Temperature control device

Abstract

To provide a temperature control device that can maintain the flatness and parallelism of the mounting surface with high precision over a wide temperature range, while suppressing displacement of the mounting surface due to movement.SOLUTION: A temperature control device includes a mounting portion having a mounting surface on which an object to be temperature-controlled is placed, a bottom portion facing the mounting portion in a first direction, a heat source arranged between the mounting portion and the bottom portion in the first direction and capable of heating and cooling the object to be temperature-controlled via the mounting portion, a support portion provided on the outer periphery of the bottom portion, extending toward the mounting portion in the first direction and supporting the mounting portion, a positioning member arranged between the mounting portion and the bottom portion in the first direction and positioning the center of the mounting portion and the center of the bottom portion such that the mounting portion can swing relative to the bottom portion, and an elastic support portion provided on the support portion that elastically supports the outer periphery of the mounting portion from the outside in a second direction that passes through the center of the mounting portion and intersects an axis extending in the first direction.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a temperature control device. [Background technology]

[0002] Semiconductor manufacturing equipment and inspection equipment use temperature control devices that adjust the temperature of wafers. For example, Patent Document 1 discloses an example of a temperature control device. This temperature control device includes a top plate that supports a wafer, a base plate connected to the top plate so as to form an internal space between the top plate and the base plate, and a thermoelectric module disposed in the internal space. The thermoelectric module controls the temperature of a wafer placed on the mounting surface of the top plate. Temperature control devices are required to operate over a wide temperature range. Furthermore, to maintain good wafer quality, the mounting surface on which the wafer is placed is required to have high-precision flatness and parallelism. Furthermore, it is required to suppress displacement of the mounting surface in response to movement of a stage on which the temperature control device is mounted, thereby maintaining the precision of the mounting surface. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2020-77810 A Summary of the Invention [Problem to be solved by the invention]

[0004] To achieve a wide temperature range and high accuracy of flatness and parallelism of the mounting surface, it is best to fix the mounting part only at the center and not constrain the outer periphery of the mounting part. This allows the mounting part to freely expand and contract in the direction perpendicular to the thickness direction, reducing the effects of thermal contraction. However, if the mounting part is fixed only at the center, it becomes unstable and the mounting surface may shift when moved. Furthermore, increasing the number of fixing points on the mounting part can reduce the shifting of the mounting surface when moved, but it also makes the mounting part more susceptible to the effects of thermal contraction, reducing the accuracy of flatness and parallelism of the mounting surface.

[0005] The present invention has been made to solve the above-mentioned problems, and aims to provide a temperature control device that can maintain the flatness and parallelism of the mounting surface with high precision over a wide temperature range, while suppressing misalignment of the mounting surface due to movement. [Means for solving the problem]

[0006] In order to solve the above problem, the temperature control device of the present invention comprises a mounting section having a mounting surface on which an object to be temperature-controlled is placed, a bottom section facing the mounting section in a first direction, a heat source arranged between the mounting section and the bottom section in the first direction and capable of heating and cooling the object to be temperature-controlled via the mounting section, a support section provided on the outer periphery of the bottom section, extending toward the mounting section in the first direction and supporting the mounting section, a positioning member arranged between the mounting section and the bottom section in the first direction and positioning the center of the mounting section and the center of the bottom section so that the mounting section can swing relative to the bottom section, and an elastic support section provided on the support section and elastically supporting the outer periphery of the mounting section from the outside in a second direction that passes through the center of the mounting section and intersects an axis extending in the first direction. [Effects of the Invention]

[0007] According to the present invention, it is possible to suppress displacement of the mounting surface due to movement while maintaining the flatness and parallelism of the mounting surface with high precision over a wide temperature range. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a plan view of a temperature control device according to a first embodiment of the present invention. [Figure 2] 1 is a cross-sectional view of a temperature control device according to a first embodiment of the present invention. [Figure 3] FIG. 2 is a perspective view showing an example of a positioning member according to the first embodiment of the present invention. [Figure 4] 3 is a cross-sectional view of an elastic support part according to the first embodiment of the present invention. FIG. [Figure 5]FIG. 6 is a cross-sectional view of an elastic support part according to a second embodiment of the present invention. [Figure 6] FIG. 10 is a perspective view of an elastic support part according to a second embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0009] First Embodiment (Configuration of temperature control device) A temperature control device 1 according to a first embodiment of the present invention will be described below with reference to Fig. 1 to Fig. 4. The temperature control device 1 shown in Fig. 1 controls the temperature of a semiconductor wafer (hereinafter simply referred to as wafer A) while performing film formation, exposure, etching, etc. on wafer A. Wafer A is an example of an object to be temperature controlled.

[0010] As shown in FIGS. 1 and 2, the temperature control device 1 is formed, for example, in a disk shape. For example, the temperature control device 1 is mounted on a stage 5. In the illustrated example, the stage 5 extends horizontally. The stage 5 is an XYZ stage that is freely movable in three mutually perpendicular directions. The stage 5 can move vertically and horizontally while maintaining its horizontal orientation. The vertical and horizontal movements of the stage 5 are controlled, for example, by an external control device (not shown). The stage 5 moves at high speed with the temperature control device 1 mounted on it. As a result, the wafer A placed on the temperature control device 1 moves to a measurement device (not shown). The measurement device, for example, probes and measures devices on the wafer A. To achieve reproducible probing, the position of the wafer A needs to be controlled with high precision.

[0011] The temperature control device 1 includes a top plate 10 (mounting portion), a bottom plate 20 (bottom portion), a Peltier module 2 (heat source), a cooling plate 3, a support portion 30, a positioning member 40, and an elastic support portion 60.

[0012] (top plate) The top plate 10 has a mounting surface 11 on which a wafer A is placed. The top plate 10 is a disk-shaped member made of a heat transfer material and has a uniform thickness. Hereinafter, the axis of the top plate 10 will be simply referred to as axis O. This axis O passes through the center C1 of the top plate 10 and extends linearly in the thickness direction of the top plate 10. Furthermore, the radial direction of this axis O will be simply referred to as the "radial direction," and the circumferential direction of this axis O will be simply referred to as the "circumferential direction." The radial direction is perpendicular to the direction of the axis O. The direction of the axis O is an example of a first direction. The radial direction is a direction that intersects with the axis O. In other words, the radial direction is an example of a second direction. In the following, an example will be described in which the top plate 10 is disposed along a horizontal plane and the axis O of the top plate 10 extends vertically.

[0013] The above-described top plate 10 expands and contracts under the influence of heat from the Peltier module 2 (described later). For example, the top plate 10 expands in the radial direction at high temperatures, and contracts in the radial direction at low temperatures.

[0014] (bottom plate) The bottom plate 20 is disposed at a position opposite to the top plate 10 in the direction of the axis O. The bottom plate 20 is formed in a circular plate shape with the axis O as its central axis. The bottom plate 20 is formed to have approximately the same diameter as the top plate 10. In addition, a pin 23 that protrudes toward the top plate 10 in the direction of the axis O is provided on an outer periphery 22 of the bottom plate 20.

[0015] The bottom plate 20 has a mounting surface 21 on the opposite side to the top plate 10 in the direction of the axis O. The mounting surface 21 extends parallel to the placement surface 11. The bottom plate 20 is mounted on the stage 5 at this mounting surface 21.

[0016] (Peltier module) The Peltier module 2 is disposed between the top plate 10 and the bottom plate 20 in the direction of the axis O. The Peltier module 2 is capable of heating and cooling the wafer A via the top plate 10. The Peltier module 2 is disposed in the shape of an annular plate with the axis O as its central axis.

[0017] (Cooling plate) The cooling plate 3 is disposed between the Peltier module 2 and the bottom plate 20 in the direction of the axis O, and exchanges heat with the Peltier module 2. This cools the Peltier module 2. The cooling plate 3 is formed in the shape of an annular plate with the axis O as its central axis. Note that a flow path through which a refrigerant flows may be formed within the cooling plate 3. In this case, heat is exchanged between the refrigerant flowing through this flow path and the Peltier module 2, thereby cooling the Peltier module 2. The cooling plate 3 is placed on pins 23 provided on the bottom plate 20. The cooling plate 3 is supported from below by the pins 23.

[0018] (Support part) The support portion 30 is provided on the outer peripheral portion 22 radially outside of the bottom plate 20. The support portion 30 extends from the bottom plate 20 toward the top plate 10 in the direction of the axis O. The end of the support portion 30 on the top plate 10 side in the direction of the axis O is in contact with the top plate 10. The support portion 30 supports the top plate 10. In other words, the top plate 10 is placed on the support portion 30.

[0019] The support portion 30 of this embodiment includes a sidewall 31 and a block 32. The sidewall 31 is formed in a cylindrical shape extending in the axial direction O along the outer peripheral edge 22a of the bottom plate 20. The sidewall 31 radially covers the Peltier module 2, the cooling plate 3, the pins 23, and a positioning member 40 (described later) from the outside. The sidewall 31 is integrally formed with the bottom plate 20. Alternatively, the sidewall 31 may be formed separately from the bottom plate 20 and fixed to the bottom plate 20 by a fixing member (not shown). The block 32 is provided at the end of the sidewall 31 on the top plate 10 side in the axial direction O. For example, only one block 32 may be provided and formed in an annular shape as viewed from the axial direction O. Alternatively, multiple blocks 32 may be provided at intervals in the circumferential direction. The arrangement, shape, and number of the blocks 32 can be changed as appropriate. The top plate 10 is placed on the block 32. The block 32 is formed separately from the side wall 31 and is fixed to the side wall 31 by a fixing member (not shown). Note that the block 32 may be formed integrally with the side wall 31.

[0020] (positioning member) As shown in FIG. 2, the positioning member 40 is disposed between the top plate 10 and the bottom plate 20 in the direction of the axis O. The positioning member 40 positions the center C1 of the top plate 10 and the center C2 of the bottom plate 20. The positioning member 40 causes the center C1 of the top plate 10 and the center C2 of the bottom plate 20 to be disposed on the same axis O. In other words, the positioning member 40 centers the top plate 10 and the bottom plate 20. As shown in FIGS. 2 and 3, the positioning member 40 includes a first positioning portion 41, a second positioning portion 42, and a fitting portion 50.

[0021] (First positioning part) The first positioning portion 41 is provided at the center C1 of the top plate 10. The first positioning portion 41 protrudes from the surface of the top plate 10 opposite the mounting surface 11 in the direction of the axis O toward the bottom plate 20 in the direction of the axis O. The first positioning portion 41 is formed separately from the top plate 10 and is fixed to the top plate 10 by a fixing member (not shown) such as a bolt. The first positioning portion 41 may also be formed integrally with the top plate 10. The first positioning portion 41 of this embodiment is formed in a cylindrical shape with the axis O as its central axis.

[0022] (Second positioning part) The second positioning portion 42 is provided at the center C2 of the bottom plate 20. The second positioning portion 42 faces the first positioning portion 41 in the direction of the axis O. The second positioning portion 42 protrudes toward the top plate 10 in the direction of the axis O from the surface of the bottom plate 20 opposite the mounting surface 21 in the direction of the axis O. The second positioning portion 42 is formed separately from the bottom plate 20 and is fixed to the bottom plate 20 by a fixing member (not shown) such as a bolt. The second positioning portion 42 may also be formed integrally with the bottom plate 20. The second positioning portion 42 in this embodiment is formed in a cylindrical shape with the axis O as its central axis.

[0023] The end face 42a (upper end face) of the second positioning portion 42 in the axis O direction is arranged with a small gap in the axis O direction relative to the end face 41a (lower end face) of the first positioning portion 41 in the axis O direction.

[0024] (Fitting part) The fitting portion 50 fits the first positioning portion 41 and the second positioning portion 42. The fitting portion 50 includes a fitting groove 51 and a fitting protrusion 52.

[0025] (Mating groove) The fitting groove 51 is provided in the first positioning portion 41. The fitting groove 51 is recessed toward the top plate 10 in the direction of the axis O. The fitting groove 51 opens toward the second positioning portion 42 in the direction of the axis O. The fitting groove 51 has a bottom surface 51a and a side surface 51b. The bottom surface 51a is formed in a circular shape. The side surface 51b extends from the outer peripheral edge of the bottom surface 51a toward the second positioning portion 42 in the direction of the axis O. In this embodiment, the side surface 51b extends parallel to the axis O.

[0026] (Mating protrusion) The fitting protrusion 52 is provided on the second positioning portion 42. The fitting protrusion 52 protrudes toward the fitting groove 51 in the direction of the axis O. The fitting protrusion 52 is fitted into the fitting groove 51. The fitting protrusion 52 is formed integrally with the second positioning portion 42. Note that the fitting protrusion 52 may be formed separately from the second positioning portion 42 and fixed to the second positioning portion 42 by a fixing member (not shown). The fitting protrusion 52 has a tapered portion 55.

[0027] (Tapered part) The tapered portion 55 is formed, for example, on the end surface 42a (upper end surface) of the second positioning portion 42 in the axis O direction. The tapered portion 55 extends along the axis O and is formed in a tapered shape that reduces in diameter as it approaches the bottom surface 51a of the fitting groove 51 in the axis O direction. The tapered portion 55 has a tip surface 55a and a tapered surface 55b. The tip surface 55a is the surface of the outer surface of the tapered portion 55 that faces the bottom surface 51a of the fitting groove 51 in the axis O direction. The tip surface 55a is a flat surface that extends in the radial direction. The tip surface 55a is formed in a circular shape with the axis O as its central axis. The tapered surface 55b is a surface that connects the outer periphery of the maximum width portion 56 and the outer periphery of the tip surface 55a. The tapered surface 55b faces radially outward and is curved so as to approach the radially inward direction as it approaches the bottom surface 51a of the fitting groove 51 in the axis O direction.

[0028] The fitting protrusion 52 is fitted into the fitting groove 51 by a clearance fit. That is, the fitting protrusion 52 is fitted into the fitting groove 51 with a small gap therebetween. The tapered surface 55b of the fitting protrusion 52 may be in contact (line contact) with the side surface 51b of the fitting groove 51.

[0029] Furthermore, the tapered portion 55 described above can minimize contact between the fitting protrusion 52 and the fitting groove 51 even if the first positioning portion 41 is tilted relative to the second positioning portion 42. This configuration absorbs any misalignment of the top plate 10 relative to the bottom plate 20. Therefore, the positioning member 40 can position the center C1 of the top plate 10 and the center C2 of the bottom plate 20 by using the fitting portion 50, allowing the top plate 10 to swing relative to the bottom plate 20.

[0030] (elastic support part) The elastic support portions 60 elastically support the outer peripheral portion 10a of the top plate 10 from the outside in the radial direction. A plurality of elastic support portions 60 (four in the illustrated example) are provided so as to surround the mounting portion when viewed in the direction of the axis O. The number of elastic support portions 60 can be changed as appropriate. The four elastic support portions 60 are arranged at equal intervals in the circumferential direction. Two of the four elastic support portions 60 are arranged opposite each other in the radial direction. The remaining two elastic support portions 60 are also arranged opposite each other in the radial direction. Each elastic support portion 60 is provided on the support portion 30. The elastic support portion 60 in this embodiment includes an O-ring 61, a bracket 62, a bushing 63, a bolt 64, and a washer 65.

[0031] (O-ring) The O-ring 61 is disposed on the outer circumferential side (radial outer side) of the top plate 10. The central axis O1 of the O-ring 61 extends in the radial direction.

[0032] (bracket) The bracket 62 is disposed further outward from the O-ring 61. The bracket 62 has an attachment piece 62a, a connection piece 62b, and a pressing piece 62c. The attachment piece 62a is attached to the support portion 30. The attachment piece 62a is fixed to the support portion 30 by a fixing member 66 such as a bolt. In the illustrated example, two fixing members 66 are provided side by side in the direction of the axis O. The attachment piece 62a extends along the support portion 30 in the direction of the axis O toward the top plate 10. The connection piece 62b is provided at the end of the attachment piece 62a on the top plate 10 side in the direction of the axis O. The connection piece 62b extends from the attachment piece 62a toward the top plate 10 in the direction of the axis O. The connection piece 62b is positioned radially outward as it approaches the top plate 10. The connection piece 62b connects the attachment piece 62a and the pressing piece 62c. The pressing piece 62c is provided at the end of the connecting piece 62b on the top plate 10 side in the direction of the axis O. The pressing piece 62c radially sandwiches the O-ring 61 together with the top plate 10. The pressing piece 62c presses the O-ring 61 against the outer circumferential portion 10a of the top plate 10 from the radially outer side. An insertion hole 62d is formed in the pressing piece 62c, and a bolt 64 can be inserted through the insertion hole 62d. The insertion hole 62d passes through the pressing piece 62c in the radial direction.

[0033] (Bush) The bushing 63 is attached to the insertion hole 62d of the bracket 62. The bushing 63 is made of an insulating material. The bushing 63 has a cylindrical portion 63a and a flange portion 63b. The cylindrical portion 63a is inserted into the insertion hole 62d of the bracket 62. The flange portion 63b is formed on the radially outer end of the cylindrical portion 63a. The flange portion 63b protrudes from the outer peripheral surface of the cylindrical portion 63a.

[0034] (bolt) The bolt 64 has a shaft portion 64a and a head portion 64b. The shaft portion 64a is screwed into a threaded hole 12 formed in the mounting portion. The shaft portion 64a is inserted through the O-ring 61 and the insertion hole 62d of the pressing piece 62c. The outer diameter of the shaft portion 64a is smaller than the inner diameter of the cylindrical portion 63a of the bushing 63, and the shaft portion 64a is inserted through the cylindrical portion 63a with a gap therebetween. The head portion 64b is provided at the radially outer end of the shaft portion 64a. The diameter of the head portion 64b is larger than the diameter of the insertion hole 62d of the pressing piece 62c. The head portion 64b is provided so as to be able to press the bracket 62 against the O-ring 61. The amount by which the pressing piece 62c presses the O-ring 61 is adjusted by adjusting the amount by which the bolt 64 is screwed in.

[0035] (washer) The washer 65 is inserted onto the shaft portion 64 a of the bolt 64 and is disposed between the head portion 64 b of the bolt 64 and the flange portion 63 b of the bushing 63 .

[0036] <Effects> The temperature control device 1 of the above-described embodiment can achieve the following effects. In this embodiment, the temperature control device 1 includes a top plate 10, a bottom plate 20, a Peltier module 2, a support portion 30, a positioning member 40, and an elastic support portion 60. The top plate 10 has a mounting surface 11. A wafer A is mounted on the mounting surface 11. The bottom plate 20 faces the top plate 10 in the direction of the axis O. The Peltier module 2 is disposed between the top plate 10 and the bottom plate 20 in the direction of the axis O. The Peltier module 2 is a device capable of heating and cooling the wafer A via the top plate 10. The support portion 30 is provided on the outer periphery 22 of the bottom plate 20. The support portion 30 extends toward the top plate 10 in the direction of the axis O. The support portion 30 supports the top plate 10. The positioning member 40 is disposed between the top plate 10 and the bottom plate 20. The positioning member 40 positions the center C1 of the top plate 10 and the center C2 of the bottom plate 20 so that the top plate 10 can swing relative to the bottom plate 20. The elastic support part 60 is provided on the support part 30. The elastic support part 60 elastically supports the outer peripheral part 10a of the mounting part from the outside in the radial direction.

[0037] In the above configuration, the top plate 10 is positioned relative to the bottom plate 20 only at its center, and the outer periphery 10a of the top plate 10 is not constrained. Therefore, even if the temperature control device 1 controls the temperature of the wafer A over a wide temperature range and the top plate 10 undergoes large thermal expansion or contraction in the radial direction, the accuracy of the flatness and parallelism of the mounting surface 11 is not significantly reduced due to the effects of thermal expansion or contraction. Therefore, the flatness and parallelism of the mounting surface 11 are maintained with high accuracy over a wide temperature range. Furthermore, the top plate 10 is swingable relative to the bottom plate 20. This allows for the offset of the top plate 10 relative to the bottom plate 20 to be absorbed. Furthermore, the outer periphery 10a of the top plate 10 is elastically supported from the radially outer side by the elastic support members 60. Therefore, even if the stage 5 moves at high speed, the force applied to the top plate 10 is absorbed by the elastic support members 60. This prevents the offset of the mounting surface 11 due to the movement.

[0038] In this embodiment, the elastic support part 60 has an O-ring 61 and a bracket 62. The O-ring 61 is disposed on the outer periphery of the top plate 10. A central axis O1 of the O-ring 61 extends in the radial direction. The bracket 62 is disposed on the outer periphery of the O-ring 61. The bracket 62 presses the O-ring 61 against the top plate 10.

[0039] This allows the elastic support portion 60 to be provided with a simple configuration that only requires the O-ring 61 and the bracket 62. This improves manufacturing efficiency and reduces manufacturing costs.

[0040] In this embodiment, the elastic support member 60 has a bolt 64. The bolt 64 has a shaft portion 64a and a head portion 64b. The shaft portion 64a is screwed into the top plate 10. The shaft portion 64a is inserted through the O-ring 61 and the bracket 62. The head portion 64b is provided at the end of the shaft portion 64a. The head portion 64b is provided so as to be able to press the bracket 62 against the O-ring 61.

[0041] This allows adjustment of the amount of screwing of the bolt 64, thereby adjusting the pressing force of the bracket 62. Therefore, the elastic support portion 60 can support the outer periphery 10a of the top plate 10 with an appropriate pressing force.

[0042] Second Embodiment (Configuration of temperature control device) A temperature control device 101 according to a second embodiment of the present invention will be described below with reference to Figures 5 and 6. Among the configurations of the second embodiment, the configurations similar to those of the first embodiment will be given the same names and symbols, and descriptions thereof will be omitted as appropriate.

[0043] In this embodiment, as shown in FIGS. 5 and 6 , the top plate 10 has a bolt 13 screwed into the outer periphery 10a of the top plate 10. The bolt 13 is screwed into a screw hole 12 in the top plate 10. A central axis O2 of the bolt 13 extends in the radial direction. The head of the bolt 13 protrudes further outward (radially outward) from the outer periphery 10a of the top plate 10. Hereinafter, this head of the bolt 13 will be referred to as a "protrusion 14." The protrusion 14 abuts against the outer periphery 10a of the top plate 10. The protrusion surface 14a of the protrusion 14 facing radially outward is formed in a spherical shape with its center on the central axis O2. Note that this protrusion surface 14a may be formed in the shape of a flat polygon, for example.

[0044] The elastic support member 160 has a leaf spring 161. The leaf spring 161 is provided on the support member 30. The leaf spring 161 presses the outer periphery 10a of the top plate 10 toward the center C1 of the top plate 10 by elastic force. The leaf spring 161 is provided on the outer periphery of the support member 30 and extends in the direction of the axis O. The leaf spring 161 has an attachment piece 161a, a connection piece 161b, and a pressing piece 161c. The attachment piece 161a is attached to the support member 30. The attachment piece 161a is fixed to the support member 30 by a fixing member 66 such as a bolt 13. In the illustrated example, two fixing members 66 are provided side by side in the direction of the axis O. The attachment piece 161a extends along the support member 30 in the direction of the axis O toward the top plate 10. The connecting piece 161b is provided at the end of the mounting piece 161a on the top plate 10 side in the direction of the axis O. The connecting piece 161b extends from the mounting piece 161a towards the top plate 10 in the direction of the axis O. The connecting piece 161b is positioned radially outward as it approaches the top plate 10 side. The connecting piece 161b connects the mounting piece 161a and the pressing piece 161c. The pressing piece 161c is provided at the end of the connecting piece 161b on the top plate 10 side in the direction of the axis O. The pressing piece 161c overlaps with the protruding portion 14 of the top plate 10 in the radial direction.

[0045] A cover portion 162 that covers the protrusion 14 from the radially outer side is formed on the pressing piece 161c of the leaf spring 161. The cover portion 162 is recessed radially outward from the leaf spring 161. The cover portion 162 is formed in a dome shape with its center on the central axis O2 of the bolt 13. An inner surface 162a of the cover portion 162 is formed in a spherical shape with its center on the central axis O2. The inner surface 162a is formed in a shape that follows the protrusion surface 14a of the protrusion 14. In this embodiment, the inner surface 162a contacts both ends of the protrusion surface 14a of the protrusion 14 in the axial direction O and both ends in the circumferential direction. The cover portion 162 has a first pressing portion 163 and a second pressing portion 164. The first pressing portion 163 presses the protrusion 14 from the side opposite the bottom plate 20 in the axial direction O. The second pressing portion 164 presses the protruding portion 14 from both sides in a direction along the outer periphery 10a of the top plate 10 (in the present embodiment, the circumferential direction).

[0046] The portion of the leaf spring 161 other than the cover portion 162 may be formed in a flat plate shape so as to extend in the axis O direction along the support portion 30.

[0047] <Effects> The temperature control device 101 of the above-described embodiment can achieve the following effects. In this embodiment, the elastic support portion 160 has a leaf spring 161. The leaf spring 161 is provided on the support portion 30. The leaf spring 161 presses the outer periphery 10a of the top plate 10 toward the center C1 of the top plate 10 by elastic force.

[0048] This allows the elastic support portion 160 to be provided with a simple configuration of just providing the leaf spring 161. This improves manufacturing efficiency and reduces manufacturing costs.

[0049] In this embodiment, the top plate 10 has a protruding portion 14 that protrudes toward the outer periphery. The leaf spring 161 has a first pressing portion 163 that presses the protruding portion 14 from the side opposite to the bottom plate 20 in the direction of the axis O, and a second pressing portion 164 that presses the protruding portion 14 from both sides in the direction along the outer periphery 10a of the top plate 10 (circumferential direction).

[0050] As a result, the temperature adjustment device 101 can absorb displacement of the top plate 10 in the direction of the axis O by the first pressing portion 163, and absorb displacement of the top plate 10 in the circumferential direction by the second pressing portion 164. Therefore, the temperature adjustment device 101 can further suppress displacement of the mounting surface 11.

[0051] In the second embodiment described above, the mounting portion has the protrusion 14, but this is not limiting. As long as the leaf spring 161 can apply an elastic force to the outer periphery 10a of the top plate 10 toward the center C1 of the top plate 10, the top plate 10 does not need to be provided with the protrusion 14. Furthermore, when the protrusion 14 is provided on the top plate 10, the protrusion 14 may be integrally formed when the top plate 10 is molded.

[0052] Furthermore, although the case has been described in which the pressing piece 161c of the leaf spring 161 has the dome-shaped cover portion 162, and the cover portion 162 presses the protrusion 14 of the top plate 10, the present invention is not limited to this. For example, the first pressing portion 163 may be formed by bending the upper portion of the pressing piece 161c toward the bottom plate 20, and the second pressing portion 164 may be formed by bending both circumferential end portions of the pressing piece 161c so as to approach each other in the circumferential direction.

[0053] (Other embodiments) The above describes an embodiment of the present invention with reference to the drawings, but the specific configuration is not limited to this embodiment, and design changes and the like are also included within the scope that does not deviate from the gist of the present invention. The temperature control devices 1 and 101 may be used in, for example, semiconductor manufacturing equipment or semiconductor inspection equipment.

[0054] In the above embodiment, the temperature control object is the wafer A, but the present invention is not limited to this. That is, the temperature control devices 1 and 101 may be used to control the temperature of a temperature control object other than the wafer A.

[0055] In the above embodiment, the temperature control devices 1 and 101 are described as being formed in a disk shape, but this is not limiting. For example, the temperature control devices 1 and 101 may be formed in a polygonal disk shape.

[0056] In the above embodiment, the elastic support members 60, 160 apply a pressing force to the outer periphery of the top plate 10 inward in the radial direction by the elastic force of the O-ring 61 or the leaf spring 161, but this is not limited to this. The elastic support members 60, 160 may use elastic members other than the O-ring 61 or the leaf spring 161 (for example, rubber pieces, disc springs, compression springs, etc.).

[0057] In the above embodiment, the elastic force (spring load, reaction force) of the elastic support members 60, 160 is generated in a direction toward the center in the second direction (a direction toward the inside in the second direction), but this is not limiting. For example, the elastic support members 60, 160 may be formed so that the elastic force (spring load, reaction force) of the elastic support members 60, 160 is generated in a direction away from the center in the second direction (a direction toward the outside in the second direction). [Explanation of symbols]

[0058] 1...temperature control device, 2...peltier module, 3...cooling plate, 5...stage, 10...top plate, 10a...periphery, 11...mounting surface, 12...screw hole, 13...bolt, 14...protrusion, 14a...protrusion surface, 20...bottom plate, 21...mounting surface, 22...periphery, 22a...periphery edge, 23...pin, 30...support portion, 31...side wall, 32...block, 40...positioning member, 41...first positioning portion, 41a...end face, 42...second positioning portion, 42a...end face, 50...fitting portion, 51...fitting groove, 51a...bottom face, 51b...side face, 52...fitting protrusion, 55...tapered portion, 55a...tip face, 55b...tape surface, 60...elastic support portion, 61...O-ring, O1...central axis, 62...bracket, 62a...mounting piece, 62b...connecting piece, 62c...pressing piece, 62d...insertion hole, 63...bush, 63a...tubular portion, 63b...flange portion, 64...bolt, 64a...shaft portion, 64b...head portion, 65...washer, 66...fixing member, 101...temperature control device, 160...elastic support portion, 161...leaf spring, 161a...mounting piece, 161b...connecting piece, 161c...pressing piece, 162...cover portion, 162a...inner surface, 163...first pressing portion, 164...second pressing portion, A...wafer, C1...center, C2...center, O...axis, O1...central axis, O2...central axis

Claims

1. a placement section having a placement surface on which an object to be temperature controlled is placed; a bottom portion facing the placement portion in a first direction; a heat source disposed between the mounting portion and the bottom portion in the first direction and capable of heating and cooling the object to be temperature-controlled via the mounting portion; a support portion provided on an outer periphery of the bottom portion, extending toward the placement portion in the first direction, and supporting the placement portion; a positioning member disposed between the mounting portion and the bottom portion in the first direction, the positioning member positioning a center of the mounting portion and a center of the bottom portion so as to allow the mounting portion to swing relative to the bottom portion; an elastic support portion provided on the support portion and elastically supporting an outer periphery of the mounting portion from outside in a second direction that intersects with an axis that passes through a center of the mounting portion and extends in the first direction; A temperature control device comprising:

2. The elastic support portion is an O-ring disposed on an outer circumferential side of the mounting portion and having a central axis extending in the second direction; a bracket disposed on an outer circumferential side of the O-ring and pressing the O-ring against the mounting portion; having The temperature control device according to claim 1 .

3. The elastic support portion is a bolt having a shaft portion that is screwed into the mounting portion and that is inserted through the O-ring and the bracket, and a head portion that is provided at an end of the shaft portion and that can press the bracket against the O-ring; The temperature control device according to claim 2 .

4. the elastic support portion is provided on the support portion and has a leaf spring that presses the outer periphery of the placement portion toward the center of the placement portion by elastic force. The temperature control device according to claim 1 .

5. the mounting portion has a protruding portion protruding outward, The leaf spring is a first pressing portion that presses the protruding portion from the opposite side to the bottom portion in the first direction; a second pressing portion that presses the protruding portion from both sides in a direction along an outer periphery of the mounting portion; having The temperature control device according to claim 4.

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