Semiconductor chip inclination cleaning method

Abstract

To provide a semiconductor chip inclination cleaning method which improves a cleaning effect, reduces a risk of contaminant residue, realizes waste reduction and cost reduction, and has high adaptability.SOLUTION: A method comprises: a step 1 of inclining a jig downwards to one side in a conveyor belt conveying direction; a step 2 of setting at least two nozzles and aiming chip gaps in a clean area; a step 3 of cleaning the gap of the nozzles along the array direction of the chips; a step 4 of, after cleaning is completed, ending cleaning if there is no adjacent clean area and synchronously moving the nozzles if there is an adjacent clean area and aiming the chip gaps in the area; a step 5 of repeating the steps 2 and 3 and continuing until all chip gaps are cleaned; and a step 6 of returning the jig to a horizontal state, then inclining the jig downward in a direction opposite to the conveyor belt conveying direction, and repeating the steps 2 to 5 to clean all chip gaps again. The nozzle used is a fluid nozzle.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to the field of semiconductor technology, and more particularly to a semiconductor chip tilt cleaning method that is applied to a transport device and cleans the chips when they are transferred from one process to another. [Background technology]

[0002] Cleaning semiconductor chips is a crucial step in microelectronics manufacturing. As semiconductor technology advances, particularly as integrated circuit (IC) linewidths continue to shrink, the demand for cleanliness on chip surfaces is becoming increasingly stringent. Even minute contaminants can degrade chip performance and cause product defects. Therefore, the development of effective, reliable, and economical cleaning technologies is an important research topic in the semiconductor manufacturing industry.

[0003] Conventional wet cleaning methods use various chemical solvents and water to clean chips and remove various impurities, but they place a heavy burden on the environment due to the large amount of chemical solvents used. Furthermore, they lack precision when cleaning ultra-fine structures, and are unable to completely remove particles and contaminants, resulting in chip damage and reduced performance.

[0004] Plasma cleaning, a type of dry cleaning, removes surface contaminants using activated species generated by plasma. While it has a smaller environmental impact than wet cleaning, it can damage the chip surface and its removal effectiveness is limited, especially when contaminants are firmly attached.

[0005] Rotary cleaning uses centrifugal force to remove chemicals from the chip, but the cleaning effect is uneven across the chip, and the centrifugal force is particularly weak near the center of the chip, resulting in insufficient cleaning. Effective cleaning also requires high-speed rotation, which increases chemical splashing, prolongs cleaning times, and increases consumable costs. Summary of the Invention [Problem to be solved by the invention]

[0006] In light of the above, the present invention provides a semiconductor chip tilted cleaning method that tilts the jig and substrate during the cleaning process to effectively clean the gap between the chip and the substrate, thereby improving cleaning efficiency and effectiveness, and aims to overcome the limitations of prior art high-precision chip cleaning and provide a more efficient and comprehensive cleaning solution for the semiconductor manufacturing industry. [Means for solving the problem]

[0007] To solve the above problems and achieve the object of the present invention, the following technical solution is provided. A tilted semiconductor chip cleaning method is used to clean objects transported by a jig on a conveyor belt. The jig has at least one clean area, and the objects include at least one substrate and at least one chip. The objects are placed in the clean area, with a gap between the chip and the substrate. The method includes the following steps: Step 1: tilt the jig downward toward one side of the conveyor belt transport direction. Step 2: set at least two nozzles and aim them at chip gaps within the clean area. Step 3: synchronously move the nozzles along the chip arrangement direction to clean the gaps. Step 4: after cleaning the chip gaps, if there are no adjacent clean areas, cleaning ends; if there are adjacent areas, move the nozzles synchronously and aim at the chip gaps in those areas. Step 5: repeat Steps 2 and 3 to clean all chip gaps. Step 6: after Step 5 is completed, return the jig to a horizontal position, tilt the jig downward toward the opposite side of the conveyor belt transport direction, and repeat Steps 2 to 5 to clean all chip gaps again. The nozzle used in each step is a fluid nozzle.

[0008] In the above technical means, the jig tilt angle in the step 1 and step 6 is 20 to 70 degrees.

[0009] In the above technical solution, the number of cleaning cycles in step 3 is either a single unidirectional cleaning cycle or multiple reciprocating cleaning cycles.

[0010] In the above technical means, the nozzle pressure is 5-125 kgf / cm 2 is.

[0011] In the above technical means, the nozzle can be adjusted to tilt in the direction of the gap, and the angle is 20 to 90 degrees.

[0012] In the above technical means, the nozzle is detachable and can be easily replaced or adjusted.

[0013] In the above technical means, the chip is positioned on the substrate by flux. [Effects of the Invention]

[0014] The technical solution of the present invention can achieve the following effects:

[0015] First, by tilting the fixture in steps 1 and 6, the cleaning solution can be effectively guided into the narrow gap between the chip and the substrate, ensuring uniform and thorough cleaning of the entire cleaning area, improving the cleaning effect.

[0016] Second, the use of fluid nozzles allows for uniform distribution of cleaning fluid, improving cleaning uniformity, penetration and quality, especially in narrow gaps, and reducing the risk of residual contaminants.

[0017] Third, tilting the fixture reduces the amount of cleaning fluid and consumables used, resulting in less waste and lower costs.

[0018] Fourth, this method is applicable to chips of various sizes and types, has high adaptability, and can be widely applied to various semiconductor manufacturing processes. [Brief explanation of the drawings]

[0019] [Figure 1] FIG. [Figure 2] FIG. 1 is a flow diagram of the present invention. [Figure 3] FIG. 10 shows a single row of chips in a clean area according to the present invention. [Figure 4] 10A and 10B are diagrams showing the operation when the jig is tilted and a single row of chips is washed in the present invention. [Figure 5] 10A and 10B are diagrams showing the operation when the jig is tilted and a single row of chips is washed in the present invention. [Figure 6] 10A and 10B are diagrams showing the operation when the jig is tilted and multiple rows of chips are washed in the present invention. [Figure 7] 10A and 10B are diagrams showing the operation when the jig is tilted and multiple rows of chips are washed in the present invention. [Figure 8] FIG. 10 is a diagram showing multiple rows of chips in a clean area according to the present invention. [Figure 9] 10A to 10C are diagrams illustrating the operation of nozzle angle adjustment in the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0020] The present invention will be described in more detail below with reference to specific examples and accompanying drawings.

[0021] As shown in Figures 1 to 7, the tilted semiconductor chip cleaning method of the present invention is for cleaning objects (30) transported by a jig (20) on a conveyor belt (10). The jig (20) has at least one clean area (60). The objects (30) include at least one substrate (301) and at least one chip (302). The objects (30) are placed in the clean area (60), with a gap (303) formed between the chip (302) and the substrate (301). The method includes the following steps: Step 1 (1): tilting the jig (20) downward toward the conveyor belt (10) in the transport direction; Step 2 (2): setting at least two nozzles (40) and aiming them at the gaps (303) between the chips (302) in the clean area (60). Step 3 (3): The nozzle 40 is moved synchronously along the chip 302 arrangement direction to clean the gaps 302. Step 4 (4): After cleaning the gaps 303 between the chips 302, if there is no adjacent clean area 60, cleaning is terminated. If there is an adjacent clean area 60, the nozzle 40 is moved synchronously to aim at the gaps 303 between the chips 302 within that clean area 60. Step 5 (5): Steps 2 (2) and 3 (3) are repeated to clean all the gaps 303 between the chips 302. Step 6 (6): After completing step 5 (5), the jig 20 is returned to a horizontal position, tilted downward in the opposite direction to the conveyor belt 10 transport direction, and steps 2 (2) through 5 (5) are repeated to clean all the gaps 303 between the chips 302 again.

[0022] The nozzle (40) used in the steps is a fluid nozzle, and the inclination angle of the jig (20) in step 1 (1) and step 6 (6) is 20 to 70 degrees.

[0023] Here, by tilting the jig 20 in steps 1 (1) and 6 (6), the cleaning solution can be effectively guided into the narrow gap 303 between the chip 302 and the substrate 301, and the entire clean area 60 can be cleaned uniformly and thoroughly, improving the cleaning effect. In addition, tilting the jig 20 reduces the amount of cleaning solution and other consumables used, reducing waste and lowering costs.

[0024] Secondly, cleaning by the fluid nozzle (40) distributes the cleaning fluid evenly, especially in the narrow gaps (303) of the chip (302), improving the uniformity, penetration and quality of cleaning and reducing the risk of residual contaminants.

[0025] Furthermore, the tilted cleaning method for semiconductor chips of the present invention can be applied to chips (302) of different sizes and types, and therefore has high adaptability and can be widely applied to various semiconductor manufacturing processes.

[0026] Specifically, the cleaning process of the present invention involves first tilting the jig 20 toward the conveyor belt 10's conveying direction, then positioning at least two nozzles 40 to accurately aim at the gaps 303 between the chips 302 in the clean area 60 to thoroughly clean each gap 303. The nozzles 40 then move synchronously in the direction of the chip 302 arrangement to thoroughly clean the gaps 303 and remove dust and contaminants. After cleaning the clean area 60, the presence or absence of an adjacent clean area 60 is checked. If not, cleaning ends. If present, the nozzles 40 are moved synchronously to aim at the gaps 303 between the chips 302 in that clean area 60. Steps 2 (2) and 3 (3) are repeated until all gaps 303 between the chips 302 in the clean area 60 are thoroughly cleaned. Finally, after step five (5) is completed, the jig (20) is returned to a horizontal position, tilted in the opposite direction to the conveyor belt (10) conveying direction, and steps two (2) to five (5) are repeated to perform complete cleaning again.

[0027] The pressure of the nozzle (40) is 5-125 kgf / cm 2Within this range, the nozzle (40) exerts sufficient force to efficiently remove dirt from small gaps and hard-to-reach areas. The pressure can be adjusted according to the degree of contamination and the type of tip (302), with low pressure being selected for light contamination and high pressure being selected for stubborn contamination. 2 Keeping the pressure below 300 psi reduces the risk of damage to fragile or finely structured chips (302). Appropriate pressure allows the cleaning solution to be evenly distributed throughout all gaps (303) of the chip (302), improving cleaning uniformity and penetration even in narrow or irregular spaces.

[0028] The nozzle (40) is detachable and easily replaceable or adjustable, simplifying cleaning and maintenance of the nozzle (40) and ensuring high-efficiency operation. If the nozzle (40) fails, only the nozzle can be replaced instead of the entire system, reducing maintenance costs and downtime. Furthermore, the nozzle (40) can be quickly replaced with different types and sizes, flexibly adapting to various cleaning needs and tip (302) sizes, shapes, and materials, ensuring optimal cleaning conditions at all times.

[0029] The chip (302) is positioned on the substrate (301) by the flux (50). The use of the flux (50) increases the bonding strength between the chip (302) and the substrate (301), ensuring accurate positioning of the chip (302) during manufacturing and improving assembly precision. The flux (50) has excellent thermal conductivity, transferring heat evenly to each welding point during heating, preventing welding defects caused by uneven heat distribution. In addition, the chemical components of the flux (50) react with and dissolve oxides on the surface of the chip (302), reducing residue generation during the welding process and the need for subsequent cleaning, saving time and resources and improving production speed and efficiency.

[0030] As shown in Figures 4 to 7, the number of washes in step 3 (3) can be either a single unidirectional wash (see Figures 4 and 5) or multiple reciprocating washes (see Figures 6 and 7). Depending on the type of contaminant and the requirements of the tip (302), selecting unidirectional or reciprocating washes increases cleaning flexibility. Unidirectional washes are sufficient for light contamination, while reciprocating washes provide more thorough cleaning for stubborn contamination. Selecting the appropriate number of washes reduces the risk of damage to the tip (302) during the cleaning process and effectively reduces the possibility of tip (302) breakage.

[0031] As shown in Figure 8, the present invention can simultaneously clean multiple rows of chips 302 in a clean area 60. By moving multiple nozzles 40 along the direction of the chips 302, multiple chips 302 in the clean area 60 can be cleaned simultaneously, improving cleaning efficiency.

[0032] As shown in Figure 9, the nozzle (40) can be adjusted to an angle (a) of 20 to 90 degrees toward the gap (303). By adjusting the angle of the nozzle (40), the coverage area of ​​the cleaning liquid can be expanded and the contaminated area can be directly targeted for cleaning, thereby improving cleaning efficiency and shortening cleaning time, saving resources and reducing costs.

[0033] The above examples are merely illustrative of the present invention and are not intended to limit the scope of the present invention. Any equivalent changes or modifications made based on the structures, features and principles described in the claims of the present invention are included in the claims of the present invention. [Explanation of symbols]

[0034] 1 Step 1 2 Step 2 3 Step Three 4 Step Four 5 Step Five 6 Step Six 10 Conveyor Belt 20 Jig 30 Items to be washed 301 Substrate 302 chips 303 Gap 40 nozzles 50 Flux 60 Clean Area a angle

Claims

1. A method for cleaning an object (30) to be cleaned that is transported by a jig (20) arranged on a conveyor belt (10), comprising: The jig (20) comprises at least one clean area (60); The object to be cleaned (30) includes at least one substrate (301) and at least one chip (302); The object to be cleaned (30) is placed in the cleaning area (60), A gap (303) is formed between the chip (302) and the substrate (301), Step 1 (1) tilting the jig (20) downward to one side of the conveyor belt (10) conveying direction; Step two (2) of setting at least two nozzles (40) and aiming each at the gaps (303) between the tips (302) in the clean area (60); Step 3 (3) of synchronously moving the nozzle (40) along the arrangement direction of the chips (302) to clean the gap (303); After the cleaning of the gap (303) between the chips (302) is completed, if there is no adjacent clean area (60), the cleaning is terminated, and if there is an adjacent clean area (60), the nozzle (40) is synchronously moved to aim at the gap (303) between the chips (302) within the adjacent clean area (60), step 4 (4); Step 5 (5) repeats step 2 (2) and step 3 (3) to clean all the gaps (303) between the chips (302); and (6) a step of returning the jig (20) to a horizontal position after the completion of the step 5 (5), tilting the jig (20) downward in the opposite direction to the conveying direction of the conveyor belt (10), and repeating the steps 2 (2) to 5 (5) to clean all the gaps (303) between the chips (302), The tilted cleaning method for semiconductor chips is characterized in that the nozzle (40) used in each step is a fluid nozzle.

2. 2. The semiconductor chip tilted cleaning method according to claim 1, wherein the tilt angle of the jig (20) in the first step (1) and the sixth step (6) is 20 to 70 degrees.

3. 2. The method for tilted cleaning of semiconductor chips according to claim 1, wherein the number of cleaning cycles in step three (3) is either one single unidirectional cleaning or multiple reciprocating cleanings.

4. The pressure of the nozzle (40) is 5-125 kgf / cm ２ 2. The method for tilted cleaning of semiconductor chips according to claim 1, wherein:

5. The nozzle (40) is adjustable in inclination angle toward the gap (303), 5. The method for tilted cleaning of semiconductor chips according to claim 4, wherein the angle (a) of the nozzle (40) is 20 to 90 degrees.

6. 6. The tilted semiconductor chip cleaning method according to claim 5, wherein the nozzle (40) is detachable and can be easily replaced or adjusted.

7. 2. The tilted semiconductor chip cleaning method according to claim 1, wherein the chip (302) is positioned on the substrate (301) by a flux (50).

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