Semiconductor module and semiconductor device

Abstract

To improve a cooling performance and prevent corrosion in a semiconductor module and a semiconductor device with a simple configuration and by easy assembly.SOLUTION: A cooler (30) has a heat radiation base (31) and a plurality of heat radiation fins (32) located on the side opposite to a substrate (20) with respect to the heat radiation base (31), and is attached to a water jacket (110) for flowing a cooling water (W) through the plurality of heat radiation fins (32). A seal member (40) integrally has a seal portion (41) that contacts a surface of the heat radiation base (31) of the cooler (30) on the opposite side to the substrate (20) and extends to the opposite side of the plurality of fins (32), a bottom part (42) having a portion facing a tip (32a) of the plurality of heat radiation fins (32), and connecting portions (43 and 44) that connect the seal portion (41) and the bottom part (42).SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a semiconductor module including a cooler, and a semiconductor device including this semiconductor module and a water jacket. [Background technology]

[0002] Among semiconductor devices used in power conversion devices such as inverter devices, there is known a semiconductor device in which cooling water flows through a plurality of heat dissipation fins in a water jacket to cool a semiconductor element by heat dissipation (see, for example, Patent Documents 1 to 4). A clearance is provided between the plurality of heat dissipation fins and the water jacket to prevent them from contacting each other due to dimensional variations during manufacturing. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 7160216 [Patent Document 2] International Publication No. 2012 / 114475 [Patent Document 3] International Publication No. 2014 / 045758 [Patent Document 4] Japanese Patent Application Laid-Open No. 2007-110025 Summary of the Invention [Problem to be solved by the invention]

[0004] The larger the clearance between the multiple heat dissipation fins and the water jacket, the less cooling water passes through the gaps between the fins, resulting in a deterioration in cooling performance. Furthermore, in the clearance, a local battery is formed due to a potential difference, generating corrosion products. These corrosion products can also clog the gaps between the fins, resulting in a deterioration in cooling performance. However, installing a component to block the clearance makes the structure more complex and requires more time and effort to assemble.

[0005] An object of the present invention is to provide a semiconductor module and a semiconductor device that can improve cooling performance and prevent corrosion with a simple configuration and easy assembly. [Means for solving the problem]

[0006] In one embodiment, a semiconductor module includes a semiconductor element, a substrate, a cooler, and a sealing material. The semiconductor element is mounted on the substrate. The cooler has a heat dissipation base and a plurality of heat dissipation fins located on the heat dissipation base opposite the substrate, and is attached to a water jacket for flowing cooling water through the plurality of heat dissipation fins. The sealing material contacts the surface of the heat dissipation base of the cooler opposite the substrate, and integrally includes a sealing portion extending to the opposite side of the plurality of fins, a bottom having a portion facing the tips of the plurality of fins, and a connecting portion connecting the sealing portion to the bottom. [Effects of the Invention]

[0007] According to the above aspect, in the semiconductor module and the semiconductor device, it is possible to improve the cooling performance and prevent corrosion with a simple configuration and easy assembly. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a front view showing an internal structure of a semiconductor device according to an embodiment; [Figure 2] FIG. 2 is a perspective view of a seal and a water jacket according to an embodiment. [Figure 3] FIG. 2 is an exploded perspective view of a sealing material and a water jacket according to an embodiment. [Figure 4A] 10 is a graph illustrating the difference in thermal resistance depending on whether or not a sealing material is present. [Figure 4B] FIG. 4B is a plan view showing regions 1 to 6 shown in FIG. 4A. [Figure 5] FIG. 10 is an exploded perspective view of a sealing material and a water jacket in a first modified example of the embodiment. [Figure 6] FIG. 10 is an exploded perspective view of a sealing material and a water jacket in a second modified example of the embodiment. [Figure 7] FIG. 11 is an exploded perspective view of a sealing material and a water jacket in a third modified example of the embodiment. [Figure 8] FIG. 10 is an exploded perspective view of a sealing material and a water jacket in a fourth modified example of the embodiment. [Figure 9] FIG. 10 is a perspective view of an O-ring and a water jacket in a comparative example. [Figure 10] FIG. 10 is a front view showing the internal structure of a semiconductor device in a comparative example, illustrating cooling water flowing through a clearance. [Figure 11] FIG. 10 is a front view showing the internal structure of a semiconductor device for explaining a corroded portion in a comparative example. DETAILED DESCRIPTION OF THE INVENTION

[0009] A semiconductor module and a semiconductor device according to an embodiment of the present invention will be described below with reference to the drawings. Note that the present invention is not limited to the embodiment described below, and can be modified and implemented as appropriate within the scope of the present invention.

[0010] FIG. 1 is a front view showing the internal structure of a semiconductor device 100 according to one embodiment.

[0011] 2 and 3 are a perspective view and an exploded perspective view of the seal member 40 and the water jacket 110. FIG.

[0012] 1 to 3 and 5 to 11 described later, the thickness direction of the semiconductor element 10 is defined as the Z direction, and of the X and Y directions that are perpendicular to the Z direction and perpendicular to each other, the flow direction D of the cooling water W is defined as the positive X direction. In some cases, the X direction may be referred to as the left-right direction, the Y direction as the front-back direction, and the Z direction as the up-down direction. These directions are terms used for convenience of explanation, and the corresponding relationships between the X direction, Y direction, and Z direction will change depending on the mounting posture of the semiconductor device 100.

[0013] The semiconductor module 1 according to this embodiment is a power semiconductor module that is applied to a power conversion device such as a power control unit, and constitutes an inverter circuit. The semiconductor module 1 and the semiconductor device 100 that includes the semiconductor module 1 and the water jacket 110 can be used for any purpose, but may be used, for example, as an inverter device for an in-vehicle or industrial motor.

[0014] 1 includes a semiconductor module 1 and a water jacket 110. The semiconductor module 1 includes two semiconductor elements 10, two laminated substrates 20, a cooler 30, a sealing material 40, a case 50, and a sealing resin 60.

[0015] The water jacket 110 is attached to the bottom of the cooler 30 by fastening, for example, screws, at fastening holes 118 at the four corners of the top surface as shown in Fig. 2. These screws may fasten the case 50, the cooler 30, and the water jacket 110 together. The water jacket 110 is provided, for example, in an inverter case of an inverter device.

[0016] The water jacket 110 is made of a die-cast material such as aluminum alloy (ADC12). The water jacket 110 has a rectangular parallelepiped shape with an opening at the top, and as shown in FIG. 1, cooling water W flows inside the water jacket 110, which houses a plurality of heat dissipation fins 32. The cooling water W flows in a flow direction D to the right (positive side of the X direction) so as to pass through the plurality of heat dissipation fins 32 of the cooler 30, and receives heat from the plurality of heat dissipation fins 32. The cooling water W is a liquid such as water containing additives such as antifreeze, anti-rust agents, and antioxidants.

[0017] The bottom surface 111 of the interior of the water jacket 110, through which the cooling water W flows, faces the tips 32a of the multiple heat dissipation fins 32 via the sealing material 40. The front and rear side surfaces 112, 113 (see FIG. 3) of the interior of the water jacket 110 extend in the XZ plane and therefore extend along the flow direction D (positive side of the X direction) in which the cooling water W flows through the multiple heat dissipation fins 32. In this embodiment, the flow direction D is parallel to the short side direction (X direction) of the water jacket 110 in a plan view, but may also be parallel to the long side direction (Y direction) of the water jacket 110 in a plan view.

[0018] As shown in FIG. 1 , an inlet passage 114 for introducing cooling water W into the water jacket 110 is provided from the left end to the interior of the water jacket 110. In addition, a discharge passage 115 for discharging cooling water W from the water jacket 110 is provided from the interior of the water jacket 110 to the right end. The inlet passage 114 extends horizontally from the left end of the water jacket 110, bends vertically upward halfway, and connects to the interior of the water jacket 110. In addition, the discharge passage 115 extends vertically downward from the interior of the water jacket 110, bends horizontally halfway, and extends to the right end of the water jacket 110. The inlet passage 114 and the discharge passage 115 may connect the interior of the water jacket 110 to the lower end of the water jacket 110.

[0019] As shown in Figure 3, the upper surface of the water jacket 110 has an inner wall 116 for holding the inner side of the sealing portion 41 of the sealing material 40 described later, at the inner edge of the part where the area (right and left parts) that is not connected to the side walls 43, 44 is located, and the inner wall 116 is provided so as to protrude toward the heat dissipation base 31 side (upward).

[0020] Furthermore, the inner wall 116 is not provided on the upper surface of the water jacket 110 in the area where the area (front and rear) of the sealing portion 41 connected to the side walls 43, 44 is located. Therefore, the area of ​​the water jacket 110 where the area of ​​the sealing portion 41 of the sealing material 40 connected to the side walls 43, 44 is located (i.e., the area of ​​the upper surface of the water jacket 110 that is more inward than the outer wall 117) forms the same plane.

[0021] Furthermore, a portion of the upper surface of the water jacket 110 that is located closer to the outer periphery than the sealing material 40 functions as an outer wall 117 for holding the outer periphery of the sealing portion 41 of the sealing material 40. The upper surface of the water jacket 110 can also be considered to have a recess between the inner wall 116 and the outer wall 117. The sealing portion 41 of the sealing material 40 may be provided with a protrusion that is inserted between the inner wall 116 and the outer wall 117 (recess) and protrudes downward.

[0022] 1 is mounted on a laminated substrate 20 (circuit board 22) with a bonding material S1, such as solder, and is connected to other circuit boards with conductor wires, metal wiring boards, etc. The semiconductor element 10 is formed in a square or rectangular shape in plan view using a semiconductor substrate made of, for example, silicon (Si), silicon carbide (SiC), gallium nitride (GaN), diamond, or the like.

[0023] The semiconductor element 10 may be a switching element such as an IGBT (Insulated Gate Bipolar Transistor) or a power MOSFET (Metal Oxide Semiconductor Field Effect Transistor), or a diode such as an FWD (Free Wheeling Diode). The switching element and the diode may be connected in anti-parallel. The semiconductor element 10 may also be an RC (Reverse Conducting)-IGBT element in which an IGBT and an FWD are integrated, a power MOSFET element, or an RB (Reverse Blocking)-IGBT element having sufficient withstand voltage against reverse bias.

[0024] A semiconductor element 10 is mounted on each of the two laminated substrates 20. The laminated substrate 20 is an example of a substrate on which the semiconductor element 10 is mounted. The laminated substrate 20 is formed, for example, of a DCB (Direct Copper Bonding) substrate, an AMB (Active Metal Brazing) substrate, or a metal-based substrate. The laminated substrate 20 is formed, for example, in a rectangular shape when viewed from above. Each of the two laminated substrates 20 has an insulating plate 21, a circuit board 22, and a heat sink 23.

[0025] The insulating plate 21 is formed of a ceramic material such as aluminum oxide (Al2O3), aluminum nitride (AlN), silicon nitride (Si3N4), a composite material of aluminum oxide and zirconium oxide (ZrO2), a resin material such as epoxy, or a sealing material such as an epoxy resin material using a ceramic material as a filler. The insulating plate 21 may also be called an insulating layer or an insulating film.

[0026] The circuit board 22 is formed on the upper surface of the insulating plate 21. The number of circuit boards 22 may be any number equal to or greater than one. The circuit board 22 is a metal layer such as copper foil, and, for example, a plurality of circuit boards 22 are formed in the shape of islands on the insulating plate 21 while being electrically insulated from one another. The circuit board 22 may also be called a circuit pattern, a circuit layer, a wiring board, a wiring pattern, a wiring layer, or the like.

[0027] The heat sink 23 is formed on the lower surface of the insulating plate 21. The heat sink 23 is preferably formed from a metal plate with good thermal conductivity, such as copper or aluminum. The heat sink 23 is joined to the upper surface 31a of the heat sink base 31 of the cooler 30 by a joining material S2, such as solder. The heat sink 23 may also be called a heat sink layer.

[0028] The above-described two semiconductor elements 10 and two laminated substrates 20 are arranged on the upper part of the heat dissipation base 31, but these two semiconductor elements 10 and two laminated substrates 20 may be used as one set of semiconductor units, and for example, three sets of semiconductor units forming a three-phase inverter circuit may be arranged. In this way, the number of semiconductor elements 10 and laminated substrates 20 is not particularly limited. Furthermore, although the two semiconductor elements 10 and the two laminated substrates 20 are arranged along the X direction, they may also be arranged in a row along the Y direction. Furthermore, the multiple semiconductor elements 10 used in the three sets of semiconductor units forming the three-phase inverter circuit may also be arranged in a row along the Y direction.

[0029] The cooler 30 has a heat dissipation base 31 and a plurality of heat dissipation fins 32. The cooler 30 is made of, for example, a copper material or an aluminum material.

[0030] The heat dissipation base 31 has, for example, a rectangular plate shape. The laminated substrate 20 (heat dissipation plate 23) is bonded to the upper surface 31a, which is an example of a first surface of the heat dissipation base 31, by the bonding material S2 as described above. The heat dissipation base 31 can be called the top plate of the cooler 30. Note that the laminated substrate 20 may be bonded to the upper surface 31a of the heat dissipation base 31 via, for example, a heat dissipation plate or the like.

[0031] The plurality of heat dissipation fins 32 protrude from a lower surface 31b, which is an example of a second surface of the heat dissipation base 31. As a result, the plurality of heat dissipation fins 32 are located on the opposite side of the heat dissipation base 31 from the laminated substrate 20 (negative side in the Z direction). The heat dissipation fins 32 can be considered open fins exposed to the outside of the cooler 30 below the heat dissipation base 31. The plurality of heat dissipation fins 32 may be formed integrally with the heat dissipation base 31 or may be formed by being fixed to the heat dissipation base 31. The plurality of heat dissipation fins 32 are, for example, pin fins and have a cylindrical shape. The plurality of heat dissipation fins 32 are arranged in multiples in both the X and Y directions. Note that the heat exchange performance of the plurality of heat dissipation fins 32 increases as the flow rate of the cooling water W passing through the heat dissipation fins 32 increases; therefore, the density and arrangement of the heat dissipation fins 32 are designed taking into consideration the balance with the allowable pressure of the pump circulating the cooling water W.

[0032] The multiple heat dissipation fins 32 are not limited to cylindrical pin fins, but may also be pin fins of other shapes such as polygonal pillars, flat fins (plate fins), curved plate fins (corrugated fins), etc., and are not particularly limited.

[0033] 3, the sealing material 40 integrally includes a sealing portion 41, a bottom portion 42, and opposing side walls 43 and 44, which are an example of connecting portions. The sealing material 40 has insulating properties. The sealing material 40 may be made of a rubber material (elastic body) such as silicone rubber or ethylene propylene rubber. The sealing material 40 may be fixed by being fitted into the water jacket 110, or may be fixed to the water jacket 110 or the cooler 30 by adhesive or the like.

[0034] The seal portion 41 extends opposite the heat dissipation fins 32 and is interposed between the heat dissipation base 31 of the cooler 30 and the water jacket 110 so as to surround the opening in the upper surface of the water jacket 110. In other words, the lower surface 31b of the heat dissipation base 31 and the water jacket 110 come into contact with the seal portion 41, sealing the inside of the water jacket 110. The seal portion 41 can be considered to be a rectangular frame-shaped O-ring (seal ring).

[0035] 1, the bottom portion (bottom wall) 42 of the sealing material 40 is disposed on at least a portion of the bottom surface 111 inside the water jacket 110 and is flat. The bottom portion 42 has a portion that faces the tips 32a of the multiple heat dissipation fins 32. The bottom portion 42 is preferably disposed on the bottom surface 111 of the water jacket 110 so as to face the tips 32a of all the heat dissipation fins 32. However, the bottom portion 42 may be disposed so as to face the tips 32a of only some of the heat dissipation fins 32.

[0036] The bottom 42 is preferably made of an elastic material as described above to prevent the heat dissipation fins 32 (cooler 30) from being pressed upward by the bottom 42 when the heat dissipation fins 32 expand downward (negative side in the Z direction) due to thermal expansion, thereby preventing the seal between the cooler 30 and the water jacket 110 from being impaired or the heat dissipation fins 32 from being deformed. Note that thermal expansion can cause not only expansion of the heat dissipation fins 32 in the negative Z direction, but also expansion of the heat dissipation fins 32 in the X and Y directions and expansion of the water jacket 110 toward the heat dissipation fins 32. Therefore, it is preferable that the entire sealing material 40 be made of an elastic material as described above so that it can follow the thermal deformation of the heat dissipation fins 32 and the water jacket 110.

[0037] The side wall 43 (first side wall) is disposed on at least a portion of the side surface 112, which is the front surface of the interior of the water jacket 110, and is flat. The side wall 44 (second side wall) is disposed on at least a portion of the side surface 113, which is the rear surface of the interior of the water jacket 110, and is flat. The side walls 43, 44 extend along the flow direction D in which the coolant W flows through the multiple heat dissipation fins 32, and have portions that face the multiple heat dissipation fins 32. The side walls 43, 44 are preferably formed to be equal to or larger than the area in the X direction in which the multiple heat dissipation fins 32 are arranged. As shown in FIG. 1 , portions of the seal portion 41 are located across the upper portions of the right and left side surfaces of the interior of the water jacket 110.

[0038] The side walls 43, 44 are an example of a connecting portion that connects the sealing portion 41 and the bottom portion 42. This connecting portion may be one of the side walls 43, 44, or may be located on the left or right side surface inside the water jacket 110, or may be a band-like (string-like) portion that is longer in the Z direction than in the X and Y directions. The side walls 43, 44 are arranged opposite each other, and the multiple heat dissipation fins 32 are surrounded by the bottom portion 42 and the side walls 43, 44.

[0039] The thickness (Z direction) of the bottom 42 should match the clearance between the plurality of heat dissipation fins 32 and the bottom surface 111 of the water jacket 110 at the temperature before the semiconductor element 10 generates heat. The thickness (Y direction) of the side walls 43, 44 should match the clearance between the plurality of heat dissipation fins 32 and the side surfaces 112, 113 of the water jacket 110 at the temperature before the semiconductor element 10 generates heat.

[0040] At least one of the bottom 42, the side wall 43, and the side wall 44 may have a thickness that is partially thicker or thinner. For example, the thickness of the bottom 42 and the side walls 43, 44 may be partially thickened so that the cooling water W can easily pass between some of the heat dissipation fins 32 by narrowing the clearance between the heat dissipation fins 32 and the water jacket 110, or conversely, the thickness of the bottom 42 may be partially thinned below the heat dissipation fins 32 that become hot and tend to expand downward (toward the negative side in the Z direction) due to thermal expansion.

[0041] The case 50 has a rectangular frame shape and is located above the heat dissipation base 31 so as to surround the two semiconductor elements 10 and the two laminated substrates 20. The case 50 is made of, for example, resin.

[0042] The sealing resin 60 is filled in the case 50 so as to cover the two semiconductor elements 10 and the two laminated substrates 20. The sealing resin 60 is made of, for example, a resin or a gel. The sealing resin 60 may be formed by transfer molding or potting.

[0043] Fig. 4A is a graph for explaining the difference in thermal resistance Rth depending on whether or not there is a sealing material 40. Fig. 4B is a plan view showing regions 1 to 6 shown in Fig. 4A, which will be described later.

[0044] "Without sealing material" shown in Fig. 4A is an example in which an O-ring 240 is disposed between the heat dissipation base 31 and the water jacket 110 instead of the sealing material 40, as shown in Figs. 9 to 11 of the comparative example. "With sealing material" is an example in which the sealing material 40 is disposed as shown in Figs. 1 to 3 of the present embodiment.

[0045] The thermal resistance Rth [°C / W] is the thermal resistance from the bonding material S1 that bonds the semiconductor element 10 and the laminated substrate 20 to the cooling water W. Regions 1 to 6 correspond to regions 1 to 6 in FIG. 4B, which will be described later. Regions 1 to 6 shown in FIG. 4B are arranged in a line along the Y direction. Each of regions 1 to 6 corresponds to the position where one semiconductor element 10 is arranged.

[0046] 4A, when the sealant 40 is provided, the thermal resistance Rth is smaller in each region than when the O-ring 240 is provided. The reason why the thermal resistance Rth can be reduced in this manner is that the sealant 40 (bottom 42 and side walls 43, 44) is provided in the clearance between the plurality of heat dissipation fins 32 and the water jacket 110, thereby making it easier for the cooling water W to pass between the plurality of heat dissipation fins 32. Note that a similar effect can be obtained when three sets of semiconductor units, each having two semiconductor elements 10 aligned in the flow direction D (X direction) of the cooling water W, are arranged along the Y direction as shown in FIG. 1.

[0047] FIG. 5 is an exploded perspective view of the seal material 40 and the water jacket 120 in the first modified example of the present embodiment.

[0048] The sealing material 40 shown in FIG. 5 can be the same as the sealing material 40 shown in FIG. 3 and the like.

[0049] The water jacket 120 is the same as the water jacket 110 shown in Figure 3 etc., except that the two inner walls 116 are omitted. That is, like the water jacket 110, the water jacket 120 has a bottom surface 121, side surfaces 122 and 123, an inlet passage 124, a discharge passage (not shown), an outer wall 127, and four fastening holes 128.

[0050] In the water jacket 120, by omitting the two inner walls 116, the portion where the sealing portion 41 of the sealing material 40 is arranged (i.e., the region of the upper surface of the water jacket 120 that is more inward than the outer wall 127) forms the same plane (for example, a horizontal plane). Note that the upper surface of the water jacket 120 can also be considered to have a recess between the interior and the outer wall 127.

[0051] Since the water jacket 120 does not have the inner wall 116, the convex portion of the sealing portion 41 inserted into the concave portion between the inner wall 116 and the outer wall 127 can be omitted.

[0052] FIG. 6 is an exploded perspective view of the seal material 70 and the water jacket 130 in a second modified example of the present embodiment.

[0053] The sealing material 70 shown in FIG. 6 has a sealing portion 71, a bottom portion 72, side walls 73 and 74 which are an example of connecting portions, and two jacket-side protrusions 75 (shown by hidden dashed lines).

[0054] The sealing portion 71 is interposed between the heat dissipation base 31 of the cooler 30 and the water jacket 130, and seals the inside of the water jacket 130. The sealing portion 71 has a flat frame shape that extends over the area of ​​the top surface of the water jacket 130, avoiding the four fastening holes 138.

[0055] The jacket side protrusions 75 protrude downward (opposite the heat dissipation base 31) from the right rear and left front portions of the bottom surface of the seal portion 71. The two jacket side protrusions 75 are inserted into recesses 139 provided on the upper surface of the water jacket 130.

[0056] The number of jacket-side protrusions 75 may be any number equal to or greater than one. Furthermore, instead of or together with the jacket-side protrusions 75, a jacket-side recess that is recessed upward (toward the heat dissipation base 31) and into which a protrusion provided on the water jacket 130 is inserted may be provided. Furthermore, the sealing material 70 may be provided with at least one of a cooler-side protrusion that is inserted into a recess that is provided on the cooler 30, and a cooler-side recess into which a protrusion provided on the cooler 30 is inserted.

[0057] In other respects, the seal material 70 can be similar to the seal material 40 shown in FIG. 3 and described above.

[0058] Compared to the water jacket 110 shown in Figure 3 etc., the water jacket 130 has two inner walls 116 and an outer wall 117 omitted and two recesses 139 added. That is, like the water jacket 110, the water jacket 130 has a bottom surface 131, side surfaces 132 and 133, an inlet passage 134, a discharge passage (not shown), and four fastening holes 138. The water jacket 130 also has two recesses 139 into which the above-mentioned jacket side protrusions 75 are inserted.

[0059] Since the two inner walls 116 and the outer wall 117 of the water jacket 130 are omitted, the entire upper surface of the water jacket 130, including the portion where the sealing portion 71 of the sealing material 70 is arranged, forms the same plane (e.g., a horizontal plane).

[0060] FIG. 7 is an exploded perspective view of a seal member 80 and a water jacket 110 in a third modified example of the present embodiment.

[0061] The sealing material 80 shown in FIG. 7 has a sealing portion 81, a bottom portion 82, side walls 83 and 84 which are an example of a connecting portion, and four through holes 86.

[0062] The sealing portion 81 is interposed between the heat dissipation base 31 of the cooler 30 and the water jacket 110, and seals the inside of the water jacket 110. The sealing portion 81 has a flat frame shape that extends over the entire upper surface of the water jacket 110.

[0063] The overall size of the sealing portion 81 in the X and Y directions is the same as the size of the upper surface of the water jacket 110, for example.

[0064] The four through holes 86 are used to insert screws that fasten the heat dissipation base 31 of the cooler 30 to the water jacket 110 (to the case 50). The through holes 86 are provided at the four corners of the sealing material 80 in a plan view, but may be provided at only two corners that are diagonally opposite to each other among the four corners.

[0065] The water jacket 110 shown in FIG. 7 may be similar to the water jacket 110 shown in FIG. 3 and the like.

[0066] FIG. 8 is an exploded perspective view of the seal material 80 and the water jacket 140 in the fourth modified example of the present embodiment.

[0067] The sealant 80 shown in FIG. 8 can be similar to the sealant 80 shown in FIG. 7 and described above.

[0068] The water jacket 140 is the water jacket 130 shown in Figure 6 with the two recesses 139 omitted. That is, like the water jacket 130, the water jacket 140 has a bottom surface 141, side surfaces 142 and 143, an inlet passage 144, a discharge passage (not shown), and four fastening holes 148.

[0069] 9 to 11, an O-ring 240 is disposed in place of the sealing material 40. Furthermore, the water jacket 210 of the comparative example differs from the water jacket 110 shown in FIG. 3 etc. in that an inner wall 216 is provided along the entire inner peripheral edge of the top surface of the water jacket 210, surrounding the interior of the water jacket 210. In other words, the water jacket 210 has a bottom surface 211, side surfaces 212, 213, an inlet passage 214, a discharge passage 215, an inner wall 216, an outer wall 217, and four fastening holes 218.

[0070] In this comparative example, since the sealing material 40 is not provided, there is little resistance to water flow in the clearance between the multiple heat dissipation fins 32 and the water jacket 210 (bottom surface 211 and side surfaces 212, 213). Therefore, as shown in Fig. 10, when the cooling water W flows through this clearance, the flow rate (flow velocity) of the cooling water W passing through the heat dissipation fins 32 relatively decreases, and the cooling performance cannot be fully exhibited. Therefore, adopting a structure that makes it difficult for the cooling water W to flow through the clearance or high-precision machining that reduces tolerances would increase costs.

[0071] Furthermore, in the clearance between the multiple heat dissipation fins 32 and the water jacket 210, if the multiple heat dissipation fins 32 (cooler 30) are made of copper and the water jacket 210 is made of die-cast material, a local battery is formed due to the potential difference between the dissimilar metals when they are close to each other and filled with cooling water W, and corrosion products such as aluminum hydroxide (Al(OH)3) are generated. Such corrosion, particularly of the water jacket 210, can cause corrosion products to adhere between the multiple heat dissipation fins 32 and between the heat dissipation base 31 and the inner wall 216 of the water jacket 210, as shown by the corroded area C indicated by the dashed line in Figure 11, or can form localized pitting corrosion P in the water jacket 210.

[0072] In the present embodiment described above, the semiconductor module 1 includes a semiconductor element 10, a laminated substrate 20 (an example of a substrate), a cooler 30, and a sealing material 40. The semiconductor element 10 is mounted on the laminated substrate 20. The cooler 30 includes a heat dissipation base 31 and a plurality of heat dissipation fins 32 located on the heat dissipation base 31 opposite the laminated substrate 20. A water jacket 110 is attached to the heat dissipation base 31 for flowing cooling water W through the plurality of heat dissipation fins 32. The sealing material 40 contacts a lower surface 31b of the heat dissipation base 31 of the cooler 30 opposite the laminated substrate 20, and integrally includes a sealing portion 41 extending to the opposite side of the plurality of heat dissipation fins 32, a bottom 42 having a portion facing the tips 32a of the plurality of heat dissipation fins 32, and side walls 43, 44 (an example of a connecting portion) connecting the sealing portion 41 and the bottom 42.

[0073] In this embodiment, the semiconductor device 100 includes the semiconductor module 1 and a water jacket 110.

[0074] In the semiconductor module 1 and the semiconductor device 100, a sealant 40 is disposed in a clearance between the heat dissipation fins 32 and the water jacket 110 to prevent them from contacting each other due to dimensional variations during manufacturing. This allows the cooling water W to easily pass between the heat dissipation fins 32, improving cooling performance. Furthermore, by disposing the sealant 40 between the heat dissipation fins 32 and the water jacket 110, the formation of a local battery due to a potential difference can be suppressed. This prevents corrosion of the water jacket 110 or the heat dissipation fins 32, and prevents accumulated corrosion products from clogging between the heat dissipation fins 32, which can lead to deterioration of cooling performance and pressure loss. Furthermore, the sealant 40 has a seal portion 41 for sealing the interior of the water jacket 110 and a bottom portion 42 that are integrated together. This allows the semiconductor module 1 and the semiconductor device 100 to have a simpler configuration than when the seal portion 41 and the bottom portion 42 are separate. Furthermore, if the clearance is closed using the bottom portion 42 separate from the sealing portion 41, assembly requires time and effort due to the need to fix and position the bottom portion 42. Therefore, according to this embodiment, it is possible to improve cooling performance and prevent corrosion with a simple configuration and easy assembly. Furthermore, by improving the cooling performance (heat dissipation performance) as described above, it is possible to improve the output and miniaturize the semiconductor module 1, reduce the cost of chip shrink, and improve reliability by suppressing the heat generation temperature. Furthermore, since the design can be performed without concern for contact between the heat dissipation fins 32 and the bottom surface 111 of the water jacket 110 or the formation of a local battery, it is also possible to relax the tolerance requirements regarding the flatness of the heat dissipation fins 32 and the water jacket 110.

[0075] In addition, in this embodiment, the connecting portion connecting the sealing portion 41 of the sealing material 40 to the bottom 42 includes side walls 43, 44 arranged on at least a portion of at least one of the side surfaces 112, 113 inside the water jacket 110 extending along the flow direction D in which the cooling water W flows through the multiple heat dissipation fins 32.

[0076] This not only closes the clearance between the tip 32a of the heat dissipation fin 32 and the bottom surface 111 of the water jacket 110, but also closes the clearance between the heat dissipation fin 32 and the side surfaces 112, 113 of the water jacket 110. This further improves cooling performance. It also prevents corrosion not only on the bottom surface 111 of the water jacket 110 but also on the side surfaces 112, 113. This further improves cooling performance and prevents corrosion. In addition, compared to when the side walls 43, 44 are separate from the sealing portion 41 and the bottom 42, it is possible to achieve a simpler configuration and easier assembly.

[0077] In this embodiment, the side walls 43 (first side walls) and 44 (second side walls) are disposed opposite each other, and the heat dissipation fins 32 are surrounded by the bottom portion 42 and the side walls 43 and 44.

[0078] Therefore, by disposing the sealant 40 in the clearance between the plurality of heat dissipation fins 32 and the bottom surface 111 and the side surfaces 112, 113 of the water jacket 110, it is possible to improve the cooling performance and prevent corrosion on all of the bottom surface 111, the side surfaces 112, and the side surfaces 113. Furthermore, compared to when at least one of the two side walls 43, 44 is separate from the seal portion 41 or the bottom portion 42, it is possible to achieve an even simpler configuration and even easier assembly.

[0079] In addition, in the third (Figure 7) and fourth (Figure 8) variants of this embodiment, the sealing material 80 has through holes 86 into which screws are inserted to fasten the heat dissipation base 31 of the cooler 30 to the water jackets 110, 140.

[0080] This allows the fixing and positioning of the seal material 80 to be performed by fixing the cooler 30 and the water jacket 110. This further facilitates assembly.

[0081] In addition, in a second variant of this embodiment (Figure 6), the sealing material 70 includes at least one of a jacket side convex portion 75 that protrudes on the opposite side of the heat dissipation base 31 and is inserted into a recess 139 provided in the water jacket 130, and a jacket side recess that is recessed toward the heat dissipation base 31 and into which a convex portion provided in the water jacket 130 is inserted.

[0082] This allows the sealing material 70 to be positioned relative to the water jacket 130, further facilitating assembly. In the water jacket 130 shown in Figure 6, which does not have the inner wall 116 and the outer wall 117 (see Figure 3), the sealing portion 71 is not held by the inner wall 116 and the outer wall 117, so it is particularly effective to position the sealing material 70 relative to the water jacket 130 by providing a jacket-side convex portion 75 (or a jacket-side concave portion).

[0083] In addition, in the first variant (Figure 5), second variant (Figure 6), and fourth variant (Figure 8) of this embodiment, the water jackets 120, 130, and 140 have the same plane at the portions where the sealing portions 41, 71, and 81 of the sealing materials 40, 70, and 80 are arranged (the portions interposed between the heat dissipation base 31 and the water jackets 120, 130, and 140).

[0084] 3 can be omitted from the water jackets 120, 130, 140. This allows for a simpler configuration. Also, the water jackets 120, 130, 140 can be easily molded.

[0085] In the present embodiment (FIG. 3) and the third modified example (FIG. 7), the water jacket 110 has a flush surface at the portion where the areas of the sealing portions 41, 81 of the sealing material 40, 80 that are connected to the side walls 43, 44, 83, 84 (i.e., the front and rear portions of the sealing portions 41, 81) are located (i.e., the area of ​​the upper surface of the water jacket 110 that is more inward than the outer wall 117). The water jacket 110 also has an inner wall 116 that protrudes toward the heat dissipation base 31 at the inner peripheral edge of the portion where the areas of the sealing portions 41, 81 of the sealing material 40, 80 that are not connected to the side walls 43, 44, 83, 84 (i.e., the left and right portions of the sealing portions 41) are located.

[0086] This allows for an even simpler configuration in the areas of the sealing portions 41, 81 that are connected to the side walls 43, 44, 83, 84 by omitting the inner wall 116 of the water jacket 110 so as not to interfere with the sealing materials 40, 80. Also, in the areas of the sealing portions 41, 81 that are not connected to the side walls 43, 44, 83, 84, the inner wall 116 holds the sealing materials 40, 80, allowing the positioning of the sealing materials 40, 80, further facilitating assembly.

[0087] Below, some of the inventions described in the specification and drawings of this application will be additionally noted.

[0088] <Appendix 1> A semiconductor element; a substrate on which the semiconductor element is mounted; a cooler having a heat dissipation base and a plurality of heat dissipation fins located on the opposite side of the heat dissipation base from the substrate, the cooler being attached to a water jacket for causing cooling water to flow through the plurality of heat dissipation fins; a sealing material that contacts a surface of the heat dissipation base of the cooler opposite to the substrate and that integrally includes a sealing portion that extends to the opposite side of the plurality of fins, a bottom portion that has a portion that faces the tips of the plurality of fins, and a connecting portion that connects the sealing portion and the bottom portion; A semiconductor module comprising:

[0089] <Appendix 2> The connecting portion of the sealing material extends in a flow direction in which the cooling water flows through the plurality of heat dissipation fins, and includes a side wall having a portion facing the plurality of heat dissipation fins. 2. The semiconductor module according to claim 1.

[0090] <Appendix 3> The side wall includes a first side wall and a second side wall disposed opposite the first side wall, The plurality of heat dissipation fins are surrounded by the bottom, the first side wall, and the second side wall. 3. The semiconductor module according to claim 2.

[0091] <Appendix 4> The sealing material has through holes into which screws are inserted to fasten the heat dissipation base of the cooler to the water jacket when the water jacket is attached to the cooler. 2. The semiconductor module according to claim 1.

[0092] <Appendix 5> The sealing material includes at least one of a jacket-side convex portion that protrudes on the side opposite to the heat dissipation base and a jacket-side concave portion that is recessed toward the heat dissipation base. 2. The semiconductor module according to claim 1.

[0093] <Appendix 6> A semiconductor module according to any one of appendixes 1 to 5; The water jacket A semiconductor device comprising:

[0094] <Appendix 7> The water jacket has a portion where the sealing portion of the sealing material is disposed and a bottom surface where the bottom of the sealing material is disposed. 7. The semiconductor device according to claim 6,

[0095] <Appendix 8> The water jacket has a portion where the sealing portion of the sealing material is arranged in the same plane. 8. The semiconductor device according to claim 7,

[0096] <Appendix 9> The water jacket has a flush surface at a portion of the sealing portion of the sealing material where the region connected to the connecting portion is disposed, and an inner wall that protrudes toward the heat dissipation base of the cooler at an inner circumferential edge of the portion of the sealing material where the region not connected to the connecting portion is disposed. 8. The semiconductor device according to claim 7, [Industrial Applicability]

[0097] As described above, the present invention has the effect of improving cooling performance and preventing corrosion in semiconductor modules and semiconductor devices with a simple configuration and easy assembly, and is particularly useful for inverter devices for industrial or electrical equipment. [Explanation of symbols]

[0098] 1. Semiconductor module 10 Semiconductor elements 20 Multilayer substrate (substrate) 21 Insulating plate 22 circuit board 23 Heat sink 30 Cooler 31 Heat dissipation base 31a Top surface 31b Bottom surface 32 Heat dissipation fin 32a tip 40,70,80 sealing material 41,71,81 Seal part 42,72,82 bottom 43,44,73,74,83,84 Side wall 75 Jacket side convex part 86 Through hole 50 cases 60 Sealing resin 100 Semiconductor device 110,120,130,140 Water Jacket 111,121,131,141 bottom 112,113,122,123,132,133,142,143 Side 114,124,134,144 Introductory road 115 Exhaust channel 116 Interior wall 117,127 exterior walls 118,128,138,148 Fastening holes 139 Recess 210 Water Jacket 211 bottom 212,213 Side 214 Introductory path 215 Exhaust channel 216 Inner wall 217 Exterior Wall 218 Fastening holes 240 O-rings C Corroded area D Flow direction P pitting corrosion S1,S2 Bonding material W Cooling water

Claims

1. A semiconductor element; a substrate on which the semiconductor element is mounted; a cooler having a heat dissipation base and a plurality of heat dissipation fins located on the opposite side of the heat dissipation base from the substrate, the cooler being attached to a water jacket for causing cooling water to flow through the plurality of heat dissipation fins; a sealing material that contacts a surface of the heat dissipation base of the cooler opposite to the substrate and that integrally includes a sealing portion that extends to the opposite side of the plurality of fins, a bottom portion that has a portion that faces the tips of the plurality of fins, and a connecting portion that connects the sealing portion and the bottom portion; A semiconductor module comprising:

2. The connecting portion of the sealing material extends in a flow direction in which the cooling water flows through the plurality of heat dissipation fins, and includes a side wall having a portion facing the plurality of heat dissipation fins.

2. The semiconductor module according to claim 1.

3. The side wall includes a first side wall and a second side wall disposed opposite the first side wall, The plurality of heat dissipation fins are surrounded by the bottom, the first side wall, and the second side wall.

3. The semiconductor module according to claim 2.

4. The sealing material has through holes into which screws are inserted to fasten the heat dissipation base of the cooler to the water jacket when the water jacket is attached to the cooler.

2. The semiconductor module according to claim 1.

5. The sealing material includes at least one of a jacket-side convex portion that protrudes on the side opposite to the heat dissipation base and a jacket-side concave portion that is recessed toward the heat dissipation base.

2. The semiconductor module according to claim 1.

6. A semiconductor module according to any one of claims 1 to 5; The water jacket A semiconductor device comprising:

7. The water jacket has a portion where the sealing portion of the sealing material is disposed and a bottom surface where the bottom of the sealing material is disposed.

7. The semiconductor device according to claim 6.

8. The water jacket has a portion where the sealing portion of the sealing material is arranged in the same plane.

8. The semiconductor device according to claim 7.

9. The water jacket has a flush surface at a portion of the sealing portion of the sealing material where the region connected to the connecting portion is disposed, and an inner wall that protrudes toward the heat dissipation base of the cooler at an inner circumferential edge of the portion of the sealing material where the region not connected to the connecting portion is disposed.

8. The semiconductor device according to claim 7.

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