Protective member formation device

Abstract

To provide a protective member formation device which detects adhesion of a small amount of a liquid resin supplied.SOLUTION: A protective member formation device for forming a protective member (1) on one surface (Wa) of a wafer (W) includes: a dropping table (16) having a dropping surface (17) for dropping a liquid resin; a dropping nozzle (36) for dropping the liquid resin to the dropping table; a holding table (25) having a holding surface (27) facing the upper side of the dropping surface of the dropping table; an adhesion nozzle (37) for adhering a small amount of a small amount liquid resin (4) to the holding surface side; an extension mechanism (30) for moving the holding table in a vertical direction, and extending the liquid resin so as to be integrated with the small amount liquid resin; a curing unit (18) for curing the liquid resin; and a detection part (53) for detecting the small amount liquid resin.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a protective member forming apparatus for forming a protective member on a wafer. [Background technology]

[0002] In wafer manufacturing, an ingot is sliced ​​to form sliced ​​wafers, and both sides of the sliced ​​wafers are ground to remove waviness and warpage. When grinding the sliced ​​wafers, a protective member is formed on one side, and the other side of the sliced ​​wafer is ground while the protective member side is held on the chuck table of the grinding machine. Next, one side of the sliced ​​wafer is ground. This results in wafers with waviness and warpage removed from both sides.

[0003] As disclosed in Patent Documents 1 and 2, a protective member forming apparatus for forming a protective member on one side of a wafer spreads a liquid resin over the entire surface of one side of the wafer, then hardens the liquid resin, and forms a protective member with the hardened resin. The protective member forming apparatus includes a dripping table having a dripping surface and a holding table having a holding surface facing the upper side of the dripping surface. The wafer is held on the holding surface of the holding table or the dripping surface of the dripping table. The liquid resin is supplied by dripping onto the dripping surface of the dripping table. When the holding table and the dripping table are moved relatively to each other and brought closer to each other, the gap between the dripping surface and the holding surface narrows, and the liquid resin is forced to spread and cover one side of the wafer.

[0004] Liquid resin dispensed onto the dispensing surface of the dispensing table can sometimes have a depression in the center. If the liquid resin with a depression in the center is spread onto one side of the wafer, air bubbles will form in the area corresponding to the depression. If the liquid resin containing air bubbles is cured to form a protective member, the thickness of the protective member will be uneven.

[0005] To prevent such problems, the protective member forming devices disclosed in Patent Documents 1 and 2 apply a small amount of liquid resin to the holding surface of the holding table (or to the wafer if a wafer is held on the holding surface). The small amount of liquid resin applied to the holding surface fills in depressions in the liquid resin on the dripping surface, thereby preventing the generation of air bubbles. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Laid-Open No. 2016-167546 [Patent Document 1] Japanese Patent Application Publication No. 2017-168616 Summary of the Invention [Problem to be solved by the invention]

[0007] However, there were cases where the small amount of liquid resin was not applied to the holding surface of the holding table. The success or failure of applying the small amount of liquid resin is affected by the viscosity of the liquid resin and the surrounding environment (temperature, humidity, etc.), so even when the application operation is performed under the same conditions, there were cases where the small amount of liquid resin was applied and cases where it was not. Also, some kind of operational error could occur in the supply mechanism that supplies the small amount of liquid resin. Therefore, a measure was needed to form a protective member with a small amount of liquid resin reliably applied.

[0008] Therefore, the protective member forming device has a problem to be solved, namely, how to detect adhesion of the small amount of supplied liquid resin. [Means for solving the problem]

[0009] One aspect of the present invention is a protective member forming device that spreads liquid resin over the entire surface of one side of a wafer and then hardens it to form a protective member made of resin, and includes a drip table having a drip surface for dripping liquid resin, a drip nozzle that drips the liquid resin onto the drip table, a holding table having a holding surface facing the upper side of the drip surface of the drip table, an attachment nozzle that attaches a small amount of liquid resin to the holding surface side, an expansion mechanism that moves the holding table vertically to expand the small amount of liquid resin together with the liquid resin, a curing unit that hardens the liquid resin, and a detection unit that detects the small amount of liquid resin.

[0010] In one embodiment, the drip table is made of a glass plate and is provided with a first camera that is positioned below the drip surface of the drip table and captures an image of the holding surface, and the detection unit detects using the image captured by the first camera.

[0011] In a different embodiment, the holding table is made of a glass plate and is provided with a second camera arranged above the holding surface of the holding table to capture an image of the holding surface, and the detection unit performs detection using the image captured by the second camera.

[0012] When the small amount of liquid resin is detected by the image captured by the second camera, the device may be provided with a distance detection unit that detects the distance between the deposition nozzle and the holding table, and a viscosity recognition unit that recognizes the viscosity of the small amount of liquid resin using the distance detected by the distance detection unit when the detection unit detects the deposition of the small amount of liquid resin on the holding surface. [Effects of the Invention]

[0013] According to the protective member forming device of the present invention, after detecting that a small amount of liquid resin supplied from the adhesion nozzle has adhered to the holding surface side of the holding table, the liquid resin is expanded and hardened, thereby making it possible to form a protective member with no variation in thickness. [Brief explanation of the drawings]

[0014] [Figure 1] 1 is a perspective view of a protective member forming apparatus according to a first embodiment. [Figure 2] 5 is a cross-sectional view showing a small amount of liquid resin supplying step in the protective member forming apparatus of the first embodiment. FIG. [Figure 3] 5A to 5C are cross-sectional views showing a detection step in the protective member forming apparatus of the first embodiment. [Figure 4] 10A and 10B are diagrams illustrating examples of captured images to be referred to in the detection process. [Figure 5] 5 is a cross-sectional view showing a liquid resin dropping step in the protective member forming apparatus of the first embodiment. FIG. [Figure 6] 5A to 5C are cross-sectional views showing an expansion step in the protective member forming apparatus of the first embodiment. [Figure 7] 10 is a cross-sectional view showing a small amount of liquid resin supplying step in the protective member forming apparatus of the second embodiment. FIG. [Figure 8] 10A and 10B are cross-sectional views showing a detection step in the protective member forming apparatus of the second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0015] A protective member forming device to which the present invention is applied will be described below with reference to the drawings. The X-axis, Y-axis, and Z-axis directions shown in Fig. 1 are perpendicular to one another. The X-axis and Y-axis directions are horizontal directions. The Z-axis direction is the up-down direction, with the +Z direction side being the top and the -Z direction side being the bottom (vertical direction).

[0016] A protective member forming apparatus 10 according to a first embodiment will be described with reference to FIGS. 1 to 6. The protective member forming apparatus 10 is an apparatus for forming a protective member 1 (see FIG. 6) on one surface Wa of a wafer W. The wafer W is, for example, a disk-shaped sliced ​​wafer cut from a cylindrical ingot of silicon or the like. After the protective member 1 is formed by the protective member forming apparatus 10, the wafer W is transported to a grinding apparatus (not shown), where the protective member 1 side of the wafer W is placed and held on a holding surface of a chuck table provided in the grinding apparatus, and the other surface Wb of the wafer W is ground with a grinding wheel. The wafer W is not limited to a sliced ​​wafer before devices are formed thereon, but may also be a device wafer after devices are formed thereon.

[0017] The protective member forming apparatus 10 supplies liquid resin 3 between one surface Wa of the wafer W and the sheet 2, spreads the liquid resin 3, and then hardens the liquid resin 3 to form the protective member 1 from the hardened liquid resin 3 and the sheet 2. Unlike the protective member forming apparatus 10 of this embodiment, it is also possible to form the protective member 1 only from the hardened liquid resin 3 without using the sheet 2.

[0018] The sheet 2 is made of a light-transmitting material. For example, a sheet made of polyethylene terephthalate or the like can be used as the sheet 2. Note that the sheet 2 made of a material other than this may also be used.

[0019] The liquid resin 3 has the property of being hardened by a predetermined external stimulus. The liquid resin 3 in this embodiment is an ultraviolet-curable resin, and is hardened by irradiating ultraviolet light onto the liquid resin 3 (see FIG. 6) in a state where the liquid resin 3 has been expanded to cover the entire surface of one side Wa of the wafer W. Note that the external stimulus applied to harden the liquid resin is not limited to irradiation with ultraviolet light, and may be a temperature change such as heating or cooling, or irradiation of light of a wavelength other than ultraviolet light.

[0020] As shown in FIG. 1, the protective member forming apparatus 10 has a cassette storage section 11 at its end on the -X direction side. The cassette storage section 11 has two storage spaces formed at different positions in the Z axis direction. An input cassette 12 that stores wafers W before the protective member 1 is formed is placed in one storage space. An output cassette 12 that stores wafers W after the protective member 1 is formed is placed in the other storage space. Each cassette 12 can store multiple wafers W.

[0021] A temporary placement table 13 and a sheet cutting table 14 are provided at positions on the +X direction side of the cassette storage unit 11. The temporary placement table 13 is located on the upper side, and the sheet cutting table 14 is located on the lower side.

[0022] A first transport mechanism 15 is provided at a position between the cassette storage unit 11 and the temporary placement table 13 and the sheet cutting table 14 in the X-axis direction. The first transport mechanism 15 movably supports a base 152 along a pair of guide rails 151 extending in the Y-axis direction, and moves the base 152 in the Y-axis direction by rotating a ball screw 153 extending in the Y-axis direction with the driving force of a motor. A robot hand 154 is supported on the base 152. The first transport mechanism 15 transports wafers W between the cassette 12 in the cassette storage unit 11 and the temporary placement table 13 and the sheet cutting table 14 by moving the base 152 in the Y-axis direction and operating the robot hand 154.

[0023] A dripping table 16 is provided at a position away from the temporary placement table 13 and the sheet cutting table 14 in the +X direction. As shown in FIGS. 2, 3, 5, and 6, the dripping table 16 has a circular, translucent holding plate 161 made of a glass plate, and a cylindrical frame member 162 that supports the periphery of the holding plate 161. The upper surface of the holding plate 161 forms a flat dripping surface 17, and the sheet 2 can be held on the dripping surface 17. A hollow internal space 163 is formed inside the frame member 162, and the upper side of the internal space 163 is covered by the holding plate 161.

[0024] A curing unit 18 is provided at the bottom of the internal space 163. The curing unit 18 has an ultraviolet lamp that irradiates ultraviolet light toward the upper side where the holding plate 161 is disposed. The ultraviolet light emitted by the curing unit 18 passes through the light-transmitting holding plate 161 and the sheet 2, reaches the liquid resin 3 on the sheet 2, and cures the liquid resin 3.

[0025] 1, a second transport mechanism 19 for transporting a wafer W is provided at a position on the -Y direction side of the temporary placement table 13, the sheet cutting table 14, and the dripping table 16. The second transport mechanism 19 movably supports a pedestal 192 along a pair of guide rails 191 extending in the X-axis direction, and moves the pedestal 192 in the X-axis direction by rotating a ball screw 193 extending in the Y-axis direction with the driving force of a motor. A robot hand 194 is supported on the pedestal 192. The second transport mechanism 19 transports the wafer W between the temporary placement table 13, the sheet cutting table 14, and the holding table 25 by moving the pedestal 192 in the X-axis direction and operating the robot hand 194.

[0026] 1, the dropping table 16 is provided with a sheet supply mechanism 20 that supplies the sheet 2. The sheet supply mechanism 20 includes a sheet supply unit 21 that supports the sheet 2 wound in a roll, and a sheet transport arm 22 that pulls out the sheet 2 from the sheet supply unit 21. The sheet transport arm 22 is provided with a sheet gripping unit 23 that grips the end of the sheet 2 on the -X direction side.

[0027] The sheet transport arm 22 is moved in the X-axis direction by a drive mechanism (not shown). The drive mechanism moves the sheet transport arm 22 in the -X direction, and the sheet 2 gripped by the sheet gripper 23 is pulled, thereby drawing the sheet 2 from the sheet supply unit 21 and supplying it to the dropping table 16. The sheet 2 is cut by a sheet cutter provided in the sheet supply mechanism 20 while it is placed on the dropping surface 17 of the dropping table 16.

[0028] 2, 3, 5, and 6, the drip table 16 has a plurality of suction holes 164 that open to the upper surface of the frame member 162. The suction holes 164 are connected to the suction source 24. By operating the suction source 24, air is sucked through the suction holes 164, creating a negative pressure, and the sheet 2 placed on the drip surface 17 of the drip table 16 is held by suction.

[0029] A holding table 25 is disposed above the dropping table 16. As shown in FIGS. 2, 3, 5, and 6, a suction plate 26, which is a circular porous member, is provided on the underside of the holding table 25. The underside of the suction plate 26 is a flat holding surface 27 that faces the upper side of the dropping surface 17 of the dropping table 16. The suction plate 26 is connected to a suction source 28. By operating the suction source 28 to suck air from the suction plate 26 and apply negative pressure, the other side Wb of the wafer W can be sucked and held on the holding surface 27.

[0030] Holding table 25 is supported movably in the Z-axis direction via extension mechanism 30 provided on column 29 located on the −X-direction side of dropping table 16. As shown in Fig. 1, extension mechanism 30 movably supports lifting table 302 along a pair of guide rails 301 extending in the Z-axis direction, and moves lifting table 302 in the Z-axis direction by rotating ball screw 303 extending in the Z-axis direction with the driving force of motor 304.

[0031] An encoder 305 is provided to detect the amount of drive of the motor 304, and feedback control is performed to adjust the amount and speed of movement of the holding table 25 by referring to information detected by the encoder 305.

[0032] The holding table 25 is disk-shaped and is supported on the lower end of a support member 31 that moves in the Z-axis direction together with the lift table 302. The holding table 25 moves in the Z-axis direction as the extension mechanism 30 moves the lift table 302. A load sensor 32 is provided between the holding table 25 and the support member 31 to detect the load acting on the holding table 25 in the Z-axis direction.

[0033] The liquid resin supply mechanism 35 is provided to supply the liquid resin 3. The liquid resin supply mechanism 35 is provided with a dripping nozzle 36 that drips the liquid resin 3 toward the dripping surface 17 of the dripping table 16, and an attachment nozzle 37 that attaches a small amount of liquid resin 4, which is a small amount of the liquid resin 3, to the holding surface 27 side of the holding table 25.

[0034] The liquid resin supply mechanism 35 includes a tank 38 that stores the liquid resin 3, and a dispenser 39 connected to the tank 38, and a supply pipe extending from the dispenser 39 is connected to the drip nozzle 36. The dispenser 39 can adjust the amount of liquid resin 3 supplied to the drip nozzle 36, and the liquid resin 3 stored in the tank 38 is sent to the drip nozzle 36 by the operation of the dispenser 39. As shown in FIG. 5, the drip nozzle 36 has a discharge port 361 that opens downward, and drips the liquid resin 3 downward from the discharge port 361.

[0035] The liquid resin supply mechanism 35 also includes a tank 40 that stores the liquid resin 3 and a resin supply box 41 connected to the tank 40, and a supply pipe extending from the resin supply box 41 is connected to the deposition nozzle 37. The resin supply box 41 can adjust the amount of liquid resin 3 supplied to the deposition nozzle 37, and the liquid resin 3 stored in the tank 40 is sent to the deposition nozzle 37 by the operation of the resin supply box 41. As shown in FIG. 2, the deposition nozzle 37 has a discharge port 371 that opens upward, and the liquid resin 3 supplied to the discharge port 371 becomes a small amount of liquid resin 4 that rises in a dome shape.

[0036] In addition, the liquid resin supply mechanism 35 of this embodiment has a structure in which the flow path that supplies liquid resin 3 to the drip nozzle 36 and the flow path that supplies liquid resin 3 to the adhesion nozzle 37 are completely separated, but it may also be structured so that the liquid resin 3 delivered from a common tank is branched into two systems midway along the supply path and supplied to the drip nozzle 36 and the adhesion nozzle 37.

[0037] The dripping nozzle 36 and the deposition nozzle 37 are each supported so as to be rotatable (pivotable) about an axis in the Z-axis direction. The dripping nozzle 36 is rotated by a rotation mechanism 42, and moves between a supply position (FIG. 5) where the discharge port 361 faces the center of the dripping surface 17 of the dripping table 16 and a retracted position (FIGS. 2, 3, and 6) where the discharge port 361 does not face the dripping surface 17 of the dripping table 16. The deposition nozzle 37 is rotated by a rotation mechanism 43, and moves between a supply position (FIG. 2) where the discharge port 371 faces the center of the holding surface 27 of the holding table 25 and a retracted position (FIGS. 3, 5, and 6) where the discharge port 371 does not face the holding surface 27 of the holding table 25.

[0038] The internal space 163 of the dripping table 16 is equipped with a first camera 44 located below the dripping surface 17. The first camera 44 is located approximately in the radial center of the dripping table 16 and is capable of capturing images above. More specifically, the first camera 44 is capable of capturing images of the holding surface 27 of the holding table 25 through the light-transmitting holding plate 161. In other words, the first camera 44 is capable of capturing images of the state of adhesion of the small amount of liquid resin 4 on the holding surface 27 side. The first camera 44 is equipped with an image sensor, and an image obtained via an optical system is formed on the light-receiving surface of the image sensor, and the image sensor generates an image signal for each pixel by photoelectric conversion.

[0039] The protective member forming apparatus 10 is controlled in its entirety by a control unit 50 (see FIG. 1). In the control unit 50, a processor executes various processes in accordance with a control program stored in a storage unit 51. The storage unit 51 stores, as part of the control program, a program for detecting the small amount of liquid resin 4 based on a captured image, which will be described later.

[0040] The control unit 50 has an image processing unit 52 and a detection unit 53 as functional blocks. The image processing unit 52 receives an image signal from the image sensor of the first camera 44, processes the image, and generates an image in a predetermined image format. The detection unit 53 detects the small amount of liquid resin 4 on the holding surface 27 side based on the image generated by the image processing unit 52. Note that the functions of the image processing unit 52 and the detection unit 53 are realized by the operation of the processor, memory, and other devices that constitute the control unit 50, and this does not mean that the image processing unit 52 and the detection unit 53 are composed of only one independent electronic component. Furthermore, while FIG. 1 schematically shows only the connection between the first camera 44 and the control unit 50, the control unit 50 is also connected to each unit of the protective member forming apparatus 10 other than the first camera 44 so as to be able to send and receive signals.

[0041] The formation of the protective member 1 by the protective member forming apparatus 10 configured as above will be described.

[0042] [Small amount liquid resin supply process] Before supplying the small amount of liquid resin 4, the wafer W is held on the holding surface 27 of the holding table 25. The wafer W before the protective member 1 is formed is removed from the cassette 12 in the cassette storage unit 11 by the first transport mechanism 15 and transported to the temporary placement table 13. After detecting the orientation and center of the wafer W on the temporary placement table 13, the second transport mechanism 19 transports the wafer W to the holding table 25. The control unit 50 operates the suction source 28 to suction-hold the other side Wb of the wafer W on the holding surface 27 of the holding table 25.

[0043] 2, the control unit 50 positions the deposition nozzle 37 at the supply position using the rotation mechanism 43, and supplies the liquid resin 3 delivered from the tank 40 to the discharge port 371 of the deposition nozzle 37 via the resin supply box 41. The liquid resin 3 supplied to the discharge port 371 of the deposition nozzle 37 becomes a dome-shaped small amount of liquid resin 4 that protrudes upward. The resin supply box 41 adjusts the amount of liquid resin 3 supplied so that the small amount of liquid resin 4 on the deposition nozzle 37 has an appropriate size (volume).

[0044] The control unit 50 drives the motor 304 of the expansion mechanism 30 to move the holding table 25 in the vertical direction (-Z direction). An initial value of the distance Za (see FIG. 2) between the holding table 25 and the attachment nozzle 37 in the Z-axis direction before the expansion mechanism 30 moves the holding table 25 in the vertical direction is set. The amount obtained by subtracting the sum of the thickness of the wafer W and the amount of protrusion of the small amount of liquid resin 4 from the upper surface of the attachment nozzle 37 from the initial value of the distance Za is the vertical movement amount of the holding table 25 until the small amount of liquid resin 4 contacts one surface Wa of the wafer W. The control unit 50 controls the drive amount of the motor 304 based on the detection information of the encoder 305, and moves the holding table 25 to reach this movement amount.

[0045] When the holding table 25 is moved vertically by a predetermined amount in this manner, the wafer W is pressed against the small amount of liquid resin 4, and as shown in Fig. 3, the small amount of liquid resin 4 adheres to the center of one surface Wa of the wafer W. After the small amount of liquid resin 4 has adhered to the wafer W, the rotation mechanism 43 moves the adhesion nozzle 37 to a retracted position.

[0046] [Detection process] Next, a detection process is performed to detect whether or not a small amount of liquid resin 4 is attached to the holding surface 27 side of the holding table 25 (more specifically, one side Wa of the wafer W held on the holding surface 27). In the detection process, the first camera 44 captures an image of the holding surface 27 side of the holding table 25. The first camera 44 captures an image of the one side Wa of the wafer W held on the holding surface 27 through the transparent holding plate 161. At this stage, no liquid resin 3 has been dripped onto the dripping surface 17 of the dripping table 16, and the first camera 44 can capture an image of the entire one side Wa of the wafer W from below, including the area where the small amount of liquid resin 4 is attached.

[0047] When capturing images using the first camera 44, the following light sources can be used. The curing unit 18 is used as the first light source. By irradiating ultraviolet light at a lower output of the curing unit 18 than when curing the liquid resin 3, it is possible to capture images without curing a small amount of the liquid resin 4. As a second light source, a light capable of irradiating the holding surface 27 is separately placed to the side of the first camera 44 or the side of the holding table 25. It is preferable that this light emits visible light with a wavelength that does not harden the liquid resin 3. As a third light source, the room lighting of the clean room in which the protective member forming device 10 is installed is used. By allowing external light to enter without completely covering the periphery of the holding table 25 with a shield, it is possible to capture images using the room lighting.

[0048] When capturing an image with the first camera 44, the sheet 2 may be placed on the dropping surface 17 of the dropping table 16. Since the sheet 2 is translucent, the first camera 44 can capture an image of one surface Wa of the wafer W held on the holding surface 27 through the holding plate 161 and the sheet 2.

[0049] The image signal captured by the first camera 44 is transmitted to the control unit 50, and an image is generated through image processing by the image processing unit 52. The detection unit 53 detects whether or not a small amount of liquid resin 4 is attached to one surface Wa of the wafer W, based on the image captured by the first camera 44.

[0050] FIG. 4 shows a captured image 70 in which a small amount of liquid resin 4 is attached to one surface Wa of the wafer W. The outer rectangular area in the captured image 70 is the imaging range of the imaging element of the first camera 44. The imaging range of the first camera 44 covers the entire holding surface 27 of the holding table 25, and an image of one surface Wa of the wafer W held on the holding surface 27 is included in the captured image 70. When ultraviolet light emitted by the curing unit 18 (ultraviolet light of an intensity that does not harden the liquid resin 3) is used as a light source, the outer periphery of the small amount of liquid resin 4 is reflected as a ring-shaped shadow, as shown in FIG. 4. The detection unit 53 detects the presence of a small amount of liquid resin 4 based on the image information contained in this captured image 70.

[0051] The appearance of the small amount of liquid resin 4 in the captured image 70 varies depending on the imaging conditions, such as the type of light source and the specifications of the first camera 44. For example, in the captured image 70, the area of ​​the small amount of liquid resin 4 may be displayed as a different color from the surrounding area. The program that controls the protective member forming device 10 has a predetermined determination algorithm set therein that can cause the detection unit 53 to determine the presence or absence of the small amount of liquid resin 4 depending on the imaging conditions.

[0052] 4, if the captured image does not contain image information indicating the small amount of liquid resin 4, the detection unit 53 determines that the small amount of liquid resin 4 is not attached. If the detection unit 53 does not detect the attachment of the small amount of liquid resin 4, it performs a predetermined countermeasure so as not to proceed to the formation of the protective member 1 in this state. The following countermeasure may be performed alone or in combination with a plurality of countermeasures.

[0053] As an example of a countermeasure, the operation of depositing a small amount of liquid resin 4 is performed again. Specifically, the expansion mechanism 30 is operated to return the holding table 25 in the +Z direction, and then the rotation mechanism 43 is operated to move the deposition nozzle 37 from the retracted position to the supply position. Liquid resin 3 is supplied from the resin supply box 41 to the deposition nozzle 37, forming a dome-shaped small amount of liquid resin 4 at the discharge port 371 of the deposition nozzle 37. Next, the expansion mechanism 30 is operated to move the holding table 25 in the vertical direction (-Z direction), and the small amount of liquid resin 4 is deposited at the center of one surface Wa of the wafer W. Finally, the rotation mechanism 43 is operated to move the deposition nozzle 37 to the retracted position. At this stage, the operation of depositing a small amount of liquid resin 4 on the wafer W is completed again, so the first camera 44 captures an image and the detection unit 53 detects the small amount of liquid resin 4 based on the captured image. The above operation and detection may be repeated until it is detected that a small amount of liquid resin 4 is attached to one surface Wa of the wafer W.

[0054] As another example of the corrective action, a notification unit (such as a display, a lamp that lights up or flashes, or a speaker that makes sound) provided in the protective member forming apparatus 10 may be used to notify the operator operating the protective member forming apparatus 10 of an error in the deposition of the small amount of liquid resin 4. The operator who receives the notification checks the operating state of the liquid resin supply mechanism 35 including the deposition nozzle 37, the state of one surface Wa of the wafer W to which the small amount of liquid resin 4 is to be deposited, and the like, and performs appropriate maintenance.

[0055] Even if the small-quantity liquid resin 4 is attached to one surface Wa of the wafer W, if the amount of the small-quantity liquid resin 4 is significantly insufficient or if the position of the small-quantity liquid resin 4 is significantly offset from the center of the wafer W, the effectiveness of the small-quantity liquid resin 4 may be reduced. Therefore, the detection unit 53 may perform detection including information on the amount and position of the small-quantity liquid resin 4 in addition to simply detecting the presence or absence of the small-quantity liquid resin 4. As shown in FIG. 4, the captured image 70 obtained using the first camera 44 includes image information indicating the area of ​​the small-quantity liquid resin 4 (i.e., the amount of the small-quantity liquid resin 4 attached corresponding to the area) and image information indicating the position of the small-quantity liquid resin 4. By referring to this image information, it is possible to perform detection taking into account whether the amount and position of the small-quantity liquid resin 4 are appropriate. In other words, the detection unit 53 may be configured to detect the attachment of the small-quantity liquid resin 4 only if the amount and position of the small-quantity liquid resin 4 are appropriate.

[0056] Through detection by the detection unit 53 and corrective action based on the detection result, a small amount of liquid resin 4 can be adhered to one surface Wa of the wafer W. When the detection unit 53 detects that a small amount of liquid resin 4 has adhered, the process proceeds to the liquid resin dripping step.

[0057] [Liquid resin dripping process] Before the liquid resin 3 is dripped onto the drip surface 17 of the drip table 16, the sheet 2 is supplied using the sheet supply mechanism 20 and held on the drip surface 17 of the drip table 16. With the end of the sheet 2 on the -X direction side held by the sheet gripper 23 of the sheet transport arm 22, the sheet transport arm 22 is moved in the -X direction to pull the sheet 2 out of the sheet supply unit 21. When the sheet 2 is pulled out to a position where it covers the drip surface 17 of the drip table 16, the movement of the sheet transport arm 22 is stopped. The suction source 24 is operated to suck air through the suction holes 164, and the sheet 2 is sucked and held on the drip surface 17 of the drip table 16. The end of the sheet 2 on the +X direction side held on the drip table 16 is cut using a sheet cutter provided in the sheet supply mechanism 20.

[0058] The rotation mechanism 42 moves the drip nozzle 36 to the supply position, and the liquid resin 3 delivered from the tank 38 is supplied to the drip nozzle 36 via the dispenser 39. The control unit 50 controls the drip nozzle 36 to supply an amount of liquid resin 3 sufficient to cover the entire surface of one side Wa of the wafer W, based on information such as the size of the wafer W. The liquid resin 3 supplied to the drip nozzle 36 is dripped from the outlet 361 of the drip nozzle 36 toward the drip table 16 and accumulates near the center of the upper surface of the sheet 2 held on the drip surface 17, within an area smaller than the area of ​​the wafer W. As shown in FIG. 5, the liquid resin 3 dripped from the drip nozzle 36 onto the sheet 2 has a depression 5 on the upper surface at the center.

[0059] [Extended process] Next, the process proceeds to the expansion step. In the expansion step, the control unit 50 causes the expansion mechanism 30 to move (lower) the holding table 25 in the vertical direction at a predetermined feed rate. As the holding table 25 moves vertically, one side Wa of the wafer W held on the holding table 25 approaches the drip table 16. Then, the small amount of liquid resin 4 adhering to the center of the one side Wa of the wafer W enters the depression 5 in the liquid resin 3 on the drip table 16 side. Then, as shown in FIG. 6 , the one side Wa of the wafer W, which moves vertically downward together with the holding table 25, presses the liquid resin 3, spreading it radially of the wafer W. In other words, as the holding table 25 moves vertically by the expansion mechanism 30, the small amount of liquid resin 4 is expanded integrally with the liquid resin 3 on the drip table 16 side.

[0060] By filling in the depression 5 in the liquid resin 3 on the drip table 16 side with a small amount of liquid resin 4 attached to the holding table 25 side, the liquid resin 3 can be expanded without generating air bubbles in the center of the liquid resin 3 due to the depression 5, and the thickness of the expanded liquid resin 3 can be made uniform.

[0061] In the spreading process, the first camera 44 takes an image of the dripping surface 17 side, and the spreading state of the liquid resin 3 is detected based on the captured image. As shown in Figure 6, when the first camera 44 captures an image of the liquid resin 3 reaching the outer edge of one surface Wa of the wafer W, the control unit 50 determines that the spreading of the liquid resin 3 is complete.

[0062] The expansion state of the liquid resin 3 may be detected by referring to changes in the detection value of the load sensor 32. As the holding table 25 is moved vertically to expand the liquid resin 3 by one side Wa of the wafer W, the load in the Z-axis direction applied to one side Wa of the wafer W increases. As shown in FIG. 6, when the liquid resin 3 spreads over the entire surface Wa of the wafer W and the liquid resin 3 spills out from the outer edge of the wafer W, the load begins to decrease. When such a change in load is detected by the load sensor 32, the control unit 50 determines that the liquid resin 3 has expanded over the entire surface Wa of the wafer W.

[0063] [Curing process] Once the expansion step is complete and the entire surface Wa of the wafer W is covered with the liquid resin 3, the process proceeds to the curing step. In the curing step, the expansion mechanism 30 releases the holding table 25 from pressing it toward the drip table 16, and the curing unit 18 irradiates the drip surface 17 with ultraviolet light of an intensity sufficient to cure the liquid resin 3. The ultraviolet light emitted from the curing unit 18 passes through the translucent holding plate 161 and sheet 2 to reach the liquid resin 3, curing the liquid resin 3, which is an ultraviolet-curable resin. When the liquid resin 3 is determined to be sufficiently cured, the irradiation of ultraviolet light from the curing unit 18 is terminated. The cured liquid resin 3 and sheet 2 form the protective member 1.

[0064] [Post-processing process] The wafer W on which the protective member 1 has been formed is transferred from the holding table 25 to the robot hand 194 of the second transport mechanism 19, and is transported by the second transport mechanism 19 to the sheet cutting table 14. The wafer W is held on the sheet cutting table 14, and a sheet cutter (not shown) is used to cut off the excess outer edge region of the sheet 2 that protrudes from the wafer W. Next, the first transport mechanism 15 stores the wafer W in the cassette 12 of the cassette storage unit 11. This completes the series of processes for the wafer W in the protective member forming apparatus 10.

[0065] As described above, the protective member forming apparatus 10 includes the dripping nozzle 36 that drips the liquid resin 3 toward the dripping surface 17 of the dripping table 16, the deposition nozzle 37 that deposits the small amount of liquid resin 4 on the holding surface 27 side of the holding table 25 (one side Wa of the wafer W held on the holding surface 27), the expansion mechanism 30 that moves the holding table 25 vertically to expand the small amount of liquid resin 4 together with the liquid resin 3 on the dripping table 16, the curing unit 18 that hardens the liquid resin 3, and the detection unit 53 that detects the small amount of liquid resin 4 deposited on the holding surface 27 side of the holding table 25. By detecting the presence or absence of the deposited small amount of liquid resin 4 using the detection unit 53 before spreading and curing the liquid resin 3, it is possible to prevent the formation of air bubbles caused by the depressions 5 in the liquid resin 3 and prevent the formation of a protective member 1 with a partially thin thickness due to the air bubbles. As a result, the protective member 1 formed by the protective member forming apparatus 10 does not have local variations in thickness.

[0066] The small amount of liquid resin 4 in the detection process is detected based on an image captured by the first camera 44 of the holding surface 27 side of the holding table 25 (one surface Wa of the wafer W). The first camera 44 is also used in the expansion process to detect that the liquid resin 3 has spread over the entire surface Wa of the wafer W, so there is no need to install special sensors for detecting the small amount of liquid resin 4, which reduces the introduction cost.

[0067] After forming the protective member 1, the wafer W is transported to a grinding device (not shown). In the grinding device, the wafer W is placed on the holding surface of a chuck table with the protective member 1 facing downward, and a grinding wheel is brought into contact with the other surface Wb of the wafer W to perform grinding. As described above, the protective member 1 formed by the protective member forming device 10 has a uniform thickness throughout by combining small amounts of liquid resin 4 on the drip table 16 and spreading the liquid resin 3. This eliminates the risk of deterioration in the grinding accuracy of the wafer W due to variations in the thickness of the protective member 1, and allows the in-plane thickness of the wafer W ground to the desired thickness to be uniform. In other words, wafers W with a uniform thickness can be manufactured by grinding.

[0068] Next, a protective member forming apparatus according to a second embodiment will be described with reference to Figures 7 and 8. The protective member forming apparatus according to the second embodiment differs from the protective member forming apparatus 10 according to the first embodiment in the configuration of the dripping table 60 and the holding table 65. The components other than the dripping table 60 and the holding table 65 are configured similarly to the protective member forming apparatus 10 according to the first embodiment, and illustrations and detailed descriptions of the components common to the protective member forming apparatus 10 will be omitted.

[0069] The dropping table 60 has a structure similar to that of the holding table 25 of the first embodiment, but turned upside down. A suction plate 61, which is a circular porous member, is provided on the upper surface of the dropping table 60. The upper surface of the suction plate 61 is a flat dropping surface 62. The suction plate 61 is connected to a suction source 63. By operating the suction source 63 to suck air from the suction plate 61 and apply negative pressure, the other side Wb of the wafer W can be sucked and held on the dropping surface 62. In other words, the wafer W is held on the dropping surface 62 of the dropping table 60 with the other side Wb facing downward.

[0070] As shown in Figure 7, the liquid resin 3 dripped onto the drip table 60 from the outlet 361 of the drip nozzle 36 positioned at the supply position accumulates near the center of one side Wa of the wafer W held on the drip surface 62, within an area narrower than the area of ​​the wafer W.

[0071] Holding table 65 has a structure similar to that of dropping table 16 of the first embodiment, turned upside down. Holding table 65 has a circular, translucent holding plate 651 made of a glass plate, and a cylindrical frame member 652 that supports the periphery of holding plate 651. The underside of holding plate 651 forms a flat holding surface 66, and sheet 2 can be held on holding surface 66. A hollow internal space 653 is formed inside frame member 652, and the underside of internal space 653 is covered by holding plate 651. Holding table 65 is moved in the Z-axis direction by expansion mechanism 30.

[0072] The holding table 65 has a plurality of suction holes 654 that open to the bottom surface of the frame member 652. The suction holes 654 are connected to a suction source 67. The sheet 2 is supplied to the holding surface 66 of the holding table 65 using the sheet supply mechanism 20, and the suction source 67 is operated to suck air through the suction holes 654, creating a negative pressure, thereby allowing the sheet 2 to be sucked and held on the holding surface 66.

[0073] A curing unit 68 is provided in the internal space 653 of the holding table 65. The curing unit 68 has an ultraviolet lamp that irradiates ultraviolet light downward where the holding plate 161 is placed.

[0074] 7 shows the small-quantity liquid resin supply process. In this process, the deposition nozzle 37 is positioned at the supply position, and a dome-shaped small amount of liquid resin 4 is supplied to the discharge port 371. In this state, the motor 304 of the expansion mechanism 30 is driven to move the holding table 65 a predetermined distance in the vertical direction (-Z direction), and the small amount of liquid resin 4 is deposited near the center of the underside of the sheet 2, which is held by suction on the holding surface 66. After the small amount of liquid resin 4 has been deposited on the underside of the sheet 2, the rotation mechanism 43 is operated to move the deposition nozzle 37 from the supply position to the retracted position.

[0075] The internal space 653 of the holding table 65 is provided with a second camera 69 located above the holding surface 66. The second camera 69 is located approximately in the center of the radial direction of the holding table 65 and is capable of capturing images of the downward direction. More specifically, the second camera 69 is capable of capturing images of the holding surface 66 of the holding table 65 through the light-transmitting holding plate 651. That is, the second camera 69 is capable of capturing images of the state of adhesion of the small amount of liquid resin 4 to the sheet 2 held on the holding surface 66. Because the holding plate 651 located below the second camera 69 and the sheet 2 are both light-transmitting, the state of adhesion of the small amount of liquid resin 4 to the underside of the sheet 2 can be captured using the second camera 69 located above the holding plate 651.

[0076] 8 shows the detection process. In the detection process, the second camera 69 captures an image of the holding surface 66, and the detection unit 53 of the control unit 50 detects the small amount of liquid resin 4 based on the captured image. In the protective member forming apparatus of the second embodiment, the second camera 69 is disposed on the holding table 65. The small amount of liquid resin 4 (the holding surface 66 that holds the sheet 2 to which the small amount of liquid resin 4 adheres) that is the object of the image capture by the second camera 69 is also located on the holding table 65 side. Therefore, the image of the small amount of liquid resin 4 can be captured using the second camera 69 regardless of the state of the dripping table 60. Therefore, the holding of the wafer W on the dripping surface 62 of the dripping table 60 and the dripping of the liquid resin 3 onto one side Wa of the wafer W held on the dripping surface 62 can be performed simultaneously with the small amount of liquid resin supply process and the detection process.

[0077] The detection unit 53 detects whether or not a small amount of liquid resin 4 has adhered based on image information contained in the image captured by the second camera 69. If the adhesion of a small amount of liquid resin 4 is detected, the process proceeds to the expansion step. In the expansion step, the control unit 50 operates the expansion mechanism 30 to move the holding table 65 in the vertical direction (-Z direction), and expands the small amount of liquid resin 4 together with the liquid resin 3 dropped on one side Wa of the wafer W on the dropping surface 62.

[0078] In the expanding step, the second camera 69 captures an image of the holding surface 66 side, and the expanded state of the liquid resin 3 is detected based on the captured image. When the second camera 69 captures an image of the liquid resin 3 reaching the outer edge of one surface Wa of the wafer W, the control unit 50 determines that the expansion of the liquid resin 3 is complete.

[0079] Once the liquid resin 3 has spread to cover the entire surface of one side Wa of the wafer W, the process proceeds to the curing step. In the curing step, ultraviolet light of an intensity sufficient to cure the liquid resin 3 is irradiated from the curing unit 68 toward the holding surface 66. The ultraviolet light emitted from the curing unit 68 passes through the light-transmitting holding plate 651 and sheet 2, reaches the liquid resin 3, and cures the liquid resin 3. When the liquid resin 3 is determined to be sufficiently cured, the irradiation of ultraviolet light from the curing unit 68 is terminated. The cured liquid resin 3 and sheet 2 form the protective member 1.

[0080] In the detection process, if the image captured by the second camera 69 does not show the small amount of liquid resin 4, the detection unit 53 determines that the small amount of liquid resin 4 is not attached to the sheet 2. If it is detected that the small amount of liquid resin 4 is not attached, the control unit 50 executes the same countermeasure processing as in the first embodiment described above. This prevents the formation of bubbles caused by the depressions 5 in the liquid resin 3, and makes it possible to form a protective member 1 with a uniform thickness.

[0081] The detection of the small amount of liquid resin 4 in the detection process is performed based on an image captured by the second camera 69 of the holding surface 66 side of the holding table 65. The second camera 69 is also used in the expansion process to detect that the liquid resin 3 has spread over the entire surface Wa of one side of the wafer W, so there is no need to install special sensors for detecting the small amount of liquid resin 4, which reduces the introduction cost.

[0082] The viscosity of the liquid resin 3 changes over time, with temperature changes, etc. The height (amount of protrusion) of the small amount of liquid resin 4 from the top surface of the deposition nozzle 37 changes depending on the viscosity of the liquid resin 3. Generally, the height of the small amount of liquid resin 4 increases as the viscosity of the liquid resin 3 increases.

[0083] In the protective member forming device of the second embodiment, a light-transmitting holding plate 651 and a sheet 2 are arranged between the small amount of liquid resin 4 on the upper surface side of the attachment nozzle 37 and the second camera 69 in the holding table 65. Therefore, when the extension mechanism 30 moves the holding table 65 in the vertical direction to bring the sheet 2 closer to the small amount of liquid resin 4, the process of the small amount of liquid resin 4 adhering to the sheet 2 can be continuously captured by the second camera 69 and continuously detected by the detection unit 53. This continuous capturing and detection can be used to recognize the viscosity of the small amount of liquid resin 4.

[0084] The control unit 50 includes, as functional blocks, a distance detection unit 54 and a viscosity recognition unit 55. The distance detection unit 54 detects the distance Zb (see FIG. 7) between the holding table 65 and the deposition nozzle 37 in the Z-axis direction. The viscosity recognition unit 55 recognizes the viscosity of the small amount of liquid resin 4 using the distance detected by the distance detection unit 54 when the detection unit 53 detects adhesion of the small amount of liquid resin 4 to the holding surface 66 of the holding table 65 (strictly speaking, the underside of the sheet 2). The greater the distance between the holding table 65 and the deposition nozzle 37 when adhesion of the small amount of liquid resin 4 is detected, the greater the height of the small amount of liquid resin 4 from the deposition nozzle 37, and the higher the viscosity of the small amount of liquid resin 4 can be considered to be.

[0085] Furthermore, as described above, after recognizing the viscosity of the small amount of liquid resin 4, the distance Zb between the holding table 65 and the adhesion nozzle 37 is narrowed (brought closer), and the detection unit 53 of the control unit 50 recognizes the amount of adhesion based on the area of ​​the adhered small amount of liquid resin 4.

[0086] A first mode for recognizing the viscosity of the small-quantity liquid resin 4 using the distance detection unit 54 and the viscosity recognition unit 55 will be described. The control unit 50 drives the motor 304 of the expansion mechanism 30 to move the holding table 65 in the vertical direction (-Z direction) at a constant speed from a state in which the holding surface 66 of the holding table 65 is spaced a predetermined distance in the Z-axis direction from the small-quantity liquid resin 4 (the state in FIG. 7).

[0087] The distance detection unit 54 counts time from the start of the uniform-speed movement of the holding table 65. Furthermore, the second camera 69 continuously captures images, and the detection unit 53 continuously detects the images based on the captured images. When the small amount of liquid resin 4 adheres to the underside of the sheet 2, the detection unit 53 detects the adhesion. Once the detection unit 53 detects the adhesion of the small amount of liquid resin 4, the distance detection unit 54 stops counting time. In other words, the distance detection unit 54 functions as a time measurement unit that measures the time from when the holding table 65 starts approaching the adhesion nozzle 37 at a uniform speed until the detection unit 53 detects the small amount of liquid resin 4 adhered to the holding surface 66 (sheet 2). The distance detection unit 54 detects the distance Zb between the holding table 65 and the adhesion nozzle 37 at the time when the small amount of liquid resin 4 adheres to the sheet 2, based on the uniform-speed movement of the holding table 65 and the time until the adhesion of the small amount of liquid resin 4 is detected.

[0088] The memory unit 51 of the control unit 50 stores a first data table indicating the relationship between the time until the detection unit 53 detects the small amount of liquid resin 4 and the viscosity of the liquid resin 3. The viscosity recognition unit 55 refers to the first data table and recognizes the viscosity of the small amount of liquid resin 4 during the time (the time measured by the distance detection unit 54) from when the holding table 65 starts to approach the adhesion nozzle 37 until the adhesion of the small amount of liquid resin 4 to the holding surface 66 (sheet 2) is detected.

[0089] A second embodiment will be described in which the viscosity of the small amount of liquid resin 4 is recognized using the distance detection unit 54 and the viscosity recognition unit 55. The position of the holding table 65 in the Z-axis direction can be detected from the drive amount of the motor 304 acquired by the encoder 305 in the expansion mechanism 30. The distance detection unit 54 detects the distance Zb between the holding table 65 and the adhesion nozzle 37 at the time when the small amount of liquid resin 4 adheres to the sheet 2 based on the information from the encoder 305.

[0090] The memory unit 51 of the control unit 50 stores a second data table indicating the relationship between the height of the holding table 65 in the Z-axis direction and the viscosity of the liquid resin 3. The viscosity recognition unit 55 recognizes the viscosity of the small amount of liquid resin 4 by referring to the second data table based on the height of the holding table 65 measured by the distance detection unit 54 using the encoder 305 when the small amount of liquid resin 4 adhering to the holding surface 66 (sheet 2) is detected.

[0091] As a modified form of recognizing the viscosity of the small amount of liquid resin 4 by referring to the second data table, instead of detecting the height position of the holding table 65 using the encoder 305, a distance sensor may be separately provided to measure the distance Zb between the holding table 65 and the adhesion nozzle 37, and the detection value by the distance sensor may be input to the distance detection unit 54.

[0092] By recognizing the viscosity of the small-quantity liquid resin 4, it is possible to optimize the movement amount and movement speed of the holding table 65 according to the viscosity, thereby improving the reliability of adhesion of the small-quantity liquid resin 4 in the small-quantity liquid resin supplying process. Furthermore, based on the information on the viscosity of the small-quantity liquid resin 4, it is also possible to grasp the tendency of the viscosity of the liquid resin 3 dripped from the drip nozzle 36 and optimize the movement amount and movement speed of the holding table 65 in the expansion process.

[0093] As described above, in the protective member forming apparatus of each embodiment, the detection unit 53 detects the adhesion of a small amount of liquid resin 4 to the holding surface 27, 66 side of the holding table 25, 65 (more specifically, the wafer W held on the holding surface 27 and the sheet 2 held on the holding surface 66). After the small amount of liquid resin 4 is detected, the liquid resin 3 dispensed onto the dispensing surface 17, 62 side of the dispensing table 16, 60 begins to spread. This ensures that the small amount of liquid resin 4 is spread integrally with the dispensed liquid resin 3. In other words, this prevents the liquid resin 3 from expanding while leaving a central depression 5, which would otherwise cause air bubbles. Curing liquid resin 3 containing air bubbles would require the protective member 1 to be reformed. Therefore, detecting the small amount of liquid resin 4 prior to the spreading and curing of the liquid resin 3 prevents wasteful consumption of the liquid resin 3.

[0094] The small amount of liquid resin 4 is detected using images captured by the first camera 44 and the second camera 69, so detection can be performed efficiently without the need for complex operations or long waiting times. As described above, the first camera 44 and the second camera 69 are used to detect the expansion state of the liquid resin 3 in addition to detecting the small amount of liquid resin 4, so by giving these cameras multiple functions, it is possible to achieve effects with a simple structure that has a small number of parts.

[0095] In each embodiment, the protective member 1 is formed using the cured liquid resin 3 and the sheet 2. However, it is also possible to form the protective member 1 using only the cured liquid resin 3 without using the sheet 2. For example, as a modification of the first embodiment, it is possible to drip the liquid resin 3 directly onto the dripping surface 17 of the dripping table 16 from the dripping nozzle 36 without supplying the sheet 2 to the dripping surface 17. In this case, the dripping table 16 can be provided without the structure for suction-holding the sheet 2 (suction holes 164, suction source 24). As a modification of the second embodiment, it is possible to deposit a small amount of liquid resin 4 directly onto the holding surface 66 of the holding table 65 from the deposition nozzle 37 without supplying the sheet 2 to the holding surface 66. In this case, it is possible to deposit the small amount of liquid resin 4 from the deposition nozzle 37 directly onto the holding surface 66 of the holding table 65. In this case, it is possible to deposit the structure for suction-holding the sheet 2 from the holding table 65 (suction holes 654, suction source 67).

[0096] The embodiments of the present invention are not limited to the above-described embodiments and modifications, and may be variously changed, substituted, or modified without departing from the spirit of the technical idea of ​​the present invention. Furthermore, if the technical idea of ​​the present invention can be realized in a different way due to technological advances or other derived technologies, it may be implemented using that method. Therefore, the claims cover all embodiments that may fall within the scope of the technical idea of ​​the present invention. [Industrial Applicability]

[0097] As described above, the protective member forming device of the present invention can form a protective member of uniform thickness by detecting the adhesion of a small amount of liquid resin to the holding surface side of the holding table and then spreading the liquid resin on the dripping surface side of the dripping table, thereby improving the processing accuracy of grinding processes and other processes performed on wafers with the protective member formed. [Explanation of symbols]

[0098] 1: Protective material 2: Sheet 3: Liquid resin 4: A small amount of liquid resin 10: Protective member forming device 16:Drip table 161: Holding plate (glass plate) 17:Dripping surface 18: Hardening unit 20: Sheet supply mechanism 25: Holding table 27: Holding surface 30: Expansion mechanism 304: Motor 305: Encoder 32: Load sensor 35: Liquid resin supply mechanism 36: Dripping nozzle 361:Discharge port 37: Adhesion nozzle 371:Discharge port 44: First camera 50: Control unit 51: Storage section 52: Image processing section 53: Detection unit 54: Distance detection unit 55: Viscosity recognition section 60:Drip table 62:Dripping surface 65: Holding table 651: Holding plate (glass plate) 66: Holding surface 68: Hardening unit 69: Second camera 70: Image capture W: wafer Wa: One side Wb: the other side

Claims

1. A protective member forming apparatus that spreads a liquid resin over the entire surface of one side of a wafer and then hardens it to form a protective member made of resin, a drip table having a drip surface for dripping liquid resin; a dripping nozzle for dripping the liquid resin onto the dripping table; a holding table having a holding surface facing an upper side of the dripping surface of the dripping table; an attachment nozzle that attaches a small amount of liquid resin to the holding surface; an expansion mechanism that moves the holding table in a vertical direction to expand the small amount of liquid resin into the liquid resin; a curing unit for curing the liquid resin; and a detection unit that detects the small amount of liquid resin.

2. The dropping table is made of a glass plate, a first camera disposed below the dripping surface of the dripping table for capturing an image of the holding surface; The protective member forming device according to claim 1 , wherein the detecting section detects by an image captured by the first camera.

3. The holding table is made of a glass plate, a second camera disposed above the holding surface of the holding table and configured to capture an image of the holding surface; The protective member forming apparatus according to claim 1 , wherein the detecting section detects by an image captured by the second camera.

4. a distance detection unit that detects the distance between the attachment nozzle and the holding table; The protective member forming device according to claim 3, further comprising a viscosity recognition unit that recognizes the viscosity of the small amount of liquid resin using the distance detected by the distance detection unit when the detection unit detects the adhesion of the small amount of liquid resin to the holding surface.

Images