Method for manufacturing grinding wheel, grinding wheel, method for manufacturing dresser board, and dresser board

Abstract

To provide a new method for manufacturing a grinding wheel which is advantageous for energy, compared to a conventional method for manufacturing a grinding wheel using a resin as a binder.SOLUTION: A method for manufacturing a grinding wheel includes a molding step of molding a material containing abrasive grains, an epoxy resin, and an amine-based curing agent into a predetermined shape, and a curing step of waiting for the epoxy resin and the amine-based curing agent contained in the molded material to chemically react and cure, wherein an amine value of the amine-based curing agent is 600 mgKOH / g or more.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a grindstone used when processing a workpiece such as a wafer, a method for manufacturing the grindstone, a dresser board used for dressing the grindstone, and a method for manufacturing the dresser board. [Background technology]

[0002] Device chips equipped with devices such as electronic circuits are essential components of electronic devices such as mobile phones and personal computers. Device chips are obtained, for example, by dividing the front surface of a wafer made of a material such as silicon (Si) into multiple regions along linear dividing lines, forming devices in each region, and then dividing the wafer along these dividing lines.

[0003] When dividing a plate-like workpiece, such as a wafer, into small pieces such as device chips, a cutting device is used, in which a cutting tool called a cutting blade, which includes a circular grinding stone, is attached to a spindle (see, for example, Patent Document 1). The cutting blade is rotated at high speed and cuts into the workpiece along the planned dividing lines while supplying a liquid such as water, thereby cutting the workpiece along the planned dividing lines and dividing it into a plurality of small pieces.

[0004] Furthermore, in recent years, with the increasing sophistication of the requirements for electronic devices, there have been an increasing number of opportunities to thin workpieces. When thinning a workpiece, for example, a grinding device is used in which a grinding tool called a grinding wheel, which includes multiple rectangular parallelepiped grinding stones, is attached to a spindle (see, for example, Patent Document 2). By rotating the grinding wheel and bringing the grinding stones into contact with the workpiece while supplying a liquid such as water, the workpiece is ground and thinned. As a result, the device chips obtained as a final product are also thinner and lighter.

[0005] Grinding wheels used in cutting and grinding processes have a structure in which abrasive grains such as diamond are dispersed and fixed in a binder made of a material selected from resin, metal, ceramics, etc. Phenolic resin, which has excellent strength, is generally used as the resin binder. For example, the above-mentioned grinding wheel can be obtained by mixing phenolic resin powder with abrasive grains, filling the mixture into a mold, and then performing processes such as hot compression and sintering. Grinding wheels that use resin as the binder are also called resin-bonded grinding wheels. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Laid-Open No. 2003-234308 [Patent Document 2] Japanese Patent Application Laid-Open No. 2006-1007 Summary of the Invention [Problem to be solved by the invention]

[0007] However, when a resin is used as a binder, as described above, processes such as hot compression and sintering are necessary, and therefore, conventional methods for manufacturing grinding wheels have room for improvement in terms of the energy used in these processes (and the costs resulting from the energy).Furthermore, the dresser boards used for dressing the above-mentioned grinding wheels (adjusting sharpening, etc.) are manufactured in the same manner as grinding wheels that use a resin as a binder, and therefore, the manufacturing methods for these dresser boards also have room for improvement in terms of energy.

[0008] Therefore, an object of the present invention is to provide a new method for manufacturing a grinding wheel that is more advantageous in terms of energy than conventional methods for manufacturing grinding wheels in which a resin is used as a binder, and a new method for manufacturing a dresser board that is more advantageous in terms of energy than conventional methods for manufacturing dresser boards. [Means for solving the problem]

[0009] According to one aspect of the present invention, there is provided a method for manufacturing a grinding wheel, comprising: a molding step of molding a material containing abrasive grains, an epoxy resin, and an amine-based curing agent into a predetermined shape; and a curing step of waiting for the epoxy resin and the amine-based curing agent contained in the molded material to chemically react and harden, wherein the amine value of the amine-based curing agent is 600 mgKOH / g or more.

[0010] Preferably, the amine curing agent is a triamine curing agent. Preferably, the molding step is performed in an environment of 1 MPa or less and 150° C. or less. In the molding step, the material may be molded into a ring or rectangular shape.

[0011] According to another aspect of the present invention, there is provided a grinding wheel comprising abrasive grains and a binder, the binder containing a resin obtained by chemically reacting an amine-based curing agent having an amine value of 600 mgKOH / g or more with an epoxy resin.

[0012] Preferably, the amine-based curing agent is a triamine-based curing agent.

[0013] According to yet another aspect of the present invention, there is provided a method for manufacturing a dresser board, comprising: a molding step of molding a material containing abrasive grains, an epoxy resin, and an amine-based curing agent into a predetermined shape; and a curing step of waiting for the epoxy resin and the amine-based curing agent contained in the molded material to chemically react and harden, wherein the amine value of the amine-based curing agent is 600 mgKOH / g or more.

[0014] Preferably, the amine curing agent is a triamine curing agent. Preferably, the curing step is carried out in an environment of 1 MPa or less and 150° C. or less. In the molding step, the material may be molded into a plate shape.

[0015] According to another aspect of the present invention, there is provided a dresser board comprising abrasive grains and a binder, the binder containing a resin obtained by chemically reacting an amine-based curing agent having an amine value of 600 mgKOH / g or more with an epoxy resin.

[0016] Preferably, the amine-based curing agent is a triamine-based curing agent. [Effects of the Invention]

[0017] In the method for producing a grinding wheel according to one aspect of the present invention, the epoxy resin and the amine-based curing agent having an amine value of 600 mgKOH / g or more are cured by chemical reaction, so that the grinding wheel can be produced without necessarily applying heat or pressure from the outside. In other words, the method for producing a grinding wheel according to one aspect of the present invention is advantageous in terms of energy consumption compared to conventional methods for producing grinding wheels that use phenolic resin as a binder.

[0018] Similarly, in a method for producing a dresser board according to yet another aspect of the present invention, the epoxy resin and the amine-based curing agent having an amine value of 600 mgKOH / g or more are cured by chemical reaction, so that the dresser board can be produced without necessarily applying heat or pressure from the outside. In other words, the method for producing a dresser board according to yet another aspect of the present invention is more advantageous in terms of energy than conventional methods for producing dresser boards that use a phenolic resin as a binder. [Brief explanation of the drawings]

[0019] [Figure 1] FIG. 1 is a perspective view schematically showing the structure of a washer-type cutting blade. [Figure 2] FIG. 2 is a perspective view schematically illustrating an outline of the cutting device. [Figure 3] FIG. 3 is a cross-sectional view showing a part of the grindstone after the epoxy resin and amine-based curing agent contained in the material have hardened. [Figure 4] FIG. 4 is a cross-sectional view showing a part of the grinding wheel in a finished state. [Figure 5] FIG. 5 is a graph showing the relationship between the amine value of an amine-based curing agent and the ease of wear of a grinding wheel. [Figure 6]FIG. 6 is a perspective view schematically showing the structure of a hub-type cutting blade. [Figure 7] FIG. 7 is a perspective view schematically illustrating an outline of a grinding wheel and a grinding device. [Figure 8] FIG. 8 is a perspective view schematically showing the structure of the dresser board. DETAILED DESCRIPTION OF THE INVENTION

[0020] Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings. Fig. 1 is a perspective view showing a schematic structure of a washer-type cutting blade 10. As shown in Fig. 1, the cutting blade 10 is composed only of an annular grinding wheel 12, and the entire blade functions as a cutting blade (cutting edge).

[0021] The grinding wheel 12 has first and second surfaces 12a, 12b that are generally parallel to each other and generally flat, and have an annular shape. The inner edges of the first and second surfaces 12a, 12b are connected to each other by an inner surface 12c that has a shape corresponding to the side surface of a cylinder, and the outer edges of the first and second surfaces 12a, 12b are connected to each other by an outer surface 12d that has a shape corresponding to the side surface of a cylinder.

[0022] An inner surface 12c connecting the inner edge of the first surface 12a and the inner edge of the second surface 12b defines a through hole that passes through the grinding wheel 12 from the first surface 12a to the second surface 12b. When the cutting blade 10 is attached to the spindle, which serves as the rotation axis, a part of a support fixed to the spindle is inserted into this through hole.

[0023] Fig. 2 is a perspective view showing a schematic overview of a cutting device 20 to which the above-mentioned cutting blade 10 is attached. Note that the X1 axis (first horizontal axis), Y1 axis (second horizontal axis), and Z1 axis (vertical axis) shown in Fig. 2 are perpendicular to one another. This cutting device 20 is configured to be able to cut the workpiece 11 by rotating the cutting blade 10 to cut into the workpiece 11.

[0024] The workpiece 11 is a disk-shaped wafer made of a material selected from, for example, silicon (Si), gallium arsenide (GaAs), indium phosphide (InP), gallium nitride (GaN), silicon carbide (SiC), etc., and has a first surface 11a and a second surface 11b that are circular and generally parallel to each other.

[0025] The first surface 11a of the workpiece 11 is divided into a plurality of rectangular regions by a plurality of streets (planned division lines) 13 that are arranged in a grid pattern so as to intersect with one another. Each region is provided with a device 15 such as an IC (Integrated Circuit). Therefore, when the workpiece 11 is cut and divided along the streets 13, a plurality of device chips, each equipped with a device 15, are obtained.

[0026] However, the material, shape, structure, size, etc. of the workpiece 11 are not limited to this embodiment. For example, a substrate made of other materials such as semiconductors, ceramics, resins, metals, etc. may be used as the workpiece 11. Similarly, the type, number, shape, structure, size, arrangement, etc. of the devices 15 are not limited to the above embodiment. The devices 15 do not have to be formed on the workpiece 11.

[0027] In this embodiment, a tape (dicing tape) 17 having a diameter larger than that of the workpiece 11 is attached to the second surface 11b side of the workpiece 11. In addition, an annular frame 19 is fixed to the outer edge of the tape 17 so as to surround the workpiece 11. In this way, the workpiece 11 is supported by the frame 19 via the tape 17, making the workpiece 11 easier to handle. However, the workpiece 11 does not necessarily have to be supported by the frame 19 via the tape 17.

[0028] The workpiece 11 described above is carried into the cutting device 20 while being supported by, for example, a frame 19, and is then cut. The cutting device 20 is provided with a chuck table (holding table) 22 that holds the workpiece 11 during cutting. The upper surface of the chuck table 22 is configured in a generally flat circular shape that is generally parallel to the X1-axis and X2-axis, and supports the workpiece 11 from below.

[0029] The upper surface of the chuck table 22 is connected to a suction source (not shown) such as an ejector via a flow path (not shown) and a valve (not shown) provided inside the chuck table 22. In addition, the chuck table 22 is connected to a ball screw type chuck table moving mechanism (not shown) that can move the chuck table 22 along the X1 axis, and a rotation drive source (not shown) such as a motor that can rotate the chuck table 22 around a rotation axis along the Z1 axis.

[0030] A cutting unit 24 is disposed above the chuck table 22. The cutting unit 24 includes a cylindrical housing 26, which accommodates a columnar spindle (not shown) whose axis is aligned with the Y1 axis. The tip of the spindle is exposed to the outside of the housing 26, and a rotation drive source (not shown), such as a motor, is connected to the base end of the spindle.

[0031] The cutting blade 10 is attached to the tip of the spindle via a support. When the rotary drive source connected to the spindle is operated with the cutting blade 10 attached to the tip of the spindle, the cutting blade 10 rotates around a rotation axis along the Y1 axis by power transmitted from the rotary drive source via the spindle.

[0032] A portion of the cutting blade 10 attached to the tip of the spindle is covered by a blade cover 28 fixed to the housing 26. The blade cover 28 is provided with a pair of nozzles 30 that sandwich the cutting blade 10 along the Y1 axis. Each nozzle 30 has an injection port (not shown) that opens toward the cutting blade 10 and can supply a liquid (machining fluid) such as pure water to the cutting blade 10. This liquid cools the cutting blade 10 and the workpiece 11 and washes away chips (machining chips) generated by the cutting process.

[0033] A ball screw type cutting unit moving mechanism (not shown) capable of moving the cutting unit 24 is connected to the cutting unit 24. The cutting unit moving mechanism moves the cutting unit 24 along the Y1 axis and also moves (raises and lowers) it along the Z1 axis. The cutting unit moving mechanism adjusts the positions of the cutting blade 10 along the Y1 axis and the Z1 axis.

[0034] When the workpiece 11 is cut by the cutting device 20, the workpiece 11 is first held by the chuck table 22. For example, the workpiece 11 is placed on the chuck table 22 so that the first surface 11a faces upward and the second surface 11b (the tape 17 side) faces the upper surface of the chuck table 22. In this state, when a suction force (negative pressure) of a suction source is applied to the upper surface of the chuck table 22, the workpiece 11 is sucked by the chuck table 22 via the tape 17 and held thereon.

[0035] Next, the orientation of the chuck table 22 around the Z1 axis is adjusted so that the orientation (longitudinal direction) of the street 13 to be cut is parallel to the X1 axis. Also, the positional relationship between the chuck table 22 and the cutting unit 24 is adjusted so that the cutting blade 10 is positioned above the extension line of the target street 13.

[0036] Thereafter, the height of the cutting unit 24 is adjusted so that the lower end of the cutting blade 10 is positioned slightly below the second surface 11b (the upper surface of the tape 17) of the workpiece 11. Then, while the rotary drive source connected to the spindle rotates the cutting blade 10 together with the spindle, the chuck table moving mechanism moves the chuck table 22 along the X1 axis.

[0037] As a result, the cutting blade 10 and the workpiece 11 move relatively along the X1 axis (machining feed), and the cutting blade 10 cuts into the workpiece 11 at the target street 13. As a result, the workpiece 11 is cut and divided at the target street 13. The same procedure is then repeated, and the workpiece 11 is divided at all of the streets 13. This results in a plurality of device chips, each equipped with a device 15.

[0038] The cutting process for the workpiece 11 may be changed as desired depending on the purpose. For example, when the cutting blade 10 is caused to cut into the workpiece 11 to a depth that does not reach the second surface 11b, a groove having a depth less than the thickness of the workpiece 11 is formed on the first surface 11a side of the workpiece 11 (half cut).

[0039] The cutting blade 10 according to this embodiment is manufactured, for example, by the following manufacturing method. First, the materials for the cutting blade 10, namely, abrasive grains, epoxy resin, and amine-based curing agent, are mixed at room temperature (0°C to 40°C) (mixing step). The abrasive grains are, for example, grains of diamond, cubic boron nitride (cBN), or the like, and typically have a width (maximum width) of about 0.1 μm to 140 μm.

[0040] As the epoxy resin, bisphenol A type, bisphenol F type, aliphatic type, etc., which are liquid at room temperature, are used. Among them, it is preferable to use an epoxy resin having characteristics such as a low epoxy equivalent and a large number of epoxy groups in the molecule.

[0041] The amine curing agent used has an amine value of 600 mgKOH / g or more, preferably 800 mgKOH / g or more. Here, the amine value refers to the amount of potassium hydroxide, expressed in mg, equivalent to the acid required to neutralize 1 g of the sample (i.e., the target amine curing agent).

[0042] By using an amine-based curing agent with an amine value of 600 mgKOH / g or more, a grinding wheel 12 having performance equal to or better than that of conventional grinding wheels formed using phenolic resin powder through processes such as hot compression and sintering can be obtained without undergoing processes such as hot compression and sintering. For example, the grinding wheel 12 manufactured by the manufacturing method according to this embodiment has durability (wear resistance) equal to or better than that of conventional grinding wheels.

[0043] Such amine-based curing agents include, for example, triamine-based curing agents. Specific examples of triamine-based curing agents include diethylenetriamine, 4-dodecyldiethylenetriamine, triethylenetetramine, hexamethylenetetramine, tetraethylenepentamine, pentaethylenehexamine, and diethylaminopropylamine. Among these, it is preferable to use diethylenetriamine, which has characteristics such as a high amine value.

[0044] In addition to the abrasive grains, epoxy resin, and amine-based curing agent, any additive may be added to the material of the cutting blade 10. The type and amount of the additive are appropriately set according to the performance required of the cutting blade 10.

[0045] After the material containing the abrasive grains, epoxy resin, and amine-based curing agent is mixed, the mixed material is molded into a desired shape (molding process). There are no particular limitations on the method for molding the material. For example, the mixed material can be molded into a desired shape by filling a mold or by filling the material between two films arranged with a gap between them.

[0046] In this embodiment, the material is molded into a ring shape corresponding to the shape of the grinding wheel 12 of the cutting blade 10. Note that, after mixing the epoxy resin with the amine-based curing agent, if, for example, 24 hours or more has passed, the material hardens and its fluidity decreases significantly. Therefore, it is preferable that the material molding step be performed within 12 hours after the above-mentioned step of mixing the material, before the material hardens to a certain extent.

[0047] After the material is molded into the desired shape, the epoxy resin and amine-based curing agent contained in the material undergo a chemical reaction until the material is completely cured (the curing process). The time required for curing varies depending on the specific material, but is typically 12 hours or more. The curing environment must be at least more advantageous in terms of energy consumption (and energy-related costs) than processes such as hot compression and baking.

[0048] Therefore, the curing of the epoxy resin and amine-based curing agent contained in this material is carried out in an environment with lower pressure and temperature than processes such as hot compression and baking, for example, an environment of 1 MPa or less and 150°C or less. It is also possible to cure the epoxy resin and amine-based curing agent without applying pressure or heat. Therefore, it is more preferable to cure this material in an environment of room temperature and normal pressure (900 hPa to 1050 hPa).

[0049] 3 is a cross-sectional view showing a part of the grinding wheel 12 after the epoxy resin and amine-based curing agent contained in the material have hardened. As shown in FIG. 3, the grinding wheel 12 obtained by the above-described procedure has a structure in which a plurality of abrasive grains 14 are dispersed and fixed in a binder 16 made of a resin obtained by a chemical reaction between the epoxy resin and the amine-based curing agent. However, in this state, almost no abrasive grains are exposed on the surface 12e of the grinding wheel 12 (such as the outer surface 12d).

[0050] After the epoxy resin and amine-based curing agent have hardened, the grinding wheel 12 is finished to a state suitable for cutting (finishing process). Specifically, the rotating grinding wheel 12 is caused to cut into a dresser board or the like having a structure in which abrasive grains are dispersed in a binder, and the grinding wheel 12 is slightly worn down. As a result, some of the abrasive grains 14 are exposed on the surface 12e of the grinding wheel 12. Figure 4 is a cross-sectional view schematically showing a portion of the grinding wheel 12 in a finished state.

[0051] The grinding wheel 12 may be finished immediately before the cutting blade 10 is used. That is, the grinding wheel 12 finishing process does not necessarily have to be included in the grinding wheel manufacturing method.

[0052] An experiment was conducted to confirm the wearability of the grinding wheel 12 obtained by the above-mentioned manufacturing method. Specifically, the grinding wheel 12 of the rotating cutting blade 10 was caused to cut into a dresser board, and then the wear amount of the grinding wheel 12 (the amount of reduction in the diameter of the cutting blade 10) was measured.

[0053] Two types of grinding wheels were prepared: one manufactured using an amine-based curing agent with an amine value of 600 mg KOH / g, and the other manufactured using an amine-based curing agent with an amine value of 800 mg KOH / g. As comparative examples, a conventional grinding wheel using phenolic resin and subjected to processes such as hot compression and baking, a grinding wheel manufactured using an amine-based curing agent with an amine value of 400 mg KOH / g, and a grinding wheel manufactured using an amine-based curing agent with an amine value of 500 mg KOH / g were subjected to the same processes and measurements as those for grinding wheel 12.

[0054] The epoxy resin used in the grinding wheel 12 was bisphenol A type, and the amine-based curing agent used in the grinding wheel 12 was a triamine-based curing agent. The abrasive grains used in the grinding wheel 12 were made of diamond, and the average grain size of the abrasive grains was 20 μm (#600). In this specification, the average grain size refers to the particle size at 50% of the cumulative particle size distribution (median diameter, d50, 50% diameter) measured by laser diffraction / scattering method.

[0055] The diameter of the inner surface 12c of the grinding wheel 12 was 40 mm, the diameter of the outer surface 12d of the grinding wheel 12 was 54 mm, and the distance between the first surface 12a and the second surface 12b of the grinding wheel 12 (i.e., thickness) was 0.2 mm. The same is true for the grinding wheel of the comparative example, except that a phenolic resin was used instead of the epoxy resin and amine-based curing agent in the conventional grinding wheel.

[0056] The conventional grinding stone used was a resin blade manufactured by Disco Corporation. The average particle size of the abrasive grains contained in the dresser board was 12 μm (#1000). The length, width, and thickness of the dresser board were 75 mm, 75 mm, and 1.0 mm, respectively.

[0057] When cutting the dresser board with the grinding wheel 12, the number of revolutions per unit time (rotation speed) of the spindle was set to 20,000 rpm, and the processing feed speed was set to 10 mm / s. In addition, the number of times the grinding wheel 12 cuts into the dresser board (the number of grooves formed in the dresser board by cutting) was set to 10 times (10 grooves).

[0058] Fig. 5 is a graph showing the experimental results, i.e., the relationship between the amine value of the amine-based curing agent and the wear rate of each grinding wheel. The horizontal axis of the graph represents the amine value of the amine-based curing agent used in each grinding wheel (corresponding to the type of grinding wheel), and the vertical axis of the graph represents the wear rate of each grinding wheel, with the conventional grinding wheel being set at 100.

[0059] As can be seen from Figure 5, the grinding wheel 12 of the embodiment manufactured using an amine-based curing agent with an amine value of 600 mgKOH / g or more wears less than a conventional grinding wheel that uses a phenolic resin, meaning that it has higher durability (wear resistance) than a conventional grinding wheel.

[0060] As described above, in the method for manufacturing a grinding wheel according to this embodiment, the epoxy resin and the amine-based curing agent having an amine value of 600 mgKOH / g or more are cured through a chemical reaction, so the grinding wheel 12 can be manufactured without necessarily applying heat or pressure from the outside. In other words, the method for manufacturing a grinding wheel according to this embodiment is more advantageous in terms of energy consumption than conventional methods for manufacturing grinding wheels that use phenolic resin as a binder.

[0061] Furthermore, in the method for manufacturing a grinding wheel according to this embodiment, an amine-based curing agent having an amine value of 600 mgKOH / g or more, preferably an amine-based curing agent having an amine value of 800 mgKOH / g or more, is used, so that a grinding wheel 12 having excellent durability can be easily obtained compared to conventional methods for manufacturing grinding wheels that use a phenolic resin as a binder.

[0062] The present invention is not limited to the above-described embodiment and can be practiced in various modifications. For example, in the above-described embodiment, a washer-type cutting blade 10 composed only of an annular grinding wheel 12 is described, but a grinding wheel used for a hub-type cutting blade can also be manufactured by the grinding wheel manufacturing method according to the present invention.

[0063] Fig. 6 is a perspective view showing the structure of a hub-type cutting blade 40. As shown in Fig. 6, the cutting blade 40 includes an annular blade base 42. The blade base 42 is made of a metal such as an aluminum alloy, and has a first surface 42a and a second surface 42b facing the opposite side to the first surface 42a.

[0064] A circular hole 42c is provided in the center of the blade base 42, penetrating from the first surface 42a side to the second surface 42b side of the blade base 42. In addition, an annular protrusion 42d is formed on the first surface 42a side of the blade base 42 so as to surround the hole 42c and protrude from the first surface 42a.

[0065] On the other hand, an annular grinding stone 44 is fixed along the outer periphery of the blade base 42 on the second surface 42b side of the blade base 42. The structure and manufacturing method of the grinding stone 44 are the same as those of the grinding stone 12 described above. That is, the grinding stone 44 has a first surface 44a and a second surface 44b that are generally flat and circular and generally parallel to each other. The outer edges of the first surface 44a and the second surface 44b are connected to each other by an outer surface 44c that has a shape corresponding to the side surface of a cylinder.

[0066] The manufacturing methods of grinding wheels according to the above-described embodiments and modifications can also be applied to manufacturing tools for grinding. Fig. 7 is a perspective view schematically showing an overview of a grinding wheel 50, which is a tool for grinding. As shown in Fig. 7, the grinding wheel 50 has an annular wheel base 52 made of a metal such as aluminum or stainless steel.

[0067] On the underside of the wheel base 52, a plurality of grinding wheels (grinding wheels) 54 formed, for example, in a rectangular parallelepiped shape are arranged at approximately equal intervals along the circumferential direction of the wheel base 52. Each grinding wheel 54 is manufactured according to the grinding wheel manufacturing method according to the embodiment described above. However, the shape, structure, size, quantity, etc. of the grinding wheels 54 may be set arbitrarily.

[0068] The grinding wheel 50 configured in this manner is mounted on and used in a grinding device 60 as shown in Fig. 7. Note that the X2 axis (first horizontal axis), Y2 axis (second horizontal axis), and Z2 axis (vertical axis) shown in Fig. 7 are perpendicular to one another.

[0069] The grinding device 60 is equipped with a chuck table (holding table) 62 that holds the workpiece 11 during grinding. An upper surface 62a of the chuck table 62 is configured in a shape that corresponds to the side surface of a cone, for example. The difference in height (height difference) between the center of the upper surface 62a, which corresponds to the apex of the cone, and the outer periphery of the upper surface 62a is approximately 10 μm to 30 μm.

[0070] The upper surface of the chuck table 62 is connected to a suction source (not shown) such as an ejector via a flow path (not shown) and a valve (not shown) provided inside the chuck table 62. In addition, the chuck table 62 is connected to a chuck table moving mechanism (not shown) that can move the chuck table 62 along the X2 axis and the Y2 axis, and a rotation drive source (not shown) such as a motor that can rotate the chuck table 62 around a rotation axis along the Z2 axis.

[0071] A grinding unit 64 is disposed above the chuck table 62. The grinding unit 64 includes a cylindrical housing (not shown). This housing accommodates a columnar spindle 66 arranged with its axis aligned along the Z2 axis. The tip of the spindle 66 is exposed to the outside of the housing, and a rotation drive source (not shown), such as a motor, is connected to the base end of the spindle 66.

[0072] A disk-shaped wheel mount 68 made of metal such as aluminum or stainless steel is fixed to the tip of the spindle 66 exposed from the housing. The grinding wheel 50 described above is detachably attached to the underside of the wheel mount 68 with fasteners 70 such as bolts.

[0073] When the rotation drive source connected to the spindle 66 is operated with the grinding wheel 50 attached to the tip of the spindle 66, the grinding wheel 50 rotates around a rotation axis along the Z2 axis by power transmitted from the rotation drive source via the spindle 66. When the grinding wheel 50 rotates, the multiple grinding stones 54 each revolve around the rotation axis of the spindle 66 along a circular orbit parallel to the X2 axis and Y2 axis.

[0074] A ball screw type grinding unit moving mechanism (not shown) that can move (lift) the grinding unit 64 along the Z2 axis is connected to the grinding unit 64. When the grinding unit moving mechanism lifts and lowers the grinding unit 64, the grinding wheel 50 moves relatively toward or away from the chuck table 62.

[0075] A nozzle (not shown) for supplying a liquid (working fluid) such as pure water is provided inside or near the grinding unit 64. When the workpiece 11 is ground with the grinding wheel 50, the liquid is supplied from this nozzle to the workpiece 11 and the grinding wheel 54. This cools the grinding wheel 54 and the workpiece 11, and washes away chips (processing chips) generated by the grinding process.

[0076] When the workpiece 11 is ground by the grinding device 60, the workpiece 11 is first held by the chuck table 62. For example, the workpiece 11 is placed on the chuck table 62 so that the second surface 11b faces upward and the first surface 11a faces the upper surface 62a of the chuck table 62. In this state, when a suction force (negative pressure) of a suction source is applied to the upper surface 62a of the chuck table 62, the workpiece 11 is sucked and held by the chuck table 62. Note that a protective tape or the like may be attached to the first surface 11a side of the workpiece 11 to protect the workpiece 11.

[0077] Next, the positional relationship between the chuck table 62 and the grinding unit 64 is adjusted. Specifically, the positional relationship between the chuck table 62 and the grinding unit 64 is adjusted along the X2 axis and the Y2 axis so that the trajectory of the grinding wheel 54 overlaps with the center of the workpiece 11 when viewed from a direction approximately perpendicular to the upper surface 62a of the chuck table 62.

[0078] Furthermore, a rotary drive source connected to the spindle 66 rotates the grinding wheel 50 together with the spindle 66, and a rotary drive source connected to the chuck table 62 rotates the chuck table 62. In this state, the grinding unit moving mechanism lowers the grinding unit 64 at a predetermined speed, bringing the grinding wheel 50 closer to the workpiece 11. When the grinding wheel 54 comes into contact with the second surface 11b of the workpiece 11, the workpiece 11 is ground.

[0079] A dresser board used for dressing a grinding wheel (adjusting sharpening, etc.) can also be manufactured using procedures similar to those of the grinding wheel manufacturing methods according to the above-described embodiments and modifications. Fig. 8 is a perspective view showing a schematic structure of a dresser board 80. This dresser board 80, like the grinding wheel 12 and the grinding wheel 54, has a structure in which a plurality of abrasive grains are dispersed and fixed in a binder made of a resin obtained by chemically reacting an epoxy resin with an amine-based curing agent.

[0080] The dresser board 80 typically has a first surface 80a and a second surface 80b that are generally parallel to each other and generally flat, and have a rectangular shape. The outer edge of the first surface 80a and the outer edge of the second surface 80b are connected to each other by four rectangular side surfaces 80c. In other words, the dresser board 80 has a rectangular flat plate shape when viewed from above. The length, width, and thickness of the dresser board 80 are typically 75 mm, 75 mm, and 1.0 mm, respectively. However, the shape, size, etc. of the dresser board 80 are not limited to this embodiment.

[0081] For example, the condition of the grinding stone can be adjusted (dressing) by holding the second surface 80b of the dresser board 80 with a chuck table or the like and bringing the grinding stone into contact with (cutting into) the first surface 80a of the dresser board 80. Specifically, the shape of the grinding stone can be adjusted or the amount of exposed abrasive grains can be changed.

[0082] The manufacturing method of the dresser board 80 is the same as the manufacturing method of the grindstone according to the above-mentioned embodiment and each modified example. Specifically, first, the materials of the dresser board 80, namely, abrasive grains, epoxy resin, and amine-based curing agent, are mixed at room temperature (0°C to 40°C) (mixing process). Details are the same as those of the above-mentioned embodiment.

[0083] After the material containing the abrasive grains, epoxy resin, and amine-based curing agent is mixed, the mixed material is molded into a desired shape (molding process). In this embodiment, the material is molded into a flat plate shape corresponding to the shape of the dresser board 80. Other details are the same as those of the above-mentioned embodiment.

[0084] After the material is molded into the desired shape, the epoxy resin and amine-based curing agent contained in the material undergo a chemical reaction and are allowed to completely cure (curing step), as described in detail in the above-described embodiment.

[0085] After the epoxy resin and the amine-based curing agent have hardened, the dresser board 80 is finished to a state suitable for dressing a grinding wheel (finishing step). Note that this step of finishing the dresser board 80 may be omitted. In other words, the step of finishing the dresser board 80 does not necessarily have to be included in the method of manufacturing a dresser board.

[0086] In addition, the structures, methods, etc. according to the above-described embodiments and modifications may be modified as appropriate without departing from the scope of the present invention. [Explanation of symbols]

[0087] 10: Cutting blade 12: Grindstone 12a: 1st page 12b: 2nd side 12c:Inner surface 12d: Outer surface 12e: surface 14: Abrasive grain 16: Binder 40: Cutting blade 42: Blade base 42a: 1st page 42b: 2nd side 42c: Hole 42d: Convex part 44: Grindstone 44a: 1st page 44b: 2nd side 44c: Outer surface 50: Grinding wheel 52: Wheel base 54: Grindstone 80: Dresser board 80a: 1st page 80b: 2nd side 80c: side 20: Cutting equipment 22: Chuck table (holding table) 24: Cutting unit 26: Housing 28: Blade cover 30: Nozzle 60: Grinding equipment 62: Chuck table (holding table) 62a:Top surface 64: Grinding unit 66: Spindle 68: Wheel mount 70: Fixture 11: Workpiece 11a: 1st page 11b: 2nd side 13: Street (planned division line) 15: Device 17: Tape (dicing tape) 19: Frame

Claims

1. a molding step of molding a material containing abrasive grains, an epoxy resin, and an amine-based curing agent into a predetermined shape; a curing step of waiting for the epoxy resin and the amine-based curing agent contained in the molded material to chemically react and harden, The amine-based curing agent has an amine value of 600 mgKOH / g or more.

2. 2. The method for producing a grindstone according to claim 1, wherein the amine-based curing agent is a triamine-based curing agent.

3. 3. The method for manufacturing a grindstone according to claim 1, wherein the hardening step is carried out in an environment of 1 MPa or less and 150°C or less.

4. 3. The method for manufacturing a grindstone according to claim 1, wherein the material is formed into a ring or a rectangular parallelepiped in the forming step.

5. Abrasive grains and a binder; The binder contains a resin obtained by chemically reacting an amine-based curing agent having an amine value of 600 mgKOH / g or more with an epoxy resin.

6. 6. The grinding wheel according to claim 5, wherein the amine-based curing agent is a triamine-based curing agent.

7. a molding step of molding a material containing abrasive grains, an epoxy resin, and an amine-based curing agent into a predetermined shape; a curing step of waiting for the epoxy resin and the amine-based curing agent contained in the molded material to chemically react and harden, The amine-based curing agent has an amine value of 600 mg KOH / g or more.

8. 8. The method for manufacturing a dresser board according to claim 7, wherein the amine-based curing agent is a triamine-based curing agent.

9. 9. The method for manufacturing a dresser board according to claim 7 or 8, wherein the curing step is carried out in an environment of 1 MPa or less and 150°C or less.

10. 9. The method for manufacturing a dresser board according to claim 7 or 8, wherein the material is formed into a plate shape in the forming step.

11. Abrasive grains and a binder; The binder contains a resin obtained by chemically reacting an amine-based curing agent having an amine value of 600 mgKOH / g or more with an epoxy resin.

12. 12. The dresser board according to claim 11, wherein the amine-based hardener is a triamine-based hardener.

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