Processing device for workpiece

Abstract

To facilitate settings of processing conditions when forming a protective member in a workpiece.SOLUTION: A processing device (10) comprises: a first holding section (20) which holds a first face (51) of a workpiece (50); a second holding section (11) which is disposed while being opposed with the first holding section; a supply section (13) which supplies a liquid-state protective member (55) to at least any one of a second face (52) of the workpiece and the side of the second holding section; a movement mechanism (22) which covers the second face of the workpiece with the protective member by making the first holding section and the second holding section relatively close to each other; a curing section (18) which cures the protective member; and a control section (40). The control section includes a storage section (41) which stores a table in which a moving speed of the movement mechanism corresponding to a desired thickness of the protective member is recorded and a setting section (42) which sets the moving speed on the basis of the table when the desired thickness of the protective member is inputted, and controls the movement mechanism in accordance with the setting of the setting section.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a processing apparatus for forming a protective member on a workpiece. [Background technology]

[0002] When producing wafers of a desired thickness by grinding both surfaces of sliced ​​wafers cut from an ingot, there is a process in which a protective member is formed on one surface of the wafer, the wafer is held by placing the protective member side on a chuck table of a grinding machine, and the other surface of the wafer is ground using a grinding wheel.

[0003] As disclosed in Patent Document 1, a processing apparatus for forming a protective member on one side of a workpiece such as a wafer applies a liquid resin to one side of the workpiece and hardens the liquid resin to form the protective member. One example of a method for applying the liquid resin to one side of the workpiece is to supply the liquid resin to a sheet placed on a holding table, bring the workpiece close to the holding table, and spread the liquid resin on the sheet with the workpiece. The liquid resin is then hardened. In this way, the protective member is formed by the hardened resin and the sheet. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2009-148866 Summary of the Invention [Problem to be solved by the invention]

[0005] In a processing device that forms a protective member on one side of a workpiece, it is necessary to set various processing conditions depending on the desired thickness of the protective member. For example, when the workpiece is brought close to a liquid resin on a sheet and spread, the operator of the processing device must input an appropriate movement speed for the workpiece according to the thickness of the protective member, which is time-consuming to set.

[0006] An object of the present invention is to provide a processing apparatus that makes it easy to set processing conditions when forming a protective member on a workpiece. [Means for solving the problem]

[0007] One aspect of the present invention is a processing device for a workpiece, comprising: a first holding unit having a first holding surface that holds a first surface of the workpiece; a second holding unit having a second holding surface facing the first holding unit; a supply unit that supplies liquid protective material to at least one of the second surface of the workpiece held by the first holding unit or the second holding surface; a moving mechanism that brings the first holding unit and the second holding unit relatively close to each other to cover the second surface of the workpiece with the protective material; a hardening unit that hardens the protective material; and a control unit, wherein the control unit has a memory unit that stores a table recording the moving speed of the moving mechanism corresponding to a desired thickness of the protective material; and a setting unit that sets the moving speed based on the table when the desired thickness of the protective material is input, and controls the moving mechanism according to the setting of the setting unit. [Effects of the Invention]

[0008] According to the present invention, it is possible to obtain a processing apparatus for a workpiece that allows easy setting of processing conditions when forming a protective member on the workpiece. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 10 is a diagram showing a process of supplying a liquid resin in a processing device. [Figure 2] 10 is a diagram showing a process of covering the second surface of the workpiece with resin in the processing device. FIG. [Figure 3] FIG. 2 is a block diagram showing the configuration of a control system of the processing apparatus. [Figure 4] FIG. 10 is a diagram showing how to set processing conditions in a processing apparatus. [Figure 5] FIG. 10 is a diagram showing a table of the relationship between the thickness of the protection member and the moving speed. [Figure 6]FIG. 10 is a diagram showing a table of the relationship between the thickness of the protection member and the pressing load. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, a processing apparatus according to the present embodiment will be described with reference to the drawings. Processing apparatus 10 shown in Figures 1 and 2 is an apparatus for forming a protective member 53 (see Figure 2) that covers one surface of a workpiece 50.

[0011] Of the workpiece 50, the surface facing upward during processing in the processing device 10 is referred to as a first surface 51, and the surface facing downward is referred to as a second surface 52. After processing in the processing device 10, the second surface 52 is covered with a protective member 53. The workpiece 50 is, for example, a disk-shaped sliced ​​wafer cut from a cylindrical ingot of silicon or the like. Note that the workpiece 50 is not limited to a sliced ​​wafer before devices are formed, and may also be a device wafer after devices are formed, etc.

[0012] After the protective member 53 has been formed by the processing device 10, the workpiece 50 (workpiece unit) is transported to a grinding device (not shown), where the protective member 53 side is placed and held on the holding surface of a chuck table provided in the grinding device, and the first surface 51 of the workpiece 50 on which the protective member 53 has not been formed is ground using a grinding wheel.

[0013] The protective member 53 is made up of a hardened resin 55 and a sheet 54. The protective member may be made up of only hardened resin without including the sheet.

[0014] The sheet 54 is made of a light-transmitting material. For example, a sheet made of polyethylene terephthalate or the like can be used as the sheet 54. Note that the sheet 54 made of a material other than this may also be used.

[0015] Resin 55 is supplied in a liquid state and has the property of being hardened by a predetermined external stimulus. Resin 55 used in processing apparatus 10 of this embodiment is an ultraviolet-curable resin, and is hardened by irradiating ultraviolet light onto resin 55 (see FIG. 2) that has been pressed and spread to cover second surface 52 of workpiece 50. Note that the external stimulus applied to harden the liquid resin is not limited to irradiation with ultraviolet light, and may be a temperature change such as heating or cooling, or irradiation of light of a wavelength other than ultraviolet light.

[0016] The processing device 10 includes a holding table 11. The holding table 11 is made of a light-transmitting material such as quartz glass, and has a flat holding surface 12 facing upward. A sheet 54 is supplied onto the holding surface 12 of the holding table 11 by a sheet supply mechanism (not shown).

[0017] Resin 55 is supplied by a resin supply mechanism 13 onto a sheet 54 held on a holding surface 12 of a holding table 11. The resin supply mechanism 13 includes a tank 14 that stores liquid resin 55 and a resin supply nozzle 15 connected to the tank 14, and a dispenser 16 adjusts the amount of resin 55 supplied from the tank 14 to the resin supply nozzle 15. The resin supply nozzle 15 is provided at the tip of a support arm 17 that can rotate about an axis facing in the vertical direction, and dispenses the resin 55 downward.

[0018] An ultraviolet irradiator 18 is provided below the holding table 11. The ultraviolet irradiator 18 is a light source that irradiates ultraviolet light upward where the holding table 11 is disposed, and irradiates the ultraviolet light through the light-transmitting holding table 11 and sheet 54 onto the resin 55 on the sheet 54 to harden it. No ultraviolet light is irradiated in the steps shown in FIGS. 1 and 2, but ultraviolet light is irradiated after the step shown in FIG. 2 to harden the resin 55.

[0019] A workpiece holding unit 20 is disposed above the holding table 11. The workpiece holding unit 20 is supported so as to be movable in the vertical direction via a moving mechanism 22 provided on a column 21. The moving mechanism 22 supports a lifting table 24 so as to be movable along a guide rail 23 extending in the vertical direction, and moves the lifting table 24 in the vertical direction by rotating a ball screw 25 extending in the vertical direction with the driving force of a motor 26. The lifting table 24 has a guided portion 27 movably supported by the guide rail 23, and a screw portion 28 that screws onto the ball screw 25.

[0020] A support member 29 is fixed to the lift table 24, and the workpiece holder 20 is supported at the lower end of the support member 29. When the lift table 24 moves up and down, the support member 29 and the workpiece holder 20 move up and down together with the lift table 24. An encoder 30 is provided to detect the drive amount of the motor 26, and feedback control is performed to adjust the movement amount and movement speed of the workpiece holder 20 by referring to the information detected by the encoder 30.

[0021] The underside of the workpiece holder 20 is a holding surface 31 that can hold a first surface 51 of a workpiece 50 by suction. The holding surface 31 is connected to a suction source 32. By operating the suction source 32 to apply negative pressure, the first surface 51 of the workpiece 50 can be held by suction on the holding surface 31.

[0022] A load sensor 33 is provided between the workpiece holder 20 and the support member 29 to detect the vertical load acting on the workpiece holder 20. When the workpiece holder 20 descends and the workpiece 50 comes into contact with and spreads the resin 55, the value of the load detected by the load sensor 33 increases.

[0023] In the processing device 10, the workpiece holding unit 20 constitutes a first holding unit, and the holding surface 31 of the workpiece holding unit 20 constitutes a first holding surface that holds the first surface 51 of the workpiece 50. The holding table 11 constitutes a second holding unit, and the holding surface 12 of the holding table 11 constitutes a second holding surface that faces the workpiece holding unit 20 (first holding unit). The resin supply mechanism 13 constitutes a supply unit that supplies liquid resin 55 (liquid protective material) to at least one of the second surface 52 of the workpiece 50 held by the workpiece holding unit 20 (first holding unit) and the holding surface 12 (second holding surface). The moving mechanism 22 constitutes a moving mechanism that brings the workpiece holding unit 20 (first holding unit) and the holding table 11 (second holding unit) relatively close to each other to cover the second surface 52 of the workpiece 50 with the resin 55 (protective material). The ultraviolet light irradiation unit 18 constitutes a curing unit that hardens the resin 55.

[0024] The processing device 10 is comprehensively controlled by a control unit 40 shown in Fig. 3. The hardware constituting the control unit 40 includes a processor that executes various processes, a memory that stores various parameters and programs, and an interface that transmits and receives signals to and from each device shown in Fig. 3. The control unit 40 includes a storage unit 41 and a setting unit 42 as functional blocks. The storage unit 41 stores a program that controls the operation of the processing device 10, and also includes a setting program that causes the setting unit 42 to set processing conditions, which will be described later. The storage unit 41 also stores data (tables) of processing conditions, which will be described later.

[0025] An operator operating the processing device 10 inputs various details relating to the settings and operation of the processing device 10 via an input unit 43 (see FIG. 3). The input unit 43 may be a touch panel display device provided in the processing device 10, or an external terminal (more specifically, a keyboard, mouse, touch panel, etc. of the external terminal) connected to the processing device 10 so as to be able to send and receive signals thereto. In other words, the input unit 43 may be provided in the processing device 10, or may be located at a location remote from the processing device 10.

[0026] The formation of the protective member 53 on the workpiece 50 using the processing apparatus 10 configured as described above will be described. First, as shown in FIG. 1 , a step of supplying liquid resin 55, which is the source of the protective member 53, is performed. A sheet 54 is held by the holding surface 12 of the holding table 11, and a resin supply nozzle 15 is positioned above the holding table 11. Liquid resin 55 delivered from a tank 14 is dispensed from the resin supply nozzle 15 and dripped onto the sheet 54 held on the holding surface 12 of the holding table 11. The amount of resin 55 to be supplied is set based on the area of ​​the second surface 52 of the workpiece 50 and the final thickness of the protective member 53. The control unit 40 controls the dispenser 16 to adjust the amount of resin 55 supplied. After the predetermined amount of resin 55 has been supplied, the support arm 17 is rotated, and the resin supply nozzle 15 is retracted from its position above the holding table 11.

[0027] 2, the workpiece holder 20 and the holding table 11 are moved relatively close to each other, and the second surface 52 of the workpiece 50 is covered with resin 55. Specifically, the first surface 51 of the workpiece 50 is held by suction on the holding surface 31 of the workpiece holder 20, and the movement mechanism 22 is used to lower the workpiece holder 20, bringing the second surface 52 of the workpiece 50 into contact with the liquid resin 55 from above, and the resin 55 is spread by the pressure load from the workpiece 50. As the workpiece holder 20 is lowered to spread the resin 55 through the workpiece 50, the load acting upward on the workpiece holder 20 increases. This change in load is detected by the load sensor 33.

[0028] When the spreading of resin 55 is completed and resin 55 covers second surface 52 of workpiece 50, or when the load reaches a predetermined value, movement mechanism 22 stops lowering workpiece holder 20. When a predetermined time has elapsed since the descent of workpiece holder 20 was stopped, or when a predetermined time has elapsed since the load reached a predetermined value, suction holding of workpiece 50 to holding surface 31 of workpiece holder 20 is released, and movement mechanism 22 raises workpiece holder 20 to separate holding surface 31 from workpiece 50.

[0029] Next, ultraviolet light is irradiated from the ultraviolet irradiation unit 18. The ultraviolet light passes through the light-transmitting holding table 11 and the sheet 54 and reaches the resin 55 on the sheet 54. When the ultraviolet light is irradiated from the ultraviolet irradiation unit 18 for a predetermined time, the ultraviolet-curable resin 55 is cured. Then, the protective member 53 is formed by the cured resin 55 and the sheet 54.

[0030] When forming protective member 53, in the step of spreading resin 55 to cover second surface 52 of workpiece 50 (FIG. 2), there are processing conditions that are appropriate depending on the protective member 53 to be formed. For example, the appropriate movement speed at which workpiece holder 20 and holding table 11 are moved relatively closer by movement mechanism 22 varies depending on the thickness of protective member 53. Furthermore, the appropriate pressing load for pressing workpiece 50 against resin 55 varies depending on the thickness of protective member 53.

[0031] Generally, the thinner the resin 55, the more difficult it is to spread it. In other words, the smaller the desired thickness of the protective member 53 and the smaller the amount of resin 55 supplied, the more difficult it is for the descending workpiece 50 to spread the resin 55. When it becomes difficult to spread the resin 55, a larger load must be applied, and the load between the workpiece holder 20 and the holding table 11, which move relative to each other, increases. If a load exceeding the load-bearing capacity of the movement mechanism 22 supporting the workpiece holder 20 or the load-bearing capacity of the support structure of the holding table 11 is applied, the holding surface 31 of the workpiece holder 20 and the holding surface 12 of the holding table 11 will tilt, causing the thickness of the protective member 53 to become uneven. Therefore, the smaller the desired thickness of the protective member 53, the slower the relative movement speed between the workpiece holding portion 20 and the holding table 11 (the amount of movement of the workpiece holding portion 20 per unit time by the movement mechanism 22) must be in order to prevent excessive load from being placed on the workpiece holding portion 20 and the holding table 11 while reliably spreading the resin 55, which is difficult to spread.

[0032] However, if the relative movement speed between workpiece holder 20 and holding table 11 is too slow, even if resin 55 spread by workpiece 50 reaches the desired thickness, the load detected by load sensor 33 will not reach the set value indicating completion of pressing. As a result, resin 55 is spread excessively, and the thickness of protective member 53 becomes thinner than desired.

[0033] Furthermore, before workpiece 50 comes into contact with liquid resin 55, even if the relative movement speed between workpiece holder 20 and holding table 11 is fast, there is no significant change in the load between them, and they can be moved at a relatively high speed. Moving workpiece holder 20 at high speed improves the processing efficiency of processing device 10. On the other hand, if the relative movement speed between workpiece holder 20 and holding table 11 is too fast at the stage when workpiece 50 comes into contact with resin 55, there is a risk that air bubbles will be introduced into resin 55 or that resin 55 will be suddenly pressed and spread unevenly.

[0034] Therefore, it is desirable to reduce the relative movement speed between workpiece holder 20 and holding table 11 just before workpiece 50 comes into contact with resin 55. In other words, it is desirable to set a speed change point at which the movement speed of workpiece holder 20 by movement mechanism 22 is changed (reduced) just before descending workpiece 50 comes into contact with resin 55.

[0035] The amount of resin 55 supplied varies depending on the desired thickness of protective member 53, and the different amounts of resin 55 result in different height positions of workpiece holder 20 (upper end positions of resin 55) when workpiece 50 comes into contact with resin 55. Therefore, the optimum height position of the speed change point at which movement mechanism 22 changes (slows) the movement speed of workpiece holder 20 varies depending on the thickness of protective member 53.

[0036] With regard to the load with which workpiece 50 presses resin 55, if the load is too high, the thickness of protective member 53 will be smaller than the desired thickness, and if the load is too low, the thickness of protective member 53 will be larger than the desired thickness. Therefore, if the load with which workpiece 50 presses resin 55 is too high or too low, the desired thickness of protective member 53 will not be achieved, and it is necessary to set an appropriate pressing load.

[0037] There has been a problem in that it is time-consuming and cumbersome for an operator to manually input the above-mentioned processing conditions in detail to correspond to the desired thickness of protective member 53. The processing device 10 of this embodiment makes it easy to set such processing conditions. Specifically, when the operator inputs the thickness of protective member 53 into input unit 43, setting unit 42 of control unit 40 automatically sets an appropriate movement speed of workpiece holder 20 by movement mechanism 22 and the value of the pressing load on resin 55.

[0038] 4 shows an example of setting processing conditions when forming protective member 53. An operator inputs a value A (μm), which is the desired thickness of protective member 53, into input unit 43 of processing device 10. Then, setting unit 42 of control unit 40 automatically sets, based on a table stored in memory unit 41, the movement speeds B (μm / s), C (μm / s), and D (μm / s) of workpiece holder 20 moved by movement mechanism 22 from the first stage to the third stage, and the load E (N) at which pressing against resin 55 is completed.

[0039] The first to third stages are operational phases separated by changes in the distance Z between the holding surface 12 of the holding table 11 and the holding surface 31 of the workpiece holding unit 20. The first stage is the range in which the distance Z is greatest, the third stage is the range in which the distance Z is smallest, and the second stage is the range in between. As the workpiece holding unit 20 holding the workpiece 50 is lowered, the distance Z decreases. The vertical distances X (μm) and Y (μm) shown in FIG. 4 have an X>Y relationship. The first stage of movement is when the distance Z reaches the sum of the desired thickness A (μm) of the protective member 53 and the distance X (μm). The second stage of movement is when the distance Z reaches the sum of the desired thickness A (μm) of the protective member 53 and the distance Y (μm). In other words, the amount of movement in the second stage is the difference between the distance X (μm) and the distance Y (μm). When the distance Z falls below the sum of the desired thickness A (μm) of the protection member 53 and the distance Y (μm), the third stage of movement is initiated.

[0040] In this embodiment, the protective member 53 is formed by the cured resin 55 and the sheet 54, and the workpiece 50 is disposed between the holding surface 31 of the workpiece holder 20 and the protective member 53. Therefore, the total thickness of the workpiece unit, which is the combination of the workpiece 50 and the protective member 53, is the sum of the thickness of the workpiece 50, the thickness of the sheet 54, and the thickness of the cured resin 55. The distance Y is a predetermined value that is greater than the total thickness of the workpiece unit. The distance X is a predetermined value that is greater than the distance Y.

[0041] The distance X that serves as the reference separating the first stage from the second stage and the distance Y that serves as the reference separating the second stage from the third stage may each be a constant value regardless of differences in the thickness A (μm) of the protective member 53, or may vary in value depending on differences in the thickness A (μm) of the protective member 53.

[0042] When the values ​​of distance X and distance Y change depending on differences in thickness A (μm) of protective member 53, a table (not shown) recording this relationship is stored in memory unit 41. Control unit 40 reads and sets values ​​corresponding to distance X and distance Y from the table based on the thickness A (μm) of protective member 53 input by the operator to input unit 43.

[0043] Alternatively, the values ​​of the distance X and the distance Y may be changed by an operator depending on the thickness A (μm) of the protective member 53.

[0044] The change in distance Z caused by the movement of workpiece holder 20 by moving mechanism 22 can be obtained based on the driving information of motor 26 detected by encoder 30. Based on the information detected by encoder 30, control unit 40 manages the transition from the first stage to the second stage and the transition from the second stage to the third stage.

[0045] The memory unit 41 of the control unit 40 stores a table (movement speed table) that records the relationship between the thickness of the protective member 53 and the relative movement speed between the workpiece holder 20 and the holding table 11. Fig. 5 shows examples of the movement speed tables for the first, second, and third stages, where the vertical axis of each table represents the movement speed and the horizontal axis represents the thickness of the protective member 53.

[0046] The setting unit 42 of the control unit 40 reads out the movement speed corresponding to the thickness (A (μm) in FIG. 4) of the protective member 53 input by the operator via the input unit 43 from the movement speed tables for the first, second, and third stages, and sets the movement speed for each stage (B (μm / s), C (μm / s), D (μm / s) in FIG. 4). Then, the control unit 40 controls the drive speed of the motor 26 in each stage so that the set movement speed is achieved.

[0047] 5, when forming protective member 53 of a predetermined thickness, the movement speed in the second stage is slower than the movement speed in the first stage, and the movement speed in the third stage is slower than the movement speed in the second stage. In other words, if the movement speed in the previous stage is set to the first speed and the movement speed in the next stage is set to the second speed, movement mechanism 22 moves workpiece holder 20 and holding table 11 relatively at the first speed, and then moves workpiece holder 20 and holding table 11 relatively at a second speed that is slower than the first speed. In this way, the movement speed is controlled to gradually slow down as distance Z between holding surface 31 of workpiece holder 20 and holding surface 12 of holding table 11 becomes closer.

[0048] The movement speed table stored in the memory unit 41 may be recorded in the form of a function as shown in Fig. 5, or may record the movement speed in stages for each thickness of the protective member 53. By recording it as a function, it is possible to easily calculate the movement speed even if the thickness of the protective member 53 changes.

[0049] In this embodiment, the moving speed is controlled in three stages according to the distance Z between the holding surface 12 of the holding table 11 and the holding surface 31 of the workpiece holding unit 20, but the number of stages for controlling the moving speed is not limited to three, and may be one, two, or four or more. In the case of one stage, there is no speed change point along the way, and the moving mechanism 22 moves the workpiece holding unit 20 at a constant speed according to the input thickness of the protective member 53.

[0050] The memory unit 41 of the control unit 40 stores a table (pressing load table) that records the relationship between the thickness of the protective member 53 and the pressing load that presses the workpiece holder 20 relatively against the holding table 11. Fig. 6 shows an example of the pressing load table, with the vertical axis representing the load and the horizontal axis representing the thickness of the protective member 53.

[0051] Setting unit 42 of control unit 40 reads out from the pressing load table the load corresponding to the thickness (A (μm) in FIG. 4) of protective member 53 input by the operator via input unit 43, and sets the pressing load (E (N) in FIG. 4). Then, when the load detected by load sensor 33 reaches the set pressing load, control unit 40 stops driving motor 26, and completes the movement of workpiece holder 20 by moving mechanism 22, i.e., the pressing of resin 55 by workpiece 50.

[0052] The pressure load table stored in the storage unit 41 may be recorded in the form of a function as shown in Fig. 6, or may record the pressure load in stages for each thickness of the protective member 53. By recording the pressure load as a function, it is possible to easily calculate the pressure load even if the thickness of the protective member 53 changes.

[0053] As described above, according to the processing device 10 of this embodiment, when the operator inputs the thickness of the protective member 53 into the input unit 43, the setting unit 42 automatically sets the movement speed of the movement mechanism 22 based on the table (movement speed table) stored in the memory unit 41. This eliminates the need for the operator to input the movement speed, and makes it easier to set the processing conditions when forming the protective member 53 on the workpiece 50.

[0054] Furthermore, by managing the moving speed in multiple stages according to the distance Z between the holding surface 12 of the holding table 11 and the holding surface 31 of the workpiece holding unit 20, it is possible to set an optimal moving speed according to the progress of the processing, thereby improving the accuracy of the thickness and shape of the protective member 53. In particular, by setting the moving speed of the next stage (second speed) to be slower than the moving speed of the previous stage (first speed), it is possible to form the protective member 53 with both high efficiency and high accuracy without applying an excessive load to the moving mechanism 22.

[0055] Furthermore, the setting unit 42 automatically sets the target value of the pressing load based on the table (pressing load table) stored in the memory unit 41 in accordance with the thickness of the protective member 53 input by the operator to the input unit 43, eliminating the need for the operator to input the load. Therefore, due to the synergistic effect with the automatic setting of the movement speed described above, it becomes even easier to set the processing conditions for forming the protective member 53 on the workpiece 50.

[0056] It is also possible to manage the viscosity of the resin 55 as a processing condition for forming the protective member 53. Resin 55 has different viscosities depending on the type (material and composition), and the ease of spreading varies depending on the viscosity of the resin 55. Therefore, by individually setting tables (movement speed table and pressing load table) stored in the memory unit 41 for each type of resin 55, the formation of the protective member 53 can be managed with even greater precision.

[0057] In the processing apparatus 10 of this embodiment, the liquid resin 55 is supplied by dripping it onto the sheet 54 held on the holding surface 12 of the holding table 11, but it is also possible to supply the liquid resin 55 by applying it to the second surface 52 of the workpiece 50. It is also possible to configure the protective member 53 using only the resin 55 without including the sheet 54. In other words, the supply unit corresponding to the resin supply mechanism 13 only needs to supply the liquid protective member (resin 55) to at least either the second surface 52 of the workpiece 50 held by the workpiece holding unit 20 or the holding surface 12 (including the sheet 54) of the holding table 11.

[0058] In the processing apparatus 10 of this embodiment, the workpiece holding unit 20 is moved up and down by the moving mechanism 22 relative to the holding table 11, which is fixed in position, to change the distance Z between the holding surface 12 and the holding surface 31, but as a modified example, it is also possible to configure the holding table 11 to be movable up and down. A configuration may be possible in which both the holding table 11 and the workpiece holding unit 20 move up and down, or a configuration may be possible in which only the holding table 11 moves up and down without the workpiece holding unit 20 moving up and down.

[0059] The embodiments of the present invention are not limited to the above-described embodiments and modifications, and may be variously changed, substituted, or modified without departing from the spirit of the technical idea of ​​the present invention. Furthermore, if the technical idea of ​​the present invention can be realized in a different way due to technological advances or other derived technologies, it may be implemented using that method. Therefore, the claims cover all embodiments that may fall within the scope of the technical idea of ​​the present invention. [Industrial Applicability]

[0060] As described above, the processing apparatus of the present invention makes it easier to set processing conditions when forming a protective member on a workpiece, improves work efficiency in forming the protective member, and increases productivity of workpieces having protective members. [Explanation of symbols]

[0061] 10: Processing equipment 11: Holding table (second holding unit) 12: Holding surface (second holding surface) 13: Resin supply mechanism (supply section) 15: Resin supply nozzle 18: Ultraviolet irradiation section (curing section) 20: Workpiece holding part (first holding part) 22: Movement mechanism 23: Guide rail 24: Lift table 25: Ball screw 26: Motor 30: Encoder 31: Holding surface (first holding surface) 32: Suction source 33: Load sensor 40: Control section 41: Storage section 42: Setting section 43: Input section 50: Workpiece 51: Front page 52:Second side 53: Protective material 54: Sheet 55: Resin (liquid protective material)

Claims

1. A processing device for a workpiece, a first holding portion having a first holding surface that holds a first surface of the workpiece; a second holding portion having a second holding surface facing the first holding portion; a supply unit that supplies a liquid protective material to at least one of the second surface of the workpiece held by the first holding unit and the second holding surface; a moving mechanism that brings the first holding portion and the second holding portion relatively close to each other to cover the second surface of the workpiece with the protective member; a curing unit that cures the protective member; a control unit, The control unit a storage unit that stores a table recording the movement speed of the movement mechanism corresponding to the desired thickness of the protection member; a setting unit that sets the moving speed based on the table when a desired thickness of the protection member is input, A processing apparatus for a workpiece, characterized in that the moving mechanism is controlled in accordance with the setting of the setting unit.

2. The moving mechanism includes: After the first holding portion and the second holding portion are moved relatively at a first speed, moving the first holding portion and the second holding portion relatively at a second speed slower than the first speed; 2. The apparatus for treating a workpiece according to claim 1, wherein the table stores a desired relationship between the protection member and the first speed and a desired relationship between the protection member and the second speed.

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