LED bracket, light-emitting unit, and light-emitting assembly

Abstract

To provide an LED bracket, a light-emitting unit, and a light-emitting assembly to solve the problem that an LED bracket has low strength and is easily broken when subjected to external force.SOLUTION: The present invention relates to an LED bracket, a light-emitting unit, and a light-emitting assembly, and the substrate of an LED bracket includes a substrate body and a support portion 14 extending from the substrate body to within a side wall of a bowl-shaped cup of the LED bracket, and the support portion extends within the side wall of the bowl-shaped cup from one conductive region of the LED bracket to the other conductive region, and also extends to a side wall region corresponding to the side wall of an insulating region 13 that insulates and isolates at least the two conductive regions.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present application relates to the field of LEDs (Light Emitting Diodes, LED chips), and in particular to LED brackets, light emitting units and light emitting assemblies. [Background technology]

[0002] Chip LEDs are widely used in fields such as lighting, decoration, backlighting, and displays. A chip LED includes an LED bracket and an LED chip mounted on the LED bracket. Conventional chip LED brackets typically include a substrate and a package mounted on the substrate, with a bowl-shaped cup formed in the package to accommodate the LED chip. However, the sidewalls of the bowl-shaped cup in conventional LED brackets have low strength and are therefore prone to breakage when subjected to external forces, such as distortion of the plate material.

[0003] Therefore, how to improve the strength of LED brackets is currently a technical problem that needs to be solved urgently. Summary of the Invention [Problem to be solved by the invention]

[0004] In view of the above-mentioned deficiencies of the prior art, the present application aims to provide an LED bracket, a light emitting unit and a light emitting assembly to solve the problem that the LED bracket in the related art has low strength and is easily broken when subjected to external force. [Means for solving the problem]

[0005] The present application provides an LED bracket including a package and a substrate, a portion of which is covered by the package, wherein a bowl-shaped cup is formed in the package, a portion of the substrate is within the bowl-shaped cup as a bottom of the bowl-shaped cup, the substrate includes two conductive regions within the bowl-shaped cup, and an insulating region is provided between the two conductive regions to insulate and isolate them, The LED bracket, wherein the substrate includes a substrate body and a support portion extending from the substrate body to within a side wall of the bowl-shaped cup, the support portion extending within the side wall from one of the conductive regions to the other of the conductive regions and extending to at least a side wall region corresponding to the side wall of the insulating region.

[0006] Based on the same inventive concept, the present application provides a light-emitting unit including an LED chip and the above-mentioned LED bracket, wherein the LED chip is disposed at the bottom of the bowl-shaped cup, and the positive and negative electrodes of the LED chip are electrically connected to the two conductive regions, respectively; The light emitting unit further includes a package layer disposed within the bowl-shaped cup.

[0007] Based on the same inventive concept, the present application further provides a light emitting assembly including a circuit board and a light emitting unit as described above, wherein the light emitting unit is mounted on the circuit board and electrically connected to the circuit board. [Effects of the Invention]

[0008] The present application provides an LED bracket, a light-emitting unit, and a light-emitting assembly, in which the substrate of the LED bracket includes a substrate body and a support portion extending from the substrate body into a side wall of a bowl-shaped cup of the LED bracket, the support portion improving the strength of the side wall of the bowl-shaped cup and thereby improving the overall strength of the LED bracket. The support portion extends within the side wall of the bowl-shaped cup from one conductive region of the LED bracket to the other conductive region, and also extends to at least a side wall region corresponding to a side wall of an insulating region that insulates and isolates the two conductive regions. That is, the support portion extends to a region between the two regions projected onto the side wall of the bowl-shaped cup of the two conductive regions. This region is the weakest region of the LED bracket, and extending the support portion to this region further improves the strength of the LED bracket, particularly by effectively reinforcing the weakest portion of the LED bracket, thereby minimizing the occurrence of the LED bracket breaking under external force. The lighting unit and lighting assembly provided by the present application employs a stronger LED bracket, which can improve the overall strength and reliability of the lighting unit and lighting assembly. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a top view of an LED bracket provided by Example 1 of the present application. [Figure 2] 2 is a top view 2 of an LED bracket provided by Example 1 of the present application. [Figure 3] 3 is a top view 3 of an LED bracket provided by Example 1 of the present application. [Figure 4] 4 is a top view 4 of an LED bracket provided by Example 1 of the present application. [Figure 5] 5 is a cross-sectional view of the LED bracket taken along line AA in FIG. 4. [Figure 6] 5 is a top view 5 of an LED bracket provided by Example 1 of the present application. [Figure 7]FIG. 1 is a structural diagram of an LED bracket provided by Example 2 of the present application. [Figure 8] FIG. 2 is a structural diagram 2 of an LED bracket provided by Example 2 of the present application. [Figure 9] FIG. 3 is a structural diagram of an LED bracket provided by Example 2 of the present application. [Figure 10] 1 is a structural diagram of a first groove provided in Example 2 of the present application; [Figure 11] 2 is a second structural view of the first groove provided in the second embodiment of the present invention; [Figure 12] 3 is a configuration diagram of the first groove provided in the second embodiment of the present invention; [Figure 13] FIG. 4 is a structural diagram of an LED bracket provided by Example 2 of the present application. [Figure 14] FIG. 5 is a structural diagram of an LED bracket provided by Example 2 of the present application. [Figure 15] FIG. 2 is a structural diagram of a light-emitting assembly provided in Example 2 of the present application. [Figure 16] FIG. 1 is a structural diagram of an LED bracket provided by Example 3 of the present application. [Figure 17] FIG. 2 is a structural diagram of an LED bracket provided by Example 3 of the present application. [Figure 18] 3 is a structural diagram of an LED bracket provided by Example 3 of the present application. [Figure 19] FIG. 4 is a structural diagram of an LED bracket provided by Example 3 of the present application. [Figure 20] 5 is a structural diagram of an LED bracket provided by Example 3 of the present application. [Figure 21] FIG. 1 is a structural diagram of a light-emitting unit provided by Example 3 of the present application. [Figure 22] FIG. 1 is a structural diagram of a substrate of an LED bracket provided in Example 4 of the present application. [Figure 23] FIG. 2 is a structural diagram of the substrate of the LED bracket provided in Example 4 of the present application. [Figure 24]FIG. 3 is a structural diagram of the substrate of the LED bracket provided in Example 4 of the present application. [Figure 25] FIG. 1 is a structural diagram of a light-emitting unit provided by Example 4 of the present application. [Figure 26] FIG. 1 is a structural diagram of an LED bracket provided by Example 5 of the present application. [Figure 27] FIG. 2 is a structural diagram of an LED bracket provided by Example 5 of the present application. [Figure 28] FIG. 3 is a structural diagram of an LED bracket provided by Example 5 of the present application. [Figure 29] 1 is a top view of an LED bracket provided by Example 5 of the present application. FIG. [Figure 30] 2 is a top view of an LED bracket provided by Example 5 of the present application. [Figure 31] 3 is a top view of an LED bracket provided by Example 5 of the present application. [Figure 32] FIG. 4 is a structural diagram of an LED bracket provided by Example 5 of the present application. [Figure 33] FIG. 1 is a structural diagram of a light-emitting unit provided by Example 5 of the present application. [Figure 34] 1 is a schematic diagram 1 of a conventional normalized spectrogram provided by Example 6 of the present application. [Figure 35] 2 is a schematic diagram 2 of a conventional normalized spectrogram provided by Example 6 of the present application. [Figure 36] 1 is a structural diagram of a light-emitting unit provided by Example 6 of the present application. [Figure 37] FIG. 37 is a top view of the light-emitting unit in FIG. 36. [Figure 38] 1 is a schematic diagram of a normalized spectrogram after improvement provided by Example 6 of the present application. [Figure 39] 2 is a structural diagram of a light-emitting unit provided by Example 6 of the present application. [Figure 40] FIG. 40 is a top view of the light-emitting unit in FIG. 39. [Figure 41]Normalized spectrogram 2 after the improvement provided by Example 6 of the present application. [Figure 42] 1 is a structural diagram of a light-emitting unit provided by Example 7 of the present application. [Figure 43] 2 is a structural diagram of a light-emitting unit provided by Example 7 of the present application. [Figure 44] 3 is a diagram showing the structure of a light-emitting unit provided by Example 7 of the present application. [Figure 45] 4 is a diagram showing the structure of a light-emitting unit provided by Example 7 of the present application. [Figure 46] 5 is a structural diagram of a light-emitting unit provided by Example 7 of the present application. [Figure 47] FIG. 10 is a diagram illustrating the configuration of a zigzag structure on the top surface of an LED bracket provided in Example 7 of the present application. [Figure 48] 6 is a diagram showing the configuration of a light-emitting unit provided by Example 7 of the present application. [Figure 49] 1 is a diagram showing the configuration of a circuit board provided by Example 8 of the present application. [Figure 50] FIG. 10 is a top view of a circuit board provided in accordance with Example 8 of the present application. [Figure 51] FIG. 1 is a structural diagram of a light-emitting assembly provided by Example 8 of the present application. [Figure 52] FIG. 10 is a schematic diagram of an electronic device provided by Example 8 of the present application in a bent state. [Figure 53] FIG. 10 is a configuration diagram of an electronic device provided by Example 8 of the present application. [Figure 54] 2 is a diagram showing the configuration of a circuit board provided by Example 9 of the present application. [Figure 55] 1 is a diagram illustrating the configuration of a light-emitting assembly provided by Example 9 of the present application. [Figure 56] 2 is a diagram illustrating the configuration of a light-emitting assembly provided by Example 9 of the present application. [Figure 57] 3 is a diagram illustrating the configuration of a light-emitting assembly provided by Example 9 of the present application. [Figure 58] 4 is a configuration diagram of a light-emitting assembly provided by Example 9 of the present application. [Figure 59] 5 is a diagram illustrating the configuration of a light-emitting assembly provided by Example 9 of the present application. [Figure 60] FIG. 10 is a diagram illustrating the configuration of a heat dissipation rib provided in Example 9 of the present application. DETAILED DESCRIPTION OF THE INVENTION

[0010] To facilitate understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. The drawings illustrate preferred embodiments of the present application. However, the present application is not limited to the embodiments set forth herein, and may be embodied in various forms. On the contrary, these embodiments are provided to provide a more complete understanding of the subject matter disclosed herein.

[0011] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0012] It should be noted that terms such as "first," "second," etc. in the specification, claims, and drawings of this application are used to distinguish between similar objects and are not necessarily used to describe a particular order or priority. It should be understood that numerals used in this manner may be interchanged where appropriate to facilitate the description of the embodiments of this application. Furthermore, the terms "comprise" and "have," and any variations thereof, are intended to cover non-exclusive inclusions; for example, a process, method, system, product, or apparatus comprising a series of steps or units is not necessarily limited to the explicitly recited steps or units, but may include other steps or units that are not explicitly recited or that are inherent to such process, method, product, or apparatus.

[0013] In this application, orientations or positional relationships indicated by terms such as "upper," "lower," "inner," "middle," "outer," "front," and "rear" are based on the orientations or positional relationships shown in the drawings. These terms are primarily intended to more appropriately describe the present application and its embodiments, and are not intended to limit the illustrated devices, elements, or components to a specific orientation or to be constructed and operated in a specific orientation. Some of the above terms may also be used to indicate other meanings in addition to indicating orientations or positional relationships. For example, the term "upper" may be used in certain cases to indicate a specific dependency or connection relationship. Those skilled in the art may understand the specific meanings of these terms in this application depending on the specific circumstances. Furthermore, the terms "set," "connected," and "fixed" should be understood broadly. For example, "connected" may mean a fixed connection, a detachable connection, or an integral structure; it may be a mechanical connection or an electrical connection; a direct connection, an indirect connection via an intermediate medium, or internal communication between two devices, elements, or components. Those skilled in the art may understand the specific meanings of the above terms in this application depending on the specific circumstances.

[0014] It should be noted that the embodiments and features of the embodiments of the present application can be combined with each other as long as there is no contradiction. The present application will be described in detail below in conjunction with the embodiments with reference to the drawings. [Example]

[0015] This embodiment provides an LED bracket with a simple structure, low cost, high yield rate, and excellent overall strength, and the LED bracket may be used in fields such as, but not limited to, lighting, decoration, backlighting, and displays. The LED bracket includes a package and a substrate, a portion of which is covered by the package. The package forms a bowl-shaped cup, and a portion of the substrate is within the bowl-shaped cup as the bottom of the bowl-shaped cup. The substrate includes two conductive areas within the bowl-shaped cup, with an insulating area between the two conductive areas to insulate them. The substrate includes a substrate body and a support part extending from the substrate body to the inside of the side wall of the bowl-shaped cup. The support part improves the strength of the side wall of the bowl-shaped cup, thereby improving the overall strength of the LED bracket. In this embodiment, the support part extends from one conductive area to the other conductive area within the side wall, and extends at least to the side wall area corresponding to the side wall of the insulating area. This side wall area is usually the weakest area of ​​the LED bracket, and by extending the support part to this area, the weakest part of the LED bracket is effectively reinforced, and the LED bracket is less likely to break when subjected to external force.

[0016] In one example, the package is formed on the substrate by a method such as, but not limited to, injection molding, pouring, or die pressing using a material such as, but not limited to, various resins. The bowl-shaped cup formed in the package is used to accommodate the LED chip. In this example, the cross-sectional shape of the bowl-shaped cup can be freely set, and may be set to a regular shape such as, but not limited to, a rectangle, a circle, a ground shape, an ellipse, or a trapezoid, or may be set to an irregular shape as needed, but this will not be described in detail here.

[0017] In one example, the material of the substrate body may be, for example, an insulating material such as resin or ceramic, but is not limited to these, and may include only one substrate, and the two conductive regions in this example may be provided on the same substrate body, or the substrate in this example may include two sub-substrates, in which case the two conductive regions may be provided on the substrate bodies of the two sub-substrates, respectively, and the conductive regions in this example may be formed by providing corresponding conductive layers on the substrate body, but is not limited to these, and the conductive layers are insulated and isolated from each other by insulating regions.

[0018] In another example, the substrate body may be made of a conductive material such as a conductive metal, and the substrate may include two sub-substrates, each of which is isolated by an insulating region, and the regions of the two sub-substrates within the bowl-shaped cups each constitute two conductive regions. Of course, in some applications, the substrate may include two sub-substrates, one of which is made of a conductive material and the other of which is made of an insulating material.

[0019] In this example, the insulating region may include, but is not limited to, a gap between the two conductive regions to insulate them, and may also include an insulating material between the two conductive regions, such as, but not limited to, various insulating adhesives or insulating resins. Furthermore, in this example, the surface of the insulating region closer to the bowl-shaped cup opening may be higher than the surface of the at least one conductive region closer to the bowl-shaped cup opening, lower than the surface of the at least one conductive region closer to the bowl-shaped cup opening, or at the same height as the surface of the at least one conductive region closer to the bowl-shaped cup opening, and may be freely configured according to various needs to specifically improve its versatility.

[0020] In this embodiment, the support and the substrate body are formed as a single unit, simplifying the LED bracket structure and improving its integration and strength. Of course, the two may also be formed as a non-single unit. Furthermore, the number and specific location of the support can be freely determined according to application needs. For ease of understanding, the following embodiment will be described as an example in which the substrate includes two sub-substrates isolated by an insulating region, and the areas of the two sub-substrates within the bowl-shaped cups each constitute two conductive regions.

[0021] In this example, the support portion may include a support portion extending from the substrate body of one of the sub-substrates to within the side wall of the bowl-shaped cup, or two support portions extending from opposing sides of the substrate body of one of the sub-substrates to within the two opposing side walls of the bowl-shaped cup, or two support portions extending from opposing sides of the substrate body of the two sub-substrates to within the two opposing side walls of the bowl-shaped cup, etc. In this example, the two sub-substrates are referred to as the first sub-substrate and the second sub-substrate, respectively, and the two conductive regions are referred to as the first conductive region and the second conductive region, respectively.

[0022] For an application example, refer to the top view of the LED bracket shown in FIG. 1. To better illustrate the structure of the LED bracket of the present invention, the package is shown in perspective. In the top view, the hatched area indicates the top of the sidewall. The first sub-substrate 11 has a relatively large area, while the second sub-substrate 12 has a relatively small area. An insulating region 13 is sandwiched between the first sub-substrate 11 and the second sub-substrate 12. Both the first sub-substrate 11 and the second sub-substrate 12 are partially covered by the package 10. In the bowl-shaped cup formed by the package, the first sub-substrate 11 and the second sub-substrate 12 are partially exposed, forming a first conductive region D1 and a second conductive region D2, respectively. The LED chip may be mounted on the first conductive region D1 or may cross the first conductive region D1 and the second conductive region D2. In this embodiment, the first sub-substrate 11 includes a support portion 14 extending from its substrate body. The support portion 14 extends from the substrate body of the first sub-substrate 11 into the sidewall of the bowl-shaped cup, and within the sidewall, from the second region T2 corresponding to the sidewall of the first conductive region D1 to the third region T3 corresponding to the sidewall of the second conductive region D2, and extends at least to the sidewall region corresponding to the sidewall of the insulating region 13, i.e., the first region T1 in FIG. 1. This effectively reinforces the weakest part of the LED bracket and minimizes the risk of the LED bracket breaking due to external force. In this embodiment, for example, as shown in FIG. 4, the support portion 14 may pass through the first region T1 and extend into the second region T2. ​​However, for example, like the support portion 14 shown in FIGS. 1 to 3, the support portion 14 does not have to extend into the second region T2. It should be understood that the support 14 in this example may be entirely covered by the package 10, i.e., it may extend entirely into the side wall, or only a portion of it may be covered by the package 10 (for example, as shown in Figure 2).

[0023] In this example, the surface of the support 14 closest to the bowl-shaped cup opening may be at the same height as the surface of the substrate body closest to the bowl-shaped cup opening, i.e., the two may be on the same plane. Alternatively, the surface of the support 14 closest to the bowl-shaped cup opening may not be on the same plane as the surface of the substrate body closest to the bowl-shaped cup opening. For example, the surface of the support 14 closest to the bowl-shaped cup opening may be higher than the surface of the substrate body closest to the bowl-shaped cup opening, i.e., the support 14 may be configured to protrude in the height direction of the substrate body (i.e., in the direction toward the bowl-shaped cup opening). In other words, the support 14 extends within the sidewall to the cup edge of the bowl-shaped cup, further improving the overall strength of the sidewall and further reducing the possibility of the sidewall breaking, particularly when the LED bracket is subjected to an external force from below to above, for example, due to distortion of the plate material. Furthermore, in this example, the first region T1 corresponding to the sidewall of the insulating region 13 refers to the region corresponding to the sidewall where the insulating region 13 and the sidewall contact each other. In other words, when viewed from the top, the insulating region 13 has a portion where its extension intersects with the support portion 14, and the support portion 14 at this portion is not on the same plane as the substrate body, forming a three-dimensional reinforcement structure to ensure the strength of the sidewall. In some applications, the plate material of the insulating region 13 is more easily deformed, and the support portion 14 extends into the first region T1, thereby more effectively reinforcing the relatively weak portion of the sidewall of the LED bracket. However, in some specific applications, the support portion 14 may also include a portion extending away from the second conductive region D2, and the other portions of the sidewall are similarly reinforced.

[0024] In this example, the support portion 14 may extend directly upward from the side edge of the substrate body, or may extend horizontally from the side edge of the substrate body a certain distance before continuing to extend upward. When extending upward, the support portion 14 may include a vertical protrusion or a diagonal protrusion. For example, in the example shown in FIG. 2, the rectangular cross-section support portion 14 may extend directly from a position approaching the top of the side edge of the substrate body, and the thickness of the support portion 14 may be smaller than the thickness of the substrate body. The support portion 14 extends along the substrate body of the first sub-substrate 11 toward the second sub-substrate 12 and enters the first region T1. In this example, the shape of the support portion 14 can be set as needed, including, but not limited to, a half-C shape (as shown in FIG. 3), an inverted L shape, or other shapes or combinations of these shapes, such as a combination of a half-ground shape and a rectangle as shown in FIG. 1.

[0025] In the example shown in FIGS. 1 to 3 , each support extends from one side of the substrate body of one sub-substrate. It should be understood that in this embodiment, the LED bracket may further improve its overall strength by including two support portions extending from opposing sides of the substrate body of one sub-substrate into the two opposing side walls of the bowl-shaped cup, or three support portions extending from opposing sides of the substrate body and other areas of the substrate body covered by the package into the side walls of the bowl-shaped cup. For example, the LED bracket shown in FIGS. 4 and 5 has two support portions 14 extending into the two opposing side walls of the bowl-shaped cup on opposing sides of the substrate body of the first sub-substrate 11, compared to the example shown in FIGS. 1 to 3 . This improves the strength of the first region T1, which corresponds to the side walls of the insulating region 3 in the length direction of the LED bracket. That is, the overall strength of the LED bracket can be more than doubled compared to the LED bracket shown in FIGS. 1 to 3 .

[0026] In this embodiment, the LED bracket may include two support portions each extending from one side of the substrate body of each of the two sub-substrates into the sidewall of the bowl-shaped cup. For example, the LED bracket shown in FIG. 6, compared to the example shown in FIGS. 1 to 3, has a support portion 14 on one side of the first sub-substrate 11 that extends into one sidewall of the bowl-shaped cup, and a support portion 14 on one side of the substrate body of the second sub-substrate 12 that extends into the other sidewall of the bowl-shaped cup. These two support portions 14 are located on two opposing sides of the bowl-shaped cup. This can more than double the overall strength of the LED bracket shown in FIGS. 1 to 3. As described above, the number and position of the support portions 14 in this embodiment can be freely set, and the simple structure allows it to be adapted to the needs of various application scenarios.

[0027] 4, the support 14 may include a first support 141 connected to the substrate body and a second support 142 extending from the first support 141, and the second support 142 may extend from the first support 141, then extend a certain distance to the second sub-substrate, and enter the corresponding first region T1 of the insulating region. In some applications, the first support 141 and the second support 142 may be integrally formed. The first support 141 may extend only horizontally along a direction perpendicular or non-perpendicular to the side of the substrate body, and the second support 142 may extend from the first support 141 and then protrude in the height direction to extend to the second sub-substrate, or the first support 141 may protrude at a certain height and the second support 142 may extend from the first support 141 and then extend horizontally to the second sub-substrate, or both the first support 141 and the second support 142 may protrude in the height direction, and at least a portion of the second support 142 entering the first region T1 may be higher than the substrate body. The two-stage support structure having first support 141 and second support 142 reinforces the strength of the side walls and ensures the bonding force between the bracket and the package. In one application example, the slope of the protrusion of first support 141 can be made gentler than that of second support 142. The gentler first support 141 strengthens the bonding force between the bracket and the package, making the bond between the bracket and the package more stable and less likely to separate when subjected to external force.

[0028] It should be understood that any portion of the support 14 that extends into the side wall can increase the strength of the side wall to some extent. In some embodiments, as shown in FIG. 5, which is a schematic view of the AA cross section of the LED bracket shown in FIG. 4, the first support 141 of the support 14 further includes an arc-shaped connection region, i.e., the portion of the support 14 that approaches the substrate body may be an arc-shaped portion 143. In this example, the arc-shaped portion 143 refers to an arc-shaped corner portion that exists when the support 14 protrudes in the height direction. The arc-shaped portion 143 smooths the interface between the support 14 and the substrate body, further increasing the contact surface with the package, leading to improved airtightness, and guiding infiltrated moisture toward the support, reducing the risk of the inside of the LED bracket becoming damp.

[0029] In some examples, as shown in FIG. 5 , in a cross section perpendicular to the side where the support 14 is provided, the support 14 extends horizontally away from the substrate body, and the included angle θ between the tip extension direction of the support 14 and the substrate body is greater than or equal to 90° and less than 180°. That is, the included angle between the tip extension direction of the support 14 within the wall and the substrate body is greater than or equal to 90° and less than 180°, thereby reducing the difficulty of molding the LED bracket. However, it should be understood that, to increase the strength of the side wall, it is desirable for the support 14 to be enclosed by the side wall of the package regardless of the included angle between the support 14 and the substrate body. When the LED bracket includes two or more supports 14, the included angles between the tip extension directions of the two supports 14 and the substrate body can be set to the same, thereby matching the strength of both sides of the LED bracket.

[0030] In this embodiment, the support 14 may be made of a material harder than the package. In one example, the package may be made of a material such as plastic, with the support having a harder hardness than the plastic. The support 14 may be made of a metal material, a ceramic material, a high-strength resin material, or other materials. In some embodiments, the first sub-substrate 11 is a conductive substrate, and the substrate body and the support 14 are made of a conductive metal material. For example, the first sub-substrate may be made of a copper substrate, an aluminum substrate, an iron substrate, a silver substrate, or the like, but is not limited to these. The support is made of the same material as the substrate body, such as a metal material, and the first sub-substrate is integrally molded to ensure structural integrity. In forming the support 14, the support 14 may be an extension of the first sub-substrate and may be formed into the required shape by a process such as pressing or etching. After molding the support 14, it is packaged with a material such as plastic to form a package structure, such as a sidewall.

[0031] In the LED brackets provided by the above examples of this embodiment, at least one of the first sub-substrate 11 and the second sub-substrate 12 has at least one support portion 14 formed on it, extending into the sidewall of the bowl-shaped cup. The support portion 14 extends from the substrate body, protruding in the height direction from the substrate body, and extends toward the second sub-substrate 12 and into the corresponding first region T1 of the insulating region 3. The support portion 14 reinforces the strength of the sidewalls of the LED bracket of this embodiment, significantly improving the strength of the corresponding first region T1 of the insulating region 3. This reduces the risk of the sidewalls breaking due to external forces, such as plate distortion, and ensures the quality of the LED bracket and the LED light-emitting device manufactured using the LED bracket. It is also expected that the overall strength and reliability of the light-emitting unit manufactured using the LED bracket provided by this embodiment and the light-emitting assembly manufactured using the light-emitting unit will be improved. [Example]

[0032] In conventional LED device packages, the LED chip is mounted within the conductive area of ​​the LED bracket substrate, and the LED chip is packaged with an encapsulant to obtain a light-emitting unit called an LED device. LED devices may operate in high-temperature, high-humidity, and salt-fog environments, which can cause the encapsulant to loosen or even peel off from the substrate, making the protection for the LED device ineffective.

[0033] In order to solve the above problems, this embodiment provides an LED bracket that has a larger contact area between the substrate and the encapsulant, stronger bonding strength, and minimizes situations such as rattling and even peeling between the encapsulant and the substrate.

[0034] The LED bracket in this embodiment may be the LED bracket shown in the above embodiment or an LED bracket with another structure, and it should be understood that this embodiment is not limiting. In this embodiment, the LED bracket includes a substrate. As shown in FIG. 7 , the substrate includes a substrate body 21 and a first conductive layer 22 and a second conductive layer 23 provided on a first surface of the substrate body 21, and the first conductive layer 22 and the second conductive layer 23 are separated by an insulating region to form two conductive regions. The LED bracket in this embodiment may also include a package provided on the substrate body 21, and the package may use various encapsulants, but is not limited to these.

[0035] In this embodiment, a plurality of first grooves 25 are provided on the edge of at least one of the first conductive layer 22 and the second conductive layer 23, so that the conductive layer in contact with the sealing material on the substrate body has a larger side area; and a plurality of first grooves 25 are provided on the edge (i.e., side wall) of the conductive layer, so that the bonding area between the substrate body and the sealing material is larger, that is, the sealing material and the substrate body of this embodiment are more firmly adhered, thereby improving the bonding strength and reducing the occurrence of situations such as rattle or peeling between the sealing material and the substrate body.

[0036] As shown in Figure 7, in this example, multiple first grooves 25 are provided on the edges of both the first conductive layer 22 and the second conductive layer 23, but it should be understood that the first grooves 25 may also be provided on one edge (i.e., one side) of the first conductive layer 22 or the second conductive layer 23, or the first grooves 25 may be provided on each of the multiple edges, thereby further improving the bonding area and bonding strength with the sealing material.

[0037] In this example, at least two conductive through holes 24 are provided in the substrate body 21, and the first conductive layer 22 and the second conductive layer 23 are electrically connected to different conductive through holes 24, respectively. As shown in FIG. 9, in this example, the substrate further includes a third conductive layer 26 and a fourth conductive layer 27 covered on the second surface of the substrate body, and the third conductive layer 26 is electrically connected to the first conductive layer 22 through the corresponding conductive through hole 24, and the fourth conductive layer 27 is electrically connected to the second conductive layer 23 through the other corresponding conductive through hole 24. In this example, the first surface and the second surface of the substrate body are two opposing surfaces, and may be, for example, but not limited to, the front and back surfaces of the substrate body.

[0038] The thickness of the plurality of first grooves 25 at the edge of the first conductive layer 22 and / or the second conductive layer 23 in the height direction of the conductive layer may be equal to or smaller than the height of the conductive layer. For example, in the situation shown in Figure 7, the thickness of the first grooves 25 in the height direction of the conductive layer is equal to the height of the conductive layer. Another example is shown in Figure 8, where the thickness of the first grooves 25 in the height direction of the conductive layer is smaller than the height of the conductive layer.

[0039] The first conductive layer 22 and / or the second conductive layer 23 may have a plurality of first grooves formed on their edges. These grooves provide a larger side area than conventional rectangular or other shaped conductive layers, and the sidewalls of the first conductive layer 22 and / or the second conductive layer 23 have a higher than average roughness. Therefore, when an encapsulant is applied to the side where the first conductive layer 22 and / or the second conductive layer 23 are provided, the encapsulant bonds more strongly. This also improves the hermeticity of the final LED light-emitting device in some implementations. In this embodiment, the conductive layers may include, but are not limited to, bonding pads and pins. For example, in some embodiments, the first conductive layer 22 and the second conductive layer 23 may be bonding pads for attaching LED chips, and the third conductive layer 26 and the fourth conductive layer 27 may be pins. In addition, in some conventional substrates, for example, a single first groove or similar shape is formed in the conductive layer designated as a positive or negative bonding pad, but in reality, such a structure is only intended to distinguish the positive and negative electrodes of the bonding pads and is not intended to intentionally enhance the adhesion of the encapsulant, and in some substrates, marks are printed to distinguish the positive and negative electrodes. In the substrate of this embodiment, the first conductive layer 22 and / or the second conductive layer 23 have a plurality of first grooves 25, which may be positioned continuously and systematically at a regular interval along the edge of the conductive layer, or may be positioned according to the actual substrate shape and / or the arrangement of electronic devices such as LED chips to be subsequently installed.

[0040] As shown in FIG. 9 , the conductive through-holes 24 in this embodiment penetrate from the first surface to the second surface of the substrate body 21. The location and number of the conductive through-holes 24 can be selected according to the actual situation. The corresponding conductive through-holes 24 of the first conductive layer 22 and the second conductive layer 23 are spaced a certain distance apart to prevent the first conductive layer 22 and the second conductive layer 23 from being too close. Optionally, a conductive metal layer can be provided in the conductive through-holes 24 to achieve connection on both sides of the substrate body. The conductive metal layer contacts the corresponding conductive layers on the first and second surfaces of the substrate body so that the corresponding conductive layers are electrically connected to each other. The material of the conductive metal layer can be any conductive metal, including, but not limited to, gold, silver, copper, platinum, etc. The conductive metal layer can be provided in the conductive through-holes by a film-forming process such as vacuum sputtering, or can be manufactured by other film-forming processes. In this example, the conductive metal layer does not have to fill the conductive through holes 24. For example, the conductive through holes 24 may be formed with a diameter of 50 μm to 200 μm, and the conductive metal layer may be formed on the inner walls of the conductive through holes with a thickness of less than 15 μm. In another example, the conductive through holes 24 may be filled with a conductive metal material or a conductive metal rod, which can also achieve the effect of electrically connecting the corresponding conductive layers on both sides of the substrate.

[0041] In some examples, the first conductive layer 22, the second conductive layer 23, the third conductive layer 26, and the fourth conductive layer 27 include copper layers, and the method of forming the copper layers may be similar to the method of forming the conductive metal layer in the conductive through hole 24, but is not limited thereto and will not be described in detail here. In this example, the thickness of the copper layer can be set according to the actual device size or specifications, etc. For example, the thickness of the copper layer is approximately 20 μm to 100 μm, and the first conductive layer 22, the second conductive layer 23, the third conductive layer 26, and the fourth conductive layer 27 may have the same thickness or different thicknesses. Alternatively, the first conductive layer 22 and the second conductive layer 23 may have the same thickness, and the third conductive layer 26 and the fourth conductive layer 27 may have the same thickness, but the first conductive layer 22 and the third conductive layer 26 may be provided so as not to have the same thickness.

[0042] In some examples, at least one of the first conductive layer 22, the second conductive layer 23, the third conductive layer 26, and the fourth conductive layer 27 further includes a metal plating layer, which may include any conductive metal whose chemical properties are more stable than copper, such as gold plating, silver plating, platinum plating, or some alloys. The metal plating layer provides the conductive layer with surface properties comparable to those of the corresponding metal and is more stable than a conductive layer made of bare copper.

[0043] In this embodiment, the first groove 25 in the substrate may be formed by a method including, but not limited to, etching, cutting, etc. For example, a copper layer may be formed on the entire surface of the substrate body 21 by a method such as vacuum sputtering, and then the copper layer may be formed into a required shape by a method such as etching or cutting, and the first groove 25 may also be formed during this process. The metal plating layer may be formed after the first groove 25 is formed, thereby coating the sidewalls of the first conductive layer 22 and / or the second conductive layer 23 with the required metal. In the manufacturing process of the substrate of this embodiment, the surface of the conductive layer may be polished to be smooth before coating the conductive layer with metal.

[0044] The substrate body in this embodiment may include a ceramic plate, that is, the substrate in this embodiment may be a ceramic substrate such as ALN, AL203, etc. In other embodiments, the substrate body may be made of other insulating materials.

[0045] It should be understood that in the substrate body of this embodiment, the first grooves 25 of the first conductive layer 22 and the second conductive layer 23 may have various shapes, and in some embodiments, the shape of the first grooves 25 may include at least one of an arc shape, a rectangle shape, and a zigzag shape. For example, the periodic arrangement of the edges of the first conductive layer 22 and the second conductive layer 23 (i.e., the spacing between each first groove 25 is constant) shown in Figure 7 has rectangular first grooves 25, the periodic arrangement of the edges of the conductive layers shown in Figure 10 has arc-shaped first grooves 25, the periodic arrangement of the edges of the conductive layers shown in Figure 11 has zigzag first grooves 25, and Figure 12 shows another form of zigzag first grooves 25. It should be understood that the first groove may have other shapes, and its size and arrangement method can be freely set. If multiple first grooves are provided, the side area of ​​the first conductive layer and the second conductive layer that come into contact with the encapsulant will be increased, thereby increasing the adhesiveness of the encapsulant.

[0046] It should be understood that in some embodiments, one or more LED chips are provided in corresponding regions of one first conductive layer 22, one second conductive layer 23, one third conductive layer 26, and one fourth conductive layer 27. Also, a substrate may have multiple such regions.

[0047] In the substrate of this embodiment, a plurality of first grooves are formed on the edges of the first conductive layer and / or the second conductive layer, thereby increasing the surface area of ​​the relatively rough side surfaces of the first conductive layer and / or the second conductive layer. After packaging with the encapsulant, the encapsulant will contact the sidewalls of the first conductive layer and / or the second conductive layer over a larger area, which will make the substrate more firmly bonded to the encapsulant, reduce the situation of encapsulant peeling in the final LED light-emitting device, and improve the quality of the final LED light-emitting device.

[0048] This embodiment also provides a light emitting unit, also referred to as an LED light emitting device, which includes a substrate body 21, an LED chip 28, and a packaging layer 29, as shown in Fig. 13. The LED chip 28 is mounted on a first surface of the substrate body 21, with the positive electrode of the LED chip 28 fused to the first conductive layer 22 and the negative electrode of the LED chip 28 fused to the second conductive layer 23. The packaging layer 29 is mounted on the first surface of the substrate body 21, covering the first conductive layer 22, the second conductive layer 23, and the LED chip 28, and the packaging layer 29 enters a first groove 25 on the edge of the first conductive layer 22 and / or the second conductive layer 23.

[0049] In the above light-emitting unit, the packaging layer 29 may be, but is not limited to, an encapsulant layer. The packaging layer 29 penetrates into the first groove 25 on the edge of the first conductive layer 22 and / or the second conductive layer 23, thereby increasing the contact area with the relatively rough sidewalls of the first conductive layer 22 and / or the second conductive layer 23 on the substrate, and effectively improving the bonding strength with the substrate.

[0050] In one example of this embodiment, the light emitting unit may further include a Zener diode, if necessary. The Zener diode is mounted on the first surface of the substrate body 21, i.e., on the same side as the LED chip 28. The positive electrode of the Zener diode is fused to the second conductive layer 23, the negative electrode is fused to the first conductive layer 22, and the Zener diode is also covered by the packaging layer. The reverse-connected Zener diode can protect the LED chip. By arranging the Zener diode on the same side as the LED chip, the Zener diode is also covered and protected by the encapsulant layer. Other elements may also be included in the LED light emitting device, and may also be mounted on the same side as the LED chip if permitted by the circuit structure.

[0051] In one example of this embodiment, the plurality of first grooves 25 on the edges of the first conductive layer 22 and the second conductive layer 23 are located outside the area covered by the LED chip 28, and if the light emitting unit further includes a Zener diode, the plurality of first grooves 25 are also located outside the area covered by the Zener diode. After the device is assembled on the substrate, some area of ​​the device can contact the first conductive layer 22 or the second conductive layer 23, and the first conductive layer 22 or the second conductive layer 23, which has a larger area, can dissipate heat. Since the first grooves 25 are located outside the device, dissipation of heat from the device by the first conductive layer 22 or the second conductive layer 23 can be ensured.

[0052] 14 shows a substrate used in the light-emitting unit shown in FIG. 13, in which the first grooves 25 in the first conductive layer 22 and the second conductive layer 23 are respectively arranged along the edges of the first conductive layer 22 and the second conductive layer 23, with a relatively large number of first grooves 25 arranged on one side of the first conductive layer 22 and the second conductive layer 23 away from the center of the substrate in the length direction. In fact, the first grooves 25 in this portion may be arranged periodically, with first grooves 25 also formed at some corners of the first conductive layer 22 and the second conductive layer 23, and a small number of first grooves 25 also arranged on one side of the first conductive layer 22 or the second conductive layer towards the center of the substrate in the length direction. In this example, none of the first grooves 25 in the first conductive layer 22 and the second conductive layer 23 are located in positions covered by the LED chip 28 and the Zener diode, and a relatively large number of first grooves 25 are located in the first conductive layer 22 and the second conductive layer 23 in positions covered by the elements, thereby improving the adhesion between the substrate and the encapsulant layer (not shown). In actual applications, the first grooves 25 in the substrate may be selected according to the final element layout, ensuring a certain surface area of ​​the first conductive layer 22 and the second conductive layer 23 while avoiding the areas covered by the elements, and forming the first grooves 25 as close as possible to the edges of the first conductive layer 22 and the second conductive layer 23 strengthens the bonding strength between the substrate and the encapsulant layer, and in some implementations, improves hermeticity, thereby ensuring the final quality of the LED light-emitting device.

[0053] In this embodiment, the manufacturing process of the substrate and the LED light-emitting chip of this embodiment will be further described. The manufacturing process of the LED light-emitting chip includes the following steps:

[0054] S101: Select an appropriate substrate body and drill holes, for example, drill one hole each in the lower left and upper right regions of the substrate body 21, with a diameter of 50 μm to 200 μm. In this step, the drilled holes are the holes that will be subsequently formed into conductive through holes.

[0055] S102: Form a metal layer on the front and back surfaces and holes of the substrate body by sputtering. For example, form a relatively thin metal layer on the substrate body 21 by sputtering, the thickness of which may be less than 15 μm. The metal layer may be a conductive metal, such as copper.

[0056] S103: The circuit is transferred onto the surface of the substrate body, and a thick copper layer is coated on the metal layer by electroplating.

[0057] S104: Fabricate a thick copper layer into the required conductive layer shape, and perform etching or cutting to obtain the outline of the example substrate shown in FIG.

[0058] S105: The surface of the conductive layer is polished to be smooth.

[0059] S106: The surface of the conductive layer is treated by electroplating to obtain a finished substrate, for example, by electroplating to form a metal plating layer on the surface of the copper layer.

[0060] S107: The element is mounted on the substrate and packaged with a sealing material.

[0061] For example, elements may be mounted on the substrate by methods such as (but not limited to) eutectic soldering, including Zener diodes and LED chips. After these elements are fixed to the substrate, an encapsulant layer is fabricated by methods such as compression. In some specific examples, the encapsulant layer may be 200 μm to 400 μm thick, and may be made of an insulating rubber material such as silica gel. It should be understood that in some examples, the encapsulant layer may be higher than the highest surface of the elements on the substrate, thereby ensuring that each element is covered and protected. After the encapsulant layer is compressed, it is baked in an oven to harden. For example, the silica gel packaging layer is baked at a temperature of 120°C to 170°C. It should be understood that if the substrate includes multiple regions for mounting LED chips, the hardened LED light-emitting device may be cut into individual LED light-emitting devices.

[0062] 15, this embodiment further provides a light emitting assembly including a circuit board 210 and a light emitting unit, the light emitting unit being the LED light emitting device shown in each of the above examples of this embodiment, the circuit board 210 including a wiring layer 211, the third conductive layer 26 and the fourth conductive layer 27 being fused to the wiring layer 211. It should be understood that the circuit board 210 of this light emitting assembly may also be provided with a corresponding circuit pattern and elements for driving the LED light emitting device to emit light. The LED light emitting device of this embodiment has a stronger bonding strength between the encapsulant layer and the substrate, making it less likely to peel off from the substrate, and the light emitting device has high quality. [Example]

[0063] Conventional LED package structures often suffer from poor bonding between the package and the substrate, poor airtightness, and problems such as light attenuation. To address these issues, this embodiment provides a new LED bracket. A second groove is added to the area of ​​the LED bracket where the substrate and package come into contact, i.e., the area where the substrate is covered by the package. The package forms a stepped structure in the second groove, and the portion of the package covered by the substrate is filled into the second groove. The second groove increases the contact area between the package and the substrate, thereby enhancing the bonding strength and airtightness between the substrate and the package. Furthermore, when this bracket is applied to an LED package to obtain a light-emitting unit, the provision of the second groove increases the inclination of the inner wall of the package compared to conventional solutions, thereby still ensuring the required bonding strength and increasing the light emission angle of the light-emitting unit. The LED bracket in this embodiment may be the LED bracket shown in the above embodiments (e.g., Example 1) or an LED bracket with another structure; it should be understood that this embodiment is not limiting.

[0064] For ease of understanding, the following description will be given with reference to some examples shown in the drawings.

[0065] 16, the LED bracket includes a substrate 3 and a package 32 mounted on the substrate 3. A second groove 31 is formed on one side of the substrate 3 connected to the package 32, and the package 32 covers a portion of the surface of the substrate 3 and is filled into the second groove 31. In some examples of this embodiment, the substrate 3 may be used as an electrically conductive and heat transfer layer, and may be made of, but is not limited to, copper alloy, aluminum, gold, silver, copper, etc. The protective structure formed by the package 32 surrounding the periphery of the substrate and filling it with a filler may be made of, but is not limited to, thermosetting resin, thermoplastic resin, etc.

[0066] In one example of this embodiment, the second groove 31 opened in the LED bracket may have a depth of 0.05mm to 0.3mm, but is not limited to this, and a width of 0.05mm to 0.5mm, but is not limited to this. Specifically, taking into consideration the particle size of the filler material to be used as the package 32, the width and depth usually need to be at least twice the maximum particle size to ensure sufficient filling.

[0067] In some examples of this embodiment, the substrate 3 has two conductive regions separated by an insulating region 34, which in this example has a strip-shaped hole-groove structure, and the insulating region 34 is filled with an insulating material, thereby achieving electrical isolation between the two conductive regions.

[0068] 16, in one example of this embodiment, the inner wall of the package 32 is hopper-shaped, and the opening size gradually increases in the direction away from the substrate 3, i.e., the opening size of the bowl-shaped cup formed by the package 32 gradually increases from the bottom of the bowl-shaped cup in the direction away from the substrate 3. The inner wall of the package 32 is connected to one side of the opening of the second groove 31 that is closer to the center of the bowl-shaped cup (i.e., the side of the opening of the second groove 31 that is away from the edge of the substrate 3), and the shape of the inner wall of the package 32 projected onto the cross section of the substrate 3 is a straight line L1, that is, the shape of the inner wall of the package 32 is the side of a round or square base structure, of which the cross section of the substrate 3 in this example is perpendicular to the surface of the substrate 3. In this structure, a second groove 31 is provided at the joint between the substrate 3 and the package 32, allowing the interior of the package 32 to be more inclined while still ensuring the required joint strength. When applied to an LED package structure, the angle between the emitted light and the central axis of the LED is larger, thereby increasing the light emission angle θ1 of the LED package.

[0069] 17 , the inner wall of the package 32 is hopper-shaped, with the opening dimensions gradually increasing away from the substrate 3, the inner wall of the package 32 connecting to one side of the second groove 31 toward the center of the bowl-shaped cup, and the shape of the inner wall of the package 32 in the cross section of the substrate 3 is a curve L2, specific shapes of the curve include, but are not limited to, a circular arc, an elliptical arc, and a parabola. Similarly, in this structure, the second groove 31 is provided at the joint between the substrate 3 and the inner wall of the package 32, allowing the interior of the package 32 to be more oblique while still ensuring the required bonding strength. When applied to an LED package structure, the angle between the emitted light and the central axis of the LED is larger, thereby increasing the light emission angle of the LED package.

[0070] In some embodiments, as shown in FIG. 18 , the inner wall of the package 32 has a hopper-like shape, with the opening gradually increasing in size away from the substrate 3. The package 32 covers the surface of the substrate 3 on both sides of the second groove 31. The cross-sectional shape of the inner wall of the package 32 includes a first step 35 that is perpendicular to the surface of the substrate 3 and a second step 36 that is inclined relative to the surface of the substrate 3. By covering the surface of the substrate 3 on both sides of the second groove 31, the package 32 forms a stepped structure on both sides of the second groove 31, further enhancing the bonding strength between the substrate 3 and the package 32 and improving airtightness. The first step 35 of the inner wall of the package 32 is used to ensure the thickness of the package 32, and the second step 36 forms a gradually expanding open opening to increase the light emission angle.

[0071] In some embodiments, as shown in FIGS. 16 to 18 , a third groove 33 for fixing a chip (including, but not limited to, an LED chip) is further formed on the side of the substrate 3 where the second groove 31 is formed. The third groove 33 may be formed in any conductive region of the substrate 3. In one example, the third groove 33 is a countersunk hole in the surface of the substrate 3, and may have a depth of, but not be limited to, 0.05 mm to 0.3 mm. The width may be greater than the side of the chip to be fixed, allowing the chip to fit inside the third groove 33. The third groove 33 also serves to increase the cup depth of the package 32. As is known to those skilled in the art, in an LED package, the packaging layer above the chip must have a certain thickness to ensure the hermeticity of the packaged product, making it less susceptible to external environmental influences that could affect the reliability of the chip. In this embodiment, the function of the third groove 33 is to ensure the thickness of the package even when the height of the LED package is insufficient, and to minimize the size of the LED package on the premise that the height of the package layer is ensured by the depth of the third groove 33. This structure prevents the bonding wire 310 between the chip and the substrate 3 from being exposed on the surface of the encapsulant, thereby reducing the possibility of light attenuation and dead light.

[0072] Furthermore, other configurations and operations of the LED package bracket provided in this embodiment are well known to those skilled in the art, and can be referred to the structures of related devices in the prior art, so they will not be described in detail here.

[0073] This embodiment further provides a light emitting unit including the LED bracket provided by this embodiment. As shown in Figures 19 to 21, the light emitting unit in this embodiment includes an LED chip 38, which is fixed to the surface of the substrate 3 inside the package 32 (i.e., in the bowl-shaped cup) by a chip fixing gel 37, and the LED chip 38 is electrically connected to the substrate 3 by, but not limited to, bonding wires 310. A package layer 39 is disposed in the bowl-shaped cup formed by the package 32 to seal the LED chip 38. If a third groove 33 is formed in the substrate 3, the third groove 33 is a chip fixing region of the LED package, and the third groove 33 is located inside the bowl-shaped package 32. The LED chip 38 is fixed inside the third groove 33 by the chip fixing gel 37, and the LED chip 38 is electrically connected to the substrate 3 by bonding wires 310.

[0074] For ease of understanding, the following embodiment takes a manufacturing process of an LED bracket as an example, which includes but is not limited to the following steps:

[0075] Manufacturing of substrate 3: A third groove 33 is opened in the center of substrate 3, and a second groove 31 is opened around the third groove 33, of which the second groove 31 has a depth of 0.05mm to 0.3mm and a width of 0.05 to 0.5mm, and the third groove 33 has a depth of 0.05 to 0.3mm and a width greater than the side of LED chip 38.

[0076] Formation of bracket: The package 32 formed by the filler is extended into the second groove 31 through the second groove 31 and the mold, and the substrate 3 and the package 32 form a bracket structure.

[0077] Chip fixing gel 37 is placed in the chip fixing area in the third groove 33 using chip fixing equipment and jigs, and then the LED chip 38 is placed on the chip fixing gel 37 using chip fixing equipment and jigs, and the LED chip 38 is fixed in the third groove 33 by a curing process.

[0078] After chip fixing and baking, wire bonding is performed on the material using a bonding wire equipment and a jig, and the LED chip 38 is electrically connected to the substrate 3 by a bonding wire 310. The bonding wire 310 used can include, but is not limited to, gold wire, silver wire, or alloy wire.

[0079] A fluorescent gel or encapsulant is applied to the material with the bonding wires by the gelling equipment, and the material with the fluorescent gel or encapsulant applied is then baked to harden, forming a package layer 39. The final light-emitting unit product has good airtightness, high product reliability, a wide light emission angle, and high brightness, making it suitable for products requiring high reliability both indoors and outdoors. It should be understood that the LED chip in this example is a standard LED chip, and can be replaced with a flip LED chip or a vertical LED chip as needed.

[0080] The light emitting unit disclosed in this embodiment includes the bracket provided in the above embodiment, so that the light emitting unit with this bracket has all the above technical effects, and will not be described in detail here. Other structures and operations of the light emitting unit are well known to those skilled in the art, and will not be described in detail here. Some embodiments in this specification are described in a progressive or parallel manner, and the emphasis of each embodiment is on the differences from other embodiments. The homologous or similar parts of each embodiment can be mutually referenced, and will not be described in detail here. [Example]

[0081] In conventional LED brackets, a copper plating layer and a silver plating layer are usually formed in this order on the surface of the substrate body to improve the overall performance of the LED bracket. However, when the LED chip is connected to the substrate surface by soldering, a large amount of copper ions in the copper plating layer transfer to the silver plating layer and combine with tin on the surface of the silver plating layer to form copper-tin compounds, which result in the formation of holes and a relatively low yield rate.

[0082] In response to the above problem, this embodiment provides a new LED bracket including a substrate, the substrate including a substrate body (i.e., substrate body), and two conductive areas on a first surface of the substrate body that are insulated and separated by an insulating area, at least one of which includes a first copper plating layer, a nickel plating layer, a second copper plating layer, and a silver plating layer that are stacked in order on the first surface of the substrate body, the thickness of the first copper plating layer being thicker than the thickness of the second copper plating layer, and the nickel plating layer being used to inhibit the migration of copper ions in the first copper plating layer to the second copper plating layer. The first copper plating layer, the nickel plating layer, the second copper plating layer, and the silver plating layer are sequentially stacked on the surface of the substrate body, effectively improving the overall performance of the LED bracket. The second copper plating layer is relatively thin, allowing only a small amount of copper ions in the second copper plating layer to migrate to the silver plating layer, effectively preventing the copper ions from migrating to the tin solder on the surface of the silver plating layer and resulting in the formation of large amounts of copper-tin compounds, which would otherwise lead to hole formation. The nickel plating layer also prevents the copper ions in the first copper plating layer from migrating to the second copper plating layer, effectively suppressing the increase in the content of transition copper ions in the second copper plating layer, preventing the formation of large amounts of copper-tin compounds, and improving the yield rate. The other structures of the LED bracket in this embodiment may be the same as those shown in the above embodiments, or may be other structures applicable to the LED bracket in this embodiment. It should be understood that this embodiment is not limited to these. For ease of understanding, this embodiment will be described below with reference to the examples shown in the drawings.

[0083] The LED bracket substrate shown in FIG. 22 includes a substrate body 40 and a first copper-plated layer 41, a nickel-plated layer 42, a second copper-plated layer 43, and a silver-plated layer 44, which are sequentially stacked on the surface of the substrate body 40. The substrate body 40 has a certain structural strength to function as a support. Furthermore, the substrate body 40 is made of a material with high thermal conductivity, so that when the LED chip operates and generates heat, the generated heat is conducted by the LED bracket, achieving effective heat dissipation. In a specific embodiment, the substrate body 40 may be made of a conductive material such as a metal material. Materials for the substrate body 40 include, but are not limited to, conductive materials, and may be made of any other high-thermal-conductivity material with a certain structural strength. It should be understood that the material for the substrate body 40 is not specifically limited herein.

[0084] In this embodiment, the substrate body 40 has a first surface 401 and a second surface 402 facing each other, and a first copper plating layer 41, a nickel plating layer 42, a second copper plating layer 43, and a silver plating layer 44 are respectively deposited on the first surface 401 and the second surface 402. The metal plating layer on the first surface 401 is connected to the LED chip, and the metal plating layer on the second surface 402 is connected to the circuit board. It should be understood that the metal plating layer is formed on the surface of the substrate body 40 by, but not limited to, electroplating. During the electroplating process, forming a metal plating layer on only one surface of the substrate body 40 is relatively difficult and requires more complicated operations. Therefore, the metal plating layer is formed on both the first surface 401 and the second surface 402 to reduce the difficulty of the process and improve processing efficiency. The method for forming the first copper plating layer 41, the nickel plating layer 42, the second copper plating layer 43, and the silver plating layer 44 on the surface of the substrate body 40 includes, but is not limited to, electroplating, and may also be metal vapor deposition, chemical plating, or any other method that meets the corresponding functional requirements, and the method for forming the metal plating layers is not specifically limited here.

[0085] The first copper plating layer 41 is formed on the surface of the substrate body 40. It should be understood that in a typical manufacturing process, the surface flatness of the substrate body 40 is poor. If the substrate body 40 is directly attached to a circuit board, gaps or holes will form between the substrate body 40 and the circuit board, resulting in a low yield rate. Similarly, if an LED chip is directly attached to the uneven surface of the substrate body 40, the performance of the LED chip will be affected to a certain extent. By providing the first copper plating layer 41 on the first surface 401 and the second surface 402 of the substrate body 40, the surface flatness of the LED bracket is improved, effectively preventing gaps or holes between the LED bracket and the circuit board. Furthermore, by attaching the LED chip to the relatively flat first copper plating layer 41, its performance is similarly improved.

[0086] In this embodiment, the thickness of the first copper plating layer 41 ranges from 0.5 μm to 5 μm. If the thickness of the first copper plating layer 41 is less than 0.5 μm, the first copper plating layer 41 is too thin, making it difficult to correct depressions on the surface of the substrate body 40, resulting in a lack of flatness. Gaps or holes may still exist between the corresponding LED bracket and the circuit board, and the performance of the LED chip mounted on the corresponding LED bracket may still be affected. However, if the thickness of the first copper plating layer 41 exceeds 5 μm, the thickness of the first copper plating layer 41 increases to a certain extent, resulting in a certain increase in manufacturing costs. Therefore, if the thickness of the first copper plating layer 41 is between 0.5 μm and 5 μm, the flatness of the surface of the LED bracket is ensured and manufacturing costs are effectively reduced.

[0087] The nickel plating layer 42 is disposed between the first copper plating layer 41 and the second copper plating layer 43. In a typical process, the LED bracket and the circuit board, and the LED chip and the LED bracket, are fixed and connected by soldering, forming a solder layer on the surface of the silver plating layer 44. After a certain period of operation, copper ions in the first copper plating layer 41 readily transfer to the second copper plating layer 43, resulting in an increase in copper ions in the second copper plating layer 43. A large number of copper ions transfer from the second copper plating layer 43 to the silver plating layer 44 and combine with tin on the surface of the silver plating layer 44 to form copper-tin compounds. These copper-tin compounds tend to form holes between the LED bracket and the circuit board, and between the LED bracket and the LED chip, thereby reducing the yield. The nickel plating layer 42 effectively prevents copper ions from transferring from the first copper plating layer 41 to the second copper plating layer 43, effectively preventing a large number of copper ions from transferring to the silver plating layer 44 and forming copper-tin compounds with the solder on the surface of the silver plating layer.

[0088] It should be further understood that the silver plating layer 44 connected to the LED chip reflects the light emitted from the LED chip to improve brightness, and the presence of the nickel plating layer 42 effectively prevents a large amount of copper ions from migrating to the silver plating layer 44, which would reduce the reflectivity of the silver plating layer 44, and further ensures the corresponding reflective function of the silver plating layer 44.

[0089] In one embodiment of the present invention, the thickness of the nickel plating layer 42 ranges from 0.125 μm to 2.5 μm. If the thickness of the nickel plating layer 42 is less than 0.125 μm, the nickel plating layer 42 is too thin to effectively inhibit the migration of copper ions, and the formation of large amounts of copper-tin compounds cannot be suppressed, making it impossible to ensure that the reflectivity of the silver plating layer 44 meets the corresponding requirements. However, it should be understood that if the thickness of the nickel plating layer 42 exceeds 2.5 μm, the nickel plating layer 42 is too thick, which increases manufacturing costs to a certain extent. Therefore, if the thickness of the nickel plating layer 42 is between 0.125 μm and 2.5 μm, the migration of copper ions is inhibited and manufacturing costs are effectively reduced.

[0090] The second copper plating layer 43 is disposed between the nickel plating layer 42 and the silver plating layer 44, and the thickness of the second copper plating layer 43 is smaller than the thickness of the first copper plating layer 41. It should be understood that if the silver plating layer 44 were disposed directly on the surface of the nickel plating layer 42, the bonding strength between the silver plating layer 44 and the nickel plating layer 42 would be poor and the silver plating layer 44 would easily peel off from the surface of the nickel plating layer 42, resulting in poor stability of the LED bracket. However, by disposing the second copper plating layer 43 between the nickel plating layer 42 and the silver plating layer 44, the bonding strength between the second copper plating layer 43 and the silver plating layer 44 is relatively good, which effectively improves the structural stability of the LED bracket. It should also be understood that the thickness of the second copper plating layer 43 should be smaller than that of the first copper plating layer 41, i.e., the thickness of the second copper plating layer 43 should be relatively thin, so that the copper ion content in the second copper plating layer 43 is low, and the migration of a large amount of copper ions from the second copper plating layer 43 to the silver plating layer 44 is effectively suppressed, the number of holes formed by copper-tin compounds is reduced to a certain extent, and the yield rate is effectively improved, while ensuring that the reflectivity of the silver plating layer 44 meets the corresponding requirements.

[0091] In this embodiment, the thickness of the second copper plating layer 43 ranges from 0.0625 μm to 1 μm. If the thickness of the second copper plating layer 43 is less than 0.0625 μm, the second copper plating layer 43 is too thin and therefore unable to perform its bonding function. The silver plating layer 44 is still prone to peeling, and the structural stability of the LED bracket cannot be effectively ensured. If the thickness of the second copper plating layer 43 is more than 1 μm, the second copper plating layer 43 is too thick and therefore contains a relatively high amount of copper ions. These copper ions are likely to migrate in large quantities from the second copper plating layer 43 to the silver plating layer 44 connected to the circuit board. Furthermore, a large amount of copper-tin compounds are formed on the surface of the silver plating layer 44, forming holes and reducing the yield. At the same time, the large amount of copper ions easily migrate to the silver plating layer 44 connected to the LED chip, reducing the reflectivity of the silver plating layer 44 and preventing it from meeting the corresponding functional requirements. Therefore, when the thickness of the second copper plating layer 43 is 0.0625 μm or more and 1 μm or less, it can be effectively bonded to the silver plating layer 44 and the migration of a large amount of copper ions to the silver plating layer 44 can be prevented.

[0092] A silver plating layer 44 is provided on one side of the second copper plating layer 43, away from the nickel plating layer 42. On the side closer to the first surface 401 of the substrate body 40, an LED chip is provided on the surface of the silver plating layer 44. Because the reflectivity of the silver plating layer 44 is relatively high, the light emitted from the LED chip is reflected by the silver plating layer 44, thereby effectively improving the brightness. On the other hand, on the side closer to the second surface 402 of the substrate body 40, a circuit board is connected to the surface of the silver plating layer 44. The circuit board and the LED bracket are usually fixed and connected by soldering. It should be understood that the bonding strength between the silver plating layer 44 and the solder layer is superior to that between the nickel plating layer 42 and the solder layer, so the silver plating layer 44 effectively fixes the circuit board and the LED bracket together, making them less likely to separate, thereby improving the structural stability. In addition, the connection method between the LED bracket and the circuit board includes, but is not limited to, soldering connection, and any other connection method that meets the requirements of the corresponding function may be used, and the connection method between the LED bracket and the circuit board is not specifically limited here.

[0093] In one embodiment of the present invention, the thickness of the silver plating layer 44 ranges from 0.25 μm to 5 μm. If the thickness of the silver plating layer 44 is less than 0.25 μm, the silver plating layer 44 near the first surface 401 of the substrate body 40 is too thin to reflect light, and the silver plating layer 44 near the second surface 402 of the substrate body 40 is not able to bond with the solder layer. However, if the thickness of the silver plating layer 44 exceeds 5 μm, the silver plating layer 44 is too thick, which is expensive and significantly increases manufacturing costs. Therefore, if the thickness of the silver plating layer 44 is between 0.25 μm and 5 μm, the requirements for light reflection and bonding with the solder layer can be met simultaneously, and manufacturing costs can be effectively reduced.

[0094] The LED bracket provided in this embodiment has a first copper plating layer 41, a nickel plating layer 42, a second copper plating layer 43, and a silver plating layer 44 stacked in this order on the surface of the substrate body 40, which effectively improves the overall performance of the LED bracket. Among them, the second copper plating layer 43 is relatively thin, and only a small amount of copper ions in the second copper plating layer 43 migrate to the silver plating layer 44, which effectively prevents the copper ions from migrating to the tin solder on the surface of the silver plating layer 44 and resulting in the formation of a large amount of copper-tin compounds, which would otherwise cause holes. In addition, the presence of the nickel plating layer 42 prevents the copper ions in the first copper plating layer 41 from migrating to the second copper plating layer 43, which effectively prevents the content of transition copper ions in the second copper plating layer 43 from increasing, which prevents the formation of a large amount of copper-tin compounds and improves the yield rate.

[0095] 23 and 24, FIG. 23 is a structural diagram of an LED bracket according to another example of this embodiment, and FIG. 24 is a structural diagram of an LED bracket according to another example of this embodiment. In this example, the LED bracket further includes a palladium plating layer 45, which is disposed on one side of the silver plating layer 44 away from the second copper plating layer 43 and serves to protect the silver plating layer 44. It should be understood that the structure of the palladium plating layer 45 is relatively stable, and the palladium plating layer 45 covers the surface of the silver plating layer 44, thereby improving the anti-oxidation, anti-sulfuration, and anti-corrosion capabilities of the silver plating layer 44, thereby improving the performance of the LED bracket to a certain extent. In this example, the thickness of the palladium plating layer 45 ranges from 0.0025 μm to 0.25 μm. It should be understood that if the thickness of the palladium plating layer 45 is less than 0.0025 μm, the palladium plating layer 45 is too thin and does not provide sufficient protection for the silver plating layer 44, causing the silver plating layer 44 to be easily oxidized, sulfided, and even corroded, while if the thickness of the palladium plating layer 45 is more than 0.25 μm, the palladium plating layer 45 is too thick, which increases the price of palladium and significantly increases manufacturing costs. Therefore, if the thickness of the palladium plating layer 45 is between 0.0025 μm and 0.25 μm, the silver plating layer 44 is effectively protected and manufacturing costs are reduced.

[0096] In one example of this embodiment, after a metal plating layer is formed on the surface of the substrate body 40, it is immersed in an antioxidant, washed, and dried, which can further improve the antioxidant ability of the LED bracket.

[0097] 24, in another example of this embodiment, in order to further reduce manufacturing costs, a palladium plating layer 45 may be provided only on the surface of the silver plating layer 44 connected to the LED chip. Usually, the silver plating layer 44 connected to the circuit board is covered with a solder layer, which can provide a certain degree of protection for the silver plating layer 44. Since most of the silver plating layer 44 connected to the LED chip is exposed to air, the palladium plating layer 45 is provided only on the surface of the silver plating layer 44 connected to the LED chip to protect the silver plating layer 44.

[0098] Refer to the structural diagram of a light emitting unit (i.e., an LED module) shown in FIG. 25 . The light emitting unit includes an LED chip 404, a package layer 405, and an LED bracket provided by this embodiment. The package layer 405 and the LED chip 404 are both mounted on the surface of a substrate 403, and the LED chip 404 is located at the bottom of a bowl-shaped cup. It should be understood that a solder layer can be further provided between the LED bracket and the package layer 405; that is, the LED bracket and the package layer 405 can be fixed by soldering or, of course, by using a conductive gel. The light emitting unit provided by this embodiment is attached with an LED bracket provided by any embodiment of the present application, which ensures good overall performance of the light emitting unit and effectively improves the yield rate of the light emitting unit. This embodiment further provides an LED package device including a package and the light emitting unit, where the package accommodates the light emitting unit and provides protection through the package. The LED package device provided by this embodiment is equipped with the light emitting unit provided by this embodiment, which ensures good overall performance of the LED package device and effectively improves the yield rate of the display device.

[0099] This embodiment further provides a light emitting assembly, including the light emitting unit or LED package device provided by this embodiment. The light emitting assembly provided by this embodiment is equipped with the light emitting unit or LED package device provided by this embodiment, which ensures good overall performance of the light emitting assembly and effectively improves the yield rate of display devices. [Example]

[0100] With the development of device technology applications, there is an increasing demand for ultra-thin and compact LED packages in instrument panels, switches, symbols, telephones, fax machines and other industrial equipment indicators, backlights, small equipment, smart wearable equipment backlight indicators, and Nixie tube backlight indicators with size restrictions. Products such as Nixie tubes and smart wearable equipment tend to be lighter and thinner. In conventional LED chip packages, the LED chip is usually fixed to the substrate with insulating adhesive, the positive and negative terminals of the chip are connected to the positive and negative terminals of the substrate with bonding wires, and finally, fluorescent gel is injected into the substrate by compression. This structure makes it difficult to make the product thin, and therefore cannot meet the application requirements of ultra-thin LED products.

[0101] To address the above-mentioned problem, this embodiment provides a fourth groove recessed from the first surface to the second surface but not penetrating the second surface in a region within the bowl-shaped cup of the substrate body, with the second surface being spaced from the bowl-shaped cup. The substrate includes first and second bonding pads disposed within the fourth groove and isolated by an insulating region, with the first and second bonding pads extending from the bottom wall of the fourth groove to the second surface of the substrate body, and the portions of the first and second bonding pads within the fourth groove each forming two conductive regions. By providing a groove in the substrate and accommodating at least a portion of the chip within the groove for packaging, the height of the chip exposed above the first surface is reduced, thereby reducing the overall thickness of the LED product and meeting the application requirements of ultra-thin LED products. For ease of understanding, this embodiment will be described below with reference to the examples shown in the drawings.

[0102] As shown in Figures 26 to 28, this embodiment provides an LED bracket. The LED bracket may be the LED bracket shown in each of the above embodiments or may have other structures; this embodiment is not limited to this LED bracket. The LED bracket provided by this embodiment includes a substrate, a first bonding pad 51, a second bonding pad 52, and an LED chip 53. The substrate 1 includes a substrate body 5. The substrate body 5 has a first surface 501 and a second surface 502 facing each other. A fourth groove 54 is formed in the first surface 501 of the substrate body 5, and the fourth groove 54 does not penetrate to the second surface 502. The first bonding pad 51 and the second bonding pad 52 are separated by an insulating region and are spaced apart on the substrate body 5. The first bonding pad 51 and the second bonding pad 52 extend from the bottom wall of the fourth groove 54 to the second surface 502. At least a portion of the LED chip 53 is accommodated in the fourth groove 54 , a first electrode of the LED chip 53 is connected to the first bonding pad 51 , and a second electrode of the LED chip 53 is connected to the second bonding pad 52 .

[0103] In this embodiment, the substrate body 5 may be, but is not limited to, a PCB board, and the PCB board is provided with a fourth groove 54, which is recessed from the first surface 501 to the second surface 502 without penetrating the second surface 502, and which accommodates an LED chip 53, and wiring corresponding to the LED chip 53 is printed on the bottom wall of the fourth groove 54. One or more LED chips 53 can be installed according to actual needs, and the installation position can be determined according to actual needs, and this embodiment is not limited thereto. When the thickness of the substrate body 5 is smaller than that of the LED chip 53 or when the light-emitting surface of the LED chip 53 is higher than the first surface 501 of the substrate body 5, the depth of the fourth groove 54 is smaller than the thickness of the LED chip 53, and a portion of the LED chip 53 is accommodated in the fourth groove 54. When the thickness of the substrate body 5 is greater than that of the LED chip 53 and the LED chip 53 does not protrude from the first surface 501, as shown in FIGS. 27 and 28, the depth of the fourth groove 54 is equal to or greater than the thickness of the LED chip 53, and the LED chip 53 is fully accommodated within the fourth groove 54. This structure provides better protection for the LED chip 53 and prevents it from being exposed outside the fourth groove 54 and being damaged by collision, etc. Optionally, the LED chip 53 is a flip LED chip to make the LED module structure more compact. In other embodiments, structures such as a mounted LED chip or a vertical LED chip may be selected.

[0104] The first bonding pad 51 and the second bonding pad 52 are made of a metal material having a conductive function, or have a conductive metal layer on their outer surfaces, with a gap between the first bonding pad 51 and the second bonding pad 52. Optionally, the first bonding pad 51 includes a first end 511 and a second end 512, and the first bonding pad 51 extends from the first end 511 to the second end 512, with the first end 511 received in the fourth groove 54 and the second end 512 connected to the second surface 502 of the substrate body 5. Similarly, the second bonding pad 52 includes a third end 521 and a fourth end 522, and the second bonding pad 52 extends from the third end 521 to the fourth end 522, with the third end 521 received in the fourth groove 54 and the fourth end 522 connected to the second surface 502. The positive electrode of the LED chip 53 is connected to the first end 511 of the first bonding pad 51, and the negative electrode of the LED chip 53 is connected to the third end 521 of the second bonding pad 52. It should be understood that the positions of the first bonding pad 51 and the second bonding pad 52 are interchangeable, i.e., when any one bonding pad is the first bonding pad 51, the other bonding pad is the second bonding pad 52.

[0105] The fourth groove 54 is formed in the substrate body 5, and at least a portion of the LED chip 53 is accommodated in the fourth groove 54 for packaging. This reduces the height of the LED chip 53 exposed on the first surface 501, thereby reducing the overall thickness of the LED product and meeting the application requirements of ultra-thin LED products.

[0106] 29 to 31, the shape of the fourth groove 54 corresponds to the shape of the LED chip 53. Optionally, as shown in FIG. 29, if there is one LED chip 53 and it is rectangular, the fourth groove 54 may be rectangular; as shown in FIG. 30, if there is one LED chip 53 and it is circular, the fourth groove 54 may be circular; or as shown in FIG. 31, if there are multiple LED chips 53 and they are irregularly arranged, the fourth groove 54 may have a corresponding irregular shape. It should be understood that the bottom area of ​​the fourth groove 54 is always greater than the area of ​​the orthogonal projection of the LED chip 53 on the first surface 501 so that the fourth groove 54 can accommodate the LED chip 53. By forming the shape of the fourth groove 54 to correspond to the LED chip 53, the shape and size of the fourth groove 54 can be freely adjusted, which is advantageous for processing the fourth groove 54 and is also advantageous for adjusting the shape and size of the fourth groove 54 in real time according to the area of ​​the substrate body 5 and the shape and arrangement of the LED chip 53, thereby meeting various requirements.

[0107] 26, 29, and 31, there is one or more fourth grooves 54, and each fourth groove 54 is provided with one or more LED chips 53. Optionally, as shown in FIG. 29, one fourth groove 54 is provided in the substrate body 5, and one LED chip 53 is provided therein. Alternatively, as shown in FIG. 31, one fourth groove 54 is provided in the substrate body 5, and multiple LED chips 53 are provided therein. The number of fourth grooves 54 can be freely adjusted to accommodate multiple LED chips 53 in one groove as needed, thereby avoiding the need to process the fourth grooves 54 multiple times. The number of fourth grooves 54 can also be increased to reduce the cutting area of ​​the substrate body 5 and improve structural strength.

[0108] 26, the substrate body 5 includes a first side surface 55 and a second side surface 56 facing each other, a first end 511 of the first bonding pad 51 extends from the bottom wall of the fourth groove 54 via the first surface 501 and the first side surface 55 to the second surface 502 to form a second end 512, and a third end 521 of the second bonding pad 52 extends from the bottom wall of the fourth groove 54 via the first surface 501 and the second side surface 56 to the second surface 502 to form a fourth end 522, and the first end 511 of the first bonding pad 51 and the third end 521 of the second bonding pad 52 are arranged symmetrically within the fourth groove 54 with respect to the perpendicular bisector B of the bottom wall of the fourth groove 54, and the first end 511 and the third end 521 are arranged with a gap between them. Optionally, an insulating material is provided between the first end 511 and the third end 521, and the insulating material is in contact with the first end 511 and the third end 521 respectively, so that the first bonding pad 51 and the second bonding pad 52 are electrically isolated by the insulating material, and at the same time, the insulating material is in contact with the first bonding pad 51 and the second bonding pad 52 respectively, thereby achieving more uniform heat transfer.

[0109] 26 and 27, the LED chip package structure further includes a stiffener 57. For example, as shown in FIG. 27, a first gap L1 is formed between the first bonding pad 51 and the second bonding pad 52 at the bottom wall of the fourth groove 54. The first gap L1 separates the first bonding pad 51 and the second bonding pad 52 and serves to form positive and negative electrode bonding pads. The size of the first gap L1 is determined according to the distance between the positive and negative electrodes of the LED chip 53. The first gap L1 is larger when the distance between the positive and negative electrodes of the LED chip 53 is large, and the first gap L1 is smaller when the distance between the positive and negative electrodes of the LED chip 53 is small. The stiffener 57 is disposed on the second surface 502, and the orthogonal projection of the stiffener 57 on the second surface 502 completely covers the orthogonal projection of the first gap L1 on the second surface 502. By providing the reinforcing material 57, the disadvantage of the substrate body 5 being prone to bending due to its thin thickness between the first bonding pad 51 and the second bonding pad 52 is compensated for, the thickness of the first gap L1 of the LED package structure is increased, and the strength of the structure is improved.

[0110] 26 and 27, a second gap L2 is provided between the first bonding pad 51 and the second bonding pad 52 on the second surface 502. Optionally, the second gap L2 is provided between the second end 512 of the first bonding pad 51 and the fourth end 522 of the second bonding pad 52 to separate the first bonding pad 51 and the second bonding pad 52 and electrically isolate the first bonding pad 51 and the second bonding pad 52, thereby forming positive and negative electrode bonding pads for the first bonding pad 51 and the second bonding pad 52, respectively. Optionally, an insulating material is provided in the second gap L2 to electrically isolate the first bonding pad 51 and the second bonding pad 52 and simultaneously connect the first bonding pad 51 and the second bonding pad 52 together, thereby ensuring uniform heat transfer.

[0111] In one embodiment, as shown in FIGS. 26 to 28, the reinforcing material 57 and the first bonding pad 51 or the second bonding pad 52 are integrally formed. Optionally, as shown in FIG. 27, the reinforcing member 57 and the first bonding pad 51 are integrally formed, and the reinforcing member 57 extends from one side of the first side surface 55 to one side of the second side surface 56 at the second end 512 of the first bonding pad 51, and the orthogonal projection of the reinforcing member 57 on the second surface 502 completely covers the orthogonal projection of the reinforcing member 57 on the second surface 502 of the first gap L1; as shown in FIG. 28, the reinforcing member 57 and the second bonding pad 52 are integrally formed, and the reinforcing member 57 extends from one side of the second side surface 56 to one side of the first side surface 55 at the fourth end 522 of the second bonding pad 52, and the area of ​​the orthogonal projection of the reinforcing member 57 on the second surface 502 is greater than the area of ​​the orthogonal projection of the reinforcing member 57 on the first surface 501 of the first gap L1. By integrating the reinforcing material 57 and the first bonding pad 51 or the second bonding pad 52 into a single structure, the strength of the LED package structure is improved, and at the same time, the contact area between the first bonding pad 51 or the second bonding pad 52 and the substrate body 5 is increased, making it easier to dissipate heat and to install.

[0112] In one embodiment, as shown in FIG. 32 , the reinforcing member 57 is disposed in the second gap L2. The width of the reinforcing member 57 is smaller than the width of the second gap L2, and the reinforcing member 57 is disposed at a distance from both the first bonding pad 51 and the second bonding pad 52. The reinforcing member 57 is closely attached to the second surface 502, and the area of ​​its orthogonal projection on the second surface 502 is larger than the area of ​​the orthogonal projection of the first gap L1 on the first surface 501. The reinforcing member 57 is made of a metal or a non-metallic material having a certain structural strength. The metallic material is, for example, copper, and the non-metallic material is, for example, ceramics. Optionally, the reinforcing member 57 is detachably connected to the second surface 502. By disposing the reinforcing member 57 in the second gap L2, the problem of the substrate body 5 being easily broken due to its thin thickness in the first gap L1 is avoided. Furthermore, the reinforcing member 57 is independent of the first bonding pad 51 and the second bonding pad 52, and can be freely attached as needed.

[0113] 26, a solder resist layer 58 is provided on the surface of the reinforcing member 57 facing away from the substrate main body 5. The reinforcing member 58 and the first bonding pad 51 or the second bonding pad 52 are integrally formed, and the surface of the reinforcing member 57 facing away from the substrate main body 5 is made of a conductive metal material, and the solder resist layer 58 is made of a material that is acid-resistant, fumes-resistant, and insulating, such as an ink layer. Therefore, the solder resist layer 58 is applied to the surface of the reinforcing member 57 facing away from the substrate main body 5 to form a protective layer, which helps prevent corrosion of the reinforcing member 57 due to factors such as external moisture, and its high insulating properties prevent short-circuit problems caused by the element being tilted to the expected position during chip mounting.

[0114] This embodiment provides a light-emitting assembly including a light-emitting unit manufactured using the LED bracket described in any of the above embodiments. The light-emitting assembly may be a general-purpose lighting device, such as an LED light-emitting diode or a high-power ceramic LED light source, and is used in high-end markets such as road lighting, building lighting, landscape lighting, and indoor lighting. It may also be a backlight source for display devices such as LED-backlit LCD TVs and smart wearable devices. The LED chip package structure provided by this embodiment reduces the thickness of the light source, leading to a thinner display device and meeting the application requirements of ultra-thin display devices.

[0115] This embodiment further provides an LED chip packaging method, including manufacturing the LED chip packaging structure described in the above embodiment and packaging the LED chip with the packaging structure, including but not limited to:

[0116] A fourth groove 54 is formed in the substrate body 5. Optionally, the substrate body 5 includes a first surface 501 and a second surface 502 facing each other. Optionally, the fourth groove 54 is formed in the first surface 501 of the substrate body 5 by a laser cutting method, and the fourth groove 54 is recessed from the first surface 501 to the second surface 502 but does not penetrate the second surface 502, dividing the substrate body 5 into two regions, a positive electrode and a negative electrode, by the fourth groove 54. Optionally, the fourth groove 54 may be formed in the substrate body 5 by a depth-controlled router, double-sided core board lamination, or other methods.

[0117] A first bonding pad 51 and a second bonding pad 52 are provided at an interval on the substrate body 5. Optionally, the first bonding pad 51 and the second bonding pad 52 are made of a conductive metal material or have a conductive metal plating layer applied to their outer surfaces. The first bonding pad 51 has a first end 511 and a second end 512. The first end 511 is received in the fourth groove 54 and connected to the bottom wall of the fourth groove 54, and the second end 512 is connected to the second surface 502 of the substrate body 5. The first bonding pad 51 extends from the first end 511 to the second end 512. Similarly, the second bonding pad 52 includes a third end 521 and a fourth end 522, the third end 521 is received in the fourth groove 54, the fourth end 522 is connected to the second surface 502, and the second bonding pad 52 extends from the third end 521 to the fourth end 522. A gap is provided between the first end 511 and the third end 521, and between the second end 512 and the fourth end 522.

[0118] The LED chip 53 is connected to the first bonding pad 51 and the second bonding pad 52. Optionally, solder 59 is printed in the fourth groove 54 of the substrate body 5 using a 3D steel mesh. Commonly used solder 59 includes silver paste, tin paste, flux, etc. The opening pattern of the 3D steel mesh is designed according to the electrodes of the LED chip 53, and then the LED chip 53 is placed on the solder 59. If the selected solder 59 is silver paste, baking is performed at a constant temperature of 170°C for 1 hour. If the selected solder 59 is tin paste or flux, reflow soldering is performed at a maximum furnace temperature of 290°C for 30 seconds in a nitrogen gas atmosphere to prevent oxidation of the metal particles in the solder 59. In this step, the first electrode of the LED chip 53 is connected to the first bonding pad 51 and the second electrode of the LED chip 53 is connected to the second bonding pad 52 by the solder 59.

[0119] The fourth groove 54 is formed in the substrate body 5 by laser cutting, which allows for higher processing accuracy and efficiency and improves the yield rate of the finished product. One end of the first bonding pad 51 and one end of the second bonding pad 52 are accommodated in the bottom wall of the fourth groove 54, and the first electrode and the second electrode of the LED chip 53 are connected to the first bonding pad 51 and the second bonding pad 52, respectively, within the fourth groove 54. This reduces the height of the LED chip protruding from the substrate body 5 and further reduces the thickness of the LED product.

[0120] Furthermore, as shown in FIGS. 32 and 33, a first bonding pad 51 and a second bonding pad 52 are provided on the substrate body 5 with a gap therebetween, and specifically, they include the following:

[0121] The first bonding pad 51 and the second bonding pad 52 are arranged symmetrically with respect to the perpendicular bisector B of the bottom wall of the fourth groove 54. Optionally, the first end 511 of the first bonding pad 51 and the third end 521 of the second bonding pad 52 are arranged on either side of the perpendicular bisector B in the fourth groove 54, respectively, and the distances to the perpendicular bisector B of the first end 511 and the third end 521 are the same, thereby achieving a symmetrical structure and avoiding warping or damage caused by uneven thickness of the LED package structure.

[0122] A reinforcing member 57 is provided on the second surface 502. Optionally, two independent metal blocks or plates are used as the first bonding pad 51 and the second bonding pad 52, with one end of each of the first bonding pad 51 and the second bonding pad 52 accommodated in the bottom wall of the fourth groove 54, with a first gap L1 between the first bonding pad 51 and the second bonding pad 52, and the other ends of the first bonding pad 51 and the second bonding pad 52 extending to the second surface 502. The reinforcing member 57 is also a metal structure and is provided on the second surface 502, with its orthogonal projection on the second surface 502 completely covering the orthogonal projection of the first gap L1 on the second surface 502. By providing the reinforcing material 57, the disadvantages of the substrate body 5 being prone to bending and damage due to the thickness being too thin between the first bonding pad 51 and the second bonding pad 52 are compensated for, and the thickness of the first gap L1 of the LED package structure is increased, improving the strength of the structure.

[0123] 26 to 28, a reinforcing member 57 is provided on the second surface 502, and includes the following: the reinforcing member 57 and the first bonding pad 51 or the second bonding pad 52 are integral with each other. Optionally, the substrate body 5 includes a first side surface 55 and a second side surface 56 opposite each other, and when the reinforcing member 57 and the first bonding pad 51 are integral with each other, the reinforcing member 57 extends from the second end 512 of the first bonding pad 51 to the fourth end 522 of the second bonding pad 52 such that the distance from the second end 512 to the first side surface 55 is greater than the distance from the third end 521 to the first side surface 55. When the reinforcement 57 and the second bonding pad 52 are integral, the reinforcement 57 extends from the fourth end 522 of the second bonding pad 52 to the second end 512 of the first bonding pad 51 so that the distance from the fourth end 522 to the second side 56 is greater than the distance from the first end 511 to the second side 56.

[0124] Optionally, in another embodiment, the reinforcement 57 is a structure made of a single metal block or other material having a certain structural strength, and the reinforcement 57 is glued or welded to the first bonding pad 51 or the second bonding pad 52.

[0125] Optionally, the reinforcement 57 is spaced apart from the first bonding pad 51 or the second bonding pad 52, and the orthogonal projection of the reinforcement 57 on the second surface 502 completely covers the orthogonal projection of the first gap L1 on the second surface 502.

[0126] By providing the reinforcing material 57 on the second surface 502, the problem of the substrate body 5 being easily damaged due to the first gap L1 being too thin can be avoided.

[0127] In some examples, as shown in FIGS. 26 and 33 , a stiffener 57 is provided on the second surface 502, and the following may be included: a solder resist layer 58 is provided on the surface of the stiffener 57 facing away from the substrate body 5. Optionally, when the stiffener 57 and the negative electrode bonding pad of the LED package structure are integrally formed, a liquid photoimageable solder mask is applied to the surface of the stiffener 57 facing away from the substrate body 5. The liquid photoimageable solder mask may be a solder resist ink of any color, such as green, red, or white. The solder resist ink is in a tacky state before use, and after printing, pre-baking, alignment, exposure, development, and curing, the solder resist layer 58 is formed, completely covering the surface of the stiffener 57 facing away from the substrate body 5. The solder resist layer 58 has advantages such as corrosion resistance, high temperature resistance, and high insulation, and therefore provides good protection for the LED package structure, and its high insulation property prevents the element from being easily short-circuited.

[0128] In some examples, as shown in Fig. 33, the method may further include cutting the package after a solder resist layer 58 is provided on the surface of the stiffener 57 facing the substrate body 5. Optionally, the disposed epoxy resin fluorescent gel 510 is first placed in a compressor, and the corresponding parameters are adjusted to perform a packaging process on the preheated and washed semi-finished product. After the packaging is completed and baked, a blade of a corresponding thickness is attached to a cutting machine, and a corresponding cutting process is performed on the entire substrate body 5 to finally obtain the required product. [Example]

[0129] Fresh food lighting is a new type of specialized lighting designed specifically for fresh food illumination, enhancing the color characteristics of fresh food and stimulating purchasing desire. The spectrum of existing fresh food lighting on the market is primarily a mixture of ordinary white light or monochromatic light, without consideration for precise color management or individual and reasonable adjustment of color restoration ability according to the object being illuminated. Common fresh food lighting solutions on the market typically use a combination of white bead lamps and red bead lamps, resulting in relatively poor mixed light effects. Other solutions use a combination of blue light chips, green fluorescent powder, and red fluorescent powder. The normalized spectrograms of the excited white light for fresh food are shown in Figures 34 and 35. The wavelength corresponding to the peak of the red light wavelength band in the two normalized spectrograms is less than 600 nm, resulting in insufficient red light transmittance. This results in cross-colored fresh food lighting and poor color restoration of fresh meat. In addition, the relative optical power (i.e., relative light intensity) of the peak of the red wavelength band in the two normalized spectrograms is less than 0.75, which results in a relatively poor red coloring effect for fresh produce. Furthermore, because the red wavelength band and the green wavelength band are connected, yellow light is easily generated, which affects the red saturation of the fresh meat, resulting in a brown color that can easily mislead consumers. This is a common problem with conventional fresh food lighting.

[0130] To address the above-mentioned issues, this embodiment provides two types of light-emitting units applicable to (but not limited to) fresh food lighting fixtures. The advantages of these light-emitting units are that they can effectively restore the color of fresh food, suppress yellow light to a certain extent, avoid the impact of yellow light on the red saturation of fresh meat, further improve the color restoration of fresh food lighting, suppress the brown color that affects purchasing desire, and present a red color that is more suitable for fresh meat. The light-emitting units provided by this embodiment can be applied to various fresh food lighting devices, such as, but not limited to, lighting fresh meats such as fresh pork and fresh beef. The fresh food lighting device can also be a fresh food lighting fixture or an electronic device such as a refrigerator or freezer with fresh food lighting function. For ease of understanding, this embodiment will hereinafter exemplify two types of light-emitting units.

[0131] 36 and 37, an example light emitting unit includes an LED bracket 60 (the LED bracket shown in each of the above embodiments may be selected, or a bracket with another structure may be selected; this embodiment is not limited to the LED bracket), a red LED chip 61, a blue LED chip 62, and a packaging layer, of which the packaging layer includes a green medium 63. The LED bracket 60 has a substrate, and the red LED chip 61 and the blue LED chip 62 are both mounted on the substrate, and the green medium 63 covers the red LED chip 61 and the blue LED chip 62. The red LED chip 61 and the blue LED chip 62 excite the green medium 63 to emit white light. The normalized spectrogram of the emitted white light satisfies the following condition: The normalized spectrogram includes a first red light wavelength band and a green light wavelength band, the full width at half maximum of the first red light wavelength band is 15 nm to 30 nm, the peak of the first red light wavelength band is a first peak, the relative optical power corresponding to the first peak is 0.9 to 1, and the wavelength corresponding to the first peak is 645 nm to 665 nm.

[0132] Optionally, the red LED chip 61 may be vertically or horizontally structured, and similarly, the blue LED chip 62 may be vertically or horizontally structured. The red LED chip 61 and the blue LED chip 62 are fixed to the bottom of the LED bracket 60 with a chip fixing gel and baked at 150°C for 1-2 hours to fully harden the chip fixing gel. For horizontally structured chips, a transparent silicone resin chip fixing gel is used, while for vertically structured chips, a silver-doped silicone resin chip fixing gel is used. Bonding wires must be provided between the red LED chip 61 and the blue LED chip 62 and the LED bracket 60. The bonding wires are typically 0.9 mil 80% Au, and are optionally bonded using an M or S wire arc process. The placement and connection method of the bonding wires are determined by the combination of the LED bracket 60 structure and the red LED chip 61 and the blue LED chip 62 structure, as long as they achieve circuit continuity. A vertically structured red LED chip 61 and a horizontally structured blue LED chip 62 are preferred, and the bracket, the blue LED chip 62, and the red LED chip 61 are connected in sequence by bonding wires.

[0133] As shown in FIG. 38, the normalized spectrogram of white light satisfies the following conditions:

[0134] The normalized spectrogram includes a first red wavelength band, and the full width at half maximum of the first red wavelength band is 15 nm to 30 nm. Specifically, the full width at half maximum of the first red wavelength band may be selected from 15 nm, 18 nm, 24 nm, 27 nm, 30 nm, etc., and is preferably 30 nm, and the half wavelength range is 640 nm to 670 nm.

[0135] The peak of the first red light wavelength band is the first peak, the relative optical power corresponding to the first peak is 0.9 to 1, and the wavelength corresponding to the first peak is 645 nm to 665 nm. Specifically, the relative optical power (i.e., relative optical intensity) corresponding to the first peak is 0.9, 0.92, 0.95, 0.99, 1, etc., with 1 being preferred. The wavelength corresponding to the first peak may be selected from 645 nm, 651 nm, 654 nm, 659 nm, 665 nm, etc., with 660 nm being preferred.

[0136] In the scheme where red LED chip 61 and blue LED chip 62 are used to excite green medium 63, the full width at half maximum of the excited first red light wavelength band is 15nm to 30nm, resulting in relatively concentrated energy and high red light saturation, and the wavelength of the first peak of the first red light wavelength band is 650nm to 670nm, resulting in strong red light transmittance and good color restoration of fresh meat. At the same time, the relative optical power corresponding to the first peak of the first red light wavelength band is 0.9 to 1, resulting in good red coloring effect of fresh food. In addition, the first red light wavelength band with the above parameters suppresses the generation of yellow light to a certain extent, preventing the yellow light from affecting the red saturation of fresh meat. This further improves the color restoration of fresh food lighting, suppressing the brown that affects purchasing desire and presenting a red that is more suitable for fresh meat.

[0137] In one embodiment, as shown in Figure 38, the normalized spectrogram further includes a green light wavelength band. The full width at half maximum of the green light wavelength band is 35 nm to 60 nm. Specifically, the full width at half maximum of the green light wavelength band may be selected from 35 nm, 41 nm, 48 nm, 53 nm, 57 nm, 60 nm, etc., with 60 nm being preferred, and the half wavelength range is 510 nm to 570 nm. By setting the full width at half maximum of the green light wavelength band to 35 nm to 60 nm, the green light wavelength band does not affect the coloring effect of white fresh foods, nor does it affect the coloring effect of red fresh foods. If the full width at half maximum of the green light wavelength band is 35 nm or less, the process cost is relatively high, the colors are easily inconsistent, and the white color is easily cross-colored, which is unfavorable for restoring the color of the white parts of fresh meat. However, if the full width at half maximum of the green light wavelength band is 60 nm or more, the proportion of the green light wavelength band in the white light is too large, so the red light is easily affected and the red color is easily cross-colored, which is unfavorable for the color development of the red parts of fresh meat.

[0138] The peak of the green light wavelength band is the second peak, and the relative optical power corresponding to the second peak is 0.2 to 0.4, with the wavelength corresponding to the second peak being 530 nm to 550 nm. Specifically, the relative optical power corresponding to the second peak may be selected as 0.2, 0.24, 0.29, 0.34, 0.38, 0.4, etc. The wavelength corresponding to the second peak may be selected as 530 nm, 532 nm, 538 nm, 544 nm, 550 nm, etc., with 540 nm being preferred. Setting the relative optical power of the second peak to 0.2 to 0.4 does not affect the white coloring, while improving the red coloring, which is advantageous for avoiding cross-color in lighting fresh food. The wavelength corresponding to the second peak is 530 nm to 550 nm, which is far from the first peak of the first red light wavelength band, and therefore is less likely to affect the red coloring.

[0139] In one embodiment, as shown in FIG. 38 , the normalized spectrogram further includes a yellow wavelength band, the wavelength range of which is 585 nm to 630 nm, and the relative optical power of the yellow wavelength band is less than 0.15. Specifically, the left side of the yellow wavelength band is connected to the green wavelength band, and the right side is connected to the red wavelength band. The yellow wavelength band has a concave shape, i.e., the relative optical power corresponding to the left and right sides of the yellow wavelength band is higher than the relative optical power corresponding to the center. By making the relative optical power of the yellow wavelength band less than 0.15, the generation of yellow light is further suppressed, the influence of yellow light on the red saturation of fresh meat is avoided, and the brown color is suppressed, which is favorable for the development of a red color more suitable for fresh meat.

[0140] In one embodiment, as shown in Figure 38, the normalized spectrogram further includes a blue wavelength band, and the blue wavelength band has a full width at half maximum (FWHM) of 15 nm to 30 nm. Specifically, the FWHM of the blue wavelength band may be selected from 15 nm, 17 nm, 19 nm, 22 nm, 26 nm, 29 nm, 30 nm, etc., with 15 nm being preferred, and the half wavelength range being 435 nm to 465 nm. By setting the FWHM of the blue wavelength band to 15 nm to 30 nm, the blue wavelength band can generate a white color that meets the requirements for fresh food without affecting the red color of fresh food. It should be understood that if the FWHM of the blue wavelength band is less than 15 nm, the manufacturing process will be difficult and the wafer substrate will be more demanding. If the full width at half maximum of the blue light wavelength band is more than 30 nm, the brightness of the entire wafer is significantly reduced, and the white light becomes unbalanced and appears pale, which is detrimental to the fresh appearance of the white area.

[0141] The peak of the blue light wavelength band is the third peak, and the relative optical power corresponding to the third peak is 0.3 to 0.5, with the wavelength corresponding to the third peak being 445 nm to 455 nm. Specifically, the relative optical power of the third peak may be selected as 0.3, 0.34, 0.39, 0.44, 0.5, etc. The wavelength corresponding to the third peak may be selected as 445 nm, 447 nm, 449 nm, 451 nm, 452 nm, 454 nm, 455 nm, etc., with 450 nm being preferred. Setting the relative optical power of the third peak to 0.3 to 0.5 does not affect the white color, but enhances the red color, which is advantageous for avoiding cross-color in lighting fresh food. The wavelength corresponding to the second peak is 445 nm to 455 nm, which can generate a white color that meets the requirements of white-area fresh food.

[0142] To accurately define the spectral radiation distribution, it should be understood that the relative optical power corresponding to the first peak in the red wavelength band is 0.9 to 1, the relative optical power corresponding to the first peak in the green wavelength band is 0.2 to 0.4, and the relative optical power corresponding to the third peak in the blue wavelength band is 0.3 to 5.

[0143] In one embodiment, as shown in FIG. 38 , the normalized spectrogram further includes a blue light wavelength band, the wavelength range corresponding to the blue light wavelength band being 465 nm to 515 nm, and the relative optical power of the blue light bottom is less than 0.1. Specifically, the left side of the blue light wavelength band is connected to the indigo light wavelength band, and the right side is connected to the green light wavelength band. The blue light wavelength band has a concave shape, i.e., the relative optical power corresponding to the left and right sides of the blue light wavelength band is higher than the relative optical power corresponding to the center. By making the relative optical power of the blue light bottom less than 0.1, the generation of blue light is suppressed, and the influence of blue light on the red color of fresh food and the influence of blue light on the white color of fresh food are avoided, which is advantageous for improving the freshness appearance of fresh meat.

[0144] In one embodiment, as shown in FIG. 38, the normalized spectrogram further includes a violet wavelength band, the wavelength range corresponding to the violet wavelength band is 350 nm to 420 nm, and the relative optical power of the violet wavelength band is less than 0.1. Specifically, the violet wavelength band is connected to the left side of the indigo wavelength band. The violet wavelength band decreases as the corresponding wavelength decreases (it decreases to a certain extent and then remains almost unchanged). By making the relative optical power of the violet wavelength band less than 0.1, the probability of appearing pale can be reduced, further improving the freshness of the white areas.

[0145] 38, the normalized spectrogram further includes a second red light wavelength band adjacent to the first red light wavelength band, the wavelength range corresponding to the second red light wavelength band is 680 nm to 780 nm, and the relative optical power of the second red light wavelength band is less than 0.1. Specifically, the left side of the second red light wavelength band is adjacent to the first red light wavelength band. By making the relative optical power of the second red light wavelength band less than 0.1, the saturation of red light is improved, and the freshness of the red area is improved.

[0146] 36 and 37, the material of the green medium 63 includes β-sialon, the material of the blue LED chip 62 includes gallium nitride (GaN), and the material of the red LED chip 61 includes aluminum indium gallium phosphide (AlGaInP). It should be understood that the wavelength positions corresponding to the full width at half maximum and peaks of the red light wavelength band, blue light wavelength band, and green light wavelength band are determined by the above materials, which leads to the acquisition of white light that matches the normalized spectrogram provided by the embodiment of the present invention.

[0147] In one embodiment, the light-emitting unit further includes an encapsulant 64 filled in a bowl-shaped cup 65. The green medium 63 and the encapsulant 64 are mixed at a ratio of 1:12 to 1:2. Specifically, the ratio may be 1:12, 1:11, 1:10.5, 1:8, 1:6.5, 1:4.5, 1:3, or 1:2. The encapsulant 64 and the green medium 63 are mixed uniformly using a stirrer. The stirring conditions may be 200 to 400 seconds, and the stirring speed may be 1000 n / min to 2000 n / min, which is advantageous for uniformly mixing the encapsulant 64 and the green medium 63. After the mixture of the encapsulant 64 and the green medium 63 is poured into the bowl-shaped cup 65 of the LED bracket 60, it is baked at 150°C for 3 to 4 hours to harden the mixture and complete the package. It should be understood that by making the mixing ratio of the green medium 63 and the sealing material 64 1:12 to 1:2, it is advantageous to adjust the heights (relative optical power) of the first peak, second peak, and third peak, and the spectral radiation distribution is more accurately defined.

[0148] In one embodiment, in the CIE1931 (also known as CIE1931 color space) chromaticity diagram, the distribution range of white light on the X axis is 0.31 to 0.39, the distribution range on the Y axis is 0.3 to 0.4, and the color temperature range of white light is 4000K to 7000K, specifically, 4000K, 4300K, 4500K, 4900K, 5120K, 5870K, 6370K, and 700K. By setting the color temperature of white light to 4000K to 7000K, the freshness and appearance effect of the light emitting unit provided by the embodiment of the present invention is fully exhibited, and the light is easily adapted to the human eye, without problems such as being too dazzling or too dark. Furthermore, the CIE1931 distribution of white light is relatively reasonable, which leads to an improved freshness and appearance effect.

[0149] 39 and 40, another example of a light-emitting unit includes an LED bracket 70, a blue LED chip 71, a red medium 72, and a green medium 73. The LED bracket 70 has a bowl-shaped cup 75, the blue LED chip 71 is placed in the bowl-shaped cup 75, and the red medium 72 and the green medium 73 are mixed and filled into the bowl-shaped cup 75, covering the blue LED chip 71. The blue LED chip 71 excites the red medium 72 and the green medium 73 to emit white light.

[0150] Optionally, the blue LED chip 71 in this example may be mounted in either a permanent or flip-type structure. For example, in the permanent mounting structure, the blue LED chip 71 is fixed to the LED bracket 70 with a chip fixing gel and baked at 150°C for 1-2 hours to fully harden the chip fixing gel. In the flip-type structure, the blue LED chip 71 is fixed to the LED bracket 70 with a high-temperature tin paste and then reflow soldered. The maximum furnace temperature for reflow soldering is 290°C, the time is approximately 30 seconds, and a nitrogen gas atmosphere is required to fully melt the solder and ensure complete adhesion between the blue LED chip 71 and the LED bracket 70. Furthermore, in the permanent mounting structure, a wire bonding process is required. Typically, the bonding wire is 0.9 mil 80% Au, and an S or M wire arc process is used. The arrangement and connection method of the bonding wires are determined by the combination of the structure of the LED bracket 70 and the structure of the blue LED chip 71, and may be any arrangement that can achieve circuit conduction.

[0151] As shown in FIG. 41, in this example the normalized spectrogram of white light satisfies the following conditions:

[0152] The spectrogram includes a red wavelength band and a green wavelength band, the full width at half maximum of the red wavelength band being 80 nm to 100 nm, the peak of the red wavelength band being a first peak, the relative optical power corresponding to the first peak being 0.75 to 0.95, the wavelength corresponding to the first peak being 645 nm to 665 nm, the full width at half maximum of the green wavelength band being 45 nm to 70 nm, the peak of the green wavelength band being a second peak, the wavelength corresponding to the second peak being 500 nm to 520 nm. Specifically, the full width at half maximum of the red wavelength band may be selected from 80 nm, 84 nm, 86 nm, 89 nm, 94 nm, 96 nm, 100 nm, etc., preferably 100 nm, and the half wavelength range is 610 nm to 710 nm. The relative optical power corresponding to the first peak may be selected from 0.75, 0.79, 0.84, 0.89, 0.93, 0.95, etc. The wavelength corresponding to the first peak may be selected from 645 nm, 646 nm, 649 nm, 653 nm, 659 nm, 663 nm, 665 nm, etc., and is preferably 660 nm. The full width at half maximum of the green light wavelength band may be selected from 45 nm, 46 nm, 49 nm, 53 nm, 55 nm, 61 nm, 67 nm, 69 nm, 70 nm, etc., and is preferably 70 nm, and the half wavelength range is 480 nm to 550 nm. The wavelength corresponding to the second peak may be selected from 500 nm, 503 nm, 509 nm, 511 nm, 516 nm, 519 nm, 520 nm, etc.

[0153] If the FWHM of the green light wavelength band is 45nm or less, the process cost is relatively high, the colors are easily inconsistent, and the white color is easily cross-colored, which is unfavorable for restoring the color of the white parts of fresh meat. However, if the FWHM of the green light wavelength band is 70nm or more, the proportion of the green light wavelength band in the white light is too large, which interferes with the red light and is easily cross-colored, which is unfavorable for color development of the red parts of fresh meat. In the case of using a blue light LED chip 71 to excite the red medium 72 and the green medium 73, the wavelength corresponding to the first peak of the excited red light wavelength band is 645nm to 665nm, which has strong red light transmittance and can effectively restore the color of fresh food. The relative optical power corresponding to the first peak is 0.75 to 0.95, which provides a good red color development effect. At the same time, the wavelength corresponding to the second peak of the green light wavelength band is 500nm to 520nm, and the full width at half maximum of the green light wavelength band is 45nm to 70nm, so the green light wavelength band is less likely to interfere with the red light wavelength band and is less likely to produce yellow light, which prevents the yellow light from affecting the red saturation of fresh meat. This further improves the color restoration of fresh food lighting, suppresses the brown that affects purchasing desire, and shows a red that is more suitable for fresh meat.

[0154] 41, the relative optical power corresponding to the second peak is 0.4 to 0.7. Specifically, the relative optical power corresponding to the second peak may be selected as 0.4, 0.5, 0.6, 0.7, etc. By setting the relative optical power of the second peak to 0.4 to 0.7, it is possible to avoid red cross color caused by oversaturation of green light and white cross color caused by undersaturation.

[0155] In one embodiment, as shown in FIG. 41 , the normalized spectrogram further includes a yellow wavelength band, the wavelength range of which is 560 nm to 590 nm, and the relative optical power of the yellow wavelength bottom is 0.05 to 0.25. Specifically, the left side of the yellow wavelength band is connected to the green wavelength band, and the right side is connected to the red wavelength band. The yellow wavelength band has a concave shape, i.e., the relative optical power corresponding to the left and right sides of the yellow wavelength band is higher than the relative optical power corresponding to the center. By setting the relative optical power of the yellow wavelength bottom to 0.05 to 0.25, the generation of yellow light is further suppressed, the influence of yellow light on the red saturation of fresh meat is avoided, and the brown color is suppressed, which is favorable for the development of a red color more suitable for fresh meat.

[0156] In one embodiment, as shown in Figure 41, the normalized spectrogram further includes a blue wavelength band, and the blue wavelength band has a full width at half maximum of 15 nm to 30 nm. Specifically, the full width at half maximum of the blue wavelength band may be selected from 15 nm, 17 nm, 19 nm, 22 nm, 26 nm, 29 nm, 30 nm, etc., with 15 nm being preferred, and the half wavelength range being 435 nm to 465 nm. By setting the full width at half maximum of the blue wavelength band to 15 nm to 30 nm, the blue wavelength band can generate a white color that meets the requirements for fresh food without affecting the red color of fresh food. It should be understood that if the full width at half maximum of the blue wavelength band is less than 15 nm, the manufacturing process will be difficult and the wafer substrate will be more demanding. If the full width at half maximum of the blue light wavelength band is more than 30 nm, the brightness of the entire wafer is significantly reduced, and the white light becomes unbalanced and appears pale, which is detrimental to the fresh appearance of the white area.

[0157] The peak of the blue light wavelength band is the third peak, and the relative optical power corresponding to the third peak is 0.9 to 1, with the wavelength corresponding to the third peak being 445 nm to 455 nm. Specifically, the relative optical power of the third peak may be selected from 0.9, 0.91, 0.93, 0.96, 0.98, 1, etc., with 1 being preferred. The wavelength corresponding to the third peak may be selected from 445 nm, 447 nm, 449 nm, 451 nm, 452 nm, 454 nm, 455 nm, etc., with 450 nm being preferred. Setting the relative optical power of the third peak to 0.9 to 1 allows for favorable red coloring without affecting white coloring, which is advantageous for avoiding cross-color in lighting fresh food. The wavelength corresponding to the third peak is 445 nm to 455 nm, which allows for favorable white coloring that meets the requirements of white-area fresh food.

[0158] To accurately define the spectral radiation distribution, it should be understood that the relative optical power corresponding to the first peak in the red wavelength band is 0.75 to 0.95, the relative optical power corresponding to the green wavelength band is 0.4 to 0.7, and the relative optical power corresponding to the third peak in the blue wavelength band is 0.9 to 1.

[0159] In one embodiment, as shown in FIG. 41 , the normalized spectrogram further includes a blue light wavelength band, the wavelength range corresponding to the blue light wavelength band being 460 nm to 490 nm, and the relative optical power of the blue light bottom being 0.15 to 0.35. Specifically, the left side of the blue light wavelength band is connected to the indigo light wavelength band, and the right side is connected to the green light wavelength band. The blue light wavelength band has a concave shape, i.e., the relative optical power corresponding to the left and right sides of the blue light wavelength band is higher than the relative optical power corresponding to the center. By setting the relative optical power of the blue light bottom to 0.15 to 0.35, the generation of blue light is suppressed, and the influence of blue light on the red color of fresh food and the influence of blue light on the white color of fresh food are avoided, which is advantageous for improving the freshness appearance of fresh meat.

[0160] In one embodiment, as shown in FIG. 41, the normalized spectrogram further includes a violet wavelength band, the wavelength range corresponding to the violet wavelength band is 350 nm to 420 nm, and the relative optical power of the violet wavelength band is less than 0.1. Specifically, the violet wavelength band is connected to the left side of the indigo wavelength band. The violet wavelength band decreases as the corresponding wavelength decreases (it decreases to a certain extent and then remains almost unchanged). By making the relative optical power of the violet wavelength band less than 0.1, the probability of appearing pale can be reduced, and the freshness of the white area can be further improved.

[0161] In one embodiment, as shown in Figure 41, the normalized spectrogram further includes an infrared wavelength band adjacent to the red wavelength band, where the corresponding wavelength of the infrared wavelength band is greater than 780 nm and the relative optical power of the infrared wavelength band is less than 0.1. Specifically, the left side of the infrared wavelength band is adjacent to the red wavelength band. By making the relative optical power of the infrared wavelength band less than 0.1, the saturation of the red light can be improved, thereby improving the freshness of the red area.

[0162] 41, the red medium 72 is made of a nitride, the green medium 73 is made of β-sialon and / or silicate, and the blue LED chip 71 is made of gallium nitride (GaN). Specifically, the green medium 73 may contain either β-sialon or silicate, or both β-sialon and silicate. It should be understood that the wavelength positions corresponding to the peaks and full widths at half maximum (FWHM) of the red, blue, and green wavelength bands are determined by the materials, which can lead to the acquisition of white light that matches the normalized spectrogram provided by the embodiment of the present invention.

[0163] 41, the ratio of the red medium 72 to the green medium 73 ranges from 1:13 to 1:4. Specifically, the ratio of the red medium 72 to the green medium 73 may be selected as 1:13, 1:12, 1:9, 1:7, 1:6, 1:5, 1:4.5, 1:4, etc. By appropriately adjusting the mixing ratio of the red medium 72 to the green medium 73, it is advantageous to adjust the heights (relative optical power) of the first, second, and third peaks, and the spectral radiation distribution can be precisely defined.

[0164] 41, the light-emitting unit further includes an encapsulant 50 filled in a bowl-shaped cup 75. The mixture ratio of the red medium 72 and the green medium 73 to the encapsulant 50 ranges from 1:8 to 1:1.8. Specifically, the ratio of the red medium 72 and the green medium 73 to the encapsulant 50 may be selected from the following: 1:8, 1:7, 1:6, 1:5.5, 1:5, 1:4.5, 1:3, 1:2, 1:1.8, etc. The mixture of the red medium 72 and the green medium 73 and the encapsulant 50 are uniformly mixed using a stirrer. The stirring conditions may be 200 to 400 seconds, and the stirring speed may be 1000 n / min to 2000 n / min, which is advantageous for uniformly mixing the encapsulant 50 and the green medium 73. After the mixture of the encapsulant 50 and the green medium 73 is poured into the bowl-shaped cup 75 of the LED bracket 70, it is baked at 150°C for 3 to 4 hours to harden the mixture and complete the package. It should be understood that a mixture ratio of the green medium 73 to the encapsulant 50 of 1:12 to 1:2 is advantageous for adjusting the heights of the first, second, and third peaks, and more precisely defines the spectral radiation distribution.

[0165] In one embodiment, on the CIE 1931 chromaticity diagram, the distribution range of white light on the X axis is 0.32 to 0.38, the distribution range on the Y axis is 0.275 to 0.34, and the color temperature range of white light is 4000K to 6200K. Specifically, the color temperature may be selected from 4000K, 4230K, 4500K, 4900K, 5120K, 5530K, 5870K, 6200K, etc. By setting the color temperature of white light to 4500K to 8000K, the freshness and appearance effect of the light emitting unit provided by the embodiment of the present invention is fully exhibited, and the light is easily adapted to the human eye without being too dazzling or too dim. Furthermore, the CIE 1931 chromaticity range of white light is relatively reasonable, ensuring the freshness and appearance effect. [Example]

[0166] Currently, backlight modules are one of the key components of display units, providing the display unit with a light source. Lightweight, thin, energy-saving, and HDR (High Dynamic Range) are the development trends for display units. These demands necessitate the LED light-emitting units in backlight modules with small dimensions, high brightness, and a large output angle. In conventional LED light-emitting units, the output angle of the LED chip is limited by the LED bracket, which affects the overall light-emitting brightness and output angle of the LED light-emitting unit. Increasing the brightness and output angle by increasing the light-mixing distance from the LED chip's light-emitting surface to the backlight module's output surface or by adding more LEDs fails to meet the requirements for lighter weight, thinner, and more energy-saving display devices. Therefore, how to increase the output angle of the LED light-emitting unit is an urgent issue that needs to be addressed.

[0167] To address the above-mentioned problem, this embodiment provides a light-emitting unit with an improved emission angle, which includes an LED chip and an LED bracket. The LED bracket in this embodiment may be the LED bracket shown in each of the above-mentioned embodiments, or may be an LED bracket with other bowl-shaped cup structures; this embodiment is not limited to the LED bracket. The LED chip is mounted at the bottom of the bowl-shaped cup of the LED bracket, and the positive and negative electrodes of the LED chip are electrically connected to the two conductive regions, respectively. The light emitting unit further includes a packaging layer disposed within the bowl-shaped cup, the packaging layer including a first encapsulant layer and a second encapsulant layer, the first encapsulant layer covering the LED chip, the surface of the second encapsulant layer facing away from the LED chip having a spherical protruding shape, light emitted from the surface of the LED chip being refracted out of the LED device via the first encapsulant layer and the spherically protruding second encapsulant layer, and the spherically protruding surface of the second encapsulant layer facing away from the LED chip increasing the emission angle of the LED device, thereby further increasing the overall emission angle, and simultaneously improving the emission angle and the luminous brightness of the LED device. For ease of understanding, the following embodiments will be described with reference to several examples shown in the drawings.

[0168] As shown in FIG. 42, the light emitting unit provided by one example of this embodiment includes an LED bracket 8, and the LED bracket 8 includes a positive substrate 81 (i.e., one conductive area), a negative substrate 82 (i.e., the other conductive area), and an isolation area 83 that insulates and isolates the positive substrate 81 and the negative substrate 82, and further includes an LED chip 84. The package of the LED bracket 8 is provided on the surfaces of the positive substrate 81 and the negative substrate 82 and surrounds them to form a bowl-shaped cup, and the LED chip 84 is provided on at least one of the positive substrate 81 and the negative substrate 82, and the LED bracket 8 and the positive substrate 82 The bowl-shaped structure formed by the plate 81 and the negative substrate 82 is filled with a first encapsulant layer 85 and a second encapsulant layer 86 in sequence. The first encapsulant layer 85 covers the LED chip 84, and the surface of the second encapsulant layer 86 facing away from the LED chip 84 has a spherical protruding shape. The first encapsulant layer 85 and the second encapsulant layer 86 isolate moisture and protect the LED chip 84. At the same time, the light emitted from the LED chip 84 is refracted, reflected, and diffused by the first encapsulant layer 85 and the second encapsulant layer 86, so that the light emitted from the surface of the LED chip 84 is refracted to the periphery and the emission angle of the light-emitting unit is increased.

[0169] In this example, as shown in FIG. 42, the second encapsulant layer 86 completely covers the first encapsulant layer 85, wherein the first encapsulant layer 85 and / or the second encapsulant layer 86 may be a transparent gel layer formed by hardening a transparent gel, which may include, but is not limited to, epoxy resin, silica gel, silicone resin, etc. Of course, the first encapsulant layer 85 and / or the second encapsulant layer 86 may also be a fluorescent gel layer formed by mixing a transparent gel with fluorescent powder and hardening it.

[0170] In this embodiment, the positive substrate 81 and the negative substrate 82 are conductive substrates. The conductive substrates in this embodiment may be substrates made of various conductive materials, such as various metal conductive substrates, including, but not limited to, copper substrates, aluminum substrates, iron substrates, and silver substrates. The conductive substrate may also be a composite conductive substrate containing conductive materials, such as conductive rubber. It should be understood that the LED chip 84 is fixed to at least one conductive substrate by a chip fixing gel, such as silver paste or insulating adhesive. The LED chip 84 may be a fully mounted LED chip, which is electrically connected to the substrate by bonding wires, or a flip LED chip, which is electrically connected to the substrate by a eutectic process. The light-emitting surface of the LED chip 84 is covered with a reflective layer of various thicknesses. The reflective layer may be made of various materials and thicknesses as needed to increase the half-value angle of the chip and further increase the emission angle of the light-emitting unit.

[0171] 42 , the height h of the bowl-shaped structure of the first encapsulant layer 85 formed by the LED bracket 8 and the positive and negative substrates 81 and 82 does not exceed the height H of the package. It should be understood that because the first encapsulant layer 85 covers the LED chip 84, the minimum height h of the bowl-shaped structure of the first encapsulant layer 85 exceeds the height h1 of the LED chip 84. It should be understood that in some application scenarios, the minimum height h of the bowl-shaped structure of the first encapsulant layer 85 covers the bonding wires, and when the bonding wires are covered, the LED chip 84 is also covered. In particular, the first encapsulant layer 85 completely covers the LED chip 84, thereby refracting and diffusively reflecting light emitted from the surface of the LED chip 84 toward the second encapsulant layer 86 and the LED bracket 8, respectively, thereby increasing the light emission angle of the LED chip 84.

[0172] In another example of this embodiment, as shown in FIG. 43, the top surface of the first encapsulant layer 85 and the top surface of the LED bracket are flush with each other.

[0173] In some examples of this embodiment, the surface of the first encapsulant layer 85 facing away from the LED chip 84 may be an arc-shaped surface recessed toward the LED chip 84. The arc-shaped recessed surface of the first encapsulant layer 85 changes the reflection and refraction angles of light, allowing the light to be easily emitted toward the LED bracket 8 and the second encapsulant layer 86, thereby making the light emission from the light emitting unit more uniform and further increasing the light emission angle of the light emitting unit, as shown in Figures 43 and 44. The minimum height of the recessed first encapsulant layer 85 is the same as the LED chip 84. It should be understood that the first encapsulant layer 85 may be recessed directly from the position where it contacts the LED bracket 8, or the first encapsulant layer 85 may be held horizontally at a certain distance from the transparent bracket before being recessed. It should be understood that in some examples, the first encapsulant layer 85 has a horizontal structure and is not recessed.

[0174] In some examples of this embodiment, as shown in FIG. 45, the width E of the second encapsulant layer 86 is equal to or less than the width e of the top surface of the bowl-shaped structure, so that the second encapsulant layer 86 is limited to the bowl-shaped structure of the light-emitting unit, and the bonding strength thereof is improved. The width E of the second encapsulant layer 86 is at least the width E1 of the surface of the first encapsulant layer 85 that faces away from the LED chip 84, so that the first encapsulant layer 85 is completely covered, and the LED chip 84 is completely covered by the first encapsulant layer 85, so that the light emitted from the surface of the LED chip 84 is respectively radiated through the second encapsulant layer 86 and the first encapsulant layer 85. It should be understood that the light emitted from the LED chip 84 is refracted and diffusely reflected by the first encapsulant layer 85 toward the second encapsulant layer 86, and is further refracted and diffusely reflected by the second encapsulant layer 86, thereby increasing the light emission angle of the LED chip 84.It should be understood that, as shown in Figures 43 and 44, when the first encapsulant layer 85 is recessed, the surface of one side of the second encapsulant layer 86 that is closer to the first encapsulant layer 85 protrudes toward the first encapsulant layer 85, and the protruding position coincides with the recessed position of the first encapsulant layer 85.

[0175] It should be understood that the surface of the second encapsulant layer 86 facing away from the LED chip 84 has a spherical protruding shape, forming a convex lens shape and diverging light, thereby increasing the light emission angle of the light-emitting unit. Meanwhile, the height of the second encapsulant layer 86 is not limited, that is, the protruding radian of the second encapsulant layer 86 is not limited. Preferably, as shown in FIG. 44, the height k of the second encapsulant layer 86 itself should not exceed the height K of the LED bracket 8, so that the protruding radian of the second package is kept within a reasonable range. In some examples of this embodiment, the refractive index of the first encapsulant layer 85 is greater than the refractive index of the second encapsulant layer 86, and the refractive index of the second encapsulant layer 86 is greater than the refractive index of air, so that the light emitted from the LED chip 84 is refracted by the first encapsulant layer 85 to reach the second encapsulant layer 86, and is further refracted to the outside by the second encapsulant layer 86. As a result, most of the light emitted directly from the front of the LED chip 84 is refracted to the periphery, increasing the emission angle of the light-emitting unit, and the emission angle of the light-emitting unit can reach a maximum of 180°.

[0176] In some examples of this embodiment, the package formed in the bowl-shaped cup of the LED bracket 8 may be, but is not limited to, a transparent bracket. That is, the LED bracket 8 may be made of a transparent material, such as a transparent thermoplastic plastic such as transparent resin, PPA (Polyphthalamide), or EMC (Epoxy Molding Compound), and the like. The light emitted from the LED chip 84 passes directly through the LED bracket 8 to reach the outside, thereby further increasing the emission angle of the light-emitting unit. It should be understood that in some instances, the LED bracket 8 may use materials employed in non-transparent brackets, such as epoxy resins (EP), high-temperature resistant nylon (PPA plastic), polyphthalamide (PPA), poly-1,4-cyclohexanedimethyleneterephthalate (PCT), liquid crystal polymer (LCP), sheet molding compound (SMC), epoxy molding compound (EMC), unsaturated polyester (UP) resin, polyethylene terephthalate (PET), polycarbonate (PC), polyhexamethylene adipamide (nylon 66), glass fiber, and the like.

[0177] In some examples of this embodiment, the LED chip 84 is provided with a DBR (distributed Bragg reflector). For example, the front surface of the LED chip 84 is coated with a DBR, which reduces the light emission from the front and increases the light emission area from the side wall, thereby further increasing the emission angle. Furthermore, by combining it with a transparent LED bracket 8, the light emission efficiency of the side wall of the light-emitting unit is further improved, and the overall light emission efficiency is further improved.

[0178] In some examples of this embodiment, the upper surface of the LED bracket 8 is zigzag C. As shown in Figures 46 and 47, the zigzag shape of the upper surface of the LED bracket 8 can enhance the bonding ability between the second encapsulant layer 86 and the LED bracket 8 when the second encapsulant layer 86 and the LED bracket 8 are bonded together. At the same time, the zigzag shape of the upper surface of the LED bracket 8 achieves the purpose of suppressing the fluidity of the second encapsulant layer 86 and controlling the molding of the second encapsulant layer 86.

[0179] In some examples of this embodiment, the LED chip 84 includes at least one of a red LED chip, a green LED chip, a blue LED chip, and a yellow LED chip, which can be freely selected according to specific application needs and will not be described in detail here.

[0180] In some examples of this embodiment, the insulating region 83 is further included, and the insulating region 83 is provided in an insulating separator, but is not limited to these. It should be understood that the insulating separator is located between the positive substrate 81 and the negative substrate 82, insulating and isolating them, and the material of the insulating separator may be the same as or different from the material of the LED bracket 8.

[0181] For better understanding, this embodiment provides a more specific example to describe the light emitting unit. As shown in Fig. 48, the first encapsulant layer 85 covers the LED chip 84, the upper surface of the first encapsulant layer 85 is flush with the upper surface of the LED bracket, and the surface of the first encapsulant layer 85 facing away from the LED chip 84 is an arc-shaped surface recessed toward the LED chip 84. The width of the second encapsulant layer 86 is the same as the width of the upper surface of the bowl-shaped structure, completely covering the first encapsulant layer 85. The surface of the second encapsulant layer 86 facing away from the LED chip 84 protrudes toward the first encapsulant layer 85, and the protruding position coincides with the recessed position toward the first encapsulant layer 85. The surface of the second encapsulant layer 86 facing away from the LED chip 84 has a spherical protruding shape, forming a convex lens-like shape that diverges light, thereby further increasing the light emission angle of the light emitting unit.

[0182] This embodiment further provides a light emitting assembly, which may be, but is not limited to, a backlight module, including a driving circuit and the above-mentioned light emitting units, the driving circuit being connected to the light emitting units, and the backlight module has a larger light emitting angle, thereby improving its coloring effect, and by providing fewer light emitting units under the same circuit board area, the same or better coloring effect can be achieved at a lower cost. This embodiment further provides a display unit, which includes the above-mentioned backlight module and a backplate, the driving circuit and light emitting units of the backlight module being provided on the backplate. [Example]

[0183] This embodiment provides a light emitting assembly, which may be, but is not limited to, a backlight module, a lighting module, etc., and includes a circuit board and a light emitting unit mounted on the circuit board and electrically connected to a corresponding circuit on the circuit board. The light emitting unit in this embodiment may be the light emitting unit shown in each of the above embodiments, or may be a light emitting unit with another structure (for example, a bracketless LED), and this embodiment does not limit the light emitting unit.

[0184] When the light emitting assembly is a backlight module, the backlight module is widely used in foldable displays. In prior art backlight modules, during repeated folding and recovery processes in foldable displays, the flexible printed circuit board (FPCB) used in the backlight module is prone to offset relative to the rear support plate, resulting in a portion of the backlight module remaining unprotected by the support plate. To address this issue, one embodiment of the present invention provides a backlight module that solves this problem. The circuit board of the backlight module in this embodiment is a flexible printed circuit board, and the backlight module further includes a support plate and a magnetic sheet. The flexible printed circuit board includes a stiffening plate and a base plate. The stiffening plate is fixed to the base plate, and a support groove is formed in the support plate, and at least a portion of the stiffening plate is received in the support groove. That is, the stiffening plate may be entirely disposed within the support groove, or only a portion thereof may be disposed within the support groove and a portion thereof may be outside the support groove. The support groove has an open end facing the base plate, the open end of the support groove is covered by the base plate, the support groove further has a groove bottom, a magnetic sheet is fixed to the groove bottom, the magnetic sheet and the reinforcing plate are arranged facing each other in parallel, and the magnetic sheet and the reinforcing plate are magnetically interlocked so that, during the process of repeated bending and recovery of the backlight module, the two magnets magnetically attract each other and allow the flexible printed circuit board and the support plate to recover to their pre-bending states, thereby improving the structural stability of the backlight module.

[0185] In one example, the thickness of the support plate is greater than the height of the support groove, the support plate is installed in the support groove, and the ceiling surface of the support plate protrudes from the support groove and is located outside the support groove, thereby creating a certain gap between the flexible printed circuit board and the support plate, which can provide a certain space for the flexible printed circuit board and the support plate to recover from bending and distortion during the bending process, or can reduce the friction force when the two come into contact during the bending process.

[0186] In another example, as shown in Figures 49 and 50, a flexible printed circuit board 90 has a base plate 901, a bonding pad 903, a light-emitting unit 904, and a reinforcing plate 905, the base plate 901 includes a welding portion 902, the welding portion 902 has a first surface 9021 and a second surface 9022 facing away from the first surface 9021, the bonding pad 903 is fixed to the first surface 9021, the light-emitting unit 904 is fixed to the first surface 9021, the pin pairs of the light-emitting unit 904 are stack-welded to the corresponding bonding pad 903, the reinforcing plate 905 is closely attached to the second surface 9022 of the welding portion 902, and the reinforcing plate 905 and the bonding pad 903 are arranged correspondingly.

[0187] The flexible printed circuit board 90 can be bent and is conductive. In the prior art, the method of fixing the light-emitting unit 904 to the flexible printed circuit board 90 generally involves fixing the pins at both ends of the device to the flexible printed circuit board 90. During the bending process of the flexible printed circuit board 90, the bending strength of the light-emitting unit 904 is weaker than the bending force required to bend the flexible printed circuit board 90. As a result, the flexible printed circuit board 90 does not protect the light-emitting unit 904 from bending, and therefore the light-emitting unit 904 is easily subjected to bending force and breaks during repeated bending. In this embodiment, the reinforcing plate 905 is adhered to one side of the flexible printed circuit board 90 away from the light emitting unit 904, and is made of a hard material. The reinforcing plate 905 is adhered to the welded portion 902, so that the bending force for bending the flexible printed circuit board 90 is transmitted to the reinforcing plate 905, and the internal stress of the reinforcing plate 905 is used to counteract the bending force for bending the flexible printed circuit board 90, preventing bending of the welded portion 902. The light emitting unit 904 is fixed to the first surface 9021, and the light emitting unit 904 and the reinforcing plate 905 are arranged correspondingly, so that the light emitting unit 904 on the first surface 9021 will not be broken. The reinforcing plate 905 increases the hardness of the welded portion 902, so that the light emitting unit 904 fixed to the welded portion 902 will not be subjected to the bending force, and the light emitting unit 904 will not be broken when the flexible printed circuit board 90 is bent.

[0188] The flexible printed circuit board 90 includes a conductive layer 906, which is disposed on a first surface 9021, and the light emitting units 904 arranged in an array are electrically connected by the conductive layer 906. The function of the conductive layer 906 is to realize the lead-out of the electrodes of the light emitting units 904. In this embodiment, the material of the conductive layer 906 may be tin, which not only performs a good conductive function but can also be easily welded and fixed to the bonding pads 903 and the base plate 901, and of course, other conductive materials such as silver, copper, aluminum, gold, etc. may also be used.

[0189] In some examples of this embodiment, the stiffening plate 905 may be made of a magnetic material, which has the advantage that a metal material corresponding to the external equipment is provided, so that when the flexible printed circuit board 90 is attached to the external equipment, the conventional screw or adhesive attachment method is not used, but the stiffening plate 905 has a magnetic attraction force, so that the flexible printed circuit board 90 can be directly attached to the support plate 912. Compared with the conventional attachment method, the stiffening plate 905 is easier to attach, simplifies the process, saves materials, and does not require the addition of other fixing parts, thereby reducing production costs.

[0190] When the flexible printed circuit board 90 in this embodiment is applied to a folding screen, the characteristics of the folding screen require a certain degree of elasticity while also ensuring that the flexible printed circuit board 90 is not damaged, and after the flexible printed circuit board 90 is fixed to a support plate by a conventional adhesive fixing method, when the flexible printed circuit board 90 is bent or folded, the welded portion 902 is subjected to a relatively large tensile force, which may result in the disconnection of the circuit of the flexible printed circuit board 90. In this embodiment, the reinforcing plate 905 is made of a magnetic material, and the reinforcing plate 905 is fixed to the support plate 912 by magnetic adsorption, and the plurality of welded portions 902 are fixed to the support plate 912 by magnetic adsorption, so that when the screen is bent or folded, the reinforcing plate 905 fixed by magnetic adsorption has a better cushioning effect and can also provide protection for the flexible printed circuit board 90 compared to when the screen is bent or folded.

[0191] As shown in FIG. 51, the present application further provides a light-emitting assembly, which may be a backlight module 91, the backlight module 91 including a flexible printed circuit board 90, a support plate 912, and a magnetic sheet 913, the flexible printed circuit board 90 including a reinforcing plate 905 and a base plate 901, the reinforcing plate 905 being fixed to the base plate 901, the support plate 912 being provided with a support groove 9121, the support groove 9121 accommodating at least a portion of the reinforcing plate 905, the support groove 9121 being provided with an opening end facing the base plate 901, the opening end of the support groove 9121 being covered by the base plate 901, the support groove 9121 further being provided with a groove bottom 9124, the magnetic sheet 913 being fixed to the groove bottom 9124, the magnetic sheet 913 and the reinforcing plate 905 being arranged facing each other and parallel to each other, and the magnetic sheet 913 and the reinforcing plate 905 being fitted together magnetically. The support plate 912 is used to fix the flexible printed circuit board 90, and in the prior art, the support plate 912 is fixed by being directly in close contact with the flexible printed circuit board 90. Therefore, when applied to a folding screen or a curved screen, the flexible printed circuit board 90 is easily cracked by the support plate 912, which is a major potential defect in product quality. In this embodiment, the support plate 912 is provided with a plurality of support grooves 9121, which are provided corresponding to the plurality of welding portions 902 of the flexible printed circuit board 90, and the groove bottom surfaces 9124 of the support grooves 9121 are parallel to the second surface 9022. The flexible printed circuit board 90 is attached to the support plate 912, and the magnetic sheet 913 is made of a material having a magnetic substance. In this embodiment, the magnetic sheet 913 may be a magnet, and the magnetic pole of the surface of the magnetic sheet 913 facing the reinforcing plate 905 is opposite to the magnetic pole of the reinforcing plate 905, that is, the north pole surface of the magnetic sheet 913 faces the south pole of the reinforcing plate 905, or the south pole surface of the magnetic sheet 913 faces the north pole of the reinforcing plate 905, and the surface of the magnetic sheet 913 facing away from the reinforcing plate 905 is tightly fixed to the groove bottom surface 9124, and there is a magnetic force attracting each other between the magnetic sheet 913 and the reinforcing plate 905, so that the flexible printed circuit board 90 is fixed to the support plate 912.In one embodiment, the magnetic sheet 913 is fixed to the support plate 912, and the reinforcing plate 905 is fixed to the light emitting unit 904. The reinforcing plate 905 and the magnetic sheet 913 are fixed by magnetic attraction and are closely attached to each other. By fixing the reinforcing plate 905 and the magnetic sheet 913, the relative positions of the light emitting unit 904 and the support plate 912 are fixed, and the structural stability of the product is improved.

[0192] 51 , there is a gap between the magnetic sheet 913 and the reinforcing plate 905. The side wall of the support groove 9121 has a groove side surface 9122 approaching the groove opening, and further has a plate contact surface 9123 connected to the groove side surface 9122 and located between the groove opening and the groove bottom surface of the support groove 9121. As shown in the figure, in this example, the plate contact surface 9123 is formed as a stepped surface, the plate contact surface 9123 and the groove bottom surface 9124 are spaced apart, there is a gap between the reinforcing plate 905 and the groove side surface 9122, and the reinforcing plate 905 is in close contact with the plate contact surface 9123. There is a mutual attractive force between the support plate 912, the reinforcing plate 905 and the magnetic sheet 913, and when the support plate 912 is bent, the flexible printed circuit board 90 is subjected to a deflection force, causing the flexible printed circuit board 90 to tend to move relative to the support plate 912. In this case, the magnetic adsorption force generates a deflection magnetic adsorption force that counteracts the deflection force, and as the support plate 912 is bent, the deflection force received by the flexible printed circuit board 90 increases. If the deflection force received by the flexible printed circuit board 90 becomes greater than the deflection magnetic adsorption force between the flexible printed circuit board 90 and the magnetic sheet 913, the flexible printed circuit board 90 and the support plate 912 will be displaced.

[0193] When the bending operation of the backlight module 91 is completed and the backlight module 91 is restored to its flat state, a deflection magnetic attraction force exists between the magnetic sheet 913 and the reinforcing plate 905, which guides the light emitting unit 904 and the support plate 912 to restore their relative positions when they are facing each other, and the magnetic attraction force between the magnetic sheet 913 and the reinforcing plate 905 performs a guiding function for the light emitting unit 904 and the support plate 912. Compared with the prior art, in this embodiment, a support groove 9121 is formed in the support plate 912 corresponding to the welding portion 902, and a magnetic sheet 913 is added to accommodate the support groove 9121. This embodiment is more environmentally friendly and does not require an encapsulation process, thereby reducing production costs. In addition, the flexible printed circuit board 90 is fixed to the support plate 912 by magnetic attraction, and the flexible printed circuit board 90 and the support plate 912 are directly arranged to complete the assembly, simplifying the installation process.

[0194] The groove side surface 9122 and the plate contact surface 9123 are provided for the purpose that, when the flexible printed circuit board 90 and the support plate 912 are displaced, the flexible printed circuit board 90 moves along a plane parallel to the magnetic sheet 913, and the plate contact surface 9123 is in close contact with the reinforcing plate 905; that is, the reinforcing plate 905 is located between the flexible printed circuit board 90, the plate contact surface 9123, and the groove side surface 9122; and, when the reinforcing plate 905 moves relative to the support plate 912, the flexible printed circuit board 90 moves along a direction parallel to the second surface 9022 while following the reinforcing plate 905, thereby ensuring close contact between the flexible printed circuit board 90 and the support plate 912. In this process, situations such as uneven display or light spots on a folding screen or curved screen can be avoided.

[0195] In this embodiment, the reinforcing plate 905 has a third surface 9051 and a fourth surface 9052, with the third surface 9051 closely attached to the second surface 9022 of the flexible printed circuit board 90, the fourth surface 9052 facing the magnetic sheet 913, and the magnetic sheet 913 has a fifth surface 9131 and a sixth surface 9132, with the fifth surface 9131 facing the reinforcing plate 905 and the sixth surface 9132 closely attached to the groove bottom surface 9124. In this embodiment, the area of ​​the fifth surface 9131 is smaller than the area of ​​the fourth surface 9052, which serves to increase the magnetic range between the reinforcing plate 905 and the magnetic sheet 913 and increase the area over which the reinforcing plate 905 is subjected to the attractive force of the magnetic sheet 913. This increases the relative movement range between the flexible printed circuit board 90 and the support plate 912, and also increases the degree of bending of the folding screen or curved screen.

[0196] In this embodiment, the contact area between the stiffening plate 905 and the flexible printed circuit board 90 is the third surface 9051, i.e., the area of ​​the third surface 9051 is the area that the stiffening plate 905 protects the flexible printed circuit board 90. Therefore, increasing the area of ​​the third surface 9051 enhances protection for the flexible printed circuit board 90, but is disadvantageous to folding the backlight module 91. In this embodiment, the protection area of ​​the stiffening plate 905 faces the light emitting unit 904, i.e., the area of ​​the third surface 9051 corresponds to the area of ​​the bonding pad 903. During use of the backlight module 91, a good folding effect is achieved, and the protection that the stiffening plate 905 provides for the light emitting unit 904 is not affected.

[0197] This embodiment further provides an electronic device, and as shown in Figures 52 and 53, the electronic device 92 further includes a control circuit board 95 and a case 93, the control circuit board 95 is housed in the case 93, and both control circuit boards 95 are electrically connected to the backlight module 91, and the control circuit board 95 is electrically connected to the flexible printed circuit board 90, the case 93 has a first edge side 935, and the support plate 912 has a second edge side 9126 facing the first edge side 935, and the second edge side 9126 is fixed to the first edge side 935.

[0198] The electronic device 92 further includes an actuator 94 on the side of the control circuit board 95 away from the flexible printed circuit board 90, which adjusts the voltage received by the electronic device 92.

[0199] In this embodiment, the electronic device 92 may be a television, a tablet, or a mobile phone. The backlight module 91 is mainly applied to electronic devices 92 with folding or curved screens. For example, if the electronic device 92 is a mobile phone, a case 93 is provided corresponding to the folding area of ​​the backlight module 91, and during use, the backlight module 91 is folded together with the case 93, thereby realizing the opening and folding of the electronic device 92. Compared with the prior art, the reinforcing plate 905 in the backlight module 91 allows the backlight module 20 to be repeatedly folded without damaging the light-emitting units 904 in the flexible printed circuit board 90, thereby increasing the service life of the backlight module 91 and improving the quality of the electronic device 92. [Example]

[0200] During use, the light emitting unit generates a large amount of heat, making heat dissipation an important consideration in the design of the light emitting assembly. For example, in the prior art, a thermal conductor is provided on the surface of the LED chip, and heat is dissipated from the thermal conductor by forced convection using a fan, or heat exchange is performed by water cooling using a pump. However, the heat dissipation process requires additional energy. To address this issue, another example of this embodiment further provides an energy-saving light emitting assembly with good heat dissipation performance. The circuit board of the light emitting assembly may be the flexible printed circuit board described above, or a rigid circuit board. The circuit board is not limited to this example.

[0201] In this embodiment, the light emitting assembly further includes a driver chip and a self-oscillating heat pipe, wherein the circuit board includes a bead lamp region and a driver chip region, the light emitting unit and the driver chip are respectively disposed in the bead lamp region and the driver chip region, the evaporator of the self-oscillating heat pipe is disposed in the driver chip region, a working medium is disposed in the self-oscillating heat pipe, the working medium in the evaporator moves away from the driver chip and approaches the condenser of the self-oscillating heat pipe, the heat in the driver chip region is conducted to the condenser away from the driver chip by the self-oscillating heat pipe for heat dissipation, and the heat exchange form of the self-oscillating heat pipe is passive heat exchange, which does not require a separate external drive and can operate only with heat from the driver chip region, saving energy and achieving excellent heat conduction effect.

[0202] The light emitting assembly provided by this embodiment includes a circuit board 101 and a self-oscillating heat pipe 104, as shown in FIGS.

[0203] The circuit board 101 includes a bead lamp area and a driver chip area, and a plurality of light emitting units 102 are provided in the bead lamp area. The light emitting units 102 may be the light emitting units 102 shown in the above embodiments, or other light emitting units 102 may be used, such as, but not limited to, LED chips or LED bead lamps with other structures. These light emitting units 102 include light emitting units of various colors, but are not limited to, and the light emitting units 102 may be arranged in an LED array or other arrangement methods, which will not be described in detail herein. The driver chip area includes, but is not limited to, a driver chip 103 for driving the light emitting units 102 to emit light. Other chips may be provided in the driver chip area, and the driver chip area may include, but is not limited to, one or more driver chips 103.

[0204] 54, the circuit board 101 is a double-sided circuit board, including a bead lamp area where the light emitting units 102 arranged in an array are provided, and a driver chip area where the driver chips are provided in the center of one side of the circuit board 101, and the driver chips and the light emitting units 102 are respectively provided on both sides of the circuit board 101. A plurality of driver chips 103 are provided on the circuit board 101, and the driver chips 103 are connected to the light emitting units 102 by circuit patterns on the circuit board 101 and drive the light emitting units 102.

[0205] 55, the light emitting assembly of this embodiment further includes a self-oscillating heat pipe 104, the evaporator section of which is located in the driving chip area, and the working medium in the evaporator section of the self-oscillating heat pipe 104 moves away from the driving chip 103 and approaches the condenser section of the self-oscillating heat pipe 104. The evaporator section of the self-oscillating heat pipe is located in the driving chip area and is used to dissipate heat dissipated from devices in the driving chip area, such as the driving chip 103. It should be understood that the driving chip 103 usually has a large heat dissipation capacity, and the area of ​​the light emitting assembly where devices such as the driving chip 103 are located is also a relatively high-temperature area of ​​the light emitting assembly. The condenser section of the self-oscillating heat pipe 104 is located away from the driving chip 103, so the condenser section is in a relatively low-temperature area, and the heat conducted by the self-oscillating heat pipe 104 can be effectively dissipated. As shown in Figure 56, the working medium inside the oscillating heat pipe 104 is randomly and alternately filled with liquid plugs 1041 and gas plugs 1042. When heat conduction is not occurring, these working mediums are in a balanced, stationary state. The stationary working medium is mainly subjected to the pressure between the gas plugs 1042, the capillary force acting on the liquid plugs 1041, and gravity acting on the working medium. When heated externally, capillary force, gravity, and the pressure caused by the thermal expansion of the bubbles in the gas plugs 1042 act as motive forces for the flow of the working medium. In this example, the working medium, which is the fluid inside the oscillating heat pipe, absorbs excess heat from the driving tip region in the evaporator and then flows to the condenser, where the heat is released into the air, thereby achieving the heat dissipation effect of the driving tip region. By applying the self-oscillating heat pipe, the heat from the driving chip area can be quickly dissipated, and the self-oscillating heat pipe does not require any external drive; it can operate using only the heat released from the driving chip area, resulting in energy saving effects and good heat conduction effects.

[0206] In some applications, the light emitting units 102 and the driver chips 103 are not arranged mixedly on the same surface of the circuit board 101, i.e., the light emitting units 102 and the driver chips 103 may be located at different positions on the same surface of the circuit board 101, or may be located at corresponding or non-corresponding positions on different surfaces of the circuit board 101, and the self-oscillating heat pipes 104 may be directly mounted on the driver chips 103, and their size and position may be adjusted so as not to interfere with the light emission of the light emitting units 102. In other implementations, a circuit board 101 with excellent thermal conductivity may be used, and the light emitting units 102 and the driver chips 103 may be arranged mixedly on the same surface of the circuit board, and the self-oscillating heat pipes may be mounted on the other side of the circuit board, so that the heat conducted from the driver chips to the circuit board can be quickly dissipated by the self-oscillating heat pipes.

[0207] 57, the light emitting assembly further includes a thermally conductive sheet 105, which is disposed between the oscillating heat pipe 104 and the driving chip 103. The thermally conductive sheet 105 allows the heat of the driving chip 103 to be uniformly conducted to the oscillating heat pipe 104, thereby improving the actual heat dissipation efficiency of the oscillating heat pipe 104. The thermally conductive sheet may be a copper sheet or a thermally conductive sheet made of other materials with good thermal conductivity.

[0208] In some applications, silicone grease is applied between the thermally conductive sheet 105 and the oscillating heat pipe 104 and / or the driving chip 103. For example, silicone grease is applied to both sides of the thermally conductive sheet 105, with one side of the thermally conductive sheet 105 adhering to the driving chip area and contacting the driving chip 103 in the driving chip area, and the oscillating heat pipe 104 adhering to the other side of the thermally conductive sheet 105. In practical applications, silicone grease may be applied only to the area of ​​the thermally conductive sheet 105 that contacts the driving chip 103 or the oscillating heat pipe 104, or silicone grease may be applied to the entire surface of both sides of the thermally conductive sheet 105. The application of silicone grease not only ensures a connection between the thermally conductive sheet 105 and the oscillating heat pipe 104 and / or the driving chip 103, but also increases the contact area for heat conduction, ensuring efficient heat conduction.

[0209] In some applications, the oscillating heat pipe 104 includes heat dissipation ribs that contact the pipe of the oscillating heat pipe 104, allowing heat from the pipe of the oscillating heat pipe 104 to be conducted to the heat dissipation ribs and dissipated by the heat dissipation ribs. The additional heat dissipation ribs increase the effective heat dissipation area of ​​the oscillating heat pipe, allowing heat to be dissipated more efficiently into the air. The heat dissipation ribs are specifically located on the condenser section and contact the pipe of the condenser section, allowing heat from the condenser section to be quickly dissipated. Of course, this embodiment does not exclude the possibility of the heat dissipation ribs being located at other positions on the oscillating heat pipe. For example, the heat dissipation ribs may be located from the condenser section to the insulating section of the oscillating heat pipe between the evaporator section and the condenser section.

[0210] In some applications, the condenser part of the oscillating heat pipe may be exposed from the circuit board, as shown in Figures 58 and 59, where Figure 58 shows the side of the circuit board 101 where the light emitting unit 102 is mounted, and Figure 59 shows the side of the circuit board 101 where the driving chip 103 is mounted (the light emitting unit and driving chip are not shown). The condenser part of the oscillating heat pipe 104 is mounted in an area other than the circuit board 101, so that the heat from the driving chip area of ​​the circuit board 101 is drawn by the oscillating heat pipe 104 and then conducted to areas other than the circuit board 101 for heat dissipation, thereby further ensuring the heat dissipation effect and preventing excessive heat accumulation on the circuit board 101. In actual applications, the condenser part of the oscillating heat pipe 104 is exposed from the circuit board but is located inside the light emitting device in which the light emitting assembly is used. Since the condensation section is located in an area other than the circuit board 101, there is a large space around it, and in these embodiments, the heat dissipation rib may be arranged so that it is inserted into the condensation section. For example, in the specific structure of the heat dissipation rib 106 shown in Figure 60, the heat dissipation rib 106 is generally in the shape of a rectangular sheet, and multiple through holes 1061 are opened in the heat dissipation rib 106, and the diameter of each through hole 1061 matches the outer diameter of the pipe of the self-excited oscillating heat pipe 104. The pipe of the self-excited oscillating heat pipe 104 passes through these through holes 1061, so that the heat dissipation rib 106 is arranged on the pipe of the self-excited oscillating heat pipe 104 and is in contact with the pipe. By providing multiple heat dissipation ribs 106 on the self-excited oscillating heat pipe 104, the heat dissipation efficiency is improved.

[0211] In some applications, multiple driver chips 103 are provided in the driver chip area, and at least a portion of each driver chip 103 is covered by the projection of the evaporator portion of the oscillating heat pipe 104 on the circuit board 101. That is, the oscillating heat pipe 104 completely covers all driver chips 103 in the driver chip area, ensuring that heat from each driver chip 103 is effectively dissipated. In some applications, a thermally conductive sheet 105 is provided between the oscillating heat pipe 104 and the driver chip 130, and the size of the thermally conductive sheet 105 may be greater than or equal to the size of the driver chip area, and the thermally conductive sheet 105 may cover all driver chips 103 in the same way, with the oscillating heat pipes 104 provided on the other side of the thermally conductive sheet 105. As shown in FIG. 59, the oscillating heat pipe 104 of this embodiment includes multiple U-shaped pipes, connected by U-shaped bends. The internal structure of the oscillating heat pipe 104 circulates and conducts heat. The longitudinal ends of the U-shaped pipes are the evaporator and condenser, respectively. That is, the working medium within the oscillating heat pipe continues to flow in the same direction and returns to its original position. These U-shaped pipes are arranged in a sequential order with narrow gaps between them, meaning the U-shaped pipes are closely spaced. This allows for more U-shaped pipes to be installed within the same area, ensuring sufficient heat dissipation capacity. In other embodiments, the oscillating heat pipe may be configured in other ways, which will not be described in detail here.

[0212] The light emitting assembly of this embodiment includes a circuit board and a self-oscillating heat pipe, the evaporator of the self-oscillating heat pipe is located in the driving chip area of ​​the circuit board, and the condenser is located away from the driving chip area, the self-oscillating heat pipe extracts heat from the driving chip area and dissipates it in the condenser, so there is no need for separate energy to drive it, which saves energy. In addition, the self-oscillating heat pipe is advantageously manufactured in a miniaturized structure, and can conduct heat evenly, so it can achieve good results even in a small space in the light emitting assembly.

[0213] According to the description of the above embodiments of the present application, it can be seen that the LED bracket, light emitting unit and light emitting assembly provided by the above embodiments can be applied to various lighting fields, for example, they can be manufactured into backlight modules and applied to the display backlight field (which may be a backlight module for terminals such as televisions, displays, and mobile phones), button backlight field, photography field, home lighting field, medical lighting field, decoration field, automotive field, transportation field, etc. When applied in the button backlight field, it may be used as a button backlight light source for buttons on mobile phones, calculators, keyboards, etc. When applied in the photography field, it may be manufactured into a camera flash lamp When applied in the home lighting field, it may be manufactured into a floor lamp, stand, luminaire, ceiling light, downlight, floodlight, etc. When applied in the medical lighting field, it may be manufactured into a shadowless lamp or low electromagnetic lamp When applied in the decorative field, it may be manufactured into various decorative lamps such as various illuminations, landscape lights, and advertising lights When applied in the automotive field, it may be manufactured into an automobile lamp or automobile indicator light, etc. When applied in the traffic field, it may be manufactured into various traffic signal lights and various street lights. It should be understood that the above applications are only a few of the applications shown in this embodiment, and the applications of the light emitting device in this embodiment are not limited to the above examples.

[0214] It should be understood that the application of the present application is not limited to the above examples, and those skilled in the art may make improvements or modifications based on the above description, and all such improvements and modifications are within the scope of protection of the appended claims of the present application.

Claims

1. A light-emitting unit including an LED chip and an LED bracket, wherein the LED bracket has a bowl-shaped cup, and the LED chip includes a red LED chip and a blue LED chip provided at a bottom of the bowl-shaped cup; the light-emitting unit further includes a packaging layer disposed in the bowl-shaped cup, the packaging layer including a green medium, the green medium being filled in the bowl-shaped cup and covering the red LED chip and the blue LED chip, the red LED chip and the blue LED chip being vertically or horizontally structured, the red LED chip and the blue LED chip being excited by the green medium to emit white light; the normalized spectrogram of the white light includes a first red light wavelength band and a green light wavelength band, the first red light wavelength band has a full width at half maximum of 15 nm to 30 nm, the peak of the first red light wavelength band is a first peak, the relative optical power corresponding to the first peak is 0.9 to 1, and the wavelength corresponding to the first peak is 645 nm to 665 nm; The package layer further includes an encapsulant filled in the bowl-shaped cup, and the mixture ratio of the green medium to the encapsulant ranges from 1:12 to 1:

2.

2. 2. The light-emitting unit of claim 1, wherein the normalized spectrogram has a full width at half maximum of the green light wavelength band of 35 nm to 60 nm, a peak of the green light wavelength band of 10 nm to 20 nm, a relative optical power corresponding to the second peak of 10 nm to 20 nm, and a wavelength corresponding to the second peak of 10 nm to 20 nm.

3. 2. The light-emitting unit of claim 1, wherein the normalized spectrogram further includes a blue light wavelength band, the full width at half maximum of the blue light wavelength band is 15 nm to 30 nm, the peak of the blue light wavelength band is a third peak, the relative optical power corresponding to the third peak is 0.3 to 0.5, and the wavelength corresponding to the third peak is 445 nm to 455 nm.

4. 2. The light-emitting unit of claim 1, wherein the normalized spectrogram further includes a yellow light waveband, the wavelength range corresponding to the yellow light waveband is 585 nm to 630 nm, and the relative optical power of the yellow light waveband is less than 0.

15.

5. 2. The light-emitting unit of claim 1, wherein the normalized spectrogram further includes a blue light wavelength band, the wavelength range corresponding to the blue light wavelength band is 465 nm to 515 nm, and the relative optical power of the blue light wavelength band is less than 0.

1.

6. 2. The light-emitting unit of claim 1, wherein the normalized spectrogram further includes a violet light wavelength band, the wavelength range corresponding to the violet light wavelength band is 350 nm to 420 nm, and the relative optical power of the violet light wavelength band is less than 0.

1.

7. 2. The light-emitting unit of claim 1, wherein the normalized spectrogram further includes a second red light wavelength band adjacent to the first red light wavelength band, the wavelength range corresponding to the second red light wavelength band is 680 nm to 780 nm, and the relative optical power of the second red light wavelength band is less than 0.

1.

8. 2. The light emitting unit of claim 1, wherein the material of the green medium comprises β-Sialon, the material of the blue LED chip comprises gallium nitride, and the material of the red LED chip comprises aluminum indium gallium phosphide.

9. The light-emitting unit described in claim 1, wherein the white light has a distribution range of 0.31 to 0.39 on the X axis and a distribution range of 0.3 to 0.4 on the Y axis on the CIE 1931 chromaticity diagram, and the color temperature range of the white light is 4000K to 7000K.

Images