Workpiece processing method

Abstract

To provide a workpiece processing method in which a workpiece is not damaged by scratches or foreign matters on a surface of a table of a processing machine.SOLUTION: A workpiece processing method includes steps of: preparing a laminated protective film in which a plurality of protective films and a plurality of adhesive layers are alternately laminated; placing the laminated protective film on a table so that an upper surface of a table of a processing device and an adhesive layer of a lowermost layer of the laminated protective film are in contact with each other; supporting a first workpiece on an upper surface of a first protective film of an uppermost layer of the laminated protective film; forming a processed first workpiece by processing a first workpiece; removing the processed first workpiece from the laminated protective film; removing the first protective film from the laminated protective film when the first protective film has a defect after forming the processed first workpiece; supporting a second workpiece on an upper surface of a second protective film exposed from the laminated protective film and located below the first protective film, after removing the first protective film; and processing the second workpiece.SELECTED DRAWING: Figure 2D

Description

[Technical Field]

[0001] The present invention relates to a method for processing a workpiece, and more particularly to a method for processing a workpiece that can prevent the workpiece from being scratched by interposing a plurality of protective films between a table of a processing machine and the workpiece. [Background technology]

[0002] A method for processing through holes in a resin substrate by laser processing has been proposed, which makes it possible to reduce the variation in the diameter of through holes formed in a resin substrate by laser processing, thereby processing through holes with smaller diameters, and also improves the processing efficiency of through holes formed in the resin substrate (for example, Patent Document 1). Fig. 3 is an explanatory diagram showing an example of an embodiment of the method for machining through holes in a resin substrate by laser machining described in Patent Document 1. As shown in Fig. 3, the method is characterized in that a resin layer 36 that can be easily etched by laser light is formed on the lower surface of a core substrate 30, which is the workpiece, and the core substrate 30 is supported on a base plate 26 via the resin layer 36 and then laser machining is performed.

[0003] In the method for processing through holes in a resin substrate by laser processing described in Patent Document 1, when a laser beam is irradiated onto a core substrate 30 to form through holes 14, the resin layer 36 below the through holes 14 is etched with the laser beam to form the through holes 14. Because the resin layer 36 is easily etched with laser beams, the resin layer 36 is etched when the through holes 14 are formed, forming recesses 36a on the undersides of the through holes 14. In this way, when the through holes 14 are formed by etching the resin layer 36 in the method for processing through holes in a resin substrate by laser processing, the inner surfaces of the through holes 14 are etched straight, and variation in the diameters of the through holes 14 is reduced. The resin layer 36, which is easily etched with laser beams, is interposed between the core substrate 30 and the base plate 26 to allow the through holes 14 to be easily opened without being closed. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2001-135912 Summary of the Invention [Problem to be solved by the invention]

[0005] In the technology disclosed in Patent Document 1, only one resin layer 36 that can be easily etched by laser light is interposed between the core substrate 30 and the base plate 26. For this reason, the method of processing through holes in the resin substrate 10 by laser processing described in Patent Document 1 has the problem that when the core substrate 30 is processed multiple times, the resin layer 36 deteriorates, causing scratches on the base plate 26 of the processing machine. Furthermore, this method of processing through holes in a resin substrate using laser processing has the problem that the resin layer 36 deteriorates, and foreign matter generated from the resin substrate 10 on the surface of the base plate 26 of the processing machine causes scratches on the core substrate 30. From this technical point of view, the technical object of the present invention is to provide a method for processing a workpiece in such a way that the table of the processing machine is not scratched when the workpiece is processed, and that the workpiece is not scratched by foreign matter or scratches that occur on the surface of the table. [Means for solving the problem]

[0006] The method for processing a workpiece according to the present invention includes the steps of preparing a laminated protective film in which multiple protective films and multiple adhesive layers are alternately stacked, placing the laminated protective film on a table provided in a processing device so that the top surface of the table is in contact with the adhesive layer located at the bottom of the laminated protective film, supporting a first workpiece on the top surface of a first protective film located at the top layer of the laminated protective film, processing the first workpiece to form a processed first workpiece, removing the processed first workpiece from the laminated protective film, and if the first protective film has a defect after forming the processed first workpiece, removing the defective first protective film from the laminated protective film, and after removing the first protective film, supporting a second workpiece on the top surface of a second protective film exposed from the laminated protective film and located below the first protective film, and processing the second workpiece. [Brief explanation of the drawings]

[0007] [Figure 1A] 1 is a cross-sectional view illustrating one embodiment of a laminated protective film used in a workpiece processing method according to the present invention. [Figure 1B] 1 is a plan view illustrating one embodiment of a laminated protective film used in a workpiece processing method according to the present invention. [Figure 2A] 1 is a cross-sectional view for explaining an embodiment of a method for machining a workpiece according to the present invention. [Figure 2B] 1 is a cross-sectional view for explaining an embodiment of a method for machining a workpiece according to the present invention. [Figure 2C] 1 is a cross-sectional view for explaining an embodiment of a method for machining a workpiece according to the present invention. [Figure 2D] 1 is a cross-sectional view for explaining an embodiment of a method for machining a workpiece according to the present invention. [Figure 2E] 1 is a cross-sectional view for explaining an embodiment of a method for machining a workpiece according to the present invention. [Figure 3] 10A and 10B are explanatory diagrams showing a conventional method for processing a through hole in a resin substrate by laser processing. DETAILED DESCRIPTION OF THE INVENTION

[0008] <Regarding the laminated protective film used in the workpiece processing method according to the present invention> An embodiment of a laminated protective film used in a method for processing a workpiece according to the present invention and a method for processing a workpiece using the laminated protective film will be described with reference to the drawings. In the example shown in Figures 1 and 2, the dimensions of each member, particularly the height dimension, are shown as dimensions different from the actual dimensions in order to make it easier to understand the features of the present invention.

[0009] Fig. 1 is an explanatory view for explaining one embodiment of a laminated protective film used in a workpiece processing method according to the present invention, and Fig. 1A is a cross-sectional view for explaining one embodiment of a laminated protective film used in a workpiece processing method according to the present invention. 1A, the laminated protective film 100 has a laminated structure in which a plurality of protective films 101 and a plurality of adhesive layers 102 are alternately laminated. The plurality of protective films 101 may include, for example, a first protective film 101A, a second protective film 101B, and a third protective film 101C. On the other hand, the multiple adhesive layers 102 may include a first adhesive layer 102A, a second adhesive layer 102B, and a third adhesive layer 102C. For example, the multiple protective films 101 serve as the base material of the laminated protective film 100. The multiple adhesive layers 102 are used to bond the protective films 101 adjacent to each other in the stacking direction.

[0010] The laminated protective film 100 may comprise a third adhesive layer 102C located at the bottom and a third protective film 101C located above the third adhesive layer 102C, a second adhesive layer 102B located above the third protective film 101C and a second protective film 101B located above the second adhesive layer 102B, and may further comprise a first adhesive layer 102A located above the second protective film 101B and a first protective film 101A located above the first adhesive layer 102A. First adhesive layer 102A is provided between first protective film 101A and second protective film 101B, and bonds first protective film 101A and second protective film 101B together. After first protective film 101A and first adhesive layer 102A are bonded together, first protective film 101A and first adhesive layer 102A are handled as the smallest unit for handling. That is, when the first protective film 101A is peeled off from the laminated protective film 100, the first adhesive layer 102A is peeled off from the laminated protective film 100 while remaining adhered to the first protective film 101A.

[0011] The number of protective films 101 and the number of adhesive layers 102 constituting the laminated protective film 100 can be appropriately set depending on the workpiece (object to be processed) and the processing method used when processing the workpiece. From the standpoint of mechanical strength and ease of manufacture, it is preferable that the laminated protective film 100 be composed of two to six protective films 101 and two to six adhesive layers 102 corresponding to the protective films 101, and it is more preferable to use a five-layer protective film composed of five protective films 101. That is, the laminated protective film 100 may have a so-called 2- to 6-layer protective film structure having 2 to 6 protective films 101, and may also have a structure having 2 to 6 adhesive layers 102 interposed between adjacent protective films 101.

[0012] The protective film 101 is preferably a film having excellent mechanical strength, etc. The material constituting the protective film 101 is preferably a polyester-based material, such as polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polytrimethylene terephthalate (PTT), polyethylene naphthalate (PEN), etc. The thickness of the protective film 101 is preferably 30 to 60 μm, and more preferably 50 μm from the viewpoint of the mechanical properties of the protective film 101 when processing a workpiece.

[0013] The adhesive layer 102 is preferably an adhesive layer with excellent adhesiveness and removability. The adhesive constituting the adhesive layer 102 is preferably, for example, an acrylic adhesive or a polyester adhesive. The thickness of the adhesive layer 102 is preferably 10 to 20 μm, and from the viewpoint of ease of manufacturing the laminated protective film 100, it is more preferably 15 μm. From such a technical viewpoint, the thickness of the minimum unit consisting of one protective film 101 and one adhesive layer 102 constituting the laminated protective film 100 is preferably 40 to 80 μm, and more preferably 65 μm. Furthermore, the thickness of the laminated protective film 100 is preferably 80 to 480 μm, and more preferably 195 μm.

[0014] The laminated protective film 100 may be produced by using a carrier 103 and alternately laminating multiple adhesive layers 102 and multiple protective films 101 on the upper surface of the carrier 103, for example, to produce a three-layer laminated protective film having three protective films 101 as follows. First, the third adhesive layer 102C is formed on the upper surface of the carrier 103. Here, the third adhesive layer 102C may be formed on the upper surface of the carrier 103 by attaching the adhesive contained in the third adhesive layer 102C, by dissolving the adhesive in a solvent and applying an adhesive solution to the upper surface of the carrier 103 and then drying it, or by using an adhesive tape on the upper surface of the carrier 103 as the third adhesive layer 102C. Third protective film 101C is then placed on the upper surface of third adhesive layer 102C formed on the upper surface of carrier 103, and then bonded by applying heat, pressure, etc.

[0015] Second, in the same manner as above, second adhesive layer 102B is formed on the upper surface of third protective film 101C formed on carrier 103. Second protective film 101B is adhered to the upper surface of second adhesive layer 102B formed on the upper surface of third protective film 101C. Third, in the same manner as above, a first adhesive layer 102A is formed on the upper surface of second protective film 101B formed on carrier 103. First protective film 101A is adhered to the upper surface of first adhesive layer 102A formed on the upper surface of second protective film 101B.

[0016] The carrier 103 used to support the laminated protective film 100 preferably has mechanical strength sufficient to stably support the plurality of protective films 101 and adhesive layers 102, and also has excellent removability from the adhesive layer 102 located at the bottom of the laminated protective film 100. The material constituting the carrier 103 is preferably a polyester-based material, such as polyethylene terephthalate (PET) or polybutylene terephthalate (PBT). The thickness of the carrier 103 is preferably 20 to 30 μm, and more preferably 25 μm from the viewpoint of ease of manufacturing the laminated protective film 100.

[0017] Fig. 1B is a plan view illustrating one embodiment of a laminated protective film used in a workpiece processing method according to the present invention. As shown in Fig. 1B, the laminated protective film 100 has suction holes 104. The suction holes 104 may be a plurality of through-holes that penetrate the laminated protective film 100. The plurality of suction holes 104 may be formed randomly or may be formed in a regular arrangement. The number of suction holes 104 is not particularly limited.

[0018] The suction holes 104 formed in the laminated protective film 100 can be set as appropriate depending on the type and shape of the workpiece to be processed. The suction holes 104 serve to support and fix the workpiece to be processed on the table.

[0019] The diameter of the suction holes 104 formed in the laminated protective film 100 is preferably 1 to 10 mmΦ, and more preferably 4 mmΦ. The processing method for forming the suction holes 104 having such a shape is not particularly limited, and they may be formed by laser processing, drilling processing, or the like.

[0020] The method for processing a workpiece according to the present invention can be carried out by using the laminated protective film 100. That is, the method for processing a workpiece according to the present invention involves preparing the laminated protective film 100, and interposing the laminated protective film between a table of a processing device and the workpiece to be processed, thereby processing the workpiece. Here, the workpiece to be processed, to which the workpiece processing method of the present invention can be applied, is not particularly limited, as long as it is a workpiece that can be processed as required on a table provided on a processing stage equipped with a processing device. Examples of such processing objects include a core substrate for forming a through hole, a printed wiring board for laminating a dry film, and a printed wiring board for forming a via hole. Hereinafter, an embodiment of the core substrate processing method according to the present invention will be described.

[0021] <One embodiment of the workpiece machining method according to the present invention> 2A to 2E are cross-sectional views illustrating an embodiment of a method for machining a workpiece according to the present invention. Hereinafter, an embodiment of a method for machining a workpiece according to the present invention will be described with reference to FIGS. 2A to 2E.

[0022] First, as shown in Fig. 2A, a laminated protective film 100X is prepared in which first protective films 101A to third protective films 101C and first adhesive layers 102A to third adhesive layers 102C are alternately laminated. That is, the laminated protective film 100X employs a three-layer protective film having three protective films 101. The laminated protective film 100X is usually formed on a carrier 103. The laminated protective film 100X may be formed on a carrier 103. The laminated protective film 100X may be any film in which multiple protective films 101 and multiple adhesive layers 102 are alternately laminated, and may include 2 to 6 protective films and 2 to 6 adhesive layers, with these protective films 101 and adhesive layers 102 alternately laminated.

[0023] 2B, the laminated protective film 100X is placed on a table 200 provided in a processing device (not shown) so that the upper surface of the table 200 comes into contact with the third adhesive layer 102C located at the bottom of the laminated protective film 100X. In order to bring the upper surface of the table 200 into contact with the third adhesive layer 102C located at the bottom of the laminated protective film 100X, the carrier 103 is peeled off from the laminated protective film 100X formed on the carrier 103, and then the third adhesive layer 102C is placed on the upper surface of the table 200. When the processing device is a laser processing device, the workpiece 300 is supported by air suction on a processing stage (not shown) provided in the laser processing device, and the processing stage is moved relative to the laser light source to process a predetermined position of the workpiece 300. The table 200 has suction holes.

[0024] 2C, a first workpiece 300X is supported on the upper surface of a first protective film 101A located in the uppermost layer of the laminated protective film 100X. Here, the first protective film 101A is the protective film 101 located in the uppermost layer of the laminated protective film 100X. In the workpiece processing method according to the present invention, the first workpiece 300X is a processing target to be processed by the processing device. The first workpiece 300X is not particularly limited as long as it is a workpiece that can be processed as required on the table 200 provided on the processing stage of the processing device. Examples of the first workpiece 300X include a core substrate for forming through holes, a printed wiring board for laminating a dry film, and a printed wiring board for forming via holes. For example, when the first workpiece 300X is a core substrate for forming through holes, the first workpiece 300X may be a double-sided copper-clad laminate.

[0025] 2D, the first workpiece 300X is processed by machining the first workpiece 300X. The machining performed on the workpiece may be laser machining or drilling for forming through holes in a core substrate, laser machining performed for forming via holes in a resin insulating layer of a printed wiring board having a resin insulating layer, or lamination for laminating a dry film on a printed wiring board. For example, when the first workpiece 300X to be processed is a core substrate for forming a through hole, it can be performed by a processing method that can penetrate a double-sided copper-clad laminate. The first workpiece 300X can be processed by, for example, laser processing, drilling, laminating, plasma processing, chemical processing using a processing liquid or the like, cutting, or the like. For example, the first workpiece 300X can be processed by drilling or laser light processing (CO2, UV-YAG, excimer, etc.).

[0026] The first workpiece 300X becomes a machined first workpiece by being machined. For example, by forming a through-hole in the first workpiece 300X, the first workpiece 300X becomes a machined first workpiece in which a through-hole is formed.

[0027] Another workpiece is adsorbed onto the first protective film 101A via the through-holes (adsorption holes) 104 of the laminated protective film 100X. The other workpiece is subjected to the same processing as the first workpiece 300X, and then the other workpiece is removed from the laminated protective film 100X. Thereafter, the first protective film 101A is inspected, for example, visually. If the first protective film 101A has no defects such as scratches or deterioration, another workpiece is further processed on the first protective film 101A. The first workpiece 300X can include a workpiece processed on the first protective film 101A. Therefore, the other workpiece processed on the first protective film 101A is included in the first workpiece 300X. By machining a plurality of first workpieces 300X, a plurality of machined first workpieces can be manufactured. The machined first workpieces are subjected to necessary processing to complete printed wiring boards.

[0028] If defects such as scratches or deterioration are found in first protective film 101A during the inspection, first protective film 101A having the defects is removed from laminated protective film 100X. Examples of defects include scratches, foreign matter, unevenness, deterioration, etc. When removing the defective first protective film 101A from the laminated protective film 100X, the first protective film 101A is removed together with the first adhesive layer 102A located immediately below it. As a result, by removing the first protective film 101A and the first adhesive layer 102A from the laminated protective film 100X, the clean second protective film 101B located directly below the first adhesive layer 102A is newly exposed from the laminated protective film 100Y as the uppermost protective film 101. As such, according to the embodiment, it is not necessary to form a new protective film on the table every time a defect occurs. Therefore, the embodiment can improve production efficiency.

[0029] The laminated protective film 100Y comprises a third adhesive layer 102C located at the bottom and a third protective film 101C located above the third adhesive layer 102C, a second adhesive layer 102B located above the third protective film 101C, and a second protective film 101B located above the second adhesive layer 102B.

[0030] Next, as shown in FIG. 2E, second workpiece 300Y is adsorbed onto the upper surface of second protective film 101B. Second workpiece 300Y is processed on second protective film 101B. After processing, second workpiece 300Y is removed from second protective film 101B. Second protective film 101B is then inspected. If the inspection reveals no defects in second protective film 101B, another workpiece is processed on second protective film 101B. If a defect is found, second protective film 101B and second adhesive layer 102B directly below second protective film 101B are removed from laminated protective film 100Y.

[0031] In this way, the workpiece processing method of the present invention removes the defective first protective film 101A, thereby exposing a new, clean second protective film 101B from the laminated protective film 100X, and allows the second workpiece 300Y to be processed on the upper surface of the second protective film 101B.

[0032] Then, a plurality of second workpieces 300Y are machined in the same manner as the first workpiece 300X, thereby producing a plurality of machined second workpieces. [Explanation of symbols]

[0033] 100 Laminated Protective Film 100X Laminated Protective Film 100Y Laminated Protective Film 101 Protective Film 101A First protective film 101B Second protective film 101C Third Protective Film 102 Adhesive layer 102A 1st adhesive layer 102B 2nd adhesive layer 102C 3rd adhesive layer 103 Career 104 Adsorption hole 200 tables 300 Work 300X 1st work 300Y 2nd work

Claims

1. A method for processing a workpiece, comprising: preparing a laminated protective film in which a plurality of protective films and a plurality of adhesive layers are alternately laminated; placing the laminated protective film on a table provided in a processing device so that an upper surface of the table and an adhesive layer located at the bottom of the laminated protective film are in contact with each other; Supporting a first workpiece on an upper surface of a first protective film located at the top layer of the laminated protective film; machining the first workpiece to form a machined first workpiece; Removing the processed first workpiece from the laminated protective film; If the first protective film has a defect after forming the processed first workpiece, removing the defective first protective film from the laminated protective film; After removing the first protective film, a second workpiece is supported on an upper surface of a second protective film exposed from the laminated protective film and positioned below the first protective film; and machining the second workpiece.

2. The method for processing a workpiece according to claim 1, wherein the laminated protective film comprises 2 to 6 protective films.

3. 3. The method for processing a workpiece according to claim 1, wherein the laminated protective film has holes for suction.

4. 3. The method for machining a workpiece according to claim 1, wherein the workpiece is a core substrate for forming a through hole.

5. 3. The method for processing a workpiece according to claim 1, wherein the workpiece is a printed wiring board for laminating a dry film.

6. 3. The method for processing a workpiece according to claim 1, wherein the workpiece is a printed wiring board for forming via holes.

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