Injection molding machine, injection device, mold clamping device, and data processing method

Abstract

To provide a technique capable of easily performing data communication with each of a control device on an injection device side and a control device on a mold clamping device side.SOLUTION: An injection molding machine 1 comprises: an injection device 20 for injecting an injection material into molds 17 and 18; and a mold clamping device 10 for clamping the molds 17 and 18. An injection control device 40 for controlling injection of the injection material by the injection device 20 is connected to a mold clamping control device 30 for controlling magnet clamps 91 and 92 of the mold clamping device 10 so as to be able to perform data communication with the mold clamping control device.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to an injection molding machine, an injection unit, a mold clamping unit, and a data processing method. [Background technology]

[0002] Injection molding machines that manufacture molded products by injecting an injection material into a mold are known. For example, Patent Document 1 (JP 2023-155538 A) discloses an injection molding machine that includes a mold clamping device that clamps a mold and an injection device that injects an injection material into the mold attached to the mold clamping device. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2023-155538 Summary of the Invention [Problem to be solved by the invention]

[0004] The clamping device of the injection molding machine is equipped with a control device that controls a magnetic clamp that can detachably attach a mold. Also, the injection device of the injection molding machine controls the injection of injection material into the mold by a control device separate from the control device dedicated to the magnetic clamp. In this way, the injection molding machine is configured to manufacture molded products in accordance with two control devices that control the injection device and the clamping device, respectively.

[0005] Here, when a test run of the injection molding machine is performed before the injection molding machine is shipped from the factory, or when servicing the injection molding machine after it is delivered to a customer, the user needs to use a user device to set initial setting data, etc., in each of the two control devices described above. In this case, the user needs to connect the user device separately to each of the control device on the injection unit side and the control device on the mold clamping unit side, which results in poor work efficiency.

[0006] The present disclosure has been made to solve such problems, and its purpose is to provide a technology that can easily perform data communication with each of the control device on the injection device side and the control device on the mold clamping device side. [Means for solving the problem]

[0007] An injection molding machine according to one embodiment includes an injection device that injects an injection material into a mold and a mold clamping device that clamps the mold. An injection control device that controls the injection of the injection material by the injection device is connected to a mold clamping control device that controls a magnetic clamp of the mold clamping device so as to be able to communicate data with each other.

[0008] An injection device according to one embodiment includes an injection control device that controls the injection of an injection material and is connected to a mold clamping control device that controls a magnetic clamp of a mold clamping device so as to be capable of data communication.

[0009] A mold clamping device according to one embodiment includes a mold clamping control device that controls a magnetic clamp and is connected to an injection control device that controls the injection of an injection material by an injection device so as to be capable of data communication.

[0010] A data processing method according to one embodiment includes the steps of acquiring injection control data for controlling the injection of injection material from a user device, storing the injection control data, acquiring clamping control data for controlling a magnetic clamp from the user device, and outputting the clamping control data to a clamping control device that controls the magnetic clamp. [Effects of the Invention]

[0011] According to the present disclosure, the injection control device on the injection device side and the mold clamping control device on the mold clamping device side are connected so that data communication is possible, so that a user can communicate data with the mold clamping control device via the injection control device simply by communicating data with the injection control device, and data communication with each of the injection control device and the mold clamping control device can be easily performed. [Brief explanation of the drawings]

[0012] [Figure 1] 1 is a schematic diagram showing an injection molding system according to an embodiment; [Figure 2] FIG. 1 is a schematic diagram showing an injection molding system according to a comparative example. [Figure 3] 1 is a block diagram showing the internal configurations of an injection control device, a mold clamping control device, and a user device included in an injection molding system according to an embodiment. FIG. [Figure 4] FIG. 10 is a diagram illustrating an example of a setting screen for a magnetic clamp displayed on a display device of a user device according to an embodiment. [Figure 5] FIG. 10 is a diagram showing an example of a setting screen for the injection device displayed on a display device of the user device according to the embodiment. [Figure 6] FIG. 10 is a diagram illustrating an example of a confirmation screen for the state of the magnetic clamp displayed on the display device of the user device according to the embodiment. [Figure 7] FIG. 4 is a diagram showing an example of a range of addresses shared between the injection control device and the mold clamping control device according to the embodiment. [Figure 8] 5 is a diagram showing the contents of coil data shared between the injection control device and the mold clamping control device according to the embodiment. FIG. [Figure 9] FIG. 10 is a diagram showing the contents of input status data shared between the injection control device and the mold clamping control device according to the embodiment. [Figure 10] FIG. 10 is a diagram showing the contents of input register data shared between the injection control device and the mold clamping control device according to the embodiment. [Figure 11] 10 is a diagram showing the contents of holding register data shared between the injection control device and the mold clamping control device according to the embodiment. FIG. [Figure 12] 4 is a flowchart showing an example of processing relating to injection control data and mold clamping control data executed by the injection molding machine according to the embodiment. [Figure 13] 10 is a flowchart illustrating an example of a process related to status data executed by the injection molding machine according to the embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0013] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. In the drawings, the same or corresponding parts are designated by the same reference numerals, and description thereof will not be repeated.

[0014] <Main components of an injection molding system> The configuration of an injection molding system 1000 according to an embodiment will be described with reference to Fig. 1. Fig. 1 is a schematic diagram showing the injection molding system 1000 according to an embodiment. As shown in Fig. 1, the injection molding system 1000 includes an injection molding machine 1 and a user device 100.

[0015] The injection molding machine 1 includes a mold clamping device 10 that clamps molds 17, 18, and an injection device 20 that injects an injection material into the molds. The injection molding machine 1 is configured to produce a molded product by injecting the injection material from the injection device 20 into the molds 17, 18 attached to the mold clamping device 10. The injection material includes, for example, a plastic material called pellets.

[0016] The injection molding process for producing molded products using the injection molding machine 1 includes a mold closing process, an injection process, a pressure holding process, a mold opening process, a plasticizing process, and an ejection process. The injection molding machine 1 can produce one molded product by performing the injection molding process, which includes these multiple processes, once, and can produce multiple molded products by performing the injection molding process repeatedly. The injection molding machine 1 can produce molded products with various shapes and materials, and performs different injection molding processes depending on the shape and material of the molded product.

[0017] The mold clamping device 10 includes a bed 11, a fixed platen 12, a movable platen 13, a mold clamping housing 14, tie bars 15, a mold clamping mechanism 16, molds 17 and 18, a ball screw 19, a mold clamping control device 30, servo motors 81 and 82, magnetic clamps 91 and 92, a temperature sensor 94, and a magnetic field sensor 95.

[0018] A fixed platen 12, a clamping housing 14, and a movable platen 13 are arranged on the bed 11. The clamping housing 14 and the movable platen 13 are each configured to be slidable in a certain direction (for example, a direction parallel to the surface on which the bed 11 is arranged) on the bed 11. Tie bars 15 are arranged between the fixed platen 12 and the clamping housing 14, and connect the fixed platen 12 and the clamping housing 14 together.

[0019] The movable platen 13 is disposed between the fixed platen 12 and the mold clamping housing 14, and is penetrated by a tie bar 15 that connects the fixed platen 12 and the mold clamping housing 14. The movable platen 13 is configured to be slidable on the bed 11 between the fixed platen 12 and the mold clamping housing 14 in a certain direction (for example, a direction parallel to the surface on which the bed 11 is placed).

[0020] The mold clamping mechanism 16 is disposed between the mold clamping housing 14 and the movable platen 13 and includes a toggle mechanism. The mold clamping mechanism 16 utilizes the toggle mechanism to move the movable platen 13 closer to the mold clamping housing 14 fixed on the bed 11 or move the movable platen 13 away from the mold clamping housing 14.

[0021] Magnetic clamp 91 is fixedly attached to fixed platen 12. Magnetic clamp 92 is fixedly attached to movable platen 13. Magnetic clamps 91 and 92 include a flat magnetic clamp plate 93, and the surface of magnetic clamp plate 93 of magnetic clamp 91 faces the surface of magnetic clamp plate 93 of magnetic clamp 92. A mold 17 is detachably attached to the surface of magnetic clamp 91 facing magnetic clamp 92. A mold 18 is detachably attached to the surface of magnetic clamp 92 facing magnetic clamp 91.

[0022] A magnet core 96 including a permanent magnet, a permanent electromagnet, and a coil is provided on the magnet clamp plate 93 of each of the magnet clamps 91, 92. The magnet clamps 91, 92 can attach and detach the molds 17, 18 depending on whether or not power is supplied to the magnet core 96 from the mold clamping control device 30.

[0023] Specifically, when a current is supplied to the magnet core 96 from the mold clamping control device 30, the magnetic poles of the permanent electromagnet are reversed, the magnetic field lines of the permanent magnet and the permanent electromagnet cancel each other out, and no magnetic field lines are generated from the surface of the magnetic clamp plate 93. As a result, no magnetizing force is generated in the magnetic clamp plate 93, and the molds 17, 18 are removed from the magnetic clamps 91, 92. This state of the magnetic clamps 91, 92 from which the molds 17, 18 have been removed is also referred to as an "unclamped state."

[0024] On the other hand, when a current is supplied from the mold clamping control device 30 to the magnet core 96 in the unclamped state, the magnetic poles of the permanent electromagnet return to their original state. In this case, the magnetic field lines of the permanent magnet and the permanent electromagnet do not cancel each other out, but rather combine and strengthen, generating magnetic field lines from the surface of the magnet clamp plate 93. This generates a strong magnetizing force in the magnet clamp plate 93, and the molds 17, 18 are attached to the magnet clamps 91, 92. This state of the magnet clamps 91, 92 with the molds 17, 18 attached is also referred to as the "clamped state."

[0025] The temperature sensor 94 is provided on the magnet clamp plate 93 and measures the temperature of the magnet clamp plate 93. Temperature data indicating the temperature measured by the temperature sensor 94 is transmitted to the mold clamping control device 30. The magnetic field sensor 95 is provided on the magnet clamp plate 93 and measures the strength of the magnetic field due to the magnetic field lines generated from the magnet clamp plate 93. Magnetic field data indicating the strength of the magnetic field measured by the magnetic field sensor 95 is transmitted to the mold clamping control device 30.

[0026] The servo motor 81 is provided in the mold clamping housing 14. The servo motor 81 drives the mold clamping mechanism 16 via the ball screw 19 under the control of the mold clamping control device 30. The ball screw 19 converts the rotational motion of the servo motor 81 into linear motion and transmits it to the mold clamping mechanism 16, thereby driving the mold clamping mechanism 16.

[0027] The mold 17 attached to the fixed platen 12 and the mold 18 attached to the movable platen 13 are arranged facing each other between the fixed platen 12 and the movable platen 13. The mold 18 moves closer to or farther away from the mold 17 as the movable platen 13 slides on the bed 11 due to the drive of the mold clamping mechanism 16.

[0028] Thus, the mold closing step of the injection molding process includes a step in which the molds 17, 18 transition from a separated state to a closely contacted state, and the mold opening step of the injection molding process includes a step in which the molds 17, 18 transition from a closely contacted state to a separated state.

[0029] The servo motor 82 is provided on the movable platen 13. The servo motor 82 protrudes a pin into the mold 18 and pulls the pin out from the mold 18 under the control of the mold clamping control device 30. When the pin protrudes into the mold 18, the molded product that is in close contact with the mold 18 is removed.

[0030] Thus, the ejection step of the injection molding process involves removing the molded article from the mold 18, which has been intimately attached to the mold 18.

[0031] The injection device 20 includes a base 21, a cylinder 22, a screw 23, a drive device 24, a hopper 25, an injection nozzle 26, a nozzle touch device 27, an injection control device 40, a heater 71, a temperature sensor 72, and servo motors 83 and 84.

[0032] A driving device 24 to which a cylinder 22 is attached is disposed on the base 21. Servo motors 83 and 84 are provided inside the driving device 24. A screw 23 that kneads the injection material is provided inside the cylinder 22.

[0033] The cylinder 22 has a cylindrical shape with ends on the nozzle side and the hopper side. The servo motor 83 rotates the screw 23 around an axis that runs in a certain direction (for example, a direction parallel to the placement surface of the base 21) as a central axis under the control of the injection control device 40. The hopper 25 is provided in the cylinder 22 and stores the granular injection material before plasticization. The injection material stored in the hopper 25 is filled into the interior of the cylinder 22 by driving the screw 23.

[0034] The heater 71 is a band heater that covers at least a portion of the cylinder 22. The heater 71 heats the cylinder 22 under the control of the injection control device 40. The temperature sensor 72 is constituted by, for example, a thermocouple, and measures the temperature of the cylinder 22 heated by the heater 71. Temperature data indicating the temperature measured by the temperature sensor 72 is sent to the injection control device 40. The injection material filled in the screw 23 inside the cylinder 22 is heated by the heat of the cylinder 22 heated by the heater 71, and is rotated within the screw 23 by the drive of the servo motor 83, thereby being kneaded.

[0035] In this way, the plasticizing step of the injection molding process includes a step of kneading the injection material to be injected into the molds 17 and 18 of the mold clamping device 10 by heating with the cylinder 22 and rotating the screw 23.

[0036] The servo motor 84 drives the screw 23 under the control of the injection control device 40, causing the screw 23 to slide toward the molds 17, 18 of the mold clamping unit 10. As a result, the injection material plasticized in the screw 23 is transported to the injection nozzle 26. The nozzle touch device 27 slides the injection device 20 toward the molds 17, 18 of the mold clamping unit 10 under the control of the injection control device 40, causing the injection nozzle 26 to contact the mold 17. As a result, the injection material is injected into the mold 18. Furthermore, pressure is applied to the injected injection material, and it is held within the molds 17, 18.

[0037] Thus, the injection step of the injection molding process includes a step of injecting the injection material plasticized in the plasticizing step into the molds 17, 18 of the mold clamping device 10. In addition, the pressure holding step of the injection molding process includes a step of applying pressure to hold the injection material injected in the injection step within the molds 17, 18.

[0038] The injection control device 40 includes an interface unit 420 having a user interface function, and a control unit 410 that controls the injection of the injection material by the injection device 20. The control unit 410 is provided inside the base 21 and is connected to the interface unit 420 via a communication cable 51 so as to be able to communicate data with it. The control unit 410 may be configured to be able to communicate data with the interface unit 420 not only via a wired connection, but also via a wireless connection such as Wi-Fi (registered trademark) or Bluetooth (registered trademark). Furthermore, the control unit 410 may be configured integrally with the interface unit 420. The control unit 410 is connected to various components of the injection device 20, such as the nozzle touch device 27, the heater 71, and the servo motors 83 and 84, and controls the injection of the injection material by the injection device 20 by controlling these components.

[0039] The mold clamping control device 30 is connected to the magnetic clamps 91, 92 so as to be able to communicate data with them via a communication cable 52. The mold clamping control device 30 may be configured to be able to communicate data with the magnetic clamps 91, 92 not only by wired connection but also by wireless connection such as Wi-Fi or Bluetooth. The mold clamping control device 30 supplies current to the magnetic clamps 91, 92 to control the magnetic clamps 91, 92 to either a clamped state or an unclamped state.

[0040] The mold clamping control device 30 is connected to the injection control device 40 by a power cable 53 so that power is supplied from the injection control device 40. The mold clamping control device 30 can control the magnetic clamps 91, 92 using the power supplied from the injection control device 40 via the power cable 53.

[0041] In the injection molding machine 1, an interlock is established between the injection unit 20 and the mold clamping unit 10 so that the magnetic clamps 91, 92 do not operate while the injection unit 20 is operating. For example, while the injection unit 20 is injecting the injection material into the molds 17, 18 of the mold clamping unit 10, no power is supplied from the injection unit 20 to the mold clamping control device 30. In this case, no current is supplied from the mold clamping control device 30 to the magnetic clamps 91, 92, so that the magnetic clamps 91, 92 are maintained in the clamped state.

[0042] The injection molding machine 1 configured as described above requires initial setting data and the like to be set in each of the injection control device 40 and the mold clamping control device 30 during a trial run before being shipped from the factory or during service after being delivered to a customer.

[0043] For example, FIG. 2 is a schematic diagram showing an injection molding system 1000A according to a comparative example. As shown in FIG. 2, the injection control device 40 is connected to the user device 100 via a communication cable 54 so as to be able to communicate data with the user device 100. The injection control device 40 may be configured to be able to communicate data with the user device 100 via a wireless connection such as Wi-Fi or Bluetooth, rather than a wired connection. In this way, by directly connecting the user device 100 to the injection control device 40, the user can check the current data set in the injection control device 40 using the user device 100. Furthermore, if the user inputs initial setting data for realizing control by the injection control device 40 into the user device 100, the initial setting data can be transmitted from the user device 100 to the injection control device 40.

[0044] The mold clamping control device 30 is also connected to the user device 100 via a communication cable 55A so as to be able to communicate data with the user device 100. The mold clamping control device 30 may be configured to be able to communicate data with the user device 100 not only via a wired connection but also via a wireless connection such as Wi-Fi or Bluetooth. In this way, by directly connecting the user device 100 to the mold clamping control device 30, the user can check the current data set in the mold clamping control device 30 using the user device 100. Furthermore, if the user inputs data for initial setting to realize control by the mold clamping control device 30 into the user device 100, the data for initial setting can be transmitted from the user device 100 to the mold clamping control device 30.

[0045] As described above, in the injection molding system 1000A according to the comparative example, the user connects the user device 100 to each of the injection control device 40 and the mold clamping control device 30 individually, and performs data communication between the user device 100 and each of the injection control device 40 and the mold clamping control device 30. In this method, the user needs to connect the user device 100 to each of the injection control device 40 and the mold clamping control device 30 individually when checking or updating currently set data, which results in poor work efficiency.

[0046] 1, the injection molding system 1000 according to the embodiment is configured to connect the injection control device 40 and the mold clamping control device 30 so as to be able to communicate data with each other via a communication cable 55A, rather than employing a method of directly connecting the mold clamping control device 30 and the user device 100 via a communication cable 55A. Note that the injection control device 40 may be configured to be able to communicate data with the mold clamping control device 30 not only via a wired connection, but also via a wireless connection such as Wi-Fi or Bluetooth.

[0047] That is, the user device 100 is configured to perform data communication indirectly with the mold clamping control device 30 via the injection control device 40, rather than directly with the mold clamping control device 30. This eliminates the need for the user to directly connect the user device 100 to the mold clamping control device 30 using the communication cable 55A, and allows the user to easily perform data communication with each of the injection control device 40 and the mold clamping control device 30 by simply connecting the user device 100 to the injection control device 40 using the communication cable 54.

[0048] <Internal structure of injection molding system> The internal configuration of the injection molding system 1000 will be described with reference to Fig. 3. Fig. 3 is a block diagram showing the internal configurations of the injection control device 40, the mold clamping control device 30, and the user device 100 provided in the injection molding system 1000 according to the embodiment.

[0049] 3, the injection control device 40 includes a calculation device 41, a memory 42, a storage device 43, a communication device 44, a display device 45, and an input device 46. The calculation device 41, the memory 42, and the storage device 43 are included in a control unit 410. The communication device 44, the display device 45, and the input device 46 are included in an interface unit 420.

[0050] The arithmetic device 41 is a computing entity (computer) that executes predetermined processing. The arithmetic device 41 is configured with a processor such as a CPU (Central Processing Unit), an MPU (Micro-Processing Unit), a TPU (Tensor Processing Unit), or a GPU (Graphics Processing Unit). A processor, which is an example of the arithmetic device 41, has the function of executing predetermined processing by executing a predetermined program. However, some or all of these functions may be implemented using dedicated hardware circuits such as an ASIC (Application Specific Integrated Circuit) or an FPGA (Field-Programmable Gate Array). The term "processor" is not limited to processors in the narrow sense that execute processing using a stored program, such as a CPU, an MPU, a TPU, or a GPU, but may also include hardwired circuits such as an ASIC or an FPGA. The arithmetic device 41 is not limited to von Neumann computers such as a CPU or a GPU, but may also be configured with non-von Neumann computers such as a quantum computer or an optical computer. The arithmetic device 41 may also be interpreted as a processing circuitry. The arithmetic device 41 may be configured with one chip or multiple chips. Furthermore, the processor and associated processing circuitry may be comprised of multiple computers interconnected by wire or wirelessly, such as via a local area network or a wireless network. The processor and associated processing circuitry may also be comprised of a cloud computer that performs remote calculations based on input data and outputs the results of the calculations to other devices at remote locations.

[0051] The memory 42 includes a storage area (for example, a working area) for storing program code or work memory when the arithmetic unit 41 executes various programs. Examples of the memory 42 include volatile memories such as DRAM (Dynamic Random Access Memory) and SRAM (Static Random Access Memory), and non-volatile memories such as ROM (Read Only Memory) and flash memory. The memory 42 may also be interpreted as processing circuitry.

[0052] The storage device 43 stores various programs and various data executed by the arithmetic device 41. For example, the storage device 43 stores an injection control program 47 executed by the arithmetic device 41. The storage device 43 may be one or more non-transitory computer readable media, or may be one or more computer readable storage media. Examples of the storage device 43 include a hard disk drive (HDD) and a solid state drive (SSD). The storage device 43 may also be interpreted as a processing circuitry.

[0053] The injection control program 47 defines the processing procedure by which the injection control device 40 controls the injection of the injection material by the injection device 20.

[0054] The communication device 44 communicates with each of the mold clamping control device 30 and the user device 100 via a wired connection using an optical fiber line or the like, or a wireless connection such as Wi-Fi. For example, the communication device 44 is connected to the communication device 104 of the user device 100 via a communication cable 54 so as to be able to communicate data. The communication device 44 is also connected to the communication device 34 of the mold clamping control device 30 via a communication cable 55 so as to be able to communicate data. The communication device 44 may also be read as a processing circuitry.

[0055] The display device 45 includes a display that displays predetermined information under the control of the arithmetic device 41. For example, the user can display current data set in the injection control device 40 on the display device 45. The display device 45 may also be interpreted as a processing circuitry.

[0056] The input device 46 includes a mouse, a keyboard, etc., and accepts information input based on user operation. For example, the user can use the input device 46 to input data (for example, data for initial setup or data for updating) to the injection control device 40, which is used to control the injection of injection material by the injection device 20. The input device 46 may also be interpreted as processing circuitry. The input device 46 may be a touch panel attached to the display device 45, or a microphone that accepts voice input.

[0057] The mold clamping control device 30 includes a computing device 31, a memory 32, a storage device 33, and a communication device .

[0058] The arithmetic device 31 is a computing entity (computer) that executes predetermined processing. The arithmetic device 31 is configured, for example, by a processor such as a CPU, MPU, TPU, or GPU. A processor, which is an example of the arithmetic device 31, has the function of executing predetermined processing by executing a predetermined program, but some or all of these functions may be implemented using dedicated hardware circuits such as an ASIC or FPGA. The term "processor" is not limited to processors in the narrow sense that execute processing using a stored program, such as a CPU, MPU, TPU, or GPU, but may also include hardwired circuits such as an ASIC or FPGA. The arithmetic device 31 is not limited to von Neumann computers such as a CPU or GPU, but may also be configured as non-von Neumann computers such as quantum computers or optical computers. The arithmetic device 31 may also be interpreted as a processing circuitry. The arithmetic device 31 may be configured on a single chip or multiple chips. Furthermore, the processor and related processing circuits may be configured as multiple computers interconnected by wire or wirelessly via a local area network, a wireless network, or the like. The processor and associated processing circuitry may be configured as a cloud computer that performs computations remotely based on input data and outputs the results of the computations to other devices at remote locations.

[0059] The memory 32 includes a storage area (for example, a working area) for storing program code or work memory when the arithmetic unit 31 executes various programs. Examples of the memory 32 include volatile memories such as DRAM and SRAM, and non-volatile memories such as ROM and flash memory. The memory 32 may also be interpreted as processing circuitry.

[0060] The storage device 33 stores various programs and various data executed by the arithmetic device 31. For example, the storage device 33 stores a mold clamping control program 37 executed by the arithmetic device 31. The storage device 33 may be one or more non-transitory computer readable media, or may be one or more computer readable storage media. Examples of the storage device 33 include an HDD and an SSD. The storage device 33 may also be interpreted as a processing circuitry.

[0061] The mold clamping control program 37 defines a processing procedure for the mold clamping control device 30 to control the magnetic clamps 91 and 92.

[0062] The communication device 34 communicates with the injection control device 40 via a wired connection using an optical fiber line or the like, or a wireless connection such as Wi-Fi. For example, the communication device 34 is connected to the communication device 44 of the injection control device 40 via a communication cable 55 so as to be able to communicate data. The communication device 34 may also be interpreted as a processing circuitry.

[0063] The user device 100 includes a processing unit 101, a memory 102, a storage unit 103, a communication unit 104, a display unit 105, and an input unit 106.

[0064] The arithmetic device 101 is a computing entity (computer) that executes predetermined processing. The arithmetic device 101 is configured with a processor such as a CPU, MPU, TPU, or GPU. A processor, which is an example of the arithmetic device 101, has the function of executing predetermined processing by executing a predetermined program. However, some or all of these functions may be implemented using dedicated hardware circuits such as an ASIC or FPGA. The term "processor" is not limited to processors in the narrow sense that execute processing using a stored program, such as a CPU, MPU, TPU, or GPU, but may also include hardwired circuits such as an ASIC or FPGA. The arithmetic device 101 is not limited to von Neumann computers such as a CPU or GPU, but may also be configured with non-von Neumann computers such as quantum computers or optical computers. The arithmetic device 101 may also be interpreted as a processing circuit. The arithmetic device 101 may be configured with a single chip or multiple chips. Furthermore, the processor and related processing circuits may be configured with multiple computers interconnected by wire or wirelessly via a local area network, a wireless network, or the like. The processor and associated processing circuitry may be configured as a cloud computer that performs computations remotely based on input data and outputs the results of the computations to other devices at remote locations.

[0065] The memory 102 includes a storage area (for example, a working area) for storing program code or work memory when the arithmetic device 101 executes various programs. Examples of the memory 102 include volatile memories such as DRAM and SRAM, and non-volatile memories such as ROM and flash memory. The memory 102 may also be interpreted as processing circuitry.

[0066] The storage device 103 stores various programs and various data executed by the arithmetic device 101. For example, the storage device 103 stores a user program 107 executed by the arithmetic device 101. The storage device 103 may be one or more non-transitory computer readable media, or one or more computer readable storage media. Examples of the storage device 103 include an HDD and an SSD. The storage device 103 may also be interpreted as a processing circuit.

[0067] The user program 107 defines a processing procedure for the user device 100 to communicate data with each of the injection control device 40 and the mold clamping control device 30. The user program 107 also includes an application program that allows the user to check the data currently set in each of the injection control device 40 and the mold clamping control device 30, and to update the data in each of the injection control device 40 and the mold clamping control device 30.

[0068] The communication device 104 communicates with the injection control device 40 via a wired connection using an optical fiber line or a wireless connection such as Wi-Fi. For example, the communication device 104 is connected to the communication device 44 of the injection control device 40 via a communication cable 54 so as to be able to communicate data. The communication device 104 may also be interpreted as a processing circuitry.

[0069] <Example of display on user device> An example of a screen displayed on the display device 105 of the user device 100 will be described with reference to FIGS.

[0070] 4 is a diagram showing an example of a setting screen 105A for the magnetic clamps 91, 92 displayed on the display device 105 of the user device 100 according to the embodiment. As described above, the user device 100 can communicate data with the mold clamping control device 30 via the injection control device 40, and the user can use the setting screen 105A shown in FIG. 4 to check current data (for example, parameters) set in the mold clamping control device 30 and set data (for example, parameters) for initial setting of the mold clamping control device 30.

[0071] For example, setting screen 105A for magnetic clamps 91 and 92 includes an input field for "current measurement gain 1" and an input field for "current measurement gain 2." When the user inputs values ​​into the input fields for "current measurement gain 1" and "current measurement gain 2," the current values ​​of the movable-side clamp current upper limit, movable-side release current upper limit, fixed-side clamp current upper limit, fixed-side release current upper limit, movable-side clamp current lower limit, movable-side release current lower limit, fixed-side clamp current lower limit, and fixed-side release current lower limit are displayed.

[0072] The movable-side clamp current upper limit is the upper limit of the current supplied from the mold clamping control device 30 to the magnetic clamp 92 in order to control the magnetic clamp 92 in the clamped state. The movable-side release current upper limit is the upper limit of the current supplied from the mold clamping control device 30 to the magnetic clamp 92 in order to control the magnetic clamp 92 in the unclamped state.

[0073] The fixed-side clamp current upper limit is the upper limit of the current supplied from the mold clamping control device 30 to the magnetic clamp 91 in order to control the magnetic clamp 91 in the clamped state. The fixed-side release current upper limit is the upper limit of the current supplied from the mold clamping control device 30 to the magnetic clamp 91 in order to control the magnetic clamp 91 in the unclamped state.

[0074] The movable-side clamp current lower limit is the lower limit of the current supplied from the mold clamping control device 30 to the magnetic clamp 92 in order to control the magnetic clamp 92 in the clamped state. The movable-side release current upper limit is the lower limit of the current supplied from the mold clamping control device 30 to the magnetic clamp 92 in order to control the magnetic clamp 92 in the unclamped state.

[0075] The fixed-side clamp current lower limit is the lower limit of the current supplied from the mold clamping control device 30 to the magnetic clamp 91 in order to control the magnetic clamp 91 in the clamped state. The fixed-side release current upper limit is the lower limit of the current supplied from the mold clamping control device 30 to the magnetic clamp 91 in order to control the magnetic clamp 91 in the unclamped state.

[0076] Because there are individual differences between the injection molding machine 1 and the mold clamping unit 10, the user inputs current measurement gain 1 and current measurement gain 2 while actually connecting the injection molding machine 1 and the mold clamping unit 10, and then applies power to each of the injection molding machine 1 and the mold clamping unit 10 to obtain current values ​​such as the movable-side clamp current upper limit. The user checks whether the obtained current values ​​are within a predetermined setting range, and if the current values ​​are not within the setting range, changes the input values ​​of current measurement gain 1 and current measurement gain 2 using the input device 106 so that the current values ​​are within the setting range. The user can also change the setting range by changing input values ​​such as the movable-side clamp current upper limit.

[0077] The setting screen 105A for the magnetic clamps 91 and 92 also includes an input field for "mold adhesion confirmation gain." When the user inputs a value into the "mold adhesion confirmation gain" input field, the current value of the mold adhesion confirmation abnormality threshold is displayed. The user inputs the mold adhesion confirmation gain while the injection molding machine 1 and the mold clamping unit 10 are actually connected, and obtains the current value of the mold adhesion confirmation gain by applying power to both the injection molding machine 1 and the mold clamping unit 10. The user checks whether the obtained current value is equal to or less than a predetermined threshold, and if not, changes the input value of the mold adhesion confirmation gain using the input device 106 so that the current value is equal to or less than the threshold. The user can also change the threshold by changing the mold adhesion confirmation threshold abnormality threshold.

[0078] In addition, the setting screen 105A for the magnetic clamps 91, 92 displays the current values ​​of various data related to the magnetic clamps 91, 92, such as the mold adhesion confirmation 100% value, the abnormality judgment temperature, and the abnormality recovery judgment temperature, and the user can input the setting values ​​for these various data.

[0079] The current values ​​of the various data shown in Figure 4 above and the setting values ​​entered by the user in the input fields include data used when the mold clamping control device 30 executes the mold clamping control program 37 to control the magnetic clamps 91, 92, and are also referred to as "mold clamping control data."

[0080] 4, the mold clamping control data may include the mold clamping control program 37 for controlling the magnetic clamps 91, 92. That is, the mold clamping control data may include at least one of a program for controlling the magnetic clamps 91, 92 (for example, the mold clamping control program 37 or an update program for the mold clamping control program 37) and parameters used in executing the mold clamping control program 37.

[0081] In this way, the user can use the setting screen 105A displayed on the display device 105 to check the current values ​​of the mold clamping control data and input setting values ​​for the mold clamping control data.

[0082] 5 is a diagram showing an example of a setting screen 105B for the injection device 20 displayed on the display device 105 of the user device 100 according to the embodiment. As described above, the user device 100 can communicate data with the injection control device 40, and the user can use the setting screen 105B shown in FIG. 5 to check current data (e.g., parameters) set in the injection device 20 and set data (e.g., parameters) for initial setting of the injection device 20.

[0083] For example, the setting screen 105B of the injection unit 20 includes variable names, units, addresses, and input fields for various data such as "mold open position limit," "mold open speed limit," and "mold open torque limit" that the injection unit 20 uses to inject the injection material in accordance with the state of the magnetic clamps 91, 92 of the mold clamping control device 30. The user can input these various data into the input fields. Furthermore, by searching for a variable name, the user can display the current value of the searched variable name on the setting screen 105B, thereby enabling the user to check the current values ​​of various data.

[0084] The current values ​​of the various data shown in FIG. 5 and the setting values ​​entered by the user in the input fields include data used when the injection control device 40 executes the injection control program 47 to control the injection of the injection material, and are also referred to as "injection control data."

[0085] The injection control data is not limited to parameters such as the limiting mold open position, limiting mold open speed, and limiting mold open torque shown in Fig. 5, but may also include the injection control program 47 for controlling the injection of the injection material. In other words, the injection control data may include at least one of a program for controlling the injection of the injection material (for example, the injection control program 47 or an update program for the injection control program 47) and parameters used to execute the injection control program 47.

[0086] In this way, the user can use the setting screen 105B displayed on the display device 105 to check the current values ​​of the injection control data and input setting values ​​for the injection control data.

[0087] Even if some kind of abnormality occurs, the user does not need to connect the user device 100 to each of the injection control device 40 and the mold clamping control device 30. By simply connecting the user device 100 to the injection control device 40, both the setting screen 105A for the magnetic clamps 91 and 92 in Fig. 4 and the setting screen 105B for the injection unit 20 in Fig. 5 can be displayed on the display device 105 of the user device 100. This allows the setting status of both the magnetic clamps 91 and 92 and the injection unit 20 to be checked using the user device 100, thereby enabling efficient maintenance.

[0088] 6 is a diagram showing an example of a confirmation screen 105C for checking the status of magnetic clamps 91 and 92, which is displayed on display device 105 of user device 100 according to the embodiment. The user can check the status of magnetic clamps 91 and 92 using confirmation screen 105C shown in FIG.

[0089] For example, the confirmation screen 105C for the status of the magnetic clamps 91 and 92 includes confirmation fields indicating the "clamp status" and "error status" of the magnetic clamps 91 and 92.

[0090] The clamp status confirmation field indicates the status of the magnetic clamps 91 and 92, such as whether clamping by the magnetic clamps 91 and 92 has been completed and whether release by the magnetic clamps 91 and 92 has been completed. In the example of Fig. 6, "ON" is displayed in the confirmation field indicating whether release by the magnetic clamps 91 and 92 has been completed, and "OFF" is displayed in the other confirmation fields. In this case, the user can use confirmation screen 105C to confirm that release by the magnetic clamps 91 and 92 has been completed.

[0091] The error status confirmation column indicates the error status of the magnetic clamps 91, 92, such as a current abnormality or a temperature abnormality. In the example of Fig. 6, "NG" is displayed in the confirmation column indicating a temperature abnormality of the fixed-side magnetic clamp 91, and "OK" is displayed in the other confirmation columns. In this case, the user can use confirmation screen 105C to confirm that an abnormality has occurred in the temperature of magnetic clamp 91 detected by temperature sensor 94.

[0092] The data indicating whether the magnetic clamps 91, 92 shown in Figure 6 described above are in a clamped state and the data indicating the error state of the magnetic clamps 91, 92 are data indicating the state of the magnetic clamps 91, 92, and are also referred to as "state data."

[0093] In this way, the user can check information indicating the clamping status of magnetic clamps 91 and 92 and information regarding errors in the magnetic clamps using confirmation screen 105C displayed on display device 105. Furthermore, the user can use confirmation screen 105C displayed on display device 105 to check whether an error has occurred in magnetic clamp 91 or magnetic clamp 92 and the type of error that has occurred.

[0094] 2, the injection control device 40 and the clamping control device 30 are not connected to enable data communication, so the injection control device 40 is unable to identify the type of error occurring in the clamping control device 30. In contrast, in the injection molding system 1000 according to the embodiment, the injection control device 40 and the clamping control device 30 are connected to enable data communication, so the injection control device 40 can identify the type of error occurring in the clamping control device 30 based on the status data acquired from the clamping control device 30.

[0095] <Example of a shared address> The injection control device 40 is configured to perform data communication with the mold clamping control device 30 using an address shared with the mold clamping control device 30. The address shared between the injection control device 40 and the mold clamping control device 30 according to the embodiment will be described with reference to Figs. 7 to 10.

[0096] Fig. 7 is a diagram showing an example of the range of addresses shared between the injection control device 40 and the mold clamping control device 30 according to the embodiment. As shown in Fig. 7, data communication is performed between the injection control device 40 and the mold clamping control device 30 in accordance with the Modbus (registered trademark) communication protocol. Types of data in the data communication include coil, input status, input register, and holding register.

[0097] Coils are data areas that can only be read in 1-bit units, and addresses in the range of 0 to 9999 are assigned to coils. Input statuses are data areas that can be read and written in 1-bit units, and addresses in the range of 10000 to 19999 are assigned to input statuses. Input registers are data areas that can only be read in 1-word units, and addresses in the range of 30000 to 39999 are assigned to input registers. Holding registers are data areas that can be read and written in 1-word units, and addresses in the range of 40000 to 49999 are assigned to holding registers.

[0098] Fig. 8 is a diagram showing the contents of the coil data shared between the injection control device 40 and the mold clamping control device 30 according to the embodiment. As shown in Fig. 8, addresses 0 to 3 of the coil data store data related to control commands for the magnetic clamps 91 and 92. Addresses 4 to 9999 of the coil data are provided as spare addresses.

[0099] Address 0 of the coil data stores data related to controlling the magnetic clamp 92 to a clamped state. For example, when the mold clamping control device 30 controls the magnetic clamp 92 to a clamped state, data "1" is stored in address 0, and when the mold clamping control device 30 does not control the magnetic clamp 92 to a clamped state, data "0" is stored in address 0.

[0100] Address 1 of the coil data stores data relating to controlling the magnetic clamp 92 to an unclamped state. For example, when the mold clamping control device 30 controls the magnetic clamp 92 to an unclamped state, data "1" is stored in address 1, and when the mold clamping control device 30 does not control the magnetic clamp 92 to an unclamped state, data "0" is stored in address 1.

[0101] Address 2 of the coil data stores data related to controlling the magnetic clamp 91 to the clamped state. For example, when the mold clamping control device 30 controls the magnetic clamp 91 to the clamped state, data "1" is stored in address 2, and when the mold clamping control device 30 does not control the magnetic clamp 91 to the clamped state, data "0" is stored in address 2.

[0102] Address 3 of the coil data stores data relating to controlling the magnetic clamp 91 to an unclamped state. For example, when the mold clamping control device 30 controls the magnetic clamp 91 to an unclamped state, data "1" is stored in address 3, and when the mold clamping control device 30 does not control the magnetic clamp 91 to an unclamped state, data "0" is stored in address 3.

[0103] Fig. 9 is a diagram showing the contents of input status data shared between the injection control device 40 and the mold clamping control device 30 according to the embodiment. As shown in Fig. 9, addresses 0 to 9999 of the input status data are provided as spares.

[0104] Fig. 10 is a diagram showing the contents of input register data shared between the injection control device 40 and the mold clamping control device 30 according to the embodiment. As shown in Fig. 10, the input register data stores status data indicating the status of the magnetic clamps 91, 92, such as data indicating whether the magnetic clamps 91, 92 are in a clamped state or not, and data indicating an error state of the magnetic clamps 91, 92.

[0105] For example, address 1000 of the input register data stores data indicating the clamping state of magnetic clamp 91. Address 1001 of the input register data stores data indicating an error state of magnetic clamp 91. Address 1002 of the input register data stores data indicating the temperature of magnetic clamp 91 (for example, the measurement value of temperature sensor 94). Address 1003 of the input register data stores data indicating the confirmation result of the adhesion of magnetic clamp 91. Address 1004 of the input register data stores data indicating the magnetizing force of magnetic clamp 91 (for example, the measurement value of magnetic field sensor 95).

[0106] Fig. 11 is a diagram showing the contents of holding register data shared between the injection control device 40 according to the embodiment and the mold clamping control device 30. As shown in Fig. 11, the holding register data stores mold clamping control data related to the magnetic clamps 91 and 92, such as the current data set in the mold clamping control device 30 and data for initial setting of the mold clamping control device 30, as shown in Fig. 4.

[0107] For example, address 0 of the holding register data stores data indicating a current measurement gain of 1. Address 1 of the holding register data stores data indicating a current measurement gain of 2. Address 2 of the holding register data stores data indicating the movable-side clamp current upper limit. Address 3 of the holding register data stores data indicating the movable-side release current upper limit. Address 4 of the holding register data stores data indicating the fixed-side clamp current upper limit. Address 5 of the holding register data stores data indicating the fixed-side release current upper limit. Address 6 of the holding register data stores data indicating the movable-side clamp current lower limit. Address 7 of the holding register data stores data indicating the movable-side release current lower limit. Address 8 of the holding register data stores data indicating the fixed-side clamp current lower limit. Address 9 of the holding register data stores data indicating the fixed-side release current lower limit.

[0108] Additionally, each address of the holding register data stores mold clamping control data related to the magnetic clamps 91 and 92, such as a mold adhesion confirmation 100% value, an abnormality determination temperature, and an abnormality recovery determination temperature.

[0109] <Example of processing performed by an injection molding machine> An example of processing executed by the injection molding machine 1 will be described with reference to Figures 12 and 13. The processing steps of the user device 100 are realized by the calculation device 101 executing a user program 107. The processing steps of the injection control device 40 are realized by the calculation device 41 executing an injection control program 47. The processing steps of the mold clamping control device 30 are realized by the calculation device 31 executing a mold clamping control program 37.

[0110] 12 is a flowchart showing an example of processing related to injection control data and mold clamping control data executed by the injection molding machine 1 according to the embodiment. As shown in FIG. 12, the user device 100 determines whether or not the user has input injection control data using the input device 106 (S101). As described above, the injection control data includes at least one of a program for controlling the injection of the injection material (for example, the injection control program 47 or an update program for the injection control program 47) and parameters used to execute the injection control program 47.

[0111] If the injection control data has been input (YES in S101), the user device 100 outputs the acquired injection control data to the injection control device 40 (S102) and proceeds to the processing of S103. On the other hand, if the injection control data has not been input (NO in S101), the user device 100 skips the processing of S102.

[0112] In response to this, the injection control device 40 determines whether or not injection control data has been acquired from the user device 100 (S41). If the injection control device 40 has acquired injection control data (YES in S41), it stores the acquired injection control data in the storage device 43 (S42). This allows the injection control device 40 to control the injection of the injection material using the injection control data stored in the storage device 43. For example, the injection control device 40 can update the injection control program 47 to the latest version using an update program included in the injection control data. Furthermore, the injection control device 40 can control the injection of the injection material using parameters included in the injection control data.

[0113] On the other hand, if the user device 100 has not acquired the injection control data (NO in S41), it skips the process of S42.

[0114] The user device 100 also determines whether or not the user has input mold clamping control data using the input device 106 (S103). As described above, the mold clamping control data includes at least one of a program for controlling the magnetic clamps 91, 92 (for example, the mold clamping control program 37 or an update program for the mold clamping control program 37) and parameters used to execute the mold clamping control program 37.

[0115] If the mold clamping control data has been input (YES in S103), the user device 100 outputs the acquired mold clamping control data to the injection control device 40 (S104) and ends the processing of this flow. On the other hand, if the mold clamping control data has not been input (NO in S103), the user device 100 skips the processing of S103 and ends the processing of this flow.

[0116] In response to this, the injection control device 40 determines whether or not mold clamping control data has been acquired from the user device 100 (S43). If the injection control device 40 has acquired mold clamping control data (YES in S43), it stores the acquired mold clamping control data in the storage device 43 (S44). Furthermore, the injection control device 40 outputs the mold clamping control data to the mold clamping control device 30 (S45) and ends the processing related to this flow. On the other hand, if the injection control device 40 has not acquired mold clamping control data (NO in S43), it skips the processing of S44 and S45 and ends the processing related to this flow.

[0117] In response to this, the mold clamping control device 30 determines whether or not mold clamping control data has been acquired from the injection control device 40 (S31). If the mold clamping control device 30 has acquired the mold clamping control data (YES in S31), it stores the acquired mold clamping control data in the storage device 33 (S32) and ends the processing related to this flow. This allows the mold clamping control device 30 to control the magnetic clamps 91, 92 using the mold clamping control data stored in the storage device 33. For example, the mold clamping control device 30 can update the mold clamping control program 37 to the latest version using an update program included in the mold clamping control data. Furthermore, the mold clamping control device 30 can control the magnetic clamps 91, 92 using parameters included in the mold clamping control data.

[0118] On the other hand, if the user device 100 has not acquired the mold clamping control data (NO in S31), the process of S32 is skipped and the process according to this flow is terminated.

[0119] As described above, if the user inputs the injection control data using the user device 100, the injection control data can be stored in the injection control device 40, and the user can use the update program included in the injection control data to cause the injection control device 40 to update the injection control program 47 to the latest version, or can use the parameters included in the injection control data to cause the injection control device 40 to control the injection of the injection material.

[0120] By inputting mold clamping control data using the user device 100, the user can transfer the mold clamping control data to the mold clamping control device 30 via the injection control device 40, and can use the mold clamping control data to cause the mold clamping control device 30 to control the magnetic clamps 91, 92.

[0121] In this way, the user can easily perform data communication with each of the injection control device 40 and the mold clamping control device 30 without having to connect the user device 100 to each of the injection control device 40 and the mold clamping control device 30 individually.

[0122] 13 is a flowchart showing an example of processing related to status data executed by the injection molding machine 1 according to the embodiment. As shown in Fig. 13, the mold clamping control device 30 determines whether or not status data has been acquired from the temperature sensor 94, the magnetic field sensor 95, or the like (S36). As described above, the status data includes at least one of information indicating whether the magnetic clamps 91, 92 are in a clamped state and information regarding an error in the magnetic clamps 91, 92.

[0123] If the mold clamping control device 30 has acquired the status data (YES in S36), it outputs the acquired status data to the injection control device 40 (S37) and ends the processing related to this flow. On the other hand, if the mold clamping control device 30 has not acquired the status data (NO in S36), it skips the processing of S37 and ends the processing related to this flow.

[0124] In response to this, the injection control device 40 determines whether or not status data has been acquired from the mold clamping control device 30 (S46). If status data has been acquired (YES in S46), the injection control device 40 stores the acquired status data in the storage device 43 (S47). This allows the injection control device 40 to use the status data stored in the storage device 43 to recognize whether the magnetic clamps 91, 92 are in a clamped state and whether the magnetic clamps 91, 92 are in an error state, and to control the injection of the injection material according to the state of the magnetic clamps 91, 92.

[0125] Furthermore, the injection control device 40 outputs the status data to the user device 100 (S48) and ends the processing of this flow. On the other hand, if the injection control device 40 has not acquired the status data (NO in S46), it skips the processing of S47 and S48 and ends the processing of this flow.

[0126] In response to this, the user device 100 determines whether or not status data has been acquired from the injection control device 40 (S106). If the status data has been acquired (YES in S106), the user device 100 stores the acquired status data in the storage device 103 (S107). On the other hand, if the status data has not been acquired (NO in S106), the user device 100 skips the process of S107 and ends the process related to this flow.

[0127] This allows the user to view status data obtained from the mold clamping control device 30 via the injection control device 40 using the user device 100 without having to connect the user device 100 individually to each of the injection control device 40 and the mold clamping control device 30.

[0128] <Additional Notes> It will be understood by those skilled in the art that the above-described embodiments are specific examples of the following aspects.

[0129] (Item 1) An injection molding machine (1) according to the present disclosure manufactures a molded product by injecting an injection material into a mold (17, 18). The injection molding machine (1) includes an injection device (20) that injects the injection material into the mold (17, 18) and a mold clamping device (10) that clamps the mold (17, 18). The injection device (20) includes an injection control device (40) that controls the injection of the injection material. The mold clamping device (10) includes magnetic clamps (91, 92) to which the molds (17, 18) are detachably attached, and a mold clamping control device (30) that controls the magnetic clamps (91, 92). The injection control device (40) is connected to the mold clamping control device (30) so as to be able to communicate data.

[0130] (Item 2) In the injection molding machine 1 according to item 1, the injection control device 40 is connected to the user device 100 so as to be able to communicate data with the user device 100. The injection control device 40 acquires injection control data relating to the injection of injection material from the user device 100 (S41) and stores the injection control data (S42).

[0131] (Item 3) In the injection molding machine (1) according to item 1 or 2, the injection control device (40) acquires clamping control data related to the magnetic clamps (91, 92) from the user device (100) (S43) and outputs the clamping control data to the clamping control device (30) (S45). The clamping control device (30) stores the clamping control data (S32).

[0132] (Item 4) In the injection molding machine (1) according to item 2 or 3, the injection control data and the mold clamping control data are input by a user using a user device (100).

[0133] (Item 5) In the injection molding machine (1) according to any one of items 2 to 4, the injection control data includes at least one of a program for controlling the injection of the injection material and parameters used to execute the program.

[0134] (Item 6) In the injection molding machine (1) according to any one of items 3 to 5, the mold clamping control data includes at least one of a program for controlling the magnetic clamps (91, 92) and parameters used to execute the program.

[0135] (Item 7) In the injection molding machine (1) according to any one of Items 1 to 6, the injection control device (40) acquires status data indicating the status of the magnetic clamps (91, 92) from the mold clamping control device (30) (S46), and outputs the status data to the user device (100) (S48).

[0136] (Item 8) In the injection molding machine (1) according to item 7, the status data includes at least one of information indicating a clamped state in which the molds (17, 18) are attached to the magnetic clamps (91, 92) or an unclamped state in which the molds (17, 18) are removed from the magnetic clamps (91, 92), and information regarding an error in the magnetic clamps (91, 92).

[0137] (Item 9) In the injection molding machine (1) according to any one of items 1 to 8, the injection control device (40) communicates data with the mold clamping control device (30) using an address shared with the mold clamping control device (30).

[0138] (Item 10) An injection device (20) according to the present disclosure injects an injection material into molds (17, 18) clamped by a mold clamping device (10). The injection device (20) includes an injection control device (40) that controls the injection of the injection material. The mold clamping device (10) includes magnetic clamps (91, 92) to which the molds (17, 18) are detachably attached, and a mold clamping control device (30) that controls the magnetic clamps (91, 92). The injection control device (40) is connected to the mold clamping control device (30) so as to be able to communicate data with them.

[0139] (Item 11) In the injection device (20) according to item 10, the injection control device (40) is connected to the user device (100) so as to be able to communicate data with the user device (100). The injection control device (40) acquires injection control data relating to the injection of the injection material from the user device (100) and stores the injection control data.

[0140] (Item 12) In the injection device (20) according to item 10 or 11, the injection control device (40) acquires clamping control data related to the magnetic clamps (91, 92) from the user device (100) and outputs the clamping control data to the clamping control device (30).

[0141] (13) In the injection device (20) according to the 11th or 12th paragraph, the injection control data and the mold clamping control data are input by a user using a user device (100).

[0142] (Item 14) In the injection device (20) according to any one of items 11 to 13, the injection control data includes at least one of a program for controlling the injection of the injection material and parameters used to execute the program.

[0143] (Item 15) In the injection device (20) according to any one of items 12 to 14, the mold clamping control data includes at least one of a program for controlling the magnetic clamps (91, 92) and parameters used in executing the program.

[0144] (Item 16) In the injection device (20) according to any one of items 10 to 15, the injection control device (40) acquires status data indicating the status of the magnetic clamps (91, 92) from the mold clamping control device (30) and outputs the status data to the user device (100).

[0145] (Item 17) In the injection device (20) according to item 16, the status data includes at least one of information indicating a clamped state in which the molds (17, 18) are attached to the magnetic clamps (91, 92) or an unclamped state in which the molds (17, 18) are removed from the magnetic clamps (91, 92), and information regarding an error in the magnetic clamps (91, 92).

[0146] (Item 18) In the injection device (20) according to any one of items 10 to 17, the injection control device (40) communicates data with the mold clamping control device (30) using an address shared with the mold clamping control device (30).

[0147] (Item 19) A mold clamping device (10) according to the present disclosure clamps molds (17, 18) for manufacturing a molded product using an injection material injected from an injection device (20). The mold clamping device (10) includes magnetic clamps (91, 92) to which the molds (17, 18) are detachably attached, and a mold clamping control device (30) that controls the magnetic clamps (91, 92). The mold clamping control device (30) is connected to an injection control device (40) that controls the injection of the injection material by the injection device (20) so as to be capable of data communication.

[0148] (Item 20) In the mold clamping device (10) according to item 19, mold clamping control data for the magnetic clamps (91, 92) input by a user using a user device (100) is obtained from the injection control device (40), and the mold clamping control data is stored.

[0149] (Item 21) In the mold clamping device (10) according to item 20, the mold clamping control data includes at least one of a program for controlling the magnetic clamps (91, 92) and parameters used in executing the program.

[0150] (Item 22) In the mold clamping device (10) according to any one of items 19 to 21, the mold clamping control device (30) outputs status data indicating the status of the magnetic clamps (91, 92) to the injection control device (40).

[0151] (Item 23) In the mold clamping device (10) according to item 22, the status data includes at least one of information indicating a clamped state in which the molds (17, 18) are attached to the magnetic clamps (91, 92) or an unclamped state in which the molds (17, 18) are removed from the magnetic clamps (91, 92), and information regarding an error in the magnetic clamps (91, 92).

[0152] (Item 24) In the mold clamping device (10) according to any one of items 19 to 23, the mold clamping control device (30) communicates data with the injection control device (40) using an address shared with the injection control device (40).

[0153] (Item 25) A data processing method according to the present disclosure is a data processing method by an injection control device (40) of an injection device (20) that injects an injection material into a mold (17, 18) that is clamped by a clamping device (10). The data processing method includes a step (S41) of acquiring injection control data related to the injection of the injection material from a user device (100), a step (S42) of storing the injection control data, a step (S43) of acquiring clamping control data related to magnetic clamps (91, 92) of the clamping device (10) from the user device (100), and a step (S45) of outputting the clamping control data to a clamping control device (30) that controls the magnetic clamps (91, 92).

[0154] (Item 26) In the data processing method according to item 25, the injection control data and the mold clamping control data are input by a user using a user device (100).

[0155] (Item 27) In the data processing method according to item 25 or 26, the injection control data includes at least one of a program for controlling the injection of the injection material and parameters used to execute the program.

[0156] (Item 28) In the data processing method according to any one of items 25 to 27, the mold clamping control data includes at least one of a program for controlling the magnetic clamps (91, 92) and parameters used to execute the program.

[0157] (Item 29) The data processing method according to any one of items 25 to 28 includes a step (S46) of acquiring status data indicating the status of the magnetic clamps (91, 92) from the mold clamping control device (30), and a step (S48) of outputting the status data to the user device (100).

[0158] (Item 30) In the data processing method according to item 29, the status data includes at least one of information indicating a clamped state in which the molds (17, 18) are attached to the magnetic clamps (91, 92) or an unclamped state in which the molds (17, 18) are removed from the magnetic clamps (91, 92), and information regarding an error in the magnetic clamps (91, 92). [Explanation of symbols]

[0159] 1 injection molding machine, 10 mold clamping unit, 11 bed, 12 fixed platen, 13 movable platen, 14 mold clamping housing, 15 tie bar, 16 mold clamping mechanism, 17, 18 mold, 19 ball screw, 20 injection unit, 21 base, 22 cylinder, 23 screw, 24 drive unit, 25 hopper, 26 injection nozzle, 27 nozzle touch device, 30 mold clamping control unit, 31, 41, 101 arithmetic unit, 32, 42, 102 memory, 33, 43, 103 storage device, 34, 44, 104 communication device, 37 mold clamping control program, 40 injection control unit, 45, 105 display device, 46, 106 input device, 47 injection control program, 51, 52, 54, 55, 55A communication cable, 53 power cable, 71 Heater, 72, 94 temperature sensor, 81, 82, 83, 84 servo motor, 91, 92 magnet clamp, 93 magnet clamp plate, 95 magnetic field sensor, 96 magnet core, 100 user device, 105A, 105B setting screen, 105C confirmation screen, 107 user program, 410 control unit, 420 interface unit, 1000, 1000A injection molding system.

Claims

1. An injection molding machine that injects an injection material into a mold to manufacture a molded product, an injection device that injects the injection material into the mold; a mold clamping device that clamps the mold, the injection device includes an injection control device that controls the injection of the injection material; The mold clamping device is a magnetic clamp to which the mold is detachably attached; a mold clamping control device that controls the magnetic clamp, The injection control device is connected to the mold clamping control device so as to be able to communicate data with the injection molding machine.

2. The injection control device is connected to a user device so as to be able to communicate data with the user device; The injection control device includes: Obtaining injection control data related to the injection of the injection material from the user device; 2. The injection molding machine according to claim 1, wherein said injection control data is stored.

3. The injection control device includes: acquiring mold clamping control data relating to the magnetic clamp from the user device; outputting the mold clamping control data to the mold clamping control device; 3. The injection molding machine according to claim 2, wherein the mold clamping control device stores the mold clamping control data.

4. The injection molding machine according to claim 3 , wherein the injection control data and the mold clamping control data are input by a user using the user device.

5. The injection molding machine according to any one of claims 2 to 4, wherein the injection control data includes at least one of a program for controlling the injection of the injection material and parameters used in executing the program.

6. 5. The injection molding machine according to claim 3, wherein the mold clamping control data includes at least one of a program for controlling the magnetic clamp and parameters used in executing the program.

7. The injection control device includes: acquiring status data indicating the status of the magnetic clamp from the mold clamping control device; The injection molding machine of claim 1 , wherein the status data is output to a user device.

8. 8. The injection molding machine according to claim 7, wherein the status data includes at least one of information indicating a clamped state in which the mold is attached to the magnetic clamp or an unclamped state in which the mold is removed from the magnetic clamp, and information regarding an error in the magnetic clamp.

9. 5. The injection molding machine according to claim 1, wherein the injection control device communicates data with the mold clamping control device using an address shared with the mold clamping control device.

10. An injection device that injects an injection material into a mold that is clamped by a mold clamping device, an injection control device that controls the injection of the injection material; The mold clamping device is a magnetic clamp to which the mold is detachably attached; a mold clamping control device that controls the magnetic clamp, The injection control device is connected to the mold clamping control device so as to be able to communicate data with the injection control device.

11. The injection control device is connected to a user device so as to be able to communicate data with the user device; The injection control device includes: Obtaining injection control data related to the injection of the injection material from the user device; The injection device according to claim 10, wherein the injection control data is stored.

12. The injection control device includes: acquiring mold clamping control data relating to the magnetic clamp from the user device; The injection apparatus according to claim 11, wherein the mold clamping control data is output to the mold clamping control device.

13. The injection device according to claim 12 , wherein the injection control data and the mold clamping control data are input by a user using the user device.

14. The injection device according to any one of claims 11 to 13, wherein the injection control data includes at least one of a program for controlling the injection of the injection material and parameters used to execute the program.

15. 14. The injection apparatus according to claim 12, wherein the mold clamping control data includes at least one of a program for controlling the magnetic clamp and parameters used in executing the program.

16. The injection control device includes: acquiring status data indicating the status of the magnetic clamp from the mold clamping control device; The jetting device of claim 10 , wherein the status data is output to a user device.

17. 17. The injection device according to claim 16, wherein the status data includes at least one of information indicating a clamped state in which the mold is attached to the magnetic clamp or an unclamped state in which the mold is detached from the magnetic clamp, and information regarding an error in the magnetic clamp.

18. The injection device according to any one of claims 10 to 13, wherein the injection control device performs data communication with the mold clamping control device using an address shared with the mold clamping control device.

19. A mold clamping device that clamps a mold for manufacturing a molded product using an injection material injected from an injection device, a magnetic clamp to which the mold is detachably attached; a mold clamping control device that controls the magnetic clamp, The mold clamping control device is connected to an injection control device that controls the injection of the injection material by the injection device so as to be able to communicate data with the mold clamping control device.

20. The mold clamping control device includes: acquiring mold clamping control data related to the magnetic clamp input by a user using a user device from the injection control device; The mold clamping apparatus according to claim 19, wherein the mold clamping control data is stored.

21. The mold clamping apparatus according to claim 20 , wherein the mold clamping control data includes at least one of a program for controlling the magnetic clamp and parameters used in executing the program.

22. The mold clamping device according to claim 19, wherein the mold clamping control device outputs status data indicating a status of the magnetic clamp to the injection control device.

23. The mold clamping device according to claim 22, wherein the status data includes at least one of information indicating a clamped state in which the mold is attached to the magnetic clamp or an unclamped state in which the mold is removed from the magnetic clamp, and information regarding an error in the magnetic clamp.

24. The mold clamping device according to any one of claims 19 to 23, wherein the mold clamping control device performs data communication with the injection control device using an address shared with the injection control device.

25. A data processing method by an injection control device of an injection device that injects an injection material into a mold clamped by a mold clamping device, comprising: obtaining injection control data relating to the injection of the jetted material from a user device; storing the injection control data; acquiring mold clamping control data related to a magnetic clamp of the mold clamping device from the user device; and outputting the mold clamping control data to a mold clamping control device that controls the magnetic clamp.

26. 26. The data processing method according to claim 25, wherein the injection control data and the mold clamping control data are input by a user using the user device.

27. 27. The data processing method according to claim 25 or 26, wherein the injection control data includes at least one of a program for controlling the injection of the injection material and parameters used to execute the program.

28. 27. The data processing method according to claim 25, wherein the mold clamping control data includes at least one of a program for controlling the magnetic clamp and parameters used in executing the program.

29. acquiring status data indicating a status of the magnetic clamp from the mold clamping control device; and outputting said status data to said user device.

30. 30. The data processing method of claim 29, wherein the status data includes at least one of information indicating a clamped state in which the mold is attached to the magnetic clamp or an unclamped state in which the mold is removed from the magnetic clamp, and information regarding an error in the magnetic clamp.

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