0035] [1-3. Stage Configuration] The configuration of the stage 71 of this embodiment will be described in detail below. FIG.

[0036] Stage 71 is a metal plate-like member, and as will be described later, one side is provided with mounting surfaces 74a, 73a on which substrate 1 (shown by dotted lines in FIG. 6) is placed. When pressure bonding is performed on substrate 1 using ACF 3, substrate 1 is placed on mounting surfaces 74a, 73a with bonding portion A of electronic component 2 on substrate 1 protruding from stage 71. In other words, a portion of substrate 1 not including bonding portion A is placed on stage 71. As a result, in substrate 1 placed on mounting surfaces 74a, 73a, bonding portion A of electronic component 2 is not directly supported by stage 71, and space is secured above and below bonding portion A for bonding section 50 and backup section 61.

[0037] The stage 71 is composed of a base portion 74 and a tip portion 73. As shown in FIG. 6(A), the shape of the base portion 74 is a substantially rectangular parallelepiped with the long side in the X direction, the short side in the Y direction, and the height in the Z direction. As shown in FIG. 6(B), a negative pressure pipe 75b and a cooling gas pipe 76b are arranged inside the base portion 74. The upper surface of the base portion 74 is the aforementioned mounting surface 74a.

[0038] The tip portion 73 is a member having a convex YZ cross section. The tip portion 73 extends in the XY directions and has two flat surfaces, a mounting surface 73a and an opposing surface 73b, which are located at different heights. The mounting surface 73a is the highest surface of the tip portion 73 and is at the same height as the mounting surface 74a of the base portion 74. As described above, the mounting surface 73a of the tip portion 73 and the mounting surface 74a of the base portion 74 form a mounting surface on which the substrate 1 is placed. A suction hole 73c is provided in the mounting surface 73a, and a hole 75a is provided in the bottom surface of the suction hole 73c. ​​The hole 75a passes through a negative pressure pipe 75b inside the stage 71 and is connected to a negative pressure generating pump (not shown). When the substrate 1 is placed on the stage 71, the substrate 1 placed on the placement surface 73a is positioned so as to block the suction holes 73c, and is adsorbed and held to the placement surface 73a without shifting due to the negative pressure inside the suction holes 73c.

[0039] The facing surface 73b is a plane extending in the XY direction at a different height from the placement surface 73a. Because the facing surface 73b is located lower than the placement surface 73a, it does not come into contact with the substrate 1 placed on the placement surface 73a. In the XY plane when the tip 73 is viewed from the placement surface 73a side, the facing surfaces 73b are arranged at two locations on either side of the placement surface 73a. A plurality of blow-out holes 76a with circular cross sections are provided on the facing surface 73b. Furthermore, the space formed by the substrate 1 placed on the placement surface 73a and the facing surface 73b is used as a space for gripping the substrate 1 without coming into contact with the surface (display surface) of the substrate 1 when the substrate 1 is being transported.

[0040] As shown in FIG. 7 , each opposing surface 73b is provided with a plurality of blowout holes 76a. The blowout holes 76a are openings that blow out cooling air toward the substrate 1 placed on the mounting surface. The cooling gas blown out from the blowout holes 76a cools the portion of the substrate 1 facing the blowout holes 76a. The cooling gas blown out from the blowout holes 76a also cools the stage 71. Each blowout hole 76a is connected to a cooling gas pipe 76b. The blowout holes 76a pass through the cooling gas pipe 76b inside the stage 71 and are connected to a cooling gas supply device (not shown). In each opposing surface 73b, the blowout holes 76a are arranged in a position that contacts a sidewall 77a between the mounting surface 73a and the opposing surface 73b. The plurality of blowout holes 76a are arranged at equal intervals along the sidewall 77a between the mounting surface 73a and the opposing surface 73b. As a result, in the XY plane when the tip portion 73 is viewed from the mounting surface 73a side, the plurality of blowing holes 76a are aligned at equal intervals on the boundary between the mounting surface 73a and the opposing surface 73b. The substrate 1 placed on the mounting surface 73a is located on the axis of each blowing hole 76a.

[0041] The sidewall 77a is provided with grooves 77b extending parallel to the axis of each blowout hole 76a. The sidewall 77a and grooves 77b function as heat dissipation fins 77 for the stage 71. In other words, the cooling gas flows along the sidewall 77a and grooves 77b and collides with the substrate 1 without a decrease in flow rate. The multiple grooves 77b provided in the sidewall 77a and the protrusions between them increase the area over which the cooling gas discharged from the blowout holes 76a comes into contact with the stage 71, thereby improving heat dissipation from the stage 71.

[0042] 8 is a perspective view showing the substrate 1 transported by the stage 71. A pressure member 51 is placed above the substrate 1 that has been moved to the bonding position, and a backup unit 61 is positioned below the substrate 1. The distance d between the stage 71 positioned at the bonding position and the backup unit 61 is set to be equal to or greater than the thickness of the electronic component 2 to be thermocompression bonded. In the figure, reference numeral 4 denotes a mounting member mounted on the surface of the substrate 1.

[0043] [1-4. Effect] Next, a method for removing heat transmitted through the substrate 1 in the pressure bonding device 40 of this embodiment having the above-described configuration will be described.

[0044] First, the electronic component 2 is pre-press-bonded to the compression bonding location A of the substrate 1 via the ACF 3 by a pre-press-bonding device arranged in a process preceding the pressure bonding device 40 .

[0045] After the temporary bonding step, the substrate 1 is moved to the bonding device 40 by a transport device (not shown). The substrate 1, to which the electronic component 2 is temporarily bonded via the ACF 3, is held by suction on the stage 71 of the support unit 70 (FIG. 9(a)), and the substrate 1 is moved by a moving device 72 so that the bonding point A, where the substrate 1 and the electronic component 2 are temporarily bonded via the ACF 3, is positioned opposite the pressure unit 51a. After the substrate 1 is moved to the bonding device 40, cooling gas begins to be discharged from the blowing holes 76a onto the substrate 1 (FIG. 9(b)).

[0046] Then, the bottom surface of the bonding point A of the substrate 1, which is held by suction on the stage 71, is placed on the support surface of the backup unit 61 by the moving device 72. In this state, the driving mechanism 54 starts to move the pressure member 51 downward toward the electronic component 2. In the bonding process, the pressure member 51 is heated to 200°C. As the pressure member 51 continues to move and the pressure surface of the pressure unit 51a reaches the pressure start position, the driving mechanism 54 moves the pressure member 51 down by a predetermined pushing amount until it reaches the pushing position, at which point the pressure member 51 stops (FIG. 9(c)).

[0047] Meanwhile, heat from the pressure member 51 and the backup part 61 melts and hardens the ACF 3. At the same time, the heat is transmitted to the substrate 1, but is absorbed by the stage 71 in contact with the substrate 1, and the substrate 1 is cooled by the cooling gas blown onto the substrate 1 from the blowing holes 76a.

[0048] When a predetermined bonding time has elapsed since the start of pressurization, drive mechanism 54 raises pressure member 51, thereby releasing electronic component 2 from pressure, and then substrate 1, which is held by suction on stage 71, is raised by moving device 72. The bonding time is, for example, 5 seconds from the start of pressurization. The discharge of cooling gas from blowing holes 76a, which has continued since substrate 1 was moved from the pressure bonding device, continues until the completion of the bonding operation (FIG. 9(d)).

[0049] Thereafter, the support section 70 transfers the substrate 1, for which the pressure bonding operation has been completed, to a subsequent process such as a substrate storage device (FIG. 9(e)).

[0050] [1-5.Effects] (1) The crimping device 40 of the present embodiment as described above includes a crimping unit 50 that, when heat-pressing an electronic component 2 to a substrate 1, heats and presses the electronic component 2 from one side at a bonding point A of the substrate 1, a backup unit 61 that heats and presses the electronic component 2 from the other side, a stage 71 having a mounting surface 73a that supports a portion of the substrate 1 that does not include the bonding point A of the electronic component 2, an opposing surface 73b that is at a different height from the mounting surface 73a of the stage 71 and faces the substrate 1 placed on the mounting surface without making contact with it, and an outlet 76a provided in the opposing surface 73b that ejects gas toward the portion of the substrate 1 placed on the mounting surface that faces the opposing surface 73b.

[0051] In the compression bonding device 40 of this embodiment, when the electronic component 2 is thermally and pressure-bonded to the substrate 1, the heat transferred from the compression bonding unit 50 to the substrate 1 is released toward the stage 71, thereby removing the heat from the substrate 1. The heat transferred to the substrate 1 is also removed by gas discharged from the blowing holes 76a. In this way, the heat transferred from the compression bonding unit 50 to the substrate 1 is first absorbed by the stage 71, and any heat that is not absorbed is cooled by the cooling gas. This makes it possible to suppress temperature increases in the electronic component 2 and other components on the substrate 1 that are not targets for thermal compression bonding, due to the heat from the compression bonding unit 50. In particular, it is possible to suppress damage caused by heat to functional members formed on the substrate 1.

[0052] (2) In the pressure bonding device 40 of this embodiment, the stage 71 is provided with the heat dissipation fins 77, which are located in the flow path of the gas discharged from the blowout holes 76a.

[0053] In the compression bonding device 40 of this embodiment, heat dissipation fins 77 are provided in the discharge direction of the cooling gas discharged from the blowout holes 76a. This allows the discharged cooling gas to not only directly remove heat from the substrate 1, but also remove heat from the substrate 1 that has been transferred to the stage 71. Not only is the heat from the substrate 1 removed by the cooling gas, but the heat transferred from the substrate 1 to the stage 71 can also be removed by the cooling gas, so the amount of heat removed from the substrate 1 can be increased.

[0054] In this embodiment, the sidewall 77a, which is a part of the heat dissipation fin 77, is not positioned on the axis of the opening of the outlet hole 76a. However, this is not limited to this. That is, the heat dissipation fin 77 may be positioned on the axis of the opening of the outlet hole 76a so that the discharged cooling gas can sufficiently remove heat from the substrate 1. Positioning the heat dissipation fin 77 on the axis of the opening of the outlet hole 76a may reduce the flow rate of the cooling gas flowing to the substrate 1, but the cooling efficiency of the stage 71 by the heat dissipation fin 77 is improved. In other words, if the amount of heat removed by the substrate 1 and the cooling efficiency of the stage 71 by the heat dissipation fin 77 can be balanced, the amount of heat removed from the substrate 1 can be increased. By adopting such an arrangement of the heat dissipation fin 77 that improves cooling efficiency, it is possible to suppress temperature increases in functional components, such as the electronic components 2, on the substrate 1 that are not targets for thermocompression bonding.

[0055] (3) In the pressure bonding device 40 of this embodiment, a flow path through which a cooling gas flows is formed inside the stage 71. The cooling gas flows inside the stage 71, thereby lowering the temperature of the stage 71. This allows the heat transferred from the substrate 1 to the stage 71 to be efficiently removed, and the amount of heat from the substrate 1 removed by the stage 71 can be increased.

[0056] (4) In the pressure bonding device 40 of this embodiment, the substrate 1 placed on the stage 71 is used as a reference, and the stage 71 is installed on the opposite side from the pressurizing member 51. The stage 71 is provided with cooling gas outlet holes 76a, so the discharged cooling gas diffuses around the stage 71. If the pressurizing member 51 and the stage 71 were located on the same side of the substrate 1 placed on the stage 71, the discharged cooling gas would lower the temperature of the pressurizing member 51, reducing the heating efficiency of the pressurizing member 51. Furthermore, the temperature of the pressurizing member 51 would become unstable, resulting in unstable pressure bonding. To achieve efficient and stable thermocompression bonding, the stage 71 is installed on the opposite side from the pressurizing member 51, using the substrate 1 placed on the stage 71 as a reference. This pressure bonding device 40 not only suppresses temperature increases in functional components, such as the electronic components 2, that are not the target of thermocompression bonding on the substrate 1, but also enables efficient and stable thermocompression bonding.

[0057] (5) In the pressure bonding device 40 of this embodiment, the mounting surface 73a is provided with suction holes 73c for suctioning the substrate 1. In this embodiment, cooling gas is discharged onto the substrate 1 to remove heat from the substrate 1. In order to efficiently remove heat from the substrate 1, it is conceivable to increase the flow rate of the discharged cooling gas, but depending on the flow rate, it is conceivable that the substrate 1 may shift from its mounting position. However, in the pressure bonding device 40, the substrate 1 is held by suction to the stage 71, and therefore the substrate 1 is prevented from shifting from its mounting position due to the influence of the discharged cooling gas. [2. Modifications]

[0058] (1) In the above embodiment, the tip portion 73 is a member having a convex YZ cross section as shown in FIG. 7 , but the shape of the tip portion 73 is not limited to this. For example, as shown in FIG. 10 , a plate-like member 78 having a width equal to the height of the convex portion may be provided at the end of the tip portion 73. In this case, the mounting surface 78a of the plate-like member 78 is at the same height as the mounting surface 74a of the base portion 74 and the tip portion 73. In this modification, the plate-like member 78 serves as a rectifying plate for the cooling gas discharged from the blowout holes 76a, thereby suppressing the diffusion of the gas discharged from the blowout holes 76a and improving the cooling efficiency of the substrate 1. Furthermore, the plate-like member 78 makes it difficult for the gas discharged from the blowout holes 76a to flow toward the backup unit 61, thereby suppressing a decrease in the temperature of the backup unit 61.

[0059] (2) In the above embodiment, the heat dissipation fins 77 are formed by the side walls 77a and the grooves 77b, but the shape of the heat dissipation fins 77 is not limited to this. In this modification, as shown in FIG. 11 , the heat dissipation fins 77 may be formed by extending the flat portions of the side walls 77a in the above embodiment onto the opposing surface 73b. In this case, the heat dissipation fins 77 are arranged to sandwich the blowing holes 76a in the XY plane. According to this modification, the heat dissipation fins 77 extending onto the opposing surface 73b significantly increase the contact area between the cooling gas and the stage 71. This allows for efficient removal of heat from the substrate 1, the heat dissipation fins 77, and the stage 71, thereby improving the cooling efficiency of the substrate 1.

[0060] [Other embodiments] Although the embodiments and modifications of each part of the present invention have been described above, these embodiments and modifications are presented as examples and are not intended to limit the scope of the invention. These novel aspects described above can be embodied in various other forms, and various omissions, substitutions, modifications, and combinations can be made without departing from the spirit of the invention. These embodiments and modifications thereof are included within the scope and spirit of the invention, and are also included in the invention described in the claims. [Explanation of symbols]

[0061] 1 board 2. Electronic Components 3 ACF 4 Mounting materials 11 Lead 21 Lead 31 Base material 32 Conductive particles 40 Crimping device 50 Crimping section 51 Pressure member 51a Pressurizing section 52 Heating section 53 Pressure source 54 Drive mechanism 60 Pressure receiving part 61 Backup Department 62 Heating section 70 Support part 71 Stages 72 Mobile Devices 73 Tip 73a Placement surface 73b Opposite side 73c Adsorption hole 74 Base 74a Placement surface 75a hole 75b Negative pressure piping 76a Air outlet 76b Cooling gas piping 77 Heat dissipation fin 77a side wall 77b Groove 78 Plate-shaped members 78a Placement surface 80 Control device 91 Input Device 92 Output Devices A Crimping point C. Protective sheet d distance

Claims

1. In a pressure bonding device that heats and presses electronic components onto a substrate, a pressure-bonding unit that heats and presses the electronic component from one side at a pressure-bonding location of the substrate; a backup unit that heats and presses the electronic component from the other side of the pressure-bonding portion of the substrate; a stage having a mounting surface on which a portion of the substrate not including the pressure-bonded portion is mounted; the stage has an opposing surface that is at a different height from the mounting surface and faces the substrate placed on the mounting surface without coming into contact with the substrate; a blowout hole provided on the facing surface and configured to blow out gas toward a portion of the substrate placed on the placement surface facing the facing surface; A crimping device comprising:

2. The stage is provided with heat dissipation fins, 2. The crimping device according to claim 1, wherein the heat dissipation fins are located in a flow path of the gas discharged from the blowout holes.

3. 3. The crimping device according to claim 2, wherein the heat dissipation fins are provided on the stage between the mounting surface and the opposing surface.

4. The pressure bonding device according to claim 1 , wherein the mounting surface is provided with suction holes for suctioning the substrate.

5. 2. The crimping device according to claim 1, wherein the substrate is a silicon substrate.

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