Method of manufacturing light emitting device and light emitting device

Abstract

To mount a light emitting element at the center of a recess in a package.SOLUTION: A method of manufacturing a light emitting device includes steps of: preparing an intermediate including a support member and a conductive member held by the support member and having an upper surface, the upper surface of the conductive member having a plurality of element mounting regions where light emitting elements can be mounted respectively and a plurality of wire connection regions where wires can be connected respectively, the support member including a side wall positioned above the upper surface of the conductive member and continuously surrounding the element mounting regions and the wire connection regions and a base including a plane on the same plane as the upper surface of the conductive member; mounting the light emitting elements on the element mounting regions of the conductive member respectively; connecting wires to the respective light emitting elements and the respective wire connection regions of the conductive member; covering, with a covering member, a connection where each wire and each wire connection region are connected; and cutting the intermediate and the covering member to be individualized.SELECTED DRAWING: Figure 1A

Description

[Technical Field]

[0001] The present invention relates to a method for manufacturing a light-emitting device and a light-emitting device. [Background technology]

[0002] BACKGROUND ART Light emitting devices such as LEDs (Light Emitting Diodes) that include a package with a recess and a semiconductor light emitting element (hereinafter also referred to as a "light emitting element") disposed in the recess are known (for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2014-195127 [Patent Document 2] Japanese Patent Application Publication No. 2017-204623 Summary of the Invention [Problem to be solved by the invention]

[0004] It is required that the light emitting element be mounted in the center of the recess of the package. [Means for solving the problem]

[0005] The present disclosure includes the following configurations. A step of preparing an intermediate body including a support member and a conductive member held by the support member and having an upper surface, The upper surface of the conductive member is a plurality of element mounting areas on which light emitting elements can be mounted; a plurality of wire connection areas to which wires can be connected; The support member is a sidewall portion located above an upper surface of the conductive member and continuously surrounding the element mounting region and the wire connection region; a base having a flat surface that is flush with the upper surface of the conductive member; providing an intermediate comprising: a step of mounting a light emitting element on the element mounting region of the conductive member; connecting a wire to the light emitting element and to a wire connection region of the conductive member; a step of covering a connection portion where the wire and the wire connection region are connected with a covering member; a step of cutting the intermediate body and the covering member into individual pieces; A method for manufacturing a light emitting device comprising: [Effects of the Invention]

[0006] As a result, a light emitting device can be obtained in which the light emitting element can be easily placed in the center of the recess of the package. [Brief explanation of the drawings]

[0007] [Figure 1A] 1 is a schematic perspective view showing a light emitting device according to an embodiment. [Figure 1B] FIG. 1 is a schematic top view showing a light emitting device according to an embodiment. [Figure 1C] FIG. 1C is a schematic top view in which the sealing member is omitted from FIG. 1B. [Figure 1D] FIG. 2 is a schematic cross-sectional view taken along line ID-ID in FIG. 1B. [Figure 2] FIG. 10 is a schematic top view showing a modified example of the light emitting device according to the embodiment. [Figure 3] FIG. 10 is a schematic top view showing a modified example of the light emitting device according to the embodiment. [Figure 4] FIG. 10 is a schematic top view showing a modified example of the light emitting device according to the embodiment. [Figure 5] FIG. 10 is a schematic top view showing a modified example of the light emitting device according to the embodiment. [Figure 6A] 5A to 5C are schematic top views illustrating a method for manufacturing a light emitting device according to an embodiment. [Figure 6B] 5A to 5C are schematic top views illustrating a method for manufacturing a light emitting device according to an embodiment. [Figure 7] FIG. 2 is a schematic top view showing a conductive member used in the light emitting device according to the embodiment. [Figure 8A] 5A to 5C are schematic top views illustrating a method for manufacturing a light emitting device according to an embodiment. [Figure 8B] FIG. 8B is a schematic cross-sectional view taken along line VIIIB-VIIIB in FIG. 8A. [Figure 9A] 5A to 5C are schematic top views illustrating a method for manufacturing a light emitting device according to an embodiment. [Figure 9B] FIG. 7B is a schematic cross-sectional view taken along line IXB-IXB in FIG. 7A. [Figure 10A] 5A to 5C are schematic top views illustrating a method for manufacturing a light emitting device according to an embodiment. [Figure 10B] 8B is a schematic cross-sectional view taken along line XB-XB in FIG. 8A. [Figure 11] 5A to 5C are schematic top views illustrating a method for manufacturing a light emitting device according to an embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0008] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The following describes embodiments of the present invention with reference to the accompanying drawings. However, the embodiments described below are merely examples of a light emitting device manufacturing method and a light emitting device that embody the technical concept of the present invention, and the present invention is not limited to the light emitting device manufacturing method and the light emitting device described below.

[0009] Furthermore, this specification does not in any way specify the components described in the claims as components of the embodiments. In particular, unless otherwise specified, the dimensions, materials, shapes, and relative positions of components described in the embodiments are not intended to limit the scope of this disclosure, but are merely illustrative examples. The sizes and relative positions of components shown in each drawing may be exaggerated or partially omitted for clarity. Furthermore, in the following description, the same names and symbols indicate the same or similar components, and detailed descriptions will be omitted as appropriate. Furthermore, in the following description, terms indicating specific directions or positions (e.g., "upper," "lower," "right," "left," and other terms incorporating these terms) are used as necessary. The use of these terms facilitates understanding of the invention with reference to the drawings, and the meanings of these terms do not limit the technical scope of the present invention. Furthermore, end views showing only the cut surface may be used as cross-sectional views. Furthermore, top views may be shown as perspective views that allow partial or complete visibility of components embedded within. In such cases, the embedded components are indicated by dashed lines. Furthermore, the same names may be used for members in an uncured state or a cured state, members before and after cutting, etc.

[0010] In the manufacturing method of a light-emitting device, the first thing prepared is an "intermediate body," which is a composite material made up of a support member and a conductive member. The intermediate body does not have a covering member (i.e., the second part), which is part of the wall of the light-emitting device. Therefore, the intermediate body does not have a recess that matches the recess of the light-emitting device. The intermediate body has a "recess" that includes the part that will become the recess. This recess is a part that is surrounded by a "side wall part." The side wall part is a part that includes part of the wall part. In a later process, a covering member (i.e., the second part) is formed, resulting in a wall part that includes the side wall part and the covering member.

[0011] 1A to 5 show a light emitting device 100 according to an embodiment. FIG. 1A is a schematic perspective view showing the light emitting device 100A. FIG. 1B is a schematic top view of the light emitting device 100A. FIG. 1C is a schematic top view of the light emitting device 100A without the sealing member 40. FIG. 1D is a schematic cross-sectional view taken along line ID-ID in FIG. 1B. FIGS. 2 to 5 are schematic top views of light emitting devices 100B to 100E according to modified examples. When the light emitting devices 100A to 100E are not to be distinguished from one another, they may be described as light emitting device 100.

[0012] The light emitting device 100 includes a package 10 and a light emitting element 20. The package 10 includes an insulating base 11 and at least two conductive members 12 that are held by the base 11 and function as a pair of positive and negative electrodes. The light emitting element 20 and the two conductive members 12 are electrically connected by wires 30.

[0013] The package 10 has an opening on the top surface and one or more recesses R defined by an inner side surface and a bottom surface. The package 10 shown in FIG. 1A and FIGS. 2 to 4 has one recess R. The package 10 shown in FIG. 5 has two recesses R. The package 10 includes an insulating base 11 and a conductive member 12 as components.

[0014] The insulating substrate 11 includes a support member 11A and a covering member 11B. The support member 11A includes a base B and a first portion W1, which is a portion of the wall W located above the base B. The covering member 11B is a second portion W2 that constitutes the wall W together with the first portion W1. In the wall W, the second portion W2 (covering member 11B) is sandwiched between the first portion W1 (support member 11A). In other words, in the substrate 11, a portion of the wall W is formed of a material different from the support member 11A. The support member 11A and the covering member 11B are each formed of a resin material, and the resin materials may be the same or different. In other words, the term "different material" here does not refer to materials (compositions) that are different, but refers to materials that are cured at different times. Specifically, the substrate 11 is formed by placing the uncured covering member 11B on the support member 11A that has been cured by molding or the like, and then curing the uncured covering member 11B. The manufacturing method will be described in detail later.

[0015] The wires 30 are connected to a wire connection region 12W located on the upper surface 12U of the conductive member 12. The wires 30 include at least two wires 30, i.e., a first wire 31 and a second wire 32, connected to one light-emitting element 20. The conductive member 12 includes at least one pair of conductive members 12, a first conductive member 121 and a second conductive member 122. The first conductive member 121 includes a first upper surface 121U, a first lower surface 121L opposite the first upper surface 121U, and a first side surface 121S between the first upper surface 121U and the first lower surface 121L. The first upper surface 121U includes a first wire connection region 121W to which the first wire 31 is connected. The second conductive member 122 has a second upper surface 122U, a second lower surface 122L opposite to the second upper surface 122U, and a second side surface 122S between the second upper surface 122U and the second lower surface 122L. The second upper surface 122U has a first wire connection region 122W to which the first wire 31 is connected, and an element mounting region 122C on which the light emitting element 20 is mounted.

[0016] In this embodiment, the connection portion between the wire 30 and the conductive member 12 is covered with the second portion W2 (covering member 11B). That is, a portion of the wire 30 is embedded in the second portion W2 (covering member 11B), which is a part of the wall portion W. This eliminates the need for a region for connecting the wire 30 within the recess R. This allows the light emitting device 100 to be miniaturized. Furthermore, the light emitting element 20 can be disposed so that its center is located at the center of the bottom surface that defines the recess R. This reduces bias in light distribution. If the size of the recess R is sufficiently large relative to the size of the light emitting element 20, it is possible to dispose the light emitting element 20 at the center of the recess R. However, as shown in FIG. 1B and other figures, if the length of one side of the top surface of the light emitting element 20 is, for example, 70% or more of the width of the recess R, the center of the light emitting element 20 is likely to be misaligned from the center of the recess R when the region for connecting the wire 30 is taken into consideration. Here, the width of the recess R refers to the distance between two sides of the periphery of the bottom surface that sandwich the light emitting element 20 when the recess R is substantially square in top view as shown in FIG. 1B. In the case of a recess R that is substantially rectangular in top view, the width of the recess R refers to the circumference of the bottom surface, which is the distance between the two short sides. In the case of a circular recess R, the width of the recess R refers to the diameter of the bottom surface.

[0017] The wall W preferably includes two second portions W2 (covering members 11B). One second portion W2 covers the connection portion between the first wire 31 and the first conductive member 121, and the other second portion W2 covers the connection portion between the second wire 32 and the second conductive member 122. When two second portions W2 (covering members 11B) are included, they are preferably arranged at positions sandwiching the light emitting element 20, as shown in FIGS. 1B, 4, and 5. In other words, in a light emitting device 100 that is rectangular in top view, the second portions W2 (covering members 11B) are preferably arranged on two parallel sides. In this case, the two second portions W2 (covering members 11B) may be positioned symmetrically with respect to an imaginary line passing through the center of the light emitting device 100 in top view, as shown in FIG. 4 or 5, or may not be positioned symmetrically with respect to an imaginary line passing through the center of the light emitting device 100, as shown in FIG. 1B.

[0018] 2, two second portions W2 (covering members 11B) can be arranged on adjacent sides of a light emitting device 100 that is rectangular in top view. Alternatively, two second portions W2 (covering members 11B) may be arranged on one side, as in light emitting device 100C shown in FIG. 3. In light emitting device 100C shown in FIG. 3, one second portion W2 (covering member 11B) is located at a corner, and therefore is located on two adjacent sides.

[0019] When a plurality of recesses R are provided, as in the light emitting device 100E shown in FIG. 5, the wall W in each recess R has a first portion W1 and a second portion W2.

[0020] The second portion W2 (covering member 11B) constitutes a part of the outer surface of the package 10. Specifically, the second portion W2 (covering member 11B) constitutes a part of the outer surface W2 of the wall portion W. Furthermore, the second portion W2 (covering member 11B) also constitutes a part of the inner surface W1 and a part of the top surface W3 of the wall portion W. Specifically, the inner surface W1 of the wall portion W is constituted by the first inner surface W11 of the first portion W1 and the second inner surface W21 of the second portion W2. The outer surface W2 of the wall portion W is constituted by the first outer surface W12 of the first portion W1 and the second outer surface W22 of the second portion W2. The top surface W3 of the wall portion W is constituted by the first top surface W13 of the first portion W1 and the second top surface W23 of the second portion W2. The first outer surface W12 and the second outer surface W22 are located on the same plane and are also located on the same plane as the side surface of the base B. By providing such a second portion W2 (covering member 11B), it is possible to further reduce the size.

[0021] In the light emitting device 100A shown in FIG. 1A etc., the bottom surface defining the recess R is composed of the first upper surface 121U of the first conductive member 121, the second upper surface 122U of the second conductive member 122, and the first plane BF which is the upper surface of the base B.

[0022] 3, the bottom surface that defines the recess R may be formed by only the second upper surface 122U of the second conductive member 122. In the light emitting device 100B shown in FIG.

[0023] The shape of the opening of the recess R, i.e., the shape of the annular opening formed by the upper end of the first inner surface W11 and the upper end of the second inner surface W21, can be circular, rectangular, or a partially deformed shape thereof. Furthermore, in the example shown in FIG. 1B and other figures, one side of the rectangular opening is linear, and the first inner surface W11 and the second inner surface W21 are linearly continuous. However, this is not limited thereto, and the second inner surface W21 may be located inside or outside the first inner surface W11. Furthermore, the angle between the first inner surface W11 and the plane BF of the base B and the angle between the second inner surface W21 and the plane BF of the base B may be the same or different. In particular, because the second portion W2 (covering member 11B) is not molded using a mold or other die, the shape of the second inner surface W21 can be controlled to some extent, but may be a convex or concave shape relative to the center of the recess R, or a shape having both a convex and a concave portion. 1C and other figures, when the upper surface 12U of the conductive member 12 has a groove G, the second portion W2 (covering member 11B) is disposed inside the groove G. In this case, depending on the position of the groove G and other factors, the position of the lower end of the second inner side surface W21 is at the same position as, or is located inside or outside the lower end of the first inner side surface W11.

[0024] The method for manufacturing the light emitting device 100 according to the embodiment mainly includes the following steps. (1) A step of preparing an intermediate (2) Step of placing a light emitting element on the intermediate body (3) Wire connection process (4) A process of covering with a covering member (5) A step of cleaving the intermediate

[0025] Each step will be described in detail below.

[0026] (1) A step of preparing an intermediate An example of the intermediate 1000A (1000) is shown in FIGS. 6A and 6B. The intermediate 1000 includes an insulating support member 11A and conductive members 12. In FIG. 6B, the conductive members 12 embedded in the support member 11A are indicated by dashed lines. In addition, FIG. 6 shows only the conductive members 12 of the intermediate 1000A, and the hatched portions are the conductive members 12. In addition, in this figure, the portions that will become the light emitting devices 100A (hereinafter also referred to as light emitting device regions A1) are shown arranged two vertically and two horizontally, for a total of four light emitting device regions A1. One intermediate 1000 can include, for example, 26 vertical by 36 horizontal light emitting device regions A1.

[0027] The support member 11A corresponds to a portion including the first portion W1 and base B of the wall W, which is a part of the base 11 of the light-emitting device 100A as shown in FIG. 1A. In the preform 1000, the support member 11A has a side wall SW and a base B. The side wall SW is located above the upper surface 12U of the conductive member 12 and continuously surrounds the element mounting region 122C, the first wire connection region 121W, and the second wire connection region 122W. The side wall SW of the preform 1000 includes a portion that will become a part of the wall W of the light-emitting device 100. The base B has a flat surface BF that is located on the same plane as the upper surface 12U of the conductive member 12. The base B of the preform 1000 includes a portion that will become the base B of the light-emitting device 100.

[0028] The intermediate 1000 has a recess D defined by the sidewall SW and the base B. Each recess D in the intermediate 1000 has a region (hereinafter also referred to as recess region D1) that will become one recess R of the light emitting device 100. As shown in FIG. 6A, laterally adjacent recess regions D1 are connected by a region (hereinafter also referred to as connecting region D2) where the covering member 11B (second portion W2) will be disposed later to form one recess D. That is, in the intermediate 1000A, adjacent recess regions D1 are connected to each other with the connecting region D2 located between them. The shape of the recess region D1 in a top view can be a polygon such as a circle, a triangle, or a rectangle, or a partially modified shape thereof. The connecting region D2 is a portion that is narrower than the width of the recess region D1 in a top view. The width of the connecting region D2 may be a width that can accommodate a capillary used to connect the wire 30. For example, the width of the connecting region D2 can be set to 0.15 mm or more and 0.17 mm or less. The width of the connecting region D2 refers to the distance between the opposing connecting side surfaces W4.

[0029] As shown in FIG. 1A and other figures, in a light emitting device 100 having a rectangular shape when viewed from above, when the second portion W2 (covering member 11B) is arranged on two parallel sides, an intermediate 1000A having a depression D in a shape in which one connection region D2 connects two recessed regions D1, as shown in FIG. 6A, can be used. However, this is not limited to this, and the intermediate 1000 may have one connection region D2 connected to only one recessed region D1. In the intermediate 1000A shown in FIG. 6A, the connection region D2 has multiple straight line segments extending in different directions when viewed from above. In the intermediate 1000B shown in FIG. 11, each connection region D2 is composed of only a straight line segment that is the shortest distance between adjacent recessed regions D1.

[0030] 2, in a light emitting device 100 having a rectangular shape when viewed from above, when second portions W2 (covering member 11B) are arranged on two adjacent sides, one or two of the two second portions W2 (covering member 11B) can be used as an intermediate body 1000 that forms a recess D connected to only one connecting region D2. When a connecting region D2 is connected to only one connecting region D2, the connecting region D2 is arranged up to a region where a portion of the covering member 11B will be removed during cutting in the singulation process. This allows the second portions W2 (covering member 11B) to form part of the outer surface W2 of the wall portion W.

[0031] 3, in the case where light emitting device 100 has a rectangular shape when viewed from above and two second portions W2 (covering member 11B) are arranged on one side, that is, when two second portions W2 (covering member 11B) are arranged in close positions, intermediate body 1000 can be formed with a structure in which one connection region D2 is connected to one recessed region D1 at two points. In this case, when cutting in the singulation step, connection region D2 can be formed so as to be connected to one recessed region D1 at two points via a region where part of covering member 11B is removed.

[0032] In the intermediate body 1000A, the recess D includes a plurality of recessed regions D1 and a plurality of connecting regions D2. The recess D is defined by the inner surface and bottom surface of the side wall portion SW. As shown in FIG. 6A , the inner surface of the side wall portion SW of the recess D includes the inner surface of the recessed region D1 (first inner surface W11 of the recess R) and a connecting side surface W4, which is the side surface of the connecting region D2.

[0033] The bottom surface that defines the recess D includes the upper surface 12U of the conductive member 12 and the plane BF of the base B. The upper surface 12U of the conductive member 12 that defines the recess D includes a first upper surface 121U of the portion that will become the first conductive member 121 and a second upper surface 122U of the portion that will become the second conductive member 122. If the conductive member 12 includes a support portion 123, it can also include the upper surface of the support portion 123. The plane BF of the base B includes a first plane BF1 and a second plane BF2. The first plane BF1 is a portion that is located in one recess region D1, between the portion that will become the first conductive member 121 and the portion that will become the second conductive member 122. The second plane BF2 is a portion that is located between the portions that will become the conductive members 12, between adjacent recess regions D1. When the conductive member 12 includes the support portion 123, the second plane BF2 is located between the portion that will become the first conductive member 121 and the support portion 123, and between the portion that will become the second conductive member 122 and the support portion 123. The bottom surface that defines the recess D may be a flat surface, or may have a recess such as a groove in part, or may have a protrusion.

[0034] 7, in the intermediate product 1000, the conductive member 12 is a single metal plate including a portion that will become the first conductive member 121 and a portion that will become the second conductive member 122, and a portion that will be removed by cutting, such as the support portion 123. In each recessed region D1, the portion that will become the second upper surface 122U of the second conductive member 122 includes an element mounting region 122C. In the example shown in FIG. 1B etc., the first conductive member 121 and the second conductive member 122 are located in the recessed region D1. In each connecting region D2, the first upper surface 121U of the first conductive member 121 includes a first wire connection region 122W.

[0035] In each coupling region D2, the second upper surface 122U of the second conductive member 122 includes a second wire connection region 122W. In the preform 1000 shown in FIG. 6B etc., the conductive member 12 includes a support portion 123 in the coupling region D2. The support portion 123 is a portion that is not included in the light emitting device 100 because it is removed with a blade or the like in the singulation process. When the upper surface of the conductive member 12 includes the support portion 123, it can be exposed from the support member 11A in the coupling region D2, as shown in FIG. 6B etc. However, the support portion 123 does not have to be exposed from the support member 11A.

[0036] A groove G may be disposed on the upper surface 12U of the conductive member 12. The groove G is disposed at or near the boundary between the recessed region D1 and the connecting region D2. In the example shown in FIG. 6B, the groove G is located within the recessed region D1 near the first wire connection region 121W and the second wire connection region 122W. The groove G prevents the uncured coating member 11B (described later) from flowing into the recessed region D1. The groove G may be formed by etching, pressing, grinding, laser irradiation, or the like. Alternatively, the conductive member 12 or the intermediate body 1000 having the groove G formed thereon may be purchased. The groove G may be linear in top view, or may be curved or have a shape combining a straight line and a curve. The length of the groove G is preferably equal to or shorter than the width of the connecting region D2. For example, the length of the groove G may be 30 μm or more and 90 μm or less. The width of the groove G can be, for example, 120 μm or more and 150 μm or less, and the depth of the groove G can be, for example, 50 μm or more and 130 μm or less.

[0037] Furthermore, the wettability of the upper surface 12U of the conductive member 12 may be varied to prevent the uncured coating material 11B from flowing out to areas other than the predetermined area. For example, by providing a surface roughness greater than the surface roughness Ra of the wire connection area 12W in place of the groove G shown in FIG. 6A, the uncured coating material 11B can be prevented from flowing out.

[0038] The intermediate body 1000 can include a protective element 50. Examples of the protective element 50 include a Zener diode and a varistor. In the example shown in FIG. 6B , the protective element 50 is fixed on the second upper surface 122U of the second conductive member 122 in a state in which the protective element 50 is electrically connected by a conductive bonding member. The protective element 50 is further electrically connected to the first conductive member 121 by a wire 30. In this state, the protective element 50 and the wire 30 are embedded in the support member 11A. The protective element 50 may be electrically connected to the first conductive member 121 and the second conductive member 122 by a conductive bonding member without using the wire 30. The intermediate body 1000 does not necessarily include the protective element 50.

[0039] Such an intermediate 1000 can be prepared by processing the conductive member 12 into a desired shape and molding the support member 11A. Methods for processing the conductive member 12 include etching and pressing. Methods for molding the support member 11A include injection molding, compression molding, transfer molding, and the like. Alternatively, the intermediate 1000 can be prepared by purchasing a conductive member 12 that has been processed into a desired shape and molding the support member 11A. Alternatively, the intermediate 1000 can be purchased and prepared.

[0040] (2) Step of placing a light emitting element on the intermediate body 8A and 8B, the light emitting element 20 is mounted on the element mounting region 122C. Specifically, an insulating bonding member such as a resin or a conductive bonding member such as a metal paste is placed on the element mounting region 122C, and the light emitting element 20 is mounted thereon. Examples of methods for forming the bonding member include transfer and potting.

[0041] (3) Wire connection process 8A and 8B, the joint between the light emitting element 20 and the wire connection region 12W of the conductive member 12 is connected with a wire 30. Specifically, a capillary is used to discharge electricity to melt the first wire 31, forming an initial ball and connecting it to the top surface of the light emitting element 20. The capillary is then moved and pressed against the first wire connection region 121W to connect it. A second wire 32 is also connected to the second wire connection region 122W in a similar manner.

[0042] (4) A process of covering with a covering member 9A and 9B, the connection portion where the wire 30 is connected to the wire connection region is covered with the covering member 11B (second portion W2). Specifically, the connection portion where the first wire 31 is connected to the first wire connection region 121W and the connection portion where the second wire 32 is connected to the second wire connection region 122W are covered with the covering member 11B. At this time, it is preferable to arrange the covering member 11B so as to cover the entire flat surface BF of the base portion B of the support member 11A and the upper surface 12U of the conductive member 12 that are exposed in the connection region D2. It is also preferable to arrange the covering member 11B so as to cover the entire connection side surface W4.

[0043] The coating member 11B can be formed by ejecting uncured coating member 11B from a nozzle and then curing it by heating. The nozzle may have an inner diameter of 130 μm to 150 μm and an outer diameter of 160 μm to 180 μm, for example. The viscosity of the uncured coating member 11B may be, for example, 12 Pa·s to 14 Pa·s. By providing grooves G on the upper surface 12U of the conductive member 12, it is possible to make it difficult for the uncured coating member 11B to be disposed in the recessed region D1 including the element mounting region 122C.

[0044] As shown in FIG. 9A , when the connection region D2 is linear and extends in different directions in a top view, i.e., when the connection region D2 is curved, the length of the connection region D2 is longer than the shortest distance between adjacent recessed regions D1. In such a case, the uncured coating material 11B can be dispensed by moving a single nozzle. For example, the nozzle movement may start from the first wire connection region 121W or the second wire connection region 122W and end at the second wire connection region 122W or the first wire connection region 121W. Furthermore, a similar operation may be performed two or more times, i.e., after placing the uncured coating material 11B, the uncured coating material 11B may be superimposed on the coating material 11B before or after curing. In this case, the nozzle may be moved in the same direction or in opposite directions. Alternatively, the nozzle may be moved from the center of the connection region D2 toward the first wire connection region 121W and then toward the second wire connection region 122W. Multiple nozzles may also be used. In this case, the nozzles may be moved while discharging the uncured coating material 11B, or the nozzles may be fixed and not moved while discharging the uncured coating material 11B. Furthermore, a single nozzle having a discharge port with the same shape as the shape of the connecting region D2 in a top view may be used.

[0045] Furthermore, as shown in FIG. 9A, by forming the connecting region D2 to have a bent portion in top view, the length of the connecting side surface W4 can be increased. In other words, the area where the covering member 11B can contact the connecting side surface W4 can be increased. This makes it easier to hold the covering member 11B. The length of the connecting region D2 (the length of the connecting side surface W4) can be 1.0 to 1.1 times the shortest distance between adjacent recessed regions D1. Furthermore, in the example shown in FIG. 9A, the connecting region D2 has three linear portions. In other words, the connecting region D2 has two bending points. However, the shape of the connecting region D2 in top view may include two or more linear portions, or may be partially or entirely curved.

[0046] 11, the shortest distance between adjacent recessed regions D1 is the same as the length of the connecting region D2. In other words, the connecting region D2 is a region that extends in a straight line. By using such a connecting region D2, the time required to arrange the covering member 11B can be reduced.

[0047] The uncured covering member 11B may extend up to the top surface W23 of the side wall SW of the support member 11A. In this case, after the covering member 11B is cured, the covering member 11B arranged on the top surface W23 of the side wall SW can be removed by grinding or the like. This allows the first top surface W13 of the first portion W1 and the second top surface W23 of the second portion W2 to be the same height, and the top surface W3 of the entire wall W of the base 11 can be made flat.

[0048] The covering member 11B may not cover the entire connecting side surface W4, in other words, the connecting side surface W4 may be exposed from the covering member 11B. Even if the covering member 11B covers the entire connecting side surface W4, the top surface (second top surface W23) of the covering member 11B (second portion W2) may have a recessed portion. In this case, a space connected to the recessed region D1 or a space not connected to the recessed region D1 is formed on the covering member 11B. If the space is connected to the recessed region D1, the sealing member 40 (described later) can be easily disposed in this space. If the space is not connected to the recessed region D1, a recessed portion is formed on the top surface of the light-emitting device 100 after singulation. However, it is preferable that the covering member 11B does not have such a recessed portion, or if it does have one, it is a slight recess.

[0049] By hardening the covering member 11B, as shown in Fig. 9A, the recessed regions D1 that were connected by the connecting regions D2 are separated by the covering member 11B, forming separate recessed portions R. Thereafter, as shown in Figs. 10A and 10B, uncured sealing member 40 is placed in each recessed portion R and then cured. The sealing member 40 can be formed by discharging the uncured sealing member 40 from a nozzle and curing it by heating.

[0050] (5) Cutting the intermediate body and the covering member Intermediate body 1000 is cut. At this time, covering member 11B is also cut at the same time. In this way, light emitting device 100 shown in FIG. 1A and the like can be obtained.

[0051] Each component will be described in detail below.

[0052] (support member) The support member is a component that forms part of the package of the light-emitting device. The support member is an insulating component that holds the conductive component. Examples of resin materials used for the support member include thermosetting resins and thermoplastic resins. Specifically, examples of thermosetting resins include epoxy resins, modified epoxy resins, silicone resins, modified silicone resins, silicone-modified epoxy resins, epoxy-modified silicone resins, polyimide resins, modified polyimide resins, and unsaturated polyesters. Examples of thermoplastic resins include polyamides, polyphthalamides (PPA), polycarbonate resins, polyphenylene sulfide (PPS), liquid crystal polymers (LCPs), ABS resins, phenolic resins, acrylic resins, and PBT resins. The support member may contain at least one of these resins. Thermosetting resins are particularly preferred. The support member preferably has a reflectance of 60% or more for light from the light-emitting element, more preferably 70% or more, 80% or more, or 90% or more.

[0053] The support member preferably contains a light-reflecting material such as titanium oxide, silicon dioxide, zirconium dioxide, potassium titanate, alumina, aluminum nitride, zinc oxide, boron nitride, or mullite. This allows for efficient reflection of light from the light-emitting element. A black material such as carbon black may also be contained. The light-reflecting material or black material can be appropriately adjusted depending on molding conditions such as the resin molding method and resin fluidity, as well as properties such as reflectivity and mechanical strength. For example, when titanium oxide is used, its content is preferably 10% by weight to 60% by weight, and more preferably 15% by weight to 50% by weight, based on the total weight of the support member.

[0054] (Covering material) The covering member is a member that covers the connection portion where the wire and the wire connection region are connected, and can be made of the same materials as those listed as the material of the support member.

[0055] (Conductive material) Examples of materials for the conductive member include metals such as copper, aluminum, silver, and gold, or alloys thereof. These may be single-layer or multilayer structures (e.g., clad materials). A metal plate containing 90% or more of Cu as the main component is preferred. Furthermore, trace amounts of non-metallic elements such as Si or P may be included.

[0056] The thickness of the conductive member is preferably, for example, about 100 μm or more and 300 μm or less, and more preferably about 150 μm or more and 250 μm or less.

[0057] The conductive member has a base material made of any of the above materials and a plating layer on the surface of the base material. The plating layer is preferably made of a material with a higher reflectivity than the base material. Examples of the plating layer include nickel, silver, gold, platinum, palladium, and aluminum. Examples of the laminated structure include, from the base material side, nickel / palladium / gold, nickel / palladium / gold / silver, nickel / platinum / gold, and nickel / gold / silver. The thickness of the plating layer is preferably about 1 μm or more and 10 μm or less, and more preferably 1.5 μm or more and 6 μm or less.

[0058] (light-emitting element) The light-emitting device includes one or more light-emitting elements. Examples of the light-emitting elements include semiconductor light-emitting elements such as light-emitting diodes. The light-emitting element includes a semiconductor laminate and a pair of positive and negative electrodes. The semiconductor laminate includes, for example, a device substrate such as sapphire and a semiconductor layer formed thereon. Alternatively, the light-emitting element may be a semiconductor laminate consisting only of semiconductor layers without a device substrate. The shape of the light-emitting element in a top view may be a polygon, such as a triangle, a rectangle, or a hexagon. The length of one side of the light-emitting element may be 70% to 90% of the width of the bottom surface defining the recess of the package. Specifically, the length of one side may be 100 μm to 3000 μm in top view. Specifically, the light-emitting element 10 may be a square with a side length of approximately 600 μm, 1000 μm, 1400 μm, or 1700 μm. Alternatively, the light-emitting element 10 may be a rectangle having long and short sides in a top view. For example, the size may be 1100 μm x 200 μm. When multiple light-emitting elements are provided, the size, emission wavelength, composition, etc. of each light-emitting element 1 may be the same, or some or all of them may be different. Furthermore, the multiple light-emitting elements may all be connected in series or in parallel, or may be connected in a mixture of series and parallel.

[0059] The semiconductor stack includes an n-type semiconductor layer, a p-type semiconductor layer, and a light emitting layer sandwiched between them. x Al y Ga 1-x-y N (0≦x, 0≦y, x+y≦1).

[0060] The semiconductor laminate may have a structure including one or more light-emitting layers between an n-type semiconductor layer and a p-type semiconductor layer, or may have a structure in which a structure including an n-type semiconductor layer, a light-emitting layer, and a p-type semiconductor layer in that order is repeated multiple times. When the semiconductor laminate includes multiple light-emitting layers, the light-emitting layers may have different emission peak wavelengths, or may have light-emitting layers with the same emission peak wavelength. Note that the same emission peak wavelength includes cases where there is a variation of about several nanometers. The combination of emission peak wavelengths between the multiple light-emitting layers can be appropriately selected. For example, when the semiconductor laminate includes two light-emitting layers, the light-emitting layers can be selected from combinations such as blue light and blue light, green light and green light, red light and red light, ultraviolet light and ultraviolet light, blue light and green light, blue light and red light, or green light and red light.

[0061] The light-emitting element includes a pair of positive and negative electrodes on the lower surface of the semiconductor laminate. The electrodes can be made of a good electrical conductor, such as gold, silver, tin, platinum, rhodium, titanium, aluminum, tungsten, palladium, nickel, or an alloy thereof. The electrodes can include an ohmic electrode in contact with the lower surface of the semiconductor laminate, and a pad electrode connected to the ohmic electrode and externally connected. The thickness of the electrodes can be, for example, 10 μm or more and 50 μm or less.

[0062] (jointing material) A bonding member can be used to fix the light-emitting element on the package. Examples of the bonding member include an insulating bonding member or a conductive bonding member. Examples of the insulating bonding member include resins, such as silicone resins and epoxy resins. Examples of the conductive bonding member include solder and metal paste.

[0063] (wire) Examples of wires for supplying power to light-emitting elements include conductive wires made of metals such as gold, silver, copper, platinum, and aluminum, and alloys containing at least these metals. Gold-containing wires, which have excellent thermal resistance, are particularly preferred. The diameter of the wire can be, for example, 10 μm to 30 μm.

[0064] (Sealing member) The encapsulating material protects electronic components, such as light-emitting elements and wires, placed in a package from dust, moisture, external forces, and the like. The encapsulating material is preferably one that is translucent enough to transmit light from the light-emitting elements and has light resistance that makes it resistant to degradation by such elements. Specific examples of the encapsulating material include insulating resin compositions that are translucent enough to transmit light from the light-emitting elements, such as silicone resins, modified silicone resins, epoxy resins, modified epoxy resins, urea resins, and acrylic resins. Other examples include silicone resins, epoxy resins, urea resins, fluororesins, and hybrid resins containing at least one of these resins. Furthermore, the encapsulating material is not limited to these organic materials; inorganic materials such as glass and silica sol can also be used. In addition to these materials, wavelength conversion materials (fluorescent materials), light scattering agents, colorants, and the like can also be added as desired. The amount of encapsulating material may be sufficient to cover the electronic components.

[0065] Examples of phosphors that can be used include yttrium-aluminum-garnet phosphors, lutetium-aluminum-garnet phosphors, terbium-aluminum-garnet phosphors, CCA phosphors, SAE phosphors, chlorosilicate phosphors, silicate phosphors, oxynitride phosphors such as β-sialon phosphors and α-sialon phosphors, nitride phosphors such as LSN phosphors, BSESN phosphors, SLA phosphors, CASN phosphors and SCASN phosphors, fluoride phosphors such as KSF phosphors, KSAF phosphors and MGF phosphors, quantum dots with a perovskite structure, II-VI quantum dots, III-V quantum dots, and quantum dots with a chalcopyrite structure.

[0066] Examples of light scattering agents that can be used include particles of titanium oxide, silicon oxide, aluminum oxide, zinc oxide, magnesium oxide, zirconium oxide, yttrium oxide, calcium fluoride, magnesium fluoride, niobium pentoxide, barium titanate, tantalum pentoxide, barium sulfate, or glass.

[0067] (protective element) The protective element may be a Zener diode, a varistor, or the like.

[0068] Embodiments of the present disclosure can include the following light emitting devices. [Section 1] A step of preparing an intermediate body including a support member and a conductive member held by the support member and having an upper surface, The upper surface of the conductive member is a plurality of element mounting areas on which light emitting elements can be mounted; a plurality of wire connection areas to which wires can be connected; The support member is a sidewall portion located above an upper surface of the conductive member and continuously surrounding the element mounting region and the wire connection region; a base having a flat surface that is flush with the upper surface of the conductive member; providing an intermediate comprising: a step of mounting a light emitting element on the element mounting region of the conductive member; connecting a wire to the light emitting element and to a wire connection region of the conductive member; a step of covering a connection portion where the wire and the wire connection region are connected with a covering member; a step of cutting the intermediate body and the covering member into individual pieces; A method for manufacturing a light emitting device comprising: [Section 2] In the step of preparing the intermediate, a first plane between the element mounting area and the wire connection area and a second plane between two of the wire connection areas; the sidewall portion of the support member is arranged so that the element mounting region, the first plane, the wire connection region, and the second plane are continuously exposed; The covering member continuously covers the two connecting portions and the second plane. Item 1. A method for producing a light-emitting device according to Item 1, comprising: [Section 3] the sidewall portion has two first inner side surfaces arranged to sandwich the element mounting region therebetween and two connecting side surfaces arranged to sandwich the wire connection region therebetween; Item 3. The method for manufacturing a light emitting device according to item 1 or 2, wherein the covering member exposes the two first inner side surfaces and covers the two connecting side surfaces so as to be in contact with the two connecting side surfaces. [Section 4] Item 4. The method for manufacturing a light emitting device according to any one of items 1 to 3, wherein in the step of preparing the intermediate, an upper surface of the conductive member has a groove in the vicinity of the wire connection region, and a part of the covering member is disposed in the groove. [Section 5] 5. The method for manufacturing a light emitting device according to any one of items 1 to 4, wherein the step of covering with the covering member includes a step of covering the top surface of the side wall portion with the covering member, and a step of removing the covering member arranged on the top surface. [Section 6] 6. The method for manufacturing a light emitting device according to any one of items 1 to 5, further comprising, before the singulation step, a step of arranging a sealing member that covers the light emitting element in the element mounting region surrounded by the wall portion, with the side wall portion and the covering member as wall portions. [Section 7] a package including a conductive member and a base, the package having a recess defined by a bottom surface and a wall surrounding the bottom surface; a light emitting element disposed within the recess; a wire connecting the conductive member and the light-emitting element; A light emitting device comprising: the wires include a first wire and a second wire; The conductive member is a first conductive member having a first top surface including a first wire connection region, a first bottom surface opposite the first top surface, and a first side surface between the first top surface and the first bottom surface; a second conductive member including a second upper surface including a second wire connection region and an element mounting region, a second lower surface opposite the second upper surface, and a second side surface between the second upper surface and the second lower surface; Including, the wall portion has a first portion that is integral with the base portion and a second portion that is a member different from the first portion and that constitutes a part of the outer surface of the package; a connection portion between the first wire and the first conductive member is covered with the second portion. [Section 8] Item 8. The light emitting device according to item 7, wherein the wall portion has two of the second portions, and the two second portions are arranged at positions sandwiching the light emitting element when viewed from above. [Section 9] The wall portion has an inner surface defining the recess, an outer surface opposite the inner surface, and a top surface between the inner surface and the outer surface, Item 9. The light emitting device according to item 7 or 8, wherein the inner surface includes a first inner surface of a first portion and a second inner surface of the second portion, and a portion of the second inner surface is located closer to the center of the bottom surface than the adjacent first inner surface. [Section 10] Item 10. The light emitting device according to any one of items 9 to 12, wherein an upper surface of the conductive member located near a lower end of the second inner surface has a groove.

[0069] The embodiments of the present disclosure have been described above with reference to specific examples. However, the present disclosure is not limited to these specific examples. All forms that can be implemented by a person skilled in the art through appropriate design modifications based on the above-described embodiments of the present disclosure also fall within the scope of the present disclosure, as long as they include the gist of the present disclosure. In addition, within the scope of the concept of the present disclosure, a person skilled in the art may come up with various modifications and alterations, and these modifications and alterations also fall within the scope of the present disclosure. [Explanation of symbols]

[0070] 100...Light emitting device 1000...Intermediate A1: Light-emitting device area 10...Package 11...Base 11A...Support member 11B...Covering member B...Base (BF...plane, BF1...first plane, BF2...second plane) W...Wall part (W1...inner surface, W2...outer surface, W3...top surface, W4...connecting side surface) W1...first part (W11...first inner surface, W12...first outer surface, W13...first top surface) W2...Second part (W21...Second inner surface, W22...Second outer surface, W23...Second top surface) SW…Side wall part 12...Conductive member (12U...upper surface, 12L...lower surface, 12S...side surface, 12W...wire connection area, G...groove portion) 121...first conductive member (121U...first upper surface, 121L...first lower surface, 121S...first side surface, 121W...first wire connection area) 122...Second conductive member (122U...Second top surface, 122L...Second bottom surface, 122S...Second side surface, 122W...Second wire connection area, 122C...Element mounting area) 123...Support part R...Concave D... depression (D1... recessed area, D2... connecting area) 20...Light emitting element 30...wire (31...first wire, 32...second wire) 40...Sealing member 50...Protection element

Claims

1. A step of preparing an intermediate body including a support member and a conductive member held by the support member and having an upper surface, The upper surface of the conductive member is a plurality of element mounting areas on which light emitting elements can be mounted; a plurality of wire connection areas to which wires can be connected; The support member is a sidewall portion located above an upper surface of the conductive member and continuously surrounding the element mounting region and the wire connection region; a base having a flat surface that is flush with the upper surface of the conductive member; providing an intermediate comprising: a step of mounting a light emitting element on the element mounting region of the conductive member; connecting a wire to the light emitting element and to the wire connection region of the conductive member; a step of covering a connection portion where the wire and the wire connection region are connected with a covering member; a step of cutting the intermediate body and the covering member into individual pieces; A method for manufacturing a light emitting device comprising:

2. In the step of preparing the intermediate, a first plane between the element mounting region and the wire connection region and a second plane between two of the wire connection regions; the sidewall portion of the support member is arranged so that the element mounting region, the first plane, the wire connection region, and the second plane are continuously exposed; The covering member continuously covers the two connecting portions and the second plane. The method for manufacturing the light emitting device according to claim 1 , comprising:

3. the sidewall portion has two first inner side surfaces arranged to sandwich the element mounting region therebetween and two connecting side surfaces arranged to sandwich the wire connection region therebetween; The method for manufacturing a light emitting device according to claim 1 , wherein the covering member exposes the two first inner side surfaces and covers the two connecting side surfaces so as to be in contact with the two connecting side surfaces.

4. The method for manufacturing a light emitting device according to claim 1 , wherein in the step of preparing the intermediate body, the upper surface of the conductive member has a groove near the wire connection region, and a portion of the covering member is disposed in the groove.

5. The method for manufacturing a light emitting device according to claim 1 , wherein the step of covering with the covering member includes a step of covering the top surface of the side wall portion with the covering member, and a step of removing the covering member disposed on the top surface.

6. 2. The method for manufacturing a light-emitting device according to claim 1, further comprising, before the singulation step, a step of forming the side wall portion and the covering member into wall portions, and placing a sealing member covering the light-emitting element in the element mounting area surrounded by the wall portions.

7. a package including a conductive member and a base, the package having a recess defined by a bottom surface and a wall surrounding the bottom surface; a light emitting element disposed within the recess; a wire connecting the conductive member and the light-emitting element; A light emitting device comprising: the wires include a first wire and a second wire; The conductive member is a first conductive member having a first top surface including a first wire connection region, a first bottom surface opposite the first top surface, and a first side surface between the first top surface and the first bottom surface; a second conductive member including a second upper surface including a second wire connection region and an element mounting region, a second lower surface opposite the second upper surface, and a second side surface between the second upper surface and the second lower surface; Including, the substrate has a base and a wall; the wall portion has a first portion that is integral with the base portion and a second portion that is a member different from the first portion and that constitutes a part of the outer surface of the package; a connection portion between the first wire and the first conductive member is covered with the second portion.

8. The light emitting device according to claim 7 , wherein the wall portion has two of the second portions, and the two second portions are arranged at positions sandwiching the light emitting element in a top view.

9. The wall portion has an inner surface defining the recess, an outer surface opposite the inner surface, and a top surface between the inner surface and the outer surface, 8. The light emitting device of claim 7, wherein the inner surface includes a first inner surface of the first portion and a second inner surface of the second portion, and a portion of the second inner surface is located closer to the center of the bottom surface than the adjacent first inner surface.

10. The light emitting device according to claim 9 , wherein an upper surface of the conductive member located near a lower end of the second inner surface has a groove.

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