Ceiling structure

Abstract

To provide a ceiling structure capable of preventing the occurrence of condensation in plenum space of a ceiling.SOLUTION: A ceiling structure 1 comprises a membrane ceiling material 2 installed to form plenum space K between the material and a ceiling 101 of a building 100, and a heat insulating material 3 installed within the plenum space K, and moisture permeation resistance of the membrane ceiling material 2 is higher than the moisture permeation resistance of the heat insulating material 3. The moisture permeation resistance of the membrane ceiling material 2 is 0.03-0.1 m2 s Pa / ng, and the moisture permeation resistance of the heat insulating material 3 is 0.01-0.035 m2 s Pa / ng.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a ceiling structure. [Background technology]

[0002] For example, a ceiling structure using a lightweight and flexible sheet-like membrane ceiling material has been proposed (see, for example, Patent Documents 1 to 4 listed below).

[0003] In such a ceiling structure, a membrane ceiling material is suspended from the ceiling of the building via hanging fittings in a stretched state, thereby creating a pocket space between the ceiling of the building and the membrane ceiling material. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 61-257558 [Patent Document 2] Japanese Patent Application Laid-Open No. 2001-323630 [Patent Document 3] Japanese Patent Application Laid-Open No. 2002-115366 [Patent Document 4] Japanese Patent Application Laid-Open No. 2023-73490 Summary of the Invention [Problem to be solved by the invention]

[0005] The space between the ceiling of the building and the membrane ceiling material plays an important role in maintaining a comfortable indoor environment, for example, by providing heat insulation and sound insulation.

[0006] However, with this type of ceiling structure, indoor water vapor can seep into the recessed space, causing condensation on the ceiling surface. Condensation can lead to the growth of mold and dust mites, so measures to prevent condensation on the ceiling are necessary.

[0007] The present invention has been proposed in view of the above-mentioned conventional circumstances, and aims to provide a ceiling structure that makes it possible to prevent condensation from occurring in the pocket space of the ceiling. [Means for solving the problem]

[0008] In order to achieve the above object, the present invention provides the following means. [1] A membrane ceiling material installed with a space between it and the ceiling of the building; a heat insulating material installed in the pocket space, A ceiling structure characterized in that the moisture permeability resistance of the membrane ceiling material is higher than the moisture permeability resistance of the insulation material. [2] The moisture permeability resistance of the membrane ceiling material is 0.03 to 0.1 m 2 s·Pa / ng, The moisture permeability resistance of the heat insulating material is 0.01 to 0.035 m 2 The ceiling structure described in [1] above is characterized in that the value is s·Pa / ng. [3] The ceiling structure described in [1], characterized in that the insulation material is installed with a first space between it and the membrane ceiling material and a second space between it and the ceiling. [4] The ceiling structure described in [1], wherein the membrane ceiling material is installed in a suspended state from the ceiling. [Effects of the Invention]

[0009] As described above, according to the present invention, a ceiling structure is provided that makes it possible to prevent condensation from occurring in the pocket space of the ceiling. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a cross-sectional view showing the configuration of a ceiling structure according to one embodiment of the present invention. [Figure 2] FIG. 10 is a cross-sectional view showing another configuration of the ceiling structure. DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the drawings used in the following description, the dimensions of the components may be shown at different scales to make them easier to see, and the dimensional ratios of the components may not necessarily be the same as in reality.

[0012] As an embodiment of the present invention, a ceiling structure 1 shown in FIG. 1 will be described. FIG. 1 is a cross-sectional view showing the configuration of the ceiling structure 1.

[0013] As shown in Figure 1, the ceiling structure 1 of this embodiment comprises a membrane ceiling material 2 installed with a pocket space K between it and the ceiling 101 of the building 100, and an insulating material 3 installed within the pocket space K.

[0014] The membrane ceiling material 2 is made of a lightweight and flexible non-combustible sheet. The membrane ceiling material 2 is installed in a suspended state from the ceiling 101 via hanging fittings 200. Specifically, the membrane ceiling material 2 is attached in a stretched state to the frame surface of the lower frame 201. The lower frame 201 is suspended and supported at the tip (lower end) side of the hanging fittings 200.

[0015] As a result, a plurality of membrane ceiling materials 2 are installed side by side in a plane parallel to the ceiling 101 so as to separate the interior 102 of the building 100 while providing an open space K between them.

[0016] The heat insulating material 3 is made of a heat insulating board with excellent heat insulating properties. The heat insulating material 3 is installed with a first space K1 between it and the membrane ceiling material 2 and a second space K2 between it and the ceiling 101. Specifically, the heat insulating material 3 is attached to the frame surface of the upper frame 202 attached to the middle of the hanging hardware 200.

[0017] As a result, the insulation materials 3 are installed in a row in a plane parallel to the ceiling 101, facing the membrane ceiling material 2 across the first space K1 and facing the ceiling 101 across the second space K2.

[0018] Incidentally, the ceiling structure 1 of this embodiment makes it possible to prevent condensation from occurring in the pocket space K of the ceiling 101 by making the moisture permeation resistance of the membrane ceiling material 2 higher than the moisture permeation resistance of the insulation material 3.

[0019] Specifically, the moisture permeability resistance of the membrane ceiling material 2 is 0.03 m 2 s Pa / ng or more, and more preferably 0.032 m 2 s Pa / ng or more, and more preferably 0.035 m 2 ·s·Pa / ng or more.

[0020] The moisture permeability resistance of membrane ceiling material 2 is 0.03 m 2 If the moisture permeability resistance of the membrane ceiling material 2 is 0.1 m 2 If the density is less than 1 / s·Pa / ng, the thickness of the membrane ceiling material 2 can be reduced, and therefore the weight of the membrane ceiling material 2 can be reduced.

[0021] The moisture permeability resistance of insulation 3 is 0.01 m 2 s Pa / ng or more, and more preferably 0.015 m 2 s Pa / ng or more, and more preferably 0.02 m 2 ·s·Pa / ng or more.

[0022] The moisture permeability resistance of insulation 3 is 0.01 m 2 If the moisture permeability resistance of the heat insulating material 3 is 0.035 m 2 ·s·Pa / ng or less, high thermal insulation performance can be maintained.

[0023] As described above, in the ceiling structure 1 of this embodiment, by setting the moisture permeability resistance of the membrane ceiling material 2 higher than the moisture permeability resistance of the insulating material 3 within the above-mentioned range, the membrane ceiling material 2 can act as a primary barrier to effectively prevent moisture in the room 102 from penetrating into the pocket space K of the ceiling 101, thereby making it possible to prevent condensation from occurring in the pocket space K of the ceiling 101.

[0024] The present invention is not necessarily limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention.

[0025] Specifically, the ceiling structure 1 is not limited to the configuration shown in Fig. 1 above, and may be configured as shown in Fig. 2, for example. In the configuration shown in Fig. 2, the heat insulating material 3 is attached to the frame surface of an upper frame 202 attached to the ceiling 101. Also, a wood wool cement board 203 is provided on the underside of the ceiling 101, and the upper frame 202 is attached to this wood wool cement board 203. Furthermore, the hanging hardware 200 is attached in a state where it is suspended from the upper frame 202. As a result, the heat insulating materials 3 are installed side by side in a plane parallel to the ceiling 101, facing the membrane ceiling material 2 across the first space K1 and facing the ceiling 101 across the second space K2. [Example]

[0026] The effects of the present invention will be made clearer by the following examples. Note that the present invention is not limited to the following examples and can be practiced with appropriate modifications within the scope of the present invention.

[0027] In this example, the ceiling structures of Examples 1 and 2 and Comparative Example 1 below were tested for the occurrence of condensation.

[0028] Example 1 In the ceiling structure of Example 1, a heat insulating material and a membrane ceiling material were installed in order from the ceiling side of the building, with a space between them. The membrane ceiling material had a thickness of 0.4 mm and a moisture permeability resistance of 0.035 m. 2 The insulation material used was a resin-coated glass cloth with a thickness of 25 mm, a thermal conductivity of 0.019 W (m K), and a moisture permeability resistance of 0.025 m 2 ·s·Pa / ng phenolic foam was used. The thickness of the space between the insulation material and the membrane ceiling material is 20 mm or more.

[0029] The moisture permeability resistance of the membrane ceiling material and the heat insulating material is a value measured in accordance with "JIS A 1324 (Method for measuring moisture permeability of building materials) 5.2 Cup Method." The thermal conductivity of the heat insulating material is a value measured in accordance with the test method of "JIS A 9521."

[0030] Example 2 In the ceiling structure of Example 2, a heat insulating material and a membrane ceiling material were installed in order from the ceiling side of the building, with a space between them. The membrane ceiling material had a thickness of 0.4 mm and a moisture permeability resistance of 0.035 m. 2 The insulation material used was a resin-coated glass cloth with a thickness of 25 mm, a thermal conductivity of 0.028 W (m K), and a moisture permeability resistance of 0.018 m 2 The thickness of the space between the insulation and the membrane ceiling is 20 mm or more.

[0031] (Comparative Example 1) In the ceiling structure of Comparative Example 1, the insulation material and the ceiling board were installed in order from the ceiling side of the building, with a space between them. 2 The insulation material used was a gypsum board with a thickness of 25 mm, a thermal conductivity of 0.019 W (m K), and a moisture permeability resistance of 0.025 m 2 ·s·Pa / ng phenolic foam was used. The thickness of the space between the insulation material and the membrane ceiling material is 20 mm or more.

[0032] The ceiling structures of Examples 1 and 2 and Comparative Example 1 were measured for the presence or absence of condensation under first test conditions of an indoor temperature of 25°C, an indoor humidity of 70%, an outdoor temperature of -15°C, and an outdoor humidity of 60%, and second test conditions of an indoor temperature of 25°C, an indoor humidity of 90%, an outdoor temperature of 5°C, and an outdoor humidity of 60%. The results are summarized in Table 1 below.

[0033] [Table 1]

[0034] As shown in Table 1, in the ceiling structures of Examples 1 and 2, no condensation occurred under either the first or second test conditions. In contrast, in the ceiling structure of Comparative Example 1, condensation occurred in the space between the ceiling and the insulation under the first test condition, and in the space between the ceiling board and the insulation under the second test condition.

[0035] As described above, in the ceiling structures of Examples 1 and 2 that satisfy the conditions of the present invention, it is possible to prevent condensation from occurring in the pocket space of the ceiling by setting the moisture permeability resistance of the membrane ceiling material higher than the moisture permeability resistance of the insulation material. [Explanation of symbols]

[0036] 1...Ceiling structure 2...Membrane ceiling material 3...Insulation material 100...Building 101...Ceiling 102...Indoor space 200...Hanging hardware 201...Lower frame 202...Upper frame 203...Wood cement board K...Neck space K1...First space K2...Second space

Claims

1. A membrane ceiling material is installed with a space between it and the ceiling of the building; a heat insulating material installed in the pocket space, A ceiling structure characterized in that the moisture permeability resistance of the membrane ceiling material is higher than the moisture permeability resistance of the insulation material.

2. The moisture permeability resistance of the membrane ceiling material is 0.03 to 0.1 m ２ s Pa / ng, The moisture permeability resistance of the heat insulating material is 0.01 to 0.035 m ２ 2. The ceiling structure according to claim 1, characterized in that the coefficient of friction is s. Pa / ng.

3. 2. The ceiling structure according to claim 1, wherein the heat insulating material is installed with a first space between it and the membrane ceiling material and a second space between it and the ceiling.

4. 2. The ceiling structure according to claim 1, wherein the membrane ceiling material is installed in a suspended state from the ceiling.

Images