Contact probe and semiconductor inspection device

Abstract

To provide a contact probe that can be slimmed, and a semiconductor inspection device using the contact probe.SOLUTION: A contact probe according to the present disclosure includes: a plunger having a first rotation mechanism portion with a needle-shaped pin at one end and a first inclination at the other end opposite to the one end; a sleeve that has a tubular shape, accommodates the plunger inside, and has a second rotation mechanism portion that is provided with a stopper at one end that prevents a portion of the plunger other than the pin from protruding outward, and provided with a second inclination at the other end opposite to the one end; and a spring provided inside the sleeve between the first rotation mechanism portion and the second rotation mechanism portion. When the plunger moves inside the sleeve from the one end toward the other end, the first inclination of the first rotation mechanism portion slides along the second inclination of the second rotation mechanism portion, so that the first rotation mechanism portion and the second rotation mechanism portion engage with each other, and the pin rotates in conjunction with the sliding motion.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to a contact probe and a semiconductor inspection device that uses the contact probe to inspect the characteristics of a semiconductor module. [Background technology]

[0002] When inspecting the characteristics of a semiconductor module having terminals (external electrodes) such as main electrode terminals and control electrode terminals, electrical continuity is ensured by connecting the terminals of the semiconductor module to a measuring instrument via contact probes.

[0003] If foreign matter such as an insulator or oxide film is present in the area where the contact probe comes into contact with the terminal of the semiconductor module, poor contact may occur, making it impossible to measure, and the actual product characteristics may not be able to be properly inspected.

[0004] To address this issue, a conventional method involves pressing a plunger against the sample to destroy the oxide film. Another technique has been disclosed in which a convex guide is provided on one side of the plunger and a guide groove on the other side of the sleeve, and the plunger rotates and slides along the guide during contact, thereby removing foreign matter with the plunger tip and improving contact performance (see, for example, Patent Document 1). Hereinafter, sliding while rotating will also be referred to as "rotary sliding." [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Utility Model Application Publication No. 4-102472 Summary of the Invention [Problem to be solved by the invention]

[0006] In the past, contact probes that rotate and slide in order to improve the contact performance described above typically had a rotation mechanism attached to the side of the contact probe, as in Patent Document 1. However, in order to cut out a guide groove in the sleeve, the sleeve itself had to be strong. Also, since a convex guide protrudes from the side of the plunger, the overall width of the contact probe increases. Meanwhile, in small semiconductor modules, the pitch between terminals is narrow due to the product structure, so there is a demand for slimmer contact probes (reduced width).

[0007] The present disclosure has been made to solve such problems, and aims to provide a contact probe that can be made slimmer, and a semiconductor inspection device that uses the contact probe to inspect the characteristics of semiconductor modules. [Means for solving the problem]

[0008] In order to solve the above problems, the contact probe disclosed herein comprises: a plunger having a needle-shaped pin at one end and a first rotation mechanism having a first inclination at the other end opposite the one end; a cylindrical sleeve that houses the plunger, has a stopper at one end that prevents anything other than the plunger pin from flying out, and has a second rotation mechanism having a second inclination at the other end opposite the one end; and a spring provided inside the sleeve between the first rotation mechanism and the second rotation mechanism; when the plunger moves from one end to the other end inside the sleeve, the first inclination of the first rotation mechanism slides along the second inclination of the second rotation mechanism, engaging the first rotation mechanism and the second rotation mechanism, and the pin rotates in conjunction with the sliding. [Effects of the Invention]

[0009] According to the present disclosure, it is possible to achieve slimmer contact probes. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a schematic diagram showing a configuration of a contact probe according to a first embodiment. FIG. [Figure 2] 3 is a schematic diagram showing a state in which the contact probe according to the first embodiment is brought into contact with a terminal of the semiconductor module. FIG. [Figure 3] 5A and 5B are schematic diagrams showing the rotational sliding operation of the plunger inside the sleeve according to the first embodiment. [Figure 4] 5A to 5C are schematic diagrams illustrating the operation of a plunger rotation mechanism and a sleeve rotation mechanism according to the first embodiment. [Figure 5] FIG. 10 is a schematic diagram showing the configuration of a contact probe according to a second embodiment. [Figure 6] 10 is a schematic view showing a recessed groove guide of a plunger according to a second embodiment. FIG. [Figure 7] 10 is a schematic view showing a convex groove guide of a sleeve according to a second embodiment. FIG. [Figure 8] 10 is a schematic diagram showing the external shape of a contact probe according to a third embodiment. FIG. [Figure 9] 10 is a schematic diagram showing the configuration of a contact probe and a holding section of a semiconductor inspection device according to a third embodiment. FIG. [Figure 10] 10 is a schematic view showing a plunger rotation mechanism and a sleeve rotation mechanism according to a fourth embodiment. FIG. [Figure 11] 10 is a schematic diagram showing an end structure of a plunger and an end structure of a sleeve according to a fourth embodiment. FIG. [Figure 12] 13 is a schematic diagram showing the external shape of a contact probe according to a fifth embodiment. FIG. [Figure 13] FIG. 10 is a schematic view showing the configuration of the tip of a plunger according to a fifth embodiment. [Figure 14] 13 is a schematic diagram showing scratches caused by a plunger on the surface of a terminal of a semiconductor module according to a fifth embodiment. FIG. [Figure 15] 13 is a schematic view showing a plunger rotation mechanism and a sleeve rotation mechanism according to a sixth embodiment. FIG. [Figure 16]13 is a diagram for explaining the design of the rotation angle of the plunger according to the sixth embodiment. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0011] <First Embodiment> <Configuration> FIG. 1 is a schematic diagram showing the configuration of contact probe 4 according to embodiment 1. In FIG. 1, a portion of sleeve 2 is shown in a see-through manner to show the internal configuration of contact probe 4. Contact probe 4 is provided in a semiconductor inspection device (not shown) that inspects the characteristics of semiconductor modules. The semiconductor inspection device includes contact probe 4 and a stage (not shown) on which a semiconductor module (see FIG. 2) having terminals 10 is placed.

[0012] The contact probe 4 includes a plunger 1, a sleeve 2, and a spring 3. The plunger 1, the sleeve 2, and the spring 3 are made of metal that is electrically conductive.

[0013] The plunger 1 has a needle-shaped pin 5 at one end and a rotation mechanism 6 (first rotation mechanism) having a protrusion structure including a slope (first slope) at the other end opposite the one end. The pin 5 comes into physical contact with a contact object (terminal 10 of the semiconductor module shown in FIG. 2) during a characteristic inspection of the semiconductor module.

[0014] The sleeve 2 is cylindrical and hollow, and houses the plunger 1 therein. A stopper 7 is provided at one end, and a rotation mechanism 8 (second rotation mechanism) having a protruding structure including a slope (second slope) is provided at the other end opposite the one end. The stopper 7 prevents anything other than the pin 5 from jumping out when the plunger 1 slides.

[0015] The rotation mechanism 6 of the plunger 1 and the rotation mechanism 8 of the sleeve 2 are shaped to fit together.

[0016] The spring 3 is provided inside the sleeve 2 between a rotation mechanism 6 provided on the plunger 1 and a rotation mechanism 8 provided on the sleeve 2. The plunger 1 and the sleeve 2 each have a connection 9 at their center. One end of the spring 3 is connected to the connection 9 of the plunger 1, and the other end of the spring 3 is connected to the connection 9 of the sleeve 2. This allows electrical conduction between the plunger 1 and the sleeve 2 via the spring 3.

[0017] <Action and effect> Fig. 2 is a schematic diagram showing how contact probe 4 according to embodiment 1 is brought into contact with terminal 10 of a semiconductor module. Fig. 3 is a schematic diagram showing the rotational sliding operation of plunger 1 inside sleeve 2 according to embodiment 1. Fig. 4 is a schematic diagram showing the operation of rotation mechanism 6 of plunger 1 and rotation mechanism 8 of sleeve 2 according to embodiment 1.

[0018] As shown in FIG. 2, during a characteristic inspection of a semiconductor module, contact probe 4 is lowered to bring pin 5 of plunger 1 into contact with terminal 10 of the semiconductor module. When contact probe 4 is then further lowered, plunger 1 receives a reaction force from terminal 10 and rises along the inner surface of sleeve 2 as shown in FIG. 3. Then, as shown in FIGS. 3 and 4, at the end of sleeve 2 (the end facing stopper 7), the protrusion structure of rotation mechanism 6 of plunger 1 interferes with the protrusion structure of rotation mechanism 8 of sleeve 2, with the protrusion structure of rotation mechanism 8 acting as a guide, and the inclination of the protrusion structure of rotation mechanism 6 slides along the inclination of the protrusion structure of rotation mechanism 8, thereby engaging rotation mechanism 6 and rotation mechanism 8. When the inclination of the protrusion structure of rotation mechanism 6 slides along the inclination of the protrusion structure of rotation mechanism 8, plunger 1 rotates in conjunction with the sliding, and pin 5 of plunger 1 comes into contact with terminal 10 of the semiconductor module while scraping off foreign matter present on the surface of terminal 10, thereby ensuring electrical continuity.

[0019] When the contact probe 4 is raised after the characteristic inspection of the semiconductor module is completed, the elastic force (spring moment force) of the spring 3 releases the rotation mechanism 6 of the plunger 1 from the rotation mechanism 8 of the sleeve 2. At this time, the plunger 1 rotates and returns to its original position (the position before the characteristic inspection began).

[0020] During the characteristic inspection of the semiconductor module, the pin 5 of the plunger 1 is rotated and brought into contact with the terminal 10 of the semiconductor module, thereby physically removing foreign matter present on the terminal 10 that may cause defects during the characteristic inspection, thereby reducing the impact on the characteristic inspection, such as poor contact.

[0021] Furthermore, by providing the rotation mechanisms 6 and 8 on the extension of the sliding motion of the plunger 1, it is not necessary to provide a rotation mechanism on the side of the contact probe as in Patent Document 1 (there is no need to provide a component that affects the overall width dimension of the contact probe). Therefore, as long as the diameter required to maintain the required strength is met based on the physical properties of the plunger 1 and sleeve 2, it is possible to design a slim contact probe 4 with as small a width dimension as possible.

[0022] <Embodiment 2> <Configuration> Fig. 5 is a schematic diagram showing the configuration of contact probe 4 according to embodiment 2. Fig. 6 is a schematic diagram showing concave groove guide 11 of plunger 1 according to embodiment 2. Fig. 7 is a schematic diagram showing convex groove guide 12 of sleeve 2 according to embodiment 2. In Figs. 5 and 7, a portion of sleeve 2 is shown in a see-through manner to show the internal configuration of contact probe 4.

[0023] Contact probe 4 according to embodiment 2 is characterized in that, instead of rotation mechanism 6 and rotation mechanism 8 described in embodiment 1, it is provided with concave groove guide 11 provided in plunger 1 and convex groove guide 12 provided in sleeve 2. Other configurations and materials are the same as those of embodiment 1, so detailed description will be omitted here.

[0024] The plunger 1 is provided with a groove guide 11 having a slope (third slope) on the side surface (see FIG. 6).

[0025] The sleeve 2 is provided with a convex groove guide 12 having a slope (fourth slope) on the inner surface (see FIG. 7).

[0026] The concave groove guide 11 of the plunger 1 and the convex groove guide 12 of the sleeve 2 are shaped to fit together.

[0027] A spring 3 (not shown) is provided at the end of the sleeve 2 so as to connect the plunger 1 and the sleeve 2 together.

[0028] <Action and effect> When the contact probe 4 is raised after the characteristic inspection of the semiconductor module is completed, the plunger 1 is no longer subjected to the reaction force from the terminal 10 and is returned to its original position by the elastic force of the spring 3 (see Figure 5). At this time, the inclination of the concave groove guide 11 of the plunger 1 slides along the inclination of the convex groove guide 12 of the sleeve 2, and the concave groove guide 11 and the convex groove guide 12 fit together. When the inclination of the concave groove guide 11 of the plunger 1 slides along the inclination of the convex groove guide 12 of the sleeve 2, the plunger 1 rotates in conjunction with this sliding. Because the concave groove guide 11 fits together with the convex groove guide 12, the plunger 1 returns to a fixed rotation angle each time.

[0029] In contact probe 4 according to embodiment 1, plunger 1 is returned to its original rotation angle by the elastic force of spring 3 after the semiconductor module characteristic inspection is completed, but it is not good at returning it to the same position with high precision every time. On the other hand, in contact probe 4 according to embodiment 2, by designing the angle and distance of concave groove guide 11 and convex groove guide 12, it is possible to set a fixed rotation angle at the end position of the sliding of plunger 1. Therefore, during the characteristic inspection of the semiconductor module, it is possible to keep constant the amount of contact with terminal 10 of the semiconductor module due to the rotation of plunger 1, thereby reducing variation in inspection characteristics.

[0030] <Third Embodiment> <Configuration> Fig. 8 is a schematic diagram showing the outer shape of contact probe 4 according to embodiment 3. Fig. 9 is a schematic diagram showing the configuration of contact probe 4 according to embodiment 3 and holding section 14 of a semiconductor inspection device.

[0031] Contact probe 4 according to the third embodiment is characterized by including press-fit portion 13. Other configurations and materials are the same as those of the first embodiment, so detailed description will be omitted here.

[0032] The sleeve 2 is provided with a press-fit portion 13 made of a square pillar or an elliptical pillar on the outer side of the terminal end (see FIG. 8).

[0033] As shown in Figure 9, the holding portion 14 of the semiconductor inspection device is provided with a recess having the same shape as the press-fit portion 13. The holding portion 14 is made of an insulating material such as acrylic. The press-fit portion 13 of the sleeve 2 is press-fitted into the recess of the holding portion 14. This allows the contact probe 4 to be attached to the holding portion 14 of the semiconductor inspection device.

[0034] <Action and effect> By forming the press-fit portion 13 of the sleeve 2, which is press-fit into the holding portion 14 of the semiconductor inspection device, in the shape of a rectangular or elliptical cylinder, it is possible to prevent the sleeve 2 from spinning freely due to the effect of the rotational force generated when the rotation mechanism 6 and the rotation mechanism 8 are fitted together when the plunger 1 comes into contact with the terminal 10 of the semiconductor module, and to efficiently transmit the rotational force only to the plunger 1 without wasting it elsewhere. Therefore, during the characteristic inspection of the semiconductor module, it is possible to keep constant the amount of contact with the terminal 10 of the semiconductor module due to the rotation of the plunger 1, thereby reducing variations in the inspection characteristics.

[0035] Although the above description has been given of the case where the third embodiment is applied to the first embodiment, the third embodiment may also be applied to the second embodiment.

[0036] <Fourth Embodiment> <Configuration> Fig. 10 is a schematic diagram showing a rotation mechanism 16 of the plunger 1 and a rotation mechanism 15 of the sleeve 2 according to the fourth embodiment. Fig. 11 is a schematic diagram showing an end structure 17 of the plunger 1 and an end structure 18 of the sleeve 2 according to the fourth embodiment.

[0037] Rotation mechanism 15 and rotation mechanism 16 are made of a ceramic material. Rotation mechanism 6 and rotation mechanism 8 described in embodiment 1 are subject to wear when they rotate and slide and fit together. On the other hand, rotation mechanism 15 and rotation mechanism 16 according to embodiment 4 are made of a ceramic material and therefore have wear resistance.

[0038] The plunger 1 has an end structure 17 for attaching the rotation mechanism 15. The end structure 17 is a convex portion made of a square pillar or an elliptical pillar, and can be press-fitted into a concave portion (first detachable portion) of the rotation mechanism 15. In other words, the rotation mechanism 15 is detachable from the plunger 1. The plunger 1 and the rotation mechanism 15 may be configured to be able to fit together, and for example, the end structure 17 may be configured as a concave portion and the rotation mechanism 15 may be configured as a convex portion. The concave portion or convex portion provided in the rotation mechanism 15 is made of a square pillar or an elliptical pillar.

[0039] The sleeve 2 has an end structure 18 for attaching the rotation mechanism 16. The end structure 18 is a protrusion made of a square prism or an elliptical cylinder, and can be press-fit into a recess (second detachable portion) of the rotation mechanism 16. In other words, the rotation mechanism 16 is detachable from the sleeve 2. Note that the sleeve 2 and the rotation mechanism 16 may be configured to be engageable with each other; for example, the end structure 18 may be configured as a recess and the rotation mechanism 16 may be configured as a protrusion. The recess or protrusion provided on the rotation mechanism 16 is made of a square prism or an elliptical cylinder.

[0040] The plunger 1 and the sleeve 2 can be electrically connected by contact with each other at their respective metallic side surfaces or via the spring 3. The other configurations and materials are the same as those in the first embodiment.

[0041] <Action and effect> The operation is the same as in the first embodiment.

[0042] In contact probe 4, in which plunger 1 rotates and slides, one cause of malfunction is breakage due to wear of operating parts. In contact probe 4 according to embodiment 2, rotation mechanism 15 and rotation mechanism 16, which are subjected to the greatest operating load, use a material such as ceramic, which is more abrasive than general metals, thereby reducing the frequency of maintenance due to breakage and contributing to a lower incidence of malfunctions.

[0043] <Fifth Embodiment> <Configuration> Fig. 12 is a schematic diagram showing the external shape of contact probe 4 according to embodiment 5. Fig. 13 is a schematic diagram showing the configuration of tip portion 19 of plunger 1 according to embodiment 5. Fig. 14 is a schematic diagram showing scratch marks of plunger 1 formed on the surface of terminal 10 of semiconductor module according to embodiment 5.

[0044] 12 and 13, a plurality of pins 5 are provided circumferentially at the tip of plunger 1. A spherical portion 20 is provided at the tip of each pin 5. The other configurations and materials are the same as those in the first embodiment.

[0045] <Action and effect> The operation is the same as in the first embodiment.

[0046] It is known that in the contact between the plunger 1 and the terminal 10 of the semiconductor module for electrical conduction, increasing the contact area through multi-point contact reduces contact resistance and improves contact reliability. However, contact probes that generally have a rotating mechanism are designed to scrape off foreign matter present on the surface of the terminal, and there are concerns that the scraped-off foreign matter may scatter inside the semiconductor inspection equipment, causing discharge problems, or that the foreign matter may clog moving parts and cause operational problems in the semiconductor inspection equipment.

[0047] In contact probe 4 according to embodiment 5, the contact area is increased by providing multiple pins 5 circumferentially on tip 19 of plunger 1. Furthermore, by providing spherical portion 20 at the tip of each pin 5, foreign matter present on terminal 10 of the semiconductor module is not scraped off, but rather the foreign matter is pressed onto terminal 10 by the scratching action of spherical portion 20, thereby preventing the scattering of foreign matter within the semiconductor inspection device.

[0048] Furthermore, the rotation angle can be designed in the rotation mechanism units 6 and 8 described in the first embodiment. Therefore, by setting the contact angle between the plunger 1 and the terminals 10 of the semiconductor module for each process of the characteristic inspection, it becomes possible to determine whether or not a characteristic inspection has been carried out from scratch marks 21 of the plunger 1 remaining on the surfaces of the terminals 10 of the semiconductor module, as shown in FIG.

[0049] Although the above description has been given of the case where the fifth embodiment is applied to the first embodiment, the fifth embodiment may be applied to any of the second to fourth embodiments.

[0050] <Sixth Embodiment> <Configuration> Fig. 15 is a schematic diagram showing a rotation mechanism 22 of the plunger 1 and a rotation mechanism 23 of the sleeve 2 according to the sixth embodiment. Fig. 16 is a diagram for explaining the design of the rotation angle of the plunger 1 according to the sixth embodiment.

[0051] Rotation mechanism 22 has four protrusion structures (four inclinations). Rotation mechanism 23 has four protrusion structures (four inclinations). Rotation mechanism 22 and rotation mechanism 23 have shapes that fit together.

[0052] The rotation mechanism unit 6 and the rotation mechanism unit 8 described in the first embodiment each have two protrusion structures (protrusion structures that divide a circle into two). On the other hand, the rotation mechanism unit 22 and the rotation mechanism unit 23 according to the sixth embodiment each have four protrusion structures (protrusion structures that divide a circle into four). Note that the number of protrusion structures that each of the rotation mechanism unit 22 and the rotation mechanism unit 23 has is not limited as long as the rotation mechanism unit 22 and the rotation mechanism unit 23 can be fitted together.

[0053] <Action and effect> The operation is the same as in the first embodiment.

[0054] The number of protrusion structures that each of rotation mechanism unit 22 and rotation mechanism unit 23 has does not need to be limited to two as in embodiment 1. In rotation mechanism unit 22 and rotation mechanism unit 23 according to embodiment 6, the optimal rotation angle 24 of plunger 1 relative to terminal 10 of the semiconductor module can be designed by changing the spacing at which the protrusion structures are arranged (see FIG. 16). This makes it possible to prevent plunger 1 from excessively scraping the surface of terminal 10 of the semiconductor module.

[0055] Although the sixth embodiment has been described above as being applied to the first embodiment, the sixth embodiment may be applied to any of the third to fifth embodiments.

[0056] Within the scope of the present disclosure, the embodiments can be freely combined, modified, or omitted as appropriate.

[0057] <Additional Notes> Various aspects of the present disclosure are summarized below as appendices.

[0058] (Appendix 1) a plunger having a needle-shaped pin at one end and a first rotation mechanism having a first inclination at the other end opposite the one end; a cylindrical sleeve that houses the plunger therein, has one end provided with a stopper that prevents parts of the plunger other than the pin from jumping out, and has the other end opposite the one end provided with a second rotation mechanism having a second inclination; a spring provided inside the sleeve between the first rotation mechanism and the second rotation mechanism; Equipped with A contact probe in which, when the plunger moves from the one end to the other end inside the sleeve, the first inclination of the first rotation mechanism slides along the second inclination of the second rotation mechanism, the first rotation mechanism and the second rotation mechanism engage with each other, and the pin rotates in conjunction with the sliding. (Appendix 2) a plunger having a needle-shaped pin at one end and a recessed groove guide having a third inclination on a side surface; a cylindrical sleeve that houses the plunger therein and has a convex groove guide with a fourth inclination on its inner surface; a spring that connects the other end of the plunger, which is opposite to the one end of the plunger, to the sleeve inside the sleeve; Equipped with A contact probe in which, when the plunger moves from the other end to the one end inside the sleeve, the third inclination of the concave groove guide slides along the fourth inclination of the convex groove guide, the concave groove guide and the convex groove guide engage with each other, and the pin rotates in conjunction with the sliding. (Appendix 3) The contact probe according to claim 1, wherein a press-fit portion made of a square prism or an elliptical cylinder is provided on the outside of the other end of the sleeve. (Appendix 4) The contact probe according to Appendix 2, wherein a press-fit portion made of a square prism or an elliptical cylinder is provided on the outside of the end of the sleeve opposite the other end of the plunger. (Appendix 5) the first rotation mechanism and the second rotation mechanism are made of a ceramic material, the first rotation mechanism has a first detachable part that is detachable from the plunger, the second rotation mechanism has a second detachable part that is detachable from the sleeve, the first detachable portion is a recessed or protruding portion formed of a rectangular or elliptical cylinder that can be fitted with the plunger, The contact probe according to claim 1, wherein the second detachable portion is a recessed or protruding portion formed of a square prism or an elliptical prism that can be fitted with the sleeve. (Appendix 6) a plurality of pins are provided circumferentially at the one end of the plunger; 2. The contact probe according to claim 1, wherein a spherical portion having a spherical shape is provided at the tip of each of the pins. (Appendix 7) a plurality of pins are provided circumferentially at the one end of the plunger; 3. The contact probe according to claim 2, wherein a spherical portion having a spherical shape is provided at the tip of each of the pins. (Appendix 8) the first rotation mechanism has a plurality of the first inclinations, The contact probe according to claim 1, wherein the second rotation mechanism has a plurality of the second inclinations. (Appendix 9) A contact probe according to any one of appendices 1 to 8; a stage on which a semiconductor module having terminals is placed; A semiconductor inspection device comprising: [Explanation of symbols]

[0059] 1 plunger, 2 sleeve, 3 spring, 4 contact probe, 5 pin, 6 rotation mechanism part, 7 stopper, 8 rotation mechanism part, 9 connection part, 10 terminal, 11 concave groove guide, 12 convex groove guide, 13 press-fit part, 14 holding part, 15 rotation mechanism part, 16 rotation mechanism part, 17 termination structure, 18 termination structure, 19 tip part, 20 spherical part, 21 scratch mark, 22 rotation mechanism part, 23 rotation mechanism part, 24 rotation angle.

Claims

1. a plunger having a needle-shaped pin at one end and a first rotation mechanism having a first inclination at the other end opposite to the one end; a cylindrical sleeve that houses the plunger therein, has one end provided with a stopper that prevents parts of the plunger other than the pin from jumping out, and has another end opposite the one end provided with a second rotation mechanism having a second inclination; a spring provided inside the sleeve between the first rotation mechanism and the second rotation mechanism; Equipped with A contact probe in which, when the plunger moves from the one end to the other end inside the sleeve, the first inclination of the first rotation mechanism slides along the second inclination of the second rotation mechanism, the first rotation mechanism and the second rotation mechanism engage with each other, and the pin rotates in conjunction with the sliding.

2. a plunger having a needle-shaped pin at one end and a recessed groove guide having a third inclination on a side surface; a cylindrical sleeve that houses the plunger therein and has a convex groove guide with a fourth inclination on its inner surface; a spring that connects the other end of the plunger, which is opposite to the one end of the plunger, to the sleeve inside the sleeve; Equipped with When the plunger moves from the other end to the one end inside the sleeve, the third inclination of the concave groove guide slides along the fourth inclination of the convex groove guide, the concave groove guide and the convex groove guide engage with each other, and the pin rotates in conjunction with the sliding.

3. The contact probe according to claim 1 , wherein a press-fit portion made of a square prism or an elliptical cylinder is provided on the outside of the other end of the sleeve.

4. The contact probe according to claim 2 , wherein a press-fit portion made of a square pillar or an elliptical pillar is provided on the outside of an end of the sleeve opposite the other end of the plunger.

5. the first rotation mechanism and the second rotation mechanism are made of a ceramic material, the first rotation mechanism has a first detachable part that is detachable from the plunger, the second rotation mechanism has a second detachable part that is detachable from the sleeve, the first detachable portion is a recessed portion or a protruding portion formed of a rectangular prism or an elliptical prism that can be fitted with the plunger, The contact probe according to claim 1 , wherein the second detachable portion is a recess or a protrusion formed of a square prism or an elliptical prism that can be fitted with the sleeve.

6. a plurality of pins are provided circumferentially at the one end of the plunger; The contact probe according to claim 1 , wherein each of the pins has a spherical portion at a tip thereof.

7. a plurality of pins are provided circumferentially at the one end of the plunger; The contact probe according to claim 2 , wherein each of the pins has a spherical portion at a tip thereof.

8. the first rotation mechanism has a plurality of the first inclinations, The contact probe according to claim 1 , wherein the second rotation mechanism has a plurality of the second inclinations.

9. The contact probe according to any one of claims 1 to 8; a stage on which a semiconductor module having terminals is placed; A semiconductor inspection device comprising:

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