Manufacturing method of package device chip

Abstract

To provide a manufacturing method of a package device chip capable of suppressing the generation of burrs in a package substrate having a concave part.SOLUTION: A manufacturing method for manufacturing a package device chip 30, in which a lead frame 3 includes a support part 7 and an electrode part 34, the electrode part 34 includes a concave part 60 formed in a region RA which is opened on a second surface 15 side of the lead frame 3 and overlaps with a division line 6, comprises: a package substrate forming step of forming a package substrate 1 by sealing a device chip 8 arrange in the support part 7 and the electrode part 34 with a mold resin 12; a concave part covering step of covering the concave part 60 with the mold resin 12; a dividing step of dividing the concave part 60 covered with the mold resin 12 along the dividing line 6 to manufacture the package device chip 30; and a removing step of removing the mold resin 12 from the concave part 60 by spraying a high-pressure water 70 onto the mold resin 12 covering the concave part 60.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present invention relates to a method for manufacturing a packaged device chip. [Background technology]

[0002] A package substrate, such as a QFN (Quad Flat Non-leaded package) substrate for manufacturing packaged device chips, has a recess (cavity) formed on its top surface so as to intersect with the planned division line. When such a package substrate is cut using a cutting blade or the like, the recess is divided along the planned division line, and the recess is exposed on the cut surfaces (side surfaces) of the individually divided chips. As a result, whisker-like burrs are formed on the edge portions of the recess along the inner surfaces of the recess.

[0003] Therefore, a method has been proposed for removing burrs formed in recesses in the above-mentioned package substrate using high-pressure water (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2016-181569 Summary of the Invention [Problem to be solved by the invention]

[0005] However, in Patent Document 1, although burrs can be removed with high-pressure water, the formation of burrs itself cannot be suppressed. Furthermore, the burrs formed by cutting the package substrate are made of metal, and the gaps in the recesses are narrow, making it difficult to remove the burrs with high-pressure water. This poses a problem in that it is difficult to separate the package substrate and manufacture package device chips.

[0006] The present invention has been made in view of the above points, and an object of the present invention is to provide a method for manufacturing a packaged device chip that can suppress the occurrence of burrs in a package substrate having a recess. [Means for solving the problem]

[0007] One aspect of the present invention is a manufacturing method for manufacturing packaged device chips by dividing a package substrate, in which a device chip mounted on a lead frame is sealed with mold resin, along a planned division line, wherein the lead frame has a plurality of support portions that support the device chip on a first surface side, and a plurality of electrode portions formed outside the support portions, and the electrode portions open to a second surface side of the lead frame opposite the first surface side and include recesses formed in areas overlapping the planned division line, the method comprising: a package substrate forming step of sealing the device chip placed on the support portions and the electrode portions with the mold resin to form the package substrate; a recess covering step of covering at least a portion of the recesses with a coating material; a dividing step of dividing the area including the recesses covered with the coating material along the planned division line to manufacture the packaged device chips; and a removal step of spraying a high-pressure fluid onto the coating material that has coated the recesses to remove the coating material from the recesses.

[0008] The electrode portion has an opening on the second surface side that communicates with the recess, opens to either side of the electrode portion, and does not divide the electrode portion, and the recess covering step may be performed by flowing the molding resin into the recess through the opening in the package substrate forming step.

[0009] The dividing step includes a first dividing step of forming a first groove from the second surface side to a depth that does not divide the package substrate, and a second dividing step of forming a second groove that communicates with the first groove and divides the package substrate, and the removing step may be performed between the first dividing step and the second dividing step. [Effects of the Invention]

[0010] According to the method for manufacturing a packaged device chip of the present invention, it is possible to suppress the occurrence of burrs in a package substrate having a recess. [Brief explanation of the drawings]

[0011] [Figure 1] 1 is a perspective view showing an outline of a package substrate for manufacturing a package device chip according to a first embodiment. [Figure 2] 2 is an enlarged view showing an area A of the lead frame in FIG. [Figure 3] 3A to 3C are cross-sectional views schematically showing a device stacking step in the first embodiment. [Figure 4] 4A to 4C are diagrams schematically showing a package substrate producing step (recess covering step) of the first embodiment. [Figure 5] 1A and 1B are diagrams showing recesses provided in an electrode portion, where (1) shows a comparative example, and (2) and (3) show the configuration of this embodiment. [Figure 6] FIG. 4 is a diagram schematically illustrating a division step in the first embodiment. [Figure 7] FIG. 4 is a diagram schematically illustrating a removal step in the first embodiment. [Figure 8] FIG. 10 is a diagram schematically illustrating a first dividing step of the second embodiment. [Figure 9] FIG. 10 is a diagram schematically illustrating a removal step in the second embodiment. [Figure 10] FIG. 10 is a diagram schematically illustrating a second dividing step of the second embodiment. [Figure 11] 10A to 10C are diagrams schematically illustrating a package substrate producing step according to the third embodiment. [Figure 12] FIG. 10 is a diagram schematically illustrating a recess covering step according to the third embodiment. [Figure 13] 10A to 10C are diagrams showing variations of the recess covering step in the third embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0012] (First embodiment) Hereinafter, a method for manufacturing a packaged device chip according to the first embodiment will be described with reference to the accompanying drawings. FIG. 1 is a perspective view showing an overview of a package substrate for manufacturing a packaged device chip according to the first embodiment. FIG. 2 is an enlarged view showing an area A of the lead frame in FIG. 1. FIG. 3 is a cross-sectional view schematically showing a device stacking step according to the first embodiment. FIG. 4 is a view schematically showing a package substrate generating step (recess covering step) according to the first embodiment. FIG. 5 is a view showing a comparative example and an embodiment of recesses provided in electrode portions. FIG. 6 is a view schematically showing a division step according to the first embodiment. FIG. 7 is a view schematically showing a removal step according to the first embodiment.

[0013] (Package device chip configuration) The first embodiment is a manufacturing method for manufacturing a packaged device chip 30. The package substrate 1 shown in Fig. 1 is subjected to cutting or the like and divided to manufacture the individual packaged device chips 30 shown in Fig. 6 and Fig. 7. The manufacturing method for manufacturing the packaged device chip 30 includes sealing a device chip 8 mounted on a lead frame 3 with a molding resin 12, and dividing the package substrate 1 including the sealed device chip 8 along the planned dividing lines 6, thereby manufacturing the individual packaged device chips 30.

[0014] As shown in FIG. 1, the package substrate 1 is formed into a rectangular flat plate in plan view. The package substrate 1 has a front surface 9 facing the +Z direction and a back surface 10 facing the -Z direction (see FIGS. 4, 6, and 7). The package substrate 1 includes a rectangular flat lead frame 3. As shown in FIG. 3, the lead frame 3 includes a first surface 14 facing the back surface 10 of the package substrate 1 and a second surface 15 facing the front surface 9. The lead frame 3 is made of a metal containing copper, i.e., a metal such as a copper alloy. The package substrate 1 is formed into a rectangular flat plate, but is not limited to this, and may be formed into a disc-shaped wafer shape using a silicon plate, a glass plate, or the like.

[0015] The package substrate 1 has a plurality of mutually intersecting division lines 6 defined thereon. One of the plurality of mutually intersecting division lines 6 extends in a direction parallel to the lead frame 3 (e.g., the Y-axis direction), and the other of the plurality of mutually intersecting division lines 6 extends in a direction perpendicular to the longitudinal direction (e.g., the X-axis direction) of the lead frame 3 and parallel to the width direction (e.g., the Y-axis direction) of the lead frame 3. A device chip 8 is disposed on the first surface 14 side of the lead frame 3 of the support portion 7 partitioned by the mutually intersecting division lines 6, and is sealed with mold resin 12.

[0016] The package substrate 1 is a so-called QFN (Quad Flat Non-leaded Package) package substrate in which a device chip 8 mounted on a metal lead frame 3 is covered with a molding resin 12. The package substrate 1 may also be a CSP (Chip Scale Packaging) substrate.

[0017] 1, in the package substrate 1, alignment marks 13 are provided at both ends of the division lines 6 on the second surface 15 (front surface 9) of the lead frame 3 to indicate cutting positions of the division lines 6 during cutting. In the first embodiment, the alignment marks 13 are arranged at the center of each division line 6 in the width direction and at positions aligned along the longitudinal direction of the division lines 6.

[0018] The division lines 6 are configured to penetrate the lead frame 3. The support portions 7 are configured from parts of the lead frame 3, and the device chips 8 are disposed on the first surface 14 side of the support portions 7. As shown in FIGS. 1 and 2, each division line 6 is set between the support portions 7, and a plurality of electrode portions 34 for connecting the device chips 8 to a wiring board or the like are disposed on each division line 6. That is, a plurality of electrode portions 34 are disposed so as to cross the division lines 6.

[0019] Therefore, as shown in FIGS. 1 and 2, the lead frame 3 has a support portion 7 that supports the device chip 8, and a plurality of electrode portions 34 formed outside the support portion 7.

[0020] 1, 4, 6, and 7, the package substrate 1 includes a molded resin 12 that seals (coats) the back surface 10 side of the package substrate 1. The molded resin 12 is made of a thermoplastic resin. On the first surface 14 side of the lead frame 3, the molded resin 12 seals (coats) the device chip 8, the electrode portions 34, and the wires 18, and also fills the interior of the planned division lines 6.

[0021] As shown in FIGS. 1 and 2, the electrode portions 34 are open to the second surface 15 of the lead frame 3 and include recesses 60 (cavities) formed in regions RA (see FIG. 5) overlapping with the planned division lines 6. The recesses 60 are formed in the shape of long grooves along the length of each electrode portion 34. The electrode portions 34 are formed by parts of the lead frame 3, and in the first embodiment, are each provided at the center of the planned division lines 6 in the width direction and formed linearly in a direction perpendicular to each planned division line 6.

[0022] (Method of manufacturing packaged device chips) The method for manufacturing the packaged device chip 30 is performed by dividing the package substrate 1, in which the device chip 8 mounted on the lead frame 3 is sealed with the molding resin 12, by cutting along the planned dividing lines 6. The method for manufacturing the packaged device chip 30 includes a package substrate forming step, a recess covering step, a dividing step, and a removing step. The method for manufacturing the packaged device chip 30 may also include a device stacking step before the package substrate forming step.

[0023] (Device stacking step) As shown in FIG. 3 , the device stacking step is a step in which the second surface 15 of the lead frame 3 is supported on the back surface 10 side of the support substrate 32, and then the device chip 8 is stacked (placed) on the support portion 7 of the lead frame 3, and the stacked (placed) device chip 8 is connected to the electrode portion 34 of the lead frame 3 with the wire 18. As a result, the device chip 8 is stacked (placed) on the first surface 14 side of the support portion 7, and the device chip 8 is connected to the electrode portion 34 with the wire 18. FIG. 3 shows a cross section taken along line B-B′ in FIG. 2. In the device stacking step, supporting the lead frame 3 with the support substrate 32 facilitates sealing of the package substrate 1 with the mold resin 12. Although only one device chip 8 is shown in the embodiment shown in FIG. 3 , this is not limited to this; multiple device chips 8 having similar structures are arranged side by side along the X-axis and Y-axis directions.

[0024] (Package substrate forming step) (Recess covering step) As shown in Fig. 4, the recess covering step of the first embodiment is performed simultaneously with the package substrate forming step, and Fig. 4 is also a diagram schematically illustrating the package substrate forming step and the recess covering step.

[0025] The package substrate creating step is performed after the device chip 8 is placed on the support portion 7 in the device stacking step. The package substrate creating step is a step in which the lead frame 3 including the device chip 8 and the electrode portion 34 stacked (placed) on the support portion 7 is covered with a mold (not shown), and molding resin 12 is poured into the mold, thereby sealing the lead frame 3 on which the device chip 8 is stacked with the molding resin 12. As a result, the device chip 8, wires 18, and electrode portion 34 are sealed with the molding resin 12, and the recesses 60 of the electrode portion 34 are covered with the molding resin 12, thereby forming the package substrate 1.

[0026] The electrode portion 34 has an opening 61 (see FIGS. 5(2) and 5(3)) on the second surface 15 side that communicates with the recess 60, opens to either side of the electrode portion 34, and has a depth that does not divide the electrode portion 34. When sealing with the mold resin 12, the mold resin 12 flows through the opening 61 into the recess 60 that opens on the second surface 15 side, thereby covering the recess 60. The recess 60 and opening 61 are formed in advance by an etching process. The recess 60 and opening 61 may also be formed by a process other than etching.

[0027] As described above, in the package substrate forming step, by injecting the mold resin 12 into the mold, the device chip 8 arranged so as to be electrically connected to the electrode portion 34 of the lead frame 3 and the electrode portion 34 are sealed with the mold resin 12. At the same time, the mold resin 12 flows into the recess 60 of the electrode portion 34 through the opening 61, covering at least a portion of the recess 60. As a result, a recess covering step is performed in which at least a portion of the recess 60 is covered with a covering material. In the first embodiment, the covering material is the mold resin 12. Therefore, in the first embodiment, the package substrate forming step is performed, and the recess covering step is performed, and the device chip 8, the electrode portion 34, and the recess 60 can be collectively sealed with the mold resin 12, thereby shortening the work process. This improves work efficiency.

[0028] Here, the recess 60 of the electrode portion 34 of the first embodiment is open to the second surface 15 side of the lead frame 3. Fig. 5(1) shows an example of the recess 60 of a comparative example that does not have an opening 61, Fig. 5(2) shows an example of the recess 60 of the present embodiment that has an opening 61, and Fig. 5(3) is a diagram showing another example of the recess 60 of the present embodiment that has an opening 61.

[0029] As shown in FIG. 5(1), the recesses 60 provided in the electrode portion 34 of the comparative example are open only on the second surface 15 side, i.e., in the +Z-axis direction. Therefore, the recesses 60 provided in the electrode portion 34 of the comparative example are not open in the direction in which the planned division lines 6 extend (extension direction), such as the X-axis direction or the Y-axis direction. That is, the recesses 60 provided in the electrode portion 34 of the comparative example are not open on either the X-axis direction or the Y-axis direction side. The second surface 15 side on which the recesses 60 are open is supported by the support substrate 32, so the recesses 60 are sealed. Therefore, even if the molding resin 12 is poured in this state, the molding resin 12 does not flow into the recesses 60.

[0030] Unlike the comparative example, in the first embodiment, as shown in FIG. 5(2), the recess 60 provided in the electrode portion 34 has an opening 61 that opens along the side surface along which the division lines 6 are formed and does not divide the electrode portion 34. In FIGS. 5(2) and 5(3), the opening 61 is an example of a groove-shaped opening groove formed with a depth dimension DA that does not divide the electrode portion 34. That is, the depth dimension DA of the groove-shaped opening 61 is formed to be smaller than the depth dimension DB of the electrode portion 34. In FIGS. 5(2) and 5(3), the opening 61 opens on the side surface in the Y-axis direction, but this is not limited thereto. It is sufficient that the opening 61 opens on the side surface in either the X-axis direction or the Y-axis direction and has a depth dimension DA that does not divide the electrode portion 34. In the configuration shown in FIG. 5(2), the width dimension WA of the opening 61 is formed to be the same as the width dimension WB of the division lines 6. This allows the molding resin 12 to flow into the recess 60 through the opening 61 when filling the molding resin 12 in the package substrate production step. This allows the recess 60 to be filled with the mold resin 12, making it easy to cover the recess 60. Therefore, by providing the opening 61, the mold resin 12 flows into the recess 60, so the device chip 8, the electrode portion 34, and the recess 60 can be collectively sealed with the mold resin 12, thereby shortening the work process. This improves the efficiency of the work.

[0031] 5(2), in the package substrate producing step, the mold resin 12 covers the entire recess 60, but this is not limited thereto, and it is sufficient to cover at least a part of the recess 60. In other words, it is sufficient that, of the entire area of ​​the recess 60, at least the area that comes into contact with the cutting blade 41 (see FIG. 6) of the cutting device 40 is covered with the mold resin 12.

[0032] As shown in FIG. 5(3), the width dimension WA of the opening 61 in the first embodiment may be formed to be wider than the width dimension WB of the planned division line 6. In FIG. 5(3), the width dimension WA of the opening 61 is formed to be the same as the width dimension WC of the recess 60. This allows the width dimension of the opening 61 to be larger. Therefore, when the molding resin 12 is flowed into the recess 60 through the opening 61 in the package substrate production step, the flow of the molding resin 12 into the recess 60 can be promoted. This allows the molding resin 12 to be filled into the recess 60, and the recess 60 can be more reliably covered. Furthermore, the width dimension WA of the opening 61 may be formed to be wider than the width dimension WC of the recess 60. This prevents the shape of the groove for flowing the molding resin 12 into the recess 60 from affecting the external shape of the final packaged device chip 30. This improves the aesthetic appearance of the packaged device chip 30.

[0033] In the embodiment of FIGS. 5(2) and 5(3), the opening 61 is formed by a groove-like opening groove formed with a depth dimension DA that does not divide the electrode portion 34, but this is not limited thereto. For example, the opening 61 may be formed by a hole-like opening hole (not shown). The opening hole is one example of the opening 61. The hole-like opening 61 may be formed so as to penetrate from the outer surface of the electrode portion 34 to the recess 60 inside the electrode portion 34. For example, as an example of the hole-like opening 61, an opening hole that is open in the +Z-axis direction may be provided. By providing the opening hole, when filling the mold resin 12 in the package substrate generating step, the mold resin 12 can flow into the recess 60 through the opening hole provided in the electrode portion 34. This allows the recess 60 to be filled with the mold resin 12, making it easy to cover the recess 60.

[0034] (Split Step) As shown in Figure 6, the division step is a step of dividing an area RA (particularly, the area RA in Figures 5(2) and 5(3)) including a recess 60 covered with molded resin 12 along the planned division line 6, and cutting the electrode portion 34 and molded resin 12 by cutting processing to manufacture individual package device chips 30.

[0035] In the dividing step, after the package substrate forming step (recess covering step) is performed, first, package substrate 1 is removed from support substrate 32, and the front surface 9 and back surface 10 of package substrate 1 are turned upside down, and then the back surface 10 side of package substrate 1, i.e., mold resin 12, is held by first dicing tape 38. In the dividing step, the back surface 10 side of package substrate 1, i.e., mold resin 12, may be suction-held on the holding surface of a chuck table (not shown).

[0036] The cutting device 40 includes a cutting blade 41. The cutting device 40 is an example of a processing device. The processing device is not limited to the cutting device 40, and may be any device that can manufacture the package device chip 30. In the division step, the cutting device 40 captures an image of the mark 13 (see FIG. 1) on the front surface 9 of the package substrate 1 held on the first dicing tape 38 with an imaging unit (not shown), and performs alignment to align the cutting blade 41 of the cutting device 40 with the planned division line 6 (see FIG. 1).

[0037] In the dividing step, the cutting device 40 performs a full cut by cutting using the cutting blade 41 of the cutting device 40 from the side of the lead frame 3 where the recesses 60 are formed, i.e., the front surface 9 side, to form the grooves 19. Specifically, the first dicing tape 38 and the cutting blade 41 are moved relatively along the division lines 6, and as shown in FIG. 6, the cutting edge of the cutting blade 41 is positioned at the center of the width of the recesses 60 and cuts through the electrode portions 34 and the molding resin 12 to a depth that does not penetrate the first dicing tape 38. This performs a full cut, forming the grooves 19 at each division line 6 of the package substrate 1. The thickness of the cutting edge of the cutting blade 41 is equal to or less than the width of the recesses 60.

[0038] In the dividing step, the cutting device 40 cuts the recesses 60 of the electrode portions 34 along the division lines 6 from the front surface 9 side with the cutting blade 41, thereby cutting the electrode portions 34 along the division lines 6 and dividing each electrode portion 34 and each recess 60 into two. As a result, the cutting device 40 cuts the package substrate 1 with the cutting blade 41 at the center in the width direction of the recesses 60 formed on each division line 6, dividing the package substrate 1 into individual package device chips 30. In this way, the package device chips 30 can be manufactured.

[0039] In the package substrate forming step (recess covering step), at least a portion of the recess 60 is covered with the mold resin 12. That is, with the lead frame 3 exposed on the front surface 9 side as shown in FIG. 6 , the mold resin 12 seals (covers) the recess 60 of the electrode portion 34 in addition to the device chip 8. As a result, even when the electrode portion 34 arranged along the division lines 6 is divided in the division step, the mold resin 12, which is the covering material, suppresses the generation of burrs. Therefore, by dividing the region RA including the recess 60 covered with the mold resin 12 along the division lines 6 in the division step, it is possible to manufacture the package device chip 30 while suppressing the generation of burrs when dividing the electrode portion 34. After the division step is completed, the removal step is performed.

[0040] (Removal step) As shown in FIG. 7 , the removing step involves spraying a high-pressure fluid onto the mold resin 12 covering the recess 60 to remove the mold resin 12 from the recess 60. In FIG. 7 , the mold resin 12 is an example of a coating material. When the mold resin 12 is divided by cutting in the dividing step, some of the mold resin 12 remains in the recess 60. For example, the mold resin 12 covering the recess 60, which exists in an area that comes into contact with the cutting blade 41, such as the center of the recess 60, is removed by the cutting blade 41. On the other hand, the mold resin 12 covering the recess 60, which exists in an area that does not come into contact with the cutting blade 41, such as the corners of the recess 60, is not cut by the cutting blade 41 and remains unremoved. If the mold resin 12 remains in the recess 60 without being removed, the remaining mold resin 12 may scatter in a subsequent process and cause contamination. Therefore, in the removal step of the first embodiment, a high-pressure water injection nozzle 26 is used to spray high-pressure fluid onto the remaining molding resin 12 covering the recess 60, thereby removing the molding resin 12, which is the covering material, from the recess 60.

[0041] The high-pressure water jet nozzle 26 is configured, for example, as a water jet nozzle used in a water jet saw, and is fixed to the cutting device 40 by a fixing part (not shown). This allows the high-pressure water jet nozzle 26 to move integrally with the cutting device 40. The high-pressure water jet nozzle 26 is an example of a fluid jet device. The high-pressure water jet nozzle 26 has a cylindrical shape extending vertically, and at its lower end is formed an injection port 27 that injects high-pressure water (hereinafter referred to as "high-pressure water 70") pressurized to a predetermined pressure or higher toward the package substrate 1. The high-pressure water 70 is an example of a fluid. The fluid may be a liquid other than high-pressure water, such as a solution, a mixed liquid, or a cleaning liquid. The fluid may also be a gas, such as air or gas, that is injected at high pressure.

[0042] The injection port 27 is connected to a flow path (not shown) formed inside the high-pressure water injection nozzle 26, and a high-pressure water supply source (not shown) is connected to the flow path via piping (not shown). The high-pressure water supply source supplies high-pressure water 70, the pressure of which has been increased by a compressor (not shown), to the high-pressure water injection nozzle 26. The pressure of the high-pressure water 70 injected from the high-pressure water injection nozzle 26 is preferably adjusted to a level that does not destroy the recess 60 of the package substrate 1.

[0043] The width dimension FA of the injection port 27 is larger than the width dimension FB of the recess 60, and has an outer diameter of, for example, 300 μm. When the width dimension FA of the injection port 27 is larger than the width dimension FB of the recess 60, the high-pressure water 70 can be injected only once onto the entire surface of the width dimension FB of the recess 60 to remove the adhering molding resin 12 without horizontally moving the first dicing tape 38 supporting the package device chip 30. This simplifies the processing steps and improves the processing speed. In the above-described embodiment, the high-pressure water 70 is injected only once, but this is not limited to this and the high-pressure water 70 may be injected two or more times.

[0044] In the removal step, high-pressure water 70 is sprayed onto the remaining mold resin 12 covering the recess 60 to remove the mold resin 12 from the recess 60, thereby removing the mold resin 12 remaining in the recess 60. This makes it possible to prevent the mold resin 12 remaining in the recess 60 from adhering to the inside of the processing device and becoming a cause of contamination.

[0045] The width dimension FA of the injection port 27 may be smaller than the width dimension FB of the recess 60. When the width dimension FA of the injection port 27 is smaller than the width dimension FB of the recess 60, the first dicing tape 38 supporting the package device chip 30 is moved horizontally to spray high-pressure water 70 over the entire width dimension FB of the recess 60, thereby removing the adhering molding resin 12. For example, the first dicing tape 38 may be moved horizontally to the left and right sides of the processing groove 19 and then sprayed twice. In the above-described embodiment, the high-pressure water 70 is sprayed twice, but this is not limited to this; it may be sprayed only once. This allows the injection port 27 to be made smaller, thereby increasing the flexibility of the processing device configuration. In the above-described embodiment, the first dicing tape 38 is moved horizontally, but this is not limited to this; the high-pressure water spray nozzle 26 may also be moved horizontally.

[0046] Furthermore, in the above-described embodiment, the cutting device 40 is provided with the cutting blade 41, but is not limited to this, and may be a laser or other device that can cut and separate the recess 60. This allows the present embodiment to be applied to various cutting devices 40, and increases the degree of freedom in the device configuration of the processing device.

[0047] In the first embodiment, the thickness of the cutting edge of the cutting blade 41 is equal to or less than the width of the recess 60, but this is not limited to this. For example, the thickness of the cutting edge of the cutting blade 41 may be approximately the same as the width of the recess 60. This allows the molding resin 12 covering the recess 60 to be removed at the same time when cutting with the cutting blade 41. This makes it possible to omit the removal step of spraying high-pressure fluid to remove the covering material including the molding resin 12 from the recess. As a result, the processing process can be simplified.

[0048] In the first embodiment, the device chip 8 and the electrode portion 34 are sealed with the mold resin 12, and the mold resin 12 flows into the recess 60 of the electrode portion 34 through the opening 61, covering at least a portion of the recess 60. As a result, a recess covering step is performed in which at least a portion of the recess 60 is covered with the mold resin 12. Therefore, in the first embodiment, the package substrate formation step is performed, thereby performing the recess covering step, and the device chip 8, the electrode portion 34, and the recess 60 can be collectively sealed with the mold resin 12, thereby shortening the work process. This improves work efficiency.

[0049] Furthermore, in the first embodiment, when filling the mold resin 12 in the package substrate producing step, the mold resin 12 can flow into the recess 60 through the opening 61. Therefore, since the mold resin 12 flows into the recess 60 through the opening 61, the device chip 8, the electrode portion 34, and the recess 60 can be collectively sealed with the mold resin 12, and the work process can be shortened. This improves the efficiency of the work.

[0050] Furthermore, in the first embodiment, in the package substrate forming step (recess covering step), the mold resin 12 seals (coats) the device chip 8 and the recesses 60 of the electrode portions 34. As a result, the recesses 60 of the electrode portions 34 are covered by the mold resin 12, and therefore, even when the electrode portions 34 arranged along the planned division lines 6 are divided in the division step, the mold resin 12 suppresses the generation of burrs. Therefore, in the division step, the package device chip 30 can be manufactured while suppressing the generation of burrs when dividing the electrode portions 34. Furthermore, in the removal step of the first embodiment, high-pressure water 70 is sprayed onto the remaining mold resin 12 covering the recesses 60 to remove the mold resin 12 from the recesses 60, thereby suppressing the mold resin 12 remaining in the recesses 60 from adhering to the inside of the processing device and causing contamination.

[0051] (Second embodiment) Next, a method for manufacturing a packaged device chip according to the second embodiment will be described with reference to the accompanying drawings. Note that components common to the first embodiment will be given the same reference numerals and descriptions thereof may be omitted. Fig. 8 is a diagram schematically showing a first dividing step of the second embodiment. Fig. 9 is a diagram schematically showing a removing step of the second embodiment. Fig. 10 is a diagram schematically showing a second dividing step of the second embodiment.

[0052] In the second embodiment, the packaged device chip 30 separated from the package substrate 1 has a side length of approximately 1 mm × 1 mm, i.e., it is a small chip. When the chip size is small, if the covering material is removed from the recess 60 by spraying a high-pressure fluid in the removing step of the first embodiment, the packaged device chip 30 may be scattered by the pressure of the spray. Therefore, in the method for manufacturing a packaged device chip in the second embodiment, the same processes as in the first embodiment are performed up to the device stacking step, package substrate forming step, and recess covering step. The dividing step in the second embodiment then includes a first dividing step (first processing step) for forming a first groove 191 from the second surface side that is deep enough not to divide the package substrate 1, and a second dividing step (second processing step) for forming a second groove 192 that communicates with the first groove 191 and divides the package substrate 1. The removing step in the second embodiment is performed between the first dividing step and the second dividing step. The first dividing step and the second dividing step are examples of dividing steps.

[0053] (First division step) 8 , the first dividing step is a step of forming a first processing groove 191 of a depth that does not divide the package substrate 1 from the second surface 15 side of the lead frame 3. The depth that does not divide the package substrate 1 from the second surface 15 side refers to the thickness dimension of the package substrate 1, i.e., a depth that penetrates the electrode portions 34 but does not penetrate the molded resin 12.

[0054] First, the front surface 9 and back surface 10 of the package substrate 1 are turned upside down, and then the back surface 10 side of the package substrate 1, i.e., the mold resin 12, is held by the first dicing tape 38. In the first dividing step, the back surface 10 side of the package substrate 1, i.e., the mold resin 12, may be suction-held on the holding surface of a chuck table (not shown).

[0055] In the first dividing step of the second embodiment, a half cut is performed by cutting from the second surface 15 side of the lead frame 3 where the recesses 60 are formed, i.e., from the front surface 9 side of the package substrate 1, using the cutting blade 41 of the cutting device 40, to form a first cutting groove 191. In the first dividing step, the cutting device 40 cuts the recesses 60 in the electrode portions 34 along the planned dividing lines 6 from the second surface 15 side with the cutting blade 41, thereby cutting the electrode portions 34 along the planned dividing lines 6 and dividing each electrode portion 34 and each recess 60 into two.

[0056] In the first division step, the cutting device 40 moves the first dicing tape 38 and the cutting blade 41 relative to each other along the division lines 6, and as shown in FIG. 8 , the cutting edge of the cutting blade 41 cuts into the center of the width of the recess 60 to a depth that penetrates the electrode portion 34 but does not penetrate the molded resin 12, thereby forming a first groove 191 by half-cutting along each division line 6 of the package substrate 1. That is, in the first division step, the first groove 191 is formed by half-cutting to a depth that penetrates the electrode portion 34 but does not penetrate the molded resin 12. Therefore, after the first division step is performed, the two divided electrode portions 34 and recesses 60 remain connected at the back surface 10 (lower surface) of the molded resin 12. After the first division step is completed, the removal step is performed.

[0057] (Removal step) As shown in Fig. 9, the removal step is a step of spraying high-pressure water 70 onto the molding resin 12 covering the recess 60 to remove the molding resin 12 from the recess 60. In Fig. 9, the molding resin 12 is an example of a coating material. The high-pressure water 70 is an example of a high-pressure fluid. In the removal step of the second embodiment, a high-pressure water spray nozzle 26 is used to spray the high-pressure fluid onto the remaining molding resin 12 covering the recess 60 to remove the molding resin 12, which is the coating material, from the recess 60.

[0058] The first processed grooves 191 formed in the first dividing step are formed deep enough to penetrate the electrode portions 34 but not the molded resin 12 by half-cutting, so that the back surface 10 (lower surface) of the molded resin 12 is connected. Therefore, even if high-pressure water 70 is sprayed onto the molded resin 12 covering the recessed portion 60 in the removing step, the two divided electrode portions 34 and the device chip 8 are connected to each other on the back surface 10 (lower surface) of the molded resin 12. Therefore, even when high-pressure water 70 is sprayed from the high-pressure water spray nozzle 26 to remove the molded resin 12 from the recessed portion 60, the packaged device chip 30 and the electrode portions 34 and device chip 8 constituting the packaged device chip 30 can be prevented from scattering due to the pressure of the spray. After the removing step is completed, the second dividing step is performed.

[0059] (Second division step) As shown in FIG. 10, the second dividing step is a step of forming second grooves 192 that communicate with the first grooves 191 and divide the package substrate 1.

[0060] First, the back surface 10 and front surface 9 of the package substrate 1 are turned upside down, and then the front surface 9 side of the package substrate 1, i.e., the lead frame 3 including the electrode portions 34 and supporting portions 7, is held by a second dicing tape 39. In the second dividing step, the front surface 9 side of the package substrate 1, i.e., the lead frame 3 including the electrode portions 34 and supporting portions 7, may be held by suction on the holding surface of a chuck table (not shown).

[0061] In the second dividing step of the second embodiment, a full cut is performed by cutting using the cutting blade 41 of the cutting device 40 from the side of the molded resin 12 where the recesses 60 are not formed, i.e., from the rear surface 10 side, to form a second processed groove 192. Specifically, the second dicing tape 39 and the cutting blade 41 are moved relative to each other along the first processed groove 191, and as shown in FIG. 10 , the cutting edge of the cutting blade 41 is positioned at the center of the width of the first processed groove 191 and cuts through the molded resin 12 to a depth that does not reach the electrode portions 34. This performs a full-cut cutting process, and forms the second processed grooves 192 at each of the division lines 6 of the package substrate 1. As a result, the molded resin 12 is cut along the division lines 6, and the divided electrode portions 34 and recesses 60 are separated from the molded resin 12.

[0062] A wettable flank can be used for the package device chip 30 of the second embodiment. The width of the second groove 192 formed in the second dividing step is larger than the width of the first groove 191 formed in the first dividing step, and the second groove 192 is cut to a depth that does not reach the electrode portion 34. Therefore, by increasing the width of the second groove 192, it is possible to easily check whether the electrode portion 34 has been soldered accurately and to prevent burrs from being generated by cutting the electrode portion 34 again.

[0063] In the second dividing step, first, the back surface 10 and the front surface 9 of the package substrate 1 are turned upside down and held by the second dicing tape 39, but this is not a limitation, and the back surface 10 and the front surface 9 of the package substrate 1 do not have to be turned upside down. This can shorten the work process, and improve the efficiency of the work.

[0064] (Third embodiment) Next, a method for manufacturing a package device chip according to the third embodiment will be described with reference to the accompanying drawings. Note that components common to the first embodiment will be given the same reference numerals and descriptions thereof may be omitted. Fig. 11 is a diagram schematically showing a package substrate generating step according to the third embodiment. Fig. 12 is a diagram schematically showing a recess covering step according to the third embodiment. Fig. 13 is a diagram showing a variation of the recess covering step according to the third embodiment.

[0065] In the first embodiment, the mold resin 12 is used as the covering material, but in the third embodiment, a covering material 71 other than the mold resin 12 is used as the covering material that covers at least a part of the recess 60.

[0066] (Package substrate formation step) As shown in FIGS. 11 and 12, the recess covering step of the third embodiment is performed after the package substrate forming step and separately from the package substrate forming step.

[0067] The package substrate creating step is performed after the device chip 8 is placed on the support portion 7 in the device stacking step. The package substrate creating step is a step in which the lead frame 3 including the device chip 8 and the electrode portion 34 placed (stacked) on the support portion 7 is covered with a mold (not shown) and molding resin 12 is poured into the mold, thereby sealing the lead frame 3 on which the device chip 8 is stacked with the molding resin 12. As a result, the device chip 8, the wires 18, and the electrode portion 34 are sealed with the molding resin 12, and the package substrate 1 is formed. In the third embodiment, the recesses 60 of the electrode portion 34 are not covered with the molding resin 12.

[0068] In this way, in the package substrate producing step, molding resin 12 is injected into the mold, and thus device chip 8 arranged so as to be electrically connected to electrode portions 34 of lead frame 3 and electrode portions 34 are sealed with molding resin 12, thereby forming a package substrate. After completion of the package substrate forming step, a recess covering step is carried out.

[0069] (recess covering step) 12(1), in the recess covering step, the entire surface 9 of the package substrate 1, including at least a portion of the recess 60, is covered with any coating material 71 other than the mold resin 12. The method for covering with the coating material 71 can be any of a spray coating method, a transfer method in a reduced pressure space, and a vacuum degassing method. The coating material 71 can be a liquid, powder, or atomized resin material.

[0070] The spray coating method is a method of spraying a liquid resin coating material 71 onto the recess 60, as shown in FIG. 12(1). By using the spray coating method, at least a portion of the recess 60 can be uniformly and quickly coated with the coating material 71. The spray coating method can easily coat recessed areas such as the recess 60. Coating with the coating material 71 by the spray coating method can be performed using a known spraying device such as a spray gun or airbrush. After coating the entire surface 9 of the package substrate 1 with the liquid resin coating material 71 by the spray coating method, the entire surface 9 of the package substrate 1 can be ground as shown in FIG. 12(2) so that only the recess 60 is covered with the coating material 71.

[0071] In the transfer method in a reduced pressure space, as shown in FIG. 12(1), the package substrate 1 is placed in a reduced pressure space. The coating material 71 is poured into a mold (not shown) prepared in advance, and then the mold is used to transfer the coating material 71 to the recess 60. During the transfer process, the coating material 71 is pressed into the recess 60 under reduced pressure, minimizing the generation of air bubbles in the coating material 71 and allowing the recess 60 to be smoothly and uniformly coated with the coating material 71. After the liquid resin coating material 71 is applied to the entire surface 9 of the package substrate 1 using the transfer method in a reduced pressure space, the entire surface 9 of the package substrate 1 can be ground as shown in FIG. 12(2), leaving only the recess 60 covered with the coating material 71.

[0072] In the vacuum degassing method, as shown in FIG. 12(1), a coating material 71 is applied to the recess 60. Immediately after application, the coating material 71 is not yet hardened. Next, the package substrate 1 including the recess 60 to which the coating material 71 has been applied is placed in a vacuum chamber (not shown). The air in the chamber is reduced in pressure to create a vacuum inside the chamber. During the vacuum process, air bubbles inside the coating material 71 are released into the chamber. As a result, the coating material 71 is degassed, and the recess 60 can be coated with a uniform, bubble-free, and dense coating layer. After the liquid resin coating material 71 is applied to the entire surface 9 of the package substrate 1 using the vacuum degassing method, the entire surface 9 of the package substrate 1 can be ground as shown in FIG. 12(2), leaving only the recess 60 covered with the coating material 71.

[0073] As shown in FIG. 13, in the recess covering step of the third embodiment, at least a part of the recess 60 may be covered with an arbitrary covering material 71 other than the molding resin 12 .

[0074] 13(1), the entire recess 60 may be filled and covered with the covering material 71. This makes it possible to reliably prevent burrs from occurring in the package substrate 1 having the recess 60.

[0075] 13(2), only the surface 601 of the recess 60 may be covered with the covering material 71. This makes it possible to suppress the occurrence of burrs in the package substrate 1 having the recess 60, and also to reduce the amount of covering material 71 used, thereby reducing processing costs.

[0076] 13(3), the width EB of the bottom surface 602 of the recess 60 that is covered by the covering material 71 may be equal to or greater than the width EA that is cut by the cutting blade 41 of the cutting device 40. This makes it possible to prevent burrs from occurring in the package substrate 1 that has the recess 60, minimize the amount of covering material 71 used, and reduce processing costs.

[0077] The embodiments of the present invention are not limited to the above-described embodiments and modifications, and may be variously changed, substituted, or modified without departing from the spirit of the technical idea of ​​the present invention. Furthermore, if the technical idea of ​​the present invention can be realized in a different way due to technological advances or other derived technologies, it may be implemented using that method. Therefore, the claims cover all embodiments that may fall within the scope of the technical idea of ​​the present invention. [Industrial Applicability]

[0078] As described above, the above-described method for manufacturing a packaged device chip can suppress the generation of burrs in a package substrate having a recess, and is therefore useful for package substrates having a recess, and is very useful in any processing apparatus for manufacturing packaged device chips. [Explanation of symbols]

[0079] 1: package substrate, 3: lead frame, 6: planned division line, 7: support part, 8: device chip, 9: front surface, 10: back surface, 12: mold resin, 30: packaged device chip, 34: electrode portion, 60: recess, 61: opening, 71: Covering material, 191: First machining groove, 192: Second machining groove, RA: Area

Claims

1. A manufacturing method for manufacturing packaged device chips by dividing a package substrate along a planned dividing line, in which a device chip mounted on a lead frame is sealed with a molding resin, the method comprising: The lead frame comprises: a plurality of support portions that support the device chip on the first surface side; a plurality of electrode portions formed outside the support portion; The electrode portion is an opening on a second surface side of the lead frame opposite to the first surface side; a recess formed in an area overlapping the planned dividing line, the device chip disposed on the support and the electrode portion are sealed with the molding resin; a package substrate forming step of forming the package substrate; a recess coating step of coating at least a portion of the recess with a coating material; Dividing the region including the recess covered with the covering material along the planned division line; a dividing step to produce the packaged device chips; a removing step of spraying a high-pressure fluid onto the coating material coated on the recessed portion to remove the coating material from the recessed portion; A method for manufacturing a packaged device chip, comprising:

2. The electrode portion is the second surface communicates with the recess and opens to one of the side surfaces of the electrode portion; an opening that does not divide the electrode portion; The recess covering step includes: In the package substrate forming step, The molding resin is poured into the recess through the opening.

2. The method for manufacturing a packaged device chip according to claim 1.

3. The division step comprises: a first dividing step of forming a first groove from the second surface side to a depth that does not divide the package substrate; a second dividing step of forming a second groove communicating with the first groove and dividing the package substrate; The removing step is carried out between the first dividing step and the second dividing step.

2. The method for manufacturing a packaged device chip according to claim 1.

Images