Test measurement system

Abstract

To provide superior isolation in between a test measurement device and a probe.SOLUTION: In a test measurement system 200, a probe 206 which can be coupled to a device under test (DUT) 202 is provided with a signal transceiver 318 transmitting / receiving a laser beam or an RF signal to / from a test measurement device 210 via an isolation barrier 208. Accordingly, the probe 206 receives supply of power and conducts transmission / reception of data and control signals. In addition, the probe 206 includes: a floating power supply 318 for supplying power to the probe 206 according to a received signal; an isolation type signal generation section 312 for generating an isolation signal that has been isolated from the test measurement device 210 using the floating power supply 320, and for outputting the isolation signal to the DUT 202; and a sensor 314 for measuring an output signal from the DUT 202 responding to the isolation signal.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] FIELD OF THE DISCLOSURE This disclosure relates to test and measurement instruments and probes, and more particularly to test and measurement instruments and probes with electrically isolated outputs. [Background technology]

[0002] Characterization of high-power devices, such as high-power MOSFETs and IGBTs, requires measuring multiple device parameters under high-voltage / high-current switching conditions. These measurements are often performed under conditions of very high common-mode signals. A best-in-class approach uses test and measurement equipment, such as an oscilloscope, and probes that employ isolation technology to measure voltages and currents under these conditions. These probes provide galvanic isolation (electrical isolation) between the device under test (DUT) connected to the probe's input and the test and measurement equipment connected to the probe's output, using optical or RF isolation technology. Examples of probes using isolation technology include the IsoVu (registered trademark) series of isolated probes manufactured and sold by Tektronix, Inc., a U.S. company, the parent company of the present applicant (see Non-Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2021-167815 [Patent Document 2] Japanese Patent Application Publication No. 2019-039904 [Patent Document 3] Japanese Patent Publication No. 2022-141621 [Patent Document 4] Japanese Patent Application Laid-Open No. 2024-000998 [Non-patent literature]

[0004] [Non-Patent Document 1] Introduction website of "IsoVu Isolated Voltage Probes", Tektronix, [online], [searched on April 14, 2025], Internet <https: / / www.tek.com / en / products / oscilloscopes / oscilloscope-probes / isovu-isolated-voltage-probes> [Non-Patent Document 2] Introduction website of "Oscilloscopes manufactured by Tektronix", Tektronix, [online], [searched on April 9, 2025], Internet <https: / / www.tek.com / ja / products / oscilloscopes> [Non-Patent Document 3] "Source Measure Unit of Keithley", Tektronix / Keithley, [online], [searched on April 10, 2025], Internet <https: / / www.tek.com / ja / products / keithley / source-measure-units> [Non-Patent Document 4] Article on "Galvanic isolation", Wikipedia (English version), [online], [searched on April 9, 2025], Internet <https: / / en.wikipedia.org / wiki / Galvanic_isolation> [Non-Patent Document 5] Article on "Insulation (electricity)", especially the explanation of "isolation", Wikipedia (Japanese version), [online], [searched on April 9, 2025], Internet <https: / / ja.wikipedia.org / wiki / 絶縁_(電気)> [Summary of the Invention] [Problems to be Solved by the Invention]

[0005] Figure 1 shows a dynamic measurement platform for performing DUT characterization. As shown, two DUTs are given in Figure 1: the upper DUT (DUT_top) and the lower DUT (DUT_bot, or DUT_bottom). Hazardous measurements requiring the use of probes with isolation technology include the current of the upper current source (I_top), the current of the inductor (TEST_L), and the voltage of the upper gate (Gate_top). Due to safety considerations, even measurements of signals such as the lower gate (Gate_bot) may require the use of probes with isolation technology. Similarly, the generation of the upper gate voltage (Vg_top) signal at the gate of the upper DUT is also subject to similar high common-mode signal conditions. Again, even if the lower gate (Gate_bot) is not significantly affected by the circuit's switching current, the circuit's switching current also raises safety concerns, potentially resulting in a device malfunction. Conventional approaches with gate drive circuits rely on magnetic coupling (transformers), which has isolation impedance limitations and potential safety limitations. The high voltage requirements of new designs are placing severe constraints on the design of power circuit isolation. [Means for solving the problem]

[0006] Embodiments of the present application relate to a test and measurement system that provides superior common mode rejection and safety advantages over existing transformer-based implementations. This disclosure describes a test and measurement system that includes a test and measurement instrument, a probe, and an isolation barrier disposed between the test and measurement instrument and the probe. The system described herein, according to embodiments of the disclosed technology, utilizes galvanic isolation techniques to provide superior common mode rejection and safety advantages over existing transformer-based implementations while still allowing power to be supplied from the test and measurement instrument to the probe.

[0007] The features briefly summarized above will now be described with particularity and detail by reference to example embodiments and the accompanying drawings, which illustrate only exemplary embodiments and are not intended to limit the scope of the claims. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 shows a dynamic measurement platform for characterizing a device under test (DUT). [Figure 2] FIG. 2 illustrates an example embodiment of a test and measurement system utilizing isolation techniques according to the present disclosure coupled to a device under test (DUT). [Figure 3] FIG. 3 illustrates an example block diagram of the test and measurement system of FIG. 2 in accordance with the disclosed technique, particularly showing the probe in more detail. DETAILED DESCRIPTION OF THE INVENTION

[0009] To facilitate understanding, the same reference numerals are used in the accompanying drawings, wherever possible, to designate identical elements common to multiple drawings, with the understanding that elements in one embodiment may be effectively incorporated in other embodiments.

[0010] Various features of the present invention will be described below with reference to the figures. It should be noted that the figures may or may not be drawn to the same scale, and that elements of similar structure or function are represented by the same reference numerals throughout the figures. It should be noted that these figures are intended to provide a brief description of the functions and are not intended to be exhaustive or to limit the scope of the claims. Furthermore, not all aspects or advantages of the present invention are present in the illustrated example embodiment. Aspects or advantages described in connection with a particular example embodiment are not necessarily limited to that example embodiment and may be implemented in any other example embodiment, even if not so illustrated or explicitly described.

[0011] FIG. 2 illustrates a test and measurement system coupled to a device under test (DUT), where the test and measurement system utilizes isolation techniques according to some example embodiments. While FIG. 2 illustrates a DUT 202 in the test and measurement system 200, the test and measurement system 200 of FIG. 2 is not required to be coupled to the DUT 202. However, the test and measurement system 200 may be capable of being coupled to the DUT 202. In FIG. 2, the DUT 202 is coupled to the test and measurement system 200 for illustrative purposes only. In some examples, the DUT 202 may be a MOSFET (metal-oxide semiconductor field-effect transistor) or an IGBT, and in such examples, the DUT 202 may be either the top DUT (DUT_top) or the bottom DUT (DUT_bottom or DUT_bottom) of FIG. 1. Also, in such examples, the driver circuit 204 illustrated in FIG. 2 may be the remaining portion of the characterization platform of FIG. 1 other than the DUT.

[0012] Test and measurement system 200 also includes circuitry 206 that can be coupled to DUT 202. In some example embodiments, circuitry 206 is probe circuitry, which ultimately connects to a test and measurement instrument 210, such as an oscilloscope, according to some embodiments of the present invention. For ease of reference, circuitry 206 may be referred to herein as probe 206. In such examples, circuitry 206 may have two paths: a high-precision, low-speed digital path and a high-bandwidth path. Circuitry 206 is further described below with reference to FIG. 3.

[0013] The circuit 206 is also coupled to an isolation barrier 208, which is disposed between the circuit 206 and the test and measurement instrument 210. The isolation barrier 208 is described further below.

[0014] Test and measurement instrument 210 may be any test and measurement instrument, such as a source measure unit (SMU) or an oscilloscope. While the illustrated example of test and measurement system 200 shows one test and measurement instrument 210, this is by way of example only, and any number of test and measurement instruments may be included in test and measurement system 200. Test and measurement instrument 210 of test and measurement system 200 may be coupled to any terminal of DUT 202. In some example embodiments, test and measurement instrument 210 of test and measurement system 200 may be coupled to multiple terminals of DUT 202 and may be coupled to any number of DUTs.

[0015] 2, test and measurement instrument 210 includes ports 212 that are coupled to probes 206 and isolation barrier 208. Test and measurement instrument 210 also includes a digital communication interface 214, a signal generator 218, a controller 220, and an earth-ground-based power supply 216 (i.e., a power supply whose reference potential (ground) for operation is connected to earth).

[0016] In some examples, the controller 220 may include one or more processors configured to execute instructions from memory 222, which may perform any method or associated steps indicated by such instructions, such as instructing the digital communication interface 214, the signal generator 218, or the earth / ground-based power supply 216. Memory 222 represents any memory within the test and measurement instrument 210 and may be implemented as processor cache, random access memory (RAM), read-only memory (ROM), solid-state memory, a hard disk drive, or any other form of memory. The memory 222 serves as a medium for storing data, computer program products, and other instructions. A display / user interface (UI) 213 is coupled to the controller 220 and receives user input. The user interface may include a keyboard, mouse, trackball, touch screen, or other operating device that can be used to interactively operate the test and measurement instrument through a graphical user interface (GUI) on the display. The display may be a digital screen or other monitor for displaying waveforms, measurements, and other data to a user. Although the components of test and measurement instrument 210 are depicted as being integrated within test and measurement instrument 210, one skilled in the art will understand that any of these components may be external to test and measurement instrument 210 and may be coupled to test and measurement instrument 210 in any conventional manner.

[0017] Under the direction of the controller 220, the signal generator 218 and the digital communication interface 214 work together to provide signals to the DUT 202 through the isolation barrier 208 and the probe 206. The isolation barrier 208 separates the input and output conductors, preventing electrical current from flowing between them, while providing galvanic isolation, allowing signal information to be transmitted between the input and output sides using radio frequency (RF) signals, optical signals, electromagnetic coupling, capacitive coupling, or the like (see Non-Patent Documents 4 and 5). In some examples, these signals can be used for high-power applications or digital communication applications. An earth-ground-based power supply 216 may power components of the test and measurement instrument 210. In some examples, the earth-ground-based power supply 216 is a power supply that supplies power to components of the test and measurement instrument 210 and has its ground (operating reference potential) connected to earth.

[0018] As described herein, the test and measurement system 200 of Figure 2, in conjunction with a driver circuit 204 coupled to the DUT 202, may be used to drive the gate of a MOSFET. Specifically, the test and measurement system 200 of Figure 2 may be used with the driver circuit 204, such as the characterization platform of Figure 1, to drive the gate of a MOSFET. In doing so, the test and measurement system 200 of Figure 2 may provide common-mode rejection and high-voltage isolation with respect to the DUT 202.

[0019] FIG. 3 shows a block diagram of an example of the test and measurement system 200 of FIG. 2 , particularly with respect to the probe, in more detail. The DUT 202, driver circuit 204, isolation barrier 208, probe 206, and test and measurement instrument 210 of FIG. 3 are the same as the DUT 202, driver circuit 204, isolation barrier 208, probe 206, and test and measurement instrument 210 of FIG. 2 , except that FIG. 3 shows the probe 206 of FIG. 2 in more detail. While only one probe is shown with reference to FIGS. 2 and 3 , the test and measurement system 200 may have any number of probes and, therefore, any number of channels for testing the DUT 202. When more than one channel is used, synchronization between the channels is performed in the test and measurement instrument 210, which has an earth-ground-based power supply 216. In another example, synchronization between the channels can be performed using a digital signal source (not shown) within the probe 206. Timing synchronization between the channels can be achieved by utilizing probe technology with isolation technology.

[0020] In multiple channel implementations, test and measurement system 200 may include a second probe or sensor. In such implementations, the second probe or sensor may be used with a second DUT and may be similar in function to probe 206 and may be used to measure an output signal from the second DUT. In some implementations, the second probe or sensor may have similar functionality to probe 206 with respect to the second DUT.

[0021] As shown in FIG. 3 , the probe 206 may include an isolated signal generator 312, a sensor 314, a signal transceiver 318, a floating (isolated) power supply 320, and a controller 316. The signal transceiver 318 receives signals from the test and measurement instrument 210 through the isolation barrier 208. These signals may be RF or laser signals. These received signals may be used for power, data, control signals, or other types of communication between the test and measurement instrument 210 and the probe 206. The power supply signals received by the probe 206 are provided to the floating power supply 320. In some examples, the floating power supply 320 captures these power supply signals and provides power to the remaining components of the probe 206. Using power from the floating power supply 320, the isolated signal generator 312 can generate measurement signals to send to the DUT 202, and the sensor 314 can measure signals output from the DUT 202 in response to the signals sent to the DUT 202. In some examples, the isolated signal generator 312 and the signal transceiver 318 may be implemented as a single component. The isolated signal generator 312 is referred to as an "isolated or floating" signal generator because it is isolated from the test and measurement instrument 210 by the isolation barrier 208. This isolation allows the isolated signal generator 312 to generate signals superimposed on the common mode. Furthermore, the signals generated by the isolated signal generator 312 and output to the DUT 202 can be referred to as isolated signals because they are isolated from the test and measurement instrument 210 by the isolation barrier 208.

[0022] The path between the test and measurement instrument 210 and the probe 206 through the isolation barrier 208 operates between the digital communication interface 214 of the test and measurement instrument 210 and the signal transceiver 318 of the probe 206. This path may include a conductor or, preferably, optical fiber. This path may also be a wireless or radio frequency (RF) communication link. The optical fiber communication link provides complete galvanic isolation to the connected test and measurement instrument and, as a result, provides complete galvanic isolation from earth ground. Thus, in some examples, the path from the test and measurement instrument 210 to the probe 206 includes the isolation barrier 208. Furthermore, the use of an optical fiber communication link allows the probe 206 to be connected to a higher common-mode voltage relative to earth ground.

[0023] The controller 316 communicates with the isolated signal generator 312 and the signal transceiver 318. In some examples, the signal transceiver 318 is a digital communication interface between the controller 316 and the controller 220 via the communication link between the test and measurement instrument 210 and the probe 206. In some examples, the sensor 314 includes an analog-to-digital converter (ADC, not shown) and sends digitized measurements to the controller 316. In some examples, the sensor 314 may be a digital multimeter, digital voltmeter, or some other measurement device for the DUT 202. The controller 316 then sends the digitized measurements to the signal transceiver 318, which then transmits the digitized measurements through the isolation barrier 208 to the test and measurement instrument 210.

[0024] In some examples, the controller 316 may include one or more processors configured to execute instructions from memory 322, which may perform any method or associated steps indicated by such instructions, such as instructing the isolated signal generator 312, the signal transceiver 318, the sensor 314, or the floating power supply 320. The memory 322 represents any memory within the test and measurement instrument 210 and may be implemented as processor cache, random access memory (RAM), read-only memory (ROM), solid-state memory, a hard disk drive, or any other form of memory. The memory 322 serves as a medium for storing data, computer program products, and other instructions.

[0025] In some examples, the input signal under test from the DUT 202 and the drive signal output to the DUT 202 do not need to be isolated from each other. The probe 206 may contain only a precision digital path, which is electrically isolated (galvanically isolated) from the controller 220 and earth ground.

[0026] In some examples, the floating power supply 320 may be comprised of a capacitor bank or other type of power source. The floating power supply 320 may include optically, e.g., laser (or electromagnetic (EM) radiation of different frequencies) isolated power supplies, which may enable capabilities not currently available in the market. The floating power supply 320 may be based on a local storage bank with minimal inductance to provide a drive signal to the gate of the DUT 202. In some examples, the probe 206 with the isolated power supply 320 and driver circuitry 204 may be implemented in the form of an output channel of the test and measurement instrument 210, such as an "aux out" channel of an oscilloscope or a "source" output of a source measure unit (SMU), or in the form of an output circuit of the test and measurement probe.

[0027] In an example involving an optical implementation, the power supply to the gate drive circuitry (gate voltage generator circuitry) that generates the voltages that drive the gates of the DUT 202 may be limited to a laser or equivalent source. However, because characterization of the DUT does not require a constant power supply, power received and captured by the floating power supply 320 through the isolation barrier 208 may be sufficient to power the gate drive circuitry of the DUT 202. Because the average power required to drive the gates of the DUT 202 is fairly low, the power supply capabilities of the probe 206 may be sufficient even with such extended capabilities.

[0028] While the above description is somewhat specific to the characterization of high-power devices, embodiments of the disclosed technology include general-purpose signal generation needs that require very high common-mode rejection and high-voltage isolation.

[0029] The test and measurement system described herein provides complete galvanic isolation between the probe and the test and measurement equipment (such as an oscilloscope or SMU) connected to the probe. Using the communications link as the isolation barrier results in very little coupling across this barrier, enabling high common-mode rejection from direct current (DC) to very high bandwidths. This allows users to make measurements that are not referenced to earth, eliminating the possibility of circulating currents forming "ground loops" that can degrade measurement accuracy and signal fidelity. The probes of the disclosed technology are capable of measuring signals above large common-mode voltages.

[0030] Aspects of the disclosed technology may operate on specially created hardware, firmware, digital signal processors, or specially programmed general-purpose computers, including processors that operate according to programmed instructions. The terms "controller" or "processor" herein contemplate microprocessors, microcomputers, ASICs, and dedicated hardware controllers, among others. Aspects of the disclosed technology may be implemented with computer-usable data and computer-executable instructions, such as one or more program modules, executed by one or more computers (including a monitoring module) or other devices. Generally, program modules include routines, programs, objects, components, data structures, etc., which, when executed by a processor in a computer or other device, perform particular tasks or implement particular abstract data types. Computer-executable instructions may be stored in computer-readable storage media, such as hard disks, optical disks, removable storage media, solid-state memory, RAM, etc. Those skilled in the art will appreciate that the functionality of the program modules may be combined or distributed as desired in various embodiments. Furthermore, such functionality may be embodied in whole or in part in firmware or hardware equivalents, such as integrated circuits, field programmable gate arrays (FPGAs), etc. Certain data structures may be used to more effectively implement one or more aspects of the disclosed technology, and such data structures are considered within the scope of the computer-executable instructions and computer-usable data described herein.

[0031] The disclosed aspects may, in some cases, be implemented in hardware, firmware, software, or any combination thereof. The disclosed aspects may also be implemented as instructions carried by or stored on one or more computer-readable media, which may be read and executed by one or more processors. Such instructions may be referred to as a computer program product. As used herein, computer-readable media refers to any medium that can be accessed by a computing device. By way of example, and not limitation, computer-readable media may include computer storage media and communication media.

[0032] "Computer storage media" means any medium that can be used to store computer-readable information. By way of example and not limitation, computer storage media may include random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory and other memory technologies, compact disc read-only memory (CD-ROM), digital video disc (DVD) and other optical disk storage, magnetic cassettes, magnetic tape, magnetic disk storage and other magnetic storage devices, and any other volatile or nonvolatile, removable or non-removable medium implemented in any technology. "Computer storage media" excludes signals themselves and transitory forms of signal transmission.

[0033] A communication medium means any medium usable for communicating computer-readable information. By way of example, and not limitation, communication media may include coaxial cable, fiber optic cable, air, or any other medium suitable for communicating electrical, optical, radio frequency (RF), infrared, acoustic, or other types of signals. Example

[0034] The following examples are provided to aid in understanding the technology disclosed in this application. Embodiments of the technology may include one or more of the examples described below, and any combination thereof.

[0035] Example 1 is a test measurement system, a test and measurement device; a circuit coupleable to a device under test (DUT); an isolation barrier providing galvanic isolation between said test and measurement equipment and said circuit; Equipped with The above circuit is a signal receiving section (receiver) configured to receive a signal from the test and measurement device through the isolation barrier; an isolated (floating) power supply configured to provide power to the circuit via the received signal; an isolated signal generator configured to generate an isolated signal isolated from the test and measurement device using the isolated power supply and output the isolated signal to the DUT; a sensor for measuring an output signal from the DUT in response to the isolation signal from the isolation type signal generator; It has.

[0036] Example 2 is the test and measurement system of Example 1, wherein the DUT is a MOSFET (metal oxide semiconductor field effect transistor) or an IGBT, and the circuit is coupled to the MOSFET or the IGBT.

[0037] Example 3 is the test and measurement system of example 1 or example 2, wherein the circuit is coupled to a gate of the MOSFET or IGBT.

[0038] Example 4 is the test and measurement system of any one of Examples 1 to 3, in which the circuit is a probe.

[0039] Example 5 is the test and measurement system of any of Examples 1 to 4, wherein the test and measurement device includes a signal generating unit configured to generate a signal for supplying power to the circuit and transmit the signal to the circuit through the isolation barrier.

[0040] Example 6 is the test and measurement system of Example 5, wherein the signal receiving unit is a signal transmitting and receiving unit, and the test and measurement device is configured to use the signal to transmit and receive data or control signals to and from the circuit through the isolation barrier.

[0041] A seventh embodiment is the test and measurement system according to any one of the first to sixth embodiments, wherein the signal received by the signal receiving unit is used to supply power to the isolated power supply.

[0042] An eighth embodiment is the test and measurement system according to any one of the first to seventh embodiments, wherein the signal received by the signal receiving unit is either a laser (laser light) or radio frequency (RF) energy.

[0043] Example 9 is the test and measurement system of any of Examples 1 to 8, further comprising a gate drive circuit coupled to the DUT.

[0044] Example 10 is a test and measurement system according to any one of Examples 1 to 9, wherein the signal receiving unit is a signal transmitting and receiving unit (signal transceiver) configured to receive a laser power supply signal from the test and measurement device through the isolation barrier.

[0045] Example 11 is the test and measurement system of any of Examples 1 to 10, wherein the isolated power supply is configured to have a duty cycle based on the power supplied by the signal received via the signal receiving unit.

[0046] Example 12 is the test and measurement system of any of Examples 1 to 11, wherein the isolated power supply may include a capacitor or a capacitor bank that stores energy to power the circuit.

[0047] Example 13 is the test and measurement system of any of Examples 1 to 12, wherein the isolation barrier provides high voltage isolation.

[0048] Example 14 is the test and measurement system of any one of Examples 1 to 13, wherein the isolation barrier implements high impedance.

[0049] A fifteenth embodiment is the test and measurement system of any one of the first to fourteenth embodiments, wherein the test and measurement device may have an earth-ground based power supply.

[0050] Example 16 is the test measurement system of any one of Examples 1 to 15, the sensor is a first sensor, The DUT is a first DUT, the isolation signal is a first isolation signal, the output signal is a first output signal, the circuit is couplable to a second DUT; the isolated signal generation unit is configured to generate a second isolated signal using the isolated power supply and output the second isolated signal to the second DUT; The circuit may further include a second sensor for measuring a second output signal from the second DUT in response to the second isolated signal from the isolated signal generator.

[0051] Example 17 is the test and measurement system of Example 16, wherein the test and measurement instrument is configured to synchronize measurements of the second output signal and the first output signal.

[0052] Example 18 is the test and measurement system of any one of Examples 1 to 17, wherein the test and measurement device is an oscilloscope or a source measure unit (SMU).

[0053] Although the description of this application refers to particular features, it should be understood that the disclosure herein includes all possible combinations of those particular features. When a particular feature is disclosed in connection with a particular aspect or embodiment, that feature can also be used in connection with other aspects and embodiments, to the extent possible.

[0054] Furthermore, when this application refers to a method having two or more defined steps or processes, these defined steps or processes may be performed in any order or simultaneously, unless the circumstances preclude this possibility.

[0055] Although specific embodiments of the invention have been illustrated and described for purposes of illustration, it will be appreciated that various modifications can be made therein without departing from the spirit and scope of the invention. Accordingly, the invention should not be limited except as by the appended claims. [Explanation of symbols]

[0056] 200 Test and Measurement System 202 Device Under Test (DUT) 204 Drive circuit 206 Probe 208 Isolation Barrier 210 Test and measurement equipment Port 212 213 Display 214 Digital Communication Interface 216 Earth Ground Base Power Supply 218 Signal Generation Unit 220 Controller 222 memory 312 Isolation type signal generator 314 Sensors 316 Controller 318 Signal Transceiver (Signal Transmitter / Receiver) 320 Floating Power Supply 322 memory I_top Upper current source Vg_top Upper gate drive circuit (gate voltage generation circuit) I_bot lower current source Vg_bot Lower gate drive circuit (gate voltage generation circuit) TEST_L Inductance

Claims

1. 1. A test and measurement system comprising: a test and measurement device; a circuit coupleable to a device under test (DUT); an isolation barrier that provides galvanic isolation between the test and measurement equipment and the circuit; Equipped with The above circuit is a signal receiving section configured to receive a signal from the test and measurement instrument through the isolation barrier; an isolated power supply configured to provide power to the circuit via the received signal; an isolated signal generator configured to use the isolated power supply to generate an isolated signal isolated from the test and measurement instrument and output the isolated signal to the DUT; a sensor for measuring an output signal from the DUT in response to the isolation signal from the isolation type signal generator; A test and measurement system comprising:

2. 2. The test and measurement system of claim 1, wherein the test and measurement instrument comprises a signal generator configured to generate a signal for powering the circuit and transmit the signal to the circuit through the isolation barrier.

3. 2. The test and measurement system of claim 1, wherein the signal received by the signal receiving section is used to supply power to the isolated power supply.

4. 2. The test and measurement system of claim 1, wherein the signal received by the signal receiving section is either a laser or radio frequency (RF) energy.

5. 2. The test and measurement system of claim 1, wherein the signal received by the signal receiving section includes a data or control signal.

6. 2. The test and measurement system of claim 1, wherein the signal receiving unit is a signal transmitting and receiving unit configured to transmit and receive data or control signals between the circuit and the test and measurement device.

7. 2. The test and measurement system of claim 1, wherein the isolated power supply includes a capacitor or capacitor bank for storing energy to power the circuitry.

8. the sensor is a first sensor, the DUT is a first DUT, the isolation signal is a first isolation signal, the output signal is a first output signal, the circuit is couplable to a second DUT; the isolated signal generating unit is configured to generate a second isolated signal using the isolated power supply and output the second isolated signal to the second DUT; The circuit further includes a second sensor for measuring a second output signal from the second DUT in response to the second isolated signal from the isolated signal generator. The test and measurement system of claim 1 .

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