Electronic component

Abstract

To provide an electronic component capable of suppressing infiltration of moisture into a functional unit.SOLUTION: An electronic component 1 includes: a sealing body 10 including a first plate 11, a lid portion 12 separated from the first plate 11 so as to face a first main surface 11a of the first plate 11, and a sealing metal layer 13 for sealing the first plate 11 and the lid portion 12, and an internal space; a functional portion 20 provided in an internal space of the sealing body 10 so as to be separated from the first plate 11; a filler-resin portion 30 between the sealing body 10 and the functional portion 20; and via conductors 40 provided inside a first through-hole 51 penetrating the first plate 11 and inside a second through-hole 52 penetrating the filler-resin portion 30 and communicating with the first through-hole 51 and electrically connected to a pair of electrodes of the functional portion 20. Water vapor permeability of the lid portion 12 is one tenth or less of that of the filler-resin portion 30 having the same film thickness, or the lid portion 12 is made of glass or metal. The first plate 11 is a glass plate. The sealing metal layer 13 is directly connected to the first plate 11.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to electronic components. [Background technology]

[0002] In electronic components having functional parts that are sensitive to humidity, the functional parts are sealed with materials such as resin, metal, or glass to protect the functional parts from moisture in the environment in which they are used.

[0003] Patent Document 1 discloses an optoelectronic module (1) having a support element (3), at least one optoelectronic element (2) mounted on the support element (3), a cover (5) for the optoelectronic element (2), and a cavity (11). The cover (5) has a frame (7) that completely surrounds the optoelectronic element (2) in the circumferential direction and is connected to the support element (3), and a glass element (9, 90) that is attached to the frame (7) and positioned substantially opposite the support element (3) for allowing electromagnetic radiation to enter and / or exit the cover (5). The cavity (11) is formed within a volume defined at least in part by the inner surface of the cover (5) and a surface of the support element (3). The optoelectronic element (2) is arranged in the cavity (11) so as to be hermetically and / or autoclavably enclosed by the cover (5). The optoelectronic module (1) has a filler material (13) at least partially filling the cavity (11). The optoelectronic module (1) is configured and shaped to compensate for expansion of the volume occupied by the filler material (13), and for this purpose has at least one deformable first compensation volume (15). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent Publication No. 2021-193731 Summary of the Invention [Problem to be solved by the invention]

[0005] Patent document 1 describes that the bonding of the cover (5) to the support element (3) in order to hermetically and / or autoclavably enclose the optoelectronic element (2) is carried out by one of the following processes: laser welding, in which case the support element (3) is preferably ceramic or metal and the frame (7) is preferably ceramic or metal, in particular glass-coated metal; Resistance welding, soldering with a metal solder, in which case the carrier element (3) and the cover (5) each have a surface suitable for establishing a firm bond with the solder, preferably a surface with a solder preform; -Soldering using glass solder, the bonding of at least the frame (7) to the glass element (9), the frame (7) to the support element (3) or the glass element (9) to the support element (3) with the filler material (13), Bonding at least the frame (7) to the glass element (9), the frame (7) to the support element (3), or the glass element (9) to the support element (3) with a silicone, polymer, or bonding material different from the filling material (13). It is described that the method is carried out by one of the following:

[0006] However, in the optoelectronic module (1) described in Patent Document 1, there is a risk of moisture penetrating between the frame (7) and the glass element (9) or between the frame (7) and the support element (3).

[0007] In particular, in electronic components having functional parts that are sensitive to humidity, if the infiltrated moisture reaches the functional parts, the infiltrated moisture will cause loss or deterioration of the functions.

[0008] The present invention has been made to solve the above problems, and has an object to provide an electronic component that can prevent moisture from entering a functional part. [Means for solving the problem]

[0009] The electronic component of the present invention includes a sealing body including a first plate having first and second main surfaces opposed to each other in a thickness direction and a side surface connecting the first and second main surfaces, a lid disposed at a distance from the first plate so as to face the first main surface of the first plate in the thickness direction, and a sealing metal layer airtightly sealing an internal space together with the first plate and the lid, a functional unit disposed at a distance from the first plate in the internal space of the sealing body and having a pair of electrodes to which a potential is applied, a filled resin portion filled between the sealing body and the functional unit, and via conductors disposed in a first through hole penetrating the first plate in the thickness direction and in a second through hole penetrating the filled resin portion in the thickness direction and communicating with the first through hole, the via conductors being electrically connected to the pair of electrodes of the functional unit. The lid portion has a water vapor permeability that is at least one-tenth that of the filled resin portion of the same thickness, or the lid portion is made of glass or metal. The first plate is a glass plate, and the sealing metal layer is provided in direct contact with the first plate. [Effects of the Invention]

[0010] According to the present invention, it is possible to provide an electronic component that can prevent moisture from entering a functional part. [Brief explanation of the drawings]

[0011] [Figure 1] FIG. 1 is a cross-sectional view schematically showing an example of an electronic component of the present invention. [Figure 2] FIG. 2 is a cross-sectional view that schematically shows an example of an electronic component in which the functional part is a capacitor. [Figure 3] FIG. 3 is an enlarged view of a portion indicated by III in FIG. [Figure 4] FIG. 4 is an enlarged view of a portion indicated by IV in FIG. [Figure 5] FIG. 5 is a cross-sectional view schematically illustrating an example of an electronic component in which the central axis of a first through hole does not coincide with the central axis of a second through hole. [Figure 6] FIG. 6 is a cross-sectional view schematically showing a first modified example of the electronic component shown in FIG. [Figure 7] FIG. 7 is a cross-sectional view schematically showing a second modified example of the electronic component shown in FIG. [Figure 8] FIG. 8 is a cross-sectional view schematically showing a modification of the electronic component shown in FIG. [Figure 9] FIG. 9 is a cross-sectional view schematically showing a modified example of the electronic component shown in FIG. [Figure 10] FIG. 10 is a cross-sectional view schematically illustrating an electronic component according to an example. [Figure 11] FIG. 11 is an enlarged view of the portion indicated by XI in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0012] The electronic component of the present invention will now be described. However, the present invention is not limited to the following configurations, and can be appropriately modified and applied within the scope of the present invention. Note that the present invention also includes a combination of two or more of the individual preferred configurations of the present invention described below.

[0013] In the electronic component of the present invention, the surface of the filling resin portion that seals the functional portion is covered with a sealing body. The first plate, lid, and sealing metal layer included in the sealing body are made of materials that are less permeable to moisture than the filling resin portion, and the sealing metal layer is provided in direct contact with the first plate, thereby preventing moisture from penetrating into the functional portion.

[0014] It is also possible to prevent moisture from penetrating into the functional section by covering the entire surface of the filled resin section with a glass material. However, because the linear expansion coefficient of glass material is smaller than that of resin material, when the filled resin section expands at high temperatures, the sealing structure may be destroyed by thermal stress. In contrast, in the electronic component of the present invention, because a portion of the surface of the filled resin section is covered with a sealing metal layer, when the filled resin section thermally expands, the sealing metal layer also thermally expands, thereby alleviating thermal stress.

[0015] Furthermore, in the electronic component of the present invention, wiring can be drawn out from the functional section to the outside through via conductors or the like provided inside the through holes that penetrate the glass plate and the filled resin section.

[0016] The drawings shown below are schematic diagrams, and the dimensions, aspect ratio, scale, etc. may differ from those of the actual product.

[0017] FIG. 1 is a cross-sectional view schematically showing an example of an electronic component of the present invention.

[0018] The electronic component 1 shown in FIG. 1 includes a sealing body 10, a functional portion 20, a filled resin portion 30, and via conductors 40.

[0019] The sealing body 10 includes a first plate 11, a lid portion 12, and a sealing metal layer 13.

[0020] The first plate 11 has a first main surface 11a and a second main surface 11b that face each other in the thickness direction, and a side surface 11c that connects the first main surface 11a and the second main surface 11b.

[0021] The lid portion 12 is disposed at a distance from the first plate 11 so as to face the first main surface 11a of the first plate 11 in the thickness direction.

[0022] The sealing metal layer 13, together with the first plate 11 and the lid portion 12, airtightly seals the internal space of the sealing body .

[0023] The functional section 20 is provided in the internal space of the sealing body 10 and spaced apart from the first plate 11. In the functional section 20, a potential is applied to a pair of electrodes (not shown).

[0024] The filled resin portion 30 is filled between the sealing body 10 and the functional portion 20 .

[0025] The via conductors 40 are provided inside first through holes 51 that penetrate the first plate 11 in the thickness direction, and inside second through holes 52 that penetrate the filled resin portion 30 in the thickness direction and communicate with the first through holes 51. The via conductors 40 are electrically connected to a pair of electrodes of the functional portion 20 (for example, a pair of electrodes located on the upper surface side of the functional portion 20).

[0026] In the example shown in FIG. 1, the central axis of the first through hole 51 coincides with the central axis of the second through hole 52, and therefore the via conductor 40 is provided linearly.

[0027] The cross-sectional shape of the first through hole 51 and the second through hole 52 as viewed in the thickness direction is not particularly limited, and examples thereof include a polygon such as a square, a circle, an ellipse, etc. The first through hole 51 and the second through hole 52 may have a taper such that the hole diameter decreases in the thickness direction toward the functional part 20. Note that the hole diameter refers to the diameter when the cross-sectional shape is circular, and refers to the maximum length passing through the center of the cross section when the cross-sectional shape is other than circular.

[0028] The via conductors 40 provided inside the first through hole 51 and the second through hole 52 may be provided on at least the inner wall surfaces of the first through hole 51 and the second through hole 52. The inner wall surfaces of the first through hole 51 and the second through hole 52 are metallized with a low-resistance metal such as copper, gold, or silver. Note that the metallization of the via conductors 40 is not limited to metallizing only the inner wall surfaces of the first through hole 51 and the second through hole 52, and the first through hole 51 and the second through hole 52 may be filled with a metal or a composite material of a metal and a resin, or the like.

[0029] In the example shown in FIG. 1, the via conductor 40 reaches the functional section 20, but the via conductor 40 may be a through-hole conductor that penetrates the sealing body 10 in the thickness direction.

[0030] In addition to the via conductors 40 (which may be through-hole conductors) electrically connected to the pair of electrodes of the functional unit 20, through-hole conductors that are not electrically connected to the pair of electrodes of the functional unit 20 may be provided. Such through-hole conductors simply function as wiring. The through-hole conductors that are not electrically connected to the pair of electrodes of the functional unit 20 may be provided so as to penetrate the sealing body 10 in the thickness direction without going through the functional unit 20, or may be provided so as to penetrate the sealing body 10 in the thickness direction, including the functional unit 20. When a through-hole conductor is provided so as to penetrate the sealing body 10 in the thickness direction, including the functional unit 20, an insulating material is filled between the through hole that penetrates the functional unit 20 and the through-hole conductor.

[0031] 1, it is preferable that wiring 60 electrically connected to via conductors 40 is provided on the second main surface 11b of the first plate 11. The portion of wiring 60 connected to via conductors 40 may be a land.

[0032] The wiring 60 is mainly made of a low-resistance metal such as copper, gold, or silver.

[0033] The first plate 11 is a glass plate.

[0034] The lid portion 12 has a water vapor permeability of at least one-tenth of that of the filled resin portion 30 having the same film thickness.

[0035] The water vapor transmission rate (WVTR) can be measured, for example, according to JIS K 7129 "Plastics - Films and sheets - Determination of water vapor transmission rate (gas chromatography)." When the water vapor transmission rates of the lid portion 12 and the filled resin portion 30 are compared at the same film thickness, the water vapor transmission rate of the lid portion 12 should be one-tenth or less of the water vapor transmission rate of the filled resin portion 30.

[0036] On the other hand, the lid portion 12 has a water vapor permeability of 10% or more when compared with the filled resin portion 30 having the same thickness. 10It is more than 1 in 10,000,000,000.

[0037] The lid portion 12 is made of, for example, glass or metal.

[0038] When the lid portion 12 is made of glass, it is, for example, a glass plate. The glass that forms the lid portion 12 may be the same as the glass that forms the first plate 11, or may be different.

[0039] When the lid portion 12 is a glass plate, via conductors (which may be through-hole conductors) may be provided in the same manner as the first plate 11, although this is not shown in FIG. 1 . In this case, the via conductors provided in the lid portion 12 are provided inside a first through hole that penetrates the lid portion 12 in the thickness direction and inside a second through hole that penetrates the filled resin portion 30 in the thickness direction and communicates with the first through hole, and are electrically connected to a pair of electrodes of the functional portion 20 (for example, a pair of electrodes located on the lower surface side of the functional portion 20). Furthermore, it is preferable that wiring electrically connected to the via conductors be provided on the main surface of the lid portion 12 opposite to the filled resin portion 30. The portion of the wiring connected to the via conductor may be a land.

[0040] When the lid portion 12 is made of a metal, the lid portion 12 has, for example, the same configuration as the sealing metal layer 13. The metal constituting the lid portion 12 may be the same as or different from the metal constituting the sealing metal layer 13.

[0041] The sealing metal layer 13 is provided in direct contact with the first plate 11. In this case, the sealing metal layer 13 is preferably directly bonded to the first plate 11.

[0042] 1, the sealing metal layer 13 is preferably provided so as to be directly connected to the side surface 11c of the first plate 11. In this case, the sealing metal layer 13 is preferably directly bonded to the side surface 11c of the first plate 11.

[0043] Furthermore, the sealing metal layer 13 is preferably provided in direct contact with the lid portion 12. In this case, the sealing metal layer 13 is preferably directly bonded to the lid portion 12.

[0044] 1, the sealing metal layer 13 is preferably provided so as to be directly connected to the side surface of the lid portion 12. In this case, the sealing metal layer 13 is preferably directly bonded to the side surface of the lid portion 12.

[0045] The sealing metal layer 13 includes, for example, an underlayer and a plating layer from the filling resin portion 30 side. The underlayer may be one layer or two or more layers. The plating layer may be one layer or two or more layers.

[0046] The underlayer is formed by, for example, sputtering or electroless plating. When the underlayer is formed by sputtering, the underlayer includes, for example, an adhesion layer and a power supply layer from the filled resin portion 30 side.

[0047] The plating layer is formed by, for example, electrolytic plating.

[0048] The filled resin portion 30 is made of an insulating resin. Examples of the resin that constitutes the filled resin portion 30 include insulating resins such as epoxy resin and phenolic resin. Furthermore, the filled resin portion 30 preferably contains a filler. Examples of the filler contained in the filled resin portion 30 include inorganic fillers such as silica particles, alumina particles, and metal particles.

[0049] Filled resin portion 30 may be composed of only one resin layer, or may be composed of two or more resin layers stacked in the thickness direction. When filled resin portion 30 is composed of two or more resin layers, the materials constituting each resin layer may be the same or different.

[0050] FIG. 2 is a cross-sectional view that schematically shows an example of an electronic component in which the functional part is a capacitor.

[0051] In the electronic component 2 shown in FIG. 2, the functional section 20 includes an anode plate 21 made of metal. For example, the anode plate 21 has a core section 22 made of a valve metal. The anode plate 21 preferably has a porous section 23 provided on at least one main surface of the core section 22. A dielectric layer (not shown) is provided on the surface of the porous section 23, and a cathode layer 24 is provided on the surface of the dielectric layer. As a result, in the example shown in FIG. 2, the functional section 20 forms a capacitor such as a conductive polymer capacitor.

[0052] 2, one via conductor 40 is electrically connected to the core 22 of the anode plate 21, and the other via conductor 40 is electrically connected to the cathode layer 24. Therefore, the core 22 of the anode plate 21 and the cathode layer 24 correspond to the "pair of electrodes of the functional part 20."

[0053] As described above, the via conductors 40 may be through-hole conductors that penetrate the sealing body 10 in the thickness direction. For example, a through-hole conductor electrically connected to the core 22 of the anode plate 21 is provided so as to penetrate the sealing body 10, including the functional part 20, in the thickness direction. In this case, the core 22 of the anode plate 21 and the through-hole conductor are directly connected to each other.

[0054] When the functional section 20 forms a conductive polymer capacitor, the anode plate 21 is made of a valve metal that exhibits so-called valve action. Examples of the valve metal include simple metals such as aluminum, tantalum, niobium, titanium, and zirconium, as well as alloys containing at least one of these metals. Among these, aluminum or an aluminum alloy is preferred.

[0055] The anode plate 21 is preferably in the form of a flat plate, and more preferably in the form of a foil. The anode plate 21 may have the porous portion 23 on at least one main surface of the core portion 22, or may have the porous portion 23 on both main surfaces of the core portion 22. The porous portion 23 is preferably a porous layer formed on the surface of the core portion 22, and more preferably an etched layer.

[0056] The dielectric layer provided on the surface of the porous portion 23 is porous, reflecting the surface condition of the porous portion 23, and has a finely uneven surface shape. The dielectric layer is preferably made of an oxide film of the valve metal. For example, when aluminum foil is used as the anode plate 21, the dielectric layer made of an oxide film can be formed by anodizing the surface of the aluminum foil in an aqueous solution containing ammonium adipate or the like (also called chemical conversion treatment).

[0057] The cathode layer 24 provided on the surface of the dielectric layer includes, for example, a solid electrolyte layer provided on the surface of the dielectric layer. Preferably, the cathode layer 24 further includes a conductor layer provided on the surface of the solid electrolyte layer.

[0058] Examples of materials constituting the solid electrolyte layer include conductive polymers such as polypyrroles, polythiophenes, and polyanilines. Among these, polythiophenes are preferred, and poly(3,4-ethylenedioxythiophene), also known as PEDOT, is particularly preferred. The conductive polymer may also contain a dopant such as polystyrene sulfonate (PSS). The solid electrolyte layer preferably includes an inner layer that fills the pores (recesses) of the dielectric layer and an outer layer that covers the dielectric layer.

[0059] The conductor layer includes at least one layer selected from a conductive resin layer and a metal layer. The conductor layer may consist of only a conductive resin layer or only a metal layer. The conductor layer preferably covers the entire surface of the solid electrolyte layer.

[0060] The conductive resin layer may be, for example, a conductive adhesive layer containing at least one conductive filler selected from the group consisting of silver filler, copper filler, nickel filler, and carbon filler.

[0061] Examples of the metal layer include a metal plating film and a metal foil. The metal layer is preferably made of at least one metal selected from the group consisting of nickel, copper, silver, and alloys containing these metals as the main component. The term "main component" refers to the element component having the largest weight ratio.

[0062] The conductive layer includes, for example, a carbon layer provided on the surface of the solid electrolyte layer and a copper layer provided on the surface of the carbon layer.

[0063] The carbon layer is provided to electrically and mechanically connect the solid electrolyte layer and the copper layer, and can be formed in a predetermined region by applying a carbon paste onto the solid electrolyte layer by sponge transfer, screen printing, dispenser application, inkjet printing, or other methods.

[0064] The copper layer can be formed in a predetermined area by applying a copper paste onto the carbon layer by a method such as sponge transfer, screen printing, spray application, dispenser application, or inkjet printing.

[0065] When the functional part 20 is a capacitor, it is possible to use a ceramic capacitor using barium titanate, or a thin film capacitor using silicon nitride (SiN), silicon dioxide (SiO2), hydrogen fluoride (HF), etc. However, from the viewpoint of being able to form a thinner capacitor with a relatively large area and from the viewpoint of mechanical properties such as rigidity and flexibility of the electronic component 2, it is preferable that the functional part 20 is a capacitor using a metal such as aluminum as a base material, and more preferably a conductive polymer capacitor using a metal such as aluminum as a base material.

[0066] Examples of the functional part 20 that requires moisture resistance include capacitors such as conductive polymer capacitors and high dielectric constant thin film capacitors, all-solid-state batteries, and batteries such as lithium ion secondary batteries (LIBs).

[0067] FIG. 3 is an enlarged view of a portion indicated by III in FIG.

[0068] 3, a first adhesive layer 14 is preferably provided between the filled resin portion 30 and the first plate 11. The first adhesive layer 14 can improve the adhesion between the filled resin portion 30 and the first plate 11.

[0069] The first adhesive layer 14 has insulating properties and adhesive properties. The first adhesive layer 14 is made of, for example, an epoxy adhesive sheet, an epoxy adhesive, an acrylic adhesive sheet, an acrylic adhesive, or the like. The first adhesive layer 14 may be provided over the entire surface between the filled resin portion 30 and the first plate 11, or may be provided over a portion thereof.

[0070] The Young's modulus of first adhesive layer 14 is preferably lower than that of first plate 11 and lower than that of filled resin portion 30. In this case, when filled resin portion 30 thermally expands, first adhesive layer 14 can absorb the thermal expansion of filled resin portion 30.

[0071] The Young's modulus of the first adhesive layer 14 is, for example, 0.005 GPa or more and 2.9 GPa or less. The Young's modulus of the first plate 11 is, for example, 50 GPa or more and 90 GPa or less. The Young's modulus of the filled resin portion 30 is, for example, 3 GPa or more and 50 GPa or less.

[0072] The Young's modulus can be measured, for example, by a static test method (bending test).

[0073] The thickness of the first plate 11 is preferably 200 μm or less. In this case, the thermal expansion of the filled resin portion 30 can be accommodated by the deformation of the first plate 11.

[0074] On the other hand, from the viewpoint of ensuring the mechanical strength of first plate 11, the thickness of first plate 11 is preferably 5 μm or more.

[0075] The thickness of the first plate 11 means the dimension of the first plate 11 in the thickness direction of the first plate 11.

[0076] When the thickness of first plate 11 is 200 μm or less, the thickness of sealing metal layer 13 is preferably four times or less the thickness of first plate 11, and more preferably thinner than the thickness of first plate 11. In this case, the thermal expansion of filled resin portion 30 can be tolerated by the deformation of both first plate 11 and sealing metal layer 13.

[0077] On the other hand, from the viewpoint of suppressing the penetration of moisture into the functional section 20, the thickness of the sealing metal layer 13 is preferably 10 μm or more.

[0078] The thickness of the sealing metal layer 13 means the dimension of the sealing metal layer 13 in a direction parallel to the main surface of the first plate 11.

[0079] When the thickness of first plate 11 is 200 μm or less, lid portion 12 is preferably plate-shaped and has a thickness of 200 μm or less. In this case, the thermal expansion of filled resin portion 30 can be accommodated by deformation of lid portion 12.

[0080] On the other hand, the thickness of lid portion 12 is preferably 5 μm or more from the viewpoint of ensuring the mechanical strength of lid portion 12. The thickness of lid portion 12 may be the same as or different from the thickness of first plate 11.

[0081] The thickness of the lid portion 12 means the dimension of the lid portion 12 in the thickness direction of the first plate 11.

[0082] FIG. 4 is an enlarged view of a portion indicated by IV in FIG.

[0083] For example, when lid portion 12 is a glass plate, as shown in Fig. 4, it is preferable to provide second adhesive layer 15 between filled resin portion 30 and lid portion 12. Second adhesive layer 15 can improve the adhesion between filled resin portion 30 and lid portion 12.

[0084] The second adhesive layer 15 has insulating properties and adhesive properties. The second adhesive layer 15 is made of, for example, an epoxy adhesive sheet, an epoxy adhesive, an acrylic adhesive sheet, an acrylic adhesive, or the like. The second adhesive layer 15 may be provided over the entire surface between the filled resin portion 30 and the lid portion 12, or may be provided over a portion of the surface. The material of the second adhesive layer 15 may be the same as or different from the material of the first adhesive layer 14.

[0085] The Young's modulus of second adhesive layer 15 is preferably lower than that of lid portion 12 and lower than that of filled resin portion 30. In this case, when filled resin portion 30 thermally expands, second adhesive layer 15 can absorb the thermal expansion of filled resin portion 30.

[0086] The Young's modulus of the second adhesive layer 15 is, for example, 0.005 GPa or more and 2.9 GPa or less. The Young's modulus of the second adhesive layer 15 may be the same as or different from the Young's modulus of the first adhesive layer 14. When the lid portion 12 is a glass plate, the Young's modulus of the lid portion 12 is, for example, 50 GPa or more and 90 GPa or less. When the lid portion 12 is a glass plate, the Young's modulus of the lid portion 12 may be the same as or different from the Young's modulus of the first plate 11.

[0087] FIG. 5 is a cross-sectional view schematically illustrating an example of an electronic component in which the central axis of a first through hole does not coincide with the central axis of a second through hole.

[0088] 5 differs from the electronic component 1 shown in FIG. 1 in that the central axis of the first through hole 51 does not coincide with the central axis of the second through hole 52. In the example shown in FIG. 5, the second through hole 52 includes a second through hole 52a on the first plate 11 side and a second through hole 52b on the functional unit 20 side, and the central axis of the first through hole 51 does not coincide with the central axis of the second through hole 52b on the functional unit 20 side. The central axis of the second through hole 52a on the first plate 11 side does not coincide with the central axis of the second through hole 52b on the functional unit 20 side. The central axis of the first through hole 51 may coincide with the central axis of the second through hole 52a on the first plate 11 side, or may not coincide with the central axis of the second through hole 52a on the first plate 11 side.

[0089] Specifically, the via conductor 40 includes a first via conductor 41 provided inside the first through hole 51 and a second via conductor 42 provided inside the second through hole 52, and the central axis of the first via conductor 41 is located laterally to the central axis of the second via conductor 42. The first via conductor 41 and the second via conductor 42 are electrically connected by wiring 61 provided in the filled resin portion 30. In the example shown in FIG. 5 , the second via conductor 42 includes a second via conductor 42a provided inside the second through hole 52a on the first plate 11 side and a second via conductor 42b provided inside the second through hole 52b on the functional unit 20 side, and the central axis of the first via conductor 41 is located laterally to the central axis of the second via conductor 42b on the functional unit 20 side. The central axis of the second via conductor 42a on the first plate 11 side is located laterally to the central axis of the second via conductor 42b on the functional unit 20 side. The central axis of the first via conductor 41 may coincide with the central axis of the second via conductor 42a on the first plate 11 side, or may be located to the side of the central axis of the second via conductor 42a on the first plate 11 side.

[0090] As shown in electronic component 3 in Figure 5, by dividing via conductor 40 into first via conductor 41 and second via conductor 42 and preventing first via conductor 41 and second via conductor 42 from being arranged in a straight line, the stress acting on first plate 11 when via conductor 40 thermally expands in the thickness direction can be alleviated.

[0091] From the viewpoint of alleviating stress applied to the first plate 11, it is preferable that there be a portion where the first via conductor 41 does not overlap with the second via conductor 42 when viewed from the thickness direction. In the example shown in Fig. 5, the first via conductor 41 does not overlap with the second via conductor 42b on the functional unit 20 side when viewed from the thickness direction. The first via conductor 41 may or may not overlap with the second via conductor 42a on the first plate 11 side when viewed from the thickness direction. The second via conductor 42a on the first plate 11 side may or may not overlap with the second via conductor 42b on the functional unit 20 side when viewed from the thickness direction.

[0092] The wiring 61 may be arranged between the first plate 11 and the functional unit 20. In the example shown in Fig. 5, the wiring 61 is arranged away from the first plate 11 and the functional unit 20, but for example, the wiring 61 may be arranged so as to be in contact with the first plate 11. When the wiring 61 is arranged so as to be in contact with the first plate 11, the second via conductor 42 does not include the second via conductor 42a on the first plate 11 side, but only includes the second via conductor 42b on the functional unit 20 side.

[0093] The wiring 61 between the first via conductor 41 and the second via conductor 42 is mainly made of a low-resistance metal such as copper, gold, or silver. The material of the wiring 61 may be the same as or different from the material of the wiring 60.

[0094] Considering that the wiring 61 itself thermally expands in the thickness direction, the thickness of the wiring 61 is preferably 0.5 μm or more and 40 μm or less.

[0095] As in electronic component 1 shown in Fig. 1, electronic component 2 shown in Fig. 2, and electronic component 3 shown in Fig. 5, second through holes 52 are preferably provided only in the region between first plate 11 and functional section 20 in filled resin section 30. Furthermore, first through holes 51 are preferably provided only in the region that overlaps with functional section 20 when viewed in the thickness direction. In this case, electronic components 1, 2, and 3 do not expand in the width direction, allowing for miniaturization.

[0096] As in electronic component 1 shown in Fig. 1, electronic component 2 shown in Fig. 2, and electronic component 3 shown in Fig. 5, in filled resin portion 30, the thickness between first plate 11 and functional portion 20 is preferably thinner than the thickness of functional portion 20. Furthermore, in filled resin portion 30, the thickness between lid portion 12 and functional portion 20 is preferably thinner than the thickness of functional portion 20. In this case, electronic components 1, 2, and 3 do not expand in the thickness direction, allowing for miniaturization.

[0097] When wiring 60 is provided on the second main surface 11b of the first plate 11, as in the electronic component 1 shown in Fig. 1, the electronic component 2 shown in Fig. 2, and the electronic component 3 shown in Fig. 5, the flatness of the second main surface 11b of the first plate 11 is preferably 30 nm or less in terms of arithmetic mean roughness. Because the first plate 11 is a glass plate, it has a high flatness. Therefore, fine wiring 60 can be formed.

[0098] On the other hand, the flatness of the second main surface 11b of the first plate 11 is preferably 0.1 nm or more in terms of arithmetic mean roughness.

[0099] The arithmetic mean roughness (Ra) is the surface roughness measured in accordance with JIS B 0601:2013.

[0100] FIG. 6 is a cross-sectional view schematically showing a first modified example of the electronic component shown in FIG.

[0101] 6, the sealing metal layer 13 may be provided from the side surface 11c of the first plate 11 to the second main surface 11b of the first plate 11. By connecting the sealing metal layer 13 not only to the side surface 11c of the first plate 11 but also to the second main surface 11b of the first plate 11, the connection area of ​​the sealing metal layer 13 increases, making it possible to accommodate thermal expansion of the filled resin portion 30.

[0102] Similarly, the sealing metal layer 13 may be provided from the side surface of the lid portion 12 to the main surface of the lid portion 12 opposite to the filled resin portion 30 .

[0103] FIG. 7 is a cross-sectional view schematically showing a second modified example of the electronic component shown in FIG.

[0104] As in the electronic component 5 shown in FIG. 7, an outer resin portion 31 may be provided on the second main surface 11b of the first plate 11.

[0105] The external resin portion 31 is made of an insulating resin similar to the filled resin portion 30. The external resin portion 31 may be made of the same material as the filled resin portion 30, or may be made of a different material.

[0106] The outer resin portion 31 may be composed of only one resin layer, or may be composed of two or more resin layers stacked in the thickness direction. When the outer resin portion 31 is composed of two or more resin layers, the materials constituting the respective resin layers may be the same or different.

[0107] The thickness of the external resin portion 31 is preferably thinner than the thickness of the filled resin portion 30 between the first plate 11 and the functional portion 20. In this case, the electronic component 5 does not expand in the thickness direction, allowing for miniaturization.

[0108] In outer resin part 31, the surface opposite to the surface in contact with first plate 11 preferably has a greater surface roughness than the surface in contact with first plate 11. Electronic component 5 is embedded inside a substrate of, for example, an HPC (high performance computer), etc. Therefore, by increasing the surface roughness of the outer surface of outer resin part 31, it is possible to improve adhesion between outer resin part 31 and the substrate.

[0109] Specifically, in the outer resin portion 31, the surface opposite to the surface in contact with the first plate 11 preferably has a surface roughness of 300 nm or more and 3000 nm or less in arithmetic mean roughness.

[0110] 7, it is preferable that wiring 60 electrically connected to via conductors 40 is provided on the surface of outer resin portion 31 opposite to the surface in contact with first plate 11. The portion of wiring 60 connected to via conductors 40 may be a land.

[0111] When wiring 60 is provided on the surface of the outer resin part 31 opposite to the surface that contacts the first plate 11, the surface roughness of the surface of the outer resin part 31 opposite to the surface that contacts the first plate 11 on which wiring 60 is not provided may be greater than the surface roughness of the surface that contacts the wiring 60.

[0112] When the outer resin portion 31 is provided on the second main surface 11b of the first plate 11, the via conductors 40 are provided inside a first through hole 51 that penetrates the first plate 11 in the thickness direction, inside a second through hole 52 that penetrates the filled resin portion 30 in the thickness direction and communicates with the first through hole 51, and inside a third through hole 53 that penetrates the outer resin portion 31 in the thickness direction and communicates with the first through hole 51, and are electrically connected to a pair of electrodes of the functional portion 20 (for example, a pair of electrodes located on the upper surface side of the functional portion 20).

[0113] In the example shown in Figure 7, the central axis of the first through hole 51 coincides with the central axis of the second through hole 52, and the central axis of the second through hole 52 coincides with the central axis of the third through hole 53, so that the via conductor 40 is arranged in a straight line.

[0114] 7, the central axis of the first through hole 51 may not coincide with the central axis of the second through hole 52, and the central axis of the second through hole 52 may not coincide with the central axis of the third through hole 53. In this case, the via conductors provided inside the through holes whose central axes do not coincide are electrically connected to each other by wiring 61 (see FIG. 5) provided in the filled resin portion 30. When viewed from the thickness direction, it is preferable that there be a portion where the via conductors provided inside the through holes whose central axes do not coincide do not overlap each other.

[0115] 7, the second through hole 52 is preferably provided only in the region of the filled resin portion 30 between the first plate 11 and the functional portion 20. Furthermore, at least one of the first through hole 51 and the third through hole 53 is preferably provided only in the region overlapping with the functional portion 20 when viewed from the thickness direction, and it is more preferable that both the first through hole 51 and the third through hole 53 are provided only in the region overlapping with the functional portion 20 when viewed from the thickness direction. In this case, the electronic component 5 does not expand in the width direction, allowing for miniaturization.

[0116] Although not shown in Figure 7, similar to Figure 3, it is preferable that an adhesive layer be provided between the filled resin portion 30 and the first plate 11, and it is preferable that an adhesive layer be provided between the outer resin portion 31 and the first plate 11.

[0117] As with the first plate 11, an outer resin portion 31 may be provided on the main surface of the lid portion 12 opposite to the filled resin portion 30.

[0118] The outer resin portion 31 provided on the main surface opposite the filled resin portion 30 of the lid portion 12 may be made of the same material as the outer resin portion 31 provided on the second main surface 11b of the first plate 11, or may be made of a different material.

[0119] The outer resin part 31 provided on the main surface of the lid part 12 opposite to the filled resin part 30 may be composed of only one resin layer, or may be composed of two or more resin layers stacked in the thickness direction. When the outer resin part 31 is composed of two or more resin layers, the materials constituting the respective resin layers may be the same or different.

[0120] The thickness of the outer resin portion 31 provided on the main surface of the lid portion 12 opposite to the filled resin portion 30 is preferably thinner than the thickness of the filled resin portion 30 between the lid portion 12 and the functional portion 20. In this case, the electronic component 5 does not expand in the thickness direction, making it possible to reduce the size. The thickness of the outer resin portion 31 provided on the main surface of the lid portion 12 opposite to the filled resin portion 30 may be the same as or different from the thickness of the outer resin portion 31 provided on the second main surface 11b of the first plate 11.

[0121] In the outer resin portion 31 provided on the main surface of the lid portion 12 opposite to the filled resin portion 30, the surface opposite to the surface in contact with the lid portion 12 preferably has a larger surface roughness than the surface in contact with the lid portion 12. The surface roughness of the outer resin portion 31 provided on the main surface of the lid portion 12 opposite to the filled resin portion 30 may be the same as or different from the surface roughness of the outer resin portion 31 provided on the second main surface 11b of the first plate 11.

[0122] Specifically, the surface roughness of the surface of the outer resin portion 31 opposite to the surface in contact with the lid portion 12 is preferably 300 nm or more and 3000 nm or less in arithmetic mean roughness.

[0123] When the lid portion 12 is a glass plate, via conductors may be provided in the same manner as the first plate 11, although this is not shown in FIG. 7 . In this case, the via conductors provided in the lid portion 12 are provided inside a first through hole that penetrates the lid portion 12 in the thickness direction, inside a second through hole that penetrates the filled resin portion 30 in the thickness direction and communicates with the first through hole, and inside a third through hole that penetrates the outer resin portion 31 in the thickness direction and communicates with the first through hole, and are electrically connected to a pair of electrodes of the functional portion 20 (for example, a pair of electrodes located on the underside of the functional portion 20). Furthermore, in the outer resin portion 31 provided on the main surface of the lid portion 12 opposite the filled resin portion 30, wiring is preferably provided on the surface opposite to the surface that contacts the lid portion 12. The portion of the wiring that is connected to the via conductor may be a land.

[0124] In the outer resin part 31 provided on the main surface opposite the filled resin part 30 of the lid part 12, when wiring is provided on the surface opposite to the surface in contact with the lid part 12, the surface roughness of the surface of the outer resin part 31 opposite to the surface in contact with the lid part 12 on which wiring is not provided may be greater than the surface roughness of the surface in contact with the wiring.

[0125] Although not shown in Figure 7, as in Figure 4, it is preferable that an adhesive layer be provided between the filled resin part 30 and the lid part 12, and it is preferable that an adhesive layer be provided between the outer resin part 31 and the lid part 12.

[0126] FIG. 8 is a cross-sectional view schematically showing a modification of the electronic component shown in FIG.

[0127] 8 , the sealing metal layer 13 may be provided from the side surface 11c of the first plate 11 to the surface of the outer resin portion 31 opposite to the surface that contacts the first plate 11. By providing the sealing metal layer 13 up to the outer surface of the outer resin portion 31, stress caused by thermal expansion of the filled resin portion 30 can be dispersed to the outer resin portion 31.

[0128] When the outer resin portion 31 is provided on the main surface of the lid portion 12 opposite the filled resin portion 30, the sealing metal layer 13 may be provided from the side of the lid portion 12 to the surface of the outer resin portion 31 opposite to the surface that contacts the lid portion 12.

[0129] FIG. 9 is a cross-sectional view schematically showing a modified example of the electronic component shown in FIG.

[0130] When the functional section 20 is a capacitor, as in the electronic component 7 shown in FIG.

[0131] In the example shown in FIG. 9, a plurality of capacitor elements 25 are arranged side by side on a plane, but they may also be arranged so as to be stacked in the thickness direction, or they may be arranged in a combination of both.

[0132] When functional section 20 includes a plurality of capacitor elements 25, the region including the plurality of capacitor elements 25 corresponds to functional section 20. Therefore, even when second through holes 52 are provided between capacitor elements 25 stacked in the thickness direction, the location where second through holes 52 are provided corresponds to "between first plate 11 and functional section 20."

[0133] The number of capacitor elements 25 is not particularly limited as long as it is at least 2. The size, shape, etc. of capacitor elements 25 may be the same, or some or all of them may be different.

[0134] The capacitor elements 25 preferably have the same configuration, but capacitor elements 25 with different configurations may be included. [Example]

[0135] Hereinafter, examples will be given that more specifically disclose the electronic component of the present invention, but the present invention is not limited to these examples.

[0136] Fig. 10 is a cross-sectional view schematically showing an electronic component according to an example, and Fig. 11 is an enlarged view of a portion indicated by XI in Fig. 10.

[0137] A capacitor element is prepared as the functional part 20, including an anode plate 21 having porous parts 23 provided on both main surfaces of a core part 22 made of a valve metal, a dielectric layer (not shown) provided on the surface of the porous part 23, and a cathode layer 24 provided on the surface of the dielectric layer. The core part 22 and the cathode layer 24 of the anode plate 21 correspond to the "pair of electrodes of the functional part 20."

[0138] The filled resin portion 30 is formed by laminating a buildup film (for example, ABF (Ajinomoto Buildup Film)) on both the front and back sides of the functional portion 20 and performing a curing process.

[0139] Separately, two glass plates (for example, G-Leaf (registered trademark) (manufactured by Nippon Electric Glass Co., Ltd., thickness 50 μm)) are prepared as the first plate 11 and the lid portion 12.

[0140] An adhesive layer 14a (e.g., a double-sided adhesive sheet, etc.) is attached to one main surface of the first plate 11, and then it is attached to the filled resin portion 30, and an adhesive layer (e.g., a double-sided adhesive sheet, etc.) is attached to one main surface of the lid portion 12, and then it is attached to the filled resin portion 30.

[0141] An adhesive layer 14b (for example, a double-sided adhesive sheet) is attached to the other main surface of the first plate 11, and an adhesive layer (for example, a double-sided adhesive sheet) is attached to the other main surface of the lid portion 12. After that, a build-up film (for example, ABF (Ajinomoto Build-up Film)) is attached to each adhesive layer, and a curing process is performed. This forms the outer resin portion 31.

[0142] In this way, a laminated body with the functional section 20 disposed therein is produced.

[0143] A through hole is formed from the surface of the outer resin part 31 to the functional part 20 by two-stage processing using a femtosecond green laser and a CO2 laser. Specifically, a through hole is formed from the surface of the outer resin part 31 to the first plate 11 or the lid part 12 using a femtosecond green laser, and a through hole is formed from the first plate 11 or the lid part 12 to the functional part 20 using a CO2 laser.

[0144] The electrodes are patterned by electroless plating, photolithography, electrolytic plating, resist stripping, electroless plating, and etching, thereby forming the via conductors 40 and the wiring 60.

[0145] The front and back surfaces of the outer resin portion 31 are covered with a heat release sheet.

[0146] The chip is separated into individual pieces by dicing.

[0147] An underlayer for the sealing metal layer 13 is formed on the side surface of the laminate. For example, a 100 nm thick adhesion layer (Ti, Cr, or NiCr) is formed by sputtering, and then a 1000 nm thick power supply layer (Cu) is formed. Alternatively, instead of sputtering, the 1000 nm thick power supply layer (Cu) may be formed by electroless plating.

[0148] The thermal release sheet is peeled off from the laminate on which the underlayer of the sealing metal layer 13 has been formed.

[0149] A plating layer of the sealing metal layer 13 is formed on the side surface of the laminate from which the thermal release sheet has been peeled off. For example, by electrolytic plating, from the base layer side, a plating layer of Cu: 20 μm thick / Ni: 5 μm thick, a plating layer of Cu: 20 μm thick / Ni: 5 μm thick / Au: 1 μm thick, or a plating layer of Cu: 20 μm thick / Ni: 5 μm thick / Sn: 2 μm thick is formed.

[0150] In this way, the electronic component 8 is obtained.

[0151] When the via conductors 40 are through-hole conductors, a through-hole that penetrates the laminate can be formed using a UV laser instead of the two-stage processing using a femtosecond green laser and a CO 2 laser.

[0152] The electronic component of the present invention is not limited to the above-described embodiment, and various applications and modifications can be made within the scope of the present invention with respect to the configuration of the electronic component, the manufacturing conditions of the electronic component, and the like. [Explanation of symbols]

[0153] 1, 2, 3, 4, 5, 6, 7, 8 Electronic Components 10 Sealing body 11 1st board 11a: First main surface of first plate 11b Second main surface of the first plate 11c Side of the first board 12 Lid 13 Sealing metal layer 14 1st adhesive layer 14a, 14b adhesive layer 15 Second adhesive layer 20 Functional Section 21 Anode plate 22 Core 23 Porous part 24 cathode layer 25 Capacitor element 30 Filling resin section 31 Outer resin part 40 Via conductor 41 First via conductor 42, 42a, 42b Second via conductors 51 First through hole 52, 52a, 52b 2nd through hole 53 Third through hole 60, 61 Wiring

Claims

1. a sealing body including: a first plate having a first main surface and a second main surface opposing each other in a thickness direction and a side surface connecting the first main surface and the second main surface; a lid portion disposed apart from the first plate so as to face the first main surface of the first plate in the thickness direction; and a sealing metal layer that hermetically seals an internal space together with the first plate and the lid portion; a functional section provided in the internal space of the sealing body at a distance from the first plate, the functional section having a pair of electrodes to which a potential is applied; a filled resin portion filled between the sealing body and the functional portion; via conductors provided inside a first through hole penetrating the first plate in the thickness direction and inside a second through hole penetrating the filled resin portion in the thickness direction and communicating with the first through hole, the via conductors being electrically connected to the pair of electrodes of the functional portion; the lid portion has a water vapor permeability that is one-tenth or less of that of the filled resin portion having the same film thickness, or the lid portion is made of glass or metal; the first plate is a glass plate; The sealing metal layer is provided in direct contact with the first plate.

2. The electronic component according to claim 1 , wherein the sealing metal layer is provided in direct contact with the side surface of the first plate.

3. The electronic component according to claim 1 , further comprising a first adhesive layer provided between the filled resin portion and the first plate.

4. The electronic component according to claim 3 , wherein the Young's modulus of the first adhesive layer is lower than that of the first plate and is also lower than that of the filled resin portion.

5. The electronic component according to claim 3 , wherein the first plate has a thickness of 200 μm or less.

6. The electronic component according to claim 5 , wherein the thickness of the sealing metal layer is four times or less the thickness of the first plate.

7. The electronic component according to claim 6 , wherein the thickness of the sealing metal layer is smaller than the thickness of the first plate.

8. The lid portion is plate-shaped, 8. The electronic component according to claim 5, wherein the lid portion has a thickness of 200 μm or less.

9. the lid is a glass plate, a second adhesive layer is provided between the filled resin portion and the lid portion; The electronic component according to claim 8 , wherein the second adhesive layer has a Young's modulus lower than that of the lid portion and lower than that of the filled resin portion.

10. 10. The electronic component according to claim 1, wherein the second through-hole is provided in the filled resin portion only in a region between the first plate and the functional portion.

11. The electronic component according to claim 10 , wherein a thickness between the first plate and the functional portion in the filled resin portion is smaller than a thickness of the functional portion.

12. The electronic component according to claim 11 , wherein a thickness between the lid portion and the functional portion in the filled resin portion is thinner than a thickness of the functional portion.

13. an outer resin portion provided on the second main surface of the first plate; The electronic component according to any one of claims 1 to 12, wherein the surface roughness of the surface opposite to the surface in contact with the first plate in the outer resin portion is greater than the surface roughness of the surface in contact with the first plate.

14. an outer resin portion provided on the second main surface of the first plate; The electronic component according to any one of claims 1 to 13, wherein the surface of the outer resin portion opposite to the surface in contact with the first plate has a surface roughness of 300 nm or more and 3000 nm or less in arithmetic mean roughness.

15. an outer resin portion provided on the second main surface of the first plate; a surface of the outer resin portion opposite to a surface in contact with the first plate, the surface being provided with wiring electrically connected to the via conductor; An electronic component according to any one of claims 1 to 14, wherein the surface of the outer resin portion opposite the surface in contact with the first plate has a surface roughness on which the wiring is not provided that is greater than the surface roughness of the surface in contact with the wiring.

16. The electronic component according to any one of claims 13 to 15, wherein the external resin portion is made of the same material as the filled resin portion.

17. The electronic component according to any one of claims 13 to 16, wherein the thickness of the outer resin portion is smaller than the thickness of the filled resin portion between the first plate and the functional portion.

18. The electronic component according to claim 17 , wherein the sealing metal layer is provided from the side surface of the first plate to a surface of the outer resin portion opposite to a surface in contact with the first plate.

19. wiring electrically connected to the via conductors is provided on the second main surface of the first plate; 13. The electronic component according to claim 1, wherein the flatness of the second main surface of the first plate is 30 nm or less in terms of arithmetic mean roughness.

20. The electronic component according to claim 19 , wherein the sealing metal layer is provided from the side surface of the first plate to the second main surface of the first plate.

21. the via conductors include a first via conductor provided inside the first through hole and a second via conductor provided inside the second through hole; a central axis of the first via conductor is located to the side of a central axis of the second via conductor; 21. The electronic component according to claim 1, wherein the first via conductor and the second via conductor are electrically connected by a wiring provided in the filled resin portion.

22. The electronic component according to any one of claims 1 to 21, wherein the functional portion is a capacitor.

23. The electronic component according to claim 22 , wherein the functional portion includes a plurality of capacitor elements.

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