Semiconductor device

Abstract

To prevent incorrect installation of standard semiconductor modules and mirror-type semiconductor modules.SOLUTION: A semiconductor device (100) comprises a standard semiconductor module (10) and a mirror-type semiconductor module (20) arranged in the first direction. An identification mark (5) is provided on the top surface of at least one of the standard semiconductor module (10) and the mirror-type semiconductor module (20). The identification mark (5) is positioned offset from the center of the package in the first direction and in the second direction, which is perpendicular to the first direction.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to a semiconductor device having a plurality of semiconductor modules mounted thereon. [Background technology]

[0002] For example, in semiconductor modules for power control (also called "power modules"), identical products are sometimes connected in parallel to ensure the required output capacity.

[0003] For example, Patent Document 1 listed below discloses a semiconductor device having a structure in which two semiconductor modules having package shapes symmetrical to each other are arranged side by side and connected in parallel. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2007-035670 Summary of the Invention [Problem to be solved by the invention]

[0005] To facilitate wiring, semiconductor modules are sometimes manufactured as standard package products (hereinafter referred to as "standard semiconductor modules") and mirror package products (hereinafter referred to as "mirror semiconductor modules") that have a structure that is linearly symmetrical to the standard package (a structure in which the left and right sides of the standard package are inverted).When incorporating a standard semiconductor module and a mirror semiconductor module into the same semiconductor device, there is a risk that an operator or an operating device (hereinafter simply referred to as "operator") may mistakenly mount the standard semiconductor module and the mirror semiconductor module.

[0006] The present disclosure has been made to solve the above-mentioned problems, and aims to prevent erroneous mounting of a standard semiconductor module and a mirror-type semiconductor module. [Means for solving the problem]

[0007] The semiconductor device according to the present disclosure comprises a standard semiconductor module and a mirror semiconductor module arranged side by side in a first direction, and an identification mark is provided on the upper surface of at least one of the packages of the standard semiconductor module and the mirror semiconductor module, and the identification mark is positioned offset from the center of the package in the first direction and in a second direction perpendicular to the first direction. [Effects of the Invention]

[0008] According to the present disclosure, it is possible to prevent erroneous mounting of a standard semiconductor module and a mirror type semiconductor module. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a top view showing a configuration of a semiconductor device according to a first embodiment. [Figure 2] FIG. 10 is a top view showing the configuration of a semiconductor device according to a second embodiment. [Figure 3] FIG. 10 is a top view showing the configuration of a semiconductor device according to a third embodiment. [Figure 4] FIG. 10 is a top view showing the configuration of a semiconductor device according to a fourth embodiment. [Figure 5] FIG. 10 is a top view showing the configuration of a semiconductor device according to a fifth embodiment. [Figure 6] FIG. 13 is a top view showing the configuration of a semiconductor device according to a sixth embodiment. [Figure 7] FIG. 13 is a top view showing the configuration of a semiconductor device according to a seventh embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] <First Embodiment> Fig. 1 is a top view showing the configuration of a semiconductor device 100 according to embodiment 1. As shown in Fig. 1, the semiconductor device 100 has a structure in which a standard semiconductor module 10 and a mirror semiconductor module 20 are arranged side by side in a first direction and mounted on a substrate (not shown).

[0011] Each of the standard semiconductor module 10 and the mirror-type semiconductor module 20 has a rectangular package having two sides parallel to a first direction and two sides parallel to a second direction perpendicular to the first direction, and is provided with a P terminal 1 which is a positive input terminal, an N terminal 2 which is a negative input terminal, an AC terminal 3 which is an AC output terminal, and a plurality of control terminals 4. However, the mirror-type semiconductor module 20 has a structure that is linearly symmetrical with respect to the standard semiconductor module 10 in the first direction. In other words, the structure of the mirror-type semiconductor module 20 is obtained by inverting the structure of the standard semiconductor module 10 in the first direction.

[0012] An identification mark 5 indicating the orientation of the package is provided on the top surface of at least one of the packages of the standard semiconductor module 10 and the mirror type semiconductor module 20. In the first embodiment, both the standard type semiconductor module 10 and the mirror type semiconductor module 20 have an identification mark 5a. The identification mark 5a is positioned offset from the center of the package in the first direction and the second direction, and the position of the identification mark 5a in the standard type semiconductor module 10 and the position of the identification mark 5a in the mirror type semiconductor module 20 are line-symmetrical in the first direction. In other words, the position of the identification mark 5a in the mirror type semiconductor module 20 is the inverted position of the position of the identification mark 5a in the standard type semiconductor module 10 in the first direction.

[0013] When mounting the standard semiconductor module 10 and the mirror type semiconductor module 20 on the semiconductor device 100 according to this embodiment, an operator can distinguish between the standard semiconductor module 10 and the mirror type semiconductor module 20 from the positions of the identification marks 5a. This prevents the standard semiconductor module 10 and the mirror type semiconductor module 20 from being erroneously mounted.

[0014] Furthermore, since both the standard semiconductor module 10 and the mirror-type semiconductor module 20 have the identification mark 5, when a pair of the standard semiconductor module 10 and the mirror-type semiconductor module 20 are configured as one set, the worker can easily identify the position and orientation of each set configuration, which also contributes to preventing incorrect installation.

[0015] <Embodiment 2> Fig. 2 is a top view showing the configuration of a semiconductor device 100 according to embodiment 2. In Fig. 2, elements that are the same as or correspond to those shown in Fig. 1 are given the same reference numerals as in Fig. 1. Therefore, their description will be omitted here.

[0016] In the second embodiment, only one of the standard semiconductor module 10 and the mirror type semiconductor module 20 has the identification mark 5b. Although Fig. 2 shows an example in which the identification mark 5b is provided only on the mirror type semiconductor module 20, the identification mark 5b may be provided only on the standard type semiconductor module 10. The identification mark 5b is positioned offset from the center of the package in the first direction and the second direction.

[0017] When mounting the standard semiconductor module 10 and the mirror type semiconductor module 20 on the semiconductor device 100 according to this embodiment, an operator can distinguish between the standard semiconductor module 10 and the mirror type semiconductor module 20 based on the presence or absence of the identification mark 5b. This prevents the standard semiconductor module 10 and the mirror type semiconductor module 20 from being mounted erroneously.

[0018] Furthermore, since only one of the standard semiconductor module 10 and the mirror-type semiconductor module 20 has the identification mark 5b, when a pair of the standard semiconductor module 10 and the mirror-type semiconductor module 20 is configured as one set, the worker can easily identify whether the standard semiconductor module 10 and the mirror-type semiconductor module 20 are correctly paired in each set configuration, which also contributes to preventing incorrect installation.

[0019] <Third Embodiment> Fig. 3 is a top view showing the configuration of a semiconductor device 100 according to embodiment 3. In Fig. 3, elements that are the same as or correspond to those shown in Fig. 1 are given the same reference numerals as in Fig. 1. Therefore, their description will be omitted here.

[0020] In the second embodiment, each of the standard semiconductor module 10 and the mirror type semiconductor module 20 has a plurality of identification marks 5c (two in FIG. 3 ) including identification marks of different sizes or shapes. Each identification mark 5c is positioned offset in the first direction and the second direction from the center of the package, and the positions of the plurality of identification marks 5c in the standard type semiconductor module 10 and the positions of the plurality of identification marks 5c in the mirror type semiconductor module 20 are line-symmetrical in the first direction. In other words, the positions of the plurality of identification marks 5c in the mirror type semiconductor module 20 are the inverted positions of the positions of the plurality of identification marks 5c in the standard type semiconductor module 10 in the first direction.

[0021] When mounting the standard semiconductor module 10 and the mirror type semiconductor module 20 on the semiconductor device 100 according to this embodiment, an operator can distinguish between the standard semiconductor module 10 and the mirror type semiconductor module 20 based on the positions of the multiple identification marks 5c that differ in size or shape. This prevents the standard semiconductor module 10 and the mirror type semiconductor module 20 from being mounted erroneously.

[0022] <Fourth Embodiment> Fig. 4 is a top view showing the configuration of a semiconductor device 100 according to embodiment 4. In Fig. 4, elements that are the same as or correspond to those shown in Fig. 1 are given the same reference numerals as in Fig. 1. Therefore, their description will be omitted here.

[0023] In the fourth embodiment, both the standard semiconductor module 10 and the mirror type semiconductor module 20 have a concave identification mark 5d. That is, the identification mark 5d is a recess formed in the package. The concave identification mark 5d utilizes pin marks (hereinafter referred to as "process marks") that are formed on the package when, after the package is formed with molding resin, the package is peeled off and lifted from the mold using pins. That is, the identification mark 5d is formed by leaving process marks at desired positions on the package. Therefore, the identification mark 5d can be formed without increasing the number of manufacturing steps for the standard semiconductor module 10 and the mirror type semiconductor module 20.

[0024] Here, the size of a typical process mark is about 0.1 mm deep and 2 mm in diameter. Therefore, it is desirable that the recessed identification mark 5d is not close to 0.1 mm deep and 2 mm in diameter so that it can be distinguished from typical process marks. For example, by setting the depth of the identification mark 5d to 0.05 mm or less or 0.2 mm or more, or by setting the diameter of the identification mark 5d to 1.5 mm or less or 3 mm or more, the identification mark 5d can be distinguished from typical process marks.

[0025] The method for forming the identification mark 5d is not limited to the above-mentioned method, and the identification mark 5d may be formed by, for example, grinding the package, although this increases the number of manufacturing steps.

[0026] Figure 4 shows an example in which the arrangement of the concave-shaped identification mark 5d is the same as the arrangement of the identification mark 5a in embodiment 1 (Figure 1), but the identification mark 5d in embodiment 4 can also be applied to embodiments 2 and 3.

[0027] <Fifth Embodiment> Fig. 5 is a top view showing the configuration of a semiconductor device 100 according to embodiment 5. In Fig. 5, elements that are the same as or correspond to those shown in Fig. 1 are given the same reference numerals as in Fig. 1. Therefore, their description will be omitted here.

[0028] As in the fourth embodiment, both the standard semiconductor module 10 and the mirror semiconductor module 20 have a concave identification mark 5e. In the fifth embodiment, letters or figures are printed in the identification mark 5e. Here, the identification mark 5e is disposed adjacent to one of the terminals, and letters representing the terminal adjacent to the identification mark 5e are printed in the identification mark 5e. FIG. 5 shows an example in which the identification mark 5e is disposed adjacent to the AC terminal 3, and the letters "AC" representing the AC terminal 3 are printed in the identification mark 5e.

[0029] According to this embodiment, in addition to the effects described in embodiment 1, an effect is obtained in that an operator can identify the terminals close to the identification mark 5e from the characters or figures printed in the identification mark 5e, which also contributes to preventing erroneous installation of the standard semiconductor module 10 and the mirror-type semiconductor module 20.

[0030] Figure 5 shows an example in which the arrangement of an identification mark 5e with letters or figures printed inside is the same as that of the identification mark 5a in embodiment 1 (Figure 1), but the identification mark 5e in embodiment 5 can also be applied to embodiments 2 and 3.

[0031] <Sixth Embodiment> Fig. 6 is a top view showing the configuration of a semiconductor device 100 according to a sixth embodiment. In Fig. 6, elements that are the same as or correspond to those shown in Fig. 1 are given the same reference numerals as in Fig. 1. Therefore, their description will be omitted here.

[0032] In the sixth embodiment, both the standard semiconductor module 10 and the mirror semiconductor module 20 have a convex identification mark 5f. That is, the identification mark 5f is a convex portion formed on the package.

[0033] The identification mark 5f has a convex shape, so it can be easily distinguished from typical concave process marks. Therefore, when mounting the standard semiconductor module 10 and the mirror type semiconductor module 20 on the semiconductor device 100, a worker is prevented from mistaking the identification mark 5f for a process mark.

[0034] Figure 6 shows an example in which the arrangement of the convex identification mark 5f is the same as the arrangement of the identification mark 5a in embodiment 1 (Figure 1), but the identification mark 5f in embodiment 6 can also be applied to embodiments 2 and 3.

[0035] <Seventh Embodiment> Fig. 7 is a top view showing the configuration of a semiconductor device 100 according to embodiment 7. In Fig. 7, elements that are the same as or correspond to those shown in Fig. 1 are given the same reference numerals as in Fig. 1. Therefore, their description will be omitted here.

[0036] In the seventh embodiment, both the standard semiconductor module 10 and the mirror semiconductor module 20 have an identification mark 5g consisting of letters or graphics printed on the package. Here, the identification mark 5g is placed near one of the terminals, and the letters representing the terminal near the identification mark 5g constitute the identification mark 5g. In FIG. 7, the identification mark 5g is placed near the AC terminal 3, and the letters "AC" representing the AC terminal 3 constitute the identification mark 5g.

[0037] According to this embodiment, in addition to the effects described in the first embodiment, an operator can check the terminals close to the identification mark 5g from the characters or figures that make up the identification mark 5g, which also contributes to preventing erroneous installation of the standard semiconductor module 10 and the mirror-type semiconductor module 20.

[0038] Figure 7 shows an example in which the arrangement of an identification mark 5g consisting of letters or figures is the same as that of the identification mark 5a in embodiment 1 (Figure 1), but the identification mark 5g in embodiment 5 can also be applied to embodiments 2 and 3.

[0039] It is possible to freely combine the embodiments, and to modify or omit the embodiments as appropriate.

[0040] <Additional Notes> Various aspects of the present disclosure are summarized below as appendices.

[0041] (Appendix 1) a standard semiconductor module and a mirror semiconductor module arranged side by side in a first direction; an identification mark is provided on an upper surface of at least one of the packages of the standard type semiconductor module and the mirror type semiconductor module; The identification mark is positioned offset from the center of the package in the first direction and in a second direction perpendicular to the first direction. Semiconductor device.

[0042] (Appendix 2) both the standard type semiconductor module and the mirror type semiconductor module have the identification mark; a position of the identification mark on the standard semiconductor module and a position of the identification mark on the mirror semiconductor module are line-symmetrical in the first direction; 2. The semiconductor device according to claim 1.

[0043] (Appendix 3) Only one of the standard type semiconductor module and the mirror type semiconductor module has the identification mark. 2. The semiconductor device according to claim 1.

[0044] (Appendix 4) a plurality of the identification marks, including marks of different sizes or shapes, are provided on the top surface of the package of at least one of the standard type semiconductor module and the mirror type semiconductor module; 4. The semiconductor device according to claim 1, wherein the semiconductor device is a semiconductor device having a first insulating layer.

[0045] (Appendix 5) The identification mark is a recess formed in the package. 5. The semiconductor device according to claim 1, wherein the semiconductor device is a semiconductor device having a first insulating layer.

[0046] (Appendix 6) The depth of the identification mark is 0.05 mm or less or 0.2 mm or more; 6. The semiconductor device according to claim 5.

[0047] (Appendix 7) The diameter of the identification mark is 1.5 mm or less or 3 mm or more; 7. The semiconductor device according to claim 5 or 6.

[0048] (Appendix 8) The identification mark has printed therein a character or a figure indicating a terminal adjacent to the identification mark. 8. The semiconductor device according to claim 5, wherein the semiconductor device is a semiconductor device having a first insulating layer.

[0049] (Appendix 9) The identification mark is a protrusion formed on the package. 5. The semiconductor device according to claim 1, wherein the semiconductor device is a semiconductor device having a first insulating layer.

[0050] (Appendix 10) The identification mark is a character or a graphic printed on the package. 5. The semiconductor device according to claim 1, wherein the semiconductor device is a semiconductor device having a first insulating layer.

[0051] (Appendix 11) The identification mark is a character or a graphic that indicates a terminal adjacent to the identification mark. 11. The semiconductor device according to claim 10. [Explanation of symbols]

[0052] 100 Semiconductor device, 10 Standard type semiconductor module, 20 Mirror type semiconductor module, 1 P terminal, 2 N terminal, 3 AC terminal, 4 Control terminal, 5 Identification mark

Claims

1. a standard semiconductor module and a mirror semiconductor module arranged side by side in a first direction; an identification mark is provided on an upper surface of at least one of the packages of the standard type semiconductor module and the mirror type semiconductor module; the identification mark is positioned offset from the center of the package in the first direction and in a second direction perpendicular to the first direction; Semiconductor device.

2. both the standard type semiconductor module and the mirror type semiconductor module have the identification mark; a position of the identification mark on the standard semiconductor module and a position of the identification mark on the mirror semiconductor module are line-symmetrical in the first direction; The semiconductor device according to claim 1 .

3. Only one of the standard type semiconductor module and the mirror type semiconductor module has the identification mark. The semiconductor device according to claim 1 .

4. a plurality of the identification marks, including marks of different sizes or shapes, are provided on the top surface of the package of at least one of the standard type semiconductor module and the mirror type semiconductor module; The semiconductor device according to claim 1 .

5. The identification mark is a recess formed in the package. The semiconductor device according to claim 1 .

6. The depth of the identification mark is 0.05 mm or less or 0.2 mm or more. The semiconductor device according to claim 5 .

7. The diameter of the identification mark is 1.5 mm or less or 3 mm or more. The semiconductor device according to claim 5 .

8. The identification mark has printed therein a character or a figure indicating a terminal adjacent to the identification mark. The semiconductor device according to claim 5 .

9. The identification mark is a protrusion formed on the package. The semiconductor device according to claim 1 .

10. The identification mark is a character or a graphic printed on the package. The semiconductor device according to claim 1 .

11. The identification mark is a character or a graphic that indicates a terminal adjacent to the identification mark. The semiconductor device according to claim 10.

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