Function panel

Abstract

To provide a function panel with high reliability, which suppresses deterioration due to impurities such as water and also suppresses electric faults of a terminal part.SOLUTION: A function panel comprises a first substrate, a second substrate, a joint layer, a function element, a protective layer, and a terminal. The joint layer is located between the first substrate and the second substrate. The function element is disposed so as to surround the first substrate, the second substrate and the joint layer. The terminal is electrically connected to the function element, and is disposed so as not to overlap either of the first substrate and the second substrate. The protective layer is disposed in contact with side faces of the first substrate, side faces of the second substrate, and exposed faces of the joint layer. On the terminal, a part of its surface is exposed without being covered by the protective layer. The terminal is configured to have, on a part of its exposed surface, a material having an ionization tendency lower than that of hydrogen.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] One aspect of the present invention relates to a functional panel having functional elements that perform various functions. , a light-emitting panel, a display panel, and a sensor panel.

[0002] Note that one embodiment of the present invention is not limited to the above technical field. Examples of the semiconductor device include a semiconductor device, a display device, a light-emitting device, a power storage device, a memory device, an electronic device, and a lighting device. , an input device, an input / output device, a driving method thereof, or a manufacturing method thereof. It can be done.

[0003] In this specification and the like, a semiconductor device is a device that can function by utilizing semiconductor characteristics. Refers to devices in general, including transistors, semiconductor circuits, arithmetic units, memory devices, imaging devices, and electro-optical devices. devices, power generation devices (including thin-film solar cells, organic thin-film solar cells, etc.), and electronic devices are semiconductor devices. This is one aspect of the arrangement. [Background technology]

[0004] Display devices using liquid crystal elements are known. In addition, organic electroluminescence (EL) ctr luminescence elements and light-emitting diodes (LEDs) a light-emitting device equipped with a light-emitting element such as a liquid crystal display (LCD) or a liquid crystal display (LCD) using an electrophoresis method, Electronic paper that displays information can also be given as an example of a display device.

[0005] For example, the basic structure of an organic EL element is a layer containing a light-emitting organic compound between a pair of electrodes. By applying a voltage to this element, light is emitted from the light-emitting organic compound. A display device using such an organic EL element is thin and lightweight. This makes it possible to realize a display device with high contrast and low power consumption.

[0006] Patent Document 1 discloses a flexible light-emitting device that uses an organic EL element. . [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Japanese Patent Application Laid-Open No. 2014-197522 Summary of the Invention [Problem to be solved by the invention]

[0008] One embodiment of the present invention is a display panel, a light-emitting panel, a sensor panel, and a touch panel with high reliability. One of the objectives is to provide functional panels, including those for water. It is an object of the present invention to provide a functional panel in which deterioration due to materials is suppressed. One of the objectives is to provide a functional panel in which electrical defects are suppressed. New function panels, light-emitting panels, display panels, sensor panels, touch panels, or electronic devices One of the objectives is to provide equipment and other items.

[0009] The description of these problems does not preclude the existence of other problems. It is not necessary to solve all of these problems. It is possible to extract this information from the detailed description, etc. [Means for solving the problem]

[0010] One aspect of the present invention is a semiconductor device including a first substrate, a second substrate, a bonding layer, a functional element, and a protective layer. The bonding layer is located between the first substrate and the second substrate. The functional element is provided so as to be surrounded by the first substrate, the second substrate, and the bonding layer. The substrate is electrically connected to the functional element and does not overlap one of the first substrate and the second substrate. The protective layer is provided on the side surface of the first substrate, the side surface of the second substrate, and the exposed portion of the bonding layer. The terminal is provided in contact with the surface that is covered with the protective layer. .

[0011] In the above, the terminal has a lower ionization tendency than hydrogen on a part of its exposed surface. In this case, the material is preferably palladium, iridium, gold, Alternatively, platinum is preferred.

[0012] In the above, the protective layer is made of aluminum oxide, hafnium oxide, zirconium oxide, or the like. Titanium oxide, zinc oxide, indium oxide, tin oxide, indium tin oxide, tin oxide talc, silicon oxide, manganese oxide, nickel oxide, erbium oxide, cobalt oxide, acid Tellurium nitride, barium titanate, titanium nitride, tantalum nitride, aluminum nitride, tantalum nitride At least one selected from the group consisting of copper nitride, cobalt nitride, manganese nitride, and hafnium nitride. It is preferred that the compound contains:

[0013] In the above, the terminal is a laminate in which a first layer and a second layer are laminated on the first layer. It is preferable that the second layer has a layer structure. In this case, a part of the surface of the second layer is exposed, and the second layer is Preferably, the first layer contains a material with a lower ionization tendency than the material contained in the first layer. In this case, the second layer preferably contains palladium, iridium, gold, or platinum. .

[0014] In the above, the first substrate and the second substrate are preferably flexible. .

[0015] In the above, it is preferable to have an FPC electrically connected to the terminal.

[0016] Another aspect of the present invention is a display device including the functional panel, wherein the functional element includes a light-emitting element. Another embodiment of the present invention is a light-emitting panel including the functional panel, The element is a display panel including a display element. The display panel has a display element and a transistor. Another aspect of the present invention is a display device having the above-mentioned functional panel, wherein the functional element includes a sensor element. It is a sensor panel. [Effects of the Invention]

[0017] According to one aspect of the present invention, a highly reliable functional panel can be provided. It is possible to provide a functional panel that suppresses deterioration due to impurities. Alternatively, a novel functional panel, a light-emitting panel, a display panel, or the like can be provided. It is possible to provide a panel, a sensor panel, a touch panel, or an electronic device. [Brief explanation of the drawings]

[0018] [Figure 1] 10 shows an example of the configuration of a function panel according to an embodiment. [Figure 2] 1A to 1C illustrate an example of a manufacturing method of a functional panel according to an embodiment. [Figure 3] 1A to 1C illustrate an example of a manufacturing method of a functional panel according to an embodiment. [Figure 4] 10 shows an example of the configuration of a function panel according to an embodiment. [Figure 5] 10 shows an example of the configuration of a function panel according to an embodiment. [Figure 6] 1A and 1B are diagrams illustrating examples of light-emitting panels according to an embodiment. [Figure 7] 1A and 1B are diagrams illustrating examples of light-emitting panels according to an embodiment. [Figure 8] 1A and 1B are diagrams illustrating examples of light-emitting panels according to an embodiment. [Figure 9] 1A and 1B are diagrams illustrating examples of light-emitting panels according to an embodiment. [Figure 10] 1A and 1B are diagrams illustrating examples of light-emitting panels according to an embodiment. [Figure 11] 1A and 1B are diagrams illustrating examples of light-emitting panels according to an embodiment. [Figure 12] 1A to 1C illustrate an example of a method for manufacturing a light-emitting panel according to an embodiment. [Figure 13] 1A to 1C illustrate an example of a method for manufacturing a light-emitting panel according to an embodiment. [Figure 14] FIG. 1 is a diagram showing an example of a touch panel according to an embodiment. [Figure 15] FIG. 1 is a diagram showing an example of a touch panel according to an embodiment. [Figure 16] FIG. 1 is a diagram showing an example of a touch panel according to an embodiment. [Figure 17] FIG. 1 is a diagram showing an example of a touch panel according to an embodiment. [Figure 18] FIG. 1 is a diagram showing an example of a touch panel according to an embodiment. [Figure 19] 1A and 1B are diagrams illustrating a configuration of a film formation apparatus according to an embodiment. [Figure 20] 1A to 1C are diagrams illustrating examples of electronic devices and lighting devices according to an embodiment. [Figure 21] 1A to 1C are diagrams illustrating examples of electronic devices according to an embodiment. [Figure 22] 1A to 1C are diagrams illustrating examples of electronic devices according to an embodiment. [Figure 23] 1A to 1C are diagrams illustrating examples of electronic devices according to an embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0019] The embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description. The present invention is not limited to the above embodiments, and various changes and modifications may be made in form and detail without departing from the spirit and scope of the present invention. Therefore, the present invention is based on the following embodiments. The present disclosure should not be construed as being limited to the contents of the preceding paragraph.

[0020] In the configuration of the invention described below, the same parts or parts having similar functions are The same reference numerals are used in common between different drawings, and repeated explanations thereof will be omitted. When referring to a function, the hatch pattern may be the same and no particular symbol may be assigned.

[0021] In each figure described in this specification, the size, layer thickness, or area of ​​each component is The figures may be exaggerated for clarity and are not necessarily limited to that scale. stomach.

[0022] In this specification, ordinal numbers such as "first" and "second" are used to avoid confusion of components. The number is not a numerical limitation.

[0023] (Embodiment 1) The following describes a functional panel according to one embodiment of the present invention.

[0024] A functional panel according to one aspect of the present invention has a configuration in which a functional element is sandwiched between a pair of substrates. The pair of substrates are bonded together by a bonding layer. The functional element is surrounded by the pair of substrates and the bonding layer. One of the pair of substrates is provided with terminals for electrical connection to the functional element. It can be done.

[0025] Furthermore, a protective layer is provided in contact with at least the exposed surface of the bonding layer. The protective layer is provided to cover not only the bonding layer but also a part or the whole of the surfaces of the pair of substrates. The protective layer may be made of a material with low moisture permeability. It is located between the By applying such a protective layer, impurities such as water can be prevented from reaching the functional element through the bonding layer. It is possible to suppress the diffusion of

[0026] The protective layer is provided to cover at least the exposed side of the bonding layer and a part of the substrate around it. The protective layer is formed using a film formation method that provides good step coverage. One such method is atomic layer deposition (ALD). There is a method called "yer deposition".

[0027] The protective layer may be made of, for example, aluminum oxide, hafnium oxide, zirconium oxide, or oxide. Titanium oxide, zinc oxide, indium oxide, tin oxide, indium tin oxide, tantalum oxide, Silicon oxide, manganese oxide, nickel oxide, erbium oxide, cobalt oxide, terbium oxide barium titanate, titanium nitride, tantalum nitride, aluminum nitride, tungsten nitride Materials including silicon nitride, cobalt nitride, manganese nitride, and hafnium nitride can be used. In particular, it is preferable to use a material containing at least one of these as a main component. Films containing this material as the main component have excellent moisture-proof properties and are suitable for use as barrier films against water, etc. It is possible.

[0028] Here, when a film is described as containing a certain material as a main component, it means that the film contains the material in relation to other components. This refers to the case where the material is contained in the film at its highest concentration, or when the material is present in the film at 50% by volume. When contained in the range of % or more but less than 100% by volume, or 50% or more but less than 100% by weight In addition, if the film is a mixture of three or more materials (if the constituent elements are three or more types), In some cases, there may be multiple materials as the main component, such as when The material in the film is 1% by volume or more but less than 100% by volume, or 1% by weight or more but less than 100% by weight. This refers to the case where the content is less than %.

[0029] The protective layer is preferably made of a material that can be formed using, for example, an ALD method. By using the ALD method, defects such as cracks and pinholes are reduced, and In addition, when forming the protective layer, it is possible to form a protective layer having a uniform thickness. Damage to the area near the material surface can be reduced.

[0030] In addition, by forming a protective layer using the ALD method, it is possible to fabricate surfaces with complex irregularities and functional It is possible to form a protective layer with uniform thickness and few defects on the top, side and back surfaces of the panel. can.

[0031] Here, at least a part of the exposed surface of the terminal is made of a conductive material that is resistant to oxidation. In other words, it is preferable to use a material with a low ionization tendency. Materials with low oxidation tendency are also materials with high standard oxidation-reduction potentials (also called standard electrode potentials). Even if the surface of such a material is exposed to an atmosphere containing water and oxygen, an oxide film does not form on the surface. If an oxide film is formed, it is very thin, so the terminals are not easily connected. It is possible to reduce contact resistance.

[0032] In addition, when forming a protective layer using the ALD method, a thin film is formed on the surface of the material, which is resistant to oxidation. In other words, the effect of having such a material on the surface is that the When using terminals that have a self-aligning property, the terminals can be formed in a self-aligning manner without the need for masking or other measures on the terminals. No protective layer is formed on top of it, and it is possible to form an exposed surface for the terminal.

[0033] More specifically, in the ALD method, a gas containing a precursor and a gas containing an oxidizing material are mixed. By alternately and repeatedly supplying these to the sample surface, a thin film can be formed on the sample surface. At this time, the surface is not oxidized by the oxidizing gas, or is difficult to oxidize, and the conductive By using the material on the surface of the terminal, a thin film is not formed on the surface or the formation of a thin film is suppressed. can be suppressed.

[0034] In the ALD method, when water (H2O) is used as an oxidizing material, A material with the lowest ionization tendency, i.e., a material with a higher standard redox potential than hydrogen (0 V) It is preferable to use a conductive material because the conductive material is not oxidized. Examples of suitable metals include copper, mercury, silver, iridium, palladium, gold, and platinum.

[0035] In addition, as the oxidizing material used in the ALD method, a material having a higher oxidizing property than water (e.g., When using ozone (O3, etc.), the ionization tendency of iridium and palladium is extremely low. It is preferable to use aluminum, gold, platinum, etc.

[0036] It is also preferable that the terminal has a laminated structure. It is preferable to use the above-mentioned metals that are difficult to oxidize, or alloys containing such metals. In addition, the material used for the portion other than the surface side is preferably one having a higher ionization tendency than the material provided on the surface side. It is preferable to use a material with a high oxidation-reduction potential, that is, a material with a low standard oxidation-reduction potential. Since oxidation-resistant materials are relatively expensive, applying them only to the surface of the terminals reduces the This makes it possible to reduce costs.

[0037] More specific configuration examples and manufacturing method examples will be described below with reference to the drawings.

[0038] [Configuration example] [Function Panel] FIG. 1(A) is a schematic top view of a functional panel 100 according to an embodiment of the present invention. ) is a schematic cross-sectional view taken along the line A1-A2 in FIG. 1(A). For clarity, some of the components (such as the protective layer 120) are not shown.

[0039] The functional panel 100 includes a substrate 101, a substrate 102, a functional element 111, a plurality of terminals 110, The semiconductor device includes a bonding layer 121, an insulating layer 122, a wiring 123, and the like.

[0040] The functional element 111 is formed on the substrate 101. The substrate 102 and the bonding layer 121 surround and seal the device.

[0041] In FIGS. 1A and 1B, the bonding layer 121 is provided so as to surround the functional element 111. 1B, the bonding layer 121, the substrate 101, and the substrate 10 A space 124 is provided inside the enclosure 2.

[0042] A protective layer 120 is provided in contact with the surface (also called the side surface or end surface) exposed to the outside of the bonding layer 121. In addition, the bonding layer 121 and the substrate 101 (or the structure formed on the substrate 101) and the bonding layer 121 and the substrate 102 (or a structure formed on the substrate 102). It is preferable that the protective layer 120 is provided up to the area where the As a result, the gap between the bonding layer 121 and the substrate 101 or 102 is effectively filled. Therefore, the diffusion of impurities into the functional element 111 can be suppressed.

[0043] In FIG. 1B, the upper surface and side surface of the substrate 101, the lower surface and side surface of the substrate 102, and the bonding layer 12 1 shows an example in which a protective layer 120 is provided to cover the side surface of the substrate 1.

[0044] The wiring 123 electrically connects the functional element 111 and the terminal 110. The terminal 110 is F As a terminal for mounting a connector for a PC or an integrated circuit such as an IC on the substrate 101 Alternatively, the terminal 110 can be used to contact a probe or the like for measurement or testing. It may also be used for other purposes.

[0045] In FIG. 1B, the terminal 110 is a stack in which a conductive layer 110a is stacked on a conductive layer 110b. In this case, a part of the wiring 123 functions as the conductive layer 110b. do.

[0046] The conductive layer 110a of the terminal 110 is provided with a part of its surface exposed. The protective layer 120 has an opening that overlaps a part of the surface of the terminal 110 .

[0047] The conductive layer 110a contains the conductive material that is resistant to oxidation. As a result, the contact resistance of the terminal 110 can be reduced.

[0048] As shown in FIG. 1B, the terminal 110 has a laminated structure in which two or more conductive layers are laminated. The conductive material that is difficult to oxidize is used only for the conductive layer 110a located on the upper layer. In this case, the conductive layer 110a is thicker than the conductive layer 110b. It is preferable to use a material with a lower ionization tendency than the above, that is, a material with a higher standard oxidation-reduction potential. It's nice.

[0049] The insulating layer 122 is provided to cover the wiring 123. For example, it may have a function of suppressing oxidation of the surface of the wiring 123. The insulating layer 122 may not be provided if it is not necessary. Alternatively, the insulating layer 124 may be provided only in the portion overlapping the bonding layer 121 and on the outer side of the bonding layer 121. In addition, although FIG. 1B shows the case where the insulating layer 122 is provided to cover the wiring 123, The insulating film 112 may be provided to cover both the functional element 111 and the wiring 123, or may be provided to cover only the wiring 123. The insulating layer may have two or more insulating layers, one covering the functional element 111 and the other covering the functional element 111 .

[0050] In the region outside the bonding layer 121, the protective layer 120 is in contact with the surface of the insulating layer 122. This prevents impurities from diffusing from the outside through the insulating layer 122. can be effectively suppressed.

[0051] 1(C) and 1(D) show examples in which the configuration of FIG. 1(B) is partially different.

[0052] In FIG. 1C, a protective layer 12 is formed on a part of the upper surface of the substrate 102 and a part of the lower surface of the substrate 101. The protective layer 120 has a portion where the protective layer 120 is not provided. The bonding layer 121 is bonded to the upper and lower surfaces of the substrate 102, the side surfaces of the substrate 102, and the side surfaces of the bonding layer 121. It is set up as such.

[0053] In addition, in FIG. 1C, a bonding layer 121 is filled between the substrate 101 and the substrate 102. That is, the bonding layer is formed so as to fill the space 124 in FIG. The bonding layer 121 is disposed so that a part of the bonding layer 121 overlaps with the functional element 111. do.

[0054] In FIG. 1D, a protective layer 120 is provided on the upper surface of the substrate 102 and the lower surface of the substrate 101. The protective layer 120 is formed on a part of the side surface of the substrate 101, a part of the side surface of the substrate 102, and a part of the side surface of the substrate 102. The bonding layer 121 is provided in contact with a part of the surface and the side surface of the bonding layer 121.

[0055] FIG. 1D shows an example in which the terminal 110 is formed by a part of the wiring 123. At this time, the wiring 123 is made of the conductive material that is not easily oxidized. That is, the wiring 123 and the conductive layer 110a may be formed of the same material. .

[0056] [Functional element] The functional element 111 may be an optical element, a sensor element, an electric element, a semiconductor element, a memory element, etc. It is possible to apply elements that exhibit various functions.

[0057] As the optical element, a display element, a light emitting element, a light receiving element, etc. can be used. Liquid crystal elements, organic EL elements, inorganic EL elements, LED elements, photoelectric conversion elements, etc. can be used. Or, an element whose contrast, reflectance, transmittance, etc. change due to electromagnetic action. By applying a display element or a light emitting element, the functional panel can be used as a display panel. It may also function as a lighting panel using a light emitting element. By using a light receiving element, it can be used as a solar cell panel.

[0058] Examples of display elements and light-emitting elements include EL (electroluminescence) elements (organic and and inorganic EL elements, organic EL elements, inorganic EL elements), LEDs (white LEDs, red LEDs ED, green LED, blue LED, etc.), transistor (transistor that emits light according to the current electron emission element, liquid crystal element, electronic ink, electrophoretic element, grating light valve GLV (global low voltage), plasma display (PDP), MEMS (microelectromechanical systems) Display elements using a digital micromirror device (DMD), DMS (Digital Micro Shutter), MIRASOL (registered trademark), IMOD ( Interference modulation (IM) elements, shutter-type MEMS display elements, Optical interference type MEMS display element, electrowetting element, piezoelectric ceramic display A display element using a plate or a carbon nanotube can be used.

[0059] The sensor elements include, for example, force, displacement, position, velocity, acceleration, angular velocity, rotation speed, and distance. , light, liquid, magnetism, temperature, chemicals, sound, time, hardness, electric field, current, voltage, power, radiation The equipment may include functions to measure flow rate, humidity, gradient, vibration, odor, or infrared rays. For example, sensor elements, photoelectric conversion elements, semiconductor circuits, etc. using MEMS can be applied. do.

[0060] Examples of electrical elements and semiconductor elements include resistors, capacitors, transistors, circuit elements, Examples include coils, inductors, diodes, and switches.

[0061] As memory elements, flash memory, MRAM (Magnetoresistive Random Access Memory), PRAM (Phase change RAM), ReRAM (Resistance RAM), FeRAM (Ferroe Non-volatile memory elements such as DRAM (Dynamic Random Access Memory) or A volatile memory element such as a static RAM (SRAM) or an SRAM (static RAM) may also be used. .

[0062] [Example of manufacturing method] An example of a method for manufacturing a functional panel according to one embodiment of the present invention will be described below.

[0063] The thin films (insulating film, semiconductor film, conductive film, etc.) that make up the functional panel are formed by sputtering. method, chemical vapor deposition (CVD) method, vacuum evaporation method, pulsed laser deposition (PLD) method, ALD method Alternatively, the film can be formed by a plating method (electrolytic plating, atomic plating, etc.). Film-forming methods such as electroplating (including electrolytic plating), coating, and printing may also be used. , sputtering, and plasma-enhanced chemical vapor deposition (PECVD) are typical methods, but MOC Thermal CVD methods such as VD (metal organic chemical vapor deposition) may also be used.

[0064] In addition, when processing the thin films that make up the functional panel, photolithography and other methods are used. Alternatively, island-shaped thin films can be formed by a film formation method using a shielding mask. Alternatively, the method may be a nanoimprint method, a sandblast method, a lift-off method, or the like. Thin films may also be processed.

[0065] The light used to form the resist mask in the photolithography method is, for example, i-line (wavelength 365nm), g-line (wavelength 436nm), h-line (wavelength 405nm), or a mixture of these In addition, ultraviolet light, KrF laser light, or ArF laser light can be used. Also, exposure may be performed by immersion exposure technology. The light used is extreme ultraviolet (EUV) light. ) or X-rays may be used. Also, electron beams may be used instead of light for exposure. Extremely fine processing is possible using extreme ultraviolet light, X-rays, or electron beams. In addition, when exposure is performed by scanning a beam such as an electron beam, No photomask is required.

[0066] There are three methods for etching thin films: dry etching, wet etching, and sandblasting. Methods such as these can be used.

[0067] First, wiring 123, an insulating layer 122, a functional element 111, etc. are formed on a substrate 101 (FIG. 2 (A)).

[0068] There is no significant limitation on the materials of the substrate 101 and the substrate 102, but at least the subsequent heat treatment For example, glass substrates and ceramic substrates Alternatively, a quartz substrate, a sapphire substrate, or the like may be used as the substrate 101 or the substrate 102. In addition, single crystal semiconductor substrates such as silicon substrates and silicon carbide substrates, polycrystalline semiconductor substrates, silicon Compound semiconductor substrates such as germanium substrates, SOI substrates, etc. can also be used. These substrates on which semiconductor elements are provided are referred to as substrate 101 or substrate 102. It may be used.

[0069] Furthermore, when flexible substrates are used as the substrates 101 and 102, a flexible functional package can be formed. In this case, a functional panel 100 can be fabricated directly on a flexible substrate 101. Alternatively, a release layer may be provided between the other substrate and the functional element 111. After the functional element 111 is formed, it may be separated from the base material and transferred onto the substrate 101. In this case, the substrate 101 on which the functional element 111 etc. is transferred is preferably a substrate with poor heat resistance or a flexible substrate. A plate can be used.

[0070] The wiring 123 is made of a material having a higher ionization tendency than the conductive layer 110a to be formed later. For example, chromium, copper, aluminum, gold, silver, zinc, and molybdenum can be used. , Tantalum, Titanium, Tungsten, Manganese, Nickel, Iron, Cobalt, Yttrium , zirconium, an alloy containing the above metals, or the above metals Alternatively, the metals or alloys can be used to form the respective electrodes. Gold nitride may also be used.

[0071] The wiring 123 may have a single layer structure or a laminated structure of two or more layers. a single-layer structure of an aluminum film containing titanium; a two-layer structure of an aluminum film with a titanium film laminated on top; Two-layer structure with a titanium film stacked on a titanium nitride film, and a tungsten film stacked on a titanium nitride film A two-layer structure in which a tungsten film is laminated on a tantalum nitride film or a tungsten nitride film. Two-layer structure: titanium film, aluminum film on top of titanium film, and titanium film on top of that. There are also three-layer structures that form an aluminum film. One or more selected from the group consisting of zinc, molybdenum, chromium, neodymium, and scandium Alternatively, an alloy film or a nitride film may be used.

[0072] The wiring 123 may also be made of an oxide conductive material or a nitride conductive material. For example, indium tin oxide, indium oxide containing tungsten oxide, tungsten oxide Indium zinc oxide containing stainless steel, indium oxide containing titanium oxide, titanium oxide Including indium tin oxide, indium zinc oxide, indium tin oxide doped with silicon oxide Oxides and the like can also be used.

[0073] The insulating layer 122 can be made of an inorganic insulating material, an organic insulating material, or the like. For example, silicon oxide, silicon oxynitride, silicon nitride, silicon nitride oxide, aluminum nitride Aluminum, aluminum oxide nitride, aluminum oxide, aluminum oxynitride, gallium oxide gallium oxide nitride, yttrium oxide, yttrium oxide nitride, hafnium oxide, Inorganic insulating materials such as hafnium oxide nitride can be used. Organic insulating materials such as silicon, polyimide, and siloxane can be used.

[0074] The insulating layer 122 is formed so as to have an opening on the wiring 123 at a portion that will later become the terminal 110. It is preferable to form

[0075] The functional element 111 may be formed by a method suitable for the element to be applied to the functional element 111. .

[0076] Next, a conductive layer 110a is formed on the wiring 123 (FIG. 2(B)). A case where 110a is formed by plating will be described.

[0077] A material that functions as a seed layer for plating is applied to the portion of the wiring 123 that will become the conductive layer 110b. Alternatively, a thin film that functions as a seed layer is formed on the conductive layer 110b. As the material that functions as the conductive layer 110a, a metal or alloy suitable for forming the conductive layer 110a is appropriately selected. For example, nickel, nickel-chromium alloy, nickel-chromium-palladium alloy, Alternatively, a thin film of the same material as the conductive layer 110a can be formed. In the case where the wiring 123 functions as a seed layer, the step of forming the thin film is not necessary.

[0078] Subsequently, the conductive layer 110a is formed by plating. However, it is preferable to use an electroless plating method. Since it is provided to cover the area other than the portion to be 110, the material that functions as the seed layer At this time, the surface of the functional element 111 is selectively formed. It is preferable that an insulating layer is provided to cover the surface of the terminal 110. If a thin film is formed on the surface by plating, it may be etched or left as it is. You may do so.

[0079] In this manner, the terminal 110 can be formed. The conductive layer 110a is laminated on the conductive layer 110b.

[0080] Subsequently, the substrate 101 and the substrate 102 are bonded together by the bonding layer 121 (FIG. 2(C)).

[0081] The bonding layer 121 is made of a resin or the like that can bond the substrate 101 and the substrate 102 together. For example, photo-curable resins such as ultraviolet curable resins, reaction-curable resins, and thermosetting resins can be used. Various curable resins such as elastomeric resins, anaerobic curable resins, etc. can be used. epoxy resin, acrylic resin, silicone resin, phenolic resin, polyimide resin, imide Resin, PVC (Polyvinyl Chloride) Resin, PVB (Polyvinyl Butyral) Resin, EV A (ethylene vinyl acetate) resins, etc. In particular, epoxy resins, etc., which have high moisture permeability, A material with low viscosity is preferable. Two-component resin may also be used. An adhesive sheet or the like may also be used. It's fine.

[0082] Next, a protective layer 120 is formed (FIG. 2(D)).

[0083] The protective layer 120 can be formed using the deposition methods described above. Preferably, ALD The film is formed using a method.

[0084] A method for forming the protective layer 120 using the ALD method will be described with reference to FIG. 3(A). ) to ) are enlarged schematic views of the vicinity of the terminal 110.

[0085] 3A shows the state before the film formation. As shown in FIG. 3A, a substrate 101, a substrate Hydroxy groups (OH) are adsorbed on the surfaces of the insulating layer 102, the insulating layer 122, and the bonding layer 121. In other words, these surfaces are covered with hydroxy groups. I can say it.

[0086] On the other hand, the conductive layer 110a is made of a material that is not easily oxidized, and therefore, there are few hydroxyl groups on the surface. It's not adsorbing at all.

[0087] Next, a precursor (MR x ) in the early stages of film formation The state is shown in Figure 3(B). When gas containing the precursor is supplied, the precursor The precursor reacts with the hydroxyl group on the surface of the substrate 101, etc., and the hydrogen in the hydroxyl group reacts with the hydrogen in the precursor. MR x-1 At this time, a molecule containing a ligand R and hydrogen (HR) is generated, As a result, as shown in FIG. 3(B), the surface of the substrate 101 etc. , MR containing metal M and ligand R x-1 Covered in.

[0088] Subsequently, when a gas containing an oxidizing material is supplied, the MR x-1 The ligand R in As a result, the outermost surface of the substrate 101 is substituted with hydroxy groups. At this time, adjacent hydroxy groups undergo a dehydration condensation reaction to form M- OM binding may also occur.

[0089] By repeating this process, a protective layer 120 containing an oxide of the metal M as a main component is formed. This can be done.

[0090] As described above, no hydroxy groups are present on the surface of the conductive layer 110a in the initial stage. Therefore, the reaction between the precursor and the hydroxyl group does not occur on the surface of the conductive layer 110a. Furthermore, when a gas containing an oxidizing material is subsequently supplied, the conductive layer 110a becomes highly oxidizing. Therefore, the surface of the material is not easily oxidized. Since there are no hydroxy groups on the conductive layer 110a even after the step of supplying Therefore, no reaction occurs with the precursor that is subsequently supplied. As a result, as shown in Figure 3(C), The protective layer 120 is not formed on the conductive layer 110a, but on the other surfaces except for the conductive layer 110a. That is, the masking is not performed to prevent the protective layer 120 from being formed. The surface of the terminal 110 can be exposed without any special process such as applying a solder paste.

[0091] By the above steps, the surface of the terminal 110 is exposed and the terminal is covered with the protective layer 120. A performance panel 100 can be produced (FIG. 2(D)).

[0092] Although an example of forming the protective layer 120 by the ALD method has been shown here, the film formation method is not limited to this. For example, the protective layer 120 may be formed by a film formation method other than the ALD method. In this case, if the protective layer 120 is formed on the terminal 110 during the film formation, In the subsequent process, the protective layer 120 is formed so that an opening is provided in the portion that will become the terminal 110. Just process it.

[0093] [Variation 1] In the above example of the manufacturing method, the conductive layer 110a located on the surface side of the terminal 110 is formed by plating. However, the conductive layer 110a may be formed by a different method. An example of a functional panel manufactured by a manufacturing method that is partially different from the above will be described.

[0094] FIG. 4A shows a structure in which an insulating layer 122 is provided to cover a part of the conductive layer 110a of the terminal 110. This example shows the case where the edge of the conductive layer 110a is protected. can.

[0095] The structure shown in FIG. 4A can be fabricated, for example, by the following method. In this example, after forming the wiring 123, a conductive film that will become the conductive layer 110a is formed on the wiring 123. Then, a part of the conductive film is removed by etching, thereby forming a wiring. A conductive layer 110a can be formed on the insulating film 123. Then, a part of the insulating film is removed by etching to form the conductive layer 11. An insulating layer 122 having an opening can be formed on the insulating layer 122. The substrate 101 and the substrate 102 are bonded together, and a protective layer 120 is formed, thereby forming a semiconductor device as shown in FIG. The configuration shown in FIG.

[0096] When processing the conductive layer 110a, a part of the wiring 123 may be etched. Therefore, when processing the conductive layer 110a, the wiring 123 is not lost. In addition, the etching conditions are adjusted, or the material of the conductive layer 110a and the material of the wiring 123 are changed. It is preferable to select the most suitable one as the

[0097] FIG. 4B shows a state in which the conductive layer 110a of the terminal 110 is provided to cover the edge of the opening of the insulating layer 122. This shows an example in which the surface area of ​​the terminal 110 is The area of ​​the opening in the insulating layer 122 can be made larger than the area of ​​the opening in the insulating layer 122. As a result, for example, an FPC, etc. In addition, the contact area between the terminal of the FPC or the like and the terminal 110 can be reduced. By increasing the resistance, it is possible to reduce the resistance.

[0098] The structure shown in FIG. 4B can be fabricated, for example, by the following method. In this example, after forming the insulating layer 122, a conductive film that will become the conductive layer 110a is formed. A conductive layer 110a can be formed by removing a part of the conductive film by etching. Then, the substrate 101 and the substrate 102 are bonded together by the bonding layer 121, and the protective layer 120 is By forming the above film, the structure shown in FIG. 4(B) can be fabricated.

[0099] According to this manufacturing method, when the conductive layer 110a is processed, the conductive layer 110a is formed. An insulating layer 122 is provided under the etched portion of the conductive film. However, the conductive film may be etched to partially etch the wiring 123. The malfunction can be suppressed.

[0100] FIG. 4C shows an example in which the conductive layer 110a has conductive particles 112. The conductive particles 112 include the conductive material that is resistant to oxidation. The conductive particles 112 may be formed of a laminated structure of two or more layers. In this case, the layer located on the most surface side may have the above-mentioned oxidation-resistant The material may be applied.

[0101] The structure shown in FIG. 4C is obtained after the insulating layer 122 is formed in the above-described manufacturing method example. Therefore, before the protective layer 120 is formed, the conductive layer 110a containing the conductive particles 112 is formed. For example, it can be produced by a dispense method, an ink jet method, etc. By this, paste or ink containing conductive particles 112 is selectively discharged, and the solvent and binder are By removing the conductive particles 112, a conductive layer 110a containing the conductive particles 112 can be formed. The conductive layer 110a may be formed before bonding the substrate 101 and the substrate 102, or after bonding the substrate 101 and the substrate 102. It may be formed after these are joined.

[0102] The protective layer 120 is not formed on the surface of the conductive particles 112. After this, the terminal 110 is formed with the surface of the conductive particles 112 exposed. Depending on the film forming conditions of the protective layer 120 and the material used on the surface of the wiring 123, In some cases, a protective layer 120 is formed on the conductive particles 1. The protective layer 12 is formed on the contact portions between the conductive particles 112 and the wiring 123 or between the conductive particles 112 and the wiring 123. 0 is not formed, the conductive particles 112 located near the surface of the terminal 110 and the wiring 12 Electrical connection with 3 is maintained.

[0103] The above is a description of the modified example.

[0104] [Variation 2] The material that can be used for the protective layer 120 is capable of suppressing the diffusion of impurities such as water. By providing a layer containing such a material between the functional element 111 and the bonding layer 121, Therefore, the diffusion of impurities into the functional element 111 can be effectively suppressed.

[0105] FIG. 5 shows a schematic cross-sectional view of a case where a protective layer 130 is provided to cover the functional element 111. .

[0106] The protective layer 130 can be made of a material that can be used for the protective layer 120. If the protective layer 120 and the protective layer 130 are formed using the same material and the same film forming equipment, costs can be reduced. This is preferable because it allows

[0107] The protective layer 130 can be formed by the same method as that for the protective layer 120 . In particular, it is preferable to use the ALD method. The ALD method can form a dense film at a low temperature and is also suitable for proton irradiation. Since no plasma is used, damage to the underlying layer (surface to be coated) during coating is extremely minimal. Therefore, by forming the film by the ALD method, the influence on the functional element 111 can be made extremely small. For example, when an organic EL element is used as the functional element 111, a layer covering the upper electrode of the organic EL element is formed. By forming the protective layer 130 by the ALD method as described above, damage to the organic EL element is minimized. It can be made smaller without any problems.

[0108] The protective layer 130 is formed after the functional element 111 is formed, and is used to bond the substrate 101 and the substrate 102 together. The protective layer 130 may be formed by the ALD method or the like at a stage before bonding. As a result, the protective layer 130 is not formed on the terminal 110, and the protective layer 130 is formed in a self-aligned manner as shown in FIG. An opening is formed in the protective layer 130 above the terminal 110 as shown in FIG.

[0109] Furthermore, as shown in FIG. 5, a protective layer 120 is provided to cover the exposed surface of the bonding layer 121. With this configuration, the functional element 111 is preferably formed by the protective layer 120 and the protective layer 111. This allows for a structure surrounded by two layers of 30, making it possible to realize a highly reliable functional panel. It can be realized.

[0110] The functional panel according to one embodiment of the present invention is highly reliable because the protective layer prevents impurities from diffusing. In addition, the protective layer is formed in a self-aligning manner, avoiding the terminal surface. , it is possible to expose a low-resistance terminal surface without going through any special process, and connect to the terminal. Functional panels with good connections to FPCs and other components can be produced at low cost.

[0111] This embodiment may be combined, at least in part, with other embodiments described in this specification. It can be implemented in combination.

[0112] (Embodiment 2) In this embodiment, a light-emitting panel and a display panel are used as examples of functional panels according to one embodiment of the present invention. An example of the configuration of the panel will be described.

[0113] In this specification, a light-emitting panel has at least a light-emitting element, and receives light emitted from the light-emitting element. A display panel is a device that has at least a display element. A display panel is a panel-shaped device that has the function of displaying images, etc. The display panel may have an electric element such as a capacitor, a resistor, or a semiconductor element. When a light-emitting element is used as a display element of the display panel, the display panel is one mode of a light-emitting panel. It can also be said that...

[0114] A light-emitting panel and a display panel according to one embodiment of the present invention include a light-emitting element provided between a pair of substrates. Alternatively, the display element has a structure in which it is sealed with a sealing layer. A protective layer is formed to cover the exposed portion.

[0115] For example, when organic EL elements are used as display elements or light-emitting elements, impurities such as water can When liquid crystal elements are used as display elements, deterioration occurs due to diffusion into the L elements. The impurities affect the resistance of the liquid crystal. In particular, in a transistor in which an oxide semiconductor is used for the semiconductor layer, impurities such as water may be present in the semiconductor. Diffusion of a substance can change its electrical properties.

[0116] By applying such a protective layer to the light-emitting panel or the display panel, water can be prevented from entering the panel. Therefore, it is possible to suppress the diffusion of impurities such as organic EL elements, liquid crystal elements, etc.), transistors, circuits, wiring, electrodes, etc. As a result, a light-emitting panel with extremely high reliability can be obtained. can realize a display panel.

[0117] In addition, terminals electrically connected to the display element and the light emitting element are provided on one of the substrates. The terminals are arranged so that they do not overlap with the other board, allowing for electrical connection with connectors such as FPC. The terminal surface is made of a conductive material that is extremely resistant to oxidation. Therefore, the contact resistance with the connector etc. is reduced, so the delay of the input signal In addition to suppressing the attenuation and heat generation at the contact points, problems such as disconnection and poor connection can be prevented. It also has the effect of making it less likely to occur.

[0118] More specifically, for example, the following configuration can be adopted.

[0119] [Example 1] FIG. 6A shows a plan view of the light-emitting panel. An example of a cross-sectional view is shown in FIG. 6(C). The light-emitting panel shown in Example 1 uses a color filter method. This is a top-emission light-emitting panel (also called a display panel) used in this embodiment. In this case, the light-emitting panel is made up of three sub-pixels, for example, R (red), G (green), and B (blue). The composition of the color, R (red), G (green), B (blue), W (white), or R (red), G A configuration in which one color is expressed by four sub-pixels of colors A (green), B (blue), and Y (yellow) can be applied. There is no particular limitation on the color elements, and colors other than RGBW may be used. For example, yellow, It may be made up of cyan, magenta, etc.

[0120] The light-emitting panel shown in FIG. 6A includes a light-emitting section 804, a driving circuit section 806, and an FPC (Flexible Printed Circuit). The light emitting unit 804 and the driving circuit The light emitting element and the transistor included in the path portion 806 are connected to the substrate 801, the substrate 803, and the bonding layer 1. It is sealed by 21.

[0121] The light-emitting panel shown in FIG. 6(C) includes a substrate 801, an adhesive layer 811, an insulating layer 813, and a plurality of transistors. The transistor 820, the terminal 110 (the conductive layer 110a, the conductive layer 110b), the insulating layer 815, ... an edge layer 817, a plurality of light-emitting elements 830, an insulating layer 821, a bonding layer 121, and an overcoat 84 9, the coloring layer 845, the light-shielding layer 847, the insulating layer 843, the adhesive layer 841, the substrate 803, and the protection The layer 120 includes a bonding layer 121, an overcoat 849, an insulating layer 843, and an adhesive layer 841. , substrate 803, and protective layer 120 are transparent to visible light.

[0122] The light emitting section 804 is a transistor on the substrate 801 via an adhesive layer 811 and an insulating layer 813. The light emitting element 830 includes a lower electrode 83 on an insulating layer 817. 1, an EL layer 833 on the lower electrode 831, and an upper electrode 835 on the EL layer 833. The lower electrode 831 is electrically connected to the source electrode or the drain electrode of the transistor 820. The end of the lower electrode 831 is covered with an insulating layer 821. Preferably, the upper electrode 835 is transparent to visible light.

[0123] The light-emitting section 804 includes a colored layer 845 overlapping the light-emitting element 830 and a layer overlapping the insulating layer 821. The colored layer 845 and the light-shielding layer 847 are covered with an overcoat 849. The space between the light emitting element 830 and the overcoat 849 is filled with the bonding layer 121. There are.

[0124] The insulating layer 815 has the effect of suppressing the diffusion of impurities into the semiconductor that constitutes the transistor. The insulating layer 817 also has a planarizing function to reduce surface irregularities caused by the transistor. It is preferable to select an insulating layer having

[0125] The driving circuit section 806 is formed by forming a transistor on the substrate 801 via an adhesive layer 811 and an insulating layer 813. In FIG. 6C, one of the transistors included in the driver circuit portion 806 is 1 shows two transistors.

[0126] The insulating layer 813 and the substrate 801 are bonded together by an adhesive layer 811. The insulating layer 813 and the insulating layer 803 are bonded to each other by the adhesive layer 841. If a film with low water permeability is used for 843, impurities such as water may get into the light emitting element 830 or the transistor 820. This is preferable because it can prevent objects from entering and improve the reliability of the light-emitting panel.

[0127] The terminal 110 is used to transmit signals (video signals, clock signals, start signals, etc.) from the outside to the drive circuit unit 806. It is electrically connected to an external input terminal that transmits a signal (such as a start signal or a reset signal) or a potential. Here, an example is shown in which an FPC808 is provided as an external input terminal. Therefore, the conductive layer 110b constituting the terminal 110 is formed on the electrodes and wiring used in the light emitting section and the drive circuit section. It is preferable to fabricate the conductive layer 110b using the same material and process as the conductive layer 110a. The same material as the electrodes (source electrode and drain electrode) constituting the transistor 820, An example produced using this process is shown below.

[0128] In addition, in FIG. 6(C), the terminal 110 is a stack in which the conductive layer 110a is stacked on the conductive layer 110b. The conductive layer 110a has a layer structure that is resistant to oxidation as described in the first embodiment. The conductive layer 110a is provided on the insulating layer 817 and includes a conductive material. An opening in the edge layer 815 electrically connects to the conductive layer 110b.

[0129] The conductive layer 110a is made of a conductive material having a lower ionization tendency than hydrogen (H2), or A conductive material having a lower ionization tendency than the layer 110b can be used, for example, the conductive layer 11 0b contains chromium, copper, aluminum, gold, silver, zinc, molybdenum, tantalum, titanium, and tantalum. selected from the group consisting of copper, manganese, nickel, iron, cobalt, yttrium, and zirconium. metals, alloys containing the above-mentioned metals, or alloys of combinations of the above-mentioned metals, The conductive layer 110a may be made of a nitride of the metal or alloy. It is also possible to use a material with low ionization tendency, such as copper, mercury, silver, iridium, or para In particular, iridium, palladium, gold, platinum, etc. can be used for the conductive layer 110a. When aluminum, gold, platinum, etc. are used, oxides do not form on the surface even in a humid environment. preferable.

[0130] In the light-emitting panel shown in FIG. 6C, the connector 825 is located on the substrate 803. 25 is an opening provided in the substrate 803, the adhesive layer 841, the insulating layer 843, and the bonding layer 121. The connector 825 is connected to the terminal 110 via the FPC 808. The FPC 808 and the terminal 110 are electrically connected via the connector 825. When the substrate 803 overlaps the substrate 803, an opening is made in the substrate 803 (or a substrate having an opening is used). ) to electrically connect the terminal 110, the connecting body 825, and the FPC 808. Cut.

[0131] In Example 1, the insulating layer 813, the transistor 820, and the light-emitting element 820 are formed on a highly heat-resistant substrate. The substrate 830 is then peeled off, and an insulating layer 8 is formed on the substrate 801 using an adhesive layer 811. 13, a transistor 820, and a light-emitting element 830. In addition, in Example 1, the insulating layer 843 and the colored layer 845 are formed on a highly heat-resistant substrate. and a light-shielding layer 847 is formed, the substrate on which the layer is formed is peeled off, and the layer is formed on the substrate 803 using the adhesive layer 841. A light-emitting panel can be produced by transposing the insulating layer 843, the colored layer 845, and the light-shielding layer 847. It shows.

[0132] If a substrate is made of a material with low heat resistance (such as resin), the substrate is exposed to high temperatures during the manufacturing process. Since it is difficult to form a thin film on the substrate, there are limitations on the conditions for forming transistors and insulating layers on the substrate. When using a highly permeable material (such as resin) for the substrate, high temperatures are applied to form a low-permeability film. In the manufacturing method of this embodiment, it is preferable to form a transistor on a manufacturing substrate having high heat resistance. High temperature can be used to produce highly reliable transistors and transistors with sufficient water permeability. Then, they can be transferred to the substrate 801 or the substrate 803. Thus, in one embodiment of the present invention, a light-emitting panel with high reliability can be manufactured. A light-weight, thin, and highly reliable light-emitting panel can be realized. Details of the manufacturing method will be described later. do.

[0133] In FIG. 6(C), a protective layer 120 is provided to cover the exposed portion of the light-emitting panel. Specifically, the substrate 803, the adhesive layer 841, the insulating layer 843, the bonding layer 121, the insulating layer 8 17, the insulating layer 815, the insulating layer 813, the adhesive layer 811, and one of the exposed surfaces of the substrate 801, etc. It is provided to cover part or all of the surface.

[0134] As shown in FIG. 6C, a portion of the upper surface of the terminal 110 electrically connected to the FPC 808 is Preferably, an opening is provided in a part of the protective layer 120 so that the part is exposed. This facilitates electrical connection between the FPC 808 and the terminal 110.

[0135] In other words, it covers the area other than the connection part (terminal part) where the FPC808 etc. are electrically connected, The protective layer 120 can effectively prevent the diffusion of impurities from the outside. This is preferable because it can be done easily.

[0136] As shown in FIG. 6(C), a protective layer is also formed on the inner wall of the opening for providing the connector 825. The structure in which the 120 is provided is preferable because it can more effectively suppress the diffusion of impurities. For example, after forming the opening, the protective layer 120 is formed on the conductive layer 110a. The protective layer 120 is not formed on the inner wall of the opening, and the protective layer 120 is formed to cover the inner wall of the opening. can.

[0137] The protective layer 120 may not be provided on the inner wall of the opening. 7B shows an example in which the protective layer 120 is formed before the opening is formed. 8 shows an example in which the protective layer 120 is not formed near the opening. This shows an example in which the protective layer 120 is formed after the PC 808 is attached.

[0138] 7(A), (B), and FIG. 8, the conductive layer 110a is thicker than the insulating layer 815. The insulating layer 8 is positioned on the 110b side, covering the end of the conductive layer 110a. 15 is provided. The connecting body 825 is made up of the substrate 803, the adhesive layer 841, the insulating layer 84 3, the terminal 11 is connected to the bonding layer 121, the insulating layer 817, and the insulating layer 815 through an opening provided therein. It is connected to 0.

[0139] The protective layer 120 may be made of, for example, aluminum oxide, hafnium oxide, zirconium oxide, Titanium oxide, zinc oxide, indium oxide, tin oxide, indium tin oxide, tantalum oxide , silicon oxide, manganese oxide, nickel oxide, erbium oxide, cobalt oxide, tantalum oxide Lull, barium titanate, titanium nitride, tantalum nitride, aluminum nitride, tungsten nitride Materials including titanium nitride, cobalt nitride, manganese nitride, and hafnium nitride may be used. It is particularly preferable to use a material containing at least one of these as a main component. , aluminum oxide, hafnium oxide, silicon nitride, etc. have extremely low moisture permeability and are therefore thin. This is preferable because the barrier properties are ensured even when the film is formed thinly.

[0140] In addition to FPC808, ICs can be mounted using the COG method or COF method. 9 shows a case where IC 809 is electrically connected to terminal 110. 1 shows a cross-sectional schematic view.

[0141] The IC 809 has a terminal 810. The terminal 810 is connected to the terminal 110 via a connector 825. Electrically connected.

[0142] [Example 2] FIG. 6B shows a plan view of the light-emitting panel. An example of a cross-sectional view is shown in FIG. 6(D). The light-emitting panel shown in Specific Example 2 is different from Specific Example 1 in that It is a top-emission type light-emitting panel that uses a color filter method. Only the differences from Example 1 will be described in detail, and explanations of the points in common with Example 1 will be omitted.

[0143] The light-emitting panel shown in FIG. 6(D) differs from the light-emitting panel shown in FIG. 6(C) in the following respects.

[0144] The light-emitting panel shown in FIG. 6D has spacers 827 on the insulating layer 821. By providing 827, the distance between the substrate 801 and the substrate 803 can be adjusted.

[0145] In addition, in the light-emitting panel shown in Fig. 6(D), the substrate 801 and the substrate 803 are different in size. The connector 825 is located on the insulating layer 843 and does not overlap the substrate 803. The substrate 843 is connected to the terminal 110 through an opening provided in the bonding layer 121. Since there is no need to provide an opening in the substrate 803, there are no restrictions on the material of the substrate 803.

[0146] The protective layer 120 is provided to cover the exposed portion of the light-emitting panel. Plate 803, adhesive layer 841, insulating layer 843, bonding layer 121, insulating layer 817, insulating layer 815, The insulating layer 813, the adhesive layer 811, and the exposed surfaces of the substrate 801 are partially or entirely covered with the insulating layer 813. It is set up as follows.

[0147] [Example 3] FIG. 10(A) shows a plan view of the light-emitting panel, and the dashed line B5-B6 in FIG. An example of a cross-sectional view between the two panels is shown in Figure 10(C). This is a top-emission type light-emitting panel. Here, only the differences from the above example are explained. A detailed description will be given, and explanations of points common to the above specific example will be omitted.

[0148] 10(A) and 10(C) has a frame-shaped bonding layer 125. The substrate 803 is in contact with the frame-shaped bonding layer 121 and the frame-shaped bonding layer 125 .

[0149] The light-emitting panel shown in FIG. 10(C) includes a substrate 801, an adhesive layer 811, an insulating layer 813, and a plurality of Transistor, terminal 110 (conductive layer 110a, conductive layer 110b), insulating layer 815, insulating layer 817, a plurality of light-emitting elements 830, an insulating layer 821, a bonding layer 121, a frame-shaped bonding layer 125, a substrate The bonding layer 125, the protective layer 120 and the substrate 803 may be Transmits visible light.

[0150] The frame-shaped bonding layer 125 is preferably a layer having a higher gas barrier property than the bonding layer 121. This prevents moisture and oxygen from entering the light-emitting panel from the outside. This makes it possible to realize a highly reliable light-emitting panel.

[0151] In Example 3, the light emitted from the light emitting element 830 is extracted from the light emitting panel through the bonding layer 121. Therefore, it is preferable that the bonding layer 121 has higher light transmittance than the frame-shaped bonding layer 125. In addition, it is preferable that the bonding layer 121 has a higher refractive index than the frame-shaped bonding layer 125. Furthermore, the bonding layer 121 has a smaller shrinkage in volume when hardened than the frame-shaped bonding layer 125. It is preferable that:

[0152] The connector 825 is connected to the terminal 110 through an opening provided in the substrate 803 and the bonding layer 121. Connected.

[0153] In Example 3, the insulating layer 813, the transistor 820, and the light-emitting element 820 are formed on a substrate having high heat resistance. The substrate 830 is then peeled off, and an insulating layer 8 is formed on the substrate 801 using an adhesive layer 811. 13, a transistor 820, and a light-emitting element 830. Since transistors and other devices can be manufactured on a highly heat-resistant substrate, This allows for the formation of highly reliable transistors and films with sufficiently low water permeability. By transferring these to the substrate 801, a highly reliable light-emitting panel can be fabricated. Therefore, in one embodiment of the present invention, a light-emitting panel that is lightweight or thin and has high reliability can be realized. Cut.

[0154] The protective layer 120 is provided to cover the exposed portion of the light-emitting panel. Plate 803, bonding layer 121, bonding layer 125, insulating layer 817, insulating layer 815, insulating layer 813, The adhesive layer 811 and the exposed surface of the substrate 801 are partially or entirely covered. do.

[0155] [Example 4] FIG. 10(B) shows a plan view of the light-emitting panel, and the dashed line B7-B8 in FIG. An example of a cross-sectional view between the color filters is shown in FIG. This is a bottom emission type light emitting panel using a method. Only the above points will be described in detail, and explanations of points common to the above specific example will be omitted.

[0156] The light-emitting panel shown in FIG. 10(D) includes a substrate 801, an adhesive layer 811, an insulating layer 813, and a plurality of Transistor, terminal 110 (conductive layer 110a, conductive layer 110b), insulating layer 815, colored layer 845, insulating layer 817a, insulating layer 817b, conductive layer 816, a plurality of light-emitting elements 830, insulating The substrate 801 includes a layer 821, a bonding layer 121, a substrate 803, and a protective layer 120. 811, insulating layer 813, insulating layer 815, insulating layer 817a, and insulating layer 817b absorb visible light. Be transparent.

[0157] In FIG. 10D, the light emitting section 804 includes a transistor 820 and a transistor 822. The upper electrode 835 preferably reflects visible light. The electrode 831 transmits visible light. The position where the colored layer 845 overlapping the light emitting element 830 is provided is particularly For example, the insulating layer 817a and the insulating layer 817b, the insulating layer 815 and the insulating layer It may be placed between 817a, etc.

[0158] In FIG. 10D, two transistors included in the driver circuit portion 806 are This shows the data.

[0159] In this case, the conductive layer 110b is made of the same material and in the same process as the conductive layer 816. In FIG. 10D, the conductive layer 816 is drawn out to a region not covered with the substrate 803. As shown in FIG. 10(D), the conductive layer The portion of 816 that is not covered by the conductive layer 110 a may be covered by a protective layer 120 .

[0160] In Example 4, the insulating layer 813, the transistor 820, and the light-emitting element 820 are formed on a substrate having high heat resistance. The substrate is peeled off, and an insulating layer is formed on the substrate 801 using the adhesive layer 811. A light-emitting panel that can be produced by transposing 813, a transistor 820, a light-emitting element 830, etc. Since transistors and other devices can be manufactured on a highly heat-resistant substrate, This allows for the formation of highly reliable transistors and films with sufficiently low water permeability. By transferring these to the substrate 801, a highly reliable light-emitting panel can be fabricated. As a result, in one embodiment of the present invention, a light-weight or thin and highly reliable light-emitting panel can be realized. It can be realized.

[0161] The protective layer 120 is provided to cover the exposed portion of the light-emitting panel. Plate 803, bonding layer 121, insulating layer 817b, insulating layer 817a, conductive layer 816, insulating layer 81 5. Part or all of the exposed surfaces of the insulating layer 813, adhesive layer 811, and substrate 801, etc. It is installed covered.

[0162] As shown in FIG. 11, a protective layer 130 may be provided to cover the light emitting element 830. The protective layer 130 has an opening at a position where it overlaps with the terminal 110. 30 prevents impurities such as water from diffusing from the bonding layer 121 to the light emitting element 830, etc. 11, it is possible to provide a protective layer 130 and a protective layer 120. By adopting this configuration, it is possible to more effectively suppress the diffusion of impurities into the light emitting element 830 and the like, and This makes it possible to realize a highly reliable light-emitting panel.

[0163] [Example 5] FIG. 10(E) shows an example of a light-emitting panel different from the examples 1 to 4. Only the differences will be described in detail, and explanations of the points in common with the above specific example will be omitted.

[0164] The light-emitting panel shown in FIG. 10(E) includes a substrate 801, an adhesive layer 811, an insulating layer 813, a conductive layer 814, conductive layer 857a, conductive layer 857b, terminal 110 (conductive layer 110a, conductive layer 110 b) includes a light-emitting element 830, an insulating layer 821, a bonding layer 121, and a substrate 803.

[0165] The conductive layer 857 a and the conductive layer 857 b are electrically connected to the light-emitting element 830 . A part of these functions as the conductive layer 110b, which is a part of the terminal 110. A conductive layer 110a is provided on the surface of the terminal 110b, and these constitute the terminal 110. 10 has a function as an external connection electrode of the light-emitting panel, and is electrically connected to an FPC or the like. This can be done.

[0166] The light emitting element 830 has a lower electrode 831, an EL layer 833, and an upper electrode 835. The end of the bottom electrode 831 is covered with an insulating layer 821. The light emitting element 830 is a bottom emitting element. The light extraction side is either a top-emission type or a dual-emission type. The electrode, the substrate, the insulating layer, etc. are transparent to visible light. and electrically connect it.

[0167] The substrate on the light extraction side has a hemispherical lens and a microlens array as a light extraction structure. For example, the resin substrate may have a film with a concave-convex structure, a light-diffusing film, or the like. The lens or film is placed on a plate with a refractive index similar to that of the substrate or the lens or film. By bonding the substrate using an adhesive having the above-mentioned properties, a light extraction structure can be formed.

[0168] The conductive layer 814 is not necessarily provided, but it is possible to reduce the voltage drop due to the resistance of the lower electrode 831. For the same purpose, the upper electrode 835 and the electrode A conductive layer for electrical connection is formed on the insulating layer 821, the EL layer 833, the upper electrode 835, or the like. It may be provided.

[0169] The conductive layer 814 may be made of copper, titanium, tantalum, tungsten, molybdenum, chromium, or neodymium. Materials selected from the group consisting of aluminum, scandium, nickel, and aluminum, or materials containing these as their main components The conductive layer 814 can be formed as a single layer or a stacked layer using an alloy material or the like. For example, it can be 0.1 μm or more and 3 μm or less, and preferably 0.1 μm or more and 0.1 μm or less. It is less than 0.5μm.

[0170] A paste (such as silver paste) is used as the material for the conductive layer electrically connected to the upper electrode 835. When the conductive layer is heated, the metal constituting the conductive layer becomes granular and aggregates. This results in a structure with many gaps, making it difficult for the EL layer 833 to completely cover the conductive layer, and This is preferable because it becomes easier to electrically connect the conductive layer to the conductive layer.

[0171] In Example 5, the insulating layer 813, the light emitting element 830, etc. are fabricated on a highly heat-resistant fabrication substrate. The substrate is peeled off, and an insulating layer 813 and a light emitting element 83 are formed on the substrate 801 using an adhesive layer 811. This shows a light-emitting panel that can be manufactured by transposing 0 etc. on a highly heat-resistant manufacturing substrate. By applying high temperature to form a film with sufficiently low water permeability and transferring it to the substrate 801, reliability is improved. Thus, in one embodiment of the present invention, a light-emitting panel that is lightweight or thin can be manufactured. Moreover, a highly reliable light-emitting panel can be realized.

[0172] The protective layer 120 is provided to cover the exposed portion of the light-emitting panel. The exposed surfaces of the plate 803, the bonding layer 121, the insulating layer 813, the adhesive layer 811, and the substrate 801, etc. The protective layer 120 is provided to cover a part or the whole of the conductive layer 857a and The conductive layer 857b has an opening that overlaps with a part of the surface of the conductive layer 110a.

[0173] Although an example in which a light-emitting element is used as a display element has been shown here, The embodiment is not limited to this.

[0174] For example, MEMS (Micro Electro Mechanical Systems) A display device using a display element such as an electron-emitting element or an electron-emitting device can be used. Display elements using MS include shutter-type MEMS display elements and optical interference-type ME Examples include MS display elements. Electron-emitting elements are made of carbon nanotubes. Electronic paper may also be used. As electronic paper, a microcapsule type , electrophoresis method, electrowetting method, electronic liquid powder (registered trademark) method, etc. The element can be used.

[0175] [Example of materials] Next, materials that can be used for the light-emitting panel will be described. The explanation of the configuration may be omitted.

[0176] The substrate can be made of materials such as glass, quartz, organic resin, metal, and alloy. The substrate on the side from which light from the optical element is extracted is made of a material that is translucent to the light.

[0177] In particular, it is preferable to use a flexible substrate. For example, an organic resin or a flexible substrate may be used. Any thickness of glass, metal or alloy can be used.

[0178] Since organic resin has a smaller specific gravity than glass, when organic resin is used as a flexible substrate, This is preferable because it allows the light-emitting panel to be lighter than when glass is used.

[0179] It is preferable to use a highly tough material for the substrate. This makes it possible to achieve excellent impact resistance and breakage resistance. For example, it is possible to realize a light-emitting panel that is hard to damage. By using a metal or alloy substrate, it is lighter and less susceptible to breakage than when using a glass substrate. It is possible to create a light-emitting panel.

[0180] Metallic and alloy materials have high thermal conductivity and can easily conduct heat across the entire substrate, making it possible to This is preferable because it can suppress local temperature rises in the panel. The thickness of the substrate is preferably 10 μm or more and 200 μm or less, and more preferably 20 μm or more and 50 μm or less. It is more preferable to do so.

[0181] The material for forming the metal substrate or alloy substrate is not particularly limited, but for example, aluminum Metals such as aluminum, copper, iron, titanium, nickel, etc., or one or more metals selected from these metals The alloy may be, for example, an aluminum alloy or a stainless steel alloy. For example, a stainless steel sheet can be preferably used.

[0182] In addition, if a material with high thermal emissivity is used for the substrate, the surface temperature of the light-emitting panel will increase. This can prevent damage to the light-emitting panel and a decrease in reliability. A stack of high emissivity layers (for example, metal oxides or ceramic materials can be used) It may also be constructed as such.

[0183] Examples of materials that are flexible and transparent include polyethylene terephthalate (PE T), polyester resins such as polyethylene naphthalate (PEN), polyacrylonitrile resin, polyimide resin, polymethyl methacrylate resin, polycarbonate (PC) resin Resin, polyethersulfone (PES) resin, polyamide resin, cycloolefin resin, Styrene resin, polyamide-imide resin, polyvinyl chloride resin, polytetrafluoroethylene In particular, it is preferable to use a material with a low thermal expansion coefficient. For example, polyamide-imide resin, polyimide resin, PET, etc. can be suitably used. In addition, there are substrates in which fibers are impregnated with resin (also called prepregs), and inorganic fillers are mixed with organic resins. It is also possible to use substrates that have been mixed with grease to reduce their thermal expansion coefficient.

[0184] As for the flexible substrate, the layer using the above material acts as a hard layer to protect the surface of the device from scratches. Coating layers (e.g., silicon nitride layers) and layers of materials that can disperse pressure (e.g., ara The insulating layer may be laminated with a polymer layer (e.g., a polymer layer).

[0185] The flexible substrate may be formed by stacking a plurality of layers. This means that the barrier properties against water and oxygen can be improved, resulting in a highly reliable light-emitting panel. can.

[0186] For example, a flexible substrate in which a glass layer, an adhesive layer, and an organic resin layer are laminated from the side closer to the light emitting element is used. The thickness of the glass layer is preferably 20 μm or more and 200 μm or less. The thickness is preferably 25 μm or more and 100 μm or less. A glass layer with such a thickness is highly resistant to water and oxygen. The thickness of the organic resin layer can be set to 1. The thickness is 0 μm or more and 200 μm or less, preferably 20 μm or more and 50 μm or less. By providing a mechanical resin layer, breakage and cracks in the glass layer are suppressed and mechanical strength is improved. By applying such a composite material of glass and organic resin to the substrate, This makes it possible to provide a highly reliable and flexible light-emitting panel.

[0187] For adhesive and bonding layers, there are various types of adhesives, such as UV-curable adhesives, reactive-curable adhesives, and thermosetting adhesives. Various curing adhesives such as adhesives and anaerobic adhesives can be used. Epoxy resin, acrylic resin, silicone resin, phenolic resin, polyimide resin, Imide resin, PVC (polyvinyl chloride) resin, PVB (polyvinyl butyral) resin Examples of the resin include EVA (ethylene vinyl acetate) resin. A material with low wettability is preferred. A two-component resin may also be used. etc. may also be used.

[0188] The resin may also contain a desiccant. For example, an oxide of an alkaline earth metal (an acid The material used is one that absorbs moisture by chemical adsorption, such as calcium oxide or barium oxide. Alternatively, materials such as zeolite and silica gel can absorb water by physical adsorption. If a desiccant is included, impurities such as moisture can be absorbed into the functional element. This is preferable because it can suppress the intrusion of foreign matter and improve the reliability of the light-emitting panel.

[0189] Furthermore, by mixing a filler with a high refractive index or a light scattering material into the resin, it is possible to For example, titanium oxide, barium oxide, Zeolite, zirconium, etc. can be used.

[0190] The structure of the transistors included in the light-emitting panel is not particularly limited. The transistor may be a top gate transistor or an inverted staggered transistor. The transistor may have either a top-gate or bottom-gate structure. The semiconductor material is not particularly limited, and examples thereof include silicon, germanium, silicon carbide, and nitride semiconductor. Indium, gallium, etc., such as In-Ga-Zn based metal oxides, Alternatively, an oxide semiconductor containing at least one of sodium and zinc may be used.

[0191] The crystallinity of the semiconductor material used in the transistor is not particularly limited. A semiconductor having crystallinity (a microcrystalline semiconductor, a polycrystalline semiconductor, a single-crystal semiconductor, or a semiconductor having a partially crystalline region) If a semiconductor having crystallinity is used, This is preferable because it can suppress deterioration of the resistor characteristics.

[0192] Here, transistors used in pixels, drive circuits, touch sensors, etc., which will be described later, It is preferable to use an oxide semiconductor for any semiconductor device. It is preferable to use an oxide semiconductor with a larger band gap than silicon. When a semiconductor material with a wide band and low carrier density is used, the off state of the transistor This is preferable because it can reduce the current in the

[0193] For example, the oxide semiconductor may contain at least indium (In) or It is preferable that zinc (Zn) is contained. More preferably, it is an In-M-Zn-based oxide (wherein M is A). (metals such as l, Ti, Ga, Ge, Y, Zr, Sn, La, Ce or Hf) Contains oxides.

[0194] In particular, the semiconductor layer has a plurality of crystal portions, and the c-axes of the crystal portions are aligned with the surface on which the semiconductor layer is formed. Or, the crystals are oriented perpendicular to the upper surface of the semiconductor layer, and grain boundaries can be confirmed between adjacent crystal portions. It is preferable to use an oxide semiconductor film that does not have a resistivity.

[0195] Such oxide semiconductors have no crystal grain boundaries, so when the display panel is bent, The occurrence of cracks in the oxide semiconductor film due to stress is suppressed. Such oxide semiconductors are suitable for use in flexible display panels that are used in a curved state. You can be there.

[0196] By using such a crystalline oxide semiconductor material as the semiconductor layer, the electrical properties This suppresses fluctuations in the resistance, thereby achieving a highly reliable transistor.

[0197] In addition, transistors using oxide semiconductors with a larger band gap than silicon are also being developed. The capacitor, with its low off-state current, can discharge the charge stored in the capacitor connected in series with the transistor. By applying such a transistor to a pixel, This makes it possible to stop the drive circuit while maintaining the gradation of the image displayed in each display area. As a result, electronic devices with extremely low power consumption can be realized.

[0198] For stabilizing the characteristics of the transistor, it is preferable to provide an underlayer film. , silicon oxide film, silicon nitride film, silicon oxynitride film, silicon nitride oxide film, etc. The base film can be formed by a single layer or a multilayer structure using an organic insulating film. , CVD (Chemical Vapor Deposition) method (Plasma CVD method, thermal CVD method, MOCVD (Metal Organic CVD) method, etc.), ALD (Atomic Layer Deposition), coating, printing, etc. In addition, the undercoat film may not be provided if it is not necessary. The layer 813 can also serve as an underlying film for the transistor.

[0199] The light emitting element can be a self-luminous element, which can be illuminated by current or voltage. The category includes devices whose light intensity is controlled, such as light-emitting diodes (LEDs), organic An EL element, an inorganic EL element, etc. can be used.

[0200] Light-emitting elements are available in top-emission, bottom-emission, and dual-emission types. The electrode on the light extraction side uses a conductive film that transmits visible light. In addition, it is preferable to use a conductive film that reflects visible light for the electrode on the side from which light is not extracted. stomach.

[0201] The conductive film that transmits visible light is made of, for example, indium oxide, indium tin oxide, indium tin oxide, It can be formed using zinc oxide, zinc oxide, zinc oxide doped with gallium, etc. Also, gold, silver, platinum, magnesium, nickel, tungsten, chromium, molybdenum , iron, cobalt, copper, palladium, titanium, and other metal materials, including these metal materials Alloys or nitrides of these metal materials (for example, titanium nitride) can also be used to the extent that they have translucency. It can be used by forming it thin. Also, a laminated film of the above materials can be used as a conductive layer. For example, a laminated film of an alloy of silver and magnesium and indium tin oxide can be used. In this case, it is preferable to use graphene or the like, since the conductivity can be increased. .

[0202] The conductive film that reflects visible light is made of, for example, aluminum, gold, platinum, silver, nickel, tungsten, or the like. Metallic materials such as stainless steel, chromium, molybdenum, iron, cobalt, copper, or palladium, or In addition, the above metal materials and alloys may contain lanthanum. Tungsten, neodymium, germanium, etc. may be added. Titanium, nickel Alternatively, an alloy containing neodymium and aluminum (aluminum alloy) may be used. Alternatively, an alloy containing silver and copper, palladium, or magnesium may be used. The alloy is preferable because of its high heat resistance. Furthermore, an aluminum film or an aluminum alloy film By laminating a metal film or a metal oxide film in contact with the surface of the substrate, oxidation can be suppressed. Examples of materials for such metal films and metal oxide films include titanium and titanium oxide. Alternatively, the conductive film that transmits visible light may be laminated with a film made of a metal material. and indium tin oxide laminated film, silver-magnesium alloy and indium tin oxide laminated film etc. can be used.

[0203] The electrodes may be formed by vapor deposition or sputtering. Forming using ejection methods such as ink jet printing, printing methods such as screen printing, or plating methods It can be achieved.

[0204] A voltage higher than the threshold voltage of the light emitting element is applied between the lower electrode 831 and the upper electrode 835. When this occurs, holes are injected into the EL layer 833 from the anode side, and electrons are injected from the cathode side. The electrons and holes are recombined in the EL layer 833, and the light-emitting material contained in the EL layer 833 emits light. It glows.

[0205] The EL layer 833 has at least a light-emitting layer. The EL layer 833 includes the following layers other than the light-emitting layer: Materials with high hole injection properties, materials with high hole transport properties, hole blocking materials, materials with high electron transport properties Highly electron-injecting or bipolar material (highly electron-transporting and hole-transporting properties) The layer may further include a layer containing a material.

[0206] The EL layer 833 can be made of either a low molecular weight compound or a high molecular weight compound. The layers constituting the EL layer 833 may be formed by evaporation (vacuum evaporation). It can be formed by methods such as transfer method, printing method, ink jet method, coating method, etc. Cut.

[0207] When a white light emitting element is used as the light emitting element 830, two types of It is preferable that the light emitting element contains two or more luminescent materials. White light can be obtained by selecting luminescent materials so that the light is complementary in color. For example, they emit light of R (red), G (green), B (blue), Y (yellow), O (orange), etc. or luminescent materials that emit light containing spectral components of two or more of the colors R, G, and B. It is preferable that the light emitting element 830 contains two or more of the above substances. The wavelength of the visible light (e.g., 350 nm to 750 nm) has two or more peaks. It is preferable to use a light-emitting element having a peak in the yellow wavelength region. The emission spectrum of this material has spectral components in the green and red wavelength regions. It is preferable that:

[0208] More preferably, the EL layer 833 is a light-emitting layer containing a light-emitting material that emits light of one color and a light-emitting layer containing a light-emitting material that emits light of another color. It is preferable that the light-emitting layer has a laminated structure including a light-emitting layer containing a light-emitting material that emits light of E The plurality of light-emitting layers in the L layer 833 may be stacked in contact with each other, or any of the light-emitting layers may be stacked in contact with each other. For example, a fluorescent light-emitting layer and a phosphorescent light-emitting layer may be laminated via an area that does not contain a light-emitting material. The same material as the fluorescent or phosphorescent emitting layer (e.g., a host material, an assist material, etc.) is interposed between the It is also possible to provide a region containing a light-emitting material and not containing any light-emitting material. This facilitates the fabrication of the light-emitting element and reduces the driving voltage.

[0209] The light emitting element 830 may be a single element having one EL layer, or may be a light emitting element having multiple EL layers. The device may be a tandem device in which an EL layer is stacked via a charge generating layer.

[0210] The light emitting element is preferably provided between a pair of insulating films with low water permeability. This makes it possible to prevent impurities such as water from entering the light emitting element, thereby preventing a decrease in the reliability of the light emitting device. It can be controlled.

[0211] As insulating films with low water permeability, films containing nitrogen and silicon such as silicon nitride film and silicon nitride oxide film are used. and films containing nitrogen and aluminum, such as an aluminum nitride film. A silicon oxide film, a silicon oxynitride film, an aluminum oxide film, or the like may also be used.

[0212] For example, the water vapor permeation rate of a low-permeability insulating film is 1×10 -5 [g / (m 2 ·day) ] or less, preferably 1 × 10 -6 [g / (m 2 ·day)] or less, preferably 1 × 1 0 -7 [g / (m 2 ·day)] or less, more preferably 1 × 10 -8 [g / (m 2 ·d ay)] below.

[0213] It is preferable to use an insulating film with low water permeability for the insulating layer 813 and the insulating layer 843.

[0214] The insulating layer 815 may be, for example, a silicon oxide film, a silicon oxynitride film, or an aluminum oxide film. An inorganic insulating film such as an inorganic film can be used. The insulating layer 817b may be made of, for example, polyimide, acrylic, polyamide, or polyimide. Organic materials such as amide and benzocyclobutene resins can be used. Low dielectric constant materials (low-k materials) can be used. Each insulating layer may be formed by

[0215] The insulating layer 821 is formed using an organic insulating material or an inorganic insulating material. Examples of the resin include polyimide resin, polyamide resin, acrylic resin, siloxane resin, and epoxy resin. In particular, photosensitive resin materials can be used to provide insulation. It is preferable that the sidewall of the edge layer 821 is formed as an inclined surface having a curvature. .

[0216] The method for forming the insulating layer 821 is not particularly limited, but may be a photolithography method, a sputtering method, or the like. , evaporation method, droplet ejection method (inkjet method, etc.), printing method (screen printing, offset printing) It is best to use a printing press, etc.

[0217] The spacer 827 may be formed using an inorganic insulating material, an organic insulating material, a metal material, or the like. For example, inorganic insulating materials and organic insulating materials can be used for the insulating layer. Examples of metal materials that can be used include titanium and aluminum. The spacer 827 containing a conductive material and the upper electrode 835 are electrically connected to each other. This can suppress the potential drop caused by the resistance of the upper electrode 835. The shape of the 27 may be either a forward tapered shape or a reverse tapered shape.

[0218] For light-emitting panels that function as electrodes and wiring of transistors or auxiliary electrodes of light-emitting elements, The conductive layer used may be made of, for example, molybdenum, titanium, chromium, tantalum, tungsten, or aluminum. Metallic materials such as aluminum, copper, neodymium, scandium, etc., or alloy materials containing these elements The conductive layer can be formed as a single layer or a laminated layer using a conductive metal oxide. The conductive metal oxide may be indium oxide (In2O3, etc.). ), tin oxide (SnO2, etc.), zinc oxide (ZnO), indium tin oxide, indium zinc Lead oxide (In2O3-ZnO, etc.) or these metal oxide materials containing silicon oxide The above can be used.

[0219] The colored layer is a colored layer that transmits light in a specific wavelength band. For example, A red (R) color filter transmits light in the green wavelength band, and a green (G) color filter transmits light in the green wavelength band. A blue (B) color filter that transmits light in the blue wavelength band can be used. Each color layer can be formed using various materials by printing, inkjet printing, photolithography, etc. They are formed at desired positions by etching using a graphic technique or the like.

[0220] The light-shielding layer is provided between adjacent colored layers. The light-shielding layer blocks light from the adjacent light-emitting element. The colored layer is formed on the edge of the light-shielding layer to prevent color mixing between adjacent light-emitting elements. By providing the light-shielding layer so that it overlaps the light-shielding layer, it is possible to suppress light leakage. Materials that block light emitted from the light-emitting element can be used, and include, for example, metal materials, pigments, and dyes. The black matrix may be formed using a resin material containing the light-shielding layer. If the light emitting element is provided in an area other than the light emitting part, unintended light leakage due to guided light can be suppressed. This is preferable.

[0221] In addition, an overcoat may be provided to cover the colored layer and the light-shielding layer. By doing so, it is possible to prevent impurities contained in the colored layer from diffusing into the light emitting element. The overcoat is made of a material that transmits light emitted from the light emitting element, such as silicon nitride. It uses inorganic insulating films such as silicon oxide films, and organic insulating films such as acrylic films and polyimide films. The insulating film may have a laminated structure of an organic insulating film and an inorganic insulating film.

[0222] In addition, when the material for the bonding layer is applied onto the colored layer and the light-shielding layer, the material for the overcoat is It is preferable to use a material that has high wettability with respect to the material of the bonding layer. As the substrate, an oxide conductive film such as an indium tin oxide film or an A thin film having a light-transmitting property is used. It is preferable to use a metal film such as a g film.

[0223] The connector is a paste or sheet made of a thermosetting resin mixed with metal particles. For example, a material that exhibits anisotropic conductivity when thermocompressed can be used. For example, particles with layers of two or more metals, such as nickel particles coated with gold, are used. Alternatively, it is preferable to use a material in which the surface of granular resin is coated with metal. Desirable.

[0224] [Example of manufacturing method] Next, a method for manufacturing a light-emitting panel will be illustrated with reference to FIGS. 12 and 13. The following description will be given taking the light-emitting panel having the configuration of 1 (FIG. 6(C)) as an example.

[0225] First, a peeling layer 203 is formed on a fabrication substrate 201, and an insulating layer 813 is formed on the peeling layer 203. Next, a plurality of transistors and terminals 110 (conductive layer 110a, conductive layer 110b) are formed on the insulating layer 813. a conductive layer 110b), an insulating layer 815, an insulating layer 817, a plurality of light-emitting elements, and an insulating layer 821. The insulating layer 821, the insulating layer 817, and the insulating layer 110b are formed so that the conductive layer 110b is exposed. The edge layer 815 is opened, and the conductive layer 110a is formed to fill the opening (FIG. 12(A)). ).

[0226] In addition, a peeling layer 207 is formed on the fabrication substrate 205, and an insulating layer 843 is formed on the peeling layer 207. Next, a light-shielding layer 847, a coloring layer 845, and an overcoat 84 are formed on the insulating layer 843. 9 is formed (Figure 12(B)).

[0227] The substrates 201 and 205 are made of glass, quartz, and surface treatment. A fiber substrate, a ceramic substrate, a metal substrate, or the like can be used.

[0228] The glass substrate may be made of, for example, aluminosilicate glass or aluminoborosilicate glass. Glass materials such as glass and barium borosilicate glass can be used. If the degree of hardness is high, it is advisable to use one with a strain point of 730°C or higher. By adding more BaO, a more practical heat-resistant glass can be obtained. Russ etc. can be used.

[0229] When a glass substrate is used as the substrate for fabrication, a silicon oxide film, an acid film, or the like is formed between the substrate for fabrication and the peeling layer. When an insulating film such as a silicon nitride film, a silicon nitride film, or a silicon nitride oxide film is formed, the glass This is preferable because it can prevent contamination from the substrate.

[0230] The peeling layer 203 and the peeling layer 207 are made of tungsten, molybdenum, and titanium, respectively. Niobium, tantalum, niobium, nickel, cobalt, zirconium, zinc, ruthenium, rhodium an element selected from the group consisting of palladium, osmium, iridium, and silicon; It is made of an alloy material or a compound material containing the element, and is a single layer or a laminated layer. The crystal structure of the layer containing silicon may be amorphous, microcrystalline, or polycrystalline.

[0231] The release layer can be formed by sputtering, plasma CVD, coating, printing, etc. The coating method includes a spin coating method, a droplet ejection method, and a dispensing method.

[0232] When the release layer has a single layer structure, it is made up of a tungsten layer, a molybdenum layer, or a combination of tungsten and molybdenum. It is preferable to form a layer containing a mixture of tungsten and tungsten. a layer containing an oxynitride, a layer containing an oxide or oxynitride of molybdenum, or a layer containing tungsten Alternatively, a layer containing an oxide or oxynitride of a mixture of silicon and molybdenum may be formed. The mixture of tungsten and molybdenum is, for example, a mixture of tungsten and molybdenum. Correct.

[0233] In addition, a layer containing tungsten and a layer containing tungsten oxide may be used as a peeling layer. When forming a structure, a layer containing tungsten is formed, and an insulating layer formed of oxide is formed on top of it. By forming a film, a tungsten oxide film is formed at the interface between the tungsten layer and the insulating film. The surface of the tungsten-containing layer may be subjected to thermal oxidation. Oxidizing agents such as oxygen plasma treatment, nitrous oxide (N2O) plasma treatment, and ozone water A layer containing tungsten oxide may be formed by treating with a solution or the like. Treatment and heating may be carried out using oxygen, nitrogen, or nitrous oxide, either alone or in combination with other gases. The plasma treatment or heat treatment may be carried out under a mixed gas atmosphere. By changing the temperature, it is possible to control the adhesion between the release layer and the insulating film that will be formed later. be.

[0234] Each insulating layer is formed by using a sputtering method, a plasma CVD method, a coating method, a printing method, etc. For example, it is possible to form a thin film at a temperature of 250°C or higher and 400°C or higher by plasma CVD. By forming the membrane at a temperature of 100° C. or lower, a dense membrane with extremely low water permeability can be obtained.

[0235] Thereafter, the surface of the production substrate 205 on which the colored layer 845 and the like are provided or the light-emitting element of the production substrate 201 is A material to be the bonding layer 121 is applied to the surface on which the element 230 and the like are provided, and the bonding layer 121 is then bonded to the surface. The fabrication substrate 201 and fabrication substrate 205 are bonded together so that their surfaces face each other (FIG. 12( C).

[0236] Then, the fabrication substrate 201 is peeled off, and the exposed insulating layer 813 and the substrate 801 are bonded to the adhesive layer 81 1. The manufacturing substrate 205 is peeled off, and the exposed insulating layer 843 and the substrate 13A, the substrate 803 is bonded to the terminal 1. Although the terminal 110 does not overlap with the substrate 803, the terminal 110 and the substrate 803 may overlap.

[0237] For example, a peeling layer may be formed by a method using a film made of a material such as a resin. When a layer containing a metal oxide film is formed on the side in contact with the peeling layer, the metal oxide film is crystallized. The layer to be peeled off can be peeled off from the substrate by weakening the film. When an amorphous silicon film containing hydrogen is formed as a peeling layer between the substrate and the peeled layer, laser light The amorphous silicon film is removed by irradiation or etching, and the layer to be peeled is separated from the substrate. The peeling layer can be peeled off from the peeled layer. The metal oxide film is weakened by crystallization, and a part of the peeling layer is then dissolved in a solution or NF. 3. After removal by etching using fluoride gases such as BrF3 and ClF3, the weakened It can be peeled off from the metal oxide film. Furthermore, nitrogen, oxygen, hydrogen, etc. can be used as a peeling layer. (for example, amorphous silicon film containing hydrogen, hydrogen-containing alloy film, oxygen-containing alloy film, etc.) The peeling layer is irradiated with laser light to release nitrogen, oxygen, and hydrogen contained in the peeling layer as gas. A method of promoting peeling between the peeled layer and the substrate by releasing the peeled layer may also be used. The substrate is mechanically removed or etched with a solution or fluorinated gas such as NF3, BrF3, or ClF3. In this case, the peeling layer can be removed without providing a peeling layer. good.

[0238] Furthermore, by combining a plurality of the above peeling methods, the peeling process can be carried out more easily. In other words, laser irradiation, etching of the peeling layer with gas or solution, sharp knife or Mechanical removal is performed using a scalpel or similar tool to make the peeling layer and the peeled layer easier to peel off. Alternatively, the peeling can be performed by physical force (using a machine, etc.).

[0239] In addition, a liquid is allowed to penetrate into the interface between the peeling layer and the layer to be peeled, and the layer to be peeled is peeled from the substrate. Furthermore, the peeling may be performed while pouring a liquid such as water on the film.

[0240] As for other peeling methods, if the peeling layer is made of tungsten, ammonia water and The peeling layer may be etched with a mixed solution of hydrogen peroxide and water to perform the peeling.

[0241] Note that if peeling can be performed at the interface between the formation substrate and the peeled layer, a peeling layer may not be provided. For example, glass is used as the substrate, and polyimide, polyester, or polyimide is placed in contact with the glass. Forming organic resins such as polyolefin, polyamide, polycarbonate, and acrylic, Insulating films, transistors, etc. are formed on the resin. In this case, by heating the organic resin, It can be peeled off at the interface between the substrate and the organic resin. A metal layer is provided, and the metal layer is heated by passing an electric current through the metal layer, and an organic resin is formed at the interface between the metal layer and the organic resin. Peeling may also be performed.

[0242] Next, the insulating layer 843 and the bonding layer 121 are opened to expose the terminal 110 ( 13(B). In the case where the substrate 803 overlaps the terminal 110, the terminal 110 is exposed. To allow the light to pass through, the substrate 803 and the adhesive layer 841 are also opened (FIG. 13(C)). The method is not particularly limited, and examples thereof include laser ablation, etching, ion beam sputtering, etc. Alternatively, the film on the terminal 110 may be cut using a sharp blade or the like. Alternatively, a part of the film may be peeled off by applying a pressure to the film.

[0243] Here, an example is shown in which the opening is provided after the insulating layer 843 and the bonding layer 121 are formed. However, it is necessary to prevent the insulating layer 843 and the bonding layer 121 from being formed in advance in the portion that will become the opening. Alternatively, you can attach adhesive tape to the part that overlaps with the terminal 110 in advance. The opening may be formed by placing the tape on the insulating film and then peeling off the tape.

[0244] Thereafter, the protective layer 120 is formed. When the protective layer 120 is formed by the ALD method, the light-emitting A dense and uniform protective layer 120 can be formed over the surface of the panel. An example of an apparatus that can be used to deposit layer 120 is described below.

[0245] The protective layer 120 can be formed by deposition methods such as sputtering and CVD, as well as by spin coating. Alternatively, a coating method using a liquid material, such as a coating method or a dipping method, may be applied.

[0246] The area where the protective layer 120 is not to be formed is masked in advance. By removing the masking later, openings can be formed in the protective layer 120. The material used for the masking must be easy to remove later and must be resistant to the temperature during the deposition of the protective layer 120. It is sufficient to use a material that is heat resistant and stable against the deposition gas (or liquid). For example, It is preferable to use an adhesive tape containing polyimide.

[0247] In addition, since the conductive layer 110a that is resistant to oxidation is formed on the surface of the terminal 110, A When the protective layer 120 is formed by the LD method or the like, it can be formed in a self-aligned manner without the need for the above-mentioned masking. In addition, a portion where the protective layer 120 is not formed is formed on the conductive layer 110a.

[0248] In this manner, a light-emitting panel can be manufactured.

[0249] This embodiment may be combined, at least in part, with other embodiments described in this specification. It can be implemented in combination.

[0250] (Embodiment 3) In this embodiment, a folding type liquid crystal display device that can be applied to a display panel included in a display device of one embodiment of the present invention will be described. An example of the configuration of a bendable touch panel will be described with reference to FIGS. 14 to 18. For materials that can be used for the layers, refer to Embodiment 2.

[0251] [Configuration example 1] FIG. 14(A) is a top view of the touch panel 390. FIG. 14(B) is a top view of the touch panel 390. FIG. 14(C) is a cross-sectional view between dashed dotted lines AB and dashed dotted lines CD. FIG. 1 is a cross-sectional view taken along dashed lines EF.

[0252] As shown in FIG. 14A, the touch panel 390 includes a display unit 301 .

[0253] The display unit 301 includes a plurality of pixels 302 and a plurality of imaging pixels 308. This allows the detection of a finger or the like touching the display unit 301. A touch sensor can be configured using the above.

[0254] The pixel 302 includes a plurality of sub-pixels (for example, the sub-pixel 302R), each of which includes a light-emitting element and a The pixel circuit is capable of supplying power to drive the light emitting element.

[0255] The pixel circuit includes wiring that can supply a selection signal and wiring that can supply an image signal. The wiring is electrically connected to the wiring.

[0256] The touch panel 390 also includes a scan line driver that can supply selection signals to the pixels 302. circuit 303g(1), and an image signal line driving circuit capable of supplying an image signal to the pixel 302. It has a path 303s(1).

[0257] The imaging pixel 308 includes a photoelectric conversion element and an imaging pixel circuit that drives the photoelectric conversion element.

[0258] The imaging pixel circuit has wiring that can supply a control signal and a power supply potential. It is electrically connected to the wiring that can be used.

[0259] The control signal is used to select an imaging pixel circuit that reads out the recorded imaging signal, for example. a signal that can initialize the imaging pixel circuit, and a signal that can initialize the imaging pixel circuit Examples of such signals include signals that can determine the time at which the signal is detected.

[0260] The touch panel 390 may provide control signals to the imaging pixels 308. and an image pickup signal line drive circuit 303s(2) that reads out the image pickup signal. .

[0261] As shown in FIG. 14B, the touch panel 390 is formed on a substrate 510 and a substrate 510 facing the substrate 510. The substrate 570 is a substrate for supporting the semiconductor device.

[0262] A flexible material can be suitably used for the substrate 510 and the substrate 570 .

[0263] Materials that suppress impurity permeation can be suitably used for the substrates 510 and 570. For example, if the water vapor permeability is 10 -5 [g / (m 2 ·day)] or less, preferably 10 -6 [g / (m 2 A material having a shelf life of 10 days or less can be preferably used.

[0264] Materials with approximately the same linear expansion coefficient can be suitably used for the substrates 510 and 570. For example, if the linear expansion coefficient is 1×10 -3 / K or less, preferably 5×10 -5 / K or less, more preferable Preferably 1 x 10 -5 A material having a solubility of 0.1 kJ / K or less can be suitably used.

[0265] The substrate 510 includes a flexible substrate 510b and an insulating layer 510a that prevents impurities from diffusing into the light emitting element. and an adhesive layer 510c that bonds the flexible substrate 510b and the insulating layer 510a together. It is a laminate.

[0266] The substrate 570 includes a flexible substrate 570b and an insulating layer 570a that prevents impurities from diffusing into the light-emitting element. and an adhesive layer 570c that bonds the flexible substrate 570b and the insulating layer 570a. do.

[0267] For example, polyester, polyolefin, polyamide (nylon, aramid, etc.), poly Imide, polycarbonate, polyurethane, acrylic resin, epoxy resin, or white A material containing a resin having xanthane bonds can be used for the adhesive layer.

[0268] The bonding layer 121 bonds the substrate 570 and the substrate 510 together. In addition, when light is extracted to the bonding layer 121 side, the bonding layer 121 is A layer that optically bonds two members (here, substrate 570 and substrate 510) sandwiching the composite layer 121. (hereinafter also referred to as an optical bonding layer) also functions as a pixel circuit and a light emitting element (for example, the first The light emitting element 350R is located between the substrate 510 and the substrate 570.

[0269] The pixel 302 includes a subpixel 302R, a subpixel 302G, and a subpixel 302B (FIG. 14 (C)). The subpixel 302R includes a light-emitting module 380R, and the subpixel 302G includes a light-emitting The subpixel 302B comprises a light emitting module 380G, and the subpixel 302B comprises a light emitting module 380B.

[0270] For example, the subpixel 302R supplies power to the first light-emitting element 350R and the second light-emitting element 350R. (FIG. 14(B)) The light emitting module 380R includes a first light emitting element 350R and an optical element (for example, a color layer 367R).

[0271] The first light emitting element 350R includes a first lower electrode 351R, an upper electrode 352, a lower electrode 35 The EL layer 353 is disposed between the 1R and the upper electrode 352 (FIG. 14(C)).

[0272] The EL layer 353 includes a first EL layer 353a, a second EL layer 353b, and a second EL layer 353c. An intermediate layer 354 is provided between 53a and the second EL layer 353b.

[0273] The light emitting module 380R has a first colored layer 367R on the substrate 570. The colored layer is particularly It is sufficient if it transmits light having a certain wavelength, for example, red, green, or blue. Alternatively, the light emitted by the light emitting element can be directly transmitted through the light emitting element. Alternatively, a transparent region may be provided.

[0274] For example, the light emitting module 380R includes a first light emitting element 350R and a first color layer 367R. The bonding layer 121 is in contact with the substrate.

[0275] The first colored layer 367R is located so as to overlap the first light emitting element 350R. A part of the light emitted by the first light emitting element 350R is incident on the bonding layer 121, which also serves as an optical bonding layer, and the first The light is transmitted through the colored layer 367R and emitted to the outside of the light emitting module 380R as shown by the arrow in the figure. It is served.

[0276] The touch panel 390 has a light-shielding layer 367BM on a substrate 570. The light-shielding layer 367BM , and is provided so as to surround the colored layer (for example, the first colored layer 367R).

[0277] The touch panel 390 includes an anti-reflection layer 367p at a position overlapping the display unit 301. The antireflection layer 367p may be, for example, a circular polarizer.

[0278] The touch panel 390 includes an insulating layer 321. The insulating layer 321 is connected to the transistor 302t. The insulating layer 321 serves to flatten the unevenness caused by the pixel circuit. In addition, the diffusion of impurities into the transistor 302t and the like can be suppressed. An insulating layer having a laminate of layers that can be formed can be applied to the insulating layer 321.

[0279] The touch panel 390 has a light emitting element (for example, a first light emitting element 350R) mounted on an insulating layer 321. has.

[0280] The touch panel 390 has a partition wall 328 overlapping the end of the first lower electrode 351R and an insulating layer 3 21. Also, a spacer 329 for controlling the distance between the substrate 510 and the substrate 570 is provided on the substrate 510. It is located on the wall 328.

[0281] The image signal line driver circuit 303s(1) includes a transistor 303t and a capacitor 303c. The driver circuit can be formed on the same substrate as the pixel circuit in the same process. As shown in (B), the transistor 303t has a second gate 304 on the insulating layer 321. The second gate 304 is electrically connected to the gate of the transistor 303t. Alternatively, different potentials may be applied to the first and second electrodes. The second gate 304 may be provided to the transistor 308t, the transistor 302t, and so on.

[0282] The imaging pixel 308 converts light incident on the photoelectric conversion element 308p and the photoelectric conversion element 308p into a The imaging pixel circuit includes a transistor 308t. include.

[0283] For example, a pin-type photodiode can be used as the photoelectric conversion element 308p.

[0284] The touch panel 390 includes wiring 311 through which signals can be supplied, and the terminals 110 are The wiring 311 is provided to supply signals such as image signals and synchronization signals. The FPC 309(1) is electrically connected to the terminal 110. 1) may have a printed wiring board (PWB) attached.

[0285] The terminal 110 has a conductive layer 110b on the wiring 311 and a conductive layer 110a on the conductive layer 110b. The laminated structure has the following:

[0286] The protective layer 120 is provided to cover the exposed portion of the touch panel. Substrate 570 (flexible substrate 570b, adhesive layer 570c, insulating layer 570a), bonding layer 121, The exposed surface of the substrate 510 (flexible substrate 510b, adhesive layer 510c, insulating layer 510a) The protective layer 120 is provided to cover a part or the whole of the surface of the terminal 110. It has an opening that overlaps with the part.

[0287] The transistors formed in the same process are referred to as transistor 302t and transistor 303. This can be applied to transistors such as transistor 308t. Please refer to the second embodiment.

[0288] In addition to the gate, source, and drain of the transistor, each element constituting the touch panel Materials that can be used for the seed wiring and electrodes include aluminum, titanium, chromium, nickel, and the like. Nickel, copper, yttrium, zirconium, molybdenum, silver, tantalum, or tungsten Metals such as nickel or alloys containing nickel as the main component are used in a single layer structure or a laminated structure. For example, a single layer structure of an aluminum film containing silicon, or a structure in which an aluminum film is laminated on a titanium film, Two-layer structure: Two-layer structure with aluminum film laminated on tungsten film, copper-magnesium- Two-layer structure with copper film laminated on aluminum alloy film, two-layer structure with copper film laminated on titanium film , a two-layer structure in which a copper film is laminated on a tungsten film, a titanium film or titanium nitride film and its titanium An aluminum film or a copper film is laminated on the titanium nitride film or the titanium nitride film, and a titanium film is further laminated on the aluminum film or the copper film. a three-layer structure in which a titanium nitride film or a molybdenum nitride film is formed; a molybdenum film or a molybdenum nitride film; An aluminum film or a copper film is laminated on the molybdenum film or the molybdenum nitride film, and There is also a three-layer structure in which a molybdenum film or molybdenum nitride film is formed on top of the above. Transparent conductive materials containing indium, tin oxide, or zinc oxide may also be used. The use of copper is preferable because it improves the controllability of the shape by etching.

[0289] [Configuration example 2] 15(A) and (B) are perspective views of the touch panel 505. FIG. 16 is a cross-sectional view taken along the dashed line X1-X2 in FIG. 15(A). be.

[0290] The touch panel 505 includes a display unit 501 and a touch sensor 595 (FIG. 15(B)). The touch panel 505 also includes a substrate 510, a substrate 570, and a substrate 590. , the substrate 510, the substrate 570 and the substrate 590 are all flexible.

[0291] The display unit 501 includes a substrate 510, a plurality of pixels on the substrate 510, and a display device for supplying signals to the pixels. The plurality of wirings 511 are provided in the form of: The wiring is routed to the outer periphery of the substrate 510, and the terminal 110 is provided on a part of the wiring. 10 is electrically connected to FPC509(1).

[0292] The terminal 110 has a conductive layer 110b on the wiring 511 and a conductive layer 110a on the conductive layer 110b. The laminated structure has the following:

[0293] The substrate 590 includes a touch sensor 595 and a plurality of electrodes electrically connected to the touch sensor 595. The wiring 598 is routed around the periphery of the substrate 590, and some of the wiring 598 The terminal is electrically connected to the FPC 509(2). 15(B), for clarity, the back side of the substrate 590 (the surface facing the substrate 510) The electrodes, wiring, etc. of the touch sensor 595 to be provided are indicated by solid lines.

[0294] As the touch sensor 595, for example, a capacitance type touch sensor can be applied. The capacitance type includes a surface capacitance type, a projected capacitance type, and the like.

[0295] The projected capacitive type is mainly divided into self-capacitance type and mutual capacitance type, which differ mainly in the driving method. The mutual capacitance method is preferable because it allows simultaneous multi-point detection.

[0296] In the following, when a projected capacitive touch sensor is applied, the following will be explained. This will be explained using:

[0297] In addition, various sensors that can detect the proximity or contact of a detection target such as a finger are used. It can be used.

[0298] The projected capacitive touch sensor 595 has an electrode 591 and an electrode 592. 591 is electrically connected to one of the plurality of wirings 598, and the electrode 592 is electrically connected to one of the plurality of wirings 598. and electrically connect to any other of the above.

[0299] As shown in FIGS. 15(A) and 15(B), the electrodes 592 are made up of a plurality of electrodes repeatedly arranged in one direction. The shape is such that two quadrilaterals are connected at their corners.

[0300] The electrode 591 is quadrilateral and is repeatedly arranged in a direction intersecting the direction in which the electrode 592 extends. It has been done.

[0301] The wiring 594 electrically connects the two electrodes 591 that sandwich the electrode 592. It is preferable to have a shape that minimizes the area of ​​the intersection between the electrode 592 and the wiring 594. This reduces the area of ​​the region where no electrodes are provided, and reduces variations in transmittance. As a result, unevenness in brightness of light passing through the touch sensor 595 can be reduced.

[0302] The shapes of the electrodes 591 and 592 are not limited to this, and may take various shapes. For example, a plurality of electrodes 591 are arranged with as few gaps as possible, and the electrodes 591 are connected to each other via an insulating layer. 92 may be provided at intervals so as to form an area that does not overlap with the electrode 591. At this time, a dummy electrode 592 is placed between two adjacent electrodes 592, and is electrically insulated from these electrodes. Providing an electrode is preferable because it can reduce the area of ​​the region with different transmittance.

[0303] The touch sensor 595 includes a substrate 590, electrodes 591 arranged in a staggered pattern on the substrate 590, and and electrode 592, an insulating layer 593 covering electrode 591 and electrode 592, and adjacent electrodes 591 and a wiring 594 for electrically connecting the

[0304] The adhesive layer 597 adheres the substrate 590 to the touch sensor 595 so that the touch sensor 595 overlaps the display unit 501. It is glued to board 570.

[0305] The electrode 591 and the electrode 592 are formed using a light-transmitting conductive material. Conductive materials that can be used include indium oxide, indium tin oxide, and indium zinc oxide. Conductive oxides such as zinc oxide and zinc oxide doped with gallium can be used. A film containing graphene can also be used. The film containing graphene is, for example, in the form of a film. The graphene oxide film can be formed by reducing the graphene oxide film. Examples of the method include a method of applying heat.

[0306] The electrodes 591 and 592 are each formed in a mesh shape, and the openings of the mesh are The light-emitting elements may be arranged so as to overlap each other. For this purpose, materials such as metals and alloys with low electrical conductivity can be used.

[0307] The conductive films such as the electrodes 591 and 592, that is, the wiring that constitutes the touch panel As a material that can be used for the electrodes, for example, a material with a low resistance value is desirable. Silver, copper, aluminum, carbon nanotubes, graphene, metal halides (halides) Furthermore, very thin particles (for example, particles having a diameter of several nanometers) may be used. Metal nanowires made up of a large number of conductors (meters) may also be used. Alternatively, a metal mesh made of a conductor may be used. For example, Ag nanowires Cu nanowires, Al nanowires, Ag meshes, Cu meshes, Al meshes, etc. In the case of Ag nanowires, the light transmittance is 89% or more, and the sheet resistance is 40 It is possible to achieve a transmittance of 100Ω / □ or more. For example, metal nanowires, metal meshes, carbon nanotubes, etc. are used for the electrodes, such as pixel electrodes and common electrodes. Nanotubes, graphene, etc. may also be used.

[0308] After forming a film of a light-transmitting conductive material on a substrate 590 by sputtering, By using various patterning techniques such as lithography, unnecessary parts are removed to form electrodes 59. 1 and electrode 592 can be formed.

[0309] The insulating layer 593 may be made of a resin such as acrylic or epoxy. In addition to resins with siloxane bonds, silicon oxide, silicon oxynitride, and aluminum oxide Inorganic insulating materials such as the above may also be used.

[0310] An opening reaching the electrode 591 is provided in the insulating layer 593, and a wiring 594 is formed on the adjacent electrode 591. The transparent conductive material increases the aperture ratio of the touch panel. Therefore, it can be suitably used for the wiring 594. 2. Materials with higher conductivity can reduce electrical resistance and are therefore suitable for use as wiring 594. can.

[0311] One electrode 592 extends in one direction, and multiple electrodes 592 are provided in a stripe pattern. .

[0312] The wiring 594 is provided to intersect with the electrodes 592 .

[0313] A pair of electrodes 591 are provided with one electrode 592 sandwiched therebetween, and wiring 594 is connected to the pair of electrodes 591 are electrically connected.

[0314] The plurality of electrodes 591 do not necessarily need to be arranged in a direction perpendicular to one electrode 592. The angle between the two electrodes may be less than 90 degrees.

[0315] One of the wirings 598 is electrically connected to the electrode 591 or the electrode 592. The wiring 598 is made of, for example, aluminum, gold, platinum, silver, or the like. , nickel, titanium, tungsten, chromium, molybdenum, iron, cobalt, copper, or para Metallic materials such as zinc and alloy materials containing such metallic materials can be used.

[0316] Note that an insulating layer is provided to cover the insulating layer 593 and the wiring 594 to protect the touch sensor 595. It is possible.

[0317] Furthermore, the connection layer 599 electrically connects the wiring 598 and the FPC 509(2).

[0318] The connection layer 599 may be made of various anisotropic conductive films (ACFs). Conductive Film) and Anisotropic Conductive Paste (ACP) opic conductive paste) can be used.

[0319] The adhesive layer 597 is transparent. For example, a thermosetting resin or an ultraviolet curing resin may be used. Specifically, resins such as acrylic, urethane, and epoxy, or siloxane Resins having such a structure can be used.

[0320] The display unit 501 includes a plurality of pixels arranged in a matrix. The display device includes a pixel circuit that drives the display element.

[0321] In this embodiment, an organic EL element that emits white light is applied to a display element. However, the display element is not limited to this.

[0322] For example, organic EL elements with different luminescent colors can be used as sub-pixels so that the color of light emitted varies from sub-pixel to sub-pixel. It may be applied pixel by pixel.

[0323] The substrate 510, the substrate 570, and the bonding layer 121 can have the same structure as in the first structural example.

[0324] The pixel includes a sub-pixel 502R, which comprises a light-emitting module 580R.

[0325] The sub-pixel 502R supplies power to the first light-emitting element 550R and the second light-emitting element 550R. The light emitting module further includes a pixel circuit including a transistor 502t. 580R includes a first light emitting element 550R and an optical element (eg, a color layer 567R).

[0326] The light-emitting element 550R has a lower electrode, an upper electrode, and an EL layer between the lower electrode and the upper electrode. .

[0327] The light emitting module 580R has a first colored layer 567R in the light extraction direction.

[0328] In addition, when the bonding layer 121 is provided on the light extraction side, the bonding layer 121 is It contacts the light emitting element 550R and the first colored layer 567R.

[0329] The first colored layer 567R is located so as to overlap the first light emitting element 550R. A part of the light emitted by the optical element 550R passes through the first colored layer 567R and is reflected by the arrows in the figure. The light is emitted to the outside of the light-emitting module 580R in the direction of the arrow.

[0330] The display unit 501 has a light-shielding layer 567BM in the light-emitting direction. , and is provided so as to surround the colored layer (for example, the first colored layer 567R).

[0331] The display unit 501 includes an anti-reflection layer 567p at a position overlapping the pixel. For example, a circular polarizer can be used as p.

[0332] The display portion 501 includes an insulating film 521. The insulating film 521 covers the transistor 502t. The insulating film 521 is used as a layer for flattening unevenness caused by the pixel circuit. In addition, a laminated film including a layer capable of suppressing the diffusion of impurities may be applied to the insulating film 521. This can reduce the reliability of the transistor 502t and the like due to the diffusion of impurities. This can suppress the decline in

[0333] The display unit 501 has a light-emitting element (for example, a first light-emitting element 550R) on an insulating film 521. do.

[0334] The display portion 501 has a partition wall 528 on the insulating film 521, which overlaps with an end portion of the first lower electrode. In addition, a spacer for controlling the distance between the substrate 510 and the substrate 570 is provided on the partition wall 528 .

[0335] The scanning line driver circuit 503g(1) includes a transistor 503t and a capacitor 503c. In addition, the driver circuit can be formed on the same substrate as the pixel circuit in the same process.

[0336] The display unit 501 includes a wiring 511 capable of supplying a signal, and the terminal 110 is connected to the wiring 511. 11. In addition, F PC 509(1) is electrically connected to terminal 110.

[0337] A printed wiring board (PWB) may be attached to the FPC509(1). stomach.

[0338] The display portion 501 has wiring such as scanning lines, signal lines, and power supply lines. can be used for wiring.

[0339] The protective layer 120 is provided to cover the exposed portion of the touch panel. Substrate 590, adhesive layer 597, substrate 570 (flexible substrate 570b, adhesive layer 570c, insulating layer 570a), bonding layer 121, terminal 110, substrate 510 (flexible substrate 510b, adhesive layer 51 0c, insulating layer 510a) and the like. The protective layer 120 has an opening that overlaps a part of the surface of the conductive layer 110 a of the terminal 110 .

[0340] Note that various transistors can be applied to the display portion 501. The configuration in which the data is applied to the display unit 501 is shown in FIGS.

[0341] For example, a semiconductor layer containing an oxide semiconductor, amorphous silicon, or the like is formed as shown in FIG. This can be applied to the transistor 502t and the transistor 503t shown.

[0342] For example, a semiconductor containing polycrystalline silicon crystallized by a process such as laser annealing. The layer is applied to the transistor 502t and the transistor 503t shown in FIG. It is possible.

[0343] 16 shows a configuration in which a top-gate transistor is applied to the display unit 501. Illustrated in (C).

[0344] For example, a single crystal silicon film transferred from a polycrystalline silicon or single crystal silicon substrate, etc. The semiconductor layer including the above is used as the transistor 502t and the transistor 502t shown in FIG. Can be applied to 03t.

[0345] Here, the configuration in which the FPC 509(2) is connected to the substrate 510 side of the substrate 590 is shown. However, as shown in FIG. 17, it may be configured to be taken out on the opposite side. Both FPC 509(1) and FPC 509(2) are connected to one side of the touch panel 505. The configuration can be such that the power supply is connected to the power supply side.

[0346] [Configuration example 3] 18 is a cross-sectional view of touch panel 505B. The display unit 505B displays the supplied image information on the side where the transistor is provided. The touch sensor is provided on the substrate 510 side of the display unit. This is different from the touch panel 505 of Example 2. The different configuration will be described in detail here. The above description is applicable to the parts where the above configuration can be used.

[0347] The first colored layer 567R is located so as to overlap the first light emitting element 550R. The light emitting element 550R shown in A) emits light toward the side where the transistor 502t is provided. As a result, part of the light emitted by the light emitting element 550R is transmitted through the first colored layer 567R. , and is emitted to the outside of light emitting module 580R in the direction of the arrow shown in the figure.

[0348] The display unit 501 has a light-shielding layer 567BM in the light-emitting direction. , and is provided so as to surround the colored layer (for example, the first colored layer 567R).

[0349] The touch sensor 595 is provided on the substrate 510 side of the display unit 501 (FIG. 18(A)). ).

[0350] The adhesive layer 597 is located between the substrate 510 and the substrate 590, and connects the display unit 501 and the touch sensor 5 Glue 95 together.

[0351] The protective layer 120 is provided to cover the exposed portion of the touch panel. Substrate 570 (flexible substrate 570b, adhesive layer 570c, insulating layer 570a), bonding layer 121, Substrate 510 (flexible substrate 510b, adhesive layer 510c, insulating layer 510a), substrate 590, contact The insulating layer 597, the terminal 110, the wiring 598, etc. are covered in part or in whole. The protective layer 120 has openings that overlap with parts of the surfaces of the terminals 110 and the wiring 598. It has a mouth.

[0352] The wiring 598 may be made of the conductive material that is not easily oxidized. Such a conductive material may be applied to the portions of the wires 598 that serve as terminals. A layer containing such a conductive material is laminated on the portion that functions as the terminal of the wiring 598. It is okay to do so.

[0353] Note that various transistors can be applied to the display portion 501. The configuration in which the data is applied to the display unit 501 is shown in FIGS.

[0354] For example, a semiconductor layer containing an oxide semiconductor, amorphous silicon, or the like is formed as shown in FIG. This can be applied to the transistor 502t and the transistor 503t shown.

[0355] For example, a semiconductor layer containing polycrystalline silicon or the like is formed as a transistor 5 shown in FIG. 02t and transistor 503t.

[0356] 18 shows a configuration in which a top-gate transistor is applied to the display unit 501. Illustrated in (C).

[0357] For example, a semiconductor layer including polycrystalline silicon or a transferred single-crystal silicon film is formed as shown in FIG. This can be applied to the transistor 502t and the transistor 503t shown in FIG. do.

[0358] This embodiment may be combined, at least in part, with other embodiments described in this specification. It can be implemented in combination.

[0359] (Fourth embodiment) [Example of film deposition equipment configuration] Hereinafter, a functional panel, a display panel, a light-emitting panel, a sensor panel, or the like according to one embodiment of the present invention will be described. The following describes an apparatus that can deposit thin films that constitute a touch panel. The illustrated apparatus can be suitably used in particular for forming the protective layer 120 and the like.

[0360] [Configuration example of ALD film formation equipment] FIG. 19 is a diagram illustrating the film formation apparatus ALD.

[0361] The film formation apparatus ALD described in this embodiment includes a film formation chamber 710 and a and a control unit 712 (see FIG. 19).

[0362] The control unit 712 includes a control device (not shown) that supplies control signals and a control circuit (not shown) that receives the control signals. The flow rate controller 712a, the flow rate controller 712b, and the flow rate controller 712c are provided. For example, a high-speed valve can be used as a flow rate controller. By doing so, the flow rate can be precisely controlled. The heating mechanism 712h controls the heating.

[0363] The flow rate controller 712a is supplied with a control signal and the first raw material and the inert gas. The control signal is used to supply the first raw material or the inert gas.

[0364] The flow rate controller 712b is supplied with a control signal and the second source gas and the inert gas. The control signal is used to supply the second raw material or the inert gas.

[0365] The flow rate controller 712c is supplied with a control signal and connects to the exhaust device 715 based on the control signal. It has the function of connecting.

[0366] ≪Raw material supply department≫ The raw material supply unit 711a has a function of supplying the first raw material and is connected to the flow rate controller 712a. It has been done.

[0367] The raw material supply unit 711b has a function of supplying the second raw material and is connected to the flow rate controller 712b. It has been done.

[0368] A vaporizer or a heating means can be used in the raw material supply section. This allows the solid raw material It is possible to produce gaseous raw materials from gaseous or liquid raw materials.

[0369] The number of raw material supply parts is not limited to two, and three or more raw material supply parts may be provided.

[0370] ≪Raw materials≫ A variety of materials can be used as the first ingredient.

[0371] For example, a volatile organometallic compound, a metal alkoxide, or the like can be used as the first raw material. Cut.

[0372] Various substances that react with the first raw material can be used as the second raw material. For example, Substances that contribute to oxidation reactions, substances that contribute to reduction reactions, substances that contribute to addition reactions, substances that contribute to decomposition reactions A substance that contributes to the hydrolysis reaction or a substance that contributes to the hydrolysis reaction can be used as the second raw material. do.

[0373] Radicals and the like can also be used. For example, a raw material is supplied to a plasma source, and the plasma Specifically, oxygen radicals, nitrogen radicals, etc. can be used. Cut.

[0374] The second raw material used in combination with the first raw material reacts at a temperature close to room temperature. For example, the reaction temperature is from room temperature to 200°C, preferably from 50°C to 150°C. Preferably, the raw material is at or below 100°C.

[0375] <Exhaust system> The exhaust device 715 has an exhaust function and is connected to the flow rate controller 712c. A trap for capturing the discharged raw material is provided between the discharge port 714 and the flow rate controller 712c. In this case, it is preferable to detoxify the exhaust gas using a detoxification facility.

[0376] <Control Unit> The control device provides a control signal for controlling the flow rate controller or a control signal for controlling the heating mechanism. For example, in the first step, a first raw material is supplied to the surface of the processing member 700. Then, in the second step, a second raw material is supplied to react with the first raw material. As a result, the first raw material reacts with the second raw material, and the reaction product is deposited on the surface of the processed member 700. It is possible.

[0377] The amount of reaction product deposited on the surface of the workpiece 700 is determined by the first step and the second step. This can be controlled by repeating the loop.

[0378] The amount of the first raw material supplied to the processed member 700 is determined based on the amount of the first raw material that can be adsorbed by the surface of the processed member 700. For example, the amount of the first source material that can be deposited on the surface of the workpiece 700 is limited by the amount of the first source material that can be deposited on the surface of the workpiece 700. The conditions for forming the first raw material are selected, and the second raw material is reacted with the formed monolayer of the first raw material. As a result, it is possible to form a layer containing a very uniform reaction product of the first raw material and the second raw material. can.

[0379] As a result, various materials can be applied to the surface of the workpiece 700 having an intricate structure on the surface. For example, a film having a thickness of 3 nm to 200 nm can be formed on the processed member. It can be formed into 700.

[0380] For example, small holes called pinholes and microcracks may appear on the surface of the processed member 700. If small cracks called "flaws" are formed, the film material will penetrate into these cracks and form a film. It can form a film and fill pinholes and microcracks.

[0381] The ALD deposition system is known for its extremely high step coverage of the deposited film. In addition, the surface of the processed member 700 has a complex uneven shape. Even in such a case, a uniform film can be formed on the surface.

[0382] In addition, the excess first source material or the excess second source material is exhausted from the film-forming chamber 710 by using the exhaust device 715. For example, the evacuation may be performed while introducing an inert gas such as argon or nitrogen. stomach.

[0383] ≪Film forming chamber≫ The film forming chamber 710 has an inlet 713 through which the first source material, the second source material, and an inert gas are supplied. and an outlet 714 for discharging the first raw material, the second raw material, and the inert gas.

[0384] The film forming chamber 710 includes a support portion 71 having a function of supporting one or more processed members 700. 6, a heating mechanism 717 having a function of heating the processed member, and a and a door 718 that has the function of opening and closing the area for carrying out.

[0385] For example, a resistance heater or an infrared lamp can be used for the heating mechanism 717 .

[0386] The heating mechanism 717 is a mechanism for heating to, for example, 80°C or higher, 100°C or higher, or 150°C or higher. It is equipped with Noh.

[0387] The heating mechanism 717 is, for example, at a temperature between room temperature and 200° C., preferably between 50° C. and 150° C. The processed member 700 is heated to a temperature.

[0388] The deposition chamber 710 also has a pressure regulator and a pressure detector.

[0389] ≪Support part≫ The support 716 supports one or more processing members 700. For example, an insulating film can be formed on one or more workpieces 700 for each process.

[0390] The processed member 700 may be a substrate, a functional panel, a display panel, a light-emitting panel, a sensor, etc. Panels, touch panels, display devices, input devices, or modules such as FPCs are connected It can be used for functional panels, display panels, light-emitting panels, sensor panels, touch panels, etc. can.

[0391] [Membrane example] The following describes a film that can be fabricated using the ALD film formation apparatus described in this embodiment. Reveal.

[0392] For example, oxides, nitrides, fluorides, sulfides, ternary compounds, metals, or polymers. A film can be formed.

[0393] For example, aluminum oxide, hafnium oxide, aluminum silicate, hafnium silicate lanthanum oxide, silicon oxide, strontium titanate, tantalum oxide, titanium oxide Zinc oxide, niobium oxide, zirconium oxide, tin oxide, yttrium oxide, cerium oxide containing sulphur dioxide, scandium oxide, erbium oxide, vanadium oxide or indium oxide, etc. It is possible to deposit a film of a material containing

[0394] For example, aluminum nitride, hafnium nitride, silicon nitride, tantalum nitride, titanium nitride, Deposits materials including niobium nitride, molybdenum nitride, zirconium nitride, or gallium nitride It is possible.

[0395] For example, copper, platinum, ruthenium, tungsten, iridium, palladium, iron, cobalt A film of a material containing nickel or the like can be formed.

[0396] For example, zinc sulfide, strontium sulfide, calcium sulfide, lead sulfide, calcium fluoride Materials including strontium fluoride or zinc fluoride can be deposited.

[0397] For example, nitrides containing titanium and aluminum, oxides containing titanium and aluminum, oxides containing aluminum and zinc, sulfides containing manganese and zinc, cerium sulfides containing erbium and strontium, oxides containing erbium and aluminum, Materials including oxides containing tritium and zirconium can be deposited.

[0398] <Film containing aluminum oxide> For example, a gas obtained by vaporizing a raw material containing an aluminum precursor compound is used as the first raw material. Specifically, trimethylaluminum (TMA, chemical formula: Al(CH3) 3) or tris(dimethylamido)aluminum, triisobutylaluminum, aluminum Minium tris(2,2,6,6-tetramethyl-3,5-heptanedionate), etc. It can be used.

[0399] Water vapor (chemical formula: H2O) can be used as the second source material.

[0400] Using the ALD film formation system, aluminum oxide is formed from the first and second raw materials. A film containing the compound can be formed.

[0401] <Film containing hafnium oxide> For example, a gas obtained by vaporizing a source material containing a hafnium precursor compound may be used as the first source material. Specifically, tetrakis(dimethylamido)hafnium (TDMAH, chemical The formula is Hf[N(CH3)2]4) or tetrakis(ethylmethylamido)hafnium, etc. A raw material containing hafnium amide of the formula (I) can be used.

[0402] Ozone can be used as the second source.

[0403] Using the ALD film formation system, a film containing hafnium oxide is formed from the first and second raw materials. It is possible to form a film that

[0404] <Film containing tungsten> For example, WF6 gas can be used as the first source material.

[0405] B2H6 gas or SiH4 gas can be used as the second source material.

[0406] Using the ALD film formation system, a tungsten-containing film is formed from the first and second raw materials. A film can be formed.

[0407] This embodiment may be combined, at least in part, with other embodiments described in this specification. It can be implemented in combination.

[0408] (Embodiment 5) In this embodiment, an electronic device and a lighting device according to one embodiment of the present invention will be described with reference to drawings. Reveal.

[0409] A functional panel, a display panel, a light-emitting panel, a sensor panel, and a touch panel according to one embodiment of the present invention Electronic devices and lighting devices can be manufactured using the input device, display device, or input / output device. The input device, the display device, or the input / output device of one embodiment of the present invention is used to display a curved and reliable In addition, an input device, a display device, or a lighting device according to one embodiment of the present invention can be manufactured. Alternatively, flexible and highly reliable electronic devices and lighting devices can be manufactured using the input / output devices. Furthermore, the input device or the input / output device of one embodiment of the present invention can be used to detect a touch sensor. This makes it possible to create electronic devices and lighting devices with improved performance.

[0410] Examples of electronic devices include television sets (also known as televisions or television receivers). (hereinafter referred to as "computer monitors"), digital cameras, digital video cameras, digital photo frames, mobile phones (also called mobile phones or mobile phone devices), portable game consoles, Examples include portable information terminals, audio playback devices, and large game machines such as pachinko machines.

[0411] Furthermore, when the electronic device or lighting device of one embodiment of the present invention is flexible, it can be easily installed inside a house or a building. It can also be incorporated into walls or exterior walls, or along the curved surfaces of the interior or exterior of a vehicle. be.

[0412] Furthermore, the electronic device of one embodiment of the present invention may include a secondary battery and may perform contactless power transmission. It is preferable that the secondary battery can be charged using the power supply.

[0413] As the secondary battery, for example, a lithium polymer battery (lithium ion battery) using a gel electrolyte is used. Lithium-ion secondary batteries such as lithium-ion polymer batteries, lithium-ion batteries, nickel-metal hydride batteries batteries, nickel-cadmium batteries, organic radical batteries, lead-acid batteries, secondary air batteries, nickel-zinc batteries, silver-zinc batteries Examples include lead batteries.

[0414] The electronic device according to one embodiment of the present invention may include an antenna. By using the battery, it is possible to display images, information, etc. on the display unit. , the antenna may be used for contactless power transfer.

[0415] 20(A), (B), (C1), (C2), (D), and (E) show a curved display unit 70. 7 shows an example of an electronic device having a display unit 7000. The display surface of the display unit 7000 is curved. The display can be performed along the curved display surface. It may be possible.

[0416] The display unit 7000 may include a functional panel, a display panel, a light-emitting panel, a sensor panel, or the like according to one embodiment of the present invention. The present invention is also applicable to a display device, an input / output device, a touch panel, a display device, an input / output device, or the like. In this manner, it is possible to provide an electronic device that has a curved display portion and is highly reliable.

[0417] An example of a mobile phone is shown in FIG. 20A. A mobile phone 7100 includes a housing 7101, a display part 7000, operation button 7103, external connection port 7104, speaker 7105, microphone 7106 etc.

[0418] A mobile phone 7100 shown in FIG. 20A includes a touch sensor in a display portion 7000. All operations, such as making a call or entering text, can be performed using a finger or stylus. This can be done by touching the part 7000.

[0419] In addition, by operating the operation button 7103, the power can be turned on and off, and the display unit 7000 For example, from the email creation screen, you can change the type of image displayed. You can switch to the main menu screen.

[0420] FIG. 20B shows an example of a television device. The television device 7200 includes a housing 7 The display unit 7000 is built into the housing 7201. The configuration shown supports 201.

[0421] The television device 7200 shown in FIG. 20B is operated by an operation switch provided in the housing 7201. This can be done by a separate remote control 7211 or the display unit 70. The display unit 7000 may be provided with a touch sensor, and the operation can be performed by touching the display unit 7000 with a finger or the like. The remote control operation device 7211 may display information to be output from the remote control operation device 7211. The remote control 7211 may have a display unit that displays the operation keys or touch panel. The panel allows the user to operate the channel and volume, and the information displayed on the display unit 7000 You can manipulate the video.

[0422] The television device 7200 includes a receiver, a modem, and the like. It is possible to receive general television broadcasts by using a modem. By connecting to a communication network, it can be one-way (sender to receiver) or two-way. It is also possible to communicate information (between a sender and a receiver, or between receivers).

[0423] Examples of portable information terminals are shown in Figures 20(C1), (C2), (D), and (E). The terminal includes a housing 7301 and a display portion 7000. Further, an operation button, an external connection port, The display unit 7000 may include a display, a speaker, a microphone, an antenna, a battery, etc. The mobile information terminal is operated by touching the display unit 700 with a finger or a stylus. This can be done by touching 0.

[0424] FIG. 20(C1) is a perspective view of the portable information terminal 7300, and FIG. 20(C2) is a perspective view of the portable information terminal 7300. 20(D) is a perspective view of the mobile information terminal 7310. FIG. FIG. 20E is a perspective view of the portable information terminal 7320. FIG.

[0425] The portable information terminal exemplified in this embodiment may be, for example, a telephone, a notebook, an information viewing device, or the like. Specifically, each of these functions can be used as a smartphone. The portable information terminal exemplified in this embodiment may be, for example, a mobile phone, an electronic mail It can be used for various purposes such as browsing and creating documents, playing music, communicating over the Internet, and playing computer games. Various applications can be run.

[0426] The mobile information terminals 7300, 7310, and 7320 are used for displaying characters and images. Image information can be displayed on multiple surfaces. For example, the image information shown in Figure 20(C1) and (D) can be displayed on multiple surfaces. As shown, three operation buttons 7302 are displayed on one side, and information 7303 shown as a rectangle is displayed on the other side. In Figures 20(C1) and 20(C2), information is displayed on the top of the mobile information terminal. FIG. 20(D) shows an example in which information is displayed on the side of the mobile information terminal. In addition, information may be displayed on three or more sides of the mobile information terminal. 304, information 7305, and information 7306 are displayed on different surfaces.

[0427] Examples of such information include notifications from social networking services (SNS). , display notifying you of incoming e-mails or phone calls, subject of e-mails or sender name , date and time, battery level, antenna reception strength, etc. Instead of information, operation buttons, icons, etc. may be displayed at the position where the information is displayed.

[0428] For example, the user of the mobile information terminal 7300 may place the mobile information terminal 7300 in the breast pocket of his / her clothes. When the item is stored, the display (information 7303 in this example) can be confirmed.

[0429] Specifically, the telephone number or name of the caller of the incoming call is stored in the mobile information terminal 7300. The display is positioned so that it can be seen from above. You can check the display and decide whether to answer the call without having to take out your phone.

[0430] 20(F) to (H) show an example of an illumination device having a curved light-emitting portion.

[0431] The light-emitting portion of each of the lighting devices shown in FIGS. 20(F) to 20(H) is a functional panel according to one embodiment of the present invention. display panel, light-emitting panel, sensor panel, touch panel, display device, or input / output device According to one aspect of the present invention, a light emitting device having a curved light emitting portion and high reliability is manufactured. High-quality lighting equipment can be provided.

[0432] The lighting device 7400 shown in FIG. 20(F) includes a light-emitting unit 7402 having a wavy light-emitting surface. This makes it a highly designed lighting device.

[0433] The light-emitting portion 7412 of the lighting device 7410 shown in FIG. 20(G) has two convexly curved portions. Therefore, the light emitting units are arranged symmetrically around the lighting device 7410. It can illuminate in all directions.

[0434] The lighting device 7420 shown in FIG. 20(H) has a light-emitting portion 7422 that is curved in a concave shape. Therefore, the light emitted from the light emitting unit 7422 is focused on the front surface of the lighting device 7420. This type of lighting is suitable for illuminating a certain area. This has the effect of making it difficult to

[0435] In addition, the light emitting devices 7400, 7410, and 7420 each include The light emitting part may be flexible. The light emitting part may be fixed by a member such as a plastic member or a movable frame. The light emitting surface of the light emitting part may be configured to be freely curved depending on the application.

[0436] The lighting device 7400, the lighting device 7410, and the lighting device 7420 each have an operation switch. It has a base 7401 with a switch 7403 and a light emitting unit supported by the base 7401.

[0437] Here, the illumination device in which the light-emitting unit is supported by the base is exemplified. The housing provided with the device can be fixed to the ceiling or hung from the ceiling. The light surface can be curved, so the light-emitting surface can be curved concavely to brighten a specific area. The light source can be curved convexly to illuminate an entire room.

[0438] 21(A1), (A2), (B) to (I) show a display device having a flexible display unit 7001. 1 shows an example of a portable information terminal.

[0439] The display portion 7001 may be a functional panel, a display panel, a light-emitting panel, a sensor panel, or the like, according to one embodiment of the present invention. It is manufactured using a panel, a touch panel, a display device, an input / output device, etc. For example, curvature Display devices or input / output devices that can be bent with a radius of 0.01 mm or more and 150 mm or less The display unit 7001 may be provided with a touch sensor, and the display may be touched with a finger or the like. The mobile information terminal can be operated by touching the portion 7001. Thus, it is possible to provide an electronic device that has a flexible display portion and is highly reliable.

[0440] FIG. 21(A1) is a perspective view showing an example of a portable information terminal, and FIG. 21(A2) is a perspective view showing an example of a portable information terminal. 7 is a side view showing an example of an information terminal. The mobile information terminal 7500 includes a housing 7501, a display unit 7 001, a drawer member 7502, an operation button 7503, etc.

[0441] The portable information terminal 7500 has a flexible display unit rolled up in a housing 7501. It has 7001.

[0442] In addition, the mobile information terminal 7500 can receive video signals using a built-in control unit. The portable information terminal 7500 can display the captured image on the display unit 7001. The housing 7501 is equipped with a terminal for connecting a connector, Signals and power may be supplied directly from the outside via wires.

[0443] In addition, the operation button 7503 can be used to turn the power on and off and to switch the displayed image. In addition, in Fig. 21 (A1), (A2), and (B), the mobile information terminal In this example, the operation button 7503 is arranged on the side of the mobile information terminal 7500. It may be placed on the same surface (front surface) as the display surface of the terminal 7500, or on the back surface.

[0444] FIG. 21B shows a mobile phone in a state where the display unit 7001 is pulled out by a pull-out member 7502. 7 shows a portable information terminal 7500. In this state, an image can be displayed on the display unit 7001. 21(A1) in which a part of the display unit 7001 is rolled up, and the state of the display unit 700 21(B) in which the portable information terminal 75 is pulled out by the pull-out member 7502. For example, in the state shown in FIG. 21(A1), By hiding the rolled-up part of the display unit 7001, the mobile information terminal 7500 Power consumption can be reduced.

[0445] When the display unit 7001 is pulled out, the display surface of the display unit 7001 is made flat. To fix the display unit 7001, a reinforcing frame may be provided on the side of the display unit 7001.

[0446] In addition to this configuration, a speaker is provided on the housing, and the audio signal received together with the video signal is output. The configuration may be such that sound is output.

[0447] 21(C) to 21(E) show an example of a foldable mobile information terminal. In the unfolded state, in Figure 21(D), from either the unfolded state or the folded state. In the other state, which is in the process of changing to the other state, the portable information terminal 760 in the folded state is shown in FIG. 21(E). The portable information terminal 7600 is highly portable when folded and The seamless, large display area provides excellent visibility.

[0448] The display unit 7001 is supported by three housings 7601 connected by hinges 7602. By bending the two housings 7601 via the hinge 7602, the portable information The terminal 7600 can be reversibly transformed from an unfolded state to a folded state.

[0449] Figures 21(F) and (G) show an example of a foldable mobile information terminal. In FIG. 21(G), the display unit 7001 is folded inward. The mobile information terminal 7650 is shown folded with the side 7001 facing outwards. The terminal 7650 has a display portion 7001 and a non-display portion 7651. When not in use, the display unit 7001 can be folded inward. This can prevent dirt and scratches.

[0450] FIG. 21(H) shows an example of a flexible portable information terminal. The device has a housing 7701 and a display portion 7001. , 7703b, speakers 7704a and 7704b as audio output means, and external connection port 7 The portable information terminal 7700 may have a flexible The battery 7709 may be mounted on the display unit 7. It may be placed overlapping with 001.

[0451] The housing 7701, the display portion 7001, and the battery 7709 are flexible. The portable information terminal 7700 can be bent into a desired shape or twisted. For example, the display portion 7001 of the portable information terminal 7700 is It can be folded outward and used. The display unit 700 can also be used in a rolled-up state. Since the portable information terminal 7700 can be freely deformed, it can be easily carried out even if it is dropped or has the advantage that it is less likely to break even if an unintended external force is applied.

[0452] In addition, since the portable information terminal 7700 is lightweight, the upper part of the housing 7701 can be held with a clip or the like. Or, the housing 7701 can be fixed to the wall with a magnet or the like. , and can be conveniently used in a variety of situations.

[0453] FIG. 21(I) shows an example of a wristwatch-type portable information terminal. The device has a keyboard 7801, a display unit 7001, an input / output terminal 7802, an operation button 7803, etc. The handheld terminal 7801 functions as a housing. The battery 7805 may be mounted on the display unit 70. It may be placed overlapping with band 01 or band 7801.

[0454] The band 7801, the display portion 7001, and the battery 7805 are flexible. Therefore, it is easy to bend the portable information terminal 7800 into a desired shape.

[0455] The operation button 7803 is used to set the time, turn the power on and off, and turn wireless communication on and off. It has various functions such as auto-start, silent mode activation and deactivation, power saving mode activation and deactivation, etc. For example, the operating system built into the portable information terminal 7800 can be Depending on the system, the functions of the operation buttons 7803 can be freely set.

[0456] In addition, by touching an icon 7804 displayed on the display unit 7001 with a finger or the like, the application You can launch the application.

[0457] The portable information terminal 7800 can also perform short-distance wireless communication in accordance with a communication standard. For example, by communicating with a wireless headset, You can also make calls using Lee.

[0458] The portable information terminal 7800 may also have an input / output terminal 7802. If the device has 802, it can exchange data directly with other information terminals via a connector. Charging can also be performed via the input / output terminal 7802. The charging operation of the mobile information terminal shown in the example is performed by non-contact power transmission without using input / output terminals. It is also possible.

[0459] 22(A) shows the exterior of the automobile 9700. FIG. 22(B) shows the driver's seat of the automobile 9700. The automobile 9700 includes a body 9701, wheels 9702, a dashboard 9703, a The display device or the input / output device of one embodiment of the present invention includes a vehicle 97 For example, the display portion 9710 shown in FIG. The display portion 9715 may include a functional panel, a display panel, a light-emitting panel, or a sensor panel according to one embodiment of the present invention. A display, a touch panel, or an input / output device may be provided.

[0460] The display portion 9710 and the display portion 9711 are display devices provided on a windshield of an automobile. The display device or the input / output device according to one embodiment of the present invention is a display device, Alternatively, electrodes of the input / output device may be formed using a light-transmitting conductive material. It can be used as a so-called see-through display device or input / output device, allowing you to see through to the other side. If it is a see-through display device or an input / output device, it is possible to Therefore, the display device or input device according to one embodiment of the present invention does not obstruct the view even when driving. The output device can be installed on the windshield of the automobile 9700. Or, in the input / output device, a display device or a transistor for driving the input / output device, etc. When provided, an organic transistor using an organic semiconductor material or a transistor using an oxide semiconductor is used. A light-transmitting transistor such as a transistor is preferably used.

[0461] The display portion 9712 is a display device or an input / output device provided in a pillar portion. By displaying an image from an imaging means provided on the vehicle body on the display unit 9712, The display unit 9713 is installed in the dashboard. For example, the image captured by the imaging means provided on the vehicle body is By projecting the image onto the display unit 9713, it complements the view blocked by the dashboard. That is, it is possible to project an image from an imaging means provided on the outside of the automobile. This can compensate for blind spots and increase safety. By projecting the image, safety checks can be performed more naturally and without any discomfort.

[0462] FIG. 22(C) shows the interior of a car with bench seats for the driver and passenger seats. The display unit 9721 is a display device or an input / output device provided in the door. For example, by displaying an image from an imaging means provided on the vehicle body on the display unit 9721, It can complement the view blocked by the door. The display unit 9723 is a display device or an input / output device mounted on the seat surface of the bench seat. The display device or input / output device is provided in the center. The display device or input / output device is installed on the seat or backrest of the chair. It can also be used as a seat heater using the heat generated by the device or input / output device as a heat source. .

[0463] The display unit 9714, the display unit 9715, or the display unit 9722 displays navigation information, speech such as the odometer, tachometer, mileage, fuel level, gear status, and air conditioning settings. It is also possible to provide various other information. The above information can be changed as needed to suit the user's preferences. The images can also be displayed on the display units 9710 to 9713, the display unit 9721, and the display unit 9723. In addition, the display units 9710 to 9715 and the display units 9721 to 9723 are illuminated. The display units 9710 to 9715 can also be used as a lighting device. The portion 9721 to the display portion 9723 can also be used as a heating device.

[0464] A functional panel, a display panel, a light-emitting panel, a sensor panel, and a touch panel according to one embodiment of the present invention The display unit to which the input / output device is applied may be flat. A functional panel, a display panel, a light-emitting panel, a sensor panel, a touch panel, a display panel, and a display panel according to an embodiment of the present invention The display device or input / output device may not have a curved or flexible surface.

[0465] The portable game machine shown in FIG. 22(D) includes a housing 901, a housing 902, a display portion 903, and a display part 904, microphone 905, speaker 906, operation keys 907, stylus 908 etc.

[0466] The portable game machine shown in FIG. 22(D) has two display units (display unit 903 and display unit 904). Note that the number of display units included in the electronic device of one embodiment of the present invention is not limited to two and may be one. If an electronic device has multiple display units, it must have at least Another display unit may be a functional panel, a display panel, a light-emitting panel, or a sensor panel according to one embodiment of the present invention. , a touch panel, a display device, or an input / output device.

[0467] FIG. 22(E) shows a notebook personal computer, which includes a housing 921, a display portion 922, It has a keyboard 923, a pointing device 924, and the like.

[0468] The display portion 922 may include a functional panel, a display panel, a light-emitting panel, a sensor panel, or the like, according to one embodiment of the present invention. A display device, a touch panel, a display unit, or an input / output unit can be applied.

[0469] 23A shows the appearance of a camera 8000. The camera 8000 includes a housing 8001, a front The camera includes a display unit 8002, operation buttons 8003, a shutter button 8004, a connecting unit 8005, etc. In addition, a lens 8006 can be attached to the camera 8000.

[0470] The coupling portion 8005 has electrodes and is connected to the finder 8100 (to be described later) as well as the strobe device. etc. can be connected.

[0471] Here, the camera 8000 is assumed to have a lens 8006 that is detached from the housing 8001 and replaced. However, the lens 8006 and the housing may be integrated.

[0472] An image can be taken by pressing the shutter button 8004. 8002 has a function as a touch panel, and an image is taken by touching the display unit 8002. It is also possible to do this.

[0473] The display portion 8002 includes a functional panel, a display panel, a light-emitting panel, a sensor panel, and the like, according to one embodiment of the present invention. A panel, a touch panel, a display device, or an input / output device can be applied.

[0474] FIG. 23(B) shows an example in which a finder 8100 is attached to a camera 8000. is doing.

[0475] The finder 8100 includes a housing 8101, a display unit 8102, buttons 8103, etc. .

[0476] The housing 8101 has a coupling portion that engages with the coupling portion 8005 of the camera 8000. A viewfinder 8100 can be attached to the camera 8000. The device has electrodes, and displays images received from a camera 8000 via the electrodes on a display unit 8102. It can be shown.

[0477] The button 8103 functions as a power button. The 8102 display can be switched on and off.

[0478] The display portion 8102 includes a functional panel, a display panel, a light-emitting panel, a sensor panel, and the like, which are embodiments of the present invention. A panel, a touch panel, a display device, or an input / output device can be applied.

[0479] In addition, in FIGS. 23(A) and 23(B), the camera 8000 and the finder 8100 are separate electronic devices. The camera 8000 is configured to have a detachable structure. The display device may have a built-in finder equipped with one of the display devices or the input / output device.

[0480] FIG. 23C shows the appearance of the head mounted display 8200.

[0481] The head-mounted display 8200 includes a mounting part 8201, a lens 8202, and a main body 82 8203, a display unit 8204, a cable 8205, etc. It has a built-in 8206 battery.

[0482] A cable 8205 supplies power from a battery 8206 to the main body 8203. 03 is equipped with a wireless receiver and the like, and image information such as received image data is displayed on a display unit 8204. In addition, the camera installed in the main body 8203 can record the movements of the user's eyeballs and eyelids. By capturing the user's viewpoint and calculating the coordinates of the user's viewpoint based on that information, It can be used as an input means.

[0483] Furthermore, the wearing unit 8201 may be provided with a plurality of electrodes at positions that come into contact with the user. The main body 8203 detects the current flowing through the electrodes in accordance with the movement of the user's eyeballs, The device may have a function to recognize the user's point of view. By doing so, the attachment unit 820 may have a function of monitoring the pulse of the user. The sensor 1 may have various sensors such as a temperature sensor, a pressure sensor, an acceleration sensor, etc. The device may have a function to display the user's biological information on the display unit 8204. The image displayed on the display unit 8204 is changed according to the movement of the part. Good too.

[0484] The display portion 8204 includes a functional panel, a display panel, a light-emitting panel, a sensor panel, or the like, according to one embodiment of the present invention. A panel, a touch panel, a display device, or an input / output device can be applied.

[0485] This embodiment may be combined, at least in part, with other embodiments described in this specification. It can be implemented in combination. [Explanation of symbols]

[0486] 100 Function Panel 101 Substrate 102 Circuit Board 110 terminal 110a conductive layer 110b Conductive layer 111 Functional elements 112 Conductive particles 120 protective layer 121 Bonding layer 122 Insulating layer 123 Wiring 124 Space 125 Bonding layer 130 Protective layer 201 Fabricated substrate 203 Peeling layer 205 Fabricated substrate 207 Peeling layer 230 Light-emitting element 301 Display section 302 pixels 302B subpixel 302G subpixel 302R subpixel 302t transistor 303c capacity 303g(1) Scanning line driver circuit 303g(2) Imaging pixel drive circuit 303s(1) Image signal line driver circuit 303s(2) Image signal line driver circuit 303t transistor Gate 304 308 imaging pixels 308p photoelectric conversion element 308t transistor 309 FPC 311 Wiring 321 Insulating Layer 328 Bulkhead 329 Spacer 350R light emitting element 351R lower electrode 352 Upper electrode 353 EL layer 353a EL layer 353b EL layer 354 Middle Class 367BM light shielding layer 367p anti-reflection layer 367R colored layer 380B Light Emitting Module 380G light emitting module 380R Light Emitting Module 390 Touch Panel 501 Display section 502R subpixel 502t transistor 503 Drive Circuit 503c capacity 503g Scanning line driver circuit 503t transistor 505 touch panel 505B Touch Panel 509 FPC 510 board 510a Insulating layer 510b flexible substrate 510c adhesive layer 511 Wiring 521 Insulating film 528 Bulkhead 550R light emitting element 567BM light shielding layer 567p anti-reflection layer 567R colored layer 570 PCB 570a Insulating layer 570b flexible substrate 570c ​​adhesive layer 580R Light Emitting Module 590 PCB 591 Electrode 592 Electrode 593 Insulating Layer 594 Wiring 595 Touch Sensor 597 Adhesive layer 598 Wiring 599 Connection Layer 700 processed parts 710 Deposition chamber 711a Raw material supply section 711b Raw material supply section 712 Control Unit 712a flow controller 712b flow controller 712c flow controller 712h heating mechanism 713 entrance 714 Outlet 715 Exhaust system 716 Support part 717 Heating mechanism 718 Door 801 board 803 board 804 Light-emitting part 806 Drive circuit section 808 FPC 809 IC 810 terminal 811 Adhesive layer 813 Insulation layer 814 Conductive layer 815 Insulation layer 816 Conductive layer 817 Insulation layer 817a Insulating layer 817b Insulating layer 820 transistors 821 Insulation layer 822 transistor 825 Connector 827 Spacer 830 Light-emitting element 831 Lower electrode 833 EL layer 835 Upper electrode 841 Adhesive layer 843 Insulation Layer 845 Colored layer 847 Light blocking layer 849 Overcoat 857a Conductive layer 857b Conductive layer 901 Case 902 Case 903 Display section 904 Display section 905 Microphone 906 Speaker 907 Operation Key 908 Stylus 921 Case 922 Display section 923 keyboard 924 Pointing Device 7000 Display 7001 Display section 7100 Mobile Phone 7101 Housing 7103 Operation button 7104 External connection port 7105 Speaker 7106 Microphone 7200 Television Equipment 7201 Case 7203 Stand 7211 Remote control device 7300 Mobile Information Terminal 7301 Housing 7302 Operation button 7303 Information 7304 Information 7305 Information 7306 Information 7310 Mobile Information Terminals 7320 Mobile Information Terminal 7400 Lighting Equipment 7401 Daibu 7402 Light-emitting part 7403 Operation switch 7410 Lighting equipment 7412 Light-emitting part 7420 Lighting equipment 7422 Light-emitting part 7500 Mobile Information Terminal 7501 Case 7502 Materials 7503 Operation button 7600 Mobile Information Terminal 7601 Case 7602 Hinge 7650 Personal Digital Assistant 7651 Hidden part 7700 Personal Digital Assistant 7701 Housing 7703a Button 7703b Button 7704a Speaker 7704b Speaker 7705 External connection port 7706 Mike 7709 Battery 7800 Mobile Information Terminal 7801 band 7802 Input / output terminal 7803 Operation button 7804 Icons 7805 Battery 8000 Camera 8001 Case 8002 Display section 8003 Operation button 8004 Shutter button 8005 Joint 8006 Lens 8100 Finder 8101 Housing 8102 Display section 8103 Button 8200 Head Mounted Display 8201 Mounting part 8202 Lens 8203 Main unit 8204 Display section 8205 Cable 8206 Battery 9700 Automobiles 9701 Body 9702 Wheel 9703 Dashboard 9704 Light 9710 Display section 9711 Display section 9712 indicates the department 9713 indicates the department 9714 indicates the department 9715 indicates the department 9721 indicates the department 9722 indicates the department 9723 indicates the department

Claims

[Claim 1] A functional panel including a first substrate, a second substrate, a bonding layer, a functional element, a protective layer, and a terminal, the bonding layer is located between the first substrate and the second substrate; the functional element is provided so as to be surrounded by the first substrate, the second substrate, and the bonding layer; the terminal is electrically connected to the functional element and is provided so as not to overlap one of the first substrate and the second substrate; the protective layer is provided in contact with a side surface of the first substrate, a side surface of the second substrate, and an exposed surface of the bonding layer; a part of the surface of the terminal is exposed and not covered by the protective layer; Function panel.

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